Data acquisition system and data acquisition method for electron beam component analysis

Abstract

The invention provides a data acquisition system and a data acquisition method for electron beam component analysis. The data acquisition system comprises a processor, a module power supply and a detector, and the module power supply supplies power to an electron beam regulation and control module; the processor is respectively connected with the module power supply and the detector; the processor sequentially executes a plurality of sampling processes, and in each sampling process, the processor configures a first electrical parameter to the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter to the electron beam regulation and control module; after determining that the module power supply outputs the first electric signal, triggering a detector to sample the electron beam; and receiving a data acquisition completion signal fed back by the detector after the electron beam sampling is completed, so as to trigger to configure a second electrical parameter to the module power supply to execute the next sampling processing. By adopting the data acquisition system, real-time data synchronization and state sharing among equipment in the data acquisition system can be realized, high-efficiency electron beam component analysis data acquisition can be realized, and the applicability is high.

Description

Technical Field

[0001] This application relates to the technical field of data processing, and in particular to a data acquisition system and a data acquisition method for electron beam composition analysis. Background Art

[0002] With the continuous progress and development of electron beam composition analysis technology, electron beam composition analysis systems are increasingly widely used in many fields such as industry, scientific research, biology, and semiconductors. In semiconductor production, electron beam composition analysis based on the reflection of light signals irradiating wafers usually includes links such as collection of samples to be measured, data acquisition, data processing, and result analysis. Among them, the data acquisition link is the basis and key of the entire electron beam composition analysis process.

[0003] In existing electron beam composition analysis, the data acquisition system usually includes a high-voltage source, an electron gun, an analyzer control board, and a detector. The analyzer control board is used to control the electron gun to generate data to be collected under different high-voltage conditions, and the analyzer control board is used to control the detector to perform data acquisition. However, in the prior art, the analyzer control board triggers the electron gun to configure voltage parameters to generate data to be collected through a universal serial bus (USB) interface, and then triggers the detector to perform data acquisition through the USB interface. Therefore, the discrete control architecture of the prior art still has problems such as control delay and lack of status feedback in the coordination mechanism of parameter configuration and sampling trigger, resulting in low data acquisition efficiency. Summary of the Invention

[0004] This application provides a data acquisition system and a data acquisition method for electron beam composition analysis, which can realize real-time mutual transmission of states and data between devices in the data acquisition system, reduce data / state synchronization delay between devices, and further realize real-time data synchronization and state perception between devices in the system, improve the data acquisition efficiency of the data acquisition system, improve the system performance of the data acquisition system, and have high applicability.

[0005] In a first aspect, the present application provides a data acquisition system for electron beam composition analysis. The data acquisition system includes a processor, a module power supply, and a detector. The module power supply is used to supply power to an electron beam control module for regulating the electron beam. The processor is connected to the module power supply and the processor is connected to the detector. The processor is configured to sequentially execute a plurality of sampling processes. In each sampling process, the processor is configured to configure a first electrical parameter for the module power supply, such that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam control module. After confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam. The data acquisition completion signal fed back by the detector after sampling the electron beam is received to trigger the configuration of a second electrical parameter for the module power supply to perform the next sampling process. In the present application, since the data acquisition system can dynamically configure the electrical parameters of the module power supply through the processor, the detector can be triggered to sample the electron beam, and after receiving the feedback signal from the detector, the electrical parameters of the module power supply are switched and configured to perform the next round of sampling. The module power supply can supply power to the electron beam control module, the detector can sample the electron beam, the processor can achieve information inter - transmission between the processor and the module power supply and information inter - transmission between the processor and the detector, and real - time communication between devices can be achieved. Furthermore, real - time control of the module power supply and the detector by the processor can be achieved. In this way, the delay in communication between devices can be reduced, and real - time state perception between devices can be achieved. Therefore, through the closed - loop parameter configuration of the module power supply by the processor and the timing trigger control of the detector, full - automatic sampling switching in multi - parameter dynamic analysis of the electron beam is realized, significantly improving the data acquisition efficiency.

[0006] In a possible implementation manner of the first aspect, the processor includes a first parameter configuration interface, and the first parameter configuration interface is connected to the module power supply. The processor is configured to configure electrical parameters for the module power supply through the first parameter configuration interface to trigger the module power supply to output an electrical signal corresponding to the electrical parameters for the electron beam control module, where one sampling process corresponds to one electrical parameter, and the electrical parameters include the first electrical parameter and the second electrical parameter. In the present application, the electrical parameters can be configured for the module power supply through the first parameter configuration interface of the processor to trigger the module power supply to output an electrical signal corresponding to the electrical parameters for the electron beam control module. By transmitting data through the first parameter configuration interface, the delay in data synchronization between the processor and the module power supply is reduced, real - time triggering of the electrical parameter configuration of the module power supply can be achieved, and further, the configuration efficiency of the electrical parameters of the module power supply can be improved, and further, the power supply efficiency of the module power supply for the electron beam control module can be improved, with high applicability.

[0007] In a possible implementation of the first aspect, the above-mentioned module power supply includes a second parameter configuration interface, and the second parameter configuration interface is connected to the above-mentioned processor; the above-mentioned module power supply is used to receive the above-mentioned electrical parameters from the above-mentioned processor through the above-mentioned second parameter configuration interface, and output an electrical signal corresponding to the above-mentioned electrical parameters to the above-mentioned electron beam control module. In this application, through the second parameter configuration interface of the module power supply, communication can be carried out with the first parameter configuration interface of the above-mentioned processor, the electrical parameters transmitted by the first parameter configuration interface are received, and an electrical signal corresponding to the above-mentioned electrical parameters is output to the above-mentioned electron beam control module to generate an electron beam to be sampled. Data transmission is carried out through the first parameter configuration interface and the second parameter configuration interface, reducing the delay of data synchronization between the processor and the module power supply, improving the communication efficiency between the processor and the module power supply. Similarly, the configuration efficiency of the electrical parameters of the module power supply can be improved, thereby improving the power supply efficiency of the module power supply for the electron beam control module, and having high applicability.

[0008] In a possible implementation of the first aspect, the above-mentioned module power supply further includes a configuration status transmission interface; the above-mentioned configuration status transmission interface is connected to the above-mentioned processor; the above-mentioned module power supply is used to transmit a parameter configuration completion signal to the above-mentioned processor through the above-mentioned configuration status transmission interface after outputting the above-mentioned first electrical signal corresponding to the above-mentioned first electrical parameters to the above-mentioned electron beam control module. In this application, through the configuration status transmission interface of the module power supply, a parameter configuration completion signal can be transmitted to the processor after outputting an electrical signal corresponding to the electrical parameters to the electron beam control module, thereby triggering the processor to execute the next action, realizing real-time status sharing between the module power supply and the processor, reducing the delay of status sharing between devices, and thus improving the data processing efficiency of the system.

[0009] In a possible implementation of the first aspect, the above-mentioned processor further includes a configuration status sensing interface, and the above-mentioned configuration status sensing interface is connected to the above-mentioned module power supply; the above-mentioned processor is used to trigger the above-mentioned detector to sample the above-mentioned electron beam after obtaining the above-mentioned parameter configuration completion signal through the above-mentioned configuration status sensing interface. In this application, the processor can communicate with the configuration status transmission interface of the module power supply through the configuration status sensing interface, receive the parameter configuration completion signal transmitted by the module power supply through the configuration status sensing interface, and can quickly know that the module power supply has completed outputting an electrical signal corresponding to the electrical parameters to the electron beam control module, thereby triggering the detector to sample the electron beam, reducing the delay between the module power supply completing outputting an electrical signal corresponding to the electrical parameters to the electron beam control module and the detector starting to sample the electron beam, and thus improving the data acquisition efficiency of the data acquisition system.

[0010] In a possible implementation of the first aspect, the above-mentioned processor includes a first detection start interface, and the first detection start interface is connected to the above-mentioned detector; the processor is configured to output a detection start signal to the detector through the first detection start interface after confirming that the module power supply outputs the first electrical signal, and the detection start signal is used to trigger the detector to sample the electron beam. In this application, the detection start signal can be output to the detector through the first detection start interface of the processor to trigger the detector to sample the electron beam, which can realize the real-time signal transmission between the processor and the detector, reduce the delay of the detector to start sampling the electron beam, and thus improve the data acquisition efficiency of the data acquisition system.

[0011] In a possible implementation of the first aspect, the above-mentioned detector includes a second detection start interface, and the second detection start interface is connected to the above-mentioned processor; the detector is configured to sample the electron beam after obtaining the detection start signal through the second detection start interface. In this application, the second detection start interface of the detector can communicate with the first detection start interface of the processor and receive the detection start signal transmitted by the first detection start interface. The detector can receive the trigger instruction from the processor through the detection start signal and then start sampling the electron beam, which can respond to the real-time control of the processor on the detector. The direct communication between the detector and the processor interface can reduce the delay of the detector to start sampling the electron beam, and thus improve the data acquisition efficiency of the data acquisition system.

[0012] In a possible implementation of the first aspect, the above-mentioned detector further includes a detection status transmission interface, and the detection status transmission interface is connected to the above-mentioned processor; the detector is configured to send a data acquisition completion signal to the processor through the detection status transmission interface after the electron beam sampling is completed. In this application, the data acquisition completion signal can be output to the processor through the detection status transmission interface of the detector to feedback the data acquisition situation to the processor, which can realize the real-time status sharing between the detector and the processor, reduce the delay of status sharing between devices, and thus improve the data processing performance of the system.

[0013] In a possible implementation of the first aspect, the above-mentioned processor further includes a detection status sensing interface, and the detection status sensing interface is connected to the above-mentioned detector; the processor is configured to, after receiving the data acquisition completion signal through the detection status sensing interface, configure a second electrical parameter for the above-mentioned module power supply to perform the next sampling process. In this application, the processor can communicate with the above-mentioned detector through the detection status sensing interface and receive the data acquisition completion signal transmitted by the detection status transmission interface. The processor can learn from the data acquisition completion signal that the detector has completed the sampling of the electron beam, and then configure the second electrical parameter for the module power supply, which can realize the status sharing among the detector, the processor, and the module power supply. Through the direct communication between the detector and the processor interface, the delay for the processor to learn the data acquisition completion can be reduced, and further the delay for triggering the electrical parameter configuration of the module power supply can be reduced, thereby improving the data acquisition efficiency of the data acquisition system and having high applicability.

[0014] In a possible implementation of the first aspect, the above-mentioned processor includes a first processing unit and a second processing unit; during the above-mentioned sampling process, the first processing unit is configured to issue a voltage regulation instruction to the second processing unit, and the second processing unit is configured to obtain the second electrical parameter according to the voltage regulation instruction, so as to, after receiving the data acquisition completion signal, configure the second electrical parameter for the above-mentioned module power supply to perform the next sampling process. Among them, the first processing unit is a microcontroller, and the second processing unit is a programmable gate array. In this application, through the division of labor and cooperation between the first processing unit and the second processing unit in the processor, gapless voltage regulation and spectrum acquisition can be realized, the state sharing and data synchronization delay between devices can be reduced, so as to improve the data acquisition efficiency of the data acquisition system, and the integrated design keeps the system structure concise and has high applicability.

[0015] In a possible implementation of the first aspect, the above-mentioned detector further includes a data transmission interface, and the data transmission interface is connected to the above-mentioned processor; the detector is configured to, after the electron beam sampling is completed to obtain sampling data, output the sampling data to the above-mentioned processor through the data transmission interface. In this application, through the data transmission interface of the detector, the sampling data can be output to the processor in real time after the electron beam sampling is completed, which can reduce the delay of data synchronous transmission, and further improve the data transmission efficiency of the data acquisition system.

[0016] In a possible implementation manner of the first aspect, the above-mentioned processor includes a data acquisition interface, and the data acquisition interface is connected to the above-mentioned detector; the above-mentioned processor is configured to receive the above-mentioned sampled data sampled by the above-mentioned detector through the above-mentioned data acquisition interface. In this application, by communicating through the data acquisition interface of the processor with the detector, the processor can receive the sampled data output by the detector in real time after the detector finishes sampling the electron beam, which can reduce the delay of data synchronization. Similarly, the data transmission efficiency of the data acquisition system can be improved.

[0017] In a possible implementation manner of the first aspect, the above-mentioned data acquisition system further includes a control unit, and the control unit is connected to the host computer and the above-mentioned processor; the control unit is configured to obtain the configuration parameters of the above-mentioned module power supply from the above-mentioned host computer, and obtain a plurality of electrical parameters for configuring the above-mentioned module power supply based on the above-mentioned configuration parameters, where one of the above-mentioned sampling processes corresponds to one of the above-mentioned electrical parameters, and the above-mentioned plurality of electrical parameters include the above-mentioned first electrical parameter and the above-mentioned second electrical parameter; the control unit is further configured to transmit the above-mentioned plurality of electrical parameters to the above-mentioned processor. In this application, by introducing the control unit, it can communicate with the host computer to obtain configuration parameters, and obtain a plurality of electrical parameters based on the configuration parameters and transmit them to the processor, which can achieve low-delay acquisition of electrical parameters, can perform preprocessing on the configuration parameters to obtain electrical parameters that can be used for module power supply configuration, can reduce the data processing amount of the processor, reduce the delay of data transmission, and thus improve the data processing efficiency of the data acquisition system.

[0018] In a possible implementation manner of the first aspect, the above-mentioned data acquisition system further includes a light intensity detection sensor, and the above-mentioned processor further includes an analog-to-digital converter; the light intensity detection sensor is connected to the analog-to-digital converter; the light intensity detection sensor is configured to detect and generate light intensity data of the above-mentioned electron beam, and transmit the detected above-mentioned light intensity data to the analog-to-digital converter; the control unit is further configured to obtain the above-mentioned sampled data and the above-mentioned light intensity data from the above-mentioned processor, and output the above-mentioned sampled data and the above-mentioned light intensity data to the above-mentioned host computer. In this application, by introducing the light intensity detection sensor, the light intensity data of the above-mentioned electron beam can be obtained through the cooperation between the light intensity detection sensor and the analog-to-digital converter in the processor. The light intensity data and the sampled data can act together on the electron beam composition analysis, which can improve the richness of the data obtained by the data acquisition system, and thus improve the effectiveness and reliability of the electron beam composition analysis. Here, the processor can transmit the sampled data and the light intensity data to the control unit, and the control unit transmits them to the host computer, which can reduce the resource occupancy of data synchronization, and thus improve the system performance of the data acquisition system, and has high applicability.

[0019] Second aspect, the present application provides a data acquisition method for electron beam composition analysis. The above method is applicable to a processor in a data acquisition system. The data acquisition system includes a module power supply, a detector, and the above processor; the module power supply is used to supply power to an electron beam regulation module for regulating the above electron beam; the processor is connected to the module power supply, and the processor is connected to the detector; the processor is used to sequentially execute multiple sampling processes. In each sampling process, the above method includes: configuring a first electrical parameter for the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam regulation module; after confirming that the module power supply outputs the first electrical signal, triggering the detector to sample the electron beam; receiving a data acquisition completion signal fed back by the detector after sampling the electron beam is completed, so as to trigger the configuration of a second electrical parameter for the module power supply to execute the next sampling process. In the present application, the processor can configure the module power supply by transmitting a first electrical parameter to the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam regulation module. After confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam. After receiving the data acquisition completion signal output by the detector, a second electrical parameter can be configured for the module power supply to execute the next sampling process. Therefore, through closed-loop parameter configuration of the module power supply and timing trigger control of the detector, automatic sampling switching in multi-parameter dynamic analysis of the electron beam is realized, and the data acquisition efficiency is significantly improved.

[0020] In a possible implementation manner of the second aspect, the above processor includes a first parameter configuration interface, and the first parameter configuration interface is connected to the module power supply; the configuring a first electrical parameter for the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam regulation module, includes: configuring the first electrical parameter for the module power supply through the first parameter configuration interface, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam regulation module and feeds back a parameter configuration completion signal after outputting the first electrical signal. In the present application, communication can be carried out between the first parameter configuration interface in the processor and the module power supply. The first electrical parameter can be output to the module power supply to configure the first electrical parameter for the module power supply, thereby triggering the module power supply to output a corresponding first electrical signal for the electron beam regulation module based on the first electrical parameter configuration. Real-time triggering of the electrical parameter configuration of the module power supply can be achieved, the delay of data synchronization between the processor and the module power supply can be reduced, the communication efficiency between the processor and the module power supply can be improved, the configuration efficiency of the electrical parameters of the module power supply can be improved, and further the power supply efficiency of the module power supply for the electron beam regulation module can be improved, with high applicability.

[0021] In a possible implementation of the second aspect, the above-mentioned processor further includes a configuration status sensing interface, and the configuration status sensing interface is connected to the module power supply; after confirming that the module power supply outputs the first electrical signal, triggering the detector to sample the electron beam includes: after obtaining the parameter configuration completion signal through the configuration status sensing interface, triggering the detector to sample the electron beam. In this application, communication can be carried out between the configuration status sensing interface of the processor and the module power supply, and the parameter configuration completion signal transmitted by the module power supply can be received through the configuration status sensing interface, so that it can be quickly known that the module power supply has completed outputting the first electrical signal, and then the detector can be triggered to perform electron beam sampling, which can reduce the delay between the module power supply completing power supply for the electron beam modulation module and the detector starting to collect data to be measured, and thus can improve the data collection efficiency.

[0022] In a possible implementation of the second aspect, the above-mentioned processor includes a first detection start interface, and the first detection start interface is connected to the detector; triggering the detector to sample the electron beam includes: outputting a detection start signal to the detector through the first detection start interface, and the detection start signal is used to trigger the detector to sample the electron beam and feedback a data collection completion signal after the electron beam sampling is completed. In this application, communication can be carried out between the first detection start interface of the processor and the detector, and a detection start signal can be output to the detector after determining that the module power supply outputs the first electrical signal to trigger the detector to sample the electron beam, which can realize real-time signal transmission between the processor and the detector, reduce the delay of the detector starting data collection, and thus can improve the data collection efficiency.

[0023] In a possible implementation of the second aspect, the above-mentioned processor further includes a detection status sensing interface, and the detection status sensing interface is connected to the detector; receiving the data collection completion signal fed back by the detector after sampling the electron beam to trigger the configuration of the second electrical parameter for the module power supply includes: after receiving the data collection completion signal through the detection status sensing interface, configuring the second electrical parameter for the module power supply. In this application, communication can be carried out between the detection status sensing interface of the processor and the detector, and the data collection completion signal transmitted by the detection status transmission interface can be received. The processor can know that the detector has completed sampling the electron beam through the data collection completion signal, and then start the process of configuring the second electrical parameter for the module power supply, which can realize the status sharing among the detector, the processor and the module power supply. Through the direct communication between the detector and the processor interface, the delay of the processor knowing the completion of data collection can be reduced, and thus the delay of triggering the electrical parameter configuration of the module power supply can be reduced, which can improve the data collection efficiency and has high applicability.

[0024] In a possible implementation of the second aspect, the above-mentioned processor includes a first processing unit and a second processing unit; before configuring the second electrical parameter for the above-mentioned module power supply after receiving the above-mentioned data acquisition completion signal through the above-mentioned detection status sensing interface, the above-mentioned method further includes: during the above-mentioned sampling process, sending a voltage regulation instruction from the above-mentioned first processing unit to the above-mentioned second processing unit, and obtaining the above-mentioned second electrical parameter by the above-mentioned second processing unit according to the above-mentioned voltage regulation instruction, so as to configure the above-mentioned second electrical parameter for the above-mentioned module power supply after receiving the above-mentioned data acquisition completion signal through the above-mentioned detection status sensing interface. In this application, through the collaborative work of the first processing unit and the second processing unit of the processor, after the first processing unit sends a voltage regulation instruction, the second processing unit obtains the second electrical parameter in advance, and then triggers the electrical parameter configuration in real time after receiving the data acquisition completion signal, reducing the state sharing and data synchronization delay between devices, so as to improve the efficiency of data acquisition and have high applicability.

[0025] In a possible implementation of the second aspect, the above-mentioned processor includes a data acquisition interface, and the above-mentioned data acquisition interface is connected to the above-mentioned detector. The above-mentioned method further includes: receiving sampling data from the above-mentioned detector through the above-mentioned data acquisition interface. In this application, communication can be carried out between the detector and the processor through the data acquisition interface of the processor, and the sampling data output by the detector can be received in real time after the detector data acquisition is completed, which can reduce the delay of data synchronization, and thus improve the data acquisition efficiency of the system.

[0026] In a possible implementation of the second aspect, before configuring the first electrical parameter for the above-mentioned module power supply, the above-mentioned method further includes: obtaining multiple electrical parameters for configuring the above-mentioned module power supply from the host computer; where one of the above-mentioned sampling processes corresponds to one of the above-mentioned electrical parameters, and the above-mentioned multiple electrical parameters include the above-mentioned first electrical parameter and the above-mentioned second electrical parameter. In this application, configuration data can be obtained from the host computer to obtain the electrical parameters for configuring the above-mentioned module power supply, which can improve the flexibility and diversity of obtaining electrical parameters, reduce the data processing burden of the processor, optimize the resource utilization of the data acquisition system, reduce the delay of data preprocessing for electrical parameters, improve the configuration efficiency of the module power supply and the power supply efficiency for the electron beam modulation module, and thus improve the data acquisition efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of an application scenario of a data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0028] Figure 2 is a schematic structural diagram of a data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0029] Figure 3It is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0030] Figure 4 It is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0031] Figure 5 It is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0032] Figure 6 It is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0033] Figure 7 It is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0034] Figure 8a It is another schematic diagram of an application scenario of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0035] Figure 8b It is another schematic diagram of an application scenario of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0036] Figure 9 It is a schematic diagram of the pipelining operation of the processor in the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0037] Figure 10 It is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application;

[0038] Figure 11 It is a schematic flowchart of the method for electron beam composition analysis provided by an embodiment of the present application.

[0039] Description of reference numerals:

[0040] 10 - Host computer; 11 - Data acquisition system;

[0041] 110 - Processor; 111 - Module power supply; 112 - Detector; 113 - Electron beam regulation module; 114 - Light intensity detection sensor; 115 - Carrier stage; 116 - Wafer to be measured; 117 - Control unit;

[0042] 1100 - Analog-to-digital converter; 1101 - First processing unit; 1102 - Second processing unit;

[0043] 1130 - Light source; 1131 - Magnetic lens; 1132 - Electrostatic lens; 1133 - First data generation source; 1134 - Second data generation source; 1135 - Third data generation source; 113n - Nth data generation source;

[0044] 11020 - System synchronization controller; 11021 - Unified interface controller; 11022 - Host - side interface;

[0045] 11320 - First electrostatic lens; 11321 - Second electrostatic lens. Detailed implementation manners

[0046] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0047] Electron beam composition analysis is an analysis technique based on physical principles. Its basic principle is to use irradiated X - rays to excite photoelectrons on the surface of the sample. When X - ray photons irradiate the surface of the sample, these photons can be absorbed by the electrons in the atomic orbitals of the elements in the sample, causing these electrons to break free from the bondage of the atomic nucleus and emit from the interior of the atom with a certain kinetic energy to become free photoelectrons, while the atom is transformed into an excited - state ion. When the energy of the fixed excitation source is given, the energy of the photoelectrons can be regarded as only related to the type of the element and the ionized and excited atomic orbitals. Therefore, the elemental type of the substance can be qualitatively analyzed according to the binding energy of the photoelectrons, that is, the chemical composition, state, and content of the elements on the surface of the sample can be identified by measuring the magnitudes of the binding energies of the photoelectrons of each element in the sample. X - ray photoelectron spectroscopy (XPS) technology is a relatively common electron beam composition analysis technique. The core principle of XPS is to bombard the surface of the sample with X - rays, so that the elements in the sample are excited and emit photoelectrons, and the accurate detection of the elemental type, chemical state, and surface composition is realized by analyzing the binding energy of the photoelectrons. Electron beam composition analysis has been widely used in many fields such as materials science, aerospace, automotive manufacturing, geology, environmental science, biomedicine, and archaeology, and will not be elaborated here. All in all, due to its high precision, micro - area analysis ability, and non - destructive characteristics, electron beam composition analysis technology has become an indispensable tool in modern scientific research and industrial production.

[0048] The process of electron beam composition analysis generally includes multiple steps such as analysis method selection, sample preparation, data acquisition, qualitative and quantitative analysis, and analysis result evaluation. Each step in the entire electron beam composition analysis process is closely linked to ensure that electron beam composition analysis can provide accurate composition information for material research, quality control, product R & D, etc., which can be specifically determined according to the actual application scenario and will not be limited here. It can be understood that the data acquisition system for electron beam composition analysis provided in the embodiments of the present application (which can be simply referred to as the data acquisition system for convenience of description) can be used to acquire various types of data available for electron beam composition analysis. Among them, the above-mentioned various types of data include, but are not limited to: the number of elements, element types, light intensity data, X-ray energy distribution information, X-ray intensity, etc., which can be specifically determined according to the analysis method of electron beam composition analysis and the actual application scenario and will not be limited here. Optionally, the various types of data in the above examples can be collected separately or in combination, which can be specifically determined according to the actual application scenario and will not be limited here. For convenience of description, the present application takes the wafer measurement scenario as an example and combines Figure 1 to illustrate the usage scenario of the data acquisition system provided in the embodiments of the present application.

[0049] Please refer to Figure 1 , Figure 1 which is a schematic diagram of an application scenario of the data acquisition system for electron beam composition analysis provided in the embodiments of the present application. As Figure 1As shown, the data acquisition system 11 may include a processor 110, a module power supply 111, and a detector 112. The data acquisition system 11 can be connected to a host computer 10, which can be used to detect and control the data acquisition system 11. The host computer 10 is usually a terminal device or a server, which can be determined according to the actual application scenario and is not limited here. The host computer 10 can send an instruction to the processor to adjust the voltage of the module power supply 111. The host computer 10 can collect data from the data acquisition system 11 through a communication protocol, such as the data collected by the detector 112, the data collected by the light intensity detection sensor 114, the data of the operation of the processor 110, etc., and process the collected data, such as filtering, analyzing, calculating, storing, etc. Optionally, the above data acquisition system 11 may further include an electron beam regulation module 113, a light intensity detection sensor 114, and a carrier stage 115. The light intensity detection sensor 114 and the carrier stage 115 can be set in the data acquisition system 11 or outside the data acquisition system 11, which can be determined according to the actual application scenario and is not limited here. For the convenience of description, the following will take the example where both the light intensity detection sensor 114 and the carrier stage 115 are set in the data acquisition system 11. Here, the processor 110 is connected to each device in the data acquisition system 11, that is, the processor 110 can be connected to each device through a physical interface and control the operation of each device in the system through a communication protocol. It can be understood that the processor 110 can be connected to each device in the data acquisition system 11 through a high-speed serial interface, a parallel interface, an industrial bus interface, etc., such as Figure 1 the module power supply 111, the detector 112, etc. shown in it, and control the operation of each device. For example, the processor 110 can control the detector 112 to perform detection work to collect data for data output, which can be determined according to the actual application scenario and is not limited here. The module power supply 111 is used to provide a stable current / voltage to the electron beam regulation module 113. Here, the current / voltage value is determined by the electrical parameter configuration of the module power supply 111. Different electrical parameter configurations correspond to different electrical signals, and thus multiple electron beams for electron beam composition analysis can be generated for the detector 112 to sample. Such as Figure 1As shown, the electron beam control module 113 may include, but is not limited to, a magnetic lens 1131, an electrostatic lens 1132, a light source 1130, a magnetic compensation coil (not shown in the figure), a hemispherical analyzer (not shown in the figure), etc., which can be specifically determined according to the actual application scenario and are not limited here. Among them, the above-mentioned carrier stage 115 can be used to carry the wafer to be measured 116, the light source 1130 is used to generate X-rays to irradiate the wafer to be measured 116 to excite the generation of electrons to be measured, and the magnetic lens 1131 is used to collect the electrons to be measured based on the deflection effect of the magnetic field on charged particles to converge into an electron beam. It can be understood that multiple electron beams available for composition analysis will be generated under the action of the electron beam control module 113 powered by different electrical signals, that is, different electron beams will be generated under different electrical signal power supply conditions. The detector 112 can be used to sample the above-mentioned electron beam. The light intensity detection sensor 114 can collect the X-ray intensity data irradiated on the wafer to be measured 116. Suppose the user expects to measure a target wafer. The user can use the target wafer as the wafer to be measured 116 and use the light source 1130 to generate X-rays to irradiate the surface of the wafer to be measured 116. Under the irradiation of the X-rays, the wafer to be measured 116 will be excited to generate electrons to be measured. The electrons to be measured will be converged into the action range of the electrostatic lens 1132 and form an electron beam to be measured under the action of the magnetic field provided by the magnetic lens 1131. At this time, the electrostatic lens 1132 can affect the electron beam to be measured converged in the action range through voltage parameter configuration. Here, it can be assumed that the current parameter configuration of the magnetic lens 1131 remains constant to control the electrons to be measured converged into the action range of the electrostatic lens 1132 to be relatively stable. Then, the sampling data of the electron beam to be measured formed by convergence will be associated with the voltage parameters of the electrostatic lens 1132. Here, the voltage parameters can be set by the user, that is, the user can set multiple target voltage parameters on the upper computer 10 and other settings, and then output them to the processor 110 through the upper computer 10. Optionally, in the embodiment of the present application, the user can input the voltage value configuration range of the target voltage in the upper computer 10, and the upper computer 10 can output the voltage value configuration range to the processor 110. The processor 110 can obtain multiple target voltage parameters based on the voltage value configuration range. Here, the processor 110 can select multiple target voltage parameters from the above voltage value configuration range according to selection rules such as equal interval point selection, obtaining historical value points within the interval, etc., which can be specifically determined according to the actual application scenario and are not limited here.

[0050] In some feasible embodiments, the processor 110 may configure multiple target electrical parameters for the module power supply 111, triggering the module power supply 111 to output corresponding voltage / current parameters to components in the electron beam modulation module 113 such as the magnetic lens 1131, the electrostatic lens 1132, or the light source 1130 based on the multiple target electrical parameters (such as target voltage / current parameters). It can be understood that after completing one configuration of the module power supply 111 and performing corresponding power supply for the electron beam modulation module 113, a group of electron beams to be measured can be generated. Then, the processor 110 can trigger the detector 112 to sample the electron beams to be measured to obtain a group of sampling data for electron beam composition analysis. That is to say, a group of sampling data corresponds to one target electrical parameter. After the module power supply 111 completes the power supply to the electron beam modulation module 113 based on the target electrical parameter, the module power supply 111 can feedback a signal indicating that the parameter configuration is completed to the processor 110. Then, the processor 110 can trigger the detector 112 to start sampling the electron beams. After the detector 112 completes the sampling of the electron beams, the detector 112 can feedback the acquisition completion signal to the processor 110 and upload the acquired data to the processor 110 for uploading to the host computer 10 by the processor 110. The processor 110 can configure the module power supply 111 based on a new target electrical parameter to trigger the module power supply 111 to supply power to the electron beam modulation module 113 based on the new target electrical parameter, thereby generating new electron beams to be measured, and then repeating the foregoing feedback and sampling processes to obtain multiple groups of sampling data. It can be understood that the sampling data is related to the target electrical parameters, the light intensity data of the X-ray irradiated on the surface of the wafer to be measured, etc. The light intensity detection sensor 114 in the data acquisition system 11 can collect the X-ray intensity, and then convert it into light intensity data through an analog-to-digital converter (not shown in the figure) and upload it to the host computer 10 to achieve electron beam composition analysis.

[0051] Optionally, in the embodiments of the present application, the communication between the processor 110, the detector 112, the module power supply 111, and the light intensity detection sensor 114 can be implemented based on a physical interface and logical adaptation, that is, data, signals, instructions, etc. can be transmitted and parsed between devices through physical connections. Here, the logical adaptation through the physical interface can support various communication protocol interfaces including but not limited to the recommended standard 232 (RS232), the recommended standard 485 (RS485), the serial peripheral interface (SPI), the network port, etc. for communication between devices. In specific implementations, the interface type can be determined according to the actual selection of the devices and the actual application scenarios, which is not limited herein.

[0052] The following will be combined with Figures 2 to 11Specifically describe the data acquisition system and data acquisition method for electron beam composition analysis provided by this application.

[0053] Please refer to Figure 2 , Figure 2 which is a schematic structural diagram of the data acquisition system for electron beam composition analysis provided by an embodiment of this application. As Figure 2As shown in the figure, the data acquisition system 11 provided by the embodiment of the present application may include a processor 110, a module power supply 111, and a detector 112. The module power supply 111 is used to supply power to an electron beam modulation module 113 for modulating the electron beam. The processor 110 is connected to the module power supply 111, and the processor 110 is connected to the detector 112. The processor 110 is configured to sequentially execute a plurality of sampling processes. In each sampling process, the processor 110 is configured to configure a first electrical parameter for the module power supply 111, so that the module power supply 111 outputs a first electrical signal corresponding to the first electrical parameter for the electron beam modulation module 113. After confirming that the module power supply 111 outputs the first electrical signal, the detector 112 is triggered to sample the electron beam. The data acquisition completion signal fed back by the detector 112 after sampling the electron beam is received to trigger the configuration of a second electrical parameter for the module power supply 111 to execute the next sampling process. It can be understood that to perform electron beam composition analysis, multiple sets of sampling data need to be obtained, that is, multiple sampling processes need to be performed after multiple configurations of the module power supply. When the detector 112 completes one sampling and feeds back the acquisition completion signal to the processor 110, it can be regarded as completing one sampling process, that is, the processor 110 will trigger the next sampling process. Here, the data acquisition system 11 may further include a stage 115. The electron beam modulation module 113 may include, but is not limited to, a light source 1130, an electrostatic lens 1132 (not shown in the figure), a magnetic lens 1131 (not shown in the figure), a magnetic compensation coil (not shown in the figure), and a hemispherical analyzer (not shown in the figure), etc., which can be specifically determined according to the actual application scenario and will not be limited here. Optionally, the stage 115 for carrying the wafer 116 to be measured and the electron beam modulation module 113 may be located inside the data acquisition system 11 or connected outside the data acquisition system 11, which can be specifically determined according to the actual application scenario and will not be limited here. For the convenience of description, the stage 115 and the electron beam modulation module 113 located inside the data acquisition system 11 will be used for illustrative purposes hereinafter. Assume that the electron beam modulation module 113 includes a light source 1130, an electrostatic lens 1132, a magnetic lens 1131, a magnetic compensation coil (not shown in the figure), and a hemispherical analyzer (not shown in the figure). Among them, the light source 1130 can be used to generate X-rays to irradiate the wafer 116 to be measured to excite the generation of electrons to be measured. The magnetic lens 1131 can be used to collect the electrons to be measured and converge them into an electron beam based on the deflection effect of the magnetic field on charged particles. The electrostatic lens 1132 can be used to adjust the high-voltage environment where the electron beam is located to obtain a diversified electron beam to be measured for subsequent sampling. The magnetic compensation coil can be used to correct the influence of the external magnetic field on the electron beam, and the hemispherical analyzer can analyze the electron energy in the electron beam to obtain richer electron beam-related data. Please refer to Figure 1 , such as Figure 1As shown, the magnetic lens 1131 can be located above the carrier stage 115 and the wafer 116 to be measured, so as to collect the electrons excited by the X-ray irradiation of the light source 1130 on the wafer 116 to be measured. The electrostatic lens 1132 can be located above the magnetic lens 1131. The electrons collected by the magnetic lens 1131 can be converged into an electron beam and enter the action range of the electrostatic lens 1132. The magnetic compensation coil (not shown in the figure) and the hemispherical analyzer (not shown in the figure) can generally be located between the electrostatic lens 1132 and the detector 112, and can be specifically determined according to the actual application scenario, and will not be limited here. Here, the light source 1130 can be a light source that can emit X-rays, including but not limited to an X-ray tube, a synchrotron radiation light source, a free electron laser, a plasma X-ray source, etc., and can be specifically determined according to the actual application scenario, and will not be limited here. The selection of the light source 1130 can affect the accuracy and quality of the data obtained by subsequent sampling, and can be specifically determined according to the actual detection requirements and the actual application scenario, and will not be limited here. The module power supply 111 can be used to provide different electrical signals for different components in the above-mentioned electron beam control module 113. For example, it can provide voltage for the light source 1130, provide voltage for the electrostatic lens 1132, provide current for the magnetic lens 1131, etc., and can be specifically determined according to the actual application scenario, and will not be limited here. It can be understood that under different power supply conditions of the module power supply 111, the electron beam control module 113 can control and generate different electron beams for the detector 112 to sample. That is to say, different electron beams will be generated under different electrical signal power supply conditions. Optionally, to control the environmental variables in the electron beam composition analysis process, the module power supply 111 can supply power to the above-mentioned electron beam control module 113 uniformly or independently adjustable. For example, it can provide a continuous and unchanged power supply for the light source 1130, and only adjust the power supply of the electrostatic lens 1132 and the magnetic lens 1131. It can also provide a continuous and unchanged power supply for the light source 1130 and the magnetic lens 1131, and only adjust the power supply of the electrostatic lens 1132, and can be specifically determined according to the actual application scenario, and will not be limited here. For the convenience of understanding, in the subsequent embodiments, the power supply of the light source 1130 by the module power supply 111 will remain unchanged, and the example of the module power supply 111 adjusting the power supply of the electrostatic lens 1132 and the magnetic lens 1131 will be used for illustration. For the convenience of description, the electron beam control module 113 under the power supply of the module power supply 111 will be referred to as a data generation source hereinafter. The data generation source can control the electron beam according to different power supply conditions of the module power supply 111 for the detector 112 to collect different sampling data. The components and specific connection structures inside the data generation source can be determined according to the actual application scenario, and will not be limited here. Please refer to again Figure 2 , such as Figure 2As shown, data generation sources (such as the first data generation source 1133, the second data generation source 1134, etc.) can be used to collect the electron beam formed after the X-ray irradiates the wafer 116 to be measured. Here, the electron beam can be regulated by the data generation source to collect electron beam sampling data under different electrical signal conditions. In each sampling process, the processor 110 can configure a first electrical parameter for the module power supply 111 to control the module power supply 111 to output a first electrical signal corresponding to the first electrical parameter to the electron beam regulation module 113 based on the configuration of the first electrical parameter. It can be understood that the electron beam regulation module 113 under the power supply of the first electrical signal can constitute the above-mentioned first data generation source 1133. That is to say, the electron beam regulation module 113 under the power supply of the second electrical signal can constitute the above-mentioned second data generation source 1134. Here, the second electrical signal can be any electrical signal different from the first electrical signal, which can be specifically determined according to the actual application scenario and is not limited here. Here, the electrical parameter configured by the processor 110 to the module power supply 111 can be a voltage parameter or a current parameter, which can be specifically determined according to the actual application scenario and is not limited here. It can be understood that one electrical parameter corresponds to one above-mentioned sampling process. That is to say, one electrical parameter corresponds to the module power supply 111 outputting one electrical signal. The magnetic lens 1131, the electrostatic lens 1132, the magnetic compensation coil, and the hemispherical analyzer that receive the above electrical signal can constitute a data generation source to generate an electron beam sampling data. The corresponding relationship between the electrical parameter and the output electrical signal can be specifically determined according to the actual application scenario and is not limited here. It can be understood that multiple data generation sources including the first data generation source 1133, the second data generation source 1134, the third data generation source 1135,..., the Nth data generation source 113n can be used to correspond to multiple electrical parameters including the first electrical parameter, the second electrical parameter, the third electrical parameter,..., the Nth electrical parameter to generate electron beam sampling data for electron beam composition analysis corresponding to the first electrical signal, the second electrical signal, the third electrical signal,..., the Nth electrical signal. The number and structure of the data generation sources can be determined according to the actual application scenario and are not limited here. When the processor 110 confirms that the module power supply 111 outputs the first electrical signal, that is, constitutes the first data generation source 1133, it can trigger the detector 112 to sample the electron beam. The detector 112 can be used to sample the electron beam and feedback a data acquisition completion signal to the processor 110 after the data to be measured is acquired. The processor 110 can also be used to configure a second electrical parameter for the module power supply 111 after receiving the data acquisition completion signal. The module power supply 111 outputs a second electrical signal corresponding to the second electrical parameter to the above electron beam regulation module 113 (magnetic lens 1131 and electrostatic lens 1132) to constitute the second data generation source 1134. The processor 110 can trigger the detector 112 to perform the next round of sampling.Here, the signals interacting between the above-mentioned detector 112 and the processor 110 can be analog signals, digital signals, etc., which can be specifically determined according to the actual application scenario and device type, and are not limited here.

[0054] In some feasible embodiments, corresponding to N electrical parameters, the processor 110 can configure the module power supply 111 N times. The module power supply 111 can output electrical signals corresponding to the electrical parameters to multiple electron beam control modules 113 (such as magnetic lens 1131, electrostatic lens 1132, etc.), thereby constituting N data generation sources to generate N groups of electron beams for the detector 112 to collect and obtain N groups of electron beam sampling data. For ease of description, the following will take two data generation sources as an example for illustration. The data generation sources include the above-mentioned magnetic lens 1131 and electrostatic lens 1132. One data generation source corresponds to one electrical signal (that is, one electrical parameter), that is, the first data generation source 1133 and the second data generation source 1134 are used for illustration. Please refer to Figure 3 , Figure 3 is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by the embodiments of the present application. As Figure 3In the data acquisition system 11 shown, it includes a processor 110, a detector 112, and a module power supply 111. Among them, the processor 110 is respectively connected to the detector 112 and the module power supply 111, and the module power supply 111 is connected to the electron beam regulation module 113. The processor 110 acquires a first electrical parameter and a second electrical parameter. Here, the first electrical parameter and the second electrical parameter can be historical parameters or parameters input from the outside, which can be specifically determined according to the actual situation and are not limited here. The processor 110 can configure the first electrical parameter for the module power supply 111 to trigger the module power supply 111 to output a first electrical signal to the electron beam regulation module 113, so as to form a first data generation source 1133, and further generate data for electron beam composition analysis. Here, the light source 1130 emits X-rays to irradiate the wafer to be measured, and electrons can be generated. The first data generation source 1133 can collect the electrons reflected after the X-rays irradiate the wafer to be measured and converge them into an electron beam for the detector 112 to obtain electron beam sampling data. In other words, for the electrons reflected by the wafer to be measured, two electron beams to be sampled for electron beam composition analysis can be generated under the action of the first data generation source 1133 and the second data generation source 1134. One of the above-mentioned electron beams to be sampled corresponds to one data generation source, and the sampling data obtained based on the electron beam to be sampled is associated with the electrical parameter configured for the module power supply 111. When the processor 110 confirms that the module power supply 111 outputs the above-mentioned first electrical signal, it can trigger the detector 112 to sample the electron beam to obtain electron beam sampling data. The detector 112 samples the electron beam and feeds back a data acquisition completion signal to the processor 110 after the electron beam sampling data acquisition is completed. When the processor 110 receives the data acquisition completion signal, it can configure the second electrical parameter for the module power supply 111 to trigger the module power supply 111 to output a second electrical signal to the electron beam regulation module 113, so as to form a second data generation source 1134, and further generate new data for electron beam composition analysis. The module power supply 111 can repeat the above implementation method to feed back a signal indicating that the output of the second electrical signal is completed to the processor 110, triggering the processor 110 to control the detector 112 to perform electron beam sampling. In the embodiment of the present application, the data acquisition system 11 can dynamically configure the electrical parameter of the module power supply 111 through the processor 110, trigger the detector 112 to sample the electron beam, and switch the electrical parameter configured for the module power supply 111 after receiving the feedback signal of the detector 112 to perform the next round of sampling.The module power supply 111 can supply power to the electron beam control module 113. The detector 112 can sample the electron beam. The processor 110 can achieve information transmission with the module power supply 111 and information transmission with the detector 112, can realize real-time communication between devices, and further can realize the real-time control of the module power supply 111 and the detector 112 by the processor 110, can reduce the communication delay between devices, and can realize the real-time status perception between devices. Therefore, through the closed-loop parameter configuration of the module power supply 111 and the timing trigger control of the detector 112 by the processor 110, the full-automatic sampling switching in the multi-parameter dynamic analysis of the electron beam is realized, and the data acquisition efficiency is significantly improved. In the traditional data acquisition process, the parameter configuration and the trigger of the detector are usually carried out through manual operation or clock delay setting, which is time-consuming and prone to introduce errors. By adopting the closed-loop control of the processor 110, the output of the module power supply 111 can be dynamically adjusted according to the preset parameters. For example, the first electrical parameter and the second electrical parameter of the module power supply 111 are set by the upper computer 10 to control the module power supply 111 to output the first electrical signal and the second electrical signal after the configuration is completed, ensuring the accuracy and stability of the parameters. At the same time, the timing trigger control of the detector 112 by the processor 110 realizes precise synchronization, so that the detector can sample the electron beam after the module power supply 111 outputs an electrical signal, avoiding invalid sampling and data loss. This fully automated sampling switching method reduces manual intervention, increases the sampling frequency and data quality, and thus significantly improves the overall efficiency of data acquisition.

[0055] Optionally, in some feasible embodiments, the module power supply 111 can be used to provide a stable electrical signal to the electron beam control module 113 (such as a magnetic lens 1131, an electrostatic lens 1132, a light source 1130). Here, the module power supply 111 can integrate functional units including but not limited to a high-voltage power supply unit, a DC voltage power supply unit, a DC current power supply unit, a control and monitoring unit, a power conversion and distribution unit, a protection and safety unit, etc., to provide different electrical signals to different components in the above-mentioned electron beam control module 113. For example, providing voltage to the light source 1130, providing voltage to the electrostatic lens 1132, providing current to the magnetic lens 1131, etc., which can be specifically determined according to the actual application scenario and are not limited here. Here, configuring the electrical parameters of the module power supply 111 can be understood as adjusting the electrical signal provided by the module power supply 111 to the above-mentioned electron beam control module 113. Here, the electrical signal can include one or more of voltage, current, frequency, power, etc., which can be specifically determined according to the actual scenario and are not limited here.

[0056] In some feasible embodiments, the above-mentioned electron beam modulation module 113 may include a magnetic lens 1131 and an electrostatic lens 1132. The magnetic lens 1131 and the electrostatic lens 1132 may constitute the above-mentioned data generation source. The magnetic lens 1131 can focus electrons using a magnetic field, causing the electrons to focus on the target area and converge into an electron beam. Here, the magnetic field strength, magnetic field distribution, etc. of the magnetic lens 1131 can be configured with current parameters based on the electrical signal transmitted by the module power supply 111. The electrostatic lens 1132 can be configured with voltage parameters based on the electrical signal transmitted by the module power supply 111 to change the voltage environment of the electron beam in the target area, thereby generating an electron beam that can be used for sampling. Here, the electrical signals output to the magnetic lens 1131 and the electrostatic lens 1132 can affect the stability and diversity of the generated data. There may be multiple electrostatic lenses 1132 and at least one magnetic lens 1131 in the data acquisition system 11. One magnetic lens 1131 and one electrostatic lens 1132 can form a data generation source, and one magnetic lens 1131 and one electrostatic lens 1132 can each correspond to an electrical signal. It can be understood that multiple electrostatic lenses 1132 can share one magnetic lens 1131 to form multiple data generation sources, that is to say, multiple electrostatic lenses 1132 can share one magnetic lens 1131. In this way, the electrons collected by the same magnetic lens 1131 in the target area under the same current parameter configuration can remain relatively stable to control the variables in subsequent electron beam composition analysis. Optionally, there may be only one electrostatic lens 1132 and one magnetic lens 1131 in the data acquisition system 11. The electrostatic lens 1132 can receive multiple electrical signals transmitted by the module power supply 111 for voltage parameter configuration. The magnetic lens 1131 and the electrostatic lens 1132 under one voltage parameter configuration can form a data generation source. Similarly, optionally, the magnetic lens 1131 can also receive multiple electrical signals transmitted by the module power supply 111 for current parameter configuration. The electrostatic lens 1132 and the magnetic lens 1131 under one current parameter configuration can form a data generation source. In other words, the voltage parameters of the electrostatic lens 1132 can be configured flexibly multiple times. When the current parameter configuration of the magnetic lens 1131 remains unchanged, each time the voltage parameters of the electrostatic lens 1132 are configured (that is, each time the value of the electrical signal output by the module power supply 111 for the electrostatic lens 1132 is changed), a data generation source composed of the electrostatic lens 1132 and the magnetic lens 1131 can be obtained. Similarly, the current parameters of the magnetic lens 1131 can also be configured flexibly multiple times. When the voltage parameter configuration of the electrostatic lens 1132 remains unchanged, each time the current parameters of the magnetic lens 1131 are configured (that is, each time the value of the electrical signal output by the module power supply 111 for the magnetic lens 1131 is changed), a data generation source composed of the electrostatic lens 1132 and the magnetic lens 1131 can be obtained.

[0057] In some feasible embodiments, the electrical parameters transmitted by the processor 110 to the module power supply 111 may include either the current parameter of the magnetic lens 1131 or the voltage parameter of the electrostatic lens 1132, or a combination of the current parameter of the magnetic lens 1131 and the voltage parameter of the electrostatic lens 1132. It can be understood that when the electrical parameters only include either the current parameter of the magnetic lens 1131 or the voltage parameter of the electrostatic lens 1132, the module power supply 111 can output a corresponding electrical signal to one of the magnetic lens 1131 or the electrostatic lens 1132 based on this electrical parameter, and the other component can be powered with the original factory default parameters or maintain power supply according to historical parameters. Optionally, when the electrical parameters are a combination of the current parameter of the magnetic lens 1131 and the voltage parameter of the electrostatic lens 1132, electrical signal distribution can be performed for the two components respectively according to their respective electrical parameters, which can be specifically determined according to the actual application scenario and is not limited herein. For example, please refer to Figure 4 , Figure 4 is another schematic structural diagram of the data acquisition system for electron beam composition analysis provided by the embodiments of the present application. Compared with Figure 3 the data acquisition system 11 shown in Figure 4In the data acquisition system 11 shown, the first data generation source 1133 is composed of a magnetic lens 1131 and a first electrostatic lens 11320, and the second data generation source 1134 (not labeled in the figure) can be composed of a magnetic lens 1131 and a second electrostatic lens 11321. When the data acquisition system 11 starts to work, the processor 110 can configure the first electrical parameters to the module power supply 111. Assuming that the first electrical parameters include the current parameter of the magnetic lens 1131 and the voltage parameter of the first electrostatic lens 11320, the module power supply 111 can be triggered to output a first electrical signal to the magnetic lens 1131 and the first electrostatic lens 11320, so as to configure the current of the magnetic lens 1131 based on the current parameter in the first electrical parameters, and configure the voltage of the first electrostatic lens 11320 based on the voltage parameter in the first electrical parameters. After the first data generation source 1133 receives the power supply from the module power supply 111, when the X-ray emitted by the light source 1130 irradiates the surface of the wafer 116 to be measured, the electrons generated by the wafer 116 to be measured can be converged by the magnetic lens 1131 into the action range of the first electrostatic lens 11320 and the second electrostatic lens 11321 to form an electron beam, and sampled by the detector 112 in the voltage environment provided by the first electrostatic lens 11320. At this time, the second electrostatic lens 11321 can be understood as being in a non-powered state and does not act on the electron beam. The second electrical parameters can only include the voltage parameter for configuring the second electrostatic lens 11321. When the processor 110 configures the second electrical parameters to the module power supply 111, the module power supply 111 can be triggered to output a second electrical signal to the magnetic lens 1131 and the second electrostatic lens 11321, so as to configure the voltage of the second electrostatic lens 11321 based on the voltage parameter in the second electrical parameters. At this time, the magnetic lens 1131 will maintain the historical current configuration, that is, the current output from the module power supply 111 to the magnetic lens 1131 will maintain the historical current value. The magnetic lens 1131 can obtain a stable and unchanged current from the module power supply 111 and continuously gather electrons into the action range of the electrostatic lens 1132, and a new electron beam can be formed in the voltage environment provided by the second electrostatic lens 11321 for the detector 112 to sample. In the embodiment of the present application, by configuring the electrical parameters of the module power supply 111, the electrons generated by the wafer 116 to be measured can be collected under different electrical signal power supply conditions and converged into an electron beam within the action range of the electrostatic lens 1132 for the detector 112 to sample, which can improve the richness of the collected data, and rich electron beam samples can be provided for the detector 112 to sample and subsequent electron beam composition analysis in a short time, thereby improving the efficiency of data acquisition and electron beam composition analysis.

[0058] In some feasible embodiments, the processor 110 may include a first parameter configuration interface. The first parameter configuration interface may be connected to the module power supply 111. The processor 110 may configure electrical parameters for the module power supply 111 through the first parameter configuration interface to trigger the module power supply 111 to output an electrical signal corresponding to the electrical parameters for the electron beam modulation module 113. Here, one sampling process corresponds to one electrical parameter, and the electrical parameters include the first electrical parameter and the second electrical parameter. Here, the first parameter configuration interface may be an SPI interface or a universal synchronous / asynchronous receiver / transmitter (USART) and other interfaces that can be used to implement data synchronization and real-time communication functions between devices, which can be specifically determined according to the actual application scenario and are not limited herein. In the embodiments of the present application, electrical parameters can be configured for the module power supply 111 through the first parameter configuration interface of the processor 110 to trigger the module power supply 111 to output an electrical signal corresponding to the electrical parameters for the electron beam modulation module 113. Data transmission through the first parameter configuration interface reduces the delay of data synchronization between the processor 110 and the module power supply 111, can achieve real-time triggering of the electrical parameter configuration of the module power supply 111, and further can improve the configuration efficiency of the electrical parameters of the module power supply 111, and further improve the power supply efficiency of the module power supply 111 for the electron beam modulation module 113, with high applicability.

[0059] Correspondingly, in some feasible embodiments, the module power supply 111 may include a second parameter configuration interface. The second parameter configuration interface may be connected to the above-mentioned processor 110. The module power supply 111 may receive electrical parameters from the processor 110 through the second parameter configuration interface and output an electrical signal corresponding to the electrical parameters to the above-mentioned electron beam control module 113. It can be understood that the processor 110 may configure electrical parameters for the module power supply 111 through the first parameter configuration interface. Correspondingly, the module power supply 111 may include a second parameter configuration interface, and the second parameter configuration interface may be connected to the first parameter configuration interface to achieve the connection between the processor 110 and the module power supply 111. Here, the second parameter configuration interface may be an interface of the same type as the first parameter configuration interface, or the signal output by the first parameter configuration interface may be converted into an interface signal of another type through an interface conversion chip to adapt to the second parameter configuration interface of a different type from the first parameter configuration interface. The specific device interface type may be determined according to the actual application scenario and is not limited herein. The processor 110 may transmit electrical parameters to the module power supply 111 through the first parameter configuration interface to achieve the electrical parameter configuration of the module power supply 111. Correspondingly, the module power supply 111 may receive the above-mentioned electrical parameters from the processor 110 through the second parameter configuration interface and output an electrical signal corresponding to the electrical parameters to the above-mentioned electron beam control module 113. That is to say, the first parameter configuration interface may send electrical parameters, and the second parameter configuration interface may receive electrical parameters to achieve data synchronization between the processor 110 and the module power supply 111, and at the same time achieve the configuration of the module power supply 111 by the processor 110. In the embodiments of the present application, through the second parameter configuration interface of the module power supply 111, it can communicate with the first parameter configuration interface of the above-mentioned processor 110, receive the electrical parameters transmitted by the first parameter configuration interface, and output an electrical signal corresponding to the electrical parameters to the above-mentioned electron beam control module 113 to generate an electron beam to be sampled. By performing data transmission through the first parameter configuration interface and the second parameter configuration interface, the delay of data synchronization between the processor 110 and the module power supply 111 can be reduced, the communication efficiency between the processor 110 and the module power supply 111 can be improved. Similarly, the configuration efficiency of the electrical parameters of the module power supply 111 can be improved, and further the power supply efficiency of the module power supply 111 for the electron beam control module 113 can be improved, with high applicability.

[0060] In some feasible embodiments, the module power supply 111 may further include a configuration status transmission interface. The configuration status transmission interface may be connected to the processor 110. After the module power supply 111 outputs a first electrical signal corresponding to the first electrical parameter to the electron beam control module 113, it may transmit a parameter configuration completion signal to the processor 110 through the configuration status transmission interface. Here, the configuration status transmission interface may be an SPI interface or a USART interface, etc., which can implement the functions of data synchronization and real-time communication between devices. It can be specifically determined according to the actual application scenario and is not limited herein. After the module power supply 111 outputs an electrical signal corresponding to the first electrical parameter to the electron beam control module 113, it may transmit a parameter configuration completion signal to the processor 110 through the configuration status transmission interface. It can be understood that the parameter configuration completion signal may be a signal form agreed upon by both devices, such as a digital signal or an analog signal, etc., which can be specifically determined according to the actual application scenario and is not limited herein. In the embodiments of the present application, through the configuration status transmission interface of the module power supply 111, a parameter configuration completion signal can be transmitted to the processor 110 after outputting an electrical signal corresponding to the electrical parameter to the electron beam control module 113, thereby triggering the processor 110 to execute the next action, realizing real-time status sharing between the two devices of the module power supply 111 and the processor 110, reducing the delay of status sharing between devices, and further improving the data processing efficiency of the system.

[0061] Correspondingly, in some feasible embodiments, the processor 110 may further include a configuration status sensing interface. The configuration status sensing interface may be connected to the above-mentioned module power supply 111. After the processor 110 obtains the parameter configuration completion signal through the configuration status sensing interface, the processor 110 may trigger the detector 112 to sample the electron beam. Here, the configuration status sensing interface may be an interface of the same interface type as the above-mentioned configuration status transmission interface, or the parameter configuration completion signal output by the configuration status transmission interface may be converted into an interface signal of other types through an interface conversion chip to adapt to the configuration status sensing interface of a different type from the configuration status transmission interface. The specific device interface type may be determined according to the actual application scenario and is not limited herein. The module power supply 111 may transmit the parameter configuration completion signal to the processor 110 through the configuration status transmission interface to synchronize to the processor 110 the completion status of the power supply of the module power supply 111 to the electron beam modulation module 113. It can be understood that the parameter configuration completion signal may indicate that the module power supply 111 has completed outputting the electrical signal corresponding to the electrical parameter to the electron beam modulation module 113. The above-mentioned components may modulate the electron beam based on the electrical signal to generate the electron beam to be sampled, and the detector 112 may start sampling the electron beam to be sampled. The processor 110 may receive the parameter configuration completion signal from the module power supply 111 through the configuration status sensing interface and trigger the detector 112 to sample the electron beam to be sampled. That is to say, the configuration status transmission interface may send the parameter configuration completion signal, and the configuration status sensing interface may receive the parameter configuration completion signal to realize the working status sensing between the module power supply 111 and the processor 110. It can be understood that the communication between the processor 110 and the module power supply 111 is two-way, and the signal sending and receiving may be realized through the above-mentioned first parameter configuration interface, second parameter configuration interface, configuration status transmission interface, and configuration status sensing interface. The first parameter configuration interface and the configuration status sensing interface of the processor 110 may be independent or may be multiplexed under the communication protocol. The second parameter configuration interface and the configuration status transmission interface on the module power supply 111 may be independent or may be multiplexed under the communication protocol. The specific situation may be determined according to the actual application scenario and is not limited herein. In the embodiment of the present application, the processor 110 may communicate with the configuration status transmission interface of the module power supply 111 through the configuration status sensing interface, and receive the parameter configuration completion signal transmitted by the module power supply 111 through the configuration status sensing interface, and can quickly learn that the module power supply 111 has completed outputting the electrical signal corresponding to the electrical parameter to the electron beam modulation module 113, and then may trigger the detector 112 to sample the electron beam, which can reduce the delay between the completion of the module power supply 111 outputting the electrical signal corresponding to the electrical parameter to the electron beam modulation module 113 and the detector 112 starting to sample the electron beam, and thus can improve the data acquisition efficiency of the data acquisition system 11.

[0062] In some feasible embodiments, the above-mentioned first parameter configuration interface, second parameter configuration interface, configuration status transmission interface, and configuration status sensing interface may be SPI interfaces, and the SPI interface can achieve a high-speed and full-duplex communication connection between processors 110. Suppose that when the above-mentioned first parameter configuration interface, second parameter configuration interface, configuration status transmission interface, and configuration status sensing interface are all SPI interfaces, the processor 110 and the module power supply 111 are connected through the SPI interface, and one or more of the serial clock signal line (serial clock, SCLK), master output slave input signal line (master output slave input, MOSI), master input slave output signal line (master input slave output, MISO), slave select / chip select signal line (slave select / chip select, SS / CS), etc. can be used to connect between the SPI interfaces of the two devices to achieve full-duplex synchronous data transmission between the two devices. Optionally, in the process of transmitting multiple data signals (such as the first electrical parameter, the second electrical parameter, or the parameter configuration completion signal), there can be multiple SPI interfaces at both the transmitting and receiving ends of the device. Each signal can be transmitted and received through an independent SPI interface, and each signal can have an independent clock and data line, which can avoid conflicts between signals. There can also be only one SPI interface at both the transmitting and receiving ends of the device, and different signals can be sent and received in different time slots through the SPI protocol, thereby simplifying the device structure complexity at both the transmitting and receiving ends. The specific type and number of interfaces can be determined according to the actual application scenario and will not be limited here.

[0063] For example, please refer to Figure 5 , Figure 5 which is another structural schematic diagram of the data acquisition system for electron beam composition analysis provided by the embodiments of the present application. As Figure 5 shown, in Figure 3Based on the data acquisition system 11 shown, the processor 110 may include a digital-to-analog converter (DAC) and an analog-to-digital converter (ADC), namely DAC1, DAC2, ADC1, and ADC2 respectively, which can be used to convert digital signals into analog signals and analog signals into digital signals. For example, DAC1 can be used to convert the first electrical parameter into a first analog signal, and the first analog signal can be transmitted on the signal line to transmit the first electrical parameter to the module power supply 111. The processor 110 also includes Interface 1 to Interface 4. Correspondingly, the module power supply 111 includes Interface 5 to Interface 8, and the interfaces of the two end devices are connected one by one, and the above interfaces can all use the SPI interface. It can be understood that the number of the first parameter configuration interfaces in the processor 110 and the second parameter configuration interfaces in the module power supply 111, the configuration status sensing interfaces in the processor 110 and the configuration status transmission interfaces in the module power supply 111 can be equal and connected one by one. For example, Interface 1 of the processor 110 is connected to Interface 5 of the module power supply 111, Interface 2 of the processor 110 is connected to Interface 6 of the module power supply 111, Interface 3 of the processor 110 is connected to Interface 7 of the module power supply 111, and Interface 4 of the processor 110 is connected to Interface 8 of the module power supply 111. In the data acquisition system 11 as shown in Figure 5 Assume that in the data acquisition system 11 shown, Interface 1 and Interface 2 are the first parameter configuration interfaces, and Interface 3 and Interface 4 are the configuration status sensing interfaces. Correspondingly, Interface 5 and Interface 6 are the second parameter configuration interfaces, and Interface 7 and Interface 8 are the configuration status transmission interfaces. When the data acquisition system 11 starts to work, the processor 110 transmits the first electrical parameter to Interface 5 through Interface 1 to configure the module power supply 111, thereby triggering the module power supply 111 to output a first electrical signal corresponding to the first electrical parameter to the electron beam control module 113. After confirming the output of the first electrical signal, the module power supply 111 can transmit a parameter configuration completion signal to Interface 3 through Interface 7 to trigger the communication between the processor 110 and the detector 112, thereby triggering the detector 112 to start sampling the electron beam to obtain electron beam sampling data. After the detector 112 finishes sampling, the processor 110 transmits the second electrical parameter to Interface 6 through Interface 2 to configure the second electrical parameter of the module power supply 111, thereby triggering the module power supply 111 to output a second electrical signal corresponding to the second electrical parameter to the electron beam control module 113. After confirming the output of the second electrical signal, the module power supply 111 can transmit a parameter configuration completion signal to Interface 4 through Interface 8 to trigger the communication between the processor 110 and the detector 112, thereby triggering the detector 112 to start sampling a new electron beam.

[0064] In some feasible embodiments, the processor 110 may include a first detection start interface, and the first detection start interface may be connected to the detector 112. After the processor 110 confirms that the module power supply 111 outputs the first electrical signal, the processor 110 may output a detection start signal to the detector 112 through the first detection start interface. The detection start signal may be used to trigger the detector 112 to sample the electron beam. Here, the first detection start interface may be an interface that can achieve high-speed communication, including but not limited to a 9-pin D-type connector (DB9) interface, a twisted pair interface, an 8-pin modular connector (RJ45) interface, a three-wire interface, etc., which can be specifically determined according to the actual application scenario and is not limited here. In the embodiment of the present application, by outputting a detection start signal to the detector 112 through the first detection start interface of the processor 110 to trigger the detector 112 to sample the electron beam, real-time signal transmission between the processor 110 and the detector 112 can be achieved, the delay of the detector 112 starting the electron beam sampling can be reduced, and thus the data acquisition efficiency of the data acquisition system 11 can be improved.

[0065] Correspondingly, in some feasible embodiments, the detector 112 may include a second detection start interface, and the second detection start interface may be connected to the above-mentioned processor 110. After obtaining the detection start signal through the second detection start interface, the detector 112 may sample the electron beam. It can be understood that the processor 110 may transmit a detection start signal to the detector 112 through the first detection start interface. Correspondingly, the detector 112 may include a second detection start interface, and the second detection start interface may be connected to the first detection start interface to realize the connection between the processor 110 and the detector 112. Here, the second detection start interface may be an interface of the same type as the first detection start interface, or the detection start signal of the first detection start interface data may be converted into an interface signal of other types through an interface conversion chip to adapt to the second detection start interface of a different type from the first detection start interface. The specific device interface type may be determined according to the actual application scenario and is not limited here. The processor 110 may send a detection start signal to the detector 112 through the first detection start interface to trigger the detector 112 to sample the electron beam. Correspondingly, the detector 112 may receive the detection start signal from the processor 110 through the second detection start interface to respond to the trigger of sampling the electron beam, and the real-time control of the detector 112 by the processor 110 may be realized. Here, the detection start signal may be one of signals including but not limited to differential signals, single-ended signals, etc., and may be specifically determined according to the communication protocol supported by the interfaces at both the sending and receiving ends and the actual application scenario. For example, when the interfaces at both the sending and receiving ends support the RS232 single-ended serial communication standard, the detection start signal may be a single-ended signal; when the interfaces at both the sending and receiving ends support the RS485 differential serial communication standard, the detection start signal may be a differential signal. The signal type and port type may be specifically determined according to the actual application scenario and are not limited here. In the embodiment of the present application, the second detection start interface of the detector 112 may communicate with the first detection start interface of the above-mentioned processor 110 and receive the detection start signal transmitted by the first detection start interface. The detector 112 may receive the trigger instruction of the processor 110 through the detection start signal, and then start to sample the electron beam, and may respond to the real-time control of the detector 112 by the processor 110. The direct communication between the detector 112 and the processor 110 interface may reduce the delay of the detector 112 starting to sample the electron beam, and thus may improve the data acquisition efficiency of the data acquisition system 11.

[0066] In some feasible embodiments, the detector 112 may further include a detection status transmission interface, which can be connected to the above-mentioned processor 110. After the electron beam sampling is completed, the detector 112 can send a data acquisition completion signal to the above-mentioned processor 110 through the detection status transmission interface. Here, the detection status transmission interface can be a DB9 interface or an RJ45 interface, etc., which can implement the communication function between devices. It can be specifically determined according to the actual application scenario and is not limited here. After the electron beam sampling is completed, the detector 112 can transmit a data acquisition completion signal to the processor 110 through the detection status transmission interface. It can be understood that the data acquisition completion signal can be a differential signal, a single-ended signal, or other signal forms agreed upon by both parties of the device, which can be specifically determined according to the actual application scenario and is not limited here. In the embodiments of the present application, the data acquisition completion signal can be output to the processor 110 through the detection status transmission interface of the detector 112 to feedback the data acquisition situation to the processor 110, so as to realize the real-time status sharing between the two devices of the detector 112 and the processor 110, reduce the delay of status sharing between devices, and further improve the data processing performance of the system.

[0067] Correspondingly, in some feasible embodiments, the processor 110 may further include a detection status sensing interface, which can be connected to the above-mentioned detector 112. The processor 110 can be configured to, after receiving a data acquisition completion signal through the above-mentioned detection status sensing interface, configure a second electrical parameter for the above-mentioned module power supply 111 to perform the next sampling process. Here, the detection status sensing interface can be an interface of the same type as the detection status transmission interface, or the data acquisition completion signal output by the detection status transmission interface can be converted into an interface signal of other types through an interface conversion chip to adapt to the detection status sensing interface of a different type from the detection status transmission interface. The specific device interface type can be determined according to the actual application scenario and is not limited here. The detector 112 can transmit a data acquisition completion signal to the processor 110 through the detection status transmission interface to synchronize the completion status of the detector 112's acquisition. It can be understood that the data acquisition completion signal can indicate that the detector 112 has completed the sampling of the electron beam at this time. Correspondingly, the processor 110 can receive the data acquisition completion signal from the detector 112 through the detection status sensing interface and configure a new electrical parameter for the module power supply 111 to trigger the module power supply 111 to output a new electrical signal to generate a new electron beam to be sampled. That is to say, the detection status transmission interface can send a data acquisition completion signal, and the detection status sensing interface can receive the data acquisition completion signal to realize the sharing of the real-time working status between the two devices of the detector 112 and the processor 110. In the embodiment of the present application, the processor 110 can communicate with the above-mentioned detector 112 through the detection status sensing interface and receive the data acquisition completion signal transmitted by the detection status transmission interface. The processor 110 can know that the detector 112 has completed the sampling of the electron beam through the data acquisition completion signal, and then configure a second electrical parameter for the module power supply 111, which can realize the status sharing among the detector 112, the processor 110, and the module power supply 111. Through the direct communication between the interfaces of the detector 112 and the processor 110, the delay for the processor 110 to know the completion of data acquisition can be reduced, and further the delay for configuring the electrical parameters of the module power supply 111 can be reduced, which can improve the data acquisition efficiency of the data acquisition system 11 and has high applicability.

[0068] In some feasible embodiments, the detector 112 may further include a data transmission interface, and the data transmission interface is connected to the processor 110; the detector 112 is configured to output the sampling data to the processor 110 through the data transmission interface after the electron beam sampling is completed and the sampling data is obtained. The data transmission interface can be used to connect to the processor 110. Here, the data transmission interface can be a DB9 interface or a universal asynchronous receiver / transmitter (UART) interface, etc., which can implement data transmission between devices, and can be specifically determined according to the actual application scenario and is not limited here. The detector 112 can output the acquired data to the processor 110 through the data transmission interface after the data to be measured is acquired and the acquired data is obtained. It can be understood that the acquired data here can be transmitted on the signal line between the interfaces in the form of a digital signal, and the specific signal form can be agreed upon by the protocols of both devices and is not limited here. In the embodiments of the present application, the sampling data can be output to the processor 110 in real time through the data transmission interface of the detector 112 after the electron beam sampling is completed, which can reduce the delay of data synchronous transmission and thus improve the data transmission efficiency of the data acquisition system 11.

[0069] Correspondingly, in some feasible embodiments, the processor 110 may further include a data acquisition interface, which can be connected to the above-mentioned detector 112. The processor 110 can receive the sampling data sampled by the detector 112 through the data acquisition interface. Here, the data acquisition interface can be an interface of the same type as the data transmission interface, or the acquisition data output by the data transmission interface can be converted into an interface signal of other types through an interface conversion chip to adapt to the data acquisition interface of a different type from the data transmission interface. The specific device interface type can be determined according to the actual application scenario and is not limited here. The detector 112 can transmit the acquisition data to the processor 110 through the data acquisition interface. The processor 110 can upload or store the acquisition data received through the data acquisition interface and output new electrical parameters to the module power supply 111 to complete the configuration of a new data generation source and then generate new data to be measured for acquisition. It can be understood that the data transmission interface can send the acquisition data, and the data acquisition interface can receive the acquisition data to achieve data synchronization between the detector 112 and the processor 110, and further achieve data acquisition of the system. It can be understood that the communication between the processor 110 and the detector 112 is bidirectional, and signal transceiver and data synchronization can be achieved through the first detection start interface, the second detection start interface, the detection status transmission interface, the detection status sensing interface, the data transmission interface, and the data acquisition interface. The first detection start interface, the detection status sensing interface, and the data acquisition interface on the processor 110 can be independent or multiplexed under the communication protocol. The second detection start interface, the detection status sensing interface, and the data transmission interface on the detector 112 can be independent or multiplexed under the communication protocol. The specific can be determined according to the actual application scenario and is not limited here. In the embodiment of the present application, by communicating through the data acquisition interface of the processor 110 with the detector 112, the processor 110 can receive the sampling data output by the detector 112 in real time after the detector 112 finishes sampling the electron beam, which can reduce the delay of data synchronization. Similarly, the data transmission efficiency of the data acquisition system 11 can be improved.

[0070] In some feasible embodiments, the first detection start interface, the second detection start interface, the detection status transmission interface, the detection status sensing interface, the data transmission interface, and the data acquisition interface can all use the RS485 communication standard. RS485 can be used as a differential serial communication standard for signal transmission and reception between two devices, and can achieve half-duplex and multi-point communication between two devices. Assume that when the first detection start interface, the second detection start interface, the detection status transmission interface, the detection status sensing interface, the data transmission interface, and the data acquisition interface all adopt physical connectors based on RS485 communication (which can be referred to as RS485 interfaces for convenience of description), the interfaces between the processor 110 and the detector 112 can be connected through two differential signal lines and one ground wire. Here, the two differential signal lines can be a positive differential signal line and a negative differential signal line, and the two differential signal lines can be used to transmit data signals. The ground wire can provide a reference level for the data signals. The combination of the three signal lines can provide high signal anti-interference ability to ensure the reliability of communication, so as to achieve real-time communication between the processor 110 and the detector 112. Optionally, during the transmission process of multiple data signals such as detection start signals, data acquisition completion signals, and acquired data, the transmitting and receiving end devices can transmit signals through multiple RS485 interfaces. Each signal can be transmitted and received through an independent RS485 interface, and each signal can have independent clock and data lines, which can avoid signal conflicts. The transmitting and receiving end devices can also have only one multiplexed RS485 interface, and different signals can be sent and received in different time slots through the RS485 protocol, thereby simplifying the device structure complexity of the transmitting and receiving end devices. The specific type and number of interfaces can be determined according to the actual application scenario and are not limited here. For example, please refer to Figure 6 , Figure 6 which is another structural schematic diagram of the data acquisition system for electron beam composition analysis provided by the embodiments of the present application. As Figure 6 shown, on the basis of the data acquisition system 11 shown in Figure 5 , the processor 110 can include interface 9 and interface 10. Correspondingly, the detector 112 includes interface 11 and interface 12. The interfaces of the two end devices are connected one by one, and the above interfaces can all adopt RS485 interfaces. For example, interface 9 of the processor 110 is connected to interface 11 of the detector 112, and interface 10 of the processor 110 is connected to interface 12 of the detector 112. RS485 communication is adopted between the above interfaces. In Figure 6In the data acquisition system 11 shown, assuming that interface 9 is multiplexed as the first detection start interface and the detection status sensing interface, and interface 10 is the data acquisition interface, correspondingly, interface 11 is multiplexed as the second detection start interface and the detection status transmission interface, and interface 12 is the data transmission interface. After confirming that the module power supply 111 outputs a first electrical signal to the electron beam control module 113, the module power supply 111 transmits a parameter configuration completion signal to the processor 110. When the processor 110 receives the parameter configuration completion signal, the processor 110 can send a detection start signal from interface 9 to interface 11 to trigger the detector 112 to sample the electron beam to obtain electron beam sampling data. After the detector 112 finishes the acquisition, the detector 112 can transmit a data acquisition completion signal from interface 11 to interface 9 to trigger the processor 110 to configure the second electrical parameter of the module power supply 111. In addition, the detector 112 can also send the sampling data from interface 12 to interface 10. After confirming that the module power supply 111 outputs a second electrical signal corresponding to the second electrical parameter to the electron beam control module 113, the module power supply 111 can send a parameter configuration completion signal to the processor 110 again to trigger communication between the processor 110 and the detector 112, that is, the processor 110 sends a detection start signal from interface 9 to interface 11 again, thereby triggering the detector 112 to start sampling a new electron beam. After the electron beam sampling is completed again, the detector 112 can send the sampling data from interface 12 to interface 10 and transmit an acquisition completion signal from interface 11 to interface 9 at the same time. In the embodiment of the present application, through the communication connection between the first detection start interface of the processor 110 and the second detection start interface of the detector 112, real-time triggering of the detector 112 by the processor 110 can be realized, and the delay in starting data acquisition by the detector 112 can be reduced. After the data acquisition is completed, through the communication connection between the detection status transmission interface of the detector 112 and the detection status sensing interface of the processor 110, and between the data transmission interface of the detector 112 and the data acquisition interface of the processor 110, the working state sensing and data synchronization between the two devices can be realized, the delay for the processor 110 to know that the data acquisition is completed can be reduced, and further the delay in triggering the electrical parameter configuration of the module power supply 111 can be reduced, thereby improving the data acquisition efficiency of the data acquisition system 11.

[0071] In some feasible embodiments, the data acquisition system 11 may further include a light intensity detection sensor 114, and the processor 110 may further include an analog-to-digital converter 1100. The light intensity detection sensor 114 may be connected to the analog-to-digital converter 1100. The light intensity detection sensor 114 may be configured to detect and generate light intensity data of the electron beam, and may transmit the detected light intensity data to the analog-to-digital converter 1100. The processor 110 may output the sampled data and the light intensity data to the host computer 10. It can be understood that the light intensity detection sensor 114 may collect the X-ray light intensity irradiating on the surface of the wafer 116 to be measured, and then convert it into light intensity data through the analog-to-digital converter 1100. It can be understood that the data collected by the data acquisition system 11 is used for electron beam composition analysis of the electron beam generated by irradiating the wafer 116 to be measured. The X-rays irradiating on the wafer 116 to be measured may come from a variety of light sources 1130, such as an X-ray tube, a synchrotron radiation source, a free electron laser, a plasma X-ray source, etc., one or more of which can be specifically determined according to the actual application scenario and will not be limited here. The selection of the light source 1130 may affect the accuracy and quality of the data obtained by subsequent sampling. Therefore, the light intensity data may be analyzed in the electron beam composition analysis to improve the accuracy of the electron beam composition analysis. The light intensity detection sensor 114 may include, but is not limited to, optoelectronic components such as a photoresistor, a photodiode, and an integrated light intensity sensor, which can be specifically determined according to the actual application scenario and will not be limited here. The output end of the light intensity detection sensor 114 may be connected to the input end of the analog-to-digital converter 1100 in the processor 110. The processor 110 may obtain the light intensity data and output the light intensity data to the host computer 10. Please refer to Figure 7 , Figure 7 is another structural schematic diagram of the data acquisition system for electron beam composition analysis provided by the embodiment of the present application. As Figure 7The data acquisition system 11 shown may include a light intensity detection sensor 114, a processor 110, a module power supply 111, a detector 112, and an electron beam control module 113. The processor 110 may include an analog-to-digital converter 1100. The electron beam control module 113 may include a light source 1130 (not shown in the figure), etc. The processor 110 may be externally connected to a host computer 10 (not shown in the figure) outside the data acquisition system 11 through a physical port or the like. The output end of the light intensity detection sensor 114 may be connected to the input end of the analog-to-digital converter. Here, the light intensity detection sensor 114 and the analog-to-digital converter 1100 may be connected through a physical port, which can be specifically determined according to the actual device structure and is not limited herein. When the light source 1130 irradiates the wafer to be measured, the light intensity detection sensor 114 may detect the light intensity (i.e., the light intensity) irradiated on the surface of the wafer to be measured, and transmit the obtained light intensity to the analog-to-digital converter 1100. Through the analog-to-digital converter 1100, it is converted into light intensity data. Furthermore, the processor 110 may upload the light intensity data and the acquisition data output by the detector 112 to the host computer 10. In the embodiment of the present application, by introducing the light intensity detection sensor 114, the light intensity data for generating the above-mentioned electron beam can be obtained through the cooperation between the light intensity detection sensor 114 and the analog-to-digital converter in the processor 110. The light intensity data and the sampling data can act together on the electron beam composition analysis, which can improve the richness of the data obtained by the data acquisition system 11, and further improve the effectiveness and reliability of the electron beam composition analysis. Here, the processor 110 may transmit the sampling data and the light intensity data to the host computer 10, which can reduce the resource occupancy of data synchronization, and further improve the system performance of the data acquisition system 11, with high applicability.

[0072] In some feasible embodiments, the data acquisition system 11 may further include a control unit 117. The control unit 117 can be used to connect the host computer 10 and the processor 110. The control unit 117 can be used to obtain the configuration parameters of the module power supply 111 from the host computer 10, and can obtain multiple electrical parameters for configuring the module power supply 111 based on the configuration parameters. Among them, one sampling process corresponds to one electrical parameter, and the multiple electrical parameters may include a first electrical parameter and a second electrical parameter. The control unit 117 can also be used to transmit the multiple electrical parameters to the processor 110. It can be understood that the control unit 117 can be arranged outside the processor 110 to connect the host computer 10 and the processor 110. Here, the control unit 117 can be selected from a microprocessor (MPU), a digital signal processor (DSP), a microcontroller unit (MCU), etc. At this time, the processor 110 can be selected from a field programmable gate array (FPGA), etc., which can be specifically determined according to the actual application scenario and is not limited here. Here, the host computer 10 can be used to detect and control the data acquisition system 11, usually running on a terminal device or a server, and can obtain the acquisition data from the data acquisition system 11 and perform processing such as filtering, analysis, calculation, and storage on the acquisition data. The user can realize the detection and control of the data acquisition system 11 by the host computer 10 through user operations on terminal devices such as mobile phones and computers or servers. For example, the user can input the configuration parameters of the module power supply 111 into the host computer 10. The configuration parameters may include, but are not limited to, the current parameter of the magnetic lens 1131, the voltage parameter of the electrostatic lens 1132, the light intensity parameter of the light source 1130, etc., which can be specifically determined according to the actual application scenario and is not limited here. The control unit 117 can obtain the configuration parameters of the module power supply 111 from the host computer 10. Here, the configuration parameters can be input by the user through the host computer 10 or generated from historical data, which can be specifically determined according to the actual application scenario and is not limited here. The control unit 117 can obtain multiple electrical parameters configured to the module power supply 111 in multiple sampling processes based on the configuration parameters. Here, the type of configuration parameters obtained by the control unit 117 from the host computer 10 can be in the form of multiple data or a data block, etc., which can be specifically determined according to the actual situation and is not limited here. The control unit 117 can perform one or more parameter processes on the configuration parameters, including but not limited to fixed-point processing, data splitting processing, parameter recombination processing, etc., to obtain multiple electrical parameters configured to the module power supply 111 in multiple sampling processes from the configuration parameters.The control unit 117 can also be used to send multiple electrical parameters to the processor 110. Here, the control unit 117 can perform data transmission through serial communication, network port communication, etc., which can be specifically determined according to the actual application scenario and is not limited here. For example, please refer to Figure 8a , Figure 8a FIG. 4 is another schematic diagram of an application scenario of the data acquisition system for electron beam composition analysis provided by the embodiment of the present application. In the data acquisition system 11 shown in Figure 8a FIG. 5, there may be included a processor 110, a module power supply 111, a detector 112, an electron beam regulation module 113, and a control unit 117. Among them, the control unit 117 can select the above-mentioned MCU, MPU, DSP, etc., and is located between the host computer 10 and the processor 110, and can be connected to the host computer 10 and the processor 110 through a physical interface, etc. The specific structure and ports of the control unit 117 can be determined according to the actual application scenario and are not limited here. Assume that the user inputs the configuration parameters of the module power supply 111 in the host computer 10. The host computer 10 can transmit the configuration parameters to the control unit 117. The control unit 117 can obtain multiple electrical parameters based on the configuration parameters and transmit them to the processor 110. Further, the processor 110 can send the multiple electrical parameters to the module power supply 111 to configure the electrical parameters of the module power supply 111. After the detector 112 completes the acquisition, the detector 112 can send the sampling data to the processor 110. The control unit 117 can obtain the sampling data from the processor 110 and upload the sampling data to the host computer 10 to complete the data acquisition work of the data acquisition system 11. In the embodiment of the present application, by introducing the control unit 117, it can communicate with the host computer 10 to obtain configuration parameters, and obtain multiple electrical parameters based on the configuration parameters to transmit to the processor 110, which can achieve low-latency acquisition of electrical parameters, can perform preprocessing on the configuration parameters to obtain electrical parameters that can be used for configuring the module power supply 111, can reduce the data processing amount of the processor 110, reduce the latency of data transmission, and thus improve the data processing efficiency of the data acquisition system 11.

[0073] Optionally, the control unit 117 can also be set inside the processor 110 and can be integrated into the processor 110 as the first processing unit 1101. At this time, the processor 110 can also integrate a second processing unit 1102. The second processing unit 1102 can select components such as FPGA, and the first processing unit 1101 can select components such as MCU, MPU, DSP, etc., which can be specifically determined according to the actual application scenario and are not limited here. Here, the second processing unit 1102 can realize real-time control and data synchronization of the module power supply 111 and the detector 112. The first processing unit 1101 can be used to connect the host computer 10 and the second processing unit 1102, and thus realize data synchronization between the host computer 10 and the second processing unit 1102. For example, please refer toFigure 8b , Figure 8b is another schematic diagram of an application scenario of the data acquisition system for electron beam composition analysis provided by an embodiment of the present application. In the data acquisition system 11 as shown in Figure 8b , the data acquisition system 11 may include a processor 110, a module power supply 111, a detector 112, and an electron beam control module 113. Among them, the processor 110 is integrated by a first processing unit 1101 and a second processing unit 1102. The module power supply 111 and the detector 112 can be respectively connected to the second processing unit 1102. There is an internal connection between the first processing unit 1101 and the second processing unit 1102 in the processor 110. The first processing unit 1101 can be externally connected to the host computer 10 through a physical interface, etc. The specific connection method and ports can be determined according to the actual application scenario and are not limited here. Assume that the user inputs the configuration parameters of the module power supply 111 in the host computer 10. The host computer 10 can transmit the configuration parameters to the first processing unit 1101. The first processing unit 1101 can obtain multiple electrical parameters based on the configuration parameters and transmit them to the second processing unit 1102. Furthermore, the second processing unit 1102 can send the multiple electrical parameters to the module power supply 111 to configure the electrical parameters of the module power supply 111. After the detector 112 completes the acquisition, the detector 112 can send the sampling data to the second processing unit 1102. The first processing unit 1101 can obtain the sampling data from the second processing unit 1102 and upload the sampling data to the host computer 10 to complete the data acquisition work of the data acquisition system 11. It can be understood that by integrating the first processing unit 1101 and the second processing unit 1102 into the same processor 110, the first processing unit 1101 focuses on the communication management and task scheduling with the host computer 10. The two share data and resources through an internal bus, significantly reducing the external interface circuit and improving the system integration and anti-interference ability. The second processing unit 1102 directly controls external devices such as the module power supply 111 and the detector 112 through parallel hardware logic, providing nanosecond-level real-time response and high-speed data synchronization capabilities. This architecture not only retains the flexible logic control advantages of the first processing unit 1101 but also fully utilizes the hardware acceleration capabilities of the second processing unit 1102. At the same time, through dynamic function allocation and unified clock management, while reducing power consumption and cost, it significantly improves the system reliability, scalability, and development efficiency.

[0074] In some feasible embodiments, the processor 110 may include a first processing unit 1101 and a second processing unit 1102. Before receiving a data acquisition completion signal through the detection status sensing interface of the processor 110 to configure a second electrical parameter for the module power supply 111, during the sampling process, the first processing unit 1101 may send a voltage regulation instruction to the second processing unit 1102. The second processing unit 1102 may obtain the second electrical parameter according to the voltage regulation instruction, so as to configure the second electrical parameter for the module power supply 111 after receiving the data acquisition completion signal through the detection status sensing interface. Among them, the first processing unit 1101 may be an MCU, and the second processing unit 1102 is an FPGA. Here, the sampling process refers to the period during which the module power supply 111 configures the second electrical parameter and the detector 112 samples. Optionally, the second processing unit 1102 may be integrated with interfaces and modules including but not limited to a system synchronization controller 11020 (system synchronization controller, SSC11020), a unified interface controller 11021 (unified interface controller, UIC11021), a host port interface 11022 (host port interface, HPI 11022), etc., which can be specifically determined according to the actual application scenario and are not limited herein. Here, the second processing unit 1102 in the processor 110 may perform data reading and writing operations alternately through two data buffer areas under the action of modules such as the SSC11020, UIC11021, and HPI 11022, thereby realizing seamless data processing to optimize data processing and transmission efficiency. The second processing unit 1102 may provide a ping-pong interface to receive multiple electrical parameters sent by the first processing unit 1101 and the acquisition data output by the detector 112. It can be understood that the processor 110 can make the information interaction unblocked through the ping-pong interface within two large cycles through the ping-pong design, so as to realize the seamless pipelining of the module power supply 111 parameter adjustment and the detector 112 spectrum acquisition. For easy understanding, please refer to Figure 9 , Figure 9 is a schematic diagram of the pipelining operation of the processor 110 in the data acquisition system 11 for electron beam composition analysis provided by the embodiment of the present application. As Figure 9As shown, without adopting the ping-pong design, there is only one working cycle for the processor 110. That is, the second processing unit 1102 needs to complete the configuration of the module power supply 111 (i.e., voltage regulation shown in the figure) and the data acquisition of the detector 112 (i.e., spectrum acquisition shown in the figure) before receiving the voltage regulation instruction of the next cycle. It is impossible to achieve uninterrupted voltage regulation and spectrum acquisition, and the data acquisition efficiency is low. Assuming that the processor 110 adopts the ping-pong design shown in the figure and performs data caching and communication through the ping-pong interface, it is possible to perform voltage regulation and spectrum acquisition within two large cycles (large cycle A and large cycle B shown in the figure). As Figure 9 shown, during the process of voltage regulation and spectrum acquisition in large cycle A, the instruction issuance of large cycle B can be received. For example, when configuring the first electrical parameter of the module power supply 111, the first processing unit 1101 can output the second electrical parameter to the second processing unit 1102, and the second electrical parameter will be cached in the second processing unit 1102. After the spectrum acquisition work in large cycle A is completed, it is sent to the module power supply 111 to achieve uninterrupted voltage regulation and spectrum acquisition in a flowing water manner. The specific buffer structure and ping-pong interface structure can be determined according to the actual situation and are not limited here. It can be understood that in the second processing unit 1102, the ping-pong interface can be combined with modules such as SSC11020, UIC11021, and HPI 11022 to improve the data processing and transmission efficiency. For easy understanding, please also refer to Figure 10 , Figure 10 which is another structural schematic diagram of the data acquisition system for electron beam composition analysis provided by the embodiment of the present application. In the Figure 10 data acquisition system 11 shown, it includes a processor 110, a module power supply 111, a detector 112, and a light intensity detection sensor 114. Among them, the processor 110 is integrated by a second processing unit 1102 and a first processing unit 1101. The second processing unit 1102 may include modules such as SSC11020, UIC11021, and HPI 11022. The HPI 11022 can be used to connect the second processing unit 1102 and the first processing unit 1101, so that the first processing unit 1101 can read the storage space of the second processing unit 1102 to provide fast data transmission. The first processing unit 1101 can be externally connected to a host computer 10 outside the data acquisition system 11 (not shown in the figure), which can be specifically determined according to the actual application scenario and is not limited here. As Figure 10As shown, the UIC11021, as a unified interface manager, is mainly used to connect to the module power supply 111 and can integrate multiple SPI interfaces to communicate independently with multiple interfaces in the module power supply 111. Assuming that the data acquisition system 11 expects to obtain 14 groups of sampling signals, the module power supply 111 can be configured with 14 electrical parameters. The module power supply 111 can be connected to the UIC11021 module in the second processing unit 1102 through 14 SPI interfaces. The UIC11021 may include multiple digital-to-analog converters (such as Figure 10 DAC0 to DAC13 in UIC11021 shown) and multiple analog-to-digital converters (such as Figure 10 ADC0 to ADC13 in UIC11021 shown) to configure 14 electrical parameters (such as the above-mentioned first electrical parameter, second electrical parameter, etc.) to the module power supply 111 and receive the configuration completion signal fed back by the module power supply 111. As Figure 10 shown, the SSC11020 can be used to connect to the detector 112 and the light intensity detection sensor 114, can achieve clock synchronization and data synchronization between devices, and can integrate multiple communication protocols and interfaces, such as Figure 10 RS485, UART, SPI, etc. shown in, can achieve the transmission of detection start signals, data acquisition completion signals, and can also achieve the transmission of data such as acquired data and light intensity data. Assuming that the second processing unit 1102 uses RS485 to communicate with the detector 112, the status synchronization signal and data synchronization signal can be transmitted through independent signal lines and interfaces. As Figure 10 shown, the RS485_SYNC interface in can be used to transmit the detection start interface and data acquisition completion signal, thereby realizing the working state perception and real-time control between the second processing unit 1102 and the detector 112. The cooperation of RS485_DATA and URAT can be used to transmit the acquired data to realize the upload of the data acquired by the detector 112. At the same time, the second processing unit 1102 can use the SPI interface to communicate with the light intensity detection sensor 114, that is, the light intensity detection sensor 114 can be connected to the analog-to-digital converter in the SSC11020 through the SPI interface (such as Figure 10 ADC0 to ADC3 in SSC11020 shown) to transmit the acquired light intensity data as data to the processor 110 and then transmit it to the first processing unit 1101 for output together with the sampling data. In the embodiment of the present application, through the processor 110 integrated by the first processing unit 1101 and the second processing unit 1102, flexible adoption of multiple communication protocols and interfaces can achieve gapless voltage regulation and spectrum acquisition, reduce the latency of working state sharing and data synchronization between devices, so as to improve the data acquisition efficiency of the data acquisition system 11. At the same time, by adopting the integrated method, the structure of the data acquisition system 11 can be kept simple and highly applicable.

[0075] Generally speaking, the data acquisition system 11 for electron beam composition analysis provided by the embodiments of the present application at least consists of a module power supply 111, a detector 112, and a processor 110. It may also include functional components such as a light intensity detection sensor 114 and a power supply unit, and can be externally connected to a host computer 10, a terminal device, etc. The data acquisition system can dynamically configure the electrical parameters of the module power supply 111 through the processor 110, trigger the detector 112 to sample the electron beam, and switch the configured electrical parameters to the module power supply 111 after receiving the feedback signal from the detector 112 to perform the next round of sampling. The module power supply 111 can supply power to the electron beam regulation module 113, the detector 112 can sample the electron beam, the processor 110 can realize information intercommunication with the module power supply 111 and information intercommunication with the detector 112, can realize real-time communication between devices, and further can realize real-time control of the module power supply 111 and the detector 112 by the processor 110, can reduce the delay of communication between devices, can realize real-time status perception between devices. Through the collaborative work of the module power supply 111, the detector 112, and the processor 110, high-efficiency data acquisition for electron beam composition analysis can be realized, and the applicability is high. Thus, it can be seen that the data acquisition system 11 provided by the embodiments of the present application can improve work efficiency, enhance the user experience, and strengthen the market competitiveness of the product.

[0076] Please refer to Figure 11 , Figure 11 which is a schematic flowchart of the data acquisition method for electron beam composition analysis provided by the embodiments of the present application. The data acquisition method for electron beam composition analysis provided by the embodiments of the present application (which can be simply referred to as the data acquisition method for convenience of description) can be applied to the processor 110 in the data acquisition system 11 provided above Figures 1 to 10 wherein the data acquisition system 11 includes a module power supply 111, a detector 112, and the above-mentioned processor 110. Among them, the module power supply 111 can supply power to the electron beam regulation module 113 for regulating the above-mentioned electron beam, and the processor 110 can be respectively connected to the module power supply 111 and the detector 112. The processor 110 can sequentially execute multiple sampling processes. In each sampling process, the above-mentioned data acquisition method includes:

[0077] S1101, configure a first electrical parameter in the module power supply to configure the first electrical parameter for the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam regulation module.

[0078] In some feasible embodiments, before configuring the first electrical parameter of the module power supply, the processor may obtain multiple electrical parameters corresponding to the configured module power supply during multiple sampling processes from the host computer. Among them, one of the above sampling processes corresponds to one of the above electrical parameters, and the multiple electrical parameters include the first electrical parameter and the second electrical parameter. Optionally, the processor may obtain the configuration parameters of the module power supply from the host computer, and may perform data processing on the configuration parameters of the module power supply, including but not limited to fixed-point processing, slicing processing, etc., to obtain multiple electrical parameters corresponding to multiple sampling processes, which can be specifically determined according to the actual application scenario and are not limited herein. In the embodiments of the present application, the configuration data can be obtained through the host computer to obtain the electrical parameters for configuring the above module power supply, which can improve the flexibility and diversity of electrical parameter acquisition, reduce the data processing burden of the processor, optimize the resource utilization of the data acquisition system, reduce the delay of data preprocessing for electrical parameters, improve the configuration efficiency of the module power supply and the power supply efficiency for the electron beam modulation module, and thus improve the data acquisition efficiency.

[0079] In some feasible embodiments, the processor may include a first parameter configuration interface. Here, the first parameter configuration interface may be connected to the module power supply, and the processor may configure the first electrical parameter for the module power supply through the first parameter configuration interface, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter to the electron beam modulation module and feeds back a parameter configuration completion signal after outputting the first electrical signal. It can be understood that the first electrical parameter may be converted into an analog signal through components such as a digital-to-analog converter in the processor and then transmitted on the signal line to complete the configuration of the first electrical parameter of the module power supply, and a parameter configuration completion signal is fed back after the module power supply outputs the first electrical signal corresponding to the first electrical parameter. For example, refer to Figure 6 , such as Figure 6 The interface 1 of the processor shown can be used as the first parameter configuration interface. The processor may transmit the first electrical parameter to the interface 5 of the module power supply through the interface 1 to configure the first electrical parameter of the module power supply. Here, the interface 1 outputs the first electrical parameter as the first parameter configuration interface, which can implement the configuration of the first electrical parameter for the module power supply. After the module power supply outputs the first electrical signal corresponding to the first electrical parameter to the electron beam modulation module, it may feed back a parameter configuration completion signal to the processor. In the embodiments of the present application, communication can be performed between the processor and the module power supply through the first parameter configuration interface in the processor, the first electrical parameter can be output to the module power supply to configure the first electrical parameter for the module power supply, and then the module power supply is triggered to output a corresponding first electrical signal to the electron beam modulation module based on the first electrical parameter configuration, which can achieve real-time triggering of the electrical parameter configuration of the module power supply, reduce the delay of data synchronization between the processor and the module power supply, improve the communication efficiency between the processor and the module power supply, improve the configuration efficiency of the electrical parameters of the module power supply, and thus improve the power supply efficiency of the module power supply for the electron beam modulation module, with high applicability.

[0080] In specific implementation, the implementation manner of the electrical parameters (including the first electrical parameter) of the processor-configured module power supply can refer to the implementation manner of the processor in the data acquisition system provided above, which will not be elaborated here. Figures 1 to 10 The implementation manner of the processor in the data acquisition system provided above, which will not be elaborated here.

[0081] S1102, after confirming that the module power supply outputs the first electrical signal, trigger the detector to sample the electron beam.

[0082] In some feasible embodiments, the processor may include a configuration status sensing interface. Here, the configuration status sensing interface can be connected to the module power supply. After the processor obtains the parameter configuration completion signal through the configuration status sensing interface, it can trigger the detector to sample the electron beam. Optionally, the processor can periodically or continuously detect whether the configuration status sensing interface receives the parameter configuration completion signal sent by the module power supply, which can be specifically determined according to the actual application scenario and will not be limited here. For example, Figure 6 the interface 3 of the processor shown can be used as the configuration status sensing interface. The processor can obtain the parameter configuration completion signal output by the module power supply through interface 7 through interface 3, so as to know that the module power supply has completed outputting the electrical signal corresponding to the electrical parameter to the electron beam modulation module, and then trigger the processor and the detector to communicate to trigger the detector to start collecting the data to be measured. In the embodiment of the present application, communication can be performed between the processor and the module power supply through the configuration status sensing interface of the processor. By receiving the parameter configuration completion signal transmitted by the module power supply through the configuration status sensing interface, it can be quickly known that the module power supply has completed outputting the first electrical signal, and then the detector can be triggered to perform electron beam sampling, which can reduce the delay between the module power supply completing power supply to the electron beam modulation module and the detector starting to collect the data to be measured, and thus improve the data acquisition efficiency.

[0083] In some feasible embodiments, the processor may further include a first detection start interface. Here, the first detection start interface can be connected to the detector. The processor can output a detection start signal to the detector through the first detection start interface. The detection start signal can trigger the detector to sample the electron beam and feedback a data acquisition completion signal after the electron beam sampling is completed. It can be understood that after confirming that the module power supply outputs the first electrical signal, the processor can output a detection start signal to the detector through the first detection start interface. Here, the detection start signal can be used to trigger the detector to sample the electron beam. After the electron beam sampling is completed, the processor can receive the data acquisition completion signal fed back by the detector. For example, Figure 6The interface 9 of the shown processor can be used as the first detection start interface. The processor can send a detection start signal to the interface 11 of the detector through the interface 9 to trigger the detector to start collecting data to be measured. After the detector completes the sampling of the electron beam, it can output a data acquisition completion signal to the processor to trigger the processor to perform the next action. In the embodiment of the present application, communication can be carried out between the processor and the detector through the first detection start interface of the processor. After determining that the module power supply outputs the above first electrical signal, a detection start signal can be output to the above detector to trigger the detector to sample the electron beam, enabling real-time signal transmission between the processor and the detector, reducing the delay in starting data acquisition by the detector, and thus improving the data acquisition efficiency.

[0084] In specific implementation, the implementation method for the processor to trigger the detector to sample the electron beam can refer to the implementation method of the processor in the data acquisition system provided above. Figures 1 to 10 It will not be elaborated here.

[0085] S1103, receive the data acquisition completion signal fed back by the above detector after sampling the above electron beam, to trigger the configuration of the second electrical parameter for the above module power supply to perform the next sampling process.

[0086] In some feasible implementation manners, the processor may further include a detection status sensing interface. Here, the detection status sensing interface can be connected to the detector. After receiving the above data acquisition completion signal through the detection status sensing interface, the processor can configure the second electrical parameter for the above module power supply. Optionally, the processor can periodically or continuously detect whether the detection status sensing interface receives the data acquisition completion signal sent by the detector, which can be specifically determined according to the actual application scenario and will not be limited here. After receiving the data acquisition completion signal through the detection status sensing interface, the processor can trigger the configuration of the second electrical parameter of the module power supply. For example, Figure 6 the interface 9 of the shown processor can be reused as the detection status sensing interface. The processor can receive the data acquisition completion signal sent by the interface 11 of the detector through the interface 9 to trigger the configuration of the second electrical parameter of the module power supply. In the embodiment of the present application, communication can be carried out between the processor and the detector through the detection status sensing interface of the processor, and the data acquisition completion signal transmitted by the detection status transmission interface can be received. The processor can learn that the detector has completed the sampling of the electron beam through the data acquisition completion signal, and then start the process of configuring the second electrical parameter for the module power supply, enabling status sharing among the detector, the processor, and the module power supply. Through direct communication between the detector and the processor interface, the delay for the processor to learn the data acquisition completion can be reduced, and thus the delay in triggering the electrical parameter configuration of the module power supply can be reduced, improving the data acquisition efficiency and having high applicability.

[0087] In some feasible embodiments, the processor may include a first processing unit and a second processing unit. During the sampling process, the first processing unit may issue a voltage regulation instruction to the second processing unit, and the second processing unit may obtain a second electrical parameter according to the voltage regulation instruction, so as to configure the second electrical parameter for the module power supply after receiving the data acquisition completion signal through the detection status sensing interface. Here, the sampling process refers to the period during which the module power supply 111 configures the second electrical parameter and the detector 112 samples. Optionally, the first processing unit may be an FPGA, and the second processing unit may be an MCU, which can be specifically determined according to the actual application scenario and is not limited herein. Here, the first processing unit can be externally connected to the host computer through a physical interface or the like, can obtain configuration parameters from the host computer or transmit sampling data to the host computer, etc. At the same time, inside the processor, the first processing unit can be connected to the second processing unit. The first processing unit can send a voltage regulation instruction to the second processing unit, and the second processing unit can obtain the second electrical parameter based on the voltage regulation instruction and configure the second electrical parameter for the module power supply after obtaining the data acquisition completion signal. In this application, through the collaborative work of the first processing unit and the second processing unit of the processor, after the first processing unit issues a voltage regulation instruction, the second processing unit obtains the second electrical parameter in advance, and then triggers the electrical parameter configuration in real time after receiving the data acquisition completion signal, reducing the state sharing and data synchronization delay between devices, so as to improve the data acquisition efficiency and have high applicability.

[0088] In some feasible embodiments, the processor may further include a data acquisition interface. Here, the data acquisition interface can be connected to the detector, and the processor can receive sampling data from the detector through the above data acquisition interface. Optionally, the processor can periodically or continuously detect whether the data acquisition interface has received sampling data sent by the detector, which can be specifically determined according to the actual application scenario and is not limited herein. The processor can also receive acquisition data from the detector through the data acquisition interface. For example, Figure 6 the interface 10 of the processor shown can be used as the data acquisition interface, and the processor can receive the sampling data sent by the interface 12 of the detector through the interface 10 to store the sampling data or output the sampling data to an external device, etc. In the embodiments of this application, communication can be carried out with the detector through the data acquisition interface of the processor, and the sampling data output by the detector can be received in real time after the detector completes data acquisition, which can reduce the delay of data synchronization, and thus improve the data acquisition efficiency of the system.

[0089] In specific implementation, the implementation manners of the processor configuring the electrical parameters (including the second electrical parameter) of the module power supply other than the first electrical parameter and the processor obtaining the sampling data output by the detector can refer to the Figures 1 to 10 implementation manner of the processor in the provided data acquisition system, which will not be elaborated herein.

[0090] Generally speaking, in the data acquisition method provided by the embodiments of the present application, the processor can configure the module power supply by transmitting a first electrical parameter to the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam modulation module. After confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam. After receiving the data acquisition completion signal output by the detector, the second electrical parameter can be configured for the module power supply to perform the next sampling process. Therefore, through the closed-loop parameter configuration of the module power supply and the timing trigger control of the detector, the full-automatic sampling switching in the multi-parameter dynamic analysis of the electron beam is realized, and the data acquisition efficiency is significantly improved. It can be seen that the data acquisition method provided by the embodiments of the present application can improve the user experience and enhance the market competitiveness of the product.

[0091] The terms "first", "second", etc. in the description, claims and drawings of the embodiments of the present application are used to distinguish different objects, rather than to describe a specific order. In addition, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion. Those of ordinary skill in the art can realize that the units or steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0092] The above-disclosed are only the preferred embodiments of the present application, and of course, the scope of the rights of the present application cannot be limited thereby. Therefore, equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. An electron beam composition analysis data acquisition system, characterized in that, The data acquisition system includes a processor, a module power supply, and a detector. The module power supply is used to supply power to the electron beam control module. The processor is connected to the module power supply, and the processor is connected to the detector. The processor is used to sequentially execute multiple sampling processes. In each sampling process, the processor is used to: Configure a first electrical parameter for the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam control module. After confirming that the module power supply outputs the first electrical signal, trigger the detector to sample the electron beam. Receive the data acquisition completion signal fed back by the detector after sampling the electron beam, so as to trigger the configuration of a second electrical parameter for the module power supply to execute the next sampling process.

2. The data acquisition system according to claim 1, wherein The processor includes a first parameter configuration interface, and the first parameter configuration interface is connected to the module power supply. The processor is used to configure electrical parameters for the module power supply through the first parameter configuration interface, so as to trigger the module power supply to output an electrical signal corresponding to the electrical parameters for the electron beam control module. Among them, one sampling process corresponds to one electrical parameter, and the electrical parameters include the first electrical parameter and the second electrical parameter.

3. The data acquisition system according to claim 2, wherein, The module power supply includes a second parameter configuration interface, and the second parameter configuration interface is connected to the processor. The module power supply is used to receive the electrical parameters from the processor through the second parameter configuration interface and output an electrical signal corresponding to the electrical parameters to the electron beam control module.

4. The data acquisition system according to any one of claims 1 to 3, characterized in that, The module power supply further includes a configuration status transmission interface; the configuration status transmission interface is connected to the processor. The module power supply is used to transmit a parameter configuration completion signal to the processor through the configuration status transmission interface after outputting the first electrical signal corresponding to the first electrical parameter to the electron beam control module.

5. The data acquisition system according to claim 4, wherein The processor further includes a configuration status sensing interface, and the configuration status sensing interface is connected to the module power supply. The processor is used to trigger the detector to sample the electron beam after obtaining the parameter configuration completion signal through the configuration status sensing interface.

6. The data acquisition system according to any one of claims 1 to 5, characterized in that, The processor includes a first detection start interface, and the first detection start interface is connected to the detector. The processor is used to output a detection start signal to the detector through the first detection start interface after confirming that the module power supply outputs the first electrical signal. The detection start signal is used to trigger the detector to sample the electron beam.

7. The data acquisition system according to claim 6, characterized in that, The detector includes a second detection start interface, and the second detection start interface is connected to the processor. The detector is used to sample the electron beam after obtaining the detection start signal through the second detection start interface.

8. The data acquisition system according to claim 7, wherein, The detector further includes a detection status transmission interface, and the detection status transmission interface is connected to the processor. The detector is used to send a data acquisition completion signal to the processor through the detection status transmission interface after the electron beam sampling is completed.

9. The data acquisition system according to claim 8, wherein The processor further includes a detection status sensing interface, and the detection status sensing interface is connected to the detector; After receiving the data acquisition completion signal through the detection status sensing interface, the processor is configured to configure a second electrical parameter for the module power supply to perform the next sampling process.

10. The data acquisition system according to claim 9, characterized in that The processor includes a first processing unit and a second processing unit; during the sampling process, the first processing unit is configured to issue a voltage regulation instruction to the second processing unit, and the second processing unit is configured to obtain the second electrical parameter according to the voltage regulation instruction, so as to configure the second electrical parameter for the module power supply after receiving the data acquisition completion signal to perform the next sampling process.

11. The data acquisition system according to any one of claims 7-10, characterized in that, The detector further includes a data transmission interface, and the data transmission interface is connected to the processor; After the electron beam sampling is completed to obtain sampling data, the detector is configured to output the sampling data to the processor through the data transmission interface.

12. The data acquisition system according to claim 11, wherein The processor includes a data acquisition interface, and the data acquisition interface is connected to the detector; The processor is configured to receive the sampling data sampled by the detector through the data acquisition interface.

13. The data acquisition system according to any one of claims 1-12, characterized in that, The data acquisition system further includes a control unit, and the control unit is connected to the host computer and the processor; The control unit is configured to obtain the configuration parameters of the module power supply from the host computer, and obtain a plurality of electrical parameters for configuring the module power supply based on the configuration parameters, where one sampling process corresponds to one electrical parameter, and the plurality of electrical parameters include the first electrical parameter and the second electrical parameter; The control unit is further configured to transmit the plurality of electrical parameters to the processor.

14. The data acquisition system according to claim 13, wherein The data acquisition system further includes a light intensity detection sensor, and the processor further includes an analog-to-digital converter; the light intensity detection sensor is connected to the analog-to-digital converter; The light intensity detection sensor is configured to detect the light intensity data for generating the electron beam and transmit the detected light intensity data to the analog-to-digital converter; The control unit is further configured to obtain the sampling data and the light intensity data from the processor and output the sampling data and the light intensity data to the host computer.

15. A data acquisition method for electron beam composition analysis, characterized in that The method is applicable to a processor in a data acquisition system, and the data acquisition system includes a module power supply, a detector and the processor; the module power supply is configured to supply power to the electron beam regulation module; the processor is connected to the module power supply, and the processor is connected to the detector; The processor is configured to sequentially perform a plurality of sampling processes, and in each sampling process, the method includes: Configuring a first electrical parameter for the module power supply so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter for the electron beam regulation module; After confirming that the module power supply outputs the first electrical signal, triggering the detector to sample the electron beam; Receiving a data acquisition completion signal fed back by the detector after sampling the electron beam to trigger configuring a second electrical parameter for the module power supply to perform the next sampling process.

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