A semiconductor device thermal resistance measuring apparatus

Abstract

The application provides a kind of semiconductor device thermal resistance measuring equipment, applied to the technical field of measuring electric variable, comprising: cabinet, the top of cabinet is fixed with workbench, the middle part of workbench is provided with thermostatic base, and the side of workbench is provided with rack erected above thermostatic base, and the rack is matched with thermal resistance detector, and the top of rack is provided with pressing mechanism that can be pressed down to the upper end surface of thermostatic base to abut against the semiconductor device to be measured;The middle part of the upper end surface of thermostatic base is provided with flexible heat-conducting contact pad for adapting to the shape of semiconductor device to be measured, and temperature control assembly is arranged in flexible heat-conducting contact pad;The environment simulation mechanism is matched on the pressing mechanism.The application not only has high adaptability, high-precision thermal resistance test structure, can adapt to various shapes of semiconductor device for testing, but also can simulate the actual application environment of semiconductor device, can provide reliable data support for thermal management design of semiconductor device, and the overall use effect is good.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of measuring electrical variables, and particularly relates to a semiconductor device thermal resistance measuring device. BACKGROUND

[0002] Thermal resistance measurement of semiconductor devices is a key technology for evaluating the heat transfer efficiency of the device during operation, and its purpose is to quantify the thermal resistance of the device from the heat generating part (such as the chip junction) to the external environment or heat dissipation device. The smaller the thermal resistance, the stronger the heat dissipation capability of the device, the lower the temperature rise, and the higher the reliability.

[0003] At present, in the prior art, the thermal resistance test equipment of semiconductor devices usually adopts a rigid planar constant temperature base, and then collects temperature and power data through a thermal resistance tester for detection. However, the rigid planar constant temperature base is difficult to adapt to special-shaped packaging devices (such as curved substrates, flexible electronics or asymmetric power modules), and the air gap is generated at the contact interface due to the geometric shape mismatch, which causes the contact thermal resistance to increase significantly and the measurement result to deviate from the true value.

[0004] In addition, such traditional constant temperature base mainly relies on a single temperature control unit and cannot simulate different heat dissipation conditions (such as vacuum or forced convection), which leads to a large difference between the thermal resistance measurement result and the actual application environment of the device, especially for the thermal resistance measurement of semiconductor devices in high reliability scenarios such as automotive electronics and aerospace equipment, so that the ordinary thermal resistance measurement data is not conducive to supporting the semiconductor thermal management design in such environment.

[0005] Therefore, the present application proposes a semiconductor device thermal resistance measuring device to solve the above technical problems. SUMMARY

[0006] In view of the above problems in the prior art, the purpose of the present application is to provide a semiconductor device thermal resistance measuring device which has a high adaptability and a high-precision thermal resistance test structure, can adapt to various shapes of semiconductor devices for testing, and can provide reliable data support for the thermal management design of semiconductor devices in different application environments.

[0007] A semiconductor device thermal resistance measuring device comprises:

[0008] A cabinet, a workbench is fixed on the top of the cabinet, a constant temperature base is arranged in the middle of the workbench, and a rack is arranged on one side of the workbench above the constant temperature base, a thermal resistance detector is matched on the rack, and a pressing mechanism is arranged on the top of the rack and can be pressed downward to abut against a semiconductor device to be measured on the upper end surface of the constant temperature base;

[0009] A flexible heat-conducting contact pad for self-adapting to the shape of the semiconductor device to be measured is arranged in the middle of the upper end surface of the constant temperature base, and a temperature control assembly is arranged in the flexible heat-conducting contact pad.

[0010] The pressing mechanism is matched with an environment simulation mechanism, which is used to form a simulated environment for the semiconductor device under test on the constant-temperature base when the pressing mechanism abuts against the semiconductor device under test.

[0011] Optionally, a gas cylinder is fixed on the top of the rack, the shaft of the gas cylinder is vertically downward, and the pressing mechanism is fixed, forming the driving control of the pressing mechanism.

[0012] Optionally, the pressing mechanism comprises a fixing frame fixed to the lower end of the shaft of the gas cylinder, and a pressure sensor is installed in the fixing frame, the lower end of the pressure sensor is connected with a pressure head, and the pressure head is located at the bottom of the fixing frame.

[0013] Optionally, the environment simulation mechanism comprises a simulation cabin cover elastically installed at the lower end of the fixing frame, the simulation cabin cover covers the pressure head, and the covering area of the simulation cabin cover is adapted to the size of the upper end surface of the constant-temperature base.

[0014] Optionally, a spring is fixed at the top of the simulation cabin cover, the top end of the spring is installed at the lower end of the fixing frame, forming the elastic installation of the simulation cabin cover, and the bottom edge of the simulation cabin cover is surrounded by a spring.

[0015] Optionally, a convection air box is symmetrically fixed at both sides of the bottom of the simulation cabin cover, a plurality of air outlet holes are formed on one side of the convection air box towards the simulation cabin cover, and an air pipe is fixed on the other side of the convection air box.

[0016] Optionally, a connecting port for connecting a simulation device through a hose is arranged at the middle of the air pipe, a sealing plug for plugging the connecting port is slidably arranged in the air pipe, a screw rod is threadedly inserted at the end of the air pipe away from the convection air box, and one end of the screw rod is fixed with the sealing plug.

[0017] Optionally, a plurality of pressing plates are arranged around the upper end surface edge of the flexible heat-conducting contact pad, and a gas chamber for pushing the pressing plates to press the flexible heat-conducting contact pad is fixed at the upper end surface edge of the constant-temperature base.

[0018] Optionally, a plurality of gas chambers corresponding to the number of pressing plates are arranged, and a movable shaft movable with air pressure is inserted at one end of the gas chamber, the movable shaft is fixed with the upper end surface of the pressing plate, forming pushing and pressing.

[0019] Optionally, the temperature control assembly arranged in the flexible heat-conducting contact pad comprises a semiconductor refrigeration matrix, and a fixing seat is matched with the bottom of the flexible heat-conducting contact pad, a heat insulation layer is fixed to the inner bottom surface of the fixing seat, and the semiconductor refrigeration matrix is arranged between the flexible heat-conducting contact pad and the heat insulation layer.

[0020] The present application has the following advantages:

[0021] The semiconductor device thermal resistance measuring device, by matching the environmental simulation mechanism with the lower end of the pressing mechanism, makes the environmental simulation mechanism completely cover the constant temperature base and the semiconductor device under test while the pressure head is used to abut the semiconductor device under test placed on the constant temperature base, and cooperates with the air outlet holes arranged on both sides of the simulation cabin cover bottom, so that a hot air pump or a vacuum pump is connected to realize forced convection or vacuum and other semiconductor device actual application scenarios, which is beneficial to reproduce the heat transfer mode under extreme working conditions, thereby providing reliable data support for the thermal management design of semiconductor devices in high reliability scenarios such as automotive electronics and aerospace equipment.

[0022] Meanwhile, thanks to the flexible heat-conducting contact pad arranged on the constant temperature base, the flexible heat-conducting contact pad can be used to adaptively wrap different shapes of semiconductor devices, which can effectively avoid the problem of poor contact that may exist in planar contact, thereby avoiding the problem of deviation of the measurement result from the true value caused by the increase of contact thermal resistance, that is, it is beneficial to ensure the thermal resistance measurement accuracy of the semiconductor device.

[0023] In summary, the present application not only has a high-adaptability, high-precision thermal resistance test structure, but also can adapt to various shapes of semiconductor devices for testing, and can simulate the actual application environment of the semiconductor device, and can provide reliable data support for the thermal management design of the semiconductor device, and the overall use effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation on the present application. In the drawings:

[0025] Figure 1 is a structural schematic view of the semiconductor device thermal resistance measuring device in embodiment one of the present application;

[0026] Figure 2 is a structural schematic view of the pressing mechanism and the environmental simulation mechanism in embodiment one of the present application;

[0027] Figure 3 is an internal structural schematic view of the environmental simulation mechanism in embodiment one of the present application;

[0028] Figure 4is the internal structure diagram of the air pipe in embodiment one of the present application;

[0029] Figure 5 is the internal structure diagram of the flexible heat-conducting contact pad in embodiment one of the present application;

[0030] Figure 6 is the structure diagram of the semiconductor device thermal resistance measuring device in embodiment two of the present application;

[0031] Figure 7 is the structure diagram of the thermostat base in embodiment two of the present application.

[0032] marked as:

[0033] 1, case; 2, workbench; 3, thermostat base; 4, flexible heat-conducting contact pad; 401, fixed seat; 402, heat insulation layer; 403, semiconductor refrigeration matrix; 5, rack; 501, thermal resistance detector; 6, air cylinder; 7, pressing mechanism; 701, fixed frame; 702, pressure sensor; 703, pressure head; 8, environment simulation mechanism; 801, simulation cabin cover; 802, spring; 803, heat insulation rubber ring; 9, convection air box; 901, air outlet hole; 10, air pipe; 1001, connecting port; 1002, sealing plug; 1003, screw rod; 11, pressing plate; 12, air chamber; 13, movable shaft. DETAILED DESCRIPTION

[0034] Embodiment one:

[0035] As shown in Figure 1 , a semiconductor device thermal resistance measuring device, comprising a case 1, the top of the case 1 is fixed with a workbench 2, the middle of the workbench 2 is provided with a thermostat base 3, and one side of the workbench 2 is provided with a rack 5 arranged above the thermostat base 3, the rack 5 is matched with a thermal resistance detector 501, and the top of the rack 5 is provided with a pressing mechanism 7 capable of pressing downwardly against the upper end surface of the thermostat base 3 to abut against the semiconductor device to be measured. In specific implementation, the top of the rack 5 is fixed with an air cylinder 6, the machine shaft of the air cylinder 6 is vertically downward, and the pressing mechanism 7 is fixed thereon, forming the downward pressing driving control of the pressing mechanism 7.

[0036] match Figure 2As shown, the pressing mechanism 7 comprises a fixed frame 701 fixed to the lower end of the shaft of the cylinder 6, and a pressure sensor 702 is installed in the fixed frame 701, and the lower end of the pressure sensor 702 is connected with a pressure head 703 located at the bottom of the fixed frame 701. The pressure sensor 702 is used to detect the pressure of the semiconductor device, so as to facilitate the measurement of the thermal resistance of the semiconductor device under different pressure conditions. The pressing mechanism 7 is matched with an environment simulation mechanism 8, which is used to form a simulated environment for the semiconductor device to be tested on the constant-temperature base 3 when the pressing mechanism 7 abuts against the semiconductor device to be tested.

[0037] Specifically as Figure 3 As shown, the environment simulation mechanism 8 comprises a simulation cabin 801 elastically installed at the lower end of the fixed frame 701 (the simulation cabin 801 can be made of stainless steel, nickel plating or ceramic coating, etc. to ensure high temperature resistance and corrosion resistance), and the pressure head 703 is located in the simulation cabin 801, so that when the pressure head 703 is driven to move downward to abut against the semiconductor device to be tested, the simulation cabin 801 can first abut against the constant-temperature base 3, and the size of the simulation cabin 801 is matched with the size of the upper end surface of the constant-temperature base 3, so that when the pressing mechanism 7 moves downward, the simulation cabin 801 can completely cover the upper end surface of the constant-temperature base 3.

[0038] In this embodiment, the top of the simulation cabin 801 is fixed with a spring 802, the top end of the spring 802 is installed at the lower end of the fixed frame 701, and the simulation cabin 801 is elastically installed. The bottom edge of the simulation cabin 801 is surrounded by a heat insulation rubber ring 803, so that when the simulation cabin 801 abuts against and covers the upper end surface of the constant-temperature base 3, the heat insulation rubber ring 803 improves the sealing effect of the abutment, which is beneficial to ensure the environment simulation effect in the simulation cabin 801.

[0039] Among them, the bottom of the simulation cabin 801 is fixed with a convection air box 9 symmetrically on both sides, a plurality of air outlet holes 901 are formed on one side of the convection air box 9 facing the simulation cabin 801, and the other side of the convection air box 9 is fixed with an air pipe 10. Specifically as Figure 4 As shown, the middle part of the air pipe 10 is provided with a connecting port 1001 for connecting a simulation device through a hose, and the simulation device can be a hot air pump or a vacuum machine. In specific implementation, the connecting port 1001 can be connected with a hot air pump to form a convection simulation, or connected with a vacuum pump to form a vacuum simulation, and the hot air pump, vacuum pump and other devices can be integrated in the case 1.

[0040] In addition, a sealing plug 1002 for plugging the connecting port 1001 is slidably arranged in the vent pipe 10, and a screw rod 1003 is threadedly inserted into one end of the vent pipe 10 away from the convection air bellow 9, and one end of the screw rod 1003 is fixed to the sealing plug 1002. Therefore, the sealing plug 1002 can be controlled to move in the vent pipe 10 by rotating the screw rod 1003, and the opening and closing of the connecting port 1001 can be controlled.

[0041] As shown in Figure 1 The upper end surface of the thermostat base 3 is further provided with a flexible heat-conducting contact pad 4 for adapting to the shape of the semiconductor device to be measured. The flexible heat-conducting contact pad 4 can be made of, but is not limited to, a silicone-based composite material (such as boron nitride-filled silicone, aluminum oxide-filled silicone, etc.), and a temperature control component is arranged in the flexible heat-conducting contact pad 4.

[0042] As shown in Figure 5 The temperature control component arranged in the flexible heat-conducting contact pad 4 includes a semiconductor refrigeration matrix 403, and the bottom of the flexible heat-conducting contact pad 4 is fitted with a fixing seat 401, and a heat insulation layer 402 is fixed to the inner bottom surface of the fixing seat 401. The semiconductor refrigeration matrix 403 is arranged between the flexible heat-conducting contact pad 4 and the heat insulation layer 402, and is bonded to the flexible heat-conducting contact pad 4 by using a heat-conducting adhesive.

[0043] Embodiment Two:

[0044] As shown in Figure 6 Compared with Figure 7 The difference between the structure of the second embodiment and the first embodiment is that:

[0045] Four pressing plates 11 are arranged around the upper end surface edge of the flexible heat-conducting contact pad 4, and an air chamber 12 for pushing the pressing plates 11 to press the flexible heat-conducting contact pad 4 is fixed to the upper end surface edge of the thermostat base 3. The air chamber 12 also has four air chambers corresponding to the number of pressing plates 11.

[0046] Meanwhile, one end of the air chamber 12 is inserted with a movable shaft 13 that can move with air pressure, and the movable shaft 13 is fixed to the upper end surface of the pressing plate 11 to form a pushing and pressing structure. A dust collection pressure detector is arranged in the air chamber 12 for monitoring the abutting pressure of the flexible heat-conducting contact pad 4 on the semiconductor device to be measured. By adjusting the pressing of the pressing plates 11 on different positions of the flexible heat-conducting contact pad 4, the abutting pressure of the flexible heat-conducting contact pad 4 on the semiconductor device at the corresponding position can be adjusted, and the pressure balance of the contact on the semiconductor device can be ensured.

[0047] In addition, in other embodiments, a thermocouple or an infrared sensor can also be embedded in the flexible heat-conducting contact pad 4 to facilitate multi-zone independent temperature control by PID algorithm.

[0048] Working principle: the semiconductor device thermal resistance measuring equipment, in use, the semiconductor device to be measured is placed on the surface of the flexible heat-conducting contact pad 4 on the constant temperature base 3, then the air cylinder 6 is started to drive the pressure head 703 to move down, in the process, the simulation cabin cover 801 will first cover the upper end face of the constant temperature base 3 as the fixed frame 701 moves down, then the pressure head 703 abuts against the semiconductor device to be measured, forming a limiting fixation.

[0049] At the same time, the flexible heat-conducting contact pad 4 can ensure that the bottom of the semiconductor device is wrapped and contacted, which can effectively avoid gaps, and the air pressure of the air chamber 12 can be controlled to push the pressing plate 11, so as to adjust the extrusion of the flexible heat-conducting contact pad 4 at different positions, so that the contact pressure of the flexible heat-conducting contact pad 4 at each position tends to be balanced, thereby effectively avoiding the possible poor contact problem of plane contact, and ensuring the thermal resistance measurement precision of the semiconductor device.

[0050] After the semiconductor device is abutted and limited as described above, the actual application environment of the semiconductor device to be measured can be further connected with the hot air pump or vacuum pump through the air pipe 10 to realize the simulation of the actual application scene of the semiconductor device such as forced convection or vacuum, and the heat transfer mode under extreme working conditions can be reproduced, so as to provide reliable data support for the thermal management design of the semiconductor device in high reliability scenes such as automobile electronics and aerospace equipment.

[0051] In summary, the present application has a high adaptability, a high-precision thermal resistance test structure, which can adapt to various shapes of semiconductor devices for testing, and can simulate the actual application environment of the semiconductor device, and can provide reliable data support for the thermal management design of the semiconductor device, and the overall use effect is good.

[0052] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor device thermal resistance measuring apparatus characterized by comprising: Include: The cabinet (1), the top of the cabinet (1) is fixed with a workbench (2), the middle part of the workbench (2) is provided with a constant temperature base (3), and one side of the workbench (2) is provided with a rack (5) arranged above the constant temperature base (3), the rack (5) is matched with a thermal resistance detector (501), and the top of the rack (5) is provided with a pressing mechanism (7) which can be pressed downward to abut the upper end face of the constant temperature base (3) and abut the semiconductor device to be tested; The upper end face of the constant temperature base (3) is provided with a flexible heat-conducting contact pad (4) for adapting to the shape of the semiconductor device to be tested, and the flexible heat-conducting contact pad (4) is provided with a temperature control assembly; The upper end face edge of the flexible heat-conducting contact pad (4) is provided with a plurality of pressing plates (11), and the upper end face edge of the constant temperature base (3) is fixed with an air chamber (12) for pushing the pressing plates (11) to press the flexible heat-conducting contact pad (4). The temperature control assembly includes a semiconductor refrigeration matrix (403), and the bottom of the flexible heat-conducting contact pad (4) is matched with a fixing seat (401), the inner bottom surface of the fixing seat (401) is fixed with a heat insulation layer (402), and the semiconductor refrigeration matrix (403) is arranged between the flexible heat-conducting contact pad (4) and the heat insulation layer (402); The pressing mechanism (7) is matched with an environment simulation mechanism (8), which is used to form a simulated environment for the semiconductor device to be tested on the constant temperature base (3) when the pressing mechanism (7) abuts the semiconductor device to be tested; The environment simulation mechanism (8) includes a simulation cabin cover (801) elastically mounted on the lower end of a fixed frame (701), the simulation cabin cover (801) covers a pressing head (703), and the covering area of the simulation cabin cover (801) is matched with the size of the upper end face of the constant temperature base (3); The top of the simulation cabin cover (801) is fixed with a spring (802), the top end of the spring (802) is mounted on the lower end of the fixed frame (701), forming the elastic mounting of the simulation cabin cover (801), and the bottom edge of the simulation cabin cover (801) is fixed with a heat insulation rubber ring (803).

2. The semiconductor device thermal resistance measurement apparatus according to claim 1, characterized by, The top of the rack (5) is fixed with an air cylinder (6), the machine shaft of the air cylinder (6) is vertically downward, and the pressing mechanism (7) is fixed, forming the downward driving control of the pressing mechanism (7).

3. The semiconductor device thermal resistance measurement apparatus according to claim 2, characterized by, The pressing mechanism (7) includes a fixed frame (701), the fixed frame (701) is fixed on the lower end of the machine shaft of the air cylinder (6), and a pressure sensor (702) is installed in the fixed frame (701), the lower end of the pressure sensor (702) is connected with a pressing head (703), and the pressing head (703) is located at the bottom of the fixed frame (701).

4. The semiconductor device thermal resistance measurement apparatus according to claim 3, characterized by The bottom of the simulation cabin cover (801) is fixed with a convection air box (9) symmetrically on both sides, a plurality of air outlet holes (901) are formed on one side of the convection air box (9) facing the simulation cabin cover (801), and the other side of the convection air box (9) is fixed with an air pipe (10).

5. The semiconductor device thermal resistance measurement apparatus according to claim 4, wherein The middle part of the ventilation pipe (10) is provided with a connecting port (1001) for connecting a simulation device through a hose, and a sealing plug (1002) is slidably arranged in the ventilation pipe (10) for plugging the connecting port (1001), and a screw rod (1003) is threadedly inserted into one end of the ventilation pipe (10) away from the convection air bellow (9), and one end of the screw rod (1003) is fixed with the sealing plug (1002).

6. The semiconductor device thermal resistance measurement apparatus according to claim 1, wherein A plurality of air chambers (12) are arranged corresponding to the number of the pressing plates (11), and one end of each air chamber (12) is inserted with a movable shaft (13) which can move with air pressure, and the movable shaft (13) is fixed with the upper end surface of the pressing plate (11) to form pushing and pressing.

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