Loop type thermosiphon 3D vapor chamber

Abstract

The invention relates to a loop type thermosiphon 3D vapor chamber. The 3D vapor chamber includes a lower body defining an evaporator region, a header over the lower body, a conduit extending between the lower body and the header, a condenser region, and a working fluid within at least one of the lower body, the header, or the conduit. The conduits are configured to direct working fluid flow to and out of the lower body and header. A portion of the working fluid is configured to be in vaporized form during use and another portion of the working fluid is configured to be in liquid form during use. The conduits are arranged such that the vaporized working fluid and the liquid working fluid are configured to flow in the same direction in at least one of the conduits.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 623,073, filed on January 19, 2024, the entire content of which is incorporated herein by reference. Technical field

[0003] The present disclosure generally relates to thermal devices for diverting heat from a heat source, including vapor chambers (also known as vacuum chamber vapor chambers). Background art

[0004] Thermal devices are typically used to remove heat from a heat source. For example, a thermal device may be at least partially made of a thermally conductive material and may contain a phase - change working fluid within the thermal device. The phase change of the working fluid is used to dissipate heat from the heat source. Thermal devices generally include: an evaporator region that is in thermal communication with the heat source to receive heat from the heat source and direct the heat to the working fluid; and a condenser region that is in thermal communication with the evaporator region, where heat is dissipated from the working fluid to the external environment. Some thermal devices include a wick material disposed within the thermal device to create capillary action to assist the working fluid in returning to the evaporator region.

[0005] During use, the working fluid typically absorbs heat generated by and transferred from the heat source. The heat absorbed from the heat source causes the working fluid to evaporate (i.e., change the phase of the working fluid), thereby transferring the heat away from the heat source. Then, the heated vapor flows to the cooler condenser region of the thermal device, where the vaporized working fluid condenses and again changes phase back to its liquid state. The condensation of the vaporized working fluid dissipates the absorbed heat. The heat leaves the condenser region and enters the external environment. The cooled working fluid returns to the evaporator region, which is sometimes facilitated by the capillary action provided by the wick structure. Once returned to the evaporator region of the thermal device, the working fluid again absorbs heat from the heat source. This heat dissipation cycle can be continuously repeated as long as the heat source generates heat. Summary of the invention

[0006] According to one example, a 3D vapor chamber includes a lower body defining an evaporator region, a manifold located above the lower body, ducts extending between the lower body and the manifold, a condenser region, and a working fluid located within at least one of the lower body, the manifold, or the ducts. The ducts are configured to direct the flow of the working fluid to and from the lower body and the manifold. A portion of the working fluid is configured to be in a vaporized form during use, and another portion of the working fluid is configured to be in a liquid form during use. The ducts are arranged such that the vaporized working fluid and the liquid working fluid are configured to flow in different directions in none, some, most, or all of the ducts.

[0007] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, conduits extending between the lower body and the header, a condenser region between the lower body and the header, and a working fluid within at least one of the lower body, the header, or the conduits. The 3D vapor chamber also includes a core structure within the lower body. The core structure is located within the lower body to impede movement of the vaporized portion of the working fluid and to urge the vaporized portion of the working fluid into one or more of the conduits and upward into the upper header and then downward back through one or more of the conduits.

[0008] According to another example, a 3D vapor chamber includes a lower body defining a well. The well defines an evaporator region. The 3D vapor chamber also includes a header located above the lower body, conduits extending between the lower body and the header, a condenser region between the lower body and the header, and a working fluid within at least one of the lower body, the header, or the conduits. The 3D vapor chamber also includes a boundary wall within the lower body. The boundary wall is configured to prevent a portion of the working fluid from entering the well.

[0009] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and conduits extending between the lower body and the header. The conduits are configured to direct the flow of the working fluid between the lower body and the header. The 3D vapor chamber also includes a condenser region between the lower body and the header. The conduits include a first conduit having a first width and a second conduit having a second width different from the first width.

[0010] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and conduits extending between the lower body and the header. The conduits are configured to direct the flow of the working fluid between the lower body and the header. The 3D vapor chamber also includes a condenser region between the lower body and the header. The conduits are sized and shaped such that there is a different total cross-sectional area of the conduits for the vapor flow of the working fluid moving upward compared to the return vapor flow of the working fluid moving downward.

[0011] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and conduits extending between the lower body and the header. The conduits are configured to direct the flow of the working fluid between the lower body and the header. The 3D vapor chamber also includes a condenser region between the lower body and the header. The condenser region includes air-cooling fins arranged in a stack. The density of the air-cooling fins within one of the stacks varies within the stack.

[0012] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and ducts extending between the lower body and the header. The ducts are configured to direct the flow of a working fluid between the lower body and the header. The 3D vapor chamber further includes a condenser region located between the lower body and the header, and a core structure located within the lower body. One or more of the ducts are in direct contact with the core structure.

[0013] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, a condenser region located between the lower body and the header, and columns within the header. Each column has a streamlined cross-sectional shape.

[0014] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and ducts extending between the lower body and the header. The ducts are configured to direct the flow of a working fluid between the lower body and the header. The 3D vapor chamber further includes a condenser region located between the lower body and the header. The condenser region includes air-cooling fins arranged in a stack. The density of the air-cooling fins in one stack is different from the density of the air-cooling fins in different stacks.

[0015] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and ducts extending between the lower body and the header. The ducts are configured to direct the flow of a working fluid between the lower body and the header. The 3D vapor chamber further includes a condenser region located between the lower body and the header, and a core structure extending at least partially within one or more of the ducts or the header.

[0016] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and ducts extending between the lower body and the header. The ducts are configured to direct the flow of a working fluid between the lower body and the header. The 3D vapor chamber further includes a condenser region located between the lower body and the header. The evaporator region includes a lower wall, and fins extending upward from the lower wall. The evaporator region further includes a core structure extending at least partially above the fins.

[0017] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a header located above the lower body, and ducts extending between the lower body and the header. The ducts are configured to direct the flow of a working fluid between the lower body and the header. The 3D vapor chamber further includes a condenser region located between the lower body and the header. The evaporator region includes fins, columns, and cavities arranged in a parallel arrangement, a grid, and / or any other regular or irregular pattern.

[0018] According to another example, a 3D vapor chamber includes a lower body defining an evaporator region, a conduit extending away from the lower body and looping back to the lower body, and a working fluid located in at least one of the lower body or the conduit. The conduit is configured to direct the flow of the working fluid into and out of the lower body. A portion of the working fluid is configured to be in a vaporized form during use, and another portion of the working fluid is configured to be in a liquid form during use.

[0019] According to another example, a thermal device includes an evaporator region having a plurality of extending surfaces defining a matrix, wherein the extending surfaces are configured to provide structural support for the evaporator region. The thermal device further includes a core structure covering at least a portion of the extending surfaces. The core structure includes powder ribs.

[0020] According to another example, a thermal device includes an evaporator region, a liquid reservoir positioned adjacent to the evaporator region, and a screen located in the liquid reservoir.

[0021] Details of one or more aspects of the present disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the techniques described in this disclosure will be apparent from the specification, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic cross-sectional view of a heat pipe according to one example.

[0023] Figure 2 is a schematic cross-sectional view of a 2D vapor chamber according to one example.

[0024] Figure 3 is a schematic cross-sectional view of a vapor chamber having a heat pipe according to one example.

[0025] Figure 4 is a schematic cross-sectional view of a circular tube 3D vapor chamber according to one example.

[0026] Figure 5 is a schematic cross-sectional view of a loop heat pipe 3D vapor chamber according to one example.

[0027] Figure 6 is a schematic cross-sectional view of a loop heat pipe 3D vapor chamber according to another example.

[0028] Figure 7 is a schematic cross-sectional view of the flow of a working fluid through a loop heat pipe 3D vapor chamber according to one example.

[0029] Figure 8 is a perspective view of a working physical prototype of a loop heat pipe 3D vapor chamber according to one example.

[0030] Figure 9A It is a perspective view of an example of a flat tube conduit for a loop thermosyphon 3D vapor chamber.

[0031] Figure 9B It is Figure 5 a schematic cross-sectional view of a loop thermosyphon 3D vapor chamber, which illustrates the flat tube conduit.

[0032] Figure 9C It is a schematic cross-sectional view of a different loop thermosyphon 3D vapor chamber, which illustrates a larger round tube conduit.

[0033] Figure 10A It is Figure 8 a perspective view of a header of a loop thermosyphon 3D vapor chamber.

[0034] Figure 10B It is Figure 10A a schematic view of the header.

[0035] Figure 10C It is a schematic view of a header according to another example.

[0036] Figure 10D It is a schematic view of a header according to yet another example.

[0037] Figure 11 It is a schematic side cross-sectional view of an extruded tube conduit inserted into a stamping plate including collars according to an example.

[0038] Figure 12 It is a schematic perspective view of a reinforcement plate according to an example.

[0039] Figure 13A It is Figure 8 a perspective view of a lower body and an evaporator region of a loop thermosyphon 3D vapor chamber, which illustrates an extended surface on the lower body and the evaporator region of the lower body.

[0040] Figure 13B It is Figure 13A another perspective view of the lower body and the evaporator region.

[0041] Figure 13C It is Figure 13A another perspective view of the lower body and the evaporator region.

[0042] Figure 14 It is a schematic side cross-sectional view of an evaporator region having a flat powder core structure.

[0043] Figure 15 It is a schematic side cross-sectional view of an evaporator region having extended powder ribs.

[0044] Figure 16 is a schematic side cross-sectional view of an evaporator region having an extended surface and powder ribs located above the extended surface.

[0045] Figure 17 is a schematic top view of an evaporator region having an extended surface, a portion of which includes circular columns.

[0046] Figure 18 is a schematic top view of an evaporator region having a planar extended surface.

[0047] Figure 19 is a schematic top view of an evaporator region having an extended surface and a grid pattern of cavities.

[0048] Figure 20 is a schematic side cross-sectional view of an extended surface in an evaporator region and a core structure located on the extended surface.

[0049] Figure 21 is a schematic perspective view of an evaporator region having an extended surface and cavities.

[0050] Figure 22 is Figure 21 a schematic top view of the evaporator region of

[0051] Figure 23 is Figure 21 a schematic top cross-sectional view of the evaporator region of

[0052] Figure 24A is a schematic side cross-sectional view of an evaporator region, which illustrates a wall and a trench region.

[0053] Figure 24B is a schematic side cross-sectional view of an evaporator region, which illustrates a powder core wall separating a liquid reservoir.

[0054] Figure 25 is a schematic top cross-sectional view of an evaporator region, which illustrates a serpentine wall.

[0055] Figure 26 is a schematic cross-sectional view of a 3D vapor chamber according to another example, which does not have headers and includes a single conduit forming a loop.

[0056] Figure 27 is a schematic perspective view of a 3D vapor chamber according to another example, which also does not have headers and includes a plurality of conduits arranged in a row.

[0057] Figure 28 is a schematic perspective view of a 3D vapor chamber according to another example, which also does not have headers and includes a plurality of conduits arranged in a staggered pattern.

[0058] Figure 29 is a schematic perspective view of a 3D vapor chamber according to another example, which also does not have manifolds and includes a plurality of conduits arranged below other conduits.

[0059] Figure 30 is a schematic front view of a 3D vapor chamber according to another example, which has fins extending from a manifold. DETAILED DESCRIPTION

[0060] Heat pipe

[0061] Figure 1 Schematically illustrates an example of a heat pipe 10 having an evaporator region 12, a condenser region 14, and an adiabatic region 16 located between the evaporator region 12 and the condenser region 14. In the illustrated example, the heat pipe 10 is a closed hollow heat pipe 10 having a body 18 (e.g., a generally cylindrical body with circular closed ends) that defines a hollow interior 20. The body 18 is formed of a thermally conductive material (e.g., copper or other thermally conductive metal). The hollow interior 20 houses a working fluid (e.g., water) in vapor form and / or liquid form. The heat pipe 10 also includes at least one wick structure 22 located within the hollow interior 20. The wick structure 22 extends at least partially (e.g., continuously) along the inner wall of the body 18 from the condenser region 14 to the evaporator region 12.

[0062] During use, heat is input at the evaporator region 12 (e.g., from a heat source such as an electronic heat source), causing the working fluid to evaporate into vapor and move through the hollow interior 20 to the condenser region 14. There, the working fluid condenses, and heat dissipates from the heat pipe 10. The condensed working fluid returns to the evaporator region 12 along the wick structure 22 (e.g., by capillary action), thus experiencing a pressure loss as it returns to the evaporator region 12.

[0063] 2D vapor chamber

[0064] Figure 2Schematically illustrates an example of a heat pipe 24 (e.g., a two-dimensional (“2D”) heat pipe), which has an evaporator region 26, a condenser region 28, and an adiabatic region 30 located between the evaporator region 26 and the condenser region 28. In the illustrated example, the 2D heat pipe 24 is a closed hollow heat pipe 24 having a body 32 (e.g., a generally rectangular body) that defines a hollow interior 34. The hollow interior 34 houses a working fluid (e.g., water). The 2D heat pipe 24 also includes at least one wick structure 36 located within the hollow interior 34. The wick structure 36 extends at least partially (e.g., continuously) along one or more inner walls of the body 32 from the condenser region 28 to the evaporator region 26. In the illustrated example, the 2D heat pipe 24 includes a lower wall 38, an upper wall 40, a first side wall 42, and a second side wall 44. The evaporator region 26 is located along a portion of the lower wall 38, and the condenser region 28 is located along a portion of the upper wall 40. The wick structure 36 extends continuously along the inner surface of each of the lower wall 38, the upper wall 40, the first side wall 42, and the second side wall 44, but in other examples, the wick structure 36 does not extend continuously, and / or extends only along a portion of the lower wall 38, the upper wall 40, the first side wall 42, and / or the second side wall 44.

[0065] Continuing to refer Figure 2 , a set of air-cooling fins 46 extends away from the upper wall 40 (e.g., vertically upward and perpendicularly) at the condenser region 28. For example, the air-cooling fins 46 are made of a thermally conductive material (e.g., copper, aluminum, or other thermally conductive metal) such that heat from the condenser region 28 is transferred upward into the air-cooling fins 46 and through the air-cooling fins 46. Air is directed through and / or past the set of air-cooling fins 46 (e.g., through the gaps between the air-cooling fins 46) to assist in removing the heat that has moved upward from the condenser region 28 into the air-cooling fins 46.

[0066] During use, heat is input at the evaporator region 26 (e.g., from a heat source such as an electronic heat source), causing the working fluid to evaporate into vapor and move through the hollow interior 34 to the condenser region 28. There, the working fluid condenses, and the heat dissipates from the heat pipe 24 and through the air-cooling fins 46. The condensed working fluid returns to the evaporator region 26 along the wick structure 36 (e.g., by capillary action and / or gravity), thereby experiencing a pressure loss as it returns to the evaporator region 26. As Figure 2 shown in

[0067] In some examples, compared to other devices (e.g., the heat pipe 10 described above), the vapor chamber 24 may have a higher heat dissipation rate, a higher heat flux, and / or a lower evaporator and condenser thermal resistance.

[0068] Vapor chamber with heat pipe

[0069] Figure 3 An example of a thermal device 48 is schematically illustrated, which has a vapor chamber 50 (e.g., a 2D vapor chamber) and a heat pipe 52 coupled to the 2D vapor chamber 50, thus forming a vapor chamber with a heat pipe. The thermal device 48 includes an evaporator region 54, a condenser region 56, and an adiabatic region 58 located between the evaporator region 54 and the condenser region 56.

[0070] The 2D vapor chamber 50 may be similar or identical to the 2D vapor chamber 24 described above. As Figure 3 seen, at least a portion of the 2D vapor chamber 50 defines the evaporator region 54 of the thermal device 48. The 2D vapor chamber 50 is a closed hollow 2D vapor chamber 50 that defines a hollow interior for housing a working fluid (e.g., water). The 2D vapor chamber 50 further includes at least one wick structure 60 located within the hollow interior. The wick structure 60 extends at least partially (e.g., continuously) along one or more inner walls.

[0071] The heat pipe 52 is coupled to the 2D vapor chamber 50 (e.g., coupled to the top wall of the vapor chamber 50). The heat pipe 52 defines its own hollow interior and may include a wick structure 62 located within the hollow interior, and also includes a working fluid within the hollow interior. In the illustrated example, the heat pipe 52 is curved and / or arcuate such that a central portion of the heat pipe 52 is coupled to (e.g., near or in contact with) the 2D vapor chamber 50 to receive heat from the 2D vapor chamber 50, and the ends 64 of the heat pipe 52 extend away from the 2D vapor chamber 50 (e.g., upward). In the illustrated example, one or both of the ends 64 define the condenser region 56 of the thermal device 48.

[0072] Continuing to refer to Figure 3 , a set of air-cooling fins 66 extends away from the ends 64 (e.g., horizontally) at the condenser region 56. For example, the air-cooling fins 66 are made of a thermally conductive material (e.g., copper, aluminum, or other thermally conductive metals) such that heat from the condenser region 56 is transferred into the air-cooling fins 66 and through the air-cooling fins 66. Air is directed through and / or past the set of air-cooling fins 66 (e.g., through the gaps between the air-cooling fins 66) to assist in removing the heat that has moved from the condenser region 56 to the air-cooling fins 66.

[0073] During use, heat is input at the evaporator region 54 (e.g., from a heat source such as an electronic heat source), causing the working fluid in the 2D vapor chamber 50 and / or the heat pipe 52 to evaporate into vapor. The working fluid in the heat pipe 52 condenses at the condenser region 56, and the heat is dissipated through the air-cooling fins 66. The condensed working fluid in the heat pipe 52 returns to the central region of the heat pipe 52 along the wick structure 62 (e.g., by capillary action and / or gravity). In the 2D vapor chamber 50, the vapor condenses (e.g., at a location remote from the evaporator region 54) and then returns to the evaporator region (e.g., via the wick structure 60).

[0074] In some examples, the overall thermal device 48 may have a lower condenser thermal resistance compared to other devices (e.g., the vapor chamber 24 described above).

[0075] Round tube 3D vapor chamber

[0076] Figure 4 An example of a circular tube 3D vapor chamber 68 (e.g., a three-dimensional "3D" vapor chamber) is schematically illustrated, which has an evaporator region 70, a condenser region 72, and an adiabatic region 74 located between the evaporator region 70 and the condenser region 72. The 3D vapor chamber 68 is a closed hollow vapor chamber 68 having a main (e.g., lower) chamber 76 and at least one circular tube 78 extending (e.g., vertically) from the main chamber 76. The main chamber 76 defines the evaporator region 70, and the one or more circular tubes 78 define the condenser region 72.

[0077] The vapor chamber 68 houses a working fluid (e.g., water) and includes at least one wick structure 80. The wick structure 80 extends at least partially (e.g., continuously) along one or more inner walls from the condenser region 72 to the evaporator region 70. In the illustrated example, the wick structure 80 extends at least partially into one or more of the circular tubes 78 and also at least partially into the main chamber 76. Additionally, in the illustrated example, a portion of the wick structure 80 extends through (e.g., completely through) the hollow interior space of the main chamber 76 to connect to the portion of the wick structure 80 located along the lower wall of the main chamber 76.

[0078] Continuing to refer Figure 4 , a set of air-cooling fins 82 extends away from the circular tubes 78 (e.g., horizontally) at the condenser region 72. For example, the air-cooling fins 82 are made of a thermally conductive material (e.g., copper, aluminum, or other thermally conductive metal) such that heat from the condenser region 72 is transferred into the air-cooling fins 82 and through the air-cooling fins 82. Air is directed through and / or past the set of air-cooling fins 82 (e.g., through the gaps between the air-cooling fins 82) to assist in removing the heat that has moved from the condenser region 72 to the air-cooling fins 82.

[0079] During use, heat is input at the evaporator region 70 (e.g., from a heat source such as an electronic heat source), causing the working fluid to evaporate into vapor. The working fluid condenses at the condenser region 72, and the heat is dissipated through the air-cooling fins 82. The condensed working fluid returns to the evaporator region 70 along the core structure 80 (e.g., by capillary action and / or gravity), thereby experiencing a pressure loss when it returns to the evaporator region 70.

[0080] In some examples, the 3D vapor chamber 68 may have a lower condenser thermal resistance compared to other devices (e.g., the thermal device 48 described above).

[0081] 3D vapor chamber with loop heat pipe

[0082] Figure 5 An example of a 3D vapor chamber 86 (e.g., a flat-tube 3D vapor chamber) with a looped thermosyphon is schematically illustrated. In the example shown, the 3D vapor chamber 86 includes an evaporator region 90, a condenser region 94, and an adiabatic region 98 (or regions 98) located between the evaporator region 90 and the condenser region 94. The 3D vapor chamber 86 also includes a lower body 102 that defines a hollow interior 106 and a well 110. The well 110 is generally centered along the lower body 102, but in other examples, the well 110 is laterally positioned closer to one end of the lower body 102 compared to the other end of the lower body 102. The evaporator region 90 is at least partially defined by the well 110. In other examples, the lower body 102 does not include the well 110.

[0083] Continuing to refer to Figure 5 , the well 110 includes: a lower well wall 114; a first side well wall 118 that extends relative to the lower well wall 114 at an inclined angle (e.g., 30 degrees, 45 degrees, 60 degrees, or other angle); and a second side well wall 122 that extends relative to the lower well wall 114 at an inclined angle (e.g., 30 degrees, 45 degrees, 60 degrees, or other angle). Although not illustrated, the well 110 may also include a third side well wall and / or a fourth side well wall that also angle downward (e.g., inward) toward the lower well wall 114. Other examples include wells 110 with different shapes and / or sizes than those shown, including wells 110 with other numbers and angles of side well walls, or no well at all.

[0084] Continuing to refer to Figure 5, the evaporator region 90 is defined by a portion of the lower well wall 114. During use, the lower well wall 114 is in direct (or indirect) contact with a heat source 126 (e.g., an electronic heat source such as a microprocessor), such that heat from the heat source 126 moves upward through the evaporator region 90 and through the lower well wall 114 toward the hollow interior 106 of the lower body 102. In other examples, the evaporator region 90 is at least partially defined by the first side well wall 118 or the second side well wall 122.

[0085] Continuing to refer Figure 5 , the lower body 102 also defines at least one liquid reservoir that receives the condensed working fluid (e.g., water), and / or directs the condensed working fluid to the sump 110. In the illustrated example, the lower body 102 includes a first liquid reservoir 130 located on one side of the sump 110 and a second liquid reservoir 134 located on the opposite side of the sump 110. As Figure 5 shown, each of the first and second liquid reservoirs 130, 134 has a generally rectangular cross-sectional shape, but other examples include different shapes and dimensions than those shown. In some examples, the first and second liquid reservoirs 130, 134 are fluidly connected such that they form a single integral liquid reservoir around the sump 110. In some examples, the lower body 102 defines more than two liquid reservoirs.

[0086] As Figure 5 shown, the first liquid reservoir 130 includes a first lower reservoir wall 136, a first upper reservoir wall 138, and a first side reservoir wall 142. During use, the condensed working fluid accumulates along the first lower reservoir wall 136 and thus rises toward the first upper reservoir wall 138. The first liquid reservoir 130 also includes a first boundary wall 146 that extends upward (e.g., vertically) from the first lower reservoir wall 136 and terminates before reaching the first upper reservoir wall 138. The first boundary wall 146 extends upward from the first lower reservoir wall 136 at the intersection of the first lower reservoir wall 136 and the first side well wall 118. In other examples, the first boundary wall 146 extends from the first lower reservoir wall 136 at a different location (e.g., laterally away from the intersection between the first lower reservoir wall 136 and the first side well wall 118). In still other examples, the first boundary wall 146 extends from the sump 110 (e.g., from the first side well wall 118 or another wall).

[0087] The second liquid reservoir 134 similarly includes a second lower reservoir wall 150, a second upper reservoir wall 154, and a second side reservoir wall 158. The first upper reservoir wall 138 and the second upper reservoir wall 154 are integrally formed together as a single piece and define a portion of the overall upper reservoir wall (e.g., the first upper reservoir wall 138 merges into the second upper reservoir wall 154 at a location generally directly above the well 110). In other examples, the first upper reservoir wall 138 is a separate wall from the second upper reservoir wall 154.

[0088] During use, the condensed working fluid accumulates along the second lower reservoir wall 150 and thus rises toward the second upper reservoir wall 154. The second liquid reservoir 134 also includes a second boundary wall 162 that extends upward (e.g., vertically) from the second lower reservoir wall 150 and terminates before reaching the second upper reservoir wall 154. The second boundary wall 162 extends upward from the second lower reservoir wall 150 at the intersection of the second lower reservoir wall 150 and the second side well wall 122. In other examples, the second boundary wall 162 extends from the second lower reservoir wall 150 at a different location (e.g., laterally away from the intersection between the second lower reservoir wall 150 and the second side well wall 122).

[0089] Continuing reference Figure 5 to, the first boundary wall 146 and the second boundary wall 162 are integrally formed together as a single piece and each is a portion of a single boundary wall that extends completely around the well 110. The height of the first boundary wall 146 (e.g., measured vertically upward from the first lower reservoir wall 136) is the same as the height of the second boundary wall 162 (e.g., measured vertically upward from the second lower reservoir wall 150). In other examples, a plurality of separate boundary walls are provided, and / or the height of the first boundary wall 146 is different from the height of the second boundary wall 162. In still other examples, the first boundary wall 146 and / or the second boundary wall 162 are completely omitted.

[0090] Continuing reference Figure 5 to, the 3D vapor chamber 86 also includes at least one core structure 166 located within the hollow interior 106 of the lower body 102. For example, the core structure 166 is formed of wire mesh or screen, sintered powder metal, or other suitable materials. In some examples, the core structure 166 includes one or more grooves formed (e.g., machined) into one or more walls of the lower body 102. Different core structures 166 have different permeabilities and maximum capillary pressures, which affect the amount of liquid flow back to the evaporator region 90.

[0091] In some examples, the core structure 166 may extend entirely along the hollow interior 106, and / or the hollow interior 106 may include additional core structures. Additionally, in some examples, the core structure 166 (or other structures located within the hollow interior 106) may contribute to tolerating freeze / thaw, thereby inhibiting or preventing the liquid from freezing and / or expanding and potentially damaging the thermal device.

[0092] Continuing to refer Figure 5 , the core structure 166 extends at least partially (e.g., continuously) along one or more inner walls of the lower body 102. The core structure 166 extends continuously along the interior of the lower well wall 114 and also along the interior of each of the first side well wall 118 and the second side well wall 122 such that the entire recessed well 110 is covered by the core structure 166. In other examples, the core structure 166 extends only along a portion of the lower well wall 114, a portion of the first side well wall 118, and / or a portion of the second side well wall 122.

[0093] The core structure 166 further includes a first peripheral portion 170 that extends upward and outward from the recessed well 110 and rolls up and wraps around the first boundary wall 146. The first peripheral portion 170 rises toward (and in some cases physically contacts) the first upper reservoir wall 138 in a region above the end of the first boundary wall 146. The first peripheral portion 170 also extends downward and laterally toward (and in some cases physically contacts) the first lower reservoir wall 136 beside the first boundary wall 146.

[0094] Similarly, the core structure 166 further includes a second peripheral portion 174 that extends upward and outward from the recessed well 110 and rolls up and wraps around the second boundary wall 162. The second peripheral portion 174 rises toward (and in some cases physically contacts) the second upper reservoir wall 154 in a region above the end of the second boundary wall 162. The second peripheral portion 174 also extends downward and laterally toward (and in some cases physically contacts) the second lower reservoir wall 150 beside the second boundary wall 162.

[0095] In the illustrated example, the first peripheral portion 170 and the second peripheral portion 174 are integrally formed together as a single piece and each is part of a single periphery of the core structure 166 that extends completely around the recessed well 110. In other examples, multiple separate peripheral portions of the core structure 166 are provided. In still other examples, at least a portion of the core structure 166 (e.g., the first and / or second peripheral portions 170, 174) is completely omitted. In some examples, the core structure 166 may replace the first liquid reservoir 130 and / or the second liquid reservoir 134 and, for example, may extend to the end of the lower body 102.

[0096] Continuing to refer Figure 5, the 3D vapor chamber 86 further includes a plurality of conduits (e.g., vertical flat tubes) 178 that are coupled to the lower body 102 and are in fluid communication with the hollow interior 106 of the lower body 102. Each conduit 178 is a hollow tube (e.g., a hollow flat tube, a hollow cylindrical tube, etc.) that is directly coupled to the first upper reservoir wall 138 or the second upper reservoir wall 154. In some examples, one or more of the conduits 178 are flattened tubes, are extruded, and / or are smooth or grooved tubes. In the illustrated example, the conduits 178 extend parallel to each other, and each conduit 178 is sized, shaped, and positioned to direct a flow (or flows) of working fluid (e.g., in liquid form and / or vaporized form) vertically upward and / or vertically downward.

[0097] Some of the conduits 178 have a different width "W" than other conduits 178. For example, the two illustrated conduits 178 located directly above the evaporator region 90 have a greater width than the conduits 178 located directly above the first liquid reservoir 130 or the second liquid reservoir 134. In other examples, the conduits 178 located directly above the evaporator region 90 have a smaller width than the conduits 178 located directly above the first liquid reservoir 130 or the second liquid reservoir 134. In still other examples, each of the conduits 178 in the 3D vapor chamber 86 has the same width. Additionally, although the illustrated conduits 178 extend parallel to each other, in other examples, at least one of these conduits does not extend parallel to another conduit among the conduits 178.

[0098] Generally, the conduits 178 are sized and shaped such that there is a different (e.g., greater) total cross-sectional area for the conduits 178 for vapor flow compared to the total cross-sectional area of the conduits 178 for the return liquid flow in the 3D vapor chamber 86, but other examples include other arrangements and desired flows. In some examples, the vaporized working fluid and the condensed liquid working fluid flow in the same direction in most or the vast majority of the 3D vapor chamber 86 (e.g., in most of the conduits 178 in the 3D vapor chamber 86). In still other examples, the vaporized working fluid and the condensed liquid working fluid do not flow in the same direction in most or the vast majority of the 3D vapor chamber 86. In some examples, the vaporized working fluid and the condensed liquid working fluid do not flow in the same direction in any part of the 3D vapor chamber 86, or only flow in the same direction in a small portion of the 3D vapor chamber 86.

[0099] In some examples, at least one of the conduits 178 extends downward and contacts the lower wall of the liquid reservoir or the fill material (e.g., the screen), the lower wall of the insulation region or the core, and / or any portion of the evaporator. For example, in the example shown, one of the conduits 178 may extend downward and contact the first lower reservoir wall 136 or the second lower reservoir wall 150, or may contact a portion of the core structure 166. The conduit 178 may alternatively extend downward into the lower body 102, but terminate slightly above the first lower reservoir wall 136 (e.g., within or above the liquid accumulated in the first liquid reservoir 130), slightly above the second lower reservoir wall 150 (e.g., within or above the liquid accumulated in the second liquid reservoir 134), or slightly above the core structure 166. In some examples, at least one of the conduits 178 may extend downward and contact any lower wall of the evaporator region 90 or the well 110 (e.g., walls 114, 118, 122), or terminate slightly above any lower wall of the evaporator region 90 or the well 110.

[0100] Continuing to refer Figure 5 , the 3D vapor chamber 86 also includes at least one header 182 that is located above the lower body 102 and the conduits 178 and is in fluid communication with the conduits 178. Each conduit 178 extends from the lower body 102 to the header 182. Each conduit 178 has the same vertical height “H” (e.g., measured between the lower body 102 and the header 182 in a direction perpendicular to the width “W”), but in other examples, at least one of the conduits 178 has a height different from that of a different one of the conduits 178.

[0101] The header 182 includes a header upper wall 186, a header lower wall 190, a first header side wall 194, and a second header side wall 198, thereby defining a rectangular cross-sectional shape, but other examples include other shapes than the one shown. The header 182 also defines an internal volume 202. The header 182 is sized, shaped, and positioned such that at least a portion of the working fluid (e.g., in liquid form and vaporized form) flows through the internal volume 202 (e.g., flows laterally through in a direction perpendicular to the flow of the working fluid in the conduits 178).

[0102] Continuing to refer Figure 5, the condenser region 94 of the 3D vapor chamber 86 includes at least one air-cooled fin 206 (e.g., a plate, protrusion, or other structure that aids in transferring heat to the surface of the structure where the heat can then be rapidly dissipated by the movement of air or other fluid across the surface). In the example shown, the 3D vapor chamber 86 includes multiple sets (e.g., stacks) of air-cooled fins 206. Each set includes a stack of air-cooled fins 206 (e.g., a vertical and / or horizontal stack). In some examples, the air-cooled fins 206 are laterally inserted into the 3D vapor chamber. For example, the air-cooled fins 206 are inserted between the flat surfaces of the conduits 178. As Figure 5 seen, the sets of air-cooled fins 206 are separated by the conduits 178. Various types of air-cooled fins 206 can be used, such as including C-shaped fins, folded fins, and / or lanced offset fins. In some examples, the 3D vapor chamber 86 includes different types of air-cooled fins 206 at different locations, allowing for different fin spacings in different sections of the condenser region 94. For example, some 3D vapor chambers 86 may also or alternatively include one or more air-cooled fins 206 located on top of the headers 182. The air-cooled fins 206 on the headers 182 can extend vertically upward and / or be otherwise positioned to receive an air flow and / or dissipate heat. Placing the air-cooled fins 206 on the headers 182 can allow the overall 3D vapor chamber 86 to be shorter, have a smaller weight, be less expensive, have a higher capacity, have a lower pressure drop, and / or have a lower thermal resistance than other 3D vapor chambers.

[0103] During use, air is directed through the sets of air-cooled fins 206 (e.g., through the spaces or gaps between each air-cooled fin 206) to aid in the condensation of the working fluid and / or to aid in removing heat from the 3D vapor chamber 86. The air (e.g., from a forced air source such as one or more fans) is directed through the sets of air-cooled fins 206 in a direction perpendicular to the flow of the working fluid through the conduits 178 (e.g., from left to right in Figure 5 or into the page in Figure 5 ). In other examples, the sets of air-cooled fins 206 include other numbers of fins 206 and / or groups of fins 206 and other air flow directions than those shown.

[0104] Continuing to refer to Figure 5, during use, the 3D vapor chamber 86 can be coupled to a heat source 126. Heat from the heat source 126 is directed vertically upward along the lower well wall 114 into the evaporator region 90. This heat warms the working fluid disposed within the well 110 (e.g., the working fluid disposed within the core structure 166 and / or the working fluid generally above or otherwise adjacent to the core structure 166 within the well 110). Once the working fluid is heated, the working fluid evaporates and begins to rise vertically, flowing upward out of the well 110 and into one or more of the conduits 178. The vaporized working fluid can then be split (as indicated by the arrows in Figure 3 ) such that a portion of the vaporized working fluid moves vertically upward through one of the conduits 178 above the well 110 and another portion of the vaporized working fluid moves vertically upward through another conduit of the conduits 178 above the well 110. The first peripheral portion 170 and the second peripheral portion 174 of the core structure 166 prevent the vaporized working fluid from moving laterally past the two conduits 178 and urge the vapor to flow upward into one or both of the two conduits 178.

[0105] The vaporized working fluid eventually reaches the manifold 182 and is then redirected (e.g., laterally left or right in Figure 3 ). In some examples, the vaporized working fluid begins to condense at least partially within the conduit 178 directly above the well 110 and / or at least partially within the manifold 182 (e.g., due to the cooling effect of air moving through the nearby air cooling fins 206 or the manifold 182). In the example shown, a small portion (e.g., less than 50%, less than 40%, less than 30%, less than 20%, less than 10%, less than 5%, etc.) of the vaporized working fluid begins to condense within the conduit 178 directly above the well 110 and / or within the manifold 182. In other examples, at least 50%, at least 60%, at least 70%, or at least 80% or at least 90% of the vaporized working fluid begins to condense within the conduit 178. In some examples, the working fluid remains entirely in the vapor state within the conduit 178 and / or within the manifold 182 as the working fluid flows upward toward the top of the 3D vapor chamber 86.

[0106] Continuing to refer to Figure 5 , the flow of the working fluid continues, as shown by Figure 5As indicated by the arrow in [description], the working fluid begins to reorient again, in a vertically downward direction, through one or more conduits 178 located above the first liquid reservoir 130 and / or the second liquid reservoir 134. The working fluid (e.g., in vaporized form, condensed liquid form, or both) moves vertically downward through three conduits 178 above the first liquid reservoir 130 and through three conduits 178 above the second liquid reservoir 134. Other examples include different numbers and arrangements of conduits and liquid reservoirs. In some examples, one or more of the conduits 178 extend completely downward and contact the core structure 166. Continuing to refer to Figure 3 , as the working fluid moves vertically downward through the conduits 178, the working fluid is air-cooled by air passing through adjacent air-cooling fins 206, thereby removing heat and causing the working fluid to condense within the conduits 178. The condensed working fluid accumulates as water droplets along the inner surface (e.g., walls) of the conduits 178. The overall flow of the working fluid and / or gravity pulls the droplets, causing them to eventually drip into the lower body 102 and into the first liquid reservoir 130 and / or the second liquid reservoir 134. As described above, in some examples, the working fluid may begin to condense within the conduits 178 directly above the sump 110 and / or within the manifold 182. Thus, some water droplets may form within these conduits 178 and / or within the manifold 182 and be pulled downward (e.g., with the help of gravity) back into the lower body 102 (e.g., directly back into the sump 110 or into the first liquid reservoir 130 or the second liquid reservoir 134). Once the condensed liquid working fluid has accumulated within the lower body 102, the liquid then rises and / or begins to contact the core structure 166. The core structure 166 pulls the liquid upward from the first liquid reservoir 130 and / or the second liquid reservoir 134 through the first boundary wall 146 and / or the second boundary wall 162 and back into the sump 110 (e.g., by capillary action). Then, the process continues and repeats, such that the working fluid continuously flows through the paths described above, and heat is continuously removed from the heat source 126.

[0107] Overall, the 3D vapor chamber 86 is unique, for example, in that the vapor phase and the liquid phase can pass through the condenser region 94 together, and the condensate can be driven back to one or more reservoirs (e.g., the first liquid reservoir 130 and / or the second liquid reservoir 134) by downward (using gravity) co-current flow. This technology can achieve better thermal resistance and much greater capacity within the same unit volume.

[0108] Figure 6Schematically illustrates another example of a 3D vapor chamber 210 (e.g., a flat tube vapor chamber) having a looped thermosyphon. Similar to the 3D vapor chamber 86, the 3D vapor chamber 210 also includes a lower body 214 that defines a hollow interior 218, and a well 222 that is generally centered along the lower body 214, but in other examples, the well 222 is laterally positioned closer to one end of the lower body 214 than to the other end of the lower body 214. The 3D vapor chamber 210 also includes an evaporator region 226 that is at least partially defined by the well 222. In other examples, the lower body 214 does not include a well 222.

[0109] Continuing reference Figure 6 , the well 222 includes: a lower well wall 230; a first side well wall 234 that extends at an inclined angle (e.g., 30 degrees, 45 degrees, 60 degrees, or other angle) relative to the lower well wall 230; and a second side well wall 238 that extends at an inclined angle (e.g., 30 degrees, 45 degrees, 60 degrees, or other angle) relative to the lower well wall 230. Although not shown, the well 222 may also include a third side well wall and / or a fourth side well wall that also angle downward (e.g., inward) toward the lower well wall 230. Other examples include wells 222 with different shapes and / or sizes than those shown, including wells with other numbers and angles of side well walls, or no well at all.

[0110] The evaporator region 226 is defined by a portion of the lower well wall 230. During use, the lower well wall 230 is in direct (or indirect) contact with a heat source (e.g., the heat source 126 described above, or a different heat source), such that heat from the heat source moves upward through the evaporator region 226 and through the lower well wall 230 into the hollow interior 218 of the lower body 214. In other examples, the evaporator region 226 is at least partially defined by the first side well wall 234 or the second side well wall 238.

[0111] Continuing reference Figure 6 , the lower body 214 also defines at least one liquid reservoir that receives the condensed working fluid (e.g., water), and / or directs the condensed working fluid to the well 222. In the example shown, the lower body 214 includes a liquid reservoir 242 on one side of the well 222 and a wick structure 246 on the opposite side of the well 222.

[0112] Continuing reference Figure 6, the liquid reservoir 242 includes a first lower reservoir wall 250, a first upper reservoir wall 254, and a first side reservoir wall 258. During use, the condensed working fluid accumulates along the first lower reservoir wall 250 and thus rises toward the first upper reservoir wall 254. The liquid reservoir 242 also includes a boundary wall 262 that extends upward (e.g., vertically) from the first lower reservoir wall 250 and terminates before reaching the first upper reservoir wall 254. The boundary wall 262 extends upward from the first lower reservoir wall 250, adjacent to but laterally spaced from the intersection between the first lower reservoir wall 250 and the first side well wall 234. In other examples, the boundary wall 262 extends from the first lower reservoir wall 250 at different locations (e.g., directly at the intersection between the first lower reservoir wall 250 and the first side well wall 234). In still other examples, the boundary wall 262 is omitted.

[0113] The core structure 246 is partially located within a portion of the lower body 214 that includes a second lower wall 266, a second upper wall 270, and a second side wall 274. In the illustrated example, the core structure 246 extends along the second lower wall 266. The core structure 246 also extends into the well 222 and into the conduit 290. The first upper reservoir wall 254 and the second upper wall 270 are integrally formed as a single piece and define a portion of the entire upper wall (e.g., the first upper reservoir wall 254 merges into the second upper wall 270 at a position generally directly above the well 222). In other examples, the first upper reservoir wall 254 is a wall separate from the second upper wall 270.

[0114] Continuing, referring to Figure 6 , for example, the core structure 246 is formed of wire mesh or screen, sintered powder metal, or other suitable materials. In some examples, the core structure 246 includes one or more grooves formed (e.g., machined) into one or more walls of the lower body 214.

[0115] Continuing to refer to Figure 6 , the core structure 246 extends at least partially (e.g., continuously) along one or more inner walls of the lower body 214. For example, the core structure 246 continuously extends along the interior of the lower well wall 230 and also along the interior of each of the first side well wall 234 and the second side well wall 238 such that the entire well 222 is covered by the core structure 246. In other examples, the core structure 246 extends only along a portion of the lower well wall 230, a portion of the first side well wall 234, and / or a portion of the second side well wall 238.

[0116] The core structure 246 also includes a peripheral portion 282 that extends upward and outward from the well 222 and rolls up and wraps around the boundary wall 262. The peripheral portion 282 rises toward (and in some cases physically contacts) the first upper reservoir wall 254 in the region above the end of the boundary wall 262. The peripheral portion 282 also extends downward and laterally toward (and in some cases physically contacts) the first lower reservoir wall 250 beside the boundary wall 262. In some examples, the peripheral portion 282 inhibits or prevents vapor from passing through the peripheral portion 282 and thus helps to direct the vapor flow within the 3D vapor chamber 210.

[0117] Continuing to refer Figure 6 to, the core structure 246 (or a completely separate core structure) can also extend within at least a portion of one or more conduits 290 within the 3D vapor chamber 210 (e.g., vertically along the inner side of the rear conduit 290, as Figure 4 shown). The core structure 246 within the conduit 290 helps the condensed working fluid to flow downward and toward the well 222 and the evaporator region 226 from at least one manifold 294. As Figure 4 shown, the core structure 246 extends vertically downward below the second upper wall 270 and then changes direction as it moves along the second lower wall 266. In other examples, the core structure 246 is located at a different position than the position shown, or extends a different distance, and / or a separate core structure can be positioned within the conduit 290. In some examples, the core structure 246 can extend upward further than shown, and / or can only extend upward to the second upper wall 270 or a position above the second upper wall 270 (e.g., extend into the manifold 294). In some examples, the core structure 246 only extends within the conduit 290 itself, or only within the lower body 214. Some examples include more than one second core structure 286. For example, a first core structure can be located within the well 222, and a second core structure can be located within one of the conduits 290. In still other examples, the core structure 246 is completely omitted. Additionally, in some examples, the core structure 246 can extend at least partially into the manifold 294.

[0118] Continuing to refer Figure 6 to, the 3D vapor chamber 210 includes a plurality of conduits 290. Similar to the conduit 178, the conduits 290 are coupled to the lower body 214 and are in fluid communication with the hollow interior 218 of the lower body 214. Each conduit 290 is a hollow tube directly coupled to the first upper reservoir wall 254 or the second upper wall 270. In some examples, one or more of the conduits 290 are flattened tubes (similar to Figure 5The flat ducts 178) shown in [description] are extruded and / or smooth or grooved tubes. In the example shown, the ducts 290 extend parallel to each other, and each duct 290 is sized, shaped, and positioned to direct a flow (or flows) of working fluid (e.g., in liquid form and / or vaporized form) vertically upward and / or vertically downward. Some ducts 290 may have a different width than other ducts 290, and in some examples, at least one of the ducts 290 is not parallel to at least another one of the other ducts 290. In the example shown, the 3D vapor chamber 210 includes one or more ducts 290 located above the well 222, and other ducts 290 located above the liquid reservoir 242 and the second upper wall 270. In some examples, one or more of the ducts 290 extend downward and physically contact the core structure 246. Other examples include different numbers and arrangements of ducts 290.

[0119] In some examples, at least one of the ducts 290 extends downward and contacts the lower wall of the liquid reservoir or the filling material, the lower wall of the insulation region or the core, and / or any part of the evaporator. For example, in the example shown, one of the ducts 290 may extend downward and contact the first lower reservoir wall 250 or the second lower wall 266, or may contact a portion of the core structure 246. The duct 290 may alternatively extend downward into the lower body 214, but terminate slightly above the first lower reservoir wall 250 (e.g., within or above the liquid accumulated in the liquid reservoir 242), slightly above the second lower wall 266, or slightly above the core structure 246. In some examples, at least one of the ducts 290 may extend downward and contact any lower wall of the evaporator region 226 or the well 222 (e.g., walls 230, 234, 238), or terminate slightly above any lower wall of the evaporator region 226 or the well 222.

[0120] Continuing to refer to Figure 6 [reference], the header 294 is located above the ducts 290 and is in fluid communication with the ducts 290 such that at least a portion of the working fluid (e.g., in liquid form and / or vaporized form) flows through the internal volume of the header 294 (e.g., laterally in a direction perpendicular to the flow of the working fluid in the ducts 290). Each duct 290 extends from the lower body 214 to the header 294. Similar to the duct 178, each duct 290 has the same vertical height, but in other examples, at least one of the ducts 290 has a height different from that of a different duct among the ducts 290.

[0121] Continuing to refer to Figure 6, the 3D vapor chamber 210 includes a condenser region 298 that includes at least one air-cooled fin 302. In the illustrated example, the 3D vapor chamber 210 includes multiple sets (e.g., stacks) of air-cooled fins 302. Each set includes a stack of air-cooled fins 302 (e.g., a vertical and / or horizontal stack, similar to Figure 5 the air-cooled fins 206 therein). The sets of air-cooled fins 302 are separated by ducts 290. During use, air is directed through the sets of air-cooled fins 302 (e.g., through the spaces or gaps between each air-cooled fin 302) to assist in the condensation of the working fluid and / or to assist in removing heat from the 3D vapor chamber 210. As Figure 6 seen in Figure 6 , air (e.g., from a powered air source such as one or more fans) is directed through the sets of air-cooled fins 302 in a lateral direction ( Figure 6 from left to right in Figure 6positioned on the right side) to facilitate uniform distribution of the cooling and condensation occurring in the 3D vapor chamber 210. Accordingly, one stack of the air cooling fins 302 may have a different density of the air cooling fins 302 than another stack. Additionally or alternatively, the density of the air cooling fins 302 may vary within a single stack of the air cooling fins 302 itself. Various types of air cooling fins 302 may be used, such as including C-shaped fins, folded fins, and / or slotted offset fins. During assembly, the air cooling fins 302 may be inserted between the flat surfaces of the conduit 290. In some examples, the 3D vapor chamber 210 includes different types of air cooling fins 302 at different locations, allowing for different fin spacings in different sections of the condenser region 298. Changing the fin spacing or the condenser arrangement has the goal of achieving the lowest thermal resistance for a given air-side pressure drop goal and seeking to optimize the condenser performance. Some 3D vapor chambers 210 may also or alternatively include one or more air cooling fins 302 located on top of the header 294. The air cooling fins 302 on the header 294 may extend vertically upward and / or may be otherwise positioned to receive an air flow and / or dissipate heat. Placing the air cooling fins 302 on the header 294 may allow the overall 3D vapor chamber 210 to be shorter, have a smaller weight, be less expensive, have a higher capacity, have a lower pressure drop, and / or have a lower thermal resistance than other 3D vapor chambers 210.

[0122] Continuing to refer to Figure 6 , at least a portion of the air cooling fins 302 (e.g., one stack of the air cooling fins 302) may be relatively long in the air flow direction (i.e., in the left-to-right direction as seen in Figure 4 ). As a result, a large amount of vapor may flow to the front of the air cooling fins 302.

[0123] In the example shown, the conduit 290 includes one or more conduits 290 near the air inflow, which helps to draw out and discharge a certain amount of liquid, thereby reducing the amount of condensate entering the front of the two conduits 290 (i.e., Figure 6 the leftmost conduit in Figure 6 ). As described above, the last or rear conduit 290 (i.e., the rightmost conduit 290 in

[0124] Continuing to refer to Figure 6, during use, the 3D vapor chamber 210 is coupled to a heat source (e.g., heat source 126 or another heat source). Heat from the heat source 126 is directed vertically upward along the lower well wall 230 into the evaporator region 226. This heat warms the working fluid disposed within the well 222 (e.g., the working fluid disposed within the core structure 246 and / or the working fluid generally above the core structure 246 within the well 222 or otherwise adjacent to the core structure 246). Once the working fluid is heated, the working fluid evaporates and begins to rise vertically, flowing upward out of the well 222 and into one or more of the conduits 290. For example, as seen by the arrows in Figure 6 , the vaporized working fluid may split such that a portion of the vaporized working fluid moves vertically upward through one of the conduits 290 located above the well 222, and other portions of the vaporized working fluid move vertically upward through the other conduits 290.

[0125] The vaporized working fluid eventually reaches the manifold 294 and is then redirected (e.g., laterally left or right in Figure 6 ). In some examples, the vaporized working fluid begins to condense at least partially within the conduits 290 directly above the well 222 and / or above the core structure 246, and / or at least partially within the manifold 294 (e.g., due to the cooling effect of air moving through the nearby air cooling fins 302 or the manifold 294). In the illustrated example, a small portion (e.g., less than 50%, less than 40%, less than 30%, less than 20%, less than 10%, less than 5%, etc.) of the vaporized working fluid begins to condense within the conduits 290 and / or the manifold 294 directly above the well 222 and / or the second upper wall 270. In other examples, at least 50%, at least 60%, at least 70%, or at least 80% or at least 90% of the vaporized working fluid begins to condense within the conduits 290. In some examples, the working fluid remains entirely in the vapor state within the conduits 290 and / or within the manifold 294 as the working fluid flows upward toward the top of the 3D vapor chamber 210. In some examples, the vaporized working fluid and the condensed liquid working fluid flow in the same direction in most or the vast majority of the 3D vapor chambers 210 (e.g., in most of the conduits 290 within the 3D vapor chamber 210, or not). In yet other examples, the vaporized working fluid and the condensed liquid working fluid do not flow in the same direction in most or the vast majority of the 3D vapor chambers 210. In some examples, the vaporized working fluid and the condensed liquid working fluid do not flow in the same direction in any portion of the 3D vapor chamber 210, or only in a small portion of the 3D vapor chamber 210.

[0126] Continuing to refer to Figure 6 , the flow of the working fluid continues, as shown by Figure 6As indicated by the arrow in [description], the working fluid begins to reorient again, in the vertically downward direction, through one or more conduits 290 located above the liquid reservoir 242 and / or the second upper wall 270. In the example shown, the working fluid (e.g., in liquid form and / or vaporized form) moves vertically downward through two conduits 290 above the liquid reservoir 242. The condensed portion of the working fluid moves downward through the second wick structure 286 (e.g., from droplets accumulating in the header 294). Other examples include different numbers and arrangements of conduits and liquid reservoirs and the flow of the working fluid.

[0127] Continuing to refer to Figure 6 , as the working fluid moves vertically downward, the air passing through the adjacent air-cooling fins 302 cools the working fluid, thereby removing heat and causing the working fluid to condense within the conduit 290. The condensed working fluid accumulates as water droplets along the inner surface (e.g., the wall) of the conduit 290. The overall flow of the working fluid and / or gravity and / or capillary action in the second wick structure 286 pulls the droplets, thus causing them to eventually drip into the lower body 214 and into the wick structure 246. As described above, in some examples, the working fluid may also begin to condense in one or more conduits 290 directly above the sump 222 and / or in the header 294. Thus, some water droplets may form within these conduits 290 and / or in the header 294 and be pulled directly downward (e.g., with the help of gravity) back into the lower body 214 (e.g., directly back into the sump 222 or into the liquid reservoir 242). Once the condensed liquid working fluid accumulates in the lower body 214, the liquid can rise and / or begin to contact a portion of the wick structure 246. The wick structure 246 (e.g., by capillary action) pulls the liquid upward from the liquid reservoir 242 across the boundary wall 262 and back into the sump 222. This process continues and repeats, causing the working fluid to continuously flow through the above-described path and heat to be continuously removed from the heat source.

[0128] Overall, the 3D vapor chamber 210 is unique, for example, because the vapor phase and the liquid phase can pass through the condenser region 298 together, and the condensate can be driven back to one or more reservoirs (e.g., reservoir 242) by a downward (using gravity) co-current flow. This technique can achieve better thermal resistance and a much larger capacity within the same unit volume.

[0129] The 3D vapor chambers described herein (e.g., including 3D vapor chambers 68, 86, or 210) generally may define a relatively large chamber that is primarily filled with a working fluid. Although the described and illustrated 3D vapor chambers are shown as extending in an upright, vertical orientation, the 3D vapor chambers may be angled or oriented at other angles. In some examples, the 3D vapor chambers are primarily filled with a vaporized working fluid and a lesser amount of condensate. The vapor chamber may incorporate one or more wick structures to draw the condensed liquid back to the evaporator region, and / or may utilize gravity to assist in liquid return by physically positioning the condenser region above the evaporator region. By taking advantage of both the attraction of the vapor caused by the condensing surface and the attraction of the liquid caused by gravity or the wick structure, an overall looped thermosyphon may be established by directing the vapor to a header at a higher elevation and then sending the working fluid downward back into the condenser, where both vapor momentum and gravity will act in the same direction to drain the liquid condensate back into the liquid reservoir. The liquid reservoir may then supply the wick, which replenishes the evaporator region by capillary action while preventing vapor from entering the liquid reservoir. This may form a "looped thermosyphon" within the 3D vapor chamber. Additionally, and as described above, some of the 3D vapor chambers described herein may include one header, or may include, for example, more than one header. For example, some conduits may be coupled to one header, while other conduits may be coupled to another header, or all conduits may be coupled to the same header. For example, the multiple headers may direct the working fluid flow to one or more condenser regions and one or more air-cooled fin stacks.

[0130] The 3D vapor chambers described herein may also include one or more wick structures that extend into and / or within one or more conduits and / or one or more headers to assist in the flow of the condensed working fluid and / or to impede the vaporized working fluid. For example, and as described above, 3D vapor chamber 210 includes a wick structure 246 positioned along evaporator region 226. Wick structure 246 includes a peripheral portion 282 that extends upwardly toward one of the conduits 290 and may, for example, abut the lower end (or a location near the lower end) of conduit 290 at first upper reservoir wall 254. Peripheral portion 282 helps to impede the flow of the vaporized working fluid within the 3D vapor chamber in at least one direction (e.g., laterally). In some examples, and as described above, wick structure 246 may extend even further upwardly into conduit 290 itself. As Figure 4 shown, wick structure 246 may extend within one of the conduits 290 (e.g., within the rear conduit, and / or generally away from the condenser region or the region of the 3D vapor chamber where most of the condensation occurs). The wick structures described herein may be present in various regions, including the lower body, conduits, and / or headers.

[0131] Using one or more wick structures in a duct or elsewhere can help a condensed liquid working fluid flow in one direction (e.g., vertically downward toward an evaporator region within the duct), while allowing the vaporized working fluid to flow in a different direction (e.g., upward within the duct toward a manifold). Using a wick structure can also or alternatively help the condensed liquid working fluid flow in one or more portions of the 3D vapor chamber (e.g., within a duct, within a lower body portion, within a manifold, or other locations within the 3D vapor chamber) in the same direction as the vaporized working fluid (e.g., vertically upward, vertically downward, and / or laterally). The wick structure can help separate the liquid working fluid from the vaporized working fluid such that the liquid working fluid stream moves separately from the vaporized working fluid stream. The wick structure can also help prevent the vaporized working fluid from flowing in one or more directions. In some examples, the liquid working fluid can be drawn into or otherwise pulled into the material of one of the wick structures (e.g., via capillary action of the wick structure and / or the positioning of the wick structure), thereby creating better overall vapor flow within the 3D vapor chamber and thus improving the performance of the 3D vapor chamber. Additionally, and as Figure 6 shown, in some examples, only a single wick structure can be utilized within one of the ducts (e.g., within the rear duct 290), but in other examples, more than one duct can include a wick structure extending therein, or the 3D vapor chamber can include only one or more wick structures that are below the ducts and / or within the manifold.

[0132] For example, compared to other heat exchange devices (e.g., Figure 1 and Figure 2 the heat pipe 10 or vapor chamber 24 of

[0133] The 3D vapor chambers described herein may be further modified and / or may include additional features or variations other than those shown. For example, a liquid reservoir (e.g., any liquid reservoir described herein) may include one or more screens to act as a filling material. The screens may be sized, shaped, and / or positioned to allow only the working fluid or certain droplets or streams of the working fluid to move through the screens.

[0134] Additionally, any conduits, manifolds, and / or any other passages of the 3D vapor chambers described herein may be sized for a sufficient vapor velocity (or dynamic pressure) to entrain droplets and push the droplets away from certain areas to reduce liquid films, overflows, and / or storage in the evaporator, condenser, or any other area of the 3D vapor chamber. This may be particularly important, for example, when the vapor is flowing horizontally without the aid of gravity or flowing upward against gravity.

[0135] Example of overall flow and movement of working fluid in 3D vapor chamber

[0136] As described above, the 3D vapor chamber may include structures that facilitate the flow of the working fluid in multiple directions. The working fluid may be in the form of a condensed liquid or an evaporated gas. In some examples, the working fluid may move vertically and / or horizontally through various conduits, manifolds, and / or other structures within the 3D vapor chamber.

[0137] Figure 7 An example of the flow and movement of the working fluid through the 3D vapor chamber 306 is schematically illustrated. Similar to the 3D vapor chambers 86, 210 described above, the 3D vapor chamber 306 includes a lower body 310 that defines a recess 314, an evaporator region 318 (e.g., formed as part of the recess 314), and at least one liquid reservoir 322. In other examples, the lower body 310 does not include the recess 314. The 3D vapor chamber further includes at least one manifold 326 and conduits 330 that extend (e.g., vertically) between the lower body 310 and the manifold 326. The 3D vapor chamber 306 also includes a condenser region 334 located above the evaporator region 318. For example, the condenser region 334 includes a stack of air-cooling fins located between the conduits 330. Figure 7 How the working fluid moves through the 3D vapor chamber 306 is further illustrated in detail by a set of arrows.

[0138] For example, note how the working fluid moves vertically upward through conduit 330 directly above and to the right of evaporator region 318, and then how the working fluid then flows primarily leftward within header 326 (e.g., flowing to the front side of 3D vapor chamber 306 where cold air enters and moves through the air-cooling fins of condenser region 334). The condensed working fluid returns downward to liquid reservoir 322, where the working fluid ultimately re-enters sump 314. In at least one conduit 330, the vaporized working fluid may flow upward while the condensed liquid working fluid may flow downward through the same conduit. In some examples, the vaporized and liquid working fluids may flow in the same direction (e.g., in most or the vast majority of conduits 330).

[0139] The 3D vapor chamber 306 may include any features of the 3D vapor chambers described herein (e.g., 3D vapor chambers 68, 86, or 210) (e.g., at least one core structure, and / or at least one boundary wall, and / or a particular number and arrangement of liquid reservoirs and conduits). Thus, Figure 7 Only one example of the flow of the working fluid through the 3D vapor chamber is presented. Similar flows may also be found in the 3D vapor chambers 68, 86, or 210 described above or in any other 3D vapor chamber described herein.

[0140] Exemplary prototype of 3D vapor chamber

[0141] Figure 8 An example of a physical working prototype of a 3D vapor chamber 338 that has been created and tested is illustrated. The vapor chamber 338 includes at least some of the above features from one or more of the schematic 3D vapor chambers (e.g., 3D vapor chambers 68, 86, 210, and / or 306). For example, as Figure 8 can be seen, the 3D vapor chamber 338 includes a lower body 342 (e.g., defining a sump having an evaporator region, and at least one liquid reservoir). The 3D vapor chamber 338 also includes at least one header 346, and conduits 350 (e.g., flat conduits) that extend vertically between the lower body 342 and the header 346. The 3D vapor chamber 338 also includes a condenser region 354 located above the evaporator region. The condenser region 354 includes a stack of air-cooling fins 358 located between the conduits 350.

[0142] The 3D vapor chamber 338 (or any 3D vapor chamber described herein) may be of any of a variety of sizes, depending on the desired application and / or desired thermal performance. As Figure 8As seen, in some examples, the 3D vapor chamber 86 may have a total height H, a total length L, and a total width W. The values of the height H, length L, and width W may vary depending on the desired application of the 3D vapor chamber and, for example, on the size of the heat source coupled to the 3D vapor chamber and / or the amount of heat to be removed.

[0143] Other examples of ducts for 3D vapor chamber

[0144] As described above, the conduits of the 3D vapor chamber may have any shape and size among a variety of shapes and sizes, including a flat shape. These conduits not only provide a path for the working fluid but also provide structural stability and support for the entire 3D vapor chamber, for example, extending between the lower body and / or the liquid reservoir and the manifold, and / or supporting a plurality of air-cooling fins.

[0145] Reference Figure 9A , in some examples, one or more of the conduits (e.g., the conduits 178, 290, 330, 350 described above) may be flat conduits having a non-circular cross-section and, for example, having one or more flat planar side surfaces 360. This is in contrast to cylindrical or circular tubular conduits. In some examples, and as Figure 9A seen, the flat conduits may include at least one support structure 361 (e.g., inserts and / or ribs) that provides additional structural support for the conduits. These flat conduits may facilitate the movement of the working fluid as described above and may provide structural stability for the entire 3D vapor chamber (e.g., supporting the manifold and / or providing structural stability at the air-cooling fins).

[0146] Additionally, these flat conduits may be aligned to facilitate the flow of air through the condenser region. For example, the flat planar side surfaces 360 of the conduits may be aligned along the direction of air movement through the 3D vapor chamber. In some examples, compared to circular (e.g., cylindrical) conduits, the use of flat conduits may facilitate greater air flow.

[0147] Figure 9B Once again, the 3D vapor chamber 86 is schematically illustrated from a front view (from Figure 5 ), which shows its flat conduit 178 and the manifold 182 above. In contrast, Figure 9C schematically illustrates an example of a different 3D vapor chamber 86' having larger tubular conduits 178' and no manifold. The 3D vapor chamber 86 provides greater clearance and space for air to flow through the air-cooling fins 206 with its flat conduit 178. In some examples, the flat conduit 178 may be aligned with and along the air flow (e.g., Figure 9B the air flow extending from left to right in

[0148] Other examples of manifolds for 3D vapor chamber

[0149] As described above, the 3D vapor chamber may include a manifold to which a working fluid (e.g., a vaporized working fluid) is delivered via conduits during use. The manifold may take any number of sizes, shapes, and forms and may include one or more structures to direct and / or control the movement of the working fluid. The manifold may additionally or alternatively include one or more structures (e.g., posts) that provide structural stability to the manifold and / or the overall 3D vapor chamber.

[0150] For example, Figure 10A illustrates a prototype manifold 346 as seen from Figure 8 and Figure 10B provides a further schematic view of the manifold 346 showing conduits 350 extending into and connected to the manifold 346. As seen in Figure 10A and 10B the manifold 346 may include geometric features (e.g., protrusions, angled walls, etc.) that help direct the continuous flow of the working fluid within the manifold 346 and inhibit "dead zones" where the working fluid might otherwise condense and accumulate (e.g., as droplets) within the manifold 346.

[0151] In the example shown, the geometric feature includes triangular protrusions 362 each formed by the inner perimeter wall 366 of the manifold 346, e.g., along the bottom of the manifold 346. These triangular protrusions 362 may help direct the working fluid into and / or out of the conduits 350. These geometric features also provide additional structural stability to the manifold 346. Other protrusions 362 may have other shapes (e.g., rectangular or square shapes, or trapezoidal shapes, or curved shapes with convex and / or concave surfaces). Similar geometric features may also be included on any other 3D vapor chamber described herein (e.g., 3D vapor chambers 68, 86, 210, 306, etc.). Other examples do not include this geometric feature.

[0152] Continuing reference to Figure 10B and as described above, the conduits 350 extending into the manifold 346 may themselves also be flat in shape and have a cross-sectional shape that facilitates the flow of the working fluid (e.g., laminar flow) through the 3D vapor chamber (e.g., laterally through air cooling fins). In the example shown, it can be seen that the conduits 350 have an elongated rectangular (or oval) cross-sectional shape with the flat planar side surfaces 360 described above and are discretely (and e.g., from each other) aligned to facilitate the flow of air through the condenser.

[0153] Referring to Figure 10A and 10B, in some examples, one or more of the 3D vapor chambers described herein may include one or more posts 370 that provide structural support for the 3D manifold and / or the remainder of the 3D vapor chamber (e.g., to prevent the manifold from collapsing or otherwise deforming when subjected to a vacuum). In the example shown, the posts 370 are integrally formed as part of the manifold 346 and are dispersed and spaced apart from each other within the manifold 346. The posts 370 may extend completely from the top of the manifold to the bottom of the manifold, or may extend partially through the manifold, and / or may extend below the manifold (e.g., into the condenser region).

[0154] The posts 370 may have various shapes and sizes. As Figure 10A and 10B shown, in some examples, the posts 370 may have a cross-sectional shape that facilitates the flow of the working fluid around the posts 370 and inhibits or prevents the accumulation of the working fluid within the manifold 346 (e.g., from stagnating after one of the posts 370 or otherwise stagnating in its vicinity). In the example shown, the posts 370 have a streamlined non-circular (e.g., lemon-shaped) cross-sectional shape that facilitates the flow of the working fluid in the Figure 10B manifold in a lateral direction (left to right or right to left).

[0155] The posts 370 may also reduce turbulence and reduce the stagnation of the flow on the back side of the posts 370, thereby inhibiting or preventing the accumulation of liquid on the posts 370. As Figure 10B seen in

[0156] , the posts 370 may be aligned with each other (e.g., in rows) to further facilitate the flow of the working fluid. Figure 10C Other examples include posts 370 having cross-sectional shapes, sizes, and positions different from those shown (e.g., circular, oval, rectangular, teardrop-shaped, or other streamlined shapes, etc.). For example,

[0157] Continuing to refer to Figure 10C , in some examples, the manifold (e.g., manifold 346) includes one or more fill tube holes 374. A fill tube may be coupled to the fill tube hole 374. Liquid may be added and air may be removed by using the fill tube and / or the fill tube hole 368. In other examples, the fill tube holes 368 may be located at other positions on the manifold 346, and / or generally at other positions on the 3D vapor chamber 338.

[0158] Figure 10DIllustrated is yet another alternative manifold 346”. The manifold 346” may include an enclosed space 376. For example, the enclosed space 376 may be formed of a solid material (e.g., metal), and / or otherwise formed such that there is no internal vapor space. For example, if the flow of the working fluid in the manifold 346” is not intended to extend laterally (i.e., to the right or left in Figure 10D ), through the entire manifold 346” or at least through the enclosed space 376, then the enclosed space 376 may be included. Instead, once reaching the manifold 346”, the flow of the working fluid extends laterally to the left or laterally to the right, and thus never crosses the enclosed space 376. In some examples, the 3D vapor chamber may also include one or more vent channels (e.g., on one or more sides of the enclosed space 376) to allow removal of air when processing the 3D vapor chamber or evacuating the 3D vapor chamber. Other examples do not include the enclosed space 376 and / or the vent channels.

[0159] Figure 10A - 10D Only a few examples of manifolds for 3D vapor chambers (e.g., for 3D vapor chambers 86, 210, 306, 338, etc.) are presented. However, manifolds similar to the manifolds 346, 346', and 346” may be used in combination with any of the 3D vapor chambers described herein.

[0160] Sheets / collars for 3D vapor chamber

[0161] As described above, the 3D vapor chamber may include one or more conduits to facilitate movement of the working fluid within the 3D vapor chamber. The 3D vapor chamber may also include a lower body and / or a manifold. Thus, some 3D vapor chambers may include one or more structures that facilitate movement of the working fluid within the 3D vapor chamber from one component (e.g., the manifold) to the next component (e.g., the conduit).

[0162] For example, and with reference to Figure 11 , in some examples, the 3D vapor chamber may include one or more conduits (e.g., conduits 178, 290, 330, 350, etc.) inserted into a stamped (or machined or 3D printed using additive manufacturing) sheet. Collars in the sheet act as wells for draining liquid (e.g., condensed working fluid) into the conduits. In the illustrated example, the conduit 178 (e.g., from Figure 5 in the 3D vapor chamber 86) extends between the lower body 102 and the manifold 182. A portion of the manifold 182 (e.g., Figure 3 the lower wall 190 of the manifold) may include a sheet 378. A portion of the sheet 378 is stamped or otherwise deformed to form an opening, thereby allowing the upper portion of the conduit 178 to extend into the opening. As Figure 11As seen, the upper end portion of the conduit 178 is located below a portion of the sheet 378. The sheet 378 is formed or inclined (e.g., curved) at the opening to form a collar 382, which serves as a well and facilitates the drainage of liquid into the conduit 178. The condensed working fluid that forms, accumulates, and / or moves along the sheet 378 slides along the curved collar 382 (e.g., with the aid of gravity) and drips into the upper end portion of the conduit 178.

[0163] Additionally or alternatively, a portion of the lower body 102 (e.g., the first upper reservoir wall 138 described above) may include a sheet 386 (e.g., a lower plate), which is similarly deformed to form an opening to receive the bottom of the conduit 178 and to form a collar 390. In some examples, the collars 382, 390 help form a groove for the brazing material when the conduit 178 is joined to the sheets 378, 386. Other examples do not include the sheets 378, 386 or the collars 382, 390. Additionally, in some examples, the sheet 378 and / or the sheet 386 may be formed and / or machined to have a ramp or drainage path that aids in draining liquid to the collars 382, 390 and / or the conduit 178.

[0164] Figure 11 Only one example of a set of sheets and collars that can be used to facilitate the flow of liquid within a 3D vapor chamber is presented. Similar sheets and collars can also be used in conjunction with any vapor chamber described herein.

[0165] Reinforcement plates for 3D vapor chamber

[0166] As described above, a 3D vapor chamber may include one or more conduits to facilitate the movement of the working fluid through the 3D vapor chamber. Thus, the 3D vapor chamber may extend vertically and may benefit from the use of one or more reinforcement elements to provide additional structural support.

[0167] For example, and with reference to Figure 12 , in some examples, the 3D vapor chamber may include a reinforcement plate 392. In the example shown, the reinforcement plate 392 is located at the conduit (e.g., from Figure 5between the conduits 178), and above (e.g., and in contact with) the lower body 102 and / or the evaporator region (e.g., the evaporator region 90). For example, the reinforcement plate 392 may be formed of a material having a strength greater than that of the conduit 178, the lower body 102, the header, and / or any other part of the vapor chamber. In some examples, the reinforcement plate 392 is inserted between two tube sheets (e.g., sheets 378, 386) before joining or attaching the risers (e.g., conduits 178, 290, 330, 350, etc.). Other examples do not include the reinforcement plate 392, or include a reinforcement plate 392 that is not stronger than other parts of the vapor chamber, or include a reinforcement plate 392 having a different profile and / or orientation than that shown.

[0168] Figure 12 Only one example of the reinforcement plate 392 that can be used with the 3D vapor chamber is presented. Similar reinforcement plates can also be used in combination with any of the 3D vapor chambers described herein.

[0169] Structural features for the evaporator region and / or the lower body

[0170] As described above, thermal devices such as heat pipes and vapor chambers (e.g., Figures 1 - 7 those schematically illustrated therein, and as shown in the Figure 8 prototypes therein) may include one or more evaporator regions that receive heat from a heat source. Additionally, some thermal devices (e.g., the 3D vapor chamber described above) may include a lower body that contains the evaporator region. Importantly, the thermal device not only transfers heat effectively but is also structurally sound, particularly in regions such as the evaporator region and / or the lower body of the thermal device. For example, the evaporator region is typically coupled (e.g., using fasteners, welding, adhesives, using clamping, or by other means) to the heat source (e.g., a processor or other electronic device). Thus, this coupling of the thermal device to the heat source typically generates stresses and forces that act on the thermal device and more specifically on the evaporator region of the thermal device. Accordingly, providing additional structural features directly to the evaporator region of the thermal device and / or the lower body that includes the evaporator region can mitigate the stresses that naturally occur when the thermal device is coupled to the heat source.

[0171] Thus, in some examples, the evaporator regions and / or lower bodies described herein may include additional structures (e.g., extended surfaces defining posts or ribs, or other enhancements such as rounded edges, fillets, etc.) to reduce thermal resistance, increase the capacity of the thermal device, and / or provide additional structural stability. In some examples, adding these additional structures may allow the evaporator walls themselves (e.g., the lower well wall and / or the lowermost wall in direct contact with the heat source along the evaporator region) to be machined thinner, thus providing even more benefits to the evaporator thermal resistance. Additionally, using an evaporator region and / or lower body with additional structures (e.g., extended surfaces) may result in a higher capacity of the overall unit. This higher capacity may allow the use of wick materials (e.g., powders) that may have lower permeability and / or capillary pressure (e.g., finer, denser, or different morphology powders), but provide better heat transfer, thus improving the overall thermal resistance of the unit.

[0172] Figures 13 - 25 illustrate various examples of added structures for the evaporator regions (e.g., for evaporator regions 12, 26, 54, 70, 90, 226, 318, etc.) and / or for the lower bodies (e.g., lower bodies 102, 214, 310, 342, etc.). Such structures may be machined, formed, and / or attached (e.g., from a substrate). In some examples, these structures are partially or fully covered by one or more wick structures, such as any of the wick structures described herein.

[0173] Figure 13A 、 13B and 13C illustrate the lower body 342 of the prototype 3D vapor chamber 338 from Figure 8 . As shown in these figures, the lower body 342 may include an evaporator region 394 (e.g., formed in a well, similar to the well 110 in the schematic of Figure 5 ). In the example shown, the lower body 342 additionally includes an extended surface that defines posts 398 (similar to the posts 370 described above in the header 346), which are both located around and within the evaporator region 394. Similar to the posts 370, these posts 398 may provide structural stability to the lower body 342 itself and / or the evaporator region 394, especially when the hollow interior of the lower body 342 is subjected to a vacuum. In the example shown, the posts 398 are integrally formed as part of the lower body 342. In some examples, the posts 398 may extend completely from the top to the bottom of the lower body 342, or only partially through the lower body 342, and / or may extend upward out of the lower body 342 (e.g., into the condenser region). In some examples, one or more of the posts 398 may be partially or fully covered by a wick structure. Other thermal devices described herein may similarly include such additional posts. Additionally, the posts 398 may have shapes and dimensions other than those shown.

[0174] Continuing reference Figure 13A 、 13B and 13C, the lower body 342 may also or alternatively include a screen 400. In the illustrated example, the screen 400 is located within a liquid reservoir of the lower body 342 (which liquid reservoir corresponds, for example, to Figure 5 the liquid reservoir 130 as seen in the schematic diagram of). The screen 400 can be a wire mesh or other structure which, for example, acts as a filling material (e.g., metal) to prevent any liquid within the reservoir from freezing and expanding (e.g., in a very low temperature environment).

[0175] Continuing reference Figure 13A 、 13B and 13C, the evaporator region 394 may additionally include a plurality of other extended surfaces 402 (e.g., protruding ribs, beams, and / or the like). The extended surfaces 402 may be integrally formed with the remainder of the evaporator region 394 and may be made of, for example, metal or other suitable material. As seen in these figures, the extended surfaces 402 may form an integral matrix or network of protruding surfaces which not only aids in the movement of heat within the evaporator region 396 but also enhances the overall strength of the evaporator region 394. One or more of the extended surfaces 402 may be partially or fully covered by the core structure.

[0176] Figures 14 - 16 Schematically illustrates an additional example of the structure of the evaporator region of a thermal device as viewed from the side. For example, and with reference Figure 14 , in the illustrated example, the evaporator region may include a lower wall 404 (e.g., forming part of the lower well wall 114 or 230 described above), and a core structure 406 (e.g., a flat powder core structure) located above (e.g., directly above and in contact with) the lower wall 404. The core structure 406 may form at least a portion of the core structure 166 or core structure 246 described above.

[0177] Reference Figure 15 , in some examples, the evaporator region includes a lower wall 404 and a core structure having a generally flat portion 410 with powder ribs 414 extending vertically upward from the generally flat portion 410 and the lower wall 404.

[0178] In yet other examples, and as seen in Figure 16 , the evaporator region includes a lower wall 404 having an extended surface 418 (e.g., a rib or fin) which extends upward from the lower wall 404 and is at least partially covered (e.g., surrounded) by the powder ribs 414 of the core structure.

[0179] In some examples, the vertical thickness of the core structure material (e.g., powder rib 414) may be increased or greater above the extended surface 418 than at other locations, especially if that area is a high-flow area in a thermal device. Generally, the vertical thickness of the core structure material in the powder rib 414 may be selected, for example, based on the desired or expected flow rate of liquid through the evaporator region.

[0180] Figures 17 - 19 Yet other examples of the structure of the evaporator region of the thermal device as viewed from above are illustrated. Refer Figure 17 , for example, the evaporator region may include an extended surface 418 (e.g., a rib) that extends upward from the lower wall (in Figure 17 in a direction out of the page), and is generally planar (e.g., thin and elongated). Circular posts 422 (e.g., similar to post 398) may extend upward from the extended surface 418 at spaced-apart locations (e.g., out of the page in Figure 17 ), and / or may be located between the extended surfaces 418 and be used to separate the extended surfaces 418 from each other. The cross-section of the circular post 422 may be circular, but other examples have other shapes (e.g., oval). In contrast, the cross-section of the extended surface 418 may be rectangular. In some examples, the circular post 422 may have a diameter or thickness that is less than the diameter or thickness of the extended surface 418. The extended surface 418 and / or the post 422 may be at least partially covered (e.g., surrounded) by a core structure (e.g., core structure 406).

[0181] Refer Figure 18 , in some examples, the evaporator region includes additional extended surfaces in the form of rectangular posts 426 that extend upward from the extended surface 418 and / or separate the extended surfaces 418 from each other. As seen in Figure 18 , the rectangular post 426 has a thickness equal to the thickness of the planar extended surface 418 itself, but in other examples, the thickness may vary. The planar extended surface 418 and the rectangular post 426 may be at least partially covered by a core structure.

[0182] Refer Figure 19 , in some examples, the evaporator region may include extended surfaces 418 arranged in a grid pattern as seen from above (similar to the arrangement of the extended surfaces 402 in Figures 13A - 13C ). The grid pattern may include a series of extended surfaces 418 that form a square or rectangle with openings therein. In some examples, the grid pattern includes a parallel arrangement of the extended surfaces 418 or other structures, while in other examples, the pattern may not be parallel in at least one or more regions. As in Figure 19As shown, a column (e.g., circular column 422 or rectangular column 426) can be located at the intersection of the extended surface 418 (e.g., at the four corners of one of the squares or rectangles within the grid structure). A core structure (e.g., core structure 406) can cover at least a portion of the extended surface 418 and the column 422.

[0183] The grid pattern and layout may be different from that shown. In some examples, the layout of the extended surface can include parallel planar extended surfaces, extended surfaces in a square or rectangular grid layout, or any other grid pattern, such as hexagonal, circular, triangular, rhombic, other quadrilateral shapes, or any other shape or pattern. Additionally, although circular and rectangular columns 422, 426 are shown, the columns can have other shapes, such as oval, square, or any other shape.

[0184] Reference Figure 20 , in some examples, the evaporator region includes extended surfaces 418 that extend vertically upward by a height H and extend parallel to each other at a spacing distance “PD”. In other examples, the extended surfaces 418 do not extend parallel to each other and / or have different spacings. Continuing to refer to Figure 20 , in the example shown, column 422 (or 426, or other column) extends vertically upward from the extended surface 418. Each column 422 has a width W1 that is equal to or less than the width W2 of the extended surface 418, but other examples include widths different from those shown.

[0185] The core structure (e.g., core structure 406) can be positioned along one or more sides of the column 422 and the extended surface 418. In the example shown, enough core structure 406 is located on the side of the extended surface 418 to maintain wetting and connectivity to the root of the extended surface 418 near the lower wall 404. The core structure 406 has a first thickness T1 near the top of the core structure 406 (e.g., at the column 422) and a smaller (or equal or larger) thickness T2 in the root. Reinforcements 430 (e.g., rounded corners or other curved surface configurations) can be machined or otherwise formed in the core structure 406, where the core structure 406 is sometimes thinnest near the root. The amount of core structure 406 on either side of each extended surface 418 maintains good wetting of the reinforcement 430 while shortening the conduction length through the core structure 406.

[0186] To form Figure 20In the arrangement shown, a mandrel (e.g., a tapered mandrel) can be vertically inserted downward between the two shown extending surfaces 418. The mandrel can have a square edge, a circular edge, a semi-circular shape, a triangular shape, or any other shape. When the mandrel is removed, a gap G is formed between the portions of the core structure 406 at the top of the core structure. The region between the portions of the core structure and between the extending surfaces 418 is a pocket and can receive, for example, a portion of a liquid working fluid during the use of a 3D vapor chamber.

[0187] In some examples, the extending surfaces 418 do not need to have a uniform thickness with increasing height. The extending surfaces 418 can be tapered, pointed, rounded, or have any other fin shape. The extending surfaces 418 themselves can also have enhancements 434 (e.g., rounded corners) machined or otherwise formed thereon. As Figure 20 seen, in the shown example, the core structure 406 is slightly bent upward at the central position 438 between the two extending surfaces 418 at the root of the extending surfaces 418. Due to this curvature, the core structure 406 may be thinner here to facilitate heat transfer in this region. In other examples, the core structure 406 can maintain a more constant thickness at this position, or can be thicker.

[0188] When forming Figure 20 the structure shown, various factors can be considered. For example, the minimum thickness of the mandrel, the minimum thickness of the core structure 406, the minimum thickness of the extending surfaces 418, and the spacing of the extending surfaces 418 can all be considered during the formation of this structure. Additionally, for regions in the evaporator area where nucleate boiling may occur, it may be beneficial to make the lower region of the core structure 406 have sharper corners (e.g., removing rounded corners), rather than the curved corners as Figure 20 seen. The shape and size of the surfaces may change, for example, depending on the type of heat transfer expected at the evaporator area.

[0189] Referring Figures 21 - 23 , in some examples, the evaporator area includes extending surfaces 418 in a square pattern (e.g., having posts 422). The core structure 406 can be at least partially positioned above the extending surfaces 418 and / or the posts 422. Additional core structures can be present on top of the extending surfaces 418 to allow liquid to flow horizontally into the middle of the evaporator area, and then there the liquid can be supplied downward into the respective pockets 440 between the extending surfaces 418 (e.g., each pocket 440 and the extending surfaces 418 around it define a "cell" of a grid structure).

[0190] Referring Figure 24A , 24Band 25. In some examples, the extended surface 418 can just terminate outside the evaporator region or at the edge of the evaporator region (e.g., the evaporator region 226), where the extended surface 418 forms a wall or is located near a wall (e.g., the boundary walls 146, 162, 262 described above, or another wall). Such an arrangement can allow for the collection of excess liquid and prevent the liquid from overflowing into the evaporator region 226. The wick structure (e.g., the wick structure 246) can include large wick channels / ribs that extend into the evaporator region to help transport the liquid without taking up too much space in the area around the evaporator region.

[0191] As Figure 24A and 24B shown, a trench region 442 can be provided outside the extended surface 418. The trench region 442 can be adjacent to or surround the evaporator region 226. For example, the trench region 442 can be positioned lower than the liquid reservoir (e.g., the liquid reservoir 130) and can be separated from the liquid reservoir 130 by a wall (e.g., the wall 146). The liquid located in the liquid reservoir 130 can be transferred to the trench region 442 (e.g., via the peripheral portion 282 of the wick structure 246 over the wall 146), and the liquid in the trench region 442 can be transferred to the evaporator region 226 (e.g., over the external extended surface 418), for example due to gravity, which causes the liquid pressure to be higher than the vapor pressure at the lowest point of the liquid level. If there is an overflow of excess liquid over the wick into the evaporator region 226, this can have a slight benefit in helping to supply liquid to the evaporator region 226. In some examples, the extended surface 418 described above also provides structural benefits and / or can be bound into the side walls of the 3D vapor chamber. The extended surface 418 can also or alternatively reinforce the area in contact with the heat source.

[0192] In some examples, the wick structure provided in the region of the boundary wall can have different thicknesses to assist with flow. For example, due to space limitations, the need for the vapor to travel in this region, or to cause a higher liquid pressure drop to reduce liquid seepage from the wick structure on the downstream side, the wick structure may be thinner in certain regions (e.g., next to the boundary wall 146). The wick structure may be thicker in other regions (e.g., to slow down the flow or to provide sufficient capillary action for high-flow regions).

[0193] Refer to Figure 24B, in some examples, the core structure (e.g., core structure 246) can include a first peripheral portion 282a and also include a second peripheral portion 282b. The second peripheral portion 282b can be spaced further from the evaporator region 226 than the peripheral portion 282a. In the illustrated example, the first peripheral portion 282a and the second peripheral portion 282b are sized and shaped such that a two-stage reservoir (having a high-pressure region 130a and a low-pressure region 130b) is formed. Vapor is allowed to cross the wall 146 and the first peripheral portion 282a (from right to left in Figure 24B ), but any droplets that might drip from the conduit can be collected in the high-pressure reservoir 130a. However, due to the presence of the powdered peripheral portion 282b that allows liquid penetration, the high-pressure reservoir 130a and the low-pressure reservoir 130b can still exchange liquid, but most of the vapor is prevented from reaching the low-pressure reservoir 130b.

[0194] Continuing to refer to Figure 24A 、 24B and 25, the walls (e.g., boundary walls 146, 162, 262 or other walls) that at least partially surround the evaporator region can have various shapes. For example, as shown in Figure 25 , in some examples, the wall has a back-and-forth meandering "snake-like" shape along at least a portion of the wall. Such a shape can be beneficial under a range of operating conditions with a high heat dissipation rate. In other examples, the wall can be straight or have a shape other than snake-like. As described above, the wall can help reduce or eliminate overflow in the evaporator region.

[0195] Additional examples of thermal devices

[0196] Many of the thermal devices described above and particularly the 3D vapor chambers described above include the use of manifolds. However, some 3D vapor chambers may completely omit the use of manifolds.

[0197] For example, and as shown in Figure 26As shown, in some examples, the 3D vapor chamber 446a includes a lower body 450 (e.g., having an evaporator region and / or a liquid reservoir). The 3D vapor chamber 446 also includes one or more conduits 454 that extend away from the lower body 450 in a “circuit.” In the example shown, the conduit 454 includes a first portion 458 that extends away from the lower body 450 (e.g., at a 90-degree angle), a second portion 462 that extends generally parallel to the lower body 450, and a third portion 466 that extends generally parallel to the first portion 458. Other examples include different angles and numbers of portions. The first, second, and third portions 458, 462, 466 form a path for the working fluid (in vaporized or liquid form). Like other conduits described herein, the 3D vapor chamber 446 can include one or more wick structures that are disposed at least partially within the lower body 450 and / or within one or more of the first, second, or third portions 458, 462, 466 of the conduit 454.

[0198] Figure 27 Another example is illustrated, where the 3D vapor chamber 446b includes a plurality of conduits 454 positioned in a row. Figure 28 Yet another example of the 3D vapor chamber 446c is illustrated, where the conduits 454 are staggered. Figure 29 Yet another example of the 3D vapor chamber 33 is illustrated, where some of the conduits 454 are disposed within other conduits 454 (e.g., directly in the space between the lower body 450 and the other conduits 454).

[0199] Other examples include combinations and orientations of the conduits 454 different from those shown. In Figures 26 - 29 In each of them, a condenser region may also be present. For example, a portion of one or more of the conduits 454 themselves may form part of the condenser region. In some examples, the 3D vapor chambers 446a, 446b, 446c, and / or 446d may include one or more air-cooling fins located near one or more of the conduits 454.

[0200] Additionally, and referring to Figure 30 , in some examples, the vapor chamber 470 includes one or more fins 474 that extend from a manifold (or manifolds) 478. The fins 474 may extend vertically upward from the manifold 478 or at different angles. In some examples, the fins 474 extend from the upper wall of the manifold (e.g., Figure 3The upper wall 186) of the header as seen extends vertically upward. Similar to the air-cooling fins 206 described above, the fins 474 can be spaced apart from each other, and in some examples, can be spaced apart differently from each other at different positions along the heat spreader 470. The stacks or regions of the fins 474 can have different densities from each other. In some examples, the fins 474 are evenly spaced apart from each other and extend vertically upward, so that heat is vertically displaced from the header 478. As Figure 30 As shown in, the heat spreader 470 can also include components similar to the heat spreaders described above, for example including a lower body 482, conduits 486, and air-cooling fins 490.

[0201] Figures 26 - 30 The thermal device shown in can include any other various features described herein as being related to it, for example including conduits, headers, columns, core structures, reinforcing plates, extended surfaces, or other structures that provide structural stability and / or enhance heat flow.

[0202] Although various aspects and examples have been described in detail with reference to certain examples shown in the drawings, there are variations and modifications within the scope and spirit of one or more of the described and illustrated individual aspects.

[0203] Some examples can be further described by referring to the following numbered clauses:

[0204] 1. A 3D heat spreader, comprising:

[0205] A lower body defining an evaporator region;

[0206] A header located above the lower body;

[0207] Conduits extending between the lower body and the header;

[0208] A condenser region; and

[0209] A working fluid located within at least one of the lower body, the header, or the conduits,

[0210] wherein the conduits are configured to direct the flow of the working fluid to and from the lower body and the header, wherein a portion of the working fluid is configured to be in a vaporized form during use, and another portion of the working fluid is configured to be in a liquid form during use, and wherein the conduits are arranged such that the vaporized working fluid and the liquid working fluid are configured to flow in the same direction in at least one of the conduits.

[0211] 2. A 3D heat spreader, comprising:

[0212] A lower body defining an evaporator region;

[0213] A header located above the lower body;

[0214] A conduit extending between the lower body and the header;

[0215] A condenser region located between the lower body and the header;

[0216] A working fluid located in at least one of the lower body, the header, or the conduit; and

[0217] A core structure located within the lower body, wherein the core structure is positioned within the lower body to impede the movement of the vaporized portion of the working fluid and to urge the vaporized portion of the working fluid into one or more of the conduits and upward into the upper header and then downward back through one or more of the conduits.

[0218] 3. A 3D vapor chamber, comprising:

[0219] A lower body defining a well, wherein the well defines an evaporator region;

[0220] A header located above the lower body;

[0221] A conduit extending between the lower body and the header;

[0222] A condenser region located between the lower body and the header;

[0223] A working fluid located in at least one of the lower body, the header, or the conduit; and

[0224] A boundary wall located within the lower body, wherein the boundary wall is configured to prevent a portion of the working fluid from entering the well.

[0225] 4. A 3D vapor chamber, comprising:

[0226] A lower body defining an evaporator region;

[0227] A header located above the lower body;

[0228] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of the working fluid between the lower body and the header; and

[0229] A condenser region located between the lower body and the header;

[0230] Wherein the conduit includes a first conduit having a first width and a second conduit having a second width different from the first width.

[0231] 5. A 3D vapor chamber, comprising:

[0232] A lower body defining an evaporator region;

[0233] A header located above the lower body;

[0234] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of a working fluid between the lower body and the header; and

[0235] A condenser region located between the lower body and the header;

[0236] Wherein the conduit is sized and shaped such that there is a different total cross-sectional area of the conduit for the vapor flow of the working fluid moving upward compared to the return vapor flow of the working fluid moving downward.

[0237] 6. A 3D vapor chamber, comprising:

[0238] A lower body defining an evaporator region;

[0239] A header located above the lower body;

[0240] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of a working fluid between the lower body and the header; and

[0241] A condenser region located between the lower body and the header, wherein the condenser includes air-cooling fins arranged in a stack, and wherein the density of the air-cooling fins within one of the stacks varies within the stack.

[0242] 7. A 3D vapor chamber, comprising:

[0243] A lower body defining an evaporator region;

[0244] A header located above the lower body;

[0245] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of a working fluid between the lower body and the header;

[0246] A condenser region located between the lower body and the header; and

[0247] A core structure located within the lower body;

[0248] Wherein one or more of the conduits are in direct contact with the core structure.

[0249] 8. A 3D vapor chamber, comprising:

[0250] A lower body defining an evaporator region;

[0251] A header located above the lower body;

[0252] A condenser region located between the lower body and the header; and

[0253] Columns in the header, wherein each column has a streamlined cross-sectional shape.

[0254] 9. A 3D vapor chamber, comprising:

[0255] A lower body defining an evaporator region;

[0256] A header located above the lower body;

[0257] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of a working fluid between the lower body and the header; and

[0258] A condenser region located between the lower body and the header, wherein the condenser includes air-cooling fins arranged in a stack, and wherein the density of the air-cooling fins in one stack is different from the density of the air-cooling fins in different stacks.

[0259] 10. A 3D vapor chamber, comprising:

[0260] A lower body defining an evaporator region;

[0261] A header located above the lower body;

[0262] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of a working fluid between the lower body and the header;

[0263] A condenser region located between the lower body and the header; and

[0264] A core structure extending at least partially within one or more of the conduit or the header.

[0265] 11. A 3D vapor chamber, comprising:

[0266] A lower body defining an evaporator region;

[0267] A header located above the lower body;

[0268] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of the working fluid between the lower body and the header; and

[0269] A condenser region located between the lower body and the header;

[0270] Wherein the evaporator region includes a lower wall and fins extending upwardly from the lower wall, and wherein the evaporator region further includes a core structure extending at least partially above the fins.

[0271] 12. A 3D vapor chamber, comprising:

[0272] A lower body defining an evaporator region;

[0273] A header located above the lower body;

[0274] A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of the working fluid between the lower body and the header; and

[0275] A condenser region located between the lower body and the header;

[0276] Wherein the evaporator region includes fins, columns, and cavities arranged in parallel, in a grid, and / or any other regular or irregular pattern.

[0277] 13. A 3D vapor chamber, comprising:

[0278] A lower body defining an evaporator region;

[0279] A conduit extending away from the lower body and looping back to the lower body; and

[0280] A working fluid located in at least one of the lower body or the conduit,

[0281] Wherein the conduit is configured to direct the flow of the working fluid into and out of the lower body, wherein a portion of the working fluid is configured to be in a vaporized form during use, and another portion of the working fluid is configured to be in a liquid form during use.

[0282] 14. A thermal device, comprising:

[0283] An evaporator region having a plurality of extended surfaces defining a matrix, wherein the extended surfaces are configured to provide structural support for the evaporator region; and

[0284] A core structure covering at least a portion of the extended surface, wherein the core structure includes powder ribs.

[0285] 15. A thermal device, comprising:

[0286] An evaporator region;

[0287] A liquid reservoir positioned adjacent to the evaporator region; and

[0288] A screen located in the liquid reservoir.

[0289] 16. A 3D vapor chamber, comprising:

[0290] A lower body defining an evaporator region;

[0291] A header located above the lower body;

[0292] A conduit extending between the lower body and the header;

[0293] A condenser region; and

[0294] A working fluid located in at least one of the lower body, the header, or the conduit,

[0295] wherein the conduit is configured to direct the flow of the working fluid to and from the lower body and the header, wherein a portion of the working fluid is configured to be in a vaporized form during use, and another portion of the working fluid is configured to be in a liquid form during use, and wherein the conduit is arranged such that the vaporized working fluid and the liquid working fluid are configured to flow in the same direction in none, some, most, or all of the conduits.

[0296] The various features and advantages of the present disclosure are set forth in the appended claims.

Claims

1. A 3D vapor chamber, comprising: A lower body defining an evaporator region; A header located above the lower body; A conduit extending between the lower body and the header; A condenser region; And A working fluid located within at least one of the lower body, the header, or the conduit, Wherein the conduit is configured to direct the flow of the working fluid to and from the lower body and the header, wherein a portion of the working fluid is configured to be in a vaporized form during use, and another portion of the working fluid is configured to be in a liquid form during use, and wherein the conduit is arranged such that the vaporized working fluid and the liquid working fluid are configured to flow in the same direction in at least one of the conduits.

2. The 3D vapor chamber according to claim 1, wherein, The vaporized working fluid and the liquid working fluid are configured to flow in the same direction in the condenser region.

3. The 3D vapor chamber according to claim 1, wherein The lower body defines a hollow interior and a well, wherein the well defines at least a portion of the evaporator region.

4. The 3D vapor chamber according to claim 3, wherein, The lower body defines a liquid reservoir configured to receive the liquid working fluid from the condenser region and direct the liquid working fluid toward the well, wherein the liquid reservoir includes a lower reservoir wall, an upper reservoir wall, side reservoir walls extending from the lower reservoir wall to the upper reservoir wall, and a boundary wall extending upward from the lower reservoir wall and terminating before reaching the upper reservoir wall.

5. The 3D vapor chamber according to claim 4, wherein, The boundary wall has a serpentine shape.

6. The 3D vapor chamber according to claim 4 further includes a core structure extending into the well, wherein, The core structure includes a peripheral portion that extends outwardly upward from the well and is rolled up and wrapped around the boundary wall.

7. The 3D vapor chamber according to claim 6, wherein, The peripheral portion physically contacts the upper reservoir wall and also physically contacts a first lower reservoir wall, and wherein the peripheral portion is configured to inhibit the vaporized working fluid from passing through the peripheral portion.

8. The 3D vapor chamber according to claim 6, wherein, At least one of the conduits is a first conduit, wherein the core structure is a first core structure, and wherein the 3D vapor chamber further includes a second conduit and a second core structure extending vertically within the second conduit, and wherein the second core structure is configured to direct the liquid working fluid toward the first core structure.

9. The 3D vapor chamber according to claim 8, wherein, The header includes columns configured to provide structural support for the header, and wherein the columns have a non-circular cross-sectional shape to facilitate the flow of the working fluid laterally through the header.

10. The 3D vapor chamber according to claim 1, wherein, The conduit includes a first conduit having a first width and a second conduit having a second width different from the first width, and wherein the condenser includes air-cooling fins arranged in a stack, and wherein the density of the air-cooling fins in one stack is different from the density of the air-cooling fins in different stacks.

11. The 3D vapor chamber according to claim 1, wherein, The evaporator region includes a lower wall and an extended surface extending upward from the lower wall, and wherein the evaporator region further includes a core structure extending at least partially above the extended surface.

12. The 3D vapor chamber according to claim 11, wherein, The extended surface is fins defining a matrix in the evaporator region, and wherein the extended surface is configured to provide structural support for the evaporator region.

13. The 3D vapor chamber according to claim 12, wherein, The evaporator region further includes columns extending vertically upward from the fins, wherein the core structure further extends above the columns.

14. A 3D vapor chamber, comprising: A lower body defining an evaporator region; A header located above the lower body; A conduit extending between the lower body and the header, wherein the conduit is configured to direct the flow of a working fluid between the lower body and the header; and A condenser region located between the lower body and the header; Wherein the evaporator region includes a lower wall and an extended surface extending upward from the lower wall, wherein the evaporator region further includes a core structure extending at least partially above the extended surface.

15. The 3D vapor chamber according to claim 14, wherein, The extended surface is fins defining a matrix in the evaporator region, wherein the extended surface is configured to provide structural support for the evaporator region.

16. The 3D vapor chamber according to claim 15, wherein, The evaporator region further includes columns extending vertically upward from the fins, wherein the core structure further extends above the columns.

17. The 3D vapor chamber according to claim 16, wherein, Each of the extended surfaces includes a root located where the extended surface rises upward from the lower wall, wherein the core structure has a first thickness along one of the fins and a second thickness at one of the roots, wherein the first thickness is greater than the second thickness.

18. The 3D vapor chamber according to claim 16, wherein, Each of the fins has a first width and each of the columns has a second width, wherein the first width is greater than the second width.

19. The 3D vapor chamber according to claim 14, wherein, The core structure includes powder ribs.

20. The 3D vapor chamber according to claim 14, wherein, The core structure is located in the lower body to prevent the movement of the vaporized portion of the working fluid and to urge the vaporized portion of the working fluid into one or more of the conduits and flow upward into the header and then flow downward back through one or more of the conduits.

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