Case temperature control method and device, case and storage medium

Abstract

The invention provides a case temperature control method and device, a case and a storage medium. The control method comprises the following steps: periodically acquiring the current case temperature and the current rotating speed of a fan according to a set sampling frequency; and performing first-level response control on the case temperature, namely, according to the deviation between the case temperature and a preset target temperature, adjusting the rotating speed of a fan by adopting a self-adaptive PI control algorithm so as to enable the case temperature to approach the target temperature. The method has a very good adjusting effect on a scene with relatively large temperature fluctuation.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic control, and particularly to a chassis temperature control method, device, chassis and storage medium. Background Art

[0002] In the field of industrial automation, industrial control computers play a very important role, and the control of the temperature of their chassis has always been a key topic of concern because temperature affects the service life of electronic devices, the performance and stability of the normal operation of the system. Temperature control generally combines with peripheral hardware, such as heat sinks, heat pipes, fans, etc., to prevent the temperature from being out of the expected range. However, the control of these hardware is not intelligent and does not adaptively regulate the temperature inside the industrial control computer, and the temperature control effect is not obvious.

[0003] In the prior art, the rotation speed of the fan can be controlled by PI regulation, and the temperature can be indirectly regulated. For example, when the temperature is higher than a certain set threshold, the rotation speed of the fan is increased. When the detected temperature drops to the expected value, the rotation speed of the fan is decreased. However, the existing PI regulation has an unsatisfactory regulation effect for scenarios with large temperature fluctuations. Summary of the Invention

[0004] In view of this, the present invention provides a chassis temperature control method, device, chassis and storage medium, which has a good regulation effect for scenarios with large temperature fluctuations.

[0005] In a first aspect, the present invention provides a chassis temperature control method. A fan is installed on the chassis for dissipating heat from the chassis. The method includes: Periodically obtaining the current chassis temperature and the current rotation speed of the fan according to the set sampling frequency; Performing a first-level response control on the chassis temperature, including: adjusting the rotation speed of the fan by using an adaptive PI control algorithm according to the deviation between the chassis temperature and the preset target temperature, so that the chassis temperature approaches the target temperature; The adaptive PI control algorithm satisfies the following expression: ; In the above expression, represents the rotation speed of the fan set this time, represents the current rotation speed of the fan, represents the proportional coefficient of PI control, represents the integral coefficient of PI control, represents the chassis temperature, represents the target temperature, is a preset exponential function with the deviation between the chassis temperature and the target temperature as a variable, and is used to reflect the non-linear change of the integral effect strength between the chassis temperature and the target temperature.

[0006] Optionally, the exponential function has the following expression: ; In the above expression, represents the width parameter of the exponential function, which takes a positive value.

[0007] Optionally, the heat source of the chassis includes the CPU of the motherboard, and the method further includes: Periodically determining whether the primary response control fails according to a set time interval. If the primary response control fails, perform secondary response control on the chassis temperature, including: determining whether the CPU frequency reaches the lower limit value. If not, reduce the CPU frequency.

[0008] Optionally, determining whether the primary response control fails includes: If the number of times the obtained chassis temperature exceeds the threshold temperature within the set time interval reaches a certain number, it is considered that the primary response control fails, where the threshold temperature is set according to the safe operation of the components in the chassis.

[0009] Optionally, the heat source of the chassis further includes the graphics processing unit GPU of the graphics card. Performing secondary response control on the chassis temperature further includes: if the CPU frequency reaches the lower limit value, determining whether the chassis temperature is on an upward trend. If so, determining whether the GPU core frequency reaches the lower limit value. If not, reduce the GPU core frequency; if the GPU core frequency reaches the lower limit value, control the buzzer to alarm.

[0010] Optionally, performing secondary response control on the chassis temperature further includes: If the chassis temperature is not on an upward trend, increment the outlier value by 1. The outlier value is used to reflect the situation where the chassis temperature is decreasing but still higher than the threshold temperature; Determine whether the outlier value is greater than the alarm threshold. If so, control the buzzer to alarm.

[0011] In a second aspect, the present invention provides a chassis temperature control device. The chassis is equipped with a fan for dissipating heat from the chassis. The device includes: An acquisition module for periodically acquiring the current chassis temperature and the current rotational speed of the fan according to a set sampling frequency; A primary response module for performing primary response control on the chassis temperature, including: adjusting the rotational speed of the fan using an adaptive PI control algorithm according to the deviation between the chassis temperature and a preset target temperature, so that the chassis temperature approaches the target temperature; The adaptive PI control algorithm satisfies the following expression: ; In the above expression, Indicates the fan speed set this time. Indicates the current speed of the fan. Indicates the proportional coefficient of PI control. Indicates the integral coefficient of PI control. Indicates the chassis temperature. Indicates the target temperature. Is a preset exponential function with the deviation between the chassis temperature and the target temperature as a variable, used to reflect the non-linear change in the strength of the integral action of the chassis temperature and the target temperature.

[0012] Optionally, the heat source of the chassis includes the CPU of the motherboard, and the device further includes: A secondary response module, configured to periodically determine whether the primary response control fails according to a set time interval. If the primary response control fails, perform secondary response control on the chassis temperature, including: determining whether the CPU frequency reaches the lower limit value. If not, reduce the CPU frequency.

[0013] In a third aspect, the present invention provides a chassis, including: A motherboard, on which there are a CPU, a graphics card with a graphics processing unit GPU, and a SuperIO chip; A chassis temperature thermistor, configured to collect the chassis temperature; A fan, configured to dissipate heat from the chassis; A buzzer, configured to emit an alarm signal; The SuperIO chip is connected to the chassis temperature thermistor, the fan, and the buzzer; The CPU is connected to the SuperIO chip through an LPC bus; The CPU is configured to execute a computer program to implement the chassis temperature control method provided in the first aspect.

[0014] In a fourth aspect, the present invention provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the chassis temperature control method provided in the first aspect.

[0015] The chassis temperature control method, device, chassis, and storage medium provided by the present invention add a function that reflects the non-linear change in the strength of the integral action of the chassis temperature and the target temperature to the traditional PI regulation, and control the fan speed through this adaptive PI control algorithm. When the error between the target temperature and the current temperature is large, the integral action is reduced, thereby suppressing temperature overshoot. When the temperature error is small, the integral action is increased, thereby better approaching the target temperature value, so as to adaptively adjust the fan speed, and has a good adjustment effect for scenarios with large temperature fluctuations. Description of the Drawings

[0016] Figure 1 It is a schematic flow chart of the chassis temperature control method in an embodiment of the present invention; Figure 2 It is a curve graph corresponding to the function introduced by PI regulation in an embodiment of the present invention; Figure 3 It is a schematic flow chart of the chassis temperature control method in another embodiment of the present invention; Figure 4 It is a schematic diagram of the chassis temperature control device in an embodiment of the present invention; Figure 5 It is a schematic diagram of the chassis temperature control device in another embodiment of the present invention; Figure 6 It is a schematic structural diagram of the chassis in an embodiment of the present invention. Specific embodiments

[0017] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0018] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances for the embodiments of this application described here. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0019] The following will describe in detail some embodiments of the present invention with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0020] An embodiment of the present invention provides a chassis temperature control method. A fan is installed in the chassis for dissipating heat from the chassis. As Figure 1 shown, the control method includes the following steps: S11, periodically obtain the current chassis temperature and the current rotational speed of the fan according to the set sampling frequency; S12, perform primary response control on the chassis temperature, including: according to the deviation between the chassis temperature and the preset target temperature, adopt an adaptive PI control algorithm to adjust the fan speed so that the chassis temperature approaches the target temperature; The adaptive PI control algorithm satisfies the following expression: ; In the above expression, represents the fan speed set this time, represents the current fan speed, represents the proportional coefficient of PI control, represents the integral coefficient of PI control, represents the chassis temperature, represents the target temperature, is a preset exponential function with the deviation between the chassis temperature and the target temperature as a variable, used to reflect the non-linear change of the integral effect strength between the chassis temperature and the target temperature.

[0021] Elaborate on the above control method.

[0022] Normally, in an environment where the chassis temperature is desired to run at the target temperature (for example, 45 °C), when the chassis temperature is lower than the target temperature, the fan speed needs to be reduced to increase the chassis temperature. Similarly, when the chassis temperature is higher than the target temperature, the fan speed needs to be increased to achieve the heat dissipation effect. Based on this temperature control idea, PI control is as shown in Equation (1): (Equation 1) The explanations of each parameter can be referred to the above description. It can be seen from Equation (1) that on the basis of the current fan speed, PI adjustment is introduced, that is, the proportional coefficient is multiplied by the difference between the target temperature and the chassis temperature, and then the integral coefficient is multiplied by the integral of the difference between the target temperature and the chassis temperature, so as to obtain the fan speed that needs to be set this time. Therefore, ideally, when the target temperature is equal to the chassis temperature, that is, when the fan speed output remains unchanged.

[0023] However, when the temperature fluctuates greatly, such as when the temperature rises rapidly within a short period of time. Fixed proportional coefficients or integral coefficients are not conducive to temperature control and cause system instability. Combining the non-linear integral idea, the integral directly acts on the steady-state error. When the error between the target temperature and the chassis temperature is large, the integral effect is reduced to suppress temperature overshoot. When the temperature error is small, the integral effect is increased to better approach the target temperature.

[0024] Therefore, on the basis of Equation (1), a function y can be designed. This function y can reflect the non-linear change of the integral effect strength between the chassis temperature and the target temperature. Introduce this function y into Equation 1 to adaptively adjust the temperature. Adaptive PI control is as shown in Equation (2): ; (Formula 2) The chassis temperature control method provided by the embodiment of the present invention adds a function with non-linear variation reflecting the strength of the integral action of the chassis temperature and the target temperature to the traditional PI regulation, and controls the fan speed through this adaptive PI control algorithm. When the error between the target temperature and the current temperature is large, the integral action is reduced to suppress the temperature overshoot. When the temperature error is small, the integral action is increased to better approximate the target temperature value, so as to adaptively adjust the fan speed, and it has a good adjustment effect for scenarios with large temperature fluctuations.

[0025] Preferably, the designed function y is as shown in Formula (3), the function output value y varies in [0,1], the function width parameter takes a positive value, and affects the fatness of the curve, that is, affects the speed of the integral action.

[0026] (Formula 3) The explanations of each parameter are as follows:

[0027] Take the function width parameter w = 36, and the curve corresponding to the function is as Figure 2 shown. The abscissa x is the difference between the target temperature and the chassis temperature, and the ordinate y is the function output value. When the temperature difference x is large, the function output value y is small; when the temperature difference x is small, the function output value y is large.

[0028] Substitute Formula (3) into Formula (2), and the adaptive PI control algorithm of the embodiment of the present invention is as shown in Formula (4). The integral system will adaptively change with the temperature difference, and better eliminate the steady-state error of the temperature.

[0029] Formula (4) The chassis temperature control method provided by the embodiment of the present invention only needs to set 1 width parameter w for the exponential function, the temperature control is more intelligent, the strategy implementation is convenient, and the adaptability is strong.

[0030] Furthermore, in practical applications, only the above first-level response control will result in the situation that the temperature cannot be controlled. Based on this, the embodiment of the present invention is further improved on the basis of the foregoing embodiment.

[0031] In one embodiment, the heat source of the chassis includes the CPU of the main board. Refer to Figure 3 , and the chassis temperature control method further includes the following steps: Step S13: Periodically determine whether the primary response control fails according to the set time interval. If the primary response control fails, proceed to step S14: Perform secondary response control on the chassis temperature. If the primary response control does not fail, return to step S11 and continue to perform primary response control on the chassis temperature; Among them, step S14 includes step S1401: Determine whether the CPU frequency reaches the lower limit value. If not, then reduce the CPU frequency.

[0032] According to an embodiment of the present invention, in step S13, determining whether the primary response control fails includes: If within the set time interval, the number of times the obtained chassis temperature exceeds the threshold temperature reaches a certain quantity, it is considered that the primary response control fails, where the threshold temperature is set according to the safe operation of the components inside the chassis.

[0033] For example, within the set time interval, a total of N times of chassis temperature are obtained. If more than half of these N times of chassis temperature are higher than the threshold temperature, it is considered that the primary response control fails; otherwise, it is considered that the primary response control does not fail (i.e., it is still effective).

[0034] As an implementation manner, the sampling period corresponding to the set sampling frequency is in milliseconds, and the set time interval is in seconds.

[0035] Suppose the set time interval is 3s and the sampling period is 1ms. A total of 3000 times of chassis temperature can be obtained within the set time interval. If more than 1500 times of the obtained chassis temperature are higher than the threshold temperature, it is considered that the primary response control fails.

[0036] Optionally, a failure flag bit can be defined. The failure flag bit being 1 indicates that the primary response control fails, and the failure flag bit being 0 indicates that the primary response control does not fail. Whether the primary response control fails can be determined by reading the failure flag bit.

[0037] According to an embodiment of the present invention, the heat source of the chassis further includes the graphics processing unit GPU of the graphics card. Refer to Figure 3 , step S14 further includes the following steps: Step S1402: If the CPU frequency reaches the lower limit value, determine whether the chassis temperature shows an upward trend. If so, proceed to step S1403: Determine whether the GPU core frequency reaches the lower limit value. If not, then reduce the GPU core frequency; if the GPU core frequency reaches the lower limit value, then control the buzzer to alarm.

[0038] Further, step S14 further includes the following steps: Step S1404: If the chassis temperature does not show an upward trend, then increment the outlier value by 1. This outlier value is used to reflect the situation where the chassis temperature is decreasing but still higher than the threshold temperature; Step S1405: Determine whether the outlier is greater than the alarm threshold. If so, control the buzzer to give an alarm.

[0039] According to an embodiment of the present invention, the outlier is initialized to 0, and when it is determined that the primary response control has not failed, the outlier is cleared. The alarm threshold can be set to 3.

[0040] For the chassis temperature control method provided by the embodiment of the present invention, when the PI regulation of the primary response control fails, for example, when the chassis temperature is higher than the target temperature and lasts for a set time interval, secondary response control is performed on the chassis temperature. According to the chassis temperature and its change trend, appropriate CPU frequency and GPU core frequency are selected, thereby reducing the system power consumption and assisting the primary response control to further cool down, so as to return to the state where only the primary response control is required for the temperature.

[0041] Regarding the secondary response control, the following explanations are made.

[0042] When the chassis temperature remains at a very high level under the adaptive PI control within the set time interval (for example, in image recognition in an industrial automation production line or high-load operation of application programs in an operating system), and the fan speed has reached the maximum, secondary response control needs to be performed on the chassis temperature at this time.

[0043] The CPU frequency and GPU core frequency are the main sources affecting the power consumption of the industrial control computer, and they play an important role in the change of temperature. For example, the CPU frequencies are 400MHZ, 300MHZ, and 200MHZ; the GPU core frequencies are 600MHZ, 400MHZ, and 200MHZ, and the default setting is the highest frequency. If both the CPU frequency and GPU core frequency are very high, the temperature of the industrial control computer chassis will naturally become very high. Therefore, when the adaptive PI can no longer meet the expected temperature requirement by adjusting the fan speed, it is necessary to stepwise adjust the above CPU frequency and GPU core frequency, thereby changing the change of the industrial control computer chassis temperature.

[0044] The secondary response control is divided into two steps: Step 1: Without reaching the lower limit value of the CPU frequency, reduce the CPU frequency, and then return to the primary response for temperature regulation.

[0045] Step 2: When the CPU frequency has reached the lower limit value, it is necessary to judge the trend of the chassis temperature, and there are two cases: Case 1: If the chassis temperature shows an upward trend and has not reached the lower limit value of the GPU core frequency, reduce the GPU frequency, and then return to the primary response for temperature regulation. If the lower limit value of the GPU core frequency is reached, the buzzer will give an alarm.

[0046] Case 2: If the chassis temperature does not show an upward trend, it may be that the chassis temperature is decreasing, but the chassis temperature is higher than the threshold temperature. In this case, the outlier is incremented by 1. It is stipulated here that if the outlier is incremented by 1 three times in a row, it indicates that the secondary response control cannot cool down either, and the buzzer alarms. If during this period, the chassis temperature is lower than the threshold temperature, the outlier is reset to zero.

[0047] In addition, it should be noted that in the embodiments of the present invention, a two - level response control strategy is proposed. Generally, the operating system program continuously obtains the chassis temperature. At that time, the primary response control of the two - level response control strategy takes effect. Even if the PI regulation of the primary response control fails, the PI regulation will not stop. The trigger of the secondary response control has nothing to do with the deviation of the PI regulation and is related to the absolute temperature of the chassis.

[0048] On the other hand, the embodiments of the present invention provide a chassis temperature control device. A fan is installed on the chassis for dissipating heat from the chassis. As Figure 4 shown, the device includes: An acquisition module 401, configured to periodically acquire the current chassis temperature and the current rotational speed of the fan according to a set sampling frequency; A primary response module 402, configured to perform primary response control on the chassis temperature, including: adjusting the rotational speed of the fan by using an adaptive PI control algorithm according to the deviation between the chassis temperature and a preset target temperature, so that the chassis temperature approaches the target temperature; The adaptive PI control algorithm satisfies the following expression: ; In the above expression, represents the fan rotational speed set this time, represents the current rotational speed of the fan, represents the proportional coefficient of the PI control, represents the integral coefficient of the PI control, represents the chassis temperature, represents the target temperature, is a preset exponential function with the deviation between the chassis temperature and the target temperature as a variable, and is used to reflect the non - linear change of the integral action strength between the chassis temperature and the target temperature.

[0049] According to an embodiment of the present invention, the expression of the exponential function is: ; In the above expression, represents the width parameter of the exponential function, and it takes a positive value.

[0050] Furthermore, the heat source of the chassis includes the CPU of the motherboard, as Figure 5As shown in the figure, the chassis temperature control device further includes: A secondary response module 403, configured to periodically determine whether the primary response control fails according to a set time interval. If the primary response control fails, perform secondary response control on the chassis temperature, including: determining whether the CPU frequency reaches the lower limit value. If not, reduce the CPU frequency.

[0051] According to an embodiment of the present invention, the heat source of the chassis further includes a graphics processing unit GPU of the graphics card. The secondary response module 403 is further configured to, if the CPU frequency reaches the lower limit value, determine whether the chassis temperature shows an upward trend. If so, determine whether the GPU core frequency reaches the lower limit value. If not, reduce the GPU core frequency; if the GPU core frequency reaches the lower limit value, control the buzzer to alarm.

[0052] According to an embodiment of the present invention, the secondary response module 403 is further configured to, if the chassis temperature does not show an upward trend, increment the outlier value. The outlier value is used to reflect the situation where the chassis temperature is decreasing but still higher than the threshold temperature; Determine whether the outlier value is greater than the alarm threshold. If so, control the buzzer to alarm.

[0053] It can be understood that the chassis temperature control device provided by the embodiment of the present invention implements the foregoing method embodiments and can produce the same technical effects.

[0054] On the other hand, an embodiment of the present invention provides a chassis, as Figure 6 shown in the figure, the chassis includes: A main board 601, on which there are a CPU, a graphics card with a graphics processing unit GPU, and a SuperIO chip; A chassis temperature thermistor 602, configured to collect the chassis temperature; A fan 603, configured to dissipate heat from the chassis; A buzzer 604, configured to emit an alarm signal; The SuperIO chip is connected to the chassis temperature thermistor 602, the fan 603, and the buzzer 604; The CPU is connected to the SuperIO chip through an LPC (Low Pin Count) bus; The CPU is configured to execute a computer program to implement the chassis temperature control method provided by the foregoing embodiments.

[0055] Further, the following description is made. The SuperIO chip integrates the IO functions of low-speed devices and can be used to control GPIO pins, monitor the chassis temperature, fan speed, etc. The pin descriptions of its connected peripheral devices are as follows: SYSIN: Connects to the peripheral thermistor circuit to facilitate the SuperIO chip to calculate the chassis temperature.

[0056] SYSFANOUT: Control pin for the chassis fan speed.

[0057] SYSFANIN: Reading pin for the chassis fan speed.

[0058] GPIO: Control pin for the buzzer.

[0059] LPC is a low-speed device connection bus for connecting the CPU and the SuperIO chip. When the temperature cannot be controlled, the buzzer is used for alarming.

[0060] Here, it should be noted that for the pin functions led out by the SuperIO chip, there are corresponding registers inside the SuperIO chip. From the perspective of the operating system program level, controlling the SuperIO chip is to operate the corresponding registers. Therefore, the SuperIO chip provides an index port and a data port to the system to control its internal registers. The operation logic is to specify the register address and read or write it. For example, write the register address to the index port, and then read the data from the data port or write data to the data port. More specifically, for example, if you want to read the chassis temperature monitored by the SuperIO chip, assuming that the chassis temperature register address is specified as 0x55 in the SuperIO chip manual, the operating system program needs to write 0x55 to the index port and then read the value from the data port.

[0061] On the other hand, the embodiment of the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements the chassis temperature control method provided by the above embodiments.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chassis temperature control method, characterized in that, The chassis is equipped with a fan for dissipating heat from the chassis, and the method includes: Periodically obtaining the current chassis temperature and the current rotational speed of the fan according to a set sampling frequency; Performing first-level response control on the chassis temperature, including: adjusting the rotational speed of the fan using an adaptive PI control algorithm according to the deviation between the chassis temperature and a preset target temperature, so that the chassis temperature approaches the target temperature; The adaptive PI control algorithm satisfies the following expression: ； In the above expression, represents the fan speed set this time, represents the current fan speed, represents the proportional coefficient of PI control, represents the integral coefficient of PI control, represents the chassis temperature, represents the target temperature, is a preset exponential function with the deviation between the chassis temperature and the target temperature as a variable, and is used to reflect the non-linear change of the integral effect strength between the chassis temperature and the target temperature.

2. The method according to claim 1, characterized in that, The exponential function has the following expression: ； In the above expression, represents the width parameter of the exponential function, which takes a positive value.

3. The method according to claim 1, wherein The heat source of the chassis includes the CPU on the motherboard, and the method further includes: Periodically determining whether the first-level response control fails according to a set time interval. If the first-level response control fails, performing second-level response control on the chassis temperature, including: determining whether the CPU frequency reaches a lower limit value. If not, reducing the CPU frequency.

4. The method according to claim 3, wherein The determination of whether the first-level response control fails includes: If the number of times the obtained chassis temperature exceeds a threshold temperature reaches a certain amount within the set time interval, it is considered that the first-level response control fails, where the threshold temperature is set according to the safe operation of the components inside the chassis.

5. The method according to claim 4, wherein The heat source of the chassis further includes the graphics processing unit GPU of the graphics card. The second-level response control on the chassis temperature further includes: If the CPU frequency reaches the lower limit value, determining whether the chassis temperature shows an upward trend. If so, determining whether the GPU core frequency reaches the lower limit value. If not, reducing the GPU core frequency; if the GPU core frequency reaches the lower limit value, controlling the buzzer to give an alarm.

6. The method according to claim 5, wherein The second-level response control on the chassis temperature further includes: If the chassis temperature does not show an upward trend, incrementing an outlier value, where the outlier value is used to reflect the situation where the chassis temperature is decreasing but still higher than the threshold temperature; Determining whether the outlier value is greater than an alarm threshold. If so, controlling the buzzer to give an alarm.

7. A chassis temperature control device, characterized in that, The chassis is equipped with a fan for dissipating heat from the chassis, and the device includes: An acquisition module for periodically obtaining the current chassis temperature and the current rotational speed of the fan according to a set sampling frequency; A first-level response module for performing first-level response control on the chassis temperature, including: adjusting the rotational speed of the fan using an adaptive PI control algorithm according to the deviation between the chassis temperature and a preset target temperature, so that the chassis temperature approaches the target temperature; The adaptive PI control algorithm satisfies the following expression: ； In the above expression, represents the fan speed set this time, represents the current fan speed, represents the proportional coefficient of PI control, represents the integral coefficient of PI control, represents the chassis temperature, represents the target temperature, is a preset exponential function with the deviation between the chassis temperature and the target temperature as a variable, and is used to reflect the non-linear change of the integral effect strength between the chassis temperature and the target temperature.

8. The device according to claim 7, characterized in that, The heat source of the chassis includes the CPU on the motherboard, and the device further includes: A second-level response module for periodically determining whether the first-level response control fails according to a set time interval. If the first-level response control fails, performing second-level response control on the chassis temperature, including: determining whether the CPU frequency reaches a lower limit value. If not, reducing the CPU frequency.

9. A chassis, characterized in that, Including: A motherboard with a CPU, a graphics card with a graphics processing unit GPU, and a SuperIO chip thereon; A chassis temperature thermistor for collecting the chassis temperature; A fan for dissipating heat from the chassis; A buzzer for emitting an alarm signal; The SuperIO chip is connected to the chassis temperature thermistor, the fan, and the buzzer; The CPU is connected to the SuperIO chip through an LPC bus; The CPU is configured to execute a computer program to implement the chassis temperature control method according to any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that, A computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the chassis temperature control method according to any one of claims 1 to 6 is implemented.

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