Heat dissipation regulation and control method and device, electronic equipment and storage medium

Abstract

The invention discloses a heat dissipation regulation and control method and device, electronic equipment and a storage medium, and relates to the technical field of heat dissipation management, and the method comprises the steps: obtaining the position information of a plurality of assemblies in the electronic equipment; determining a first temperature compensation value corresponding to a second component in the plurality of components based on the position information of the plurality of components in the electronic equipment in response to the temperature reading fault of the first component in the plurality of components; based on the first temperature compensation value, a compensation temperature corresponding to the second assembly is determined; according to the technical scheme, heat dissipation regulation and control are conducted on the second assembly based on the compensation temperature, the temperature is compensated before heat dissipation regulation and control, the technical problems that in the related scheme, fan noise is too large, and heat dissipation regulation and control lags can be solved, and the technical effects of reducing the fan noise and effectively avoiding heat dissipation regulation and control lags are achieved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation management, and particularly to a heat dissipation regulation method, device, electronic device, and storage medium. Background Art

[0002] In a high-performance computing environment, heat dissipation management of electronic devices is crucial. Effective heat dissipation can not only ensure the stable operation of electronic devices, but also extend the hardware life and reduce energy consumption. However, in actual operation, it may be encountered that components are operating normally, but the temperature reading of the components is abnormal. In related heat dissipation regulation schemes, usually the fan is directly set to full speed or the temperature of the component is directly ignored for temperature regulation. Although the problem of local overheating of electronic devices can be solved to a certain extent, at the same time, problems such as excessive fan noise and lag in heat dissipation regulation also occur. Summary of the Invention

[0003] This application provides a heat dissipation regulation method, device, electronic device, and storage medium to at least solve the problems of excessive fan noise and lag in heat dissipation regulation in related technologies.

[0004] This application provides a heat dissipation regulation method, including:

[0005] Obtaining the position information of multiple components in an electronic device;

[0006] In response to a temperature reading failure of a first component among the multiple components, based on the position information of the multiple components in the electronic device, determining a first temperature compensation value corresponding to a second component among the multiple components;

[0007] Based on the first temperature compensation value, determining a compensation temperature corresponding to the second component;

[0008] Based on the compensation temperature, performing heat dissipation regulation on the second component.

[0009] This application also provides a heat dissipation regulation device, including:

[0010] An obtaining unit, configured to obtain the position information of multiple components in an electronic device;

[0011] A first determining unit, configured to, in response to a temperature reading failure of a first component among the multiple components, based on the position information of the multiple components in the electronic device, determine a first temperature compensation value corresponding to a second component among the multiple components;

[0012] A second determining unit, configured to determine a compensation temperature corresponding to the second component based on the first temperature compensation value;

[0013] A regulation unit, configured to perform heat dissipation regulation on the second component based on the compensation temperature.

[0014] The present application also provides an electronic device, including: a memory for storing a computer program; a processor for implementing the steps of any of the above heat dissipation control methods when executing the computer program.

[0015] The present application also provides a computer-readable storage medium storing a computer program, wherein the computer program implements the steps of any of the above heat dissipation control methods when executed by a processor.

[0016] The present application also provides a computer program product including a computer program, and the computer program implements the steps of any of the above heat dissipation control methods when executed by a processor.

[0017] Through the present application, the position information of multiple components in an electronic device is obtained; in response to a temperature reading failure of a first component among the multiple components, based on the position information of the multiple components in the electronic device, a first temperature compensation value corresponding to a second component among the multiple components is determined; based on the first temperature compensation value, a compensated temperature corresponding to the second component is determined; based on the compensated temperature, heat dissipation control of the second component is performed. By compensating the temperature before heat dissipation control, the technical problems of excessive fan noise and lag in heat dissipation control in related solutions can be solved, and the technical effects of reducing fan noise and effectively avoiding lag in heat dissipation control can be achieved. Description of the Drawings

[0018] The drawings are used to better understand the present solution and do not constitute a limitation to the present disclosure. Among them:

[0019] Figure 1 is a schematic flowchart of a heat dissipation control method provided by an embodiment of the present application;

[0020] Figure 2 is a schematic structural diagram of a server space layout provided by an embodiment of the present application;

[0021] Figure 3 is a schematic flowchart of a heat dissipation control method provided by an embodiment of the present application;

[0022] Figure 4 is a schematic structural diagram of a heat dissipation control framework provided by an embodiment of the present application;

[0023] Figure 5 is a schematic structural diagram of a heat dissipation control device provided by an embodiment of the present application. Detailed Description of the Invention

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the protection scope of the present application.

[0025] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0026] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the following further details the present application with reference to the accompanying drawings and specific embodiments.

[0027] Embodiments of the present application provide a heat dissipation control method, and the method will be described in detail in combination with the execution flow of the heat dissipation control method.

[0028] The Baseboard Management Controller (BMC) is used to manage and monitor the hardware of a server or other electronic devices. Specifically, it can monitor the temperatures of various components inside the system in real time, including the CPU, memory, storage devices, etc., and can also monitor and control the speed of the fans to maintain an appropriate cooling effect. It can also provide status monitoring of the power supply unit, including power input and output conditions, redundant power supply status, etc.

[0029] The Redundant Array of Inexpensive Disks (RAID) can improve storage redundancy by combining multiple independent physical hard disks in different ways to form a logical hard disk.

[0030] The Graphics Processing Unit (GPU) is used for image processing or artificial intelligence computing.

[0031] The Power Supply Unit (PSU) is responsible for converting the alternating current from the mains into direct current that can be used by the internal components of the electronic device.

[0032] In related heat dissipation control solutions, in air-cooled electronic devices (such as servers), the main source of noise is the operation of the fan. The higher the fan speed, the greater the noise. In the operating scenario of edge servers, since edge servers are deployed in an environment where humans and machines coexist, there are relatively high requirements for noise. When a certain component in the server functions normally but its corresponding temperature cannot be obtained, the traditional heat dissipation control strategy is to let the fan rotate at full speed to increase heat dissipation, or directly exclude the component from heat dissipation control.

[0033] However, when the fan rotates at full speed, it will cause the device to generate relatively large noise, affecting the coexistence of humans and machines. If the component is directly excluded from heat dissipation control, it will lead to a lag in heat dissipation control, easily resulting in high-temperature alarms and affecting the actual business operation.

[0034] To solve the above problems, obtain the position information of multiple components in the electronic device; in response to a temperature reading failure of a first component among the multiple components, based on the position information of the multiple components in the electronic device, determine a first temperature compensation value corresponding to a second component among the multiple components; based on the first temperature compensation value, determine the compensated temperature corresponding to the second component; based on the compensated temperature, perform heat dissipation control on the second component. By compensating the temperature before heat dissipation control, the technical problems of excessive fan noise and heat dissipation control lag in related solutions can be solved, achieving the technical effects of reducing fan noise and effectively avoiding heat dissipation control lag.

[0035] A heat dissipation control method provided by an embodiment of the present disclosure can be executed by BMC. The heat dissipation control method provided by the present disclosure can be applied to the thermal management and heat dissipation optimization of electronic devices, data centers, and edge computing devices.

[0036] Figure 1 It is a schematic flowchart of a heat dissipation control method provided by an embodiment of the present disclosure.

[0037] As Figure 1 shown, it includes the following steps:

[0038] Step 101, obtain the position information of multiple components in the electronic device;

[0039] In some embodiments, the electronic device can be a server, a mobile device, an industrial control device, etc. In this application, the electronic device is taken as an example of a server, and the server includes multiple components such as a chassis, a central processing unit (CPU), a RAID card, a GPU card, a PSU, a storage device, a heat dissipation system, a network interface, and a circuit board. Among them, the storage device can include a hard disk drive and a solid-state drive, the heat dissipation system includes a fan, a heat sink, a liquid cooling system, etc., and the network interface can include a network card, a fiber channel card, etc.

[0040] In some embodiments, the location information of multiple components in an electronic device can be obtained from the layout file of the electronic device, or from the design document of the electronic device. Additionally, temperature sensors, pressure sensors, or other types of sensors can be arranged inside the electronic device, and the location information of multiple components in the electronic device can be obtained based on the locations of the sensors.

[0041] In some embodiments, the location information of a component refers to the spatial or logical location of each component relative to the device or other components inside the electronic device.

[0042] Step 102, in response to a temperature reading failure of a first component among multiple components, based on the location information of multiple components in the electronic device, determine a first temperature compensation value corresponding to a second component among the multiple components;

[0043] In some embodiments, the first component refers to a component in the electronic device that functions normally but cannot read the corresponding temperature. It can be a CPU or a RAID card. Specifically, when the first component operates normally, it continuously generates heat. However, the temperature reading failure, that is, the inability to obtain the true temperature of the first component, will cause errors in the heat dissipation regulation of the entire electronic device.

[0044] In some embodiments, it can be detected whether the first component has a temperature reading failure through BMC or sensor monitoring. For example, when the first component does not respond or returns an invalid value after a temperature reading instruction is issued, or when it exceeds the reasonable temperature range of the component (the CPU temperature is usually between 30°C and 90°C), it is determined that the first component has a temperature reading failure.

[0045] In some embodiments, the second component refers to other normally operating components adjacent to or related to the first component (such as nearby GPU cards, PSUs, etc.)

[0046] In some embodiments, by analyzing the temperature data of the second component and the location relationship between components, estimate the possible temperature compensation value of the second component.

[0047] In some embodiments, based on the location information of multiple components in the electronic device, such as the spatial relationship between the first component and the second component, including the distance relationship, whether they are in the same air duct, etc., and based on this location information, determine the first temperature compensation value corresponding to the second component among the multiple components.

[0048] Step 103, based on the first temperature compensation value, determine the compensated temperature corresponding to the second component;

[0049] In some embodiments, the compensated temperature refers to the temperature of the second component after compensation, which is determined by the sum of the first temperature compensation value and the real-time temperature of the second component. Among them, the real-time temperature of the second component can be obtained using a sensor.

[0050] In some embodiments, the compensation temperature can be dynamically adjusted according to real-time environmental conditions. Specifically, the compensation temperature can be adjusted according to the real-time load of the first component and the change in environmental temperature.

[0051] Step 104, based on the compensation temperature, perform heat dissipation regulation on the second component.

[0052] In some embodiments, heat dissipation regulation refers to controlling the temperature of the second component by adjusting the rotation speed of the fan, or using a liquid as a cooling medium to directly or indirectly contact the second component to take away the heat to control the temperature of the second component. The specific method of heat dissipation regulation in this application is not limited.

[0053] In some embodiments, if the compensation temperature is relatively high, increase the rotation speed of the fan to enhance the heat dissipation effect; if the compensation temperature is relatively low, appropriately reduce the rotation speed of the fan to reduce noise and energy consumption.

[0054] In some embodiments, by using a more accurate compensation temperature to perform heat dissipation regulation on the second component, the problems of energy waste and noise caused by the high-speed operation of the fan in the electronic device can be avoided, and at the same time, the problem of lag in heat dissipation regulation can also be avoided.

[0055] Through this application, obtain the position information of multiple components in the electronic device; in response to a temperature reading failure of the first component among the multiple components, based on the position information of the multiple components in the electronic device, determine the first temperature compensation value corresponding to the second component among the multiple components; based on the first temperature compensation value, determine the compensation temperature corresponding to the second component; based on the compensation temperature, perform heat dissipation regulation on the second component. By compensating the temperature before heat dissipation regulation, the technical problems of excessive fan noise and lag in heat dissipation regulation in the related solutions can be solved, and the technical effects of reducing fan noise and effectively avoiding lag in heat dissipation regulation can be achieved.

[0056] In some embodiments, obtaining the position information of multiple components in the electronic device includes:

[0057] Obtain the air duct information, component information, and temperature measurement point information of the electronic device;

[0058] Based on the air duct information, component information, and temperature measurement point information of the electronic device, determine the position information of multiple components in the electronic device.

[0059] In some embodiments, after the BMC is started, obtain the server model according to the server motherboard, and then obtain the air duct information according to the server model, where the air duct information can be pre-configured in a file or database manner.

[0060] In some embodiments, the air duct information is used to understand the design of the air flow inside the electronic device, including the fan position, vent position, air flow direction, etc. This information can usually be obtained from the technical manual of the device or the documents provided by the manufacturer.

[0061] In some embodiments, the component information refers to the information of all the main hardware components inside the electronic device, including but not limited to the CPU, memory module, storage device (such as hard disk), PSU, etc. For each component, it is necessary to know its name, model, and installation position on the motherboard.

[0062] In some embodiments, the temperature measurement point information refers to the positions of the various sensors used to monitor the temperature inside the electronic device. These sensors may be located near key components (such as above the CPU and GPU cards), or may be distributed in different areas of the chassis to monitor the ambient temperature.

[0063] In some embodiments, the position information of multiple components can be in the form of a mapping relation table or an array. In this application, no specific form is limited.

[0064] In some embodiments, obtaining the air duct information, component information, and temperature measurement point information of the electronic device includes:

[0065] Obtaining the model of the electronic device;

[0066] In some embodiments, the model of the electronic device can be obtained by viewing the identification label on the electronic device, entering the Basic Input / Output System (BIOS) interface using the operating system command to view the system information, or consulting the product manual at the time of purchase.

[0067] Based on the model of the electronic device, determine the air duct information, component information, and temperature measurement point information in the electronic device from the pre-configured resources. The component information includes the component name, component position, and the air duct where the component is located.

[0068] In some embodiments, the air duct information in the electronic device can be determined from the pre-written file or database.

[0069] In some embodiments, the interface provided by the BMC can be used to query the hardware configuration information, including the air duct design, component information, and its related temperature measurement point information, etc.

[0070] In some embodiments, the component information can be in the form of a table or an array. Table 1 is the component information management table in this application. Here, the position starts from the lower left corner of the front window of the server in this application. The length is the z-axis, the width is the y-axis, and the height is the z-axis, with the unit being millimeters. For example, Hard Disk 1 is at the starting point, and Hard Disk 1, Hard Disk 2, and Hard Disk 3 are stacked in the z-axis direction, and Hard Disk 4, Hard Disk 5, and Hard Disk 6 are stacked in the z-axis direction.

[0071] Component Name Component Location (x, y, z) Air Duct to Which the Component Belongs Hard Disk 1 (0,0,0) 1 Hard Disk 2 (0,0,50) 1 Hard Disk 3 (0,0,100) 1 Hard Disk 4 (0,70,0) 1 Hard Disk 5 (0,70,50) 1 Hard Disk 6 (0,70,100) 1 CPU (400,100,0) 1 Network Card (30,150,30) 1 RAID Card (30,250,30) 2 GPU Card (30,350,30) 3 PSU (650,350,50) 3 Temperature Measurement Point 1 (200,60,0) 1 Temperature Measurement Point 2 (200,250,0) 2

[0072] Table 1 Component Information Management Table

[0073] In some embodiments, as Figure 2 shown, Figure 2 is a schematic structural diagram of a server space layout provided by an embodiment of this application. Here, the wind direction blows from the rear window to the front window. The hard disks are at the lower left corner of the front window and include network cards, RIAD cards, GPU cards, and PSU components. They are divided into 3 air ducts by the air guide cover. From left to right, they are Air Duct 1 / 2 / 3. As described in the aforementioned Table 1 Component Information Management Table, the hard disks and network cards are both in Air Duct 1, the RIAD card is in Air Duct 2, and the GPU card is in Air Duct 3. 1 to 6 on the motherboard are the temperature measurement points on the server motherboard, and FAN is the fan. Heat dissipation regulation is performed by adjusting the fan speed.

[0074] In some embodiments, the heat dissipation regulation method further includes:

[0075] In response to the first component among multiple components not having a temperature reading failure, determine the temperature read by the second component among the multiple components;

[0076] In some embodiments, after using BMC or other hardware monitoring tools to issue a temperature reading instruction, if the first component responds in a timely manner and the returned temperature value is within the reasonable temperature range of the component, it is considered that the first component does not have a temperature reading failure. At this time, there is no need to perform temperature compensation on the second component.

[0077] Based on the read temperature, perform heat dissipation regulation on the second component among the multiple components.

[0078] In some embodiments, if the temperature read by the second component is higher than a preset temperature threshold, such as 90 degrees Celsius, measures need to be taken to reduce the temperature. If the temperature read by the second component is within the safe temperature range, the current heat dissipation can be maintained. If the temperature read by the second component is lower than the preset temperature threshold, such as 30 degrees Celsius, the heat dissipation intensity can be reduced (such as by lowering the fan speed) to save energy consumption. Among them, based on the read temperature, the rotation speed corresponding to the current temperature can be determined according to the mapping relationship between the temperature and the fan speed, and the second component can be regulated for heat dissipation based on this rotation speed. When regulating, a closed-loop control system can also be introduced to collect the temperature data of the second component in real time and dynamically adjust the heat dissipation strategy according to the temperature change. Specifically, a proportional-integral-derivative controller can be used to smoothly adjust the fan speed to avoid frequent fluctuations.

[0079] In some embodiments, by utilizing the temperature read by the second component (real-time temperature reading) and dynamically adjusting the heat dissipation strategy (such as fan speed or liquid cooling flow rate), the heat dissipation efficiency can be optimized while maintaining the stable operation of the internal components of the electronic device.

[0080] In some embodiments, in response to a temperature reading failure of the first component among multiple components, based on the position information of the multiple components in the electronic device, determining the first temperature compensation value corresponding to the second component among the multiple components includes:

[0081] In response to a temperature reading failure of the first component among multiple components, based on the position information of the multiple components in the electronic device, determining the distance between the first component and each component among the multiple components;

[0082] In some embodiments, the distance between the first component and each component among the multiple components refers to the distance between the component with a temperature reading failure and the normally operating component.

[0083] In some embodiments, the distance between the first component (x1, y1, z1) and the second component (x2, y2, z2) can be obtained according to the distance formula between two points in three-dimensional space, and the mathematical expression is as follows:

[0084]

[0085] Among them, l represents the distance between the first component and the second component.

[0086] Based on the distance between the first component and each component among the multiple components, determining the second component among the multiple components whose distance is less than a preset distance threshold;

[0087] In some embodiments, the preset distance threshold is used to determine the second component that will be affected by the temperature of the first component.

[0088] In some embodiments, as described aboveFigure 2 Taking the component layout in the electronic device shown as an example, assuming that the RAID card can work properly, but the temperature of the RAID card cannot be obtained. If the second components within the preset distance threshold calculated are the network card, GPU, and temperature measurement points 2, 3, and 4.

[0089] Determine the air duct and air flow direction where the second components are located among the multiple components. The air flow direction includes the upper air inlet and the lower air inlet.

[0090] In some embodiments, obtain the air duct where the second components are located according to Table 1. Among them, the network card and temperature measurement point 2 are in air duct 1, the GPU card is in air duct 3, and temperature measurement points 3 and 4 are in air duct 2.

[0091] In some embodiments, the air flow direction can be judged according to the orientation of the first component relative to the second component.

[0092] Based on the air duct and air flow direction where the second components are located among the multiple components, determine the first temperature compensation value corresponding to the second components among the multiple components.

[0093] In some embodiments, the first temperature compensation value refers to the temperature compensation value obtained according to the distance, air duct, and air flow direction.

[0094] In some embodiments, it is determined that the first temperature compensation value corresponding to the second components in different air ducts from the RAID card is 0.5 °C. For the second components in the same air duct as the RAID card, there is no compensation for the upper air inlet (i.e., the first temperature compensation value is 0 °C), and the first temperature compensation value corresponding to the second components for the lower air inlet is 1 °C. In this application, the first temperature compensation value can be set as needed and is not limited to the values in this embodiment.

[0095] In some embodiments, if the local temperature of the electronic device is too high, it will cause the fan speed to be very fast. Therefore, it is also necessary to perform secondary compensation on the second components to increase the temperature compensation intensity and reduce the possibility of server downtime.

[0096] In some embodiments, the heat dissipation regulation of the second components based on the compensated temperature includes:

[0097] Based on the compensated temperature, use the preset temperature compensation method to determine the second temperature compensation value corresponding to the second components among the multiple components;

[0098] Based on the second temperature compensation value corresponding to the second components among the multiple components, determine the temperature after secondary compensation corresponding to the second components among the multiple components, and perform heat dissipation regulation on the second components based on the temperature after secondary compensation.

[0099] In some embodiments, the compensated temperature is determined by the aforementioned first temperature compensation value and the temperature read by the second components.

[0100] In some embodiments, the preset temperature compensation method is used to further compensate the temperature of the second component.

[0101] In some embodiments, by determining the temperature after secondary compensation corresponding to the second component among multiple components based on the second temperature compensation value corresponding to the second component among the multiple components, and performing heat dissipation regulation on the second component based on the temperature after secondary compensation, the temperature estimation can be further refined using the preset temperature compensation method on the basis of the preliminary temperature compensation, and more accurate heat dissipation regulation can be performed accordingly, which can optimize the heat dissipation strategy, ensure the stable operation of the components in the electronic device, and extend the service life of the hardware.

[0102] In some embodiments, the preset temperature compensation method includes a gradient compensation method and a linear compensation method. The gradient compensation method is that the temperature compensation value is fixed in the preset temperature range, and the linear compensation method is that the temperature compensation value increases at a preset ratio in the preset temperature range.

[0103] In some embodiments, Table 2 and Table 3 are a gradient compensation method and a linear compensation method provided by the embodiments of the present disclosure.

[0104] Temperature Range Temperature Compensation Value 0°C to 34°C 0℃ 35°C to 50°C 0.5℃ 65°C to 84°C 1.5℃ 85°C to 95°C 2℃

[0105] Table 2 Gradient Compensation Method

[0106] Temperature Range Temperature Compensation Value 0°C to 34°C 0℃ 35°C to 50°C 0°C to 0.5°C 65°C to 84°C 0.5°C to 1.5°C 85°C to 95°C 1.5°C to 2°C

[0107] Table 3 Linear Compensation Method

[0108] Among them, in Table 2, the preset temperature ranges may include four preset temperature ranges: 0°C to 34°C, 35°C to 50°C, 65°C to 84°C, and 85°C to 95°C. Each temperature range corresponds to a second temperature compensation value. This application does not limit the number of preset temperature ranges or the temperature range of the preset temperature ranges. When the temperature range of the second component is 35°C to 50°C, it can be determined that the second temperature compensation value corresponding to the second component is 0.5°C. In Table 3, the preset temperature ranges may include four preset temperature ranges: 0°C to 34°C, 35°C to 50°C, 65°C to 84°C, and 85°C to 95°C. Each temperature range corresponds to a second temperature compensation value range. This application also does not limit the second temperature compensation value range. For example, when the temperature range of the second component is 35°C to 50°C, the range of the second temperature compensation value can be 0°C to 0.5°C or 0°C to 1.5°C. When the temperature range of the second component is 35°C to 50°C, the second temperature compensation value corresponding to the second component can be determined according to the specific temperature value of the second component. Specifically, the preset ratio is 0.5*(50 - 35). The preset ratio represents the second temperature compensation value increased for each 1°C increase of the second component. If the second component is at 40°C, it can be determined that the second temperature compensation value corresponding to the second component is 0.5*(50 - 35) / (40 - 35), that is, 0.167°C.

[0109] In some embodiments, as Figure 3 shown, Figure 3 is a flowchart of a heat dissipation regulation method provided by an embodiment of this application, including BMC startup, obtaining the server model based on the motherboard, obtaining the air duct based on the server model, obtaining the motherboard temperature measurement points and the components on each slot, establishing a component position management table based on the components, air duct, and temperature measurement points, determining whether there is a temperature reading failure for the components or temperature measurement points. If not, directly perform heat dissipation regulation on the temperature data of each temperature measurement point. If so, first perform temperature compensation on the surrounding components (second components) based on the faulty component (first component), and then perform heat dissipation regulation based on the compensated temperature.

[0110] In some embodiments, as Figure 4 shown, Figure 4 is a schematic structural diagram of a heat dissipation regulation framework provided by an embodiment of this application. Among them, the three-dimensional management module is mainly used to manage the component and temperature measurement point position management table (component information management table). The temperature compensation module is mainly used to compensate the temperature value based on the position management table when there is a temperature reading failure but the corresponding function is normal. The heat dissipation regulation module performs heat dissipation regulation based on the compensated temperature or the temperature after secondary compensation.

[0111] Through this application, the position information of multiple components in an electronic device is obtained; in response to a temperature reading failure of a first component among the multiple components, based on the position information of the multiple components in the electronic device, a first temperature compensation value corresponding to a second component among the multiple components is determined; based on the first temperature compensation value, a compensated temperature corresponding to the second component is determined; based on the compensated temperature, heat dissipation regulation of the second component is performed. By compensating the temperature before heat dissipation regulation, the technical problems of excessive fan noise and lag in heat dissipation regulation in related solutions can be solved, and the technical effects of reducing fan noise and effectively avoiding lag in heat dissipation regulation can be achieved.

[0112] From the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware, but in many cases, the former is a better implementation method.

[0113] An embodiment of this application also provides a heat dissipation regulation device 500. Figure 5 As shown in the structural schematic diagram of a heat dissipation regulation device provided by an embodiment of the present disclosure, Figure 5 as shown, it includes:

[0114] An acquisition unit 501, configured to acquire the position information of multiple components in an electronic device;

[0115] A first determination unit 502, configured to, in response to a temperature reading failure of a first component among the multiple components, based on the position information of the multiple components in the electronic device, determine a first temperature compensation value corresponding to a second component among the multiple components;

[0116] A second determination unit 503, configured to determine a compensated temperature corresponding to the second component based on the first temperature compensation value;

[0117] A regulation unit 504, configured to perform heat dissipation regulation on the second component based on the compensated temperature.

[0118] Through this device, the position information of multiple components in an electronic device is obtained; in response to a temperature reading failure of a first component among the multiple components, based on the position information of the multiple components in the electronic device, a first temperature compensation value corresponding to a second component among the multiple components is determined; based on the first temperature compensation value, a compensated temperature corresponding to the second component is determined; based on the compensated temperature, heat dissipation regulation of the second component is performed. By compensating the temperature before heat dissipation regulation, the technical problems of excessive fan noise and lag in heat dissipation regulation in related solutions can be solved, and the technical effects of reducing fan noise and effectively avoiding lag in heat dissipation regulation can be achieved.

[0119] Further, in a possible implementation manner of an embodiment of the present disclosure, the acquisition unit 501 is configured to:

[0120] Obtain the air duct information, component information, and temperature measurement point information of the electronic device;

[0121] Based on the air duct information, component information, and temperature measurement point information of the electronic device, determine the position information of multiple components in the electronic device.

[0122] Further, in a possible implementation manner of the embodiments of the present disclosure, the obtaining unit 501 is used for:

[0123] Obtain the model of the electronic device;

[0124] Based on the model of the electronic device, determine the air duct information, component information, and temperature measurement point information in the electronic device from the pre-configured resources, where the component information includes the component name, component location, and the air duct where the component is located.

[0125] Further, in a possible implementation manner of the embodiments of the present disclosure, the heat dissipation control device 500 further includes a third determination unit, and the third determination unit is used for:

[0126] In response to the first component among the multiple components not having a temperature reading failure, determine the temperature read by the second component among the multiple components;

[0127] Based on the read temperature, perform heat dissipation control on the second component among the multiple components.

[0128] Further, in a possible implementation manner of the embodiments of the present disclosure, the first determination unit 502 is used for:

[0129] In response to the first component among the multiple components having a temperature reading failure, based on the position information of the multiple components in the electronic device, determine the distance between the first component and each component among the multiple components;

[0130] Based on the distance between the first component and each component among the multiple components, determine the second component among the multiple components whose distance is less than the preset distance threshold;

[0131] Determine the air duct and air flow direction where the second component among the multiple components is located, and the air flow direction includes the upper air inlet and the lower air inlet;

[0132] Based on the air duct and air flow direction where the second component among the multiple components is located, determine the first temperature compensation value corresponding to the second component among the multiple components.

[0133] Further, in a possible implementation manner of the embodiments of the present disclosure, the regulation unit 504 is used for:

[0134] Based on the compensated temperature, use the preset temperature compensation method to determine the second temperature compensation value corresponding to the second component among the multiple components;

[0135] Based on the second temperature compensation value corresponding to the second component among multiple components, determine the temperature after secondary compensation corresponding to the second component among the multiple components, and perform heat dissipation regulation on the second component based on the temperature after secondary compensation.

[0136] Further, in a possible implementation manner of the embodiments of the present disclosure, the preset temperature compensation methods include a gradient compensation method and a linear compensation method. In the gradient compensation method, the temperature compensation value is fixed within a preset temperature range, and in the linear compensation method, the temperature compensation value increases at a preset ratio within the preset temperature range.

[0137] Through this device, obtain the position information of multiple components in the electronic device; in response to a temperature reading failure of the first component among the multiple components, based on the position information of the multiple components in the electronic device, determine the first temperature compensation value corresponding to the second component among the multiple components; based on the first temperature compensation value, determine the compensated temperature corresponding to the second component; based on the compensated temperature, perform heat dissipation regulation on the second component. By compensating the temperature before heat dissipation regulation, the technical problems of excessive fan noise and lag in heat dissipation regulation in related solutions can be solved, and the technical effects of reducing fan noise and effectively avoiding lag in heat dissipation regulation can be achieved.

[0138] For the description of the features in the embodiments corresponding to the heat dissipation regulation device, reference can be made to the relevant descriptions in the embodiments corresponding to the heat dissipation regulation method, which will not be elaborated here one by one.

[0139] The embodiments of the present application further provide an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any of the above heat dissipation regulation method embodiments.

[0140] The embodiments of the present application further provide a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps in any of the above heat dissipation regulation method embodiments when running.

[0141] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: USB flash drives, read-only memories (ROM), random access memories (RAM), mobile hard disks, magnetic disks, or optical discs and other various media that can store computer programs.

[0142] The embodiments of the present application further provide a computer program product. The above computer program product includes a computer program, and when the computer program is executed by a processor, it implements the steps in any of the above heat dissipation regulation method embodiments.

[0143] Embodiments of the present application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, where the computer program, when executed by a processor, implements the steps in any of the above-described embodiments of the heat dissipation control method.

[0144] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0145] The above has introduced in detail a heat dissipation control method, device, electronic device, and storage medium provided by the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A heat dissipation control method, characterized in that, Including: Obtaining the location information of multiple components in the electronic device; In response to a temperature reading failure of a first component among the multiple components, determining a first temperature compensation value corresponding to a second component among the multiple components based on the location information of the multiple components in the electronic device; Determining a compensated temperature corresponding to the second component based on the first temperature compensation value; Performing heat dissipation regulation on the second component based on the compensated temperature.

2. The heat dissipation regulation method according to claim 1, wherein, The obtaining the location information of multiple components in the electronic device includes: Obtaining the air duct information, component information, and temperature measurement point information of the electronic device; Determining the location information of multiple components in the electronic device based on the air duct information, component information, and temperature measurement point information of the electronic device.

3. The heat dissipation control method according to claim 2, wherein The obtaining the air duct information, component information, and temperature measurement point information of the electronic device includes: Obtaining the model of the electronic device; Based on the model of the electronic device, determining the air duct information, component information, and temperature measurement point information in the electronic device from pre-configured resources, where the component information includes component name, component location, and the air duct where the component is located.

4. The heat dissipation regulation method according to claim 1, wherein The method further includes: In response to no temperature reading failure of a first component among the multiple components, determining the temperature read by a second component among the multiple components; Performing heat dissipation regulation on a second component among the multiple components based on the read temperature.

5. The heat dissipation control method according to claim 1, wherein The in response to a temperature reading failure of a first component among the multiple components, determining a first temperature compensation value corresponding to a second component among the multiple components based on the location information of the multiple components in the electronic device includes: In response to a temperature reading failure of a first component among the multiple components, determining the distance between the first component among the multiple components and each component among the multiple components based on the location information of the multiple components in the electronic device; Determining a second component among the multiple components whose distance is less than a preset distance threshold based on the distance between the first component among the multiple components and each component among the multiple components; Determining the air duct and air flow direction where the second component among the multiple components is located, where the air flow direction includes the upper air inlet and the lower air inlet; Determining a first temperature compensation value corresponding to the second component among the multiple components based on the air duct and air flow direction where the second component among the multiple components is located.

6. The heat dissipation regulation method according to claim 1, wherein The performing heat dissipation regulation on the second component based on the compensated temperature includes: Determining a second temperature compensation value corresponding to the second component among the multiple components using a preset temperature compensation method based on the compensated temperature; Determining a temperature after secondary compensation corresponding to the second component among the multiple components based on the second temperature compensation value corresponding to the second component among the multiple components, and performing heat dissipation regulation on the second component based on the temperature after secondary compensation.

7. The heat dissipation control method according to claim 6, characterized in that, The preset temperature compensation methods include a gradient compensation method and a linear compensation method. In the gradient compensation method, the temperature compensation value in a preset temperature range is fixed, and in the linear compensation method, the temperature compensation value in a preset temperature range increases according to a preset ratio.

8. A heat dissipation control device, characterized in that, Including: An obtaining unit for obtaining the location information of multiple components in the electronic device; A first determination unit, configured to, in response to a temperature reading failure of a first component among the multiple components, determine a first temperature compensation value corresponding to a second component among the multiple components based on the position information of the multiple components in the electronic device; A second determination unit, configured to determine a compensated temperature corresponding to the second component based on the first temperature compensation value; A regulation unit, configured to perform heat dissipation regulation on the second component based on the compensated temperature.

9. An electronic device, characterized in that, Comprising: A memory, configured to store a computer program; A processor, configured to implement the steps of the heat dissipation regulation method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium, wherein the computer program implements the steps of the heat dissipation regulation method according to any one of claims 1 to 7 when executed by a processor.

Images