PCB circuit board etching machine with multi-angle high-pressure spraying system

Abstract

The application discloses a PCB circuit board etching machine with a multi-angle high-pressure spraying system and relates to the technical field of etching machines.The etching machine body is internally provided with a spraying mechanism, a glue removing mechanism, a cleaning mechanism and a drying mechanism;the etching machine body is internally further provided with a station switching mechanism, and the lower end of the station switching mechanism is provided with at least one set of a loading mechanism;the loading mechanism comprises a telescopic unit arranged at the lower end of the station switching mechanism and a loading disc in rotational connection with the output shaft of the telescopic unit, and a plurality of groups of substrates are arranged on the loading disc in an inclined manner;in operation, the substrates arranged on the loading disc sequentially pass through the spraying mechanism, the glue removing mechanism, the cleaning mechanism and the drying mechanism, thereby realizing etching of the substrates;and the application can simultaneously perform etching work on a plurality of groups of substrates synchronously.

Description

Technical Field

[0001] This invention relates to the technical field of etching machines, specifically to a PCB circuit board spray etching machine with a multi-angle high-pressure spray system. Background Technology

[0002] Circuit boards are also known as ceramic circuit boards, alumina ceramic circuit boards, alumina ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed circuit boards (copper etching technology), etc. Circuit boards make circuits miniaturized and more intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. During the production and manufacturing of PCB circuit boards, circuit grooves are precisely cut on the outside of the PCB circuit board, which is commonly processed by photolithography or etching. Etching machines use a method of uniformly spraying corrosive liquid onto the outside of the circuit board for processing.

[0003] Patent document CN116828722B discloses a PCB circuit board spray etching machine, including a conveyor box. An auxiliary support plate is fixedly connected inside the conveyor box. Rollers are fixedly connected to the side of the auxiliary support plate inside the conveyor box. A first helical gear is fixedly connected to the front end of the rollers. A rotating rod is provided at the rear end of the conveyor box. A second helical gear is fixedly connected to the outside of the rotating rod. A limit rod is fixedly connected inside the conveyor box. A movable sleeve is movably sleeved on the outside of the limit rod. In this PCB circuit board spray etching machine, holes are opened inside the rollers. At the same time, a liquid conveying pipe drives liquid to be transported into the inside of the rollers and discharged through the liquid limiting sleeve. That is, during the rotation of the rollers, the condensate continuously cools the rollers, avoiding the problem of friction during the rotation of the rollers, which would cause the temperature to rise and affect the processing of PCB circuit boards.

[0004] However, in actual use, the inventors found that existing spray etching machines place the substrates one by one on the conveyor rollers and perform spray etching during the etching process, which results in low etching efficiency. In addition, after the etching work is completed, it is necessary to remove the photoresist on the substrate and clean the substrate. During this process, the substrate inside the etching machine needs to be transferred to the photoresist removal and cleaning equipment. The substrate is prone to damage during the transfer process, and the substrate processing efficiency is low. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a PCB circuit board spray etching machine with a multi-angle high-pressure spray system.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] This invention provides a PCB circuit board spray etching machine with a multi-angle high-pressure spray system, characterized in that it includes:

[0008] The etching machine body is equipped with a spraying mechanism, a desmearing mechanism, a cleaning mechanism and a drying mechanism inside the etching machine body;

[0009] The etching machine body is also equipped with a station switching mechanism, and at least one set of material loading mechanism is provided at the lower end of the station switching mechanism.

[0010] The material loading mechanism includes a telescopic unit located at the lower end of the workstation switching mechanism and a material loading tray rotatably connected to the output shaft of the telescopic unit. Several sets of inclined substrates are arranged on the material loading tray.

[0011] During operation, the substrate placed on the material tray passes through the spraying mechanism, the adhesive removal mechanism, the cleaning mechanism, and the drying mechanism in sequence to achieve the etching of the substrate.

[0012] As a preferred embodiment of the present invention, the material loading mechanism is provided in four sets.

[0013] As a preferred embodiment of the present invention, the material tray is frustum-shaped, and the side of the material tray is provided with a plurality of mounting grooves for placing the substrate.

[0014] The mounting groove has a positioning element fixedly installed inside at the positioning hole corresponding to the substrate. The positioning element includes a fixing rod and several sets of elastic sleeves sleeved on the outside of the fixing rod.

[0015] As a preferred embodiment of the present invention, the spraying mechanism includes:

[0016] The spray chamber is installed inside the etching machine body;

[0017] A spray assembly, comprising at least one set of spray pipes disposed inside a spray box and several sets of first spray nozzles mounted on the spray pipes;

[0018] A filter plate is fixedly installed inside the spray box, and a drain valve is also provided at the bottom of the spray box.

[0019] As a preferred embodiment of the present invention, an impeller is fixedly provided at the bottom of the material carrier, and a second spray nozzle is provided inside the spray box at a position corresponding to the impeller.

[0020] As a preferred embodiment of the present invention, the adhesive removal mechanism includes:

[0021] The adhesive removal box contains an adhesive removal solvent inside.

[0022] A perforated mesh plate is fixedly installed inside the adhesive removal box by several sets of brackets;

[0023] Bubble-diffusing units are provided in several groups and are fixedly installed at the lower end of the porous mesh plate;

[0024] The glue inlet pipe and glue outlet pipe are located on one side of the glue removal box.

[0025] As a preferred embodiment of the present invention, the cleaning mechanism includes a cleaning chamber disposed inside the etching machine body, a cleaning water pipe installed inside the cleaning chamber, and a number of cleaning nozzles disposed on the cleaning water pipe.

[0026] As a preferred embodiment of the present invention, the drying mechanism includes a drying chamber disposed inside the etching machine body and several sets of blower units fixed inside the drying chamber.

[0027] As a preferred embodiment of the present invention, the station switching mechanism includes a drive unit fixedly disposed inside the etching machine body and a support plate disposed at the lower end of the drive unit, and the material loading mechanism is disposed at the lower end of the support plate.

[0028] As a preferred embodiment of the present invention, the etching machine body is further provided with a control module, and the telescopic unit and the drive unit are electrically connected to the control module.

[0029] The beneficial effects of this invention are:

[0030] 1. In this invention, multiple material-carrying mechanisms are set inside the etching machine body. Multiple substrates can be set on the material-carrying mechanisms at the same time. When etching the substrates, multiple substrates can be etched simultaneously. At the same time, with the help of the spraying mechanism and the material-carrying mechanism, the material-carrying mechanism and multiple substrates can be rotated and etched at the same time during the spraying process, thereby ensuring the uniformity of etching and ensuring the effect of substrate etching.

[0031] 2. In this invention, by setting up a spraying mechanism, a desmearing mechanism, a cleaning mechanism, and a drying mechanism inside the etching machine body, after the etching work is completed, the station switching mechanism can transfer the material carrier to the desmearing mechanism for desmearing. Therefore, this etching machine can simultaneously perform spraying, desmearing, cleaning, and drying on substrates on four different material carriers without having to transfer the etched substrates to other equipment, thus greatly improving the substrate production efficiency while ensuring the substrate's effectiveness. Attached Figure Description

[0032] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0033] In the attached diagram:

[0034] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0035] Figure 2 This is a partial structural diagram of the present invention.

[0036] Figure 3 This is a schematic diagram of the material loading mechanism.

[0037] Figure 4 This is a partial structural diagram of the material loading mechanism.

[0038] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0039] Figure 6 This is a schematic diagram of the spraying mechanism.

[0040] Figure 7 This is a cross-sectional schematic diagram of the spraying mechanism.

[0041] Figure 8 This is a schematic diagram of the adhesive removal mechanism.

[0042] Figure 9 This is a schematic diagram of the structure of the porous mesh plate and the bubble unit.

[0043] Figure 10 This is a cross-sectional schematic diagram of the cleaning mechanism.

[0044] Figure 11 This is a cross-sectional view of the drying chamber.

[0045] In the diagram: 1. Etching machine body; 11. Collection plate; 111. Through hole; 2. Spraying mechanism; 21. Spraying box; 22. Spraying assembly; 221. Spray pipe; 222. First spray nozzle; 23. Filter plate; 24. Drain valve; 25. Second spray nozzle; 3. Adhesive removal mechanism; 31. Adhesive removal box; 32. Perforated mesh plate; 33. Bubbling unit; 34. Adhesive inlet pipe; 35. Adhesive outlet pipe; 4. Cleaning mechanism; 41 1. Cleaning chamber; 42. Cleaning water pipe; 43. Cleaning nozzle; 5. Drying mechanism; 51. Drying chamber; 52. Blower unit; 6. Station switching mechanism; 61. Drive unit; 62. Support plate; 7. Material loading mechanism; 71. Telescopic unit; 72. Material loading plate; 721. Mounting slot; 722. Positioning component; 7221. Fixing rod; 7222. Elastic sleeve; 73. Impeller; 8. Base plate; 9. Control module. Detailed Implementation

[0046] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0047] Example 1

[0048] like Figures 1-3 As shown, the present invention provides a PCB circuit board spray etching machine with a multi-angle high-pressure spray system, including an etching machine body 1. The etching machine body 1 is internally provided with a spray mechanism 2, a desmearing mechanism 3, a cleaning mechanism 4, and a drying mechanism 5. The etching machine body 1 is also internally provided with a station switching mechanism 6. At least one set of material loading mechanism 7 is provided at the lower end of the station switching mechanism 6. The material loading mechanism 7 includes a telescopic unit 71 provided at the lower end of the station switching mechanism 6 and a material loading tray 72 rotatably connected to the output shaft of the telescopic unit 71. Several sets of inclined substrates 8 are provided on the material loading tray 72. During operation, the substrates 8 provided on the material loading tray 72 pass through the spray mechanism 2, the desmearing mechanism 3, the cleaning mechanism 4, and the drying mechanism 5 in sequence to achieve etching of the substrates 8.

[0049] The station switching mechanism 6 includes a drive unit 61 fixedly installed inside the etching machine body 1 and a support plate 62 installed at the lower end of the drive unit 61, and the material loading mechanism 7 is installed at the lower end of the support plate 62.

[0050] The present invention completes multiple processes within the same equipment, eliminating the need to transfer the substrate 8 to other equipment, thus reducing the risks of handling and transfer and improving production efficiency.

[0051] The cooperation between the material carrier 7 and the spraying mechanism 2 enables multiple substrates 8 to be processed simultaneously, and the rotation design during the spraying process ensures the uniformity of etching and improves the etching effect of the substrates 8.

[0052] The station switching mechanism 6 enables the substrate 8 to seamlessly switch between different stations, ensuring the continuity and smoothness of different processing procedures, while reducing the complexity of operation and the footprint of the equipment. During operation, the drive unit 61 in the station switching mechanism 6 can drive the support plate 62 to rotate, thereby driving the multiple sets of material loading mechanisms 7 at the lower end of the support plate 62 to rotate synchronously.

[0053] The material carrier 7 is an important component of the system, responsible for supporting and transporting PCB circuit boards. It includes a telescopic unit 71 and a material carrier tray 72 connected to it. The telescopic unit 71 adjusts the height and position of the substrate 8 by electric or pneumatic means so as to accurately place the substrate 8 into the corresponding processing position. The material carrier tray 72 usually has multiple sets of tilted substrates 8, which can maximize the use of equipment space and ensure the stability and transport accuracy of the substrate 8.

[0054] Preferably, the material carrier mechanism 7 is provided in four sets. When working, the four sets of material carrier mechanisms 7 are respectively arranged in a one-to-one correspondence with the spraying mechanism 2, the adhesive removal mechanism 3, the cleaning mechanism 4, and the drying mechanism 5. That is, while one set of material carrier mechanisms 7 enters the spraying mechanism 2 to perform spraying, the other three sets of material carrier mechanisms 7 enter the adhesive removal mechanism 3, the cleaning mechanism 4, and the drying mechanism 5 respectively to perform adhesive removal, cleaning, and drying. This arrangement greatly improves the processing and forming efficiency of the substrate 8. It should be noted that after the drying mechanism 5 completes the drying of the substrate 8, the telescopic unit 71 will drive the material carrier mechanism 7 to rise, so that the operator can replace the etched substrate 8.

[0055] It should be noted that the spraying mechanism 2, the desmearing mechanism 3, the cleaning mechanism 4, and the drying mechanism 5 are arranged in a circular array inside the etching machine body 1 to ensure that when the material loading mechanism 7 switches positions, multiple sets of material loading mechanisms 7 can enter the spraying mechanism 2, the desmearing mechanism 3, the cleaning mechanism 4, or the drying mechanism 5 respectively.

[0056] Furthermore, such as Figures 3-5 As shown, the material tray 72 is frustum-shaped, and the side of the material tray 72 is provided with a plurality of mounting grooves 721 for placing the substrate 8.

[0057] The mounting groove 721 has a positioning member 722 fixedly installed inside at the positioning hole corresponding to the substrate 8. The positioning member 722 includes a fixing rod 7221 and several sets of elastic sleeves 7222 sleeved on the outside of the fixing rod 7221.

[0058] The frustum-shaped design typically offers good structural stability and facilitates operation and transportation by automated equipment during production. The shape of the tray 72 effectively prevents the substrate 8 from shifting or being damaged due to unevenness. Generally, the number and size of the mounting slots 721 are customized according to the size of the substrate 8 and the usage requirements. The design of these slots enables the substrate 8 to be placed neatly while preventing multiple substrates 8 from contacting or squeezing each other, thus ensuring the safety of the substrate 8.

[0059] The function of the positioning component 722 is to ensure the accurate positioning of the substrate 8 on the carrier tray 72 and to prevent the substrate 8 from shifting or sliding during transportation or operation.

[0060] The function of the elastic sleeve 7222 is to provide soft support for the substrate 8 and avoid damage to the substrate 8 that may be caused by hard contact. Especially for thin or fragile substrates 8, the elastic sleeve 7222 can play a role in shock absorption and impact resistance. In addition, the elastic sleeve 7222 can also prevent the substrate 8 from shifting during vibration or transportation to a certain extent. The design of the elastic sleeve 7222 usually needs to be customized according to the size and material of the substrate 8 to ensure that sufficient fastening force can be maintained when supporting the substrate 8, while avoiding excessive pressure, thereby ensuring the integrity of the substrate 8.

[0061] Furthermore, such as Figures 6-7 As shown, the spraying mechanism 2 includes a spray box 21, a spraying assembly 22, a filter plate 23, and a drain valve 24. The spray box 21 is installed inside the etching machine body 1. The spraying assembly 22 includes at least one set of spray pipes 221 disposed inside the spray box 21 and several sets of first spray nozzles 222 mounted on the spray pipes 221. The filter plate 23 is fixedly disposed inside the spray box 21. A drain valve 24 is also provided at the bottom of the spray box 21.

[0062] Among them, the spray mechanism 2 is one of the key components of the etching machine. It is responsible for uniformly spraying the chemical etching solution onto the surface of the PCB circuit board in a high-pressure jet manner. In order to improve the uniformity and efficiency of etching, the spray mechanism 2 adopts a multi-angle design, which can spray in multiple directions at the same time. This helps to overcome the shortcomings of uneven spraying in traditional spray systems.

[0063] The filter plate 23 is located inside the spray box 21 and is mainly used to filter the etching solution after etching is completed, so as to facilitate the subsequent recycling and treatment of the etching solution. The drain valve 24 at the bottom of the spray box 21 is used to discharge excess liquid or cleaning solution.

[0064] According to process requirements, the spray volume and pressure of the first spray nozzle 222 can be adjusted. The flow rate is usually controlled by adjusting the opening size of the first nozzle, while the pressure is controlled by the pump system to ensure that the spray liquid is evenly distributed and to avoid uneven spraying.

[0065] It should be noted that in this embodiment, two sets of spraying components 22 are provided, and the spraying angles of the first spray nozzles 222 in the two sets of spraying components 22 are different, so as to ensure that the sprayed etching liquid can completely cover the substrate 8.

[0066] Furthermore, such as Figure 7 As shown, an impeller 73 is fixedly installed at the bottom of the material tray 72, and a second spray nozzle 25 is provided inside the spray box 21 at a position corresponding to the impeller 73.

[0067] By rotating an impeller 73 at the bottom of the material tray 72, when the material tray 72 drives the substrate 8 to extend into the interior of the spray mechanism 2, the second spray nozzle 25 and the first spray nozzle 222 work simultaneously. While the first spray nozzle 222 sprays etching liquid onto the substrate 8, the second spray nozzle 25 sprays water onto the impeller 73, thereby driving the impeller 73 to rotate. Since the material tray 72 is rotatably connected to the output shaft of the telescopic unit 71, the rotation of the impeller 73 can drive the material tray 72 and multiple sets of substrates 8 to rotate synchronously, ensuring that the etching liquid is in full contact with multiple sets of substrates 8.

[0068] Furthermore, such as Figures 8-9 As shown, the adhesive removal mechanism 3 includes an adhesive removal box 31, a perforated mesh plate 32, a bubbling unit 33, an adhesive inlet pipe 34, and an adhesive outlet pipe 35. The adhesive removal box 31 contains adhesive removal solvent. The perforated mesh plate 32 is fixedly installed inside the adhesive removal box 31 by several sets of brackets. Several sets of bubbling units 33 are provided and fixedly installed at the lower end of the perforated mesh plate 32. The adhesive inlet pipe 34 and the adhesive outlet pipe 35 are located on one side of the adhesive removal box 31.

[0069] During the PCB manufacturing process, the surface of the substrate 8 is typically coated with a protective adhesive film to prevent contamination or damage during subsequent processing. The adhesive removal mechanism 3 removes this film using a special chemical solution or mechanical method. This mechanism is designed to work closely with the spray mechanism 2 to ensure that adhesive removal does not cause any other damage to the circuit board.

[0070] During operation, the material tray 72 enters the interior of the adhesive removal box 31 driven by the telescopic unit 71 and is immersed in the adhesive removal solvent for adhesive removal. At the same time, multiple bubbling units 33 work and generate bubbles, which help the adhesive removal solvent to cover the material surface more evenly. The micro-impact of the bubbles can further improve the wettability of the solvent to the adhesive layer, accelerating the dissolution and removal of the adhesive layer.

[0071] The glue inlet pipe 34 is used to introduce the material to be degummed into the glue removal chamber 31, and the glue outlet pipe 35 is used to discharge the material that has had its glue layer removed from the glue removal chamber 31.

[0072] It should be noted that the bubbling unit 33 typically uses an air pump or air compressor to provide the air source, and generates fine bubbles through a bubble generator (such as a quartz bubble generator or other microporous bubble generating device). These bubbles have a high surface area and can effectively decompose the adhesive layer when in contact with it. The bubble size and airflow rate can be adjusted according to the characteristics of the material to improve efficiency.

[0073] Furthermore, such as Figures 10-11As shown, the cleaning mechanism 4 includes a cleaning chamber 41 disposed inside the etching machine body 1, a cleaning water pipe 42 installed inside the cleaning chamber 41, and a number of cleaning nozzles 43 disposed on the cleaning water pipe 42.

[0074] The drying mechanism 5 includes a drying chamber 51 disposed inside the etching machine body 1 and several sets of blower units 52 fixed inside the drying chamber 51.

[0075] Among them, the cleaning mechanism 4 is used to remove the residues generated during the etching process, such as chemicals, dirt and waste. In order to avoid contaminating the PCB circuit board surface, the cleaning mechanism 4 effectively cleans the substrate 8 surface by spraying. The quality of the cleaning effect directly affects the quality of subsequent drying and post-processing. Therefore, the cleaning process is particularly important. During cleaning, the cleaning solution is usually deionized water.

[0076] After etching and cleaning, the PCB circuit board needs to be dried quickly to remove residual moisture and chemical solutions from the surface. The drying mechanism 5 uses hot air or infrared heating technology for rapid drying. In this embodiment, the blower unit 52 is used to dry the substrate 8 to ensure that there are no water stains on the surface of the substrate 8 and to avoid the negative impact of moisture residue on subsequent processes.

[0077] It should be noted that the upper surfaces of the spray box 21, the adhesive removal box 31, the cleaning box 41, and the drying box 51 are flush. Inside the etching machine body 1, a collection plate 11 is provided at a position corresponding to the upper surface of the spray box 21. The collection plate 11 has several sets of through holes 111.

[0078] The flush design of the top surfaces of these enclosures makes the equipment look neater and also facilitates subsequent maintenance and operation. Because the tops of different enclosures are in the same position, it is easy to centrally manage and control them. This design ensures that the operation process between multiple enclosures is not affected by differences in height, which helps to improve overall production efficiency and process stability.

[0079] In addition, the collection plate 11 is usually used in the etching machine to collect liquids or other substances during spraying, cleaning or other processes, to keep the internal environment of the etching machine clean and avoid damage to the equipment or safety hazards to the operators.

[0080] Furthermore, such as Figure 2 As shown, the etching machine body 1 is also equipped with a control module 9, and the telescopic unit 71 and the drive unit 61 are electrically connected to the control module 9.

[0081] The control module 9 is responsible for coordinating the work of various components (drive unit 61, support plate 62, material loading mechanism 7, etc.) to ensure that each station switches at the appropriate time.

[0082] Work process:

[0083] Substrate 8 Preparation and Loading

[0084] The substrate 8 is placed onto the loading tray 72 via the loading mechanism 7. The loading tray 72 has multiple mounting slots 721 for fixing and tilting the substrate 8. Each set of substrates 8 is precisely adjusted to the appropriate position via the telescopic unit 71 to ensure the stability and transmission accuracy of the substrate 8.

[0085] Substrate 8 enters spray mechanism 2

[0086] Under the action of the station switching mechanism 6, the material tray 72 rotates and sends the substrate 8 into the spraying mechanism 2. The spraying component 22 in the spraying mechanism 2 sprays high-pressure etching liquid at multiple angles to ensure that the etching liquid evenly covers the surface of the substrate 8. The first spray nozzle 222 and the second spray nozzle 25 work at the same time. The first nozzle sprays the etching liquid, while the second nozzle sprays water jets onto the impeller 73, driving the impeller 73 and the substrate 8 to rotate, thereby enhancing the etching effect.

[0087] Substrate 8 enters the adhesive removal mechanism 3

[0088] The material tray 72 enters the adhesive removal box 31 through the operation of the telescopic unit 71 and is immersed in the adhesive removal solvent. The porous mesh plate 32 and the bubbling unit 33 work together to generate bubbles, which helps the adhesive removal solvent to evenly cover the surface of the substrate 8 and accelerate the removal of the adhesive film.

[0089] Substrate 8 enters cleaning mechanism 4

[0090] After the adhesive is removed, the substrate 8 is sent to the cleaning unit 4. The cleaning water pipe 42 and nozzle in the cleaning chamber 41 spray deionized water to clean the surface of the substrate 8 and remove residual chemicals and waste.

[0091] Substrate 8 enters drying mechanism 5

[0092] The substrate 8 enters the drying mechanism 5, where hot air is generated by the blower unit 52 to quickly remove residual moisture and chemical solutions from the surface of the substrate 8. The dried substrate 8 is then ready for further processing or replacement.

[0093] Workstation switching and synchronization operation

[0094] Throughout the process, the station switching mechanism 6 drives the material carrier mechanism 7 as needed to sequentially send the substrate 8 to each station for spraying, desmearing, cleaning and drying, ensuring that different processing processes can be seamlessly connected. The cooperation between the material carrier mechanism 7 and the spraying mechanism 2 enables multiple substrates 8 to be processed simultaneously and ensures the uniformity of the etching process.

[0095] Substrate 8 Replacement and Continued Processing

[0096] Once drying is complete, the telescopic unit 71 lifts the material loading mechanism 7, allowing the operator to replace the processed substrate 8 and prepare a new substrate 8 to continue the same workflow.

[0097] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A PCB circuit board spray etching machine with multi-angle high-pressure spray system, characterized in that, Include: Etching machine body (1), the inside of the etching machine body (1) is provided with a spraying mechanism (2), a glue removing mechanism (3), a cleaning mechanism (4) and a drying mechanism (5); The inside of the etching machine body (1) is also provided with a station switching mechanism (6), and the lower end of the station switching mechanism (6) is provided with at least one set of loading mechanism (7); The loading mechanism (7) includes a telescopic unit (71) arranged at the lower end of the station switching mechanism (6) and a loading disc (72) rotatably connected with the output shaft of the telescopic unit (71), and a plurality of groups of substrates (8) are arranged on the loading disc (72) in an inclined manner. When working, the substrates (8) arranged on the loading disc (72) pass through the spraying mechanism (2), the glue removing mechanism (3), the cleaning mechanism (4) and the drying mechanism (5) in sequence to realize etching of the substrates (8). The loading disc (72) is in the shape of a circular truncated cone, and a plurality of mounting grooves (721) for placing the substrates (8) are formed in the side surface of the loading disc (72). The inside of the mounting groove (721) is fixedly provided with a positioning piece (722) at the position corresponding to the positioning hole of the substrate (8), and the positioning piece (722) includes a fixed rod (7221) and a plurality of elastic sheaths (7222) sleeved outside the fixed rod (7221). The spraying mechanism (2) includes: A spraying box body (21) is installed in the inside of the etching machine body (1); A spraying assembly (22) includes at least one set of spraying pipes (221) arranged in the inside of the spraying box body (21) and a plurality of groups of first spraying nozzles (222) mounted on the spraying pipes (221); A filter plate (23) is fixedly arranged in the inside of the spraying box body (21), and a drain valve (24) is further arranged at the bottom of the spraying box body (21); The glue removing mechanism (3) includes: A glue removing box body (31) is arranged in the inside of the glue removing box body (31); A plurality of groups of supports are arranged in the inside of the glue removing box body (31); A plurality of groups of bubble units (33) are arranged at the lower end of the porous mesh plate (32); A glue inlet pipe (34) and a glue outlet pipe (35) are arranged on one side of the glue removing box body (31).

2. The PCB circuit board spray etching machine with multi-angle high-pressure spray system according to claim 1, characterized in that, The loading mechanism (7) is provided with four groups.

3. The PCB circuit board spray etching machine with multi-angle high-pressure spray system according to claim 1, characterized in that, A plurality of groups of bubble units (33) are arranged at the lower end of the porous mesh plate (32); 4. The PCB circuit board spray etching machine with multi-angle high-pressure spray system according to claim 1, characterized in that, The cleaning mechanism (4) includes a cleaning box body (41) arranged in the inside of the etching machine body (1), a cleaning water pipe (42) mounted in the inside of the cleaning box body (41) and a plurality of groups of cleaning nozzles (43) arranged on the cleaning water pipe (42).

5. The PCB circuit board spray etching machine with multi-angle high-pressure spray system according to claim 1, characterized in that, The drying mechanism (5) includes a drying box body (51) arranged in the inside of the etching machine body (1) and a plurality of groups of air blowing units (52) fixed in the inside of the drying box body (51).

6. The PCB circuit board spray etching machine with multi-angle high-pressure spray system according to claim 1, characterized in that, The work station switching mechanism (6) comprises a driving unit (61) fixedly arranged inside the etching machine body (1) and a supporting disc (62) arranged at the lower end of the driving unit (61), and the material loading mechanism (7) is arranged at the lower end of the supporting disc (62).

7. The PCB circuit board spray etching machine with multi-angle high-pressure spray system according to claim 6, characterized in that, The etching machine body (1) is further provided with a control module (9), and the telescopic unit (71) and the driving unit (61) are electrically connected with the control module (9) respectively.

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