Automatic assembling equipment for computer mainboard accessories

Abstract

The invention belongs to the technical field of mainboard assembly, and discloses computer mainboard accessory automatic assembly equipment which comprises an ultrasonic cleaning machine, a guide mechanism and a driving mechanism which are distributed inside and outside are arranged above the ultrasonic cleaning machine, and the guide mechanism is of an annular structure. A plurality of sets of clamping mechanisms are suspended on the guide mechanism at equal intervals; the driving mechanism controls the clamping mechanism to move in the preset direction, and part of the bottom of the clamping mechanism is immersed into the ultrasonic cleaning machine. The driving mechanism and the guide mechanism are arranged, the tops of the multiple clamping mechanisms are connected with the driving mechanism and the guide mechanism at the same time, and in the process that the driving mechanism controls the multiple clamping mechanisms to slowly reciprocate, fluctuating movement of the clamping mechanisms can be achieved through the structural characteristics of the guide mechanism; therefore, the PCB substrate clamped at the bottom of the clamping mechanism can be immersed into the ultrasonic cleaning machine to be cleaned, automatic feeding and discharging of PCB substrate cleaning are achieved, and the overall efficiency of computer mainboard assembling is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of motherboard assembly, and specifically to an automatic assembly device for computer motherboard accessories. Background Art

[0002] In the field of modern electronic manufacturing, the computer motherboard, as the core hub of electronic devices, the precision and efficiency of its production process directly determine the product performance and market competitiveness. The installation process of computer motherboard accessories includes multiple precision processes such as motherboard pretreatment, surface mounting, component insertion, and detection and calibration, and each process requires the collaborative operation of a variety of special equipment. For example, in the motherboard pretreatment stage, a cleaning machine is needed to clean the surface of the PCB substrate, removing impurities such as dust, oil, and oxide layers. Subsequently, a solder paste printer is used to precisely coat the solder paste on the pads of the substrate to lay the foundation for subsequent component soldering. In the surface mounting process, a high-speed and high-precision pick-and-place machine is used to accurately solder surface-mounted components such as resistors, capacitors, and chips to the surface of the substrate. Currently, some production links still adopt a production mode that combines manual and semi-automatic equipment. Taking the PCB substrate cleaning process as an example, the traditional operation process is as follows: operators need to strictly follow the cleaning procedures, first manually place the PCB substrate in the cleaning basket or fixture at a specific angle and spacing, and then manually immerse the cleaning basket or fixture slowly into the cleaning tank containing chemical cleaning agents. During the cleaning process, operators need to manually control the soaking time according to the pollution degree of the substrate, and enhance the cleaning effect by intermittently shaking the cleaning basket. After cleaning, special tools are also needed to take out the substrate from the cleaning solution. Although this manual intervention method can achieve substrate cleaning, it has significant drawbacks. On the one hand, the efficiency of manual operation is restricted by the proficiency and physical condition of operators. According to industry statistics, the number of PCB substrates processed by a single person per day is about 300 - 500 pieces, which is difficult to meet the large-scale and batch production requirements. On the other hand, during the manual operation process, the grease, dander carried by the operator's hands, and dust particles in the external environment are very likely to introduce secondary pollution when frequently contacting the substrate. At the same time, due to improper control of the clamping force during fixture installation or irregular picking and placing actions, the probability of causing damage such as scratches on the substrate surface and component displacement is as high as 8% - 12%, seriously affecting the product yield. In addition, the position accuracy error of manual loading and unloading is usually above ±0.5mm, which has a significant gap with the ±0.1mm accuracy standard required by subsequent automated equipment, resulting in problems such as board jamming and recognition errors during equipment connection, restricting the automation level and production rhythm of the entire production line. Summary of the Invention

[0003] The purpose of the present invention is to provide an automatic assembly device for computer motherboard accessories, aiming to improve the problem of high manual participation and low efficiency in substrate cleaning.

[0004] The present invention is implemented as follows: an automatic assembly device for computer motherboard accessories includes an ultrasonic cleaning machine, on top of which are arranged guide mechanisms and drive mechanisms that are distributed inside and outside, the guide mechanism being arranged as a ring structure, and multiple sets of clamping mechanisms being suspended at equal intervals on the guide mechanism; the drive mechanism controls the clamping mechanism to move along a predetermined direction, and the bottom of part of the clamping mechanism is immersed in the ultrasonic cleaning machine; adjustment mechanisms are arranged at both ends of the ultrasonic cleaning machine, and the adjustment mechanisms are connected to the multiple sets of clamping mechanisms one by one in a transmission manner.

[0005] Preferably, the driving mechanism includes a rectangular chain and four sprockets distributed at the end corners of the chain. The four sprockets are connected through bearing seats and evenly installed on two brackets. The brackets are arranged in an L-shaped structure, and the bottom of the brackets are connected to the ultrasonic cleaning machine; the central axis of a certain sprocket is connected to the power output shaft of the first motor; a tensioning wheel is also meshedly arranged on the side of the chain, and the tensioning wheel is connected to the bracket.

[0006] Preferably, the guiding mechanism comprises two circles of supporting guide rails distributed up and down, the sides of the two circles of supporting guide rails are connected to a supporting frame, and the ends of the supporting frame are connected to the bracket; a first guide rail and a second guide rail connected end to end are arranged on the inner side of the supporting guide rail, the first guide rail is located below the second guide rail, and a connecting rod installed at the end of the second guide rail is connected to the bracket.

[0007] Preferably, the first guide rail and the second guide rail are arranged on the inner side of the chain, the support rail is located on the outer side of the chain, multiple sets of clamping mechanisms are distributed along the circumference direction of the chain, and the clamping mechanisms are in contact with the guide rail and the support rail at the same time.

[0008] Preferably, the clamping mechanism includes a support tube, a lifting plate arranged through the support tube, and a plurality of first clamps and second clamps arranged at the bottom of the lifting plate. The lifting plate is arranged as an inverted T-shaped structure, and the plurality of first clamps and second clamps are alternately installed at the horizontal section of the lifting plate, and the second clamp is stationary relative to the lifting plate, and the first clamp is movably connected to the lifting plate.

[0009] Preferably, a connecting plate is fixedly provided on one side of the support tube, and two pulleys distributed up and down are provided on the other side connected through a bearing seat, the connecting plate is connected to the chain, and the two pulleys are respectively arranged in contact with two circles of support guide rails; limiting plates are provided on the sides where the two pulleys are away from each other, and the ends of the two limiting plates that are close to each other are respectively in contact with their respective adjacent support guide rails, and the ends of the two limiting plates that are away from each other are respectively mounted on their respective threaded columns, and the limiting rod installed on the threaded column passes through the limiting groove of the limiting plate.

[0010] Preferably, a connecting column is fixedly arranged at the vertical section of the lifting plate. A sleeve is sleeved at the end of the connecting column. An arc-shaped column is fixedly installed at the end of the sleeve. The central angle of the arc-shaped column is greater than or equal to 180° and is sleeved on the guide rail. A slot hole is arranged at the bottom of the support pipe. The bottom of the slot hole is an opening, and the connecting column penetrates through the slot hole.

[0011] Preferably, a buckle groove with an open end is arranged along the length direction on the horizontal section of the lifting plate. A first buckle frame and a second buckle frame are respectively and fixedly arranged on the tops of the first clamping plate and the second clamping plate. The first buckle frame and the second buckle frame are sleeved on the horizontal section of the lifting plate. Multiple first clamping plates are threadedly sleeved on the same threaded rod. The end of the threaded rod is connected to a worm gear. A worm is meshed on the side of the worm gear. The worm gear and the worm are installed on the same frame body, and this frame body is connected to the lifting plate. A driven gear is installed at the end of the worm. Multiple second clamping plates are connected by bolts and sleeved on the same brake plate. A fixed end plate installed at the end of the brake plate is connected to the brake plate.

[0012] Preferably, the adjusting mechanism includes a driving gear and a second motor. The driving gear is connected and installed on the connecting frame through a bearing seat. The second motor is also installed on the connecting frame, and the power output shaft of the second motor is connected to the central axis of the driving gear. A bottom frame is sleeved at the bottom of the connecting frame. A clamping column installed on the inner side wall of the bottom frame extends into a clamping groove on the side wall of the connecting frame. The telescopic end of a telescopic cylinder installed on the bottom frame is connected to the connecting frame. The driving gear can be meshed and connected with the driven gear.

[0013] Preferably, a plurality of pairs of first baffles and second baffles are arranged at both ends of the upper side of the ultrasonic cleaner. Multiple first baffles are fixedly installed on the same bottom plate. The bottom plate is installed on the ultrasonic cleaner, and a sliding groove is arranged on the bottom plate. Multiple second baffles are fixedly installed on the same sliding clamping plate. The sliding clamping plate is installed in the sliding groove, and an adjusting screw rod installed at the end of the sliding clamping plate threadedly penetrates through a threaded hole on the bottom plate.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The present invention is provided with a driving mechanism and a guiding mechanism, and the tops of multiple sets of clamping mechanisms are simultaneously connected to the driving mechanism and the guiding mechanism. During the process that the driving mechanism controls multiple sets of clamping mechanisms to move slowly and reciprocally, the undulating movement of the clamping mechanisms can be realized by using the structural characteristics of the guiding mechanism. Furthermore, the PCB substrate clamped at the bottom of the clamping mechanism can be immersed in the ultrasonic cleaner for cleaning, and the automatic loading and unloading of the PCB substrate during cleaning can be realized, further improving the overall efficiency of computer motherboard assembly and reducing the labor intensity of workers.

[0015] 2. The clamping mechanism provided in the present invention includes paired first clamping plates and second clamping plates. The second clamping plates are fixedly installed relative to the lifting plate, and the first clamping plates are movably sleeved on the lifting plate. Thus, multiple first clamping plates can be controlled to move synchronously under an external force to adjust the distance between the first clamping plates and the second clamping plates, realizing the clamping and releasing of the PCB substrate.

[0016] 3. The present invention is provided with two sets of adjusting mechanisms distributed at both ends of the ultrasonic cleaning machine. After the clamping mechanism moves to the side of the adjusting mechanism, the two sets of adjusting mechanisms can work to adjust two opposite states of the clamping mechanism, that is, to reduce or increase the distance between the first clamping plate and the second clamping plate, facilitating the picking up of the PCB substrate from the tooling or regularly placing it on the tooling, and realizing the automatic loading and unloading of the PCB substrate.

[0017] 4. The tooling of the present invention includes a first baffle and a second baffle respectively installed on the bottom plate and the sliding clamping plate. The sliding clamping plate is movably installed on the bottom plate, and at the same time, the relative movement of the sliding clamping plate relative to the bottom plate can be controlled by rotating the adjusting screw, thereby realizing the adjustment of the relative positions of the first baffle and the second baffle, and further enabling the tooling to adapt to PCB substrates of different thicknesses. Description of the Drawings

[0018] Figure 1 is the first structural schematic diagram of the whole of the present invention; Figure 2 is the second structural schematic diagram of the whole of the present invention; Figure 3 is the first structural schematic diagram of the ultrasonic cleaning machine, driving mechanism, clamping mechanism, and guiding mechanism of the present invention; Figure 4 is the second structural schematic diagram of the ultrasonic cleaning machine, driving mechanism, clamping mechanism, and guiding mechanism of the present invention; Figure 5 is the third structural schematic diagram of the ultrasonic cleaning machine, driving mechanism, clamping mechanism, and guiding mechanism of the present invention; Figure 6 is the structural schematic diagram of the ultrasonic cleaning machine of the present invention; Figure 7 is the structural schematic diagram of the driving mechanism of the present invention; Figure 8 is the structural schematic diagram of the guiding mechanism of the present invention; Figure 9 is the structural schematic diagram of the clamping mechanism of the present invention; Figure 10 is the first structural schematic diagram of the support tube of the present invention; Figure 11 is the second structural schematic diagram of the support tube of the present invention; Figure 12 is the structural schematic diagram of the lifting plate of the present invention; Figure 13 It is a schematic structural diagram of the first clamping plate and the second clamping plate of the present invention; Figure 14 It is a schematic structural diagram of the first clamping plate of the present invention; Figure 15 It is a schematic structural diagram of the second clamping plate of the present invention; Figure 16 It is a schematic structural diagram of the adjusting mechanism of the present invention; Figure 17 It is a schematic structural diagram of the connecting frame and the bottom frame of the present invention; Figure 18 It is a schematic structural diagram of the first baffle and the second baffle of the present invention; Figure 19 It is a schematic structural diagram of the first baffle of the present invention; Figure 20 It is a schematic structural diagram of the second baffle of the present invention.

[0019] In the figure: 1. Ultrasonic cleaning machine; 11. Mesh plate; 12. First baffle; 13. Second baffle; 14. Sliding clamping plate; 15. Bottom plate; 16. Sliding groove; 17. Adjusting screw; 2. Robot arm; 3. Automatic solder paste printer; 4. Mounter; 5. Inserting machine; 6. Driving mechanism; 61. Chain; 62. Bracket; 63. Sprocket; 64. Tensioning wheel; 65. First motor; 7. Clamping mechanism; 71. Support tube; 711. Connecting plate; 712. Slot hole; 713. Limiting rod; 714. Stud; 72. Lifting plate; 721. Connecting column; 722. Sleeve; 723. Arc column; 724. Snap groove; 73. First clamping plate; 731. Threaded rod; 732. First snap frame; 733. Worm; 734. Driven gear; 735. Worm gear; 74. Second clamping plate; 741. Braking plate; 742. Second snap frame; 743. Fixed end plate; 75. Pulley; 751. Limiting plate; 752. Limiting groove; 8. Guiding mechanism; 81. Support guide rail; 82. Support frame; 83. First guide rail; 84. Second guide rail; 85. Connecting rod; 9. Adjusting mechanism; 91. Second motor; 92. Driving gear; 93. Connecting frame; 94. Bottom frame; 95. Telescopic cylinder; 96. Card slot; 97. Card column. Detailed implementation manners

[0020] In the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0021] The following is a further description in conjunction with the accompanying drawings and specific embodiments: Embodiment 1

[0022] As Figure 1 、 Figure 2 shown, from the publicly available technology, when automatically assembling a computer motherboard and its accessories, generally, it is necessary to go through a cleaning machine to clean the PCB substrate, removing dust, oil stains, and the oxide layer on the PCB surface; the PCB substrate separated from the cleaning machine can also enter a drying machine to achieve the drying process of the PCB substrate; a fully automatic solder paste printer 3 precisely coats solder paste on the pads to prepare for component soldering; a pick-and-place machine 4 precisely solders SMD components onto the PCB surface or mounts high-pin-density chips such as BGA and QFP packages; the solder paste is melted by heating in a reflow soldering furnace to achieve the soldering of components to the PCB; a plug-in machine 5 (automatic plug-in machine) grabs memory slots, PCIe slots, etc., aligns them with the PCB hole positions and inserts them, and the plug-in pins complete soldering through a molten solder wave peak, etc. Through the above and other equipment (such as a multi-axis automatic screw locking machine), the automatic assembly of the computer motherboard is realized. If two sets of equipment are placed adjacent to each other, a robotic arm 2 can be installed between the adjacent two pieces of equipment to achieve the transfer of the computer motherboard through the robotic arm 2. The fully automatic solder paste printer 3, pick-and-place machine 4, plug-in machine 5, drying machine, etc. have all been publicly used and will not be elaborated here.

[0023] In order to further improve the overall efficiency of computer motherboard assembly and reduce the labor intensity of workers, in this embodiment, corresponding structures are added to the existing ultrasonic cleaning machine 1 to achieve continuous cleaning of a batch of PCB substrates, automatic loading and unloading, etc.

[0024] Before introducing the added structures, here is a brief introduction to the publicly available ultrasonic cleaning machine 1 first. It includes an ultrasonic generator, ultrasonic transducers, a cleaning tank, a heating and temperature control system, a liquid level sensor, a PLC controller, and a touch screen, etc. The ultrasonic generator converts 220V / 380V alternating current into high-frequency electrical signals (usually 20 - 130 kHz) to drive the transducers to work; the ultrasonic transducers convert high-frequency electrical signals into mechanical vibrations (ultrasound) to stimulate the cleaning liquid to generate cavitation effects; the heating and temperature control system includes heating tubes, temperature sensors, etc., to raise the temperature of the cleaning liquid (usually 40 - 70 °C), enhancing the oil dissolution ability and the efficiency of cavitation effects; the PLC controller and the touch screen integrate the setting of parameters such as cleaning time, temperature, and power, and support multi-program storage. Even some ultrasonic cleaning machines 1 can also be set with a circulating filtration system, which includes a centrifugal pump, a filter barrel, a backwashing device, etc., to filter impurities in the cleaning liquid, extend the service life, and improve the cleaning accuracy. A detachable mesh plate 11 can also be set at the inner bottom of the ultrasonic cleaning machine 1 to support the frame for holding the PCB substrate when manually cleaning the PCB substrate.

[0025] like Figures 3 - 5 As shown, the added structure includes a driving mechanism 6, a guide mechanism 8, an adjustment mechanism 9, a plurality of clamping mechanisms 7, etc. The guide mechanism 8 and the driving mechanism 6 are arranged inside and outside the ultrasonic cleaning machine 1, the guide mechanism 8 is arranged as a ring structure, and a plurality of clamping mechanisms 7 are suspended and arranged on the guide mechanism 8 at equal intervals, and the clamping mechanism 7 is connected to the driving mechanism 6. Therefore, when the driving mechanism 6 is working, the clamping mechanism 7 is controlled to move slowly and reciprocally along a predetermined direction, that is, after the clamping mechanism 7 clamps a plurality of PCB substrates from one end of the ultrasonic cleaning machine 1, it drives the plurality of PCB substrates to move up and down, and then controls the PCB substrates to be immersed in the ultrasonic cleaning machine 1 and to complete the cleaning in a sufficient time, and to be separated from the ultrasonic cleaning machine 1 after cleaning, and then placed neatly at the other end of the ultrasonic cleaning machine 1 under the operation of the clamping mechanism 7, so that the cleaning of the PCB substrate is completed.

[0026] In order to adjust the state of the clamping mechanism 7 and realize the clamping and releasing of the PCB substrate, adjustment mechanisms 9 are provided at both ends of the ultrasonic cleaning machine 1. The adjustment mechanisms 9 are connected to multiple sets of clamping mechanisms 7 one by one in transmission, so that the same set of clamping mechanisms 7 can be adjusted to two opposite states with the cooperation of two sets of adjustment mechanisms 9.

[0027] In addition, in order to place multiple PCB substrates that have not been cleaned side by side at one end of the ultrasonic cleaning machine 1, or to place multiple PCB substrates that have been cleaned neatly at the other end of the ultrasonic cleaning machine 1, tooling is respectively provided at both ends of the upper side of the ultrasonic cleaning machine 1. The tooling is provided with multiple parallel grooves. After the bottom of the PCB substrate is inserted into the groove, it can be stably placed on the tooling.

[0028] like Figure 9 As shown, in order to stably clamp the PCB substrate through the clamping mechanism 7, the clamping mechanism 7 includes a support tube 71, a lifting plate 72, a plurality of first clamping plates 73 and a second clamping plate 74. The lifting plate 72 is set as an inverted T-shaped structure, and the vertical section of the lifting plate 72 runs through the support tube 71. At the same time, the support tube 71 is connected to the driving mechanism 6 and the guide mechanism 8, so that the support tube 71 and the lifting plate 72 can be controlled to move synchronously when the support tube 71 is stably installed, and the structural characteristics of the guide mechanism 8 are used to force the lifting plate 72 to move up and down, which facilitates the immersion of the PCB substrate in the cleaning liquid for cleaning. The number of the first clamping plates 73 and the second clamping plates 74 is equal, and they are alternately installed at the horizontal section of the lifting plate 72. Therefore, the first clamping plates 73 and the second clamping plates 74 are paired in pairs to form a clamp. In addition, the first clamping plate 73 is movably connected to the lifting plate 72, that is, the first clamping plate 73 can move relative to the second clamping plate 74 under the action of external force, so as to adjust the distance between the first clamping plate 73 and the second clamping plate 74, and provide support for clamping and releasing the PCB substrate.

[0029] As shown Figures 13 - 15 in FIG. Figures 13 - 15 , on the horizontal section of the lifting plate 72, a snap groove 724 with an open end is provided along its length direction. At the tops of the first clamping plate 73 and the second clamping plate 74, a first snap frame 732 and a second snap frame 742 are respectively fixedly provided, and the first snap frame 732 and the second snap frame 742 are sleeved on the horizontal section of the lifting plate 72.

[0030] As shown Figure 15 in FIG. Figure 15 , multiple second clamping plates 74 can be sleeved on the same brake plate 741 through bolts, and the fixed end plate 743 installed at the end of the brake plate 741 is connected to the brake plate 741 through bolts. Or directly connect the second snap frame 742 to the bottom of the lifting plate 72 through bolts. Both of these two methods can achieve the relative static installation of the second clamping plate 74 and the lifting plate 72.

[0031] As shown Figure 14 in FIG. Figure 14 , multiple first clamping plates 73 are threadedly sleeved on the same threaded rod 731. The end of the threaded rod 731 is connected to the worm gear 735. A worm 733 is meshed on the side of the worm gear 735. The worm gear 735 and the worm 733 are installed on the same frame, and this frame is connected to the lifting plate 72. When the worm gear 735 and the worm 733 are stably installed, the rotation of the worm 733 can be controlled to drive the rotation of the worm gear 735, driving the threaded rod 731 to rotate, forcing multiple first clamping plates 73 to move synchronously relative to the lifting plate 72, and realizing the clamping and release of multiple PCB substrates.

[0032] As shown Figure 14 and Figure 16 in FIG. Figure 16 , in order to control the rotation of the worm 733, a driven gear 734 is installed at the end of the worm 733. The adjusting mechanism 9 includes a driving gear 92 and a second motor 91. The driving gear 92 is connected to the power output shaft of the second motor 91, and the driving gear 92 can be meshed with the driven gear 734. Therefore, after the clamping mechanism 7 moves to the side of the adjusting mechanism 9, the second motor 91 can be controlled to drive the driving gear 92 to rotate, driving the worm 733 to rotate. In order to facilitate the operation of the second motor 91, an induction switch needs to be equipped, that is, after the clamping mechanism 7 moves to the adjusting mechanism 9, the adjusting mechanism 9 can be controlled to work.

[0033] As shown Figure 17As shown, in order to enable the driving gear 92 to mesh with the driven gear 734, the driving gear 92 is connected and installed on the connecting rod 93 through a bearing block, and the second motor 91 is also installed on the connecting rod 93. A bottom frame 94 is sleeved on the bottom of the connecting rod 93. The clamping posts 97 installed on the inner side wall of the bottom frame 94 extend into the clamping grooves 96 on the side wall of the connecting rod 93, and the telescopic end of the telescopic cylinder 95 installed on the bottom frame 94 is connected to the connecting rod 93. After the clamping mechanism 7 moves to the adjusting mechanism 9, the telescopic cylinder 95 works to control the movement of the connecting rod 93, so as to control the driving gear 92 to approach or move away from the driven gear 734, and further adjust the state of the clamping mechanism 7.

[0034] As Figure 7 shown, in order to enable multiple sets of clamping mechanisms 7 to reciprocate cyclically, the driving mechanism 6 includes a chain 61, two brackets 62, four sprockets 63, etc. The chain 61 is arranged in a rectangular structure. The four sprockets 63 are arranged inside the chain 61 and distributed at the four end corners of the chain 61. At the same time, the four sprockets 63 are evenly installed on the two brackets 62 through bearing blocks. In addition, the bottom of the bracket 62 is connected to the ultrasonic cleaning machine 1, so that the chain 61 can be stably installed under the action of the bracket 62 and the sprockets 63. In order to adjust the tension of the chain 61, a tensioning wheel 64 is meshed on the side of the chain 61. The tensioning wheel 64 is connected to the bracket 62, and the tension adjustment of the chain 61 can be realized by changing the position of the tensioning wheel 64.

[0035] As Figure 7 、 Figure 10 shown, in addition, the central axis of a certain sprocket 63 is connected to the power output shaft of the first motor 65, and the first motor 65 is installed on the bracket 62, so that the chain 61 can be controlled to rotate when the first motor 65 works. A connecting plate 711 is fixedly arranged on one side of the support tube 71. The connecting plate 711 is connected to the chain 61. When the chain 61 moves, the support tube 71 can be driven to move along the preset direction.

[0036] As Figure 8 、 Figure 10 、 Figure 11As shown in the figure, in order to support the stable movement of the clamping mechanism 7, the guiding mechanism 8 includes two circles of supporting guide rails 81 distributed vertically. The sides of the two circles of supporting guide rails 81 are connected to a support frame 82, and the end of the support frame 82 is connected to the support 62. On the other side of the support tube 71, two pulleys 75 distributed vertically are arranged through a bearing seat. The two pulleys 75 are respectively arranged in contact with the two circles of supporting guide rails 81. On the side where the two pulleys 75 are far away from each other, limit plates 751 are arranged. The ends of the two limit plates 751 close to each other are respectively in contact with the adjacent supporting guide rails 81. In this way, the support tube 71 can be stably installed on the side of the supporting guide rail 81 under the cooperation of the limit plate 751 and the pulley 75. And because there is a gap at the ends of the two limit plates 751 close to each other, the movement of the support tube 71 will not be affected by the existence of the support frame 82. In order to stably install the limit plate 751, the ends of the two limit plates 751 far away from each other are respectively sleeved on their respective threaded columns 714, and at the same time, the limiting rods 713 installed on the threaded columns 714 penetrate through the limiting grooves 752 of the limit plate 75. As Figure 8 , Figure 12 shown in the figure, a first guide rail 83 and a second guide rail 84 connected end to end are arranged inside the supporting guide rail 81. The first guide rail 83 is located below the second guide rail 84. The connecting rod 85 installed at the end of the second guide rail 84 is connected to the support 62. A connecting column 721 is fixedly arranged at the vertical section of the lifting plate 72. A sleeve 722 is sleeved at the end of the connecting column 721. An arc-shaped column 723 is fixedly installed at the end of the sleeve 722. The central angle of the arc-shaped column 723 is greater than or equal to 180° and is sleeved on the guide rail. During the process that the support tube 71 can move along the preset direction of the supporting guide rail 81, the lifting of the lifting plate 72 can be controlled under the cooperation of the first guide rail 83, the second guide rail 84 and the connecting column 721, so as to adjust the height of the PCB substrate and provide support for cleaning the PCB substrate and moving it in and out of the ultrasonic cleaning machine 1.

[0037] As Figure 10 , Figure 12 shown in the figure, in order to realize the large-range lifting of the lifting plate 72, a slot 712 is arranged at the bottom of the support tube 71. The bottom of the slot 712 is an opening, and the connecting column 721 penetrates through the slot 712.

[0038] In order to control the normal operation of the added structure, corresponding control devices also need to be equipped for it. For example, a programmable logic controller, a relay control module, a motor drive system (such as a contactor + thermal relay), a hydraulic / pneumatic telescopic cylinder (such as an electromagnetic directional valve), a signal conditioning module, etc. are added in the electrical control box to control the operation of the motor and the telescopic cylinder and receive the signals of sensors such as induction switches. Even other corresponding devices can be installed according to requirements. Embodiment 2

[0039] As Figures 18 - 20 shown, on the basis of Embodiment 1, in order to enable the tooling for regularly placing the PCB substrate to adapt to PCB substrates of different thicknesses, the tooling includes multiple pairs of first baffles 12 and second baffles 13. Multiple first baffles 12 are fixedly installed on the same bottom plate 15. The bottom plate 15 is installed on the ultrasonic cleaning machine 1, and a sliding groove 16 is provided on the bottom plate 15. Multiple second baffles 13 are fixedly installed on the same sliding clamping plate 14. The sliding clamping plate 14 is installed in the sliding groove 16 to realize the movable and stable connection between the first baffle 12 and the second baffle 13. In addition, an adjusting screw 17 is connected to the end of the sliding clamping plate 14 through a bearing, that is, the end of the adjusting screw 17 is inserted into the sliding clamping plate 14, and the adjusting screw 17 is threadedly penetrated through the threaded hole of the bottom plate 15. The adjusting screw 17 can be rotated according to requirements to adjust the distance between the first baffle 12 and the second baffle 13, thereby adapting to the thickness of the PCB substrate and providing support for regularly and stably placing the PCB substrate.

[0040] The above is only the preferred embodiment of the present invention and is not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automatic assembly device for computer motherboard accessories, characterized in that, The invention comprises an ultrasonic cleaning machine (1), wherein a guide mechanism (8) and a driving mechanism (6) are arranged above the ultrasonic cleaning machine (1), the guide mechanism (8) being arranged in an annular structure, and a plurality of clamping mechanisms (7) being suspended at equal intervals on the guide mechanism (8); the driving mechanism (6) controlling the clamping mechanism (7) to move along a predetermined direction, and the bottom of a part of the clamping mechanism (7) is immersed in the ultrasonic cleaning machine (1); and adjustment mechanisms (9) are arranged at both ends of the ultrasonic cleaning machine (1), and the adjustment mechanisms (9) are connected to the plurality of clamping mechanisms (7) one by one in a transmission manner.

2. The automatic assembly device for computer motherboard accessories according to claim 1, characterized in that, The driving mechanism (6) comprises a chain (61) of a rectangular structure and four sprockets (63) distributed at the end corners of the chain (61); the four sprockets (63) are connected via bearing seats and are evenly mounted on two brackets (62); the bracket (62) is arranged in an L-shaped structure, and the bottom of the bracket (62) is connected to the ultrasonic cleaning machine (1); the central axis of one of the sprockets (63) is connected to the power output shaft of the first motor (65); and a tensioning wheel (64) is also meshedly arranged on the side of the chain (61), and the tensioning wheel (64) is connected to the bracket (62).

3. The automatic assembly device for computer motherboard accessories according to claim 2, characterized in that, The guide mechanism (8) comprises two circles of support rails (81) distributed in an upper and lower manner, the sides of the two circles of the support rails (81) are connected to a support frame (82), and the end of the support frame (82) is connected to the bracket (62); a first guide rail (83) and a second guide rail (84) connected end to end are arranged on the inner side of the support rail (81), the first guide rail (83) is located below the second guide rail (84), and a connecting rod (85) installed at the end of the second guide rail (84) is connected to the bracket (62).

4. An automatic assembly device for computer motherboard accessories according to claim 3, characterized in that, The first guide rail (83) and the second guide rail (84) are arranged on the inner side of the chain (61), the support rail (81) is located on the outer side of the chain (61), and the plurality of clamping mechanisms (7) are distributed along the circumference direction of the chain (61), and the clamping mechanisms (7) are in contact with the guide rail and the support rail (81) at the same time.

5. The automatic assembly device for computer motherboard accessories according to claim 3, wherein, The clamping mechanism (7) comprises a support tube (71), a lifting plate (72) arranged through the support tube (71), and a plurality of first clamping plates (73) and a second clamping plate (74) arranged at the bottom of the lifting plate (72); the lifting plate (72) is arranged as an inverted T-shaped structure; the plurality of first clamping plates (73) and second clamping plates (74) are alternately installed at a horizontal section of the lifting plate (72); the second clamping plates (74) are stationary relative to the lifting plate (72); and the first clamping plates (73) are movably connected to the lifting plate (72).

6. An automatic assembly device for computer motherboard accessories according to claim 5, characterized in that, On one side of the support tube (71), a connecting plate (711) is fixedly arranged, and on the other side, two pulleys (75) distributed up and down are connected through a bearing seat. The connecting plate (711) is connected to the chain (61), and the two pulleys (75) are respectively arranged in contact with two circles of support guide rails (81); on one side of the two pulleys (75) away from each other, limit plates (751) are arranged. One end of the two limit plates (751) close to each other is in contact with the adjacent support guide rail (81) respectively, and one end of the two limit plates (751) away from each other is respectively sleeved on their respective threaded posts. At the same time, a limiting rod (713) installed on the threaded post penetrates through the limiting groove (752) of the limit plate (751).

7. An automatic assembly device for computer motherboard accessories according to claim 6, characterized in that, On the vertical section of the lifting plate (72), a connecting column (721) is fixedly arranged. At the end of the connecting column (721), a sleeve (722) is sleeved. At the end of the sleeve (722), an arc-shaped column (723) is fixedly installed. The central angle of the arc-shaped column (723) is greater than or equal to 180° and is sleeved on the guide rail; at the bottom of the support tube (71), a slot hole (712) is arranged. The bottom of the slot hole (712) is an opening, and the connecting column (721) penetrates through the slot hole (712).

8. An automatic assembly device for computer motherboard accessories according to claim 5, characterized in that, On the horizontal section of the lifting plate (72), a buckle groove (724) with an open end is arranged along its length direction. On the tops of the first clamping plate (73) and the second clamping plate (74), a first buckle frame (732) and a second buckle frame (742) are respectively fixedly arranged. The first buckle frame (732) and the second buckle frame (742) are sleeved on the horizontal section of the lifting plate (72); multiple first clamping plates (73) are threadedly sleeved on the same threaded rod (731). The end of the threaded rod (731) is connected to a worm gear (735). On the side of the worm gear (735), a worm (733) is meshed. The worm gear (735) and the worm (733) are installed on the same frame body, and this frame body is connected to the lifting plate (72); the end of the worm (733) is installed with a driven gear (734); multiple second clamping plates (74) are connected by bolts and sleeved on the same brake plate (741). A fixed end plate (743) installed at the end of the brake plate (741) is connected to the brake plate (741).

9. An automatic assembly device for computer motherboard accessories according to claim 8, characterized in that, The adjusting mechanism (9) includes a driving gear (92) and a second motor (91). The driving gear (92) is connected and installed on the connecting frame (93) through a bearing seat. The second motor (91) is also installed on the connecting frame (93), and the power output shaft of the second motor (91) is connected to the central axis of the driving gear (92); at the bottom of the connecting frame (93), a bottom frame (94) is sleeved. A clamping post (97) installed on the inner side wall of the bottom frame (94) extends into a clamping slot (96) on the side wall of the connecting frame (93). The telescopic end of a telescopic cylinder (95) installed on the bottom frame (94) is connected to the connecting frame (93); the driving gear (92) is meshed and connected to the driven gear (734).

10. The automatic assembly device for computer motherboard accessories according to claim 1, wherein, At both ends of the upper side of the ultrasonic cleaner (1), there are multiple pairs of first baffles (12) and second baffles (13). Multiple said first baffles (12) are fixedly installed on the same bottom plate (15). The bottom plate (15) is installed on the ultrasonic cleaner (1), and a sliding groove (16) is provided on the bottom plate (15). Multiple said second baffles (13) are fixedly installed on the same sliding clamping plate (14). The sliding clamping plate (14) is installed in the sliding groove (16), and an adjusting screw rod (17) at the end of the sliding clamping plate (14) is threadedly penetrated through the threaded hole of the bottom plate (15).

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