Gluing developing machine

Abstract

The invention relates to the technical field of wafer processing equipment processing, in particular to a gluing developing machine which comprises a carrying mechanical arm used for conveying wafers; the containing tool is used for containing photoresist, and the opening and closing mechanism is arranged at the top of the containing tool and can control the opening state of the top of the containing tool; the opening and closing mechanism comprises an opening and closing component arranged at the top end of the containing tool in a sliding mode and a transmission lantern ring movably arranged outside the containing tool in a sleeving mode. When the carrying mechanical arm drives the wafer to penetrate through the transmission lantern ring to move into the containing tool, the transmission lantern ring can be extruded to move downwards, and then the opening and closing component is driven to be opened towards the peripheral side of the containing tool to open the top end of the containing tool, so that dipping of the wafer on photoresist is achieved; after the wafer is dipped in the photoresist and centrifugally coated, the carrying mechanical arm drives the wafer to be separated from the container, and the opening and closing part can be reset to close the container again, so that the container is in a closed state in a non-working state, and the influence on the coating quality caused by volatilization of a solvent in the photoresist is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, and particularly to a spin coater and developer. Background Art

[0002] A spin coater and developer generally consists of a transmission system, a spin coating system, a heating system, a developing system, etc., integrating functions of photoresist coating, heating and drying, and developing, and performing automated spin coating and developing processes on wafers in batches. Traditional wafer spin coating uses an upright drop coating and static spin coating process, which has problems such as difficulty in recovering the centrifugally ejected photoresist.

[0003] For example, the patent with the publication number CN116943983B discloses a wafer spin coating device and method, including a container, a material taking part, a power part, and a heating part. The container is used for holding photoresist, the material taking part is used for fixing the wafer, the heating part is arranged on the material taking part and is used for heating the wafer. The material taking part is arranged above the container, and the power part is connected to the material taking part and is used for driving the material taking part to move up and down so that the wafer contacts and separates from the photoresist. The power part is also used for driving the material taking part to rotate around the central axis of the wafer. It can throw the excess photoresist into the container and improve the utilization rate of the photoresist.

[0004] In the prior art of the above patent, the wafer is driven into the container in an inverted manner by the power part to dip the photoresist, and centrifugal coating is completed in the container, which can realize convenient recovery of the photoresist. However, the container is in an open state all the time, and the solvent in the photoresist will volatilize to the outside, resulting in an increase in the viscosity of the photoresist and affecting the subsequent coating effect. Therefore, there is an urgent need for a spin coater and developer to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a spin coater and developer to solve the above deficiencies in the prior art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A spin coater and developer, including a handling robotic arm for transporting wafers; a container for holding photoresist, and further including an opening and closing mechanism arranged at the top of the container to control the open state of the top of the container;

[0007] The opening and closing mechanism includes an opening and closing component slidably arranged at the top end of the container and a transmission collar movably sleeved outside the container, and the transmission collar is in transmission connection with the opening and closing component;

[0008] When the handling robotic arm drives the wafer to move through the middle of the transmission collar and into the interior of the container, it can squeeze the transmission collar downward. During the downward movement of the transmission collar, it can push the opening and closing component outward to the outside of the container, opening the top of the container. When the handling robotic arm drives the wafer away from the wafer, the opening and closing component can reset to close the top of the container again.

[0009] Preferably, an adsorption and rotation mechanism is provided at the execution end of the handling robotic arm for adsorbing the wafer and driving the wafer to rotate with its central axis as the rotation center.

[0010] Preferably, the adsorption and rotation mechanism includes a gas guiding rod rotatably installed at the execution end of the handling robotic arm. A vacuum chuck is fixedly connected to the bottom end of the gas guiding rod for adsorbing the wafer, and a rotary joint is fixedly connected to the top end of the gas guiding rod.

[0011] Preferably, the adsorption and rotation mechanism further includes a servo motor fixedly installed at the execution end of the handling robotic arm for providing power for the rotation of the gas guiding rod.

[0012] Preferably, the opening and closing components can completely cover the top of the container after combination. The opening and closing component includes an opening and closing plate. The part of the opening and closing plate that cooperates with the top of the container is fan-shaped. A tension spring is provided at one end of the opening and closing plate close to the peripheral side of the container for driving the opening and closing plate to reset.

[0013] Preferably, the opening and closing mechanism further includes a transmission arm disposed between the opening and closing component and the transmission collar. The transmission collar drives the opening and closing component to move outward to the outside of the container through the transmission arm.

[0014] Preferably, a blowing mechanism is provided on the container, which is in transmission connection with the transmission collar. When the transmission collar moves downward, it can drive the blowing mechanism to act, blowing the photoresist in the central area inside the container to form a raised blowing part.

[0015] Preferably, the blowing mechanism includes a piston rod and a blowing pipe. The blowing pipe is fixedly installed on the container, and one end of the blowing pipe extends to the central area inside the container, and the other end extends to the outside of the container. The piston rod is fixedly installed on the transmission collar and is inserted into the part of the blowing pipe located outside the container.

[0016] Preferably, a lifting and blowing head is movably sleeved at one end of the blowing pipe located inside the container, and the outlet of the lifting and blowing head is a tapered mouth that gradually shrinks. When the piston rod moves downward inside the blowing pipe and pushes the photoresist to flow inside the blowing pipe, the photoresist discharged along the outlet of the blowing pipe can push the lifting and blowing head upward.

[0017] Preferably, an isolation ring is provided on the circumferential side of the lifting and blowing head. When the wafer dips the photoresist, the isolation ring can move upward under the drive of the lifting and blowing head and abut against the bottom of the wafer.

[0018] In the above technical solution, the beneficial effects of the present invention are as follows: when the handling robotic arm drives the wafer to move through the transmission collar and into the container, the transmission collar can be squeezed to move downward, thereby driving the opening and closing component to open towards the circumferential side of the container, opening the top of the container to achieve the dipping of the wafer into the photoresist; when the wafer finishes dipping the photoresist and centrifugal coating, the handling robotic arm drives the wafer to leave the container, and the opening and closing component can reset to close the container again, ensuring that the container is in a closed state when not in use, thus avoiding the influence of the solvent volatilization in the photoresist on the coating quality; in addition, after the wafer dips the photoresist and is centrifugally coated completely in the container, the excess photoresist can be directly thrown into the container for recovery, improving the utilization rate of the photoresist.

[0019] It should be understood that the foregoing general description and the following detailed description are merely exemplary and explanatory and are not intended to limit the present disclosure.

[0020] This application document provides an overview of various implementations or examples of the technologies described in the present disclosure, and is not a complete disclosure of the entire scope or all features of the disclosed technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings.

[0022] Figure 1 Structural schematic diagram of the overall combination of the present invention;

[0023] Figure 2 Structural schematic diagram of the overall adsorption and rotation mechanism of the present invention;

[0024] Figure 3 Structural schematic diagram of the cross-section of the opening and closing mechanism of the present invention;

[0025] Figure 4 Structural schematic diagram of the installation of the opening and closing component on the top of the container of the present invention;

[0026] Figure 5 Structural schematic diagram of the overall opening and closing component of the present invention;

[0027] Figure 6 Structural schematic diagram of the transmission collar of the present invention;

[0028] Figure 7Schematic structural diagram when the air-blowing mechanism of the present invention is working;

[0029] Figure 8 Schematic structural diagram of the air-blowing part of the present invention in cooperation with a wafer;

[0030] Figure 9 Schematic structural diagram of the combined air-blowing pipe, lifting air-blowing head and isolation ring of the present invention

[0031] Figure 10 Schematic top view structural diagram of the air-blowing part of the present invention.

[0032] Explanation of reference numerals in the drawings:

[0033] In the figure: 1, a carrying frame; 2, a handling robotic arm;

[0034] 3, an adsorption and rotation mechanism; 31, a gas guide rod; 32, a vacuum chuck; 33, a rotary joint; 34, a servo motor; 35, a synchronous transmission gear; 36, a synchronous transmission belt;

[0035] 4, a container;

[0036] 5, an opening and closing mechanism; 51, an opening and closing component; 511, an opening and closing plate; 512, a tension spring; 513, a guiding chute; 514, a guiding slide rail; 52, a transmission collar; 53, a transmission arm; 54, a pressing plate; 55, a clearance groove;

[0037] 6, an air-blowing mechanism; 61, a piston rod; 62, an air-blowing pipe; 63, a lifting air-blowing head; 64, an isolation ring; 65, a connecting arm; 66, an air-blowing part;

[0038] 7, a wafer; 8, a solenoid valve; 9, a liquid level sensor. Detailed implementation manners

[0039] To make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0040] Please refer to Figure 1-10 , an embodiment of the present invention provides a technical solution: a spin coater and developer, including a handling robotic arm 2 for transporting a wafer 7; a container 4 for containing photoresist;

[0041] The glue coating and developing machine of the present application further includes a carrying frame 1. A handling robotic arm 2 is fixedly installed on one side of the carrying frame 1, and a container 4 is fixedly installed on the other side of the carrying frame 1. The handling robotic arm 2 is a prior art device that can drive the wafer 7 for horizontal handling and vertical lifting. At the same time, a rotating assembly can be added to the execution end of the handling robotic arm 2 as needed to drive the wafer 7 to perform a 180° reverse rotation.

[0042] It further includes an opening and closing mechanism 5, which is arranged at the top of the container 4 and can control the open state of the top of the container 4.

[0043] The opening and closing mechanism 5 includes an opening and closing component 51 slidably arranged at the top end of the container 4 and a transmission collar 52 movably sleeved outside the container 4. The transmission collar 52 is in transmission connection with the opening and closing component 51.

[0044] When the handling robotic arm 2 drives the wafer 7 to move through the middle of the transmission collar 52 and into the container 4, it can squeeze the transmission collar 52 to move downward. During the downward movement of the transmission collar 52, it can push the opening and closing component 51 to move outward from the container 4, opening the top of the container 4. When the handling robotic arm 2 drives the wafer 7 to leave the wafer 7, the opening and closing component 51 can reset to close the top of the container 4 again.

[0045] Specifically, under the control of the prior art control system, the handling robotic arm 2 adsorbs the wafer 7 supplied in place by the prior art feeding mechanism, and under the control of the control system, transports the wafer 7 to the top position of the opening and closing mechanism 5. After the wafer 7 arrives, it is on the central axis of the transmission collar 52. The handling robotic arm 2 continues to drive the wafer 7 to move downward into the container 4 under the control of the control system. The height at which the handling robotic arm 2 drives the wafer 7 to move downward is always controlled by the control system to be in a constant state. When the handling robotic arm 2 drives the wafer 7 to move downward into the container 4, it simultaneously squeezes the transmission collar 52 to move downward. The transmission collar 52 drives the opening and closing component 51 to move outward from the container 4, opening the top of the container 4 to provide a passage for the wafer 7 to enter the container 4. When the wafer 7 completes glue dipping and centrifugal coating in the container 4, the handling robotic arm 2 drives the wafer 7 to leave the container 4, and the handling robotic arm 2 directly transports the coated wafer 7 to the subsequent processing procedure. When the wafer 7 leaves the container 4, the handling robotic arm 2 simultaneously releases the downward pressure on the transmission collar 52, and the opening and closing component 51 resets to close again, sealing the top of the container 4 to prevent the solvent in the photoresist from volatilizing.

[0046] Compared with the prior art, when the handling robotic arm 2 drives the wafer 7 to move through the transmission collar 52 into the carrier 4, the transmission collar 52 can be squeezed to move downward, thereby driving the opening and closing component 51 to open towards the periphery of the carrier 4, opening the top of the carrier 4 to achieve dipping of the wafer 7 in the photoresist; when the wafer 7 finishes dipping the photoresist and centrifugal coating, the handling robotic arm 2 drives the wafer 7 to leave the carrier 4, and the opening and closing component 51 can reset to close the carrier 4 again, ensuring that the carrier 4 is in a closed state during the non-working state, thus avoiding the influence of solvent volatilization in the photoresist on the coating quality; in addition, after the wafer 7 dips the photoresist and completes centrifugal coating in the carrier 4, the excess photoresist can be directly thrown into the carrier 4 for recovery, improving the utilization rate of the photoresist.

[0047] This application's coating and developing machine further includes a liquid level sensor 9 fixedly installed inside the carrier 4 and a solenoid valve 8 fixedly installed at the bottom end of the carrier 4. Since the photoresist inside the carrier 4 is in a continuous consumption state during the coating of the wafer 7, during the intermittent period between two working cycles of the wafer 7 coating operation, the liquid level sensor 9 detects the liquid level of the photoresist inside the carrier 4, and the solenoid valve 8 is controlled through the control system in the prior art. The photoresist can be added to the carrier 4 through the glue supply component in the prior art; the solenoid valve 8 and the liquid level sensor 9 are common prior arts currently.

[0048] In an embodiment provided by the present invention, an adsorption and rotation mechanism 3 is provided at the execution end of the handling robotic arm 2, which is used to adsorb the wafer 7 and drive the wafer 7 to rotate around its central axis. Specifically, after the adsorption and rotation mechanism 3 completes the adsorption of the wafer 7 and the handling robotic arm 2 transports the wafer 7 to the carrier 4 in place, the adsorption and rotation mechanism 3 can drive the wafer 7 to rotate to perform centrifugal coating of the photoresist on the bottom of the wafer 7.

[0049] In an embodiment provided by the present invention, the adsorption and rotation mechanism 3 includes a gas guiding rod 31, which is rotatably installed at the execution end of the handling robotic arm 2. The bottom end of the gas guiding rod 31 is fixedly communicated with a vacuum chuck 32 for adsorbing the wafer 7, and the top end of the gas guiding rod 31 is fixedly connected with a rotary joint 33. Specifically, the gas guiding rod 31 is rotatably installed at the execution end of the handling robotic arm 2 through a bearing, which can realize the communication between the vacuum chuck 32 and the rotary joint 33. The rotary joint 33 is communicated with the gas supply system in the prior art, and under the control of the control system, the working state of the vacuum chuck 32 can be controlled, thereby realizing the adsorption or release of the vacuum chuck 32 to the wafer 7; at the same time, the gas guiding rod 31 can rotate at the execution end of the handling robotic arm 2, thereby driving the wafer 7 to perform centrifugal coating. And a rotary joint 33 is provided at the top end of the gas guiding rod 31, which satisfies the gas conduction of the gas guiding rod 31 while enabling the gas guiding rod 31 to rotate stably.

[0050] In another embodiment provided by the present invention, the adsorption and rotation mechanism 3 further includes a servo motor 34, which is fixedly installed at the execution end of the handling robotic arm 2 and is used to provide power for the rotation of the air guide rod 31. Specifically, synchronous transmission gears 35 are fixedly sleeved on the output shaft of the servo motor 34 and above the outside of the air guide rod 31, and a synchronous transmission belt 36 is meshed and sleeved on the outside of the two groups of synchronous transmission gears 35. The servo motor 34 and the air guide rod 31 are driven through the synchronous transmission gears 35 and the synchronous transmission belt 36. The servo motor 34 can drive the air guide rod 31 and the vacuum chuck 32 to rotate under the control of the control system, so as to realize the centrifugal coating after the wafer 7 is dipped in glue; after the wafer 7 dips in the photoresist and completes the centrifugal coating in the container 4, the excess photoresist can be directly thrown into the container 4 for recovery, improving the utilization rate of the photoresist.

[0051] In another embodiment provided by the present invention, the opening and closing components 51 can completely cover the top of the container 4 after being combined. The opening and closing components 51 include an opening and closing plate 511. The part of the opening and closing plate 511 that cooperates with the top of the container 4 is fan-shaped. One end of the opening and closing plate 511 close to the peripheral side of the container 4 is provided with a tension spring 512 for driving the opening and closing plate 511 to reset. Specifically, a plurality of opening and closing components 51 are slidably installed on the top of the container 4 in an annular array, and the fan-shaped parts of the plurality of opening and closing plates 511 can be combined into a complete circle to achieve a full coverage of the top of the container 4; when the container 4 is in a non-working state, by applying a pulling force to the opening and closing plate 511 through the tension spring 512, the opening and closing plate 511 can be covered on the top of the container 4 to seal the container 4 and prevent the solvent in the photoresist from volatilizing outward.

[0052] In another embodiment provided by the present invention, the opening and closing mechanism 5 further includes a transmission arm 53, which is arranged between the opening and closing component 51 and the transmission collar 52. The transmission collar 52 drives the opening and closing component 51 to move outward of the container 4 through the transmission arm 53. Specifically, the opening and closing mechanism 5 further includes a pressing plate 54, which is movably sleeved outside the air guide rod 31 and fixedly installed at the execution end of the handling robotic arm 2; one end of the transmission arm 53 is hinged to the inner ring of the transmission collar 52, and the other end is hinged to one end of the opening and closing plate 511 close to the outside of the container 4. When the handling robotic arm 2 drives the wafer 7 to move downward into the container 4, the transmission collar 52 can be simultaneously extruded through the pressing plate 54 to drive the transmission collar 52 to move downward. The transmission collar 52 drives the transmission arm 53 to drive a plurality of opening and closing plates 511 to move outward of the container 4 against the elastic force of the tension spring 512, opening the top of the container 4 and providing a passage for the wafer 7 to enter the container 4; a guiding slide rail 514 is fixedly installed at the bottom of the opening and closing plate 511, and a guiding chute 513 matching the guiding slide rail 514 is opened at the top of the container 4. The opening and closing plate 511 is restricted by the cooperation of the guiding chute 513 and the guiding slide rail 514 to ensure its stability when moving on the top of the container 4; an avoidance groove 55 matching the opening and closing component 51 is opened on the circumferential side of the transmission collar 52. When the opening and closing component 51 moves to the circumferential side of the container 4, an avoidance space is provided in the transmission collar 52 to meet the movement requirement of the opening and closing component 51.

[0053] As can be seen from the above embodiments, the wafer 7 is moved to the container 4 in an inverted manner driven by the handling robotic arm 2 for dipping and centrifugal coating. However, the size of the wafer 7 is relatively thin. When dipping the bottom of the wafer 7, the photoresist is likely to spread along the edge of the wafer 7 to its back surface, increasing the difficulty of subsequent cleaning. In this regard, the following embodiments are proposed to solve this problem.

[0054] In an embodiment provided by the present invention, a blowing mechanism 6 is arranged on the container 4, which is in transmission connection with the transmission collar 52. When the transmission collar 52 moves downward, it can drive the blowing mechanism 6 to act, blowing the photoresist in the central area inside the container 4 to form a bulging portion 66 protruding upward. Specifically, during the process of the wafer 7 moving downward into the container 4, the transmission collar 52 is synchronously driven to move downward. The transmission collar 52 drives the blowing mechanism 6 to act, blowing the photoresist inside the container 4, so as to form a bulging portion 66 protruding upward in the central area of the photoresist liquid surface, enabling only the central part of the bottom of the wafer 7 to contact the photoresist during the process of the wafer 7 moving downward and dipping in the container 4, thereby avoiding the back surface of the wafer 7 from adhering to the photoresist and reducing the subsequent cleaning process of the back surface of the wafer 7.

[0055] In one embodiment provided by the present invention, the blowing mechanism 6 includes a piston rod 61 and a blowing tube 62. The blowing tube 62 is fixedly mounted on the container 4, and one end of the blowing tube 62 extends to the central area inside the container 4, and the other end extends to the outside of the container 4. The piston rod 61 is fixedly mounted on the transmission collar 52, and the piston rod 61 is inserted into the part of the blowing tube 62 located outside the container 4. In the present application, the blowing tubes 62 are arranged in a circular array on the container 4, and the piston rods 61 and the blowing tubes 62 correspond to each other in position and are arranged on the transmission collar 52; it should be noted that the blowing tubes 62 include but are not limited to the arrangement method and arrangement quantity specified in the present application, so as to meet the requirement that the blowing part 66 formed by a plurality of blowing tubes 62 can dip the glue in the bottom center area of the wafer 7; specifically, in the process of the wafer 7 moving down to the container 4 , the transmission sleeve 52 drives the piston rod 61 to move downward synchronously, the piston rod 61 moves in the blowing tube 62 to push the photoresist to move in the blowing tube 62, and is squeezed out along the outlet end of the blowing tube 62, and the extruded photoresist can form a blowing portion 66 at the outlet end of the blowing tube 62 that is higher than the photoresist liquid level, and the height of the blowing portion 66 is higher than the height of the wafer 7 after it moves down to its position, so as to meet the dipping of the photoresist in the blowing portion 66 during the downward movement of the wafer 7; when the wafer 7 and the opening and closing component 51 move down to their positions, the transmission sleeve 52 stops driving the piston rod 61 to move, and the blowing portion 66 disappears at this time, so as to avoid the blowing portion 66 affecting the subsequent centrifugal coating of the wafer 7; when the transmission sleeve 52 moves up and resets, it can pull the piston rod 61 to move upward synchronously, and the piston rod 61 can draw the photoresist into the blowing tube 62 again, so as to facilitate the subsequent continuous blowing operation.

[0056] In another embodiment provided by the present invention, a lifting blowing head 63 is movably sleeved on one end of the blowing tube 62 located on the inner side of the container 4, and the outlet of the lifting blowing head 63 is a tapered outlet. When the piston rod 61 moves downward inside the blowing tube 62 to push the photoresist to flow inside the blowing tube 62, the photoresist discharged along the outlet of the blowing tube 62 can push the lifting blowing head 63 to lift upward. It should be noted that due to the high viscosity of the photoresist, the photoresist squeezed out along the outlet end of the blowing tube 62 is not enough to form a blowing part 66 that meets the height requirement. When the bottom of the wafer 7 is dipped in the photoresist at the position of the blowing part 66, the distance between the bottom of the wafer 7 and the photoresist liquid surface is small, and the wafer 7 is in the process of entering. During centrifugal coating, when excess photoresist is thrown to the photoresist liquid surface, the splashed photoresist may still be splashed onto the back side of the wafer 7. By movably installing a lifting blowing head 63 at the outlet end of the blowing tube 62 and designing the outlet of the lifting blowing head 63 with a constricted opening, the photoresist extruded along the outlet end of the blowing tube 62 enters and is blocked by the constricted opening of the lifting blowing head 63, which can push the lifting blowing head 63 to move upward and extrude along the constricted opening of the lifting blowing head 63 to form a blowing portion 66, thereby increasing the formation height of the blowing portion 66, thereby reducing the downward movement height of the wafer 7, increasing the distance between the bottom of the wafer 7 and the photoresist liquid surface, and preventing the photoresist from splashing onto the back side of the wafer 7 during centrifugal coating.

[0057] In another embodiment provided by the present invention, an isolation ring 64 is arranged on the circumferential side of the lifting and blowing head 63. When the wafer 7 dips the photoresist, the isolation ring 64 can move upward under the drive of the lifting and blowing head 63 and abut against the bottom of the wafer 7. Specifically, in the blowing stage, when the lifting and blowing head 63 lifts, it synchronously drives the connecting arm 65 to move upward and abuts against the bottom of the wafer 7 during the downward movement of the wafer 7, so as to prevent the area of the formed blowing part 66 from being too large and causing the photoresist to spread to the back of the wafer 7. After the transmission collar 52 drives the piston rod 61 to move downward in place, the lifting and blowing head 63 loses the lifting force brought by the flowing photoresist, and the formed blowing part 66 disappears. Moreover, the lifting and blowing head 63 and the connecting arm 65 reset under the action of gravity to avoid interference during the centrifugal coating of the wafer 7. After the blowing part 66 moves downward and resets at the outlet end of the blowing pipe 62, the top of the lifting and blowing head 63 is lower than the height of the photoresist liquid level, which is convenient for the piston rod 61 to reset and pump the photoresist into the blowing pipe 62 again.

[0058] Only some exemplary embodiments of the present invention have been described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. A glue coating and developing machine, comprising a handling robotic arm (2) for transporting a wafer (7); and a container (4) for containing photoresist, characterized in that, It further includes an opening and closing mechanism (5) which is arranged at the top of the container (4) and can control the open state of the top of the container (4); The opening and closing mechanism (5) includes an opening and closing component (51) slidably arranged at the top end of the container (4) and a transmission collar (52) movably sleeved outside the container (4), and the transmission collar (52) is in transmission connection with the opening and closing component (51); When the handling robotic arm (2) drives the wafer (7) to move inside the container (4) through the middle of the transmission collar (52), it can squeeze the transmission collar (52) to move downward. During the downward movement of the transmission collar (52), it can push the opening and closing component (51) to move outward from the container (4) to open the top of the container (4). When the handling robotic arm (2) drives the wafer (7) to separate from the wafer (7), the opening and closing component (51) can reset to close the top of the container (4) again.

2. The glue coating and developing machine according to claim 1, wherein An adsorption and rotation mechanism (3) is arranged at the execution end of the handling robotic arm (2) for adsorbing the wafer (7) and driving the wafer (7) to rotate around its central axis.

3. The glue coating and developing machine according to claim 2, wherein, The adsorption and rotation mechanism (3) includes a gas guide rod (31) rotatably installed at the execution end of the handling robotic arm (2). A vacuum chuck (32) is fixedly communicated with the bottom end of the gas guide rod (31) for adsorbing the wafer (7), and a rotary joint (33) is fixedly connected to the top end of the gas guide rod (31).

4. The glue coating and developing machine according to claim 3, wherein The adsorption and rotation mechanism (3) further includes a servo motor (34) fixedly installed at the execution end of the handling robotic arm (2) for providing power for the rotation of the gas guide rod (31).

5. The glue coating and developing machine according to claim 1, characterized in that, After being combined, the opening and closing component (51) can completely cover the top of the container (4). The opening and closing component (51) includes an opening and closing plate (511). The part of the opening and closing plate (511) cooperating with the top of the container (4) is fan-shaped. A tension spring (512) is arranged at one end of the opening and closing plate (511) close to the circumferential side of the container (4) for driving the opening and closing plate (511) to reset.

6. The glue coating and developing machine according to claim 1, wherein, The opening and closing mechanism (5) further includes a transmission arm (53) arranged between the opening and closing component (51) and the transmission collar (52). The transmission collar (52) drives and pushes the opening and closing component (51) to move outward from the container (4) through the transmission arm (53).

7. A glue coating and developing machine according to claim 1, characterized in that A blowing mechanism (6) is arranged on the container (4) and is in transmission connection with the transmission collar (52). When the transmission collar (52) moves downward, it can drive the blowing mechanism (6) to act to blow the photoresist in the central area inside the container (4) to form a bulging blowing part (66).

8. A glue coating and developing machine according to claim 7, characterized in that, The blowing mechanism (6) includes a piston rod (61) and a blowing pipe (62). The blowing pipe (62) is fixedly installed on the container (4). One end of the blowing pipe (62) extends to the central area inside the container (4), and the other end extends to the outside of the container (4). The piston rod (61) is fixedly installed on the transmission collar (52), and the piston rod (61) is inserted into the part of the blowing pipe (62) located outside the container (4).

9. A glue coating and developing machine according to claim 8, characterized in that, One end of the blowing tube (62) located inside the container (4) is movably sleeved with a lifting blowing head (63), and the outlet of the lifting blowing head (63) is a gradually shrinking conical outlet. When the piston rod (61) moves downward inside the blowing tube (62) to push the photoresist to flow inside the blowing tube (62), the photoresist discharged along the outlet of the blowing tube (62) can push the lifting blowing head (63) to lift upward.

10. A glue coating and developing machine according to claim 9, characterized in that, An isolation ring (64) is provided on the peripheral side of the lifting and blowing head (63); when the wafer (7) is dipped into the photoresist, the isolation ring (64) can be moved upwards and abutted against the bottom of the wafer (7) under the drive of the lifting and blowing head (63).

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