Intelligent temperature control device and method for optical communication device coupling production

By establishing a temperature field model and material characteristic mapping during the coupling process of optical communication devices, configuring temperature control strategies and displacement correction parameters, the problem of coordinated control of temperature distribution and material thermal response is solved, and higher coupling accuracy and power stability are achieved.

CN120335534AActive Publication Date: 2025-07-18WUHAN YILUT TECH CO LTD

Patent Information

Application Number
CN202510544611.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-28
Publication Date
2025-07-18
Estimated Expiration
2045-04-28

AI Technical Summary

Technical Problem

The prior art lacks joint modeling and coordinated control of temperature spatial distribution and device material thermal response during coupling of optical communication devices, resulting in reduced positioning accuracy and unstable optical power.

Method used

The temperature field model is established through the environmental acquisition unit, and the temperature control strategy and displacement correction parameters are configured in combination with the material data to form adaptive closed-loop control to optimize temperature and displacement compensation.

Benefits of technology

It improves the positioning accuracy and optical power output stability of coupling optical communication devices, and reduces the defect rate during the production process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides an intelligent temperature control device and method for optical communication device coupling production, and relates to the technical field of optical communication, and the device comprises an environment collection unit which is used for collecting a coupling packaging station environment data set; the data reading unit is used for acquiring device material data and an optimal coupling temperature value and configuring expansion displacement of temperature drift mapping; the strategy configuration unit is used for configuring a temperature control response strategy according to the station environment data set and the optimal coupling temperature value, and establishing a cooperative displacement correction parameter in combination with the expansion displacement; and the feedback correction unit is used for feeding back and adjusting a temperature control response strategy and a cooperative displacement correction parameter after executing coupling packaging. According to the invention, the technical problems of reduced coupling positioning precision and unstable optical power output caused by lack of a joint modeling and cooperative control mechanism for temperature spatial distribution and device material thermal response in the coupling process in the prior art are solved, and the coupling precision and power output stability of the optical communication device are improved.
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Description

Technical Field

[0001] This application relates to the field of optical communication technologies, and particularly to an intelligent temperature control device and method for the coupling production of optical communication devices. Background Art

[0002] In the process of coupling production of optical communication devices, precise alignment, bonding, and thermal curing operations of multiple microstructural components are involved, and the entire process is extremely sensitive to temperature changes. In the existing process of coupling production of optical communication devices, maintaining the thermal stability of the working environment mostly relies on constant temperature control equipment (such as a constant temperature platform and a temperature control box), supplemented by temperature sensors to monitor the temperature at key nodes. Some solutions introduce PID closed-loop temperature control logic to improve the adjustment response speed. However, on the one hand, the temperature control strategies of these methods are mostly based on single points or local areas, and they fail to perceive the temperature field of the entire work station and the thermal interference of adjacent work stations; on the other hand, they ignore the inconsistency of the thermal responses of various materials in the device structure, and it is difficult to effectively compensate for the non-uniform expansion displacement caused by temperature. These problems lead to a decrease in positioning accuracy and unstable optical power during the coupling process of optical communication devices, restricting the further improvement of the assembly yield and coupling efficiency. Summary of the Invention

[0003] This application provides an intelligent temperature control device and method for the coupling production of optical communication devices, which solves the technical problems in the prior art that due to the lack of a joint modeling and collaborative control mechanism for the temperature spatial distribution and the thermal response of device materials during the coupling process, the positioning accuracy decreases and the optical power output is unstable during the coupling process of optical communication devices, and achieves the technical effect of improving the coupling accuracy and power output stability of optical communication devices.

[0004] In view of the above problems, on the one hand, this application provides an intelligent temperature control device for the coupling production of optical communication devices. The device includes: an environment acquisition unit for performing the acquisition of the work station environment for the coupling and encapsulation of optical communication devices, establishing a work station environment data set, and the work station environment data set includes the work station environment temperature field and the adjacent work station environment temperature field; a data reading unit for obtaining the device material data of the optical communication device, obtaining the optimal coupling temperature value according to the device material data, and configuring the expansion displacement of the temperature drift mapping; a strategy configuration unit for configuring a temperature control response strategy according to the work station environment data set and the optimal coupling temperature value, and establishing a collaborative displacement correction parameter according to the temperature control response strategy and the expansion displacement; a feedback correction unit for performing the coupling and encapsulation of the optical communication device with the collaborative displacement correction parameter and the temperature control response strategy, testing the coupling optical power at the end of the encapsulation, generating an adjustment feedback according to the coupling optical power, and optimizing the temperature control response strategy and the collaborative displacement correction parameter by using the adjustment feedback.

[0005] On the other hand, the present application also provides an intelligent temperature control method for the coupling production of optical communication devices. The method includes: performing the acquisition of the working station environment for the coupling and packaging of optical communication devices, establishing a working station environment data set, where the working station environment data set includes the working station environment temperature field and the adjacent position environment temperature field; obtaining the device material data of the optical communication device, obtaining the optimal coupling temperature value according to the device material data, and configuring the expansion displacement of the temperature drift mapping; configuring a temperature control response strategy according to the working station environment data set and the optimal coupling temperature value, and establishing a collaborative displacement correction parameter according to the temperature control response strategy and the expansion displacement; performing the coupling and packaging of the optical communication device according to the collaborative displacement correction parameter and the temperature control response strategy, and testing the coupling optical power at the end of the packaging, generating an adjustment feedback according to the coupling optical power, and optimizing the temperature control response strategy and the collaborative displacement correction parameter by using the adjustment feedback.

[0006] One or more technical solutions provided in the present application have at least the following beneficial effects:

[0007] Through the environmental acquisition unit, the spatial temperature field perception ability of the coupling and packaging working station is established, the temperature data of the working station and the adjacent position environment are collected, and a dynamic temperature distribution model is constructed, providing an environmental perception basis for the subsequent temperature control strategy. Through the data reading unit, the thermal characteristics of the materials used in the optical communication device are identified, the optimal coupling temperature value is extracted, and the structural expansion displacement law caused by temperature drift is mapped according to the thermal expansion behavior, providing data support for displacement compensation. Through the strategy configuration unit, on the basis of the known environmental temperature field and the device thermal response law, a temperature control response strategy is formulated, and combined with the material expansion displacement, a collaborative displacement correction parameter linked with temperature control is constructed to achieve precise compensation. Through the feedback correction unit, the temperature control strategy and displacement compensation are executed during the actual packaging process, and an adjustment feedback is generated by detecting the coupling optical power after the packaging is completed, which is used to dynamically optimize the temperature control response strategy and the collaborative displacement correction parameter to form an adaptive closed-loop control.

[0008] In summary, through the intelligent temperature control and displacement compensation optimization driven by the collaboration of environmental perception and material characteristics, the present application reduces the coupling deviation caused by factors such as temperature and displacement, achieving the technical effects of improving the coupling positioning accuracy and the stability of optical power output of optical communication devices, and reducing the defective rate during the production process.

[0009] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specific embodiments of the present application are specifically given. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1Schematic structural diagram of the intelligent temperature control device for the coupling production of optical communication devices provided by the embodiments of the present application.

[0011] Figure 2 Schematic flow diagram of the intelligent temperature control method for the coupling production of optical communication devices provided by the embodiments of the present application.

[0012] Explanation of reference numerals: Environment acquisition unit 10, data reading unit 20, policy configuration unit 30, feedback correction unit 40. Detailed implementation manners

[0013] The embodiments of the present application provide an intelligent temperature control device and method for the coupling production of optical communication devices, which solve the technical problems in the prior art that due to the lack of a joint modeling and collaborative control mechanism for the temperature spatial distribution and the thermal response of device materials during the coupling process, the positioning accuracy decreases and the optical power output is unstable during the coupling process of optical communication devices, and achieve the technical effect of improving the coupling accuracy and power output stability of optical communication devices.

[0014] Embodiment 1, as Figure 1 shown, the embodiments of the present application provide an intelligent temperature control device for the coupling production of optical communication devices, and the device includes:

[0015] An environment acquisition unit 10, configured to perform the acquisition of the station environment for the coupling and packaging of optical communication devices, and establish a station environment data set, where the station environment data set includes a station environment temperature field and an adjacent station environment temperature field.

[0016] Specifically, a station is a location or platform for a specific packaging operation, such as an automatic coupling table, an optical fiber bonding table, etc. Multi-point temperature sensors (such as thermocouple arrays, infrared temperature measurement modules) are used to arrange acquisition nodes at the coupling and packaging station and its adjacent areas, and temperature data is periodically acquired to establish a temperature field distribution model in the time and space dimensions. These data are uniformly uploaded to the control system to form a station environment data set, including a station environment temperature field and an adjacent station environment temperature field, so as to reflect the thermal distribution, thermal interference trend and temperature drift law of the station and its adjacent stations, and provide a high-precision environmental data basis for subsequent temperature control and displacement compensation.

[0017] A data reading unit 20, configured to obtain the device material data of the optical communication device, obtain the optimal coupling temperature value according to the device material data, and configure the expansion displacement of the temperature drift mapping.

[0018] Specifically, access the material database or experimental data to obtain the device material data of the optical communication device, including the thermal expansion coefficient, thermal conductivity, etc. of the materials used in the optical communication device structure (such as glass, silicon, metal housing, etc.). Use a thermodynamic model (such as finite element analysis software) to calculate the temperature value that can make the device performance reach the optimal state during the coupling and packaging process, and obtain the optimal coupling temperature value. Combine the package structure size with the temperature change range ΔT (the range from the station temperature to the optimal coupling temperature), and use the formula ΔL = αLΔT (where α is the thermal expansion coefficient of the device material and L is the device size) to calculate the physical displacement caused by thermal expansion due to temperature change (temperature drift) of the material, and establish a mapping relationship between temperature and expansion displacement, providing a physical quantification model for the temperature control compensation strategy.

[0019] The strategy configuration unit 30 is used to configure the temperature control response strategy according to the station environment data set and the optimal coupling temperature value, and establish a collaborative displacement correction parameter according to the temperature control response strategy and the expansion displacement.

[0020] Specifically, input the station environment data set and the optimal coupling temperature value into the control algorithm (such as fuzzy controller, PID controller, etc.) in the strategy configuration unit 30 to formulate the temperature control response strategy. For example, when local thermal interference occurs, automatically adjust the power of the micro-heater in a certain area or adjust the assembly path. At the same time, combine the expansion displacement data to determine the collaborative displacement correction parameter for adjusting the device position. Through the coupling optimization of thermal control logic and mechanical displacement control, moving from single temperature control to structural control collaboration significantly improves the dynamic stability of coupling positioning.

[0021] The feedback correction unit 40 is used to perform the coupling and packaging of the optical communication device according to the collaborative displacement correction parameter and the temperature control response strategy, and test the coupling optical power at the end of the packaging. Generate an adjustment feedback according to the coupling optical power, and use the adjustment feedback to optimize the temperature control response strategy and the collaborative displacement correction parameter.

[0022] Specifically, after performing co-displacement correction parameters and temperature control response strategy for the optical communication device coupling and packaging, the light energy transmission efficiency between the two devices, that is, the coupled optical power, is measured by an optical power meter or an integrated optical detector, and the measurement result is compared with the expected target optical power. According to the comparison result, an adjustment feedback for adjusting the temperature control response strategy and co-displacement correction parameters is generated. Exemplarily, if the coupled optical power is low, it is necessary to adjust the heating or cooling intensity in the temperature control response strategy, or adjust the displacement correction coefficient in the co-displacement correction parameters, etc. Use algorithms such as genetic algorithm and gradient descent to automatically adjust the original temperature control strategy, finely adjust the station temperature to a better value, and recalculate the co-displacement correction parameters to achieve closed-loop optimization. By introducing a closed-loop feedback mechanism based on the coupling effect, the device has the capabilities of self-learning, self-adaptation, and self-optimization, significantly enhancing the stability and robustness in complex temperature change scenarios.

[0023] Further, the environment acquisition unit 10 includes:

[0024] An interaction unit, configured to connect to the multi-station collaborative temperature control system and read the preset temperature control strategy of the adjacent station.

[0025] A measurement unit, configured to perform multi-point temperature acquisition on the current station and the adjacent station respectively, and construct a station environment temperature field and an adjacent position real-time temperature field according to the multi-point temperature acquisition results respectively.

[0026] A fitting unit, configured to perform environment simulation on the adjacent position real-time temperature field according to the preset temperature control strategy to establish an adjacent position environment temperature field.

[0027] Specifically, the interaction unit performs data interaction with the multi-station collaborative temperature control system based on the communication protocol, and reads the preset temperature control operation plan of the adjacent station according to the communication rules set by the temperature control system to obtain the preset temperature control strategy. Among them, the multi-station collaborative temperature control system is a system used to manage the temperature control of multiple stations during the optical communication device coupling and packaging process, which can coordinate the temperature control strategies between different stations to achieve overall temperature optimization. For example, in a production environment based on industrial Ethernet, the interaction unit uses the TCP / IP protocol to send a request to the multi-station collaborative temperature control system, obtains the preset temperature control strategy data of the adjacent station, and stores it in the local cache or database for subsequent use.

[0028] The measurement unit installs multiple high-precision digital temperature sensors at various key positions (such as the surface of the encapsulation equipment, brackets, etc.) in the current station and adjacent stations to collect the temperature at each point in real time. The collected ambient temperature data is transmitted to the microcontroller or data acquisition system of the measurement unit through the interface circuit of the sensor, and interpolation algorithms (such as bilinear interpolation, Kriging method, etc.) are used to generate isothermal surfaces or thermal gradient maps between the measurement points at each station, constructing the ambient temperature field of the station and the real-time temperature field of the adjacent station.

[0029] According to the preset temperature control strategy obtained by the interaction unit and the real-time temperature field data of the adjacent station provided by the measurement unit, the fitting unit uses physical models (such as the heat diffusion equation) and mathematical models (such as the finite difference method, neural network, etc.) to perform environmental simulation, predict the temperature change trend of the adjacent station environment, and establish the ambient temperature field of the adjacent station according to the environmental simulation results. Exemplarily, the heat conduction equation can be used, taking the known temperature points in the real-time temperature field of the adjacent station as boundary conditions, combining information such as the heating or cooling rate in the preset temperature control strategy, and solving the heat conduction equation through the finite difference method to establish the ambient temperature field of the adjacent station. Through environmental simulation, predicting the temperature change of the adjacent station environment in advance can supplement the possible monitoring blind spots of the measurement unit, more comprehensively and accurately reflect the temperature situation of the adjacent station environment, provide more perfect ambient temperature data for temperature control in the entire optical communication device coupling and encapsulation process, reduce coupling errors caused by local temperature fluctuations and adjacent station temperature changes, and improve the coupling accuracy of optical communication devices.

[0030] Furthermore, the measurement unit further includes:

[0031] A structure acquisition unit, which is used to obtain the station structures of the current station and adjacent stations and obtain the heat source distribution of the stations.

[0032] A distribution configuration unit, which is used to optimize the position configuration of the monitoring points according to the monitoring accuracy, heat source distribution and station results, establish the position configuration optimization result, and distribute monitoring sensors according to the position configuration optimization result to complete multi-point temperature acquisition.

[0033] Specifically, the structure acquisition unit reads CAD files or performs three-dimensional vision reconstruction through a 3D scanner or lidar to identify and obtain the physical structure information of the current station and its adjacent stations, such as workbench size, component distribution, heat-sensitive parts, etc., and collects the distribution information of heat sources on the station through a thermal imager or infrared sensor, such as heater position, laser source, hot air nozzle, etc., providing basic data for the subsequent optimization configuration of monitoring points and ensuring the reasonable layout of monitoring points.

[0034] The distribution configuration unit determines the required number range of monitoring points according to the monitoring accuracy, and then combines the heat source distribution and the workstation structure to optimize the configuration of the monitoring point positions by using algorithms (such as genetic algorithm, simulated annealing algorithm, etc.). Taking the genetic algorithm as an example, the positions of the monitoring points are used as chromosome coding, and a fitness function is constructed based on factors such as monitoring accuracy, heat source distribution, and workstation structure. Through continuous iterative evolution, a monitoring point position configuration scheme with the highest fitness (that is, the one that can best meet the monitoring accuracy requirements and effectively cover the characteristics of the heat source and workstation structure) is found and output as the optimization result of the position configuration. Temperature sensors are installed at the corresponding positions of the workstation according to the optimization result of the position configuration to complete multi-point temperature acquisition. By optimizing the configuration of the monitoring point positions considering various factors, it is possible to achieve comprehensive and accurate monitoring of the workstation temperature with the fewest monitoring points on the premise of meeting the monitoring accuracy requirements, and reduce unnecessary sensor installation costs.

[0035] Further, the policy configuration unit 30 includes:

[0036] A perturbation trend fitting unit, which is used to predict the thermal perturbation trend based on the adjacent environment temperature field and the workstation environment temperature field in the workstation environment dataset, and establish a time-series perturbation factor.

[0037] A fitting curve establishment unit, which is used to establish a target fitting temperature curve based on the workstation environment temperature field and the optimal coupling temperature value.

[0038] A temperature control response policy establishment unit, which is used to take the target fitting temperature curve as the node control target, perform control optimization under the constraint of the time-series perturbation factor, and establish the temperature control response policy.

[0039] Specifically, the perturbation trend fitting unit analyzes the time-series data of the adjacent environment temperature field and the workstation environment temperature field in the workstation environment dataset, uses time-series analysis methods (such as ARIMA model, LSTM neural network, etc.) to predict the thermal perturbation trend, fits a perturbation trend function, and generates a time-series perturbation factor from this. This time-series perturbation factor is a quantifiable time-series index used to describe the intensity change and duration of the perturbation over time, facilitating the policy algorithm to understand "when and how much" to respond to the perturbation.

[0040] The fitting curve establishment unit uses methods such as polynomial fitting and spline interpolation, takes the actual temperature data in the workstation environment temperature field as the basic data points, takes the optimal coupling temperature value as the target value, finds a curve that can best fit these data points and tends to the optimal coupling temperature value, and establishes a target fitting temperature curve, so that the coupling environment can be stably maintained near the optimal coupling temperature value. This curve usually shows a "smooth warming - plateau - slow decline" form.

[0041] The temperature control response strategy establishment unit uses the target fitting temperature curve as the control target. Under the constraint of the timing disturbance factor, it uses control algorithms (such as PID controllers, particle swarm optimization algorithms, etc.) to perform control optimization. On the premise of meeting the control accuracy and response speed, it selects the optimal control parameters such as heating power and cooling rate to establish the temperature control response strategy. Taking the particle swarm optimization algorithm as an example, the parameters of the temperature control strategy (heating power, cooling rate, etc.) are used as the position vector of the particle, and the deviation between the actual temperature and the target fitting temperature curve and the satisfaction of the timing disturbance factor are used as the fitness function. Through the iterative search of the particle swarm, the particle position with the highest fitness is found, that is, the optimal temperature control response strategy.

[0042] Exemplarily, it is set that the optimal coupling temperature of a certain optical communication device is 35 °C, but the adjacent B station will release thermal interference during 10 - 20 seconds, causing the temperature of this station to rise to 36.2 °C. The strategy configuration unit 30 fits the disturbance factor curve according to the historical disturbance samples, pre-cools in advance 10 s before, and at the same time controls the target temperature curve to be depressed to 34.2 °C in the 9th to 11th second segment. The controller issues an advance refrigeration instruction accordingly to offset the upcoming temperature rise and achieve thermal stability during the coupling process.

[0043] Through the coordinated operation of the above multiple sub-units, the strategy configuration unit 30 realizes the multi-objective optimization control that takes into account disturbance compensation and target achievement. The established temperature control response strategy can control the temperature more precisely, effectively cope with thermal disturbances, improve the temperature control accuracy during the coupling and packaging process of optical communication devices, and thus improve the quality of coupling and packaging.

[0044] Furthermore, the strategy configuration unit 30 further includes:

[0045] A matching unit, configured to perform displacement matching of the expansion displacement according to the target fitting temperature curve and the temperature drift mapping, and establish an expansion displacement matching result.

[0046] A cooperative displacement matching unit, configured to generate cooperative displacement correction parameters according to the expansion displacement matching result.

[0047] Specifically, the matching unit obtains the temperature values at different time points from the target fitting temperature curve. Then, these temperature values are substituted into the temperature drift mapping relationship, and the expansion displacement value at each moment is mapped according to the temperature - time point to obtain the expansion displacement matching result.

[0048] The co-displacement matching unit extracts the displacement values corresponding to each time node according to the expansion displacement matching result, and generates co-displacement correction parameters for adjusting the position of the optical communication device. Exemplarily, for a certain optical device coupling, the required ambient temperature is 34 °C, and the thermal expansion of the material will cause an axial displacement of 0.9 μm. Then, at the time point t = 10 s (i.e., when the coupling starts), the displacement Δx = +0.9 μm is obtained, and shifting 0.9 μm axially backward is written into the configuration table of the coupling device (platform positioning system, tooling fixture configuration system, etc.) as the correction parameter. Before starting the encapsulation, the initial positions of the platform or the optical fiber positioning kit can be adjusted in advance according to this correction parameter to compensate for the displacement error caused by temperature changes.

[0049] By generating accurate displacement correction parameters, converting the displacement error caused by thermal expansion into static compensation parameters, it ensures the positioning accuracy of the optical communication device during the coupling process, reduces the displacement error caused by temperature changes, thereby improving the initial alignment accuracy of the coupling and reducing the power loss caused by thermal drift.

[0050] Furthermore, the device further includes:

[0051] A judgment unit for monitoring the device temperature during the coupling and encapsulation process of the optical communication device and establishing node achievement feedback.

[0052] A feedback response unit for updating the feedback of the temperature control response strategy according to the node achievement feedback and completing the coupling and encapsulation of the optical communication device according to the feedback update.

[0053] Specifically, during the coupling and encapsulation process, the judgment unit uses temperature sensors (such as thermocouples, infrared sensors, etc.) to monitor the local or overall temperature of the optical communication device body, compares the monitored temperature data with the target fitting temperature curve, judges whether the device temperature enters or reaches a certain stage node, and generates node achievement feedback according to the judgment result. If the node state meets the set conditions (such as being stable within the temperature range of ±0.3 °C for 2 seconds), a achievement feedback signal is output. If the node state does not meet the set conditions, a delayed achievement or failure feedback is output, indicating that the strategy may need to be adjusted.

[0054] The feedback response unit updates the temperature control response strategy according to the node achievement feedback information, using control algorithms (such as PID control algorithm, adaptive control, fuzzy control, etc.). For example, if the feedback shows that the device temperature is lower than the target temperature and the gap is large, the heating power needs to be increased. If there is overshoot in the node, the constant temperature time is shortened or the temperature control amplitude is adjusted. Then, continue to complete the coupling and encapsulation process of the optical communication device according to the updated temperature control response strategy, ensuring that the device temperature changes along the target fitting temperature curve, improving the temperature stability of the entire encapsulation process. Furthermore, the success rate of the coupling and encapsulation and the quality of the optical communication device are improved.

[0055] Further, the device further includes:

[0056] An early warning unit, configured to perform achievement anomaly verification after receiving the node achievement feedback. If the achievement anomaly verification result meets the preset anomaly threshold, generate a temperature control anomaly warning, perform shutdown processing based on the temperature control anomaly warning, and send out a warning signal.

[0057] Specifically, the early warning unit receives the node achievement feedback information from the judgment unit, then analyzes the feedback information, calculates the deviation value from the normal situation for achievement anomaly verification, and obtains the achievement anomaly verification result. And compare the achievement anomaly verification result with the preset anomaly threshold. If the achievement anomaly verification result meets the preset anomaly threshold, generate a temperature control anomaly warning. Exemplarily, calculate the normal temperature range corresponding to each node according to the target fitting temperature curve. If the temperature value in the node achievement feedback is not within this range, calculate the deviation degree between the actual temperature and the normal temperature range. Compare this deviation degree with the preset anomaly threshold. If the deviation is greater than or equal to the preset anomaly threshold, generate a temperature control anomaly warning, send a shutdown instruction to the optical communication device coupling and packaging control system, stop the equipment during the optical communication device coupling and packaging process, and send the warning signal to the monitoring system or the operator.

[0058] Through the achievement anomaly verification, it is possible to timely detect and handle the temperature anomalies in the optical communication device coupling and packaging process, reduce the production accidents and product loss anomalies caused by temperature anomalies, and improve the safety and reliability of the entire coupling and packaging process.

[0059] Further, the feedback correction unit 40 is further configured to:

[0060] Continuously record the coupled optical power, and weaken the influence of individual anomalies according to the continuous recording results; generate a general adjustment feedback using the individual anomaly influence weakening results, and optimize the temperature control response strategy and the collaborative displacement correction parameters using the general adjustment feedback.

[0061] Specifically, the feedback correction unit 40 continuously collects the data of the coupled optical power through devices such as optical power sensors during the coupling and packaging process of the optical communication device, and stores these data in chronological order. The continuously recorded optical power data is processed through data analysis algorithms (such as filtering algorithms, machine learning algorithms) to identify and weaken the influence of individual abnormal data or situations on the overall result, and remove short-term abnormal fluctuations (such as instantaneous power drops or slight thermal disturbances) from the overall dataset to obtain a more stable and steady power change curve. For example, a moving average filter can be used to smooth the optical power data, or an isolation forest algorithm can be used to detect and remove outliers. Based on the coupled optical power data with weakened influence of individual anomalies, the characteristics such as the overall optical power trend and fluctuation range are analyzed, and a general adjustment feedback including appropriately increasing the heating power, adjusting the displacement correction direction, etc. is generated, and the temperature control response strategy and coordinated displacement correction parameters are optimized using control algorithms (such as PID control, adaptive control) to improve the accuracy and stability of temperature control and displacement correction during the coupling and packaging process of the optical communication device, thereby improving the coupling and packaging quality.

[0062] Further, the device further includes:

[0063] An emergency management unit, configured to interact with the environment acquisition unit 10 to perform real-time update of the environment at the current work station, and perform mutation trigger identification on the real-time update result. If a mutation trigger identification result is generated, an emergency temperature compensation instruction is generated, and the temperature control response strategy is optimized according to the emergency temperature compensation instruction.

[0064] Specifically, the emergency management unit interacts with the environment acquisition unit 10 to obtain the environmental data of the current work station in real time using the communication protocol. The mutation threshold is set according to the type and normal change range of the environmental data, and whether there is a temperature mutation situation is identified by comparing the real-time update result of the work station environment with the mutation threshold. For example, for temperature data, a temperature change rate threshold k = 0.5 °C / second is set, and the temperature change rate ΔT / t (where ΔT is the temperature change amount and t is the time interval) between the current time and the previous update time is calculated. If ΔT / t > k, it is determined that the environmental temperature has mutated, and a mutation trigger identification result is generated. Then, according to the mutation trigger identification result, the direction and amplitude of temperature compensation are determined, an emergency temperature compensation instruction is generated, and the temperature control response strategy is adjusted and optimized to avoid the decrease in coupling accuracy or instability of optical power caused by sudden temperature changes. Exemplarily, during a certain coupling process, it is monitored that the temperature at the work station suddenly rises from 34 °C to 35.2 °C within 1 second, exceeding the set temperature change threshold (±0.5 °C / second). At this time, the emergency management unit generates an emergency temperature compensation instruction through the internal control algorithm, requiring the temperature control system to immediately slow down the heating rate, reducing the heating rate from 0.5 °C / second to 0.3 °C / second to ensure a stable temperature change.

[0065] In summary, the intelligent temperature control device for the coupling production of optical communication devices provided by the embodiments of the present application has the following beneficial effects:

[0066] The environmental acquisition unit 10 establishes the spatial temperature field perception ability of the coupling and packaging station, collects the environmental temperature data of the station and adjacent positions, constructs a dynamic temperature distribution model, and provides an environmental perception basis for subsequent temperature control strategies. The data reading unit 20 identifies the thermal properties of the materials used in the optical communication device, extracts its optimal coupling temperature value, and maps the structural expansion displacement law caused by temperature drift according to the thermal expansion behavior, providing data support for displacement compensation. The strategy configuration unit 30 formulates a temperature control response strategy based on the known environmental temperature field and the device thermal response law, and constructs a collaborative displacement correction parameter linked to temperature control in combination with the material expansion displacement to achieve precise compensation. The feedback correction unit 40 executes the temperature control strategy and displacement compensation during the actual packaging process, and generates an adjustment feedback by detecting the coupled optical power after the packaging is completed, which is used to dynamically optimize the temperature control response strategy and the collaborative displacement correction parameter to form an adaptive closed-loop control. The early warning unit and the judgment unit combine node feedback and anomaly verification to ensure real-time early warning and emergency handling under any temperature fluctuation conditions, and ensure the normal operation of the coupling and packaging. In addition, the emergency management unit ensures that when a sudden temperature change occurs, it can quickly respond and adjust the temperature control strategy by identifying the mutation trigger and generating an emergency temperature compensation instruction, avoiding abnormal fluctuations from affecting the coupling effect.

[0067] Overall, through the intelligent temperature control and displacement compensation optimization driven by the collaboration of environmental perception and material characteristics, the embodiments of the present application reduce the coupling deviation caused by factors such as temperature and displacement, achieving the technical effects of improving the coupling positioning accuracy and the stability of optical power output of optical communication devices, and reducing the defective rate during the production process.

[0068] Embodiment 2, as Figure 2 shown, based on the same inventive concept as the foregoing Embodiment 1, the embodiments of the present application provide an intelligent temperature control method for the coupling production of optical communication devices, and the method includes:

[0069] Step S1: Perform the acquisition of the working station environment for the coupling and packaging of optical communication devices, and establish a working station environment data set, where the working station environment data set includes the working station environment temperature field and the adjacent position environment temperature field.

[0070] Step S2: Obtain the device material data of the optical communication device, obtain the optimal coupling temperature value according to the device material data, and configure the expansion displacement of the temperature drift mapping.

[0071] Step S3: Configure a temperature control response strategy according to the working station environment data set and the optimal coupling temperature value, and establish a collaborative displacement correction parameter according to the temperature control response strategy and the expansion displacement.

[0072] Step S4: Perform optical communication device coupling and packaging according to the collaborative displacement correction parameters and the temperature control response strategy, and test the coupling optical power at the end of packaging. Generate an adjustment feedback based on the coupling optical power, and use the adjustment feedback to optimize the temperature control response strategy and the collaborative displacement correction parameters.

[0073] Further, step S1 of the embodiment of the present application includes:

[0074] Connect the multi-station collaborative temperature control system, and read the preset temperature control strategies of adjacent stations; perform multi-point temperature acquisition on the current station and adjacent stations respectively, and construct a station environmental temperature field and an adjacent position real-time temperature field according to the multi-point temperature acquisition results; perform environmental simulation on the adjacent position real-time temperature field according to the preset temperature control strategy to establish an adjacent position environmental temperature field.

[0075] Further, performing multi-point temperature acquisition on the current station and adjacent stations respectively, and constructing a station environmental temperature field and an adjacent position real-time temperature field according to the multi-point temperature acquisition results includes:

[0076] Obtain the station structures of the current station and adjacent stations, and obtain the heat source distribution of the stations; perform optimization of the position configuration of the monitoring points according to the monitoring accuracy, heat source distribution and station results, establish the position configuration optimization results, and install monitoring sensors according to the position configuration optimization results to complete multi-point temperature acquisition.

[0077] Further, step S3 of the embodiment of the present application includes:

[0078] Predict the thermal disturbance trend according to the adjacent position environmental temperature field and the station environmental temperature field in the station environmental data set, and establish a time series disturbance factor; establish a target fitting temperature curve according to the station environmental temperature field and the optimal coupling temperature value; use the target fitting temperature curve as the node control target, and perform control optimization under the constraint of the time series disturbance factor to establish the temperature control response strategy.

[0079] Further, step S3 of the embodiment of the present application further includes:

[0080] Perform displacement matching of the expansion displacement according to the target fitting temperature curve and the temperature drift mapping, and establish the expansion displacement matching result; generate the collaborative displacement correction parameter according to the expansion displacement matching result.

[0081] Further, the method of the embodiment of the present application includes:

[0082] Perform device temperature monitoring during the optical communication device coupling and packaging process, and establish a node achievement feedback; perform feedback update of the temperature control response strategy according to the node achievement feedback, and complete the optical communication device coupling and packaging according to the feedback update.

[0083] Further, the method described in the embodiments of the present application includes:

[0084] After receiving the feedback that the nodes reach an agreement, perform an agreement anomaly verification. If the agreement anomaly verification result meets a preset anomaly threshold, generate a temperature control anomaly warning, perform a shutdown process based on the temperature control anomaly warning, and report a warning signal.

[0085] Further, step S4 in the embodiments of the present application further includes:

[0086] Continuously record the coupled optical power, and weaken the influence of individual anomalies according to the continuous recording results; generate a general adjustment feedback using the results of weakening the influence of individual anomalies, and optimize the temperature control response strategy and the collaborative displacement correction parameters using the general adjustment feedback.

[0087] Further, the method described in the embodiments of the present application includes:

[0088] The interactive environment acquisition unit 10 performs real-time update of the environment at the current station, and performs mutation trigger recognition on the real-time update results. If a mutation trigger recognition result is generated, an emergency temperature compensation instruction is generated, and the temperature control response strategy is optimized according to the emergency temperature compensation instruction.

[0089] Through the foregoing detailed description of the intelligent temperature control device for the coupling production of optical communication devices in this specification, those skilled in the art can clearly know the intelligent temperature control method for the coupling production of optical communication devices in this embodiment. For the method disclosed in Embodiment 2, since it corresponds to the device disclosed in Embodiment 1, it has corresponding execution steps and beneficial effects. For the relevant parts, refer to the description of the device part.

[0090] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An intelligent temperature control device for coupling production of optical communication devices, characterized in that, The device includes: An environment acquisition unit for performing acquisition of the station environment during the coupling and packaging of optical communication devices, establishing a station environment data set, where the station environment data set includes a station environment temperature field and an adjacent station environment temperature field; A data reading unit for obtaining the device material data of the optical communication device, obtaining the optimal coupling temperature value according to the device material data, and configuring the expansion displacement of the temperature drift mapping; A strategy configuration unit for configuring a temperature control response strategy according to the station environment data set and the optimal coupling temperature value, and establishing a collaborative displacement correction parameter according to the temperature control response strategy and the expansion displacement; A feedback correction unit for performing coupling and packaging of the optical communication device according to the collaborative displacement correction parameter and the temperature control response strategy, testing the coupling optical power at the end of packaging, generating an adjustment feedback according to the coupling optical power, and optimizing the temperature control response strategy and the collaborative displacement correction parameter by using the adjustment feedback.

2. The intelligent temperature control device for coupling production of an optical communication device according to claim 1, characterized in that The environment acquisition unit includes: An interaction unit for connecting to a multi-station collaborative temperature control system and reading the preset temperature control strategy of the adjacent station; A measurement unit for performing multi-point temperature acquisition on the current station and the adjacent station respectively, and constructing a station environment temperature field and an adjacent station real-time temperature field according to the multi-point temperature acquisition results; A fitting unit for performing environment simulation on the adjacent station real-time temperature field according to the preset temperature control strategy and establishing an adjacent station environment temperature field.

3. The intelligent temperature control device for coupling production of an optical communication device according to claim 2, characterized in that, The measurement unit further includes: A structure acquisition unit for obtaining the station structures of the current station and the adjacent station, and obtaining the heat source distribution of the station; A distribution configuration unit for performing optimization of the position configuration of the monitoring points according to the monitoring accuracy, heat source distribution, and station results, establishing a position configuration optimization result, and distributing monitoring sensors according to the position configuration optimization result to complete multi-point temperature acquisition.

4. The intelligent temperature control device for coupling production of an optical communication device according to claim 2, wherein, The strategy configuration unit includes: A perturbation trend fitting unit for predicting the thermal perturbation trend according to the adjacent station environment temperature field and the station environment temperature field in the station environment data set, and establishing a time-series perturbation factor; A fitting curve establishment unit for establishing a target fitting temperature curve according to the station environment temperature field and the optimal coupling temperature value; A temperature control response strategy establishment unit for using the target fitting temperature curve as the node control target, performing control optimization under the constraint of the time-series perturbation factor, and establishing the temperature control response strategy.

5. The intelligent temperature control device for coupling production of an optical communication device according to claim 4, wherein, The strategy configuration unit further includes: A matching unit for performing displacement matching of the expansion displacement according to the target fitting temperature curve and the temperature drift mapping, and establishing an expansion displacement matching result; A collaborative displacement matching unit for generating a collaborative displacement correction parameter according to the expansion displacement matching result.

6. The intelligent temperature control device for coupling production of an optical communication device according to claim 1, characterized in that, The device further includes: A judgment unit for performing device temperature monitoring during the coupling and packaging of the optical communication device and establishing a node achievement feedback; A feedback response unit for performing feedback update of the temperature control response strategy according to the node achievement feedback, and completing the coupling and packaging of the optical communication device according to the feedback update.

7. The intelligent temperature control device for coupling production of an optical communication device according to claim 6, characterized in that, The device further includes: The warning unit is used to perform compliance anomaly verification after receiving the node compliance feedback. If the compliance anomaly verification result meets the preset anomaly threshold, it generates a temperature control anomaly warning, performs shutdown processing based on the temperature control anomaly warning, and reports a warning signal.

8. The intelligent temperature control device for the coupling production of the optical communication device according to claim 1, characterized in that, The feedback correction unit is further used for: Continuously recording the coupled optical power and weakening the influence of individual anomalies according to the continuous recording results; Generating a general adjustment feedback using the result of weakening the influence of individual anomalies, and optimizing the temperature control response strategy and the collaborative displacement correction parameter using the general adjustment feedback.

9. The intelligent temperature control device for coupling production of an optical communication device according to claim 1, characterized in that, The device further includes: The emergency management unit is used to interact with the environment acquisition unit, perform real-time update of the environment at the current work station, and perform mutation trigger recognition on the real-time update result. If a mutation trigger recognition result is generated, it generates an emergency temperature compensation instruction and optimizes the temperature control response strategy according to the emergency temperature compensation instruction.

10. An intelligent temperature control method for the coupling production of optical communication devices, characterized in that, The method is executed by the intelligent temperature control device for the coupling production of the optical communication device according to any one of claims 1-9, and includes: Performing acquisition of the work station environment for the coupling and encapsulation of the optical communication device, and establishing a work station environment data set, where the work station environment data set includes the work station environment temperature field and the adjacent work station environment temperature field; Obtaining the device material data of the optical communication device, obtaining the optimal coupling temperature value according to the device material data, and configuring the expansion displacement of the temperature drift mapping; Configuring a temperature control response strategy according to the work station environment data set and the optimal coupling temperature value, and establishing a collaborative displacement correction parameter according to the temperature control response strategy and the expansion displacement; Performing coupling and encapsulation of the optical communication device according to the collaborative displacement correction parameter and the temperature control response strategy, testing the coupled optical power at the end of the encapsulation, generating an adjustment feedback according to the coupled optical power, and optimizing the temperature control response strategy and the collaborative displacement correction parameter using the adjustment feedback.

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