Modularized multi-cavity directional cold plate

Abstract

The invention relates to a modular multi-cavity directional cold plate, and belongs to the technical field of chip cooling, the modular multi-cavity directional cold plate comprises a chip module mounting plate, the top of the chip module mounting plate is provided with a chip module capable of processing information, and the top of the chip module is provided with a cold plate module capable of orienting the chip module for cooling. According to the modularized multi-cavity directional cold plate, the flow direction of cooling liquid can be effectively controlled through the cold plate module, the cooling liquid can be intensively output to the serious heating position of a heating element and then circulates to the periphery, the heat dissipation problem of a high-heat-flux area is solved in a targeted mode, the heat dissipation effect is further improved, efficient and continuous operation of the heating element is guaranteed, and the service life of the heating element is prolonged. The first heat conduction pad and the second heat conduction pad can conduct heat transfer on surrounding high places with relatively high temperature, the overall heat dissipation effect is further effectively improved, meanwhile, due to the modular design, the convenience of subsequent maintenance and replacement can be improved by replacing corresponding parts, and the device is good in cooling effect and can conduct targeted heat dissipation on high-heat areas.

Description

Technical Field

[0001] The invention relates to the technical field of chip cooling, and in particular to a modular multi-cavity directional cold plate. Background Art

[0002] The cold plate is a key component of the heat dissipation device. The cold plate is usually in direct contact with the heat source (such as CPU, GPU, etc.). Its main function is to quickly conduct the heat generated by the heat source through materials with high thermal conductivity (such as copper, aluminum and other metals).

[0003] For example, a Chinese patent (publication number: CN111580625A) discloses a heat dissipation device for a server GPU, including a circuit board on which the heat dissipation device is installed, a mounting frame is fixed to the outer wall of the top of the circuit board by bolts, and a conical tube is arranged on the inner wall of the mounting frame, fans are fixed to the inner walls of both sides of the conical tube by bolts, screw holes are provided on the outer walls of both sides of the mounting frame, and fixing bolts are screwed on the inner walls of the two screw holes, heat dissipation holes distributed at equal distances are provided on the outer walls of the conical tube, threaded holes are provided on the outer walls of both sides of the conical tube, two fixing bolts are screwed on the inner walls of the two threaded holes, and a first heat exchange tube is fixed to the inner wall of the conical tube by bolts. The present invention arranges heat exchange tubes on the conical tube and the heat conductive block, and drives the coolant in the two heat exchange tubes to flow by a micro pump, so as to conveniently and quickly extract the heat from the GPU, and then dissipate the heat by the fan, and arranges the cooperation between the telescopic rod and the spring on the heat conductive block, so as to facilitate the attachment of the heat conductive block to the GPU.

[0004] However, the cooling effect of the device is not good. It only uses a heat-conducting block to dissipate heat for the GPU. The heat-conducting block does not have a good guiding function. Since the heat levels of different parts of the GPU and other heating components are different when working, the use of heat-conducting blocks cannot centrally cool down key positions. Therefore, a modular multi-cavity directional cold plate is proposed to solve the above problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a modular multi-cavity directional cold plate, which has the advantages of good cooling effect and solves the problem of poor cooling effect.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a modular multi-cavity directional cold plate, comprising a chip module mounting plate, a chip module capable of performing information processing is provided on the top of the chip module, and a cold plate module capable of directing the chip module for cooling is provided on the top of the chip module.

[0007] Furthermore, the chip module includes a card module fixed to the top of the chip module mounting plate, and a connection module is fixed to the top of the card module.

[0008] Furthermore, the connection module is fixed to the upper surface of the card module, and a clearance hole for the chip to be placed out and matched with the chip is provided on the connection module.

[0009] Furthermore, the cold plate module includes a stabilizing frame fixed to the top of the connection module, and a chip cooling component penetrating the top wall of the stabilizing frame is provided at the bottom of the stabilizing frame.

[0010] Furthermore, the stabilizing frame includes a cold plate bracket, the top of the cold plate bracket is threadedly connected with four mounting screws, each of the mounting screws passes through the cold plate bracket, the cold plate bracket is fixed to the stabilizing frame by the four mounting screws, the top of the cold plate bracket is abutted with four compression springs respectively located on the outer surfaces of the four mounting screws, the four compression springs are respectively abutted against the four mounting screws on one side away from the cold plate bracket, and a heat transfer component is provided at the bottom of the cold plate bracket.

[0011] Furthermore, a stepped groove penetrating the cold plate bracket is provided at the bottom of the cold plate bracket, and the heat transfer assembly consists of two first thermal pads and two second thermal pads, the two first thermal pads are respectively located on the front and rear sides of the stepped groove, and the two first thermal pads are fixed to the bottom of the cold plate bracket, and the two second thermal pads are respectively located on the left and right sides of the stepped groove, and the two second thermal pads are fixed to the bottom of the cold plate bracket.

[0012] Furthermore, the chip cooling assembly includes a cold plate upper cover abutting against the top wall in the stepped groove, the top of the cold plate upper cover is fixedly connected with a liquid inlet pagoda head and a liquid outlet pagoda head, the liquid inlet pagoda head and the liquid outlet pagoda head both pass through the cold plate bracket, the bottom of the cold plate upper cover is fixed with a liquid guide plate, the bottom of the liquid guide plate is fixed with a cold plate bottom cover, and a plurality of shovel teeth are fixed to the top of the cold plate bottom cover and below the liquid guide plate.

[0013] Furthermore, a liquid inlet hole and a liquid outlet hole penetrating the cold plate cover are provided on the top of the cold plate upper cover, a connecting hole penetrating the liquid guide plate is provided on the top of the liquid guide plate, a connecting tube is fixed to the inner top wall of the cold plate upper cover, and the top and bottom of the connecting tube are fixedly connected to the liquid outlet hole and the connecting hole respectively.

[0014] Furthermore, a guide plate is fixed to the inner top wall of the upper cover of the cold plate, and a baffle plate is fixed to the inner top wall of the liquid guide plate, and the baffle plate is located on the right side of the plurality of shovel teeth.

[0015] Furthermore, a guide groove penetrating the liquid guide plate is provided on the top of the liquid guide plate, and the plurality of shovel teeth are respectively located at the front and rear sides of the guide groove.

[0016] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0017] 1. The modular multi-chamber directional cold plate can effectively control the flow direction of the coolant through the cold plate module, and can centrally output the coolant to the severely heated area of the heating element, and then circulate it to the periphery, targeting to solve the heat dissipation problem in the high heat flux density area, further improving the heat dissipation effect, and ensuring the efficient and continuous operation of the heating element.

[0018] 2. For the modular multi-chamber directional cold plate, the first heat conduction pad and the second heat conduction pad can transfer heat to the areas with less heat generation around, further effectively improving the overall heat dissipation effect. At the same time, the modular design can improve the simplicity of subsequent maintenance and replacement by replacing the corresponding parts. Brief Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of the present invention;

[0020] Figure 2 It is a three-dimensional exploded view of the cold plate module of the present invention;

[0021] Figure 3 It is a three-dimensional external view of the stabilizing frame of the present invention;

[0022] Figure 4 It is a three-dimensional exploded view of the chip cooling assembly of the present invention;

[0023] Figure 5 For the present invention Figure 4 The enlarged view at A in;

[0024] Figure 6 It is a three-dimensional view of the connection relationship between the liquid inlet tower head and the cold plate upper cover of the present invention.

[0025] In the figure: 1 chip module mounting plate, 2 chip module, 201 card module, 202 connection module, 3 cold plate module, 301 stabilizing frame, 3011 cold plate bracket, 3012 mounting screw, 3013 compression spring, 3014 first heat conduction pad, 3015 second heat conduction pad, 302 chip cooling assembly, 3021 cold plate upper cover, 3022 liquid inlet tower head, 3023 liquid outlet tower head, 3024 liquid guide plate, 3025 cold plate bottom cover, 3026 shovel tooth. Detailed Embodiment

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] Please refer to Figure 1A modular multi-cavity directional cold plate in this embodiment includes a chip module mounting plate 1, a chip module 2 capable of performing information processing is provided on the top of the chip module mounting plate 1, and a cold plate module 3 capable of directing the chip module 2 for cooling is provided on the top of the chip module 2.

[0028] It needs to be further explained that the chip module 2 includes a card module 201 fixed to the top of the chip module mounting plate 1, and the card module 201 plays a connecting and fixing role to ensure that the chip module 2 is smoothly and stably fixed to the chip module mounting plate 1. A connecting module 202 is fixed to the top of the card module 201, and the connecting module 202 is fixed to the upper surface of the card module 201. The connecting module 202 is provided with a clearance hole for the chip to be placed out and adapted thereto. The chip is installed on the card module 201 and then placed out through the clearance hole on the connecting module 202. The plane where the upper surface of the chip is located is higher than the plane where the upper surface of the connecting module 202 is located, and the connecting module 202 plays a role in connecting to the cold plate module 3.

[0029] In this embodiment, a large amount of heat is generated when high-heat devices such as GPUs are working normally. Due to the different types and distribution of components in different areas, the heat flux density is unevenly distributed. If high-heat devices are too concentrated, a high heat flux density area will be formed. This cold plate design can well target the heat dissipation of high heat flux density areas.

[0030] Please refer again Figure 1 and Figures 2 to 6 In order to improve the cooling effect, the cold plate module 3 in this embodiment includes a stabilizing frame 301 fixed to the top of the connecting module 202. In addition to supporting the chip cooling component 302, the stabilizing frame 301 also effectively dissipates the heat of the peripheral connecting module 202 of the GPU card main chip, which can be molded after mass production, shorten the processing cycle, and reduce costs. The bottom of the stabilizing frame 301 is provided with a chip cooling component 302 that penetrates the top wall of the stabilizing frame 301. The chip cooling component 302 mainly dissipates the heat of the main chip and assists in taking away the heat on the stabilizing frame 301, thereby effectively improving the heat dissipation effect.

[0031] In addition, the stabilizing frame 301 includes a cold plate bracket 3011. A plurality of heat dissipation fins are fixed to the top of the cold plate bracket 3011. The heat dissipation fins can effectively improve the overall heat dissipation effect. If combined with air cooling, the heat dissipation effect can be further improved. Four mounting screws 3012 are threadedly connected to the top of the cold plate bracket 3011. Each mounting screw 3012 passes through the cold plate bracket 3011. The cold plate bracket 3011 is fixed to the stabilizing frame 301 by the four mounting screws 3012. Four compression springs 3013 are abutted against the top of the cold plate bracket 3011 and are respectively located on the outer surfaces of the four mounting screws 3012. The mounting screws 3012 and the compression springs 3013 cooperate to ensure the connection reliability, thereby maximizing the heat dissipation performance on the premise of ensuring that the GPU is not damaged. One side of the four compression springs 3013 away from the cold plate bracket 3011 abuts against the four mounting screws 3012 respectively. A heat transfer component is provided at the bottom of the cold plate bracket 3011.

[0032] It can be understood that a stepped groove penetrating the cold plate bracket 3011 is provided at the bottom of the cold plate bracket 3011. The stepped groove plays a limiting role and can effectively limit the chip cooling component 302, ensuring that the chip cooling component 302 is in contact with heat-generating components such as the GPU. The heat transfer component is composed of two first heat-conducting pads 3014 and two second heat-conducting pads 3015. The two first heat-conducting pads 3014 are respectively located on the front and rear sides of the stepped groove, and both of the two first heat-conducting pads 3014 are fixed to the bottom of the cold plate bracket 3011. The two second heat-conducting pads 3015 are respectively located on the left and right sides of the stepped groove, and both of the two second heat-conducting pads 3015 are fixed to the bottom of the cold plate bracket 3011. The two first heat-conducting pads 3014 and the two second heat-conducting pads 3015 can effectively conduct heat to relatively lower-heat-generating areas around, further improving the overall heat conduction effect.

[0033] It should be further noted that the chip cooling component 302 includes a cold plate upper cover 3021 abutted against the inner top wall of the stepped groove. A liquid inlet tower head 3022 and a liquid outlet tower head 3023 are fixedly communicated with the top of the cold plate upper cover 3021. The liquid inlet tower head 3022 and the liquid outlet tower head 3023 play a role in connection to ensure the continuous flow of the coolant. Both the liquid inlet tower head 3022 and the liquid outlet tower head 3023 pass through the cold plate bracket 3011. A liquid diversion plate 3024 is fixed to the bottom of the cold plate upper cover 3021. A cold plate bottom cover 3025 is fixed to the bottom of the liquid diversion plate 3024. A plurality of shovel teeth 3026 are fixed to the top of the cold plate bottom cover 3025 and below the liquid diversion plate 3024. Through the cooperation of the cold plate upper cover 3021, the liquid diversion plate 3024 and the cold plate bottom cover 3025, a typical sandwich structure is formed. At the same time, the three cooperate to effectively control the flow direction and achieve the purpose of controllable targeted cooling.

[0034] In addition, a liquid inlet hole and a liquid outlet hole penetrating through the upper cover 3021 of the cold plate are formed at the top of the upper cover 3021 of the cold plate, a communication hole penetrating through the liquid guide plate 3024 is formed at the top of the liquid guide plate 3024, and a communication pipe is fixed to the inner top wall of the upper cover 3021 of the cold plate. The communication pipe plays an isolation role to ensure that the incoming liquid and the outgoing liquid will not be mixed, guarantee the stable and continuous flow direction of the liquid, and the top and bottom of the communication pipe are respectively fixedly communicated with the liquid outlet hole and the communication hole.

[0035] Furthermore, a drainage plate is fixed to the inner top wall of the upper cover 3021 of the cold plate, which plays a role in draining the coolant and improves the targeting of the coolant flow. A partition plate is fixed to the inner top wall of the liquid guide plate 3024. The partition plate can block the coolant to ensure that the coolant that just falls onto the liquid guide plate 3024 and the bottom cover 3025 of the cold plate will not flow out directly, and ensure that the liquid can only smoothly enter the communication pipe through the pin fins 3026 first. The partition plate is located on the right side of the plurality of pin fins 3026. A flow guide groove penetrating through the liquid guide plate 3024 is formed at the top of the liquid guide plate 3024, and the plurality of pin fins 3026 are respectively located on the front and back sides of the flow guide groove.

[0036] In this embodiment, according to the different heat flux densities of the chips, the density of the pin fins 3026 and the size of the water inlet of the liquid guide plate 3024 can be adjusted during production. The design idea is that the density of the pin fins 3026 in the area with a high heat flux density is high and the water inlet of the guide plate is large, while in the area with a small heat flux density, the density of the pin fins 3026 is sparse and the water inlet is small. Through the design of the pin fins 3026 and the flow direction of the flow channel, as well as the size of the water inlet of the guide plate, the heat dissipation effect is improved.

[0037] It can be understood that the chip module 2 provides reliable support for the whole. The installation screw 3012 and the compression spring 3013 cooperate to improve the connection stability between the cold plate module 3 and the chip module 2. Finally, the special structural design of the chip cooling component 302 can achieve the targeted flow effect and improve the heat dissipation effect.

[0038] All the electrical components mentioned in the text are electrically connected to the controller and the power supply. The control mode of the present invention is controlled by the controller. The control circuit of the controller can be realized by simple programming of those skilled in the art. The provision of the power supply also belongs to the common knowledge in the art, and the present invention mainly aims to protect the mechanical device, so the control mode and the circuit connection of the present invention will not be explained in detail.

[0039] The working principle of the above embodiment is as follows:

[0040] When in use, the coolant first enters the cold plate upper cover 3021 from the liquid inlet pagoda head 3022 and the liquid inlet hole. Due to the obstruction of the guide plate, the coolant can move in the direction of the guide plate, and further enter between the liquid guide plate 3024 and the cold plate bottom cover 3025 through the guide groove. When the coolant flows in, this is the high temperature place of the heat-generating components such as the GPU. At this time, the strong temperature difference can quickly take away a large amount of heat. At the same time, the multiple shovel teeth 3026 play a drainage role, causing the relatively high temperature coolant to flow to the outside through the multiple shovel teeth 3026, and finally flow to the liquid outlet pagoda head 3023 through the connecting hole and the connecting pipe, thereby achieving stable and continuous cooling. The heat dissipation effect at the flow path end is high, and the ability to take away heat is strong.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0042] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A modular multi-cavity directional cold plate, comprising a chip module mounting plate (1), characterized in that: A chip module (2) capable of performing information processing is arranged on the top of the chip module mounting plate (1), and a cold plate module (3) capable of directing the chip module (2) for cooling is arranged on the top of the chip module (2).

2. The modular multi-cavity directional cold plate according to claim 1, wherein: The chip module (2) comprises a card module (201) fixed to the top of the chip module mounting plate (1), and a connection module (202) is fixed to the top of the card module (201).

3. The modular multi-cavity directional cold plate according to claim 2, characterized in that: The connection module (202) is fixed to the upper surface of the card module (201), and a clearance hole for the chip to be placed out and adapted thereto is provided on the connection module (202).

4. The modular multi-chambered directional cold plate according to claim 2, wherein: The cold plate module (3) comprises a stabilizing frame (301) fixed to the top of the connection module (202), and a chip cooling component (302) penetrating the top wall of the stabilizing frame (301) is provided at the bottom of the stabilizing frame (301).

5. The modular multi-cavity directional cold plate according to claim 4, wherein: The stabilizing frame (301) comprises a cold plate support (3011), the top of the cold plate support (3011) is threadedly connected with four mounting screws (3012), each of the mounting screws (3012) passes through the cold plate support (3011), the cold plate support (3011) is fixed to the stabilizing frame (301) by the four mounting screws (3012), the top of the cold plate support (3011) is abutted with four compression springs (3013) respectively located on the outer surfaces of the four mounting screws (3012), the four compression springs (3013) are respectively abutted against the four mounting screws (3012) on the side away from the cold plate support (3011), and a heat transfer component is provided at the bottom of the cold plate support (3011).

6. The modular multi-cavity directional cold plate according to claim 5, wherein: The bottom of the cold plate bracket (3011) is provided with a stepped groove penetrating the cold plate bracket (3011); the heat transfer component is composed of two first thermal pads (3014) and two second thermal pads (3015); the two first thermal pads (3014) are respectively located on the front and rear sides of the stepped groove; the two first thermal pads (3014) are both fixed to the bottom of the cold plate bracket (3011); the two second thermal pads (3015) are respectively located on the left and right sides of the stepped groove; the two second thermal pads (3015) are both fixed to the bottom of the cold plate bracket (3011).

7. The modular multi-cavity direct cooling plate according to claim 6, wherein: The chip cooling assembly (302) comprises a cold plate upper cover (3021) abutting against the top wall in the stepped groove, the top of the cold plate upper cover (3021) is fixedly connected with a liquid inlet pagoda head (3022) and a liquid outlet pagoda head (3023), both of which pass through the cold plate bracket (3011), a liquid guide plate (3024) is fixed at the bottom of the cold plate upper cover (3021), a cold plate bottom cover (3025) is fixed at the bottom of the liquid guide plate (3024), and a plurality of shovel teeth (3026) are fixed at the top of the cold plate bottom cover (3025) and below the liquid guide plate (3024).

8. A modular multi-chambered directional cold plate according to claim 7, characterized in that: The top of the cold plate upper cover (3021) is provided with a liquid inlet hole and a liquid outlet hole penetrating through the cold plate upper cover (3021). The top of the liquid guide plate (3024) is provided with a communication hole penetrating through the liquid guide plate (3024). The inner top wall of the cold plate upper cover (3021) is fixed with a communication pipe, and the top and bottom of the communication pipe are fixedly communicated with the liquid outlet hole and the communication hole respectively.

9. A modular multi-chamber directional cold plate according to claim 7, characterized in that: The inner top wall of the cold plate upper cover (3021) is fixed with a drainage plate, and the inner top wall of the liquid guide plate (3024) is fixed with a baffle plate, and the baffle plate is located on the right side of a plurality of shovel teeth (3026).

10. A modular multi-cavity directional cold plate according to claim 7, characterized in that: The top of the liquid guide plate (3024) is provided with a diversion groove penetrating through the liquid guide plate (3024), and a plurality of the shovel teeth (3026) are respectively located on the front and rear sides of the diversion groove.

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