Camera apparatus and optical apparatus including the same

Abstract

An embodiment includes: a fixed portion; and a moving portion including a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and moving in a direction perpendicular to the optical axis direction with respect to the fixed portion. The first circuit board includes a plurality of conductive layers and a terminal soldered to the second circuit board, and the terminal is positioned higher than a lowermost conductive layer of the plurality of conductive layers of the first circuit board.

Description

Technical Field

[0001] The embodiments relate to a camera device and an optical instrument including the camera device. Background Art

[0002] It is difficult to apply the voice coil motor (VCM) technology used in existing general camera devices to ultra-miniature and low-power camera devices, and thus related research has been actively carried out.

[0003] The demand for and production of electronic products such as smartphones and mobile phones equipped with cameras are increasing. The cameras of mobile phones are developing in the direction of high resolution and miniaturization. This has led to the need for actuators to also be miniaturized, have a large diameter, and be multifunctional. In order to implement a high-resolution camera for mobile phones, it is necessary to improve the performance of the mobile phone camera and add functions such as autofocus, shake correction, and zoom. Summary of the Invention

[0004] Technical Problem

[0005] The embodiments provide a camera device and an optical instrument including the camera device, which can improve the reliability of the electrical connection between the terminals of the first circuit board of the moving unit and the terminals of the second circuit board.

[0006] In addition, the embodiments provide a camera device and an optical instrument including the camera device, which can improve the radiation efficiency of heat generated by the heat source of the OIS moving unit.

[0007] The embodiments provide a camera device and an optical instrument including the camera device, which can simplify the assembly process, reduce the manufacturing cost, and prevent the reliability degradation of the autofocus operation caused by welding defects.

[0008] Technical Solution

[0009] A camera device according to an embodiment includes a fixed unit and a moving unit. The moving unit includes a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and can move relative to the fixed unit in a direction perpendicular to the optical axis direction. The first circuit board includes a plurality of conductive layers. The first circuit board includes terminals connected to the second circuit board by solder, and the terminals are positioned higher than the lowermost conductive layer among the plurality of conductive layers of the first circuit board.

[0010] The terminals may be located between the lowermost conductive layer and the uppermost conductive layer among the plurality of conductive layers of the first circuit board.

[0011] The terminals may be formed at another conductive layer disposed on the lowermost conductive layer among the plurality of conductive layers.

[0012] The terminals may be formed at the second lowermost conductive layer among the plurality of conductive layers.

[0013] The lowermost surface of the solder may be set to be higher than the lowermost surface of the second circuit board.

[0014] A plurality of conductive layers may be arranged to be spaced apart from each other in the optical axis direction, and the first circuit board may include a plurality of insulating layers disposed between the plurality of conductive layers.

[0015] A camera device according to another embodiment includes a fixing unit and a moving unit. The moving unit includes a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and is movable relative to the fixing unit in a direction perpendicular to the optical axis direction. The first circuit board includes a mounting groove recessed from its lower surface. The second circuit board is disposed in the mounting groove in the first circuit board. The first circuit board includes a first terminal, which is disposed in the mounting groove and is connected to the second circuit board through solder.

[0016] The second circuit board may include a second terminal, at least a part of which is disposed in the mounting groove and is connected to the first terminal through solder.

[0017] At least a part of the solder may be disposed in the mounting groove in the first circuit board.

[0018] The first circuit board may include a plurality of conductive layers arranged in the optical axis direction, and the first terminal may be positioned higher than the lowermost conductive layer among the plurality of conductive layers of the first circuit board.

[0019] The first terminal may be located between the lowermost conductive layer and the uppermost conductive layer among the plurality of conductive layers of the first circuit board.

[0020] The first terminal may be formed at another conductive layer disposed on the lowermost conductive layer among the plurality of conductive layers of the first circuit board.

[0021] The second terminal may be formed on the side surface of the second circuit board.

[0022] The second circuit board may include a plurality of conductive layers arranged in the optical axis direction, and the second terminal may be positioned higher than the lowermost conductive layer among the plurality of conductive layers of the second circuit board.

[0023] The second terminal may include a first pad formed on the side surface of the second circuit board and a second pad connected to the lower part of the first pad.

[0024] The second circuit board may include a plurality of conductive layers arranged in the optical axis direction, and the first pad and the second pad may be set to be higher than the lowermost conductive layer among the plurality of conductive layers of the second circuit board. The lowermost conductive layer of the second circuit board may be positioned lower than the lowermost conductive layer of the first circuit board. The solder may be connected to at least one of the first pad or the second pad.

[0025] The moving unit may include a first heat dissipation member disposed below the second circuit board and on which the image sensor is disposed, and the fixing unit may include a second heat dissipation member disposed spaced apart from the first heat dissipation member.

[0026] The second heat dissipation member may include a first region and a second region. The first region overlaps (is stacked) with the first heat dissipation member in the optical axis direction, and the second region does not overlap with the first heat dissipation member in the optical axis direction. And the first region may protrude toward the first heat dissipation member based on the second region. The image sensor may be disposed on the second circuit board.

[0027] A camera device according to another embodiment includes a fixing unit, a moving unit, and a support plate. The fixing unit includes a lens module and a position sensor configured to detect displacement of the lens module. The moving unit includes an image sensor. The support plate includes a first portion coupled to the fixing unit and a second portion coupled to the moving unit, and supports the moving unit such that the moving unit can move in a direction perpendicular to the optical axis direction. The support plate has an extending region extending from the first portion, and the position sensor is disposed in the extending region.

[0028] The moving unit may further include a holder and a first circuit board disposed on the holder and electrically connected to the image sensor. The fixing unit may include a base and a second circuit board disposed on the base and electrically connected to the support plate.

[0029] The extending region may include pads coupled to the position sensor.

[0030] The support plate may surround the holder. The first portion of the support plate may be coupled to the holder, and the second portion of the support plate may be coupled to the base.

[0031] The extending region may include a first region on which the position sensor is disposed and a second region connecting the first region to the second portion. The second region may include at least one bent portion. The support plate may include a wire connecting a terminal connected to the second circuit board to the pad of the extending region. The wire may be formed of a single conductive layer.

[0032] The fixing unit may include a housing and a bobbin disposed in the housing and coupled to the lens module, and at least a portion of the extending region may be disposed on the housing.

[0033] The base may include a protrusion coupled to the second portion of the support plate, and the protrusion may include a groove through which at least a portion of the extending region passes.

[0034] The length of the second region in the optical axis direction may be less than the length of the first region in the optical axis direction.

[0035] The fixing unit may include a magnet and a coil configured to move the lens holder in the optical axis direction, and an elastic member coupled to the housing and the lens holder and connected to the coil, and the elastic member may be electrically connected to the extension area.

[0036] The position sensor may be a driver IC including a Hall sensor, and the driver IC may supply a drive signal to the coil.

[0037] A camera device according to another embodiment includes a fixing unit, a moving unit, and a support plate. The fixing unit includes a lens module, a position sensor configured to displace the lens module, and a second circuit board. The moving unit includes an image sensor. The support plate is configured to support the moving unit such that the moving unit can move in a direction perpendicular to the optical axis direction, wherein the support plate includes a pad coupled to the position sensor, a terminal electrically connected to the second circuit board, and a wire connecting the pad to the terminal.

[0038] The support plate may include a first insulating layer, a second insulating layer, and a single conductive layer disposed between and in contact with the first and second insulating layers, and the terminals, pads, and wires of the support plate are formed by patterning the conductive layer.

[0039] The support plate may include a body and an extension area. The body includes a first part coupled to the fixing unit and a second part coupled to the moving unit. The extension area extends from the second part and the pad is disposed on the extension area.

[0040] The support plate may include an extension portion that extends from the second part of the body to the second circuit board, and the terminal is disposed on the extension portion. The extension portion may include first and second extension portions and third and fourth extension portions that are oppositely positioned with respect to the first and second extension portions, and the lens module is interposed therebetween. The terminal of the support plate may be disposed on one of the first and second extension portions.

[0041] Advantageous Effects

[0042] By positioning the terminals of the first circuit board of the OIS moving unit below the lowermost conductive layer of the first circuit board, the embodiment can increase the distance between the solder of the terminals coupled to the first circuit board and the fixing unit.

[0043] Since the distance between the solder and the fixing unit is increased, the embodiment can prevent cracks from occurring in the solder due to the collision between the solder and the fixing unit.

[0044] The embodiment can improve the reliability of the electrical connection between the terminals of the first circuit board and the terminals of the second circuit board by preventing cracks from occurring in the solder.

[0045] By disposing the second circuit board in the placement groove formed in the first circuit board, the embodiment can increase the distance between the OIS moving unit and the fixed unit.

[0046] The embodiment can reduce the height of the camera device in the optical axis direction within the increased distance range between the OIS moving unit and the fixed unit.

[0047] The embodiment can increase the thickness of the heat dissipation member disposed on the fixed unit within the increased distance range, thereby improving the heat dissipation efficiency of the heat source of the OIS moving unit.

[0048] The embodiment eliminates the need for an additional board design for arranging the AF position sensor because the portion of the board where the first position sensor is arranged is integrally formed with the support board.

[0049] The embodiment eliminates the management of component tolerances and assembly tolerances during the manufacture of the additional board.

[0050] The embodiment can simplify the assembly process of the camera device and the manufacturing cost of the camera device.

[0051] In addition, the embodiment can prevent the deterioration of the electrical connection reliability due to the soldering defect between the AF position sensor and the additional board, thereby preventing the AF operation failure or the deterioration of the reliability of the autofocus operation due to the soldering defect.

[0052] In addition, since there is no need to provide an opening in the cover member for soldering between the AF position sensor and the additional board, the embodiment can prevent foreign matter from entering the camera device. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 is a perspective view of a camera device according to an embodiment;

[0054] Figure 2 is a perspective view of the camera device with the cover member removed;

[0055] Figure 3 is Figure 1 an exploded perspective view of the camera device shown;

[0056] Figure 4a is along Figure 1 a cross-sectional view of the camera device taken along line A-B in

[0057] Figure 4b is along Figure 1 a cross-sectional view of the camera device taken along line C-D in

[0058] Figure 4c is along Figure 1 a cross-sectional view of the camera device taken along line E-F in

[0059] Figure 5 is Figure 3 exploded perspective view of the AF operation unit shown;

[0060] Figure 6 is a perspective view of a bobbin, a sensing magnet, a balance magnet, a first coil, a circuit board, a first position sensor, and a capacitor;

[0061] Figure 7a is a perspective view of a bobbin, a housing, a circuit board, an upper elastic member, a sensing magnet, and a balance magnet;

[0062] Figure 7b is another perspective view of the one additionally provided with a wire Figure 7a ;

[0063] Figure 8 is a bottom perspective view of a housing, a bobbin, a lower elastic member, a magnet, and a circuit board;

[0064] Figure 9 is a perspective view of an image sensor unit;

[0065] Figure 10a is Figure 9 the first exploded perspective view of the image sensor unit shown;

[0066] Figure 10b is Figure 9 the second exploded perspective view of the image sensor unit shown;

[0067] Figure 10c is Figure 10a an enlarged view of the groove in the holder shown;

[0068] Figure 10d is Figure 10a an enlarged view of the terminal member shown;

[0069] Figure 10e is Figure 10a an enlarged view of the groove in the base shown;

[0070] Figure 10f is an enlarged view of the groove in the holder in which the terminal member shown is provided Figure 10b ;

[0071] Figure 11 is Figure 10a a bottom perspective view of the holder, the terminal member, the first plate unit, the support plate, the heat dissipation member, the base, and the second plate unit shown;

[0072] Figure 12 is a plan view of the holder, the first plate unit, the image sensor, the second coil, and the OIS position sensor;

[0073] Figure 13 is a rear perspective view of the holding member and the first board unit;

[0074] Figure 14 is a perspective view of the base, terminal member, and wire;

[0075] Figure 15 is a bottom view of the first board unit, support board, and heat dissipation member;

[0076] Figure 16 is a perspective view of the first board unit, support board, and heat dissipation member;

[0077] Figure 17a is a first perspective view of the support board coupled to the holding member and the base;

[0078] Figure 17b is a second perspective view of the support board coupled to the holding member and the base;

[0079] Figure 18a shows the movement of the OIS moving unit in the X-axis direction;

[0080] Figure 18b shows the movement of the OIS moving unit in the Y-axis direction;

[0081] Figure 18c shows the clockwise rotation of the OIS moving unit in the case of being driven by four channels;

[0082] Figure 18d shows the counterclockwise rotation of the OIS moving unit in the case of being driven by four channels;

[0083] Figure 19a shows Figure 5 an embodiment of the magnet shown;

[0084] Figure 19b shows Figure 5 another embodiment of the magnet shown;

[0085] Figure 20a shows the layout of the first to third regions of the second board unit, extension region, AF moving unit, OIS moving unit, and controller according to an embodiment;

[0086] Figure 20b is a schematic cross-sectional view of the lens module, first board unit, image sensor, first board unit, and heat dissipation member;

[0087] Figure 21 is a block diagram showing the configuration of the controller and the first to third sensors;

[0088] Figure 22Is a perspective view of a first circuit board, a support board, a second circuit board, and a heat dissipation member;

[0089] Figure 23 Is Figure 4b A partially enlarged view of;

[0090] Figure 24 Is a partial cross-sectional view of a connecting member between the first circuit board and the support board;

[0091] Figure 25 Is a cross-sectional view of the first circuit board, the second circuit board, and the solder;

[0092] Figure 26 Is a cross-sectional view of the second circuit board, the first circuit board, and the solder according to another embodiment;

[0093] Figure 27 Is a cross-sectional view of the second circuit board, the first circuit board, and the solder according to another embodiment;

[0094] Figure 28 Is a perspective view of the first circuit board and the second circuit board according to another embodiment;

[0095] Figure 29a Is Figure 28 The cross-sectional view of the first circuit board, the second circuit board, and the solder shown;

[0096] Figure 29b Is a cross-sectional view of the solder according to another embodiment;

[0097] Figure 30 Shows the cracks generated by the solder in the impact experiment according to the comparative example;

[0098] Figure 31 Is a perspective view of a camera device according to an embodiment;

[0099] Figure 32 Is the Figure 31 Perspective view of the camera device shown with the cover member removed;

[0100] Figure 33 Is Figure 31 Exploded perspective view of the camera device shown;

[0101] Figure 34a Is along Figure 31 Cross-sectional view of the camera device taken along line A-B in;

[0102] Figure 34b Is along Figure 31 Cross-sectional view of the camera device taken along line C-D in;

[0103] Figure 34c Is along Figure 31Cross-sectional view of the camera device taken along line E-F;

[0104] Figure 35 is Figure 33 Exploded perspective view of the AF operation unit shown;

[0105] Figure 36 Perspective view of the bobbin, sensing magnet, balance magnet, first coil, first position sensor, and capacitor;

[0106] Figure 37 Perspective view of the bobbin, housing, upper elastic member, wire, damper, sensing magnet, and balance magnet;

[0107] Figure 38 Bottom perspective view of the housing, bobbin, lower elastic member, magnet, and lower elastic member;

[0108] Figure 39 is Figure 33 Perspective view of the image sensor unit shown;

[0109] Figure 40a is Figure 39 First exploded perspective view of the image sensor unit shown;

[0110] Figure 40b is Figure 39 Second exploded perspective view of the image sensor unit shown;

[0111] Figure 41 is Figure 40a Bottom perspective view of the holder, terminal member, first plate unit, support plate, heat dissipation member, base, and second plate unit shown;

[0112] Figure 42 Plan view of the holder, first plate unit, image sensor, second coil, and OIS position sensor;

[0113] Figure 43 Rear perspective view of the holder and first plate unit;

[0114] Figure 44 Perspective view of the base, terminal member, and wire;

[0115] Figure 45 Bottom view of the first plate unit, support plate, and heat dissipation member;

[0116] Figure 46 Perspective view of the first plate unit, support plate, and heat dissipation member;

[0117] Figure 47a First perspective view of the support plate connected to the holder and base;

[0118] Figure 47b is a second perspective view of a support plate connected to a holder and a base;

[0119] Figure 48a is a first perspective view of the support plate, a first position sensor, and a capacitor;

[0120] Figure 48b is a second perspective view of the support plate, the first position sensor, and the capacitor;

[0121] Figure 49a is another perspective view of the camera device;

[0122] Figure 49b is Figure 49a a perspective view of the camera device shown, in which the cover member and the housing are removed;

[0123] Figure 50 shows terminals of an extension portion of the support plate;

[0124] Figure 51 is a bottom view of the support plate and a first plate unit;

[0125] Figure 52 shows pads and wires in an extended area of the support plate;

[0126] Figure 53 is a perspective view of a camera device including a cover member according to another embodiment;

[0127] Figure 54a is a perspective view showing an optical instrument according to an embodiment;

[0128] Figure 54b is a perspective view of an optical instrument according to another embodiment;

[0129] Figure 54c is a perspective view of an optical instrument according to another embodiment;

[0130] Figure 55 is showing Figures 54a to 54c a view of the configuration of the optical instrument shown. DETAILED DESCRIPTION

[0131] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0132] The technical idea of the present invention can be embodied in many different forms and should not be construed as being limited to the following embodiments described herein. One or more components of the embodiments can be selectively combined with or replaced by each other without departing from the technical spirit and scope of the present invention.

[0133] Unless otherwise specifically defined, the terms (including technical and scientific terms) used in the embodiments of the present invention have the same meanings as those commonly understood by those of ordinary skill in the art to which the present invention pertains. It should be further understood that common terms, such as those defined in a dictionary, should be interpreted as having meanings consistent with their meanings in the context of the relevant art.

[0134] The terms used in the embodiments of the present invention are only used to describe specific embodiments and are not intended to limit the present invention. As used in this disclosure and the appended claims, unless the context clearly indicates otherwise, the singular forms are also intended to include the plural forms. The phrase "at least one of A, B, or C" or "one or more of A, B, and C" can be interpreted to include one or more of all combinations of A, B, and C.

[0135] In addition, when describing the components of the present invention, terms such as "first", "second", "A", "B", "(a)", or "(b)" may be used. Since these terms are provided only to distinguish components from each other, they do not limit the nature, order, or sequence of the components.

[0136] It should be understood that when an element is referred to as being "linked", "coupled", or "connected" to another element, the element can be directly "linked", "coupled", or "connected" to the other element, or it can be "linked", "coupled", or "connected" to the other element through another intervening element. In addition, it can be understood that when an element is referred to as being formed "on" or "under" another element, it can be directly "on" or "under" the other element, or it can be disposed indirectly relative to the other element, with one or more intervening elements therebetween. In addition, it can also be understood that being "on" or "under" an element may mean based on the upward or downward direction of the element.

[0137] Hereinafter, the AF operation unit may also be referred to as a "lens moving device", "lens moving unit", "VCM (voice coil motor)", "actuator", or "lens moving device". Hereinafter, the term "coil" may be used interchangeably with "coil unit", and the term "elastic member" may also be used interchangeably with "elastic unit" or "spring".

[0138] In the following description, "terminal" may also be referred to as "pad", "electrode", "conductive layer", or "bonding portion".

[0139] In the following description, the terms "plate portion", "printed circuit board", "circuit board", and "board" may be used interchangeably with each other.

[0140] For ease of description, although the camera module according to an embodiment is described using an orthogonal coordinate system (x, y, z), some other coordinate systems can be used to describe the lens moving device, and the embodiment is not limited thereto. In the respective figures, the X-axis direction and the Y-axis direction refer to the directions perpendicular to the optical axis (i.e., the Z-axis). The Z-axis direction, which is the direction of the optical axis OA, can be referred to as the "first direction", the X-axis direction can be referred to as the "second direction", and the Y-axis direction can be referred to as the "third direction". In addition, for example, the X-axis direction can be expressed as "one of the first horizontal direction and the second horizontal direction", and the Y-axis direction can be referred to as "the other of the first horizontal direction and the second horizontal direction".

[0141] For example, the optical axis can be the optical axis of a lens mounted on a lens barrel. Or, for example, the optical axis can be an axis perpendicular to the imaging area of an image sensor and extending through the center of the imaging area.

[0142] The first direction can be the direction perpendicular to the imaging area of the image sensor. In addition, the optical axis direction can be the direction parallel to the optical axis.

[0143] The camera device according to an embodiment of the present invention is capable of performing an "autofocus function". Here, the "autofocus function" is used to automatically focus an image of an object on the surface of the image sensor.

[0144] Hereinafter, the camera device may also be referred to as a "camera module", "camera assembly", "camera unit", "camera", "imaging device", or "lens moving device".

[0145] In addition, the camera device according to the present embodiment can perform a function of "handshake correction". Here, the function of "handshake correction" can be used to prevent the contour lines of a captured image from being blurred due to vibrations caused by the shaking of the user's hand when capturing a still image.

[0146] Figure 1 is a perspective view of a camera device 1010 according to an embodiment. Figure 2 is a perspective view of the camera device 1010 with the cover member 1300 removed. Figure 3 is Figure 1 an exploded perspective view of the camera device 1010 shown. Figure 4a is along Figure 1 a cross-sectional view of the camera device 1010 taken along line A-B in. Figure 4b is along Figure 1 a cross-sectional view of the camera device 1010 taken along line C-D in. Figure 4c is along Figure 1 a cross-sectional view of the camera device 1010 taken along line E-F in. Figure 5 is Figure 3 an exploded perspective view of the AF operation unit 1100 shown. Figure 6is a perspective view of the bobbin 1110, the sensing magnet 1180, the balance magnet 1185, the first coil 1120, the circuit board 1190, the first position sensor 1170, and the capacitor 1195. FIG. 7 is a perspective view of the bobbin 1110, the housing 1140, the circuit board 1190, the upper elastic member 1150, the sensing magnet 1180, and the balance magnet 1185. Figure 8 is a bottom perspective view of the housing 1140, the bobbin 1110, the lower elastic member 1160, the magnet 1130, and the circuit board 1190.

[0147] Referring to Figures 1 to 8 , the camera device 1010 may include an AF operation unit 1100 and an image sensor unit 1350. The AF operation unit 1100 may include an AF moving unit. The image sensor unit 1350 may include an OIS operation unit. The OIS operation unit may include an OIS moving unit. One of the AF moving unit and the OIS moving unit may be a first moving unit, and the other of the AF moving unit and the OIS moving unit may be a second moving unit.

[0148] The camera device 1010 may further include at least one of a cover member 1300 or a lens module 1400. The cover member 1300 and the base 1210, which will be described later, may form an outer shell.

[0149] The AF operation unit 1100 may be coupled to the lens module 1400 to move the lens module in the direction of the optical axis OA or in a direction parallel to the optical axis, and may perform the autofocus function of the camera device 1010.

[0150] The image sensor unit 1350 may include an image sensor 1810. For example, the image sensor unit 1350 (or the OIS operation unit) may include an OIS operation unit that includes the image sensor 1810. For example, the image sensor unit 1350 may move the OIS moving unit (e.g., the image sensor 1810) in a direction perpendicular to the optical axis. In addition, the image sensor unit 1350 may cause the OIS moving unit (e.g., the image sensor 1810) to tilt or rotate (or roll) with respect to the optical axis or around the optical axis. With the image sensor unit 1350, the camera device 1010 may perform shake correction.

[0151] For example, the image sensor 1810 may include an imaging area configured to sense light passing through the lens module 1400. Here, the imaging area may alternatively be referred to as an "effective area", a "light receiving area", an "active area", or a "pixel area". For example, the imaging area of the image sensor 1810 may be an area where light passing through the filter 1610 is incident thereon, so that an image included in the light is formed in this area, and may include at least one unit pixel. For example, the imaging area may include a plurality of unit pixels.

[0152] The AF operation unit 1100 may also be referred to as a "lens moving unit" or a "lens moving device". Alternatively, the AF operation unit 1100 may also be referred to as a "first moving unit (or second moving unit)", a "first actuator (or second actuator)", or an "AF operation unit".

[0153] In addition, the image sensor unit 1350 may also be referred to as an "image sensor moving unit", an "image sensor shifting unit", a "sensor moving unit", or a "sensor shifting unit". In addition, the image sensor unit 1350 may alternatively be referred to as a "second moving unit" (or "first moving unit") or a "second actuator" (or "first actuator").

[0154] Refer to Figure 5 and Figure 6 , the AF operation unit 1100 may move the lens module 1400 in the optical axis direction. For example, the AF operation 1100 may move the bobbin 1110 in the optical axis direction. For example, the AF operation unit 1100 may include a bobbin 110, a first coil 1120, a magnet 1130, and a housing 1140. The AF operation unit 1100 may further include an upper elastic member 1150 and a lower elastic member 1160.

[0155] The AF operation unit 1100 may further include a first position sensor 1170, a circuit board 1190, and a sensing magnet 1180 for AF feedback operation. In addition, the AF operation unit 1100 may further include at least one of a balance magnet 1185 or a capacitor 1195.

[0156] The bobbin 1110 may be disposed in the housing 1140 and may move in the direction of the optical axis OA or in a first direction (e.g., along the Z-axis direction) by the electromagnetic interaction between the first coil 1120 and the magnet 1130.

[0157] The bobbin 1110 may include a perforation, to which the lens module 1400 is coupled or on which the lens module 1400 is mounted. For example, the perforation in the bobbin 1110 may be a through hole formed through the bobbin 1110 in the optical axis direction. Although the perforation in the bobbin 1110 may have a circular, elliptical, or polygonal shape, the present disclosure is not limited thereto.

[0158] For example, the lens module 1400 may include at least one lens and / or a lens barrel. For example, the lens module 1400 may include one or more lenses and a lens barrel that receives the one or more lenses therein. However, the components of the lens module are not limited to the lens barrel and may be any other components as long as the components have a holding structure capable of supporting one or more lenses.

[0159] For example, the lens module 1400 may be threadedly coupled to the bobbin 1110. Alternatively, for example, the lens module 1400 may be coupled to the bobbin 1110 by an adhesive (not shown). Light passing through the lens module 1400 may be irradiated onto the image sensor 1810 through the filter 1610.

[0160] The bobbin 1110 may include one or more protrusions 1111A and 1111B provided on its outer surface. For example, although the one or more protrusions 1111A and 1111B may protrude in a direction parallel to the wire in the direction perpendicular to the optical axis OA, the present disclosure is not limited thereto. For example, the bobbin 1110 may include two protrusions 1111A and 1111B that are positioned opposite to each other.

[0161] The protrusions 1111A and 1111B of the bobbin 1110 may correspond to the grooves 1025A and 1205B in the housing 1140 and may be inserted or disposed in the grooves 1025A and 1205B in the housing 1140 to inhibit or prevent the bobbin 1110 from rotating about the optical axis beyond a predetermined range.

[0162] The bobbin 1110 may include a protrusion 1146A that protrudes in a direction perpendicular to the optical axis. For example, the protrusion 1146A of the bobbin 1110 may be provided at a corner of the bobbin 1110.

[0163] The housing 1140 may include a groove 146B that corresponds to, faces, or overlaps with the protrusion 1146A of the bobbin 1110. At least a portion of the protrusion 1146A may be disposed in the groove 1146B in the housing 1140.

[0164] The protrusion 1146A of the bobbin 1110 may be used as a stopper configured to allow the bobbin 1110 to move within a predetermined range in the optical axis direction (e.g., in a direction from the upper elastic member 1150 toward the lower elastic member 1160).

[0165] The upper surface of the bobbin 1110 may be provided with a first avoidance groove 1113a therein to avoid spatial interference with the first frame connector 1153 of the upper elastic member 1150. In addition, the lower surface of the bobbin 1110 may be provided with a second avoidance groove 1112b therein to avoid spatial interference with the second frame connector 1163 of the lower elastic member 1160.

[0166] The bobbin 1110 may include a first coupler 1116a that is coupled or fixed to the upper elastic member 1150. For example, although the first coupler 1116a of the bobbin 1110 may be in the form of a protrusion, the present disclosure is not limited thereto. In another embodiment, the first coupler 1116a may be in the form of a flat surface or a groove. In addition, the bobbin 1110 may include a second coupler 1116b that is coupled or fixed to the lower elastic member 1160. For example, although the second coupler 1116b may be in the form of a protrusion, the present disclosure is not limited thereto. In another embodiment, the second coupler 1116b may be in the form of a flat surface or a groove.

[0167] Referring to Figure 5 , a groove 1105 may be provided on the outer surface of the bobbin 1110, and the first coil 1120 may be placed, inserted, or arranged in the groove 1105. For example, the groove 1105 in the bobbin 1110 may have a shape consistent with the shape of the first coil 1120, that is, a closed curve shape (e.g., annular).

[0168] In addition, the bobbin 1110 may be provided with a first placement groove 1026a for the sensing magnet 1180 to be placed, inserted, fixed, or set in the first placement groove 1026a. In addition, a second placement groove 26b may be provided in the outer surface of the bobbin 1110, and the balance magnet 1185 is placed, inserted, fixed, or set in the second placement groove 26b.

[0169] For example, the first placement groove 1026a and the second placement groove 1026b in the bobbin 1110 may be formed in the opposite outer surfaces of the bobbin 1110. For example, the first placement groove 1026a may be formed in the first protrusion 1111A of the bobbin 1110, and the second placement groove 1026b may be formed in the second protrusion 1111B of the bobbin 1110.

[0170] The bobbin 1110 may include a guiding protrusion 1104A configured to guide a part of the first frame connector 1153 of the upper elastic member 1150. For example, the guiding protrusion 1104A may protrude from the bottom surface of the avoidance portion 1112a of the bobbin 1110.

[0171] Referring to Figure 5With reference to FIGS. 6 and 7, damper 1048 can be disposed between bobbin 1110 and upper elastic member 1150. For example, damper 1048 can be disposed between bobbin 1110 and first frame connector 1153 of upper elastic member 1150, and can be in contact with, coupled to, or attached to bobbin 1110 and first frame connector 1153.

[0172] For example, upper elastic member 1150 can include an extension (or protrusion) extending from first frame connector 1153. Extension 1155 can be spaced apart from each of outer frame 1152 and inner frame 1151. Extension 1155 can be spaced apart from one end of first frame connector 1153 connected to inner frame 1151 and the other end of first frame connector 1153 connected to outer frame 1152. Extension 1155 can extend toward the upper surface of bobbin 1110.

[0173] For example, a portion (or end) of extension 1155 can be disposed on damper 1048, which is disposed on the upper surface of bobbin 1110, and a portion of extension 1155 can overlap with damper 1048. For example, bobbin 1110 can include receiving portion 1104B, in which damper 1048 is received or disposed. For example, receiving portion 1104B can be a groove. Receiving portion 1104B can be recessed from the bottom surface of relief portion 112a of bobbin 1110.

[0174] For example, damper 1048 can be disposed between receiving portion 1104B of bobbin 1110 and extension 1155 of upper elastic member 1150, and can be in contact with, coupled to, or attached to receiving portion 1104B and extension 1154. Since damper 1048 is in contact with or attached to both extension 1155 and receiving portion 1104B, damper 1048 can be used to damp or absorb the vibration of bobbin 1110. For example, damper 1048 can be made of a damping member (such as silicone).

[0175] First coil 1120 can be disposed or coupled to bobbin 1110. For example, first coil 1120 can be disposed or coupled to the outer surface of bobbin 1110. For example, although first coil 1120 can be around the outer surface of bobbin 1110 in the rotational direction about optical axis OA, the present disclosure is not limited thereto.

[0176] Although first coil 1120 can be directly wound around the outer surface of bobbin 1110, the present disclosure is not limited thereto. In another embodiment, first coil 1120 can be disposed as a coil loop wound around bobbin 1110, or can be disposed as an angled coil block.

[0177] Power or a drive signal can be supplied to the first coil 1120. The power or drive signal supplied to the first coil 1120 can be a DC signal, an AC signal, or a signal including DC and AC components, and can be a voltage type or a current type.

[0178] When a drive signal (e.g., a drive current) is supplied to the first coil 1120, an electromagnetic interaction between the first coil 1120 and the magnet 1130 can generate an electromagnetic force, and the bobbin 1110 can move in the optical axis direction OA by the generated electromagnetic force.

[0179] At the initial position of the AF operation unit, the bobbin 1110 can move upward or downward from the initial position of the AF operation unit, which is referred to as bidirectional driving of the AF operation unit. Alternatively, at the initial position of the AF operation unit, the bobbin 1110 can move upward, which is referred to as unidirectional driving of the AF operation unit.

[0180] At the initial position of the AF operation unit, the first coil 1120 can correspond to or overlap with the magnet 1130 provided on the housing 1140 in a direction perpendicular to the optical axis OA and parallel to the (straight) line passing through the optical axis.

[0181] For example, the AF operation unit can include a bobbin 1110 and components coupled to the bobbin 1110 (e.g., the first coil 1120, the sensing magnet 1180, and the balance magnets 1180 and 1185). The AF operation unit can also include a lens module 1400.

[0182] The initial position of the AF operation unit can be the original position of the AF operation unit in a state where no power is applied to the coil 120, or the position where the AF operation unit is located when the upper elastic member 1150 and the lower elastic member 1160 are elastically deformed only due to the weight of the AF operation unit. In addition, the initial position of the bobbin 110 can be the position where the AF operation unit is located when gravity acts in the direction from the bobbin 110 to the base 210 or when gravity acts in the direction from the base 210 to the bobbin 110.

[0183] The sensing magnet 180 can provide a magnetic field detected by the first position sensor 1170, and the balance magnet 1185 can be used to cancel the influence of the magnetic field of the sensing magnet 1180 and establish a weight balance relative to the sensing magnet 1180.

[0184] The sensing magnet 1180 may also be referred to as a "sensor magnet" or a "second magnet". The sensing magnet 1180 may be disposed on the bobbin 1110 or may be coupled to the bobbin 1110. The sensing magnet 1180 may be arranged to face the first position sensor 1170. The balance magnet 1185 may be disposed on the bobbin 1110 or may be coupled to the bobbin 1110. For example, the balance magnet 1185 may be disposed opposite to the sensing magnet 1180. The balance magnet 1185 may alternatively be referred to as a "balance member" or a "weight member". In another embodiment, the balance member may be a non-magnetic body.

[0185] For example, although each of the sensing magnet 1180 and the balance magnet 1185 may be a unipolar magnetized magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of the sensing magnet 1180 and the balance magnet 1185 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0186] The sensing magnet 1180 may move together with the bobbin 1110 in the optical axis direction, and the first position sensor 1170 may detect the intensity or magnetic force of the magnetic field of the sensing magnet 1180 moving in the optical axis direction and may output an output signal corresponding to the detection result.

[0187] For example, according to the displacement of the bobbin 1110 in the optical axis direction, the intensity or magnetic force of the magnetic field detected by the first position sensor 1170 may change. Therefore, the first position sensor 1170 may output an output signal proportional to the detected magnetic field intensity, and the output signal from the first position sensor 1170 may be used to detect the displacement of the bobbin 1110 in the optical axis direction.

[0188] The housing 1140 may be disposed in the cover member 1300. For example, the housing 1140 may be disposed on the image sensor unit 1350.

[0189] The housing 1140 may accommodate the bobbin 1110 therein and may support the magnet 1130, the first position sensor 1170, and the circuit board 1190.

[0190] Refer to Figure 37 、 Figure 38 and FIG. 40, the housing 1140 may have a hollow columnar shape. For example, the housing 1140 may have a polygon (e.g., a rectangle or an octagon) or a circular perforation, and the perforation in the housing 1140 may be a through hole that is formed to pass through the housing 1140 in the optical axis direction.

[0191] The housing 1140 may include sides and corners, where the sides correspond to or face the side plates 1302 of the cover member 1300, and the corners correspond to or face the corners of the cover member 300.

[0192] To prevent direct collision with the inner surface of the upper plate 1301 of the cover member 1300, the housing 1140 may include a stopper 1145 provided on its upper part, upper surface, or upper end.

[0193] Referring Figure 5 , the housing 1140 may have a mounting groove (or recess) 1014a configured to receive the circuit board 1190 therein. The mounting groove 1014a may have a shape corresponding to the shape of the circuit board 1190.

[0194] Referring Figure 7a and Figure 7b , the housing 1140 may include protrusions 1044A and 1044B surrounding at least one of the circuit board 1190 or the support plate 1310. For example, the protrusions 1044A and 1044B may be provided or formed on the outer surface of the housing 1140. For example, the protrusions 1044A and 1044B may be provided or formed on the outer surface of the sides of the housing 1140. The protrusions 1044A and 1044B may also be referred to as "protective members", "support members", "extension members", or "guide members".

[0195] The protrusions 1044A and 1044B of the housing 1140 may surround at least a portion of the circuit board 1190 and at least a portion of the support plate 1310. For example, the housing 1140 may include a first protrusion 1044A provided on a first side of the housing and a second protrusion 1044B provided on a second side of the housing 1140. The first protrusion 1044A and the second protrusion 1044B may be positioned relative to each other based on the optical axis OA or the bobbin 1110. In another embodiment, the second protrusion 1044B may be omitted.

[0196] For example, the circuit board 1190 may be disposed in the first protrusion 1044A. For example, the mounting groove 1014A may be formed in the first protrusion 1044A.

[0197] For example, each of the first protrusion 1044A and the second protrusion 1044B may include a first portion 1047A connected to the upper surface of the housing 1140, and a second portion 1047B connected to the first portion 1047A and spaced apart from the side portion of the housing 1140. For example, the first portion 1047A of the first protrusion 1044A may be connected to the upper surface of the first side portion of the housing 1140, and the first portion 1042A of the second protrusion 1044B may be connected to the upper surface of the second side portion of the housing 1140. For example, the first portion 1047A may protrude from the upper surface of the housing 1140 in the optical axis direction or in the direction toward the inner surface of the upper plate 1301 of the cover member 1300.

[0198] For example, at least a portion of the circuit board 1190 may be located between the first portion 1047A and the second portion 1047B of the first protrusion 1044A. Further, for example, at least a portion of the support plate 1310 may be located between the first portion 1047A and the second portion 1047B of the first protrusion 1044A.

[0199] The housing 1140 may include an opening through which the terminals B1 to B4 of the terminal member 1095 of the circuit board 1190 are exposed. The opening may be formed in the side portion of the housing 1140.

[0200] Each of the first protrusion 1044A and the second protrusion 1044B of the housing 1140 may include a third portion 1037C extending from the second portion 1047B. For example, the third portion 1037C may extend or protrude from the lower portion or the lower end of the second portion 1047B in a direction parallel to the outer surface of the first side portion (or the second side portion) of the housing 1140 (e.g., in the second horizontal direction).

[0201] For example, the third portion 1037C may include a first portion of the third portion extending from one end of the second portion 1047B, and a second portion of the third portion extending from the other end of the second portion. The first portion and the second portion in the third portion may extend or protrude in opposite directions.

[0202] An adhesive or a sealing member may be provided between the protrusions 1044A and 1044B of the housing 1140 and the cover member 1300. For example, an adhesive (or a sealing member) may be provided between the protrusions 1044A and 1044B of the housing 1140 and the side plates 1302 of the cover member 1300 to bond them therebetween. The protrusions 1044A and 1044B may increase the coupling area between the protrusions and the side plates of the cover member 1300, and may stably couple the housing 1140 to the cover member 1300 without interfering with the support plate 1310.

[0203] The upper part, upper end, or upper surface of the housing 1140 may be provided with at least one first coupler that is coupled to the first outer frame 1152 of the upper elastic member 1150. The lower part, lower end, or lower surface of the housing 1140 may be provided with a second coupler that is coupled and fixed to the second outer frame 1162 of the lower elastic member 1160. For example, each of the first and second couplers of the housing 1140 may have the shape of a flat surface, a protrusion, or a groove.

[0204] Holes 1147 may be provided at the corners of the housing 1140, and the holes 1147 are paths for the wires 1220 to extend through. The holes 1147 may be through holes formed through the housing 1140 in the optical axis direction. In another embodiment, the holes may be structures recessed from the outer surface of the corner portion of the housing 1140, and at least a portion of the holes may open at the outer surface of the corner portion. The number of holes 1147 in the housing 1140 may be equal to the number of support members.

[0205] The magnet 1130 may be provided, coupled, or fixed to the housing 1140 as a fixing unit. For example, the magnet 1130 may be provided, coupled, or fixed to the side portion of the housing 1140. The magnet 1130 may include an AF operation magnet 1071A for AF operation. In addition, the magnet 1130 may include an OIS operation magnet 1071B for OIS operation. Hereinafter, the AF operation magnet 1071A may be represented as one of the first magnet and the second magnet, and the OIS operation magnet 1071B may be represented as the other of the first magnet and the second magnet.

[0206] In another embodiment, the magnet 1130 may be provided, coupled, or fixed to the corner portion of the housing.

[0207] For example, the magnet 1130 may include a plurality of magnet units. For example, the magnet 1130 may include a first magnet unit 1130-1 to a fourth magnet unit 1130-4 provided on the housing 1140. In another embodiment, the magnet 1130 may include two or more magnet units.

[0208] The magnet 1130 may be provided on at least one of the side portion or the corner portion of the housing 1140. For example, at least a portion of the magnet 1130 may be provided on the side portion or the corner portion of the housing 1140. Alternatively, for example, at least a portion of the magnet 1130 may be provided on the side portion of the housing 1140, and the remaining portion of the magnet 1130 may be provided on the corner portion of the housing 1140.

[0209] For example, each of the magnet units 1130-1 to 1130-4 may include a first portion disposed at a corresponding one of the four corners of the housing 140. In addition, each of the magnet units 1130-1 to 1130-4 may include a second portion disposed at a side of the housing 1140 adjacent to the corresponding corner of the housing 1140.

[0210] For example, the first magnet unit 1130-1 and the third magnet unit 1130-3 may be positioned opposite to each other based on the housing 1140 in a first horizontal direction (e.g., in the Y-axis direction). For example, the second magnet unit 1130-2 and the fourth magnet unit 1130-4 may be positioned opposite to each other based on the housing 1140 in a second horizontal direction (e.g., in the X-axis direction).

[0211] For example, the first magnet unit 130-1 and the third magnet unit 1130-3 may be arranged parallel to each other in the second horizontal direction (e.g., in the X-axis direction), and the second magnet unit 1130-2 and the fourth magnet unit 1130-4 may be arranged parallel to each other in the first horizontal direction (e.g., in the Y-axis direction).

[0212] At the initial position of the AF operation unit, the magnet 1130 may be disposed on the housing 1140 so as to partially overlap with the first coil 1120 in a direction perpendicular to the optical axis OA and parallel to the line passing through the optical axis OA.

[0213] The magnet 1130 may include a monopole magnetized magnet or a dipole magnet, which includes one N pole and one S pole. In another embodiment, the magnet 1130 may include a bipolar magnetized magnet or a quadrupole magnet, which includes two N poles and two S poles. In another embodiment, the magnet 1130 may include a monopole magnetized magnet and a bipolar magnetized magnet.

[0214] For example, the magnet 1130 may include an AF magnet (or AF operation magnet) for AF operation and an OIS magnet (or OIS operation magnet) for OIS operation. In another embodiment, for example, the magnet 1130 may be a common magnet for AF operation and OIS operation.

[0215] Figure 19a Is shown Figure 5 An embodiment of the shown magnet 1130.

[0216] Referring to Figure 19a , the magnet 1130 may include a first magnet 1071A as an AF operation magnet and a second magnet 1071B disposed below the first magnet 1071A.

[0217] The first magnet 1071A may be a dipole magnet including one N pole and one S pole. For example, the N pole and the S pole of the first magnet 1071A may be arranged to face or oppose each other in a direction perpendicular to the optical axis. In another embodiment, the first magnet 1071A may be a quadrupole magnet including two N poles and two S poles.

[0218] The first magnet 1071A may include a plurality of magnet units 1071A1 to 1071A4. As described above, each of the plurality of magnet units 1071A1 to 1071A4 may be a dipole magnet or a quadrupole magnet. For example, the magnet units 1071A1 to 1071A4 may have the same size and shape. For example, two magnet units 1071A1 and 1071A3 that are opposite to each other in the first diagonal direction may have the same size and shape, while the remaining two magnet units 1071A2 and 1071A4 that are opposite to each other in the second diagonal direction may have the same size and shape.

[0219] In another embodiment, the size and shape of each of the two magnet units 1071A1 and 1071A3 may be different from the size and shape of each of the remaining two magnet units 1071A2 and 1072A4. For example, the length of the long side of each of the two magnet units 1071A1 and 1071A3 may be greater than the long side of each of the remaining two magnet units 1071A2 and 1071A4. For example, the length of the short side of each of the two magnet units 1071A and 1071A3 may be equal to the length of the short side of each of the remaining two magnet units 1071A2 and 1071A4.

[0220] The second magnet 1071B may be a quadrupole magnet including two N poles and two S poles. For example, the second magnet 1071B may include a first magnet portion 1030A, a second magnet portion 1030B, and a partition wall 1030C disposed between the first magnet portion 1030A and the second magnet portion 1030B. Here, the partition wall 1030C may be a non-magnetic material or air, and may be referred to as a "neutral zone (intermediate zone)". In another embodiment, the second magnet 1071B may be a dipole magnet including one N pole and one S pole.

[0221] For example, the first magnet portion 1030A and the second magnet portion 1030B may be spaced apart from each other in a direction perpendicular to the first direction (or the optical axis direction). For example, the first magnet portion 1030A may include a first N pole and a first S pole that face each other or are opposite to each other in the optical axis direction. The second magnet portion 1030B may include a second N pole and a second S pole that face each other or are opposite to each other in the optical axis direction. In addition, the first N pole (or the first S pole) of the first magnet portion 1030A and the second S pole (or the second N pole) of the second magnet portion 1030B may face each other or be opposite to each other in a direction perpendicular to the optical axis.

[0222] The second magnet 1071B may include a plurality of magnet units 1071B1 to 1071B4. As described above, each of the plurality of magnet units 1071B1 to 1071B4 may be a quadrupole magnet. In another embodiment, each of the magnet units 1071B1 to 1071B4 may be a dipole magnet. Each of the magnet units 1071B1 to 1071B4 may face or overlap a corresponding one of the second coil units 1230-1 to 1230-4.

[0223] For example, the magnet units 1071B1 to 1071B4 may have the same size and shape. For example, two magnet units 1071B1 and 1071B3 that are opposite to each other in the first diagonal direction may have the same size and shape, and the remaining two magnet units 1071B2 and 1071B4 that are opposite to each other in the second diagonal direction may have the same size and shape.

[0224] In another embodiment, the size and shape of each of the two magnet units 1071B1 and 1071B3 may be different from the size and shape of each of the remaining two magnet units 1071B2 and 1071B4. For example, the length of the long side of each of the two magnet units 1071B1 and 1071B3 may be greater than the length of the long side of each of the remaining two magnet units 1071B2 and 1071B4. For example, the length of the short side of each of the two magnet units 1071B1 and 1071B3 may be equal to the length of the short side of each of the remaining two magnet units 1071B2 and 1071B4.

[0225] The second magnet 1071B may be disposed below the first magnet 1071A. The second magnet 1071B may be disposed on the lower surface of the first magnet 1071A. For example, the upper surface of the second magnet 1071B may be in contact with the lower surface of the first magnet 1071A, or may be fixed or coupled to the lower surface of the first magnet 1071A by an adhesive. For example, at least a part of the first magnet 1071A may overlap at least a part of the second magnet 1071B in the first direction (or the optical axis direction).

[0226] In another embodiment, the second magnet may be spaced apart from the first magnet. Here, a portion of the housing 1140 may be disposed between the first magnet and the second magnet. In another embodiment, a spacer wall or yoke may be disposed between the first magnet and the second magnet. Here, the description of the spacer wall 1030C may be applied to the spacer wall with or without modification.

[0227] For example, the length T2 of the second magnet 1071B in the optical axis direction may be less than the length T1 of the first magnet 1071A in the optical axis direction (T2 < T1). In another embodiment, the length T2 may be equal to the length T1.

[0228] The length L2 of the long side of the second magnet 1071B may be equal to or less than the length L1 of the long side of the first magnet 1071A (L2 ≤ L1). In another embodiment, the length L2 may be greater than the length L1.

[0229] In addition, the width W2 (or the length of the short side) of the second magnet 1071B may be equal to or less than the width W1 (or the length of the short side) of the first magnet 1071A (W2 ≤ W1). In another embodiment, the width W2 may be greater than the width W1.

[0230] In the initial position of the AF moving unit, the first coil 1120 may face or overlap the first magnet 1071A in a direction perpendicular to the first direction (or the optical axis direction). Although in Figure 19a the N pole of the first magnet 1071A may be set to face the first coil 1120, or may be positioned closer to the first coil 1120 than the S pole, in another embodiment, this setting may be reversed.

[0231] For example, in the initial position of the OIS moving unit, at least a portion of the first magnet 1130 may overlap at least a portion of the second coil 1230 in the first direction (or the optical axis direction). For example, in the initial position of the OIS moving unit, at least a portion of the second magnet 1071B may overlap at least a portion of the second coil 1230 in the first direction (or the optical axis direction).

[0232] The length L2 of the long side of the second magnet 1071B may be greater than the length L3 of the long side of the second coil 1230 (L2 > L3). In another embodiment, the length of the long side of the second magnet 1071B may be equal to or less than the length of the long side of the second coil 1230.

[0233] The width W2 (or the length of the short side) of the second magnet 1071B may be greater than the length L4 of the short side of the second coil 1230 (W2 > L4). In another embodiment, the length of the long side of the second magnet 1071B may be equal to or less than the length of the long side of the second coil 1230.

[0234] For example, the length of the long side of each of the two magnet units 1081B1 and 1071B3 of the second magnet 1071B may be less than the length of the long side of each of the coil units 1230-1 and 1230-3 of the second coil 1230. In another embodiment, the length of the long side of each of the two magnet units 1071B1 and 1071B3 may be equal to or greater than the length of the long side of each of the coil units 1230-1 and 1230-3.

[0235] In addition, the length of the long side of each of the two remaining magnet units 1071B2 and 1071B4 of the second magnet 1071B may be greater than the length of the long side of each of the coil units 1230-2 and 1230-4 of the second coil 1230. In another embodiment, the length of the long side of each of the magnet units 1071B2 and 1071B4 may be equal to or less than the length of the long side of each of the coil units 1230-2 and 1230-4 of the second coil 1230.

[0236] For example, the length of the short side of each of the first magnet unit 1071B1 to the fourth magnet unit 1071B4 of the second magnet 1071B may be less than the length of the short side of each of the first coil unit 1230-1 to the fourth coil unit 1230-4 of the second coil 1230. In another embodiment, the length of the short side of each of the first magnet unit 1071B to the fourth magnet unit 1071B4 may be greater than the length of the short side of each of the first coil unit 1230-1 to the fourth coil unit 1230-4.

[0237] Figure 19b is shown Figure 5 Another embodiment of the magnet 1130 shown is shown.

[0238] Referring to Figure 19b , Figure 19b The second magnet 1071BB shown may be a dipole magnet including one N pole and one S pole. Figure 19a The descriptions of the lengths T2, L2, and W2 of the second magnet 1071B shown in Figure 19b may be applied to the second magnet 1071BB shown in

[0239] The circuit board 1190 may be disposed on the housing 1140, the first position sensor 1170 may be disposed or mounted on the circuit board 1190, and may be electrically connected to the circuit board 1190. For example, the circuit board 1190 may be disposed in the mounting groove 1014A in the housing 1140, and the terminal member 1095 of the circuit board 1090 may be exposed outside the housing 1140.

[0240] The circuit board 1190 may include a terminal member (or terminal unit) 1095, and the terminal member 1095 includes a plurality of terminals B1 to B4 electrically connected to an external terminal or an external device. The plurality of terminals B1 to B4 of the circuit board 1190 may be electrically connected to the first position sensor 1170.

[0241] The first position sensor 1170 may be disposed on the housing 1140 and / or the circuit board 1190. For example, the first position sensor 1170 may be disposed on the first surface of the circuit board 1190, and the plurality of terminals B1 to B4 may be disposed on the second surface of the circuit board 1190. Here, the second surface of the circuit board 1190 may be a surface opposite to the first surface of the circuit board 1190. For example, the first surface of the circuit board 1190 may be a surface of the circuit board 1190 facing the bobbin 1110 or the sensing magnet 1180. For example, the circuit board 1190 may be a printed circuit board or a flexible printed circuit board.

[0242] The first position sensor 1170 may be electrically connected to the circuit board 1190. For example, the first position sensor 1170 may be electrically connected to the first terminal B1 to the fourth terminal B4 of the circuit board 1190. For example, the circuit board 1190 may include a circuit pattern or a wire (not shown) configured to electrically connect the first terminal B1 to the fourth terminal B4 to the first position sensor 1170.

[0243] For example, at the initial position of the AF operation unit, at least a part of the first position sensor 1170 may face or overlap the sensing magnet 1180 in a direction perpendicular to the optical axis OA and parallel to a line passing through the optical axis OA. In another embodiment, at the initial position of the AF operation unit, the first position sensor may not face or overlap the sensing magnet.

[0244] The first position sensor 1170 can be used to detect the movement, displacement or position of the bobbin 1110 in the optical axis direction. In other words, the first position sensor 1170 can detect the magnetic field or magnetic field intensity of the sensing magnet 1180 mounted on the bobbin 1110 caused by the movement of the bobbin 1110, and can output an output signal corresponding to the detection result. Therefore, the output of the first position sensor 1170 can be used to detect the movement, displacement or position of the bobbin 1110.

[0245] The first position sensor 1170 may be a driver IC including a Hall sensor and a driver. The position sensor 1170 may include first to fourth terminals for data communication to send data to and receive data from an external device by using a protocol such as I2C communication, and fifth and sixth terminals for directly providing a driving signal to the coil 1120.

[0246] For example, each of the first to fourth terminals of the first position sensor 1170 can be electrically connected to a corresponding one of the first to fourth terminals B1 to B4 of the circuit board 1190 using solder or a conductive adhesive.

[0247] For example, the fifth and sixth terminals of the first position sensor 1170 can be electrically connected to the first coil 1120. For example, the first position sensor 1170 can be electrically connected to the first coil 1120 via at least one of the upper elastic member 1150 and the lower elastic member 1160 to supply a drive signal to the first coil 1120.

[0248] For example, a part of the first upper elastic unit 1150-1 can be connected to one end of the first coil 1120, and another part of the first upper elastic unit 1150-1 can be electrically connected to the circuit board 1190. A part of the second upper elastic unit 1150-2 can be connected to the other end of the first coil 1120, and another part of the second upper elastic unit 1150-2 can be electrically connected to the circuit board 1190. The circuit board 1190 can include a first pad 5A electrically connected to another part of the first upper elastic unit 1150-1 and a second pad 5B electrically connected to another part of the second upper elastic unit 1150-2. Each of the fifth and sixth terminals of the first position sensor 1170 can be electrically connected to a corresponding one of the first pad 5A and the second pad 5B of the circuit board 1190.

[0249] In another embodiment, the first coil 1120 can be electrically connected to the circuit board 1190 and the fifth and sixth terminals of the first position sensor 1170 through two lower elastic members.

[0250] For example, in an embodiment where the first position sensor 1170 is a driver IC, the first terminal B1 and the second terminal B2 of the circuit board 1190 can be power terminals for power supply, the third terminal B3 can be a terminal for transmitting and receiving clock signals, and the fourth terminal B4 can be a terminal for transmitting and receiving data signals.

[0251] In another embodiment, the first position sensor 1170 may be a Hall sensor. Here, the first position sensor 1170 may include two input terminals and two output terminals, to which a driving signal or power is supplied, and a sensed voltage (or output voltage) is output through the two output terminals. For example, the driving signal may be supplied to the first position sensor 1170 through the first terminal B1 and the second terminal B2 of the circuit board 1190, and the output of the first position sensor 1170 may be output to the outside through the third terminal B3 and the fourth terminal B4. In addition, the first coil 1120 may be electrically connected to the circuit board 1190. In addition to the first terminal B1 to the fourth terminal B4, the circuit board 1190 may further include two additional terminals, such that an external driving signal may be supplied to the first coil 1120 via the two additional terminals.

[0252] For example, the ground terminal among the power terminals of the first position sensor 1170 may be electrically connected to the cover member 1300.

[0253] The capacitor 1195 may be disposed or mounted on the first surface of the circuit board 1190. The capacitor 1195 may be configured to have a chip shape. Here, the chip may include a first terminal corresponding to one end of the capacitor 1195 and a second terminal corresponding to the other end of the capacitor 1195. The capacitor 1195 may also be referred to as a "capacitive element" or a "condenser".

[0254] The capacitor 1195 may be electrically connected in parallel to the first terminal B1 and the second terminal B2 of the circuit board 1190, and power (or a driving signal) is supplied to the first position sensor 1170 from the outside through these terminals. Alternatively, the capacitor 1195 may be electrically connected in parallel to the terminals of the first position sensor 1170 that are electrically connected to the first terminal B1 and the second terminal B2 of the circuit board 1190.

[0255] Since the capacitor 1195 is electrically connected in parallel to the first terminal B1 and the second terminal B2 of the circuit board 1190, the capacitor 1195 can be used as a smoothing circuit for eliminating the ripple components included in the power signals GND and VDD supplied to the first position sensor 1170 from the outside, so that a stable and consistent power signal can be supplied to the first position sensor 1170.

[0256] In another embodiment, the sensing magnet 1180 may be disposed on the housing 1140, and the first position sensor 1170 may be disposed on the bobbin 1110. In another embodiment, the balance magnet 1185 may be omitted.

[0257] The upper elastic member 1150 and the lower elastic member 1160 may be coupled to the bobbin 1110 and the housing 1140. For example, the upper elastic member 1150 may be coupled to the upper portion, upper end, or upper surface of the bobbin 1110 and the upper portion, upper end, or upper surface of the housing 1140, and the lower elastic member 1160 may be coupled to the lower portion, lower end, or lower surface of the bobbin 1110 or the upper portion, upper end, or upper surface of the housing 1140. The upper elastic member 1150 and the lower elastic member 1160 may elastically support the bobbin 1110 relative to the housing 1140.

[0258] The upper elastic member 1150 may include a plurality of upper elastic units (e.g., 1150-1 to 1150-4) that are electrically separated or spaced apart from each other. Although the lower elastic member 1160 is implemented as a single elastic unit, in another embodiment, the lower elastic member 1160 may include a plurality of lower elastic units that are electrically separated or spaced apart from each other. In another embodiment, at least one of the upper elastic member or the lower elastic member may be implemented as a single unit or a single structure.

[0259] The upper elastic member 1150 may further include: a first inner frame 1151 coupled or fixed to an upper portion, an upper surface or an upper end of the coil frame 1110; a second inner frame 1152 coupled or fixed to an upper portion, an upper surface or an upper end of the housing 1140; and a first frame connector 1153 connecting the first inner frame 1151 to the first outer frame 1152. In addition, the upper elastic member 1150 may include the above-mentioned extension portion 1155.

[0260] The lower elastic member 1160 may include: a second inner frame 1161 coupled or fixed to a lower portion, a lower surface, or a lower end of the coil frame 1110; a second outer frame 1162 coupled or fixed to a lower portion, a lower surface, or a lower end of the housing 1140; and a second frame connector 1163 connecting the second inner frame 1161 to the second outer frame 1162. The inner frame may alternatively be referred to as an inner portion, the outer frame may alternatively be referred to as an outer portion, and the frame connector may alternatively be referred to as a connector.

[0261] Each of the first frame connector 1153 and the second frame connector 1163 may be bent or folded (or may be formed into a curve) at least once to define a predetermined pattern.

[0262] Each of the upper elastic member 1150 and the lower elastic member 1160 may be made of a conductive material, such as a metal material. In addition, each of the upper elastic member 1150 and the lower elastic member 1160 may be made of an elastic member, such as a leaf spring or the like.

[0263] refer to Figure 5 , Figure 7a and Figure 7b, for example, the second outer frame 1152 of the first upper elastic unit 1150-1 may include a first bonding portion 1004A coupled or electrically connected to the first pad 5A of the circuit board 1190, and the second outer frame 1152 of the second upper elastic unit 1150-2 may include a second bonding portion 1004B electrically connected to the second pad 5B of the circuit board 1190.

[0264] In another embodiment, at least one of the upper elastic member 1150 or the lower elastic member 1160 may include two elastic members. For example, each of the two elastic members of one of the upper elastic member 1150 and the lower elastic member 1160 may be coupled or electrically connected to a corresponding one of the first and second pads of the circuit board 1190. The first coil 1120 may be electrically connected to the two elastic members.

[0265] The first outer frame 1152 of the upper elastic member 1150 may include a first coupler 1510 coupled to the housing 1140, a second coupler 1520 coupled to the wire 1220, and a connecting member 1530 connecting the first coupler 1510 to the second coupler 1520. The first coupler 1510 may have a through hole or a hole to be coupled to the first coupler 1143 of the housing 1140. The second coupler 1520 may have a through hole or a hole to be coupled to the wire 1220. For example, the second coupler 1520 may be coupled to the wire 1220 using a conductive adhesive or solder. For example, although the connecting member 1530 may include a bent portion bent at least once, or a bent portion bent at least once. However, the present invention is not limited thereto. In another embodiment, the connecting member 1530 may have a linear shape.

[0266] Figure 9 is a perspective view of the image sensor unit 1350. Figure 10a is Figure 9 the first exploded perspective view of the image sensor unit 1350 shown. Figure 10b is Figure 9 the second exploded perspective view of the image sensor unit 1350 shown. Figure 10c is Figure 10a an enlarged view of the groove 1341a in the holder 1270 shown. Figure 10d is Figure 10a an enlarged view of the terminal member 1037 shown. Figure 10e is Figure 10a an enlarged view of the groove 1341b in the base 1210 shown. Figure 10f is one in which Figure 10b an enlarged view of the groove 1028A in the holder 1270 in which the terminal member 1037 shown is provided. Figure 11 is Figure 10aAn upward perspective view of the retainer 1270, terminal member 1037, first board unit 1255, support plate 1310, heat dissipation member 1280, base 1210, and second board unit 1800 as shown. Figure 12 A plan view of the retainer 1270, first board unit 1255, image sensor 1810, second coil 1230, and OIS position sensor 1240. Figure 13 A rear perspective view of the retainer 1270 and first board unit 1255. Figure 14 A perspective view of the base 1210, terminal member 1037, and wire 1220. Figure 15 A bottom view of the first board unit 1255, support plate 1310, and heat dissipation member 1280. Figure 16 A perspective view of the first board unit 1255, support plate 1310, and heat dissipation member 1280. Figure 17a A first perspective view of the support plate 1310 coupled to the retainer 1270 and base 1210. Figure 17b A second perspective view of the support plate 1310 coupled to the retainer 1270 and base 1210.

[0267] Refer to Figures 9 to 17b , the image sensor unit 1350 may include a fixed unit and an OIS moving unit, and the OIS moving unit is arranged to be spaced apart from the fixed unit. The image sensor unit 1350 may include a support unit that connects the fixed unit to the OIS moving unit.

[0268] For example, the support unit may include the support plate 1310. Alternatively, for example, the support unit may be the support plate 1310. In another embodiment, the support unit may include an elastic member, such as a leaf spring or a suspension wire, instead of the support plate 1310.

[0269] The fixed unit may be a part of the camera device 1010 that is immovable during OIS operation. For example, the fixed unit may include the board unit 1800. For example, the fixed unit may include components coupled to the second board unit 1800. The board unit 1255 or 1800 may alternatively be referred to as a "board" or a "circuit board".

[0270] For example, the fixed unit may include the base 1210 coupled to the second board unit 1800. For example, the fixed unit may include the housing 1140 of the AF operation unit, and components provided on the housing 1140, such as the magnet 1130, first position sensor 1170, and circuit board 1190. In addition, the fixed unit may include the cover member 1300 coupled to the base 1210. The OIS moving unit may be provided in the cover member 1300. For example, the cover member 1300 may accommodate the OIS moving unit and the support plate 1310 therein.

[0271] The OIS moving unit may include an image sensor 1810. The OIS moving unit may further include a first plate unit 1255, which is spaced apart from the second plate unit 1800 and electrically connected to the second plate unit 180. For example, the OIS moving unit may include components disposed on the first plate unit 1255, such as at least one of a heat dissipation member 1280, a holder 1270, a second coil 1230, and a second position sensor 1240. The holder 1270 may also be referred to as a "spacing member". In another embodiment, the holder 1270 may be omitted, and the second coil 1230 may be disposed on the first plate unit 1255, such as on the first circuit board 1250.

[0272] For example, the camera device 1010 may include a fixing unit, a moving unit, and a supporting unit (such as 1310). The moving unit includes a first heat dissipation member 280 disposed on the fixing unit and an image sensor 1810 disposed in the first heat dissipation member 280. The supporting unit is configured to support the moving unit while allowing the moving unit to move in a direction perpendicular to the optical axis direction. The supporting unit (such as 1310) may be connected between the moving unit and the fixing unit.

[0273] The moving unit may include a first plate unit 1255 on which the image sensor 1810 is disposed. The fixing unit may include a second plate unit 1800, which is disposed to be spaced apart from the first plate unit 1255, and the supporting unit may connect the first plate unit 255 to the second plate unit 1800.

[0274] The supporting unit may include a conductive layer 1093-1, a first insulating layer 1094-1 disposed under the conductive layer 1093-1, and a second insulating layer 1094-2 disposed on the conductive layer 1093-1. The supporting unit may be configured such that a part of the first insulating layer 1094-1 is removed, thereby exposing a region of the conductive layer 1093-1 through the removed part.

[0275] The first plate unit 1255 may include a first circuit board 1250, a second circuit board 1260 electrically connected to the image sensor 1810, and a solder 1901 that electrically connects the first circuit board 1250 to the second circuit board 1260.

[0276] The camera device 1010 may include an elastic member 1220 (hereinafter referred to as a "lead wire"), which is configured to flexibly support the OIS moving unit. The elastic member 1220 may be in the form of a lead wire or a spring.

[0277] For example, one end of the wire 1220 can be connected to the upper elastic member 1150 (or the housing 1140), and the other end of the wire 1220 can be connected to the holder 1270. For example, one end of the wire 1220 can be connected to the first outer frame 1152 (e.g., the second coupler 1520) of the upper elastic member 1150 using solder or a conductive adhesive. For example, the other end of the wire 1220 can be connected to the terminal member 1037, and the terminal member 1037 can be disposed on or connected to the holder 1270 using solder or a conductive adhesive.

[0278] Referring to Figure 7a and Figure 7b , a damper DA can be disposed between one end of the wire 1220 extending through the hole 1147 in the housing 1140 and the hole 1147 in the housing 1140. For example, at least a portion of the damper DA can be disposed in the hole 1147 in the housing 1140 and can be connected or attached to at least a portion of the housing 1140 and the wire 1220.

[0279] For example, the wire 1220 can be disposed parallel to the optical axis direction. For example, the wire 1220 can be disposed at a corner of the housing 1140 and / or a corner of the holder 1270. For example, the wire 1220 can include four wires 1220-1 to 1220-4. Each of the four wires 1220-1 to 1220-4 can be disposed on a corresponding one of the four corners of the housing 1140 and / or the four corners of the holder 1270.

[0280] Referring to Figures 10a to 10f , a hole 1271 can be formed in the holder 1270, and at least a portion of the wire 1220 extends through the hole. For example, the corners of the holder 1270 can be formed through the hole 1271, and the other end of the wire 1220 extends through the hole. For example, each of the four corners of the holder 1270 can have a hole 1271 formed therein. For example, although the hole 1271 can be a through hole formed through the holder 1270 in the optical axis direction, in another embodiment, the hole 1271 can also have the form of an avoidance groove.

[0281] For example, the terminal member 1037 can be disposed on or connected to the upper surface or the lower surface of the holder 1270. For example, the terminal member 1037 can be disposed on or connected to the lower surface of a corner of the holder 1270. A groove 1028A can be formed in the holder 1270, and the terminal member 1037 is disposed in the groove 1028A. For example, the groove 1028A can be formed in the lower surface of a corner of the holder 1270.

[0282] The holding member 1270 may include at least one protrusion 1028B, and the terminal member 1037 may have at least one hole 1081A to be coupled to the at least one protrusion 1028B of the holding member 1170. The terminal member 1037 and the holding member 1270 may be coupled to each other using an adhesive or by heat melting. The terminal member 1037 may have a hole 1071B into which the other end of the wire 1220 is inserted or coupled. For example, each of the holes 1081A and 1071B may be a through hole.

[0283] For example, the terminal member 1037 may include a body 1081 coupled to the holding member 1270. The body 1081 may include a coupler 1071 coupled to the wire 1220. The coupler 1071 may include a coupling region 1071A coupled to the wire 1220 and a hole 1071B formed in the first coupling region 1071A. The coupling region 1071A may be a region of the body 1081 that is coupled to the wire 1220 using solder or a conductive adhesive. For example, the other end of the wire 1220 passing through the hole 1071B may be connected to the lower part or the lower surface of the coupling region 1071A using solder or a conductive adhesive.

[0284] For example, the body 1081 may have at least one hole 101071C formed around the coupling region 1071A. For example, the body 1081 may have a plurality of holes 1071C around the coupling region 1071A. For example, the plurality of holes 1071C may be spaced apart from the hole 1071B.

[0285] The body 1081 may include a support portion that is located between the plurality of holes 1071C to support the coupling region 1071A. The support portion 1071D may also be referred to as a "connector" or a "bridge". The support portion 1071D may include a plurality of support portions spaced apart from each other. The support portion 1071D may be connected to the coupling region 1071A.

[0286] The at least one hole 1071C may be used during the soldering process to cause the solder to form mainly only in the coupling region 1071A due to the interfacial tension (e.g., surface tension) of the peripheral region of the coupling region 1071A.

[0287] To perform soldering, the coupling region 1071A must be heated. Here, the at least one hole 1071C may inhibit or prevent the heat transfer of the coupling region 1071A to another region while preventing the formation of a soldered portion in the remaining region of the body 1081. In other words, the at least one hole 1071C can improve the soldering efficiency.

[0288] The terminal member 1037 may include an extension portion 1082 extending from the body 1081. The extension portion 1082 may be bent downward at the body 1081 and may extend downward. For example, the extension portion 1082 may extend toward the hole 1059 in the base 1210. The extension portion 82 may also be referred to as a "bent portion".

[0289] For example, the terminal member 1037 may include four terminals 1037A to 1037D corresponding to four wires 1220-1 to 1220-4 of the terminal member 1037. Each of the terminals 1037A to 1037D may be disposed on a respective corner of the holder 1270 and may be coupled to a respective one of the wires 1220-1 to 1220-4. Figure 10a The description may be applied to the structure of each of the terminals 1037A to 1037D with or without modification. The terminal member 1037 may be made of a conductive material, such as metal. In another embodiment, the terminal member 1037 may be omitted and the wire 1220 may be directly coupled to the holder 1270.

[0290] Referring to Figure 14 , a damper or an adhesive 1049 may be disposed between the terminal member 1037 and the base 1210 and may be in contact with or coupled to or attached to the terminal member 1037 and the base 1210. For example, the base 1210 may have a hole 1059 (or a groove) formed at a position corresponding to or facing the terminal member 1037. For example, the hole 1059 (or the groove) may be formed at a corner of the base 1210.

[0291] For example, the damper 1049 may be disposed in the hole 1059 in the base 1210. Alternatively, at least a portion of the extension portion 1082 of the terminal member 1037 may be disposed in the hole 1059 in the base 1210 and the damper 1049 may be in contact with or coupled to or attached to the extension portion 1082. The damper 1049 can be used to absorb or reduce the vibration of the OIS moving unit, thereby preventing or suppressing the oscillation of the OIS moving unit during OIS operation.

[0292] In another embodiment, the extension portion 1082 may be omitted from the terminal member 1037 and the camera device 1010 may not include Figure 14 the damper 1049 shown.

[0293] The support plate 1310 may support the OIS moving unit relative to the fixed unit such that the OIS moving unit moves in a direction perpendicular to the optical axis, tilts with respect to the optical axis, or rotates within a predetermined range.

[0294] For example, one end of the support plate 1310 can be connected or coupled to the first plate unit 1255, and the other end of the support plate 1310 can be connected or coupled to the second plate unit 1800.

[0295] The holder 1270 can be disposed below the AF operation unit. For example, the holder 1270 can be made of a non-conductive member. For example, the holder 1270 can be made of an injectable material that is easily formed by an injection molding process. In addition, the holder 1270 can be made of an insulating material. In addition, for example, the holder 1270 can be made of resin or plastic.

[0296] Referring to Figure 10a 、 Figure 10f and Figure 12 , the holder 1270 can include an upper surface, a lower surface opposite to the upper surface, and a side surface (e.g., an outer surface) connecting the upper surface to the lower surface. For example, the lower surface of the holder 1270 can be opposite to or face the second plate unit 1800.

[0297] The holder 1270 can support the first plate unit 1255 and can be coupled to the first plate unit 1255. For example, the first plate unit 1255 can be disposed below the holder 1270. The lower part, lower surface, or lower end of the holder 1270 can be coupled to the upper part, upper surface, or upper end of the first plate unit 1255. For example, the holder 1270 can be coupled to the first plate unit 1255 using an adhesive. In another embodiment, for example, the first plate unit 1255 can be disposed above the holder 1270.

[0298] The holder 1270 can accommodate or support the second coil 1230. The holder 1270 can support the second coil 1230 in a state spaced apart from the first plate unit 1255. For example, at least a part of the holder 1270 can be disposed between the second coil 1230 and the first plate unit 1255.

[0299] The holder 1270 can have a hole 1070 corresponding to an area of the first plate unit 1255. For example, the hole 1070 in the holder 1270 can be a through hole formed through the holder 1170 in the optical axis direction. For example, the hole 1270 in the holder 1270 can correspond to, face, or overlap with the image sensor 1810 in the optical axis direction.

[0300] Although when viewed from above, the hole 1070 in the holder 1270 can have a polygonal shape, such as a quadrilateral, circular, or elliptical shape, the present invention is not limited thereto. The hole 1070 can have any of various shapes.

[0301] For example, the holes 1070 in the holder 1270 may be configured to have such a shape or size as to expose a part of the upper surface of the image sensor 1810, the upper surface of the first circuit board 1250, the upper surface of the second circuit board 1260, and the components. For example, the surface area of the holes 1070 in the holder 1270 may be larger than the surface area of the image sensor 1810 and may be smaller than the surface area of the perforations 1250A in the first circuit board 1250.

[0302] Referring to Figure 11 , the holder 1270 may have holes 1041A, 1041B, and 1041C corresponding to the second position sensors 1240. For example, the holder 1270 may have holes 1041A, 1041B, and 1041C formed at positions corresponding to the first to third sensors 1240A, 1240B, and 1240C, respectively.

[0303] For example, the holes 1041A, 1041B, and 1041C may be located near the corners of the holder 1270. The holder 1270 may also have dummy holes 1041D formed adjacent to the corners of the holder 1270, which do not correspond to any of the second position sensors 1240. The dummy holes 1041D can be used to achieve weight balance of the OIS moving unit during OIS operation. The dummy holes 1041D may be through holes. In another embodiment, the dummy holes 1041D may not be formed. The holes 1041A, 1041B, and 1041C may be formed through the holder 1270 in the optical axis direction. In another embodiment, the holes 1041A, 1041B, and 1041C in the holder 1270 may be omitted.

[0304] The upper surface of the holder 1270 may be provided with at least one coupling protrusion 1051 configured to be coupled to the second coil 1230. The coupling protrusion 1051 may protrude from the upper surface of the holder 1270 in an upward direction or in a direction toward the AF operation unit. For example, the coupling protrusion 1051 may be formed adjacent to each of the holes 1041A to 1041D in the holder 1270.

[0305] For example, two coupling protrusions 1051A and 1051B may be provided or arranged at the holder 1270 to correspond to each of the holes 1041A to 1041D in the holder 1270. For example, each of the holes 1041A, 1041B, 1041C, and 1041D in the holder 1270 may be located between the two coupling protrusions 1051A and 1051B.

[0306] The holding member 1270 may include one or more protrusions 1027A and 1027B. The protrusions 1027A and 1027B may protrude from the upper surface of the holding member 1270. For example, the protrusions 1027A and 1027B may protrude from the outer surface of the holding member 1270 in the optical axis direction or the upward direction.

[0307] For example, the holding member 1270 may include two protrusions 1027A and 1027B that face or overlap each other in the second horizontal direction (e.g., in the X-axis direction).

[0308] For example, the holding member 1270 may include four side portions (or side plates), and the protrusions 1027A and 1027B may be respectively formed on two of the four side portions. For example, each of the protrusions 1027A and 1027B may be disposed or positioned at the center of the corresponding side portion (or side plate) of the holding member 1270.

[0309] The holding member 1270 may include a groove 1341a. The groove 1341a may be an adhesive receiving groove. The groove 1341a may be formed in the outer surface of each of the protrusions 1027A and 1027B. The groove 1341a may be formed in the upper surface of each of the protrusions 1027A and 1027B of the holding member 1270. The groove 1341a may be formed from the upper surface to the lower surface of each of the protrusions 1027A and 1027B of the holding member 1270. An adhesive configured to attach the support plate 1310 to the holding member 1270 may be disposed in the groove 1341a. The groove 1341a may include a plurality of grooves. For example, the groove 1341a may extend in the optical axis direction. In another embodiment, the groove in the holding member 1270 may extend in a direction perpendicular to the optical axis.

[0310] The first plate unit 1255 may include a first circuit board 1250 and a second circuit board 1260 that are electrically connected to each other. The second circuit board 1260 may also be referred to as a "sensor board". In another embodiment, a heat dissipation member 1280 may be included in the first plate unit 1255.

[0311] The first plate unit 1255 may be disposed on the lower surface of the holding member 1270. For example, the first plate unit 1255 may be coupled to the lower surface of the holding member 1270. For example, the first circuit board 1250 may be disposed on and / or coupled to the lower surface of the holding member 1270. For example, the first surface of the first circuit board 1250 may be coupled or attached to the lower surface of the holding member 1270 using an adhesive member.

[0312] Here, the first surface of the first circuit board 1250 may be opposite to or face the AF operation unit, and may be the surface on which the second position sensor 1240 is provided. The second surface of the first circuit board 1250 may be the surface opposite to the first surface of the first circuit board 1250.

[0313] The first circuit board 1250 may alternatively be referred to as a "sensor board", "main board", "main circuit board", "sensor circuit board", "mobile circuit board", etc. In all embodiments, the first circuit board 1250 may alternatively be referred to as a "second board" or "second circuit board", and the second circuit board 1260 may alternatively be referred to as a "first board" or "first circuit board".

[0314] The second position sensors 1240 (1240A, 1240B, and 1240C) may be provided on the first circuit board 1250 to detect the movement of the OIS moving unit in a direction perpendicular to the optical axis and / or the rotation, tilt, or roll of the OIS moving unit relative to the optical axis. In addition, the controller 1830 and / or circuit elements (such as capacitors) may be provided on the first circuit board 1250.

[0315] The first circuit board 1250 may include first terminals E1 to E8 for electrically connecting to the second coil 1230. Here, the first terminals E1 to E8 may alternatively be referred to as "first pads" or "first bonding portions". The first terminals E1 to E8 of the first circuit board 1250 may be provided or arranged on the first surface 1060A of the first circuit board 1250. For example, the first circuit board 1250 may be a printed circuit board or a flexible printed circuit board (FPCB).

[0316] The first circuit board 1250 may have a through-hole 1250A that corresponds to or faces the through-hole of the bobbin 1110 and the lens module 1400. For example, the through-hole 1250A in the first circuit board 1250 may be a through-hole or cavity formed through the first circuit board 250 in the optical axis direction, and may be formed at the center of the first circuit board 1250.

[0317] When viewed from above, the shape of the first circuit board 1250, such as the outer peripheral shape of the first circuit board 250, may be a shape that coincides with or corresponds to the holder 1270, such as a quadrilateral. When viewed from above, the through-hole 1250A in the first circuit board 1250 may have a polygonal shape, such as a quadrilateral shape, a circular shape, or an oval shape. For example, the through-hole 1250a in the first circuit board 1250 may open or expose the image sensor 1810 and / or the through-hole 1260A in the second circuit board 1260.

[0318] The first circuit board 1250 may include at least one terminal 1251 for electrical connection to the second circuit board 1260. The terminal 1251 of the first circuit board 1250 may alternatively be referred to as a "pad" or a "bonding portion". The terminal 1251 of the first circuit board 1250 may be provided or arranged on the lower surface of the first circuit board 1250.

[0319] For example, the terminal 1251 may include a plurality of terminals, and the plurality of terminals 1251 may be provided and arranged in a region between the perforation 1250A in the first circuit board 1250 and one side of the first circuit board 1250 in a direction parallel to that side. For example, the plurality of terminals 1251 may be arranged to surround the perforation 1250A.

[0320] The second circuit board 1260 may be provided below the first circuit board 1250. The second circuit board 1260 may be electrically connected to the image sensor 1810.

[0321] When viewed from above, although the second circuit board 1260 may have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape), the present disclosure is not limited thereto. In another embodiment, the second circuit board 1260 may have a circular shape or an oval shape.

[0322] For example, the surface area of the outer periphery of the second circuit board 1260 may be larger than the surface area of the perforation 1250A in the first circuit board 1250. For example, the lower side of the perforation 1250A in the first circuit board 1250 may be blocked or obstructed by the second circuit board 1260.

[0323] For example, when viewed from above or below, the outer surface (or outer side) of the second circuit board 1260 may be located between the outer surface (or side) of the first circuit board 1250 and the perforation 1250A in the first circuit board 1250A.

[0324] For example, the second circuit board 1260 may have a perforation 1260A corresponding to the perforation 1250A in the first circuit board 1250 and / or the image sensor 1810. The perforation 1260A in the second circuit board 1260 may be a hole or cavity formed through the second circuit board 1260, and may be formed at the center of the second circuit board 1260.

[0325] For example, the perforation 1260A in the second circuit board 1260 may open or expose the image sensor 1810. For example, the image sensor 1810 may be provided in the perforation 1260A in the second circuit board 1260, and may be electrically connected to the second circuit board 1260. For example, the image sensor 1810 may be electrically connected to the second circuit board 1260 via a wire.

[0326] In another embodiment, the perforation 1260A may not be formed in the second circuit board 1260, and the image sensor 1810 may be disposed on the upper surface of the second circuit board 1260.

[0327] In another embodiment, the heat dissipation member 1280 may be omitted. In the embodiment where the heat dissipation member 1280 is omitted, the perforation 1260A may not be formed in the second circuit board 1260, and the image sensor 1810 may be disposed on the upper surface of the second circuit board 1260.

[0328] In the embodiment where the heat dissipation member 1280 is omitted, for example, the image sensor 1810 may be disposed on the upper surface of a single board in which the first circuit board and the second circuit board are integrally formed.

[0329] The second circuit board 1260 may include at least one terminal 1261 that is electrically connected to at least one terminal 1251 of the first circuit board 1250. For example, the terminal 1261 of the second circuit board 1260 may include a plurality of terminals.

[0330] For example, at least one terminal 1261 of the second circuit board 1260 may be formed on a side surface or an outer surface of the second circuit board 1260 that connects the upper surface and the lower surface of the second circuit board 1260 to each other. The upper surface of the second circuit board 1260 may be a surface facing the first circuit board 1250, and the lower surface of the second circuit board 1260 may be a surface opposite to the upper surface of the second circuit board. For example, the terminal 1261 may have the form of a groove having a structure recessed from the side surface of the second circuit board 1260. Alternatively, for example, the terminal 1261 may have the form of a circular or semi-elliptical through-hole formed in the side surface of the second circuit board 1260. In another embodiment, at least one terminal of the second circuit board 1260 that is electrically connected to the second terminal 1251 of the first circuit board 1250 may be formed on the upper surface of the second circuit board 1260.

[0331] For example, the terminal 1261 of the second circuit board 1260 may be coupled to the terminal 1251 of the first circuit board 1250 using solder or a conductive path portion 1901 (see Figure 11 ). Although Figure 13 the enlarged dashed-line portion in

[0332] For example, each of the first circuit board 1250 and the second circuit board 1260 may be a printed circuit board or a flexible printed circuit board (FPCB). At least one of the first circuit board 1250 and the second circuit board 1260 may be an organic substrate or a ceramic board.

[0333] The heat dissipation member 1280 may be disposed on or coupled to the first board unit 1255. For example, the heat dissipation member 1280 may be disposed on or coupled to the second circuit board 1260. For example, the heat dissipation member 1280 may be disposed below the second circuit board 1260. For example, the heat dissipation member 1280 may be coupled or fixed to the lower surface of the second circuit board 1260. For example, at least a part of the upper surface of the heat dissipation member 1280 may be coupled or fixed to the lower surface of the second circuit board 1260.

[0334] The term "heat dissipation member" may be used interchangeably with "heat sink", "heat dissipation strip", "heat dissipation layer", "heat radiation film", "heat insulation board", "heat release plate", or "heat dissipation body".

[0335] In another embodiment, the heat dissipation member 1280 may be included in the first board unit 1255, and the image sensor 1810 may be disposed on the first board unit 1255.

[0336] The through hole 1260A in the second circuit board 1260 may open or expose at least a part of the heat dissipation member 1280. The image sensor 1810 may be disposed on, attached to, or coupled to at least a part of the heat dissipation member 1280 exposed through the through hole 1260A. For example, the image sensor 1810 may be fixed, attached, or coupled to the heat dissipation member 1280 using an adhesive. For example, the image sensor 1810 may be disposed on the first board unit 1255.

[0337] For example, at least one area of the upper surface of the heat dissipation member 1280 may be exposed through the through hole 1260A, and the image sensor 1810 may be disposed on, attached to, or coupled to at least one area of the upper surface of the heat dissipation member 1280 exposed through the through hole 1260A.

[0338] In another embodiment, the second circuit board 1260 may include a groove formed in its lower surface to accommodate or dispose the heat dissipation member 1280 therein.

[0339] In another embodiment, the through hole 1260A may not be formed in the second circuit board 1260, and the heat dissipation member 1280 may be fixed, attached, or coupled to the lower surface of the second circuit board 1260. In another embodiment, the heat dissipation member 1280 may be omitted.

[0340] For example, the heat dissipation member 280 may be a plate-like member having a predetermined thickness and hardness. The heat dissipation member 1280 may enhance the effect of dissipating the heat generated by the heat source of the first plate unit 1255 to the outside. Here, the heat source of the first plate unit 1255 may be an electronic component (or circuit component) disposed on the first plate unit 1255, such as an image sensor 1810, a controller 1830, a second position sensor 1240, and / or a capacitor.

[0341] For example, the heat dissipation member 1280 may include a metal material having high thermal conductivity and high heat dissipation efficiency, such as at least one of stainless steel, aluminum, nickel, phosphorus, bronze, or copper.

[0342] The heat dissipation member 1280 may be used to stably support the image sensor 1810 and may serve as a reinforcing material for suppressing damage to the image sensor 1810 caused by external impact or contact.

[0343] In another embodiment, the heat dissipation member 1280 may be made of a heat dissipation member having high thermal conductivity, such as heat-releasing epoxy resin, heat-releasing plastic (such as polyimide), or heat-releasing synthetic resin.

[0344] For example, in one embodiment, the term "heat dissipation member" may be used interchangeably with "heat sink", "radiator", "heat dissipation plate", "heat sink fin", "plate", "metal plate", "reinforcing material", or "reinforcement".

[0345] To improve the heat dissipation efficiency, the heat dissipation member 1280 may include at least one groove or at least one uneven predetermined pattern. For example, grooves or uneven portions having a predetermined pattern may be formed in the lower surface of the heat dissipation member 1280.

[0346] For example, the predetermined pattern may include a plurality of grooves spaced apart from each other at a predetermined interval. For example, the predetermined pattern may have a striped shape. In another embodiment, the predetermined pattern may have a mesh or net shape. In another embodiment, the predetermined pattern may have a shape with points spaced apart from each other. For example, each point may have a circular, oval, or polygonal (such as quadrilateral) shape.

[0347] In another embodiment, the predetermined pattern may be formed on at least one of the upper surface, lower surface, or outer surface of the heat dissipation member 1280. In another embodiment, the heat dissipation member 1280 may include perforations or through holes instead of grooves or uneven portions. Since the heat dissipation member 1280 moves together with the OIS moving unit, the heat dissipation member 1280 may be spaced apart from a fixed unit (such as the second plate unit 1800). The heat dissipation member 1280 may include at least one avoidance groove 1281 (see Figure 10a ) to avoid spatial interference with the solder 1901.

[0348] Although in Figure 13 the first circuit board 1250 and the second circuit board 1260 are electrically coupled to each other using the conductive path portion 1901, in another embodiment, the first board and the second board may be implemented as a single integrated circuit board.

[0349] The second coil 1230 may be disposed on or coupled to the OIS moving unit. For example, the second coil 1230 may be disposed on the holder 1270. The second coil 1230 may be disposed on the upper surface of the holder 1270. The second coil 1230 may be disposed below the magnet 1130.

[0350] The second coil 1230 may be coupled to the holder 1270. For example, the second coil 1230 may be coupled or attached to the upper surface of the holder 1270. For example, the second coil 1230 may be coupled to the coupling projection 1251 of the holder 1270. The second coil 1230 may move the OIS moving unit through interaction with the magnet 1130.

[0351] For example, the second coil 1230 may correspond to, face, or overlap the magnet 1130 disposed on the fixed unit in the direction of the optical axis OA. In another embodiment, the fixed unit may include a dedicated OIS magnet independent of the magnet of the AF operation unit, and the second coil may correspond to, face, or overlap the dedicated OIS magnet. Here, the OIS magnet may include the same number of OIS magnets as the number of coil units included in the second coil 1230.

[0352] In another embodiment, the OIS magnet may be disposed on the fixed unit of the second coil 1230, and the OIS magnet 1071B of the magnet 1130 may be disposed on the OIS moving unit. Here, the second coil 1230 may be electrically connected to the support plate 1310 and / or the second board unit 1800 via a conductive member.

[0353] For example, the second coil 1230 may include a plurality of coil units 1230-1 to 1230-4. For example, the second coil 1230 may include four coil units 1230-1 to 1230-4 disposed at the four corners of the holder 1270. For example, at least a part of each of the coil units 1230-1 to 1230-4 may be disposed at a corresponding corner of the holder 1270. A part of each of the coil units 1230-1 to 1230-4 may be disposed on a side adjacent to the corresponding corner of the holder 1270.

[0354] Each of the coil units 1230-1 to 1230-4 may have the form of a coil block in a closed-loop or ring shape. For example, each coil unit may have a cavity or a hole. For example, each coil unit may be composed of a fine pattern (FP) coil, a wound coil, or a coil block. For example, the cavity or hole in each of the coil units 1230-1 to 1230-4 may be fitted onto or coupled to the protrusion 1251 of the holder 1270.

[0355] In another embodiment, the second coil 1230 may be disposed on the first circuit board 1250 and may be coupled to the first circuit board 1250.

[0356] The second coil 1230 may be electrically connected to the first circuit board 1250. For example, the first coil unit 1230-1 may be conductively connected to the two terminals E1 and E2 of the first circuit board 1250, and the second coil unit 1230-2 may be electrically connected to the other two terminals E3 and E4. In addition, the third coil unit 1230-2 may be electrically connected to the two other terminals E5 and E6 of the first circuit board 250, and the fourth coil unit 1230-4 may be electrically connected to the other two terminals E7 and E8 of the first circuit board 1250.

[0357] Power or a drive signal may be provided to the first coil unit 1230-1 to the fourth coil unit 1230-4 through the first circuit board 1250. The power or drive signal provided to the second coil 1230 may be a DC signal, an AC signal, or a signal including DC and AC components, and may be voltage-type or current-type.

[0358] Through the interaction between the first magnet units 1130-1 to 1130-4 and the first coil units 1230-1 to 1230-4, the OIS moving unit may move in the first horizontal direction or the second horizontal direction, or may roll with respect to the optical axis.

[0359] For example, current may be independently applied to at least three of the four coil units 1230-1 to 1230-4. In another embodiment, current may be independently applied to at least two of the four coil units 1230-1 to 1230-4.

[0360] For example, an independent drive signal, such as an independent drive current, may be provided to each of the four coil units 1230-1 to 1230-4.

[0361] The controllers 1830 and 780 can provide at least one driving signal to at least one of the first coil units 1230-1 to the fourth coil units 1230-4, and can move the OIS moving unit in the X-axis direction and / or the Y-axis direction, or can rotate the OIS moving unit within a predetermined angular range around the optical axis by controlling at least one driving signal. Hereinafter, the "controller" can be at least one of the controller 1830 of the camera device 1010 or the controller 780 of the optical instrument 200A.

[0362] When the second coil 1230 is driven through three channels, three independent driving signals can be provided to the second coil 1230. For example, among the four coil units, two coil units that are diagonally opposite to each other (e.g., 1230-2 and 1230-4 or 1230-1 and 1230-3) can be connected in series with each other, and one driving signal can be provided to the two coil units connected in series with each other. Independent driving signals can be respectively provided to the other two coil units among the four coil units.

[0363] Alternatively, when the second coil 1230 is driven through four channels, independent driving signals can be respectively provided to the four mutually separated coil units 1230-1 to 1230-4.

[0364] Figure 18a It is a view illustrating the movement of the OIS moving unit in the X-axis direction. Figure 18b It is a view illustrating the movement of the OIS moving unit in the Y-axis direction.

[0365] The N poles and S poles of each of the first magnet unit 1071B1 and the third magnet unit 1071B3 facing each other in the first diagonal direction can be set to face each other in the first horizontal direction (e.g., in the Y-axis direction). In addition, the N poles and S poles of each of the second magnet unit 1071B2 and the fourth magnet unit 1071B4 facing each other in the second diagonal direction perpendicular to the first diagonal direction can be set to face each other in the second horizontal direction (e.g., in the X-axis direction).

[0366] In other words, the direction in which the N pole and S pole of the first magnet unit 1071B1 face each other can be the same as or parallel to the direction in which the N pole and S pole of the third magnet unit 1071B3 face each other. In addition, the direction in which the N pole and S pole of the second magnet unit 1071B2 face each other can be the same as or parallel to the direction in which the N pole and S pole of the fourth magnet unit 1071B3 face each other.

[0367] In another embodiment where the second magnet 1071B is a dipole magnet, based on the boundary line (or boundary plane) between the N pole and the S pole, the N pole of each of the first magnet unit 1071B1 to the fourth magnet unit 1071B4 can be located on the inner side, and the S pole can be located on the outer side. In another embodiment, based on the boundary line between the N pole and the S pole, the S pole of each of the first magnet unit 1071B1 to the fourth magnet unit 1071B4 can be located on the inner side, and the N pole can be located on the outer side. The boundary line (or boundary plane) can be a part that is almost completely non-magnetic and has almost no polarity.

[0368] Referring to Figure 18a , the OIS moving unit can move or shift in the X-axis direction by the first electromagnetic force Fx1 (or Fx3) generated by the interaction between the second coil unit 1230-2 and the second magnet unit 1071B2, and the second electromagnetic force Fx2 (or Fx4) generated by the interaction force between the fourth coil unit 1230-4 and the fourth magnet unit 1071B4. For example, the directions of the first electromagnetic force Fx1 (or Fx3) and the second electromagnetic force Fx2 (or Fx4) can be the same.

[0369] Referring to Figure 18b , the OIS moving unit can move or shift in the Y-axis direction by the third electromagnetic force Fy1 (or Fy3) generated by the interaction between the first coil unit 1230-1 and the first magnet unit 1071B1, and the fourth electromagnetic force (Fy2 (or Fy4)) generated by the interaction force between the third coil unit 1230-3 and the third magnet unit 1071B3. For example, the directions of the third electromagnetic force Fy1 (or Fy3) and the fourth electromagnetic force Fy2 (or Fy2) can be the same.

[0370] Figure 18c Shows the clockwise rotation of the OIS moving unit when driven by four channels. Figure 18d Shows the counterclockwise rotation of the OIS moving unit when driven by four channels.

[0371] Referring to Figure 18c , by means of the first electromagnetic force FR1 generated by the interaction between the first coil unit 1230-1 and the first magnet unit 1071B1, the second electromagnetic force FR2 generated by the second coil unit 1230-2 and the second magnet unit 1071B2, the third electromagnetic force FR3 generated by the interaction force between the third coil unit 1230-3 and the third magnet unit 1071B3, and the fourth electromagnetic force FR4 generated by the interaction between the fourth coil unit 1230-4 and the fourth magnet unit 1071B4, the OIS moving unit can rotate clockwise around the optical axis or can be tilted or rolled relative to the optical axis.

[0372] Reference Figure 18d , by means of the first electromagnetic force FL1 generated by the interaction between the first coil unit 1230-1 and the first magnet unit 1071B1, the second electromagnetic force FL2 generated by the second coil unit 1230-2 and the second magnet unit 1071B2, the third electromagnetic force FL3 generated by the interaction force between the third coil unit 1230-3 and the third magnet unit 1071B3, and the fourth electromagnetic force FL4 generated by the interaction between the fourth coil unit 1230-4 and the fourth magnet unit 1071B4, the OIS moving unit can rotate counterclockwise around the optical axis, or can be tilted or rolled relative to the optical axis.

[0373] For example, the directions of the first electromagnetic force FR1 (or FL1) and the third electromagnetic force FR3 (or FL3) can be opposite to each other. In addition, for example, the directions of the second electromagnetic force FR2 (or FL2) and the fourth electromagnetic force FR4 (or FL4) can be opposite to each other. In addition, for example, the directions of the first electromagnetic force RF1 (or FL1) and the second electromagnetic force FR2 (or FL2) can be perpendicular to each other.

[0374] In the case of driving through three channels, drive signals may not be provided to two coil units connected in series with each other (for example, 1130-1 and 1130-3 or 1130-2 and 1130-4), so the electromagnetic force caused by the two coil units connected in series with each other may not be generated. For example, in the case of driving through three channels, the electromagnetic forces FR2 and FR4 can be omitted, and the electromagnetic forces FR1 and FR3 can exist in Figure 18c . Or, in the case of driving through three channels, the electromagnetic forces R2 and FR4 can exist, and the electromagnetic forces FR1 and FR3 can be omitted in Figure 18c . In addition, in the case of driving through three channels, the electromagnetic forces FL2 and FL4 can be omitted, and the electromagnetic forces FL1 and FL3 can exist in Figure 18d . Or, in the case of driving through three channels, the electromagnetic forces FL2 and FL4 can exist, and the electromagnets FL1 and FL3 can be omitted in Figure 18d .

[0375] Compared with driving through three channels, according to Figure 18c and Figure 18d the driving through four channels shown, the electromagnetic force required for the OIS moving unit to rotate can be increased, thereby reducing the drive current required to drive the first coil unit 1230-1 to the fourth coil unit 1230-4, thereby reducing power consumption.

[0376] Although in Figure 2In the illustrated embodiment, the second magnet 1071B and the second coil 1230 are used to perform the OIS operation for hand shake correction. However, in another embodiment, a shape memory alloy member may be used to perform the OIS operation for hand shake correction. For example, the shape memory alloy member may be coupled to the fixing unit and the OIS moving unit, and may be electrically connected to the first plate unit 1255. The controllers 1830 and 780 may provide a driving signal to the shape memory alloy member and may move the OIS moving unit in a direction perpendicular to the optical axis, or may rotate, tilt, or roll the OIS moving unit relative to the optical axis through the shape memory alloy member.

[0377] In another embodiment, the second magnet 1071B and the second coil 1230 may be used to perform the OIS operation, and the camera device 1010 may include a spherical member (not shown) disposed between the base 1210 and the holder 1270 to support the OIS moving unit. Here, the spherical member may support the OIS moving unit such that the OIS moving unit moves in a direction perpendicular to the optical axis, or rotates, tilts, or rolls relative to the optical axis by the frictional force and / or rolling force between the base 1210 and the holder 1270. In one embodiment, for example, the spherical member may be disposed in the hole 1059 in the base 210 and may be in contact therewith. In another embodiment, a spherical member may be provided, and the terminal member 1037 and the wire 1220 may be omitted.

[0378] The second position sensor 1240 may be set, coupled, or mounted to the first surface (e.g., the upper surface) of the first plate unit 1255. The second position sensor 1240 may detect the movement or displacement of the OIS moving unit in a direction perpendicular to the optical axis direction, e.g., the movement or shift of the OIS moving unit in a direction perpendicular to the optical axis direction. In addition, the second position sensor 1240 may detect the rotation, rolling, or tilting of the OIS moving unit within a predetermined range relative to or around the optical axis. The first position sensor 1170 may alternatively be referred to as an "AF position sensor", and the second position sensor 1240 may alternatively be referred to as an "OIS position sensor".

[0379] The second position sensor 1240 may face or overlap the magnet 1130 in the optical axis direction. For example, the second position sensor 1240 may include three or more sensors (e.g., 240A to 240C) that correspond to or overlap three or more magnet units among the first magnet unit 1130-1 to the fourth magnet unit 1130-4 in the optical axis direction to detect the movement of the OIS moving unit.

[0380] For example, the second position sensor 1240 may be disposed below the second coil 1230.

[0381] For example, the second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis. For example, the sensing element of the second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis. The sensing element may be an element configured to detect a magnetic field.

[0382] For example, the center of the second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis. For example, the center of the second position sensor 1240 may be the spatial center in the X-axis and Y-axis directions on the X-Y coordinate plane perpendicular to the optical axis. Alternatively, the center of the second position sensor 240 may be the spatial center in the X-axis, Y-axis, and Z-axis directions.

[0383] In another embodiment, at least a portion of the second position sensor 1240 may overlap with the second coil 1230 in a direction perpendicular to the optical axis.

[0384] For example, the second position sensor 1240 may overlap with the holes 1041A to 1041C in the holder 1270 in the optical axis direction. For example, the second position sensor 1240 may overlap with the cavity in the second coil 1230 in the optical axis direction. For example, at least a portion of the holes 1041A to 1041C in the holder 1270 may overlap with the cavity in the second coil 1230 in the optical axis direction.

[0385] For example, at least a portion of the second position sensor 1240, such as the center of the second position sensor 1240, may not overlap with the second coil 1230.

[0386] For example, the second position sensor 1240 may include a first sensor 1240A, a second sensor 1240B, and a third sensor 1240C, which are arranged to be spaced apart from each other.

[0387] For example, each of the first to third sensors 1240A, 1240B, and 1240C may be a Hall sensor. In another embodiment, each of the first to third sensors 1240A, 1240B, and 1240C may be a driver IC including a Hall sensor and a driver. The description of the first position sensor 1170 may be applied to the first to third sensors 1240A, 1240B, and 1240C with or without modification. For example, each of the first to third sensors 1240A, 1240B, and 1240C may be a displacement detection sensor, where its output voltage varies according to the relative position or relationship with respect to the corresponding magnet unit.

[0388] Each of the first sensor 1240, the second sensor 1240B, and the third sensor 1240C may be electrically connected to the first circuit board 1250.

[0389] The second position sensor 1240 may be disposed below the cavity in the second coil 1230. In another embodiment, when viewed along the optical axis direction or from above, the second position sensor 1240 may be disposed outside the second coil 1230.

[0390] The second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis direction. For example, the second position sensor 1240 may overlap with the holder 1270 in a direction perpendicular to the optical axis direction.

[0391] For example, the first sensor 1240A may be disposed below the cavity in the first coil unit 1230-1. The first sensor 1240A may be disposed in a corresponding one of the holes 1041A to 1041C in the holder 1270, such as the hole 1041A. The second sensor 1240B may be disposed below the cavity in the second coil unit 1230-2. The second sensor 1240B may be disposed in another one of the holes 1041A to 1041C in the holder 1270, such as the hole 1041B. The third sensor 1240C may be disposed below the cavity in the third coil unit 1230-3. The third sensor 1240C may be disposed in another one of the holes 1041A to 1041C in the holder 1270, such as the hole 1041C.

[0392] For example, each of the first to third sensors 1240A, 1240B, and 1240C may not overlap with a corresponding one of the coil units 1230-1 to 230-3 in a direction perpendicular to the optical axis. The first to third sensors 1240A, 1240B, and 1240C may overlap with the holder 1270 in a direction perpendicular to the optical axis.

[0393] By arranging the first to third sensors 1240A, 1240B, and 1240C so as not to overlap with the OIS coil 230 in a direction perpendicular to the optical axis, the influence of the magnetic field of the OIS coil 230 on the output of the OIS position sensor 1240 can be reduced, thereby performing an accurate OIS feedback operation, and thus ensuring the reliability of the OIS operation.

[0394] The second position sensor 1240 may face, correspond to, or overlap with the magnet 1130 in the optical axis direction. For example, at the initial position of the OIS moving unit, at least a part of the first sensor 1240A may overlap with the first magnet unit 1071B1 of the second magnet 1071B in the optical axis direction. The first sensor 1240A may output a first output signal (e.g., a first output voltage) corresponding to the detection result of the magnetic field of the first magnet unit 1071B1.

[0395] For example, at the initial position of the OIS moving unit, at least a part of the second sensor 1240B may overlap with the second magnet unit 1071B2 of the second magnet 1071B in the optical axis direction, and the second sensor 1240B may output a second output signal (e.g., a second output voltage) corresponding to the magnetic field detection result of the second magnetic unit 1071B2.

[0396] For example, at the initial position of the OIS moving unit, at least a part of the third sensor 1240C may overlap with the third magnet unit 1071B3 of the second magnet 1071B in the optical axis direction, and the third sensor 1240C may output a third output signal (e.g., a third output voltage) corresponding to the magnetic field detection result of the third magnet unit 1071B3.

[0397] The initial position of the OIS moving unit may be the original position of the OIS moving unit in a state where no power or drive signal is applied from the controllers 1830 and 780 to the second coil 1230, or the position where the OIS moving unit is located when the support plate is elastically deformed only due to the weight of the OIS moving unit. In addition, the initial position of the OIS moving unit may be the position where the OIS moving unit is located when gravity acts in the direction from the first plate unit 1255 to the second plate unit 1800, or when gravity acts in the direction from the second plate unit 1800 to the first plate unit 1250.

[0398] To improve the linearity of the relationship between the displacement of the OIS moving unit and the output of the second position sensor 1240, each of the sensor units 1240A, 1240B, and 1240C may overlap with a corresponding one of the magnet units 1071B1, 1071B2, and 1027B3 in the optical axis direction within the stroke range of the OIS moving unit.

[0399] For example, the controllers 1830 and 780 may use at least one of the first output voltage of the first sensor 1240A, the second output voltage of the second sensor 1240B, and the third output voltage of the third sensor 1240C to control the rolling of the OIS moving unit. For example, the controllers 1830 and 780 may use the first output voltage and the third output voltage to control the rolling of the OIS moving unit.

[0400] For example, the controllers 1830 and 780 may control or regulate the movement or displacement of the OIS moving unit in a first horizontal direction (e.g., in the Y-axis direction) or in a second horizontal direction (e.g., in the X-axis direction) using at least one of the first to third output voltages. For example, the controllers 1830 and 780 may control or regulate the movement or displacement of the OIS moving unit in the first horizontal direction (e.g., in the Y-axis direction) using the first output voltage of the first sensor 1240A, and may control or regulate the movement and displacement of the OIS moving unit in the second horizontal direction using the second output voltage of the second sensor 1240B.

[0401] Each of the first to third sensors 1240A, 1240B, and 1240C may be a Hall sensor. In another embodiment, each of the first to third sensors may be a driver IC including a Hall sensor. In another embodiment, each of the first and second sensors 1240A and 1240B may be a Hall sensor, and the third sensor 1240C may be a tunnel magnetoresistance (TMR) sensor. Here, the tunnel magnetoresistance (TMR) sensor may be a TMR magnetic angle sensor.

[0402] In another embodiment, each of the first to third sensors 1240A, 1240B, and 1240C may be a tunnel magnetoresistance (TMR) sensor. Here, the TMR sensor may be a TMR linear magnetic field sensor, the output of which has a linear relationship with the displacement (or stroke) of the OIS moving unit.

[0403] The base 1210 may be disposed below the first plate unit 1255. The base 1210 may be spaced apart from the first plate unit 1255. The base 1210 may have a polygonal shape, such as a quadrilateral shape, which coincides with or corresponds to the cover member 1300 or the first plate unit 1255.

[0404] For example, the base 1210 may have a perforation 1210A that corresponds to or faces the first plate unit 1255. The perforation 1210A in the base 1210 may be a through hole formed through the base 1210 along the optical axis direction. In another embodiment, the base may have no perforation.

[0405] For example, the base 1210 may be coupled to the side plate 1302 of the cover member 1300. The side portion or outer surface of the base 1210 may include a step 1211 (see Figure 14) When the side or outer surface is coupled to the side plate 1302 of the cover member 1300, an adhesive is applied to the step 1211. Here, the step 1211 may guide the side plate 1302 of the cover member 1300 coupled to its upper side. The step 1211 of the base 1210 and the lower end of the side plate 1302 of the cover member 1300 may be coupled or fixed to each other using an adhesive or the like.

[0406] The base 1210 may include one or more protrusions 1216A and 1216B protruding from its upper surface. For example, the protrusions 1216A and 1216B may protrude upward from the outer surface of the base 1210. For example, the base 1210 may include two protrusions 1216A and 1216B facing or overlapping each other in a first horizontal direction (e.g., in the Y-axis direction).

[0407] For example, the base 1210 may include four sides (or side plates), and the protrusions 1216A and 1216B may be formed at two of the four side portions. For example, the protrusions 1216A and 1216B may be provided or positioned at the center of the side portion (or side plate) of the base 1210.

[0408] The base 210 may include a groove 341B. The groove 341b may be an adhesive receiving groove. The groove 341b may be formed in the outer surface of a corresponding one of the protrusions 216A and 216B of the base 210. The groove 1341b may be formed in the upper surface of a corresponding one of the protrusions 1216A and 1216B of the base 1210. The groove 1341b may be formed from the upper surface to the lower surface of a corresponding one of the protrusions 1216A and 1216B. An adhesive may be disposed in the groove 1341b to couple the support plate 1310 to the base 1210. The groove 1341b may include a plurality of grooves. For example, the groove 1341b may extend in the optical axis direction. In another embodiment, the groove formed in a corresponding one of the protrusions 1216A and 1216B of the base 1210 may extend in a direction perpendicular to the optical axis.

[0409] For example, the second plate unit 1800 may be disposed below the base 1210. For example, the second plate unit 1800 may be disposed to be spaced apart from the OIS moving unit (e.g., the first plate unit 1255 and the first heat dissipation member 1280) in the optical axis direction.

[0410] For example, the second plate unit 800 may be disposed below the lower surface of the base 1210. The second plate unit 1800 may be coupled to the base 1210. For example, the second plate unit 1800 may be coupled to the lower surface of the base 1210.

[0411] The second board unit 1800 can be used to supply a signal to the image sensor unit 1350 from the outside, or output the signal transmitted from the image sensor unit 1350 to the outside.

[0412] The second board unit 1800 may include a first region 1801 (or a first board) corresponding to, facing, or overlapping the AF operation unit 1100 or the image sensor 1810 in the optical axis direction, a second region 1802 (or a second board) on which a connection member 1804 is provided, and a third region 1803 (or a third board) connecting the first region 1801 to the second region 1802. The connection member 1804 may include a port that will be electrically connected to the second region 1802 of the second board unit 1800 and an external device (e.g., the optical instrument 200A). The perforation 1210A in the base 1210 may be closed or blocked by the first region 1801 of the second board unit 1800.

[0413] The first region 1801 of the second board unit 1800 may correspond to, face, or overlap at least one of the cover member 1300 or the base 1210 in the optical axis direction. For example, the first region 1801 may overlap the upper plate 1301 and the side plates 1302 of the cover member 1300 in the optical axis direction.

[0414] Each of the first region 1801 and the second region 1802 of the second board unit 1800 may include a rigid board. The third region 1803 may include a flexible board. Each of the first region 1801 and the third region 1802 may also include a flexible board.

[0415] In another embodiment, at least one of the first to third regions 1801 to 1803 of the circuit board 1800 may include at least one of a rigid board or a flexible board.

[0416] The second board unit 1800 may be disposed behind the first board unit 1255. For example, the first board unit 1255 may be disposed between the AF operation unit 1100 and the second board unit 1800. In another embodiment, the second board unit may be disposed between the AF operation unit and the first board unit.

[0417] Although the first region 1801 of the second board unit 1800 may have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, the present disclosure is not limited thereto. In another embodiment, the first region 801 may have a shape such as a circle.

[0418] Figure 20a The layout of the first to third regions 1801 to 1803, the extension region 1808, the AF moving unit, the OIS moving unit, and the controller 1830 of the second board unit 1800 according to an embodiment is shown.

[0419] Referring to Figure 20a Figure 20a , the first region 1801 may include four side portions 1085A to 1085D (or side surfaces). For example, the first region 1801 may include first and second side portions 1085A and 1085B that face or oppose each other in a second horizontal direction (e.g., in the X-axis direction), and third and fourth side portions 1085C and 1085D that face or oppose each other in a first horizontal direction (e.g., in the Y-axis direction).

[0420] The second region 1802 may be provided adjacent to the first side portion 1085A of the first region 1801, and the third region 1803 may be connected to the first side portion 1085A of the first region 1801. For example, the third region 1803 may extend from the first region 1801 and may be connected to a side of the second region 1802 that is opposite to the first side portion 1085A.

[0421] The second board unit 1800 may include a plurality of terminals 1800B corresponding to the terminals 1311 of the support board 1310. The plurality of terminals 1800B may be formed in the first region 1801 of the second board unit 1800. For example, the second board unit 1800 may include a first terminal 800B1 and a second terminal 800B2. The first terminal 800B1 is arranged or disposed to be spaced apart from each other along one side of the third side portion 1085C of the first region 1801 in a second horizontal direction (e.g., in the X-axis direction), and the second terminal 800B2 is arranged or disposed to be spaced apart from each other along one side of the fourth side portion 85D of the first region 1801 in the second horizontal direction.

[0422] For example, the plurality of terminals 1800B may be formed on a first surface (e.g., an upper surface) of the second board unit 1800 (e.g., the first region 1801) facing the first board unit 1255.

[0423] For example, the controller 1830 may be provided on an extended region extending from one of the third side portion 1085C and the fourth side portion 1085D of the first region 1801 of the second board unit 1800. In another embodiment, the controller may be provided on an extended region extending from a side portion of the first region 1801 of the second board unit 1800 where a plurality of terminals are formed.

[0424] A coupling hole (not shown) may be formed in the first region 1801, and a coupling protrusion (not shown) may be formed on the base 1210 to be coupled to the coupling hole in the first region 1801.

[0425] The camera device 1010 may further include a heat dissipation member 1380 disposed, coupled, or fixed to the second board unit 1800. For example, the heat dissipation member 1380 may be disposed on, coupled to, or fixed to the upper surface of the first region 1801 of the second board unit 1800. In another embodiment, the heat dissipation member 1380 may be omitted.

[0426] The camera device 1010 may further include a third heat dissipation member (not shown) disposed on, coupled to, or fixed to the second surface (e.g., the lower surface) of the second board unit 1800.

[0427] For example, the heat dissipation member 1380 may be a plate-like member having a predetermined thickness and hardness. The heat dissipation member 1380 may face or overlap the first heat dissipation member 1280 in the optical axis direction.

[0428] Although in Figure 20a the controller 1830 is disposed or coupled to the upper surface of the extended region 1808, in another embodiment, the controller may also be disposed or coupled to the lower surface of the extended region 1808.

[0429] Although in Figure 20a the controller 1830 is disposed on the extended region 1808 of the second board unit 1800 located outside the cover member 1300, in another embodiment, the controller may also be disposed in the first region of the second board unit 1800 located outside the base 1210.

[0430] In another embodiment, the controller may be disposed or mounted on the second circuit board 1260 serving as a sensor board. In another embodiment, for example, the controller may be disposed or mounted on the upper surface of the second circuit board 1260. Since the heat dissipation member 1280 is disposed on or coupled to the lower surface of the second circuit board 1260, when the controller is disposed on the second circuit board 1260, the heat generated by the controller can be easily dissipated through the heat dissipation member 1280, thereby improving the heat dissipation efficiency and performance.

[0431] Figure 20b is a schematic cross-sectional view of the lens module 1400, the first board unit 1255, the image sensor 1810, and the second board unit 1800.

[0432] Referring to Figure 20b , the image sensor 1810 may be disposed in the perforation 1260A (or hole) in the second circuit board 1260 and may be coupled to the first heat dissipation member 1280.

[0433] For example, the first heat dissipation member 1280 may include a body 1037A and a protrusion 1037B (or a protrusion region). The body 1037A is disposed below the second circuit board 1260, and the protrusion 1037B is disposed in a through hole 1260A in the second circuit board 1260.

[0434] The image sensor 1810 may be disposed, coupled, or fixed to the protrusion 1037B. For example, the image sensor 1810 may be disposed, coupled, or attached to the upper surface of the protrusion 1037B. For example, the upper surface of the protrusion 1037B may be positioned lower than the upper surface of the second circuit board 1260. In another embodiment, the upper surface of the protrusion 1037B may be flush with the upper surface of the second circuit board 1260.

[0435] The heat dissipation member 1380 may be disposed on the first surface 1801A (or the upper surface) of the first region 1801 of the second board unit 1800, which faces the first heat dissipation member 1280 in the optical axis direction.

[0436] The distance G1 (or the gap) between the first board unit 1255 and the second board unit 1800 in the optical axis direction may be 0.05 mm to 0.7 mm. For example, the distance G1 may be the distance between the lower surface of the heat dissipation member 1280 and the upper surface of the heat dissipation member 1380.

[0437] In another embodiment, the distance G1 may be 0.15 mm to 0.5 mm. In another embodiment, the distance G1 may be 0.15 mm to 0.3 mm. In another embodiment, the distance G1 may be 0.2 mm to 0.3 mm.

[0438] The second board unit 1800 may include a first conductive layer 1093, which is exposed from the first surface 1801A and contacts the heat dissipation member 1380, for example, contacts the lower surface of the heat dissipation member 1380. For example, the first conductive layer 1093 may be thermally fused to the lower surface of the heat dissipation member 1380, or may be coupled to the lower surface of the heat dissipation member 1380 using a conductive adhesive (such as solder, etc.). For example, the first conductive layer 1093 may be electrically connected to the heat dissipation member 1380.

[0439] The second board unit 1800 may include a second conductive layer 1092A, which is connected to the first conductive layer 1093 and is exposed from the second surface 1801B (or the lower surface) of the second board unit 1800, which is opposite to the first surface 1801A of the second board unit 1800. For example, the second conductive layer 1092A may be electrically connected to the ground (grounding component) of the second board unit 1800.

[0440] The first conductive layer 1093 may be a via hole formed through at least a part of the second plate unit 1800. For example, the first conductive layer 1093 may include a first via hole 1093A that is formed through the second plate unit 1800 and opens or is exposed at the second surface 1801B of the second plate unit 1800. In addition, the first conductive layer 1093 may include a second via hole 1093B, one end of which contacts the lower surface of the heat dissipation member 1380, and the other end of which contacts, is coupled to, or is connected to the second conductive layer 1092A.

[0441] In Figure 20b it, the second conductive layer 1092A may be disposed in, coupled to, or attached to a groove formed in the second surface 1801B of the second plate unit 800-1. In another embodiment, the second conductive layer may be disposed in or coupled to or attached to the second surface 1801B of the second plate unit 1800 without a groove being formed on the second surface 1801B.

[0442] The first conductive layer 1093 and the second conductive layer 1092A may be used as a heat dissipation pattern or a heat dissipation pad of the second plate unit 1800. In other words, since the first conductive layer 1093 and the second conductive layer 1092A are only used for heat dissipation, they do not need to be electrically connected to other wires except the ground of the second plate unit 1800. Here, the other wires may be wires electrically connected to an electronic component (or a circuit component) (such as an image sensor 1810 or a support plate 1310).

[0443] The second conductive layer 1092A may be electrically connected to the cover member 1300 (such as a side plate 1302) via solder, a conductive adhesive, or a conductive tape. In another embodiment, the second conductive layer 1092A connected to the ground of the second plate unit 1800 may be electrically connected to the cover member 1300 through a bracket. The bracket may be a structure that receives or houses the camera device to protect the camera device. For example, the bracket may be made of a conductive member. Since the ground of the second plate unit 1800 and the heat dissipation member 1380 are electrically connected to the cover member 1300, the camera device 1010 can be protected from static electricity and the heat dissipation efficiency can be improved.

[0444] In another embodiment, the first conductive layer and the second conductive layer of the second plate unit 1800 may be applied to the second circuit board 1260 with or without modification. For example, the second circuit board 1260 according to another embodiment may include at least one third conductive layer that contacts the first heat dissipation member 1280, and at least a part of the third conductive layer may be exposed from the second circuit board 1260.

[0445] Since the heat dissipation member 1380 is disposed on the first surface of the second plate unit 1800, the distance between the heat dissipation member 1280 and the heat dissipation member 1380 can be reduced, thereby improving the heat dissipation efficiency.

[0446] The heat radiated from the first heat dissipation member 1280 can be transferred to the heat dissipation member 1380 by convection or radiation, and the transferred heat can be radiated to the outside via the heat dissipation member 1380, thereby improving the heat dissipation efficiency. Since the upper surface of the heat dissipation member 1380 and the lower surface of the first heat dissipation member 1280 are arranged to face or overlap each other in the optical axis direction, heat can be effectively transferred from the first heat dissipation member 1280 to the heat dissipation member 1380.

[0447] For example, the heat dissipation member 1280 and the heat dissipation member 1380 can be made of the same material. In another embodiment, the first heat dissipation member 1280 and the heat dissipation member 1380 can be made of different materials. For example, the thermal conductivity of the first heat dissipation member 1280 can be applied to the heat dissipation member 1380 with or without modification.

[0448] In addition, the heat dissipation member 1380 can stably support the second plate unit 1800 and can be used as a reinforcing member configured to inhibit breakage of the second plate unit 1800 due to external impact or contact.

[0449] In another embodiment, the heat dissipation member 1380 can be made of a heat dissipation member having high thermal conductivity, such as exothermic epoxy resin, exothermic plastic, or exothermic synthetic resin.

[0450] To improve the heat dissipation efficiency, the heat dissipation member 1380 can include at least one groove or uneven portion. For example, grooves or uneven portions having a predetermined pattern can be formed on at least one of the upper surface or the lower surface of the heat dissipation member 1380.

[0451] In another embodiment, the heat dissipation member 1380 can have holes or through holes instead of grooves. For example, the heat dissipation member 1380 according to another embodiment can have a plurality of through holes. The description of the predetermined pattern of the heat dissipation member 1280 can be applied to the heat dissipation member 1380 with or without modification.

[0452] A camera device according to another embodiment can include a heat dissipation member disposed below the second plate unit 1800. Here, the description of the material of the heat dissipation member 1280 or 380 can be applied to this heat dissipation member with or without modification.

[0453] The support plate 1310 can support the OIS moving unit so that the OIS moving unit can move relative to the fixed unit in a direction perpendicular to the optical axis direction and electrically connect the first plate unit 1255 and the second plate unit 1800.

[0454] The support plate 1310 may also be referred to as a "support member", "connection plate", or "connection part". Alternatively, the support plate 1310 may also be referred to as an "insert". Alternatively, the insert may include the first circuit board 1250 and the support plate 1310 integrally formed.

[0455] In another embodiment, a support unit may be provided instead of the support plate 1310. One end of the support unit is connected to the moving unit, such as the first plate unit 1255, and the other end is connected to the fixed unit, such as the second plate unit 1800. For example, the support unit may include at least one of a leaf spring or a suspension wire. For example, the support unit may electrically connect the first plate unit 1255 to the second plate unit 1800.

[0456] The support plate 1310 may include a flexible plate, or may be a flexible plate. For example, the support plate 1310 may include a flexible printed circuit board (FPCB). At least a part of the support plate 1310 may be flexible. The first circuit board 1250 may be connected to the support plate 1310.

[0457] For example, referring to Figure 16 , the support plate 1310 may include a connection part 1320 connected to the first circuit board 150. For example, the first circuit board 1250 and the support plate 1310 may be integrally formed. In another embodiment, the first circuit board 1250 and the support plate 1310 may not be integrally formed, but may be separately formed. The first circuit board 1250 and the support plate 1310 may be connected to each other via the connection part 1320 and may be electrically connected to each other. In another embodiment, the connection part 1320 may be integrally formed with at least one of the support plate 1310 or the first circuit board 1250.

[0458] The support plate 1310 may be electrically connected to the first circuit board 1250. The support plate 1310 may be electrically connected to the second plate unit 1800. For example, one end of the support plate 1310 may be connected or coupled to the first plate unit 255 (e.g., the second circuit board 1250). The other end of the support plate 1310 may be connected or coupled to the second plate unit 1800.

[0459] The support plate 1310 may support the OIS moving unit relative to the fixed unit. The support plate 1310 may guide the movement of the OIS moving unit. The support plate 1310 may guide the OIS moving unit such that the OIS moving unit can move in a direction perpendicular to the optical axis direction. The support plate 1310 may guide the OIS moving unit such that the OIS moving unit rotates, tilts, or rolls relative to the optical axis. The support plate 1310 may limit the movement of the OIS moving unit in the optical axis direction.

[0460] A portion of the support plate 1310 can be coupled, attached, or fixed to the base 1210 as a fixed unit, and another portion of the support plate 1310 can be coupled, attached, or fixed to the holder 1270 as an OIS moving unit.

[0461] For example, a portion of the main bodies 1086 and 1087 of the support plate 1310 can be coupled to the base 1210 as a fixed unit (e.g., the protrusions 1216A and 1216B), and other portions of the main bodies 1086 and 1087 can be coupled to the holder 1270 as an OIS moving unit (e.g., the protrusions 1027A and 1027B).

[0462] The connection portion 1320 of the support plate 1310 can be connected to the first plate unit 255 (e.g., the first circuit board 1250) and can be electrically connected thereto. The extensions 1007A to 1007D of the support plate 1310 can be coupled to the second plate unit 1800 (e.g., the terminal 1800B) and can be electrically connected thereto.

[0463] The support plate 1310 can include a circuit board and an elastic portion coupled to a circuit member. The elastic portion for flexibly supporting the OIS moving unit can be implemented as an elastomer, such as a spring. The elastic portion can include metal or be made of an elastic material. The circuit member for electrically connecting the first circuit board 1250 to the second plate unit 1800 can be a flexible board or can include at least one of a flexible board and a rigid board. For example, the circuit member can be a flexible printed circuit board (FPCB).

[0464] For example, the support plate 1310 can include one or more connection members 1320A and 1320B that are connected to the first plate unit 1255 (e.g., the first circuit board 1250) and electrically connected to the first plate unit 1255 (e.g., the first circuit board 1250).

[0465] In addition, the support plate 1310 can include one or more extensions 1007A to 1007D that are connected to the second plate unit 1800 and electrically connected to the second plate unit 1800. The one or more extensions 1007A to 1007D can include a plurality of terminals 1311.

[0466] For example, the support plate 1310 can be arranged to surround the OIS moving unit, such as the first plate unit 1255. For example, the support plate 1310 can be arranged to surround the four sides 1033A to 1033D of the first circuit board 1250 (see Figure 16 ) or surround its outer surface.

[0467] For example, the support plate 1310 may not overlap with the OIS moving unit (e.g., the first plate unit 1255) in the optical axis direction, and at least a part of the support plate 1310 may overlap with the OIS moving unit (e.g., the first plate unit 1255) in a direction perpendicular to the optical axis direction.

[0468] For example, the support plate 1310 may include a plurality of support plates separated or spaced apart from each other. In another embodiment, the support plate 1310 may be formed to have a single integrated structure.

[0469] The support plate 1310 may include bodies 1086 and 1087. For example, the bodies 1086 and 1087 may be arranged to surround the OIS moving unit, such as the first plate unit 1255. For example, the bodies 1086 and 1087 may not overlap with the OIS moving unit (e.g., the first plate unit 1255) in the optical axis direction, and at least a part of each of the bodies 1086 and 1087 may overlap with the OIS moving unit (e.g., the first plate unit 1255) in a direction perpendicular to the optical axis direction.

[0470] For example, each of the bodies 1086 and 1087 may have the form of a flat plate in the optical axis direction or a direction parallel to the optical axis direction. For example, when viewed from above, each of the bodies 1086 and 1087 may have a polygonal shape profile, such as a quadrilateral shape or a circular shape.

[0471] For example, each of the bodies 1086 and 1087 may include a plurality of parts separated or spaced apart from each other. In another embodiment, each body may be formed to have an integrated structure.

[0472] The support plate 1310 may include extensions extending from each of the bodies 1086 and 1087 and connected to the second plate unit 1800. For example, the extensions of the support plate 1310 may extend toward the second plate unit 1800, and one end of the extension of the support plate 1410 may be connected to the second plate unit 1800. A plurality of terminals may be provided at one end of the extension of the support plate 1310, and these terminals are electrically connected to the second plate unit 1800 using solder or a conductive adhesive. For example, the extension of the support plate 1310 may alternatively be referred to as a "terminal portion", a "protruding portion", or a "leg".

[0473] For example, each of the extensions 1007A to 1007D of the support plate 1310 may include a first portion and a second portion. The first portion extends in the optical axis direction from a corresponding one of the bodies 1086 and 1087, and the second portion extends from the first portion in a direction perpendicular to the optical axis. For example, the extensions 1007A to 1007D of the support plate 1310 may be fixed or coupled to a fixing unit (e.g., the base 1210). For example, when the OIS moving unit moves, the bodies 1086 and 1087 of the support plate 1310 are movable, but the extensions 1007A to 1007D of the support plate 1310 may be fixed and immovable.

[0474] For example, the support plate 1310 may include a first support plate 1310-1 and a second support plate 1310-2 spaced apart from each other. The first support plate 1310-1 and the second support plate 1310-2 may be formed axially symmetrically. In another embodiment, the first support plate 1310-1 and the second support plate 1310-2 may be integrally formed as a single plate. In another embodiment, the support plate 1310 may include three or more support plates.

[0475] For example, the first and second support plates 1310-1 and 1310-2 may be disposed around four side portions 1033A to 1033D of the first circuit board 1250.

[0476] For example, the first support plate 1310-1 may include a first body 1086 and one or more extensions 1007A and 1007B extending from the first body 1086. One or more extensions 1007A and 1007B of the first support plate 1310-1 may include a plurality of terminals 1311.

[0477] The second support plate 1310-2 may include a second body 1087 and one or more extensions 1007C and 1007D extending from the second body 1087. One or more extensions 1007C and 1007D of the second support plate 1310-2 may include a plurality of terminals 1311.

[0478] The first circuit board 1250 may include a first side portion 1033A and a second side portion 1033B positioned opposite to each other, and a third side portion 1033C and a fourth side portion 1033D positioned between the first side portion 1033A and the second side portion 1033B and opposite to each other.

[0479] For example, the first connecting member 1320A may connect the first body 1086 to the first side portion 1033A of the first circuit board 1250. The second connecting member 1320B may connect the second body 1087 to the second side portion 1033B of the first circuit board 1250.

[0480] The first body 1086 may include a first part 1006A, a second part 1006B, and a third part 1006C. The first part 1006A corresponds to or faces the first side portion 1033A of the first circuit board 1250. The second part 1004B corresponds to a part (or one side) of the third side portion 1033C of the first circuit board 1250. The third part 1006C corresponds to a part of the fourth side portion 1033D of the first circuit board 1250. In addition, the first body 1086 may include a first bending part 1006D and a second bending part 1006E. The first bending part 1006D connects one end of the first part 1006A to the second part 1006B and bends at one end of the first part 1006A. The second bending part 1006E connects the other end of the first part 1006A to the third part 1006C and bends at the other end of the first part 1006A. For example, the first body 1086 may have a "U" shape.

[0481] For example, the first support plate 1310-1 may include extending parts 1007A and 1007B. For example, the extending part 1007A may be connected to one side of the first body 1086, while the extending part 1007B may be connected to the other side of the first body 1086.

[0482] For example, the extending part 1007A may extend or protrude from the first part 1006B of the first body 1086 toward the second plate unit 1800. The extending part 1007B may extend or protrude from the third part 1006C of the first body 1086 toward the second plate unit 1800. The extending part 1007B may be positioned opposite to the extending part 1007A, and the first plate unit 1255 (e.g., the first circuit board 1250) is interposed therebetween.

[0483] For example, the first connecting member 1320A may connect the first part 1006A of the first body 1086 to the first side portion 1033A of the first circuit board 1250. The first connecting member 1320A may include a bending part. For example, the first connecting member 1320A may connect the central area of the first part 1006A of the first body 1086 to the central area of the first side portion 1033A of the first circuit board 1250.

[0484] The second body 1087 may include a first portion 1009A, a second portion 1009B, and a third portion 1009C. The first portion 1009A corresponds to or faces the second side portion 1033B of the first circuit board 1250. The second portion 1009B corresponds to or faces another portion (or the other side) of the third side portion 1033C of the first circuit board 1250. The third portion 1009C corresponds to or faces another portion (or the other side) of the fourth side portion 1033D of the first circuit board 1250. In addition, the second body 1087 may include a first bent portion 1009D and a second bent portion 1009E. The first bent portion 1009D connects one end of the first portion 1009A to the second portion 1009B and is bent at one end of the first portion 1009A. The second bent portion 1009E connects the other end of the first portion 1009A to the third portion 1009C and is bent at the other end of the first portion 1009A. For example, the second body 1087 may have a "U" shape. For example, the second body 1087 may have a shape symmetric with respect to the optical axis with the first body 1086. For example, the second body 1087 may be symmetric with the first body 1086 based on the optical axis.

[0485] For example, the second support plate 1310-2 may include extensions 1007C and 1007D. For example, the extension 1007C may be connected to one side of the second body 1087, and the extension 1007D may be connected to the other side of the second body 1086.

[0486] The extension 1007C may extend or protrude from the second portion 1009B of the second body 1087 toward the second plate unit 1800, and the extension 1007D may extend or protrude from the third portion 1009C of the second body 1087 toward the second plate unit 1800. The extension 1007D may be positioned opposite to the extension 1007C, and the first plate unit 1255 (e.g., the first circuit board 1250) is interposed therebetween.

[0487] For example, when viewed from the front, the extension 1007A and the extension 1007C may be axisymmetric with each other. In another embodiment, the extension 1007A and the extension 1007C may not be axisymmetric with each other.

[0488] For example, when viewed from the front, the extension 1007B and the extension 1007D may be axisymmetric with each other. In another embodiment, the extension 1007B and the extension 1007D may not be axisymmetric with each other.

[0489] For example, the second connecting member 1320B can connect the first portion 1009A of the second body 1087 to the second side portion 1033B of the first circuit board 1250. The second connecting member 1320B can include a bent portion. For example, the second connecting member 1320B can connect the central region of the first portion 1009A of the second body 1087 to the central region of the second side portion 1033B of the first circuit board 1250.

[0490] Referring to Figure 16 , the terminal members (e.g., 1007A and 1007C) of the support plate 1310 can be provided with terminals P1 to P4, which are electrically connected to the terminal members 1095 of the circuit board 1190 of the AF operation unit 1100 at terminals B1 to B4. The terminal members 1095 of the circuit board 1190 at terminals B1 to B4 and the terminals P1 to P4 of the extension portions 7A and 7C of the support plate 1310 can be connected to each other using solder or a conductive adhesive, respectively. In other words, the circuit board 1190 of the AF operation unit 1100 can be electrically connected to the second board unit 1800 via the support plate 1310.

[0491] Referring to Figure 16 , the support plate 1310 can include a conductive layer 1093-1. In addition, the support plate 1310 can include a first insulating layer 1094-1 provided on one surface (or the first surface) or one side of the conductive layer 1093-1. In addition, the support plate 1310 can include a second insulating layer 1094-2 provided on the other surface (or the second surface) or the other side of the conductor 1093-1. In another embodiment, for example, the support plate 1310 can include at least one of the first insulating layer 1094-1 or the second insulating layer 1094-2. The support plate 1310 can include a protective layer 1096 provided on the first insulating layer 1094-1. For example, the protective layer 1096 can be an EMI member (e.g., an EMI tape). Or, for example, the protective layer 1096 can be a heat dissipation member, such as graphite. Or, for example, the protective layer 1096 can be an elastic material. Or, for example, the projection layer 1096 can be a conductive member. Or, for example, the protective layer 1096 can be an insulating member.

[0492] For example, the conductive layer 1093-1 can correspond to the Figure 24 conductive layer 1091-2 shown in Figure 24 below, the first insulating layer 1094-1 can correspond Figure 24 to the insulating layer 1092-1 shown in Figure 24 below, and the second insulating layer 1094-2 can correspond

[0493] Figure 17ais a first perspective view of a support plate 1310 coupled to a holder 1270 and a base 1210. Figure 17b is a second perspective view of a support plate 1310 coupled to a holder 1270 and a base 1210.

[0494] Referring to Figure 17a and Figure 17b , the holder 1270 may include first to fourth side portions 1064A to 1064D corresponding to or facing first to fourth side portions 1033A to 1033D of the first circuit board 1250.

[0495] The first side portion 1064A and the second side portion 1064B of the holder 1270 may be arranged to face or oppose each other in a second horizontal direction (e.g., in the X-axis direction). The third side portion 1064C and the fourth side portion 1064D of the holder 1270 may be arranged to face or oppose each other in a first horizontal direction (e.g., in the Y-axis direction).

[0496] At least a part of the support plate 1310 may be attached to or coupled to the holder 1270. For example, one or more connecting members 1320A and 1320B of the support plate 1310 may be coupled to at least one of the first to fourth side portions 1064A to 1064D of the holder 1270 using an adhesive. For example, the first connecting member 1320A may be coupled, attached, or fixed to the first side portion 1064A of the holder 1270 using an adhesive, and the second connecting member 1320B may be coupled, attached, or fixed to the second side portion 1064B of the holder 1270 using an adhesive.

[0497] The first protrusion 1027A may be formed at the first side portion 1064A of the holder 1270, and the second protrusion 1027B may be formed at the second side portion 1064B of the holder 1270.

[0498] The support plate 1310 may be coupled, attached, or fixed to the protrusions 1027A and 1027B of the holder 1270. The support plate 1310 may be coupled, attached, or fixed to the outer surface (or inner surface) of the protrusions 1027A and 1027B of the holder 1270.

[0499] For example, a part of the support plate 1310 may be coupled, attached, or fixed to the first protrusion 1027A and the second protrusion 1027B of the holder 1270. The main bodies 1086 and 1087 of the support plate 1310 may be coupled, attached, or fixed to the first and second protrusions 1027A and 1027B of the holder 1270.

[0500] For example, the first support plate 1310-1 can be coupled, attached, or fixed to the first protrusion 1027A, and the second support plate 1310-2 can be coupled, attached, or fixed to the second protrusion 1027B. For example, the first part 1006A of the first body 1086 can be coupled, attached, or fixed to the outer surface (or inner surface) of the first protrusion 1027A, and the first part 1009A of the second body 1087 can be coupled, attached, or fixed to the outer surface (or inner surface) of the second protrusion 1027B.

[0501] The base 1210 can include a first side portion 1065A to a fourth side portion 1065D (see Figure 14 ), which correspond to or face the first side portion 1033A to the fourth side portion 1033D of the first circuit board 1250. The first side portion 1065A to the fourth side portion 1065D of the base 1210 can correspond to or face the first side portion 1064A to the fourth side portion 1064D of the holder 1270.

[0502] The first side portion 1065A and the second side portion 1065B of the base 1210 can be arranged to face or oppose each other in a first horizontal direction (e.g., in the Y-axis direction). In addition, the third side portion 1065C and the fourth side portion 1065D of the base 1210 can be arranged to face or oppose each other in a second horizontal direction (e.g., in the X-axis direction).

[0503] At least a part of the support plate 1310 can be coupled, attached, or fixed to the base 1210. For example, the bodies 1086 and 1087 of the support plate 1310 can be connected to the base 1210 using an adhesive. For example, the portions of the bodies 1086 and 1087 of the support plate 1310 that are connected to the extension portions 107A to 1007D can be coupled to the base 1210.

[0504] For example, at least a part of the support plate 1310 can be coupled, attached, or fixed to the protrusions 1216A and 1216B formed at the base 1210. For example, the support plate 1310 can be coupled, attached, or fixed to the outer surface (or inner surface) of the protrusions 1216A and 1216B of the base 1210. The first protrusion 1216A can be formed at the third side portion 1065C of the base 1210, and the second protrusion 1216B can be formed at the fourth side portion 1065D of the base 1210.

[0505] For example, the bodies 1086 and 1087 of the support plate 1310 can be coupled, attached, or fixed to the first protrusion 1216A and the second protrusion 1216B of the base 1210.

[0506] For example, one end of the first support plate 1310-1 (e.g., the second part 1006B) can be coupled, attached, or fixed to an area of the first protrusion 1216A of the base 1210, while the other end of the first support plate 1310-1 (e.g., the third part 1006C) can be coupled, attached, or fixed to an area of the second protrusion 1216B of the base 1210.

[0507] For example, one end of the second support plate 1310-2 (e.g., the second part 1009B) can be coupled, attached, or fixed to another area of the first protrusion 1216A of the base 1210, and the other end in the second support plate 1310-2 (e.g., the third part 1009C) can be coupled, attached, or fixed to another area of the second protrusion 1216B of the base 1210.

[0508] The first coupling area 1069A can be formed between the first body 1086 of the first support plate 1310-1 and the first protrusion 1027A of the holder 1270, and the second coupling area 1069B can be formed between the second body 1087 of the second support plate 1310-2 and the second protrusion 1027B of the holder 1270.

[0509] In addition, the third coupling area 1059A can be formed between one end of each of the first support plate 1310-1 and the second support plate 1310-2 and the first protrusion 1216A of the base 1210. The fourth coupling area 1059B can be formed between the other end of each of the first support plate 1310-1 and the second support plate 1310-2 and the second protrusion 1216B of the base 1210.

[0510] Through the support plate 1310 and the first to fourth coupling areas 1069A, 1069B, 1059A, and 1059B, the OIS moving unit can be flexibly supported relative to the fixed unit. The terminals 1311 of the support plate 1310 can be coupled and electrically connected to the terminals 1800B of the second plate unit 1800 using solder 1902 (see Figure 17a and 17B) or a conductive adhesive.

[0511] In another embodiment, for example, the support member may be an elastic member that does not include a plate, such as a spring, a wire, a shape memory alloy, or a spherical member. For example, when the support member is made of a wire, a plurality of wires may be disposed on at least one of the corners and sides of the base 1210 or the second plate unit 1800 to connect the first plate unit 1255 (e.g., the second circuit board 1260) to the second plate unit 1800 (or the base 1210). For example, one end of each of the plurality of wires may be coupled to the first plate unit 1255 (e.g., the second circuit board 1260), and the other end of each of the plurality of wires may be coupled to the second plate unit 1800 (or the base 1210).

[0512] The image sensor unit 1350 may include at least one of a controller 1830, a memory 1512, or a capacitor 1514.

[0513] The controller 1830 may be arranged to be spaced apart from the first plate unit 1255. For example, the controller 1830 may be disposed on the second plate unit 1800.

[0514] The memory 1512 may be disposed on one of the first plate unit 1255 and the second plate unit 1800. For example, the memory 1512 may be disposed or mounted on the first region 1801 of the second plate unit 1800. For example, the memory 1512 may avoid spatial interference with the heat dissipation member 1380, or may be spaced apart from the heat dissipation member 1380. For example, the heat dissipation member 1380 may include an avoidance groove or an opening to avoid spatial interference with the memory 1512, and the memory 1512 may be disposed in the avoidance groove or the opening in the heat dissipation member 1380. The capacitor 1514 may be disposed on at least one of the first plate unit 1255 or the second plate unit 1800.

[0515] The memory 1512 may store a first data value (or code value) corresponding to the output of the second position sensor 1240 for an OIS feedback operation according to the displacement (or stroke) of the OIS moving unit in a direction perpendicular to the optical axis (e.g., in the X-axis direction or the Y-axis direction). In addition, the memory 1512 may store a first data value (or code value) corresponding to the output of the first position sensor 1170 according to the displacement (or stroke) of the bobbin 1110 in a first direction (e.g., in the optical axis direction or in the Z-axis direction) for an AF feedback operation.

[0516] For example, each of the first and second data values may be stored in the memory 1512 as a look-up table. In addition, the memory 1512 may store mathematical formulas, algorithms, or programs for the operation of the controller 1830. For example, the memory 1512 may be a non-volatile memory, such as an electrically erasable programmable read-only memory (EEPROM).

[0517] The controller 1830 may be positioned outside the cover member 1300, or may be disposed on a region of the second plate unit 1800 that is outside the cover member 1300.

[0518] Referring to Figure 20a , the second plate unit 1800 may include an extension region 1808 that is connected to and extends from the first region 1801. The extension region 1808 may extend from a first side portion 1085A of the first region 1801. For example, the extension region 1808 may protrude from the first side portion 1085A of the first region. For example, the extension region 1808 may protrude from an outer surface of the first side portion 1085A of the first region. For example, the extension region 1808 may extend or protrude in a second horizontal direction (e.g., in the X-axis direction).

[0519] The extension region 1808 may be positioned outside the cover member 1300, or may be positioned on the outside of the cover member 1300.

[0520] The extension region 1808 may alternatively be referred to as a "fourth region", a "protrusion region", an "extension portion", or a "protrusion portion". The extension region 1808 may not overlap with the AF moving unit and the OIS moving unit in the optical axis direction. For example, the extension region 1808 may extend in the same direction as the third region 1803 (e.g., along the second horizontal direction).

[0521] The controller 1830 may be disposed in the extension region 1808 of the second plate unit 1800. For example, the controller 1830 may be disposed or mounted on an upper surface of the extension region 1808 of the second plate unit 1800. In another embodiment, the controller 1830 may be disposed or mounted on a lower surface of the extension region 1808. For example, the controller 1830 may not overlap with the cover member 1300 in the optical axis direction. For example, the extension region 1808 may not overlap with the cover member 1800 in the optical axis direction. For example, the surface area of the upper surface of the extension region 1808 may be equal to or greater than the surface area of the lower surface of the controller 1830.

[0522] Since the extension region 1808 and the third region 1803 are connected to the first side portion 1085A of the second plate unit 1800, the surface area occupied by the camera device 1010 in a direction perpendicular to the optical axis can be reduced. Therefore, this embodiment is capable of reducing an increase in the size of the camera device 1010 due to the extension region 1808.

[0523] In another embodiment, the extension region may be connected to one of the second to fourth sides 1085B, 1085C, and 1085D of the first region 1801 of the second plate unit 1800, and may protrude from one of the second to fourth sides 1085B, 1085C, and 1085D in the first region 1801.

[0524] The controller 1830 may be positioned outside the cover member 1300, or may be positioned on the outer side of the cover member 1300. For example, the controller 1830 may be located outside the space defined between the cover member 1300, the base 1210, and the first region 1801 of the second plate unit 1800.

[0525] For example, the controller 1830 may not overlap with the lens module 1400, the AF moving unit, the OIS moving unit, and the first region 1801 of the second plate unit 1255 in the optical axis direction. At least one capacitor 1514 may be provided or mounted on the upper surface of the extension region 1808.

[0526] In a sensor-shift type camera device in which a moving image sensor performs shake correction, since the OIS moving unit including the image sensor and the first plate unit is arranged to be spaced apart from the fixed unit including the second plate unit, it may be insufficient to dissipate the heat generated by the OIS moving unit to the outside through the fixed unit. In addition, the sensor-shift type camera device may have a structure in which the AF operation unit and the OIS operation unit are restricted in the cover member to prevent malfunctions caused by foreign substances, so it may not be easy to dissipate heat to the outside of the camera device.

[0527] The image sensor, the second coil, and the controller may correspond to heat sources. Here, the "controller" may be a driver IC configured to control the AF operation and / or the OIS operation.

[0528] The camera device 1010 may include a heat dissipation member 1870, which is provided, coupled, or attached to the extension region 1808 to improve the efficiency of heat radiation. The heat dissipation member 1870 may be in contact with the extension region 1808. For example, the heat dissipation member 1870 may be provided below the extension region 1808. For example, the heat dissipation member 1870 may be provided, coupled, or fixed to the lower surface of the extension region 1808. The heat dissipation member 1870 may be a plate-like member, and the description of the material of the heat dissipation member 1280 may be applied to the heat dissipation member 1870 with or without modification. At least a part of the heat dissipation member 1870 may overlap with the controller 1830 in the optical axis direction.

[0529] The camera device 1010 may include a cover box 1405 that is disposed in the extension area 1808 and houses a controller 1830 therein to protect the controller 1830 from external shocks. The cover box 1405 may include an upper plate 1405A and side plates 1405B that are connected to the upper plate 1405A and extend from the upper plate 1405A toward the extension area 1808.

[0530] The cover box 1405 may be set, coupled, or fixed to the upper surface of the extension area 1808. For example, the lower portion, lower end, or lower surface of the side plate 1405B of the cover box 1405 may be coupled, attached, or fixed to the upper surface of the extension area 1808.

[0531] Since the cover box 1405 houses the controller 1830 therein, heat generated by the controller 1830 can be prevented from dissipating to the outside and being transferred to the image sensor. A description of the material of the heat dissipation member 1280 or the cover member 1300 may be applied to the cover box 1405 with or without modification.

[0532] The camera device 1010 may further include a heat dissipation layer 1860 disposed on the controller 1830. The heat dissipation layer 1860 may cover the surface of the controller 1830. For example, the heat dissipation layer 1860 may be disposed to surround the surface of the controller 1830. For example, the heat dissipation layer 1860 may be in contact with the upper surface and side surfaces of the controller 1830 to surround these surfaces. The heat dissipation layer 1860 may be made of a heat-releasing plastic or a heat-dissipating resin, such as a heat-releasing epoxy resin. The heat dissipation layer 1860 may improve the heat dissipation efficiency and performance of the controller 1830.

[0533] In another embodiment, the heat dissipation layer may be disposed on at least one of the upper surface or side surface of the controller 1830. For example, the heat dissipation layer may expose at least a part of the controller 1830.

[0534] The controller 1830 may be electrically connected to a second position sensor 1240. The controller 1830 may adjust or control a drive signal provided to the second coil 1230, and may perform a feedback OIS operation using output signals received from sensors 1240A, 1240B, and 1240C of the second position sensor 1240 and first data values stored in the memory 1512.

[0535] In addition, the controller 1830 may be electrically connected to a first position sensor 1170. For example, when the first position sensor 1170 is implemented as a Hall sensor separately, the first position sensor 1780 may be electrically connected to the controller 1830. Here, the controller 1830 may control a drive signal provided to the first coil 1120, thereby performing a feedback autofocus operation using the output signal of the first position sensor 1170 and second data values stored in the memory 1512.

[0536] Although the controller 1830 can be implemented as a driver IC, the present disclosure is not limited thereto. For example, the controller 1830 can be electrically connected to the terminal 1800B of the second board unit 1800.

[0537] The controller 1830 can control a first position sensor implemented separately as a Hall sensor and a second position sensor implemented separately as a Hall sensor. For example, the controller 1830 can provide a drive signal to the first position sensor implemented separately as a Hall sensor and / or the second position sensor implemented separately as a Hall sensor, and can receive the output signal of the first position sensor and / or the output signal of the second position sensor.

[0538] In another embodiment, the first position sensor can be implemented separately as a Hall sensor, and the second position sensor can be implemented as a drive IC including a Hall sensor. Here, the controller 1830 can be electrically connected to the first position sensor, can provide a drive signal to the first position sensor, and can receive the output signal from the first position sensor.

[0539] For example, the controller 1830 can include a driver configured to drive at least one of the first position sensor or the second position sensor.

[0540] The image sensor unit 1350 can further include a motion sensor (not shown) disposed on one of the first board unit 1255 and the second board unit 1800. The motion sensor can be electrically connected to the controller 1830. The motion sensor can output rotational angular velocity information corresponding to the movement of the camera device 1010. For example, the motion sensor can be implemented as a biaxial or triaxial gyro sensor or an angular velocity sensor. For example, the motion sensor can output information about the amount of movement in the X-axis direction and the Y-axis direction and the amount of rotation caused by the movement of the camera device 1010.

[0541] In another embodiment, the motion sensor in the camera device 1010 can be omitted. In the case where the motion sensor in the camera device is omitted, the camera device 1010 can receive position information about the movement of the camera device 1010 from a motion sensor provided at the optical instrument 200A.

[0542] The image sensor unit 1350 can further include a filter 1610 disposed between the lens module 1400 and the image sensor 1810. The image sensor unit 1350 can further include a filter holder 1600 in which the filter is disposed, placed, or received. The filter holder 1600 can alternatively be referred to as a "sensor base".

[0543] The filter 1610 can be used to prevent light within a specific frequency band passing through the lens barrel 1400 from being introduced into the image sensor 1810. The filter 1610 can be, for example, an infrared light blocking filter. For example, the filter 1610 can be oriented parallel to the X-Y plane perpendicular to the optical axis OA. The filter 1610 can be disposed below the lens module 1400.

[0544] The filter holder 1600 can be disposed below the AF operation unit 1100. For example, the filter holder 1600 can be disposed on the first plate portion 1255. For example, the filter holder 1600 can be disposed on the upper surface of the second circuit board 1260 of the first plate unit 1255.

[0545] The filter holder 1600 can be coupled to an area around the image sensor 1810 on the second circuit board 1260 using an adhesive, and can be exposed through the through-hole 1250A in the first circuit board 1250. For example, the through-hole 1250A in the circuit board 1250 can expose the filter holder 1600 disposed on the second circuit board 1260 and the filter 1610 disposed on the filter holder 1600 through the through-hole 1250A. The filter holder 1600 can have a through-hole 61A formed in the area where the filter 1610 is mounted or disposed to allow light passing through the filter 1610 to enter the image sensor 1810. The through-hole 61A in the filter holder 1600 can be configured in the form of a through-hole that is formed through the filter holder 1600 in the optical axis direction. For example, the through-hole 61A in the filter holder 1600 can be formed through the center of the filter holder 1600 and can be set to correspond to or face the image sensor 1810.

[0546] The filter holder 1600 can have a recessed portion 1500 that is recessed from its upper surface, and the filter 1610 is located therein. The filter 610 can be set, placed, or mounted in the recessed portion 1500. The recessed portion 1500 can be formed to surround the through-hole 61A. In another embodiment, the recessed portion of the filter holder can be configured in the form of a protrusion that protrudes from the upper surface of the filter.

[0547] The image sensor unit 1350 can also include an adhesive disposed between the filter 1610 and the recessed portion 1500. With the adhesive, the filter 1610 can be coupled or attached to the filter holder 1600.

[0548] In another embodiment, the filter holder can be coupled to the holder 1270 or the AF operation unit 1100.

[0549] Refer to Figure 3, the cover member 1300 may be in the form of a box having an opening at its lower part, and include an upper plate 1301 and side plates 1302. The lower part of the side plates 1302 of the cover member 1300 may be coupled to the base 1210. The upper plate 1301 of the cover member 1300 may have a polygonal shape, such as a quadrilateral shape or an octagonal shape. For example, the side plates 1302 may include four side plates connected to each other. A through hole 1303 may be formed in the upper plate 1301 of the cover member 1300, and the lens of the lens module 1400 coupled to the bobbin 1110 is exposed to external light through the through hole 1303.

[0550] Referring to Figure 1 and Figure 3 , a groove 304 may be formed in the side plates 1302 of the cover member 1300, and the terminals 95 of the circuit board 1190 and the terminals 800B of the second plate unit corresponding to the terminals 95 are exposed through the groove 304.

[0551] For example, the cover member 1300 may be made of metal. For example, the cover member 1300 may be made of SUS (such as SUS4 series stainless steel). In addition, the cover member 1300 may be made of cold-rolled steel sheet (SPC). For example, the cover member 1300 may be made of SUS containing 50% or more of Fe. In order to prevent oxidation, an antioxidant metal, such as nickel, may be plated on the surface of the cover member 1300. In another embodiment, for example, the cover member 1300 may be made of a magnetic material or a magnetic metal.

[0552] In another embodiment, the cover member 1300 may be injection-molded of, for example, plastic or resin. In addition, the cover member 1300 may be made of an insulating material or a material capable of shielding electromagnetic waves.

[0553] The cover member 1300 and the base 1210 may accommodate the AF operation unit 1100 and the OIS moving unit therein. The cover member 1300 and the base 1210 may protect the AF operation unit 1100 and the OIS moving unit from external shocks and may prevent foreign substances from being introduced from the outside.

[0554] For example, at the initial position of the OIS moving unit, the outer surface of the holder 1270 may be spaced apart from the inner surface of the base 1210 by a predetermined distance. For example, at the initial position of the OIS moving unit, the lower surface of the holder 1270 and the first plate unit 1255 may be spaced apart from the base 1210 by a predetermined distance.

[0555] The controller 1830 may supply at least one driving signal to at least one of the first coil unit 1230-1 to the fourth coil unit 1230-4, and may control the at least one driving signal to move the OIS moving unit in the X-axis direction and / or the Y-axis direction, or to rotate, tilt, or roll the OIS moving unit within a predetermined angular range with respect to the optical axis.

[0556] Figure 21 A is a block diagram showing the configuration of the controller 1830 and the first to third sensors 1240A, 1240B, and 1240C. The controller 1830 may perform communication for transmitting and receiving data with respect to the host, such as I2C communication, using a clock signal SCL and a data signal SDA. For example, the host may be the controller 780 of the optical instrument 200A.

[0557] The controller 1830 may be electrically connected to the second coil 1230. The controller 1830 may include a driving unit 1510 configured to supply driving signals for driving the first to fourth coil units 1230-1 to 1230-4. For example, the driving unit 1510 may include an H-bridge circuit or an H-bridge driver capable of changing the polarity of the driving signal. Here, the driving signal may be a PWM signal for reducing current consumption, and the driving frequency of the PWM signal may be 20 kHz or higher, which exceeds the audible frequency range. In another embodiment, the driving signal may be a DC signal.

[0558] Each of the first to third sensors 1240A, 1240B, and 1240C may include two input terminals and two output terminals. The controller 1830 may supply power or driving signals to the two input terminals of each of the first to third sensors 1240A to 1240C. For example, the first input terminals of the first to third sensors 1240A to 1240C may be commonly connected to each other. For example, the two input terminals may be a (+) input terminal and a (-) input terminal (e.g., a ground terminal).

[0559] For example, the controller 1830 may receive a first output voltage of the first sensor 1240A, a second output voltage of the second sensor 1240B, and a third output voltage of the third sensor 1240C, and may use the received first to third output signals to control the movement (or displacement) of the OIS moving unit in the X-axis direction or the Y-axis direction. In addition, the controller 1830 may use the received first to third output voltages to control the rotation, tilt, or roll of the OIS moving unit with respect to the optical axis.

[0560] In addition, the controller 1830 may include an analog-to-digital converter 1530 configured to receive output voltages output from two output terminals of each of the first to third sensors 1240A to 1240C and output a data value, a digital value, or a code value corresponding to the analog-to-digital conversion result of the received output voltage. The controller 1830 may control the movement (or displacement) of the OIS moving unit in the X-axis direction or the Y-axis direction and the rotation, tilt, or roll of the OIS moving unit with respect to the optical axis.

[0561] The temperature sensor 1540 may measure the ambient temperature (e.g., the temperature of the first to third sensors 1240A, 1240B, and 1240C) and may output a temperature detection signal Ts corresponding to the measurement result. For example, the temperature sensor 1540 may be a thermistor.

[0562] The resistance value of the resistor included in the temperature sensor 1540 may vary according to the ambient temperature, and thus the value of the temperature detection signal Ts may vary according to the surrounding temperature. A mathematical formula or a look-up table related to the ambient temperature and the temperature detection signal Ts established through calibration may be stored in the memory or the controllers 1830 and 1780.

[0563] Since the output values of the first to third sensors 1240A, 1240B, and 1240C are also affected by temperature, in order to perform the OIS feedback operation accurately and reliably, it is necessary to compensate the output values of the first to third sensors 1240A, 2400B, and 1240C according to the ambient temperature.

[0564] To this end, for example, the controllers 1830 and 780 can use the ambient temperature measurement value of the temperature sensor 1540 and a temperature compensation algorithm or compensation formula to compensate the output values (or data values corresponding to the outputs) of the first to third sensors 1240A, 1240B, and 1240C. The temperature compensation algorithm or compensation formula may be stored in the controllers 1830 and 780 or the memory.

[0565] The camera device may further include a fourth sensor 1240D that corresponds to or faces the fourth magnet unit 1130-4 in the optical axis direction. The fourth sensor 1240D may be disposed on the first plate unit 1255 (e.g., the first circuit board 1250). For example, the fourth sensor 1240D may be disposed near a corner of the first circuit board 1250 where the first to third sensors 1240A to 1240C are not disposed. The description of the configuration relationship between the first sensor 1240A and the first coil unit 1230-1 may be applied to the configuration between the fourth sensor 1240D and the fourth coil unit 1230-4 with or without modification.

[0566] For example, the fourth sensor 1240D can be positioned to face the second sensor 1240B in a diagonal direction. For example, the output voltage of the fourth sensor 1240D can also be used to detect the movement of the OIS moving unit in the X-axis direction or the Y-axis direction.

[0567] In another embodiment, the fourth sensor 1240D can correspond to the first position sensor 1170 of the AF operation unit 1100.

[0568] The controller 1830 can be electrically connected to at least one of the first position sensor 1170, the second coil 1230, or the second position sensor 1240 via the second board unit 1800, the support board 1310, and the first board unit 1255.

[0569] In another embodiment, the controller 1830 can be disposed on the first board unit 1255. In another embodiment, for example, the controller 1830 can be disposed on the first circuit board 1250.

[0570] Figure 22 is a perspective view of the first circuit board 1250, the support board 1310, the second circuit board 1260, and the heat dissipation member 1280. Figure 23 is Figure 4b a partial enlarged view of Figure 24 is a partial cross-sectional view of the connecting member 1320 between the first circuit board 1250 and the support board 1310. Figure 25 is a cross-sectional view of the first circuit board 1250, the second circuit board 1260, and the solder 1901.

[0571] Referring to Figures 22 to 25 , a receiving placement groove 1129 can be formed in the lower surface 1128 of the first circuit board 1250, and the second circuit board 1260 is disposed or received in the placement groove 1129.

[0572] For example, the placement groove 1129 can be a groove recessed from the lower surface 1128 of the first circuit board 1250. For example, the shape of the placement groove 1129 can correspond to or be consistent with the shape of the outer peripheral surface of the second circuit board 1260. For example, the placement groove 1129 can have a polygonal shape, such as a quadrilateral shape.

[0573] The placement groove 1129 may include a bottom surface 1129A that defines a height difference relative to the lower surface 1128 of the first circuit board 1250. For example, the position of the bottom surface 1129A may be higher than the lower surface 1128 of the first circuit board 1250. For example, the upper surface of the first circuit board 1250 may be closer to the bottom surface 1129A than the lower surface 1128 of the first circuit board 1250. For example, the placement groove 1129 may include a side surface 129B that is disposed between the lower surface 1128 of the first circuit board 1250 and the bottom surface 1129A to connect the lower surface 1128 of the circuit board 1250 to the bottom surface 1129A.

[0574] For example, the terminals 1251 of the first circuit board 1250 may be disposed in the placement groove 1129 in the first circuit board 1250. For example, the terminals 1251 of the first circuit board 1250 may be disposed on the bottom surface 129B of the placement groove 1129 in the first circuit board 1250.

[0575] Referring to Figure 24 , the bottom surface 1129A of the placement groove 1129 in the first circuit board 1250 may be the first insulating layer 1092-1. For example, the bottom surface 1129A may be the covering layer 1009a2.

[0576] For example, at least a portion of the terminals 1251 of the first circuit board 1250 may be opened or exposed from the bottom surface 1129A of the placement groove 1129. For example, at least a portion of the terminals 1251 may be opened or exposed from the covering layer 1009a2 that serves as the bottom surface 1129A. For example, the covering layer 1009a2 may be a transparent ink-type material. The covering layer 1009a2 can be used for flexible boards.

[0577] The terminals 1251 of the first circuit board 1250 may be positioned higher than the lower surface 1128 of the first circuit board 1250. For example, the upper surface of the first circuit board 1250 may be closer to the terminals 1251 than the lower surface 1128 of the first circuit board 1250.

[0578] For example, the second circuit board 1260 may be coupled to the placement groove 1129 in the first circuit board 1250 using an adhesive. For example, the upper surface of the second circuit board 1260 may be coupled or attached to the bottom surface 1129A of the placement groove 1129 in the first circuit board 1250 using an adhesive.

[0579] At least a portion of the terminals 1261 of the second circuit board 1260 may be disposed in the placement groove 1129 in the first circuit board 1250.

[0580] The placement grooves 1129 in the second circuit board 1260 and the first circuit board 1250 may overlap each other in the optical axis direction. Since at least a part of the second circuit board 1260 is disposed in the placement groove 1129 in the first circuit board 1250, at least another part of the second circuit board 1260 may overlap the first circuit board 1250 in a direction perpendicular to the optical axis. The length or thickness of the first board unit 1255 in the optical axis direction may be reduced due to the thickness of the overlap between the first circuit board 1250 and the second circuit board 1260. Therefore, according to the present embodiment, the length of the first board unit 1255 in the optical axis direction and the size of the camera module in the optical axis direction can be reduced.

[0581] Referring to Figure 24 , the first circuit board 1250 may include a plurality of conductive layers 1091-1 to 1091-m (m is a natural number greater than 1). Although Figure 24 shows four conductive layers 1091-1 to 1091-4 sequentially stacked in the optical axis direction, the present disclosure is not limited thereto. In another embodiment, the number of conductive layers of the first circuit board 1250 may be two or more. Each conductive layer may include a copper foil, a wire, a terminal, or a conductive pattern layer for transmitting an electrical signal, or may include a ground layer. For example, each of the conductive layers 1091-1 to 1091-4 may be made of a conductive metal such as copper, aluminum, gold, silver, or an alloy including at least one of them. For example, each of the conductive layers 1091-1 to 1091-4 may be formed to include at least one of a pattern layer, a line, or a terminal (or pad).

[0582] For example, the first circuit board 1250 may include insulating layers 1092-1 to 1092-3 disposed between the plurality of conductive layers 1091-1 to 1091-4. The insulating layers 1092-1 to 1092-3 for electrically insulating the conductive layers 1091-1 to 1091-4 from each other may prevent an electrical short circuit between the conductive layers 1091-2 to 1091-4.

[0583] Although Figure 24 shows three insulating layers disposed between the conductive layers, the present disclosure is not limited thereto. The number of insulating layers may be determined according to the number of conductive layers and may be one or more. The insulating layer may also be referred to as an "insulating foil" or an "insulating film".

[0584] The first circuit board 250 may include at least one of a rigid insulating layer made of a rigid material or a flexible insulating layer made of a flexible material. Here, the flexible insulating layer may have a bendable property, and the rigid insulating layer may have a higher strength or hardness than the flexible insulating layer.

[0585] For example, the flexible insulating layer may include a flexible resin such as polyimide. For example, the rigid insulating layer may include a rigid resin such as prepreg. For example, the rigid insulating layer may include at least one of prepreg and a cover layer. For example, the cover layer may include a resin. Further, for example, the cover layer may include a resin and an adhesive. For example, the resin may be polyimide. For example, the cover layer may form a film or a sheet.

[0586] For example, at least one of the plurality of insulating layers 1092-1 to 1092-3 of the first circuit board 1250 may be a rigid insulating layer, and at least one of the plurality of insulating layers 1092-1 to 1092-3 may be a flexible insulating layer.

[0587] For example, the first circuit board 1250 may include a first insulating layer 1092-1 disposed between the first conductive layer 1091-1 and the second conductive layer 1091-2, a second insulating layer 1092-2 disposed between the second conductive layer 1091-2 and the third conductive layer 1091-3, and a third insulating layer 1092-3 disposed between the third conductive layer 1091-3 and the fourth conductive layer 1091-4.

[0588] For example, each of the first insulating layer 1092-1 and the third insulating layer 1092-3 may be a rigid insulating layer. For example, each of the first insulating layer 1092-1 and the third insulating layer 1092-3 may include prepreg 9a1. Alternatively, for example, each of the first insulating layer 1092-1 and the third insulating layer 1092-3 may include prepreg 9a1 and a cover layer 1009a2.

[0589] The second insulating layer 1092-2 may be a flexible insulating layer. For example, the second insulating layer 1092-2 may include polyimide.

[0590] The first circuit board 1250 may include a cover layer 1098 disposed on the outermost conductive layers (e.g., 1091-1 and 1091-4) to protect the conductive layers 1091-1 to 1091-4 from external impacts and the like. For example, the cover layer 1098 may include a first cover layer 1098a disposed below the first conductive layer 1091-1 which is the lowermost conductive layer and a second cover layer 1098b disposed on the fourth conductive layer 1091-4 which is the uppermost conductive layer.

[0591] The cover layer 1098 may be formed of an insulating material such as a solder resist layer (SR). For example, the cover layer 1098 may be a photo solder resist (PSR) or a dry film type solder resist (DFSR). For example, the cover layer 1098 may be made of an opaque ink type material or a translucent film type material. The cover layer 1098 can be used to protect the internal conductive layers of the first circuit board 1250.

[0592] For example, the conductive layer 1091-2 of the first circuit board 1250 may include a portion or region that is open or exposed from the first insulating layer 1092-1. Here, the portion that is open or exposed from the first insulating layer 1092-1 may be formed as the terminal 1251. For example, the conductive layer 1091-2 may include the terminal 1251.

[0593] The terminal 1251 may be located at a position higher than the lowermost conductive layer (e.g., 1091-1) of the first circuit board 1250. For example, the terminal 1251 may be positioned higher than the lowermost conductive layer (e.g., 1091-1) of the first circuit board 1250. For example, the terminal 1251 may not be formed at the lowermost conductive layer (e.g., 1091-1) of the first circuit board 1250.

[0594] For example, the terminal 1251 may be formed at another conductive layer (such as 1091-2) provided on the lowermost conductive layer (e.g., 1091-1) of the first circuit board 1250.

[0595] For example, the terminal 1251 may be formed on a conductive layer (such as 1091-2) directly on the lowermost conductive layer (e.g., 91-1) of the first circuit board 1250. For example, the terminal 1251 may be formed at the second lowermost conductive layer (e.g., 91-21091-2) of the first circuit board 1250.

[0596] In another embodiment, the terminal 1251 may be formed at the third lowermost conductive layer (e.g., 1091-3) of the first circuit board 1250.

[0597] In another embodiment, the terminal 1251 may be formed at a conductive layer between the lowermost conductive layer (e.g., 109-1) and the uppermost conductive layer (example, 1091-4) of the first circuit board 1250. In another embodiment, the terminal 1251 may be formed at the uppermost conductive layer (e.g., 1091-4) of the first circuit board 1250.

[0598] The side surface between the upper surface and the lower surface of the first circuit board 1250 may be insulated by an insulating layer (such as a cover layer). For example, the insulating layer (e.g., the cover layer) may be provided or formed on the outermost surfaces of the outermost layers among the conductive layers 1091-1 to 1091-4 and the insulating layers 1092-1 to 1092-3 of the first circuit board 1250.

[0599] For example, the lowermost layer of the first circuit board 1250 may be a first insulating layer. For example, the first cover layer 1098a and the first conductive layer 1091-1 may be provided on the first insulating layer (e.g., the first cover layer 1098a).

[0600] Refer to Figure 25, the second circuit board 1260 may include a rigid board. For example, the second circuit board 1260 may include a plurality of conductive layers 1081-1 to 1081-m (m is a natural number greater than 1). For example, the second circuit board 1260 may include four conductive layers 1081-1 to 1081-4 stacked in sequence in the optical axis direction. In another embodiment, the number of conductive layers included in the second circuit board 1260 may be two or more. Each conductive layer of the second circuit board 1260 may include a copper foil, a wire, a conductive pattern layer, or a ground layer for transmitting an electrical signal.

[0601] For example, the conductive layers 1081-1 to 1081-4 may be made of a conductive metal, such as copper, aluminum, gold, silver, or an alloy including at least one of them. For example, the conductive layers 1081-1 to 1081-4 may include at least one of a pattern layer, a wire, or a terminal (or pad).

[0602] In addition, the second circuit board 1260 may include a plurality of insulating layers 1092-1 to 1082-3.

[0603] For example, the second circuit board 1260 may include insulating layers 1082-1 to 1082-3 disposed between the plurality of conductive layers 1081-1 to 1081-4. The insulating layers 1082-1 to 1082-3 for electrically insulating the conductive layers 1081-1 to 1081-4 from each other may prevent an electrical short circuit between the conductive layers 1081-1 to 1081-4.

[0604] For example, although the second circuit board 1260 is shown as including three insulating layers disposed between the conductive layers 1081-1 to 1081-4, the number of insulating layers of the second circuit board 1260 may be determined according to the number of conductive layers and may be one or more in another embodiment. The insulating layer may also be referred to as an "insulating foil" or an "insulating film".

[0605] For example, the second circuit board 1260 may include at least one of a rigid insulating layer made of a rigid material or a flexible insulating layer made of a flexible material. The description of the rigid insulating layer and the flexible insulating layer of the first circuit board 1250 may be applied to the second circuit board 1260 with or without modification.

[0606] For example, at least one of the plurality of insulating layers 1082-1 to 1082-3 of the second circuit board 1260 may be a rigid insulating layer, and at least one of the plurality of insulating layers 1082-1 to 1082-3 may be a flexible insulating layer.

[0607] For example, the second circuit board 1260 may include a first insulating layer 1082-1 disposed between a first conductive layer 1081-1 and a second conductive layer 1081-2, a second insulating layer 1082-2 disposed between the second conductive layer 1081-2 and a third conductive layer 1081-3, and a third insulating layer 1082-3 disposed between the third conductive layer 1081-3 and a fourth conductive layer 1081-4.

[0608] For example, each of the first insulating layer 1082-1 and the third insulating layer 1082-3 may be a rigid insulating layer. For example, each of the first insulating layer 1082-1 and the third insulating layer 1082-3 may include a prepreg 83a. Alternatively, for example, each of the first insulating layer 1082-1 and the third insulating layer 1082-3 may include a prepreg 83a and a cover layer 83b. The second insulating layer 1082-2 may be a flexible insulating layer. For example, the second insulating layer 1082-2 may include polyimide.

[0609] The second circuit board 1260 may include an insulating layer 1097 disposed on the outermost conductive layers (e.g., 1081-1 and 1081-4) to protect the conductive layers 1081-1 to 1081-4 from external impacts and the like. Here, the insulating layer 1087 may be referred to as a "cover layer", and the following reference numeral "1097" represents the cover layer.

[0610] For example, the cover layer 1087 may include a first cover layer 1097a disposed below the first conductive layer 1081-1 which is the lowermost conductive layer and a second cover layer 1097b disposed on the fourth conductive layer 1081-4 which is the uppermost conductive layer.

[0611] The cover layer 1087 may be formed of an insulating material, such as a solder resist SR. For example, the cover layer 1087 may be a photo solder resist (PSR) or a dry film solder resist (DFSR).

[0612] The side surface between the upper surface and the lower surface of the second circuit board 1260 may be insulated by an insulating layer (e.g., the cover layer). For example, the insulating layer (e.g., the cover layer) may be provided or formed on the outermost surfaces of the conductive layers 1081-1 to 1081-4 and the insulating layers 1082-1 to 1082-3.

[0613] For example, the lowermost layer of the second circuit board 1260 may be a first insulating layer, such as the first cover layer 1097a, and the conductive layer 1081-1 may be disposed on the first insulating layer (e.g., the first cover layer 1097a).

[0614] Refer to Figure 13 and Figure 25, at least a portion of the terminal 1261 of the second circuit board 1260 can be disposed in the placement groove 1129 in the first circuit board 1250. At least a portion of the solder 1901 can be disposed in the placement groove 1129 in the first circuit board 1250. For example, the solder 1901 can include a first portion disposed in the placement groove 1129 in the first circuit board 1250 and a second portion protruding outward from the placement groove 1129.

[0615] The terminal 1261 of the second circuit board 1260 can be disposed on at least one of the upper surface, side surface, or lower surface of the second circuit board 1260. For example, the terminal 1261 can be disposed or formed on at least one of the uppermost conductive layer, lowermost conductive layer, or side surface of the conductive layer of the second circuit board 1260.

[0616] The terminal 1261 of the second circuit board 1260 can be electrically connected to at least one of the plurality of conductive layers 1081-1 to 1081-4 of the second circuit board 1260. For example, the terminal 1261 can include a first pad 1261A (or “first portion”) formed at the side surface of the second circuit board 1260 to connect to at least one of the plurality of conductive layers 1081-1 to 1081-4.

[0617] For example, the first pad 1261A of the terminal 1261 can extend in the direction parallel to the optical axis. For example, the first pad 1261A can include a portion (e.g., a groove) recessed from the side surface of the second circuit board 1260. For example, the first pad 1261A can have a curved shape recessed from the side surface of the second circuit board 1260. Or, for example, the first pad 1261A can be a conductive layer, plating layer, or metal layer formed on the side surface of the second circuit board 1260 in the form of a semi-circular through hole or a semi-elliptical through hole. The reason for doing this is to increase the contact area with the solder to improve the solderability and reliability of the electrical connection.

[0618] For example, the first pad 1261A can be connected to at least one of the first to fourth conductive layers 1081-1 to 1081-4. For example, the first pad 1261A can be positioned lower than the height of the first cover layer 1097a but higher than the second cover layer 1097b.

[0619] For example, the first pad 1261A can be connected or coupled to one end of at least one of the first to fourth conductive layers 1081-2 to 1081-4. For example, the first pad 1261A can be a plating layer. The first pad 1261A can be the same material as the conductive layers 1081-1 to 1081-4. For example, the first pad 1261A can include a gold plating layer or a copper plating layer including gold.

[0620] For example, the first pad 1261A can be disposed at a position corresponding to the terminal of the first circuit board 1250 along a direction parallel to the optical axis. For example, at least a part of the first pad 1261A can overlap at least a part of the terminal 1251 of the first circuit board 1250 in a direction parallel to the optical axis.

[0621] For example, the first pad 1261A can overlap two or more conductive layers (such as 1081-1 to 1081-4) of the second circuit board 1260 in a direction perpendicular to the optical axis. For example, the first pad 1261A can include a portion that overlaps the terminal 1251 of the first circuit board 1250 in the optical axis direction. For example, the first pad 1261A can include a portion that does not overlap the terminal 1251 of the first circuit board 1250 in the optical axis direction.

[0622] For example, the terminal 1261 of the second circuit board 1260 can include a second pad 1261B (or "second part") connected to the first pad 1261A. For example, the second pad 1261B can be connected to the lower part or the lower end of the first pad 1261A.

[0623] For example, the second pad 1261B can be perpendicular to the optical axis direction. For example, the upper surface (or the lower surface) of the second pad 1261B can be perpendicular to the optical axis direction. For example, the second pad 1261B can include a portion that does not overlap the terminal 1251 of the first circuit board 1250. In addition, for example, the second pad 1261B can include a portion that overlaps the terminal 1251 of the first circuit board 1250 in the optical axis direction.

[0624] For example, the solder 1901 or the conductive adhesive can be coupled, attached, or fixed to the terminal 1251 of the first circuit board 1250 and the terminal 1261 of the second circuit board 1260.

[0625] For example, since the terminal 1251 is not formed at the lowermost conductive layer 1091-1 of the first circuit board 1250, the solder 1901 can be not disposed on the lowermost conductive layer 1091-1 of the first circuit board 1250. For example, the solder 1901 can be spaced apart from the lowermost conductive layer 1091-1 of the first circuit board 1250.

[0626] For example, the solder 1901 can be disposed on the first pad 1261A of the terminal 1261 of the second circuit board 1260. For example, the solder 1901 can be coupled or fixed to the outer surface of the first pad 1261A of the terminal 1261 of the second circuit board 1260.

[0627] For example, the solder 1901 may contact or be coupled to a portion of the first pad 1261A that does not overlap with the terminal 1251 of the first circuit board 1250 in the optical axis direction. Alternatively, the solder 1901 may be disposed on another portion of the first pad 1261A that overlaps with the terminal 1251 of the first circuit board 1250 along the optical axis direction.

[0628] The solder 1901 may be coupled or fixed to the terminal 1251 of the first circuit board 1250. For example, the solder 1901 may be coupled or fixed to a region of the second conductive layer 1091-2, such as the terminal 1251 that is opened or exposed from the second insulating layer 1092-1 of the first circuit board 1250. For example, the solder 1901 may be coupled or fixed to a region of the second conductive layer 1091-2, such as the terminal 1251 that is opened or exposed from the covering layer 1009a2 of the second insulating layer 1092-1.

[0629] For example, the coupling surface or attachment surface between the terminal 1251 and the solder 1901 may be positioned higher than the lowermost conductive layer (such as 1091-1) of the first circuit board 1260. For example, the coupling surface or attachment surface between the terminal 1251 and the solder 1901 may be positioned higher than the lowermost conductive layer (such as 1091-1) of the first circuit board 1260. For example, the coupling surface between the terminal 1251 and the solder 1901 may be formed on another conductive layer (such as 91-2) provided on the lowermost conductive layer (such as 1091-1). For example, the coupling surface between the terminal 1251 and the solder 1901 may be formed at a conductive layer (such as 1091-2) corresponding to a layer on the lowermost conductive layer (such as 1091-1) of the first circuit board 1250. In another embodiment, the coupling surface between the terminal 1251 and the solder 910 may be formed at a conductive layer located between the lowermost conductive layer 92-1 1092-1 and the uppermost conductive layer 92-4 of the first circuit board 1250.

[0630] Referring to Figure 25 , for example, at least a portion of the solder 1901 may be disposed between the second lowermost conductive layer 1091-2 of the first circuit board 1250 and the lowermost conductive layer 1081-1 of the second circuit board 1260.

[0631] In addition, for example, at least a portion of the solder 1901 may be disposed between the second lowermost conductive layer 1091-2 of the first circuit board 1250 and the covering layer 1098a of the first circuit board 1250.

[0632] In addition, for example, at least another portion of the solder 1901 may be located below the covering layer 1098a of the first circuit board 1250.

[0633] Figure 30Shows the cracks generated in the solder according to the comparative example. The comparative example corresponds to the case where the terminal 1251 of the first circuit board 1250 is formed at the lowermost conductive layer 1091-1 of the first circuit board 1250.

[0634] Referring to Figure 30 , in the comparative example, when an impact is applied to the solder, the solder connected to the terminal cannot withstand the impact, so cracks may occur in the solder. The cracks may reduce the reliability of the electrical connection between the terminal of the first circuit board 1250 and the terminal of the second circuit board 1260.

[0635] In the comparative example, since the length of the solder protruding beyond the lower surface of the first circuit board 1250 is long, the distance between the solder and the heat dissipation member 1380 of the first board unit 1255 can be less than a predetermined distance. Here, the predetermined distance (or gap) can be the distance defined between the OIS moving unit and the fixed unit to allow simple and normal OIS operation. For example, the predetermined distance for OIS operation can be the distance (e.g., 210 μm) between the lowermost end of the moving unit (e.g., the heat dissipation member 1280) and the first board unit 1255 (e.g., the heat dissipation member 1380) as the fixed unit.

[0636] For example, in the comparative example, the lowermost end of the solder can be positioned lower than the lowermost end of the OIS moving unit (e.g., the heat dissipation member 1280), and the solder may collide with the heat dissipation member 1380 of the first board unit 1255 due to the impact, so cracks may occur in the solder.

[0637] In this embodiment, since the connection surface between the solder 1901 and the terminal 1251 of the first circuit board 1250 is positioned higher than the lowermost conductive layer (e.g., 1091-1) of the first circuit board 1250, the length H1 of the solder 1901 protruding from the lower surface of the first circuit board 25 can be reduced, and the distance H2 between the solder and the heat dissipation member 1380 of the first board unit 1255 can be greater than the distance in the comparative example. In this embodiment, the lowermost end of the solder can be positioned higher than the lowermost end of the OIS moving unit (e.g., the heat dissipation member 1280), and the collision between the solder and the heat dissipation member 1380 of the first board unit 1255 can be prevented, thereby preventing cracks from being generated in the solder due to the impact.

[0638] For example, the lowermost surface (or the lowermost end) of the solder 1901 can be set higher than the lowermost surface of the second circuit board 1260. In another embodiment, the lowermost surface (or the lowermost end) of the solder 1901 can be positioned at the same height as the lowermost surface of the second circuit board 1260.

[0639] In another embodiment, the lowermost surface (or the lowermost end) of the solder 1901 may be set to be lower than the lowermost surface of the second circuit board 1260. For example, the lowermost surface (or the lowermost end) of the solder 1901 may be set to be lower than the covering layer 1097a of the second circuit board 1260. For example, the lowermost surface (or the lowermost end) of the solder 1901 may be located at a height equal to or higher than the lower surface of the heat dissipation member 1280. For example, the protruding length of the lowermost surface (or the lowermost end) of the solder 1901 relative to the lowermost surface of the second circuit board 1260 may be equal to or less than the sum of the thickness of the heat dissipation member 1280 and the thickness of the adhesive. Here, the adhesive may be disposed between the heat dissipation member 1280 and the second circuit board 1260 so as to couple, attach, or fix the heat dissipation member 1280 to the second circuit board 1260.

[0640] The protruding length of the lowermost surface (or the lowermost end) of the solder 1901 relative to the lowermost surface of the second circuit board 1260 may be greater than 0, but equal to or less than 140 μm. The reason is that when the protruding length of the lowermost surface (or the lowermost end) of the solder 1901 relative to the lowermost surface of the second circuit board 1260 exceeds 140 μm, cracks may occur in the solder 1901 due to the impact caused by the collision between the solder 1901 and the heat dissipation member 1380.

[0641] Referring to Figure 23 , for example, the lowermost surface (or the lowermost end) of the solder 1901 may be positioned higher than the lower surface of the heat dissipation member 1280. For example, the lowermost surface (or the lowermost end) of the solder 1901 may be positioned higher than the lower surface of the heat dissipation member 1280.

[0642] For example, by positioning the terminal 1251 of the first circuit board 1250 higher than the first conductive layer 1091-1, the terminal 125l in this embodiment may be set to be higher than the comparative example by a predetermined height. For example, the predetermined height may be approximately 92 μm. Therefore, the distance between the solder and the heat dissipation member 1380 of the fixing unit can be further ensured to reach a predetermined height (for example, about 92 μm). For example, the predetermined height may be Figure 22 the depth or the height difference of the placement groove 1129 shown. Therefore, according to this embodiment, the size of the camera module in the optical axis direction can be reduced within the range where the solder 1901 does not extend downward beyond the lowermost end of the OIS moving unit.

[0643] Compared with the comparative example, in this embodiment, the position of the image sensor 1810 can be raised upward toward the lens module 1400. By raising the position of the lens module 1400 upward, the distance between the lens module 1400 and the image sensor 1810 can be adjusted according to the conventional design specifications.

[0644] In the comparative example, the thickness (or the length in the optical axis direction) of the heat dissipation member 1380 may be about 140 μm. For example, the thickness of the heat dissipation member 1380 may include the thickness of an adhesive configured to couple or attach the heat dissipation member 1380 to the second plate unit 1800.

[0645] From the perspective of heat dissipation, it is advantageous to increase the thickness of the heat dissipation member 1380. In this embodiment, since the height difference or depth of the placement groove 1129 increases the height of the second circuit board 1260 and the heat dissipation member 1280, the predetermined distance (or gap) between the OIS moving unit and the fixing unit can be increased. Accordingly, according to this embodiment, the thickness of the heat dissipation member 1380 can be increased while maintaining the predetermined distance, thereby improving the heat dissipation efficiency of the heat generated by the heat dissipation source (e.g., the image sensor 1810) of the OIS moving unit. For example, the thickness of the heat dissipation member 1380 may be 180 μm to 230 μm. For example, the thickness of the heat dissipation member 1380 may be 200 μm to 220 μm. When the thickness of the heat dissipation member 1380 is less than 180 μm, the improvement in heat dissipation may be relatively low compared to the comparative example. Meanwhile, when the thickness of the heat dissipation member 1380 exceeds 230 μm, the thickness may exceed the predetermined distance (or gap) between the OIS moving unit and the fixing unit, resulting in a collision between the OIS moving unit and the fixing unit, and cracks may occur in the solder 1901 due to the collision or impact.

[0646] For example, the heat dissipation member 1380 of the fixing unit has a first region and a second region. The first region overlaps with the heat dissipation member 1280 (or the second circuit board 1260) of the OIS moving unit in the optical axis direction, and the second region does not overlap with the heat dissipation member 1280 (or the second circuit board 1260) of the OIS moving unit in the optical axis position. For example, the first region of the heat dissipation member 1380 may protrude upward based on the second region. For example, the heat dissipation member 1380 may have a general hat shape. The shape of the first region of the heat dissipation member 1380 may be a polygon (e.g., a quadrilateral), a circle, an ellipse, etc.

[0647] For example, the thickness of the first region of the heat dissipation member 1380 may be greater than the thickness of the second region. For example, the thickness of the second region of the heat dissipation member 1380 according to this embodiment may be equal to the thickness of the heat dissipation member 1380 according to the comparative example (e.g., 140 μm), and the thickness of the first region of the heat dissipation member according to this embodiment may be 180 μm to 230 μm as described above.

[0648] Figure 26 is a cross-sectional view of the second circuit board 1260-1, the first circuit board 1250, and the solder 1901A according to another embodiment. And Figure 25Like reference numerals designate like components throughout, and descriptions of like components are omitted.

[0649] Referring to Figure 26 , the terminal 1261-1 of the second circuit board 1260-1 can be positioned higher than the lowermost conductive layer (e.g., 1081-1) among the plurality of conductive layers 1081-1 to 1081-4 in the second circuit board 1260-1. For example, the terminal 1261-1 can be located above the lowermost conductive layer (e.g., 1081-1). For example, the lowermost conductive layer (e.g., 1081-1) can be positioned lower than the lowermost conductive layer 1091-1 of the first circuit board 1250.

[0650] For example, the terminal 1261-1 can be electrically connected to at least one of the plurality of conductive layers 1081-1 to 1081-4 of the second circuit board 1260.

[0651] The terminal 1261-1 can include a first pad 1262A. The first pad 1262A can include a portion that does not overlap with the terminal 1251 of the first circuit board 1250 in the optical axis direction. In addition, for example, the first pad 1262A can include a portion that overlaps with the terminal 1251 of the first circuit board 1250 in the optical axis direction.

[0652] The first pad 1262A can be positioned higher than the lowermost conductive layer (e.g., 1081-1) of the second circuit board 1260. For example, the first pad 1262A can be formed at another conductive layer (such as 1081-2) provided on the lowermost conductive layer (e.g., 1081-1). For example, the first pad 1262A can be formed at a conductive layer (e.g., 1081-2) corresponding to the layer immediately above the lowermost conductive layer (e.g., 1081-1). For example, the first pad 1262A can be formed at the second lowermost conductive layer (e.g., 1081-2).

[0653] For example, the first pad 1262A can extend parallel to the optical axis direction. Figure 25 The description of the shape of the first pad 1261A shown in can be applied to the shape of the first pad 1262A with or without modification. For example, the first pad 1262A can be positioned lower than the second cover layer 1097b.

[0654] The first pad 1262A can be connected or coupled to one end of at least one of the second to fourth conductive layers 1081-2 to 1081-4. The first pad 1262A can be electrically connected to one end of at least one of the second to fourth conductive layers 1081-2 to 1081-4.

[0655] The terminal 1261-1 can include a second pad 1262B connected to the first pad 1262A.

[0656] For example, the second pad 1262B may be positioned above the bottommost conductive layer (e.g., 1081-1) of the second circuit board 1260. For example, the second pad 1262B may be formed at another conductive layer (such as 1081-2) disposed on the bottommost conductive layer (e.g., 1081-1). For example, the second pad 1262B may be formed at the conductive layer (e.g., 1081-2) corresponding to the layer immediately above the bottommost conductive layer (e.g., 1081-1). For example, the second pad 1262B may be a part of the conductive layer (e.g., 1081-2) disposed on the bottommost conductive layer (e.g., 1081-1). For example, the second pad 1261B may extend parallel to the lower surface of the second circuit board 1260.

[0657] For example, the lower surface of the first pad 1262B may be positioned above the upper surface of the bottommost conductive layer 1081-1. For example, the second pad 1262B may be positioned above the upper surface of the bottommost conductive layer 1081-1. For example, the first pad 1262A and the second pad 1262B may be positioned above the upper surface of the first insulating layer 1082-1.

[0658] For example, the second cover layer 1097b may be disposed between the first pad 1262A and the first circuit board 1250. For example, a part of the second cover layer 1097b may be disposed between the first pad 1262A and the area of the terminal 1251 of the first circuit board 1250. For example, a part of the second cover layer 1097b may contact the first pad 1262A and the area of the terminal 1251 of the first circuit board 1250.

[0659] The solder 1901A may be disposed on at least one of the first pad 1262A and the second pad 1262B of the terminal 1261-1 of the second circuit board 1260, and may contact, touch, or be coupled to at least one of the first pad 1262A and the second solder pad 1261B.

[0660] For example, the solder 1901A may contact, join, or be coupled to the terminal 1251 of the first circuit board 1250 and the first pad 1262A of the terminal 1261-1 of the second circuit board 1260. In addition, the solder 1901A may contact, join, or be coupled to the second pad 1262B of the terminal 1261-1 of the second circuit board 1260.

[0661] For example, the distance between the upper surface of the second circuit board 1260 and the second pad 1262B in the optical axis direction may be greater than the distance between the lower surface of the second circuit board 1260 and the second pad 1262B in the optical axis direction.

[0662] For example, the distance between the upper surface of the second circuit board 1260 and the lower surface of the second pad 1262B in the optical axis direction can be greater than the distance between the lower surface of the second circuit board 1260 and the lower surface of the second pad 1262B in the optical axis direction.

[0663] Referring to Figure 26 , for example, at least a portion of the solder 1901A can be disposed between the cover layer 1098a of the first circuit board 1250 and the second lowermost conductive layer 1081-2 of the second circuit board 1260. For example, at least another portion of the solder 1901A can be located below the second lowermost conductive layer 1081-2 of the second circuit board 1260.

[0664] In another embodiment, the terminal 1261-1 of the second circuit board 1260-1 can be in direct contact with the terminal 1251 of the first circuit board 1250. For example, one end of the terminal 1261-1 of the second circuit board 1260-1 can be in direct contact with a portion of the uppermost insulating layer (e.g., the second cover layer 1097b) and the terminal 1251 of the first circuit board 1250. For example, the first pad 1262A of the terminal 1261-1 of the second circuit board 1260-1 can extend to the terminal 1251 of the first circuit board 1250 and then can contact the lower surface of the terminal 1251 of the first circuit board 1250.

[0665] In Figure 26 the embodiment shown, since the solder 1901A can contact or be coupled to the second pad 1262B of the terminal 1261-1, the contact area between the solder 1901A and the terminal 1261-1 can be increased, thereby improving the solderability between the terminal 1251 of the first circuit board 1250 and the terminal 1261-1 of the second circuit board 1260.

[0666] Figure 27 is a cross-sectional view of a second circuit board 1260-2, a first circuit board 1250, and solder 1901B according to another embodiment. Components having the same reference numerals as in Figure 26 are the same components, and the description of the same components is omitted.

[0667] Referring to Figure 27 , the terminal 1261-2 of the second circuit board 1260-2 can include a first pad 1262A, a second pad 1262B, and a third pad 1262C.

[0668] For example, the third pad 1262C may be formed at the uppermost conductive layer (e.g., 1081-4). For example, the third pad 1262C may be formed at the conductive layer (e.g., 1081-4) closest to the terminal 1251 of the first circuit board 1250 among the plurality of conductive layers 1081-1 to 1081-4 of the second circuit board 1260. Alternatively, for example, the third pad 1262C may be a part of the uppermost conductive layer (e.g., 1081-4). For example, the third pad 1262C may extend parallel to the upper surface (or lower surface) of the second circuit board 1260-2.

[0669] For example, the third pad 1262C may be open or exposed from a covering layer (e.g., 1097b). For example, the third pad 1262C may be connected to the upper part of the first pad 1262A and may be parallel to the second pad 1262B.

[0670] In a direction parallel to the optical axis direction, a height difference may be formed between the upper surface of the third pad 1262C and the upper surface of the second circuit board 1260-2. For example, the upper surface of the third pad 1262C may be positioned lower than the upper surface of the second circuit board 1260. For example, the upper surface of the second circuit board 1260-2 may include the upper surface of the second covering layer 1097b. Alternatively, for example, the upper surface of the second circuit board 1260-2 may be the upper surface of the second covering layer 1083B.

[0671] For example, when the second circuit board 1260-2 is viewed from above, the third pad 1262C may have the same or similar curve as the through-hole of the first pad 1262A. Although the curvature of the through-hole curve of the second pad 1262B may be the same as the curvature of the curve of the first pad 1262A, in another embodiment, the latter may be greater than the former. In another embodiment, the latter may be less than the former.

[0672] At least a part of the third pad 1262C may overlap with the terminal 1251 of the first circuit board 1250 in a direction parallel to the optical axis. For example, the third pad 1262C, the solder 1901B, and the terminal 1251 of the first circuit board 1250 may overlap with each other in a direction parallel to the optical axis. In addition, the third pad 1262C may include a part that does not overlap with the terminal 1251 of the first circuit board 1250 in a direction parallel to the optical axis. For example, the solder 1901B may be disposed in a part that does not overlap with the terminal 1251 of the first circuit board 1250 in a direction parallel to the optical axis. For example, the solder 1901B may be in contact with or coupled to a part of the first circuit board 1250 that does not overlap with the terminal 1251 in a direction parallel to the optical axis.

[0673] For example, the solder 1901B can be disposed between the third pad 1262C and the first circuit board 1250. For example, at least a portion of the solder 1901B can be in contact with the third pad 1262C. For example, the third pad 1262C can be in contact with or connected to the first pad 1262A. For example, the third pad 1262C can be connected to the upper portion or upper end of the first pad 1262A.

[0674] The solder 1901B can be in contact with, joined to, or coupled to the third pad 1262C of the terminal 1251 of the first circuit board 1250 and the terminal 1261-2 of the second circuit board 1260-2.

[0675] In Figure 27 the illustrated embodiment, since the solder 1901B is in contact with or coupled to the first pad 1262A, the second pad 1262B, and the third pad 1262C, compared with Figure 25 and Figure 26 the illustrated embodiment, the contact and coupling area can be increased, thereby improving the solderability and electrical connection performance and more effectively preventing cracks from occurring in the solder.

[0676] Figure 28 is a perspective view of the first circuit board 1250-1 and the second circuit board 1260-1 according to another embodiment. Figure 29a is Figure 28 a cross-sectional view of the first circuit board 1250-1, the second circuit board 1260-1, and the solder 1901C shown in

[0677] Figure 28 The first circuit board 1250-1 shown in Figure 22 is a variant of the first circuit board 1250 shown in Figure 28 The first circuit board 1250-1 shown in

[0678] The first circuit board 1250-1 can include a groove 1267 at a portion where the terminal 1251 is formed. The groove 1267 can be a groove recessed from the lower surface 1128 of the first circuit board 1250-1. For example, the groove 1267 can be non-overlapping with the second circuit board 1260-1 in the optical axis direction. When viewed from above, the groove 1267 can have a polygonal shape, such as a quadrilateral shape.

[0679] For example, the recess 1267 may include a bottom surface that defines a height difference relative to the lower surface 1128 of the first circuit board 1250-1. For example, the bottom surface of the recess 1267 may be positioned higher than the lower surface 1128 of the first circuit board 1250-1. For example, the upper surface of the first circuit board 1250-1 may be closer to the bottom surface of the recess 1267 than the lower surface 1128 of the first circuit board 1250-1. For example, the recess 1267 in the first circuit board 1250-1 may include side surfaces that are located between the lower surface 1128 and the bottom surface 1129A of the circuit board 1250 to connect the lower surface 1128 and the bottom surface 1129A of the circuit board 1250 to each other.

[0680] In Figure 28 , a plurality of terminals may be arranged in a row adjacent to each of the four sides of the lower surface of the first circuit board 1250-1, and the first circuit board 1250-1 may include four recesses 1267A to 1267D located at the four sides of the lower surface. In another embodiment, the number of the recesses 1267 may be determined according to the shape of the terminals provided along the side surfaces of the first circuit board 1250-1. For example, when the terminals are arranged along two opposite sides of the lower surface of the first circuit board 1250-1, the first circuit board 1250-1 may include two recesses located at two opposite sides of the first circuit board 1250-1 that are oppositely positioned.

[0681] The recess 1267 may include an opening at the outer surface of the first circuit board 1250-1. For example, at least one of the recesses 1267A to 1267D (e.g., 1267D) may include an opening at the outer surface of the first circuit board 1250-1.

[0682] For example, the terminal 1251 of the first circuit board 1250-1 may be provided in the recess 1267 in the first circuit board 1250-1. For example, the terminal 1251 of the first circuit board 1250-1 may be provided on the bottom surface of the recess 1267 in the first circuit board 1250. Figure 22 The description of the position of the terminal 1251 shown in Figure 26 may be applied to the terminal 1251 of the first circuit board 1250-1 with or without modification. In addition, Figure 29a the description of the solder 1901A shown in

[0683] may be applied to Figure 29a, since the terminal 1251 of the first circuit board 1250-1 is positioned higher than the lowermost conductive layer 1091-1 of the first circuit board 1250-1, the length of the portion where the solder 1901C protrudes from the lower surface of the circuit board 1250-1 can be reduced, and the distance between the solder 1901C and the heat dissipation member 1380 of the first board unit 1255 can be increased. Therefore, this embodiment can prevent the solder 1901C from colliding with the heat dissipation member 1380 of the first board unit 1255, thereby preventing the occurrence of cracks in the solder 1901C caused by impact.

[0684] Figure 29b is a cross-sectional view of the solder 1901D according to another embodiment. Figure 29b The solder 1901D shown in Figure 29a can be a modification of the solder 1901C shown in

[0685] Figure 29a The solder 1901C shown can contact, or be coupled, attached, or fixed to the first pad 1262A and the second pad 1262B of the terminal 1261-1 of the second circuit board 1260-1.

[0686] Referring to Figure 29b , the solder 1901D can contact, or be coupled, attached, or fixed to the terminal 1251 of the first circuit board 1250-1 and the first pad 1262A of the terminal 1261-1 of the second circuit board 1260-1. For example, the solder 1901D can be spaced apart from the second pad 1262B of the terminal 1261-1 of the circuit board 1260-1. In addition, for example, the solder 1901D can be not in direct contact with the second pad 1262B of the terminal 1261-1 of the circuit board 1260-1.

[0687] Although Figure 28 , Figure 29a and Figure 29b show embodiments applying the Figure 26 shown second circuit board 1260-1, the second circuit boards 260 and 260-2 according to the Figure 25 and 27 shown embodiments can be applied, with or without modification, to the Figure 28[[END , ​ and ​ shown embodiments in another embodiment.

[0688] According to this embodiment, when coupling between the terminal 1251 of the first circuit board 1250 and the terminal 1261 of the second circuit board 1260 through a soldering process, the terminal 125l of the first circuit board 1250 can be positioned higher than the lowermost conductive layer of the first circuit board 1250. Accordingly, the distance between the solder coupled to the terminal 1251 and the fixing unit (e.g., the heat dissipation member 1380 disposed on the fixing unit) can be increased, thereby preventing cracks from occurring in the solder due to collision between the solder and the fixing unit and improving the reliability of the electrical connection between the terminal 1251 of the first circuit board 1250 and the terminal 1261 of the second circuit board 1260.

[0689] In addition, since the second circuit board 1260 is disposed in the accommodation groove 1129 formed in the first circuit board 1250, this embodiment can increase the height of the image sensor 1810 disposed on the heat dissipation member 1280 coupled to the second circuit board 1260 and increase the thickness of the heat dissipation member 1380 of the fixing unit within a range that satisfies a predetermined distance between the OIS moving unit and the fixing unit, thereby improving the heat dissipation efficiency.

[0690] ​ is a perspective view of a camera device 10 according to an embodiment. ​ is a perspective view of the camera device 10 with the cover member 300 removed. ​ is ​ the exploded perspective view of the camera device 10 shown. ​ is along ​ the cross-sectional view of the camera device 10 taken along line A - B in. ​ is along ​ the cross-sectional view of the camera device 10 taken along line C - D in. ​ is along ​ the cross-sectional view of the camera device 10 taken along line E - F in. ​ is ​ the exploded perspective view of the AF operation unit 100 shown. ​ is a perspective view of the bobbin 110, the sensing magnet 180, the balance magnet 185, the first coil 120, the first position sensor 170, and the capacitor 195. ​ is a perspective view of the bobbin 110, the circuit board 190, the wire 220, the damper DA, the upper elastic member 150, the sensing magnet 180, and the balance magnet 185. ​ is a bottom perspective view of the housing 140, the bobbin 110, the lower elastic member 160, the magnet 130, and the lower elastic member 160.

[0691] Referring to ​, the camera device 10 may include an AF operation unit 100 and an image sensor unit 350. The AF operation unit 100 may include an AF moving unit. The image sensor unit 350 may include an OIS moving unit. One of the AF moving unit and the OIS moving unit may be a first moving unit, and the other of the AF moving unit and the OIS moving unit may be a second moving unit.

[0692] The camera device 10 may further include at least one of a cover member 300 and a lens module 400. The cover member 300 and the base 210, which will be described later, may define the housing.

[0693] The AF operation unit 100 may be coupled to the lens module 400 and may move the lens module 400 in the direction of the optical axis OA or in a direction parallel to the optical axis to perform the autofocus function of the camera device 10.

[0694] The image sensor unit 350 may include an image sensor 810. For example, the image sensor unit 350 (or the OIS operation unit) may include an OIS moving unit that includes the image sensor 810. For example, the image sensor unit 350 may move the OIS moving unit (e.g., the image sensor 810) in a direction perpendicular to the optical axis. In addition, the image sensor unit 350 may cause tilting or rotation (or rolling) with respect to or around the optical axis. The image sensor unit 350 may perform shake correction for the camera device 10.

[0695] For example, the image sensor 810 may include an imaging area configured to detect light passing through the lens module 400. Here, the imaging area may optionally be referred to as an effective area, a light receiving area, an active area, or a pixel area. For example, the imaging area of the image sensor 810 may be an area where light passes through the filter 610 and then enters the imaging area and contains an image, and may include at least one unit pixel. For example, the imaging area may include a plurality of unit pixels.

[0696] The AF operation unit 100 may also be referred to as a "lens moving unit" or a "lens moving device". Alternatively, the AF operation unit 100 may also be referred to as a "first moving unit (or second moving unit)", a "first actuator (or second actuator)", or an "AF operation unit".

[0697] The image sensor unit 350 may also be referred to as an "image sensor moving unit" or an "image sensor shifting unit", a "sensor moving unit" or a "sensor shifting unit". Alternatively, the image sensor unit 350 may also be referred to as a "second moving unit (or first moving unit)" or a "second actuator (or first actuator)".

[0698] The AF operation unit 100 can move the lens module 400 in the optical axis direction. For example, the AF operation unit 100 can move the bobbin 110 in the optical axis direction. For example, the AF operation unit 100 can include a bobbin 110, a first coil 120, a magnet 130, and a housing 140. The AF operation unit 100 can also include an upper elastic member 150 and a lower elastic member 160.

[0699] The AF operation unit 100 can also include a first position sensor 170 and a sensing magnet 180 for AF feedback operation. The AF operation unit 100 can also include at least one of a balance magnet 185 and a capacitor 195.

[0700] The bobbin 110 can be disposed in the housing 140 so as to move in the optical axis direction OA or a first direction (e.g., the Z-axis direction) by the electromagnetic interaction between the first coil 120 and the magnet 130.

[0701] The bobbin 110 can have a perforation to which the lens module 400 is coupled or mounted. For example, the perforation in the bobbin 110 can be a through hole formed through the bobbin 110 in the optical axis direction, and can have a circular, elliptical, or polygonal shape, but is not limited thereto.

[0702] The lens module 400 can include at least one lens and / or a lens barrel. For example, the lens module 400 can include at least one lens and a lens barrel that receives the at least one lens. However, the configuration of the lens module is not limited to a lens barrel, and the lens module can have any configuration as long as the configuration can support at least one lens.

[0703] For example, the lens module 400 can be threadedly engaged with the bobbin 110. Alternatively, the lens module 400 can be coupled to the bobbin 110 using, for example, an adhesive (not shown). The light passing through the lens module 400 can be irradiated onto the image sensor 810 through a filter 610.

[0704] The bobbin 110 can include one or more protrusions 111A and 111B provided on its outer surface. For example, although the one or more protrusions 111A and 111B can protrude in a direction parallel to a wire perpendicular to the optical axis OA, the present disclosure is not limited thereto. For example, the bobbin 110 can include two protrusions 111A and 111B that are positioned opposite to each other.

[0705] The protrusions 111A and 111B of the bobbin 110 can correspond to the grooves 25A and 25B in the housing 140, and can be disposed in the grooves 25A and 25B in the housing 140 to minimize or prevent the bobbin 110 from rotating around the optical axis beyond a predetermined range.

[0706] The bobbin 110 may include a protrusion 146A protruding in a direction perpendicular to the optical axis. For example, the protrusion 146A of the bobbin 110 may be provided at a corner portion of the bobbin 110.

[0707] The housing 140 may include a groove 146b that corresponds to, faces, or overlaps with the protrusion 146A of the bobbin 110. At least a portion of the protrusion 146A of the bobbin 110 may be disposed in the groove 146B in the housing 140.

[0708] In addition, the protrusion 146A of the bobbin 110 may serve as a stopper configured to move the bobbin 110 within a predetermined range in the optical axis direction (e.g., in a direction from the upper elastic member 150 toward the lower elastic member 160) in response to an external shock or the like.

[0709] The bobbin 110 may form a first relief groove 112a in its upper surface to avoid spatial interference with the first frame connector 153 of the upper elastic member 150. The bobbin 110 may form a second relief groove 112b in its lower surface to avoid spatial interference with the second frame connector 163 of the lower elastic member 160.

[0710] The bobbin 110 may include a first coupler 116a configured to couple and fix to the upper elastic member 150. For example, although the first coupler 116a of the bobbin 110 may have a raised form, the present invention is not limited thereto. In another embodiment, the first coupler 116a of the bobbin 110 may have a flat surface or a groove form. In addition, the bobbin 110 may include a second coupler 116b configured to couple and fix to the lower elastic member 160. Although the second coupler 116b may have, for example, a raised form, the present disclosure is not limited thereto. In another embodiment, the second coupler 116b may have a flat surface or a groove form.

[0711] A groove 105 may be formed in the outer surface of the bobbin 110, and the first coil 120 is disposed, assembled, or arranged in the groove 105. For example, the groove 105 in the bobbin 110 may have a shape corresponding to the shape of the first coil 120, i.e., a closed curve shape (e.g., a ring shape).

[0712] A first placement groove 26a may be provided in the bobbin 110, and the sensing magnet 180 may be placed, assembled, fixed, or arranged in the first placement groove. In addition, a second placement groove 26b may be provided in the outer surface of the bobbin 110, and the balance magnet 185 is placed, assembled, fixed, or arranged in the second placement groove 26b.

[0713] For example, the first placement groove 26a and the second placement groove 26b in the bobbin 110 may be formed in the outer surfaces of the bobbin 110 that face each other. For example, the first placement groove 26a may be formed in the first protrusion 111A of the bobbin 110, and the second placement groove 26b may be formed in the second protrusion 111B of the bobbin 110.

[0714] The bobbin 110 may include a guide protrusion 104A configured to guide a part of the first frame connection member 153 of the upper elastic member 150. For example, the guide protrusion 104A may protrude from the bottom surface of the avoidance portion 112a in the bobbin 110.

[0715] The damper 48 may be provided between the bobbin 110 and the upper elastic member 150. For example, the damper 48 may be provided between the bobbin 110 and the first frame connection member 153 of the upper elastic member 150, and may be in contact with or coupled to or attached to it.

[0716] For example, the upper elastic member 150 may include an extension (or protrusion) extending from the first frame connection member 153. The extension 155 may be spaced apart from the outer frame 152 and the inner frame 151. In addition, the extension 155 may be spaced apart from one end of the first frame connection member 153 connected to the inner frame 151 and the other end of the first frame connection member 153 connected to the outer frame 152. For example, the extension 155 may extend beyond the upper surface of the bobbin 110.

[0717] For example, a part (or end) of the extension 155 may be provided on the damper 48 (the damper 48 provided on the upper surface of the bobbin 110) so as to overlap with the damper 48. For example, the bobbin 110 may include a receiving portion 104B in which the damper 48 is received or provided. For example, the receiving portion 104B may be a groove. The receiving portion 104B may have a structure recessed from the bottom surface of the avoidance portion 112a in the bobbin 110.

[0718] For example, the damper 48 may be provided between the receiving portion 104B and the extension 155 of the upper elastic member 150, and may be in contact with or coupled to or attached to it. The damper 48 may be in contact with or attached to the extension 155 and the receiving portion 104B in the bobbin 110 for damping or absorbing the vibration of the bobbin 110. For example, the damper 48 may be made of a damping member (such as silicone).

[0719] The first coil 120 may be disposed on or coupled to the bobbin 110. For example, the first coil 120 may be disposed on or coupled to the outer surface of the bobbin 110. For example, the first coil 120 may be wound around the outer surface of the bobbin 110 in the winding direction about the optical axis OA, but is not limited thereto.

[0720] Although the first coil 120 may be directly wound around the outer surface of the bobbin 110, the present invention is not limited thereto. In another embodiment, the first coil 120 may be implemented as a coil loop wound around the bobbin 110, or as a coil block having an inclined shape.

[0721] Power or a drive signal may be supplied to the coil 120. The power or drive signal supplied to the first coil 120 may be a DC signal, an AC signal, or a signal including DC and AC components, and may be a voltage type or a current type.

[0722] When a drive signal (e.g., a drive current) is supplied to the first coil 120, an electromagnetic force caused by the electromagnetic interaction with the first magnet may be generated, and thereby the bobbin 110 may be moved in the direction of the optical axis OA by the generated electromagnetic force.

[0723] At the initial position of the AF operation unit, the bobbin 110 may be moved upward or downward, which is referred to as the bidirectional drive of the AF operation unit. Alternatively, at the initial position of the AF operation unit, the bobbin 110 may be moved upward, which is referred to as the unidirectional drive.

[0724] At the initial position of the AF operation unit, the first coil 120 may be arranged to correspond to the magnet 130 provided on the housing 140 in a direction parallel to a wire that is perpendicular to the optical axis OA and extends through the optical axis.

[0725] For example, the AF operation unit may include a bobbin 110 and components coupled to the bobbin 110 (e.g., a first coil 120, a sensing magnet 180, and a balance magnet 185). The AF operation unit may further include a lens module 400.

[0726] The initial position of the AF operation unit may be the original position of the AF operation unit in a state where no power is applied to the first coil 120, or the position where the AF operation unit is located when the upper elastic member 150 and the lower elastic member 160 are elastically deformed only due to the weight of the AF operation unit. In addition, the initial position of the bobbin 110 may be the position where the AF operation unit is located when gravity acts in the direction from the bobbin 110 to the base 210 or when gravity acts in the direction from the base 210 to the bobbin 110.

[0727] The sensing magnet 180 can provide a magnetic field detected by the first position sensor 170. The balancing magnet 185 can be used to cancel the influence of the magnetic field of the sensing magnet 180 and establish a weight balance relative to the sensing magnet 180.

[0728] The sensing magnet 180 may alternatively be referred to as a "sensor magnet" or a "second magnet". The sensing magnet 180 may be disposed on the bobbin 110 or may be coupled to the bobbin 110. The sensing magnet 180 may be disposed to face the first position sensor 170. The balancing magnet 185 may be disposed on the bobbin 110 or may be coupled to the bobbin 110. For example, the balancing magnet 185 may be disposed opposite to the sensing magnet 180.

[0729] Although each of the sensing magnet and the balancing magnets 180 and 185 may be a single-pole magnetized magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of the sensing magnet and the balancing magnets 180 and 185 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0730] The sensing magnet 180 may move together with the bobbin 110 in the optical axis direction.

[0731] The first position sensor 170 may detect the displacement of the bobbin 110 in the optical axis direction or the displacement of the lens module 400 in the optical axis direction. Alternatively, the first position sensor 170 may detect the sensing magnet 180.

[0732] The first position sensor 170 may detect the intensity or magnetic force of the magnetic field of the sensing magnet 180 moving in the optical axis direction and may output an output signal corresponding to the detection result.

[0733] For example, according to the displacement of the bobbin 110 in the optical axis direction, the intensity or magnetic force of the magnetic field detected by the first position sensor 170 may change. Therefore, the first position sensor 170 may output an output signal proportional to the detected magnetic field intensity, and the output signal from the first position sensor 170 may be used to detect the displacement of the bobbin 110 in the optical axis direction.

[0734] The housing 140 may be disposed in the cover member 300. For example, the housing 140 may be disposed on the image sensor unit 350.

[0735] The housing 140 may accommodate the bobbin 110 therein and may support the magnet 130 and the first position sensor 170.

[0736] The housing 140 may be configured to have a hollow column shape. For example, the housing 140 may have a polygonal (e.g., rectangular or octagonal) or circular hole, and the perforations in the housing 140 may be through-holes that are formed through the housing 140 in the optical axis direction.

[0737] The housing 140 may include sides and corners, where the sides correspond to or face the side plates 302 of the cover member 300, and the corners correspond to or face the corners of the cover member 300.

[0738] To prevent direct collision with the inner surface of the upper plate 301 of the cover member 300, the housing 140 may include a stopper 145 provided on its upper part, upper surface, or upper end.

[0739] The housing 140 may include a mounting groove (or recess) 14A configured to receive a portion of the support plate 310 therein. For example, the housing 140 may include a mounting groove (or recess) 14A configured to receive an extended region 190 of the support plate 310, in which the first position sensor 170 is provided. For example, the mounting groove 14A may have the same shape as the shape of the extended region 190 of the support plate 310.

[0740] The housing 140 may include protrusions 44A and 44B that surround at least a portion of the extended region 190 of the support plate 310. For example, the protrusions 44A and 44B may be provided or formed on the outer surface of the housing 140. For example, the protrusions 44A and 44B may be provided or formed on the outer surface of the side portions of the housing 140. The protrusions 44A and 44B may also be referred to as "protection portions", "support portions", "extension portions", or "guide portions".

[0741] The protrusions 44A and 44B of the housing 140 may surround at least a portion of the extended region 190 of the support plate 310 and another region of the support plate 310 other than the extended region 190. For example, the housing 140 may include a first protrusion 44A provided on the first side portion of the housing and a second protrusion 44B provided on the second side portion of the housing 140. The first protrusion 44A and the second protrusion 44B may be positioned relative to each other with respect to the optical axis OA or the bobbin 110. In another embodiment, the second protrusion 44B may be omitted.

[0742] For example, the extended region 190 of the support plate 310 may be provided in the first protrusion 44A. For example, the mounting groove 14A may be formed in the first protrusion 44A.

[0743] For example, each of the first protrusion 44A and the second protrusion 44B may include a first portion 47A connected to the upper surface of the housing 140 and a second portion 47 connected to the first portion 47A and spaced apart from the side portion of the housing 140. For example, the first portion 47A of the first protrusion 44A may be connected to the upper surface of the first side portion of the housing 140, and the first portion 47A of the second protrusion 44B may be connected to the upper surface of the second side portion of the housing 140. For example, the first portion 47A may protrude from the upper surface of the second side portion of the housing 140 in the optical axis direction or toward the inner surface of the upper plate 301 of the cover member 300.

[0744] For example, at least a portion of the extension region 190 of the support plate 310 may be located between the first portion 47A and the second portion 47 of the first protrusion 44A. Further, for example, another region of the support plate 310 that does not include the extension region 190 may be located between the first portion 47A and the second portion 47 of the first protrusion 44A.

[0745] Each of the first protrusion 44A and the second protrusion 44B of the housing 140 may include a third portion 37C extending from the second portion 47. For example, the third portion 37C may extend or protrude from the lower portion or the lower end of the second portion 47 in a direction parallel to the outer surface of the first side portion (or the second side portion) of the housing 140 (e.g., the second horizontal direction).

[0746] For example, the third portion 37C may include a 3-1 portion extending from one end of the second portion 47 and a 3-2 portion extending from the other end of the second portion. The 3-1 portion and the 3-2 portion may extend or protrude in opposite directions.

[0747] An adhesive or a sealing member may be provided between the protrusions 44A and 44B of the housing 140 and the cover member 300. For example, an adhesive (or a sealing member) may be provided between the protrusions 44A and 44B of the housing 140 and the side plate 302 of the cover member 300, and may couple the two parts to each other. The protrusions 44A and 44B may increase the surface area of the protrusions 44A and 44B coupled to the cover member 300, and may stably couple the housing 140 to the cover member 300 without interfering with the support plate 310.

[0748] At least one first coupler 143 that will be coupled to the first outer frame 152 of the upper elastic member 150 may be provided on the upper portion, the upper end, or the upper surface of the housing 140. A second coupler that will be coupled and fixed to the second outer frame 162 of the lower elastic member 160 may be provided on the lower portion, the lower end, or the lower surface of the housing 140. For example, each of the first and second couplers of the housing 140 may have a shape of a flat surface, a protrusion, or a groove.

[0749] Holes 147 may be formed at the corners of the housing 140, which are paths through which the wires 220 extend. The holes 147 may be through holes formed through the housing 140 along the optical axis direction. In another embodiment, the holes may have a structure recessed from the outer surface of the corner portion of the housing 140, and at least a portion of the holes may be exposed from the outer surface of the corner portion. The holes 147 in the housing 140 may include the same number of holes as the number of support members.

[0750] The magnet 130 may be disposed on, coupled to, or fixed to the housing 140 as a fixed member. For example, the magnet 130 may be disposed on, coupled to, or fixed to the side portion of the housing 140. The magnet 130 may include an AF operation magnet 71A for AF operation. The magnet 130 may include an OIS operation magnet 71B for OIS operation. Hereinafter, the AF operation magnet 71A may be referred to as one of the first and second magnets, and the OIS operation magnet 71B may be referred to as the other of the first and second magnets.

[0751] In another embodiment, the magnet 130 may be disposed, coupled, or fixed to the corner portion of the housing.

[0752] For example, the magnet 130 may include a plurality of magnet units. For example, the magnet 130 may include a first magnet unit 130-1 to a fourth magnet unit 130-4 disposed on the housing 140. In another embodiment, the magnet 130 may include two or more magnet units.

[0753] The magnet 130 may be disposed on at least one of the side portion or the corner portion of the housing 140. For example, at least a portion of the magnet 130 may be disposed on the side portion or the corner portion of the housing 140. Alternatively, for example, at least a portion of the magnet 130 may be disposed on the side portion of the housing 140, and the remaining portion of the magnet 130 may be disposed at the corner portion of the housing 140.

[0754] For example, each of the magnet units 130-1 to 130-4 may include a first portion disposed on a corresponding one of the four corners of the housing 130. In addition, each of the magnet units 130-1 to 130-4 may include a second portion disposed on the side portion of the housing 140 adjacent to a corner portion of the housing 140.

[0755] For example, the first magnet unit 130-1 and the third magnet unit 130-3 may be located on opposite sides of the housing 140 in a first horizontal direction (e.g., the Y-axis direction). For example, the second magnet unit 130-2 and the fourth magnet unit 130-4 may be positioned on opposite sides of the housing 140 in a second horizontal direction (e.g., the X-axis direction).

[0756] For example, the first magnet unit 130-1 and the third magnet unit 130-3 may be arranged parallel to each other in the second horizontal direction (e.g., the X-axis direction), and the second magnet unit 130-2 and the fourth magnet unit 130-4 may be arranged parallel to each other in the first horizontal direction (e.g., the Y-axis direction).

[0757] In the initial position of the AF operation unit, the magnet 130 may be arranged on the housing so as to partially overlap with the first coil 120 in a direction parallel to a wire that is perpendicular to the optical axis OA and extends through the optical axis OA.

[0758] The magnet 130 may include a unipolar magnetized magnet or a dipole magnet, which includes one N pole and one S pole. In another embodiment, the magnet 130 may include a bipolar magnetized magnet or a quadrupole magnet, which includes two N poles and two S poles. In another embodiment, the magnet 130 may include a unipolar magnetized magnet and a bipolar magnetized magnet.

[0759] For example, the magnet 130 may include an AF magnet (or an AF operation magnet) for AF operation and an OIS magnet (or an OIS operation magnet) for OIS operation. In another embodiment, for example, the magnet 130 may be a common magnet for AF operation and OIS operation.

[0760] In ​ and ​ the description of the magnet 1130 may be applied to the magnet 130 with or without modification.

[0761] The extended area 190 of the support plate 310 may be arranged on the fixing unit. For example, the extended area 190 of the support plate 310 may be arranged on the housing 140.

[0762] The first position sensor 170 may be arranged or mounted in the extended area 190 of the support plate 310 and may be electrically connected to the extended area 190.

[0763] The first position sensor 170 may be arranged on the housing 140. The first position sensor 170 may be arranged in the extended area 190 of the support plate 310. For example, the first position sensor 170 may be arranged on the first surface 19A of the extended area 190 (see ​ A). For example, the first surface 19A of the extended area 190 may be a surface of the extended area 190 facing the bobbin 110 or the sensing magnet 180. The first position sensor 170 may be electrically connected to the extended area 190 of the support plate 310.

[0764] For example, at the initial position of the AF operation unit, at least a part of the first position sensor 170 may face or overlap with the sensing magnet 180 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis OA. In another embodiment, at the initial position of the AF operation unit, the first position sensor may not face or overlap with the sensing magnet.

[0765] The first position sensor 170 can be used to detect the movement, displacement, or position of the bobbin 110 in the optical axis direction. The first position sensor 170 can detect the magnetic field or magnetic field intensity of the sensing magnet 180 mounted on the bobbin 110 during the movement of the bobbin 110, and can output an output signal corresponding to the detection result. Therefore, the movement, displacement, or position of the bobbin 110 in the optical axis direction can be detected using the output of the first position sensor 170.

[0766] The capacitor 195 may be disposed in the extension region 190 of the support plate 310. This will be described later.

[0767] In another embodiment, the sensing magnet 180 may be disposed on the housing 140, and the first position sensor 170 may be disposed on the bobbin 110. In another embodiment, the balance magnet 185 may be omitted.

[0768] The upper elastic member 150 and the lower elastic member 160 may be coupled to the bobbin 110 and the housing 140. For example, the upper elastic member 150 may be coupled to the upper portion, upper end, or upper surface of the bobbin 110 and the upper portion, upper end, or upper surface of the housing 140, and the lower elastic member 160 may be coupled to the lower portion, lower end, or lower surface of the bobbin 110 or the upper portion, upper end, or upper surface of the housing 140. The upper elastic member 150 and the lower elastic member 160 may elastically support the bobbin 110 with respect to the housing 140.

[0769] The upper elastic member 150 may include a plurality of upper elastic units (e.g., 150-1 to 150-4) that are electrically separated or spaced apart from each other. Although the lower elastic member 160 is implemented as a single elastic unit, in another embodiment, the lower elastic member 160 may include a plurality of lower elastic units that are electrically separated or spaced apart from each other. In another embodiment, at least one of the upper elastic member and the lower elastic member may be implemented as a single unit or a single structure.

[0770] The upper elastic member 150 may further include: a first inner frame 151 coupled or fixed to the upper portion, upper surface, or upper end of the bobbin 110; a second inner frame 152 coupled or fixed to the upper portion, upper surface, or upper end of the housing 140; and a first frame connector 153 connecting the first inner frame 152 to the first outer frame 152. In addition, the upper elastic member 150 may include the above-described extension portion 155.

[0771] The lower elastic member 160 may include: a second inner frame 161 coupled or fixed to the lower part, lower surface or lower end of the bobbin 110; a second outer frame 162 coupled or fixed to the lower part, lower surface or lower end of the housing 140; and a second frame connecting member 163 connecting the second inner frame 161 to the second outer frame 162. The inner frame may alternatively be referred to as the interior, the outer frame may alternatively be referred to as the exterior, and the frame connecting member may alternatively be referred to as the connecting portion.

[0772] Each of the first frame connecting member 153 and the second frame connecting member 163 may be bent or folded (or may be formed as a curve) at least once to define a predetermined pattern.

[0773] Each of the upper elastic member 150 and the lower elastic member 160 may be made of a conductive material, such as a metallic material. In addition, each of the upper elastic member 150 and the lower elastic member 160 may be made of an elastic member, such as a leaf spring or the like.

[0774] For example, the second outer frame 152 of the first upper elastic unit 150-1 may include a first bonding portion 4A that is coupled or electrically connected to the pad 5A of the extension region 190 that is coupled or electrically connected to the support plate 310 using solder or a conductive adhesive. The second outer frame 152 of the second upper elastic unit 150-2 may include a second bonding portion 4B that is electrically connected to the pad 5B of the extension region 190 that is electrically connected to the support plate 310 using solder or a conductive adhesive.

[0775] In another embodiment, at least one of the upper elastic member 150 or the lower elastic member 160 may include two elastic members. For example, each of the two lower elastic members of one of the upper elastic member 150 and the lower elastic member 160 may be coupled or electrically connected to a corresponding one of the first pad 5a and the second pad 5b of the circuit board 190. The first coil 120 may be electrically connected to the two elastic members.

[0776] The first outer frame 152 of the upper elastic member 150 may include a first coupler 510 coupled to the housing 140, a second coupler 520 coupled to the wire 220, and a connecting member 530 connecting the first coupler 510 to the second coupler 520. The first coupler 510 may have a through hole or a hole to be coupled to the first coupler 143 of the housing 140. The second coupler 520 may have a through hole or a hole to be coupled to the wire 220. For example, the second coupler 520 may be coupled to the wire 220 using a conductive adhesive or solder. For example, although the connecting member 530 may include a bent portion bent at least once or a folded portion folded at least once, the present invention is not limited thereto. In another embodiment, the connecting member 530 may have a linear shape.

[0777] ​is a perspective view of the image sensor unit 350. ​ is ​ the first exploded perspective view of the image sensor unit 350 shown. ​ is ​ the second exploded perspective view of the image sensor unit 350 shown. ​ is Figure 40a the bottom perspective view of the holder 270, terminal member 37, first plate unit 255, support plate 310, heat dissipation member 280, base 210, and second plate unit 800 shown. Figure 42 is a plan view of the holder 270, first plate unit 255, image sensor 810, second coil 230, and OIS position sensor 240. Figure 43 is a rear perspective view of the holder 270 and first plate unit 255. Figure 44 is a perspective view of the base 210, terminal member 37, and wire 220.

[0778] Figure 45 is a bottom view of the first plate unit 255, support plate 310, and heat dissipation member 280. Figure 46 is a perspective view of the first plate unit 255, support plate 310, and heat dissipation member 280. Figure 47a is a first perspective view of the support plate 310 coupled to the holder 270 and the base 210. Figure 47b is a second perspective view of the support plate 310 coupled to the holder 270 and the base 210. Refer to Figures 10c to 10f the description of Figures 31 to 53 the embodiments shown.

[0779] Refer to Figures 39 to 47b , the image sensor unit 350 may include a fixed unit and an OIS moving unit, and the OIS moving module is arranged to be spaced apart from the fixed unit. The image sensor unit 350 may include a support unit that connects the fixed unit to the OIS moving unit.

[0780] For example, the support unit may include the support plate 310. Alternatively, for example, the support unit may be the support plate 310. In another embodiment, the support unit may include an elastic member, such as a leaf spring or a suspension wire, instead of the support plate 310.

[0781] The fixed unit may be a part of the camera device 10 that is immovable during OIS operation. For example, the fixed unit may include the plate unit 800. For example, the fixed unit may include components coupled to the second plate unit 800. The plate unit 255 or 800 may also be referred to as a "plate" or a "circuit board".

[0782] For example, the fixing unit may include a base 210 coupled to the second plate unit 800. For example, the fixing unit may include a housing 140 of the AF operation unit, and components provided on the housing 140, such as a magnet 130, a first position sensor 170, and a circuit board 180. In addition, the fixing unit may include a cover member 300 coupled to the base 210. The OIS moving unit may be disposed in the cover member 300. For example, the cover member 300 may accommodate the OIS moving unit and a support plate 310 therein.

[0783] The OIS moving unit may include an image sensor 810. The OIS moving unit may further include a first plate unit 255 spaced apart from the second plate unit 800 and electrically connected to the second plate unit 900. For example, the OIS moving unit may include at least one of components provided on the first plate unit 255, such as a heat dissipation member 280, a holder 270, a second coil 230, and a second position sensor 340. The holder 270 may alternatively be referred to as a "spacer". In another embodiment, the holder 270 may be omitted, and the second coil 230 may be provided on the first plate unit 255, such as on a first circuit board 250.

[0784] For example, the camera device 10 may include a fixing unit, a moving unit, and a support unit (such as 310), the moving unit including a first heat dissipation member 280 provided on the fixing unit and an image sensor 810 provided in the first heat dissipation member 280, the support unit being configured to support the moving unit while allowing the moving unit to move in a direction perpendicular to the optical axis direction. The support unit (such as 310) may be connected between the moving unit and the fixing unit.

[0785] The moving unit may include a first plate unit 255 on which the image sensor 810 is provided, the fixing unit may include a second plate unit 800 disposed to be spaced apart from the first plate unit 225, and the support unit may connect the first plate unit 255 to the second plate unit 800.

[0786] The support plate 310 may include a conductive layer 93-1, a first insulating layer 94-1 provided under the conductive layer 93-1, and a second insulating layer 94-2 provided on the conductive layer 93-1. The support unit may be configured such that a part of the first insulating layer 94-1 is removed, thereby exposing a region of the conductive layer 93-1 through the removed part.

[0787] The first plate unit 255 may include a first circuit board 250, a second circuit board 260 electrically connected to the image sensor 810, and a solder 901 electrically connecting the first circuit board 250 to the second circuit board 260.

[0788] The camera device 10 may include an elastic member 220 (hereinafter referred to as a "wire"), which is configured to flexibly support the OIS moving unit. The elastic member 220 may be in the form of a wire or a spring.

[0789] For example, one end of the wire 220 may be coupled to the upper elastic member 150 (or the housing 140), and the other end of the wire 220 may be coupled to the holder 270. For example, one end of the wire 220 may be coupled to the first outer frame 152 (e.g., the second coupler 520) of the upper elastic member 150 using solder or a conductive adhesive. For example, the other end of the wire 220 may be coupled to the terminal member 37, and the terminal member 37 may be disposed on or coupled to the holder 270 using solder or a conductive adhesive.

[0790] A damper DA may be disposed between one end of the wire 220 and a hole 147 in the housing 140, and the wire 220 extends through the hole 147 in the housing 140. For example, at least a portion of the damper DA may be disposed in the hole 147 in the housing 140 and may be coupled or attached to at least a portion of the wire 220 and the housing 140.

[0791] For example, the wire 220 may be disposed parallel to the optical axis direction. For example, the wire 220 may be disposed at a corner of the housing 140 and / or a corner of the holder 270. For example, the wire 220 may include four wires 220-1 to 220-4. Each of the four wires 220-1 to 220-4 may be disposed on a corresponding one of the four corners of the housing 140 and / or the four corners of the holder 270.

[0792] A hole 271 may be formed in the holder 270, and at least a portion of the wire 220 extends through the hole 271. For example, a corner of the holder 270 may be formed through the hole 271, and the other end of the wire 220 extends through the hole 271. For example, each of the four corners of the holder 270 may form a hole 271 therein. For example, although the hole 271 may be a through hole formed through the holder 270 in the optical axis direction, in another embodiment, the hole 271 may be in the form of an avoidance groove.

[0793] For example, the terminal member 27 may be disposed on or coupled to the upper surface or the lower surface of the holder 270. For example, the terminal member 27 may be disposed or coupled to the lower surface of a corner of the holder 270. A groove 28A may be formed in the holder 270, and the terminal member 37 is disposed in the groove 28A. For example, the groove 28A may be formed in the lower surface of a corner of the holder 270.

[0794] The holding member 270 may include at least one protrusion 28B, and the terminal member 37 may have at least one hole 81A to be coupled to the at least one protrusion 28B of the holding member 270. The terminal member 37 and the holding member 270 may be coupled to each other using an adhesive or by heat melting. The terminal member 37 may have a hole 71B, and the other end of the wire 220 is inserted or coupled to the hole 71B. For example, each of the holes 81A and 71B may be a through hole.

[0795] For example, the terminal member 37 may include a body 81 coupled to the holding member 270. The body 81 may include a coupler 71 coupled to the wire 220. The coupler 71 may include a coupling region 71A coupled to the wire 220 and a hole 71B formed in the first coupling region 71A. The coupling region 71A may be a region of the body 81 that is coupled to the wire 220 using solder or a conductive adhesive. For example, the other end of the wire 220 passing through the hole 71B may be coupled to the lower portion or the lower surface of the coupling region 71A using solder or a conductive adhesive.

[0796] For example, the body 81 may have at least one hole 71C formed around the coupling region 71A. For example, the body 81 may have a plurality of holes 71C around the coupling region 71A. For example, the plurality of holes 71C may be spaced apart from the hole 71B.

[0797] The body 81 may include a support portion located between the plurality of holes 71C to support the coupling region 71A. The support portion 71D may also be referred to as a "connector" or a "bridge". The support portion 71D may include a plurality of support portions spaced apart from each other. The support portion 71D may be connected to the coupling region 71A.

[0798] During the soldering process, at least one hole 71C may be used to cause the solder to be mainly formed only in the coupling region 71B through the interfacial tension (such as surface tension) of the peripheral region of the coupling region 71A.

[0799] To perform soldering, the coupling region 71A must be heated. Here, at least one hole 71C may inhibit or prevent the heat transfer of the coupling region 71B to another region while preventing the formation of a soldered portion in the remaining region of the body 81. In other words, at least one hole 71C can improve the soldering efficiency.

[0800] The terminal member 37 may include an extension 82 extending from the body 81. The extension 82 may be bent downward at the body 81 and may extend downward. For example, the extension 82 may extend toward the hole 59 in the base 210. The extension 82 may also be referred to as a "bent portion".

[0801] For example, the terminal member 37 may include four terminals 37A to 37D corresponding to four wires 220-1 to 220-4 of the terminal member 37. Each of the terminals 37A to 37D may be disposed on a respective corner of the holder 270 and may be coupled to a respective one of the wires 220-1 to 220-4. Figure 42 The description of A may be applied, with or without modification, to the structure of each of the terminals 37A to 37D. The terminal member 37 may be made of a conductive material, such as metal. In another embodiment, the terminal member 37 may be omitted, and the wire 220 may be directly coupled to the holder 270.

[0802] A damper or an adhesive 49 may be disposed between the terminal member 37 and the base 210 and may be in contact with, coupled to, or attached to the terminal member 37 and the base 210. For example, the base 210 may have a hole 59 (or a groove) formed at a position corresponding to or facing the terminal member 37. For example, the hole 59 (or the groove) may be formed at a corner of the base 210.

[0803] For example, the damper 59 may be disposed in the hole 59 in the base 210. Alternatively, at least a portion of the extension 82 of the terminal member 37 may be disposed in the hole 59 in the base 210, and the damper 59 may be in contact with, coupled to, or attached to the extension 82. The damper 59 may be used to absorb or mitigate vibrations of the OIS moving unit, thereby preventing or suppressing oscillations of the OIS moving unit during OIS operation.

[0804] In another embodiment, the extension 82 may be omitted from the terminal member 37, and the camera device 10 may not include Figure 14 the damper 49 shown.

[0805] The support plate 310 may support the OIS moving unit relative to the fixing unit such that the OIS moving unit moves in a direction perpendicular to the optical axis, tilts relative to the optical axis, or rotates within a predetermined range.

[0806] For example, one end of the support plate 310 may be connected to or coupled to the first plate unit 255, and the other end of the support plate 310 may be connected or coupled to the second plate unit 800.

[0807] The holder 270 may be disposed below the AF operation unit. For example, the holder 270 may be made of a non-conductive member. For example, the holder 270 may be made of an injectable material that is easily moldable by an injection molding process. In addition, the holder 270 may be made of an insulating material. In addition, for example, the holder 270 may be made of resin or plastic.

[0808] The holding member 270 may include an upper surface, a lower surface opposite to the upper surface, and side surfaces (e.g., outer surfaces) connecting the upper surface to the lower surface. For examp...

Claims

1. A camera device, comprising: A fixing unit; And A moving unit, including a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and being movable relative to the fixing unit in a direction perpendicular to the optical axis direction, Wherein, the first circuit board includes a plurality of conductive layers, Wherein, the first circuit board includes terminals connected to the second circuit board via solder, and Wherein, the terminals are positioned higher than the lowermost conductive layer among the plurality of conductive layers of the first circuit board.

2. The camera device according to claim 1, wherein, The terminals are located between the lowermost conductive layer and the uppermost conductive layer among the plurality of conductive layers of the first circuit board.

3. The camera device according to claim 1, wherein, The terminals are formed at another conductive layer disposed on the lowermost conductive layer among the plurality of conductive layers.

4. The camera device according to claim 1, wherein, The terminals are formed at the second lowermost conductive layer among the plurality of conductive layers.

5. The camera device according to claim 1, wherein, The lowermost surface of the solder is provided higher than the lowermost surface of the second circuit board.

6. The camera device according to claim 1, wherein, The plurality of conductive layers are provided spaced apart from each other in the optical axis direction, and Wherein, the first circuit board includes a plurality of insulating layers disposed between the plurality of conductive layers.

7. A camera device, comprising: A fixing unit; And A moving unit, including a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and being movable relative to the fixing unit in a direction perpendicular to the optical axis direction, Wherein, the first circuit board includes a placement groove recessed from its lower surface, Wherein, the second circuit board is disposed in the placement groove in the first circuit board, and Wherein, the first circuit board includes a first terminal, the first terminal is disposed on the bottom surface or the bottom face of the placement groove and is connected to the second circuit board via solder.

8. The camera device according to claim 7, wherein, The second circuit board includes a second terminal, at least a part of the second terminal is disposed in the placement groove and is connected to the first terminal via solder.

9. The camera device according to claim 7, wherein, At least a part of the solder is disposed in the placement groove in the first circuit board.

10. The camera device according to claim 7, wherein, The first circuit board includes a plurality of conductive layers arranged in the optical axis direction, and The first terminal is positioned higher than the lowermost conductive layer among the plurality of conductive layers of the first circuit board.

Images