Micro-electro-mechanical device, electronic equipment and radar monitoring device

Abstract

The invention relates to the technical field of micro-electro-mechanical systems, in particular to a micro-electro-mechanical device, electronic equipment and a radar monitoring device. The micro-electro-mechanical device includes a mounting housing, a damping structure, and a microelectronic component. At least one pair of mounting lugs is arranged on the side face of the mounting shell, each pair of mounting lugs are symmetrical about the mounting shell, and the mounting lugs are used for mounting and fixing the mounting shell in the thickness direction of the mounting shell. Wherein the thickness of the mounting lug is smaller than that of the mounting shell, and when the mounting shell and the mounting lug are subjected to vibration with the same energy, the mounting lug is easier to deform. The installation shell is provided with a containing cavity, the microelectronic assembly is installed in the containing cavity, and at least part of the damping structural domain protrudes out of the bottom face of the installation shell. The micro-electronic mechanical device has relatively good anti-seismic performance and relatively high reliability.

Description

Technical Field

[0001] This application relates to the technical field of micro electro mechanical systems, and particularly to a micro electro mechanical device, an electronic device, and a radar monitoring device. Background Art

[0002] Micro electro mechanical systems (MEMS) is a technology that combines micro mechanical structures with electronic technology. A micro electro mechanical device refers to a micro mechanical structure manufactured using microfabrication technology.

[0003] Micro electro mechanical devices usually need to work in a harsh vibration environment, and many application scenarios have strict requirements for their reliability. There may be risks of performance degradation, structural deformation, or even damage when micro electro mechanical devices are subjected to external impacts. Summary of the Invention

[0004] This application provides a micro electro mechanical device, an electronic device, and a radar monitoring device. The micro electro mechanical device has better earthquake resistance and can improve the reliability of the device.

[0005] In a first aspect, this application provides a micro electro mechanical device, which can be used in the field of lidar monitoring. The micro electro mechanical device includes a mounting housing, a damping structure, and a microelectronic component. At least one pair of mounting ears is provided on the side surface of the mounting housing. Each pair of mounting ears is symmetric about the mounting housing, and the mounting ears are used to mount and fix the mounting housing along the thickness direction of the mounting housing. Among them, the thickness of the mounting ears is less than the thickness of the mounting housing. When the mounting housing and the mounting ears are subjected to vibrations of the same energy magnitude, the mounting ears are more likely to deform. The mounting housing has a receiving cavity, and the microelectronic component is installed in the receiving cavity. The damping structure at least partially protrudes from the bottom surface of the mounting housing. When the mounting housing is mounted to the mounting position along the thickness direction, the bottom surface of the mounting housing faces the mounting position, and the damping structure contacts the mounting position, so that there is a certain gap between the bottom surface of the mounting housing and the mounting position, and the mounting housing does not directly contact the mounting position.

[0006] For this micro electro mechanical device, in a vibration environment, the vibrations of the environment can only be transmitted to the mounting housing through the damping structure and the mounting ears. The damping structure and the mounting ears can play a buffering role, thereby weakening the vibrations transmitted to the mounting housing, protecting the microelectronic component installed in the mounting housing, and improving the reliability of the device.

[0007] In a possible implementation manner, the mounting ear has a mounting hole for mounting the damping structure, and the mounting hole penetrates the mounting ear along the thickness direction of the mounting housing. The inner wall of the mounting hole has a mounting boss, and the mounting boss extends along the circumferential direction of the mounting hole. Correspondingly, the damping structure has a mounting groove for accommodating the mounting boss. When the damping structure is mounted in the mounting hole, the cooperation between the mounting groove of the damping structure and the mounting boss of the mounting hole can limit the damping structure along the thickness direction of the mounting housing.

[0008] Among them, the damping structure can be made of elastic materials such as rubber and silica gel. The mounting ear has a bayonet, and the bayonet communicates with the outer surface of the mounting ear and the mounting hole along the direction perpendicular to the thickness direction of the mounting housing, and the width of the bayonet along the direction perpendicular to the thickness direction of the mounting housing is smaller than the radial dimension of the mounting boss. The mounting groove of the elastic damping structure can be installed on the mounting ear through deformation through the bayonet, which is convenient for the installation and disassembly between the damping structure and the mounting housing.

[0009] In order to provide the buffering and shock absorption effect of the damping structure, a plurality of thread grooves can be provided on the outer peripheral surface of the damping structure, each thread groove extends along the direction perpendicular to the thickness direction of the mounting housing, and the plurality of thread grooves are arranged in a circumferentially staggered manner along the damping structure.

[0010] In a possible implementation manner, the microelectromechanical device includes a top cover assembly, and the top cover assembly includes a top shell and a transparent optical window. The top shell is fixed to the top surface of the mounting housing, and the top cover has a first hollow communicating with the accommodating cavity. The transparent optical window is fixed to the top cover, and the transparent optical window covers the first hollow of the top cover. External electromagnetic waves or light can pass through the transparent optical window and enter the mounting housing to reach the microelectronic component. The transparent optical window is a transparent material without optical power, which can specifically be glass or plastic, and can ensure that at least part of the electromagnetic waves pass through smoothly.

[0011] When the electromagnetic wave irradiates the transparent optical window, the surface of the transparent optical window will reflect the electromagnetic wave and interfere with the target signal. For this reason, the transparent optical window can be arranged at an angle with the plane where the microelectronic component is located, and the angle is 0-15°. The interference of the electromagnetic wave reflected from the transparent optical window on the target signal reception can be avoided through the angle deviation between the two.

[0012] In a possible implementation manner, the microelectronic component includes a chip structure and a driving structure. The driving structure is fixed to the mounting housing, and the chip structure is arranged in the accommodating cavity of the mounting housing. The chip structure includes a reflecting mirror, and the driving structure is used to drive the reflecting mirror to deflect. When the reflecting mirror deflects, the reflection angle of the incident electromagnetic wave changes, and thus the outgoing direction of the electromagnetic wave can be changed to realize the scanning of the environment.

[0013] Among them, the driving structure includes a bottom plate, an iron core, and a magnet group. The bottom plate is fixed to one side of the bottom surface of the mounting housing and does not protrude from the bottom surface of the mounting housing. The iron core is connected to the side of the bottom plate facing the top surface of the mounting housing and is located in the accommodation cavity. The magnet group is arranged around the iron core perpendicular to the set direction. The magnet group forms a certain magnetic field distribution. When an electric current is applied to the metal coil configured on the reflecting mirror, an electromagnetic field can be generated, and this electromagnetic field can interact with the magnetic field formed by the magnet group to drive the reflecting mirror to deflect.

[0014] In a possible implementation manner, the microelectronic component further includes a support substrate disposed between the chip structure and the driving structure. The support substrate is fixed to the mounting housing, and the fixing portion is fixed to the support substrate. The support substrate has an avoidance hole, and the avoidance hole penetrates the support substrate along the set direction. Along the thickness direction of the mounting housing, the orthographic projection of the first accommodation hole on the support substrate falls within the avoidance hole so as not to hinder the deflection of the reflecting mirror. The material of the support substrate is ceramic or silicon, which can play a buffering effect between the magnet and the chip structure with different coefficients of thermal expansion and improve the structural stability.

[0015] In order to improve the sealing performance of the device, a sealing structure is provided between the top shell and the mounting housing, and a sealing structure is also provided between the bottom plate and the mounting housing.

[0016] In a second aspect, the present application provides an electronic device, including a monitoring device and any one of the microelectromechanical devices provided in the first aspect. The monitoring device is used to detect the signal emitted by the microelectronic component. The electronic device can be a sensor device, an accelerometer device, a gyroscope device, etc.

[0017] In a third aspect, the present application provides a radar monitoring device, including a laser, a monitoring device, and any one of the microelectromechanical devices provided in the first aspect. The microelectromechanical device is used as a micro-vibrating mirror. The laser is used to emit a laser signal, the microelectronic component is used to reflect the laser signal, and the monitoring device is used to monitor the laser signal reflected by the microelectronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0019] Figure 2 It is a schematic diagram of the working principle of the radar monitoring device;

[0020] Figure 3a It is a schematic structural diagram of a microelectromechanical device provided by an embodiment of the present application;

[0021] Figure 3b It is a schematic structural diagram of a microelectromechanical device provided by an embodiment of the present application;

[0022] Figure 4aSchematic diagram of the mating state of the mounting housing and the damping structure provided by the embodiment of the present application for a microelectromechanical device;

[0023] Figure 4b Schematic cross-sectional view of the mating state of the mounting ear of the mounting housing of the microelectromechanical device provided by the embodiment of the present application and the damping structure;

[0024] Figure 4c Schematic cross-sectional view of the mating state of the mounting ear of the mounting housing of the microelectromechanical device provided by the embodiment of the present application and the damping structure;

[0025] Figure 5a Top view of the mounting housing of the microelectromechanical device provided by the embodiment of the present application;

[0026] Figure 5b Schematic diagram of the structure of the mounting housing of the microelectromechanical device provided by the embodiment of the present application;

[0027] Figure 6a Schematic diagram of the structure of the damping structure of the microelectromechanical device provided by the embodiment of the present application;

[0028] Figure 6b Front view of the damping structure of the microelectromechanical device provided by the embodiment of the present application;

[0029] Figure 7a Schematic diagram of the structure of the microelectronic component of the microelectromechanical device provided by the embodiment of the present application;

[0030] Figure 7b Exploded view of the microelectronic component of the microelectromechanical device provided by the embodiment of the present application;

[0031] Figure 8 Schematic diagram of the structure of the microelectronic component of the microelectromechanical device provided by the embodiment of the present application;

[0032] Figure 9 Schematic diagram of the structure of the support substrate of the microelectromechanical device provided by the embodiment of the present application;

[0033] Figure 10a Schematic diagram of the mating structure of the microelectronic component and the support substrate of the microelectromechanical device provided by the embodiment of the present application;

[0034] Figure 10b Schematic diagram of the mating structure of the microelectronic component and the support substrate of the microelectromechanical device provided by the embodiment of the present application;

[0035] Figure 11a Schematic diagram of the structure of the mounting housing of the microelectromechanical device provided by the embodiment of the present application;

[0036] Figure 11b Schematic diagram of the structure of the mounting housing for a microelectromechanical device provided by an embodiment of the present application;

[0037] Figure 12a Exploded view of the assembly of the microelectronic component and the mounting housing of a microelectromechanical device provided by an embodiment of the present application;

[0038] Figure 12b Exploded view of the assembly of the microelectronic component and the mounting housing of a microelectromechanical device provided by an embodiment of the present application;

[0039] Figure 13a Assembly schematic diagram of the microelectronic component and the mounting housing of a microelectromechanical device provided by an embodiment of the present application;

[0040] Figure 13b Assembly schematic diagram of the microelectronic component and the mounting housing of a microelectromechanical device provided by an embodiment of the present application;

[0041] Figure 14 Schematic diagram of the structure of the connection between the microelectronic component of a microelectromechanical device and the signal line passing through the mounting housing provided by an embodiment of the present application;

[0042] Figure 15a Schematic diagram of the structure of a microelectromechanical device provided by an embodiment of the present application;

[0043] Figure 15b Exploded view of a microelectromechanical device provided by an embodiment of the present application;

[0044] Figure 16a Schematic diagram of the structure of the top shell of a microelectromechanical device provided by an embodiment of the present application;

[0045] Figure 16b Schematic diagram of the structure of the top shell of a microelectromechanical device provided by an embodiment of the present application;

[0046] Figure 16c Right view of the top shell of a microelectromechanical device provided by an embodiment of the present application;

[0047] Figure 17a Schematic diagram of the structure of the mounting housing for a microelectromechanical device provided by an embodiment of the present application;

[0048] Figure 17b Assembly structure schematic diagram of the top cover assembly and the mounting housing of a microelectromechanical device provided by an embodiment of the present application;

[0049] Figure 18a Schematic diagram of the structure of a microelectromechanical device fixed to a mounting panel provided by an embodiment of the present application;

[0050] Figure 18b A right side view of a micro-electromechanical device provided in an embodiment of the present application being fixed to a mounting panel;

[0051] Figure 19 A comparison chart of the simulated vibration reduction effects of a micro-electromechanical device provided in an embodiment of the present application and a traditional micro-vibration mirror in a vibration environment.

[0052] Reference numerals:

[0053] 10-micro-electromechanical device; 20-monitoring device; 30-laser; 40-collimating lens; 50-converging lens; 60-mounting panel; 70-signal line; 1-mounting housing; 11-mounting ear; 111-mounting hole; 112-bayonet; 12-notch; 13-first sealing groove; 14-protrusion; 15-second sealing groove; 16-first connecting hole; 17-second connecting hole; 2-damping structure; 21-mounting groove; 22-through hole; 23-threaded groove; 3-microelectronic component; 31-chip structure; 311-fixing part; 31 3-adapter frame; 3131-second hollow; 312-reflective micromirror; 32-driving structure; 321-bottom plate; 3211-first through hole; 322-iron core; 323-magnet group; 33-support substrate; 331-avoidance hole; 332-positioning mark; 34-first sealing structure; 35-first screw; 4-top cover assembly; 41-top shell; 411-first hollow; 412-annular protrusion; 413-bump; 414-second through hole; 42-transparent light window; 43-second sealing structure; 44-second screw; 5-mounting part. DETAILED DESCRIPTION

[0054] Micro-electromechanical devices are manufactured using micro-machining technology and have the advantages of small size, light weight, low power consumption, fast response speed, and high reliability. They are widely used in sensors, optical devices, biomedical devices, etc. Micro-electromechanical devices usually include micro-mechanical structures, electronic components, and control circuits. Micro-electromechanical devices are generally used in relatively harsh vibration environments and are easily affected by external shocks.

[0055] Specifically, the impact of the vibration environment on microelectromechanical devices is classified into three categories according to the severity. The first category: Vibration will cause a decrease in output accuracy. For example, for a thin-film piezoelectric pressure sensor under a vibration condition of 10 g, its output accuracy will decrease by 10 - 12%. The second category: Vibration will also cause output errors. For example, under a vibration load of 100 g, a microelectromechanical gyroscope will give an output result of 3.5° / s without rotational motion. The third category: Vibration will also cause structural damage to microelectromechanical devices. For example, a microelectromechanical galvanometer mirror will generate microcracks or fracture of the microstructure under a random vibration of 30 g, resulting in the failure or damage of the microelectromechanical galvanometer mirror. It can be seen that the seismic resistance performance of the microelectromechanical galvanometer mirror is crucial.

[0056] Based on this, the embodiments of the present application provide a microelectromechanical device, an electronic device, and a radar monitoring device. The microelectromechanical device can maintain good seismic resistance in a vibration environment to protect the microelectronic components.

[0057] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0058] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above", "said", "this" are also intended to include the forms such as "one or more", unless clearly indicated to the contrary in the context.

[0059] Reference to "one embodiment" or "some embodiments" etc. described in this specification means that a specific feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "include", "comprise", "have" and their variants all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0060] Figure 1 A schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device is a device that combines a micro-mechanical structure and electronic technology. As Figure 1As shown, the electronic device includes a monitoring device 20 and a micro-electromechanical device 10. The micro-electromechanical device 10 includes a micro-mechanical structure and an electronic chip. The electronic chip is installed in the micro-mechanical structure. The electronic chip can be connected to the monitoring device 20 signal, and the electrical signal emitted by the electronic chip can be monitored by the detection device 20. The micro-electromechanical device 10 has the advantages of small size, light weight, low power consumption, fast response speed, high reliability, etc., and can be applied to sensors, optical devices, biomedical devices and other fields. The micro-electromechanical device 10 has a variety of specific structures to achieve different functions. For different micro-electromechanical devices 10, the signals monitored by the monitoring device 20 are also different. The micro-electromechanical device 10 includes accelerometers, gyroscopes, pressure sensors, temperature and humidity sensors, optical sensors, etc. and their integrated products.

[0061] In a specific embodiment, the electronic device is a radar monitoring device, which introduces the micro-electromechanical device 10 into a laser radar system and uses the micro-electromechanical device 10 as a laser beam control component to scan the detection environment. Figure 2 As shown, the radar monitoring device includes a laser 30, a monitoring device 20 and a micro-electromechanical device 10. The laser 30 is used to emit a laser signal, the micro-electromechanical device 10 includes a micro-vibration mirror, the micro-vibration mirror is used as a control component of the laser beam to reflect the laser signal to scan the detection environment, and the monitoring device is used to monitor the laser signal reflected by the micro-electromechanical device 10. Among them, the reflector included in the micro-electromechanical device 10 can rotate around the first direction and the second direction to adjust the reflection angle of the laser signal, so as to scan the detection environment. The laser signal monitored by the monitoring device 20 can obtain a laser radar point cloud image. Specifically, a collimating lens 40 is also provided between the laser 30 and the micro-electromechanical device 10 to adjust and process the laser signal, and a converging lens 50 is also provided between the micro-electromechanical device 10 and the monitoring device 20 to converge the laser signal.

[0062] Taking the micro-electromechanical device 10 including a micro-vibration mirror as an example, the structure of the micro-electromechanical device 10 is introduced. Figure 3a An example of a micro-electromechanical device 10 is shown, which includes a mounting housing 1, a damping structure 2, and a micro-electronic component 3. The micro-electronic component 3 can be considered as a micro-vibration mirror. Figure 3a As shown, the mounting housing 1 is exemplarily in a rectangular shape, and the thickness direction of the mounting housing 1 can be considered as the mounting direction of the micro-electromechanical device 10. For the convenience of illustration, the X direction, Y direction and Z direction are set to be perpendicular to each other, the X direction is the length direction of the mounting housing 1, the Y direction is the width direction of the mounting housing 1, and the Z direction is the height or thickness direction of the mounting housing 1. The mounting housing 1 has a receiving cavity Q, and the microelectronic component 3 is installed in the receiving cavity Q.

[0063] On the side of the mounting housing 1, at least a pair of mounting ears 11 are provided. Each pair of mounting ears 11 is symmetrical about the mounting housing. The mounting ears 11 are used to mount and fix the mounting housing 1 in the thickness direction of the mounting housing. Exemplarily, along the X direction, the mounting housing 1 is provided with two pairs of mounting ears 11, and the axis of symmetry between each pair of mounting ears 11 is parallel to the Y direction. The thickness of the mounting ear 11 is smaller than the thickness of the mounting housing 1. That is to say, along the Z direction, the size of the mounting ear 11 is smaller than the size of the mounting housing 1. The mounting housing 1 can be mounted and fixed through the mounting ears 11. In a vibrating environment, the vibration is first transmitted to the mounting ears 11. The smaller thickness of the mounting ears 11 can deform to absorb the vibration energy, playing a buffering role, reducing the vibration energy transmitted to the mounting housing 1, and further reducing the vibration impact on the microelectronic component 3. Among them, the mounting ear 11 can be a structure fixed to the mounting housing 1, or the mounting ear 11 can also have an integral structure with the mounting housing 1.

[0064] Please continue to refer to Figure 3a As shown, exemplarily, along the Z direction, the mounting housing 1 has a bottom surface a2 and a top surface a1. When the microelectromechanical device 10 is installed, the bottom surface a2 of the mounting housing 1 is used to face the installation position. The surface of the mounting ear 11 facing the installation position is coplanar with the bottom surface a2 of the mounting housing 1. In order to electrically connect the microelectronic component 3 with an external device, the mounting housing 1 also has a notch 12. The notch 12 is recessed from the top surface a1 of the mounting housing 1 towards the bottom surface a2 along the Z direction, so that the accommodation cavity Q communicates with the external space through the notch 12. When assembling the microelectromechanical device 10, the connection line between the microelectronic component 3 and the external device can pass through the notch 12.

[0065] As Figure 3b shown, the accommodation cavity Q extends through the top surface a1 along the Z direction, so that external electromagnetic waves can enter the accommodation cavity Q through the top surface a1 and irradiate on the microelectronic component 3. The microelectronic component 3 can deflect and reflect the electromagnetic waves. Each mounting ear 11 corresponds to one damping structure 2 installed. The damping structure 2 at least partially protrudes from the bottom surface a2 of the mounting housing 1. After the microelectromechanical device 10 is installed and fixed, there is a gap between the bottom surface a2 of the mounting housing 1 and the installation position, so that the bottom surface a2 of the mounting housing 1 does not directly contact the installation position. The damping structure 2 is installed on the mounting ear 11 and protrudes from the surface of the mounting ear 11 facing the installation position. When the mounting housing 1 is installed on the mounting surface, the damping structure 2 is at least partially located between the mounting ear and the installation position. The vibration of the environment is first transmitted to the damping structure 2 for buffering, and then transmitted to the mounting ear 11 for further buffering and dissipation, reducing the vibration transmitted to the microelectronic component 3 through the mounting housing 1.

[0066] As Figure 4aThe shown mounting housing 1 and damping structure 2, the mounting ear 11 has a mounting hole 111 for mounting the damping structure 2, and the mounting hole 111 penetrates the mounting ear 11 along the thickness direction of the mounting housing 1, that is, the Z direction. Specifically, the inner wall of the mounting hole 111 has a mounting boss T, and the mounting boss T extends along the circumferential direction of the mounting hole 111 and protrudes from the inner wall of the mounting hole 111. The circumferential direction of the mounting hole 111 refers to the direction perpendicular to the Z direction, and the inner wall of the mounting hole 111 is parallel to the Z direction. The shape of the mounting boss T is adapted to the inner wall of the mounting hole 111. To cooperate with the mounting hole 111, the damping structure 2 has a mounting groove 21 for accommodating the mounting boss T. Among them, along the direction perpendicular to the Z direction, the radial dimension at the mounting groove 21 of the damping structure 2 is adapted to the radial dimension of the inner wall of the mounting boss T.

[0067] Among them, the damping structure 2 is made of an elastic material, such as rubber, silica gel, etc. As Figure 4a shown, to facilitate the cooperation between the damping structure 2 and the mounting hole 111, the mounting ear 11 has a bayonet 112, and the bayonet 112 communicates the outer surface of the mounting ear 11 with the mounting hole 111 along the direction perpendicular to the Z direction, so that the mounting hole 111 can communicate with the outside. When the damping structure 2 is installed into the mounting hole 111, it can enter the mounting hole 111 from the bayonet 112 along the Figure 4a direction of the black arrow shown, and the mounting groove 21 of the damping structure 2 can cooperate with the mounting boss T of the mounting hole 111 to realize the cooperative installation of the damping structure 2 and the mounting hole 111. The damping structure 2 also has a through hole 22 extending along the Z direction and penetrating the damping structure 2, and this through hole 22 can allow mounting parts such as bolts and screws to pass through, so as to fix the mounting housing 1 to the mounting position through such mounting parts.

[0068] Exemplarily, along the Z direction, the mounting boss T is located at the middle position of the mounting ear 11, so that upper and lower two steps are formed between the mounting boss T and the inner wall of the mounting hole 111, and the middle part of the inner wall of the mounting hole 111 protrudes. Correspondingly, the mounting groove 21 of the damping structure 2 is also located in the middle of the damping structure 2, so that the damping structure 2 is in a barbell shape. When the damping structure 2 cooperates with the mounting ear 11, the mounting boss T is accommodated in the mounting groove 21. Along the Z direction, the mounting hole 111 can limit the damping structure 2 to prevent the damping structure 2 from moving along the Z direction or disengaging from the mounting hole 111.

[0069] Further refer to Figure 4bSchematic cross-sectional structure diagram of the damping structure 2 cooperating with the mounting ear 11. This cross-section is along the plane formed by the Y direction and the Z direction and passes through the central axis of the through hole 22 of the damping structure 2. When the damping structure 2 is installed in the mounting hole 111 of the mounting ear 11, along the Z direction, the mounting groove 21 of the damping structure 2 is adapted to the mounting boss T of the mounting hole 111, and the structures on both sides of the mounting groove 21 of the damping structure 2 can be accommodated in the mounting holes 111 on both sides of the mounting boss T. After the damping structure 2 is installed on the mounting ear 11, the end of the damping structure 2 facing the bottom surface a2 of the mounting housing 1 protrudes from the bottom surface a2 of the mounting housing 1 to protect the mounting housing 1. At this time, as Figure 4b shown, the damping structure 2 protrudes from one side of the bottom surface of the mounting ear 11 that is flush with the bottom surface a2 of the mounting housing 1. The end of the damping structure 2 facing the top surface a1 of the mounting housing 1 can also protrude from one side of the top surface of the mounting ear 11.

[0070] Figure 4c Schematic cross-sectional structure diagram of another damping structure 2 cooperating with the mounting ear 11. This cross-section is along the plane formed by the Y direction and the Z direction and passes through the central axis of the through hole 22 of the damping structure 2. The difference from the Figure 4b structure shown is that the mounting boss T in the mounting hole 111 of the mounting ear 11 is located at the bottom of the mounting hole 111, and the lower bottom surface of the mounting boss T is flush with the lower bottom surface of the mounting ear 11. When the damping structure 2 is installed in the mounting hole 111 of the mounting ear 11, along the Z direction, the mounting groove 21 of the damping structure 2 is adapted to the mounting boss T of the mounting hole 111, the structure on the lower side of the mounting groove 21 of the damping structure 2 protrudes from the lower bottom surface of the mounting ear 11, and the structure on the upper side of the mounting groove 21 of the damping structure 2 is accommodated in the mounting hole 111.

[0071] Of course, there are other possible implementation ways for the cooperation between the damping structure 2 and the mounting ear 11, as well as the position and structure of the mounting ear 11 relative to the mounting housing 1. As long as at least part of the damping structure 2 protrudes from the bottom surface a2 of the mounting housing 1 after the damping structure 2 is installed on the mounting ear 11, so that there is a certain gap between the mounting housing 1 and the mounting position, and the vibration of the environment can only be transmitted to the mounting housing 1 through the damping structure 2 and the mounting ear 11. The damping structure 2 and the mounting ear 11 can play a buffering role, thereby weakening the vibration transmitted to the mounting housing 1 and protecting the microelectronic component 3.

[0072] Figure 5a Illustrates the top view of the mounting housing 1. As Figure 5aAs shown, the mounting housing 1 has two sets of mounting lugs 11 that are symmetric along the X direction. Each mounting lug 11 can be considered as the structure within the dashed box. Taking one of the mounting lugs 11 as an example, the mounting lug 11 with a bayonet 112 is C-shaped, and the bayonet 112 is the opening of the C shape. The mounting hole 111 formed by the inner wall of the mounting lug 11 is an open hole. The inner wall of the mounting lug 11 is C-shaped, and the mounting boss T is also C-shaped. The bayonet 112 is between the two ends of the opening of the mounting boss T. As Figure 5a shown, the width h1 of the bayonet 112 perpendicular to the Z direction is smaller than the radial dimension h2 of the inner wall of the mounting boss T. The radial dimension h2 of the inner wall of the mounting boss T is adapted to the radial dimension at the mounting groove 21 of the damping structure 2. Then, the width h1 of the bayonet 112 is smaller than the radial dimension at the mounting groove 21 of the damping structure 2. It should be understood that Figure 5a in, along the X direction, the two mounting lugs 11 on the same side of the mounting housing 1 have an integral structure. It can also be considered that these two mounting lugs 11 are one mounting lug 11 with two mounting holes 111.

[0073] Combined with Figure 5b shown, the width of the bayonet 112 along the Y direction is smaller than the radial dimension of the inner wall of the mounting boss T. When the elastic damping structure 2 is mounted onto the mounting lug 11 along the bayonet 112, the mounting groove 21 of the damping structure 2 can pass through the bayonet 112 through elastic compression deformation and enter the mounting hole 111. The radial dimension h2 of the inner wall of the mounting boss T is relatively large. The structure at the mounting groove 21 of the damping structure 2 that enters the mounting boss T can restore its shape and cooperate with the mounting boss T to fix the damping structure 2 within the mounting hole 111. Of course, the mounting groove 21 of the damping structure 2 can also be removed from the mounting hole 111 by passing through the bayonet 112 through compression deformation, realizing the disassembly of the damping structure 2. The installation and disassembly between the damping structure 2 and the mounting housing 1 are more simple and easy, which can optimize the assembly process and maintenance of the device.

[0074] Figure 6a shows the structure of the damping structure 2, Figure 6bThis is the front view of the damping structure 2. A plurality of threaded grooves 23 are provided on the outer peripheral surface of the damping structure 2, and each threaded groove 23 extends along the circumferential direction of the damping structure 2. With reference to the structure in which the damping structure 2 is assembled to the mounting housing 1, the circumferential direction of the damping structure 2 is perpendicular to the Z direction. Specifically, the threaded grooves 23 are formed on the outer peripheral surface of the damping structure 2 on both axial sides of the through hole 22 along the mounting groove 21. When the damping structure 2 receives ambient vibration energy, the presence of the threaded grooves 23 provides the damping structure 2 with more space for greater deformation in the Z direction, which can further improve the buffering effect of the damping structure 2 by deforming to absorb vibration energy. Exemplarily, taking one end of the damping structure 2 as an example, a plurality of threaded grooves 23 can be provided, and the threaded grooves 23 are mutually offset along the circumferential direction of the damping structure 2, which can not only provide more deformation space for the damping structure 2, but also ensure sufficient strength of the damping structure 2.

[0075] Figure 7a shows the structure of the microelectronic component 3, Figure 7b shows an exploded view of the microelectronic component 3. Referring together to Figure 7a and Figure 7bAs shown, the microelectronic component 3 includes a chip structure 31 and a driving structure 32. Along the Z direction, the chip structure 31 and the driving structure 32 are sequentially arranged in the accommodation cavity Q of the mounting housing 1, and the driving structure 32 is located on the side of the chip structure 31 facing the bottom surface a2. Here, the microelectronic component 3 is used as a micro mirror. The chip structure 31 includes a fixing part 311, a transfer frame 313, and a reflecting mirror 312. The fixing part 311 is used to be fixed to the mounting housing 1. The reflecting mirror 312 is connected to the fixing part 311 through the transfer frame 313, and the reflecting mirror 312 can deflect relative to the fixing part 311. Among them, the reflecting mirror 312 can be hermetically encapsulated during manufacturing. The driving structure 32 includes a bottom plate 321, an iron core 322, and a magnet group 323. The bottom plate 321 is used to be fixed to one side of the bottom surface a2 of the mounting housing 1 and does not protrude from the bottom surface a2 of the mounting housing 1. The iron core 322 is fixed to the side of the bottom plate 321 facing the top surface a1 of the mounting housing 1 and is located in the accommodation cavity Q of the mounting housing 1. The magnet group 323 is arranged on the side of the bottom plate 321 facing the top surface a1 of the mounting housing 1, and the magnet group 323 is arranged around the iron core 322 perpendicular to the Z direction. When the microelectronic component 3 is installed in the mounting housing 1, the chip structure 31, the iron core 322 of the driving structure 32, and the magnet group 323 are all located in the accommodation cavity Q of the mounting housing 1, and the bottom plate 321 of the driving structure 32 is fixed to one side of the bottom surface a2 of the mounting housing 1 to achieve bottom encapsulation. Among them, the iron core 322 and the bottom plate 321 are exemplarily an integral structure. The number and shape of the magnet group 323 are not limited and are set according to needs to form a certain magnetic field distribution. The iron core 322 is made of ferromagnetic material and can strengthen the magnetic field effect. The reflecting mirror 312 is configured with a metal coil. When the metal coil is energized, an electromagnetic field can be generated, and this electromagnetic field can interact with the magnetic field formed by the magnet group 323 to drive the reflecting mirror 312 to deflect relative to the fixing part 311. When the reflecting mirror 312 deflects, it can change the reflection angle of the electromagnetic wave incident on the reflecting mirror 312, realizing the scanning detection of the surrounding environment.

[0076] Please continue to refer to Figure 7a and Figure 7bAs shown, the microelectronic component 3 further includes a support substrate 33. The support substrate 33 is located between the chip structure 31 and the driving structure 32. The support substrate 33 is used to be fixed to the mounting housing 1, and then the chip structure 31 is fixed on the support substrate 33. The support substrate 33 can bear a certain mechanical stress. The support substrate 33 is provided with an avoidance hole 331. Along the Z direction, the orthographic projection of the reflecting mirror 312 of the chip structure 31 on the support substrate 33 falls within the area where the avoidance hole 331 is located, so as not to interfere with the deflection action of the reflecting mirror 312. The support substrate 33 can isolate the chip structure 31 from the magnet group 323. The thermal expansion coefficient of the support substrate is between that of the chip structure 31 and the magnet group 323. The support substrate 33 can play a buffering effect between the magnet 323 with different thermal expansion coefficients and the chip structure 31, improving the structural stability. Specifically, the material of the support substrate 33 can be selected as silicon or ceramic.

[0077] Figure 8 The structure of the chip structure 31 is shown. As Figure 8 shown, the center of the adapter frame 313 has a second hollow 3131. Specifically, both ends of the reflecting mirror 312 are connected to the adapter frame 313 through a pair of first connecting ribs J1, so that the reflecting mirror 312 is located within the second hollow 3131. Both ends of the adapter frame 313 are connected to the fixing part 311 through a pair of second connecting ribs J2. Both the first connecting rib J1 and the second connecting rib J2 are strip-shaped structures with large deformation capabilities. The arrangement direction of a pair of first connecting ribs J1 is exemplarily perpendicular to the arrangement direction of a pair of second connecting ribs J2. When the reflecting mirror 312 is energized and interacts with the magnetic field formed by the magnet group 323, the reflecting mirror 312 can deflect around the arrangement direction of a pair of first connecting ribs J1, and the reflecting mirror 312 can also drive the adapter frame 313 to deflect around the arrangement direction of a pair of second connecting members J2. These two deflections can be realized separately or simultaneously. It should be understood that the chip structure 31 further includes components such as a conductive structure and a control circuit, which are not detailed here.

[0078] Figure 9 The structure of the support substrate 33 is shown. As Figure 9 shown, the center of the support substrate 33 has an avoidance hole 331. The avoidance hole 331 is in a shape similar to a runway and penetrates the support substrate 33 along the thickness direction of the support 33. Around the avoidance hole 331, a plurality of positioning marks 332 are also distributed. The positioning marks 332 are used for reference when the chip structure 31 is fixed to the support substrate 33. The structure, shape, quantity and distribution mode of the positioning marks 332 are not limited. Based on Figure 8 the rectangular chip structure 31 shown, the positioning marks 332 include a plurality of broken line positioning marks and a plurality of straight line positioning marks, which jointly identify and reference the assembly of the chip structure 31.

[0079] Combined withFigure 8 and Figure 9 , Figure 10a and Figure 10b shows the structure in which the chip structure 31 is fixed to the support substrate 33. As Figure 10a shown, when observed from one side of the chip structure 31, the fixing portion 311 of the chip structure 31 is fixed to the support substrate 33, and the four corners of the chip structure 31 are adapted to four groups of zigzag positioning marks 332, and the four sides of the chip structure 31 are adapted to four groups of linear positioning marks 332. As Figure 10b shown, when observed from one side of the support substrate 33, the reflecting mirror 312 of the chip structure 31 and the adapter frame 313 connecting the reflecting mirror 312 both expose the avoidance holes 331 of the support substrate 33, and the deflection actions of the reflecting mirror 312 and the adapter frame 313 are not affected by the support substrate 33.

[0080] Figure 11a shows the structure on one side of the top surface a1 of the mounting housing 1, Figure 11b shows the structure on one side of the bottom surface a2 of the mounting housing 1.

[0081] As Figure 11a shown, the top surface a1 of the mounting housing 1 has a depression to form a first plane a11, and the first plane a11 is recessed along the thickness direction of the mounting housing 1, that is, the Z direction, so that the first plane a21 is annular and forms a stepped shape with the top surface a1. Along the Z direction, the first plane a21 is higher than the bottom of the notch 12, and the notch 12 passes through the first plane a11 along the X direction. The inner wall of the mounting housing 1 forms a receiving cavity Q between the first plane a11 and the second plane a11. The inner wall of the mounting housing 1 has a protruding portion 14 perpendicular to the Z direction, and along the Z direction, the protruding portion 14 partially protrudes from the inner edge of the first plane a11, and a space for accommodating the support substrate 33 of the microelectronic component 3 is formed between the first plane a11 and the protruding portion 14, and the surface of the protruding portion 14 facing the top surface a1 can be used to carry the support substrate 33 of the microelectronic component 3.

[0082] As Figure 11b shown, the bottom surface a2 of the mounting housing 1 has a recessed second plane a21, and the second plane a21 is recessed along the thickness direction of the mounting housing 1 to form a space for accommodating the bottom plate 321 of the driving structure 32. The protruding portion 14 protrudes toward the center of the receiving cavity Q perpendicular to the Z direction, and the surface of the protruding portion 14 facing the bottom surface a2, that is, the second plane a21, is used to carry the bottom plate 321. The mounting housing 1 also forms an annular first sealing groove 13 around the second plane a21, and the first sealing groove 13 is located between the bottom surface a2 and the second plane a21 and is recessed toward the top surface a1 side. The second plane a21 of the mounting housing 1 also has a first connection hole 16 for connecting the bottom plate 321 of the driving structure 32. The opening of the first connection hole 16 is located on the second plane a21.

[0083] Figure 12a and Figure 12b shows a schematic assembly structure between the drive structure 32 and the mounting housing 1. The inner wall shape of the accommodation cavity Q of the mounting housing 1 is adapted to the shape of the magnet group 323. The bottom plate 321 is provided with a first through hole 3211, and the first screw 35 can pass through the first through hole 3211 on the bottom plate 321 and be connected and fixed to the first connection hole 16 of the mounting housing 1, so as to fix the bottom plate 321 to the protruding portion 14 of the mounting housing 1. The bottom plate 321 is in contact with the second plane a21 and is accommodated in the space between the second plane a21 and the bottom surface a2, so that the bottom plate 321 does not protrude from the bottom surface a2. A first sealing structure 34 is provided between the mounting housing 1 and the bottom plate 321, and the first sealing structure 34 is exemplified as a sealing ring. The first sealing structure 34 can be embedded in the first sealing groove 13, and the first sealing structure 34 can be in interference fit with the first sealing groove 13 to play a sealing role between the bottom plate 321 and the mounting housing 1.

[0084] Figure 13a and Figure 13b shows the structure of the microelectronic component 3 mounted on the mounting housing 1. As Figure 13a shown on one side of the top surface a1 of the mounting housing 1, the support substrate 33 of the microelectronic component 3 is accommodated in the space formed by the first plane a21 and the protruding portion 14 of the mounting housing 1, and the support substrate 33 can abut against the surface of the protruding portion 14 on the side facing the top surface a1. The chip structure 31 fixed on the support substrate 33 can be electrically connected to external devices through the notch 12 on the mounting housing 1. As Figure 13b shown on one side of the bottom surface a2 of the mounting housing 1, the bottom plate 321 of the microelectronic component 3 is accommodated in the space formed by the second plane a21 and the bottom surface a2 of the mounting housing 1, and the bottom plate 321 can abut against the second plane a21, that is, abut against the surface of the protruding portion 14 facing the bottom surface a2, and the bottom plate 321 does not protrude from the bottom surface a2 of the mounting housing 1. Here, the bottom plate 321 blocks the second plane a21, and the second plane a21 is not shown.

[0085] Figure 14 shows a schematic diagram of the microelectromechanical device 10 being electrically connected to external devices through the signal line 70. As Figure 14As shown, the chip structure 31 is fixed to the mounting housing 1 through the support substrate 33. The driving structure 32 can drive the deflection of the reflecting mirror 312 of the chip structure 31 to reflect electromagnetic waves to achieve environmental scanning. The signal line 70 is used to connect one end of the microelectronic component 3, passes through the notch 12 and enters the accommodation cavity Q of the mounting housing 1, and is electrically connected to the chip structure 31 of the microelectronic component 3. The signals obtained by scanning the chip structure 31 can be transmitted to external devices through the signal line 70. Among them, neither the chip structure 31 nor the signal line 70 protrudes from the top surface a1 of the mounting housing 1, and the mounting housing 1 can protect the chip structure 31 and the signal line 70.

[0086] In some embodiments, the top surface a1 side of the microelectromechanical device 10 is also encapsulated. As Figure 15a shown, the microelectromechanical device 10 includes a top cover assembly 4. The top cover assembly 4 includes a top shell 41 and a transparent optical window 42. The top shell 41 is fixed to the top surface a1 of the mounting housing 1. The top shell 41 has a first hollow 411 communicating with the accommodation cavity Q of the mounting housing 1. The transparent optical window 42 is fixed to the top shell 41, and the transparent optical window 42 covers the first hollow 411 of the top shell 41. The transparent optical window 42 is a transparent material without optical power, and can specifically be glass or plastic, which can ensure that electromagnetic waves pass through smoothly. Among them, the transparent optical window 42 is fixed to the side of the top shell 41 facing the mounting housing 1. In some possible scenarios, the lens optical window 42 has a certain band screening function, so that some electromagnetic waves can pass through, while another part of the electromagnetic waves is blocked.

[0087] Figure 15b An exploded view of the microelectromechanical device 10 is shown. The top shell 41 is exemplarily fixed to the mounting housing 1 through the second screw 44. Of course, the connection and fixation between the top shell 41 and the mounting housing 1 can also be achieved by other means. A sealing structure 43 is also provided between the top shell 41 and the mounting housing 1. The second sealing structure 43 is exemplarily an O-ring.

[0088] When the top cover assembly 4 is installed on the mounting housing 1, electromagnetic waves can only enter the microelectromechanical device 10 through the transparent optical window 42 and be received by the microelectronic component 3. When electromagnetic waves irradiate the transparent optical window 42, the surface of the transparent optical window 42 will reflect the electromagnetic waves. The reflected electromagnetic waves are unnecessary electromagnetic waves for the signal receiving side of the microelectromechanical device 10 and may also interfere with the detection results. Therefore, in some embodiments, the transparent optical window 42 and the plane where the microelectronic component 3 is located are arranged at an angle, and the angle is 0-15°. Exemplarily, the plane where the microelectronic component 3 is located is parallel to the top surface a1 of the mounting housing 1. Therefore, as long as the lens optical window 42 and the top surface a1 of the mounting housing 1 are arranged at an angle.

[0089] Figure 16a andFigure 16b shows the structure of the top shell 41. With reference to the state where the top shell 41 is installed on the installation shell 1, the thickness of the top shell 41 is also the thickness of the installation shell 1. Referring together to Figure 16a and Figure 16b as shown, along the thickness direction of the top shell 41, the top shell 41 has a top surface b1 and a bottom surface b2, and the first hollow 411 penetrates the top shell 41 along the thickness direction of the top shell 41. As Figure 16b shown, the inner wall of the first hollow 411 of the top shell 41 has an abutting surface b3, which is used to install the transparent light window 42, and the abutting surface b3 is parallel to the top surface b1. A space for accommodating the transparent light window 42 is formed between the abutting surface b3 and the inner wall of the first hollow 411. In addition, on one side of the bottom surface b2 of the top shell 41, there is a ring-shaped protrusion 412, which protrudes from the bottom surface b2 along the thickness direction of the top shell 41 for cooperating with the installation shell 1. On one side of the bottom surface b2 of the top shell 41, there is also a convex block 413, which is used to cooperate with the notch 12 of the installation shell 1. The top shell 41 also has a second through hole 414 that penetrates the top shell 41 along the thickness direction of the top shell 41, and the second screw 44 can pass through the second through hole 414 to be fixedly connected to the installation shell 1.

[0090] Figure 16c shows the right view of the top shell 41. An included angle α is provided between the top surface b1 and the bottom surface b2 of the top shell 41, and the included angle α between the top surface b1 and the bottom surface b2 is 0 - 15°. When an included angle α is provided between the top surface b1 and the bottom surface b2, an included angle α is also provided between the abutting surface b3 and the bottom surface b2. When the transparent light window 42 is installed on the top shell 41, the transparent light window 42 is accommodated in the space formed between the abutting surface b3 and the inner wall of the first hollow 411, and the surface of the transparent light window 42 facing the top surface b1 abuts against the abutting surface b3. The transparent light window 42 can be fixed to the top shell 41 by means of gluing, welding, etc. Since an included angle α is provided between the abutting surface b3 and the bottom surface b2, an included angle α is provided between the transparent light window 42 and the bottom surface b2.

[0091] In order to cooperate with the structure of the top shell 41, Figure 17a shows the structure of the installation shell 1. A second sealing groove 15 is provided on the top surface a1 of the installation shell 1, and the second sealing groove 15 is used to accommodate the ring-shaped protrusion 412 of the top shell 41 and the second sealing structure 43. When the top shell 41 is fixed to the installation shell 1, the second sealing structure 43 is embedded into the second sealing groove 15, and then the ring-shaped protrusion 412 of the top shell 41 is embedded into the second sealing groove 15. The second sealing structure 43 is located between the ring-shaped protrusion 412 and the second sealing groove 15 to play a sealing role. A second connection hole 17 is provided on the top surface a1 of the installation shell 1 for installing and fixing the second screw 44.

[0092] Figure 17bThe structure in which the top shell 41 is fixed to the mounting shell 1 by the second screw 44 is shown. The second screw 44 passes through the second through hole 414 of the top shell 41 and is fixedly connected to the second connection hole 17 on the base 1. As Figure 17b shown, the bump 413 of the top shell 41 is inserted into the notch 12 of the mounting shell 1 along the thickness direction of the mounting shell 1. Along the Z direction, there is a gap c between the bump 413 and the notch 12, and this gap c is used for the signal line 70 to pass through.

[0093] Figure 18a The schematic structural diagram of the microelectromechanical device 10 fixed to the mounting panel 60 is shown. As Figure 18a shown, the mounting shell 1 of the microelectromechanical device 10 is fixed to the mounting panel 60 through the mounting member 5, and one side of the bottom surface a2 of the mounting shell 1 faces the mounting panel 60. Exemplarily, the mounting member 5 is a bolt or a screw, and the mounting member 5 passes through the mounting ear 11 and the damping structure 2 of the mounting shell 1 and is connected and fixed to the mounting panel 60.

[0094] Figure 18b The right view of the microelectromechanical device 10 fixed to the mounting panel 60 is shown. The surface of the mounting panel 60 here can be considered as the mounting position towards which the bottom surface a2 of the mounting shell 1 faces. The damping structure 2 protrudes from the bottom surface a2 of the mounting shell 1 and contacts the mounting panel 60, so that there is a gap M between the bottom surface a2 of the mounting shell 1 and the mounting panel 60. When the mounting panel 60 vibrates, the vibration energy is transmitted from the mounting panel 60 to the damping structure 2, and then to the mounting ear 11 through the damping structure 2. The damping structure 2 and the mounting ear 11 are deformed due to the vibration, absorbing a part of the vibration energy, and finally the vibration energy transmitted to the mounting shell 1 is reduced, which can protect the microelectronic component 3 installed in the mounting shell 1 and improve the reliability of the device.

[0095] The microelectronic component 3 in the microelectromechanical device 10 provided by the embodiment of the present application is used as a micro-vibrating mirror. During operation, external electromagnetic waves can be transmitted to the reflecting mirror 312 of the microelectronic component 3 through the transparent optical window 42, and the reflecting mirror 312 reflects the electromagnetic waves. When the reflecting mirror 312 deflects, the angle of the reflected electromagnetic waves can be changed to achieve the scanning of the environment. Please continue to refer to Figure 18bAs shown, the transparent optical window 42 is installed inside the top shell 41, and the reflecting mirror 312 is installed inside the installation housing 1. The transparent optical window 42 and the reflecting mirror 312 are shown by dashed lines. Among them, the reflecting mirror 312 is shown in a state parallel to the bottom surface a2 of the installation housing 1, and the transparent optical window 42 is arranged at an angle α with respect to the bottom surface a2 of the installation housing 1. It can be considered that the plane where the transparent optical window 42 is located and the plane where the reflecting mirror 312 is located are arranged at an angle α. The incident electromagnetic wave L1 of the incident microelectromechanical device 10 first reaches the transparent optical window 42, and the transparent optical window 42 reflects the electromagnetic wave to form an outgoing electromagnetic wave L2'. Other incident electromagnetic waves L1 pass through the transparent optical window 42 and irradiate the reflecting mirror 312, and the reflecting mirror 312 reflects the electromagnetic wave to form an outgoing electromagnetic wave L2. The outgoing electromagnetic wave L2 is the target signal, and the outgoing electromagnetic wave L2' can be considered as an interference signal. Since the plane where the transparent optical window 42 is located and the plane where the reflecting mirror 312 is located are arranged at an angle α, the directions of the outgoing electromagnetic wave L2' and the outgoing electromagnetic wave L2 are different, and the interference of the outgoing electromagnetic wave L2' on the target signal reception can be avoided through the angle deviation between the two.

[0096] Figure 19 Figure 4 shows the comparison of the simulated vibration damping effects of the microelectromechanical device 10 provided by the embodiment of the present application and the traditional micro-vibrating mirror in a vibrating environment. As Figure 19 shown, the curve S0 is the amplitude change of the traditional micro-vibrating mirror without vibration damping protection in a vibrating environment with different frequencies, the curve S1 is the amplitude change of the installation housing 1 of the microelectromechanical device 10 provided by the embodiment of the present application in a vibrating environment with different frequencies, and the curve S2 is the amplitude change of the microelectronic component 3 of the microelectromechanical device 10 provided by the embodiment of the present application in a vibrating environment with different frequencies. It can be seen that in the same vibrating environment, the microelectromechanical device 10 provided by the embodiment of the present application can provide good vibration damping protection for the microelectronic component 3, and improve the reliability and safety of the device.

[0097] It should be understood that the microelectronic component 3 in the microelectromechanical device 10 in the above embodiments of the present application is taken as an example of a micro-vibrating mirror and can be used in the field of lidar. When the microelectronic component 3 is other microelectronic structures, the buffer and anti-seismic effects can still be exerted through the installation ears 11 and the damping structure 2. Therefore, the structure of setting the installation ears 11 and the damping structure 2 in the installation housing 1 can also be applied to the microelectromechanical devices 10 in other fields. For example, the microelectromechanical device 10 may also be a device such as a sensor, an accelerometer, a gyroscope, etc., and the electronic device including the microelectromechanical device 10 corresponds to a sensor device, an accelerometer device, a gyroscope device, etc.

[0098] The above is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A microelectromechanical device, characterized in that, It includes an installation housing, a damping structure and a microelectronic component; At least a pair of mounting ears are provided on the side of the installation housing, and each pair of the mounting ears is symmetrical about the installation housing. The mounting ears are used to mount and fix the installation housing in the thickness direction of the installation housing; the thickness of the mounting ears is less than the thickness of the installation housing; The installation housing has a receiving cavity, the microelectronic component is installed in the receiving cavity, and at least part of the damping structure protrudes from the bottom surface of the installation housing.

2. The microelectromechanical device according to claim 1, wherein The mounting ear has a mounting hole for mounting the damping structure, and the mounting hole penetrates the mounting ear in the thickness direction of the installation housing; The inner wall of the mounting hole has a mounting boss, and the mounting boss extends along the circumferential direction of the mounting hole; The damping structure has a mounting groove for receiving the mounting boss.

3. The microelectromechanical device according to claim 2, wherein The damping structure is made of an elastic material. The mounting ear has a bayonet, and the bayonet communicates the outer surface of the mounting ear with the mounting hole in the direction perpendicular to the thickness direction of the installation housing, and the width of the bayonet in the direction perpendicular to the thickness direction of the installation housing is less than the radial dimension of the mounting boss.

4. The microelectromechanical device according to any one of claims 1 to 3, characterized in that A plurality of threaded grooves are provided on the outer peripheral surface of the damping structure, and the threaded grooves extend in the direction perpendicular to the thickness direction of the installation housing, and the plurality of threaded grooves are arranged in a circumferentially staggered manner along the damping structure.

5. The microelectromechanical device according to any one of claims 1 to 4, characterized in that, The microelectromechanical device includes a top cover assembly, and the top cover assembly includes a top shell and a transparent optical window; The top shell is fixed to the top surface of the installation housing, and the top cover has a first hollow that communicates with the receiving cavity; The transparent optical window is fixed to the top cover, and the transparent optical window covers the first hollow of the top cover.

6. The microelectromechanical device according to claim 5, wherein The transparent optical window is arranged at an angle with the plane where the microelectronic component is located, and the angle is 0-15°.

7. The microelectromechanical device according to claim 5 or 6, characterized in that, A sealing structure is provided between the top shell and the installation housing.

8. The microelectromechanical device according to any one of claims 1-7, characterized in that, The microelectronic component includes a chip structure and a driving structure; The driving structure is fixed to the installation housing, and the chip structure is arranged in the receiving cavity of the installation housing; The chip structure includes a reflecting mirror, and the driving structure is used to drive the reflecting mirror to deflect.

9. The microelectromechanical device according to claim 8, wherein, The driving structure includes a bottom plate and a magnet group; The bottom plate is fixed to one side of the bottom surface of the installation housing and does not protrude from the bottom surface of the installation shell; The magnet group is located in the receiving cavity of the installation housing and is fixed to the bottom plate.

10. The microelectromechanical device according to claim 9, wherein, The driving structure includes an iron core, and the iron core is fixed to the top surface side of the bottom plate facing the installation housing and is located in the receiving cavity; Along the direction perpendicular to the thickness direction of the installation housing, the magnet group is arranged around the iron core.

11. The microelectromechanical device according to claim 9 or 10, characterized in that, A sealing structure is provided between the bottom plate and the installation housing.

12. The microelectromechanical device according to any one of claims 8-11, characterized in that, The microelectronic component further includes a support substrate arranged between the chip structure and the driving structure. The support substrate is fixed to the installation housing, the chip structure is installed on the support substrate, and the support substrate has an avoidance hole; Along the thickness direction of the installation housing, the avoidance hole penetrates the support substrate, and the orthographic projection of the reflecting mirror on the support substrate falls within the avoidance hole.

13. The microelectromechanical device according to claim 12, wherein The material of the support substrate is ceramic or silicon.

14. An electronic device, characterized in that, Comprising a monitoring device and a microelectromechanical device as described in any one of claims 1-13, the monitoring device being configured to detect a signal emitted by the microelectronic component.

15. A radar monitoring device, characterized in that, Comprising a laser, a monitoring device and a microelectromechanical device as described in any one of claims 1-13; The laser is configured to emit a laser signal, the microelectronic component is configured to reflect the laser signal, and the monitoring device is configured to monitor the laser signal reflected by the microelectronic component.

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