Software and hardware cooperative heat dissipation control system of vehicle MicroLED digital headlight

Abstract

The invention relates to a software and hardware cooperative heat dissipation control system of a vehicle MicroLED digital headlamp, which remarkably improves the heat export efficiency of core components such as a MicroLED and an FPGA through a copper embedding process of a light source plate and an FPGA plate, an optimized multi-stage heat conduction structure and tight attachment of the light source plate and the FPGA plate and a radiator. The efficient heat dissipation is combined with the PID cooperative control strategy based on the FPGA, the heat dissipation fan can be accurately adjusted in real time, different working conditions are dynamically adapted, and the system temperature is strictly controlled within the optimal working interval. According to the invention, light decay, color cast and service life shortening caused by overheating of the MicroLED are avoided, and performance reduction or damage possibly caused by high temperature of the chip is controlled, so that the long-term working reliability and the service life of the whole digital headlamp system are greatly improved; meanwhile, the stable temperature environment ensures that the MicroLED can continuously output high-brightness and high-precision light beams and projection images, various advanced functions of the digital headlamp are guaranteed, and optimal balance of heat dissipation performance and power consumption is achieved through an automatic fan speed regulation strategy.

Description

Technical Field

[0001] The present invention relates to the technical field of headlamp heat dissipation, and particularly to a software and hardware collaborative heat dissipation control system for a vehicle-mounted MicroLED digital headlamp. Background Art

[0002] With the rapid development of the automotive industry and the advancement of the digital wave, vehicle lighting systems have evolved from traditional basic lighting functions to core components integrating advanced driver assistance, personalized interaction, safety warning and other functions. Among them, digital, high-resolution vehicle headlamps, especially digital headlamps based on micro light-emitting diode (MicroLED) technology, are becoming the focus of industry research and development due to their excellent performance and design flexibility. However, in the process of applying MicroLED technology to vehicle digital headlamps and realizing their full potential, the existing technology still faces many challenges, especially bottlenecks in meeting strict automotive-grade requirements, achieving miniaturized packaging, and efficient heat dissipation.

[0003] 1. Requirements of MicroLED digital headlamps for lighting control and display functions: Compared with traditional LED or halogen headlamps, MicroLED digital headlamps can achieve unprecedented lighting accuracy and display diversity through densely integrated micron-level pixel points. This includes: (1) Ultra-high-resolution adaptive driving beam (ADB) and precise area dimming: MicroLED technology enables independent control of tens of thousands or even hundreds of thousands of pixel points, allowing the ADB system to extremely precisely block oncoming or forward vehicles while maximizing the driver's field of view, greatly improving night driving safety. (2) Complex information projection and personalized interaction: MicroLED headlamps can directly project navigation instructions, safety warning icons, lane markings, welcome animations, and even low-resolution images onto the road surface to achieve a new interaction mode between the vehicle and the environment, and the vehicle and people. (3) Millisecond-level dynamic response and seamless switching: Complex road conditions and driving scenarios require the light pattern and projection content of the headlamp to have extremely high dynamic response speed and smooth switching, which poses a severe test to the processing ability of the control system and the transient response of the light source.

[0004] 2. Challenges of MicroLED Technology in Miniaturized and High-Brightness Applications: MicroLEDs are highly favored for their advantages such as high brightness, high contrast, low power consumption, and long lifespan. However, in scenarios like automotive headlights that require high power density and miniaturization, its challenges are particularly prominent: (1) Contradiction between extremely high pixel density and heat dissipation: To achieve the high resolution required for digital headlights, MicroLED chips need to be arranged at an extremely high density. This high-density integration leads to a sharp accumulation of heat per unit area, forming local hotspots, which poses a severe challenge to the heat dissipation system. (2) Sensitivity of light efficiency to junction temperature: The luminous efficiency, brightness, and color coordinates of MicroLEDs are highly sensitive to their operating junction temperature. If poor heat dissipation causes the junction temperature to be too high, it will not only cause light decay and color shift, shortening the service life, but in severe cases, it may even cause permanent damage to the chip, affecting driving safety. (3) Constraints of miniaturized design on heat dissipation space: The internal space of automotive headlight assemblies is limited, and there is an extremely high requirement for the miniaturization of MicroLED lighting modules. This further compresses the design space for the heat dissipation system, making it difficult for traditional heat dissipation methods to cope.

[0005] 3. Limitations of Existing Heat Dissipation Solutions in MicroLED Digital Headlight Applications: For the heat dissipation of LEDs, existing technologies mainly include passive heat dissipation and active heat dissipation. However, in the context of high-performance MicroLED digital headlight applications, these solutions all have deficiencies: (1) Bottleneck in passive heat dissipation efficiency: Traditional passive heat dissipation methods such as heat sinks and heat pipes have a large thermal resistance when dealing with the extremely high heat flux density of MicroLED modules, and the heat dissipation efficiency is difficult to meet the requirements, especially within the compact lamp volume. (2) Complexity and additional cost of active heat dissipation: Although using active heat dissipation methods such as fans and liquid cooling can improve the heat dissipation effect, it will introduce additional structural complexity, noise, power consumption, and cost, and pose higher requirements for the reliability and maintainability of the system. (3) Lack of thermal management that dynamically coordinates with the light source state: Most existing heat dissipation strategies are controlled based on fixed thresholds or simple temperature feedback, and fail to fully combine the real-time operating state of MicroLED light sources (such as drive current, lit area, display content complexity) and external environmental factors (such as ambient temperature, vehicle speed) for refined and dynamic thermal management. This results in either excessive heat dissipation causing energy waste or insufficient heat dissipation affecting performance and lifespan.

[0006] 4. The existing software and hardware control architecture is difficult to support efficient collaborative heat dissipation: The complex functions and stringent heat dissipation requirements of MicroLED digital headlights also pose new challenges to the software and hardware architecture of the control system: (1) Insufficient hardware computing power and real-time performance: Traditional vehicle headlight controllers (such as MCUs) may face computing power bottlenecks and response delays when processing high-resolution image data, real-time light pattern algorithms, and complex collaborative heat dissipation strategies. (2) Disconnection between software control logic and heat management: The lighting control logic and heat dissipation control logic of the headlights are often developed as independent modules, lacking in-depth data interaction and collaborative optimization mechanisms. For example, it is impossible to adjust the display strategy or light source drive parameters in advance according to the predicted heat dissipation pressure. (3) Low degree of integration of perception and control: The information integration and closed-loop control between environmental perception units such as temperature sensors and light sensors and MicroLED drive units and heat dissipation execution units are not tight enough, making it difficult to achieve system-level energy efficiency and thermal efficiency optimization.

[0007] Therefore, when developing high-performance and miniaturized vehicle-use MicroLED digital headlights in the existing technology, the following problems generally exist: The huge heat dissipation pressure brought by the high pixel density of the MicroLED module is difficult to be effectively solved in a limited space; Traditional heat dissipation technologies cannot meet the requirements of MicroLED for precise and dynamic thermal management; There is a lack of an effective software and hardware collaborative mechanism between the lighting control system and the thermal management system, resulting in the inability to dynamically optimize the working state according to real-time working conditions and heat dissipation requirements, and it is difficult to balance the optical performance, reliability, energy efficiency, and cost of the headlights. These problems limit the performance and popularization of MicroLED digital headlights, and there is an urgent need for a new type of software and hardware collaborative heat dissipation control system to overcome the above challenges. Summary of the Invention

[0008] In view of the above problems, a software and hardware collaborative heat dissipation control system for vehicle-use MicroLED digital headlights is proposed, which adopts a light source board and an FPGA control board with a copper-embedded process and optimized welding to enhance heat conduction, and combines a radiator assembly to achieve effective heat dissipation. The system monitors the MicroLED temperature in real time through the FPGA, and combines the core processing unit and the PID control algorithm to adaptively adjust the rotation speed of the heat dissipation fan, thereby effectively managing the heat of the MicroLED and the FPGA itself, and ensuring the temperature stability and working reliability of the digital headlights under harsh working conditions such as high temperature.

[0009] The technical solution of the present invention is: A software and hardware collaborative heat dissipation control system for vehicle-use MicroLED digital headlights, comprising a light source board, an FPGA control board, and a radiator assembly;

[0010] The light source board: MicroLED chips are mounted on the light source board using the copper-embedded process. The light source board is welded to the FPGA control board which also uses the copper-embedded process. The heat generated by the MicroLEDs is laterally diffused through the copper-embedded light source board and conducted to the copper-embedded FPGA control board. A MicroLED temperature sensor is integrated on or near the light source board to monitor the operating temperature of the MicroLED chips in real time and feed the data back to the FPGA control board;

[0011] The FPGA control board: The hot spot area of the FPGA control board is in close contact with this radiator, and the heat is smoothly transferred to the radiator. The core processing unit in the FPGA control board outputs a real-time adjustment signal to the cooling fan through the PID control module according to the temperature data, the preset algorithm, and the vehicle status information;

[0012] The radiator assembly: It is made of a metal material with a high thermal conductivity coefficient. A cooling fan is installed on the radiator to form an active air-cooling system. The radiator status sensor collects information and feeds it back to the FPGA control board.

[0013] Preferably, the light source board is provided with designed welding pads for the electrical connection of the MicroLED chips and driving elements. The light source board is firmly mounted on the FPGA control board by welding through the welding pads, and there are large-area heat-conducting pads corresponding to the back sides of the welding pads. The welding pads form an efficient heat conduction bridge from the light source board to the FPGA control board.

[0014] Preferably, the FPGA control board: uses a high-thermal-conductivity PCB substrate, and the copper-embedded process is implemented in the area under the FPGA chip and receiving the heat from the light source board to enhance the board-level heat conduction and diffusion capabilities; the back side of the FPGA control board corresponding to the copper-embedded process area is set as the radiator installation area, and this area is in close contact with the main radiator through a high-thermal-conductivity interface material to ensure that the heat generated by the FPGA itself and the heat transferred from the light source board can be efficiently transferred to the radiator.

[0015] Preferably, the radiator in the radiator assembly has a large-surface-area heat sink fin array to facilitate heat exchange with the air; a cooling fan is installed on the radiator, and its rotation speed is driven by the instruction output by the FPGA control board according to the real-time temperature and the control algorithm, and the heat dissipation effect is enhanced through forced convection; the radiator status sensor monitors the fan rotation speed or the radiator temperature and inputs it as a feedback signal to the FPGA control board for closed-loop control or system diagnosis.

[0016] A software and hardware collaborative heat dissipation control method for a vehicle-mounted MicroLED digital headlight. In the software and hardware collaborative heat dissipation control system of the vehicle-mounted MicroLED digital headlight described in claim 4, a URAT interface, SRAM, a data preprocessing module, a MicroLED temperature detection module, an FPGA core processing unit, and a radiator speed PID control module are integrated on the FPGA control board. The data of the MicroLED temperature sensor and the radiator status sensor are input into the FPGA core processing unit through the URAT interface. Inside the FPGA core processing unit, the data is first processed by the data preprocessing module and the MicroLED temperature detection module. Subsequently, the core processing unit makes an automated decision in combination with the vehicle information stored in the SRAM, generates a heat dissipation control strategy, and converts it into a regulation instruction by the radiator speed PID control module. Finally, the regulation instruction is output to the execution unit through another URAT interface to drive the radiator motor to adjust its working state, thereby efficiently dissipating heat from the MicroLED light-emitting panel. At the same time, the radiator status sensor data is fed back to the FPGA core processing unit.

[0017] Furthermore, the control target output by the FPGA core processing unit directly uses the preprocessed temperature deviation as the input of the radiator speed PID control module. In the radiator speed PID control module, the PID controller calculates the precise control quantity through PID operation according to the deviation between the current actual temperature and the target temperature. This control quantity is converted into the duty cycle of the PWM signal for driving the radiator fan and sent to the radiator fan driving motor.

[0018] Furthermore, the PID parameters in the PID controller are adaptively adjusted according to different working conditions or instructions of the core.

[0019] An application of a software and hardware collaborative heat dissipation control method for a vehicle-mounted MicroLED digital headlight. The software and hardware collaborative heat dissipation control method for the vehicle-mounted MicroLED digital headlight described above is adopted and used for the headlight controller to process high-resolution image data and real-time light patterns.

[0020] The beneficial effects of the present invention are as follows: The software and hardware collaborative heat dissipation control system of the vehicle-mounted MicroLED digital headlamp of the present invention significantly improves the heat dissipation efficiency of core components such as MicroLED and FPGA through the copper-embedded process of the light source board and the FPGA board, the optimized multi-stage heat conduction structure, and the close fit with the radiator. The combination of this efficient heat dissipation and the PID collaborative control strategy based on FPGA can accurately adjust the cooling fan in real time, dynamically adapt to different working conditions, and strictly control the system temperature within the optimal working range. The present invention not only avoids the light decay, color deviation, and shortened lifespan caused by overheating of MicroLED, but also controls the performance degradation or damage that may occur to the chip due to high temperature, thereby greatly improving the long-term working reliability and service life of the entire digital headlamp system; at the same time, the stable temperature environment ensures that MicroLED can continuously output high-brightness and high-precision light beams and projection images, guaranteeing the advanced functions of the digital headlamp, and achieving an optimized balance between heat dissipation performance and power consumption through an automated fan speed regulation strategy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a framework diagram of the software and hardware collaborative control system of the vehicle-mounted digital headlamp of the present invention;

[0022] Figure 2 is a schematic diagram of the hardware design of the MicroLED digital vehicle lamp of the present invention;

[0023] Figure 3 is a schematic diagram of the heat dissipation design of the light source board of the present invention;

[0024] Figure 4 is a schematic diagram of the heat dissipation design of the FPGA board of the present invention;

[0025] Figure 5 is a flowchart of the system operation of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation manners and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0027] As Figure 1The framework diagram of the software and hardware co - operating control system of the vehicle - used digital headlight of the present invention is shown. The system is monitored and configured through a PC host computer, and the data of the MicroLED temperature sensor and the radiator status sensor are collected in real time. These data are input into the FPGA core processing unit through the URAT interface. Inside the FPGA, the data are first processed by the data pre - processing module and the MicroLED temperature detection module. Subsequently, the core processing unit makes an automated decision in combination with the vehicle setting information stored in the SRAM, generates a heat dissipation control strategy, and converts it into a regulation instruction by the radiator speed PID control module. Finally, the regulation instruction is output to the execution unit through another URAT interface to drive the radiator motor to adjust its working state, so as to efficiently dissipate heat from the MicroLED light - emitting panel. At the same time, the data of the radiator status sensor are fed back to the FPGA core processing unit. Figure 1 The input URAT interface, SRAM, data pre - processing module, MicroLED temperature detection module, FPGA core processing unit, radiator speed PID control module, and output URAT interface constitute the FPGA - based software and hardware co - operating module. The entire architecture embodies the idea of software and hardware co - design, aiming to achieve adaptive, real - time, and efficient management of the temperature of the MicroLED light - emitting panel.

[0028] As Figure 2 The schematic diagram of the hardware design of the MicroLED digital vehicle headlight is shown. The hardware system of this vehicle - used MicroLED digital headlight is carefully designed to achieve efficient heat dissipation and stable performance. Its core physical components include a light source board, an FPGA control board, and a radiator, which are tightly integrated through specific processes and connection methods.

[0029] Light Source Board: This board is the core of lighting and display, on which a MicroLED array (i.e., the "MicroLED light - emitting panel") is mounted with high density. To optimize the heat conduction performance, the light source board itself adopts a copper - inlay process, enhancing the heat diffusion ability within its plane. A MicroLED temperature sensor is integrated on the board or in its vicinity to monitor the working temperature of the MicroLED chips in real time and feed the data back to the FPGA control board.

[0030] FPGA Control Board: As the control center of the system (corresponding to Figure 1The FPGA-based hardware and software co - operation module), and this control board also adopts the copper - inlay process to improve the overall heat conduction and heat dissipation performance. The light source board is firmly connected and installed on the FPGA control board by welding. This connection not only ensures the reliable transmission of electrical signals but also provides an effective conduction path for the heat generated by the MicroLED. The FPGA chip itself and its surrounding high - power components ensure the efficient conduction of the heat generated by them through an excellent heat dissipation interface design. This board integrates components including a URAT interface, SRAM, a data pre - processing module, a MicroLED temperature detection module, a core processing unit, and a radiator speed PID control module, etc.

[0031] Heatsink: This is an efficient passive heat dissipation component, usually made of a metal material with a high thermal conductivity (such as aluminum alloy) and designed with dense heat dissipation fins. The key is that the FPGA control board (together with the light source board welded on it) enables the FPGA chip area or specific hot - spot areas of the entire circuit board to be closely attached to this heatsink through a specific structural design, ensuring that heat can smoothly transfer from the FPGA and the heat of the MicroLED conducted through the FPGA board to the heatsink. To further enhance the heat dissipation effect, a cooling fan is also installed on the heatsink, forming an active air - cooling system. The heatsink status sensor (such as a fan speed sensor) will also feedback information to the FPGA control board.

[0032] Overall hardware structure and collaborative heat dissipation workflow: In terms of physical structure, the MicroLED chip is mounted on a light source board using a copper-embedded process. The light source board is then welded to the FPGA control board, which also uses a copper-embedded process. The FPGA control board (especially the heat-generating area such as the FPGA chip) fits tightly with the large heat sink. This design forms an efficient heat dissipation path: the heat generated by the MicroLED is first quickly diffused laterally through the copper-embedded light source board and conducted to the copper-embedded FPGA control board. Then, this concentrated heat, together with the heat generated by the FPGA itself, is quickly transferred to the radiator through the contact surface with the radiator, and is finally taken away by the heat dissipation fins and the cooling fan. When working, the MicroLED emits light to generate heat, and the temperature sensor transmits real-time temperature data to the FPGA control board. The core processing unit in the FPGA control board adjusts the speed of the cooling fan in real time through the PID control module based on these temperature data, preset algorithms, and possible other vehicle status information. For example, when the temperature rises, the fan speed is increased to enhance heat dissipation; when the temperature is low or the load is not high, the fan speed is reduced to save energy and reduce noise, thereby dynamically ensuring the temperature stability and optical performance of the entire digital car light system under various working conditions. The PC host can be used for monitoring and configuration. This hardware and software collaborative design, which uses copper embedding technology to strengthen the heat conduction path and combines FPGA real-time active air cooling control, is the key to ensuring the long-term and reliable operation of high-performance MicroLED digital headlights.

[0033] like Figure 3 Schematic diagram of the heat dissipation design of the light source board shown: The heat dissipation design of the light source board in the present invention focuses on efficiently exporting the heat generated by the MicroLED when it is working, and its core lies in the use of advanced copper embedding technology. Specifically, the MicroLED chip is mounted on the optimized layout area on the front of the light source board, and a large area of copper embedding is implemented on the back of the light source board corresponding to the position of the MicroLED and the main heating components. This copper embedding structure not only greatly enhances the lateral heat dissipation ability of the board itself and quickly disperses local hot spots, but also constructs an efficient longitudinal heat conduction channel, so that heat can be quickly transferred from the MicroLED to the back of the board. With the carefully designed multifunctional welding pad that takes into account both electrical connection and heat conduction, the light source board can effectively collect heat and prepare for transfer to the next-level circuit board (such as the FPGA control board) and the final radiator, forming the key starting link of the entire digital car light cooling system.

[0034] like Figure 4Schematic diagram of the heat dissipation design of the FPGA board shown: The heat dissipation design of the FPGA control board in the present invention undertakes dual heat dissipation responsibilities: it not only needs to efficiently manage the heat generated by the FPGA chip and other high-power components on the board, but also serves as a key channel for the heat transferred from the light source board. For this purpose, the FPGA board adopts a copper-embedded process to significantly improve the overall thermal conductivity, and optimizes the contact interface with the light source board welded on it to ensure smooth heat conduction. A large area of "heat sink position" is specially planned on its back, which is closely attached to the main heat sink through a high-thermal-conductivity interface material, so as to efficiently transfer the heat generated by the FPGA itself and conducted from the light source board to the final heat dissipation unit. Combined with the temperature monitoring and heat dissipation fan control logic integrated on the board, this FPGA board constitutes the core hub of heat management and dynamic regulation in the entire digital vehicle lamp system, effectively ensuring the stable operation of the system under high load.

[0035] I. Composition of the hardware system:

[0036] It mainly includes a MicroLED light-emitting module, a light source board, an FPGA control board, and a heat sink assembly:

[0037] MicroLED light-emitting module (light source core): The MicroLED light-emitting module is the light source and the main heat-generating unit of the digital headlamp, which is composed of an array of micron-scale light-emitting diode (MicroLED) chips arranged in a high density. These MicroLED chips are directly welded and mounted on the light source board. A MicroLED temperature sensor is integrated on the light source board to accurately monitor the operating temperature of the MicroLED array in real time. This temperature signal is a key input for the heat control algorithm. And the temperature data is transmitted to the FPGA control board through the light source board via a communication protocol.

[0038] Light source board (efficient heat conduction): The light source board is a key component that bears the MicroLED chips and realizes preliminary heat management. Substrate and copper-embedded process: The light source board uses a PCB substrate material with a high thermal conductivity coefficient. To enhance the thermal conductivity, a copper-embedded process is implemented on the back of the light source board corresponding to the MicroLED placement positions and other potential hot spots. The embedded copper blocks or thick copper layers significantly improve the lateral heat equalization ability and longitudinal heat conduction efficiency of the board, quickly conducting the heat generated by the MicroLEDs from the front to the back of the board and evenly diffusing it.

[0039] Electrical and heat conduction interface: The light source board is equipped with precisely designed welding pads, which are not only used for the electrical connection of MicroLED chips and driving elements, but more importantly, the light source board is firmly mounted on the FPGA control board by welding through these pads (especially the large-area heat-conducting pads on the back). These welding points constitute an efficient heat conduction bridge from the light source board to the FPGA control board.

[0040] FPGA Control Board (Core Control and Heat Relay): The FPGA control board is the core controller of the entire system and an important relay for heat transfer.

[0041] Core Controller: An FPGA (Field Programmable Gate Array) chip is integrated on the board as the main controller. The internal logic resources of the FPGA are used to implement data acquisition, signal preprocessing, core processing unit, PID temperature control algorithm, and control of peripheral interfaces, etc. SRAM is also integrated on the board for data caching.

[0042] Substrate and Copper Inlay Process: Similar to the light source board, the FPGA control board also uses a high - thermal - conductivity PCB substrate and implements the copper inlay process in key areas (such as below the FPGA chip and the area that receives the heat from the light source board) to enhance the board - level heat conduction and diffusion capabilities.

[0043] Interfaces: The FPGA control board is equipped with multiple URAT (Universal Asynchronous Receiver / Transmitter) interfaces, which are used to receive data from MicroLED temperature sensors and radiator status sensors, and can communicate with the PC host computer for system debugging, parameter configuration, and status monitoring.

[0044] Heat Reception and Transfer: The light source board is welded to a specific area of the FPGA control board, and heat is transferred to the FPGA control board through the solder joints. The back of the FPGA control board corresponding to the area where the copper inlay process is implemented is set as the radiator installation area ( Figure 4 ), and this area is closely attached to the main radiator through a high - thermal - conductivity interface material to ensure that the heat generated by the FPGA itself and the heat transferred from the light source board can be efficiently transferred to the radiator.

[0045] Radiator Assembly (Final Heat Dissipation): The radiator assembly is the unit responsible for the final heat dissipation task.

[0046] Radiator Body: Usually made of high - thermal - conductivity metal materials such as aluminum alloy, it has a large - surface - area heat sink fin array to facilitate heat exchange with air.

[0047] Active Cooling Fan: A cooling fan (radiator drive motor) is installed on the radiator, and its rotation speed is driven by the instructions output by the FPGA control board according to the real - time temperature and control algorithm to enhance the heat dissipation effect through forced convection.

[0048] Radiator Status Sensor: A sensor can be equipped to monitor the fan rotation speed or radiator temperature, which is input to the FPGA control board as a feedback signal for closed - loop control or system diagnosis.

[0049] II. Heat Control Algorithm (Core of Software - Hardware Collaboration)

[0050] The heat control algorithm runs inside the FPGA chip of the FPGA control board, achieving deep cooperation between software and hardware. The main steps are as follows:

[0051] 1. Real-time temperature data acquisition and preprocessing: The FPGA periodically reads temperature data from the MicroLED temperature sensors on the light source board through the URAT interface. The raw data read may be preprocessed through digital filtering, linearization calibration, etc. to improve data accuracy.

[0052] 2. Precise adjustment of the fan speed by the PID controller: The control target output by the core processing unit (or directly use the temperature deviation after preprocessing) is used as the input of the PID (Proportional-Integral-Derivative) controller. The PID controller calculates the precise control quantity u(t) based on the deviation e(t) between the current actual temperature and the target temperature (or control target) through PID operation where K p 、K i 、K d are the PID proportional, integral, and derivative parameters), and the control quantity u(t) is usually converted into the duty cycle of the PWM (Pulse Width Modulation) signal for driving the cooling fan. The PID parameters can be adaptively adjusted according to different working conditions or instructions from the core.

[0053] 3. Closed-loop feedback and dynamic optimization: The FPGA outputs a PWM signal to drive the cooling fan. The change in the fan speed directly affects the heat dissipation efficiency, and then changes the temperature of the MicroLED. The new temperature is collected by the sensor and fed back to the FPGA, forming a dynamic closed-loop control system. The core processing unit can continuously learn and optimize its decision-making model, and the PID parameters can also be dynamically adjusted, enabling the entire heat dissipation control system to adapt to various complex and dynamically changing external environments and internal working states.

[0054] III. Example of the system working process( Figure 5 )

[0055] 1. When the system is powered on, the MicroLED digital headlight starts to work, and the MicroLED array emits light and generates heat.

[0056] 2. The heat is conducted through the copper-embedded layer and thermal conductive pads of the light source board to the copper-embedded layer of the FPGA control board. At the same time, the FPGA chip itself also generates heat due to operation. These heats are finally collected and transferred to the main radiator closely attached to the back of the FPGA control board.

[0057] 3. The MicroLED temperature sensors on the light source board continuously monitor the temperature and send the data to the FPGA through the URAT interface.

[0058] 4. The data preprocessing module inside the FPGA processes the received temperature data.

[0059] 5. The core processing unit analyzes the current temperature, historical data, and possible other inputs to generate a heat dissipation control decision.

[0060] 6. The PID controller calculates the PWM duty cycle of the fan according to the temperature deviation.

[0061] 7. The FPGA outputs the PWM signal to the heat dissipation fan drive circuit to adjust the fan speed.

[0062] 8. The change in the fan speed affects the heat dissipation capacity of the radiator, thereby changing the temperature of the MicroLED.

[0063] 9. The system continuously repeats steps 3 - 8 to form a closed-loop control, so that the temperature of the MicroLED is stabilized within a preset safe or optimal operating range.

[0064] 10. The PC host computer can communicate with the FPGA through the URAT interface, which is used to monitor the system status, read temperature data, adjust control parameters, or perform firmware upgrades.

[0065] Through the precise design of the above hardware structure (especially the application of the copper-embedded process on the multi-layer PCB board and the optimized heat conduction path) and the cooperative control algorithm running on the FPGA, the present invention realizes the efficient management of the heat of the vehicle-mounted MicroLED digital headlamp, ensuring its optical performance, reliability, and service life under various complex working conditions.

[0066] The above-described embodiments only represent the specific implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A software and hardware collaborative heat dissipation control system for a vehicle-mounted MicroLED digital headlight, characterized in that It includes a light source board, an FPGA control board, and a radiator assembly; For the light source board, MicroLED chips are mounted on the light source board using the copper-embedded process. The light source board is welded to the FPGA control board which also uses the copper-embedded process. The heat generated by the MicroLEDs is laterally diffused through the copper-embedded light source board and conducted to the copper-embedded FPGA control board. A MicroLED temperature sensor is integrated on or near the light source board to monitor the operating temperature of the MicroLED chips in real time and feed the data back to the FPGA control board; For the FPGA control board, the hot spot area of the FPGA control board is closely attached to this radiator, and the heat is smoothly transferred to the radiator. The core processing unit in the FPGA control board outputs a real-time adjustment signal to the cooling fan through the PID control module according to the temperature data, the preset algorithm, and the vehicle status information; For the radiator assembly: It is made of a metal material with a high thermal conductivity coefficient. A cooling fan is installed on the radiator to form an active air-cooling system. The radiator status sensor collects information and feeds it back to the FPGA control board.

2. The software and hardware collaborative heat dissipation control system of the vehicle-mounted MicroLED digital headlamp according to claim 1, wherein, The light source board is provided with designed welding pads for the electrical connection of the MicroLED chips and driving elements. The light source board is firmly mounted on the FPGA control board by welding through the welding pads, and there are large-area heat-conducting pads corresponding to the back sides of the welding pads. The welding pads constitute an efficient heat conduction bridge from the light source board to the FPGA control board.

3. The software and hardware collaborative heat dissipation control system for the vehicle-mounted MicroLED digital headlamp according to claim 1 or 2, characterized in that, For the FPGA control board: It uses a high thermal conductivity PCB substrate, and the copper-embedded process is implemented in the area under the FPGA chip and receiving the heat from the light source board to enhance the board-level heat conduction and diffusion capabilities; The back side of the FPGA control board corresponding to the copper-embedded process area is set as the radiator installation area, and this area is closely attached to the main radiator through a high thermal conductivity interface material to ensure that the heat generated by the FPGA itself and the heat transferred from the light source board can be efficiently transferred to the radiator.

4. The software and hardware collaborative heat dissipation control system of the vehicle-mounted MicroLED digital headlamp according to claim 3, characterized in that, In the radiator assembly, the radiator has a large-surface-area heat sink fin array to facilitate heat exchange with the air; a cooling fan is installed on the radiator, and its rotation speed is driven by the instructions output by the FPGA control board according to the real-time temperature and control algorithm. The heat dissipation effect is enhanced through forced convection; the radiator status sensor monitors the fan rotation speed or the radiator temperature and inputs it as a feedback signal to the FPGA control board for closed-loop control or system diagnosis.

5. A software and hardware collaborative heat dissipation control method for a vehicle-mounted MicroLED digital headlamp, characterized in that, In the software and hardware collaborative heat dissipation control system of the vehicle-mounted MicroLED digital headlamp described in claim 4, a URAT interface, an SRAM, a data preprocessing module, a MicroLED temperature detection module, an FPGA core processing unit, and a radiator speed PID control module are integrated on the FPGA control board. The data of the MicroLED temperature sensor and the radiator status sensor are input into the FPGA core processing unit through the URAT interface. Inside the FPGA core processing unit, the data is first processed by the data preprocessing module and the MicroLED temperature detection module. Subsequently, the core processing unit makes an automated decision in combination with the vehicle information stored in the SRAM, generates a heat dissipation control strategy, and converts it into a regulation instruction by the radiator speed PID control module. Finally, the regulation instruction is output to the execution unit through another URAT interface to drive the radiator motor to adjust its working state, thereby efficiently dissipating heat from the MicroLED light-emitting panel. At the same time, the radiator status sensor data is fed back to the FPGA core processing unit.

6. The software and hardware collaborative heat dissipation control method for the vehicle-mounted MicroLED digital headlamp according to claim 5, characterized in that, The control target output by the FPGA core processing unit is directly used as the input of the radiator speed PID control module with the preprocessed temperature deviation. In the radiator speed PID control module, the PID controller calculates the precise control quantity through PID operation based on the deviation between the current actual temperature and the target temperature. This control quantity is converted into the duty cycle of the PWM signal for driving the cooling fan and sent to the cooling fan drive motor.

7. The software and hardware collaborative heat dissipation control method for the vehicle-mounted MicroLED digital headlamp according to claim 6, characterized in that, The PID parameters in the PID controller are adaptively adjusted according to different working conditions or the instructions of the core.

8. Application of a software and hardware collaborative heat dissipation control method for a vehicle-mounted MicroLED digital headlamp, characterized in that, The software and hardware collaborative heat dissipation control method of the vehicle-mounted MicroLED digital headlamp described in any one of claims 5-7 is adopted for the headlamp controller to process high-resolution image data and real-time light patterns.

Images