Systems, devices, and methods for testing gas sensors

Abstract

Systems, devices, and methods for testing a gas sensor are provided. A sensor test system may include a metal cartridge including a first inlet and configured to enclose a gas sensor configured to sense the presence of a gas of interest. The system may include a liquid gas bubbler configured to receive a carrier gas and generate a gas of interest from the gas of interest in liquid form using the carrier gas. The system may include a first flow controller configured to control a flow rate of the carrier gas to the liquid gas bubbler and the gas of interest from the liquid gas bubbler to the first inlet of the metal box. The system may include a hot chamber configured to enclose a liquid gas bubbler and a metal box and configured to set a temperature within the hot chamber to a desired temperature.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to systems, devices, and methods for testing one or more sensors. In particular, some embodiments of the present disclosure relate to systems, devices, and methods for testing one or more gas sensors. Background Art

[0002] Various substances can release gases, such as by outgassing. Gas sensors can be used to detect the released gases. Before being used to sense the released gases, gas sensors may need to be tested, such as calibrated and / or characterized.

[0003] The applicant has recognized many technical challenges and difficulties associated with testing gas sensors. Through the applied effort, wisdom, and innovation, the applicant has solved the problems associated with testing gas sensors by developing the solutions embodied in the present disclosure, which will be described in detail below. Summary of the Invention

[0004] The various embodiments described herein relate to systems, devices, products, and methods for testing, calibrating, and / or characterizing gas sensors.

[0005] In various embodiments, a sensor test system is provided. The sensor test system may include a metal box that includes a first inlet, wherein the metal box is configured to enclose a gas sensor that is configured to sense the presence of a gas of interest; a liquid gas bubbler that is configured to receive a carrier gas and generate the gas of interest from the gas of interest in liquid form using the carrier gas; a first flow controller that is configured to control the flow rate of the carrier gas to the liquid gas bubbler and the flow rate of the gas of interest from the liquid gas bubbler to the first inlet of the metal box; and a thermal chamber that is configured to enclose the liquid gas bubbler and the metal box and is configured to set the temperature inside the thermal chamber to a desired temperature.

[0006] In various embodiments, the sensor test system further includes: a gas channel that is configured to direct the gas of interest from the first inlet of the metal box to the gas sensor; a carrier gas container that is configured to: provide the carrier gas to the liquid gas bubbler, wherein the first flow controller is placed between the carrier gas container and the liquid gas bubbler; and provide the carrier gas to the metal box through a second inlet of the metal box; and a second flow controller that is placed between the carrier gas container and the second inlet of the metal box and is configured to control the flow rate of the carrier gas to the metal box.

[0007] In various embodiments, the sensor test system further includes a water bubbler configured to provide water vapor to the metal cartridge through a third inlet of the metal cartridge; and a third flow controller placed between the water bubbler and the third inlet and configured to control the flow rate of the water vapor to the metal cartridge.

[0008] In various embodiments, the sensor test system further includes a heater configured to increase the temperature of the water in the water bubbler and facilitate the generation of water vapor. In various embodiments, the water bubbler includes a metal coin configured to rotate at a high speed and cause the water to vaporize; and the heater is a magnetic heater and is configured to cause the coin to rotate and increase the temperature of the coin to facilitate the generation of water vapor.

[0009] In various embodiments, the metal cartridge is configured to contain a temperature sensor and a humidity sensor, wherein the temperature sensor is configured to measure the temperature inside the metal cartridge and the humidity sensor is configured to measure the humidity within the metal cartridge.

[0010] In various embodiments, the metal cartridge includes a first outlet configured to transfer the gas of interest, the carrier gas, and the water vapor to the external environment.

[0011] In various embodiments, the sensor test system further includes a scrubber coupled to the first outlet and configured to remove harmful substances from the gas of interest, the carrier gas, and the water vapor before flowing to the external environment.

[0012] In various embodiments, the sensor test system further includes a vacuum pump coupled to a second outlet of the metal cartridge, wherein the vacuum pump is configured to purge the gas of interest from the metal cartridge in combination with the flow of the carrier gas through the metal cartridge; and a cold trap including an ambient condenser or an active condenser, wherein the cold trap is coupled to the second outlet of the metal cartridge and placed outside the hot chamber and is configured to convert the gas of interest into a liquid form of the gas of interest; and a liquid gas channel coupled to the cold trap and a liquid gas bubbler, the liquid gas channel being configured to direct the liquid form of the gas of interest to the gas bubbler.

[0013] In various embodiments, the liquid gas bubbler includes a sintered tube configured to break large bubbles generated by the carrier gas into smaller bubbles and facilitate the generation of the gas of interest.

[0014] Various embodiments provide a method for testing a gas sensor that includes generating a gas of interest from the gas of interest in liquid form using a liquid gas bubbler; controlling a flow rate of a carrier gas to the liquid gas bubbler using a first flow controller, wherein the flow of the carrier gas to the liquid gas bubbler determines the flow rate of the generated gas of interest; flowing the gas of interest into a metal chamber via a first inlet of the metal chamber, the metal chamber being configured to enclose the gas sensor, wherein the gas sensor is configured to sense the presence of the gas of interest; and regulating the temperature of the liquid gas bubbler to be substantially the same as the temperature of the metal chamber using a thermal chamber.

[0015] In various embodiments, the method further includes converting the gas of interest into the gas of interest in liquid form using a condensation trap including an ambient condenser or an active condenser placed outside the thermal chamber; and directing the gas of interest in liquid form to the gas bubbler using a liquid channel coupled to the condensation trap and the liquid gas bubbler, wherein the thermal chamber is configured to enclose the liquid gas bubbler and the metal chamber.

[0016] In various embodiments, the method further includes directing the gas of interest from the first inlet of the metal chamber to the gas sensor via a gas channel; flowing the carrier gas into the metal chamber via a second inlet of the metal chamber; and controlling a flow rate of the carrier gas to the metal chamber using a second flow controller, wherein the second flow controller is placed between the carrier gas container and the metal chamber.

[0017] In various embodiments, the method further includes controlling the concentration of the gas of interest in the metal chamber by controlling the flow rate of the gas of interest to the metal chamber using the first flow controller; and controlling the flow rate of the carrier gas to the metal chamber using the second flow controller.

[0018] In various embodiments, the method further includes generating water vapor using a water bubbler; flowing the water vapor into the metal chamber via a third inlet of the metal chamber; and controlling a flow rate of the water vapor using a third flow controller, wherein the third flow controller is placed between the water bubbler and the metal chamber.

[0019] In various embodiments, the method further includes heating a metal coin in water contained in the water bubbler using a magnetic heater; heating the water in the water bubbler using the metal coin; and rotating the metal coin in the water contained in the water bubbler using the magnetic heater to generate water vapor.

[0020] In various embodiments, the method further includes controlling the humidity inside the metal chamber by controlling the flow rate of the carrier gas to the metal chamber using the second flow controller; and controlling the flow rate of the water vapor to the metal chamber using the third flow controller.

[0021] In various embodiments, the method further includes measuring the humidity inside the metal box using a humidity sensor in the metal box; and controlling the humidity inside the metal box to a desired humidity level using the measured humidity inside the metal box.

[0022] In various embodiments, the method further includes measuring the temperature inside the metal box using a temperature sensor in the metal box; and controlling the temperature inside the metal box to a desired temperature level using the measured temperature inside the metal box.

[0023] Various embodiments of the present disclosure provide a method that includes converting a substance of interest from a liquid form to a gas form using a liquid gas bubbler and a carrier gas; flowing the gas form of the substance of interest into a metal box via a first inlet of the metal box; changing the humidity level inside the metal box by flowing water vapor generated by a water bubbler into the metal box through a second inlet of the metal box; flowing the carrier gas directly into the metal box using a third inlet of the metal box; controlling the flow rates of the gas form of the substance of interest, the water vapor, and the carrier gas into the metal box; controlling the temperature of the liquid gas bubbler and the metal box using a thermal chamber enclosing the liquid gas bubbler and the metal box; and purging the substance of interest from the metal box using the carrier gas and a vacuum pump.

[0024] The above Summary is provided merely for the purpose of summarizing some example embodiments to provide a basic understanding of some aspects of the present disclosure. Accordingly, it should be understood that the above embodiments are merely examples and should not be construed as in any way narrowing the scope or essence of the present disclosure. It should also be understood that, in addition to those summarized here, the scope of the present disclosure also encompasses many possible embodiments, some of which will be further described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 are schematic diagrams showing various aspects of the subject matter according to the present disclosure.

[0026] Figure 2 are schematic diagrams showing various aspects of the subject matter according to the present disclosure.

[0027] Figure 3 are schematic diagrams showing various aspects of the subject matter according to the present disclosure.

[0028] Figure 4A is a schematic diagram showing a sensor test system according to various embodiments of the present disclosure.

[0029] Figure 4B are schematic diagrams showing various aspects of a sensor test system according to various embodiments of the present disclosure.

[0030] Figure 5is a schematic diagram showing a liquid gas bubbler according to various embodiments of the present disclosure.

[0031] Figure 6 is a schematic diagram showing a water bubbler according to various embodiments of the present disclosure.

[0032] Figure 7 is a schematic diagram showing a controller according to various embodiments of the present disclosure.

[0033] Figure 8 is a flowchart showing a method according to various embodiments of the present disclosure. Detailed Description

[0034] Embodiments of the present disclosure will now be described more fully with reference to the accompanying drawings, in which some, but not all embodiments of the disclosure are shown. In fact, the various embodiments of the present disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Throughout the specification, like reference numerals refer to like elements.

[0035] The phrases "in one embodiment", "according to one embodiment", "in some embodiments", "in various embodiments", etc. generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure and may be included in more than one embodiment of the present disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0036] As used herein, the words "example" or "exemplary" mean "serving as an example, instance, or illustration". Any particular implementation described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations.

[0037] If the specification states that a component or feature "may", "can", "might", "should", "would", "preferably", "possibly", "typically", "optionally", "for example", "usually", or "may" (or other such language) be included or have a characteristic, then the particular component or feature need not be included or have that characteristic. Such a component or feature may optionally be included in some embodiments, or it may be excluded.

[0038] The use of broader terms such as "comprising," "including," and "having" should be understood to provide support for narrower terms such as "consisting of," "consisting essentially of," and "substantially constituted by." The use of terms such as "optionally," "can," "may," "possibly," etc. for any element of an embodiment means that the element is not required, or alternatively, the element is required, and both alternatives are within the scope of one or more embodiments. Additionally, the mention of examples is for illustrative purposes only and is not intended to be exclusive.

[0039] The terms "electrically coupled," "communicate with," "electronically communicate with," or "connected" in the present disclosure refer to two or more elements or components connected by wired devices and / or wireless devices such that signals, voltage / current, data, and / or information can be transmitted to and / or received from these elements or components.

[0040] The term "mechanically coupled" or "coupled" in the present disclosure refers to two or more mechanical elements (such as but not limited to frames, surfaces, support units, joints, etc.) physically connected in various ways, such as directly, through intermediate elements, and / or using fasteners, hooks, clamps, joints, pin joints, shafts, hinges, adhesives, etc. The term "mechanically coupled" can refer to a physical connection that can be any of movable, rotatable, rotating, pivoting, fixed, and / or stationary, etc.

[0041] Various embodiments of the present disclosure relate to improved systems, devices, products, and methods for testing gas sensors. It should be readily understood that the embodiments of the systems, devices, and methods described herein can be configured in various additional and alternative ways in addition to those explicitly described herein.

[0042] It may be desirable to detect the presence of various gases in various devices, methods, or systems. For example, gases generated via degassing may be an indication of a hazardous condition. Thus, detecting the generated and / or released gases can be used to detect and / or prevent hazardous conditions.

[0043] Various embodiments of the present disclosure provide systems, devices, and methods for testing gas sensors. The testing can include calibrating and / or characterizing the gas sensor. For example, calibrating the sensor can include determining the output from the sensor in a controlled environment and / or adjusting various parameters of the sensor. Characterizing the sensor can include determining the output of the sensor under controlled conditions.

[0044] Various embodiments of the present disclosure test sensors configured to detect the presence of a gas of interest. In various embodiments, the gas of interest is generated from a substance of interest. The gas of interest can be generated from the substance of interest in liquid form for testing the gas sensor.

[0045] In an example implementation, the gas of interest (which may be simply referred to as gas) may include any gas from the carbonate gas family, such as including but not limited to propylene carbonate (PC), ethyl methyl carbonate (EMC), dimethyl carbonate (DMC), ethylene carbonate (EC), etc.

[0046] In one example, the gas of interest may be generated by a battery. The battery may encounter a condition known as thermal runaway, which may lead to fire and / or other hazardous conditions. Before thermal runaway occurs, the battery may enter an exhaust stage, during which gases such as PC are released from the battery. PC may be generated, for example, due to the degassing of the electrolyte from the battery when at an elevated temperature. A gas sensor may be used to detect PC during the exhaust stage and provide a warning and / or indication before thermal runaway occurs. Thus, in the case of using a battery (such as in an electric vehicle (EV)), the gas sensor contributes to battery and user safety.

[0047] The gas sensor may require a test setup to calibrate and / or characterize the gas sensor at various temperature and / or humidity levels. For example, the various temperature or humidity levels may be those to which the battery pack of an EV may be exposed. In various implementations, systems, devices, and methods are provided to expose the gas sensor to the gas of interest at various temperature and / or humidity levels in order to calibrate and / or characterize the sensor for various operating conditions.

[0048] The various implementations provided by the present disclosure may be applied to calibration and / or characterization setups for sensors used to detect any other gas such as gases generated by degassing. When used to determine thermal runaway of a battery, the various implementations of the present invention may be used for calibration and / or characterization setups of sensors configured to detect any carbonate gas family that may be generated by the battery. The various implementations of the present disclosure convert the gas of interest from a liquid form to a gas form for testing.

[0049] Now referring to Figure 1 , a schematic diagram showing a vaporization process is provided in accordance with the present disclosure. Many forms of gas that need to be detected may not be easily available in gas form due to factors such as their natural state, reactivity, transportation and storage considerations, and / or safety reasons. Thus, the gas of interest may be more easily available in liquid form and converted from the liquid form to its gas form. Converting a liquid to a gas may pose challenges. This conversion may involve a vaporization or evaporation process to separate the molecules in order to convert the liquid to a gas. For example, due to the above factors, PC gas is not easily available in gas form, and liquid PC can be converted into gas form PC.

[0050] Now referring to Figure 2, according to the present disclosure, there is provided a schematic diagram showing a metal box 208 and a thermal chamber 210. A gas sensor 212 can be used to determine the presence of a gas of interest (e.g., PC). To calibrate and / or characterize the gas sensor 212, it can be placed inside a metal box 208 configured to contain gas. The metal box 208 can have a metal box inlet 204 and a metal box outlet 206 for gas inflow and outflow. The gas sensor 212 can be exposed to the gas after the gas is converted from a liquid form to a gas form and transmitted into the metal box 208 via the metal box inlet 204.

[0051] When dealing with gases such as PC, it is beneficial to enclose the gas sensor 212 in a closed metal box 208 during testing because it may be flammable and breathing it may be harmful to health. The metal box 208 provides safety by preventing the release or diffusion of the gas, thus protecting against potential hazards.

[0052] Testing the sensor at various temperature and humidity levels is important for evaluating its performance and accuracy under different environmental conditions, thus ensuring its reliability and applicability for different operating environments. Even in a closed environment, the gas sensor 212 can be exposed to different temperatures by placing the metal box 208 inside a thermal chamber 210 and adjusting the temperature of the thermal chamber as needed for testing.

[0053] However, it may be challenging to maintain a specific humidity level inside the sealed metal box during testing because the housing can limit the moisture exchange between the internal and external environments.

[0054] Additionally, before starting to calibrate and / or characterize a new gas sensor or calibrating and / or characterizing the same gas sensor under different temperature and / or humidity conditions, it may be necessary to remove the gas of interest from the metal box to check how the gas sensor works in the absence of gas. This process can be referred to as purging. Among the various methods used, nitrogen gas (N2) can be used to purge the metal box to remove the gas. When both the metal box inlet 204 and the metal box outlet 206 are open, N2 can be transmitted into the metal box using the metal box inlet 204, flow through the metal box, and be transmitted out of the metal box through the metal box outlet 206.

[0055] However, the molecular weight of the gas of interest such as PC gas may be higher compared to the molecular weight of nitrogen gas. In this case, the gas tends to settle at the bottom of the metal box, while nitrogen gas will occupy the upper space. This reduces the efficiency of purging. Therefore, purging the metal box of the existing gas may be another challenge in calibrating and / or characterizing the gas sensor 212.

[0056] Now refer to Figure 3, a schematic diagram showing a liquid gas bubbler 310 is provided according to various methods used. The liquid gas bubbler 310 can be used to convert a gas of interest from its liquid form to its gas form before flowing into the metal cartridge 208.

[0057] However, the temperature inside the metal cartridge can be similar to the temperature inside the hot chamber 210 and higher than the temperature outside the hot chamber 210. The generally higher temperature increases the gas pressure; thus, the gas tends to move from the region of higher temperature to the region of lower temperature. Therefore, in this case, the normal flow of the gas can be from the metal cartridge to the liquid gas bubbler. For example, if the temperature of the metal cartridge is 60 °C and the temperature of the liquid gas bubbler 310 containing the gas in liquid form is 25 °C, it is challenging to make the gas flow from the liquid gas bubbler 310 to the metal cartridge 208. This may be because, due to the temperature difference, the pressure of the liquid gas in the liquid gas bubbler 310 may be lower than the gas pressure required to reach the metal cartridge 208.

[0058] Now referring to Figure 4A , a schematic diagram showing a sensor test system 400 according to various embodiments of the present disclosure is provided. The sensor test system 400 overcomes various challenges of testing gas sensors as described above.

[0059] In various embodiments, the sensor test system 400 includes a carrier gas container configured to contain a carrier gas. For example, the carrier gas container can be a dry nitrogen gas cylinder 406, which is a container that holds compressed nitrogen (N2). In various embodiments, the dry nitrogen gas cylinder 406 is moisture-free.

[0060] In various embodiments, the N2 generated by the dry nitrogen gas cylinder 406 can flow through a first flow controller 412. A flow controller can be a device configured to control and / or regulate the flow rate of the gas flowing through it. The first flow controller 412 can be configured to control and / or regulate the flow rate of N2 from the dry nitrogen gas cylinder 406 to the liquid gas bubbler 418. The liquid gas bubbler 418 can include the gas of interest in liquid form and convert it into the gas form to be detected by the gas sensor. Referring below to Figure 5 Further illustrate and describe the liquid gas bubbler.

[0061] In various embodiments, the sensor test system 400 includes a metal cartridge 420. In various embodiments, the metal cartridge 420 can be an airtight sealed metal cartridge 420. The metal cartridge 420 can encapsulate a gas sensor 422, a humidity sensor 424, and a temperature sensor 426.

[0062] In various embodiments, the gas sensor 422 is configured to sense the presence of a gas of interest. Maintaining the gas sensor 422 within the cartridge can isolate the gas sensor 422 from external influences and maintain a controlled test environment.

[0063] In various embodiments, 420 has three inlets and two outlets. In various embodiments, the inlets and outlets of the metal cartridge 420 can be combined into a single inlet and / or a single outlet. Various flow control and / or regulation devices can be used at the single inlet and / or single outlet of the metal cartridge 420.

[0064] The gas of interest flows from the liquid gas bubbler 418 to the metal cartridge 420 through the first inlet 432. The output of the liquid gas bubbler 418 can include a mixture of a carrier gas (e.g., N2) and the gas. By varying the N2 flow through the liquid gas bubbler 418, the amount of gas generated and delivered to the metal cartridge 420 changes. In various embodiments, using the first flow controller 412, the N2 flow through the liquid gas bubbler 418, the amount of gas generated and delivered to the metal cartridge 420, and thus the concentration of the gas in the metal cartridge 420 are determined. A generally continuous flow of the gas of interest can pass from the first inlet 432 through the metal cartridge 420 to the first outlet 440.

[0065] In various embodiments, at least the N2 flow set and / or controlled by the first flow controller 412 is used to maintain a generally constant concentration of the gas of interest in the metal cartridge 420. For example, by using the first flow controller 412 to increase the N2 flow, the concentration of the gas of interest in the metal cartridge 420 can be increased, and by using the first flow controller 412 to decrease the N2 flow, the concentration of the gas of interest in the metal cartridge 420 can be decreased. By using the first flow controller 412 to increase the flow rate of N2, a higher rate of the gas of interest can be generated in the liquid gas bubbler 418 and delivered to the metal cartridge 420, and the concentration of the gas in the metal cartridge 420 can be increased. By using the first flow controller 412 to decrease the flow rate of N2, a lower rate of the gas of interest can be generated in the liquid gas bubbler 418 and delivered to the metal cartridge 420, and the concentration of the gas in the metal cartridge 420 can be decreased.

[0066] In various embodiments, the concentration of the gas of interest in the metal cartridge 420 can alternatively and / or additionally be controlled using the third flow controller 410. In various embodiments, the third flow controller 410 can control the N2 flow directly to the metal cartridge 420 via the third inlet 434. Using the third flow controller 410 to increase the N2 flow to the metal cartridge 420 can decrease the concentration of the gas of interest in the metal cartridge 420, and using the third flow controller 410 to decrease the N2 flow to the metal cartridge 420 can increase the concentration of the gas of interest in the metal cartridge 420.

[0067] In various embodiments, there is a continuous flow of the gas of interest and / or N2 through the metal cartridge 420. The gas of interest and / or N2 flows into the metal cartridge 420 using the first inlet 432 or the third inlet 434 and flows out of the metal cartridge 420 through the first outlet 440 to the external environment. In various embodiments, a scrubber is used at the first outlet 440 to prevent any harmful materials from dissipating into the external environment.

[0068] In various embodiments, the sensor test system 400 includes a thermal chamber 414 that is configured to enclose the liquid gas bubbler 418 and the metal cartridge 420. The concentration and / or pressure of the gas of interest in the metal cartridge 420 can additionally or alternatively be controlled using the temperature set by the thermal chamber.

[0069] In various embodiments, by increasing the temperature, the pressure inside the metal cartridge 420 can be increased, which can result in more outflow of the gas of interest from the metal cartridge 420 and a decrease in the concentration of the gas of interest in the metal cartridge 420. Decreasing the temperature can reduce the pressure inside the metal cartridge 420, increase the inflow of the gas of interest into the metal cartridge 420, and increase the concentration of the gas of interest in the metal cartridge 420.

[0070] In various embodiments, the concentration of the gas of interest in the metal cartridge 420 can be fixed and / or dynamically determined using at least one of the methods described herein.

[0071] In various embodiments, a temperature sensor 426 and a humidity sensor 424 are also placed inside the metal cartridge to monitor the temperature and humidity. In various embodiments, the gas sensor 422 is calibrated and / or characterized under various temperature or humidity conditions to simulate the conditions under which the gas sensor 422 will be deployed and the gas of interest may be released and / or may need to be detected.

[0072] In various embodiments, the metal cartridge 420 is placed inside the thermal chamber 414. The thermal chamber 414 is configured to change and / or set the desired temperature inside. Since the metal cartridge 420 is thermally conductive, the temperature inside the metal cartridge 420 will be set using the thermal chamber 414.

[0073] In various embodiments, the thermal chamber 414 is used to determine the temperature at which the gas sensor 422 is tested in the metal cartridge 420. Certain desired temperatures or temperature ranges for testing the gas sensor 422 can be determined based on the various conditions in which the gas sensor 422 will be deployed. In various embodiments, when the temperature sensor 426 determines that the temperature inside the metal cartridge 420 is higher than the desired temperature, the thermal chamber 414 decreases the temperature inside the thermal chamber 414. When the temperature sensor 426 determines that the temperature inside the metal cartridge 420 is lower than the desired temperature, the thermal chamber 414 increases the temperature inside the thermal chamber 414.

[0074] In various embodiments, by placing the liquid gas bubbler 418 inside the thermal chamber 414, the liquid gas bubbler 418 is placed in an environment having the same temperature as the metal cartridge 420. Accordingly, the liquid gas bubbler 418 and the metal cartridge 420 may have substantially the same temperature.

[0075] In an exemplary embodiment, increasing the temperature of the liquid gas bubbler 418 may also facilitate evaporation of the gas of interest in liquid form and increase the gas concentration. In some examples, by having the liquid gas bubbler 418 and the metal cartridge 420 at approximately similar temperatures, the gas generated by the liquid gas bubbler 418 more readily flows to the metal cartridge 420. In an exemplary embodiment, a higher gas pressure is generated at the liquid gas bubbler 418. The higher gas pressure in combination with the flow of N2 further facilitates movement of the gas of interest to the metal cartridge 420.

[0076] In various embodiments, the sensor test system 400 includes a water bubbler 402 and a heater 404, which are configured to generate humidity for altering and / or setting the humidity inside the metal cartridge 420. Referring below to Figure 6 The water bubbler is further described.

[0077] In various embodiments, the water bubbler 402 generates water vapor. A second flow controller 408 controls the flow rate of the water vapor delivered to the metal cartridge 420. The second flow controller 408 may increase the flow rate of the water vapor to increase the humidity inside the metal cartridge 420. The second flow controller 408 may decrease the flow rate of the water vapor to decrease the humidity inside the metal cartridge 420. In various embodiments, the controlled water vapor generated by the water bubbler 402 and the second flow controller 408 is delivered to the metal cartridge 420 using a second inlet 436.

[0078] As previously described, in various embodiments, N2 generated by the dry nitrogen gas cylinder 406 also passes through a third flow controller 410 to generate a controlled flow of N2. The controlled flow of N2 is delivered to the metal cartridge 420 using a third inlet 434. By delivering more N2 to the metal cartridge 420, the humidity inside the metal cartridge 420 may be decreased.

[0079] In various embodiments, the humidity inside the metal box 420 is measured using the humidity sensor 424. To achieve a desired humidity inside the metal box 420, the flow rate of water vapor through the second inlet 436 and the flow rate of N2 through the third inlet 434 can be adjusted. For example, if the humidity sensor 424 indicates that the humidity inside the metal box 420 is higher than the desired humidity level, the second flow controller 408 can reduce the water vapor flow to the metal box 420 and / or the third flow controller 410 can increase the N2 flow to the metal box 420. For example, if the humidity sensor 424 indicates that the humidity inside the metal box 420 is lower than the desired humidity level, the second flow controller 408 can increase the water vapor flow to the metal box 420 and / or the third flow controller 410 can reduce the N2 flow to the metal box 420. In various embodiments, the water vapor and / or N2 also leave the metal box 420 via the first outlet 440.

[0080] In various embodiments, before starting to calibrate and / or characterize a new gas sensor or calibrating and / or characterizing the same gas sensor 422 under different temperature and / or humidity conditions, it is necessary to remove the gas from the metal box 420 to test and / or record how the second outlet 442 functions in the absence of the gas of interest in the metal box 420. In various embodiments, an N2 flow from a dry nitrogen gas cylinder 406 via the third inlet 434 is used to purge the gas of interest in the metal box 420. Under various conditions, the N2 flow from the third inlet 434 can remove some of the gas. However, the molecular weight of some gases (such as PC) is higher than that of N2 and the gas molecules can settle at the bottom of the metal box 420, while the N2 molecules can occupy the upper space of the metal box 420 and flow there. This may result in a reduced effectiveness of purging the gas using only N2.

[0081] In various embodiments, the sensor test system 400 includes a vacuum pump 428 mechanically coupled to the second outlet 442. The vacuum pump 428 can be a mechanical device for removing gas molecules from the metal box 420 by creating a vacuum or a low-pressure environment. The vacuum pump 428 can operate by reducing the pressure inside the metal box 420 below atmospheric pressure, so that molecules of various forms of the gas of interest or the substance of interest are expelled.

[0082] In various embodiments, considering the pressure of the gas of interest (such as PC) inside the metal box 420, the vacuum pump 428 is set to a desired vacuum level. For example, the pressure inside the vacuum can be set to a pressure lower than the pressure of the gas of interest inside the metal box 420. Then, the vacuum pump 428 creates a low-pressure environment inside the metal box 420, causing the gas to be suctioned towards the pump. The gas can then be released into the environment after being cleaned using a scrubber. In various embodiments, the vacuum pump 428 operates for a sufficient period of time until a desired level of purging has occurred.

[0083] During the purge of the metal cartridge 420, the flow of the gas of interest through the first inlet 432 is stopped. In various embodiments, the liquid gas bubbler 418 is deactivated during the purge of the gas of interest from the metal cartridge 420. The liquid gas bubbler 418 can be deactivated by stopping the N2 flow by the first flow controller 412. In various embodiments, during the purge of the metal cartridge 420, the flow of water vapor to the second inlet 436 can also be stopped, for example, by stopping the flow with the second flow controller 408 or by turning off the heater 404.

[0084] In an example embodiment, using the sensor test system 400 can allow the evaluation of the response time, stability, and / or various other characteristics of gas sensors to determine their various performances. The gas sensor characterization test can provide a controlled environment for calibrating gas sensors against known gas concentrations to ensure accurate and reliable measurements during operation. The gas sensor characterization test can also support R&D activities, enabling the study of gas sensor behavior under various conditions (such as various pressure, temperature, and / or humidity conditions) to improve the design and develop new technologies for detecting desired gases for various purposes (such as preventing thermal runaway in battery packs used in electric vehicles, etc.).

[0085] In an example embodiment, the sensor test system 400 can be used for quality control. For example, the gas sensor characterization test can assist in polymer sensor quality control by identifying defective gas sensors and ensuring that only those gas sensors that meet the performance criteria are released and / or installed.

[0086] In various embodiments, the test system is used to test the ability of one or more gas sensors to sense the presence of the gas of interest or to calibrate and / or characterize the one or more sensors for sensing the gas of interest.

[0087] Now refer to Figure 4B , a schematic diagram is provided showing various aspects of a sensor test system in accordance with various embodiments of the present disclosure.

[0088] When the gas of interest enters the metal cartridge 420, due to the weight of the gas of interest, it may settle in the lower part of the metal cartridge. In various embodiments, a gas channel can direct the gas of interest to the gas sensor in the metal cartridge. In various embodiments, the gas channel can be, for example, a nozzle, a funnel, a tube, etc.

[0089] In various embodiments, the metal cartridge includes one or more gas sensors. For example, the metal cartridge may include gas sensors 422A through gas sensors 422N. In various embodiments, any integer number of gas sensors may be used. In various embodiments, one or more gas channels are used to direct a gas of interest to one or more gas sensors in the metal cartridge.

[0090] In various embodiments, a single gas channel may direct a gas of interest to one or more gas sensors. In various embodiments, corresponding gas channels may direct a gas of interest to each of the gas sensors. For example, gas channel 421A may direct a gas of interest to first gas sensor 422A, and gas channel 421N may direct a gas of interest to gas sensor 422N. In various embodiments, N is an integer greater than or equal to 1. In various embodiments, metal cartridge 420 includes N gas sensors and N corresponding gas channels. Each gas channel may direct a gas of interest to one or more corresponding gas sensors or to its vicinity. In various embodiments, each gas channel directs a gas of interest to a corresponding region in the metal cartridge, where one or more gas sensors may be placed.

[0091] In various embodiments, when using a test system to test the ability of a gas sensor to determine the presence of a gas of interest or to calibrate the sensor, depending on the location of the sensor in the metal cartridge, the gas of interest may reach the gas sensor at various times or with various time delays. Testing a gas sensor may include determining the time delay of the sensor when detecting a gas of interest. To eliminate the delay in reaching the gas of interest from when the gas of interest enters the metal cartridge to when it reaches the gas sensor, various embodiments use one or more gas channels such that the gas of interest reaches all sensors at nearly similar times and with a low time delay.

[0092] In various embodiments, when the gas of interest exits the hot chamber toward vacuum pump 428, it may pass through condensation trap 445. Condensation trap 445 may be configured to condense some or all of the gas of interest exiting the hot chamber into a liquid form of the gas of interest before it reaches vacuum pump 428. After the gas of interest is condensed into a liquid form, it may be directed back to the liquid bubble for reuse. Doing so may remove or reduce the amount of the gas of interest reaching vacuum pump 428 or being released to the environment.

[0093] In various embodiments, due to the temperature difference between the hot chamber and the external environment, condensation of the gas of interest in the condensation trap 445 can occur. For example, the condensation trap can include an ambient condenser 441 that is configured to use the ambient temperature to condense the gas of interest. The ambient condenser 441 can include channels at ambient temperature, such as tubes, gas passages, and the like.

[0094] In various embodiments, the condensation trap 445 can include an active condenser 443. In various embodiments, the active condenser uses active cooling techniques to condense the gas of interest as it exits the hot chamber. For example, the active condenser 443 can use one or more channels or tubes to pass water or coolant having a temperature below the condensation temperature of the gas of interest over the gas of interest.

[0095] In various embodiments, the condensation trap can include or use either the ambient condenser 441 or the active condenser 443 to condense the gas of interest. In various embodiments, the condensation trap can include or use both the ambient condenser 441 and the active condenser 443 to condense the gas of interest. In various embodiments, after using the condensation trap 445 to generate a liquid form of the gas of interest, it is transferred to a cryogenic gas bubbler using a cryogenic gas channel 447. In various embodiments, a pump can be used to move the gas of interest in liquid form to the gas bubbler 418. After the gas of interest in liquid form is transferred to the gas bubbler, it can be converted back into a gas form and directed to a metal cell for reuse in testing, calibrating, and / or characterizing a gas sensor.

[0096] In various embodiments, the condensation trap 445 transfers the carrier gas and / or water vapor to a vacuum pump. In various embodiments, by creating a low pressure, the vacuum pump facilitates the flow of the gas of interest, the carrier gas, and / or the water vapor out of the metal chamber through the second outlet 442, although some and / or all of the gas of interest can be converted into a liquid form of the gas of interest and directed to the gas bubbler using the liquid channel 447 and not reach the vacuum pump.

[0097] Now referring to Figure 5 , there is provided a schematic diagram showing a cryogenic gas bubbler 500 in accordance with various embodiments of the present disclosure. In various embodiments, the cryogenic gas bubbler 500 can include a cryogenic gas bubbler inlet 504 through which a carrier gas (e.g., N2) enters. In various embodiments, the carrier gas can be any other inert gas such as N2, which can then pass through a cap 508 to break large bubbles into smaller bubbles in a container 510 holding the substance of interest in liquid form (such as liquid PC). In various embodiments, the cap 508 is a sintered tube. When N2 passes through the gas in liquid form, bubbles are formed, and the substance of interest is released in gas form to generate the gas of interest even at temperatures below its boiling point.

[0098] In an example embodiment, the use of the cap 508 increases the liquid-N2 interface area and facilitates the conversion of liquid molecules into the gaseous form. N2 can also pick up gas molecules from the liquid surface and carry them away through the cryogenic bubbler outlet 506, causing the liquid to evaporate into a gas. In various embodiments, placing the cryogenic bubbler 500 in the hot chamber 414 and increasing its temperature further facilitates the conversion of the substance of interest in liquid form into its gaseous form.

[0099] Now referring to Figure 6 , a schematic diagram showing a water bubbler 604 and a heater 606 in accordance with various embodiments of the present disclosure is provided. In various embodiments, the water bubbler 604 includes a coin 608 immersed in water. The heater 606 can be a magnetic heater and / or an induction heater. The heater 606 can heat the water and convert it into steam. The magnetic heater 606 can cause the coin 608 to rotate at a high speed, thereby generating steam that exits through the outlet 610. The heater 606 can cause the coin 608 to rotate at a high speed and can increase its temperature to convert the water into steam at a high rate. The steam exits at the outlet 610, and its flow is controlled using the second flow controller 408 before it enters the metal box 420 via the second inlet 436.

[0100] Now referring to Figure 7 , a schematic diagram of an example controller 700 of an example device that depicts an example device in electronic communication with various other components in accordance with various embodiments of the present disclosure is provided. For example, referring to Figure 4A , as described herein, the controller 700 can be in electronic communication with and / or control any component of the sensor test system 400 (such as at least one of the second flow controller 408, the third flow controller 410, and / or the first flow controller 412, the heater 404, the temperature sensor 426, the humidity sensor 424, the gas sensor 422, and / or the vacuum pump 428). As shown, the controller 700 includes a processing circuit 702, a communication module 708, an input / output module 706, a memory 704, and / or other components configured to perform various operations, programs, functions, etc. described herein.

[0101] The processing circuit 702 may be implemented as, for example, various devices, including one or more microprocessors with an accompanying digital signal processor; one or more processors without an accompanying digital signal processor; one or more coprocessors; one or more multi-core processors; one or more controllers; a processing circuit; one or more computers; and various other processing elements (including integrated circuits such as ASICs or FPGAs or specific combinations thereof). In some embodiments, the processing circuit 702 may include one or more processors. In one exemplary embodiment, the processing circuit 702 is configured to execute instructions stored in the memory 504 or otherwise accessible to the processing circuit 702. When executed by the processing circuit 502, these instructions may enable the controller 700 to perform one or more functions as described herein. Whether the processing circuit 702 is configured by a hardware approach, a firmware / software approach, or a combination thereof, the processing circuit may include an entity that, when configured accordingly, is capable of performing operations in accordance with embodiments of the present invention. Thus, for example, when the processing circuit 702 is implemented as an ASIC, FPGA, etc., the processing circuit 702 may include specially configured hardware for implementing one or more of the operations described herein. Alternatively, for example, when the processing circuit 702 is implemented as an actuator for instructions (such as those that may be stored in the memory 704), these instructions may specifically configure the processing circuit 702 to perform one or more of the methods, algorithms, and operations described herein, such as those discussed with reference to any of the figures herein.

[0102] The memory 704 may include, for example, volatile memory, non-volatile memory, or a specific combination thereof. Although shown as a single memory in Figure 7 , the memory 704 may include multiple memory components. In various embodiments, the memory 704 may include, for example, a hard disk drive, random access memory, cache memory, flash memory, compact disc read-only memory (CD-ROM), digital versatile disc read-only memory (DVD-ROM), optical discs, circuits configured to store information, or some combination thereof. The memory 704 may be configured to store information, data, applications, instructions, etc., such that the controller 700 can perform various functions in accordance with embodiments of the present disclosure. For example, in at least some embodiments, the memory 704 is configured to cache input data for processing by the processing circuit 702. Additionally or alternatively, in at least some embodiments, the memory 704 is configured to store program instructions for execution by the processing circuit 702. The memory 704 may store information in the form of static and / or dynamic information. When performing functions, the stored information may be stored and / or used by the controller 700.

[0103] The communication module 708 can be implemented as any device included in a circuit, hardware, computer program product, or a combination thereof, configured to: receive data from and / or transmit data to another component or device. The computer program product includes computer-readable program instructions stored on a computer-readable medium (e.g., memory 704) and executed by a controller 700 (e.g., processing circuit 702). In some embodiments, the communication module 708 (like other components discussed herein) can be at least partially implemented as the processing circuit 702 or otherwise controlled by the processing circuit 702. In this regard, the communication module 708 can communicate with the processing circuit 702, for example, via a bus. The communication module 708 can include, for example, an antenna, a transmitter, a receiver, a transceiver, a network interface card, and / or supporting hardware and / or firmware / software, and is used to establish communication with another device. The communication module 708 can be configured to: receive and / or transmit any data that can be stored by the memory 704 by using any protocol that can be used for communication between devices. The communication module 708 can additionally or alternatively communicate with the memory 704, the input / output module 706, and / or any other components of the controller 700, for example, via a bus.

[0104] In some embodiments, the controller 700 can include an input / output module 706. The input / output module 706 can communicate with the processing circuit 702 to receive instructions input by a user and / or provide an auditory, visual, mechanical, or other output to the user. Thus, the input / output module 706 can communicate electronically with support devices such as a keyboard, a mouse, a display, a touchscreen display, and / or other input / output mechanisms. Alternatively, at least some aspects of the input / output module 706 can be implemented on a device used by the user to communicate with the controller 700. The input / output module 706 can communicate with the memory 704, the communication module 708, and / or any other components, for example, via a bus. One or more input / output modules and / or other components can be included in the controller 700.

[0105] Now refer to Figure 8 , a flowchart showing an example method 800 according to various embodiments of the present disclosure is provided. Referring to Figure 7 , in some examples, the various steps of the method 800 can be performed by a control system such as a control system using the controller 700. Referring to the reference Figure 4A , Figure 4B , Figure 5 or Figure 6 the sensor test system 400 described to describe the various aspects of the method.

[0106] In various embodiments, at block 802, method 800 uses a liquid gas bubbler 418 to generate a gas of interest from the gas of interest in liquid form. For example, a liquid gas bubbler as referenced Figure 4A , Figure 4B and Figure 5 can be used to form PC gas from liquid PC.

[0107] In various embodiments, at block 804, method 800 uses a first flow controller 412 to control the flow rate of a carrier gas (e.g., N2) to the liquid gas bubbler 418. The flow of the carrier gas to the liquid gas bubbler 418 can determine the flow rate of the generated gas of interest. For example, by increasing the N2 flow to the liquid gas bubbler 418, a higher flow rate of the gas of interest to the metal cartridge 420 is generated.

[0108] In various embodiments, at block 806, method 800 flows the gas of interest through a first inlet 432 of the metal cartridge 420. The metal cartridge 420 can be configured to enclose a gas sensor 422. The gas sensor 422 can be configured to sense the presence of the gas of interest in the metal cartridge 420.

[0109] In various embodiments, at block 808, method 800 uses a thermal chamber 414 to adjust the temperature of the liquid gas bubbler 418 to be substantially the same as the temperature of the metal cartridge 420. In various embodiments, the thermal chamber 414 is configured to enclose the liquid gas bubbler 418 and the metal cartridge 420.

[0110] In various embodiments, method 800 can flow the carrier gas through a second inlet 436 of the metal cartridge 420 into the metal cartridge. Method 800 can control the flow rate of the carrier gas to the metal cartridge 420 via a second flow controller 408. In various embodiments, the second flow controller 408 is placed between a carrier gas container (such as a dry nitrogen gas cylinder 406) and the metal cartridge 420.

[0111] In various embodiments, method 800 controls the concentration of the gas of interest in the metal cartridge 420 by using the first flow controller 412 to control the flow rate of the gas of interest to the metal cartridge and using the second flow controller 408 to control the flow rate of the carrier gas to the metal cartridge.

[0112] In various embodiments, method 800 uses a water bubbler 402 to generate water vapor, flows the water vapor into the metal cartridge through a third inlet 434 of the metal cartridge, and uses a third flow controller 410 to control the flow rate of the water vapor to the metal cartridge 420. In various embodiments, the third flow controller is placed between the water bubbler and the metal cartridge.

[0113] In various embodiments, method 800 uses a magnetic heater to heat metal coins in water contained in a water bubbler. In various embodiments, method 800 uses the heated metal coins to heat the water in the water bubbler. In various embodiments, method 800 rotates the metal coins in the water contained in the water bubbler to generate water vapor using the magnetic heater.

[0114] In various embodiments, method 800 controls the humidity inside the metal cartridge by using a second flow controller to control the flow rate of the carrier gas to the metal cartridge and using a third flow controller to control the flow rate of the water vapor to the metal cartridge.

[0115] In various embodiments, method 800 uses a humidity sensor in the metal cartridge to measure the humidity inside the metal cartridge, and uses the measured humidity inside the metal cartridge to control the humidity inside the metal cartridge to a desired humidity level. For example, if the measured humidity is below the desired level, method 800 increases the humidity in metal cartridge 420, and if the humidity is below the desired level, method 800 decreases the humidity inside metal cartridge 420.

[0116] In various embodiments, method 800 uses a temperature sensor in the metal cartridge to measure the temperature inside the metal cartridge, and uses the measured temperature inside the metal cartridge to control the temperature inside the metal cartridge to a desired temperature level.

[0117] Referring to Figure 4A 、 Figure 4B 、 Figure 5 、 Figure 6 、 Figure 7 In various embodiments, a method uses a liquid gas bubbler 418 and a carrier gas to convert a substance of interest from a liquid form to a gas form. The method can flow the substance of interest in gas form through a first inlet 432 of a metal cartridge 420 into the metal cartridge 420. In various embodiments, the method can change the humidity level inside the metal cartridge 420 by flowing water vapor generated by a water bubbler 402 into the metal cartridge 420 through a second inlet 436 of the metal cartridge 420.

[0118] In various embodiments, the method can flow the carrier gas directly into the metal cartridge 420 through a third inlet 434 of the metal cartridge 420. As described herein, the method can control the flow rate of the substance of interest in gas form, the flow rate of the water vapor, and the flow rate of the carrier gas to the metal cartridge 208. In various embodiments, the method can use a thermal chamber 414 enclosing the liquid gas bubbler 418 and the metal cartridge 420 to control the temperature of the liquid gas bubbler 418 and the metal cartridge 420. In various embodiments, the method can purge the substance of interest from the metal cartridge 420 using the carrier gas and a vacuum pump.

[0119] Many modifications and other embodiments of the present disclosure set forth herein will come to mind to those skilled in the art of the field to which these embodiments pertain after benefiting from the foregoing description and the teachings presented in the related drawings. Accordingly, it is to be understood that the present disclosure is not limited to the specific embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. In addition, although the example embodiments have been described above in the context of certain example combinations of elements and / or functions, it should be understood that different combinations of elements and / or functions can be provided by alternative embodiments without departing from the scope of the appended claims. In this regard, for example, combinations of elements and / or functions different from those explicitly described above can also be contemplated, as may be set forth in some of the appended claims. Although specific terms are employed herein, they are used only in a general and descriptive sense and not for purposes of limitation.

Claims

1. A sensor testing system, the sensor testing system comprising: A metal box, the metal box including a first inlet, wherein the metal box is configured to encapsulate a gas sensor, and the gas sensor is configured to sense the presence of a gas of interest; A liquid gas bubbler, the liquid gas bubbler being configured to receive a carrier gas and generate the gas of interest from the gas of interest in liquid form using the carrier gas; A first flow controller, the first flow controller being configured to control the flow rate of the carrier gas to the liquid gas bubbler and the flow rate of the gas of interest from the liquid gas bubbler to the first inlet of the metal box; And A thermal chamber, the thermal chamber being configured to encapsulate the liquid gas bubbler and the metal box, and being configured to set the temperature inside the thermal chamber to a desired temperature.

2. The sensor testing system according to claim 1, the sensor testing system further comprising: A gas channel, the gas channel being configured to direct the gas of interest from the first inlet of the metal box to the gas sensor; A carrier gas container, the carrier gas container being configured to: Provide the carrier gas to the liquid gas bubbler, wherein the first flow controller is placed between the carrier gas container and the liquid gas bubbler; and Provide carrier gas to the metal box through a second inlet of the metal box; And A second flow controller, the second flow controller being placed between the carrier gas container and the second inlet of the metal box, and being configured to control the flow rate of the carrier gas to the metal box.

3. The sensor testing system according to claim 2, the sensor testing system further comprising: A water bubbler, the water bubbler being configured to provide water vapor to the metal box through a third inlet of the metal box; And A third flow controller, the third flow controller being placed between the water bubbler and the third inlet, and being configured to control the flow rate of the water vapor to the metal box.

4. The sensor testing system according to claim 3, the sensor testing system further comprising a heater, the heater being configured to increase the temperature of the water in the water bubbler and facilitate the generation of the water vapor.

5. The sensor testing system according to claim 4, wherein: The water bubbler includes a metal coin, the metal coin being configured to rotate at a high speed and cause the water to vaporize; and The heater is a magnetic heater, and is configured to cause the coin to rotate and increase the temperature of the coin to facilitate the generation of the water vapor.

6. The sensor testing system according to claim 3, the sensor testing system further comprising: A vacuum pump, the vacuum pump being coupled to a second outlet of the metal box, wherein the vacuum pump is configured to purge the gas of interest from the metal box in combination with the flow of the carrier gas through the metal box; And A condensation trap, the condensation trap including an ambient condenser or an active condenser, wherein the condensation trap is coupled to the second outlet of the metal box and is placed outside the hot chamber, and is configured to convert the gas of interest into the gas of interest in the liquid form; and A liquid gas channel, the liquid gas channel being coupled to the condensation trap and the liquid gas bubbler, the liquid gas channel being configured to direct the gas of interest in the liquid form to the gas bubbler.

7. A method for testing a gas sensor, the method comprising: Generating the gas of interest from the gas of interest in the liquid form using a liquid gas bubbler; Controlling the flow rate of the carrier gas to the liquid gas bubbler using a first flow controller, wherein the flow of the carrier gas to the liquid gas bubbler determines the flow rate of the generated gas of interest; Flowing the gas of interest through a first inlet of a metal box, the metal box being configured to enclose the gas sensor, wherein the gas sensor is configured to sense the presence of the gas of interest; and Adjusting the temperature of the liquid gas bubbler to be substantially the same as the temperature of the metal box using a hot chamber.

8. The method according to claim 7, the method further comprising: Converting the gas of interest into the gas of interest in the liquid form using a condensation trap including an ambient condenser or an active condenser placed outside the hot chamber; and Directing the gas of interest in the liquid form to the gas bubbler using a liquid channel coupled to the condensation trap and the liquid gas bubbler, wherein the hot chamber is configured to enclose the liquid gas bubbler and the metal box.

9. The method according to claim 8, the method further comprising: Generating water vapor using a water bubbler; Flowing the water vapor through a third inlet of the metal box; Controlling the flow rate of the water vapor using a third flow controller, wherein the third flow controller is placed between the water bubbler and the metal box; Heating a metal coin in the water contained in the water bubbler using a magnetic heater; Heating the water in the water bubbler using the metal coin; and Rotating the metal coin in the water contained in the water bubbler using the magnetic heater to generate water vapor.

10. A method, the method comprising: Converting a substance of interest from a liquid form to a gas form using a liquid gas bubbler and a carrier gas; Flowing the substance of interest in the gas form through a first inlet of a metal box; Changing the humidity level inside the metal box by flowing water vapor generated by a water bubbler through a second inlet of the metal box; Flowing the carrier gas directly into the metal box using a third inlet of the metal box; Controlling the flow rates of the substance of interest in the gas form, the water vapor, and the carrier gas to the metal box; Controlling the temperatures of the liquid gas bubbler and the metal box using a hot chamber enclosing the liquid gas bubbler and the metal box; and Purge the substance of interest from the metal cartridge using the carrier gas and the vacuum pump.

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