Thermal control power supply cabinet with cooling and dehumidifying structure

Abstract

The invention relates to the technical field of thermal control power supply cabinets, in particular to a thermal control power supply cabinet with a cooling and dehumidifying structure. Comprising a cabinet body and a cabinet door, an air inlet is formed in the top of the cabinet body, an air outlet is formed in the bottom of the cabinet body, and a cooling device and a dehumidification device are further arranged in the cabinet body; the cooling device comprises a liquid cooling circulation system, a liquid cooling device and a heat conduction device, the liquid cooling circulation system is arranged outside the cabinet body, the heat conduction device and the surface of the liquid cooling device are attached and fixedly connected, and the liquid cooling device and the liquid cooling circulation system are communicated to form a circulation loop; the dehumidification device comprises dehumidification fans, the dehumidification fans are arranged at the air inlet and the air outlet of the cabinet body, heat in the power supply cabinet can be continuously dissipated to the outside, efficient heat dissipation is achieved, and it is ensured that the power supply cabinet always works and operates at the appropriate temperature and humidity.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal control power cabinets, and particularly relates to a thermal control power cabinet with a cooling and dehumidifying structure. Background Art

[0002] A thermal control power cabinet is a dedicated device applied in an industrial automation control system to provide stable power for thermal automation control devices such as instruments, sensors, actuators, etc. It plays an important role in the production process control of industries such as power, chemical, metallurgy, and energy. Its main function is to provide reliable AC or DC power for various devices in the thermal control system to ensure the normal operation of the settings. At the same time, it has functions such as voltage transformation, rectification, and filtering, converting the input power into a voltage level that meets the requirements of the devices, and ensuring the stability of the output voltage through voltage stabilization technology to avoid failures caused by the fluctuation of the power grid affecting the operation accuracy of the devices.

[0003] In a complex industrial environment, the thermal control power cabinet still needs to maintain stable working performance to better cope. However, most existing thermal control power cabinets rely on natural heat dissipation or a simple exhaust port heat dissipation mode. When the power density of the power modules and electronic components inside the power cabinet is relatively high, the heat in the power cabinet is prone to accumulation. When the internal temperature exceeds the standard, faults such as capacitor bulging and chip performance degradation will occur. And the traditional heat dissipation method is difficult to dissipate the accumulated heat inside, and it is necessary to frequently stop the machine for maintenance or replace components. At the same time, there is no dedicated dehumidifying device design in the traditional thermal control power cabinet, so the thermal control power cabinet has a weak ability to cope with high-humidity environments, and there is a risk of electrical component short circuits due to high humidity inside the thermal control power cabinet. Summary of the Invention

[0004] The purpose of the present invention is to solve the problems in the background art and provide a thermal control power cabinet with a cooling and dehumidifying structure to solve the problems of low heat dissipation efficiency and poor dehumidifying effect of the existing power cabinet cooling and dehumidifying structure.

[0005] The above technical object of the present invention is achieved through the following technical solutions: A thermal control power cabinet with a cooling and dehumidifying structure includes a cabinet body and a cabinet door. An air inlet is provided at the top position of the cabinet body, and an air outlet is provided at the bottom position. A cooling device and a dehumidifying device are further provided inside the cabinet body. The cooling device includes a liquid cooling circulation system, a liquid cooling device, and a heat conduction device. The liquid cooling circulation system is arranged outside the cabinet body. The heat conduction device and the liquid cooling device are fixedly connected in surface contact. The liquid cooling device is communicated with the liquid cooling circulation system to form a circulation loop. The dehumidifying device includes a dehumidifying fan, and the dehumidifying fan is arranged at the air inlet and the air outlet of the cabinet body.

[0006] Preferably, a temperature sensor and a humidity sensor are arranged inside the cabinet, a controller is arranged on the cabinet door, the controller is electrically connected to the liquid cooling circulation system and the dehumidifying fan, and the temperature sensor and the humidity sensor are in signal connection with the controller; the temperature sensor is arranged inside the cabinet for detecting the internal temperature of the cabinet and transmitting the temperature signal to the controller, and the humidity sensor is also arranged inside the cabinet for detecting the humidity inside the cabinet and transmitting the humidity signal to the controller. The controller is electrically connected to the liquid cooling circulation system and the dehumidifying fan for controlling the operation of the liquid cooling circulation system and the dehumidifying fan according to the detection signals transmitted by the temperature sensor and the humidity sensor.

[0007] Preferably, a support frame is arranged inside the cabinet, an electrical installation board is arranged on the support frame, and the heat conduction device is installed on the back of the electrical installation board and fixed in a fitting manner. The heat conduction device can transfer the heat of the electrical components on the electrical installation board to the liquid cooling device and then discharge it; the heat conduction device is arranged on the back of the electrical installation board, and the heat generated by the operation of the electrical components on the electrical installation board will be transferred to the liquid cooling device at the back through the transfer function of the heat conduction device. The liquid cooling device then transfers the heat inside the cabinet through the operation of the liquid cooling circulation system, realizing the cooling effect on the power cabinet.

[0008] Preferably, the side of the heat conduction device in contact with the electrical installation board is an endothermic layer, and the side in contact with the liquid cooling device is a heat transfer layer. A number of connecting columns are arranged between the endothermic layer and the heat transfer layer for supporting connection and providing sufficient heat conduction space; the endothermic layer of the heat conduction device is in contact with the electrical installation board, and the endothermic layer can absorb the heat generated by the electrical components in the power cabinet. The heat transfer layer of the heat conduction device is in contact with the liquid cooling device, and the heat absorbed by the endothermic layer is transferred to the heat transfer layer through the heat conduction space formed by the connecting columns. The heat on the heat transfer layer will then be taken out of the cabinet interior by the liquid cooling circulating water inside the liquid cooling device.

[0009] Preferably, the end face of the endothermic layer is provided with a copper endothermic top cover, and an inner side of the endothermic top cover is fixedly connected with a top cover liquid absorbing core; the end face of the heat transfer layer is also provided with a copper heat transfer bottom cover, and an inner side of the heat transfer bottom cover is fixedly connected with a bottom cover liquid absorbing core. The top cover liquid absorbing core and the bottom cover liquid absorbing core are separated by the connecting columns; both the endothermic top cover and the heat transfer bottom cover of the heat conduction device are made of copper plates with good heat conduction performance. Utilizing the good heat conduction performance of copper, the heat generated by the electrical components in the power cabinet during operation can be evenly and quickly transferred out, avoiding damage to the electrical components inside the cabinet due to excessive heat accumulation in the cabinet, improving the use stability of the power cabinet, and also improving the service life of the electrical components.

[0010] Preferably, the top cover wick and the bottom cover wick are designed with rough contact surfaces. The inside of the wick contains a rich capillary pore structure. The capillary pores in the top cover wick and the bottom cover wick are also provided with a cooling liquid for heat transfer. The top cover wick and the bottom cover wick are formed by sintering copper powder through a specific process. Abundant capillary pores are formed between the copper powders, which can provide good capillary force for the cooling liquid inside the wick, enabling the coolant to flow and circulate smoothly therein, and making heat transfer more efficient. The top cover wick and the bottom cover wick of the heat conduction device contain a cooling liquid for heat transfer. When the heat-absorbing top cover of the heat conduction device contacts the heat source, the heat will be transferred to the inner top cover wick through the heat-absorbing top cover. The cooling liquid in the top cover wick vaporizes when heated to generate steam. The steam diffuses to the bottom cover wick with a lower temperature on the heat conduction device under the action of air pressure. The steam condenses into a liquid when it reaches the bottom cover wick, and the condensed liquid will flow back through the capillary effect to form a cycle, while the heat will be transferred to the liquid cooling device through the outer heat transfer layer and then dissipated. The structural design of the heat conduction device can make the heat dissipation in the power cabinet more uniform, avoiding the situation of electrical component damage caused by excessive temperature difference due to slow heat dissipation caused by local overheating, greatly improving the cooling speed and heat dissipation uniformity of the power cabinet, and prolonging the service life of the electrical components inside the cabinet.

[0011] Preferably, a heat dissipation coil is provided inside the liquid cooling device. The liquid cooling circulation system includes a water circulation system and a refrigeration circulation system. The water inlet and outlet of the heat dissipation coil are both connected to the water circulation system of the liquid cooling circulation system. The heat dissipation coil inside the liquid cooling device has a large number of pipe bends, greatly increasing the contact area between the heat dissipation coil and the heat conduction device, making the heat dissipation efficiency of the liquid cooling water in the liquid cooling device higher during the circulation process and the heat dissipation effect better.

[0012] Preferably, the liquid cooling circulation system connects and enables the water circulation system and the refrigeration circulation system to work together through an evaporator. A liquid cooling water inlet pipe and a liquid cooling water outlet pipe are provided in the water circulation system. The liquid cooling water inlet pipe and the liquid cooling water outlet pipe are connected through the evaporator. The liquid cooling water inlet pipe is connected to the water outlet of the heat dissipation coil, and the liquid cooling water outlet pipe is connected to the water inlet of the heat dissipation coil. A delivery pump is also provided on the liquid cooling water outlet pipe; the liquid cooling circulation system is jointly operated by the water circulation system and the refrigeration circulation system. The water circulation system can circulate and take away the heat in the power cabinet, and the refrigeration circulation system cools the circulating water in the water circulation system; the delivery pump pushes the circulating water in the liquid cooling water outlet pipe into the liquid cooling device. After the circulating water contacts the heat source, it will absorb heat and increase the water temperature. The heated circulating water will enter the water circulation system through the liquid cooling water inlet pipe and then reach the evaporator. In the evaporator, the circulating water will transfer the heat to the refrigerant in the refrigeration circulation system. After the temperature of the circulating water itself decreases, it will flow back to the delivery pump to continue the cycle.

[0013] Preferably, the refrigeration circulation system includes a refrigeration inlet pipe and a refrigeration outlet pipe. One ends of the refrigeration inlet pipe and the refrigeration outlet pipe are connected through the evaporator, and the other ends are connected through a condenser. A compressor is also provided on the pipeline of the refrigeration inlet pipe; the refrigerant in the refrigeration circulation system will absorb the heat carried out by the circulating water after entering the evaporator and evaporate into steam and water. At this time, the circulating water is cooled, and the refrigerant gas will enter the compressor. The compressor compresses the low-temperature and low-pressure refrigerant gas into a high-temperature and high-pressure gas. After the high-temperature and high-pressure gas enters the condenser, the condenser will release heat and liquefy it into a refrigerant liquid. The liquid refrigerant will enter the evaporator again to complete the cycle; through the linkage of the water circulation system and the refrigeration circulation system, the heat in the power cabinet can be continuously transferred to the outside world, realizing efficient heat dissipation and ensuring that the power cabinet always operates at a suitable temperature.

[0014] Preferably, a dehumidification impeller is provided inside the dehumidification fan, and filters are provided at the positions of the air inlet and the air outlet where the dehumidification fan is installed; the dehumidification fan is arranged at the air inlet and the air outlet positions of the cabinet body. The dehumidification fan can send the dry air outside into the interior of the power cabinet body, and at the same time discharge the moisture inside the cabinet body, thereby reducing the humidity inside the cabinet body. Filters are provided at the positions of the air inlet and the air outlet, which can prevent dust or sundries in the outside air from entering the interior of the cabinet body and affecting the normal operation of the equipment inside the cabinet during the dehumidification process.

[0015] In summary, the beneficial effects of the present invention are: 1. A thermal control power cabinet with a cooling and dehumidifying structure according to the present invention. The temperature sensor and humidity sensor can monitor the temperature and humidity inside the cabinet in real time. The liquid cooling circulation system and dehumidifying fan are automatically started and stopped by the controller to achieve dynamic adjustment of cooling and dehumidifying inside the cabinet, avoiding energy waste. At the same time, the power cabinet can still work stably and continuously in relatively special environments such as high-temperature and high-humidity environments. 2. A thermal control power cabinet with a cooling and dehumidifying structure according to the present invention. The structural design of the heat conduction device and its good heat conduction performance can evenly and quickly transfer the heat generated inside the cabinet, avoiding damage to internal equipment due to excessive heat accumulation inside the cabinet, improving the use stability of the power cabinet, and also extending the service life of electrical components inside the cabinet. 3. A thermal control power cabinet with a cooling and dehumidifying structure according to the present invention. The liquid cooling circulation system works in coordination with the water circulation system and the refrigeration circulation system. The water circulation system takes away the heat inside the cabinet, and the refrigeration circulation system cools the circulating water in the water circulation system, so as to continuously dissipate the heat inside the power cabinet to the outside world, achieving efficient heat dissipation and ensuring that the power cabinet always operates at an appropriate temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall structure of the power cabinet of the present invention; Figure 2 is a schematic diagram of the internal structure of the cabinet of the present invention; Figure 3 is a schematic diagram of the structure of the dehumidifying device of the present invention; Figure 4 is a schematic diagram of the structure of the heat conduction device of the present invention; Figure 5 is a schematic diagram of the structure of the liquid cooling device of the present invention; Figure 6 is a schematic diagram of the structure of the liquid cooling circulation system of the present invention.

[0017] Reference numerals in the figures: 1 - cabinet, 11 - air inlet, 12 - air outlet, 13 - temperature sensor, 14 - humidity sensor, 2 - cabinet door, 21 - controller, 3 - heat conduction device, 31 - heat absorption layer, 311 - heat absorption top cover, 312 - top cover liquid absorption core, 32 - heat transfer layer, 321 - heat transfer bottom cover, 322 - bottom cover liquid absorption core, 33 - connecting column, 4 - liquid cooling device, 41 - heat dissipation coil, 5 - liquid cooling circulation system, 51 - water circulation system, 511 - liquid cooling inlet pipe, 512 - liquid cooling outlet pipe, 513 - delivery pump, 52 - refrigeration circulation system, 521 - refrigeration inlet pipe, 522 - refrigeration outlet pipe, 523 - condenser, 524 - compressor, 53 - evaporator, 6 - dehumidifying fan, 61 - dehumidifying impeller, 62 - filter screen, 7 - support frame, 71 - electrical installation board. Detailed implementation manners

[0018] The following specific embodiments are only explanations of the present invention, and they do not limit the present invention. After reading this specification, those skilled in the art can make modifications to these embodiments without creative contributions as needed, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

[0019] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0020] Embodiment

[0021] According to Figures 1 to 6 As shown, a thermal control power cabinet with a temperature reduction and dehumidification structure includes a cabinet body 1 and a cabinet door 2. An air inlet 11 is provided at the top position of the cabinet body 1, and an air outlet 12 is provided at the bottom position. A temperature reduction device and a dehumidification device are also provided inside the cabinet body 1. The temperature reduction device includes a liquid cooling circulation system 5, a liquid cooling device 4, and a heat conduction device 3. The liquid cooling circulation system 5 is arranged outside the cabinet body 1. The heat conduction device 3 and the liquid cooling device 4 are fixedly connected in surface contact. The liquid cooling device 4 is communicated with the liquid cooling circulation system 5 to form a circulation loop. The dehumidification device includes a dehumidification fan 6, and the dehumidification fan 6 is arranged at the air inlet 11 and the air outlet 12 of the cabinet body 1.

[0022] According to Figure 2 As shown, a temperature sensor 13 and a humidity sensor 14 are arranged inside the cabinet body 1, and a controller 21 is arranged on the cabinet door 2. The controller 21 is electrically connected to the liquid cooling circulation system 5 and the dehumidification fan 6, and the temperature sensor 13 and the humidity sensor 14 are signal-connected to the controller 21. The temperature sensor 13 is arranged inside the cabinet body 1 for detecting the temperature inside the cabinet body 1 and transmitting the temperature signal to the controller 21. The humidity sensor 14 is also arranged inside the cabinet body 1 for detecting the humidity inside the cabinet body 1 and transmitting the humidity signal to the controller 21. The controller 21 is electrically connected to the liquid cooling circulation system 5 and the dehumidification fan 6 for controlling the operation of the liquid cooling circulation system 5 and the dehumidification fan 6 according to the detection signals transmitted by the temperature sensor 13 and the humidity sensor 14.

[0023] According to Figure 2 As shown, a support frame 7 is arranged inside the cabinet body 1, an electrical installation board 71 is arranged on the support frame 7, and the heat conduction device 3 is installed on the back of the electrical installation board 71 and is fixedly connected in surface contact. The heat conduction device 3 can transfer the heat of the electrical components on the electrical installation board 71 to the liquid cooling device 4 and then discharge it. The heat conduction device 3 is arranged on the back of the electrical installation board 71. The heat generated by the electrical components working on the electrical installation board 71 will be transferred to the liquid cooling device 4 at the rear through the transfer action of the heat conduction device 3. The liquid cooling device 4 then transfers the heat inside the cabinet body 1 through the operation of the liquid cooling circulation system 5, realizing the temperature reduction effect on the power cabinet.

[0024] According to Figure 4 As shown, one side of the heat conduction device 3 that fits with the electrical installation board 71 is the heat absorption layer 31, and the side that fits with the liquid cooling device 4 is the heat transfer layer 32. A number of connecting columns 33 are arranged between the heat absorption layer 31 and the heat transfer layer 32 to support the connection and provide sufficient heat conduction space; the heat absorption layer 31 of the heat conduction device 3 is in contact with the electrical installation board 71, and the heat absorption layer 31 can absorb the heat generated by the electrical components in the power cabinet. The heat transfer layer 32 of the heat conduction device 3 is in contact with the liquid cooling device 4. The heat absorbed by the heat absorption layer 31 is transferred to the heat transfer layer 32 through the heat conduction space formed by the connecting columns 33. The heat on the heat transfer layer 32 will then be taken out of the cabinet body through the liquid cooling circulating water inside the liquid cooling device 4.

[0025] According to Figure 4 As shown, an end face of the heat absorption layer 31 is provided with a heat absorption top cover 311, and a top cover liquid absorption core 312 is fixedly connected to the inner side of the heat absorption top cover 311; an end face of the heat transfer layer 32 is also provided with a heat transfer bottom cover 321, and a bottom cover liquid absorption core 322 is fixedly connected to the inner side of the heat transfer bottom cover 321. The top cover liquid absorption core 312 and the bottom cover liquid absorption core 322 are separated by the connecting columns 33; both the heat absorption top cover 311 and the heat transfer bottom cover 321 of the heat conduction device 3 are made of copper plates with good heat conduction performance. By using the good heat conduction performance of copper, the heat generated by the electrical components in the power cabinet during operation can be evenly and quickly transferred, avoiding damage to the electrical components inside the cabinet body 1 due to excessive heat accumulation in the cabinet body 1, improving the use stability of the power cabinet, and at the same time improving the service life of the electrical components.

[0026] According to Figure 4As shown, the top cover wick 312 and the bottom cover wick 322 are designed with rough contact surfaces. The inside of the wick contains a rich capillary pore structure. The capillary pores in the top cover wick 312 and the bottom cover wick 322 are also provided with a cooling liquid for heat transfer. The top cover wick 312 and the bottom cover wick 322 are formed by sintering copper powder through a specific process. Abundant capillary pores are formed between the copper powders, which can provide good capillary force for the cooling liquid inside the wick, enabling the cooling liquid to flow and circulate smoothly therein, and making heat transfer more efficient. The top cover wick 312 and the bottom cover wick 322 of the heat conduction device 3 contain a cooling liquid for heat transfer. When the heat absorption top cover 311 of the heat conduction device 3 contacts the heat source, heat will be transferred to the inner top cover wick 312 through the heat absorption top cover 311. The cooling liquid in the top cover wick 312 vaporizes to generate steam when heated. The steam diffuses to the bottom cover wick 322 with a lower temperature on the heat conduction device 3 under the action of air pressure. The steam condenses into a liquid when it reaches the bottom cover wick 322. The condensed liquid will flow back through the capillary effect to form a cycle, and the heat will be transferred to the liquid cooling device 4 through the outer heat transfer bottom cover 321 and then dissipated. The structural design of the heat conduction device 3 can make the heat dissipation in the power cabinet more uniform, avoiding the occurrence of damage to electrical components caused by excessive temperature difference due to slow heat dissipation caused by local overheating, greatly improving the cooling speed and heat dissipation uniformity of the power cabinet, and improving the service life of the electrical components inside the cabinet 1.

[0027] According to Figure 5 As shown, a heat dissipation coil 41 is provided inside the liquid cooling device 4. The liquid cooling circulation system 5 includes a water circulation system 51 and a refrigeration circulation system 52. The water inlet and outlet of the heat dissipation coil 41 are both connected to the water circulation system 51 of the liquid cooling circulation system 5. The heat dissipation coil 41 inside the liquid cooling device 4 is provided with a relatively large number of pipe bends, greatly increasing the contact area between the heat dissipation coil 41 and the heat conduction device 3, making the heat dissipation efficiency of the liquid cooling water in the liquid cooling device 4 higher during the circulation process and the heat dissipation effect better.

[0028] According to Figure 5As shown, the liquid cooling circulation system 5 connects the water circulation system 51 and the refrigeration circulation system 52 through the evaporator 53 and enables them to work together. In the water circulation system 51, there are a liquid cooling inlet pipe 511 and a liquid cooling outlet pipe 512. The liquid cooling inlet pipe 511 and the liquid cooling outlet pipe 512 are connected through the evaporator 53. The liquid cooling inlet pipe 511 is connected to the water outlet of the heat dissipation coil 41, and the liquid cooling outlet pipe 512 is connected to the water inlet of the heat dissipation coil 41. A delivery pump 513 is also provided on the liquid cooling outlet pipe 512. The liquid cooling circulation system 5 works together with the water circulation system 51 and the refrigeration circulation system 52. The water circulation system 51 can circulate to take away the heat in the power cabinet, and the refrigeration circulation system 52 cools the circulating water in the water circulation system 51. The delivery pump 513 pushes the circulating water in the liquid cooling outlet pipe 512 into the liquid cooling device 4. After the circulating water contacts the heat source, it will absorb heat and increase the water temperature. The heated circulating water enters the water circulation system 51 through the liquid cooling inlet pipe 511 and then reaches the evaporator 53. In the evaporator 53, the circulating water transfers the heat to the refrigerant in the refrigeration circulation system 52. After the temperature of the circulating water itself decreases, it flows back to the delivery pump 513 to continue the cycle.

[0029] According to Figure 5 As shown, the refrigeration circulation system 52 includes a refrigeration inlet pipe 521 and a refrigeration outlet pipe 522. One end of the refrigeration inlet pipe 521 and the refrigeration outlet pipe 522 is connected through the evaporator 53, and the other end is connected through the condenser 523. A compressor 524 is also provided on the pipeline of the refrigeration inlet pipe 521. After the refrigerant in the refrigeration circulation system 52 enters the evaporator 53, it absorbs the heat brought out by the circulating water and evaporates into steam and water. At this time, the circulating water is cooled, and the refrigerant gas enters the compressor 524. The compressor 524 compresses the low-temperature and low-pressure refrigerant gas into a high-temperature and high-pressure gas. After the high-temperature and high-pressure gas enters the condenser 523, the condenser 523 releases heat and liquefies it into a refrigerant liquid. The liquid refrigerant will enter the evaporator 53 again to complete the cycle. Through the linkage of the water circulation system 51 and the refrigeration circulation system 52, the heat in the power cabinet can be continuously transferred to the outside, realizing efficient heat dissipation and ensuring that the power cabinet always operates at a suitable temperature.

[0030] According to Figure 1 、 Figure 3As shown in the figure, a dehumidifying impeller 61 is provided inside the dehumidifying fan 6, and filter screens 62 are provided at both the inlet 11 and the outlet 12 of the dehumidifying fan 6; the dehumidifying fan 6 is arranged at the inlet 11 and the outlet 12 of the cabinet body 1. The dehumidifying fan 6 can send the dry air from the outside into the cabinet body 1 of the power cabinet, and at the same time discharge the moisture inside the cabinet body 1, thereby reducing the humidity inside the cabinet body 1. Filter screens 62 are provided at the positions of the inlet 11 and the outlet 12, which can prevent dust or sundries in the outside air from entering the cabinet body 1 during the dehumidification process and affecting the normal operation of the equipment inside the cabinet body 1, making the operation of the power cabinet more stable and reliable.

Claims

1. A thermal control power cabinet with a cooling and dehumidifying structure, comprising a cabinet body (1) and a cabinet door (2), characterized in that, An air inlet (11) is provided at the top position of the cabinet body (1), and an air outlet (12) is provided at the bottom position. A cooling device and a dehumidifying device are also provided inside the cabinet body (1). The cooling device includes a liquid cooling circulation system (5), a liquid cooling device (4), and a heat conduction device (3). The liquid cooling circulation system (5) is arranged outside the cabinet body (1). The heat conduction device (3) and the liquid cooling device (4) are fixedly connected in surface contact. The liquid cooling device (4) is communicated with the liquid cooling circulation system (5) to form a circulation loop. The dehumidifying device includes a dehumidifying fan (6), and the dehumidifying fan (6) is arranged at the air inlet (11) and the air outlet (12) of the cabinet body (1).

2. The thermostatic power supply cabinet with a temperature reduction and dehumidification structure according to claim 1, characterized in that, A temperature sensor (13) and a humidity sensor (14) are provided inside the cabinet body (1). A controller (21) is provided on the cabinet door (2). The controller (21) is electrically connected to the liquid cooling circulation system (5) and the dehumidifying fan (6). The temperature sensor (13) and the humidity sensor (14) are in signal connection with the controller (21).

3. The thermal control power supply cabinet with a cooling and dehumidifying structure according to claim 1, characterized in that, A support frame (7) is provided inside the cabinet body (1). An electrical installation board (71) is provided on the support frame (7). The heat conduction device (3) is installed on the back of the electrical installation board (71) and is fixedly attached. The heat conduction device (3) can transfer the heat of the electrical components on the electrical installation board (71) to the liquid cooling device (4) and then discharge it.

4. A thermal control power cabinet with a cooling and dehumidifying structure according to claim 3, characterized in that, The surface of the heat conduction device (3) that is in contact with the electrical installation board (71) is an endothermic layer (31), and the surface that is in contact with the liquid cooling device (4) is a heat transfer layer (32). A number of connecting columns (33) are arranged between the endothermic layer (31) and the heat transfer layer (32) for supporting connection and providing sufficient heat conduction space.

5. The thermostatic power supply cabinet with a cooling and dehumidifying structure according to claim 4, wherein An endothermic top cover (311) is provided at the end face of the endothermic layer (31). A top cover liquid absorbing core (312) is fixedly connected inside the endothermic top cover (311). Similarly, a heat transfer bottom cover (321) is provided at the end face of the heat transfer layer (32). A bottom cover liquid absorbing core (322) is fixedly connected inside the heat transfer bottom cover (321). The top cover liquid absorbing core (312) and the bottom cover liquid absorbing core (322) are separated by the connecting columns (33).

6. The thermostatic power supply cabinet with a cooling and dehumidifying structure according to claim 1, characterized in that, The top cover liquid absorbing core (312) and the bottom cover liquid absorbing core (322) are designed with rough contact surfaces. The inside of the liquid absorbing core contains a rich capillary pore structure. Cooling liquid for heat transfer is also provided in the capillary pores of the top cover liquid absorbing core (312) and the bottom cover liquid absorbing core (322).

7. The thermal control power supply cabinet with a cooling and dehumidifying structure according to claim 1, characterized in that, A heat dissipation coil (41) is provided inside the liquid cooling device (4). The liquid cooling circulation system (5) includes a water circulation system (51) and a refrigeration circulation system (52). The water inlet and outlet of the heat dissipation coil (41) are both communicated with the water circulation system (51) of the liquid cooling circulation system (5).

8. A thermal control power cabinet with a cooling and dehumidifying structure according to claim 7, characterized in that, The liquid cooling circulation system (5) connects the water circulation system (51) and the refrigeration circulation system (52) through the evaporator (53) and enables them to work together. A liquid cooling inlet pipe (511) and a liquid cooling outlet pipe (512) are provided in the water circulation system (51). The liquid cooling inlet pipe (511) and the liquid cooling outlet pipe (512) are communicated through the evaporator (53). The liquid cooling inlet pipe (511) is communicated with the water outlet of the heat dissipation coil (41), and the liquid cooling outlet pipe (512) is communicated with the water inlet of the heat dissipation coil (41). A delivery pump (513) is further provided on the liquid cooling outlet pipe (512).

9. The thermostatic power supply cabinet with a cooling and dehumidifying structure according to claim 8, wherein The refrigeration circulation system (52) includes a refrigeration inlet pipe (521) and a refrigeration outlet pipe (522). One ends of the refrigeration inlet pipe (521) and the refrigeration outlet pipe (522) are communicated through the evaporator (53), and the other ends are communicated through the condenser (523). A compressor (524) is further provided on the pipeline of the refrigeration inlet pipe (521).

10. A thermal control power cabinet with a cooling and dehumidifying structure according to claim 1, characterized in that, A dehumidifying impeller (61) is provided in the dehumidifying fan (6), and filter screens (62) are provided at the positions of the air inlet (11) and the air outlet (12) where the dehumidifying fan (6) is installed.

Images