Semiconductor device screening and testing device

Abstract

The present invention belongs to the technical field of semiconductor testing devices, specifically a semiconductor device screening and testing device, including a water collecting mechanism, a test box is installed on the upper surface of the water collecting mechanism, a test mechanism is installed inside the test box, a pin detection mechanism is installed inside the test mechanism, the test mechanism includes a semiconductor body arranged inside the test box, the surface of the semiconductor body is connected to a wire body, and the surface of the wire body is fixedly connected to a movable plate by bolts; through the above-mentioned structural coordination, based on the mutual coordination of structures such as the test mechanism and the pin testing mechanism, the semiconductor body is inserted into the test box, based on the driving mechanism, the striking rod repeatedly impacts the semiconductor body through the guide tube, and at the same time, the pure water inside the water collecting box is injected into the test box, so that not only the hardness of the packaged device of the semiconductor body can be tested, but also the air tightness of the packaged device can be tested.

Description

Technical Field

[0001] The invention belongs to the technical field of testing devices, in particular to a semiconductor device screening and testing device. Background Art

[0002] Semiconductor devices are electronic devices with electrical conductivity between that of good conductors and insulators, utilizing the unique electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, amplify signals, and perform energy conversion. Made of silicon, germanium, or gallium arsenide, semiconductor devices can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other devices. Sometimes referred to as discrete devices to distinguish them from integrated circuits, the basic structure of most two-terminal devices (i.e., crystal diodes) is a PN junction. Semiconductor devices typically utilize different semiconductor materials, processes, and geometries. A wide variety of crystal diodes with diverse functional applications have been developed, covering a frequency range from low and high frequencies, microwaves, millimeter waves, infrared, and even optical waves.

[0003] A Chinese invention patent publication numbered CN114047420B discloses a semiconductor package device testing device. The key technical features of the device include: a base, a second plate fixedly connected to the top surface of the base, a third plate fixedly connected to one side of the second plate, a movable column slidably connected to the third plate, the movable column extending through the third plate, a blocking rod and an L-shaped rod fixedly connected to one side of the movable column, the blocking rod positioned above the third plate, the L-shaped rod positioned below the third plate, a ninth column rotatably connected to the side of the second plate proximate the movable column, one end of the ninth column fixedly connected to the sixth column, the sixth column fixedly connected to the side proximate the movable column to the seventh column, the L-shaped rod fixedly connected to the eighth column, the seventh column cooperating with the eighth column, a first spring sheathed around the exterior of the movable column, the first spring positioned between the L-shaped rod and the third plate, and a striking block fixedly connected to the bottom end of the movable column. The present invention achieves the purpose of testing the exterior robustness of packaged devices.

[0004] However, the above technologies often have the following defects:

[0005] Although the striking block falls and strikes the outside of the packaged device through the cooperation between the driving motor and the ninth column and other structures, and the above process is repeated, a judgment is made based on the damage to the outside of the packaged device, thereby achieving the purpose of testing the strength of the outside of the packaged device. However, when testing the connection performance between the wire and the packaged device, it is impossible to test the connection between the wire and the packaged device and the airtightness of the packaged device at the same time, which may cause external dust and other impurities to enter the interior of the packaged device during use, affecting the semiconductor device.

[0006] To this end, the present invention provides a semiconductor device screening and testing device. Summary of the Invention

[0007] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0008] The technical solution adopted by the present invention to solve the technical problem is as follows: a semiconductor device screening and testing device according to the present invention comprises a water collection mechanism, a test box is installed on the upper surface of the water collection mechanism, a test mechanism is installed inside the test box, and a pin detection mechanism is installed inside the test mechanism;

[0009] The testing mechanism includes a semiconductor body arranged inside the test box, the surface of the semiconductor body is connected to a wire body, the surface of the wire body is fixedly connected to a movable plate by bolts, the surface of the movable plate is fixedly connected to a linkage gear plate, the surface of the linkage gear plate is meshed with a driving gear, one side of the semiconductor body is attached to a guide cylinder fixedly connected to the inside of the test box, a striking rod is slidably inserted into the inside of the guide cylinder, the surface of the striking rod is fixedly connected to a movable plate, the upper surface of the movable plate is fixedly connected to a driving gear plate corresponding to the driving gear, and a driving mechanism is installed on one side of the striking rod.

[0010] As a further solution of the present invention: the pin detection mechanism includes pins fixedly connected to one side of the semiconductor body in a rectangular array, and the surfaces of several of the pins are commonly sleeved with a fixing plate, and the surface of the fixing plate is slidably sleeved with a sealing box corresponding to the semiconductor body, and the surface of the sealing box is fixedly connected to a sealing cover by bolts, and one side of the fixing plate is provided with a plug-in slot corresponding to the pin, and one side of the fixing plate is fixedly connected to a moving rod by bolts.

[0011] As a further solution of the present invention: the pin detection mechanism also includes a connecting tube fixedly connected to the surface of the fixed plate and connected to the plug-in slot, one end of the connecting tube is fixedly connected to a water collecting box with glue inside, the water collecting box is fixedly connected to the moving rod, the interior of the water collecting box is slidingly connected to an extrusion plate, the surface of the extrusion plate is threadedly connected to a threaded rod rotatably connected to the water collecting box, and one end of the threaded rod is fixedly connected to a servo motor with an output end fixedly connected to the threaded rod.

[0012] As a further solution of the present invention: the pin detection mechanism also includes a pushing plate fixedly connected to one end of the moving rod, one side of the pushing plate is fixedly connected to an iron plate corresponding to the movable plate, the interior of the test box is fixedly connected to a support plate, the interior of the support plate is fixedly connected to an electromagnetic coil, and one side of the support plate is fixedly connected to an adsorption plate corresponding to the electromagnetic coil and the iron plate.

[0013] As a further solution of the present invention: the testing mechanism also includes a support rod fixedly connected to one side of the support plate, the surface of the support rod is rotatably sleeved with a magnet block, the surface of the magnet block is fixedly connected to a connecting frame fixedly connected to the sealing cover, the surface of the connecting frame is fixedly connected to a guide plate slidingly connected to the linkage gear plate, and the driving gear is rotatably connected to the connecting frame through a bearing seat.

[0014] As a further solution of the present invention: the driving mechanism includes a driving motor fixedly connected to the inside of the test box, the output end of the driving motor is fixedly connected to a rotating rod, one end of the rotating rod is fixedly connected to a rotating disk rotatably connected to the inside of the test box, the surface of the rotating disk is rotatably connected to a flip plate rotatably connected to the striking rod through a pin shaft, and the surfaces of the rotating rod and the guide cylinder are both sleeved with a limiting tube fixedly connected to the test box.

[0015] As a further solution of the present invention: a reset spring is fixedly connected to the upper surface of the sealing cover, one end of the reset spring is fixedly connected to a hook, the surface of the hook is fitted with a limiting ring fixedly connected to the adsorption plate, and the fixed plate and the moving rod are both slidably connected to the interior of the sealing box.

[0016] As a further solution of the present invention: the water collecting mechanism includes a supporting base plate, the upper surface of the supporting base plate is fixedly connected to a water collecting box, the upper surface of the water collecting box is fixedly connected to a hollow box, the test box is fixedly connected to the interior of the hollow box, one side of the water collecting box is fixedly connected to a water inlet pipe connected to the hollow box, and the pure inlet water arranged inside the water collecting box is pumped into the interior of the test box through the cooperation of the existing water pump and the water inlet pipe.

[0017] As a further solution of the present invention: the water collection mechanism also includes a drain pipe fixedly connected to one side of the test box, an electromagnetic valve is installed on the surface of the drain pipe, the test box is connected to the hollow box through the drain pipe, the inner bottom wall of the test box is fixedly connected to an electric heating plate, and one side of the water collecting box is fixedly connected to a water supply pipe.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The semiconductor device screening and testing device disclosed herein utilizes a testing mechanism and a pin testing mechanism to coordinate with each other. A semiconductor body is inserted into a test chamber. A driving mechanism causes a striking rod to repeatedly strike the semiconductor body via a guide tube, while simultaneously injecting pure water from a water collection tank into the test chamber. This allows testing of not only the hardness of the semiconductor body's packaged components but also the airtightness of the packaged components.

[0020] 2. The semiconductor device screening and testing device described in the present invention, based on the mutual cooperation of the test mechanism and the pin test mechanism, simultaneously drives the striking rod, the movable plate, and the drive gear plate to move during the movement of the striking rod, so that the drive gear plate and the drive gear self-engage, driving the linkage gear plate to rotate, and the linkage gear plate drives the movable plate to move, thereby causing the movable plate to move the wire body, pulling the wire body to test the connection performance and airtightness of the connection between the wire body and the semiconductor body. Thus, the semiconductor device screening and testing device can test the airtightness and strength of the packaged device of the semiconductor body while also testing the connection;

[0021] 3. The semiconductor device screening and testing device described in the present invention utilizes a pin detection mechanism and other structures. When the movable plate and striking rod move, the movable plate pushes the iron plate, and the electromagnetic coil is energized, causing the adsorption plate to generate magnetic force, adsorbing the iron plate, and causing the fixed plate to apply a tensile force to the pins, thereby testing the tensile strength of the pins. This allows the semiconductor device screening and testing device to simultaneously test the pins. Based on the testing of the semiconductor body package, connections, and pin tensile strength, semiconductor devices can be screened and selected to select semiconductor devices of different specifications.

[0022] 4. The semiconductor device screening and testing device described in the present invention, through the mutual cooperation of structures such as an electric heating plate and a reset spring, uses a water pump to inject pure water inside the water collecting tank into the test box, and at the same time starts the electric heating plate to heat the pure water, so that the semiconductor device screening and testing device can test the packaged devices of the semiconductor body at different temperatures, and through the elastic force of the reset spring, after the pin test is completed, the electromagnetic coil is powered off, and the reset spring drives the moving rod to reset, which facilitates the multiple use of the pin detection mechanism, and through the setting of the bolts, the sealing cover and the sealing box are more convenient to disassemble, and the replacement of the internal components of the sealing box is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings.

[0024] Figure 1 It is a structural schematic diagram of the present invention;

[0025] Figure 2 It is a structural schematic diagram of the second viewing angle in the present invention;

[0026] Figure 3 It is a structural diagram of the water collection mechanism and the test box in the present invention;

[0027] Figure 4 It is a structural diagram of the test box and the electric heating plate in the present invention;

[0028] Figure 5It is a structural diagram of the driving mechanism and the testing mechanism in the present invention;

[0029] Figure 6 It is a schematic structural diagram of the semiconductor body, the striking rod and the driving gear plate in the present invention;

[0030] Figure 7 It is a structural diagram of the pin detection mechanism of the present invention;

[0031] Figure 8 It is a structural schematic diagram of the sealing box, the moving rod and the magnet block in the present invention;

[0032] Figure 9 This invention Figure 8 A in the middle is an enlarged structural diagram;

[0033] Figure 10 It is a structural schematic diagram of the plug-in slot, the moving rod and the water collecting box in the present invention;

[0034] Figure 11 This invention Figure 2 Enlarged structural diagram at point B in the middle.

[0035] In the figure: 1. water collection mechanism; 101. supporting bottom plate; 102. water collection box; 103. hollow box; 104. water inlet pipe; 105. drain pipe; 106. solenoid valve; 107. electric heating plate; 2. test box; 3. test mechanism; 301. semiconductor body; 302. wire body; 303. movable plate; 304. linkage gear plate; 305. driving gear; 306. guide cylinder; 307. striking rod; 308. movable plate; 309. driving gear plate; 310. supporting rod; 311. magnet block; 312. connecting frame; 313. guide plate ; 4. Pin detection mechanism; 401. Pin; 402. Fixed plate; 403. Sealing box; 404. Plug slot; 405. Moving rod; 406. Connecting pipe; 407. Water collecting box; 408. Extrusion plate; 409. Threaded rod; 410. Servo motor; 411. Push plate; 412. Iron plate; 413. Support plate; 414. Electromagnetic coil; 415. Adsorption plate; 416. Sealing cover; 5. Driving mechanism; 501. Driving motor; 502. Rotating rod; 503. Rotating disk; 504. Flip plate; 6. Reset spring; 7. Hook. DETAILED DESCRIPTION

[0036] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0037] The present invention provides a semiconductor device screening test device, referring to Figures 1-11 , the present invention provides three embodiments: Example

[0038] The semiconductor device screening and testing device comprises a water collecting mechanism 1, a test box 2 is mounted on the upper surface of the water collecting mechanism 1, the water collecting mechanism 1 comprises a supporting bottom plate 101, and a test mechanism 3 is mounted inside the test box 2;

[0039] The testing mechanism 3 includes a semiconductor body 301 disposed within the test chamber 2. A wire body 302 is connected to the surface of the semiconductor body 301. Bolts are provided to securely connect the wire body 302 to the surface of a movable plate 303, which allows the movable plate 303 to move the wire body 302. The connection between the wire body 302 and the packaged device of the semiconductor body 301 is tested, and the airtightness of the connection is tested by the provision of pure water.

[0040] A movable plate 303 is fixedly connected to the surface of the wire body 302 via bolts. A linkage tooth plate 304 is fixedly connected to the surface of the movable plate 303. A driving gear 305 is meshed with the surface of the linkage tooth plate 304. A guide cylinder 306 fixedly connected to the interior of the test box 2 is attached to one side of the semiconductor body 301. A striking rod 307 is slidably inserted into the interior of the guide cylinder 306. A movable plate 308 is fixedly connected to the surface of the striking rod 307. A driving tooth plate 309 corresponding to the driving gear 305 is fixedly connected to the upper surface of the movable plate 308.

[0041] During the movement of the striking rod 307, the movable plate 308 is synchronously driven to move, so that the movable plate 308 drives the driving tooth plate 309 to move, so that the driving tooth plate 309 is self-engaged with the driving gear 305, thereby causing the driving gear 305 to mesh and rotate, driving the linkage tooth plate 304 and the driving tooth plate 309 to move in opposite directions, thereby driving the movable plate 303 to move;

[0042] The testing mechanism 3 also includes a support rod 310 fixedly connected to one side of the support plate 413. The setting of the support rod 310 makes it more stable when the magnet block 311 drives the semiconductor body 301 to rotate. The surface of the support rod 310 is rotatably sleeved with the magnet block 311. The surface of the magnet block 311 is fixedly connected to a connecting frame 312 fixedly connected to the sealing cover 416. The sealing box 403, the sealing cover 416 and the magnet block 311 are fixedly connected by the connecting frame 312. The surface of the connecting frame 312 is fixedly connected to a guide plate 313 slidably connected to the linkage gear plate 304. The setting of the guide plate 313 can not only limit the linkage gear plate 304, but also guide the linkage gear plate 304, thereby making the linkage gear plate 304 more stable when moving;

[0043] The driving gear 305 is rotatably connected to the connecting frame 312 via a bearing seat. A driving mechanism 5 is installed on one side of the striking rod 307. The driving mechanism 5 includes a driving motor 501 fixedly connected to the inside of the test box 2. The output end of the driving motor 501 is fixedly connected to a rotating rod 502. One end of the rotating rod 502 is fixedly connected to a rotating disk 503 rotatably connected to the inside of the test box 2. The surface of the rotating disk 503 is rotatably connected to a flip plate 504 rotatably connected to the striking rod 307 via a pin. The surfaces of the rotating rod 502 and the guide cylinder 306 are both sleeved with a limiting tube fixedly connected to the test box 2. The provision of the limiting tube makes the rotating rod 502 and the guide cylinder 306 more stable during use.

[0044] Start the driving motor 501 so that its output end drives the rotating rod 502 to rotate, thereby causing the rotating disk 503 to drive the flip plate 504 to move through the pin shaft, causing the striking rod 307 to move back and forth inside the guide cylinder 306, so that the striking rod 307 strikes one side of the semiconductor body 301 to test the strength of the semiconductor body 301 packaged device. At the same time, through the setting of pure water, observe whether the pure water produces bubbles to test the airtightness of the semiconductor body 301 packaged device.

[0045] Embodiment 2, based on embodiment 1, further, a pin detection mechanism 4 is installed inside the test mechanism 3, and the pin detection mechanism 4 includes pins 401 fixedly connected to one side of the semiconductor body 301 in a rectangular array, and the surfaces of several pins 401 are commonly sleeved with a fixing plate 402, and the surface of the fixing plate 402 is slidably sleeved with a sealing box 403 corresponding to the semiconductor body 301, and the surface of the sealing box 403 is fixedly connected with a sealing cover 416 by bolts, and the upper surface of the sealing cover 416 is fixedly connected with a reset spring 6. Through the setting of the reset spring 6, after the tensile performance test of the pin 401 by the moving rod 405 and the fixing plate 402, the moving rod 405 is moved. The rod 405 can be automatically reset, which is convenient for repeated use of the pin detection mechanism 4. One end of the reset spring 6 is fixedly connected to the hook 7. The surface of the hook 7 is fitted with a limit ring fixedly connected to the adsorption plate 415. Through the mutual cooperation of the hook 7 and the limit ring, when the fixed plate 402 is replaced, the hook 7 and the push plate 411 are detachable, avoiding the reset spring 6 from hindering the movement of the push plate 411. One side of the fixed plate 402 is provided with a plug-in slot 404 corresponding to the pin 401. One side of the fixed plate 402 is fixedly connected to the moving rod 405 by a bolt. The fixed plate 402 and the moving rod 405 are both slidably connected to the interior of the sealing box 403.

[0046] The pin detection mechanism 4 also includes a connecting pipe 406 fixedly connected to the surface of the fixed plate 402 and connected to the plug-in slot 404, one end of the connecting pipe 406 is fixedly connected to a water collecting box 407 with glue inside, the water collecting box 407 is fixedly connected to the moving rod 405, the interior of the water collecting box 407 is slidably connected to an extrusion plate 408, the surface of the extrusion plate 408 is threadedly connected to a threaded rod 409 rotatably connected to the water collecting box 407, one end of the threaded rod 409 is fixedly connected to a servo motor 410 whose output end is fixedly connected to the threaded rod 409, and the servo motor 410 is started, so that its output end drives the threaded rod 409 to rotate, so that the threaded rod 409 drives the extrusion plate 408 to move inside the water collecting box 407, squeezing the glue inside the water collecting box 407, so that the glue enters the interior of the plug-in slot 404 through the connecting pipe 406, so that the pin 401 is fixedly connected to the fixed plate 402;

[0047] The pin detection mechanism 4 also includes a pushing plate 411 fixedly connected to one end of the moving rod 405, and one side of the pushing plate 411 is fixedly connected to an iron plate 412 corresponding to the movable plate 308. When the movable plate 308 moves, the movable plate 308 slides inside the movable plate 303, so that the movable plate 308 fits against the iron plate 412, pushing the iron plate 412 to move, so that the iron plate 412 drives the moving rod 405 and the fixed plate 402 to move, applying a pulling force to the pin 401, and the interior of the test box 2 is fixedly connected to a support plate 413, and the interior of the support plate 413 is fixedly connected to an electromagnetic coil 414, and one side of the support plate 413 is fixedly connected to an adsorption plate 415 corresponding to the electromagnetic coil 414 and the iron plate 412. When the electromagnetic coil 414 is energized, the adsorption plate 415 generates a magnetic force, which adsorbs the iron plate 412, so that the fixed plate 402 pulls the pin 401 to remain in a fixed position, and the tensile performance of the pin 401 is tested.

[0048] Example 3, based on Example 1 and Example 2, further, a water collecting box 102 is fixedly connected to the upper surface of the supporting base plate 101, a hollow box 103 is fixedly connected to the upper surface of the water collecting box 102, the test box 2 is fixedly connected to the interior of the hollow box 103, and a water inlet pipe 104 connected to the hollow box 103 is fixedly connected to one side of the water collecting box 102. The pure water set in the water collecting box 102 is pumped into the interior of the test box 2 through the cooperation of the existing water pump and the water inlet pipe 104;

[0049] Insert the semiconductor body 301 into the sealed box 403 so that the pins 401 are inserted into the insertion slots 404 on the fixing plate 402. Rotate the magnet block 311 to drive the semiconductor body 301 into the test chamber 2 so that one side of the semiconductor body 301 is aligned with one side of the guide cylinder 306. Using an existing water pump, pure water from the water collection tank 102 is pumped into the test chamber 2 through the water inlet pipe 104, so that the pure water submerges the semiconductor body 301.

[0050] The water collection mechanism 1 also includes a drain pipe 105 fixedly connected to one side of the test box 2. A solenoid valve 106 is installed on the surface of the drain pipe 105. The test box 2 is connected to the hollow box 103 through the drain pipe 105. Through the cooperation between the drain pipe 105 and the solenoid valve 106, when the temperature inside the test box 2 needs to be adjusted, the hot water inside the test box 2 is discharged into the interior of the hollow box 103, and the test box 2 is refilled with water through the water inlet pipe 104, so that hot and cold water are alternately used, the temperature is quickly reduced, and the efficiency of testing the semiconductor body 301 is improved. An electric heating plate 107 is fixedly connected to the inner bottom wall of the test box 2. When the electric heating plate 107 is turned on, it heats the pure water inside the test box 2. This not only allows the temperature of the semiconductor body 301 to be adjusted as needed during testing, so that the semiconductor body 301 can be tested at different temperatures, but also heats the glue, so that the glue can more quickly fix the pin 401 to the fixing plate 402. A water supply pipe is fixedly connected to one side of the water collection box 102.

[0051] Working principle: The semiconductor body 301 is inserted into the sealing box 403 so that the pin 401 is inserted into the insertion slot 404 on the fixing plate 402. The magnet block 311 is rotated to drive the semiconductor body 301 to rotate into the test box 2 so that one side of the semiconductor body 301 is in contact with one side of the guide cylinder 306. Based on the existing water pump, the pure water in the water collection tank 102 enters the test box 2 through the water inlet pipe 104 so that the pure water covers the semiconductor body 301. The driving motor 501 is started so that its output end drives the rotating rod 502 to rotate, thereby causing the rotating disk 503 to drive the flip plate 504 to move through the pin shaft, so that the striking rod 307 moves back and forth inside the guide cylinder 306, so that the striking rod 307 strikes one side of the semiconductor body 301 to test the strength of the semiconductor body 301 packaged device. At the same time, through the setting of pure water, whether bubbles are generated in the pure water is observed to test the airtightness of the semiconductor body 301 packaged device.

[0052] At the same time, during the movement of the striking rod 307, the movable plate 308 is synchronously driven to move, so that the movable plate 308 drives the driving tooth plate 309 to move, so that the driving tooth plate 309 self-engages with the driving gear 305, thereby causing the driving gear 305 to mesh and rotate, driving the linkage tooth plate 304 and the driving tooth plate 309 to move in opposite directions, driving the movable plate 303 to move, and through the setting of bolts, the wire body 302 is fixedly connected to the surface of the movable plate 303, so that the movable plate 303 drives the wire body 302 to move, and the connection between the wire body 302 and the semiconductor body 301 packaging device is tested, and the air tightness of the connection is tested by setting pure water;

[0053] The servo motor 410 is started, and its output end drives the threaded rod 409 to rotate, so that the threaded rod 409 drives the extrusion plate 408 to move inside the water collecting box 407, squeezing the glue inside the water collecting box 407, so that the glue enters the inside of the plug-in slot 404 through the connecting pipe 406, so that the pin 401 is fixedly connected to the fixed plate 402. When the movable plate 308 moves, the movable plate 308 slides inside the movable plate 303, so that the movable plate 308 fits the iron plate 412, pushing the iron plate 412 to move, so that the iron plate 412 drives the movable rod 405 and the fixed plate 402 to move, applying a pulling force to the pin 401. At the same time, the electromagnetic coil 414 is energized, so that the adsorption plate 415 generates a magnetic force, which adsorbs the iron plate 412, so that the fixed plate 402 pulls the pin 401 to remain in a fixed position, and the tensile performance of the pin 401 is tested.

[0054] When testing the semiconductor body 301, the electric heating plate 107 is started as needed to heat the pure water inside the test box 2. This not only allows the temperature of the semiconductor body 301 to be adjusted as needed during testing, so that the semiconductor body 301 can be tested at different temperatures, but also heats the glue so that the glue can fix the pin 401 and the fixing plate 402 more quickly.

[0055] The above-mentioned front, back, left, right, up and down are all based on the Figure 1 As a benchmark, according to the person's observation perspective, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present invention.

[0057] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device screening and testing device, characterized in that: It comprises a water collecting mechanism (1), a test box (2) is installed on the upper surface of the water collecting mechanism (1), a test mechanism (3) is installed inside the test box (2), and a pin detection mechanism (4) is installed inside the test mechanism (3); The testing mechanism (3) comprises a semiconductor body (301) arranged inside the testing box (2), the surface of the semiconductor body (301) is connected to a wire body (302), the surface of the wire body (302) is fixedly connected to a movable plate (303) via bolts, the surface of the movable plate (303) is fixedly connected to a linkage tooth plate (304), the surface of the linkage tooth plate (304) is meshed with a driving gear (305), one side of the semiconductor body (301) is attached to a guide cylinder (306) fixedly connected to the inside of the testing box (2), a striking rod (307) is slidably inserted into the inside of the guide cylinder (306), the surface of the striking rod (307) is fixedly connected to a movable plate (308), the upper surface of the movable plate (308) is fixedly connected to a driving tooth plate (309) corresponding to the driving gear (305), and a driving mechanism (5) is installed on one side of the striking rod (307); The pin detection mechanism (4) comprises pins (401) fixedly connected to one side of the semiconductor body (301) in a rectangular array, a fixing plate (402) being sleeved on the surfaces of a plurality of the pins (401), a sealing box (403) corresponding to the semiconductor body (301) being slidably sleeved on the surface of the fixing plate (402), a sealing cover (416) being fixedly connected to the surface of the sealing box (403) by bolts, a plug-in slot (404) corresponding to the pins (401) being provided on one side of the fixing plate (402), and a moving rod (405) being fixedly connected to one side of the fixing plate (402) by bolts; The pin detection mechanism (4) further comprises a connecting pipe (406) fixedly connected to the surface of the fixing plate (402) and communicating with the plug-in slot (404); one end of the connecting pipe (406) is fixedly connected to a water collecting box (407) provided with glue inside; the water collecting box (407) is fixedly connected to the moving rod (405); an extrusion plate (408) is slidably connected to the inside of the water collecting box (407); a surface of the extrusion plate (408) is threadedly connected to a threaded rod (409) rotatably connected to the water collecting box (407); one end of the threaded rod (409) is fixedly connected to a servo motor (410) whose output end is fixedly connected to the threaded rod (409); The pin detection mechanism (4) further comprises a push plate (411) fixedly connected to one end of the moving rod (405), an iron plate (412) corresponding to the movable plate (308) being fixedly connected to one side of the push plate (411), a support plate (413) being fixedly connected to the interior of the test box (2), an electromagnetic coil (414) being fixedly connected to the interior of the support plate (413), and an adsorption plate (415) corresponding to the electromagnetic coil (414) and the iron plate (412) being fixedly connected to one side of the support plate (413); The testing mechanism (3) further comprises a support rod (310) fixedly connected to one side of the support plate (413); a magnet block (311) is rotatably sleeved on the surface of the support rod (310); a connecting frame (312) fixedly connected to the sealing cover (416) is fixedly connected to the surface of the magnet block (311); a guide plate (313) slidably connected to the linkage tooth plate (304) is fixedly connected to the surface of the connecting frame (312); and the driving gear (305) is rotatably connected to the connecting frame (312) via a bearing seat.

2. A semiconductor device screening and testing device according to claim 1, characterized in that: The driving mechanism (5) comprises a driving motor (501) fixedly connected to the interior of the test box (2); an output end of the driving motor (501) is fixedly connected to a rotating rod (502); one end of the rotating rod (502) is fixedly connected to a rotating disk (503) rotatably connected to the interior of the test box (2); a flip plate (504) rotatably connected to the striking rod (307) is rotatably connected to the surface of the rotating disk (503) via a pin; and a limiting tube fixedly connected to the test box (2) is sleeved on the surfaces of the rotating rod (502) and the guide cylinder (306).

3. The semiconductor device screening and testing device according to claim 1, wherein: The upper surface of the sealing cover (416) is fixedly connected to a return spring (6), one end of the return spring (6) is fixedly connected to a hook (7), the surface of the hook (7) is fitted with a limiting ring fixedly connected to the adsorption plate (415), and the fixed plate (402) and the moving rod (405) are both slidably connected to the interior of the sealing box (403).

4. A semiconductor device screening and testing device according to claim 3, characterized in that: The water collecting mechanism (1) comprises a supporting base plate (101), the upper surface of the supporting base plate (101) is fixedly connected to a water collecting box (102), the upper surface of the water collecting box (102) is fixedly connected to a hollow box (103), the test box (2) is fixedly connected to the interior of the hollow box (103), one side of the water collecting box (102) is fixedly connected to a water inlet pipe (104) connected to the hollow box (103), and the pure inlet water arranged in the water collecting box (102) is pumped into the interior of the test box (2) through the cooperation of an existing water pump and the water inlet pipe (104).

5. The semiconductor device screening and testing device according to claim 4, wherein: The water collecting mechanism (1) further comprises a drainage pipe (105) fixedly connected to one side of the test box (2); a solenoid valve (106) is installed on the surface of the drainage pipe (105); the test box (2) is connected to the hollow box (103) via the drainage pipe (105); an electric heating plate (107) is fixedly connected to the inner bottom wall of the test box (2); and a water supply pipe is fixedly connected to one side of the water collecting box (102).

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