Auxiliary jig, method for manufacturing the same, and application thereof
By designing grooves on the auxiliary fixture to disperse thermal stress, the problem of glass substrates cracking due to mismatch in thermal expansion coefficients during semiconductor processing is solved, achieving efficient protection and the fabrication of substrates of various specifications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AALTOSEMI INC
- Filing Date
- 2025-04-15
- Publication Date
- 2026-05-29
AI Technical Summary
In semiconductor processes, the mismatch in the coefficients of thermal expansion of heterogeneous bonding glass substrates leads to uneven thermal stress, making them prone to breakage and affecting product yield and equipment safety.
Design an auxiliary fixture comprising a plate, a first metal layer and an insulating layer, forming grooves to disperse thermal stress and protect the substrate structure, suitable for various packaging substrate sizes.
It effectively prevents substrate cracking during thermal cycling, improves product yield, protects equipment safety, and is suitable for manufacturing various packaging substrate sizes and specifications.
Smart Images
Figure CN120341202B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a semiconductor packaging technology, and more particularly to an auxiliary fixture that can be used to manufacture a packaging substrate, its manufacturing method, and its application. Background Technology
[0002] With the booming development of the electronics industry, electronic products are becoming thinner and smaller in form, and are moving towards high performance, high functionality, and high speed in terms of function. Therefore, in order to meet the requirements of high integration and miniaturization of semiconductor devices, packaging substrates with high-density and fine-pitch lines are often used in packaging processes.
[0003] Glass, which is now commonly used, is an indispensable key material in the modern electronics industry. It carries the core components of many high-tech products and is widely used in display technology, semiconductor processes and photovoltaic industry due to its unique physical and chemical properties.
[0004] In semiconductor processes, the flatness, thermal stability, and chemical stability of existing glass substrates have been significantly improved, making glass substrates increasingly important.
[0005] However, in semiconductor processes, glass substrates are prone to uneven thermal stress due to mismatch in the coefficient of thermal expansion (CTE) between heterogeneous bonding materials, which can cause the glass substrate to crack during thermal cycling.
[0006] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Summary of the Invention
[0007] The purpose of this invention is to provide an auxiliary fixture, its manufacturing method, and its application to solve at least one of the above-mentioned problems.
[0008] In view of the various deficiencies of the prior art, the present invention provides an auxiliary fixture, comprising: a plate having at least one substrate region and a peripheral region surrounding the substrate region defined on its surface; a first metal layer formed on the peripheral region; and an insulating layer formed on the first metal layer, such that the plate surface of the first metal layer, the insulating layer and the substrate region forms a groove, wherein the sidewall of the groove includes the insulating layer and the first metal layer.
[0009] In one specific embodiment, the auxiliary fixture further includes a metal lamination layer disposed on the insulating layer, such that the sidewall of the groove also includes the metal lamination layer.
[0010] In one specific embodiment, a first metal layer and an insulating layer are formed on the peripheral regions on opposite sides of the plate, so that the opposite sides of the plate are provided with corresponding grooves.
[0011] The present invention also provides a method for manufacturing an auxiliary fixture, comprising: providing a plate having a first metal layer and a second metal layer thereon; forming a first boundary trench on the second metal layer, wherein the first boundary trench extends through the first metal layer and the second metal layer, such that the plate defines at least a substrate region and a peripheral region surrounding the substrate region; removing the second metal layer of the peripheral region to expose the first metal layer of the peripheral region; forming an insulating layer on the plate to cover the first metal layer and the second metal layer; forming a second boundary trench through the insulating layer along the first boundary trench; and removing a structure on the substrate region to form a groove formed by the first metal layer of the peripheral region, the insulating layer and the plate surface of the substrate region, wherein the sidewall of the groove includes the insulating layer and the first metal layer of the peripheral region.
[0012] In one specific embodiment of the manufacturing method, the surface of the insulating layer formed has a metal lamination layer, so that after the structure on the substrate region is removed, the groove is formed by the first metal layer, the insulating layer, the metal lamination layer and the plate surface of the substrate region in the peripheral region, and the sidewall of the groove also includes the metal lamination layer disposed on the insulating layer in the peripheral region.
[0013] In one specific embodiment of this manufacturing method, the groove is provided on both opposite sides of the plate.
[0014] The present invention further provides an application of an auxiliary fixture, comprising: providing a aforementioned auxiliary fixture; placing a substrate structure in a groove of the auxiliary fixture, wherein the substrate structure includes a substrate body having two opposing sides, a wiring layer formed on one side of the substrate body, and a bonding layer formed on the other side of the substrate body, and placing the substrate structure in the groove via the bonding layer to form a circuit structure on the auxiliary fixture to cover the substrate structure, and electrically connecting the circuit structure to the wiring layer of the substrate structure; cutting along the sidewall of the groove of the auxiliary fixture to remove the peripheral area of the plate body of the auxiliary fixture and its structure thereon, so that a packaging substrate is formed on the substrate area of the plate body; and removing the bonding layer and the plate body to obtain the packaging substrate.
[0015] In one specific embodiment of this application, the substrate body is a semiconductor substrate or a glass material.
[0016] In one specific embodiment of this application, a plurality of conductive vias electrically connected to the wiring layer are formed in the substrate body.
[0017] In one specific embodiment of the application, a solder resist layer is formed on the substrate body and the circuit structure after the bonding layer and the board body are removed.
[0018] In one specific embodiment of this application, the circuit structure includes a dielectric layer formed on the substrate body and a circuit layer formed on the dielectric layer. In other specific embodiments, the number of circuit structure layers can be increased or decreased as needed before the dicing step. For example, a first circuit structure can be formed on the substrate body first, and then a second circuit structure can be formed on the first circuit structure.
[0019] As can be seen from the above, the auxiliary fixture of the present invention, its manufacturing method and application mainly utilize the design of forming grooves on the substrate area of the plate to make it suitable for the manufacture of various packaging substrate sizes (such as unit substrates, strip substrates with multiple unit substrates arranged, or full-area substrates in the form of an array), so that the auxiliary fixture meets the requirements of versatility.
[0020] Furthermore, the design of the groove protects the substrate structure (such as the substrate body of the glass material), and the sidewall of the groove includes an insulating layer and a first metal layer. In the process of manufacturing the packaging substrate, when the coefficient of thermal expansion (CTE) between heterogeneous bonding materials is mismatched and uneven thermal stress occurs, the stress can be dispersed, so that during thermal cycling, the substrate body (such as the glass material) can be prevented from cracking, which would lead to product defects. Attached Figure Description
[0021] Figure 1A , Figure 1B , Figure 1C , Figure 1D and Figure 1E This is a cross-sectional schematic diagram of the manufacturing method of the auxiliary fixture of the present invention.
[0022] Figure 1A-1 and Figure 1A-2 for Figure 1A Top view schematic diagrams of different embodiments.
[0023] Figures 2A to 2G This is a cross-sectional schematic diagram illustrating the application of the auxiliary fixture of the present invention.
[0024] The attached figures are labeled as follows:
[0025] 1 Auxiliary fixture
[0026] 10 plate body
[0027] 100 grooves
[0028] 11 First metal layer
[0029] 12 Second metal layer
[0030] 13 Insulation layer
[0031] 14 Metal lamination layer
[0032] 15 Sidewalls
[0033] 2 Packaging substrate
[0034] 2a Substrate Structure
[0035] 20 substrate body
[0036] 200 conductive via
[0037] 21 Wiring Layer
[0038] 22 Bonding Layer
[0039] 23 First Line Structure
[0040] 23a Metal layer
[0041] 230 First dielectric layer
[0042] 231 First Line Layer
[0043] 24 Second Line Structure
[0044] 240 Second dielectric layer
[0045] 241 Second Line Layer
[0046] 25 Solder resist layer
[0047] 250 opening
[0048] A substrate area
[0049] B. Outer Area
[0050] L1 First boundary trench
[0051] L2 Second Boundary Trench
[0052] S edge Detailed Implementation
[0053] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0054] It should be understood that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms such as "above," "first," "second," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.
[0055] Figures 1A to 1E This is a cross-sectional schematic diagram of the manufacturing method of the auxiliary fixture 1 of the present invention.
[0056] like Figure 1A As shown, a plate 10 is provided, on which a first metal layer 11 and a second metal layer 12 are sequentially formed on opposite sides. Next, a patterning process is performed to form a first boundary trench L1 on the second metal layer 12 using a laser, and the first boundary trench L1 extends through the first metal layer 11 and the second metal layer 12, so that the plate 10 defines at least a substrate region A and a peripheral region B surrounding the substrate region A.
[0057] In this embodiment, the plate 10 is a bis(cis-butenedioic acid imide) / triazine (BT) plate, the first metal layer 11 is a thin copper foil with a thickness of about 3 micrometers, and the second metal layer 12 is a thick copper layer like copper foil with a thickness of about 18 micrometers (um), which is formed on the first metal layer 11 by bonding.
[0058] Furthermore, the specifications of region A of the substrate are compatible with the specifications of the substrate material, such as strips, etc. Figure 1A-1 The full panel shown or as shown Figure 1A-2 The unit shown.
[0059] like Figure 1B As shown, the second metal layer 12 of the outer perimeter region B is removed by tearing, thereby exposing the first metal layer 11 of the outer perimeter region B.
[0060] like Figure 1C As shown, an insulating layer 13 is formed on opposite sides of the plate 10 to cover the first metal layer 11 and the second metal layer 12, and the insulating layer 13 is filled into the first boundary trench L1.
[0061] In this embodiment, the insulating layer 13 is an ABF film (Ajinomoto build-up film), polybenzoxazole (PBO), polyimide (PI), glass fiber prepreg (PP), or other dielectric materials.
[0062] Furthermore, the insulating layer 13 can be formed on opposite sides of the plate 10 by lamination. In addition, the insulating layer 13 may have a metal lamination layer 14, such as a copper layer, so as to press the insulating layer 13 onto opposite sides of the plate 10 by means of the metal lamination layer 14.
[0063] like Figure 1D As shown, a second boundary trench L2 is formed along the first boundary trench L1 using laser or mechanical drilling methods (such as positioning, depth confirmation, retrieval, etc.) that penetrate the metal laminate layer 14 and the insulating layer 13.
[0064] like Figure 1E As shown, the structure on the substrate region A, namely the metal lamination layer 14, the insulating layer 13, the first metal layer 11 and the second metal layer 12, is removed to form a groove 100 on the substrate region A on opposite sides of the plate body 10. The groove 100 is surrounded by the first metal layer 11, the insulating layer 13 of the peripheral region B and the surface of the plate body 10 of the substrate region A, and the sidewall 15 of the groove 100 includes the metal lamination layer 14, the insulating layer 13 and the first metal layer 11 of the peripheral region B.
[0065] Therefore, the auxiliary fixture 1 of the present invention is mainly designed to be suitable for the fabrication of various package substrate sizes (such as strip, panel, unit, etc.) by forming a groove 100 on the substrate region A, so that the auxiliary fixture 1 meets the requirements of versatility.
[0066] Furthermore, the auxiliary fixture 1 uses conventional BT material as the core plate 10. After removing part of the second metal layer 12, an insulating layer (such as PP material) is then pressed to form the second boundary groove L2, and the auxiliary fixture 1 is finally produced. Therefore, the auxiliary fixture 1 is made of existing materials, which are not only easy to obtain, but also easy to manufacture, thus meeting the requirements of easy manufacturing.
[0067] Figures 2A to 2G This is a cross-sectional schematic diagram illustrating the application of the auxiliary fixture 1 of the present invention. In this embodiment, the auxiliary fixture 1 is applied to the fabrication of the packaging substrate 2.
[0068] like Figure 2A As shown, a... Figure 1E The auxiliary fixture 1 shown is used to place the base plate structure 2a in the groove 100 of the auxiliary fixture 1.
[0069] In this embodiment, the substrate structure 2a includes a substrate body 20 having two opposing sides, a wiring layer 21 formed on one side of the substrate body 20, and a bonding layer 22 formed on the other side of the substrate body 20. The substrate structure 2a is placed on the plate 10 in the groove 100 via the bonding layer 22. For example, the substrate body 20 is a semiconductor substrate such as glass or silicon. Furthermore, a plurality of conductive vias 200 electrically connected to the wiring layer 21 are formed in the substrate body 20. For example, the wiring layer 21 and the conductive vias 200 are made of copper. Additionally, the bonding layer 22 is, for example, a metal layer, such as a thin copper layer, with a thickness of approximately 3 micrometers.
[0070] like Figure 2B As shown, a first dielectric layer 230 is formed on opposite sides of the auxiliary fixture 1 to cover and fix the substrate structure 2a.
[0071] In this embodiment, the first dielectric layer 230 is an ABF film (Ajinomoto build-up film), polybenzoxazole (PBO), polyimide (PI), glass fiber prepreg (PP), or other dielectric materials.
[0072] Furthermore, the first dielectric layer 230 can be formed on the opposite sides of the auxiliary fixture 1 and on the substrate body 20 of the substrate structure 2a by lamination. For example, the first dielectric layer 230 has a metal layer 23a, such as a copper layer, so that the first dielectric layer 230 can be laminated to the opposite sides of the auxiliary fixture 1 by means of the metal layer 23a.
[0073] like Figure 2C As shown, a patterning process is performed to form a first circuit layer 231 on the first dielectric layer 230 using the metal layer 23a. The first circuit layer 231 extends into the first dielectric layer 230 and is electrically connected to the wiring layer 21 via conductive blind vias. This results in the first circuit structure 23 including the first dielectric layer 230 formed on the substrate body 20 and the first circuit layer 231 formed on the first dielectric layer 230.
[0074] In this embodiment, a hole is formed in the first dielectric layer 230 by laser drilling, so that the conductive blind hole portion of the first circuit layer 231 extends into the hole.
[0075] like Figure 2DAs shown, a layer-addition process is performed to form a second circuit structure 24 on the first circuit structure 23. The second circuit structure 24 includes a second dielectric layer 240 formed on the first dielectric layer 230 and the first circuit layer 231, and a second circuit layer 241 formed on the second dielectric layer 240, so that the second circuit layer 241 extends into the second dielectric layer 240 and is electrically connected to the first circuit layer 231 by a conductive blind via.
[0076] In this embodiment, the second dielectric layer 240 is an ABF film (Ajinomoto build-up film), polybenzoxazole (PBO), polyimide (PI), glass fiber prepreg (PP), or other dielectric materials, and the second circuit layer 241 contains copper.
[0077] It should be understood that the number of layers in the circuit structure can be increased or decreased as needed, and is not limited to the two layers mentioned above.
[0078] like Figure 2E As shown, the edge S of the groove 100 of the auxiliary fixture 1 is cut to remove the peripheral area B of the plate body 10 of the auxiliary fixture 1 and its structure, so that the encapsulation substrate 2 is formed on the substrate area A of the plate body 10.
[0079] In this embodiment, the structure on the peripheral region B includes the sidewall 15 (first metal layer 11, insulating layer 13 and metal lamination layer 14) of the auxiliary fixture 1, part of the material of the first circuit structure 23 and part of the material of the second circuit structure 24.
[0080] like Figure 2F As shown, the bonding layer 22 is separated from the plate 10 to remove the plate 10 of the auxiliary fixture 1.
[0081] In this embodiment, the bonding layer 22 is still retained on the packaging substrate.
[0082] like Figure 2G As shown, the bonding layer 22 is removed by a rapid etching method to obtain the packaging substrate 2, and the substrate body 20 exposes the end face of the conductive through-hole 200.
[0083] In this embodiment, a solder resist layer 25 can be formed on the substrate body 20 and the second circuit structure 24, and the solder resist layer 25 has a plurality of openings 250 so that the end faces of the second circuit layer 241 and the conductive via 200 are exposed through the plurality of openings 250.
[0084] Therefore, the auxiliary fixture 1, through the design of the groove 100, effectively protects the substrate structure 2a (such as the substrate body 20 of glass material) to prevent the processing equipment from cracking the substrate body 20. The sidewall 15 of the groove 100 includes an insulating layer 13 (such as PP material) and a copper layer (first metal layer 11 and metal lamination layer 14). In the process of manufacturing the packaging substrate 2, when the coefficient of thermal expansion (CTE) between heterogeneous bonding materials is mismatched and uneven thermal stress occurs, the stress can be dispersed. During thermal cycling, the substrate body 20 (such as glass material) can be prevented from cracking, which would lead to product defects, or even personal injury (such as scratches from glass shards) or damage to production line equipment (such as glass shards getting stuck in the equipment).
[0085] Furthermore, the groove 100 has a protective function, so the auxiliary fixture 1 is suitable for embedding various heterogeneous materials (such as substrate structure 2a) to facilitate the production of various embedded circuit packaging substrates.
[0086] In addition, if the auxiliary fixture 1 has grooves 100 on both sides, the packaging substrate 2 can be processed on both sides of the auxiliary fixture 1 at the same time, thus increasing the production capacity.
[0087] In addition, the auxiliary fixture 1 is suitable for the fabrication of various package substrate sizes (such as strip, panel, unit, etc.), so the auxiliary fixture 1 is suitable for fan-out type circuit structures with heterogeneous material bonding (such as a glass substrate body 20 and a first dielectric layer 230).
[0088] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Those skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.
Claims
1. An auxiliary fixture, characterized in that, include: A plate having at least one substrate region and a peripheral region surrounding the substrate region defined on its surface; A first metal layer is formed on the peripheral region; as well as An insulating layer is formed on the first metal layer to form a groove on the surface of the plate, which is composed of the first metal layer, the insulating layer and the substrate area, wherein the sidewall of the groove includes the insulating layer and the first metal layer.
2. The auxiliary fixture as described in claim 1, characterized in that, The auxiliary fixture also includes a metal lamination layer disposed on the insulating layer, such that the sidewall of the groove also includes the metal lamination layer.
3. The auxiliary fixture as described in claim 1, characterized in that, A first metal layer and an insulating layer are formed on the outer regions of the opposite sides of the plate, so that the opposite sides of the plate are provided with corresponding grooves.
4. A method for manufacturing an auxiliary fixture, characterized in that, include: A plate is provided having a first metal layer and a second metal layer thereon; A first boundary trench is formed on the second metal layer, and the first boundary trench extends through the first metal layer and the second metal layer, so that the plate defines at least one substrate region and a peripheral region surrounding the substrate region. Remove the second metal layer in the outer perimeter area to expose the first metal layer in the outer perimeter area; An insulating layer is formed on the plate to cover the first metal layer and the second metal layer; A second boundary trench is formed along the first boundary trench, penetrating the insulating layer; as well as The structure on the substrate area is removed so that a groove is formed by the first metal layer, the insulating layer and the plate surface of the substrate area in the peripheral area, wherein the sidewall of the groove includes the insulating layer and the first metal layer in the peripheral area.
5. The method for manufacturing the auxiliary fixture as described in claim 4, characterized in that, The surface of the insulating layer formed has a metal lamination layer, so that after the structure on the substrate area is removed, the groove is formed by the first metal layer, the insulating layer, the metal lamination layer and the plate surface of the substrate area in the peripheral area, and the sidewall of the groove also includes the metal lamination layer provided on the insulating layer in the peripheral area.
6. The method for manufacturing the auxiliary fixture as described in claim 4, characterized in that, The groove is provided on both opposite sides of the plate.
7. The application of an auxiliary fixture, characterized in that, include: Provide an auxiliary fixture as described in claim 1; The substrate structure is placed in the groove of the auxiliary fixture, wherein the substrate structure includes a substrate body having opposite sides, a wiring layer formed on one side of the substrate body and a bonding layer formed on the other side of the substrate body, and the substrate structure is placed in the groove by means of the bonding layer. A circuit structure is formed on the auxiliary fixture to cover the substrate structure, and the circuit structure is electrically connected to the wiring layer of the substrate structure. Cut along the sidewall of the groove in the auxiliary fixture to remove the peripheral area of the plate body and its structure, thereby forming a packaging substrate on the substrate area of the plate body; and Remove the bonding layer from the plate to obtain the encapsulation substrate.
8. The application of the auxiliary fixture as described in claim 7, characterized in that, The substrate itself is a semiconductor plate or glass material.
9. The application of the auxiliary fixture as described in claim 7, characterized in that, The substrate body has multiple conductive vias that are electrically connected to the wiring layer.
10. The application of the auxiliary fixture as described in claim 7, characterized in that, The application of this auxiliary fixture also includes forming a solder resist layer on the substrate body and the circuit structure after removing the bonding layer and the board body.
11. The application of the auxiliary fixture as described in claim 7, characterized in that, The circuit structure includes a dielectric layer formed on the substrate body and a circuit layer formed on the dielectric layer.