Supporting fence structure, electric control device and outdoor unit

Abstract

The invention relates to a supporting enclosure structure, an electric control device and an outdoor unit, the supporting enclosure comprises a supporting main body, the supporting main body comprises a first side and a second side which are oppositely arranged along a first direction, the first side is provided with at least one first assembly structure, and the second side is provided with at least one accommodating area and a second assembly structure; the first type of enclosure is connected with the supporting main body, at least one enclosure area is defined by the first type of enclosure and the supporting main body, and the enclosure area is used for glue pouring; in the first type of enclosure and the supporting main body, at least the supporting main body is an insulating material piece and / or a heat insulating material piece. According to the supporting fence structure, the main board and the power device are isolated through the supporting body, the heat insulation effect is achieved, the fence area is used for glue pouring, the main board is prevented from being wetted by condensation of the main board or condensate water of a heat dissipation device, and then the short circuit situation is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of air-conditioning equipment, and in particular to a supporting enclosure structure, an electric control device and an outdoor unit. Background Art

[0002] The electronic control device in the air conditioner outdoor unit includes multiple power devices such as rectifier bridge, PFC (Power Factor Corrector) switch tube, diode, inverter module, etc. These power devices will generate a lot of heat when working. In order to ensure their normal operation and life, heat dissipation treatment is required.

[0003] At present, power devices are installed on the mainboard, and the mainboard is also equipped with peripheral circuit devices. Since the power devices are directly fixed to the mainboard, the heat generated by the power devices will be directly transferred to the mainboard or radiated to the peripheral circuit devices, affecting the performance of the mainboard and the peripheral circuit devices. In some equipment, a radiator is arranged above the power device, and the refrigerant flows through the radiator. The heat generated by the power device is taken away by the heat transfer effect of the refrigerant, thereby achieving the purpose of heat dissipation. However, since the power device and the peripheral circuit devices near the power device will be fixed under the radiator and blocked by the radiator, it is more difficult to cover the pins of the power device and the peripheral circuit devices near the power device with the three-proof adhesive, resulting in the risk of condensation short circuit of the pins of the power device and the peripheral circuit devices nearby. Summary of the invention

[0004] The purpose of the present invention is to at least solve the problem of heat from power devices being directly transferred to the mainboard and condensation on the mainboard. This purpose is achieved by:

[0005] The first aspect of the present invention proposes a support enclosure structure, which includes: for installation on an electronic control device, the support enclosure structure includes: a support body, the support body includes a first side and a second side arranged oppositely along a first direction, the first side is provided with at least one first assembly structure, the first assembly structure is used to be connected to the mainboard of the electronic control device, the second side is provided with at least one accommodating area and a second assembly structure, the accommodating area is used to place power devices, and the second assembly structure is used to be connected to the heat dissipation device of the electronic control device; a first type of enclosure is connected to the support body and encloses at least one enclosure area with the support body, and the enclosure area is used for glue filling; of the first type of enclosure and the support body, at least the support body is an insulating material piece and / or a heat insulating material piece.

[0006] According to the support and enclosure structure of the present invention, the main board and the power device are isolated by the support body, which has the function of heat insulation. The enclosure area is used for potting to prevent the main board from condensing or the condensate water of the heat dissipation device from wetting the main board, thereby avoiding the occurrence of short circuits.

[0007] In addition, according to the support and enclosure structure of the present invention, the following additional technical features may also be included:

[0008] In some embodiments of the present invention, the support body includes a support plate and a second type of enclosure. The second type of enclosure extends along the edge of the support plate. The first type of enclosure is connected to the second type of enclosure and jointly encloses the enclosure area with the second type of enclosure.

[0009] In some embodiments of the present invention, the support body and the first type of enclosure are of an integral structure.

[0010] In some embodiments of the present invention, the support body further includes a plurality of reinforcing ribs protruding from the first side and / or the second side.

[0011] In some embodiments of the present invention, along the first direction, the height by which one end of the first type of enclosure on the first side protrudes from the first side is H1, and the height by which one end of the second type of enclosure on the first side protrudes from the first side is H2, where H1 is equal to H2.

[0012] In some embodiments of the present invention, the support body further includes a plurality of limiting ribs protruding from the second side of the support plate. The limiting ribs extend along at least a part of the side edge of the accommodating area, and the limiting ribs are used to limit the power device within the accommodating area.

[0013] In some embodiments of the present invention, the first type of enclosure is inclined with respect to the support plate, and the first side of the first type of enclosure is closer to the support plate than the second side of the first type of enclosure.

[0014] In some embodiments of the present invention, the shape of the enclosure area is a regular shape and / or an irregular shape.

[0015] In some embodiments of the present invention, the first assembly structure includes at least one first boss protruding from the first side, and the first boss is used to connect to the main board.

[0016] In some embodiments of the present invention, at least one first positioning hole is provided on the support plate within the accommodating area. The first positioning hole is used for a connecting piece to pass through to fix the power device within the accommodating area.

[0017] In some embodiments of the present invention, the first positioning holes correspond to the first bosses one by one, and each of the positioning holes penetrates one of the first bosses along the first direction.

[0018] In some embodiments of the present invention, the second assembly structure includes at least one second boss, the second boss protrudes from the second side of the support plate, and the second boss is used to position the heat dissipation device.

[0019] In some embodiments of the present invention, the second assembly structure includes at least one second positioning hole, the second positioning hole penetrates the support plate along the first direction, and the second positioning hole is used for a connecting piece to pass through to connect the support plate and the heat dissipation device.

[0020] In some embodiments of the present invention, the support enclosure structure includes a plurality of the accommodating areas, and the plurality of accommodating areas are sequentially arranged at intervals along the second direction, and the second direction is perpendicular to the first direction.

[0021] In some embodiments of the present invention, the support enclosure structure further includes a plurality of heat insulation cavities, and at least one heat insulation cavity is arranged between any two adjacent accommodating areas along the second direction.

[0022] In some embodiments of the present invention, the plurality of accommodating areas include a first accommodating area, a second accommodating area, and a third accommodating area arranged in sequence, and the first accommodating area, the second accommodating area, and the third accommodating area are used to respectively accommodate different power devices.

[0023] In some embodiments of the present invention, the support enclosure structure includes a plurality of the enclosure areas, and the plurality of enclosure areas are arranged around the circumferences of the second accommodating area and the third accommodating area.

[0024] In some embodiments of the present invention, along the first direction, the height by which one end of the first type of enclosure on the second side protrudes from the second side of the support plate is H3, and the height by which the limiting rib protrudes from the second side of the support plate is H4, wherein H3 is less than H4.

[0025] According to a second aspect of the present invention, an electronic control device is further provided. The electronic control device includes a main board, a power device, a heat dissipation device, and the support enclosure structure according to the first aspect. The main board is connected to the first assembly structure, the power device is placed in the accommodating area and electrically connected to the main board, and the heat dissipation device is connected to the second assembly structure and thermally connected to the power device.

[0026] In some embodiments of the present invention, the heat dissipation device includes: a first radiator, which is connected to the second assembly structure and thermally connected to the power device; a second radiator, which is detachably connected to the first radiator, and a refrigerant channel for the flow of refrigerant is provided inside the second radiator, and the refrigerant channel is used to communicate with the refrigerant circulation pipeline.

[0027] In some embodiments of the present invention, along the first direction, the first radiator has an installation side and a heat conduction side arranged oppositely, the second radiator is detachably installed on the installation side, the heat conduction side includes a heat conduction surface and an avoidance groove, the heat conduction surface is thermally connected to the power device, along the direction parallel to the heat conduction surface, the avoidance groove is arranged on at least one side of the heat conduction surface, and along the first direction, the avoidance groove is arranged opposite to the first type of enclosure.

[0028] In some embodiments of the present invention, along the first direction, the avoidance groove has a bottom surface arranged opposite to the main board, the distance between the bottom surface and the main board is L1, and the distance between the end of the first type of enclosure away from the main board and the main board is L2, and L1 is greater than L2.

[0029] In some embodiments of the present invention, the heat dissipation device includes a radiator, a refrigerant heat dissipation pipe and a cover plate; the cover plate covers the radiator, a receiving channel is provided between the radiator and the cover plate, the refrigerant heat dissipation pipe is arranged in the receiving channel, and the surface of the radiator on the side away from the cover plate is connected to the second assembly structure and thermally connected to the power device.

[0030] In some embodiments of the present invention, the heat dissipation device has a first projection on the main board along the first direction, the first type of enclosure has a second projection on the main board along the first direction, and at least part of the second projection is located outside the first projection.

[0031] According to the third aspect of the present invention, an outdoor unit is further provided, and the outdoor unit includes the electric control device of the second aspect. Description of the Drawings

[0032] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present invention. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. Among them:

[0033] Figure 1 It is a schematic structural diagram of the support enclosure structure from the first perspective of an embodiment of the present invention;

[0034] Figure 2 shows Figure 1 a schematic cross-sectional structure diagram of the K-K part in

[0035] Figure 3 a schematic structural diagram of the support enclosure structure from a second perspective according to an embodiment of the present invention;

[0036] Figure 4 a schematic structural diagram of the support enclosure structure from a third perspective according to an embodiment of the present invention;

[0037] Figure 5 a schematic structural diagram of the support enclosure structure from a fourth perspective according to an embodiment of the present invention;

[0038] Figure 6 a partial structural schematic diagram of an electric control device according to an embodiment of the present invention;

[0039] Figure 7 a structural schematic diagram of an electric control device according to an embodiment of the invention;

[0040] Figure 8 shows Figure 7 a schematic cross-sectional structure diagram of the N-N part in

[0041] Figure 9 shows Figure 8 a partially enlarged structural schematic diagram of the Q part in

[0042] Figure 10 an exploded view of parts of a heat dissipation device according to an embodiment of the present invention;

[0043] Figure 11 a structural schematic diagram of a heat dissipation device according to an embodiment of the present invention;

[0044] Figure 12 an exploded view of parts of an electric control device according to another embodiment of the present invention;

[0045] Figure 13 a partial structural schematic diagram of an outdoor unit according to another embodiment of the present invention;

[0046] Figure 14 a structural schematic diagram of an outdoor unit according to another embodiment of the present invention.

[0047] The reference numerals in the drawings are represented as follows:

[0048] 80, support enclosure structure; 801, enclosure area; 802, heat insulation cavity;

[0049] 81. Support main body; 811. Support plate; 812. Second type of enclosure; 813. Reinforcing rib; 8101. First side; 8102. Second side; 814. First assembly structure; 8141. First boss; 815. Accommodation area; 8151. First accommodation area; 8152. Second accommodation area; 8153. Third accommodation area; 816. Second assembly structure; 8161. Second boss; 8162. Second positioning hole; 817. Limit rib; 8111. First positioning hole;

[0050] 82. First type of enclosure;

[0051] 30. Electric control device; 32. Main board; 310. Power device; 3101. Third positioning hole; 300. Heat dissipation device; 34. First radiator; 341. Installation side; 342. Heat conduction side; 3421. Heat conduction surface; 344. Avoidance groove; 3441. Bottom surface; 35. Second radiator; 351. Refrigerant channel; 301. Radiator; 302. Refrigerant heat dissipation pipe; 303. Cover plate; 3201. Peripheral circuit device;

[0052] E. Rectifier bridge; F. Sealed device; G. Inverter module; A. First enclosure area; B. Second enclosure area; C. Third enclosure area; D. Fourth enclosure area;

[0053] 1. Outdoor unit; 10. Cabinet; 12. Front panel; 14. Top cover; 101. Accommodation cavity; 132. Right side plate; 160. Partition assembly; 1011. First cavity; 1012. Second cavity;

[0054] X. First direction; Y. Second direction. Detailed implementation manner

[0055] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention can be more thoroughly understood and the scope of the present invention can be fully conveyed to those skilled in the art.

[0056] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and thus specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the particular order described or illustrated, unless an execution order is explicitly stated. It should also be understood that additional or alternative steps may be used.

[0057] Although the terms first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly dictates otherwise, terms such as "first", "second", and other numerical terms when used herein do not imply an order or sequence. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0058] In this application, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "coupled", "fixed", etc. shall be construed broadly. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or communicable with each other; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention may be understood according to specific circumstances.

[0059] For ease of description, spatial relative relationship terms may be used in the text to describe the relationship of one element or feature shown in the figure with respect to another element or feature. These relative relationship terms are, for example, "inside", "outside", "inner side", "outer side", "below", "beneath", "above", "over", etc. Such spatial relative relationship terms are intended to include different orientations of the device during use or operation other than the orientations depicted in the figure. For example, if the device in the figure rotates, then an element described as "below" or "beneath" other elements or features will subsequently be oriented as "above" or "over" other elements or features. Thus, the exemplary term "below" can include both upper and lower orientations.

[0060] According to an embodiment of the present invention, a support enclosure structure 80 is provided. Referring to Figure 1 , Figure 3 , Figure 4 , Figure 6 and Figure 7 , the support enclosure structure 80 includes a support main body 81 and a first type of enclosure 82. The support main body 81 includes a first side 8101 and a second side 8102 arranged in opposite directions along a first direction. The first side 8101 is provided with at least one first assembly structure 814 for connecting to the main board 32. The second side 8102 is provided with at least one accommodation area 815 and a second assembly structure 816. The accommodation area 815 is used to accommodate the power device 310, and the second assembly structure 816 is used to connect to the heat dissipation device 300. The first type of enclosure 82 is connected to the support main body 81. The first type of enclosure 82 encloses the pins of the power device 310 and the peripheral circuit device 3201 and forms a plurality of enclosure areas 801, and the enclosure areas 801 are used for potting. Wherein, the first direction is a direction perpendicular to the main board 32.

[0061] The first assembly structure 814 and the second assembly structure 816 can be set in various structural forms. For example, the first assembly structure 814 can be set as a boss or an ear plate with threaded holes, and through holes are opened at corresponding positions on the main board 32. The two are connected by tightening a bolt through the through hole of the main board 32 and the threaded hole of the support body 81. This connection has the advantages of being easy to disassemble and being able to withstand a certain amount of tensile force and shear force. Or, the first assembly structure 814 can also be set as an elastic buckle, and a clamping groove or a clamping hole is set at the corresponding position on the main board 32. During installation, the buckle is aligned with the clamping groove or the clamping hole, and the buckle is snapped in, and the fastening connection is realized by the elastic deformation of the buckle. The second assembly structure 816 can be set as an insertion plate or a plug-in component, and the corresponding part of the heat dissipation device 300 is designed as a slot for inserting the insertion plate or the plug-in component. The insertion plate is inserted into the slot to realize the connection and positioning of the two. Or, the second assembly structure 816 can also be set as a stud, and through holes or threaded holes are opened at the corresponding positions on the heat dissipation device 300. The heat dissipation device 300 is fixedly connected to the stud of the support body 81 through a nut.

[0062] The above-mentioned power device 310 is composed of a body and pins, and is used to process high-frequency signals in the air conditioner. Its power density is relatively high and a large amount of heat will be generated. The body of the power device 310 is installed in the accommodation area 815 of the support body 81, and the pins of the power device 310 are electrically connected to the main board 32.

[0063] Among the first type of enclosure 82 and the support body 81, at least the support body 81 is an insulating part made of insulating material or a heat-insulating part made of heat-insulating material, or the support body 81 is both a heat-insulating part and an insulating part at the same time. For example, the materials used to make the support body 81 include but are not limited to polytetrafluoroethylene, polyimide, alumina ceramic, boron nitride ceramic, glass fiber reinforced plastic, carbon fiber reinforced plastic, and ceramic fiber.

[0064] The support body 81 is used to isolate the main board 32 and the power device 310, which has the function of heat insulation. The enclosure area 801 is used for potting, and the glue covers the pins of the power device 310 and the outer circuit devices on the main board 32, preventing the main board 32 from condensing or the condensed water of the heat dissipation device 300 from soaking the main board 32, thereby avoiding the occurrence of a short circuit.

[0065] In some embodiments, please refer to Figure 1 、 Figure 3 、 Figure 4 、 Figure 6 and Figure 7As shown, the support body 81 includes a support plate 811 and a second type of enclosure 812. The second type of enclosure 812 extends along the edge of the support plate 811. The first type of enclosure 82 is connected to the second type of enclosure 812 and jointly encloses an enclosure area 801 with the second type of enclosure 812. The first type of enclosure 82 can be regarded as a structural member extending from the edge of the support plate 811, and the second type of enclosure 812 is a structural member located on the support plate 811, but the second type of enclosure 812, the first type of enclosure 82, and the support plate 811 are integrally formed. Among them, the first direction is perpendicular to the support plate 811.

[0066] Structurally, the second type of enclosure 812 can be regarded as an annular enclosure plate arranged around the edge of the support plate 811, and the annular enclosure plate is perpendicular to the support plate 811. The first type of enclosure 82 is also arranged as a plate-like structure. The shape of the first type of enclosure 82 can be set as a regular square or an arc-shaped plate. The two ends of the first type of enclosure 82 are respectively connected to the second type of enclosure 812. The inner surface of the first type of enclosure 82 (i.e., the surface of the first type of enclosure 82 facing the second type of enclosure 812) and the circumferential outer surface of the second type of enclosure 812 are respectively perpendicular to the main board 32. The above-mentioned enclosure area 801 is enclosed between the inner surface of the first type of enclosure 82 and the circumferential outer surface of the second type of enclosure 812. With such a setting, along the first direction, the enclosure area 801 has a certain depth, so as to facilitate the accommodation of more glue.

[0067] Furthermore, as Figure 1 , Figure 3 and Figure 5 shown, the support body 81 further includes a plurality of reinforcing ribs 813. A plurality of the above-mentioned reinforcing ribs 813 are provided on both the first side 8101 and the second side 8102 of the support plate 811. By providing the reinforcing ribs 813, when the support body 81 bears the power device 310 and is connected to the main board 32 and the heat dissipation device 300, it needs to bear a certain amount of pressure and stress. The reinforcing ribs 813 can increase the thickness and cross-sectional area of the support body 81, disperse the force borne, reduce the possibility of deformation and damage, improve the overall structural stability of the support body 81, and ensure that it can reliably support and fix relevant components during long-term use.

[0068] In some exemplary embodiments, the plurality of reinforcing ribs 813 are distributed parallel to each other on the first side 8101 and the second side 8102 of the support body 81. The above arrangement is simple and regular, facilitating processing and manufacturing, and can effectively enhance the strength and stiffness of the support body 81 in a specific direction. For example, arranging them parallel along the length direction or the width direction of the support body 81 can respectively enhance the bearing capacity and anti-deformation ability in the corresponding direction.

[0069] In some other exemplary embodiments, a plurality of reinforcing ribs 813 are arranged in a crisscross pattern to form a grid. The above arrangement can provide uniform reinforcement effects in two mutually perpendicular directions, enhancing the strength, stiffness, and vibration resistance of the support body 81 in all directions, enabling it to better handle complex stress conditions and effectively disperse forces and vibrations from different directions.

[0070] In some other exemplary embodiments, around key components or regions on the support body 81, such as the accommodation area 815, the assembly structure, etc., circumferential reinforcing ribs 813 are provided to focus on strengthening the structural strength of these key parts, preventing local deformation or damage in these regions during component installation and stress application, and ensuring the connection stability and reliability between the key components and the support body 81.

[0071] In some embodiments, as Figure 1 and Figure 2 shown, the first type of enclosure 82 is inclined relative to the support plate 811, and the first side of the first type of enclosure 82 is closer to the support plate 811 than the second side of the first type of enclosure 82. With this setting, after the support enclosure structure is installed on the main board, the enclosure area enclosed by the first type of enclosure 82 has a larger opening at the section away from the main board, which is beneficial for the potting operation.

[0072] In some embodiments, please refer to Figure 2 and Figure 9 shown. Along the first direction, the height by which one end of the first type of enclosure 82 located on the first side 8101 protrudes from the first side 8101 of the support plate 811 is H1, and the height by which one end of the second type of enclosure 812 located on the first side 8101 protrudes from the first side 8101 of the support plate 811 is H2, where H1 is equal to H2. With this setting, when the support enclosure structure 80 is installed on the main board 32, one end of the first type of enclosure 82 located on the first side 8101 and one end of the second type of enclosure 812 located on the first side 8101 are flush and respectively abut against the board surface of the main board 32, closing the bottom of the enclosure area 801 with the board surface of the main board 32, thereby preventing glue from leaking through the gap between the first type of enclosure 82 and the main board 32 or the gap between the second type of enclosure 812 and the main board 32 during potting.

[0073] In some embodiments, please refer to Figure 1 , Figure 2 , Figure 5 and Figure 7As shown, the support body 81 further includes a plurality of limiting convex ribs 817 convexly disposed on the second side 8102 of the support plate 811, and the limiting convex ribs 817 extend along at least two side edges of the accommodation area 815, and the limiting convex ribs 817 are used to limit the power device 310 within the accommodation area 815. Specifically, for a power device 310 with a single-side pin, the limiting convex ribs 817 surround three side edges of the power device 310, and for a power device 310 with a double-side pin, the limiting convex ribs 817 surround two side edges of the power device 310, that is, the non-pin side edge of the power device 310 needs to be provided with the limiting convex ribs 817 to limit the power device 310, so as to avoid the rotation force during the screw tightening process when the power device 310 is fixed on the heat sink 300 and the support plate 811, causing the power device 310 to rotate, thereby causing the pins on the mainboard 32 to deform due to the force.

[0074] In this embodiment, the edge of the power device 310 is partially enclosed by the limiting rib 817, which can limit the power device 310 and prevent the power device 310 from being damaged due to force. The pins of the power device 310 and the peripheral circuit components 3201 are enclosed by part of the second-type enclosure 812 and the first-type enclosure 82, making it convenient to use the three-proof adhesive to seal the pins and the peripheral circuit components 3201.

[0075] In this embodiment, a portion of the second type of enclosure 812 located on the second side 8102 of the support plate 811 constitutes a limiting rib 817, making the supporting enclosure structure 80 more compact.

[0076] In some embodiments, the shape of the enclosure area 801 includes a regular shape and / or an irregular shape. The shape of the enclosure area 801 can be designed according to the arrangement of the peripheral circuit device 3201 around the power device 310, as long as the peripheral circuit device 3201 and the pins of the power device 310 can be enclosed.

[0077] In some embodiments, please combine Figure 3 , Figure 4 and Figure 6 As shown, the first assembly structure 814 includes at least one first boss 8141 , and the first boss 8141 is protruded from the first side 8101 of the support plate 811 . Correspondingly, a limiting hole matching the first boss 8141 is provided on the main board 32 .

[0078] By inserting the first boss 8141 into the limiting hole on the main board 32 , the support enclosure structure 80 can be limited to the main board 32 , so that the pins of the power device 310 on the support plate 811 can also be inserted into the pad holes of the main board 32 .

[0079] It should be noted here that since the first boss 8141 on the support plate 811 needs to be inserted into the main board 32, the first boss 8141 should be higher than the height of the first type of enclosure 82 of the support enclosure structure 80 to ensure that the support enclosure structure 80 is closely attached to the main board 32.

[0080] There are 2 first bosses 8141 provided, which can stably limit the support enclosure structure 80 on the main board 32. Of course, the application does not specifically limit the number of the first bosses 8141.

[0081] In this embodiment, by respectively providing the matching first bosses 8141 and limiting holes on the support plate 811 and the main board 32, the support enclosure structure 80 can be limited to the main board 32, which is convenient for the pins of the power device 310 to be placed in the corresponding pad holes.

[0082] Furthermore, as Figure 1 、 Figure 5 and Figure 6 shown, at least one first positioning hole 8111 is provided on the support plate 811. The first positioning hole 8111 is located in the accommodating area 815. The power device 310 is provided with a third positioning hole 3101 that matches the first positioning hole 8111. The first positioning hole 8111 is used to fix the power device 310 on the support plate 811. In this embodiment, by providing the mutually matching positioning holes on the support plate 811 and the power device 310, the power device 310 can be closely attached to the support plate 811.

[0083] Furthermore, the first positioning hole 8111 penetrates through the first boss 8141. That is to say, the first boss 8141 can be regarded as a hollow cylinder. In this way, while limiting the support enclosure structure 80 to the main board 32, it is also convenient to fix the support enclosure structure 80 on the main board 32.

[0084] Still further, by using screws to pass through the limiting hole of the main board 32, the first positioning hole 8111 of the support plate 811, and the third positioning hole 3101 of the power device 310 for fixed connection, the main board 32, the support enclosure structure 80, and the power device 310 can be closely fixed together.

[0085] In some embodiments, please combine Figure 1 、 Figure 4 、 Figure 5 、 Figure 9 and Figure 11As shown, the second assembly structure 816 includes at least one second boss 8161. The second boss 8161 protrudes from the second side 8102 of the support plate 811, that is, the second boss 8161 is provided on the side of the support plate 811 close to the heat dissipation device 300. The second boss 8161 is located in the non-contact area of the support plate 811 with the body of the power device 310. Correspondingly, a limiting hole matching the second boss 8161 is provided on the surface of the heat dissipation device 300.

[0086] By inserting the second boss 8161 into the limiting hole on the heat dissipation device 300, the radiator 301 device can be limited to the support enclosure structure 80, facilitating the fixing of the heat dissipation device 300 on the support enclosure structure 80.

[0087] It should also be noted that since the second boss 8161 on the support plate 811 needs to be inserted into the heat dissipation device 300, the second boss 8161 should be higher than the heights of the first type of enclosure 82 and the second type of enclosure 812 to ensure close fit between the support member and the heat dissipation device 300.

[0088] The support plate 811 is provided with 2 second bosses 8161, which can stably limit the heat dissipation device 300 on the support enclosure structure 80. Of course, the number of the second bosses 8161 in this application is not specifically limited.

[0089] In some embodiments, please refer to Figure 1 、 Figure 5 、 Figure 9 and Figure 11 As shown, the second assembly structure 816 includes at least one second positioning hole 8162. The second positioning hole 8162 penetrates the support plate 811 along the first direction. The second positioning hole 8162 is located in the non-contact area of the support plate 811 with the body of the power device 310. By using a screw to pass through the second positioning hole 8162, the heat dissipation surface of the power device 310 can be brought into contact with the surface of the heat dissipation device 300, and the heat dissipation device 300 and the support enclosure structure 80 can be tightly fixed together.

[0090] In some embodiments, such as Figure 1 、 Figure 5 and Figure 6As shown, the support enclosure structure 80 includes a plurality of accommodation areas 815, each accommodation area 815 is provided with a power device 310, and the plurality of accommodation areas 815 are arranged at intervals in sequence along the second direction, and the second direction is perpendicular to the first direction. With such an arrangement, the multiple power devices 310 mounted on the support enclosure structure 80 are arranged in sequence along the second direction, and any two adjacent power devices 310 are arranged at intervals, separating the power devices 310 from each other. The heat generated by each power device 310 can be dissipated into the surrounding space relatively independently, reducing the mutual influence between the heats, lowering the overall temperature peak value, and helping to keep the power device 310 within a suitable operating temperature range. The interval arrangement of the plurality of accommodation areas 815 enables the power devices 310 on the entire support enclosure structure 80 to dissipate heat more evenly, avoiding the phenomenon of heat accumulation formed by the superposition of heats, ensuring that the temperatures of the individual power devices 310 are relatively consistent, being beneficial to the stable operation of the entire electronic control device 30, and avoiding affecting the performance or lifespan of an individual power device 310 due to its over-high temperature.

[0091] It should also be noted that the interval arrangement provides a more reasonable path for the heat dissipation of the refrigerant flow in the heat dissipation device 300. The refrigerant can flow more evenly between the individual power devices 310 and more effectively absorb and carry away the heat.

[0092] In some embodiments, please refer to Figure 1 , Figure 5 and Figure 6 As shown, the support enclosure structure 80 further includes a plurality of heat insulation cavities 802. Along the second direction, at least one heat insulation cavity 802 is provided between any two adjacent accommodation areas 815. Among them, the heat insulation cavity 802 is formed by enclosing the second type of enclosure 812 and a part of the limiting ribs 817. The heat insulation cavity 802 can block the heat conduction path between the power devices 310 in the adjacent accommodation areas 815. Since the air or heat insulation material in the heat insulation cavity 802 has a low thermal conductivity, it can effectively reduce the conduction of heat from one accommodation area 815 to another accommodation area 815, making the heat generated by each power device 310 more confined within its own accommodation area 815, facilitating heat dissipation management.

[0093] Among them, the provision of the heat insulation cavity 802 also has the effect of reducing the thermal interference between the power devices 310. The heat between adjacent power devices 310 may interfere with each other, which may lead to a decline in their performance. For example, some power devices 310 may have problems such as parameter drift and slower response speed at high temperatures. The heat insulation cavity 802 can reduce the thermal interference between adjacent devices, enabling each device to work in a relatively independent thermal environment, reducing performance fluctuations caused by thermal interference, ensuring that each power device 310 can function properly, and improving the stability and accuracy of the entire electronic control device 30. When the power devices 310 are working, they may generate electrical noises such as electromagnetic interference. The heat insulation cavity 802 can play a role in isolation and shielding to a certain extent, reducing the electrical interference between adjacent devices, ensuring the accuracy of signal transmission and control of each power device 310, and improving the electromagnetic compatibility of the entire electronic system.

[0094] In some embodiments, the interior of the heat insulation cavity 802 may also be filled with heat insulation materials, thereby improving the heat insulation performance of the heat insulation cavity 802.

[0095] In some embodiments of the present invention, such as Figure 1 and Figure 6 shown, the power device 310 includes at least one of a rectifier bridge, a PFC (Power Factor Corrector) switch tube, a diode, and an inverter module.

[0096] Among them, the electrical flow direction of the HVAC controller is rectification processing → power factor correction and boosting → inversion processing. Therefore, the circuit of the HVAC controller mainly includes a power supply filter circuit, a rectifier circuit, a PFC circuit, and an inverter circuit.

[0097] In this embodiment, the rectifier bridge belongs to the electronic component in the rectifier circuit, the PFC switch tube and the diode both belong to the electronic components in the PFC circuit, and the inverter module belongs to the electronic component in the inverter circuit, and can also be called an IPM (Intelligent Power Module) module.

[0098] Furthermore, the rectifier bridge, the PFC switch tube, the diode, and the inverter module are arranged along the second direction, that is, the rectifier bridge, the PFC switch tube, the diode, and the inverter module are arranged in sequence on the main board 32. This is beneficial for the heat dissipation device 300 to cover these power devices 310 below.

[0099] It should be noted that the rectifier bridge, the PFC switch tube, the diode, and the inverter module included in the above power device 310 can be set as single devices according to their functions respectively, or these devices can be integrated into a combined package device in whole or in part. Therefore, the combined package device includes at least two of the rectifier bridge, the PFC switch tube, the diode, and the inverter module.

[0100] The setting forms of the power device 310 are different, and the shape of the corresponding support plate 811 is also different. For example, Figure 2 and Figure 3 as shown, the PFC switch tube and the diode are integrated into a co-packaged device F, the rectifier bridge E and the inverter module G are both set as single devices, the rectifier bridge E, the co-packaged device F, and the inverter module G are arranged along the second direction, and the support plate 811 provides corresponding placement positions for the rectifier bridge E, the co-packaged device F, and the inverter module G. Of course, if the rectifier bridge, the PFC switch tube, the diode, and the inverter module are all integrated into a co-packaged device, then the support plate 811 only needs to provide one placement position.

[0101] Specifically, as Figure 1 and Figure 6 shown, the multiple accommodating areas 815 include a first accommodating area 8151, a second accommodating area 8152, and a third accommodating area 8153 arranged in sequence. The first accommodating area 8151 is used to accommodate the rectifier bridge E, the second accommodating area 8152 is used to accommodate the co-packaged device F integrated with the PFC switch tube and the diode, and the third accommodating area 8153 is used to accommodate the inverter module G.

[0102] Furthermore, the support enclosure structure 80 includes multiple enclosure areas 801, and the multiple enclosure areas 801 are arranged around the circumferences of the second accommodating area 8152 and the third accommodating area 8153. Specifically, the support enclosure structure 80 includes 4 enclosure areas 801: a first enclosure area A, a second enclosure area B, a third enclosure area C, and a fourth enclosure area D. The second enclosure area B, the third enclosure area C, and the fourth enclosure area D are regular quadrilaterals, and the first enclosure area A is an irregular shape.

[0103] The components enclosed by the first enclosure area A include the pins of the co-packaged device F, the external resistors, the external capacitors, etc. The components enclosed by the second enclosure area B include the overcurrent protection circuit, the sampling detection circuit, etc. of the co-packaged device F. The components enclosed by the third enclosure area C include one side pins of the inverter module G, the sampling resistors, etc. The components enclosed by the fourth enclosure area D include the other side pins of the inverter module G, the bootstrap circuit, the signal detection circuit, etc.

[0104] It should be noted that the 4 enclosure areas 801 shown above are only for exemplary illustration, and the present application does not specifically limit the number of the enclosure areas 801. The number of the enclosure areas 801 is designed according to the circuit setting. For example, the first enclosure area A and the third enclosure area C can also be combined into one enclosure area 801, and the second enclosure area B and the fourth enclosure area D can be combined into one enclosure area 801. In this way, 2 enclosure areas 801 are formed.

[0105] In some embodiments, please refer toFigure 2 and Figure 9 As shown in Figure 9 , along the first direction, at one end of the second side 8102 of the first type of enclosure 82 protruding from the second side 8102 of the support plate 811, the height is H3, and the height of the limiting rib 817 protruding from the second side 8102 of the support plate 811 is H4, where H3 is greater than H4. With such a setting, when the heat dissipation device 300 is installed on the support enclosure structure 80, since the height H3 of the first type of enclosure 82 protruding from the second side 8102 of the support plate 811 is less than the height H4 of the limiting rib 817 protruding from the second side 8102 of the support plate 811, there is a height difference between the heat dissipation device 300 and the first type of enclosure 82 in the first direction, thereby providing a conveying space for the glue outlet pipe of the glue filling device during glue filling and reducing the difficulty of the glue filling operation.

[0106] According to an embodiment of the present invention, an electronic control device 30 is further provided. Please refer to Figure 1 、 Figure 3 、 Figure 6 and Figure 7 As shown in Figure 7 , the electronic control device 30 includes a main board 32, a power device 310, a heat dissipation device 300, and a support enclosure structure 80. The main board 32 is connected to the first assembly structure 814, the power device 310 is arranged in the accommodation area 815 and is electrically connected to the main board 32. The heat dissipation device 300 is connected to the second assembly structure 816 and is thermally connected to the power device 310. According to the electronic control device 30 proposed by the present invention, the support body 81 isolates the main board 32 and the power device 310, which has the function of heat insulation. The enclosure area 801 is used for glue filling, and the glue covers the pins of the power device 310 and the outer circuit devices on the main board 32, preventing the main board 32 from condensing or the condensed water of the heat dissipation device 300 from wetting the main board 32, thereby avoiding the occurrence of a short circuit. Among them, the connection methods of the support enclosure structure to the main board 32, the power device 310, and the heat dissipation device 300 have been described above and will not be elaborated here.

[0107] In some embodiments, please refer to Figure 8 、 Figure 9 、 Figure 10 and Figure 11As shown, the heat dissipation device 300 includes a first radiator 34 and a second radiator 35. The first radiator 34 is used for thermally connecting with the power devices on the main board 32 to ensure that the heat generated when the power devices are working can be efficiently transferred to the first radiator 34. The second radiator 35 is detachably connected to the first radiator 34. The detachable connection methods include but are not limited to convenient and reliable connection structures such as snap connection and threaded connection, so that the first radiator 34 and the second radiator 35 can be closely connected and are also convenient to disassemble when maintenance of the second radiator 35 is required. A refrigerant channel 351 is provided inside the second radiator 35, and the refrigerant channel 351 is used for externally connecting to a refrigerant circulation pipeline. The second radiator 35 is an integral structure obtained by a metal processing process from a piece of metal material. After the external refrigerant circulation pipeline is connected to the refrigerant channel 351, the refrigerant can circulate in the refrigerant channel 351, and the refrigerant undergoes a phase change. By using the characteristic that a large amount of heat is absorbed during its phase change process, the heat generated by the power devices transferred from the first radiator 34 can be quickly taken away, thereby realizing efficient heat dissipation of the power devices.

[0108] The refrigerant channel 351 with an integral structure is directly formed on the second radiator 35, which greatly improves the heat exchange efficiency compared with the traditional method of using a refrigerant pipe. The integral design of the second radiator 35 reduces the thermal resistance during the heat transfer process, enabling the heat to be transferred from the power devices to the refrigerant more smoothly, and thus significantly enhancing the heat dissipation effect and ensuring that the power devices are always within an appropriate working temperature range. When the second radiator 35 fails or needs maintenance, the maintenance personnel can easily detach the second radiator 35 from the first radiator 34 for separate repair or replacement without having to disassemble the entire heat dissipation system as a whole, greatly reducing the maintenance difficulty and cost, improving the maintenance efficiency, and providing a strong guarantee for the long-term stable operation of the product.

[0109] Furthermore, the first heat sink 34 and the second heat sink 35 are integrally in a plate-like structure, and the plate-like structure helps the heat dissipation device 300 to provide a large heat dissipation area in a limited space. Specifically, the first heat sink 34 has an installation side 341 and a heat conduction side 342 arranged oppositely. The installation side 341 and the heat conduction side 342 are arranged in parallel and at intervals. The heat conduction side 342 is thermally connected to the power device on the main board 32. The heat conduction side 342 includes a heat conduction surface 3421 and an avoidance groove 344 provided on at least one side of the heat conduction surface 3421. The heat conduction surface 3421 is used for thermally connecting with the power device, and the avoidance groove 344 extends from the heat conduction surface 3421 to the edge of the first heat sink 34. Among them, the avoidance groove 344 can be provided on one side of the heat conduction surface 3421, or on both sides of the heat conduction surface 3421, or the avoidance groove 344 is provided on the periphery of the heat conduction surface 3421. In this embodiment, along the first direction, the avoidance groove 344 is arranged oppositely to the first type of enclosure, and, along the first direction, the avoidance groove 344 has a bottom surface 3441 arranged oppositely to the main board. The distance between the bottom surface 3441 and the main board 32 is L1, and the distance between the end of the first type of enclosure facing away from the main board and the main board is L2, and L1 is greater than L2.

[0110] By providing the avoidance groove 344, it is beneficial to provide an avoidance space for potting in the area between the main board 32 and the first heat sink 34. Therefore, by providing the avoidance groove 344, the spacing dimensions between the first type of enclosure and the edge area of the first heat sink 34 in the first direction and the second direction are increased, so as to facilitate the operation of edge potting, and it can also enable the glue to fully fill the area between the main board 32 and the first heat sink 34.

[0111] In some embodiments, as Figure 12 shown, the heat dissipation device 300 includes a heat sink 301, a refrigerant heat dissipation pipe 302, and a cover plate 303. The cover plate 303 covers the heat sink 301. An accommodation channel is provided between the heat sink 301 and the cover plate 303. The refrigerant heat dissipation pipe 302 is arranged in the accommodation channel. The surface of the heat sink 301 on the side facing away from the cover plate 303 is in contact with the heat dissipation surface of the power device 310.

[0112] Among them, the refrigerant heat dissipation pipe 302 includes a refrigerant inlet and a refrigerant outlet. The refrigerant inlet can be connected to the refrigerant pipeline of the condenser. Thus, a part of the refrigerant in the refrigerant pipeline will flow into the refrigerant heat dissipation pipe 302 from the refrigerant inlet. After taking away the heat of the power device 310, it flows out from the refrigerant outlet and is finally transmitted to the compressor. Therefore, there is continuously circulating refrigerant flowing in the refrigerant heat dissipation pipe 302, which can ensure that the power device 310 is maintained within a reliable operating temperature range.

[0113] Further, the refrigerant heat dissipation tube 302 and the radiator 301 can be fastened by screws through the cover plate 303, so that the refrigerant heat dissipation tube 302 and the radiator 301 are closely attached, improving the heat dissipation efficiency of the power device 310.

[0114] In this embodiment, the refrigerant heat dissipation assembly is realized by using the cover plate 303, the radiator 301, and the refrigerant heat dissipation tube 302. The cover plate 303 is covered on the radiator 301, so that the refrigerant heat dissipation tube 302 and the radiator 301 are attached together, which is beneficial to reducing the temperature rise of the radiator 301, and thus well realizing the heat dissipation effect of the power device 310.

[0115] In some embodiments, as Figure 9 shown, the heat dissipation device 300 has a first projection on the main board 32 along the first direction, the first type of enclosure 82 has a second projection on the main board 32 along the first direction, and at least part of the second projection is located outside the first projection. Since the heat dissipation device 300 is installed above the power device 310, it will cause a certain obstruction to the potting operation. If the projection of the first type of enclosure 82 is completely inside the projection of the heat dissipation device 300, it will be difficult for the potting gun to find a suitable angle and space to extend into the enclosure area 801 for potting. Therefore, in the present invention, at least part of the second projection is located outside the first projection, providing a space for the potting gun to extend. The potting gun can find a suitable position outside the projection range of the heat dissipation device 300 to inject glue into the enclosure area 801, ensuring the smooth progress of the potting operation. Specifically, since at least part of the second projection is located outside the first projection, the enclosure area 801 enclosed by the first type of enclosure 82 is exposed outside the first projection of the heat dissipation device 300. Along the direction perpendicular to the main board 32, the enclosure area 801 has a window for potting that is exposed outside the heat dissipation device 300, and the potting gun can extend into the enclosure area 801 through this window to perform the potting operation.

[0116] According to an embodiment of the present invention, an outdoor unit is also proposed, as Figure 13 and Figure 14As shown in the figure, the outdoor unit 1 includes an electric control device 30. The outdoor unit further includes a box body and a partition assembly. Specifically, the box body 10 includes a bottom plate, a top cover 14, a front panel 12, a left side plate, and a right side plate 132. The bottom plate, the top cover 14, the front panel 12, the left side plate, and the right side plate 132 jointly enclose a receiving cavity 101. The partition assembly 160 is disposed in the receiving cavity 101. The partition assembly 160 is respectively connected to the front panel 12 and the bottom plate. The partition assembly 160 is disposed between the left side plate and the right side plate 132 and divides the receiving cavity 101 into a first cavity 1011 and a second cavity 1012. The first cavity 1011 is used to accommodate the heat exchanger and the fan. The electric control device 30 is installed on the partition assembly 160 and is located in the second cavity 1012. The electric control device 30 is installed on the partition assembly and is located in the second cavity. The heat dissipation device takes away the heat of the power device through the circulating flow of the refrigerant to achieve efficient heat dissipation.

[0117] As described above, the above is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A support enclosure structure for installation on an electric control device, characterized in that, The described support and enclosure structure includes: A support main body, which includes a first side and a second side arranged in opposite directions along a first direction. At least one first assembly structure is provided on the first side, and the first assembly structure is used to connect to the main board of the electronic control device. At least one accommodation area and a second assembly structure are provided on the second side. The accommodation area is used to place power devices, and the second assembly structure is used to connect to the heat dissipation device of the electronic control device; A first type of enclosure, which is connected to the support main body and encloses at least one enclosure area with the support main body, and the enclosure area is used for potting; The support main body is an insulating part made of insulating material and / or a heat-insulating part made of heat-insulating material.

2. The supporting enclosure structure according to claim 1, characterized in that, The support main body includes a support plate and a second type of enclosure. The second type of enclosure extends along the edge of the support plate. The first type of enclosure is connected to the second type of enclosure and jointly encloses the enclosure area with the second type of enclosure.

3. The support retaining structure according to claim 1, wherein The support main body and the first type of enclosure are of an integral structure.

4. The support enclosure structure according to claim 2, wherein, The support main body further includes a plurality of reinforcing ribs, and the plurality of reinforcing ribs protrude from the first side and / or the second side.

5. The support enclosure structure according to claim 2, characterized in that, Along the first direction, the height by which one end of the first type of enclosure located on the first side protrudes from the first side is H1, and the height by which one end of the second type of enclosure located on the first side protrudes from the first side is H2, where H1 is equal to H2.

6. The support enclosure structure according to claim 2, wherein, The support main body further includes a plurality of limiting ribs protruding from the second side of the support plate. The limiting ribs extend along at least part of the side edge of the accommodation area, and the limiting ribs are used to limit the power device within the accommodation area.

7. The support retaining structure according to claim 2, wherein The first type of enclosure is inclined with respect to the support plate, and the first side of the first type of enclosure is closer to the support plate than the second side of the first type of enclosure.

8. The support retaining structure according to claim 1, characterized in that, The shape of the enclosure area is a regular shape and / or an irregular shape.

9. The support enclosure structure according to claim 2, characterized in that, The first assembly structure includes at least one first boss, and the first boss protrudes from the first side and is used to connect to the main board.

10. The support retaining structure according to claim 9, wherein, At least one first positioning hole is provided on the support plate, and the first positioning hole is located within the accommodation area. The first positioning hole is used for a connecting piece to pass through to fix the power device within the accommodation area.

11. The support enclosure structure according to claim 10, characterized in that, The first positioning hole corresponds to the first boss one by one, and each positioning hole penetrates one first boss along the first direction.

12. The support retaining structure according to claim 2, wherein, The second assembly structure includes at least one second boss, and the second boss protrudes from the second side of the support plate and is used to position the heat dissipation device.

13. The support enclosure structure according to claim 2, characterized in that, The second assembly structure includes at least one second positioning hole, and the second positioning hole penetrates the support plate along the first direction. The second positioning hole is used for a connecting piece to pass through to connect the support plate and the heat dissipation device.

14. The support enclosure structure according to claim 1, wherein, The support and enclosure structure includes a plurality of the accommodation areas, and the plurality of accommodation areas are arranged at intervals in sequence along a second direction, and the second direction is perpendicular to the first direction.

15. The support enclosure structure according to claim 14, characterized in that, The support and enclosure structure further includes a plurality of heat-insulating cavities. Along the second direction, at least one heat-insulating cavity is provided between any two adjacent accommodation areas.

16. The support retaining structure according to claim 14, wherein, The multiple accommodation areas include a first accommodation area, a second accommodation area and a third accommodation area which are arranged in sequence, and the first accommodation area, the second accommodation area and the third accommodation area are used to respectively accommodate different power devices.

17. The support enclosure structure according to claim 16, wherein, The supporting enclosure structure includes a plurality of enclosure areas, and the plurality of enclosure areas are arranged around the second accommodating area and the third accommodating area.

18. The support enclosure structure according to claim 6, characterized in that, Along the first direction, one end of the first type enclosure located on the second side protrudes from the second side of the support plate by a height of H3, and the limiting rib protrudes from the second side of the support plate by a height of H4, wherein H3 is smaller than H4.

19. An electronic control device, characterized in that, The electronic control device includes a main board, a power device, a heat sink and a supporting enclosure structure as described in any one of claims 1 to 18, the main board is connected to the first assembly structure, the power device is placed in the accommodating area and electrically connected to the main board, and the heat sink is connected to the second assembly structure and thermally connected to the power device.

20. The electronic control device according to claim 19, characterized in that, The heat dissipation device comprises: A first heat sink, the first heat sink is connected to the second assembly structure and is thermally connected to the power device; The second radiator is detachably connected to the first radiator, and a refrigerant channel for the flow of refrigerant is provided inside the second radiator, and the refrigerant channel is used to communicate with the refrigerant circulation pipeline.

21. The electronic control device according to claim 20, characterized in that, Along the first direction, the first heat sink has an installation side and a heat conduction side that are oppositely arranged. The second heat sink is detachably mounted on the installation side. The heat conduction side includes a heat conduction surface and an avoidance groove. The heat conduction surface is thermally connected to the power device. Along a direction parallel to the heat conduction surface, the avoidance groove is arranged on at least one side of the heat conduction surface. Along the first direction, the avoidance groove is arranged opposite to the first type of enclosure.

22. The electronic control device according to claim 21, characterized in that, Along the first direction, the avoidance groove has a bottom surface arranged opposite to the main board, the distance between the bottom surface and the main board is L1, the distance between the end of the first type of enclosure away from the main board and the main board is L2, and L1 is greater than L2.

23. The electronic control device according to claim 19, characterized in that, The heat dissipation device comprises a radiator, a refrigerant heat dissipation pipe and a cover plate; The cover plate is covered on the radiator, an accommodating channel is provided between the radiator and the cover plate, the refrigerant heat dissipation pipe is passed through the accommodating channel, and the surface of the radiator facing away from the cover plate is connected to the second assembly structure and is thermally connected to the power device.

24. The electronic control device according to any one of claims 19 to 23, characterized in that, The heat dissipation device has a first projection on the mainboard along the first direction, and the first type of enclosure has a second projection on the mainboard along the first direction, and at least a portion of the second projection is located outside the first projection.

25. An outdoor unit, characterized in that, Comprising the electronic control device as claimed in any one of claims 19 to 24.

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