Wireless earplug type earphone

Abstract

The earplug-type earphone comprises: a dielectric structure which is disposed inside a handle and is formed by a front surface, a back surface, and side surfaces; and a radiator which is formed on the dielectric structure and radiates a wireless signal to the outside of the earplug-type earphone. The radiator includes: a first conductive pattern formed on a first surface of the dielectric structure; a second conductive pattern formed on a second surface perpendicular to the first surface; a third conductive pattern formed on a third surface perpendicular to the first surface and facing the second surface, the third conductive pattern including a power supply connection pattern and a ground connection pattern; a slit region formed by removing at least a partial region of the first conductive pattern on the first surface and the third conductive pattern on the third surface; and a fourth conductive pattern disposed on the third surface so as to be adjacent to the power supply connection pattern of the third conductive pattern.

Description

Technical Field

[0001] This specification relates to an electronic device for receiving content, and more particularly, to an electronic device for receiving content through an antenna. In particular, it relates to wireless earbuds having an antenna and a control circuit. Background Art

[0002] Electronic devices such as electronic accessories for mobile phones, computers, and other electronic equipment include wireless circuits. For example, as an electronic device that communicates wirelessly with a mobile phone and other equipment, earbuds can be used.

[0003] A small electronic device such as wireless earbuds is configured to receive content reproduced from a host device, i.e., a mobile terminal, through a Bluetooth band. Wireless earbuds are wearable electronic devices inserted into a person's ear.

[0004] When embodying an antenna and a wireless communication circuit in a small electronic device such as wireless earbuds, another problem arises. Regarding this, inside the body of wireless earbuds worn on a human body, the antenna cannot operate effectively to radiate a wireless signal. Therefore, it is difficult to achieve a desired wireless communication performance with surrounding electronic devices through wireless communication.

[0005] The wireless earbuds are designed to receive wireless signals through a Bluetooth band having a certain bandwidth centered at about 2.45 GHz. Regarding this, the operational bandwidth of the antenna provided in the wireless earbuds needs to be designed wider than that of other electronic devices performing wireless communication through the Bluetooth band. Because when wearing the wireless earbuds, the antenna resonance frequency may be changed due to the movement of the human body or the movement of the wireless earbuds in the space inside the ear. In addition, the antenna configuration space inside the appliance of the wireless earbuds is narrow, resulting in sensitivity to antenna performance changes caused by manufacturing deviations. Therefore, it is necessary to embody an electronic device such as wireless earbuds having an improved antenna and a control circuit.

[0006] In addition, the propagation quality of an ISM (Industry-Science-Medical) band such as the Bluetooth band temporarily deteriorates in a densely populated area with many users. Therefore, when reproducing content, the reproduction quality temporarily deteriorates. To solve such a problem, the content is reproduced by receiving wireless signals through UWB (ultra-wide band).

[0007] There is a problem in that it is difficult to embody an antenna structure that can operate in both the Bluetooth band and the UWB band within the limited space inside the apparatus structure of a wireless earbud. Regarding this, it is necessary to embody the antenna structure to cover the 6.25 to 8.25 GHz band. In addition, it is necessary to embody the antenna structure to cover the 6.25 to 10 GHz band for UWB communication services in each wireless channel. Summary of the Invention

[0008] Technical Problem

[0009] The purpose of this specification is to solve the above problems and other problems. In addition, another purpose is to provide an electronic device such as a wireless earbud equipped with an improved antenna and control circuit.

[0010] Another purpose of this specification is to increase the operating bandwidth of the antenna provided in the wireless earbud.

[0011] Another purpose of this specification is to stably receive wireless signals even when the antenna resonance frequency changes as the wireless earbud is worn.

[0012] Another purpose of this specification is to minimize the change in antenna performance caused by the narrow antenna configuration space inside the apparatus of the wireless earbud.

[0013] Another purpose of this specification is to embody an antenna structure that can operate in the Bluetooth band and the UWB band inside the apparatus of the wireless earbud.

[0014] Means for Solving the Problem

[0015] To achieve the above purpose or other purposes, the earbud of the embodiment includes: a dielectric structure that is disposed inside the stem and is formed by a front surface, a back surface, and a side surface; and a radiator that is formed on the dielectric structure and radiates wireless signals to the outside of the earbud. The radiator includes: a first conductive pattern that is formed on a first surface of the dielectric structure; a second conductive pattern that is formed on a second surface perpendicular to the first surface; a third conductive pattern that is formed on a third surface perpendicular to the first surface and opposite to the second surface and includes a power supply connection pattern and a ground connection pattern; a slit region that is formed by removing at least a part of the first conductive pattern on the first surface and the third conductive pattern on the third surface; and a fourth conductive pattern that is disposed adjacent to the power supply connection pattern of the third conductive pattern on the third surface.

[0016] According to an embodiment, the above-mentioned in-ear headphones include: a housing having a main body portion including a speaker port and a stalk extending from the main body portion; and a printed circuit board (PCB) electrically connected to the radiator. The radiator includes a coaxial cable that electrically connects the first conductive pattern and the PCB.

[0017] According to an embodiment, the first conductive pattern and the coaxial cable are configured to radiate signals in a first frequency band. The first conductive pattern and the second conductive pattern are configured to radiate signals in a second frequency band different from the first frequency band. The fourth conductive pattern and the slit region are configured to radiate signals in a third frequency band higher than the first frequency band and the second frequency band.

[0018] According to an embodiment, the slit region is formed between the power supply connection pattern and the ground connection pattern. The slit region is formed to have a first length on one axis and a first width on the other axis on the first surface. The power supply connection pattern is connected to the signal line of the coaxial cable disposed below the dielectric structure, and the ground connection pattern is connected to a ground structure, and the ground structure is connected to a second PCB disposed below the dielectric structure.

[0019] According to an embodiment, the radiator includes a second slit region formed at the same position as the slit region on the one axis and separated from the slit region on the other axis on the first surface. The radiator includes a third slit region formed separated from the slit region on the other axis on the first surface. The radiator includes a fourth slit region formed separated from the slit region on the other axis on the first surface and the third surface.

[0020] According to an embodiment, in the direction of the other axis, the first slit region and the second slit region are formed separated by a second length from the end of the first conductive pattern adjacent to the stalk. In the direction of the other axis, the length of the third slit region is formed to be a third length shorter than the second length. In the direction of the other axis, the length from one end of the fourth slit region to the end of the first conductive pattern is formed to be a fourth length shorter than the second length.

[0021] According to an embodiment, the second length from the end of the first conductive pattern to one end of the first slit region and the second slit region is formed to be a length within a specified range based on 4.4 mm. The third length to one end of the third slit region is formed to be a length within the range of 2.4 to 2.75 mm. The fourth length to one end of the fourth slit region is formed to be a length within a specified range based on 2.8 mm.

[0022] According to an embodiment, the second conductive pattern includes a touch sensor. In the one axial direction of the handle, the first conductive pattern is formed to be a length of a first pattern, and in the one axial direction, the second conductive pattern is formed to be a length of a second pattern shorter than the length of the first pattern.

[0023] According to an embodiment, the fourth conductive pattern formed on the third surface opposite to the second conductive pattern includes a force sensor or a pressure sensor. The fourth conductive pattern is disposed between the other end of the sub-pattern of the third conductive pattern formed on the third surface and one end of the power supply connection pattern formed on the third surface.

[0024] According to an embodiment, the third conductive pattern includes: the sub-pattern, which is disposed at a distance from one end of the fourth conductive pattern; the power supply connection pattern, which is disposed at a distance from the other end of the fourth conductive pattern and is connected to the power supply terminal of the PCB; and the ground connection pattern, which is disposed at a distance from the power supply connection pattern through the slit region and is connected to the ground layer of the PCB.

[0025] According to an embodiment, the third conductive pattern further includes: a second sub-pattern, which is disposed at a distance from the ground connection pattern through the fourth slit region and is connected to the first conductive pattern between the slit region and the third slit region.

[0026] According to an embodiment, the third conductive pattern and the slit region formed on the third surface are configured to radiate signals in a third frequency band higher than the second frequency band. The third conductive pattern and the slit region are configured to perform dual resonance in the 7 GHz and 10 GHz frequency bands for UWB communication.

[0027] According to an embodiment, the third conductive pattern formed on the above-described third surface and the slit region, the second slit region, the third slit region, and the fourth slit region are configured to radiate a signal in a third frequency band higher than the second frequency band. The third conductive pattern and the slit region, the second slit region, the third slit region, and the fourth slit region are configured to perform multi-layer resonance in the frequency band of 6 GHz to 10 GHz for UWB communication.

[0028] According to an embodiment, the signal line of the coaxial cable is connected to the first conductive pattern. The ground layer of the coaxial cable is connected to the ground layer of the PCB. The length of the first pattern of the first conductive pattern is formed to be within a specified range based on 14.6 mm, and the length of the second pattern of the second conductive pattern is formed to be within a specified range based on 13.6 mm. The first frequency band is a band having a center frequency of 2.3 GHz for the electronic device to perform Bluetooth communication, and the second frequency band is a band having a center frequency of 2.6 GHz to perform the Bluetooth communication.

[0029] According to an embodiment, the first conductive pattern formed on the first surface and the coaxial cable formed on the first surface radiate a first signal in the first frequency band. The first conductive pattern and the second conductive pattern formed on the second surface perpendicular to the first surface are configured to radiate a second signal in the second frequency band. One end portion of the first conductive pattern and one end portion of the second conductive pattern are spaced apart, and the current formed in the first conductive pattern is coupled to the second conductive pattern in the second frequency band. The first direction of the first current of the first conductive pattern and the coaxial cable formed on the first surface and the second direction of the second current of the second conductive pattern formed on the second surface perpendicular to the first surface are formed orthogonally, so that the radiator performs broadband operation in the first frequency band and the second frequency band.

[0030] According to an embodiment, the signal pattern of the first conductive pattern is formed as a conductive pattern of a specified shape to radiate a signal in the first frequency band and the second frequency band. The ground pattern of the first conductive pattern is electrically connected to the ground layer of the coaxial cable. The signal pattern of the second conductive pattern is formed as a conductive pattern of a specified shape to radiate a signal in the second frequency band and act as a touch sensor. The ground pattern of the second conductive pattern is electrically connected to the ground portion of the coaxial cable.

[0031] According to an embodiment, the signal pattern of the fourth conductive pattern is formed as a conductive pattern of a specified shape to act as a force sensor. The ground pattern of the fourth conductive pattern is electrically connected to the ground portion of the coaxial cable.

[0032] Another type of electronic device according to the present specification includes: a dielectric housing having a main body portion including a port and a protruding portion extending from the main body portion; and an antenna disposed within the protruding portion to radiate wireless signals to the outside of the electronic device. The antenna includes: a first conductive pattern formed on a first surface within the protruding portion; a second conductive pattern formed on a second surface perpendicular to the first surface; a connection portion electrically connecting the first conductive pattern and a printed circuit board (PCB); a third conductive pattern formed on a third surface perpendicular to the first surface and opposite to the second surface, and including a power supply connection pattern and a ground connection pattern; a slit region formed by removing at least a partial region of the first conductive pattern on the first surface and the third conductive pattern on the third surface; and a fourth conductive pattern disposed adjacent to the power supply connection pattern of the third conductive pattern on the third surface.

[0033] According to an embodiment, the first conductive pattern and the connection portion are configured to radiate signals in a first frequency band. The first conductive pattern and the second conductive pattern are configured to radiate signals in a second frequency band different from the first frequency band. The fourth conductive pattern and the slit region are configured to radiate signals in a third frequency band higher than the first frequency band and the second frequency band.

[0034] According to an embodiment, the slit region is formed between the power supply connection pattern and the ground connection pattern. The slit region is formed to have a first length on one axis and a first width on another axis on the first surface. The power supply connection pattern is connected to a signal line of a coaxial cable disposed below the dielectric structure, and the ground connection pattern is connected to a ground structure, which is connected to a second PCB disposed below the dielectric structure.

[0035] According to an embodiment, the antenna includes a second slit region formed on the first surface at the same position as the slit region on the one axis and spaced apart from the slit region on the another axis. The antenna includes a third slit region formed on the first surface and spaced apart from the slit region on the another axis. The antenna includes a fourth slit region formed on the first surface and the third surface and spaced apart from the slit region on the another axis.

[0036] According to an embodiment, in the above-mentioned other axial direction, the above-mentioned first slit region and the above-mentioned second slit region are formed by being separated from the end of the above-mentioned first conductive pattern adjacent to the above-mentioned handle by a second length. In the above-mentioned other axial direction, the length of the above-mentioned third slit region is formed as a third length shorter than the above-mentioned second length. In the above-mentioned other axial direction, a fourth length shorter than the above-mentioned second length is formed from one end of the above-mentioned fourth slit region to the above-mentioned end of the above-mentioned first conductive pattern.

[0037] According to an embodiment, the above-mentioned second conductive pattern includes a touch sensor. The above-mentioned first conductive pattern is formed as a length of a first pattern in the above-mentioned one axial direction of the above-mentioned handle, and the above-mentioned second conductive pattern is formed as a length of a second pattern shorter than the length of the above-mentioned first pattern in the above-mentioned one axial direction. The above-mentioned fourth conductive pattern formed on the above-mentioned third surface opposite to the above-mentioned second conductive pattern includes a force sensor or a pressure sensor. The above-mentioned fourth conductive pattern is disposed between the other end of the sub-pattern of the above-mentioned third conductive pattern formed on the above-mentioned third surface and one end of the above-mentioned power supply connection pattern formed on the above-mentioned third surface.

[0038] Advantages of the Invention

[0039] The technical effects of such wireless earbuds equipped with a broadband antenna are described as follows.

[0040] According to this specification, in an electronic device such as wireless earbuds, a broadband antenna can perform broadband operation.

[0041] According to this specification, the current formed on the conductive pattern of the antenna provided in the wireless earbuds is coupled to the touch sensor, thereby increasing the operation bandwidth of the antenna.

[0042] According to this specification, when wearing the wireless earbuds, even if the antenna resonance frequency changes according to the movement of the human body or the movement of the wireless earbuds in the space inside the ear, a wireless signal can be stably received.

[0043] According to this specification, minimizing the change in antenna performance due to the narrow antenna configuration space inside the appliance configured in the wireless earbuds can stably maintain the wireless communication performance.

[0044] According to this specification, an antenna structure capable of operating in the Bluetooth band and the UWB band can be realized through the conductive pattern in front of the dielectric structure provided inside the wireless earbuds and the conductive pattern with a force sensor disposed on the side.

[0045] According to this specification, an antenna structure capable of operating in both the Bluetooth band and the UWB band can be realized through one or more gap regions formed in a conductive pattern and a front conductive pattern that are disposed on the side surface of a dielectric structure.

[0046] The additional scope to which the present invention can be applied can be clearly understood from the following detailed description. However, those skilled in the art can clearly understand various changes and modifications within the spirit and scope of the present invention. Therefore, the detailed description and specific embodiments such as the preferred embodiments of the present invention are merely illustrative. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a structural diagram of an exemplary system of an electronic device that includes wireless communication with a wearable electronic device such as the wireless earbuds of this specification.

[0048] Figure 2 and Figure 3 It shows a front perspective view and a back perspective view of the earbuds of this specification.

[0049] Figure 4a and Figure 4b It shows components including a conductive pattern and an appliance structure disposed inside the earbuds of this specification from different sides.

[0050] Figure 5a in which, according to Figure 4a and Figure 4b the reflection coefficient characteristics generated by the frequency of the earbuds having a radiator structure disposed inside are compared with the reflection coefficient characteristics of a radiator structure having a single conductive pattern.

[0051] Figure 5b and Figure 5c It shows the change in the reflection coefficient caused by the morphological change of the RF cable and the FPCB in a single-mode and dual-mode antenna structure.

[0052] Figure 6 It shows a radiator structure formed by a plurality of conductive patterns inside the earbuds of this specification.

[0053] Figure 7 It shows Figure 6 a side view and a front view of the radiator structure.

[0054] Figure 8 It shows a radiator structure and a reflection coefficient realized through a first conductive pattern formed with a gap region composed of a plurality of gap regions.

[0055] Figure 9a It shows Figure 6 a structure in which one gap region is formed in the radiator structure.

[0056] Figure 9b showing a structure in which a plurality of slit regions are formed in the radiator structure of Figure 6 The structure in which a plurality of slit regions are formed in the radiator structure of

[0057] Figure 10a showing Figure 9a the reflection coefficient characteristics of each frequency band in the radiator structure of Figure 10b showing Figure 9b the reflection coefficient characteristics of each frequency band in the radiator structure of

[0058] Figure 11 showing the single-mode antenna and appliance structure inside the earphone

[0059] Figure 12 showing the dual-mode antenna and appliance structure inside the earphone of the present specification

[0060] Figure 13 showing a side view, a perspective view, and a front view of an earphone configured with a conductive pattern formed of a single slit structure

[0061] Figure 14 showing a side view, a perspective view, and a front view of an earphone configured with a conductive pattern formed of a multi-layer slit structure

[0062] Figure 15 compares the current distributions of the radiator structures of the single slit structure and the multi-layer slit structure in Detailed Description of the Invention

[0063] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings. Regardless of the reference numerals of the drawings, the same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted. In the following description, the suffixes "module" and "unit" of the components are given or mixed for convenience of writing the specification, and they do not have meanings or functions for distinguishing each other. In addition, when it is determined that a detailed description of related well-known techniques may obscure the gist of the embodiments disclosed in the present specification, the detailed description thereof is omitted. In addition, the drawings are provided to facilitate understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited to the drawings, but should be understood to include all changes, equivalents, and alternatives made within the technical idea and technical scope of the present invention.

[0064] The terms including ordinal numbers such as first, second, etc. may be used to describe each component, and these components are not limited to the terms. The terms are only used to distinguish one component from another.

[0065] When referring to a certain component being "connected" or "linked" to another component, it should be understood that the structural element can be directly connected or linked to the other component, but there may also be other components between them. On the contrary, when referring to a certain component being "directly connected" or "directly linked" to another component, it should be understood that there are no other components between them.

[0066] Unless otherwise expressly indicated, the singular forms include the plural meanings.

[0067] In this application, the terms "comprising" or "having" should be understood to mean the presence of the features, numbers, steps, actions, components, parts, or combinations thereof disclosed in this specification, and do not preclude the presence or additional possibility of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0068] The electronic device described in this specification may be a wearable device. A wireless wearable electronic device such as a wireless earbud can communicate with a host device. In such an arrangement, any suitable type of host electronic device and wearable wireless electronic device can be used. The use of a wireless host such as a cellular phone, computer, or watch will sometimes be illustrated as an example in this specification. Additionally, any suitable wearable wireless electronic device can wirelessly communicate with a wireless host. The use of a wireless earbud for communicating with a wireless host is only an illustration.

[0069] Wireless communication can occur between a wireless electronic device host and an accessory device such as an earbud. Regarding this, Figure 1 is a structural diagram of an exemplary system including an electronic device that wirelessly communicates with a wearable electronic device such as the wireless earbud of this specification.

[0070] Referring to Figure 1 , the host electronic device 100a can be a mobile terminal that performs wireless communication or a wearable device different from the wireless earbud, but is not limited thereto. The host electronic device 100a can be embodied by any electronic device that wirelessly communicates with the wireless earbud, such as a computer, a lightweight computer, a content playback device for a home network, or a communication device for a vehicle.

[0071] The wireless earbud 100 is composed of various components. In this regard, the wireless earbud 100 includes an antenna module 200, an RF circuit 10, and a sensor module 20. The wireless earbud 100 also includes a control circuit 30, a battery 40, and a speaker 50. On the other hand, the host electronic device 100a includes an antenna module 200a and an RF circuit 10a to perform wireless communication with the earbud 100. The host electronic device 100a also includes a sensor module 20, a control circuit 30, a battery 40, and a speaker 50, but is not limited thereto. The host electronic device 100a also includes more components than the earbud 100.

[0072] The antenna module 200 is configured to receive a wireless signal including voice content from the host electronic device 100a. The antenna module 200 is configured to receive a wireless signal in the Bluetooth band, for example, in the 2.4 to 2.488 GHz band, from the host electronic device 100a. In this regard, the wireless communication link between the host electronic device 100a and the earbud 100 is not limited to Bluetooth communication. Any wireless communication link that supports short-range wireless communication between the host electronic device 100a and the earbud 100 can be used, such as a short-range wireless communication link in the 2.4 GHz, 5 GHz, or other bands. Depending on the application, a wireless communication link in the mobile communication band that supports IoT wireless communication or a wireless communication link in the millimeter wave band can also be used.

[0073] In addition, when a user input is applied through an operation button provided on the earbud 100, a control command is transmitted to the host electronic device 100a through the antenna module 200 to control the playback of the voice content, the volume, etc. The antenna module 200a of the host electronic device 100a receives a wireless signal including the control command from the Bluetooth band.

[0074] The antenna module 200 is operably coupled to the RF circuit 10. The antenna module 200 is connected to the signal pattern of the RF circuit 10 through a power supply unit FP. The antenna module 200 is connected to the ground pattern of the RF circuit 10 through a ground connection unit GP. The RF circuit 10 is configured to amplify, filter, and process the signals transmitted and received through the antenna module 200.

[0075] The sensor module 20 is configured to include at least one sensor. The sensor module 20 includes a proximity sensor capable of sensing the movement and proximity of the user, a touch sensor capable of sensing the user input, a pressure sensor, etc., but is not limited thereto. The sensor module 20 may also include an acceleration sensor, a gyroscope sensor, etc.

[0076] The control circuit 30 is operably coupled to the sensor module 20, the battery 40, and the speaker 50. The control circuit 30 is configured to control the operations of the sensor module 20, the battery 40, and the speaker 50.

[0077] The battery 40 is configured to supply power to each of the electronic components disposed inside the earbud 100. The battery 40 is configured to store power when receiving power from a charger and supply power to each of the electronic components. The speaker 50 is configured to reproduce the voice content received from the host electronic device 100a.

[0078] On the other hand, the earbud 100 of the present specification is formed in an appliance structure having a housing form, and a port such as a speaker port is formed on the outside. Regarding this, an antenna module capable of receiving or transmitting a wireless signal in the earbud 100 is disposed inside the housing. Regarding this, Figure 2 and Figure 3 A front perspective view and a rear perspective view of the earbud of the present specification are shown.

[0079] Referring to Figure 2 the front perspective view, the earbud 100 is divided into a front 100F and a rear 100R with respect to an axis. The housing 120 includes a main body portion 120b in which a speaker port 120a is formed. The speaker port 120a is formed to face the front of the earbud 100. An elongated protruding portion such as a stem portion 122 of the housing 120 extends outward from the main housing portion 120b. The stem portion 122 is formed as an elongated protruding portion having a predetermined length L and a diameter D.

[0080] The main body portion 120b has a shape that matches the user's ear. The speaker 20 is mounted to the main body portion 120b and aligned with the speaker port 120a. The speaker 20 is used to provide sound to the user's ear. The speaker port 120a is formed from one or more openings in the housing 120. One or more plastic or metal mesh layers are interposed between the speaker 20 and the opening of the housing 120.

[0081] The housing 120 is formed of metal, plastic, carbon fiber composite material, or other fiber composite material, glass, ceramic, other materials, or a combination of these materials. The elongated shape of the ear stem 122 allows the user to grasp the earbud 100 on the ear with the hand. The stem 122 extends from the main body portion 120b at the rear 100R of the housing 120 and extends along the stem axis 120 in the length direction. Depending on the application, the stem 122 may be formed in a curved shape in addition to a straight shape.

[0082] Figure 3 Shows Figure 2 A rear perspective view of the earbud 100. As Figure 3 shown, the antenna 200 has an elongated shape extending along an axis parallel to the length of the stem 122. The antenna 200 is formed from the power supply unit 108 to the lower region of the stem 122, but is not limited thereto.

[0083] Referring Figures 1 to 3 , the antenna 200 is formed by overlapping structures such as the battery 26 and other conductive components located in the inner region 124 of the housing 120. Such structures include conductive materials that tend to shield the antenna 200.

[0084] The antenna power supply unit 108 may be located not at a position overlapping the region 124 of the main body unit 120b, but at the joint 12J of the housing 120 between the main body unit 120b and the stem 122. Compared with arranging the position of the antenna power supply unit at the first position 108' such as the main body unit 120b, arranging the position of the antenna power supply unit at the second position 108 such as the joint point 120J is beneficial to minimizing unnecessary radiation and current consumption generated on other ground plane layers. By minimizing such unnecessary radiation and current consumption, the current consumption of the battery can be reduced and the antenna efficiency can be improved.

[0085] The antenna 200 is formed by a patterned metal pattern or metal trace on a printed circuit board (PCB). In addition to a rigid substrate, the PCB is composed of a flexible printed circuit board (FPCB) (for example: a printed circuit formed of a sheet of polyimide or other polymer substrate material).

[0086] Next, a structure for performing wireless communication between a radiator disposed inside the earbud of the present specification and an external electronic device of the earbud will be described. The external electronic device of the earbud corresponds to Figure 1 the host electronic device 100a, and the earbud corresponds to Figure 1 the earbud 100, and wireless communication is performed with the host electronic device 100a through the antenna module 200. The earbud is a kind of electronic device that receives content from the host electronic device through wireless communication. The earbud can be called TWS (True Wireless Stereo). The radiator structure disposed inside the earbud for performing wireless communication with the host electronic device will be described in detail.

[0087] Regarding this, Figure 4a and Figure 4b show components including a conductive pattern and an appliance structure disposed inside the earbud headset described in this specification from different sides. Referring to Figures 2 to 4b , the earbud headset 100 includes a housing 120, a radiator 200, and a printed circuit board (PCB, 150). The radiator 200 radiates a wireless signal to wirelessly communicate with an electronic device outside the earbud headset 100. Since the radiator 200 transmits and receives wireless signals, it can be referred to as the antenna 200.

[0088] The housing 120 includes a main body portion (120b) including a speaker port 120a and a stoke (122) extending from the main body portion. The radiator 200 is configured to be disposed inside the stoke 122 to radiate a wireless signal to the outside of the earbud headset 100. The PCB 150 is configured to be electrically connected to the radiator.

[0089] The radiator 200 includes a first conductive pattern 210 and a second conductive pattern 220. The radiator 200 also includes a connection portion 250. The connection portion 250 can be embodied by an RF cable such as a coaxial cable, but is not limited thereto. The first conductive pattern 210 is formed on a first surface inside the stoke 122. The second conductive pattern 220 is formed on a second surface perpendicular to the first surface inside the stoke 122. The connection portion 250 is configured to electrically connect the first conductive pattern 210 and the PCB 150.

[0090] The first conductive pattern 210 and the connection portion 250 are configured to radiate a signal in a first frequency band. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate a signal in a second frequency band different from the first frequency band. As an example, the second frequency band may be a frequency band higher than the first frequency band, but is not limited thereto.

[0091] The connection portion 250 is configured to include a signal line 251 formed on the inside, a dielectric 252, and a ground portion 253. The connection portion 250 is embodied by a coaxial cable including the signal line 251, the dielectric 252, and the ground portion 253, but is not limited thereto. The signal line 251 of the coaxial cable 250 is connected to the first conductive pattern 210. The signal line 251 of the coaxial cable 250 is connected to the power supply connection portion FP of the first conductive pattern 210. The ground portion 253 of the coaxial cable 250 is connected to the ground portion of the PCB 150. The ground portion 253 of the coaxial cable 250 is connected to the first conductive pattern 210. The ground portion 253 of the coaxial cable 250 is connected to the ground connection portion GP of the first conductive pattern 210.

[0092] The ground portion 253 of the coaxial cable 250 disposed horizontally with respect to the first conductive pattern 210 radiates a first signal in the first frequency band and operates as a radiator. The ground portion 253 of the coaxial cable 250 is disposed parallel to the first conductive pattern 210 in the lower region of the first conductive pattern 210.

[0093] The second conductive pattern 220 includes a touch sensor. The first conductive pattern 210 and the second conductive pattern 220 are substantially formed in a vertical plane to a predetermined length. The first conductive pattern 210 is formed to a first length in the first axial direction of the handle. The second conductive pattern 210 is formed to a second length in the first axial direction. The first length of the first conductive pattern 210 is formed to be within a predetermined range based on 14.6 mm, but is not limited thereto. The second length of the second conductive pattern 210 is formed to be within a predetermined range based on 13.6 mm, but is not limited thereto. The radiator 200 further includes a fourth conductive pattern 240. The fourth conductive pattern 240 disposed on the third surface includes a force sensor 241. As Figure 6 shown, the fourth conductive pattern 240 provided with the force sensor 241 is disposed inside the dielectric housing 240c.

[0094] The first conductive pattern 210 and the coaxial cable 250 are configured to radiate signals in the first frequency band. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate signals in a second frequency band higher than the first frequency band. The first frequency band may be a frequency band having a center frequency of 2.3 GHz to perform Bluetooth communication with an electronic device, but is not limited thereto. The second frequency band may be a frequency band having a center frequency of 2.6 GHz to perform Bluetooth communication, but is not limited thereto.

[0095] Regarding this, Figure 5a in the reflection coefficient characteristics generated by the frequency of the earbud headphones according to the radiator structure in which Figure 4a and Figure 4b are internally disposed and the reflection coefficient characteristics of the radiator structure having a single conductive pattern are compared. Figure 5b and Figure 5c show the change in the reflection coefficient that occurs according to the change in the form of the RF cable and the FPCB in the antenna structures of the single mode and the dual mode.

[0096] Referring to Figure 4a and Figure 4b , through the first conductive pattern 210 and the second conductive pattern 220 substantially formed in a vertical plane and the coaxial cable 250 connected to the first conductive pattern 210, the earbud headphones transmit and receive wireless signals in a wide frequency band range. Referring to Figures 2 to 5a, the radiator 200 having the first conductive pattern 210, the second conductive pattern 220, and the connection portion 240 operates as an antenna having dual resonance characteristics in the first band and the second band. On the contrary, the radiator structure having a single conductive pattern operates as an antenna having a single resonance characteristic in the band between the first band and the second band.

[0097] Regarding this, the first conductive pattern 210 formed on the first surface and the coaxial cable 250 formed on the first surface are configured to radiate the first signal in the first band. On the other hand, the first conductive pattern 210 and the second conductive pattern 220 formed on the second surface perpendicular to the first surface are configured to radiate the second signal in the second band. As an example, the first band is the 2.3 GHz band, and the second band is a band higher than the first band, but it is not limited thereto. As an example, the second band may be the 2.55 GHz band or the 2.6 GHz band, but it is not limited thereto.

[0098] On the other hand, the antenna structure inside the earphone of the present specification is formed in a structure in which flexible printed circuit boards (FPCBs) for arranging a plurality of electronic components are connected to each other. Regarding this, the FPCB 160 disposed on the upper part of the PCB 150 is connected to the second FPCB 162. The ground patterns of the FPCB 160 and the second FPCB 162 are connected to each other. A plurality of proximity sensors 121a are provided on the side surface of the second FPCB 162, and a voice pickup unit (VPU, 121b) is disposed between the proximity sensors 121a. One end of the connection FPCB 164 connected to the PCB 150 is connected to the FPC B160.

[0099] On the other hand, referring to Figure 5a , the operating frequency of the antenna provided in the earphone that performs wireless communication via Bluetooth is configured to have a specified bandwidth with a center frequency of about 2.45 GHz. Regarding this, the operating bandwidth BW1 of the antenna operating in a single band is set to about 100 MHz. The bandwidth of wireless communication via Bluetooth is set to about 2.4 to 2.4835 GHz. The operating bandwidth BW1 of the antenna set to about 100 MHz covers the bandwidth for performing Bluetooth wireless communication. However, due to the manufacturing deviation of the antenna provided inside the earphone or the possible change in antenna performance when inserted into the ear and used. Thus, there is a problem that it is difficult to apply an antenna having a bandwidth of about 100 MHz to the earphone.

[0100] On the other hand, the operating bandwidth BW2 of the antenna of this specification that operates in a multi-layer frequency band is set to about 400 MHz or more. Regarding this, the operating frequency of the antenna of this specification is about 2.25 to 2.6 GHz, and accordingly the operating bandwidth BW2 is set to about 450 MHz. Therefore, the antenna with dual-band resonance characteristics of this specification can be applied to in-ear headphones. Regarding this, even if there are manufacturing deviations of the antenna arranged inside the in-ear headphones or antenna performance changes occur when used after being inserted into the ear, the in-ear headphones can be stably used.

[0101] Specifically, antenna performance changes can be caused by 1) the dielectric constant deviation of the structure arranged inside the in-ear headphones, 2) the assembly deviation of the structure arranged inside the in-ear headphones, and 3) the environmental deviation of the user when using the in-ear headphones. For example, an antenna resonance frequency deviation of about 45 to 90 MHz is caused by a dielectric constant deviation of about 5 to 10%. The assembly deviation caused by the flexible circuit board arranged inside the in-ear headphones may be larger than other component assembly deviations. For example, an antenna resonance frequency deviation of about 170 MHz is caused by the form and configuration error of the assembled FPCB. Therefore, this specification discloses a broadband antenna structure arranged inside the in-ear headphones with a bandwidth of about 400 MHz or more. For this purpose, this specification discloses a dual-mode broadband antenna structure that operates in a first mode in a low-frequency band, i.e., the first frequency band, and operates in a second mode in a high-frequency band, i.e., the second frequency band.

[0102] On the other hand, in Figure 4a and Figure 4b In the antenna structure inside the in-ear headphones shown like this, antenna performance changes may occur according to the form changes of the FPCB and RF cable and the use environment. Regarding this, Figure 5b shows the reflection coefficient change caused by the form changes of the RF cable and FPCB in a single-mode antenna structure of the first conductive pattern only formed inside the in-ear headphones of Figure 4a and Figure 4b . Figure 5c shows the reflection coefficient change according to the form changes of the RF cable and FPCB in a dual-mode antenna structure with the first conductive pattern and the second conductive pattern connected to the RF cable inside the in-ear headphones equipped with Figure 4a and Figure 4b .

[0103] Referring to Figure 4a , Figure 4b and Figure 5b(a), according to the shape change and shaking of FPCB160, 162, the resonant frequency of the single mode antenna changes from a frequency lower than 2.2 GHz to a frequency higher than 2.6 GHz. In this regard, according to the shape change and shaking of FPCB160, 162, the resonant frequency moves by about 0.4 GHz. Figure 4a , Figure 4b and Figure 5b (b), the resonant frequency of the single mode antenna changes from about 2.45 GHz to a lower frequency, i.e., 2.3 GHz, according to the shape change and shaking of the RF cable 240. In this regard, the resonant frequency moves by about 0.2 GHz according to the shape change and shaking of the RF cable 240. Therefore, considering the shape change and shaking of the RF cable 240 and the FPCB 160, 162, the resonant frequency of the single mode antenna changes by about 0.4 GHz + 0.2 GHz = 0.6 GHz.

[0104] Reference Figure 4a , Figure 4b and Figure 5c (a) of the present invention, the dual-mode antenna 200 is designed to perform dual resonance in the approximately 2.3 GHz band and the 2.6 GHz band. Figure 4a , Figure 4b and Figure 5c (b), according to the shape change and shaking of the RF cable 240 and FPCB160, 162, the antenna operation frequency band is changed to about 2.2 GHz band and 2.4 GHz band. Therefore, even considering the shape change and shaking of the RF cable 240 and FPCB160, 162, the degree of change of the resonant frequency of the dual-mode antenna 200 is reduced compared with the single-mode antenna. In addition to the radiation contribution component generated by the first conductive pattern 210 in the first frequency band and the second frequency band, the dual-mode antenna 200 also has a radiation contribution component generated by the connecting part and other conductive patterns. Therefore, compared with the single-mode antenna, the dual-mode antenna 200 has less resonant frequency change caused by other environmental changes such as shape change and shaking of the cable 240 and FPCB160, 162.

[0105] On the other hand, when performing wideband operation as in the dual-mode antenna 200, it is necessary to minimize the change in resonant frequency caused by the shape change and shaking of the connection structure. In order to minimize the movement of the resonant frequency caused by the shape change and shaking of the FPCB 160, 162, the FPCB 160, 162 is attached to a support structure such as the metal frame 165 by an adhesive tape. In order to minimize the movement of the resonant frequency caused by the shape change and shaking of the RF cable 240, a guide structure is provided to guide the RF cable 240.

[0106] On the other hand, the radiator structure disposed inside the in-ear headphones described in this specification needs to operate in a frequency band for UWB (ultra-wide band) communication in addition to the Bluetooth band. Regarding this, the wireless in-ear headphones are designed to receive wireless signals through a Bluetooth band with a certain bandwidth centered at approximately 2.45 GHz. Regarding this, it is necessary to design the operational bandwidth of the antenna provided in the wireless in-ear headphones to be wider than that of other electronic devices that perform wireless communication through the Bluetooth band. Because when wearing the wireless in-ear headphones, the antenna resonance frequency changes as the body moves or the wireless in-ear headphones move within the space inside the ear. In addition, the antenna configuration space inside the appliance of the wireless in-ear headphones is narrow, so the change in antenna performance caused by manufacturing deviations is sensitive. Therefore, it is necessary to embody an electronic device such as a wireless in-ear headphone with an improved antenna and control circuit.

[0107] In addition, in an ISM (Industry-Science-Medical) band such as the Bluetooth band, the propagation quality temporarily decreases in a densely populated area with many users, resulting in a temporary decrease in the reproduction quality when reproducing content. To solve such a problem, the content can be reproduced by receiving wireless signals through Wi-Fi and / or UWB (ultra-wide band). In the limited space inside the appliance structure of the wireless in-ear headphones, there is a problem that it is difficult to embody an antenna structure that can operate in both the Bluetooth band and the UWB band. Regarding this, the antenna structure (radiator structure) needs to be embodied to cover the frequency band from 6.25 to 8.25 GHz. The antenna structure needs to be embodied to cover the frequency band from 6.25 to 10 GHz for UWB communication services in each wireless channel. In addition, the antenna structure needs to be embodied to resonate in the Bluetooth band and the UWB band under the appliance structure of a single unibody.

[0108] Regarding this, Figure 6 shows a radiator structure formed by a plurality of conductive patterns inside the in-ear headphones described in this specification. In Figure 6 the conductive pattern of the radiator structure has one or more slit regions. Figure 7 shows Figure 6 a side view and a front view of the radiator structure of Figure 7 The (a) of Figure 6 shows a side view of the radiator structure of Figure 7 and the (b) of Figure 6 shows a front view of the radiator structure of

[0109] Refer to Figures 2 to 4b andFigure 6 and Figure 7 , the in-ear headphone 100 of this specification will be described. The in-ear headphone 100 includes a housing 120, a printed circuit board (PCB) 150, a dielectric structure 201, and a radiator 200. The dielectric structure 201 is formed by a dielectric injection, and the radiator 200 embodied by a plurality of conductive patterns can be referred to as an antenna.

[0110] The housing 120 includes a main body portion 120b having a speaker port 120a and a stoke 122 extending from the main body portion 120b. The dielectric structure 201 is disposed inside the stoke 122. The dielectric structure 201 is formed to include a front surface, a back surface, and side surfaces. The front surface of the dielectric structure 201 is referred to as the first surface, and one side surface and the other side surface of the dielectric structure 201 are referred to as the second surface and the third surface, respectively. The radiator 200 is configured to be formed on the dielectric structure 201 to radiate wireless signals to the outside of the in-ear headphone 100. The PCB 150 is configured to be electrically connected to the radiator 200.

[0111] The radiator 200 is composed of a plurality of conductive patterns. The radiator 200 is composed of a first conductive pattern 210 and a second conductive pattern 220, whereby it can operate in a first frequency band and a second frequency band of the Bluetooth band. The radiator 200 is composed of a first conductive pattern 210, a second conductive pattern 220, and a fourth conductive pattern 230, whereby it can not only operate in the Bluetooth band but also operate in the UWB band. The radiator 200 is composed of a first conductive pattern 210 to a fourth conductive pattern 240, whereby it can not only operate in the Bluetooth band but also operate in the UWB band. Through the first conductive pattern 210 to the fourth conductive pattern 240 and the gap region 210s, the radiator 200 can not only operate in the Bluetooth band but also operate in the UWB band.

[0112] The first conductive pattern 210 is formed on the first surface S1 of the dielectric structure 201. The first conductive pattern 210 is formed on the second surface S2 perpendicular to the first surface S1 of the dielectric structure 201. The coaxial cable 250 is configured to electrically connect the first conductive pattern 210 and the PCB 150. A third conductive pattern 230 is formed on the third surface S3 that is perpendicular to the first surface S1 of the dielectric structure 201 and opposite to the second surface S2. The third conductive pattern 230 is connected to the first conductive pattern 210 to form a first radiation structure that operates in the first frequency band of the radiator 200. The third conductive pattern 230 is configured to include a power supply connection pattern 230f and a ground connection pattern 230g. The third conductive pattern 230 is connected to the first conductive pattern 210, and together with the second conductive pattern 220 spaced apart from the first conductive pattern 210, forms a second radiation structure that operates in the second frequency band of the radiator 200.

[0113] A fourth conductive pattern 240 is disposed on the third surface S3 of the dielectric structure 201. The fourth conductive pattern 240 is disposed adjacent to the power supply connection pattern 230f of the third conductive pattern 230. At least a partial region of the first conductive pattern 210 on the first surface S1 of the dielectric structure 201 and the third conductive pattern 230 on the third surface S3 of the dielectric structure 201 is removed to form a slot region 210s.

[0114] The first conductive pattern 210 and the coaxial cable 250 are configured as a first radiation structure to radiate signals in the first frequency band. The first conductive pattern 210 and the second conductive pattern 220 are configured as a second radiation structure to radiate signals in a second frequency band different from the first frequency band. Herein, the first conductive pattern 210 formed on the first surface S1 of the dielectric structure 210 and the third conductive pattern 230 formed on the third surface S3 of the dielectric structure 201 are formed integrally. The fourth conductive pattern 240 and the slot region 210s are configured as a third radiation structure to radiate signals in a third frequency band higher than the first and second frequency bands.

[0115] A slot region 210s is formed between the power supply connection pattern 230f and the ground connection pattern 230g. The slot region 210s is formed to have a first length L1 on one axis and a first width W1 on the other axis on the first surface S1 of the dielectric structure 201. The power supply connection pattern 230f of the third conductive pattern 230 is connected to the signal line 251 of the coaxial cable 250. The ground connection pattern 230g of the third conductive pattern 230 is connected to the ground structure 150g of the second PCB 150b. The coaxial cable 250 is disposed below the dielectric structure 201. The second PCB 150b is disposed below the dielectric structure 201.

[0116] The radiator 200 of the earplug headphone 100 is composed of a plurality of conductive patterns and a plurality of slit regions. In this regard, the radiator 200 is configured to include two or more regions among the slit region 210s, the second slit region 220s, the third slit region 230s, and the fourth slit region 240s.

[0117] On one axis, the second slit region 220s is formed at the same position as the slit region 210s. On another axis, the third slit region 230s is formed on the first surface S1 of the dielectric structure 201 at a distance from the slit region 210s. On another axis, the fourth slit region 240s is formed on the first surface S1 and the third surface S3 of the dielectric structure 201 at a distance from the slit region 210s.

[0118] In another axial direction, the first slit region 210s and the second slit region 220s are formed at a distance from the second length L2 on the end of the first conductive pattern 210 adjacent to the end of the handle 122. The second length L2 from the end of the first conductive pattern 210 to one end of the first slit region 210s and the second slit region 220s is formed to be within a specified range based on 4.4 mm.

[0119] In another axial direction, the length of the third slit region 230s is formed to be a third length L3 shorter than the second length L2. The third length L3 to one end of the third slit region 230s is formed to be within the range of 2.4 to 2.75 mm. In another axial direction, the length from one end of the fourth slit region 240s to the end of the first conductive pattern 210s is formed to be a fourth length L4 shorter than the second length L2. The fourth length L4 to one end of the fourth slit region 240s is formed to be within a specified range based on 2.8 mm.

[0120] The first conductive pattern 210 is formed to have a length Lp1 of the first pattern in the first axial direction of the handle. The second conductive pattern 220 is formed to have a length Lp2 of the second pattern in the first axial direction of the handle. The signal line 251 of the coaxial cable 250 is connected to the first conductive pattern 210. The ground portion 253 of the coaxial cable 250 is connected to the ground portion of the PCB 150. The first conductive pattern 210 and the coaxial cable 250 are configured to radiate signals in the first frequency band. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate signals in a second frequency band different from the first frequency band.

[0121] The length Lp1 of the first pattern of the first conductive pattern 210 is formed to be within a specified range based on 14.6 mm, but is not limited thereto. The length Lp2 of the second pattern of the second conductive pattern 210 is formed to be within the range of 8 mm to 14.6 mm, but is not limited thereto. The length Lp2 of the second pattern of the second conductive pattern 210 is formed to be within a specified range based on 13.6 mm, but is not limited thereto. The first frequency band is set to a band having a center frequency of 2.3 GHz to perform Bluetooth communication with an electronic device. The second frequency band is set to a band having a center frequency of 2.6 GHz to perform Bluetooth communication.

[0122] The fourth conductive pattern 240 formed on the third surface S3 of the dielectric structure 201 opposite to the second conductive pattern 220 includes a force sensor 251 or a pressure sensor. The fourth conductive pattern 240 is disposed between the other end of the sub-pattern 231 of the third conductive pattern 230 and one end of the power supply connection pattern 230f. The sub-pattern 231 of the third conductive pattern 230 and the power supply connection pattern 230f are formed on the third surface S3 of the dielectric structure 201.

[0123] The third conductive pattern 230 disposed on the third surface S3 of the dielectric structure 201 is formed in an optimal shape in consideration of the operating frequency band of the radiator 200. The third conductive pattern 230 is composed of a sub-pattern 231, a power supply connection pattern 230f, and a ground connection pattern 230g. The third conductive pattern 230 is composed of a sub-pattern 231, a second sub-pattern 232, a power supply connection pattern 230f, and a ground connection pattern 230g.

[0124] The sub-pattern 231 of the third conductive pattern 230 is disposed at a distance from one end of the fourth conductive pattern 240. The power supply connection pattern 230f of the third conductive pattern 230 is disposed at a distance from the other end of the fourth conductive pattern 240. The power supply connection pattern 230f of the third conductive pattern 230 is connected to a power supply terminal or a signal pattern of the PCB 150. The ground connection pattern 230g of the third conductive pattern 230 is disposed at a distance from the power supply connection pattern 230f through the gap region 210s. The gap region 210s is formed between the power supply connection pattern 230f and the ground connection pattern 230g of the third conductive pattern 230.

[0125] The second sub-pattern 232 of the third conductive pattern 230 is disposed at a distance from the ground connection pattern 230g through the fourth gap region 240s. The fourth gap region 240s is formed between the ground connection pattern 230g and the second sub-pattern 232 of the third conductive pattern 230.

[0126] The third conductive pattern 230 formed on the third surface S3 of the dielectric structure 201 and the slot region 210s are configured to radiate signals in a third frequency band higher than the second frequency band. The third conductive pattern 230 and the slot region 210s are configured to perform dual resonance in the 7 GHz and 10 GHz frequency bands for UWB communication.

[0127] On the other hand, the radiator 200 of the earphone in this specification forms a plurality of slot regions so that the frequency band for UWB communication becomes a wider frequency band. Regarding this, the third conductive pattern 230 formed on the third surface S3 of the dielectric structure 201 and the plurality of slot regions formed in the first conductive pattern 210 and the third conductive pattern 230 are configured to radiate signals in a third frequency band higher than the second frequency band. The third conductive pattern 230, the slot region 210s, the second slot region 220s, the third slot region 230s, and the fourth slot region 240s are configured to radiate signals in the third frequency band.

[0128] The third conductive pattern 230, the slot region 210s, the second slot region 220s, the third slot region 230s, and the fourth slot region 240s are configured to perform multi-layer resonance in the 6 GHz to 10 GHz frequency band for UWB communication.

[0129] The coaxial cable 250 includes a signal line 251, a dielectric 252, and a ground portion 253 formed on the inside. The signal line 251 of the coaxial cable 250 is connected to the first conductive pattern 210. The signal line 251 of the coaxial cable 250 is connected to the power supply connection portion FP of the first conductive pattern 210. The ground portion 253 of the coaxial cable 250 is connected to the ground portion of the PCB 150. The ground portion 253 of the coaxial cable 250 is connected to a position of the first conductive pattern 210. The ground portion 253 of the coaxial cable 250 is connected to the ground connection portion GP of the first conductive pattern 210.

[0130] The ground portion 253 of the coaxial cable 250 disposed horizontally with respect to the first conductive pattern 210 radiates a first signal in the first frequency band and operates as a radiator. The ground portion 253 of the coaxial cable 250 is disposed in parallel with the first conductive pattern 210 in the lower region of the first conductive pattern 210.

[0131] The second conductive pattern 220 includes a touch sensor. The first conductive pattern 210 and the second conductive pattern 220 are formed to have a predetermined length on substantially perpendicular surfaces. The first conductive pattern 210 is formed to have a first length in the first axial direction of the handle. The second conductive pattern 210 is formed to have a second length in the first axial direction. The first length of the first conductive pattern 210 is formed to be within a predetermined range based on 14.6 mm, but is not limited thereto. The second length of the second conductive pattern 210 is formed to be within a predetermined range based on 13.6 mm, but is not limited thereto.

[0132] As described above, the first conductive pattern 210 and the coaxial cable 250 are configured to radiate a first signal in the first frequency band. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate signals in a second frequency band different from the first frequency band. The first frequency band is a band having a center frequency of 2.3 GHz and performs Bluetooth communication with an electronic device. The second frequency band is a band having a center frequency of 2.6 GHz and performs Bluetooth communication. The fourth conductive pattern 240 and the slit region 210s are configured to radiate signals in a third frequency band higher than the first frequency band and the second frequency band. The third frequency band is configured to include a 6 GHz band, a 7 GHz band, or a 10 GHz band for performing UWB communication.

[0133] The first conductive pattern 210 formed on the first surface S1 of the dielectric structure 201 and the coaxial cable 250 formed on the first surface S1 are configured to radiate a first signal in the first frequency band. The first conductive pattern 210 and the second conductive pattern 220 formed on the second surface S2 perpendicular to the first surface S1 are configured to radiate a second signal in the second frequency band. One end of the first conductive pattern 210 and one end of the second conductive pattern 220 are formed to be spaced apart. The current formed in the first conductive pattern 210 is coupled to the second conductive pattern 220 in the second frequency band.

[0134] A first current and a second current are respectively generated on the first conductive pattern 210 and the second conductive pattern 220. The first direction of the first current of the first conductive pattern 210 and the coaxial cable 250 formed on the first surface is orthogonal to the second direction of the second current of the second conductive pattern 220 formed on the second surface perpendicular to the first surface. Here, the first direction of the first current formed on the first surface is the x-axis direction or the y-axis direction on the first conductive pattern 210. On the other hand, the second direction of the second current formed on the second surface is the z-axis direction on the second conductive pattern 220. Accordingly, the radiator 200 operates in a wide frequency band in the first frequency band and the second frequency band.

[0135] The signal pattern of the first conductive pattern 210 is formed as a conductive pattern of a specified shape to radiate signals in the first frequency band and the second frequency band. The ground pattern of the first conductive pattern 210 is electrically connected to the ground portion of the coaxial cable 250. The signal pattern of the second conductive pattern 220 is formed as a conductive pattern of a specified shape to radiate signals in the second frequency band and operate as a touch sensor. The ground pattern of the second conductive pattern 220 is electrically connected to the ground portion of the coaxial cable 250. The signal pattern of the fourth conductive pattern 240 is formed as a conductive pattern of a specified shape to operate as a force sensor. Alternatively, the force sensor 241 is disposed on the substrate, and the fourth conductive pattern 240 is formed on the front surface of the substrate. The ground pattern of the fourth conductive pattern 240 is electrically connected to the ground portion of the coaxial cable 250.

[0136] On the other hand, the radiator 200 provided in the earphone of the present specification is embodied by the first conductive pattern 210 in which a slit region 210s formed of a plurality of slit regions is formed and a conductive pattern connected thereto. Regarding this, Figure 8 The radiator structure and reflection coefficient embodied by the first conductive pattern in which a slit region formed of a plurality of slit regions is formed are shown.

[0137] Unlike Figures 6 to 7 the radiator 200 of (b), Figure 8 the radiator 200b of (a) is embodied by the first conductive pattern 210 in which a slit region 210s formed of a plurality of slit regions is formed. Referring to Figures 6 to 8 (a) of, the radiator 200b includes the first conductive pattern 210, the second conductive pattern 220 including a touch sensor, and the third conductive pattern 230 connected to the first conductive pattern 210. The radiator 200b is embodied without the fourth conductive pattern 240 in which the force sensor 241 is disposed. Regarding this, in a structure without a force sensor, even if there are conductive patterns and slit regions for the UWB radiator, there may be no resonance point in the UWB frequency band. In addition, even if there is a force sensor, if there are no conductive patterns and slit regions for the UWB radiator, there may be no resonance point in the UWB frequency band.

[0138] Referring to Figures 4a to 8In (b), the first conductive pattern 210 and the coaxial cable 250 are configured to radiate a first signal in a first frequency band. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate a signal in a second frequency band different from the first frequency band. On the other hand, it can be configured to radiate a signal in a third frequency band through the slit regions (210s to 240s) of the first conductive pattern 210. However, the radiator 200b cannot be configured to completely cover the entire frequency band for UWB communication, that is, the 6 GHz to 10 GHz or 7 GHz to 10 GHz frequency band, in the absence of the fourth conductive pattern 240 where the force sensor 241 is disposed.

[0139] On the other hand, in order to optimize the number of slit regions of the radiator structure of the wireless earphone of the present specification for antenna performance. Regarding this, Figure 9a shows Figure 6 a structure in which one slit region is formed in the radiator structure. Figure 9b shows in Figure 6 a structure in which multiple slit regions are formed in the radiator structure.

[0140] Figure 10a shows Figure 9a the reflection coefficient characteristics of each frequency band in the radiator structure. Figure 10a In (a) of, it shows the reflection coefficient characteristics of the radiator 200a structure in the Bluetooth frequency band including the first frequency band and the second frequency band. Figure 10a In (b) of, it shows the reflection coefficient characteristics of the radiator 200a structure in the UWB frequency band including the third frequency band. Figure 10a In (c) of, it shows the reflection coefficient characteristics of the radiator 200a structure in the entire frequency band including the first to third frequency bands.

[0141] Figure 10b shows Figure 9b the reflection coefficient characteristics of each frequency band in the radiator structure. Figure 10a In (b) of, it shows the reflection coefficient characteristics of the radiator 200 structure in the Bluetooth frequency band including the first frequency band and the second frequency band. Figure 10b In (b) of, it shows the reflection coefficient characteristics of the radiator 200 structure in the UWB frequency band including the third frequency band. Figure 10b In (c) of, it shows the reflection coefficient characteristics of the radiator 200 structure in the entire frequency band including the first to third frequency bands.

[0142] Referring to Figure 6 , Figure 7 and Figure 9a , the radiator 200a is composed of a first conductive pattern 210 in which a first slit region 210s is formed, a second conductive pattern 220, a fourth conductive pattern 240, and a coaxial cable 250. Referring to Figure 6 ,Figure 7 , Figure 9a and Figure 10a , inside the dielectric housing 241, with respect to the fourth conductive pattern 240, the first conductive pattern 210 and the coaxial cable 250 are configured to radiate signals in the first frequency band centered at 2.33 GHz. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate signals in the second frequency band centered at 2.53 GHz. The fourth conductive pattern 240 and the first slot region 210s are configured to resonate doubly and radiate signals in the third frequency band. In this regard, the fourth conductive pattern 240 and the slot region 210s are configured to resonate doubly centered at 7.2 GHz and 10 GHz.

[0143] Refer to Figure 6 , Figure 7 and Figure 9b , the radiator 200 includes the first conductive pattern 210, the second conductive pattern 220, the fourth conductive pattern 240, and the coaxial cable 250 formed with the first to fourth slot regions (210s to 240s). A part of the first slot region 210s and the fourth slot region 240s is formed in the third conductive pattern 230 connected to the first conductive pattern 210. Refer to Figure 6 , Figure 7 , Figure 9b and Figure 10b , the first conductive pattern 210 and the coaxial cable 250 are configured to radiate signals in the first frequency band centered at 2.2 GHz. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate signals in the second frequency band centered at 2.55 GHz.

[0144] Refer to Figure 9a and Figure 9b , the force sensor operates as a source of the conductive pattern and the excitation slot region that operates as a radiator in the UWB frequency band.

[0145] Refer to Figure 6 , Figure 7 and Figure 9b , the fourth conductive pattern 240 and the first to fourth slot regions (210s to 240s) are configured to resonate multiply and radiate signals in the third frequency band. The fourth conductive pattern 240 and the first to fourth slot regions (210s to 240s) are configured to resonate doubly at 6.3 GHz, 6.7 GHz, and 7.0 GHz. The fourth conductive pattern 240 and the first to fourth slot regions (210s to 240s) are configured to resonate doubly centered at 8.5 GHz and 9.7 GHz. Therefore, the more the number of slot regions increases, the more the number of multi-resonance points increases, thereby expanding the operating frequency band of the radiator 200.

[0146] On the other hand, a plurality of conductive patterns of the radiator 200 of the earphone of the present specification are configured to be connected to a signal line and / or a ground portion. The radiator and the device structure inside the earphone of the present specification are formed as Figure 11 and Figure 12 shown in the structure.

[0147] Regarding this, Figure 11 shows a single-mode antenna and a device structure inside the earphone. Figure 12 shows a dual-mode antenna and a device structure inside the earphone of the present specification. Regarding this, the single-mode antenna is configured to operate in the Bluetooth band, i.e., the first band and the second band. The dual-mode antenna is configured to operate in the Bluetooth band, i.e., the first band and the second band and the UWB band, i.e., the third band.

[0148] Refer to Figure 9a and Figure 11 , the radiator 200a operating in a single mode inside the earphone includes a first conductive pattern 210 and a second conductive pattern 220 having a touch sensor. The first conductive pattern 210 includes a signal pattern 211 and a ground pattern 212. The second conductive pattern 220 is disposed at a coupled distance from the first conductive pattern 210. One end of the coaxial cable 250 connected to the first conductive pattern 210 is formed by a power supply connection portion FP and is connected at the first position P1. The signal pattern 211 of the first conductive pattern 210 is connected to the ground pattern 212 through a ground connection portion GP. The other end of the coaxial cable 250 connected to the PCB 150 is connected at the second position P2.

[0149] A gap region 210s is formed between the power supply connection portion FP and the ground connection portion GP. As Figure 10a shown, the radiator 200a operating in a single mode is composed of a single-mode antenna that performs double resonance in the first band and the second band. On the other hand, when including a fourth conductive pattern 240 having a force sensor, the fourth conductive pattern 240 and the gap region 210s of the radiator 200a are configured to perform double resonance centered on 7.2 GHz and 10 GHz.

[0150] Refer to Figure 9b and Figure 12, the radiator 200 operating in a dual mode inside the earplug-type earphone includes a first conductive pattern 210, a second conductive pattern 220 having a touch sensor, a fourth conductive pattern 240 having a force sensor, and gap regions (210s to 240s). The first conductive pattern 210 includes a signal pattern 211 and a ground pattern 212. The second conductive pattern 220 is disposed at a spaced-apart position in coupling with the first conductive pattern 210. One end of the coaxial cable 250 connected to the first conductive pattern 210 is formed as a power supply connection portion FP and is connected at the first position P1. The signal pattern 211 of the first conductive pattern 210 is connected to the ground pattern 212 through a ground connection portion GP. The other end of the coaxial cable 250 connected to the PCB 150 is connected at the second position P2.

[0151] A part of the pattern form of the first conductive pattern 210 can be embodied as the pattern form of a UWB antenna with less ground effect. For this purpose, a gap region 230s is formed in the first conductive pattern 210. A gap region 210s is formed between the power supply connection portion FP and the ground connection portion GP. The end of the first conductive pattern 210 in which the gap region 230s is formed can form a sub-pattern 213 that operates as a radiator in the UWB band.

[0152] As Figure 10b shown, the radiator 200 is configured as a dual-mode antenna that performs dual resonance in the first and second frequency bands and multi-layer resonance in the third frequency band.

[0153] From the perspective of the UWB pattern, the BT pattern portion can operate as a ground portion. From the perspective of the BT pattern, the UWB pattern portion can operate as a ground portion. When adjusting the BT pattern, in order to minimize the change of the UWB antenna, a UWB antenna with a ground effect below a certain level is applied. Regarding this, a part of the ground pattern 212 of the first conductive pattern 210 is removed to realize UWB antenna patterning. In order to keep the length of the slot mode as much as possible, the shape of the antenna pattern portion of the gap region of the first conductive pattern 210 that is not adjacent to the second conductive pattern 220 provided with the touch sensor is formed to be the same as that of Figure 9a and Figure 11 the antenna pattern portion.

[0154] One end of the PCB 150 is formed adjacent to the end of the ground pattern 212 of the first conductive pattern 210. The FPCB 160 is configured to connect the PCB 150 and the first conductive pattern 210. The second FPCB 162 is disposed in the metal frame 165 that forms the inner side surface region of the curved surface of the main body portion. The FPCB 160 is formed to surround the metal frame 165 that forms the inner side surface region of the curved surface of the main body portion. The second FPCB 162 is also formed to surround the metal frame 165 that forms the inner side surface region of the curved surface of the main body portion.

[0155] On the other hand, the radiator structure of the earbud headphones of the present specification is formed as a single slit structure or a multilayer slit structure. Regarding this, Figure 13 A side view, a perspective view, and a front view of an earbud headphone configured with a conductive pattern formed as a single slit structure are shown. On the other hand, Figure 14 A side view, a perspective view, and a front view of an earbud headphone configured with a conductive pattern formed of a multilayer slit structure are shown.

[0156] Refer to Figure 9a 、 Figure 9b 、 Figure 13 In (a) of Figure 14 and (a) of Figure 13 The first conductive pattern 210 is configured to radiate signals in the Bluetooth band. The first conductive pattern 210 is formed to be connected to the third conductive pattern 230. The power supply connection pattern 230f of the third conductive pattern 230 that forms the slit region 210s is connected to the power supply connection portion FP, which is one end of the coaxial cable 250. The ground connection pattern 230g of the third conductive pattern 230 that forms the slit region 210s is connected to the ground connection portion GP. Inside the dielectric cover 240c of

[0157] Refer to Figure 9a and Figure 13 In (b) of Figure 9b and Figure 14In (b) thereof, the radiator 200 is configured as a multi-layer slot structure. A first slot region 210s is formed on the first conductive pattern 210 and the third conductive pattern 230. A second slot region 220s is formed on the first conductive pattern 210s and is spaced apart from the first slot region 210s in one axial direction. A third slot region 230s is formed on the first conductive pattern 210s and is spaced apart from the first slot region 210s in the other axial direction. A fourth slot region 240s is formed on the first conductive pattern 210 and the third conductive pattern 230 and is spaced apart from the first slot region 210s. The end of the first conductive pattern 210 where the third slot region 230s is formed forms sub-patterns 213a, 213 that operate as radiators in the UWB band. Thus, the radiator 200 is configured to perform multi-layer resonance in the UWB band.

[0158] Refer to Figure 9a and Figure 13 In (c) thereof, the operating band can be expanded to the second band of the Bluetooth band through the first conductive pattern 210 and the second conductive pattern 220. Refer to Figure 9b and Figure 14 In (c) thereof, the operating band is expanded to the second band of the Bluetooth band through the first conductive pattern 210 and the second conductive pattern 220. Regarding this, the second to fourth slot regions (220s to 240s) are added to the first conductive pattern 210 and the third conductive pattern 230, so that the operating band of the second band can be further expanded.

[0159] On the other hand, the operating principle in the UWB band will be described by comparing the current distributions of the radiator structures of the single slot structure and the multi-layer slot structure in this specification. Regarding this, Figure 15 The current distributions of the radiator structures of the single slot structure and the multi-layer slot structure are compared. Figure 9a and Figure 15 (a) of shows the radiator 200a in which the slot region 210s is formed on the first conductive pattern 210 and the third conductive pattern 230. Figure 9b and Figure 15 (b) of shows the radiator 200 in which the first to fourth slot regions (210s to 240s) are formed on the first conductive pattern 210 and the third conductive pattern 230.

[0160] Figure 15 (a) of and Figure 15In the structure of the radiator 200a and 200 of (b), the current distribution of the power supply connection pattern 230f and the ground connection pattern 230g adjacent to the slot region 210s is shown to be higher than other parts. Therefore, the power supply connection pattern 230f and the ground connection pattern 230g adjacent to the slot region 210s act as a structure for exciting a force sensor inside the dielectric housing 240c to operate a radiator in the UWB band. Thus, the slot region 210s of the first conductive pattern 210 and the third conductive pattern 230 and the first region R1 where the force sensor is disposed act as a UWB radiator of the first structure.

[0161] Compared with Figure 15 the single slot structure of (a), Figure 15 in the radiator 200 of the multi-layer slot structure of (b), the conductive patterns that generate UWB resonance are formed by multiple structures to expand the UWB operation band. Regarding this, the slot region 210s of the first conductive pattern 210 and the third conductive pattern 230, the first region R1 where the force sensor is disposed, and the second region R2 adjacent to the first region R1 all act as UWB radiators of the second structure. The second region R2 of the UWB radiator of the second structure includes second to fourth slot regions (220s to 240s). By forming the second region R2 of the sub-patterns of the first conductive pattern 210 and the third conductive pattern 230 adjacent to the second to fourth slot regions (220s to 240s), the UWB radiator of the second structure operates in a wider frequency band.

[0162] The broadband antenna structure disposed inside the earphone described in this specification uses the conductive pattern and the conductive pattern of the sensor and the appliance structure such as the metal frame as part of the radiator. Therefore, the broadband antenna structure disposed inside the earphone is equivalent to a broadband sensor fusion type Zero-Volume antenna that ensures antenna performance in the Bluetooth band and bands lower and higher than it.

[0163] The multi-layer mode antenna structure disposed inside such an earphone ensures broadband antenna performance, for example, an antenna bandwidth 5 times wider than the Bluetooth bandwidth. Thus, stable antenna performance can be maintained under various user scenario conditions. Regarding this, the structural radiation performance realized according to the appliance and PCB structure is manifested as having a relatively high radiation efficiency of at least -6 dB and an average of at least -5 dB throughout the frequency band.

[0164] Above, the earphone with a broadband antenna structure in this specification has been described. Next, an electronic device having an antenna inside the dielectric housing in this specification will be described. Regarding this, refer toFigures 1 to 15 An electronic device having an antenna inside a dielectric housing of this specification will be described.

[0165] The electronic device 100 includes a main body portion 120b having a port 120a and a dielectric housing 120 having a protruding portion extending from the main body portion 120b. The electronic device 100 includes an antenna 200 disposed within the protruding portion and radiating a wireless signal to the outside of the electronic device. The antenna 200 includes a first conductive pattern 210 formed on a first surface S1 within the protruding portion and a second conductive pattern 220 formed on a second surface S2 perpendicular to the first surface S1. The antenna 200 includes the first conductive pattern 210 and a connection portion 250 electrically connecting the first conductive pattern 210 and a printed circuit board (PCB) 150. The connection portion 250 may be embodied by an RF cable, i.e., a coaxial cable, but is not limited thereto.

[0166] The antenna 200 includes a third conductive pattern 230 formed on a third surface S3 perpendicular to the first surface S1 and opposite to the second surface S2, and includes a power supply connection pattern 230f and a ground connection pattern 230g. The antenna 200 includes a slit region 210s formed by removing at least a partial region of the first conductive pattern 210 on the first surface S1 and the third conductive pattern 230 on the third surface S3. The antenna 200 includes a fourth conductive pattern 240 disposed adjacent to the power supply connection pattern 230f of the third conductive pattern 230 on the third surface S3.

[0167] The first conductive pattern 210 and the connection portion 250 are configured to radiate a signal in a first frequency band. The first conductive pattern 210 and the second conductive pattern 220 are configured to radiate a signal in a second frequency band different from the first frequency band. The fourth conductive pattern 240 and the slit region 210s are configured to radiate a signal in a third frequency band higher than the first frequency band and the second frequency band.

[0168] The slit region 210s is formed between the power supply connection pattern 230f and the ground connection pattern 230g. The slit region 210s is formed to have a first length L1 on one axis and a first width W1 on the other axis on the first surface S1. The power supply connection pattern 230f of the third conductive pattern 230 is connected to a signal line 251 of a coaxial cable 250 disposed below a dielectric structure 201 provided with the first conductive pattern 210. The ground connection pattern 230g of the third conductive pattern 230 is connected to a ground structure 150g of a second PCB 150b disposed below the dielectric structure 201.

[0169] The antenna 200 is formed by including a plurality of slot regions. The antenna 200 includes a second slot region 220s that is formed at the same position as the slot region 210s on one axis and is formed on the first surface S1 and is separated from the slot region 210s on the other axis. The antenna 200 includes a third slot region 230 that is formed on the first surface S1 and is separated from the slot region 210s on the other axis. The antenna 200 includes a fourth slot region 240s that is formed on the first surface S1 and the third surface S3 and is separated from the slot region 210s on the other axis.

[0170] The slot region 210s and the second slot region 220s are formed by being separated by a second length L2 from the end of the first conductive pattern 210 adjacent to the handle 122 in the other axis direction. In the other axis direction, the length of the third slot region 230s is formed as a third length L3 that is shorter than the second length L2. In the other axis direction, the length from one end of the fourth slot region 240s to the end of the first conductive pattern 210s is formed as a fourth length L4 that is shorter than the second length L2.

[0171] The second conductive pattern 220 includes a touch sensor. The first conductive pattern 210 is formed as a length Lp1 of the first pattern in the first axial direction of the handle 122. The second conductive pattern 220 is formed as a length Lp2 of the second pattern that is shorter than the length Lp1 of the first pattern in the first axial direction of the handle 122. The signal line 251 of the coaxial cable 250 is connected to the first conductive pattern 210. The fourth conductive pattern 240 formed on the third surface S3 opposite to the second conductive pattern 220 includes a force sensor 241 or a pressure sensor. The fourth conductive pattern 240 is disposed between the other end of the sub-pattern of the third conductive pattern 230 formed on the third surface S3 and one end of the power supply connection pattern 230f formed on the third surface S3.

[0172] As described above, the wireless earbud with a broadband antenna has been described. The technical effects of the wireless earbud with such a broadband antenna are summarized as follows, but are not limited thereto.

[0173] According to this specification, in an electronic device such as a wireless earbud, the broadband antenna can perform broadband operation.

[0174] According to this specification, the current formed on the conductive pattern of the antenna provided in the wireless earbud is coupled to the touch sensor, thereby enabling an increase in the operation bandwidth of the antenna.

[0175] According to this specification, when wearing the wireless earbud, even if the antenna resonance frequency changes according to the movement of the human body or the movement of the wireless earbud in the space inside the ear, a wireless signal can be stably received.

[0176] According to this specification, the antenna performance change caused by the narrow antenna configuration space inside the device configured in the wireless earbuds is minimized, thereby enabling stable maintenance of wireless communication performance.

[0177] According to this specification, an antenna structure capable of operating in the Bluetooth band and the UWB band can be realized by the conductive pattern in front of the dielectric structure configured inside the wireless earbuds and the conductive pattern with a force sensor configured on the side.

[0178] According to this specification, an antenna structure capable of operating in the Bluetooth band and the UWB band can be realized by one or more gap regions of the conductive pattern with a force sensor configured on the side of the dielectric structure and the conductive pattern in front.

[0179] The additional scope to which the present invention is applicable can be clearly understood from the following detailed description. However, those skilled in the art can clearly understand various changes and modifications within the spirit and scope of the present invention. Therefore, the detailed description and specific embodiments such as the preferred embodiments of the present invention are merely illustrative.

[0180] Regarding the above-described present invention, the antenna structure configured in the wireless earbuds and the control operation thereof can be constituted by software, hardware, or a combination thereof. On the other hand, the antenna structure configured in the wireless earbuds and the structure for performing the control operation thereof can be realized by computer-readable code in a medium recording a program. The computer-readable medium includes all kinds of recording devices storing data readable by a computer system. As the computer-readable medium, for example, there are HDD (Hard Disk Drive), SSD (Solid State Disk), SDD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc. In addition, it can also be embodied in the form of a carrier wave (for example, transmission via the Internet). In addition, the above computer may include a terminal or a processor which is a control unit of the wireless earbuds. Therefore, the above detailed description is illustrative in all aspects and should not be construed in a limiting sense. The scope of the present invention should be determined according to a reasonable interpretation of the appended claims, and all changes within the equivalent scope of the present invention are included in the scope of the present invention.

Claims

1. An earbud, which includes: A housing having a main body portion including a speaker port and a stalk extending from the main body portion; A dielectric structure disposed inside the stalk and formed by a front surface, a back surface, and side surfaces; A radiator formed on the dielectric structure to radiate wireless signals to the outside of the earbud; And A printed circuit board (PCB) electrically connected to the radiator, The radiator includes: A first conductive pattern formed on a first surface of the dielectric structure; A second conductive pattern formed on a second surface perpendicular to the first surface; A coaxial cable electrically connecting the first conductive pattern and the PCB; A third conductive pattern formed on a third surface perpendicular to the first surface and opposite to the second surface, and including a power supply connection pattern and a ground connection pattern; A gap region formed by removing at least a part of the first conductive pattern on the first surface and the third conductive pattern on the third surface; and A fourth conductive pattern disposed adjacent to the power supply connection pattern of the third conductive pattern on the third surface, The first conductive pattern and the coaxial cable are configured to radiate signals in a first frequency band, The first conductive pattern and the second conductive pattern are configured to radiate signals in a second frequency band different from the first frequency band, The fourth conductive pattern and the gap region are configured to radiate signals in a third frequency band higher than the first frequency band and the second frequency band.

2. The earbud according to claim 1, wherein The gap region is formed between the power supply connection pattern and the ground connection pattern, The gap region is formed to have a first length on one axis and a first width on another axis on the first surface, The power supply connection pattern is connected to a signal line of the coaxial cable disposed at the lower part of the dielectric structure, and the ground connection pattern is connected to a ground structure, and the ground structure is connected to a second PCB disposed at the lower part of the dielectric structure.

3. The earbud according to claim 2, wherein The radiator further includes: A second gap region formed at the same position as the gap region on the one axis and separated from the gap region on the another axis on the first surface; A third gap region separated from the gap region on the another axis on the first surface; and A fourth gap region separated from the gap region on the another axis and formed on the first surface and the third surface.

4. The earbud according to claim 3, wherein In the direction of the another axis, the first gap region and the second gap region are formed at a second length separated from an end of the first conductive pattern adjacent to the stalk, In the direction of the another axis, the length of the third gap region is formed to be a third length shorter than the second length, In the above-mentioned other axial direction, a fourth length from one end of the above-mentioned fourth slit region to the above-mentioned end of the above-mentioned first conductive pattern is formed to be shorter than the above-mentioned second length.

5. The in-ear headphone according to claim 4, wherein the above-mentioned second length from the above-mentioned end of the above-mentioned first conductive pattern to one end of the above-mentioned first slit region and the above-mentioned second slit region is formed to be a length within a specified range based on 4.4 mm, the above-mentioned third length from the above-mentioned end of the above-mentioned first conductive pattern to one end of the above-mentioned third slit region is formed to be a length within the range of 2.4 to 2.75 mm, the above-mentioned fourth length from the above-mentioned end of the above-mentioned first conductive pattern to one end of the above-mentioned fourth slit region is formed to be a length within a specified range based on 2.8 mm.

6. The in-ear headphone according to claim 2, wherein the above-mentioned second conductive pattern includes a touch sensor, in the above-mentioned one axial direction of the above-mentioned stem, the above-mentioned first conductive pattern is formed to be the length of a first pattern, and in the above-mentioned one axial direction, the above-mentioned second conductive pattern is formed to be the length of a second pattern shorter than the length of the above-mentioned first pattern.

7. The in-ear headphone according to claim 3, wherein the above-mentioned fourth conductive pattern formed on the above-mentioned third surface opposite to the above-mentioned second conductive pattern includes a force sensor or a pressure sensor, the above-mentioned fourth conductive pattern is disposed between the other end of the sub-pattern of the above-mentioned third conductive pattern formed on the above-mentioned third surface and one end of the above-mentioned power supply connection pattern formed on the above-mentioned third surface.

8. The in-ear headphone according to claim 7, wherein the above-mentioned third conductive pattern includes: the above-mentioned sub-pattern, which is disposed at a distance from one end of the above-mentioned fourth conductive pattern; the above-mentioned power supply connection pattern, which is disposed at a distance from the other end of the above-mentioned fourth conductive pattern and is connected to the power supply terminal of the above-mentioned PCB; the above-mentioned ground connection pattern, which is disposed at a distance from the above-mentioned power supply connection pattern through the above-mentioned slit region and is connected to the ground layer of the above-mentioned PCB.

9. The in-ear headphone according to claim 7, wherein the above-mentioned third conductive pattern further includes: a second sub-pattern, which is disposed at a distance from the above-mentioned ground connection pattern through the above-mentioned fourth slit region and is connected to the above-mentioned first conductive pattern between the above-mentioned slit region and the above-mentioned third slit region.

10. The in-ear headphone according to claim 7, wherein the above-mentioned third conductive pattern and the above-mentioned slit region formed on the above-mentioned third surface are configured to radiate signals in a third frequency band higher than the above-mentioned second frequency band, the above-mentioned third conductive pattern and the above-mentioned slit region perform double resonance in the 7 GHz and 10 GHz frequency bands for UWB communication.

11. The in-ear headphone according to claim 7, wherein the above-mentioned third conductive pattern and the above-mentioned slit region, the above-mentioned second slit region, the above-mentioned third slit region, and the above-mentioned fourth slit region formed on the above-mentioned third surface are configured to radiate signals in a third frequency band higher than the above-mentioned second frequency band, The above-mentioned third conductive pattern and the above-mentioned gap region, the above-mentioned second gap region, the above-mentioned third gap region, and the above-mentioned fourth gap region perform multi-layer resonance in the frequency band of 6 GHz to 10 GHz for UWB communication.

12. The earbud according to claim 6, wherein the signal line of the above-mentioned coaxial cable is connected to the above-mentioned first conductive pattern, the ground layer of the above-mentioned coaxial cable is connected to the ground layer of the above-mentioned PCB, the length of the above-mentioned first pattern of the above-mentioned first conductive pattern is formed to be within a specified range based on 14.6 mm, and the length of the above-mentioned second pattern of the above-mentioned second conductive pattern is formed to be within a specified range based on 13.6 mm, the above-mentioned first frequency band is a frequency band having a center frequency of 2.3 GHz for Bluetooth communication with an electronic device, and the above-mentioned second frequency band is a frequency band having a center frequency of 2.6 GHz for performing the above-mentioned Bluetooth communication.

13. The earbud according to claim 2, wherein the above-mentioned first conductive pattern formed on the above-mentioned first surface and the above-mentioned coaxial cable formed on the above-mentioned first surface radiate a first signal in the above-mentioned first frequency band, the above-mentioned first conductive pattern and the above-mentioned second conductive pattern formed on the above-mentioned second surface perpendicular to the above-mentioned first surface are configured to radiate a second signal in the above-mentioned second frequency band, one end portion of the above-mentioned first conductive pattern and one end portion of the above-mentioned second conductive pattern are spaced apart to be formed, and the current formed in the above-mentioned first conductive pattern is coupled to the above-mentioned second conductive pattern in the above-mentioned second frequency band, the first direction of the first current of the above-mentioned first conductive pattern and the above-mentioned coaxial cable formed on the above-mentioned first surface and the second direction of the second current of the above-mentioned second conductive pattern formed on the above-mentioned second surface perpendicular to the above-mentioned first surface are formed orthogonally, whereby the radiator performs broadband operation in the above-mentioned first frequency band and the above-mentioned second frequency band.

14. The earbud according to claim 2, wherein the signal pattern of the above-mentioned first conductive pattern is formed into a conductive pattern of a specified shape to radiate a signal in the above-mentioned first frequency band and the above-mentioned second frequency band, the ground pattern of the above-mentioned first conductive pattern is electrically connected to the ground layer of the above-mentioned coaxial cable, the signal pattern of the above-mentioned second conductive pattern is formed into a conductive pattern of a specified shape to radiate a signal in the above-mentioned second frequency band and operate as a touch sensor, the ground pattern of the above-mentioned second conductive pattern is electrically connected to the ground layer of the above-mentioned coaxial cable.

15. The earbud according to claim 2, wherein the signal pattern of the above-mentioned fourth conductive pattern is formed into a conductive pattern of a specified shape to operate as a force sensor, the ground pattern of the above-mentioned fourth conductive pattern is electrically connected to the ground layer of the above-mentioned coaxial cable.

16. An electronic device, comprising: a dielectric housing having a main body portion including a port and a protruding portion extending from the main body portion; an antenna disposed within the protruding portion to radiate a wireless signal to the outside of the electronic device, the antenna includes: A first conductive pattern formed on a first surface within the above-mentioned protrusion; A second conductive pattern formed on a second surface perpendicular to the above-mentioned first surface; A connection portion that electrically connects the above-mentioned first conductive pattern and a printed circuit board (PCB), i.e., a printed circuit board; A third conductive pattern formed on a third surface perpendicular to the above-mentioned first surface and opposite to the above-mentioned second surface, and including a power supply connection pattern and a ground connection pattern; A slit region formed by removing at least a part of the above-mentioned first conductive pattern on the above-mentioned first surface and the above-mentioned third conductive pattern on the above-mentioned third surface; and A fourth conductive pattern disposed adjacent to the above-mentioned power supply connection pattern of the above-mentioned third conductive pattern on the above-mentioned third surface, The above-mentioned first conductive pattern and the above-mentioned connection portion are configured to radiate signals in a first frequency band, The above-mentioned first conductive pattern and the above-mentioned second conductive pattern are configured to radiate signals in a second frequency band different from the above-mentioned first frequency band, The above-mentioned fourth conductive pattern and the above-mentioned slit region are configured to radiate signals in a third frequency band higher than the above-mentioned first frequency band and the above-mentioned second frequency band.

17. The electronic device according to claim 16, wherein, The above-mentioned slit region is formed between the above-mentioned power supply connection pattern and the above-mentioned ground connection pattern, The above-mentioned slit region is formed to have a first length on one axis and a first width on another axis on the above-mentioned first surface, The above-mentioned power supply connection pattern is connected to a signal line of a coaxial cable disposed below a dielectric structure provided with the above-mentioned first conductive pattern, and the above-mentioned ground connection pattern is connected to a ground structure, and the ground structure is connected to a second PCB disposed below the above-mentioned dielectric structure.

18. The electronic device according to claim 17, wherein, The above-mentioned antenna further includes: A second slit region formed at the same position as the above-mentioned slit region on the above-mentioned one axis and separated from the above-mentioned slit region on the above-mentioned another axis on the above-mentioned first surface; A third slit region formed separated from the above-mentioned slit region on the above-mentioned another axis on the above-mentioned first surface; and A fourth slit region formed separated from the above-mentioned slit region on the above-mentioned another axis on the above-mentioned first surface and the above-mentioned third surface.

19. The electronic device according to claim 3, wherein, In the direction of the above-mentioned another axis, the above-mentioned slit region and the above-mentioned second slit region are formed separated by a second length from an end portion of the above-mentioned first conductive pattern adjacent to the above-mentioned protrusion, In the direction of the above-mentioned another axis, the length of the above-mentioned third slit region is formed to be a third length shorter than the above-mentioned second length, In the direction of the above-mentioned another axis, a distance from one end portion of the above-mentioned fourth slit region to the above-mentioned end portion of the above-mentioned first conductive pattern is formed to be a fourth length shorter than the above-mentioned second length.

20. The electronic device according to claim 17, wherein, The above-mentioned second conductive pattern includes a touch sensor, The above-mentioned first conductive pattern is formed to have a length of a first pattern in the direction of the above-mentioned one axis of the above-mentioned protrusion, and the above-mentioned second conductive pattern is formed to have a length of a second pattern shorter than the length of the above-mentioned first pattern in the direction of the above-mentioned one axis, The fourth conductive pattern formed on the third surface opposite to the second conductive pattern includes a force sensor or a pressure sensor. The fourth conductive pattern is disposed between the other end of the sub-pattern of the third conductive pattern formed on the third surface and one end of the power supply connection pattern formed on the third surface.

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