A PCB board processing etching spray device

Abstract

The present invention relates to the technical field of PCB board processing, and specifically to a PCB board processing etching spray device, comprising an etching machine and two spray mechanisms, wherein a conveying mechanism is provided inside the etching machine, and the two spray mechanisms are symmetrically distributed at the top and bottom of the conveying mechanism, and a U-shaped movable frame is provided at the top and bottom of the conveying mechanism, and a transmission mechanism is provided in each of the two U-shaped movable frames, and a connecting rod 1 and a connecting rod 2 are fixedly installed on one side of the two U-shaped movable frames, respectively. Cylinder 1 and cylinder 2 are fixedly installed on one side of the etching machine near the connecting rod 1 and the connecting rod 2. The beneficial effect of the present invention is that the angles of the spray nozzles in the two spray mechanisms are adjusted according to the depth of the hole, and the etching liquid sprayed at an angle can be forced into holes with a high aspect ratio, thereby reducing copper residue inside the hole.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board processing, in particular to a PCB board processing etching spray device. Background Art

[0002] PCB board is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. In PCB manufacturing, etching spray is a key step in the etching process. The copper foil not protected by the anti-corrosion layer is removed through a combination of chemical solution and physical spray to form a circuit pattern.

[0003] Typically, a PCB is transported by a conveyor mechanism into the etching machine, where it is then sprayed and etched on the top and bottom of the PCB. Some PCBs have holes. In existing technology, the nozzles in the spray mechanism are typically positioned vertically, with the direction of the liquid flow parallel to the axis of the through-hole. This makes it difficult for the etching liquid to effectively penetrate the hole. This is especially true for deep holes on PCBs with an aspect ratio exceeding 8:1. Vertical spraying can barely etch the center of the hole, resulting in incomplete etching of the copper layer on the inner wall of the hole. This requires subsequent etching of the hole separately, impacting the efficiency of PCB processing. Summary of the Invention

[0004] The object of the present invention is to provide a PCB board processing etching spray device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a PCB board processing etching spray device, comprising an etching machine and two spray mechanisms, a conveying mechanism is provided inside the etching machine, the two spray mechanisms are symmetrically distributed at the top and bottom of the conveying mechanism, a U-shaped movable frame is provided at the top and bottom of the conveying mechanism, a transmission mechanism is provided in each of the two U-shaped movable frames, a connecting rod 1 and a connecting rod 2 are fixedly installed on one side of the two U-shaped movable frames, a cylinder 1 and a cylinder 2 are fixedly installed on one side of the etching machine close to the connecting rod 1 and the connecting rod 2, the telescopic shaft end of the cylinder 1 is fixedly connected to the connecting rod 1, the cylinder 2 and the connecting rod 2 cooperate with each other, the telescopic shaft end of the cylinder 2 is fixedly installed with a receiving block, a connecting groove is provided inside the receiving block, and a connecting mechanism is provided inside the connecting rod 2.

[0006] Preferably, the conveying mechanism includes a rectangular sliding frame and two rectangular fixed frames, a plurality of evenly distributed conveying rollers are rotatably installed inside the rectangular sliding frame, the two rectangular fixed frames are respectively fixedly installed at the two ends inside the etching machine, a plurality of evenly distributed pulleys are rotatably installed on both sides of the rectangular sliding frame, and the top and bottom of the inner walls of the two rectangular fixed frames are fixedly installed with limiting slides, and the four limiting slides cooperate with the plurality of pulleys respectively, and the U-shaped movable frame at the bottom is fixedly connected to the rectangular sliding frame.

[0007] Preferably, the spraying mechanism includes a conveying pipe, and the side of the conveying pipe close to the rectangular sliding frame is connected to multiple evenly distributed hoses, and the ends of multiple hoses away from the conveying pipe are connected to multiple spraying pipes, and the ends of multiple spraying pipes away from their respective corresponding hoses are connected to multiple evenly distributed spray nozzles.

[0008] Preferably, the transmission mechanism includes two fixed seats, which are respectively fixedly connected to the inner walls on both sides of the etching machine, and multiple evenly distributed rotating seats are rotatably installed on the opposite sides of the two fixed seats. Multiple rotating seats are provided with transmission grooves at one end away from the rectangular sliding frame, and multiple transmission rods are movably installed inside the transmission grooves. Multiple transmission rods are fixedly connected to the U-shaped movable frame, and multiple spray pipes are respectively arranged between the two opposite rotating seats.

[0009] Preferably, rectangular mounting blocks are fixedly installed on both sides of the plurality of spray pipes, mounting grooves are opened inside the plurality of rotating seats, and the plurality of mounting grooves cooperate with the plurality of rectangular mounting blocks.

[0010] Preferably, L-shaped slots are provided inside the four fixing seats, L-shaped sliders are slidably installed inside the four L-shaped slots, and the four L-shaped sliders are fixedly connected to their corresponding U-shaped movable frames respectively.

[0011] Preferably, the connecting mechanism includes a separation component 1 and a separation component 2, the separation component 1 includes a lifting rod, the lifting rod is slidably mounted inside the connecting rod 2, a plurality of evenly distributed clips 1 are fixedly mounted on the top of the lifting rod, a pushing plate is provided inside the lifting rod, the bottom of the pushing plate cooperates with the lifting rod, two guide rods are slidably sleeved on both ends of the pushing plate, the same side of the four guide rods is fixedly connected to the connecting rod 2, the outside of the four guide rods is sleeved with a spring 1, a spring 2 is fixedly mounted between the bottom of the lifting rod and the inner wall of the connecting rod 2, the separation component 2 is provided inside the lifting rod, a plurality of evenly distributed clips 2 are fixedly mounted on the bottom of the connecting rod 1, and the plurality of clips 2 respectively cooperate with the plurality of clips 1.

[0012] Preferably, the second separation component includes a connecting plate and a wedge block, the wedge block is fixedly installed on the side of the etching machine close to the second connecting rod, the connecting plate is slidably fitted inside the lifting rod, a spring three is fixedly installed between the top of the connecting plate and the inner wall of the lifting rod, the bottom of the connecting plate close to the end of the push plate cooperates with the connecting groove, and the bottom end of the connecting plate away from the push plate cooperates with the wedge block.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The angles of the spray nozzles in the two spray mechanisms can be adjusted synchronously by pushing the cylinder 1. When the height-to-diameter ratio of the hole in the PCB board is relatively large, the angles of the spray nozzles in the two spray mechanisms need to be adjusted according to the depth of the hole. The etching liquid sprayed obliquely can be forced into the hole with a high aspect ratio, thereby reducing the copper residue inside the hole. In addition, the eddy current effect generated by the oblique angle can remove the bubbles in the hole, avoiding the "etching blind area" and preventing subsequent staff from etching the hole separately, thereby improving the efficiency of PCB board processing.

[0015] 2. Through the connection mechanism, when cylinder 2 is started, connecting rod 1 and connecting rod 2 are separated and cooperate with cylinder 1 to achieve the effect of adjusting the angle of the spray nozzles in the two spray mechanisms separately. When the copper thickness of the upper and lower surfaces of the PCB board is different, the independent angle adjustment method can avoid excessive etching of the upper and lower surfaces of the PCB board. At the same time, it also ensures that the etching liquid can enter the interior of the hole with a high aspect ratio, meeting the etching requirements of different PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 It is a structural schematic diagram of one side of the etching machine of the present invention;

[0018] Figure 3 It is a schematic diagram of a partial three-dimensional structure of the present invention;

[0019] Figure 4 For the present invention Figure 3 A partial enlarged view in FIG;

[0020] Figure 5 It is a schematic structural diagram of the spray mechanism and two U-shaped movable frames of the present invention;

[0021] Figure 6 It is a schematic structural diagram of the spray mechanism of the present invention;

[0022] Figure 7 For the present invention Figure 6 Partial enlarged view of B in FIG;

[0023] Figure 8 This is a structural diagram of a cylinder according to the present invention;

[0024] Figure 9 This is a schematic structural diagram of the second cylinder of the present invention;

[0025] Figure 10 This is a schematic diagram of the U-shaped mobile frame structure of the present invention;

[0026] Figure 11 It is a schematic diagram of the fixing seat structure of the present invention;

[0027] Figure 12 It is a schematic diagram of the structure of the rotating seat of the present invention;

[0028] Figure 13 This is a schematic structural diagram of the connecting rod 2 of the present invention;

[0029] Figure 14 This is a schematic diagram of the internal structure of the connecting rod 2 of the present invention;

[0030] Figure 15 It is a schematic diagram of the connecting plate structure of the present invention.

[0031] In the accompanying drawings, the list of components represented by each reference numeral is as follows: 1. Etching machine; 2. Rectangular sliding frame; 3. Conveying roller; 4. Rectangular fixed frame; 5. Pulley; 6. Limiting slide; 7. Conveying pipe; 8. Hose; 9. Spray pipe; 10. Spray nozzle; 11. U-shaped movable frame; 12. Fixed seat; 13. Rotating seat; 14. Transmission groove; 15. Transmission rod; 16. Rectangular mounting block; 17. Mounting groove; 18. L-shaped slide groove; 19. L-shaped slider; 20. Connecting rod one; 21. Connecting rod two; 22. Cylinder one; 23. Cylinder two; 24. Support block; 25. Connecting groove; 26. Lifting rod; 27. Card strip one; 28. Push plate; 29. ​​Guide rod; 30. Spring one; 31. Spring two; 32. Card strip two; 33. Connecting plate; 34. Spring three; 35. Wedge block. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] The present invention provides a technical solution: Figure 1 - Figure 15The shown PCB board processing etching spray device includes an etching machine 1 and two spray mechanisms. A conveying mechanism is provided inside the etching machine 1. The two spray mechanisms are symmetrically distributed at the top and bottom of the conveying mechanism. U-shaped movable frames 11 are provided at the top and bottom of the conveying mechanism. The two U-shaped movable frames 11 are provided with transmission mechanisms. Connecting rod 1 20 and connecting rod 2 21 are fixedly installed on one side of the two U-shaped movable frames 11 respectively. Cylinder 1 22 and cylinder 2 23 are fixedly installed on one side of the etching machine 1 close to connecting rod 1 20 and connecting rod 2 21. The telescopic shaft end of cylinder 1 22 is fixedly connected to connecting rod 1 20, and cylinder 2 23 cooperates with connecting rod 2 21. The telescopic shaft end of cylinder 23 is fixedly installed with a receiving block 24, and a connecting groove 25 is provided inside the receiving block 24. A connecting mechanism is provided inside the connecting rod 21.

[0034] The conveying mechanism includes a rectangular sliding frame 2 and two rectangular fixed frames 4. A plurality of evenly distributed conveying rollers 3 are rotatably installed inside the rectangular sliding frame 2. The two rectangular fixed frames 4 are fixedly installed at both ends of the inside of the etching machine 1. A plurality of evenly distributed pulleys 5 are rotatably installed on both sides of the rectangular sliding frame 2. The top and bottom of the inner walls of the two rectangular fixed frames 4 are fixedly installed with limiting slides 6. The four limiting slides 6 cooperate with the plurality of pulleys 5 respectively. The U-shaped movable frame 11 at the bottom is fixedly connected to the rectangular sliding frame 2.

[0035] The spraying mechanism includes a conveying pipe 7, which is connected to a plurality of evenly distributed hoses 8 on one side of the conveying pipe 7 close to the rectangular sliding frame 2, and the ends of the multiple hoses 8 away from the conveying pipe 7 are connected to a plurality of spraying pipes 9, and the ends of the multiple spraying pipes 9 away from their respective corresponding hoses 8 are connected to a plurality of evenly distributed spray nozzles 10.

[0036] The transmission mechanism includes two fixed seats 12, which are respectively fixedly connected to the inner walls on both sides of the etching machine 1. A plurality of evenly distributed rotating seats 13 are rotatably installed on the opposite sides of the two fixed seats 12. A transmission groove 14 is provided at one end of the plurality of rotating seats 13 away from the rectangular sliding frame 2. A transmission rod 15 is movably installed inside the plurality of transmission grooves 14. The plurality of transmission rods 15 are fixedly connected to the U-shaped movable frame 11, and the plurality of spray pipes 9 are respectively arranged between the two opposite rotating seats 13.

[0037] Rectangular mounting blocks 16 are fixedly mounted on both sides of the plurality of spray pipes 9 , and mounting grooves 17 are provided inside the plurality of rotating seats 13 . The plurality of mounting grooves 17 cooperate with the plurality of rectangular mounting blocks 16 .

[0038] An L-shaped chute 18 is provided inside each of the four fixing seats 12 . An L-shaped slider 19 is slidably installed inside each of the four L-shaped chute 18 . The four L-shaped sliders 19 are fixedly connected to their corresponding U-shaped movable frames 11 .

[0039] The connecting mechanism includes a separation component 1 and a separation component 2. The separation component 1 includes a lifting rod 26, which is slidably fitted inside the connecting rod 21. A plurality of evenly distributed card strips 27 are fixedly installed on the top of the lifting rod 26. A push plate 28 is provided inside the lifting rod 26. The bottom of the push plate 28 cooperates with the lifting rod 26. Two guide rods 29 are slidably sleeved on both ends of the push plate 28. The same side of the four guide rods 29 is fixedly connected to the connecting rod 21. The outside of the four guide rods 29 is sleeved with a spring 1 30. A spring 2 31 is fixedly installed between the bottom of the lifting rod 26 and the inner wall of the connecting rod 21. The separation component 2 is provided inside the lifting rod 26. A plurality of evenly distributed card strips 2 32 are fixedly installed on the bottom of the connecting rod 1 20. The plurality of card strips 2 32 respectively cooperate with the plurality of card strips 1 27.

[0040] The second separation component includes a connecting plate 33 and a wedge block 35. The wedge block 35 is fixedly installed on the side of the etching machine 1 close to the second connecting rod 21. The connecting plate 33 is slidably fitted inside the lifting rod 26. A spring three 34 is fixedly installed between the top of the connecting plate 33 and the inner wall of the lifting rod 26. The end of the bottom of the connecting plate 33 close to the push plate 28 cooperates with the connecting groove 25, and the bottom end of the connecting plate 33 away from the push plate 28 cooperates with the wedge block 35.

[0041] Working principle: Before spray etching the PCB board, a driving mechanism is installed to rotate multiple conveying rollers 3, and two conveying pipes 7 are connected to the device for conveying etching liquid. The driving mechanism, how to rotate the multiple conveying rollers 3 and the device for conveying etching liquid are all existing technologies and will not be described in detail here. The PCB board to be processed is placed on the top of the rectangular sliding frame 2. As the multiple conveying rollers 3 rotate, the PCB board can be conveyed to the inside of the etcher 1. Subsequently, the device for conveying etching liquid conveys the etching liquid into the inside of the two conveying pipes 7. The conveying liquid inside the two conveying pipes 7 then enters the inside of the multiple spray pipes 9 through multiple hoses 8, and finally is sprayed onto the surface of the PCB board through multiple spray nozzles 10 for etching.

[0042] When the height-to-diameter ratio of the holes in the PCB board is relatively large, it is necessary to adjust the angles of the spray nozzles 10 in the two spray mechanisms according to the depth of the holes. The etching liquid sprayed obliquely can be forced into the holes with a high aspect ratio, thereby reducing the copper residue inside the holes. In addition, the eddy current effect generated by the oblique angle can take away the bubbles in the holes and avoid "etching blind areas". There are two ways to adjust the angles of the spray nozzles 10 in the two spray mechanisms. Method 1: Start the cylinder 1 22. At this time, the connecting rod 1 20 is connected to the connecting rod 2 21. Therefore, when the cylinder 1 22 pushes the connecting rod 1 20, the connecting rod 21 moves synchronously, and the two U-shaped moving frames 11 move synchronously. The L-shaped sliders 19 in the U-shaped movable frame 11 slide inside their respective corresponding L-shaped slots 18. The mutual cooperation of the four L-shaped sliders 19 and the four L-shaped slots 18 improves the stability of the two U-shaped movable frames 11 during movement. As the two U-shaped movable frames 11 move, multiple transmission rods 15 move inside their respective corresponding transmission slots 14, and multiple rotating seats 13 are all forced to rotate, thereby driving multiple spray pipes 9 to rotate, and then adjusting the angles of multiple spray nozzles 10. This method achieves the effect of synchronously adjusting the spray nozzles 10 in the two spray mechanisms through the cylinder 22. The parameter setting of the adjustment angle of the entire device is simple, and it is suitable for standardized mass production of PCB boards.

[0043] Method 2: First, start the cylinder 23. The cylinder 23 pushes the receiving block 24 into the interior of the connecting rod 21. The receiving block 24 generates a force on the push plate 28. The push plate 28 is forced to move synchronously with the receiving block 24. The push plate 28 moves along the four guide rods 29 and squeezes the four springs 1 30. The bottom of the push plate 28 contacts the inclined surface of the lifting rod 26. Therefore, when the push plate 28 moves, its bottom acts on the inclined surface, and the lifting rod 26 is forced to move downward and squeeze the spring 2 31 at the bottom. Due to the descent of the lifting rod 26, the card strip 1 27 at its top moves downward, thereby disengaging from the multiple card strips 2 32, and the lifting rod 26 is separated from the connecting rod 1 20, thereby separating the connecting rod 21 from the connecting rod 1 20. At this time, the connecting plate 3 One end of 3 cannot move downward under the action of the wedge block 35. Subsequently, when the receiving block 24 moves to the maximum position inside the connecting rod 21, the connecting rod 21 begins to move synchronously with the receiving block 24. When the connecting plate 33 and the wedge block 35 are staggered, the connecting plate 33 moves downward under the action of the spring 34 at its top, and its bottom end is stuck in the inside of the connecting groove 25. The connecting rod 21 can move left and right under the action of the cylinder 2 23, and the angle of the spray nozzle 10 in the lower spray mechanism is adjusted separately, and the cylinder 1 22 adjusts the angle of the spray nozzle 10 in the upper spray mechanism separately. When the copper thickness of the upper and lower surfaces of the PCB board is different, the independent angle adjustment method can avoid excessive etching of the upper and lower surfaces of the PCB board, and at the same time, ensure that the etching liquid can enter the hole with a high aspect ratio.

[0044] When the two spray mechanisms in method two are reset, the connecting rod one 20 is first reset by cylinder one 22, and then the connecting rod two 21 is pulled to reset by cylinder two 23. As the connecting rod two 21 moves, the wedge block 35 acts on the connecting plate 33, and the connecting plate 33 is forced to move upward. When the connecting rod two 21 moves to the extreme position close to the side of cylinder two 23, the connecting plate 33 is completely separated from the inside of the connecting groove 25. As the receiving block 24 gradually resets, the push plate 28 is reset under the action of four springs one 30, and the lifting rod 26 is reset upward under the action of spring two 31, and drives multiple clips one 27 to be clipped into multiple clips two 32, thereby realizing the reconnection between the connecting rod two 21 and the connecting rod one 20.

[0045] In method one and method two, while the U-shaped movable frame 11 below moves, the rectangular sliding frame 2 moves synchronously, driving multiple pulleys 5 to move along the corresponding limiting slides 6, to avoid the etching liquid sprayed from the spray nozzle 10 acting on the outside of multiple conveying rollers 3 when the spray nozzle 10 in the spray mechanism below moves at a large angle.

[0046] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0047] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A PCB board processing etching spray device, comprising an etching machine (1) and two spray mechanisms, characterized in that: The etching machine (1) is provided with a conveying mechanism inside, and the two spraying mechanisms are symmetrically distributed at the top and bottom of the conveying mechanism. The top and bottom of the conveying mechanism are both provided with a U-shaped moving frame (11), and the two U-shaped moving frames (11) are both provided with a transmission mechanism. One side of the two U-shaped moving frames (11) is fixedly installed with a connecting rod 1 (20) and a connecting rod 2 (21), respectively. The etching machine (1) is fixedly provided with a cylinder 1 (22) and a cylinder 2 (23) on one side close to the connecting rod 1 (20) and the connecting rod 2 (21). The telescopic shaft end of the cylinder 1 (22) is fixedly connected to the connecting rod 1 (20), and the cylinder 2 (23) cooperates with the connecting rod 2 (21). The telescopic shaft end of the cylinder 2 (23) is fixedly provided with a receiving block (24), and a connecting groove (25) is provided inside the receiving block (24). The connecting mechanism is provided inside the connecting rod 2 (21); The spray mechanism comprises a delivery pipe (7), wherein the delivery pipe (7) is connected to a plurality of evenly distributed hoses (8) on one side close to the rectangular sliding frame (2), and the ends of the plurality of hoses (8) away from the delivery pipe (7) are connected to a plurality of spray pipes (9), and the ends of the plurality of spray pipes (9) away from the respective corresponding hoses (8) are connected to a plurality of evenly distributed spray nozzles (10); The transmission mechanism includes two fixed seats (12), the two fixed seats (12) are respectively fixedly connected to the inner walls on both sides of the etching machine (1), and multiple evenly distributed rotating seats (13) are rotatably installed on the opposite sides of the two fixed seats (12), and multiple rotating seats (13) are each provided with a transmission groove (14) at one end away from the rectangular sliding frame (2), and multiple transmission rods (15) are movably installed inside the multiple transmission grooves (14), and multiple transmission rods (15) are fixedly connected to the U-shaped movable frame (11), and multiple spray pipes (9) are respectively arranged between the two opposite rotating seats (13).

2. A PCB board processing etching spray device according to claim 1, characterized in that: The transmission mechanism comprises a rectangular sliding frame (2) and two rectangular fixed frames (4), wherein a plurality of evenly distributed transmission rollers (3) are rotatably installed inside the rectangular sliding frame (2), and the two rectangular fixed frames (4) are respectively fixedly installed at the two ends inside the etching machine (1), and a plurality of evenly distributed pulleys (5) are rotatably installed on both sides of the rectangular sliding frame (2), and the top and bottom of the inner walls of the two rectangular fixed frames (4) are fixedly installed with limiting slides (6), and the four limiting slides (6) cooperate with the plurality of pulleys (5) respectively, and the U-shaped movable frame (11) at the bottom is fixedly connected to the rectangular sliding frame (2).

3. A PCB board processing etching spray device according to claim 1, characterized in that: Rectangular mounting blocks (16) are fixedly mounted on both sides of the plurality of spray pipes (9), mounting grooves (17) are provided inside the plurality of rotating seats (13), and the plurality of mounting grooves (17) cooperate with the plurality of rectangular mounting blocks (16).

4. A PCB board processing etching spray device according to claim 1, characterized in that: The four fixed seats (12) are each provided with an L-shaped chute (18), and the four L-shaped chute (18) are each slidably installed with an L-shaped slider (19). The four L-shaped sliders (19) are respectively fixedly connected to their corresponding U-shaped movable frames (11).

5. The PCB board processing etching spray device according to claim 1, characterized in that: The connecting mechanism includes a separation component 1 and a separation component 2, the separation component 1 includes a lifting rod (26), the lifting rod (26) is slidably mounted inside the connecting rod 2 (21), a plurality of evenly distributed card strips 1 (27) are fixedly mounted on the top of the lifting rod (26), a push plate (28) is provided inside the lifting rod (26), the bottom of the push plate (28) cooperates with the lifting rod (26), and two guide rods (29) are slidably sleeved at both ends of the push plate (28), four guide rods (29) are provided. The same side of the guide rods (29) is fixedly connected to the second connecting rod (21), and the outside of the four guide rods (29) is sleeved with a spring one (30). The spring two (31) is fixedly installed between the bottom of the lifting rod (26) and the inner wall of the second connecting rod (21). The second separation component is arranged inside the lifting rod (26). The bottom of the first connecting rod (20) is fixedly installed with a plurality of evenly distributed clip strips two (32), and the plurality of clip strips two (32) respectively cooperate with the plurality of clip strips one (27).

6. The PCB board processing etching spray device according to claim 5, characterized in that: The second separation component includes a connecting plate (33) and a wedge block (35), wherein the wedge block (35) is fixedly installed on a side of the etching machine (1) close to the second connecting rod (21), and the connecting plate (33) is slidably fitted inside the lifting rod (26). A spring three (34) is fixedly installed between the top of the connecting plate (33) and the inner wall of the lifting rod (26), and the end of the bottom of the connecting plate (33) close to the push plate (28) cooperates with the connecting groove (25), and the bottom end of the connecting plate (33) away from the push plate (28) cooperates with the wedge block (35).

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