Multi-parameter layout etching compensation methods, devices, media, program products and terminals
By acquiring and processing multi-parameter feature information of the layout pattern, generating and filtering etching compensation values, the problem of difficulty in capturing multi-parameter coupling relationships in the existing technology is solved, achieving high-precision etching compensation effect and improving the quality and efficiency of chip manufacturing.
Patent Information
- Application Number
- CN202510814825.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-18
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2045-06-18
AI Technical Summary
Existing etching compensation methods based on two-dimensional rule tables cannot effectively capture the complex coupling relationships between multiple parameters, resulting in limited compensation accuracy and efficiency, and failing to meet the needs of modern complex processes.
By acquiring the layout graphic and compensation script file, multiple feature information and feature parameters corresponding to the target compensation coordinates are extracted, a comprehensive calculation is performed to generate a preliminary compensation value, and a target compensation value is generated through a filtering operation. Finally, an etching compensation operation is performed, which solves the complex coupling problem between multiple parameters.
It improves the freedom and accuracy of etching compensation, enables precise compensation of multiple parameters, and enhances chip design quality and the adaptability of manufacturing processes.
Smart Images

Figure CN120337849B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the semiconductor field, and in particular to a multi-parameter layout etching compensation method, apparatus, medium, process product, and terminal. Background Technology
[0002] In integrated circuit (IC) manufacturing processes, etching compensation refers to the technical means employed during the etching process to compensate for linewidth variations or pattern deviations caused by the etching process, directly impacting chip manufacturing yield and performance. However, existing etching compensation methods exhibit significant limitations when dealing with the interactions of multi-dimensional parameters. Among traditional compensation strategies, methods based on two-dimensional rule tables are the most typical. Their basic design concept is to describe the interactions between process parameters through discretized tables, but they are limited to modeling combinations of two parameters.
[0003] Specifically, this method requires establishing an independent two-dimensional rule table for every pair of key feature parameters such as line width, line spacing, and pattern length. For example, to accurately capture the variation pattern between line width and line spacing, one rule table needs to be designed; while analyzing the relationship between line width and pattern length requires another rule table. Although this method of constructing rule tables pairwise simplifies the problem to some extent, it has significant shortcomings: it cannot simultaneously consider the complex coupling effects between multiple process parameters, making it difficult to achieve the optimal compensation scheme under the combined influence of multiple parameters. Furthermore, as the parameter dimensions and value range increase, the number of rule tables and maintenance costs grow exponentially, further limiting the scalability and applicability of the method. These bottlenecks make it difficult for traditional two-dimensional rule table strategies to achieve accurate and efficient etching compensation when facing modern complex processes. Summary of the Invention
[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a multi-parameter layout etching compensation method, apparatus, medium, program product and terminal to solve the problem that the existing etching compensation method based on two-dimensional rule tables can only model parameters one pair at a time, and cannot effectively capture the complex coupling relationship between multiple parameters, resulting in limited compensation accuracy and efficiency.
[0005] To achieve the above and other related objectives, a first aspect of this application provides a multi-parameter layout etching compensation method, comprising: acquiring a layout graphic and a compensation script file, wherein the layout graphic includes one or more target compensation coordinates; performing the following operations based on the compensation script file: acquiring multiple feature information corresponding to the target compensation coordinates from the layout graphic, and feature parameters of each feature information; for each target compensation coordinate, performing a compensation calculation operation on the feature parameters of preset feature information according to a calculation instruction to generate a preliminary compensation value; performing a filtering operation on the preliminary compensation value according to filtering conditions to generate a target compensation value; and performing an etching compensation operation on the target compensation coordinates according to the target compensation value.
[0006] In some embodiments of the first aspect of this application, the process of performing a filtering operation on the preliminary compensation value according to filtering conditions to generate a target compensation value includes: if the preliminary compensation value fails the filtering operation, then performing the compensation calculation operation on the preliminary compensation value again and updating the preliminary compensation value; performing the filtering operation on the updated preliminary compensation value again; repeating the compensation calculation operation and the filtering operation until the updated preliminary compensation value passes the filtering operation.
[0007] In some embodiments of the first aspect of this application, the process of performing compensation calculation operations on the feature parameters of preset feature information according to the calculation instructions to generate a preliminary compensation value includes: filtering preset feature information defined in the calculation instructions from the plurality of feature information; and performing one or more calculations of logical operation, arithmetic operation, topological operation and relational operation on the preset feature information according to the operation type in the calculation instructions to generate a preliminary compensation value.
[0008] In some embodiments of the first aspect of this application, the calculation instructions include target compensation coordinates to be calculated, as well as feature information, calculation type, and compensation direction associated with the coordinates.
[0009] In some embodiments of the first aspect of this application, the compensation script file includes an influence factor for each feature information, and the process of performing an etching compensation operation on the target compensation coordinates according to the target compensation value includes: modifying the target compensation value based on the influence factor to generate a compensation correction value; and performing a displacement operation on the target compensation coordinates according to the compensation direction specified in the operation instruction, using the compensation correction value as a moving distance.
[0010] In some embodiments of the first aspect of this application, the feature information includes one or more of the following layout feature types: spacing, line width, length, corner angle, density distribution, adjacent edge spacing, adjacent edge line width, and adjacent edge length.
[0011] To achieve the above and other related objectives, a second aspect of this application provides a multi-parameter layout etching compensation device, comprising: a data acquisition module for acquiring a layout graphic and a compensation script file, wherein the layout graphic includes one or more target compensation coordinates; a compensation calculation module for performing the following operations based on the compensation script file: acquiring multiple feature information corresponding to the target compensation coordinates from the layout graphic, and feature parameters of each feature information; for each target compensation coordinate, performing a compensation calculation operation on the feature parameters of preset feature information according to a calculation instruction to generate a preliminary compensation value; performing a filtering operation on the preliminary compensation value according to filtering conditions to generate a target compensation value; and an etching compensation module for performing an etching compensation operation on the target compensation coordinates according to the target compensation value.
[0012] To achieve the above and other related objectives, a third aspect of this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the multi-parameter layout etch compensation method.
[0013] To achieve the above and other related objectives, a fourth aspect of this application provides a computer program product including computer program code that, when executed on a computer, causes the computer to implement the multi-parameter layout etch compensation method.
[0014] To achieve the above and other related objectives, a fifth aspect of this application provides an electronic terminal, including a memory, a processor, and a computer program stored in the memory; the processor executes the computer program to implement the multi-parameter layout etch compensation method.
[0015] As described above, the multi-parameter layout etching compensation method, apparatus, medium, program product, and terminal of this application have the following beneficial effects: By acquiring a layout graphic containing target compensation coordinates and a compensation script file; extracting multiple feature information and feature parameters corresponding to the target compensation coordinates from the layout graphic based on the compensation script file; performing comprehensive calculations on the feature parameters for each target compensation coordinate according to preset calculation instructions to generate a preliminary compensation value; filtering out unreasonable compensation results using screening conditions; and performing etching compensation operations on the target compensation coordinates based on the target compensation value. This solves the problem that a single two-dimensional etching deviation rule table in the prior art cannot adapt to the influence of multiple factors, improving the freedom and accuracy of etching compensation. Attached Figure Description
[0016] Figure 1 The diagram shows a flowchart of an embodiment of the multi-parameter layout etch compensation method of this application.
[0017] Figure 2 This diagram shows a structural schematic of an embodiment of the multi-parameter layout etching compensation device of this application.
[0018] Figure 3 This diagram shows a structural schematic of an embodiment of the multi-parameter layout etch compensation terminal of this application. Detailed Implementation
[0019] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.
[0020] Before providing a further detailed description of the present invention, the nouns and terms used in the embodiments of the present invention are explained, and the nouns and terms used in the embodiments of the present invention are subject to the following interpretations:
[0021] <1> Layout graphics: In integrated circuit design, the combination of patterns on the surface of a chip represents the geometry of circuit elements and their interconnections, used in chip manufacturing.
[0022] <2> Corner angle: The angle at which a line or edge turns, a key parameter affecting manufacturing and electrical performance.
[0023] <3> Density distribution: The coverage density of the pattern on the chip surface reflects the distribution of the pattern per unit area, affecting the uniformity and performance of the manufacturing process.
[0024] <4> Edge spacing: The minimum distance between the edge of a graphic and the edge of a neighboring graphic, ensuring electrical isolation and manufacturing margin.
[0025] <5> Edge line width: The line width near the edge, which affects electrical performance and process reliability.
[0026] <6> Edge length: The length of the line at the edge, which is related to electrical and mechanical properties.
[0027] <7> Script file: A text file used to automate the design, verification, or processing of layouts. It contains programming instructions or command scripts to automate operations and control processes.
[0028] <8> YMAL: YMAL (YAML Ain't Markup Language) is a data serialization format designed to represent data structures in a concise, readable plain text format. It supports multiple data types such as scalars, sequences, and mappings, and is commonly used in configuration files and data exchange scenarios.
[0029] To facilitate understanding of the embodiments of this application, firstly, in conjunction with Figure 1 Detailed explanation. Figure 1 A flowchart illustrating a multi-parameter layout etching compensation method according to an embodiment of the present invention is shown. The multi-parameter layout etching compensation method in this embodiment mainly includes the following steps:
[0030] Step S11: Obtain the layout graphic and compensation script file, wherein the layout graphic contains one or more target compensation coordinates.
[0031] In one embodiment of this application, the feature information includes one or more of the following layout feature types: spacing, line width, length, corner angle, density distribution, adjacent edge spacing, adjacent edge line width, and adjacent edge length.
[0032] In this embodiment, spacing refers to the distance between two graphics or lines; line width is the width of the line itself in the layout, representing the distance from one edge to the other; length represents the dimension of the line or graphic, that is, the distance from the start point to the end point of the line segment; corner angle refers to the turning angle of the line at the bell node, usually the angle between two line segments; density distribution refers to the area ratio or the arrangement density of elements in the layout within a predetermined area; edge spacing characteristic represents the distance between the graphic and the adjacent edge of the layout; edge line width refers to the width control of the line near the edge of the layout; edge length refers to the length dimension of the line near the edge of the layout.
[0033] In one embodiment of this application, the layout graphic includes one or more target compensation coordinates.
[0034] In this embodiment, the layout graphic includes one or more target compensation coordinates, which are line segment coordinates obtained by dividing the line segments in the layout graphic. This embodiment divides the continuous graphic lines into multiple independent line segments, forming the basic spatial units for subsequent attribute calculations and position adjustments.
[0035] By segmenting the layout into lines, precise control over each part of the chip layout can be achieved during etching optimization, improving the accuracy and efficiency of layout adjustment, thereby enhancing chip design quality and manufacturing process adaptability. This implementation method maintains the overall structural rationality of the layout while allowing for flexible adjustments to local areas, meeting the high-precision spatial layout management requirements of complex semiconductor designs.
[0036] Step S12: Based on the compensation script file, perform the following operations: obtain multiple feature information corresponding to the target compensation coordinates from the layout graphic, as well as feature parameters of each feature information; for each target compensation coordinate, perform compensation calculation operations on the feature parameters of the preset feature information according to the calculation instructions to generate a preliminary compensation value; perform a filtering operation on the preliminary compensation value according to the filtering conditions to generate a target compensation value.
[0037] In one embodiment of this application, multiple feature information and their feature parameters corresponding to the target compensation coordinates in the chip layout are extracted and obtained according to the preset calculation instructions in the compensation script file. For each target compensation coordinate, a compensation calculation operation is performed based on the feature parameters to generate a preliminary compensation value. This compensation value reflects the comprehensive calculation result of the multi-dimensional feature information of the graphic and the set calculation rules. Subsequently, the preliminary compensation value is filtered according to predetermined filtering conditions to remove compensation results that do not conform to the design or process specifications, thereby obtaining the final target compensation value.
[0038] Furthermore, whether the target compensation coordinates in the layout have shifted is determined based on a comprehensive analysis of their associated feature information and feature parameters. Specifically, based on the selected target compensation values, it is determined whether the conditions for triggering graphic movement are met. If so, the graphic movement operation is executed. The amount of graphic movement is jointly determined by multiple feature parameters through predetermined compensation calculation rules. This calculation process fully considers the multi-dimensional characteristics of each line segment after segmentation to ensure the accuracy and rationality of compensation. Combining the target compensation value selection results, the specific amount and direction of graphic movement are determined, achieving precise adjustment of the layout graphic.
[0039] In one embodiment of this application, the filtering conditions include, but are not limited to: compensation values being within a preset reasonable range, and compensation values exceeding this range being discarded; compensation values having an absolute value greater than a predetermined threshold, and compensation values below this threshold being excluded; and compensation values being filtered out when the combination of characteristic parameters corresponding to the compensation value does not conform to the design specifications according to the constraints set by the process specifications.
[0040] In one embodiment of this application, the compensation script file may employ programming languages including but not limited to Python, C++, or JavaScript, and be stored using specific scripting language file formats such as JSON, XML, or YMAL to achieve structured and easily parsed data management. For the graphics in the chip layout, multiple feature information corresponding to the target compensation coordinates is extracted using layout analysis tools or processing modules, such as line segment length, angle, attribute values, and other multi-dimensional feature parameters. The extracted feature information and its corresponding feature parameters are uniformly stored in a predefined data structure, often organized in key-value pairs; exemplarily, attribute fields in JSON format are used. This embodiment is only used for explanation and illustration of this application and is not intended to limit its scope.
[0041] Furthermore, to ensure accurate matching with the information in the compensation script file, the data structure design of the feature information in the layout is consistent with the pre-defined parameter naming and hierarchy in the compensation script. Specifically, the variable names, feature parameter labels, and data hierarchy defined in the compensation script file correspond to the storage format of the layout feature information. The compensation script can directly reference the feature parameters extracted from the layout through variable mapping or interface calls, avoiding ambiguity and the complexity of data conversion.
[0042] In one embodiment of this application, the process of performing a filtering operation on the preliminary compensation value according to the filtering conditions to generate a target compensation value includes: if the preliminary compensation value fails the filtering operation, then the compensation calculation operation is performed again on the preliminary compensation value, and the preliminary compensation value is updated; the filtering operation is performed again on the updated preliminary compensation value; the compensation calculation operation and the filtering operation are repeated until the updated preliminary compensation value passes the filtering operation.
[0043] For example, taking target locations A, B, and C in the chip layout as examples, the feature parameters of their line width and spacing are optimized, and updated feature parameters with compensation values are generated through complex expression calculations. Based on these new feature parameters, the feature results A1, B1, and C1 at each target location are calculated. The above feature results are judged according to preset unified filtering conditions. If C1 meets the filtering conditions, the compensation value at location C is confirmed; if A1 and B1 do not meet the conditions, the compensation values at locations A and B are corrected accordingly.
[0044] Specifically, for positions A and B that failed the screening, the compensation calculation operation is performed again based on the previously calculated compensation value. In this compensation calculation, the inherent size characteristic parameters of the target positions are incorporated, and logical operations are used to form the basis for adjusting the compensation value. Based on these adjusted characteristic parameters, the characteristic results A2 and B2 for positions A and B are calculated again, and the original unified screening and filtering conditions are still used to determine the compensation value for each target position. This embodiment iterates under the unified screening and filtering conditions, gradually optimizing the characteristic parameters and correcting the compensation value in multiple rounds until the compensation value for all target positions meets the screening requirements.
[0045] In one embodiment of this application, the calculation instruction includes the target compensation coordinates to be calculated, as well as the feature information, calculation type, and compensation direction associated with the coordinates.
[0046] In this embodiment, the target compensation coordinates represent the coordinates of points or line segments in the layout that need to be compensated. The feature information associated with these coordinates includes, but is not limited to, line width, line spacing, graphic length, and surrounding environment density. This application overcomes the limitations of traditional two-dimensional rule tables by using calculation instructions in a script file, enabling simultaneous targeted optimization of multiple process parameters and the adoption of precise compensation strategies based on different feature combinations.
[0047] In one embodiment of this application, the process of performing compensation calculation operations on the feature parameters of preset feature information according to the calculation instructions to generate a preliminary compensation value includes: filtering out the preset feature information defined in the calculation instructions from the plurality of feature information; and performing one or more calculations of logical operation, arithmetic operation, topological operation and relational operation on the preset feature information according to the operation type in the calculation instructions to generate a preliminary compensation value.
[0048] In this embodiment, the process of filtering out preset feature information defined in the operation instruction from multiple feature information includes: performing field matching based on the feature identifier field contained in the compensation script file. The aforementioned feature identifier is a unique ID, type code, or descriptor used to indicate the target compensation coordinates. The feature identifier in the operation instruction is compared with the corresponding field in the feature information database using exact matching or pattern matching. For example, when the operation instruction contains the identifier "LW_50nm", all linewidth feature information with that ID is filtered out.
[0049] In this embodiment, the process of performing one or more operations according to the operation type in the operation instruction includes: arithmetic operations using weighted summation, multiplication, exponential functions, logarithmic functions, etc., to calculate the compensation value; topological operations calculating the spatial relationships and geometric structures between map elements, such as the minimum distance between two line segment boundaries, intersection area, connectivity, etc., as a reference for correcting the compensation amplitude and adjusting the compensation direction; relational operations comparing feature parameters, such as determining whether the line width exceeds a set threshold or the magnitude relationship of multiple sets of parameters, and using the determination result as a numerical value to participate in the assignment and adjustment of the compensation amount; and logical operations combining the results or weights of multiple compensation models using logical rules such as AND, OR, NOT.
[0050] Step S13: Perform an etching compensation operation on the target compensation coordinates according to the target compensation value.
[0051] In one embodiment of this application, the compensation script file includes an influence factor for each type of feature information. The process of performing an etching compensation operation on the target compensation coordinates based on the target compensation value includes: correcting the target compensation value based on the influence factor to generate a compensation correction value; and performing a displacement operation on the target compensation coordinates according to the compensation direction specified in the operation instruction, using the compensation correction value as the moving distance.
[0052] In this embodiment, the influence factor reflects the specific degree of influence of different feature information on the etching compensation effect. For the target compensation coordinates in the chip layout, various feature information and their dimensional parameters, such as line width and spacing, are automatically measured and calculated at that location, and multiple corresponding compensation values are calculated accordingly. Then, these compensation values are multiplied by the corresponding influence factor, and a weighted summation is performed to form a comprehensive compensation correction value.
[0053] Taking locations with narrow linewidths and small spacing as an example, relevant influencing factors may increase the overall compensation correction value to compensate for the risk of insufficient etching caused by the small structure. This overall correction value is used to determine the actual movement distance of the target location, and combined with a predetermined compensation direction, completes the precise displacement adjustment of the layout. Through this embodiment, an overall compensation correction based on multiple feature size parameters and their influence weights is achieved.
[0054] It should be noted that, in the embodiments of this application, the words "exemplary" or "for example" indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0055] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.
[0056] Figure 2 This is a schematic block diagram of a multi-parameter layout etching compensation device 200 provided in an embodiment of this application. Figure 2 As shown, the device includes a data acquisition module 201, a compensation calculation module 202, and an etching compensation module 203.
[0057] Data acquisition module 201: used to acquire the layout graphic and compensation script file, wherein the layout graphic contains one or more target compensation coordinates.
[0058] Compensation calculation module 202: is used to perform the following operations based on the compensation script file: obtain multiple feature information corresponding to the target compensation coordinate from the layout graphic, as well as feature parameters of each feature information; for each target compensation coordinate, perform compensation calculation operation on the feature parameters of the preset feature information according to the calculation instruction to generate a preliminary compensation value; perform a filtering operation on the preliminary compensation value according to the filtering conditions to generate a target compensation value.
[0059] Etching compensation module 203: used to perform etching compensation operation on the target compensation coordinates according to the target compensation value.
[0060] It should be understood that the specific process of each module performing the above-mentioned steps has been described in detail in the above method embodiments, and will not be repeated here for the sake of brevity.
[0061] It should also be understood that the module division in the embodiments of this application is illustrative and only represents a logical functional division; in actual implementation, there may be other division methods. Furthermore, the functional modules in the various embodiments of this application can be integrated into a single processor, exist as separate physical entities, or be integrated into a single module. The integrated modules described above can be implemented in hardware or as software functional modules.
[0062] Figure 3This is a schematic block diagram of the electronic terminal provided in an embodiment of this application. Figure 3 As shown, the electronic terminal includes at least one processor 301, a memory 302, at least one network interface 303, and a user interface 305. The various components in the device are coupled together via a bus system 304. It is understood that the bus system 304 is used to implement communication between these components. In addition to a data bus, the bus system 304 also includes a power bus, a control bus, and a status signal bus. However, for clarity, in… Figure 3 The general will label all buses as bus systems.
[0063] The user interface 305 may include a monitor, keyboard, mouse, trackball, clicker, button, touchpad, or touch screen.
[0064] It is understood that memory 302 can be volatile memory or non-volatile memory, or both. Non-volatile memory can be read-only memory (ROM) or programmable read-only memory (PROM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM) and synchronous static random access memory (SSRAM). The memories described in the embodiments of this invention are intended to include, but are not limited to, these and any other suitable categories of memory.
[0065] In this embodiment of the invention, the memory 302 is used to store various types of data to support the operation of the electronic terminal 300. Examples of this data include: any executable program for operation on the electronic terminal 300, such as the operating system 3021 and application programs 3022; the operating system 3021 contains various system programs, such as the framework layer, core library layer, driver layer, etc., for implementing various basic services and handling hardware-based tasks. The application program 3022 may contain various applications, such as a media player, browser, etc., for implementing various application services. The implementation of the multi-parameter layout etch compensation method provided in this embodiment of the invention can be included in the application program 3022.
[0066] The methods disclosed in the above embodiments of the present invention can be applied to processor 301, or implemented by processor 301. Processor 301 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the integrated logic circuit of the hardware in processor 301 or by instructions in the form of software. The processor 301 may be a general-purpose processor, a digital signal processor (DSP), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Processor 301 can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. General-purpose processor 301 may be a microprocessor or any conventional processor, etc. The steps of the accessory optimization method provided in the embodiments of the present invention can be directly reflected as being executed by a hardware decoding processor, or being executed by a combination of hardware and software modules in the decoding processor. The software module may be located in a storage medium, which is located in memory. The processor reads the information in the memory and combines it with its hardware to complete the steps of the aforementioned method.
[0067] In an exemplary embodiment, the electronic terminal 300 may be used by one or more application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), or complex programmable logic devices (CPLDs) to execute the aforementioned method.
[0068] According to the method provided in the embodiments of this application, this application also provides a computer program product, which includes: computer program code, which, when run on a computer, causes the computer to perform a multi-parameter layout etch compensation method as described in any of the embodiments above.
[0069] According to the method provided in the embodiments of this application, this application also provides a computer-readable storage medium storing program code that, when run on a computer, causes the computer to perform a multi-parameter layout etch compensation method as described in any of the embodiments above.
[0070] As used in this specification, the terms "component," "module," "system," etc., are used to refer to computer-related entities, hardware, firmware, combinations of hardware and software, software, or software in execution. For example, a component can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or a computer. As illustrated, applications running on computing devices and computing devices can both be components. One or more components may reside in a process and / or an execution thread, and components may be located on a single computer and / or distributed among two or more computers. Furthermore, these components can be executed from various computer-readable media on which various data structures are stored. Components can communicate, for example, via local and / or remote processes based on signals having one or more data packets (e.g., data from two components interacting with another component between a local system, a distributed system, and / or a network, such as the Internet interacting with other systems via signals).
[0071] Those skilled in the art will recognize that the various illustrative logical blocks and steps described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this application.
[0072] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.
[0073] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0074] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0075] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0076] In the above embodiments, the functions of each functional unit can be implemented entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. A computer program product includes one or more computer instructions (programs). When the computer program instructions (programs) are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. Computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., high-density digital video discs (DVDs)), or semiconductor media (e.g., solid-state drives (SSDs)).
[0077] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0078] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
[0079] In summary, this application provides a multi-parameter layout etching compensation method, apparatus, medium, program product, and terminal. It acquires a layout graphic containing target compensation coordinates and a compensation script file. Based on the compensation script file, it extracts multiple feature information and feature parameters corresponding to the target compensation coordinates from the layout graphic. For each target compensation coordinate, it performs comprehensive calculations on the feature parameters according to preset calculation instructions to generate a preliminary compensation value. It uses screening conditions to filter unreasonable compensation results. Etching compensation is then performed on the target compensation coordinates based on the target compensation value. This solves the problem that a single two-dimensional etching deviation rule table in the prior art cannot adapt to the influence of multiple factors, improving the freedom and accuracy of etching compensation. Therefore, this application effectively overcomes the various shortcomings of the prior art and has high industrial application value.
[0080] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.
Claims
1. A multi-parameter layout etching compensation method, characterized in that, include: Obtain a layout graphic and a compensation script file, wherein the layout graphic contains one or more target compensation coordinates; Based on the compensation script file, the following operations are performed: Multiple feature information corresponding to the target compensation coordinates are obtained from the layout graphic, along with feature parameters for each feature information; for each target compensation coordinate, a compensation calculation operation is performed on the feature parameters of the preset feature information according to the calculation instructions to generate a preliminary compensation value; wherein, the process of performing the compensation calculation operation on the feature parameters of the preset feature information according to the calculation instructions to generate a preliminary compensation value includes: filtering out the preset feature information defined in the calculation instructions from the multiple feature information; performing one or more calculations among logical operations, arithmetic operations, topological operations, and relational operations on the preset feature information according to the operation type in the calculation instructions to generate a preliminary compensation value; and performing a filtering operation on the preliminary compensation value according to the filtering conditions to generate a target compensation value. An etching compensation operation is performed on the target compensation coordinates based on the target compensation value.
2. The multi-parameter layout etching compensation method according to claim 1, characterized in that, The process of performing a filtering operation on the preliminary compensation value according to the filtering conditions to generate the target compensation value includes: If the initial compensation value fails the filtering operation, the compensation calculation operation is performed again on the initial compensation value, and the initial compensation value is updated; the filtering operation is then performed again on the updated initial compensation value. Repeat the compensation calculation operation and the filtering operation until the updated preliminary compensation value passes the filtering operation.
3. The multi-parameter layout etching compensation method according to claim 1, characterized in that, The calculation instructions include the target compensation coordinates to be calculated, as well as the feature information associated with the coordinates, the calculation type, and the compensation direction.
4. The multi-parameter layout etching compensation method according to claim 3, characterized in that, The compensation script file includes an influence factor for each type of feature information. The process of performing an etching compensation operation on the target compensation coordinates based on the target compensation value includes: Based on the aforementioned influencing factors, the target compensation value is modified to generate a modified compensation value. According to the compensation direction specified in the operation instruction, the compensation correction value is used as the moving distance to perform a displacement operation on the target compensation coordinates.
5. The multi-parameter layout etching compensation method according to claim 1, characterized in that, The feature information includes one or more of the following layout feature types: Spacing, line width, length, corner angle, density distribution, adjacent edge spacing, adjacent edge line width, and adjacent edge length.
6. A multi-parameter layout etching compensation device, characterized in that, include: Data acquisition module: used to acquire layout graphics and compensation script files, wherein the layout graphics contain one or more target compensation coordinates; The compensation calculation module is used to perform the following operations based on the compensation script file: obtaining multiple feature information corresponding to the target compensation coordinates from the layout graphic, and feature parameters for each feature information; for each target compensation coordinate, performing compensation calculation operations on the feature parameters of the preset feature information according to the calculation instructions to generate a preliminary compensation value; wherein, the process of performing compensation calculation operations on the feature parameters of the preset feature information according to the calculation instructions to generate a preliminary compensation value includes: filtering the preset feature information defined in the calculation instructions from the multiple feature information; performing one or more calculations of logical operations, arithmetic operations, topological operations, and relational operations on the preset feature information according to the operation type in the calculation instructions to generate a preliminary compensation value; and performing a filtering operation on the preliminary compensation value according to the filtering conditions to generate a target compensation value. Etching compensation module: used to perform etching compensation operation on the target compensation coordinates according to the target compensation value.
7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the multi-parameter layout etch compensation method of any one of claims 1 to 5.
8. A computer program product, characterized in that, The computer program product includes computer program code that, when run on a computer, causes the computer to implement the multi-parameter layout etch compensation method as described in any one of claims 1 to 5.
9. An electronic terminal, comprising a memory, a processor, and a computer program stored in the memory, characterized in that, The processor executes the computer program to implement the multi-parameter layout etch compensation method according to any one of claims 1 to 5.
Citation Information
Patent Citations
Dynamic etching compensation method for circuit of printed circuit board
CN117794089A
Layout etching compensation method and device, electronic equipment and storage medium
CN119275123A