A silicon carbide diode device

Abstract

The present invention discloses a silicon carbide diode device, specifically relating to the field of diodes. The silicon carbide diode comprises a diode body and a frame. The diode body comprises a ceramic plate, the upper surface of which is fixedly connected to a tube shell. An upper transition plate and a silicon carbide chip are also fixed to the upper surface of the ceramic plate in sequence. Two ceramic rings are fixedly connected to one side of the tube shell. External leads are fixedly connected to the interiors of the two ceramic rings. One end of the external lead located inside the tube shell is connected to the silicon carbide chip via an internal lead, and the other end of the external lead located outside the tube shell is fixedly connected to the frame. Compared with existing technologies, the silicon carbide diode of the present invention has a higher internal air ionization voltage level and can operate in complex environments.

Description

Technical Field

[0001] The present invention relates to the technical field of diodes, and more particularly to a silicon carbide diode device. Background Art

[0002] Silicon carbide (SiC) diodes are a new type of semiconductor material. Compared to traditional silicon (Si), SiC diodes offer high-temperature stability and relatively low conduction losses. When two chemical energy sources jointly provide current to a control system, the diode's unidirectional conductivity is utilized. Connecting a sink diode to each positive terminal of the chemical power source output prevents current from flowing into the failed source if one source fails, potentially destabilizing the output voltage and preventing current from flowing into the failed source.

[0003] To facilitate installation of silicon carbide diodes, a frame is welded to each of their two leads. Through the frame, the silicon carbide diode can be bolted onto the circuit board. Currently, soldering is performed at the junction of the leads and the frame. However, during soldering, the soldering gun only welds at one location, and the solder cannot completely cover the junction between the outer lead and the frame, resulting in poor electrical conductivity and unstable operation. Summary of the Invention

[0004] The present invention provides a silicon carbide diode device to solve the problem that, when soldering at the joint between the lead and the frame, the tin soldering gun only solders at one position at the joint, and the solder cannot completely cover the joint between the external lead and the frame, resulting in poor electrical conductivity and unstable operation.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a silicon carbide diode device, the silicon carbide diode comprising a diode body, two frames, and two external leads, the frames being fixed to the diode body via the external leads, the silicon carbide diode being manufactured by the following method: step 1: using a conveyor belt to convey the silicon carbide diode to a welding station; step 2: two soldering guns arranged opposite each other on either side of the welding station serve as a group to simultaneously weld the external leads and the frame of the silicon carbide diode, with the two groups of soldering guns respectively welding two adjacent silicon carbide diodes; step 3: the conveyor belt conveys the silicon carbide diode forward, causing the first group of soldering guns to weld the next silicon carbide diode, and the second group of soldering guns to weld the remaining group of external leads and frame welded by the first group of soldering guns.

[0006] The machine also includes a frame, on which a conveyor belt is installed, which is used to transport silicon carbide diodes; a welding assembly is installed at the lower side of the conveyor belt, and the welding assembly includes a mounting plate, which is fixedly mounted on the frame, and both sides of the upper surface of the welding assembly are rotatably connected to spur gear one and spur gear two, and spur gear one and spur gear two are engaged with each other for transmission, and a motor two is fixedly mounted on the bottom of the mounting plate, and the output shaft of the motor two is fixedly mounted to the spur gear one, and eccentric wheels are fixedly mounted on the upper surfaces of the spur gear one and the spur gear two, and the two eccentric wheels are rotatably connected to the driving frames, and two soldering guns are installed on the upper ends of the two driving frames, and the two soldering guns on the two driving frames are arranged opposite to each other, and the two soldering guns arranged opposite to each other are used to simultaneously weld a frame and an external lead together.

[0007] In a preferred embodiment, the welding assembly also includes a guide component, which includes two guide rods 2 fixedly mounted on both sides of the mounting plate, two guide rods 3 are arranged between the two guide rods 2, the two ends of the two guide rods 3 are respectively slidably mounted on the two guide rods 2, and the two drive frames are movably mounted on the two guide rods 3.

[0008] In a preferred embodiment, a movable part is provided at the upper end of the driving frame, and the movable part includes a moving frame. Both ends of the moving frame are fixedly connected to a guide rod 1, and the two guide rods 1 are laterally movably plugged into the driving frame. A cylinder is installed on the driving frame, and the output end of the cylinder is fixedly installed on the moving frame.

[0009] In a preferred embodiment, the conveyor belt includes a bracket, which is fixedly mounted on a frame, with both ends of the bracket being rotatably connected to a wheel, a belt being transmission-connected between the two wheels, and a motor 1 being fixedly mounted on the bracket, with the output end of the motor 1 being transmission-connected to one of the wheels.

[0010] In a preferred embodiment, a plurality of grooves are provided on the surface of the belt. The grooves are arranged in groups of two, and the two grooves in the same group are symmetrically arranged. The grooves are used to accommodate the frame.

[0011] In a preferred embodiment, a trough is provided at the upper end of the conveyor belt in front of the welding assembly. The trough is fixedly mounted on the conveyor belt, has a feed port on one side and a discharge port at the lower end of the other side of the trough.

[0012] In a preferred embodiment, a loading assembly is provided at the bottom of the spur gear 2, and the loading assembly includes a rotating column, which is fixedly connected to the middle part of the spur gear 2. An inclined groove is provided on the outer wall of the rotating column, and a feeding rod is vertically inserted into the mounting plate. The bottom end of the feeding rod is horizontally inserted into the inside of the inclined groove and can slide inside the inclined groove, and the upper end of the feeding rod is vertically inserted at the position of the discharge port.

[0013] In a preferred embodiment, a spring sheet is fixedly connected to the side wall of the discharge port, and when the diode body is located inside the discharge port, the spring sheet presses the diode body inside the discharge port.

[0014] In a preferred embodiment, a guide frame is provided above the conveyor belt, the guide frame is fixedly mounted on the conveyor belt, a guide groove is provided on the lower surface of the conveyor belt, and when the conveyor belt conveys the silicon carbide diode, the upper end of the diode body slides inside the guide groove.

[0015] In a preferred embodiment, the diode body includes a ceramic sheet, the upper surface of which is fixedly connected to a tube shell, and the upper surface of the ceramic sheet is also fixed with an upper transition sheet and a silicon carbide chip in sequence, and two ceramic rings are fixedly connected to one side of the tube shell, one end of the two outer leads is fixedly connected to the two ceramic rings respectively, the end of the outer lead located inside the tube shell is connected to the silicon carbide chip through the inner lead, and the end of the outer lead located outside the tube shell is fixedly connected to the frame.

[0016] The technical effects and advantages of the present invention are as follows: the present invention adopts relatively arranged solder guns to weld the frame through the setting of the welding assembly, and the movement paths of the two solder guns are both semicircular arcs, so that welding can be performed from one side of the outer lead to the other side, so as to perform comprehensive welding in the circumference of the outer lead, so that the solder can wrap the outer lead. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall installation structure of the present invention.

[0018] Figure 2 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 3 Schematic diagram of the structure of the welding assembly of the present invention.

[0020] Figure 4 It is a structural schematic diagram of the conveyor belt of the present invention.

[0021] Figure 5 It is a structural schematic diagram of the feeding assembly of the present invention.

[0022] Figure 6 It is a schematic diagram of the soldering gun of the present invention during soldering.

[0023] Figure 7 Schematic diagram of the structure of the silicon carbide diode of the present invention.

[0024] Figure 8 A cross-sectional view of the silicon carbide diode of the present invention Figure 1 .

[0025] Figure 9 A cross-sectional view of the silicon carbide diode of the present invention Figure 2 .

[0026] The accompanying drawings are marked as follows: 1, frame; 2, conveyor belt; 21, bracket; 22, rotating wheel; 23, belt; 231, groove; 24, motor 1; 3, welding assembly; 31, mounting plate; 32, spur gear 1; 33, spur gear 2; 34, motor 2; 35, eccentric wheel; 36, driving frame; 37, soldering gun; 38, movable part; 381, moving frame; 382, ​​cylinder; 383, guide rod 1; 39, guide part; 391, guide rod 2; 39 2. Guide rod three; 4. Loading assembly; 41. Rotating column; 411. Inclined trough; 42. Feed rod; 43. Feed trough; 431. Feed inlet; 432. Feed outlet; 433. Shrapnel; 5. Guide frame; 51. Guide groove; 6. Silicon carbide diode; 61. Diode body; 611. Ceramic sheet; 612. Tube shell; 613. Ceramic ring; 614. Outer lead; 615. Inner lead; 616. Silicon carbide chip; 617. Upper transition piece; 62. Frame. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Refer to the instruction manual Figure 7-Figure 9 A silicon carbide diode device, the silicon carbide diode 6 includes a diode body 61 and a frame 62, the diode body 61 includes a ceramic piece 611, the upper surface of the ceramic piece 611 is fixedly connected to a tube shell 612, the upper surface of the ceramic piece 611 is also fixed with an upper transition piece 617 and a silicon carbide chip 616 in sequence, one side of the tube shell 612 is fixedly connected to two ceramic rings 613, the two ceramic rings 613 are fixedly connected with external leads 614, one end of the external lead 614 located inside the tube shell 612 is connected to the silicon carbide chip 616 through an internal lead 615, and the end of the external lead 614 located outside the tube shell 612 is fixedly connected to the frame 62.

[0029] The thermal expansion coefficient between the two materials should not exceed 3*10-6 / °C. The thermal expansion coefficient of silicon carbide chip 616 is 4.5*10-6 / °C. The upper transition piece 617 is a molybdenum-copper sheet with a thermal expansion coefficient of 5*10-6 / °C. The ceramic sheet 611 is made of BeO (beryllium oxide) with a thermal expansion coefficient of 7.3*10-6 / °C. Therefore, silicon carbide chip 616, upper transition piece 617, and ceramic sheet 611 are sintered together using solder, ensuring that the thermal expansion coefficients of the chip and the substrate are consistent at different temperatures, protecting the chip from damage due to external stress. Ceramic ring 613 is made of 95% alumina with a resistivity greater than 1×1017 (μΩ·m). Outer leads 614 are copper leads, sintered to the outer casing through ceramic ring 613. The tube shell 612 is made of T2 copper, the inner leads 615 are made of TU1 oxygen-free copper, and the frame 62 is made of an iron-nickel alloy.

[0030] Compared with existing technologies, the silicon carbide diode 6 has a higher internal air ionization voltage level and can work in complex environments.

[0031] The frame 62 is attached to the two external leads 614 of the diode body 61 by soldering. Threaded holes are provided in the frame 62 to allow the silicon carbide diode 6 to be mounted on the circuit board using bolts. The soldering process requires soldering where the upper end of the frame 62 contacts the external leads 614, i.e., on the upper surface of the frame 62. However, with current soldering technology, the solder does not completely enclose the external leads 614. To address this issue, the following technical solution is proposed.

[0032] Refer to the instruction manual Figures 1-9 , a silicon carbide diode device, made by the following method:

[0033] Step 1: Use the conveyor belt 2 to transport the silicon carbide diode 6 to the welding station;

[0034] Step 2: Two soldering guns 37 arranged opposite to each other on both sides of the welding station work as a group to simultaneously weld the outer lead 614 and the frame 62 of the silicon carbide diode 6. The two groups of soldering guns 37 weld two adjacent silicon carbide diodes 6 respectively.

[0035] Step 3: The conveyor belt 2 conveys the silicon carbide diode 6 forward, so that the first group of soldering guns 37 solders the next silicon carbide diode 6, and the second group of soldering guns 37 solders the remaining set of outer leads 614 and frame 62 soldered by the first group of soldering guns 37;

[0036] The machine also includes a frame 1, on which a conveyor belt 2 is installed, which is used to transport silicon carbide diodes 6; a welding assembly 3 is installed at the lower side of the conveyor belt 2, and the welding assembly 3 includes a mounting plate 31, which is fixedly mounted on the frame 1, and the two sides of the upper surface of the welding assembly 3 are respectively rotatably connected with a spur gear 1 32 and a spur gear 2 33, which are meshed with each other for transmission, and a motor 2 34 is fixedly mounted on the bottom of the mounting plate 31, and the output shaft of the motor 2 34 is fixedly mounted on the spur gear 1 32, and an eccentric wheel 35 is fixedly mounted on the upper surface of the spur gear 1 32 and the spur gear 2 33, and the two eccentric wheels 35 are rotatably connected to a driving frame 36, and the upper ends of the two driving frames 36 are respectively installed with two soldering guns 37, and the two soldering guns 37 on the two driving frames 36 are arranged opposite each other, and the two soldering guns 37 arranged opposite each other are used to simultaneously weld a frame 62 and an external lead 614 together.

[0037] In the above technical solution, if Figure 2 and Figure 3 As shown, the welding assembly 3 also includes a guide component 39, which includes two guide rods 2 391 fixedly mounted on both sides of the mounting plate 31, two guide rods 392 are arranged between the two guide rods 2 391, and the two ends of the two guide rods 392 are respectively slidably mounted on the two guide rods 2 391, and the two drive frames 36 are movably mounted on the two guide rods 392.

[0038] It should be noted that the two guide rods 2 391 are fixed, the two guide rods 392 can move along the axial direction of the guide rods 2 391, and the two drive frames 36 can move along the axial direction of the two guide rods 392. The guide rods 2 391 and the guide rods 392 are arranged vertically.

[0039] In the above technical solution, if Figure 2 and Figure 4 As shown, the conveyor belt 2 includes a bracket 21, which is fixedly mounted on the frame 1. Both ends of the bracket 21 are rotatably connected to a wheel 22, and a belt 23 is transmission-connected between the two wheels 22. A motor 24 is fixedly mounted on the bracket 21, and the output end of the motor 24 is transmission-connected to one of the wheels 22.

[0040] Furthermore, a plurality of grooves 231 are formed on the surface of the belt 23 . The grooves 231 are grouped in pairs, and the two grooves 231 in the same group are symmetrically arranged. The grooves 231 are used to accommodate the frame 62 .

[0041] It should be noted that the interior of the groove 231 is used to place the frame 62, and then the motor 24 drives the wheel 22 to rotate, so that the belt 23 is transmitted to transport the frame 62. In addition, the setting of the groove 231 is also used to position the frame 62 to prevent the position of the silicon carbide diode 6 from moving during the transportation process.

[0042] It should also be noted that the purpose of symmetrically arranging the two grooves 231 in the same group is that the two frames 62 installed on the diode body 61 are symmetrical. Therefore, the two grooves 231 correspond to one diode body 61, that is, to one silicon carbide diode 6.

[0043] In this embodiment, the specific implementation is as follows: the conveyor belt 2 conveys the assembled silicon carbide diode 6 forward, and two solder guns 37 arranged opposite each other form a group. When the conveyor belt 2 reaches the position of two groups of solder guns 37, it stops. At this time, each group of solder guns 37 corresponds to one silicon carbide diode 6, and as shown in FIG. Figure 6 As shown, the welding ends of the two soldering guns 37 of each group are located on the same side of the outer lead 614. During welding, the motor 2 34 drives the spur gear 1 32 to rotate, and the spur gear 1 32 drives the spur gear 2 33 to rotate. The rotation directions of the spur gear 1 32 and the spur gear 2 33 are opposite. The eccentric wheel 35 on the spur gear 1 32 is not collinear with the rotation axis of the spur gear 1 32, and the eccentric wheel 35 on the spur gear 2 33 is not collinear with the rotation axis of the spur gear 2 33. The spur gear 2 33 drives the eccentric wheel 35 to rotate, and the eccentric wheel 35 drives the driving frame 36 to move. Through the guiding effect of the guide rod 2 391 and the guide rod 392, the motion trajectory of any point on the driving frame 36 (including the parts installed on the driving frame 36) can be made into a circle. By controlling the rotation angles of the spur gear 1 32 and the spur gear 2 33, the motion trajectories of the two soldering guns 37 can be made as follows: Figure 6 As shown by the dotted line, the movement trajectory is a semicircle. In this way, when the welding ends of the two solder guns 37 move from one side of the outer lead 614 to the other side, the outer lead 614 can be fully welded in the circumference, that is, the solder can wrap around the outer lead 614.

[0044] It should be noted that when two groups of solder guns 37 are performing welding, the first group is used to weld the frame 62 on the left side of a silicon carbide diode 6, and the second group is used to weld the frame 62 on the right side of another silicon carbide diode 6. In this way, after the first group is welded, the second group is used to weld to complete the final welding.

[0045] It should also be noted that the purpose of providing two sets of soldering guns 37 is to be able to weld the frames 62 on two silicon carbide diodes 6 at the same time, the purpose of which is to improve efficiency. In addition, the purpose of having the two sets of soldering guns 37 weld the two frames 62 on a silicon carbide diode 6 at different times is that the space between the two frames 62 is smaller, thereby preventing the problem of collision of the soldering guns 37.

[0046] The above technical solution uses relatively arranged solder guns 37 to weld the frame 62 through the setting of the welding component 3. The movement paths of the two solder guns 37 are both semicircular arcs, so that welding can be performed from one side of the external lead 614 to the other side, so as to perform comprehensive welding on the circumference of the external lead 614, so that the solder can wrap around the external lead 614.

[0047] In this embodiment, if Figure 1-Figure 3 As shown, since the diameter of the outer lead 614 is small, the diameter of the movement path of the welding end of the soldering gun 37 is also small. After the welding is completed, the conveyor belt 2 needs to continue to transport forward, and the welding end is likely to touch the silicon carbide diode 6. Therefore, the following technical solution is further proposed.

[0048] Specifically, a movable component 38 is provided at the upper end of the driving frame 36, and the movable component 38 includes a moving frame 381. Both ends of the moving frame 381 are fixedly connected with a guide rod 383. The two guide rods 383 are laterally movably inserted into the driving frame 36. A cylinder 382 is installed on the driving frame 36, and the output end of the cylinder 382 is fixedly installed with the moving frame 381.

[0049] It should be noted that after one welding is completed, the cylinder 382 drives the movable frame 381 and the guide rod 383 to move, so that the two sets of solder guns 37 move away from the conveyor belt 2, so that the welding end of the solder gun 37 is farther away from the silicon carbide diode 6, so that when the conveyor belt 2 transports the silicon carbide diode 6, the solder gun 37 will not touch the silicon carbide diode 6.

[0050] Refer to the instruction manual Figure 1-Figure 3 and Figure 4 A material trough 43 is provided at the upper end of the conveyor belt 2 in front of the welding assembly 3. The material trough 43 is fixedly installed on the conveyor belt 2. One side of the material trough 43 has a feed port 431, and the lower end of the other side of the material trough 43 has a discharge port 432.

[0051] Furthermore, a loading assembly 4 is provided at the bottom of the spur gear 2 33, and the loading assembly 4 includes a rotating column 41, which is fixedly connected to the middle part of the spur gear 2 33, and an inclined groove 411 is provided on the outer wall of the rotating column 41. A feeding rod 42 is vertically inserted into the mounting plate 31, and the bottom end of the feeding rod 42 is horizontally inserted into the inside of the inclined groove 411 and can slide inside the inside of the inclined groove 411, and the upper end of the feeding rod 42 is vertically inserted at the position of the discharge port 432.

[0052] It should be noted that when the spur gear 33 rotates, it can drive the rotating column 41 to rotate. When the rotating column 41 rotates, the material rod 42 can slide inside the inclined groove 411. In other words, the forward and reverse rotation of the rotating column 41 can drive the material rod 42 to reciprocate up and down. When the material rod 42 moves upward, the upper end of the material rod 42 moves upward from the inside of the discharge port 432. When the material rod 42 moves downward, the upper end of the material rod 42 enters the inside of the discharge port 432, pressing the diode body 61 in the discharge port 432 downward and out of the discharge port 432.

[0053] Furthermore, a spring piece 433 is fixedly connected to the side wall of the discharge port 432 . When the diode body 61 is located inside the discharge port 432 , the spring piece 433 presses the diode body 61 inside the discharge port 432 .

[0054] It should be noted that when the diode body 61 enters the discharge port 432 , the diode body 61 is blocked by the spring piece 433 , preventing the spring piece 433 from falling downward without the pressure of the material rod 42 .

[0055] Working principle: Figure 2 and Figure 5 As shown, initially, the conveyor belt 2 conveys the silicon carbide diode 6 to the position of two groups of solder guns 37. The upper end of the material rod 42 is inserted into the discharge port 432. The welding ends of the two solder guns 37 in each group are located on the same side of the external lead 614. The working process is as follows:

[0056] (1) During welding, the motor 2 34 drives the spur gear 1 32 to rotate forward, and the spur gear 1 32 drives the spur gear 2 33 to rotate. The rotation directions of the spur gear 1 32 and the spur gear 2 33 are opposite. The spur gear 2 33 drives the eccentric wheel 35 to rotate, and the eccentric wheel 35 drives the driving frame 36 and the soldering gun 37 to move, as shown in FIG. Figure 6 As shown, the movement trajectory of the soldering end of the solder gun 37 is a circular arc. The upper solder gun 37 rotates counterclockwise, while the lower solder gun 37 rotates clockwise, thereby achieving full soldering, so that the solder wraps around the outer lead 614. During this process, the spur gear 2 33 drives the rotating column 41 to rotate, and the rotating column 41 drives the material rod 42 to move upward, so that the upper end of the material rod 42 moves out of the discharge port 432.

[0057] (2) The cylinder 382 drives the movable frame 381 and the guide rod 383 to move, so that the two sets of soldering guns 37 move away from the conveyor belt 2, so that the welding ends of the soldering guns 37 are farther away from the silicon carbide diode 6.

[0058] (3) The conveyor belt 2 conveys the silicon carbide diode 6 forward to the welding position of the two soldering guns 37.

[0059] (4) The cylinder 382 drives the soldering gun 37 to move toward the conveyor belt 2.

[0060] (5) Motor 2 34 drives spur gear 1 32 to rotate in reverse, returning the two soldering guns 37 to their initial positions. During this process, spur gear 2 33 drives the rotating column 41 to rotate, which in turn drives the feed rod 42 to move downward. The feed rod 42 pushes the diode body 61 located inside the discharge port 432 downward, allowing the two outer leads 614 of the diode body 61 to be inserted into the holes of the frame 62 inside the two grooves 231 on the belt 23.

[0061] The subsequent welding process repeats the steps (1) to (5).

[0062] It should be noted that the frame 62 in the groove 231 can be placed therein by a robot or manually.

[0063] It should also be noted that a plurality of diode bodies 61 are arranged inside the material trough 43, and an electric push rod is provided at the position of the feed port 431. When the number of diode bodies 61 in the material trough 43 decreases, the electric push rod pushes the diode body 61 forward so that the diode body 61 enters the interior of the discharge port 432.

[0064] Furthermore, if Figure 4 As shown, a guide frame 5 is provided above the conveyor belt 2 and is fixedly mounted on the conveyor belt 2 . A guide groove 51 is provided on the lower surface of the conveyor belt 2 . When the conveyor belt 2 transports the silicon carbide diode 6 , the upper end of the diode body 61 slides inside the guide groove 51 .

[0065] It should be noted that when the conveyor belt 2 transports the silicon carbide diode 6, the upper end of the diode body 61 is located inside the guide groove 51, which can improve the stability of the silicon carbide diode 6 during transportation and prevent it from tipping over during transportation.

[0066] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A silicon carbide diode device, wherein the silicon carbide diode (6) comprises a diode body (61), two frames (62) and two external leads (614), wherein the frame (62) is fixed to the diode body (61) via the external leads (614), and is characterized in that: The silicon carbide diode (6) is made by the following method: Step 1: Use a conveyor belt (2) to transport the silicon carbide diode (6) to a welding station; Step 2: Two soldering guns (37) arranged opposite to each other on both sides of the welding station are used as a group to simultaneously weld the outer lead (614) and the frame (62) of the silicon carbide diode (6), and the two groups of soldering guns (37) are used to weld two adjacent silicon carbide diodes (6); Step 3: The conveyor belt (2) conveys the silicon carbide diode (6) forward, so that the first group of soldering guns (37) solders the next silicon carbide diode (6), and the second group of soldering guns (37) solders the remaining set of external leads (614) and the frame (62) soldered by the first group of soldering guns (37); The machine also includes a frame (1), a conveyor belt (2) is installed on the frame (1), and the conveyor belt (2) is used to convey the silicon carbide diode (6); a welding assembly (3) is installed at the lower side of the conveyor belt (2), and the welding assembly (3) includes a mounting plate (31), and the mounting plate (31) is fixedly installed on the frame (1), and the two sides of the upper surface of the welding assembly (3) are respectively rotatably connected to a spur gear 1 (32) and a spur gear 2 (33), and the spur gear 1 (32) and the spur gear 2 (33) are meshed with each other for transmission, and the bottom of the mounting plate (31) is fixedly installed with an electric Machine 2 (34), the output shaft of the motor 2 (34) is fixedly mounted on the spur gear 1 (32), the upper surfaces of the spur gear 1 (32) and the spur gear 2 (33) are fixedly mounted with eccentric wheels (35), the two eccentric wheels (35) are rotatably connected to a drive frame (36), the upper ends of the two drive frames (36) are each mounted with two soldering guns (37), the two soldering guns (37) on the two drive frames (36) are arranged opposite to each other, and the two soldering guns (37) arranged opposite to each other are used to simultaneously weld a frame (62) and an external lead (614) together; Solder guns (37) arranged opposite to each other are used to weld the frame (62). The movement paths of the two solder guns (37) are both semicircular arcs, so that welding can be performed from one side of the external lead (614) to the other side, so as to fully weld the circumference of the external lead (614) so ​​that the solder can wrap around the external lead (614).

2. The silicon carbide diode device according to claim 1, wherein: The welding assembly (3) further includes a guide component (39), the guide component (39) including two guide rods (391) fixedly mounted on both sides of the mounting plate (31), two guide rods (392) are arranged between the two guide rods (391), the two ends of the two guide rods (392) are respectively slidably mounted on the two guide rods (391), and the two driving frames (36) are both movably mounted on the two guide rods (392).

3. The silicon carbide diode device according to claim 2, characterized in that: A movable component (38) is provided at the upper end of the driving frame (36), and the movable component (38) includes a moving frame (381). Both ends of the moving frame (381) are fixedly connected to a guide rod (383). The two guide rods (383) are laterally movably plugged into the driving frame (36). A cylinder (382) is installed on the driving frame (36), and the output end of the cylinder (382) is fixedly installed with the moving frame (381).

4. The silicon carbide diode device according to claim 1, characterized in that: The conveyor belt (2) includes a bracket (21), the bracket (21) is fixedly mounted on the frame (1), both ends of the bracket (21) are rotatably connected to a rotating wheel (22), a belt (23) is transmission-connected between the two rotating wheels (22), a motor (24) is fixedly mounted on the bracket (21), and an output end of the motor (24) is transmission-connected to one of the rotating wheels (22).

5. The silicon carbide diode device according to claim 4, characterized in that: The surface of the belt (23) is provided with a plurality of grooves (231), the plurality of grooves (231) are arranged in groups of two, and the two grooves (231) in the same group are symmetrically arranged, and the grooves (231) are used to accommodate the frame (62).

6. The silicon carbide diode device according to claim 1, characterized in that: A material trough (43) is provided at the upper end of the conveyor belt (2) at a position in front of the welding assembly (3). The material trough (43) is fixedly mounted on the conveyor belt (2). One side of the material trough (43) has a material feed port (431), and the lower end of the other side of the material trough (43) has a material discharge port (432).

7. The silicon carbide diode device according to claim 6, characterized in that: A feeding assembly (4) is provided at the bottom of the spur gear 2 (33), and the feeding assembly (4) includes a rotating column (41), the rotating column (41) is fixedly connected to the middle part of the spur gear 2 (33), an outer wall of the rotating column (41) is provided with an inclined groove (411), a feeding rod (42) is vertically inserted into the mounting plate (31), the bottom end of the feeding rod (42) is horizontally inserted into the inside of the inclined groove (411) and can slide inside the inclined groove (411), and the upper end of the feeding rod (42) is vertically inserted at the position of the discharge port (432).

8. The silicon carbide diode device according to claim 7, characterized in that: A spring piece (433) is fixedly connected to the side wall of the discharge port (432), and when the diode body (61) is located inside the discharge port (432), the spring piece (433) presses the diode body (61) inside the discharge port (432).

9. The silicon carbide diode device according to claim 1, characterized in that: A guide frame (5) is provided above the conveyor belt (2), and the guide frame (5) is fixedly mounted on the conveyor belt (2). A guide groove (51) is provided on the lower surface of the conveyor belt (2). When the conveyor belt (2) conveys the silicon carbide diode (6), the upper end of the diode body (61) slides inside the guide groove (51).

10. The silicon carbide diode device according to claim 1, characterized in that: The diode body (61) comprises a ceramic sheet (611), the upper surface of the ceramic sheet (611) is fixedly connected to a tube shell (612), and the upper surface of the ceramic sheet (611) is also fixed with an upper transition sheet (617) and a silicon carbide chip (616) in sequence, one side of the tube shell (612) is fixedly connected to two ceramic rings (613), one end of the two external leads (614) is fixedly connected to the two ceramic rings (613), one end of the external lead (614) located inside the tube shell (612) is connected to the silicon carbide chip (616) through an internal lead (615), and one end of the external lead (614) located outside the tube shell (612) is fixedly connected to the frame (62).

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