Heat dissipation adhesive tape, backlight module and preparation method of heat dissipation adhesive tape

Abstract

The embodiment of the invention discloses a heat dissipation adhesive tape, a backlight module and a preparation method of the heat dissipation adhesive tape. The heat dissipation adhesive tape comprises a base material layer and a heat-conducting adhesive layer, the heat-conducting glue layer covers the surface of one side, deviating from the backboard, of the circuit board, and the base material layer covers the surface of one side, deviating from the circuit board, of the heat-conducting glue layer; the area of the heat-conducting glue layer is smaller than that of the base material layer, and the base material layer comprises a bonding part protruding out of the peripheral edge of the heat-conducting glue layer and support lug parts formed by extending the bonding part towards the left side and the right side; the heat dissipation adhesive tape comprises a non-press-fit state and a press-fit state; when the heat dissipation adhesive tape is in a press fit state, the heat conduction adhesive layer comprises a first attaching part and a second attaching part, the first attaching part is attached to the upper surface of a component of the circuit board, and the second attaching part is embedded between adjacent components and attached to the side wall of the component. Heat generated by the circuit board heating element of the circuit board is conducted to the outside through the heat dissipation adhesive tape to be dissipated, the problem that a film material of the backlight module is wrinkled is avoided, and meanwhile the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation tapes. More specifically, it relates to a heat dissipation tape, a backlight module, and a method for preparing a heat dissipation tape. Background Art

[0002] Currently, both high refresh rate display modules and MINI LED modules are facing the problem that some components on the PCB board generate excessive heat due to overloading of components. To solve this problem, existing design solutions mostly use large-area sheet-shaped thermal conductive tapes. Such thermal conductive tapes can be composed of one or more materials and have good thermal conductivity. Common ones include aluminum foil tapes, graphene tapes, filled acrylic polymer tapes, etc. Since the area of the sheet-shaped thermal conductive tape is large, most of its area can extend and adhere to the surface of the backplane, thereby conducting heat from the PCB board to the main body of the backlight module for sharing, achieving the purpose of heat dissipation.

[0003] However, as Figure 1-2 shown in the schematic diagram and cross-sectional view of the sheet-shaped thermal conductive tape attached to the PCB board, the sheet-shaped thermal conductive tape can only contact the upper surface of the heat-generating component, and heat can only be introduced into the surrounding through the upper surface layer of the tape in the direction shown by the arrow, with low thermal conductivity and unsatisfactory cooling effect on the heat-generating component. In addition, when the sheet-shaped thermal conductive tape is attached to the PCB board, it will form a structure similar to a vacuum insulation layer in the gap between adjacent components (such as the part circled by the dotted line in Figure 2 ), and the air in the gap cannot flow, so convective heat dissipation cannot be formed, which is not conducive to the overall thermal conductivity of the sheet-shaped thermal conductive tape. Moreover, the sheet-shaped thermal conductive tape dissipates heat by conducting heat to the backplane, and this method will cause serious wrinkling problems of the film material at the corresponding position in the backlight module, affecting the quality of the picture presented by the module. Summary of the Invention

[0004] In view of the above problems, an object of the present invention is to provide a heat dissipation tape with excellent heat dissipation effect.

[0005] Another object of the present invention is to provide a backlight module including the above heat dissipation tape.

[0006] Still another object of the present invention is to provide a method for preparing the above heat dissipation tape.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] According to one aspect of the present invention, there is provided a heat dissipation tape, comprising:

[0009] a base material layer and a thermal conductive adhesive layer;

[0010] The heat-conducting adhesive layer covers one side surface of the circuit board facing away from the backplane, and the base material layer covers one side surface of the heat-conducting adhesive layer facing away from the circuit board;

[0011] The area of the heat-conducting adhesive layer is smaller than the area of the base material layer. The base material layer includes an adhesive part protruding from the four peripheral edges of the heat-conducting adhesive layer, and support ear parts extending from the adhesive part to the left and right sides;

[0012] The heat-dissipating tape includes an un-pressed state and a pressed state. When the heat-dissipating tape is in the pressed state, the circuit board is fixed to the backplane;

[0013] When the heat-dissipating tape is in the pressed state, the heat-conducting adhesive layer includes a first fitting part and a second fitting part. The first fitting part fits on the upper surface of the components of the circuit board, and the second fitting part is embedded between adjacent components and fits on the side walls of the components.

[0014] In addition, an optional solution is that the second fitting part is formed by the first fitting part protruding in the direction close to the circuit board;

[0015] The second fitting part is at least located in the gap between the heat-generating element of the circuit board and the adjacent components of the heat-generating element.

[0016] In addition, an optional solution is that the ratio of the orthographic projection area of the first fitting part on the backplane to the orthographic projection area of the second fitting part on the backplane is 5:1.

[0017] In addition, an optional solution is that the calculation formula for the thickness A of the heat-conducting adhesive layer in the un-pressed state is:

[0018] B*(1 + 17%) ≤ A ≤ B*(1 + 23%)

[0019] Wherein, B is the height of the heat-generating element of the circuit board. When the circuit board includes multiple heat-generating elements, B takes the maximum value.

[0020] In addition, an optional solution is that the value range of the thickness A of the heat-conducting adhesive layer in the un-pressed state is: 1.287 mm - 1.353 mm.

[0021] In addition, an optional solution is that the heat-dissipating tape further includes a first adhesive layer covering one side surface of the base material layer close to the heat-conducting adhesive layer, and the first adhesive layer is configured to fix the heat-dissipating tape to the outer surfaces of the circuit board and the backplane.

[0022] In addition, an optional solution is that the first adhesive layer evenly covers the adhesive part and the support ear parts, and the adhesive part fits and is fixed to the part of the backplane close to the edge of the circuit board; or

[0023] The bonding part is adhesively fixed to the edge of the circuit board and the part of the backplane close to the edge of the circuit board.

[0024] In addition, an optional solution is that the first adhesive layer includes a first adhesive part corresponding to the heat-conducting adhesive layer and a second adhesive part covering the bonding part and the ear parts;

[0025] The first adhesive part connects the base material layer and the heat-conducting adhesive layer;

[0026] The bonding part is adhesively fixed to the part of the backplane close to the edge of the circuit board through the second adhesive part; or

[0027] Adhesively fixed to the edge of the circuit board and the part of the backplane close to the edge of the circuit board.

[0028] In addition, an optional solution is that the heat-dissipating tape further includes a second adhesive layer covering one side surface of the base material layer away from the heat-conducting adhesive layer.

[0029] In addition, an optional solution is that the heat-conducting adhesive layer includes silicone resin, aluminum oxide, polytetrafluoroethylene and an adhesive;

[0030] Among them, the weight part ratio of the aluminum oxide to the polytetrafluoroethylene is 1:2.

[0031] According to another aspect of the present invention, there is provided a backlight module, including a backplane, a circuit board, and a heat-dissipating tape, and the circuit board is fixed to the backplane through the heat-dissipating tape.

[0032] According to still another aspect of the present invention, there is provided a method for preparing a heat-dissipating tape, including:

[0033] Calculating the required thickness of the heat-conducting adhesive layer according to the height of the heat-generating element of the circuit board to be installed;

[0034] Covering a heat-conducting adhesive clay with this thickness on the release film;

[0035] Cutting the heat-conducting adhesive clay according to the shape of the circuit board to be installed, removing the waste materials, and obtaining the heat-conducting adhesive layer;

[0036] Covering the base material layer on one side of the obtained heat-conducting adhesive layer away from the release film to obtain the heat-dissipating tape.

[0037] The beneficial effects of the present invention are as follows:

[0038] A heat dissipation tape, a backlight module and a preparation method of the heat dissipation tape are provided to solve the technical problems existing in the prior art. By combining a base material layer with a thermally conductive adhesive layer having strong composite plasticity, the heat generated by the heat generating elements of the circuit board is only conducted on the circuit board and dissipated to the outside through the heat dissipation tape, avoiding the tape from introducing heat into the backplane, thereby preventing the occurrence of film wrinkles in the backlight module and ensuring the display quality. The heat dissipation tape is used in the same manner as the existing method, without causing additional man-hour costs. During the smoothing operation, the thermally conductive adhesive layer can be embedded into the gaps between the components and adhered to the side walls of the components, increasing the contact area between the thermally conductive adhesive layer and the heat generating elements, enabling the heat to be evenly conducted from all contact positions between the thermally conductive adhesive layer and the components to the surrounding area, and then diffusing to other positions of the circuit board and then to the outside, improving the heat conduction efficiency of the heat dissipation tape, and thus enhancing the heat dissipation efficiency and effect. In addition, the manufacturing composite process of the heat dissipation tape is simple and easy to implement, with low raw material costs and mass production feasibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The following further elaborates in detail on the specific embodiments of the present invention with reference to the accompanying drawings.

[0040] Figure 1 Schematic diagram showing a sheet-shaped heat dissipation tape attached to the backplane.

[0041] Figure 2 Cross-sectional view showing a sheet-shaped heat dissipation tape attached to the backplane.

[0042] Figure 3 Schematic diagram showing the heat dissipation tape provided by the embodiment of the present invention attached to the backplane.

[0043] Figure 4 Schematic structural diagram of the heat dissipation tape provided by the embodiment of the present invention.

[0044] Figure 5 Cross-sectional view showing the heat dissipation tape provided by the embodiment of the present invention attached to the backplane in an un-pressed state.

[0045] Figure 6 Cross-sectional view showing the heat dissipation tape provided by the embodiment of the present invention attached to the backplane in a pressed state.

[0046] Figure 7 Flowchart showing the preparation method of the heat dissipation tape provided by the embodiment of the present invention.

[0047] Figures 8a-8c Process flowchart showing the preparation method of the heat dissipation tape provided by the embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0048] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the sake of description, only the parts related to the present invention are shown in the drawings, rather than all the structures.

[0049] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0050] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween.

[0051] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left", and "right" are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0052] Currently, both high refresh rate display modules and MINI LED modules are facing the problem that some components on the PCB board heat up severely due to excessive load of the components. To solve this problem, most of the existing design solutions adopt large-area sheet thermal conductive tapes. Such thermal conductive tapes can be composed of one or more materials and have good thermal conductivity. Commonly used ones include aluminum foil tapes, graphene tapes, filled acrylic polymer tapes, etc. Since the area of the sheet thermal conductive tape is large, most of its area can extend and adhere to the surface of the backplane, so as to conduct the heat from the PCB board to the backlight module body for sharing, achieving the purpose of heat dissipation.

[0053] However, as Figure 1-2 the schematic diagram and cross-sectional view of the sheet thermal conductive tape 400 adhered to the PCB board shown, the sheet thermal conductive tape can only contact the upper surface of the heating element, and the heat can only be introduced into the surrounding through the upper surface layer of the tape in the direction shown by the arrow, with low thermal conductivity and unsatisfactory cooling effect on the heating element. In addition, when the sheet thermal conductive tape 400 is adhered to the PCB board, it will form a structure similar to a vacuum insulation layer in the gap between adjacent components (asFigure 2 (the part circled by the dotted line in the middle), the air in the gap cannot flow, so convection heat dissipation cannot be formed, which is not conducive to the overall thermal conductivity of the sheet thermal conductive tape. Moreover, the sheet thermal conductive tape dissipates heat by conducting heat to the backplane, and this method will cause serious wrinkling problems of the film material corresponding to this position in the backlight module, affecting the quality of the picture presented by the module.

[0054] In view of the deficiencies of the prior art, an embodiment of the present invention provides a heat dissipation tape for fixing a circuit board to a backplane. As Figures 4-6 shown, the heat dissipation tape 100 includes a stacked base material layer 1 and a thermal conductive adhesive layer 2. The thermal conductive adhesive layer 2 is in contact with the circuit board 300, and the base material layer 1 wraps around the outside of the thermal conductive adhesive layer 2 and the circuit board 300 and adheres to the outer surface of the backplane 200.

[0055] The thermal conductive adhesive layer 2 covers one side surface of the circuit board 300 facing away from the backplane 200, and the base material layer 1 covers one side surface of the thermal conductive adhesive layer 2 facing away from the circuit board 300.

[0056] As Figure 4 shown, the projected area of the thermal conductive adhesive layer 2 on the horizontal plane is smaller than the projected area of the base material layer 1 on the horizontal plane. The base material layer 1 includes an adhesive portion 11 protruding from the four peripheral edges of the thermal conductive adhesive layer 2, and support ear portions 12 extending from the adhesive portion 11 to the left and right sides. The adhesive portion 11 and the support ear portions 12 have adhesiveness and can adhere to the backplane 200. The support ear portions 12 can increase the adhesive area between the base material layer 1 and the backplane 200, making the circuit board 300 fixed more firmly.

[0057] As Figures 5-6 shown, the heat dissipation tape 100 includes an un-pressed state and a pressed state. The un-pressed state is the state when the heat dissipation tape 100 is initially attached to the circuit board 300 and the backplane 200, and the pressed state is the use state of the heat dissipation tape 100 after a smoothing operation is performed on the heat dissipation tape 100. When the heat dissipation tape 100 is in the pressed state, the circuit board 300 is fixed to the backplane 200.

[0058] In this embodiment, as Figure 6As shown, when the heat dissipation tape 100 is in a pressed state, the thermal conductive adhesive layer 2 includes a first fitting portion 21 and a second fitting portion 22. The first fitting portion 21 evenly covers the upper surfaces of the respective components of the circuit board 300, and the second fitting portion 22 is embedded in the gaps between adjacent components and fits against the side walls of the components. The contact area between the thermal conductive adhesive layer 2 and the components is larger than that of the traditional sheet-like thermal conductive tape and the components, enabling heat to be evenly conducted from all contact positions between the thermal conductive adhesive layer 2 and the components to the surrounding area, and then diffusing to other positions of the circuit board 300 and then to the outside, improving the heat conduction efficiency of the heat dissipation tape 100 and thus the heat dissipation efficiency.

[0059] In a specific embodiment, the thermal conductive adhesive layer 2 is a thermal conductive paste, which has the advantages of high thermal conductivity, good plasticity, no melting and no precipitation at high temperatures, good insulation, and excellent corrosion resistance, and can be adjusted in shape according to requirements to fit the structure of the circuit board 300. After the heat dissipation tape 100 is smoothed, the first fitting portion 21 is completely fitted against the upper surfaces of the respective components under the action of an external force and bulges towards the circuit board 300 to fill the gaps between adjacent components. The portion of the thermal conductive adhesive layer 2 located in the gaps between adjacent components is the second fitting portion 22.

[0060] The components of the circuit board 300 include heat generating elements 301. When the heat generating elements 301 are overloaded during use, it will cause heat generation in the corresponding area of the circuit board 300. The heat generating elements 301 generally include one or several of components such as transformers, integrated circuits, diodes, triodes, and resistors. The layout positions of the respective heat generating elements 301 on the circuit board 300 can be adjacent or can be separately arranged in specific areas, specifically determined according to the usage requirements of the circuit board 300. The function of the thermal conductive adhesive layer 2 is to expand the contact area with the heat generating elements 301 and conduct the heat to the outside, so that the heat generated by the heat generating elements in the circuit board 300 is only conducted inside the circuit board 300 and dissipated to the outside, without affecting the film materials in the backlight module.

[0061] In this embodiment, the second fitting portion 22 can fill the gaps between all the components on the circuit board 300, or can only fill the gaps between the heat generating element 301 and the adjacent components of the heat generating element 301 to ensure that the thermal conductive adhesive layer 2 and the heat generating element 301 have sufficient contact area and improve the heat conduction efficiency.

[0062] In one embodiment, the ratio of the area occupied by each component arranged on the circuit board 300 to the area of the gaps between the components is 5:1. When the second bonding portion 22 is filled in the gaps between each component on the circuit board 300, the ratio of the orthographic projection area of the first bonding portion 21 on the backplane 200 to the orthographic projection area of the second bonding portion 22 on the backplane 200 is 5:1.

[0063] In a specific embodiment, since the thermal conductive adhesive layer 2 needs to be smoothed during use so that the second bonding portion 22 can be embedded in the gaps between the components, the thickness A of the thermal conductive adhesive layer 2 in the un-pressed state is affected by the height B of the heating element 301. Specifically, in the un-pressed state, the calculation formula for the thickness A of the thermal conductive adhesive layer 2 is:

[0064] B*(1 + 17%) ≤ A ≤ B*(1 + 23%)

[0065] Wherein, when the circuit board 300 includes multiple heating elements 301, the value of B should be the height value of the heating element 301 with the highest height.

[0066] In an alternative example, the height of the heating element 301 is B = 1.1 mm. According to the above formula, the value range of the thickness A of the thermal conductive adhesive layer 2 in the un-pressed state is calculated to be 1.287 mm - 1.353 mm.

[0067] It should be noted that the value of the thickness A of the thermal conductive adhesive layer 2 in the un-pressed state can be adjusted according to the above formula in combination with the actual application product to ensure that the overall thickness of the backlight module in the pressed state meets the specifications.

[0068] In a specific embodiment, the heat dissipation tape 100 further includes a first adhesive layer (not shown in the figure) uniformly covering one side surface of the base material layer 1 close to the thermal conductive adhesive layer 2. The first adhesive layer can make one side of the base material layer 1 close to the thermal conductive adhesive layer 2 have adhesiveness, so that the heat dissipation tape 100 can be adhered and fixed to the outer surfaces of the circuit board 300 and the backplane 200.

[0069] The first adhesive layer is an acrylic pressure-sensitive adhesive, which has good thermal conductivity and adhesiveness, can effectively conduct heat to the outside for heat dissipation, and connect the circuit board 300 and the backplane 200.

[0070] In one embodiment, as Figure 4 shown, the first adhesive layer only covers the bonding portion 11 and the ear portion 12. The part of the base material layer 1 covering the thermal conductive adhesive layer 2 is the body portion, and the first adhesive layer is not coated on the body portion. The first adhesive layer imparts adhesiveness to the bonding portion 11 and the ear portion 12.

[0071] The body part is wrapped around the outer side of the circuit board 300. The bonding part 11 is located at the outer edge of the body part and is adhesively fixed to the part of the backplane 200 close to the edge of the circuit board 300, or the bonding part 11 is adhesively fixed to the edge of the circuit board 300 and the part of the backplane 200 close to the edge of the circuit board 300 to fix the circuit board 300 on the backplane 200. At the same time, the connection area between the base material layer 1 and the backplane 200 is increased through the support ear part 12, making the connection between the heat dissipation tape 100 and the backplane 200 more stable.

[0072] In one embodiment, the first adhesive layer includes a first adhesive part covering the body part and a second adhesive part correspondingly covering the bonding part 111 and the support ear part 12. The first adhesive part 3 connects the base material layer 1 and the thermal conductive adhesive layer 2, making the combination between the base material layer 1 and the thermal conductive adhesive layer 2 more stable.

[0073] The second adhesive part gives adhesiveness to the bonding part 11 and the support ear part 12. The body part is wrapped around the outer side of the circuit board 300. The bonding part 11 is located at the outer edge of the body part and is adhesively fixed to the part of the backplane 200 close to the edge of the circuit board 300, or the bonding part 11 is adhesively fixed to the edge of the circuit board 300 and the part of the backplane 200 close to the edge of the circuit board 300 to fix the circuit board 300 on the backplane 200. At the same time, the connection area between the base material layer 1 and the backplane 200 is increased through the support ear part 12, making the connection between the heat dissipation tape 100 and the backplane 200 more stable.

[0074] In this embodiment, the base material layer 1 is an aluminum foil sheet. The aluminum foil sheet has the advantages of high thermal conductivity, waterproof, moisture-proof, corrosion-resistant, easy to process, low cost, etc., and can be cut and processed into any shape and size according to requirements, making the heat dissipation tape applicable to a variety of use environments and scenarios. Or, in other embodiments, the base material layer 1 can also use a composite double-sided adhesive with excellent thermal conductivity, which can eliminate the coating step of the first adhesive layer and improve production efficiency.

[0075] In a specific embodiment, the heat dissipation tape 100 further includes a second adhesive layer (not shown in the figure) evenly covering the surface of the base material layer 1 away from the thermal conductive adhesive layer 2. The installation and fixation of the backplane 200 can be assisted through the second adhesive layer.

[0076] In a specific embodiment, the thermal conductive adhesive layer 2 includes silicone resin, aluminum oxide, polytetrafluoroethylene and an adhesive. Among them, silicone resin is generally used as the base material, and then aluminum oxide, polytetrafluoroethylene and the adhesive are proportioned in different ratios to make a thermal conductive adhesive paste with high thermal conductivity, good plasticity, non-melting and non-precipitating at high temperatures, good insulation and excellent corrosion resistance. When making the thermal conductive adhesive paste, the weight part ratio of aluminum oxide to polytetrafluoroethylene is 1:2.

[0077] In a preferred example, the thermally conductive mastic includes raw materials in the following parts by weight: 100 parts of silicone resin, 5 parts of aluminum oxide, 10 parts of polytetrafluoroethylene, and 1100 parts of binder.

[0078] In one embodiment, a backlight module using a sheet-shaped thermally conductive tape and a backlight module using the heat dissipation tape provided in this embodiment are subjected to a comparative test, and the test data is as follows in the table:

[0079]

[0080] According to the above data, it can be known that the temperature reduction amplitude of the heat dissipation tape provided in this embodiment compared with the sheet-shaped thermally conductive tape in the same product can reach: (7 + 13.7 + 12.3) / (51.6 + 58.7 + 56.8) = 19.7%, having a significant temperature reduction effect.

[0081] Another embodiment of the present invention provides a backlight module, which includes a back plate 200, a circuit board 300, and the heat dissipation tape 100 provided in the above embodiment. The circuit board 300 is fixed to the outer surface of the back plate 200 through the heat dissipation tape 100. When fixing the circuit board 300, first determine the installation position of the circuit board 300, then take out the heat dissipation tape 100, tear off the release film of the heat dissipation tape 100, partially cover the thermally conductive adhesive layer 2 of the heat dissipation tape 100 at the position of the circuit board 300, and then perform a smoothing operation to make the heat dissipation tape 100 wrap the circuit board 300 and be fixed to the outer surface of the back plate 200.

[0082] Another embodiment of the present invention provides a preparation method of a heat dissipation tape, as Figures 7-8c shown, including the following steps:

[0083] Step S10, calculate the thickness of the required thermally conductive adhesive layer according to the height of the heating element of the circuit board to be installed;

[0084] Step S20, as Figure 8a shown, cover the thermally conductive mastic 20 with this thickness on the release film 3;

[0085] Step S30, as Figure 8b shown, cut the thermally conductive mastic 20 according to the shape of the circuit board to be installed, remove the waste materials, and obtain the thermally conductive adhesive layer 2;

[0086] Step S40, as Figure 8c shown, cover the substrate layer 1 on the side of the obtained thermally conductive adhesive layer 2 away from the release film 3 to obtain the heat dissipation tape 100.

[0087] In one embodiment, the thickness of the thermal conductive adhesive layer 2 confirmed in step S10 is the thickness of the heat dissipation tape in the pressed state. Specifically, in the unpressed state, the calculation formula for the thickness A of the thermal conductive adhesive layer 2 is:

[0088] B*(1 + 17%) ≤ A ≤ B*(1 + 23%)

[0089] Wherein, when the circuit board 300 includes multiple heat generating components 301, the value of B should be the height value of the heat generating component 301 with the highest height.

[0090] In an alternative example, the height of the heat generating component 301 is B = 1.1 mm. According to the above formula, the value range of the thickness A of the thermal conductive adhesive layer 2 in the unpressed state is calculated to be 1.287 mm - 1.353 mm.

[0091] In one embodiment, when fixing the circuit board 300, first determine the installation position of the circuit board 300, then take out the heat dissipation tape 100, tear off the release film of the heat dissipation tape 100, cover a part of the thermal conductive adhesive layer 2 of the heat dissipation tape 100 at the circuit board 300, and then perform a smoothing operation to wrap the heat dissipation tape 100 around the circuit board 300 and fix it on the outer surface of the backplane 200.

[0092] In one embodiment, in step S20, the thermal conductive clay covered on the release film is rectangular.

[0093] The heat dissipation tape, backlight module and preparation method of the heat dissipation tape provided by the embodiments of the present invention combine a substrate layer and a thermal conductive adhesive layer with strong composite plasticity, so that the heat generated by the heat generating components of the circuit board only conducts on the circuit board and is conducted to the outside through the heat dissipation tape for heat dissipation, avoiding the tape from introducing heat into the backplane, thereby avoiding the occurrence of film wrinkles in the backlight module and ensuring the display quality. The heat dissipation tape is used in the same manner as the existing method, without causing additional man-hour costs. When performing the smoothing operation, the thermal conductive adhesive layer can be embedded into the gaps between the components and fit against the side walls of the components, increasing the contact area between the thermal conductive adhesive layer and the heat generating components, enabling heat to be evenly conducted from all contact positions between the thermal conductive adhesive layer and the components to the surrounding area, and then diffusing to other positions of the circuit board and then to the outside, improving the heat conduction efficiency of the heat dissipation tape, thereby improving the heat dissipation efficiency and heat dissipation effect. In addition, the manufacturing composite process of the heat dissipation tape is simple and easy to implement, the raw material cost is low, and it has mass production properties.

[0094] Obviously, the above-mentioned embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation manners here. Any obvious changes or modifications derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. A heat dissipation tape for fixing a circuit board to a backplane, characterized in that, It includes a base material layer and a heat-conducting adhesive layer; The heat-conducting adhesive layer covers one side surface of the circuit board facing away from the backplane, and the base material layer covers one side surface of the heat-conducting adhesive layer facing away from the circuit board; The area of the heat-conducting adhesive layer is smaller than the area of the base material layer. The base material layer includes an adhesive part protruding from the four peripheral edges of the heat-conducting adhesive layer, and support ear parts extending from the adhesive part to the left and right sides; The heat-dissipating tape includes an un-pressed state and a pressed state. When the heat-dissipating tape is in the pressed state, the circuit board is fixed to the backplane; When the heat-dissipating tape is in the pressed state, the heat-conducting adhesive layer includes a first fitting part and a second fitting part. The first fitting part fits on the upper surface of the components of the circuit board, and the second fitting part is embedded between adjacent components and fits on the side walls of the components.

2. The heat dissipation tape according to claim 1, wherein The second fitting part is formed by protruding from the first fitting part towards the direction close to the circuit board; The second fitting part is at least located in the gap between the heat-generating element of the circuit board and the adjacent components of the heat-generating element.

3. The heat dissipation tape according to claim 1, wherein The ratio of the orthographic projection area of the first fitting part on the backplane to the orthographic projection area of the second fitting part on the backplane is 5:

1.

4. The heat dissipation tape according to claim 1, wherein The calculation formula for the thickness A of the heat-conducting adhesive layer in the un-pressed state is: B*(1 + 17%) ≤ A ≤ B*(1 + 23%) Wherein, B is the height of the heat-generating element of the circuit board. When the circuit board includes multiple heat-generating elements, B takes the maximum value.

5. The heat dissipation tape according to claim 1, wherein, The value range of the thickness A of the heat-conducting adhesive layer in the un-pressed state is: 1.287mm - 1.353mm.

6. The heat dissipation tape according to claim 1, characterized in that The heat-dissipating tape further includes a first adhesive layer covering one side surface of the base material layer close to the heat-conducting adhesive layer. The first adhesive layer is configured to fix the heat-dissipating tape to the outer surfaces of the circuit board and the backplane.

7. The heat dissipation tape according to claim 6, wherein The first adhesive layer evenly covers the adhesive part and the support ear parts. The adhesive part is fitted and fixed to the part of the backplane close to the edge of the circuit board; or The adhesive part is fitted and fixed to the edge of the circuit board and the part of the backplane close to the edge of the circuit board.

8. The heat dissipation tape according to claim 6, wherein The first adhesive layer includes a first adhesive part corresponding to the heat-conducting adhesive layer and a second adhesive part corresponding to covering the adhesive part and the support ear parts; The first adhesive part connects the base material layer and the heat-conducting adhesive layer; The adhesive part is fitted and fixed to the part of the backplane close to the edge of the circuit board through the second adhesive part; Or Fitted and fixed to the edge of the circuit board and the part of the backplane close to the edge of the circuit board.

9. The heat dissipation tape according to claim 1, wherein The heat-dissipating tape further includes a second adhesive layer covering one side surface of the base material layer away from the heat-conducting adhesive layer.

10. The heat dissipation tape according to claim 1, wherein, The heat-conducting adhesive layer includes silicone resin, aluminum oxide, polytetrafluoroethylene and an adhesive; Wherein, the weight part ratio of the aluminum oxide and the polytetrafluoroethylene is 1:

2.

11. A backlight module, characterized in that, It includes a backplane, a circuit board, and the heat-dissipating tape according to any one of claims 1 - 10. The circuit board is fixed to the backplane through the heat-dissipating tape.

12. A method for preparing a heat dissipation tape, characterized in that, It includes: Calculating the required thickness of the heat-conducting adhesive layer according to the height of the heat-generating element of the circuit board to be installed as needed; Covering the heat-conducting adhesive clay of this thickness on the release film; Cut the thermal conductive putty according to the shape of the circuit board to be installed, remove the waste material, and obtain a thermal conductive glue layer; Cover the obtained thermal conductive glue layer on the side away from the release film with a substrate layer to obtain a heat dissipation tape.

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