A platform-type constant temperature device suitable for semiconductor temperature calibration

Abstract

The present invention discloses a platform-type constant temperature device suitable for semiconductor temperature calibration, which relates to the semiconductor field and includes a device body, a temperature increase control mechanism, and a temperature decrease control mechanism. An operating table is provided above the device body, and a constant temperature calibration platform is embedded in the operating table. The temperature increase control mechanism is disposed within the device body and is used to control the temperature increase of the constant temperature calibration platform. The temperature decrease control mechanism is disposed within the device body and is used to control the temperature decrease of the constant temperature calibration platform. Both the temperature increase control mechanism and the temperature decrease control mechanism are supported and controlled by a support control mechanism. In the present invention, the structures for temperature increase and temperature decrease control are independent of each other, that is, the temperature increase control mechanism and the temperature decrease control mechanism independently control the semiconductor to increase or decrease the temperature. The two can quickly respond to temperature adjustment requirements without affecting each other, thereby improving the efficiency and accuracy of the calibration process and ensuring the quality of semiconductor products.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a platform-type constant temperature device suitable for semiconductor temperature calibration. Background Art

[0002] Temperature calibration is a critical step in ensuring product quality and performance during semiconductor manufacturing and testing. Precise temperature control directly impacts the physical and electrical properties of semiconductor materials, making it crucial to use efficient and reliable constant temperature equipment for temperature calibration.

[0003] Existing semiconductor temperature calibration equipment typically uses a constant temperature bath or dry-type furnace for temperature control calibration, making it impossible to perform large-scale calibration. Furthermore, most existing constant temperature baths or dry-type furnaces integrate the heating and cooling control structures in the same area. While this design simplifies the structure and operation of the equipment to a certain extent, it also brings many technical problems. The most significant problem is the mutual interference between the heating and cooling processes. In actual operation, the heating and cooling processes need to adjust the temperature quickly and accurately to meet the requirements of different semiconductor materials. However, because the heating and cooling control structures are located in the same area, they are prone to heat transfer interference when operating. When the heating device is operating, the heat generated may affect the effectiveness of the cooling device, resulting in reduced cooling efficiency; vice versa, this significantly increases the response time of the entire calibration process, affecting the accuracy and efficiency of the calibration.

[0004] Furthermore, when switching temperature modes (e.g., from heating to cooling), existing devices can take a long time to stabilize at the target temperature due to the interaction between the heating and cooling structures. In some cases, temperature fluctuations can occur, further impacting calibration reliability. This structural design reduces temperature control accuracy, and in severe cases, can prevent the expected calibration results from being achieved, thus affecting the performance of semiconductor products. Summary of the Invention

[0005] (1) Purpose of the invention

[0006] In view of this, the purpose of the present invention is to propose a platform-type constant temperature device suitable for semiconductor temperature calibration, in which the structures for heating and cooling control are independent of each other, that is, the heating control mechanism and the cooling control mechanism independently control the semiconductor to heat up or cool down, and the two can quickly respond to temperature adjustment requirements without affecting each other, thereby improving the efficiency and accuracy of the calibration process and ensuring the quality of semiconductor products.

[0007] (2) Technical solution

[0008] To achieve the above technical objectives, the present invention provides a platform-type constant temperature device suitable for semiconductor temperature calibration, which includes an equipment body, an operating table is provided above the equipment body, a constant temperature calibration platform is embedded in the surface of the operating table, and an insulating sealed box is provided above the operating table, and the insulating sealed box covers the constant temperature calibration platform;

[0009] a temperature rise control mechanism, which is disposed inside the device body and is used to control the temperature rise of the constant temperature calibration platform;

[0010] A temperature reduction control mechanism, which is arranged inside the device body and is used to control the temperature reduction of the constant temperature calibration platform;

[0011] In which, the temperature rising control mechanism and the temperature falling control mechanism are both supported and controlled by a support control mechanism, and the temperature rising control mechanism and the temperature falling control mechanism can move to a first position and a second position under the control of the support control mechanism. The first position is: the temperature rising control mechanism is horizontal, the temperature falling control mechanism is vertical, the top of the temperature rising control mechanism is in contact with the constant temperature calibration platform, and the temperature falling control mechanism is separated from the constant temperature calibration platform. The second position is: the temperature rising control mechanism is vertical, the temperature falling control mechanism is horizontal, the temperature rising control mechanism is separated from the constant temperature calibration platform, and the temperature falling control mechanism is in contact with the constant temperature calibration platform.

[0012] As a further description of the above technical solution: the temperature increase control mechanism and the temperature decrease control mechanism are respectively located at symmetrical positions on both sides below the constant temperature calibration platform.

[0013] As a further description of the above technical solution: the support control mechanism is provided with two groups, and the two groups of support control mechanisms are symmetrically installed inside the device body, and the support control mechanism includes:

[0014] There are two upright posts, which are vertically arranged;

[0015] A turning connecting plate is rotatably mounted between the two upright posts;

[0016] A position control motor is installed on the outside of one of the columns, and the output shaft of the position control motor is connected to the rotating shaft of the flip connecting plate, so that the position control motor can control the rotation of the flip connecting plate;

[0017] The temperature increase control mechanism and the temperature decrease control mechanism are respectively installed on two groups of flip connection plates supporting the control mechanism, so that the temperature increase control mechanism and the temperature decrease control mechanism can follow the rotation and position change of the flip connection plates.

[0018] As a further description of the above technical solution: a guide groove is provided on the top of the column in the vertical direction, and a slide is slidably installed in the guide groove. The two ends of the flip connecting plate are respectively rotatably installed on the inner side of the slide in the two columns, so that the flip connecting plate can slide in the vertical direction within the range of the guide groove following the slide. A cylinder for pushing the slide to move up and down is installed at the lower part of the interior of the column. A docking space is provided at the bottom of the operating table below the constant temperature calibration platform. The cooling control mechanism and the heating control mechanism can be lifted and lowered so that the upper surface is docked to the docking space and fits with the bottom of the constant temperature calibration platform.

[0019] As a further description of the above technical solution: the bottom of the slide is connected to a connecting plate via a spring, and the front end of the piston rod of the cylinder is fixedly connected to the connecting plate via a bolt.

[0020] As a further description of the above technical solution: snap-fit ​​components are provided at both ends of the docking space inside the device body, and the snap-fit ​​components can snap-fit ​​and fix the cooling control mechanism and the heating control mechanism when they are docked in the docking space. The snap-fit ​​components include:

[0021] A U-shaped frame is fixedly mounted on the bottom of the operating table, a shaft body is rotatably mounted on the inner side of the U-shaped frame, a buckle control motor is fixedly mounted on one side of the U-shaped frame, and an output shaft of the buckle control motor is in transmission connection with the shaft body;

[0022] A pressure plate, which is fixedly mounted on the shaft body via a U-shaped connecting rod, so that the pressure plate can be controlled to rotate by the shaft body;

[0023] Among them, a pressure sensor is embedded in the surface of the pressure plate. When the buckle control motor is running, the pressure plate can be driven to rotate through the shaft and the U-shaped connecting rod to reach the locking position and the unlocking position.

[0024] As a further description of the above technical solution: the temperature reduction control mechanism includes:

[0025] A refrigerant carrier plate, one side of which is fixed to the flip connection plate, and a refrigerant channel for circulating the refrigerant is provided inside the refrigerant carrier plate;

[0026] a first heat conducting plate, embedded above the refrigerant carrying plate and covering the refrigerant channel;

[0027] Wherein, the refrigerant channel adopts a continuous S-shaped structure.

[0028] As a further description of the above technical solution: the temperature reduction control mechanism also includes a refrigerator, which is installed on the operating table. The refrigerator is connected to the refrigerant channel inside the refrigerant supporting plate through a refrigerant conduit and a refrigerant return pipe.

[0029] As a further description of the above technical solution: the temperature rise control mechanism includes a heat source carrier plate, one side of the heat source carrier plate is fixed to the flip connecting plate, a heating coil is provided inside the heat source carrier plate, and a second heat conducting plate is embedded in the upper surface of the heat source carrier plate, and the second heat conducting plate covers the heating coil.

[0030] As a further description of the above technical solution: the edge of the first heat conducting plate is surrounded by a circle of first heat-resistant bulkhead frame, the edge of the second heat conducting plate is surrounded by a circle of second heat-resistant bulkhead frame, and the edge of the constant temperature calibration platform is surrounded by a circle of third heat-resistant bulkhead frame, wherein the first heat-resistant bulkhead frame, the second heat-resistant bulkhead frame and the third heat-resistant bulkhead frame are made of ceramic fiber.

[0031] In the above technical scheme, the present invention provides a platform-type constant temperature device suitable for semiconductor temperature calibration. The device is a platform-type calibration, that is, a constant temperature calibration platform is used to perform temperature calibration of semiconductors. Compared with traditional constant temperature baths or dry furnace calibrations, the device can perform temperature calibration on multiple semiconductors at the same time, and the calibration efficiency is high. In addition, the structures used for heating and cooling control in the device are independent of each other, that is, the heating control mechanism and the cooling control mechanism independently control the semiconductor to heat up or cool down. The two can quickly respond to temperature adjustment requirements without affecting each other, thereby improving the efficiency and accuracy of the calibration process and ensuring the quality of semiconductor products. Moreover, through the structural design of the heating control mechanism, the cooling control mechanism and the supporting control mechanism, the heating control mechanism and the cooling control mechanism have high efficiency and fast speed in temperature conduction exchange when controlling the constant temperature calibration platform to heat up and cool down, further improving the speed and efficiency of semiconductor temperature calibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the overall structure of a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention;

[0034] Figure 2 A schematic structural diagram of a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention from another perspective;

[0035] Figure 3A schematic diagram of the installation structure of a constant temperature calibration platform in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention;

[0036] Figure 4 A schematic diagram of the internal structure of a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention;

[0037] Figure 5 Schematic diagram of the installation of a cooling control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention Figure 1 ;

[0038] Figure 6 Schematic diagram of the installation of a cooling control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention Figure 2 ;

[0039] Figure 7 A schematic diagram of a temperature reduction control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention;

[0040] Figure 8 A schematic diagram of the slide installation structure in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention;

[0041] Figure 9 A schematic diagram of the connection structure between the slide and the cylinder in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention;

[0042] Figure 10 A schematic diagram of a temperature rise control mechanism in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention;

[0043] Figure 11 This is a schematic diagram of the structure of the snap-fit ​​components in a platform-type constant temperature device suitable for semiconductor temperature calibration provided by the present invention.

[0044] Description of the drawings: 1. Equipment body; 2. Operating table; 200. Constant temperature calibration platform; 201. Third heat-resistant insulation frame; 202. Docking space; 3. Refrigerator; 300. Refrigerant conduit; 301. Refrigerant return pipe; 4. Insulated sealing box; 5. Temperature control mechanism; 500. Heat source bearing plate; 501. Second heat-resistant insulation frame; 502. Second heat conduction plate; 503. Heating coil; 6. Support control mechanism; 600. Column; 601. Flip connection plate ; 602, cylinder; 603, guide groove; 604, slide; 605, displacement control motor; 606, spring; 607, connecting plate; 7, cooling control mechanism; 700, refrigerant bearing plate; 701, first heat conduction plate; 702, first heat-resistant insulation frame; 703, refrigerant channel; 8, snap-fit ​​assembly; 800, U-shaped frame; 801, snap-fit ​​control motor; 802, shaft; 803, U-shaped connecting rod; 804, pressure sensor; 805, pressure plate. DETAILED DESCRIPTION

[0045] The following description is merely illustrative in nature and is not intended to limit the present disclosure, its applications, or uses. It should be understood that throughout the drawings, identical or similar reference numerals indicate identical or similar parts and features. The drawings merely schematically illustrate the concepts and principles of the embodiments of the present disclosure and do not necessarily depict the specific dimensions and proportions of the various embodiments of the present disclosure. Certain portions of certain drawings may be exaggerated to illustrate relevant details or structures of the embodiments of the present disclosure.

[0046] Example 1

[0047] like Figure 1-Figure 7 As shown, this embodiment provides a technical solution: a platform-type constant temperature device suitable for semiconductor temperature calibration, including a device body 1, a temperature increase control mechanism 5 and a temperature decrease control mechanism 7, wherein an operating table 2 is provided above the device body 1, a constant temperature calibration platform 200 is embedded in the surface of the operating table 2, an insulating sealed box 4 is provided above the operating table 2, and the insulating sealed box 4 covers the constant temperature calibration platform 200, the temperature increase control mechanism 5 is provided inside the device body 1, and is used to control the temperature increase of the constant temperature calibration platform 200, and the temperature decrease control mechanism 7 is provided inside the device body 1, and is used to control the temperature decrease of the constant temperature calibration platform 200;

[0048] The temperature increase control mechanism 5 and the temperature decrease control mechanism 7 are both supported and controlled by the support control mechanism 6. The temperature increase control mechanism 5 and the temperature decrease control mechanism 7 can be moved to a first position and a second position under the control of the support control mechanism 6. The first position is a temperature increase working position in which the temperature increase control mechanism 5 is horizontal, the temperature decrease control mechanism 7 is vertical, the upper portion of the temperature increase control mechanism 5 is in contact with the constant temperature calibration platform 200, and the temperature decrease control mechanism 7 is separated from the constant temperature calibration platform 200. The second position is a temperature decrease working position in which the temperature increase control mechanism 5 is vertical, the temperature decrease control mechanism 7 is horizontal, the temperature increase control mechanism 5 is separated from the constant temperature calibration platform 200, and the upper portion of the temperature decrease control mechanism 7 is in contact with the constant temperature calibration platform 200.

[0049] Working Principle: When using the device, the semiconductor to be calibrated is first placed on top of the constant temperature calibration platform 200, and then the thermally insulated sealed box 4 is closed. Then, according to the need for heating or cooling, the temperature control mechanism 5 and the temperature control mechanism 7 are controlled by the support control mechanism 6 to move the temperature control mechanism 5 and the temperature control mechanism 7 to the heating working position or the cooling working position, and the semiconductor temperature calibration operation can be carried out;

[0050] In summary: the device is a platform-type calibration, that is, a constant temperature calibration platform 200 is used to calibrate the temperature of the semiconductor. Therefore, the device can perform temperature calibration on multiple semiconductors at the same time, and the structures used for heating and cooling control in the device are independent of each other, that is, the temperature increase control mechanism 5 and the temperature reduction control mechanism 7 independently control the semiconductor to heat up or cool down. The two can quickly respond to temperature adjustment requirements without affecting each other, thereby improving the efficiency and accuracy of the calibration process and ensuring the quality of semiconductor products.

[0051] Specifically, the temperature increasing control mechanism 5 and the temperature decreasing control mechanism 7 are respectively located at symmetrical positions on both sides below the constant temperature calibration platform 200 , so that the temperature increasing control mechanism 5 and the temperature decreasing control mechanism 7 do not interfere with each other when switching positions.

[0052] Specifically, such as Figure 4-Figure 9 As shown, in order to realize the control of the temperature increase control mechanism 5 and the temperature decrease control mechanism 7, in this embodiment, two groups of support control mechanisms 6 are provided. The two groups of support control mechanisms 6 are symmetrically installed inside the device body 1. The support control mechanism 6 includes a column 600, a flip connection plate 601 and a position control motor 605. Among them, there are two columns 600, the two columns 600 are vertically arranged, the flip connection plate 601 is rotatably installed between the two columns 600, and the position control motor 605 is installed on the outside of one of the columns 600. The output shaft of the position control motor 605 is connected to the rotating shaft of the flip connection plate 601, so that the position control motor 605 can control the rotation of the flip connection plate 601;

[0053] The temperature increase control mechanism 5 and the temperature decrease control mechanism 7 are respectively mounted on two sets of flip connection plates 601 supporting the control mechanism 6, so that the temperature increase control mechanism 5 and the temperature decrease control mechanism 7 can follow the rotation and position change of the flip connection plates 601;

[0054] Based on this, when it is necessary to control the temperature rise through the temperature rise control mechanism 5, the temperature drop control mechanism 7 is in a vertical state and separated from the constant temperature calibration platform 200. The flip connection plate 601 on which the temperature rise control mechanism 5 is installed is rotated to the horizontal under the drive control of the position change control motor 605. That is, the position change control motor 605 is running, and the flip connection plate 601 on which the temperature rise control mechanism 5 is installed is driven by the rotating shaft to rotate 90°, so that it rotates from a vertical state to a horizontal state. At this time, the upper part of the temperature rise control mechanism 5 is in contact with the constant temperature calibration platform 200, and the temperature rise of the constant temperature calibration platform 200 can be controlled by the temperature rise control mechanism 5. Conversely, when it is necessary to When the temperature reduction control mechanism 7 controls the temperature reduction, the flip connecting plate 601 on which the temperature increase control mechanism 5 is installed is driven by the position control motor 605 and rotates from a horizontal state to a vertical state, and is separated from the constant temperature calibration platform 200. The flip connecting plate 601 on which the temperature reduction control mechanism 7 is installed is driven and controlled by the position control motor 605 and rotates to a horizontal state. At this time, the top of the temperature reduction control mechanism 7 contacts the constant temperature calibration platform 200, and the temperature reduction control mechanism 7 can be used to control the constant temperature calibration platform 200 to cool down. Therefore, there will be no mutual interference between the temperature increase control mechanism 5 and the temperature reduction control mechanism 7, thereby ensuring the response efficiency of heating and cooling.

[0055] Specifically, such as Figure 4-Figure 9 As shown, in order to make the cooling control mechanism 7 and the heating control mechanism 5 transfer heat faster in the process of controlling the constant temperature calibration platform 200 to cool down or heat up, in this embodiment, a guide groove 603 is opened in the vertical direction at the top of the column 600, and a slide 604 is slidably installed in the guide groove 603. The two ends of the flip connecting plate 601 are respectively rotatably installed on the inner side of the slide 604 in the two columns 600, so that the flip connecting plate 601 can follow the slide 604 and slide in the vertical direction within the range of the guide groove 603. A cylinder 602 is installed at the bottom of the column 600 to push the slide 604 to move up and down. The bottom of the operating table 2 is located below the constant temperature calibration platform 200 and is provided with a docking space 202. The cooling control mechanism 7 and the heating control mechanism 5 can be lifted and lowered so that the upper surface is docked into the docking space 202 and fits with the bottom of the constant temperature calibration platform 200. This structural arrangement makes the cooling control mechanism 7 and the heating control mechanism 5 respond faster when controlling the constant temperature calibration platform 200 to cool down or heat up.

[0056] Specifically, such as Figure 4-Figure 9As shown, in order to further improve the temperature reduction control mechanism 7 and the temperature increase control mechanism 5 so that they can fully contact the constant temperature calibration platform 200 when they are docked in the docking space 202, in this embodiment, the bottom of the slide 604 is connected to the connecting plate 607 through a spring 606, and the front end of the piston rod of the cylinder 602 is fixedly connected to the connecting plate 607 through a bolt. Based on this, when the cylinder 602 pushes the slide 604 to rise, so that the temperature reduction control mechanism 7 and the temperature increase control mechanism 5 are docked in the docking space 202, under the elastic force of the spring 606, the temperature reduction control mechanism 7 and the temperature increase control mechanism 5 can fully contact the constant temperature calibration platform 200, thereby improving the temperature conduction speed and efficiency.

[0057] Specifically, such as Figure 6 and Figure 11 As shown, in order to ensure the stability of the cooling control mechanism 7 and the temperature increasing control mechanism 5 when the cooling control mechanism 7 and the temperature increasing control mechanism 5 are docked to the docking space 202 and to avoid the situation where the cooling control mechanism 7 and the temperature increasing control mechanism 5 are excessively squeezed and damaged as a result, in this embodiment, a snap-fit ​​assembly 8 is provided at both ends of the docking space 202 inside the equipment main body 1. The snap-fit ​​assembly 8 can snap-fit ​​and fix the cooling control mechanism 7 and the temperature increasing control mechanism 5 when they are docked into the docking space 202. The snap-fit ​​assembly 8 includes a U-shaped frame 800 and a pressure plate 805, wherein the U-shaped frame 800 is fixedly mounted on the bottom of the operating table 2, and a shaft 802 is rotatably mounted on the inner side of the U-shaped frame 800, and a snap-fit ​​control motor 801 is fixedly mounted on one side of the U-shaped frame 800, and the output shaft of the snap-fit ​​control motor 801 is connected to the pressure plate 805. The shaft 802 is connected for transmission, and the pressure plate 805 is fixedly mounted on the shaft 802 through the U-shaped connecting rod 803, so that the pressure plate 805 can be controlled to rotate by the shaft 802. Specifically, in order to improve the fastening stability of the fastening assembly 8, a plurality of U-shaped frames 800 are provided in the fastening assembly 8, and the plurality of U-shaped frames 800 are arranged equidistantly in the horizontal direction, and the shafts 802 on the plurality of U-shaped frames 800 are connected, and the fastening control motor 801 is installed on the U-shaped frame 800 at the edge, so that when the cooling control mechanism 7 or the heating control mechanism 5 is docked to the docking space 202, the plurality of U-shaped frames 800 in the fastening assembly 8 can simultaneously lock the edges of the cooling control mechanism 7 and the heating control mechanism 5, thereby improving the stability of the cooling control mechanism 7 and the heating control mechanism 5, thereby improving the temperature conduction effect;

[0058] The surface of the pressure plate 805 is embedded with a pressure sensor 804. When the buckle control motor 801 is running, the pressure plate 805 can be driven to rotate through the shaft 802 and the U-shaped connecting rod 803 to reach the locking position and the unlocking position. The locking position is that the pressure plate 805 is attached to the bottom of the temperature control mechanism 7 or the temperature control mechanism 5, and the two ends of the temperature control mechanism 7 or the temperature control mechanism 5 are tightly fixed. The unlocking position is that the pressure plate 805 is away from the temperature control mechanism 7 or the temperature control mechanism 5, so that the temperature control mechanism 7 or the temperature control mechanism 5 is unlocked. In this way, the temperature control mechanism 7 and the temperature control mechanism 5 are stable when the temperature control mechanism 7 and the temperature control mechanism 5 are docked to the docking space 202, and the pressure sensor 804 can sense the pressing force value of the pressure plate 805 on the temperature control mechanism 7 and the temperature control mechanism 5, so as to avoid the situation where the temperature control mechanism 7 and the temperature control mechanism 5 are over-extruded and damaged, thereby forming an "element autonomous protection mechanism". The system improves the service life of the equipment. Specifically, the pressure sensor 804 is connected to the external host device, and the monitoring pressure threshold of the pressure sensor 804 is set by the host. The pressure sensor 804 transmits the pressure value to the host in real time. When the pressure value of the pressure sensor 804 reaches the threshold, the host controls the buckling control motor 801 to stop rotating. At the same time, it is ensured that when the cooling control mechanism 7 and the heating control mechanism 5 are docked to the docking space 202, the cooling control mechanism 7 and the heating control mechanism 5 can fully contact the constant temperature calibration platform 200, thereby achieving the effect of improving temperature conduction. It should also be noted that: since the buckling component 8 can buckle and fix the cooling control mechanism 7 or the heating control mechanism 5 when it is docked to the docking space 202, the displacement control motor 605 used to control the rotation of the cooling control mechanism 7 or the heating control mechanism 5 can be shut down to avoid it being in an over-pressure state for a long time and causing overheating damage, thereby ensuring its service life.

[0059] Example 2

[0060] like Figure 1-Figure 7 As shown, this embodiment provides a technical solution: Based on Example 1, in order to achieve temperature reduction control, the temperature reduction control mechanism 7 includes a refrigerant carrier plate 700 and a first heat conducting plate 701, wherein one side of the refrigerant carrier plate 700 is fixed to the flip connecting plate 601, and a refrigerant channel 703 for circulating the refrigerant is provided inside the refrigerant carrier plate 700. The first heat conducting plate 701 is embedded above the refrigerant carrier plate 700 and covers the refrigerant channel 703;

[0061] The refrigerant channel 703 adopts a continuous S-shaped structure. Based on this, when the refrigerant medium flows in the refrigerant channel 703, since the first heat conduction plate 701 is in direct contact with the constant temperature calibration platform 200, the refrigerant can exchange heat with the constant temperature calibration platform 200 to achieve temperature reduction control of the constant temperature calibration platform 200.

[0062] Specifically, the temperature-lowering control mechanism 7 also includes a refrigerator 3, which is installed on the operating table 2. The refrigerator 3 is connected to the refrigerant channel 703 inside the refrigerant carrier plate 700 through the refrigerant conduit 300 and the refrigerant return pipe 301, respectively, to form a circulation loop, that is, the refrigerant of the refrigerator 3 is introduced into the refrigerant channel 703 through the refrigerant conduit 300, and then flows back to the refrigerator 3 through the refrigerant return pipe 301 to complete the refrigeration. It should be noted that the refrigerator 3 adopts a Stirling refrigerator.

[0063] Specifically, such as Figure 10 As shown, in order to achieve temperature rise control, in this embodiment, the temperature rise control mechanism 5 includes a heat source carrier plate 500, one side of the heat source carrier plate 500 is fixed on the flip connecting plate 601, a heating coil 503 is provided inside the heat source carrier plate 500, and a second heat conducting plate 502 is embedded in the upper surface of the heat source carrier plate 500, and the second heat conducting plate 502 covers the heating coil 503. Therefore, when the heating coil 503 is heated, since the second heat conducting plate 502 is in direct contact with the constant temperature calibration platform 200, the heat can be directly conducted to the constant temperature calibration platform 200, thereby achieving temperature rise control of the constant temperature calibration platform 200.

[0064] Specifically, such as Figure 3 、 Figure 4 、 Figure 6 、 Figure 10 As shown, in order to reduce energy dissipation and affect the calibration effect of the equipment, in this embodiment, the edge of the first heat conducting plate 701 is surrounded by a circle of first heat-resistant insulation frame 702, the edge of the second heat conducting plate 502 is surrounded by a circle of second heat-resistant insulation frame 501, and the edge of the constant temperature calibration platform 200 is surrounded by a circle of third heat-resistant insulation frame 201, wherein the first heat-resistant insulation frame 702, the second heat-resistant insulation frame 501 and the third heat-resistant insulation frame 201 are made of ceramic fiber, thereby achieving the effect of preventing heat dissipation.

[0065] The exemplary implementation schemes proposed in the present disclosure are described in detail above with reference to preferred embodiments. However, it will be understood by those skilled in the art that, without departing from the concept of the present disclosure, various modifications and variations can be made to the above-mentioned specific embodiments, and various technical features and structures proposed in the present disclosure can be combined in various ways without exceeding the scope of protection of the present disclosure, which is determined by the appended claims.

Claims

1. A platform-type constant temperature device suitable for semiconductor temperature calibration, characterized in that: It includes: An equipment body (1) is provided with an operating table (2) above it, a constant temperature calibration platform (200) is embedded in the middle surface of the operating table (2), and an insulating sealed box (4) is provided above the operating table (2), and the insulating sealed box (4) covers the constant temperature calibration platform (200); A temperature rise control mechanism (5), which is arranged inside the device body (1) and is used to control the temperature rise of the constant temperature calibration platform (200); A temperature reduction control mechanism (7), which is arranged inside the device body (1) and is used to control the temperature reduction of the constant temperature calibration platform (200); Wherein, the temperature increasing control mechanism (5) and the temperature decreasing control mechanism (7) are both supported and controlled by the support control mechanism (6), and the temperature increasing control mechanism (5) and the temperature decreasing control mechanism (7) can be moved to a first position and a second position under the control of the support control mechanism (6), wherein the first position is: the temperature increasing control mechanism (5) is horizontal, the temperature decreasing control mechanism (7) is vertical, the upper portion of the temperature increasing control mechanism (5) is in contact with the constant temperature calibration platform (200), and the temperature decreasing control mechanism (7) is separated from the constant temperature calibration platform (200); and the second position is: the temperature increasing control mechanism (5) is vertical, the temperature decreasing control mechanism (7) is horizontal, the temperature increasing control mechanism (5) is separated from the constant temperature calibration platform (200), and the upper portion of the temperature decreasing control mechanism (7) is in contact with the constant temperature calibration platform (200); The support control mechanism (6) is provided with two groups in total. The two groups of support control mechanisms (6) are symmetrically installed inside the equipment body (1). The support control mechanism (6) includes two vertically arranged columns (600), a flip connection plate (601) rotatably installed between the two columns (600), and a position control motor (605) installed on the outside of one of the columns (600). The output shaft of the position control motor (605) is connected to the rotating shaft of the flip connection plate (601). The temperature increase control mechanism (5) and the temperature decrease control mechanism (7) are respectively installed on the flip connection plates (601) of the two groups of support control mechanisms (6). A guide groove (603) is provided on the top of the column (600) in the vertical direction, and a slide (604) is slidably mounted in the guide groove (603). The two ends of the flip connecting plate (601) are respectively rotatably mounted on the inner sides of the slides (604) in the two columns (600). A cylinder (602) for pushing the slide (604) to move up and down is installed at the lower part of the column (600). The bottom of the operating table (2) is located below the constant temperature calibration platform (200) and is provided with a docking space (202). The cooling control mechanism (7) and the heating control mechanism (5) can be lifted and lowered so that the upper surface is docked in the docking space (202) and fits with the bottom of the constant temperature calibration platform (200).

2. A platform-type constant temperature device suitable for semiconductor temperature calibration according to claim 1, characterized in that: The temperature increase control mechanism (5) and the temperature decrease control mechanism (7) are respectively located at symmetrical positions on both sides below the constant temperature calibration platform (200).

3. A platform-type constant temperature device suitable for semiconductor temperature calibration according to claim 1, characterized in that: The bottom of the slide seat (604) is connected to a connecting plate (607) via a spring (606), and the front end of the piston rod of the cylinder (602) is fixedly connected to the connecting plate (607) via a bolt.

4. A platform-type constant temperature device suitable for semiconductor temperature calibration according to claim 3, characterized in that: Snap-fit ​​components (8) are provided at both ends of the docking space (202) inside the device body (1). The snap-fit ​​components (8) can snap-fit ​​and fix the temperature-lowering control mechanism (7) and the temperature-increasing control mechanism (5) when they are docked in the docking space (202). The snap-fit ​​components (8) include: A U-shaped frame (800) is fixedly mounted on the bottom of the operating table (2); a shaft (802) is rotatably mounted on the inner side of the U-shaped frame (800); a buckling control motor (801) is fixedly mounted on one side of the U-shaped frame (800); an output shaft of the buckling control motor (801) is in driving connection with the shaft (802); A pressure plate (805) is fixedly mounted on the shaft (802) via a U-shaped connecting rod (803), so that the pressure plate (805) can be controlled to rotate by the shaft (802); The surface of the pressure plate (805) is embedded with a pressure sensor (804), and when the locking control motor (801) is running, the pressure plate (805) can be driven to rotate via the shaft (802) and the U-shaped connecting rod (803), so that the pressure plate (805) reaches a locked position and an unlocked position.

5. A platform-type constant temperature device suitable for semiconductor temperature calibration according to any one of claims 1 to 4, characterized in that: The temperature reduction control mechanism (7) comprises: A refrigerant carrier plate (700), one side of which is fixed to the flip connection plate (601), and a refrigerant channel (703) for circulating the refrigerant is provided inside the refrigerant carrier plate (700); A first heat conducting plate (701) is embedded above the refrigerant carrier plate (700) and covers the refrigerant channel (703); Wherein, the refrigerant channel (703) adopts a continuous S-shaped structure.

6. The platform-type constant temperature device suitable for semiconductor temperature calibration according to claim 5, characterized in that: The temperature-lowering control mechanism (7) further includes a refrigerator (3), which is mounted on the operating table (2). The refrigerator (3) is connected to the refrigerant channel (703) inside the refrigerant carrier plate (700) through a refrigerant conduit (300) and a refrigerant return pipe (301), respectively.

7. The platform-type constant temperature device suitable for semiconductor temperature calibration according to claim 5, characterized in that: The temperature rise control mechanism (5) comprises a heat source carrier plate (500), one side of the heat source carrier plate (500) is fixed to the flip connection plate (601), a heating coil (503) is provided inside the heat source carrier plate (500), and a second heat conducting plate (502) is embedded in the upper surface of the heat source carrier plate (500), and the second heat conducting plate (502) covers the heating coil (503).

8. The platform-type constant temperature device suitable for semiconductor temperature calibration according to claim 7, characterized in that: The edge of the first heat-conducting plate (701) is surrounded by a circle of a first heat-resisting bulkhead (702), the edge of the second heat-conducting plate (502) is surrounded by a circle of a second heat-resisting bulkhead (501), and the edge of the constant temperature calibration platform (200) is surrounded by a circle of a third heat-resisting bulkhead (201), wherein the first heat-resisting bulkhead (702), the second heat-resisting bulkhead (501) and the third heat-resisting bulkhead (201) are made of ceramic fiber.

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