High-temperature-resistant single-component epoxy glue as well as preparation method and application thereof

Abstract

The invention relates to the technical field of epoxy glue, in particular to high-temperature-resistant single-component epoxy glue as well as a preparation method and application thereof. The high-temperature-resistant single-component epoxy glue comprises the following components in parts by weight: 45-55 parts of modified high-temperature-resistant epoxy resin, 25-35 parts of linear novolac epoxy resin, 5-10 parts of epoxidized hydroxyl-terminated polybutadiene, 5-10 parts of a diluent, 20-30 parts of modified silica powder, 8-10 parts of a curing agent, 0.1-2 parts of an accelerant and 0.1-1 part of a dispersing agent, the high-temperature-resistant single-component epoxy glue has the advantages of high curing speed, high toughness and long-term high-temperature-resistant stability.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy adhesives, and particularly to a high-temperature resistant one-component epoxy adhesive, its preparation method and application. Background Art

[0002] With the rapid development of frontier science and technology fields such as 5G communication and new energy vehicles, inductors, as key electronic components, are facing increasingly stringent performance requirements. Among them, the improvement of the power density of inductors has become one of the core demands. However, there are many problems to be solved urgently in the adhesives currently used for inductor encapsulation and fixation.

[0003] Traditional two-component epoxy resins have exposed many defects in practical applications. On the one hand, it is difficult to achieve absolute uniformity in the mixing process, and it is easy to have proportioning errors, which directly affects the performance stability of the adhesive. On the other hand, its storage stability is poor, and problems such as component separation and performance degradation are likely to occur during storage, bringing a lot of inconvenience to production and use.

[0004] Although existing one-component epoxy adhesives have been improved in some aspects, there are still obvious deficiencies. In a high-temperature environment, its shear strength drops significantly, usually below 10 MPa (at 150 °C), and it is difficult to meet the structural stability requirements of inductors in high-temperature working scenarios. At the same time, the thermal expansion coefficient of this type of adhesive is relatively high, generally greater than 50 ppm / °C, and it is easy to cause deformation or damage to the inductor structure when the temperature changes. In addition, the cured colloid is brittle and lacks sufficient toughness to effectively resist external impacts or vibrations.

[0005] Currently, the curing of one-component epoxy adhesives mostly relies on dicyandiamide curing agents. Although it can improve the heat resistance to a certain extent, the curing temperature is too high, usually exceeding 160 °C. This not only increases energy consumption but also easily causes deformation of the precision inductor core due to thermal stress, affecting its performance and accuracy. To solve the brittleness problem, some products try to add silicone for toughening, but the bonding strength decays significantly after high-temperature aging, and the reliability of inductors during long-term high-temperature operation cannot be guaranteed.

[0006] In summary, existing adhesive products cannot meet the requirements of rapid curing, high toughness, and long-term high-temperature stability at the same time, seriously restricting the further development of inductors in high-end application fields. Therefore, developing an epoxy adhesive with both rapid curing, high toughness, and long-term high-temperature stability has become an urgent technical problem in this field and is of great significance for promoting the technological progress of industries such as 5G communication and new energy vehicles. Summary of the Invention

[0007] The object of the present invention is to provide a high-temperature resistant one-component epoxy adhesive, which avoids the deficiencies in the prior art and has the advantages of fast curing speed, high toughness and long-term high-temperature stability.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] Provide a high-temperature resistant one-component epoxy adhesive, comprising the following components in parts by weight:

[0010] 45 - 55 parts of modified high-temperature resistant epoxy resin, 25 - 35 parts of linear phenolic epoxy resin, 5 - 10 parts of epoxy-terminated hydroxyl polybutadiene, 5 - 10 parts of diluent, 20 - 30 parts of modified silica powder, 8 - 10 parts of curing agent, 0.1 - 2 parts of accelerator, 0.1 - 1 part of dispersant;

[0011] The modified high-temperature resistant epoxy resin is prepared by the following method:

[0012] Put 10 - 20 parts of bisphenol A epoxy resin, 40 - 60 parts of bisphenol F epoxy resin, 10 - 20 parts of phenolic epoxy resin, and 30 - 40 parts of trifunctional solid epoxy resin into a reaction kettle, introduce nitrogen, gradually heat up to 100°C - 150°C, stir and react for 2 - 3 hours, and vacuum dehydrate. Cool and filter the obtained product to obtain the modified high-temperature resistant epoxy resin;

[0013] The modified silica powder is prepared by the following method:

[0014] Hydrolyze the silane coupling agent to generate silanol, adjust the pH value of the silanol to 3 - 5 with water or ethanol, and heat the silica powder to 100°C - 110°C;

[0015] Add the silanol to the heated silica powder, disperse evenly, stir and react at 80 - 100°C for 1 - 2 hours, then vacuum dry at 100 - 110°C for 2 - 3 hours, and finally screen to remove the false knot particles and hard agglomerates in the product to obtain the modified silica powder;

[0016] The curing agent is a dicyandiamide-based latent curing agent;

[0017] The accelerator is an imidazole adduct and / or a modified amine-based accelerator.

[0018] In some embodiments, the viscosity of the bisphenol F epoxy resin is less than 6000 cps.

[0019] In some embodiments, the viscosity of the phenolic epoxy resin is less than 16000 cps.

[0020] In some embodiments, the particle size of the silica powder is 1200 mesh - 1300 mesh.

[0021] In some embodiments, the silanol is added to the heated silicon micropowder by an atomization method.

[0022] In some embodiments, the diluent is one or a combination of two or more of a long-chain bifunctional toughening diluent and an o-tolyl glycidyl ether diluent.

[0023] In some embodiments, the dispersant is one or a combination of two or more of an epoxy phosphate, a hydroxy-functional carboxylic acid ester, a modified polymeric ionic polymer, an unsaturated polyamine amide, and a low molecular weight acidic polyester salt solution.

[0024] Advantages of the high-temperature resistant one-component epoxy adhesive of the present invention:

[0025] (1) For the high-temperature resistant one-component epoxy adhesive of the present invention, the epoxy resin used is a modified high-temperature resistant epoxy resin, which is grafted from bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phenolic epoxy resin, and trifunctional solid epoxy resin. Among them, bisphenol A-type epoxy resin provides basic mechanical properties and electrical insulation, the low viscosity characteristic of bisphenol F-type epoxy resin improves the processing fluidity, the high crosslinking density (including a rigid benzene ring structure) of phenolic epoxy resin significantly enhances the heat resistance, and trifunctional solid epoxy resin makes the curing network denser by increasing the crosslinking point density. After grafting of the four, a multi-level crosslinked structure is formed: the flexible chain segments of bisphenol A / F and the rigid structures of phenolic / trifunctional form an interpenetrating network, which not only maintains toughness but also increases the glass transition temperature (Tg). This synergistic effect enables the modified resin to still maintain more than 80% of its original strength at 180 °C. The obtained modified high-temperature resistant epoxy resin has excellent properties of high temperature resistance and high shear, can increase the temperature resistance and adhesion of the epoxy adhesive, and significantly enhances the adhesion of the modified epoxy resin to various substrates (such as metals, ceramics, etc.), and can effectively prevent the delamination problem caused by the difference in thermal expansion coefficient; moreover, this synergistic effect enables the modified resin to still maintain more than 80% of its original strength at 180 °C, which is significantly better than traditional one-component epoxy adhesives (usually the strength drops below 10 MPa at 150 °C).

[0026] (2) For the high-temperature resistant one-component epoxy adhesive of the present invention, the curing agent is a dicyandiamide-type latent curing agent, which usually requires high-temperature curing at 150-170 °C when used alone, but by adding an imidazole adduct or a modified amine promoter, its curing temperature can be significantly reduced. The imidazole adduct and / or modified amine promoter of the present invention enables the system to quickly complete crosslinking at 120 °C and can be cured in 30 min by reducing the activation energy, optimizing the reaction mechanism, and enhancing the compatibility, thereby improving the thermal stability of the epoxy adhesive.

[0027] (3) The high-temperature resistant one-component epoxy adhesive of the present invention, its linear phenolic resin has structural characteristics such as high functionality, high crosslinking density, support of the rigid benzene ring skeleton, phenolic-epoxy synergistic effect, and compactness of the molecular structure, which provide excellent thermal stability and mechanical strength.

[0028] (4) The high-temperature resistant one-component epoxy adhesive of the present invention, its epoxidized hydroxyl-terminated polybutadiene plays a role in temperature resistance and toughening based on the synergistic effect of flexible chain segments and crosslinked network, phase structure optimization, catalytic effect of active groups, and mechanism of retaining thermal stability;

[0029] (5) The high-temperature resistant one-component epoxy adhesive of the present invention, its modified silica powder can reduce the thermal peak temperature of the curing reaction, mainly due to the optimization of the reaction process by its surface modification and physical properties, reduce the linear expansion coefficient and shrinkage rate of the cured product, thereby eliminating internal stress and significantly improving the impact strength, tensile / compressive strength and wear resistance of the cured product.

[0030] The preparation method of the above-mentioned high-temperature resistant one-component epoxy adhesive is also provided, including the following steps:

[0031] Step 1: Mix the formulated amounts of modified high-temperature resistant epoxy resin, linear phenolic epoxy resin, epoxidized hydroxyl-terminated polybutadiene, and diluent and stir evenly at 20°C to 40°C to obtain a first mixed material;

[0032] Step 2: Add modified silica powder to the first mixed material to make the modified silica powder completely wet with the first mixed material, start stirring and evacuate for 1 to 3 hours to mix evenly, control the mixing temperature at 20 to 40°C, and the vacuum degree is below -0.1 mpa;

[0033] Step 3: Add a curing agent, a promoter, and a dispersant, mix evenly under vacuum conditions, lower the temperature to below 30°C, and continue stirring for 1 to 3 hours to obtain a high-temperature resistant one-component epoxy adhesive.

[0034] In some embodiments, in Step 1, first perform the first dispersion at a revolution speed of 25 Hz / minute, and then perform the second dispersion at a stirring speed of 15 Hz / minute under vacuum conditions;

[0035] In some embodiments, in Step 2, after adding the modified silica powder, first stir at a stirring speed of 10 Hz / min for 5 to 10 minutes, scrape the cylinder wall once, if there is more modified silica powder, add the modified silica powder in batches until the modified silica powder is completely wet with the first mixed material.

[0036] The application of the above-mentioned high-temperature resistant one-component epoxy adhesive in precision components is also provided. Specific embodiments

[0037] The preferred embodiments of the present invention will be described in more detail below. Although the preferred embodiments of the present invention are shown, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0038] Example 1

[0039] The high-temperature resistant one-component epoxy adhesive disclosed in this example comprises the following components in parts by weight:

[0040] 45 - 55 parts of modified high-temperature resistant epoxy resin, 25 - 35 parts of linear phenolic epoxy resin, 5 - 10 parts of epoxy-terminated hydroxyl polybutadiene, 5 - 10 parts of diluent, 20 - 30 parts of modified silica powder, 8 - 10 parts of curing agent, 0.1 - 2 parts of accelerator, 0.1 - 1 part of dispersant;

[0041] The parts by weight of the above components can be adjusted according to the actual situation.

[0042] Among them, for the epoxy-terminated hydroxyl polybutadiene, the resin is preferably one or a combination of PB3600 and PB4700 of DAICEL in Japan and EPP-175 of Complex High-Tech Materials (Shanghai) Co., Ltd.

[0043] Among them, the modified high-temperature resistant epoxy resin is prepared by the following method:

[0044] Put 10 - 20 parts of bisphenol A epoxy resin, 40 - 60 parts of bisphenol F epoxy resin, 10 - 20 parts of phenolic epoxy resin, and 30 - 40 parts of trifunctional solid epoxy resin into a reaction kettle, introduce nitrogen, gradually heat up to 100°C - 150°C, stir and react for 2 - 3 h, and vacuum dehydrate. Cool and filter the obtained product to obtain the modified high-temperature resistant epoxy resin;

[0045] The parts by weight of the above bisphenol A epoxy resin, bisphenol F epoxy resin, phenolic epoxy resin, and trifunctional solid epoxy resin can be selected according to the actual situation.

[0046] The modified silica powder is prepared by the following method:

[0047] Add the silanol to the heated silica powder, disperse evenly, stir and react at 80 - 100°C for 1 - 2 h, then vacuum dry at 100 - 110°C for 2 - 3 h, and finally screen to remove the false knot particles and hard agglomerates in the product to obtain the modified silica powder;

[0048] Specifically,

[0049] The selected filler is fused spherical silica powder. The fused spherical silica powder is dynamically heated to 100 - 110 °C to activate the hydroxyl groups (Si-OH) on its surface. This step is the basis for subsequent chemical modification. By heating, the hydroxyl groups on the surface of the silica powder become more active, facilitating the reaction with the silane coupling agent. A suitable silane coupling agent is selected and first hydrolyzed to form silanol. The main function of the silane coupling agent is to improve the interfacial bonding performance between the silica powder and the epoxy resin through surface chemical modification. The specific operation is as follows: The silane coupling agent is dissolved in a mixed solution of ethanol and water with a volume ratio of 9:1.

[0050] The pH value of the solution is adjusted to an acidic condition of about 4, which helps to optimize the hydrolysis and surface reaction conditions of the silane coupling agent.

[0051] The hydrolyzed silane coupling agent is evenly sprayed onto the heated silica powder by the atomization method. The atomization method can ensure sufficient contact between the silane coupling agent and the silica powder, thus achieving uniform dispersion.

[0052] Stir and react at 80 - 100 °C for 1 - 2 hours to promote the formation of chemical bonds between the silane coupling agent and the hydroxyl groups (Si-OH) on the surface of the silica powder. Subsequently, vacuum dry, and finally remove the false knot particles and hard agglomerates in the product to obtain the modified silica powder.

[0053] The curing agent is a dicyandiamide-based latent curing agent, preferably a compound of one or several of SH-300 / SH-500 / SH-900 from Guangzhou Xinxi Metallurgical Chemical Co., Ltd. and OMICURE DDA 5CI / OMICURE DDA10CI from Shenzhen Jiadida New Material Technology Co., Ltd. These curing agents have good toughness and high temperature resistance.

[0054] The accelerator is an accelerator of imidazole adduct and / or modified amine type, preferably a compound of one or several of HT110, MC120D from Guangzhou Guyan and M-30, M-40, M-50 from Changzhou Marigold Resin Co., Ltd.

[0055] In this embodiment, the viscosity of the bisphenol F type epoxy resin is lower than 6000 cps, and the viscosity of the phenolic epoxy resin is lower than 16000 cps. Reducing the viscosity of the bisphenol F type epoxy resin and the phenolic epoxy resin can effectively improve the fluidity of the product and enhance the performance.

[0056] In this embodiment, the particle size of the silica powder is 1200 mesh to 1300 mesh. The silica powder in this particle size range has a low expansion coefficient and good insulation performance, and is preferably 1250 mesh (about 10 μm) in particle size; the silanol is added to the heated silica powder by the atomization method.

[0057] In this embodiment, the diluent is one or a composition of two or more of a long-chain bifunctional toughening diluent and an o-cresyl glycidyl ether diluent.

[0058] In this embodiment, the dispersant is one or a composition of two or more of an epoxy phosphate, a hydroxy-functional carboxylic acid ester, a modified polymer ionic polymer, an unsaturated polyamine amide, and a low molecular weight acidic polyester salt solution.

[0059] The preparation method of the above high-temperature resistant one-component epoxy adhesive is characterized by including the following steps:

[0060] Step 1: Mix the formulated amount of modified high-temperature resistant epoxy resin, linear phenolic epoxy resin, epoxidized hydroxyl-terminated polybutadiene, and diluent and stir evenly at 20°C to 40°C to avoid premature reaction caused by overheating of the material, and obtain a first mixed material;

[0061] By precisely controlling the stirring speed and temperature, ensure the uniform mixing of the basic resin system, and at the same time avoid side reactions of the material due to overheating.

[0062] Step 2: Add modified silicon micropowder to the first mixed material to make the modified silicon micropowder completely wet with the first mixed material, start stirring and evacuate for 1 to 3 hours to mix evenly, control the mixing temperature at 20 to 40°C to avoid premature reaction caused by overheating of the material, and the vacuum degree is below -0.1 mpa;

[0063] Step 3: Add a curing agent, a promoter, and a dispersant, mix evenly under vacuum conditions, lower the temperature to below 30°C, and continue stirring for 1 to 3 hours to obtain a high-temperature resistant one-component epoxy adhesive.

[0064] In Step 1, first perform the first dispersion at a revolution speed of 25 Hz / minute, and then perform the second dispersion at a stirring speed of 15 Hz / minute under vacuum conditions;

[0065] In Step 2, after adding the modified silicon micropowder, first stir at a stirring speed of 10 Hz / min for 5 to 10 minutes, scrape the cylinder wall once, if there is more modified silicon micropowder, add the modified silicon micropowder in portions, and wait until the modified silicon micropowder is completely wet with the first mixed material.

[0066] Application of the obtained high-temperature resistant one-component epoxy adhesive in precision components.

[0067] Effect verification

[0068] To further illustrate the performance of the one-component epoxy adhesive of the present invention, the following experiments are carried out:

[0069] Preparation of high-temperature resistant one-component epoxy adhesives in Experimental Examples 1 to 3 and Comparative Examples 1 to 2:

[0070] (1) Stir the modified high-temperature resistant epoxy resin, linear phenolic resin, hydroxyl-terminated polybutadiene epoxy, diluent, and curing agent at 20 - 40 °C for 20 min under vacuum.

[0071] (2) Add modified silica powder to the system obtained in step (1), and continue stirring at 20 - 40 °C for 2 h under vacuum until evenly mixed, then cool down to 35 °C.

[0072] (3) Then add 8 - 10 parts of curing agent, accelerator, and 0.1 - 1 part of dispersant, mix evenly at a temperature below 30 °C under vacuum conditions, and continue stirring for 2 h. After stirring evenly, it can be discharged.

[0073] The raw materials and their dosages (wt%) used in Experimental Examples 1 - 3 and Comparative Examples 1 - 2 are shown in Table 1;

[0074] Among them, the steps for preparing the self-made modified high-temperature resistant epoxy resin in Table 1 are as follows: Mix 40 - 60 parts of bisphenol F (viscosity 6000 cps) epoxy resin, 10 - 20 parts of phenolic resin (viscosity below 16000 cps), 10 - 20 parts of bisphenol A, and 30 - 40 parts of solid trifunctional epoxy resin in a certain proportion, put them into a reaction kettle, introduce nitrogen for vacuum dehydration and stirring for 2 hours, slowly heat up to 100 - 150 °C, start heat preservation and keep stirring evenly, cool down to below 30 °C, and discharge to obtain the modified high-temperature resistant epoxy resin.

[0075] The steps for preparing the self-made modified silica powder are as follows: Dynamically heat the silica powder to 100 - 110 °C, hydrolyze the silane coupling agent to generate silanol, use an ethanol or water mixed solution (volume ratio 9:1) to adjust its pH value to about 4. Add the hydrolyzed silane to the heated silica powder by atomization method to ensure uniform dispersion. Stir and react at 80 - 100 °C for 1 - 2 hours, and finally dry under vacuum at 105 °C for 2 hours. Remove false knot particles and hard agglomerates by screening to ensure the quality of the powder.

[0076] Table 1

[0077]

[0078]

[0079] The test standard for viscosity of experimental results refers to GBT15357 - 2014;

[0080] The test standard for curing shrinkage rate refers to GB / T 533 - 2008;

[0081] The test standard for shear strength refers to GB / T 7124 - 2008;

[0082] Test standard reference for TG point: GB / T 19466.2-2004;

[0083] Test standard reference for hardness: GB / T 531.1-2008;

[0084] Test standard reference for thermal shock test: GB / T 2423.2-2008; Test standard reference for high temperature and high humidity (double 85°C) test: GB / T 2423.3-2006. The performance test results of the products obtained in Experimental Examples 1-3 are shown in Table 2;

[0085] Table 2

[0086]

[0087] Compared with Comparative Examples 1-2, the modified high-temperature resistant epoxy resin prepared in Experimental Examples 1-3 can improve the TG point of the epoxy resin adhesive, and there are no cracking and corrosion phenomena in the thermal shock test and high temperature and high humidity test, showing excellent thermal stability and weather resistance. The addition of epoxy ring-oxidized hydroxyl-terminated polybutadiene can improve the toughness of the epoxy adhesive, improve the adhesion, and have a high shear strength at high temperature (150°C); the addition of modified silica powder can reduce the viscosity, facilitate dispersion, and have a low shrinkage rate of the epoxy resin adhesive, and at the same time, the thermal expansion coefficient is improved compared with conventional silica powder (<50 ppm / °C).

[0088] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-temperature resistant one-component epoxy adhesive, characterized in that, It comprises the following components in parts by weight: 45 - 55 parts of modified high - temperature resistant epoxy resin, 25 - 35 parts of linear phenolic epoxy resin, 5 - 10 parts of epoxidized hydroxyl - terminated polybutadiene, 5 - 10 parts of diluent, 20 - 30 parts of modified silica powder, 8 - 10 parts of curing agent, 0.1 - 2 parts of accelerator, 0.1 - 1 part of dispersant; The modified high - temperature resistant epoxy resin is prepared by the following method: Put 10 - 20 parts of bisphenol A epoxy resin, 40 - 60 parts of bisphenol F epoxy resin, 10 - 20 parts of phenolic epoxy resin, and 30 - 40 parts of trifunctional solid epoxy resin into a reaction kettle, introduce nitrogen, gradually heat up to 100℃ - 150℃, stir and react for 2 - 3 h, and vacuum - dehydrate, then cool and filter the obtained product to get the modified high - temperature resistant epoxy resin; The modified silica powder is prepared by the following method: Hydrolyze the silane coupling agent to generate silanol, adjust the pH value of the silanol to 3 - 5 using water or ethanol, and heat the silica powder to 100℃ - 110℃; Add the silanol to the heated silica powder, disperse evenly, stir and react at 80℃ - 100℃ for 1 - 2 h, then vacuum - dry at 100℃ - 110℃ for 2 - 3 h, and finally screen to remove the false - knot particles and hard agglomerates in the product to get the modified silica powder; The curing agent is a dicyandiamide - type latent curing agent; The accelerator is an imidazole adduct and / or an accelerator of modified amine type.

2. The high-temperature resistant one-component epoxy adhesive according to claim 1, characterized in that, The viscosity of the bisphenol F epoxy resin is lower than 6000 cps.

3. The high-temperature resistant one-component epoxy adhesive according to claim 1, wherein The viscosity of the phenolic epoxy resin is lower than 16000 cps.

4. The high-temperature resistant one-component epoxy adhesive according to claim 1, wherein The particle size of the silica powder is 1200 - 1300 mesh.

5. The high-temperature resistant one-component epoxy adhesive according to claim 1, wherein, The silanol is added to the heated silica powder by atomization method.

6. The high-temperature resistant one-component epoxy adhesive according to claim 1, wherein The diluent is one or a combination of two or more of long - chain bifunctional toughening diluent and o - toluidyl glycidyl ether diluent.

7. The high-temperature resistant one-component epoxy adhesive according to claim 1, wherein The dispersant is one or a combination of two or more of epoxy phosphate, hydroxyl - functional carboxylic acid ester, modified polymer ionic polymer, unsaturated polyamine amide, and low - molecular - weight acidic polyester salt solution.

8. The preparation method of the high-temperature resistant one-component epoxy adhesive according to any one of claims 1 to 7, characterized in that, It includes the following steps: Step 1: Mix the formulated amounts of modified high - temperature resistant epoxy resin, linear phenolic epoxy resin, epoxidized hydroxyl - terminated polybutadiene, and diluent and stir evenly at 20℃ - 40℃ to obtain the first mixed material; Step 2: Add the modified silica powder to the first mixed material to make the modified silica powder completely wet with the first mixed material, start stirring and vacuumize for 1 - 3 h to mix evenly, control the mixing temperature at 20℃ - 40℃, and the vacuum degree is below - 0.1 mpa; Step 3: Add the curing agent, accelerator, and dispersant, mix evenly under vacuum conditions, lower the temperature to below 30℃, and continue stirring for 1 - 3 h to obtain the high - temperature resistant one - component epoxy adhesive.

9. The preparation method of the high-temperature resistant one-component epoxy adhesive according to claim 8, characterized in that, In Step 1, first disperse for the first time at a revolution speed of 25 Hz / minute, and then disperse for the second time at a stirring speed of 15 Hz / minute under vacuum conditions; In Step 2, after adding the modified silica powder, first stir at a stirring speed of 10 Hz / min for 5 min to 10 min, scrape the cylinder wall once. If there is more modified silica powder, add the modified silica powder in portions until the modified silica powder is completely wetted with the first mixed material.

10. Application of the high-temperature resistant one-component epoxy adhesive according to any one of Claims 1 to 7 in precision components.

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