Vapor chamber, heat dissipation assembly and vehicle-mounted charger

Abstract

The invention discloses a vapor chamber, a heat dissipation assembly and a vehicle-mounted charger, and relates to the technical field of heat dissipation, the vapor chamber comprises a plate body, at least one end-to-end micro-channel structure is formed in the plate body, and the micro-channel structure is used for being filled with a phase change working medium. According to the technical scheme provided by the invention, the phase change of the phase change working medium in the vapor chamber can be realized without depending on gravity, a heat source can be mounted in each direction of the vapor chamber, and meanwhile, the heat dissipation efficiency of the vapor chamber can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly relates to a heat pipe, a heat dissipation component, and a vehicle-mounted charger. Background Art

[0002] In the technical field of heat dissipation, heat pipes are usually used to dissipate heat from related devices. The heat pipes in related technologies generally include a plurality of independent and juxtaposed microchannels filled with a phase change working fluid. The phase change of the phase change working fluid in the microchannels needs to rely on gravity to achieve the conversion between gas and liquid, and the heat source must be installed below the heat pipe. In addition, the microchannels in the existing heat pipes generally use embedded capillary tubes, that is, independent capillary tube structures are embedded in the plate body or the heat exchanger, and their thermal resistance is large, resulting in low heat dissipation efficiency. Summary of the Invention

[0003] The main object of the present invention is to propose a heat pipe, a heat dissipation component, and a vehicle-mounted charger, aiming to enable the phase change of the phase change working fluid in the heat pipe to be achieved without relying on gravity, so that the heat source can be installed in all directions of the heat pipe, and at the same time improve the heat dissipation efficiency of the heat pipe.

[0004] To achieve the above object, a heat pipe proposed by the present invention includes a plate body, and at least one microchannel structure connected end to end is formed in the plate body for filling a phase change working fluid.

[0005] In one embodiment, the plate body includes at least two sub-plate bodies, and at least two of the sub-plate bodies are stacked;

[0006] When the plate body includes two sub-plate bodies, the plate body includes a single-layer microchannel structure formed between the two sub-plate bodies, and the single-layer microchannel structure includes at least one microchannel structure connected end to end;

[0007] When the plate body includes more than two sub-plate bodies, a single-layer microchannel structure or at least two layers of microchannel structures are formed in the plate body, and each layer of microchannel structure includes at least one microchannel structure connected end to end.

[0008] In one embodiment, the plate body includes two sub-plate bodies stacked, and at least one of the opposite sides of the two sub-plate bodies is provided with a groove, and the other side encloses with the groove to form the single-layer microchannel structure.

[0009] In one embodiment, the plate body includes three sub-plate bodies stacked in sequence. The middle sub-plate body is provided with a through-channel that penetrates from one side facing the upper sub-plate body to the side facing the lower sub-plate body, and the through-channel and the adjacent upper and lower sub-plate bodies enclose to form the single-layer microchannel structure.

[0010] In one embodiment, the plate body includes at least four of the sub-plate bodies stacked in sequence, and at least two layers of microchannel structures are formed in the plate body. Each layer of microchannel structure includes at least one microchannel structure connected end to end; wherein:

[0011] Each layer of microchannel structure is formed between two adjacent sub-plate bodies; and / or,

[0012] Each layer of microchannel structure is formed between three adjacent sub-plate bodies.

[0013] In one embodiment, two adjacent sub-plate bodies are fixedly welded together.

[0014] In one embodiment, a single microchannel structure connected end to end includes:

[0015] A plurality of straight segments, the plurality of straight segments are spaced apart along a first direction, the straight segments extend along a second direction, and the first direction and the second direction are arranged at an angle;

[0016] A plurality of arc segments, and two adjacent straight segments are connected in series by one of the arc segments;

[0017] A connection segment, and the straight segment at the head end and the straight segment at the tail end are connected in series by the connection segment.

[0018] In one embodiment, at least one avoidance opening is provided on the heat pipe, and the avoidance opening is formed between any two adjacent straight segments;

[0019] The plate body is provided with a mounting hole at a position corresponding to the avoidance opening.

[0020] In one embodiment, the plate body is in a flat shape or the plate body has at least one bending portion.

[0021] In one embodiment, the plate body includes:

[0022] A first plate segment;

[0023] Two bending segments, the two bending segments are respectively connected to opposite side edges of the first plate segment, the bending segments and the first plate segment are arranged at an angle, and the two bending segments are arranged oppositely; the microchannel structure extends to the first plate segment and the two bending segments.

[0024] In one embodiment, the plate body further includes:

[0025] Two second plate segments, each of the second plate segments being connected to a side of one of the bent segments away from the first plate segment, the second plate segment being disposed at an angle to the bent segment; the microchannel structure further extends to the two second plate segments.

[0026] In one embodiment, a side of one of the second plate segments away from the bent segment extends in a direction away from the other second plate segment.

[0027] In one embodiment, the plate body includes a first plate segment and a second plate segment disposed at an angle; the microchannel structure extends to the first plate segment and the second plate segment.

[0028] To achieve the above object, the present invention further provides a heat dissipation assembly, including a heat source, a radiator, and the heat pipe as described above. The heat pipe is thermally connected to the heat source and the radiator respectively, and is used to conduct the heat generated by the heat source to the radiator for heat dissipation.

[0029] To achieve the above object, the present invention further provides a vehicle-mounted charger, including the heat dissipation assembly as described above.

[0030] The technical solution of the present invention directly forms a microchannel structure connected end to end in the plate body, and directly injects a phase change working fluid into the microchannel structure. Compared with the embedded capillary, there is one less layer of interfacial thermal resistance, so as to effectively improve the heat dissipation efficiency of the heat pipe.

[0031] In addition, by designing a microchannel structure adjacent end to end, during the use of the heat pipe, when the phase change working fluid at the hot end of the heat pipe absorbs heat and changes from liquid to gas, the gaseous phase change working fluid will flow from the hot end of the heat pipe to the cold end. During the process of the gaseous phase change working fluid flowing to the cold end, it will squeeze the liquid phase change working fluid at the cold end towards the hot end. When the gaseous phase change working fluid flows to the cold end, it will change back to liquid again, and when the liquid phase change working fluid flows from the cold end to the hot end, it will change to gas. In this way, a pulsating heat pipe can be formed, enabling the microchannel structure connected end to end inside the heat pipe to achieve the effect of anti-gravity, having no requirement for the installation direction, and increasing the usage scenarios of the heat pipe. Therefore, this solution can make the phase change of the phase change working fluid in the heat pipe not rely on gravity to achieve, enable the heat source to be installed in all directions of the heat pipe, and at the same time improve the heat dissipation efficiency of the heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0033] Figure 1 Explosion diagram of an embodiment of the heat pipe provided by the present invention;

[0034] Figure 2 Explosion diagram of another embodiment of the heat pipe provided by the present invention;

[0035] Figure 3 Explosion diagram of yet another embodiment of the heat pipe provided by the present invention;

[0036] Figure 4 Schematic diagram of the microchannel structure in an embodiment of the heat pipe provided by the present invention;

[0037] Figure 5 Schematic diagram of the structure of an embodiment of the heat pipe provided by the present invention;

[0038] Figure 6 Schematic diagram of the structure of another embodiment of the heat pipe provided by the present invention;

[0039] Figure 7 Schematic diagram of the structure of yet another embodiment of the heat pipe provided by the present invention.

[0040] Explanation of the reference numerals in the drawings:

[0041] Label Name Label Name 100 Heat pipe 13 Bending section 10 Plate body 14 Second plate section 11 Sub-plate body 20 Microchannel structure 11a First sub-plate body 20a Groove 11b Second sub-plate body 20b Through-channel 11c Third sub-plate body 21 Straight section 11d Fourth sub-plate body 22 Arc section 111 Mounting hole 23 Connecting section 12 First plate section 24 Avoidance opening

[0042] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0043] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0044] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0045] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0046] In the field of heat dissipation technology, heat dissipation of related devices is usually carried out through a heat spreader. The heat spreader in the related technology usually includes multiple independent and side-by-side microchannels, which are filled with phase-change working fluids. The phase-change working fluids in the microchannels need to use gravity to achieve the conversion between gas and liquid, and the heat source must be installed under the heat spreader; in addition, the microchannels in the existing heat spreaders generally use embedded capillaries, that is, the independent capillary structure is embedded in the plate body or heat exchanger, and its thermal resistance is large, resulting in low heat dissipation efficiency.

[0047] Based on the above problems, the present invention proposes a temperature vapor chamber 100 , aiming to improve the heat dissipation efficiency of the temperature vapor chamber 100 .

[0048] See also Figures 1 to 4 In one embodiment of the present invention, the temperature homogenizing plate 100 includes a plate body 10, and at least one microchannel structure 20 connected end to end is formed in the plate body 10, and the microchannel structure 20 is used to fill the phase change working medium.

[0049] The technical solution of the present invention forms a microchannel structure 20 connected end to end directly in the plate body 10 to directly inject phase change working fluid into the microchannel structure 20. Compared with the embedded capillary, there is one less layer of interface thermal resistance, thereby effectively improving the heat dissipation efficiency of the temperature equalizing plate 100.

[0050] In addition, by designing the microchannel structure 20 with adjacent head and tail, during the use of the heat pipe 100, when the phase change working fluid at the hot end of the heat pipe 100 absorbs heat and changes from liquid to gas, the gaseous phase change working fluid will flow from the hot end of the heat pipe 100 to the cold end. During the process of the gaseous phase change working fluid flowing to the cold end, it will squeeze the liquid phase change working fluid at the cold end towards the hot end. When the gaseous phase change working fluid flows to the cold end, it will change back to liquid again, and when the liquid phase change working fluid flows from the cold end to the hot end, it will change to gas. In this way, a pulsating heat pipe 100 can be formed, enabling the microchannel structure 20 with adjacent head and tail inside the heat pipe 100 to achieve the effect of counteracting gravity, having no requirement for the installation direction, and increasing the usage scenarios of the heat pipe 100. Therefore, this solution can enable the phase change of the phase change working fluid in the heat pipe 100 to be realized without relying on gravity, allowing the heat source to be installed in all directions of the heat pipe 100, and simultaneously improving the heat dissipation efficiency of the heat pipe 100.

[0051] In this embodiment, the plate body 10 of the heat pipe 100 is provided with a liquid injection port. When it is necessary to inject the phase change working fluid into the microchannel structure 20, the liquid injection port is opened, and after the injection is completed, the liquid injection port is closed. A plug can be provided at the liquid injection port to open or close the liquid injection port with the plug. In the actual application process, the phase change working fluid can include but is not limited to refrigerant, liquid ammonia, and fluorinated liquid.

[0052] In the actual application process, one or at least two microchannel structures 20 located on the same layer can be formed in the plate body 10, or at least two microchannel structures 20 located on different layers can be formed, and each microchannel structure 20 is a microchannel with adjacent head and tail. Moreover, the plate body 10 can have one layer or at least two sub - plate bodies 11, as long as a microchannel structure 20 with adjacent head and tail can be formed in the plate body 10.

[0053] It should be noted that the plate body 10 and the internal microchannel structure 20 are of an integrally formed structure, and the forming methods can include but are not limited to etching, machining, forging, stamping, etc. Moreover, the material of the plate body 10 can include but is not limited to aluminum, copper, steel, etc.

[0054] In the actual application process, the shape of the microchannel structure 20 with adjacent head and tail can include but is not limited to a square shape, a comb - tooth shape, an O - shape, or other shapes.

[0055] It should be noted that the plate body 10 of the heat pipe 100 can be bent into a three - dimensional structure to achieve a three - dimensional heat dissipation effect, so that the heat pipe 100 can be adapted to different - shaped devices for heat dissipation. The shape after bending of the plate body 10 of the heat pipe 100 can include but is not limited to a π - shape, an L - shape, a U - shape, or other shapes.

[0056] Please refer to Figures 1 to 3, in an embodiment of the present invention, the plate body 10 includes at least two sub-plate bodies 11, and the at least two sub-plate bodies 11 are stacked; when the plate body 10 includes two sub-plate bodies 11, the plate body 10 includes a single-layer microchannel structure formed between the two sub-plate bodies 11, and the single-layer microchannel structure includes at least one microchannel structure 20 connected end to end; when the plate body 10 includes more than two sub-plate bodies 11, a single-layer microchannel structure 20 or at least two layers of microchannel structures 20 are formed in the plate body 10, and each layer of microchannel structure 20 includes at least one microchannel structure 20 connected end to end.

[0057] With such a setting, a single-layer microchannel structure 20 or at least two layers of microchannel structures 20 can be formed by at least two sub-plate bodies 11 according to the heat dissipation requirements of the device, so that the heat pipe 100 can adapt to devices with different heat dissipation requirements. For example, when the heat dissipation requirement of the device is low, a single-layer microchannel structure 20 can be formed by at least two sub-plate bodies 11 to dissipate heat from the device under the action of the phase change working fluid inside the single-layer microchannel structure 20; when the heat dissipation requirement of the device is high, a single-layer microchannel structure 20 or at least two layers of microchannel structures 20 can be formed by more than two sub-plate bodies 11 to efficiently dissipate heat from the device under the action of the phase change working fluid inside the single-layer microchannel structure 20 or at least two layers of microchannel structures 20.

[0058] In actual application, adjacent two sub-plate bodies 11 can be connected by means such as welding, bonding, and screw connection.

[0059] In the actual application process, when the single-layer microchannel structure 20 includes at least two microchannel structures 20, the at least two microchannel structures 20 can be spaced apart along the length direction or the width direction of the plate body 10, as long as each microchannel structure 20 extends to the hot end and the cold end of the heat pipe 100.

[0060] Please refer to Figure 1 , in an embodiment of the present invention, the plate body 10 includes two sub-plate bodies 11 stacked, and at least one of the opposite sides of the two sub-plate bodies 11 is provided with a groove 20a, and the other is enclosed with the groove 20a to form a single-layer microchannel structure 20.

[0061] With such a setting, during the preparation process, a groove 20a can be opened on at least one of the opposite sides of the two sub-plate bodies 11, and then after the two sub-plate bodies 11 are stacked with each other, the groove 20a can be enclosed with the opposite other sub-plate body 11 to form a single-layer microchannel structure 20, which is more convenient for forming a single-layer microchannel structure 20 in the plate body 10.

[0062] In the actual application process, a groove 20a can be provided on one side of one of the two sub-plate bodies 11 facing the other, so that a single-layer microchannel structure 20 is formed by enclosing between the groove 20a and the other sub-plate body 11; alternatively, grooves 20a with matching shapes can also be provided on both opposite sides of the two sub-plate bodies 11, so that the two grooves 20a form a single-layer microchannel structure 20.

[0063] Please refer to Figure 2 , in another embodiment of the present invention, the plate body 10 includes three sub-plate bodies 11 stacked in sequence. The middle sub-plate body 11 is provided with a through-channel 20b. The through-channel 20b penetrates from one side facing the upper-layer sub-plate body 11 to the side facing the lower-layer sub-plate body 11. The through-channel 20b and the adjacent upper-layer sub-plate body 11 and lower-layer sub-plate body 11 enclose to form a single-layer microchannel structure 20.

[0064] With such a setting, during the preparation process, a through-channel 20b can be opened on the middle sub-plate body 11, and then the upper-layer sub-plate body 11 is stacked above the middle sub-plate body 11 so that the upper-layer sub-plate body 11 blocks one side of the through-channel 20b, and the lower-layer sub-plate body 11 is stacked below the middle sub-plate body 11 so that the lower-layer sub-plate body 11 blocks the other side of the through-channel 20b, then the through-channel 20b and the adjacent upper-layer sub-plate body 11 and lower-layer sub-plate body 11 can enclose to form a single-layer microchannel structure 20, which is also more convenient to form a single-layer microchannel structure 20 in the plate body 10.

[0065] Please refer to Figure 3 , in yet another embodiment of the present invention, the plate body 10 includes at least four sub-plate bodies 11 stacked in sequence. At least two layers of microchannel structures 20 are formed in the plate body. Each layer of microchannel structure 20 includes at least one microchannel structure 20 connected end to end; wherein: each layer of microchannel structure 20 is formed between two adjacent sub-plate bodies 11; and / or, each layer of microchannel structure 20 is formed between three adjacent sub-plate bodies 11.

[0066] With such a setting, during the preparation process, when each layer of the microchannel structure 20 is formed between two adjacent sub-plate bodies 11, grooves 20a can be provided on at least one of the opposite sides of the two sub-plate bodies 11. Then, after the two sub-plate bodies 11 are stacked on top of each other, the grooves 20a and the other sub-plate body 11 opposite thereto can enclose to form a single-layer microchannel structure 20, which is more convenient for forming the single-layer microchannel structure 20 within the plate body 10. When each layer of the microchannel structure 20 is formed between three adjacent sub-plate bodies 11, a through-channel 20b can be provided on the middle sub-plate body 11. Then, the upper-layer sub-plate body 11 is stacked above the middle sub-plate body 11 to block one side of the through-channel 20b, and the lower-layer sub-plate body 11 is stacked below the middle sub-plate body 11 to block the other side of the through-channel 20b. In this way, the through-channel 20b and the adjacent upper-layer sub-plate body 11 and lower-layer sub-plate body 11 can enclose to form a single-layer microchannel structure 20, which is also more convenient for forming the single-layer microchannel structure 20 within the plate body 10. Therefore, with the design of at least four sub-plate bodies 11, at least two layers of microchannel structures 20 can be formed within the plate body 10, and such a design is more convenient for forming at least two layers of microchannel structures 20 within the plate body 10.

[0067] In some embodiments, the four sub-plate bodies 11 can be a first sub-plate body 11a, a second sub-plate body 11b, a third sub-plate body 11c, and a fourth sub-plate body 11d respectively. The second sub-plate body 11b is provided with a through-channel 20b that penetrates from the side facing the first sub-plate body 11a to the side facing the third sub-plate body 11c. The through-channel 20b and the first sub-plate body 11a and the third sub-plate body 11c enclose to form a first-layer microchannel structure 20. Grooves 20a are provided on at least one of the opposite sides of the third sub-plate body 11c and the fourth sub-plate body 11d, and the grooves 20a and the third sub-plate body 11c and the fourth sub-plate body 11d enclose to form a second-layer microchannel structure 20.

[0068] During the preparation process, a through-channel 20b can be formed on the second sub-plate body 11b, and then the first sub-plate body 11a is stacked above the second sub-plate body 11b so that the first sub-plate body 11a blocks one side of the through-channel 20b, and the third sub-plate body 11c is stacked below the second sub-plate body 11b so that the third sub-plate body 11c blocks the other side of the through-channel 20b, thus enabling the through-channel 20b to be enclosed by the first sub-plate body 11a and the third sub-plate body 11c to form a first-layer micro-channel structure 20; in addition, by forming grooves 20a on at least one of the opposite sides of the third sub-plate body 11c and the fourth sub-plate body 11d, and then stacking the fourth sub-plate body 11d below the third sub-plate body 11c, the grooves 20a can be enclosed by the third sub-plate body 11c and the fourth sub-plate body 11d to form a second-layer micro-channel structure 20; therefore, with the design of the first sub-plate body 11a, the second sub-plate body 11b, the third sub-plate body 11c, and the fourth sub-plate body 11d, at least two layers of micro-channel structures 20 can be formed within the plate body 10, and such a design is more convenient for forming at least two layers of micro-channel structures 20 within the plate body 10.

[0069] During the actual application process, grooves 20a can be provided on the side of the third sub-plate body 11c facing the fourth sub-plate body 11d; alternatively, grooves 20a can also be provided on the side of the fourth sub-plate body 11d facing the third sub-plate body 11c; or, grooves 20a with matching shapes can be provided on both opposite sides of the third sub-plate body 11c and the fourth sub-plate body 11d so that the two grooves 20a form at least one layer of micro-channel structure 20.

[0070] Please refer to Figures 1 to 3 , in an embodiment of the present invention, two adjacent sub-plate bodies 11 are fixedly connected by welding.

[0071] With such a setting, by connecting two adjacent sub-plate bodies 11 together by welding, not only can the connection reliability between two adjacent sub-plate bodies 11 be effectively ensured, but also the sealing performance of the formed micro-channel structure 20 can be guaranteed to prevent the phase-change working fluid inside the micro-channel structure 20 from leaking.

[0072] During the actual application process, the welding method adopted between two adjacent sub-plate bodies 11 can include but is not limited to brazing, laser welding, molecular diffusion, or other welding methods.

[0073] Please refer to Figure 4, in an embodiment of the present invention, a single microchannel structure 20 with adjacent head and tail includes a plurality of straight segments 21, a plurality of arc segments 22, and connecting segments 23; the plurality of straight segments 21 are spaced apart along a first direction, the straight segments 21 extend along a second direction, and the first direction and the second direction are arranged at an angle; two adjacent straight segments 21 are connected in series by an arc segment 22; the straight segment 21 at the head end and the straight segment 21 at the tail end are connected in series by a connecting segment 23.

[0074] With such a setting, by designing a plurality of straight segments 21 spaced apart along the first direction, and connecting two adjacent straight segments 21 in series with an arc segment 22, and at the same time using the connecting segment 23 to connect the straight segment 21 at the head end and the straight segment 21 at the tail end in series, the plurality of straight segments 21, the plurality of arc segments 22, and the connecting segments 23 can form a microchannel structure 20 with connected head and tail. And this design can make the microchannel structure 20 with connected head and tail fully cover most of the plane of the plate body 10, which can increase the flow path of the phase change working medium inside the microchannel structure 20, thereby improving the heat dissipation effect of the heat pipe 100. In addition, using the arc segment 22 to connect two adjacent straight segments 21 in series can enable the phase change working medium to flow smoothly from one straight segment 21 to another straight segment 21 through the arc segment 22, reducing the loss of the phase change working medium during the flow process.

[0075] In some embodiments, the first direction may be the width direction of the plate body 10, and the second direction may be the length direction of the plate body 10.

[0076] Please refer to Figures 1 to 4 , in an embodiment of the present invention, at least one avoidance opening 24 is provided on the heat pipe, and the avoidance opening 24 is formed between any two adjacent straight segments 21; the plate body 10 is provided with a mounting hole 111 corresponding to the position of the avoidance opening 24.

[0077] With such a setting, when the heat pipe 100 needs to be installed on the corresponding device for heat dissipation, the heat pipe 100 can be fixedly installed on the corresponding device by using a fastener in cooperation with the mounting hole 111 and the avoidance opening 24, which can avoid interference between the fastener passing through the plate body 10 and the microchannel structure 20, thereby ensuring the sealing performance of the microchannel structure 20.

[0078] It should be noted that when the avoidance opening 24 needs to be formed between two adjacent straight segments 21, the positions of these two straight segments 21 corresponding to the avoidance opening 24 can be bent in a direction away from each other, so that the avoidance opening 24 can be formed at this position. Therefore, the straight segment 21 refers to at least part of the position being designed as a straight line, and the position corresponding to the avoidance opening 24 can be designed in an arc shape, a wavy shape or other shapes.

[0079] In the actual application process, the shapes of the avoidance opening 24 and the mounting hole 111 may include, but are not limited to, shapes such as circular, oval, rectangular, etc.

[0080] Please refer to Figures 5 to 7 , in an embodiment of the present invention, the plate body 10 is in a flat plate shape or the plate body 10 has at least one bending portion.

[0081] With such a setting, the plate body 10 can be designed into a matching flat plate shape or a shape with at least one bending portion according to the shape of the device (heat source) that needs to dissipate heat, which can improve the heat dissipation effect of the heat pipe 100 on the device.

[0082] Please refer to Figure 5 , in an embodiment of the present invention, the plate body 10 includes a first plate segment 12 and two bending segments 13; the two bending segments 13 are respectively connected to opposite side edges of the first plate segment 12, the bending segments 13 are arranged at an angle with the first plate segment 12, and the two bending segments 13 are arranged oppositely; the microchannel structure 20 extends to the first plate segment 12 and the two bending segments 13.

[0083] With such a setting, the first plate segment 12 and the two bending segments 13 can form a U-shaped plate body 10, and the microchannel structure 20 extends to the first plate segment 12 and the two bending segments 13, so that a U-shaped heat pipe 100 can be formed, which can achieve a three-dimensional heat dissipation effect, so that the U-shaped heat pipe 100 can adapt to devices of corresponding shapes to improve the heat dissipation effect of the heat pipe 100 on the devices.

[0084] It should be noted that both of the two bending segments 13 are bending portions of the plate body 10.

[0085] In some embodiments, the two side edges of the plate body 10 with the microchannel structure 20 formed inside can be bent in the same direction, so that the first plate segment 12 and the two bending segments 13 can be formed.

[0086] Please refer to Figure 6 , in another embodiment of the present invention, the plate body 10 further includes two second plate segments 14, each second plate segment 14 is connected to a side edge of a bending segment 13 away from the first plate segment 12, the second plate segment 14 is arranged at an angle with the bending segment 13; the microchannel structure 20 also extends to the two second plate segments 14.

[0087] With such a setting, the first plate segment 12, the two bending segments 13 and the two second plate segments 14 can form a square-shaped or π-shaped plate body 10, and the microchannel structure 20 extends to the first plate segment 12, the two bending segments 13 and the two second plate segments 14, so that a square-shaped or π-shaped heat pipe 100 can be formed, which can achieve a three-dimensional heat dissipation effect, so that the square-shaped or π-shaped heat pipe 100 can adapt to devices of corresponding shapes to improve the heat dissipation effect of the heat pipe 100 on the devices.

[0088] In the actual application process, the side of one second plate segment 14 away from the bending segment 13 can extend away from the other second plate segment 14, or can extend towards the other second plate segment 14.

[0089] Please refer to Figure 6 , in another embodiment of the present invention, the side of one second plate segment 14 away from the bending segment 13 extends away from the other second plate segment 14.

[0090] With such a setting, the first plate segment 12, the two bending segments 13, and the two second plate segments 14 can form a π-shaped plate body 10, and the microchannel structure 20 extends to the first plate segment 12, the two bending segments 13, and the two second plate segments 14, and then a π-shaped heat pipe 100 can be formed, which can make the π-shaped heat pipe 100 adapt to devices with corresponding shapes to improve the heat dissipation effect of the heat pipe 100 on the devices.

[0091] It should be noted that the two bending segments 13 and the two second plate segments 14 are both bending parts of the plate body 10.

[0092] Please refer to Figure 7 , in yet another embodiment of the present invention, the plate body 10 includes a first plate segment 12 and a second plate segment 14 arranged at an angle; the microchannel structure 20 extends to the first plate segment 12 and the second plate segment 14.

[0093] With such a setting, the first plate segment 12 and the second plate segment 14 can form an L-shaped plate body 10, and the microchannel structure 20 extends to the first plate segment 12 and the second plate segment 14, and then an L-shaped heat pipe 100 can be formed, which can achieve a three-dimensional heat dissipation effect, make the L-shaped heat pipe 100 adapt to devices with corresponding shapes, and improve the heat dissipation effect of the heat pipe 100 on the devices.

[0094] The present invention also proposes a heat dissipation assembly, which includes a heat source, a radiator, and a heat pipe 100. The specific structure of the heat pipe 100 refers to the above embodiments. Since this heat dissipation assembly adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one. Among them, the heat pipe 100 is thermally connected to the heat source and the radiator respectively, and is used to conduct the heat generated by the heat source to the radiator for heat dissipation.

[0095] In this embodiment, the heat pipe 100 can be applied to heat dissipation scenarios of heat sources such as frequency converters and servo drivers, and no specific limitation is made here. The radiator is installed on the heat dissipation surface of the heat pipe 100 and can dissipate heat from the heat pipe 100.

[0096] The present invention also provides a vehicle-mounted charger, which includes electronic components and a heat dissipation component. The specific structure of the heat dissipation component refers to the above-mentioned embodiments. Since this vehicle-mounted charger adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be elaborated here one by one.

[0097] The above is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structural transformation made by using the content of the specification and drawings of the present invention under the technical concept of the present invention, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A heat pipe, characterized in that, It includes a plate body, and at least one microchannel structure that is connected end to end is formed in the plate body, and the microchannel structure is used to fill a phase change working fluid.

2. The heat pipe according to claim 1, wherein The plate body includes at least two sub-plate bodies, and at least two of the sub-plate bodies are stacked; When the plate body includes two of the sub-plate bodies, the plate body includes a single-layer microchannel structure formed between the two sub-plate bodies, and the single-layer microchannel structure includes at least one microchannel structure that is connected end to end; When the plate body includes more than two of the sub-plate bodies, a single-layer microchannel structure or at least two layers of microchannel structures are formed in the plate body, and each layer of microchannel structure includes at least one microchannel structure that is connected end to end.

3. The heat pipe according to claim 2, characterized in that, The plate body includes two sub-plate bodies that are stacked, and at least one of the opposite sides of the two sub-plate bodies is provided with a groove, and the other is enclosed with the groove to form the single-layer microchannel structure.

4. The heat pipe according to claim 2, wherein The plate body includes three sub-plate bodies that are stacked in sequence, and the middle sub-plate body is provided with a through channel, and the through channel penetrates from one side facing the upper sub-plate body to the side facing the lower sub-plate body, and the through channel and the adjacent upper and lower sub-plate bodies enclose to form the single-layer microchannel structure.

5. The heat pipe according to claim 2, characterized in that, The plate body includes at least four sub-plate bodies that are stacked in sequence, and at least two layers of microchannel structures are formed in the plate body, and each layer of microchannel structure includes at least one microchannel structure that is connected end to end; wherein: Each layer of microchannel structure is formed between two adjacent sub-plate bodies; and / or, Each layer of microchannel structure is formed between three adjacent sub-plate bodies.

6. The heat pipe according to claim 2, wherein Two adjacent sub-plate bodies are fixed by welding.

7. The heat pipe according to any one of claims 1 to 6, characterized in that A single microchannel structure that is connected end to end includes: Multiple straight segments, the multiple straight segments are spaced along a first direction, the straight segments extend along a second direction, and the first direction and the second direction are arranged at an angle; Multiple arc segments, and two adjacent straight segments are connected in series by one of the arc segments; A connecting segment, and the straight segment at the head end and the straight segment at the tail end are connected in series by the connecting segment.

8. The heat spreader according to claim 7, wherein At least one avoidance opening is provided on the heat pipe, and the avoidance opening is formed between any two adjacent straight segments; The plate body is provided with a mounting hole at a position corresponding to the avoidance opening.

9. The heat pipe according to any one of claims 1 to 6, characterized in that, The plate body is in a flat plate shape or the plate body has at least one bending part.

10. The heat pipe according to claim 9, characterized in that, The plate body includes: A first plate segment; Two bending segments, the two bending segments are respectively connected to opposite side edges of the first plate segment, the bending segments are arranged at an angle with the first plate segment, and the two bending segments are arranged oppositely; the microchannel structure extends to the first plate segment and the two bending segments.

11. The heat pipe according to claim 10, characterized in that, The plate body further includes: Two second plate segments, each second plate segment is connected to a side edge of one of the bending segments away from the first plate segment, and the second plate segment is arranged at an angle with the bending segment; the microchannel structure further extends to the two second plate segments.

12. The heat pipe according to claim 11, characterized in that, A side edge of one of the second plate segments away from the bending segment extends in a direction away from the other second plate segment.

13. The heat pipe according to any one of claims 1 to 6, characterized in that The plate body includes a first plate segment and a second plate segment arranged at an included angle; the microchannel structure extends to the first plate segment and the second plate segment.

14. A heat dissipation component, characterized in that, It includes a heat source, a radiator, and a heat pipe as described in any one of claims 1 to 13. The heat pipe is thermally connected to the heat source and the radiator respectively, and is used to conduct the heat generated by the heat source to the radiator for heat dissipation.

15. A vehicle-mounted charger, characterized in that, It includes a heat dissipation component as described in claim 14.

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