Auxiliary heat dissipation device for tablet type fixed-fixed contact notebook computer

Abstract

The invention discloses a tablet type fixed-fixed contact notebook computer auxiliary heat dissipation device, and relates to the technical field of heat dissipation of electronic equipment. The heat dissipation module in the notebook computer is provided with a flat heat conduction contact surface which is in solid-solid contact with the corresponding flat heat conduction contact surface on the external water cooling head, and part of heat in the notebook computer can be conducted to the external water cooling head and then conducted to the water cooling radiator through the solid-solid contact surface, so that auxiliary heat dissipation of the notebook computer is achieved. Wherein a wafer slice in the semiconductor manufacturing field is innovatively selected as a flat plate heat conduction contact surface, the selected semiconductor wafer slice has excellent surface roughness and flatness indexes, and the heat conduction thermal resistance of a solid-solid contact surface can be effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and particularly focuses on heat dissipation for portable high-power devices such as laptop computers. Background Art

[0002] Existing laptop computers all use heat pipes or vapor chambers to transfer heat to heat dissipation fins, and internally install fans to suck in external cold air, so that a sufficient amount of cold air can conduct heat exchange with the heat dissipation fins to complete the heat exchange from the inside of the laptop to the external environment. However, with the continuous improvement of the performance of computing chips mainly based on CPUs and GPUs, the heat generation power has gradually increased, and the heat dissipation performance of laptop computers also needs to be gradually improved. Using the existing heat dissipation solutions for laptop computers, only by increasing the area of the heat dissipation fins can the heat dissipation power be increased, which brings a relatively large weight for high-performance laptop computers. And the weight of the laptop cannot increase infinitely, thus there is a need for auxiliary heat dissipation for laptop computers.

[0003] For example, in the laptop model "MECHREVO Z16 Ultra", a water cooling plate is internally installed in the laptop, and part of the heat generated inside can be conducted to the external water cooling radiator through the water cooling plate, achieving the equivalent effect of increasing the area of the heat dissipation fins externally.

[0004] The solution of using a liquid medium for heat transfer inside the laptop computer has some usage defects. The water cooling connectors used may have a risk of liquid leakage after multiple pluggings and unplugings, which may further cause water ingress inside the laptop computer. And after disconnecting from the water cooling radiator, there will still be a part of the liquid remaining in the water cooling plate inside the laptop, and the long-term retention of the liquid will also increase the risk of corrosion and damage to the sealing connectors and the internal water cooling pipelines. Summary of the Invention

[0005] In order to overcome the risk of liquid leakage in the internal water cooling pipelines of laptop computers, which may lead to liquid ingress damage to the laptop computers, a flat solid-solid contact heat conduction form is proposed. Part of the heat inside the laptop computer is conducted to the external water cooling pipeline through the mutual contact of the heat conduction interfaces of the two internal and external flat plates, so as to achieve the same effect of external auxiliary water cooling heat dissipation. There is no water cooling pipeline inside the laptop computer, eliminating the risk of liquid ingress damage inside the laptop computer.

[0006] The core of the present invention is to add a flat heat conduction contact surface to the existing laptop computer heat dissipation module, and set a corresponding flat heat conduction contact surface on the external water cooling heat dissipation component. The two flat heat conduction contact surfaces are in direct contact, and no other heat conduction medium needs to be filled between the contact interfaces, which is a flat solid-solid contact. The internal components of the laptop computer and the external water cooling heat dissipation component can form a heat conduction path through the solid-solid contact form of the two flat heat conduction contact surfaces. Finally, part of the heat inside the laptop computer is conducted to the external water cooling radiator through this heat conduction path, realizing the auxiliary heat dissipation for the laptop computer.

[0007] The flat heat-conducting contact surface is required to have high flatness and low surface roughness to reduce the contact thermal resistance between the two heat-conducting contact surfaces. In the present invention, a wafer slice in the semiconductor manufacturing field is selected to serve as the flat heat-conducting contact surface. It has a relatively low existing procurement cost, and excellent surface roughness and flatness indexes, which is an ideal selection scheme.

[0008] According to the core principle described above, the technical solution adopted in the present invention is: a notebook computer auxiliary heat dissipation device with flat solid-solid contact, including a heat dissipation module, a D-shell, a water-cooling head, and a base, and a water pump, a water-cooling radiator, water-cooling pipes, and water-cooling pipe joints are additionally designed on the periphery.

[0009] The above-mentioned notebook computer auxiliary heat dissipation device with flat solid-solid contact has a heat dissipation module that is roughly the same as the existing notebook computer internal heat dissipation module, both including a heat pipe, heat pipes, and heat dissipation fins. However, additionally, a first semiconductor wafer slice is added to the heat pipes; the heat dissipation module is designed as two heat pipes with appropriate areas. One side of the two heat pipes is brazed to 4 heat pipes to ensure good heat conduction from the heat pipes to the heat pipes; the other side of the heat pipes is in direct contact with the CPU and GPU chips and filled with a heat-conducting medium such as thermal grease to reduce the thermal resistance of heat conduction; there are openings around the two heat pipes, and it is designed to use screws to fix the heat dissipation module to the motherboard of the notebook computer; on the heat pipes, 3 threaded bases are designed at appropriate positions to achieve threaded connection between the heat dissipation module and the D-shell of the notebook computer; the 4 heat pipes have a flat cross-section, and 3 of the longer heat pipes are bent into appropriate shapes, and their lower surfaces are brazed to the heat dissipation fins. Another shortest heat pipe only spans and connects the two heat pipes, while balancing the heat distribution of the two heat pipes and increasing the area of the heat pipes connected side by side; the lower surfaces of the 4 heat pipes are brazed side by side to the heat pipes, and a suitable-sized area is spliced side by side on the upper part of one of the heat pipes. On the upper surface of the heat pipes in this area, a first semiconductor wafer slice is brazed; the first semiconductor wafer slice is a square thin slice, designed to be 43mm * 43mm * 0.7mm, and the thickness of 0.7mm can effectively reduce the thermal resistance of the first semiconductor wafer slice itself; the material of the first semiconductor wafer slice is silicon, and it is polished on one side. The polished surface has excellent flatness and low surface roughness. The process data that can be referred to for the polished surface are: flatness TIR < 3um, warpage TTV < 10um, bow BOW < 10pm, roughness RA < 0.5nm, and particle size < 10 (for size > 0.3pm); the non-polished surface of the first semiconductor wafer slice is brazed to the upper surface of the heat pipes in the area to fix the first semiconductor wafer slice on the heat dissipation module and can effectively reduce the thermal resistance from the heat pipes to the first semiconductor wafer slice; the polished surface of the first semiconductor wafer slice is the flat heat-conducting contact surface on the heat dissipation module, which can be in solid-solid contact with the corresponding external heat-conducting contact surface, so that part of the heat inside the notebook computer is conducted to the outside through this heat-conducting plane, thereby achieving auxiliary heat dissipation; the first semiconductor wafer slice can also be a wafer slice made of materials such as silicon carbide and diamond according to the technological iteration of semiconductor chips and the manufacturing cost to improve the thermal conductivity of the flat heat-conducting contact surface itself and optimize the performance of auxiliary heat dissipation.

[0010] The heat dissipation fins are formed by splicing small components bent from copper sheets into a long rectangular shape, and the length, width and height dimensions meet the requirements of the internal space of the notebook computer; the heat dissipation fins are distributed at the heat dissipation air outlet of the notebook computer, and one of the upper and lower sides is brazed to the heat pipe to conduct the heat on the heat pipe to the heat dissipation fins. The built-in fan of the notebook computer sucks in external cold air, so that a sufficient amount of cold air conducts heat transfer with the heat dissipation fins, and most of the heat inside the notebook computer is exchanged with the external ambient air.

[0011] For the above-mentioned flat solid-solid contact notebook computer auxiliary heat dissipation device, the D shell has a square opening of the same size at the corresponding position of the first semiconductor wafer slice of the heat dissipation module, so that the flat heat conduction contact surface on the notebook computer heat dissipation module can contact the corresponding external heat conduction contact surface outward; at the square opening on the outer side of the notebook computer, the D shell has a bevel design on the side to facilitate the guiding connection with the corresponding external heat conduction contact surface; at the square opening on the inner side of the notebook computer, the D shell is designed with a thickened edge to enhance the structural strength of the opening; the D shell is designed with 3 stepped through holes around the opening, and the opening positions correspond to the positions of 3 threaded bases on the heat dissipation module to realize the threaded connection between the D shell and the heat dissipation module; according to the internal space distribution of the notebook computer, the D shell is designed with 3 inwardly protruding positioning holes at appropriate positions, which are responsible for cooperating with the positioning pins at the corresponding positions on the base to realize the docking positioning of the internal and external heat conduction contact surfaces.

[0012] For the above-mentioned flat solid-solid contact notebook computer auxiliary heat dissipation device, the water-cooling head is composed of a water-cooling head bottom plate, a water-cooling head top cover and a second semiconductor wafer slice.

[0013] The water-cooling head bottom plate is integrally milled from a copper block, and is designed with counterbores around to realize the threaded connection with the water-cooling head top cover; the convex side of the water-cooling head bottom plate is a regular quadrangular pyramid, and the second semiconductor wafer slice is brazed on the top plane of the pyramid; the concave side of the water-cooling head bottom plate is also an inverted regular quadrangular pyramid structure corresponding to the convex side, and a group of micro water channels are opened on the bottom plane, and the coolant flows through the micro water channels to increase the contact area with the coolant; the bottom plane of the concave side of the water-cooling head bottom plate, in the area of the micro water channels, cooperates with the middle boss on the bottom surface of the water-cooling head top cover to close the top surface of the micro water channels; the micro water channels of the water-cooling head bottom plate are designed to allow the coolant to flow in from the middle of the micro water channels and flow out from both sides; the area around the group of micro water channels on the bottom plane of the concave side of the water-cooling head bottom plate cooperates with the corresponding grooves of the water-cooling head top cover to form a return channel for the coolant.

[0014] The second semiconductor wafer slice is similar to that on the heat dissipation module, being a square thin sheet with a designed size of 40mm * 40mm * 0.7mm; the material of the second semiconductor wafer slice is silicon, with single-sided polishing. The process data that can be referred to for the polished surface are: flatness TIR < 3um, warp TTV < 10um, bow BOW < 10pm, roughness RA < 0.5nm, particle size < 10 (for size > 0.3pm). The designed size is slightly smaller than the square opening on the D shell, facilitating the alignment and fitting of the second semiconductor wafer slice on the water-cooling head with the first semiconductor wafer slice on the heat dissipation module through the square opening of the D shell; the non-polished surface of the second semiconductor wafer slice is brazed to the top surface of the convex side prism of the water-cooling head bottom plate to reduce the thermal resistance of heat conduction from the second semiconductor wafer slice to the water-cooling head bottom plate; the polished surface of the second semiconductor wafer slice is another flat heat conduction contact surface, which can be in solid-solid contact with the corresponding heat conduction contact surface on the notebook computer heat dissipation module, enabling part of the heat inside the notebook computer to be conducted to the outside through the two mutually contacting heat conduction planes, thereby realizing auxiliary heat dissipation; the second semiconductor wafer slice can also, depending on the technological iteration of semiconductor chips, use wafer slices made of materials such as silicon carbide and diamond according to manufacturing costs to improve the thermal conductivity coefficient of the flat heat conduction contact surface itself and optimize the performance of auxiliary heat dissipation.

[0015] The top cover of the water-cooling head is designed to mill out the corresponding structure from acrylic material, with threaded holes drilled at the four corners to achieve threaded connection and fixation with the water-cooling head bottom plate; the bottom surface of the water-cooling head top cover is matched with the concave side of the water-cooling head bottom plate. An annular groove is designed on the periphery of the bottom surface of the water-cooling head top cover for placing an annular sealing ring to seal the fitting surface between the water-cooling head top cover and the water-cooling head bottom plate, preventing liquid leakage of the whole water-cooling head; in the middle area of the bottom surface of the water-cooling head top cover, there is a convex platform, which is matched with the bottom plane of the concave side of the water-cooling head bottom plate to close the top surface of the micro-channel; on the bottom surface of the water-cooling head top cover, grooves are opened at appropriate positions, which cooperate with the area around the micro-channel of the water-cooling head bottom plate to form a return channel for the coolant; on the bottom surface of the water-cooling head top cover, two drill holes are provided at appropriate positions, which are respectively connected to the inlet and outlet water ports on the side of the water-cooling head top cover to supply the coolant to the micro-channel; on one side of the water-cooling head top cover, there are two openings, which are respectively the inlet and outlet water ports of the coolant. G1 / 4 pipe threads are tapped at the openings to achieve connection with the water-cooling pipe joint; the water-cooling head top cover and the water-cooling head bottom plate are connected and matched to enable the coolant to flow into the middle of the micro-channel from the inlet water port, flow out from both sides of the micro-channel, and then pass through the return channel and finally flow out of the water-cooling head from the outlet water port; on the left and right sides of the water-cooling head top cover, there are two lugs each. While having a certain thickness, there is also a circular through-hole in the middle of the lugs, which is designed to cooperate with the guiding posts on the base to realize the guiding movement of the whole water-cooling head.

[0016] The above-mentioned notebook computer auxiliary heat dissipation device with flat solid-solid contact has a hollow base structure. The water-cooling head assembly is designed and installed inside the base. The notebook computer can be reliably placed on the base, and the D-shell of the notebook computer is positioned and connected to the base to align the flat heat-conducting contact surfaces of the water-cooling head and the notebook computer heat dissipation module. The water-cooling head moves through guidance to achieve the solid-solid contact and cooperation between the flat heat-conducting contact surface on the water-cooling head and the flat heat-conducting contact surface on the notebook computer; the base can place the notebook computer on its upper part. At this time, the notebook computer is lifted at a certain inclination angle to increase the air intake of the notebook computer itself and enhance the air-cooling heat dissipation performance of the notebook computer itself; the upper plane of the base has a certain inclination angle, which is the same as the lifting inclination angle of the notebook computer, ensuring the positioning and cooperation between the notebook computer and the base; there is an opening on the upper part of the base, and the flat heat-conducting contact surface on the water-cooling head extends through this opening to contact the flat heat-conducting contact surface on the notebook computer; there are 3 positioning pins on the upper part of the base, which are square cylinders, and their sizes and shapes correspond to the positioning holes on the D-shell of the notebook computer. The positioning connection between the positioning holes and the positioning pins is used to achieve the positioning and alignment of the flat heat-conducting contact surface on the water-cooling head and the flat heat-conducting contact surface on the notebook computer; there are chamfers around the top of the positioning pin to facilitate the sliding connection with the positioning holes on the D-shell of the notebook computer; the top surface height of the positioning pin is slightly higher than the flat heat-conducting contact surface on the water-cooling head, aiming to protect the flat heat-conducting contact surface on the water-cooling head from touching the D-shell during the positioning placement of the notebook computer; in the upper area inside the base, 4 guide posts are designed at appropriate positions and cooperate with the lugs on the water-cooling head cover, enabling the lugs to slide up and down along the direction of the guide posts, thereby realizing the up and down movement of the entire water-cooling head; after the guide posts and the lugs on the water-cooling head cover are installed in alignment, a compression spring is added and locked with flat head screws to achieve the connection and cooperation between the water-cooling head assembly and the base; there are two long strip-shaped openings on the side of the base to achieve the connection between the water-cooling head installed inside the base and the water-cooling pipe.

[0017] The above-mentioned notebook computer auxiliary heat dissipation device with flat solid-solid contact is assisted by a water pump, a water-cooled radiator, water-cooled pipes and water-cooled pipe joints in its peripheral design. The connection and cooperation with the water-cooled head form an external cooling loop for the notebook computer, thereby realizing the auxiliary heat dissipation of the notebook computer. The water pump selected is a centrifugal pump, which centrifugally drives the liquid flow in the external cooling loop, and its interface thread is a G1 / 4 pipe thread. The water-cooled radiator selected is a "240 radiator", which is responsible for realizing the heat exchange with the ambient air, and its interface thread is a G1 / 4 pipe thread. The water-cooled pipe selected is a water-cooled hose with an inner diameter of 8 mm and an outer diameter of 12 mm, which realizes the connection with the water-cooled pipe joint. One end of the water-cooled pipe joint is a 9 mm outer diameter pagoda water nozzle, which is responsible for connecting the water-cooled pipe, and the other end is a G1 / 4 pipe thread joint, which is responsible for connecting the relevant interfaces. The water pump, the water-cooled radiator, the water-cooled pipes and the water-cooled pipe joints can all refer to the water-cooled heat dissipation technology solutions used by the computer and purchase existing products. The selection of the water pump, the water-cooled radiator, the water-cooled pipes and the water-cooled pipe joints is recommended but not mandatory.

[0018] The beneficial effects of the present invention are that the auxiliary heat dissipation can be elegantly realized by placing the notebook computer on the base, improving the heat dissipation performance of the notebook computer. Through the positioning and cooperation between the base and the D shell of the notebook computer, the flat heat conduction contact surface on the internal heat dissipation module of the notebook computer is brought into contact with the flat heat conduction contact surface of the external water-cooled head, thereby realizing the heat conduction between the inside of the notebook computer and the external water-cooled radiator, and avoiding the introduction of water-cooled pipelines inside the notebook computer. All the water-cooling devices are placed outside, and the components of the water-cooling devices do not need to be disassembled, effectively reducing the risk of coolant leakage and liquid ingress into the notebook computer. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below.

[0020] Figure 1 It is a schematic diagram of the overall flat-type solid-solid contact notebook computer auxiliary heat dissipation device.

[0021] Figure 2 It is a bottom view schematic diagram of a flat-type solid-solid contact notebook computer auxiliary heat dissipation device.

[0022] Figure 3 It is a schematic diagram of the structure of the heat dissipation module in a flat-type solid-solid contact notebook computer auxiliary heat dissipation device.

[0023] Figure 4 It is a schematic diagram of the inner structure of the D shell in a flat-type solid-solid contact notebook computer auxiliary heat dissipation device.

[0024] Figure 5It is a schematic diagram of the overall water-cooling head in a notebook computer auxiliary heat dissipation device with flat-plate solid-solid contact.

[0025] Figure 6 It is a schematic diagram of the bottom plate of the water-cooling head in a notebook computer auxiliary heat dissipation device with flat-plate solid-solid contact.

[0026] Figure 7 It is a schematic diagram of the top cover of the water-cooling head in a notebook computer auxiliary heat dissipation device with flat-plate solid-solid contact.

[0027] Figure 8 It is a schematic diagram of the inside of the base in a notebook computer auxiliary heat dissipation device with flat-plate solid-solid contact.

[0028] Figure 9 It is a schematic diagram of the assembly of the water-cooling head and the base in a notebook computer auxiliary heat dissipation device with flat-plate solid-solid contact.

[0029] In the attached drawings: 1. Heat dissipation module; 101. Heat pipe plate; 102. Heat pipe; 103. Heat dissipation fins; 104. First semiconductor wafer slice; 2. D shell; 201. Positioning hole; 3. Water-cooling head; 301. Bottom plate of the water-cooling head; 302. Top cover of the water-cooling head; 303. Second semiconductor wafer slice; 4. Base; 401. Positioning pin; 402. Guide post; 5. Water pump; 6. Water-cooled radiator; 7. Water-cooling pipe; 8. Water-cooling pipe joint; 9. Heat dissipation fan; 10. Overall notebook computer. Detailed implementation mode

[0030] The structure and usage steps of the present invention will be further described below in conjunction with the attached drawings, which are explanations rather than limitations of the present invention.

[0031] As Figure 1 shown, what is described is the overall schematic diagram of the present invention. The present invention mainly includes a heat dissipation module 1, a D shell 2, a water-cooling head 3, a base 4, and is supplemented with a water pump 5, a water-cooled radiator 6, a water-cooling pipe 7, and a water-cooling pipe joint 8.

[0032] The present invention can be divided into two parts: internal components and external components of the notebook computer. The internal components include the D shell 2 and the heat dissipation module 1 on the notebook computer; the external components include the water-cooling head 3, the base 4, the water pump 5, the water-cooled radiator 6 (a heat dissipation fan 9 can be added), the water-cooling pipe 7, and the water-cooling pipe joint 8.

[0033] The heat dissipation module 1 includes: a heat pipe plate 101, a heat pipe 102, heat dissipation fins 103, and a first semiconductor wafer slice 104.

[0034] The water-cooling head 3 includes: a bottom plate 301 of the water-cooling head, a top cover 302 of the water-cooling head, and a second semiconductor wafer slice 303.

[0035] For the internal components, the heat dissipation module 1 is installed inside the laptop. The vapor chamber 101, heat pipes 102, and heat sink fins 103 are connected by brazing. A first semiconductor wafer slice 104 is brazed on the upper surface of the heat pipe 102, and the non-polished surface is the brazing surface. The vapor chamber 101 is in contact with the surfaces of the CPU and GPU wafers, and a heat-conducting medium such as thermal grease is filled between the contact surfaces to reduce the contact thermal resistance from the chip to the vapor chamber 101. The heat dissipation module 1 is fixedly connected to the laptop motherboard by screws. The D-shell 2 is threadedly connected to the threaded base on the heat dissipation module 1 and the laptop case.

[0036] For the external components, in the water block 3, the water block bottom plate 301 and the water block top cover 302 are connected by countersunk head screws, and the contact surface between the two is sealed with a sealing ring. A second semiconductor wafer slice 303 is brazed on the upper surface of the protruding side of the water block bottom plate 301, and the non-polished surface is the brazing surface. The lugs on the water block 3 are installed and connected to the guide posts 402 inside the base 4 to realize the up and down movement of the water block 3 in the length direction of the guide posts 402. Refer to Figure 9 Add compression springs and use flat head screws to lock the 4 guide posts 402 shown in the attached drawing, then the installation connection between the water block 3 and the base 4 can be realized. The water inlets and outlets of the water block 3, water pump 5, and water cooling radiator 6 are all installed and connected with water pipe connectors 8. The water inlets and outlets of the water block 3 are connected in series with the outlets and inlets of the water cooling radiator 6 and the water pump 5 through the water pipe 7 to form a water cooling circulation loop. The water pump 5 provides the liquid flow pressure to transfer the heat of the second semiconductor wafer slice 303 on the water block 3 in the external components to the water cooling radiator 6 through the coolant, and then through the water cooling radiator 6, heat exchange is carried out with the ambient air.

[0037] When this technical solution is in use, the entire laptop 10 is placed on the base 4. The positioning holes 201 on the D-shell 2 and the positioning pins 401 on the base 4 are positioned and connected. At the same time, the first semiconductor wafer slice 104 on the laptop heat dissipation module 1 is parallel and aligned with the second semiconductor wafer slice 303 on the water block 3 inside the base 4. When the positioning pins 401 on the base 4 are aligned and slide into the positioning holes 201 on the D-shell 2, and at the same time, the polished surfaces of the first semiconductor wafer slice 104 on the heat dissipation module 1 and the second semiconductor wafer slice 303 on the water block 3 are in solid-solid contact, the heat inside the laptop is conducted through this solid-solid contact surface to the water block 3, and then conducted to the water cooling radiator 6 through the coolant, realizing heat exchange with the environment, that is, realizing the auxiliary heat dissipation of the laptop.

Claims

1. A notebook computer auxiliary heat dissipation device with flat solid-solid contact, the main components of which include a heat dissipation module (1), a D shell (2), a water cooling head (3) and a base (4); the heat dissipation module (1) is installed inside the notebook computer and includes a heat pipe plate (101), heat pipes (102), heat dissipation fins (103) and a first semiconductor wafer slice (104); the cross-section of the heat pipes (102) is flat, the number is not less than 1 and is bent into an appropriate shape, and its lower surface is brazed and spliced side by side on the heat pipe plate (101); heat dissipation fins (103) are brazed at appropriate positions on the lower surface of the heat pipes (102), and a first semiconductor wafer slice (104) is brazed in an appropriate area on the upper surface of the heat pipes (102); the D shell (2) is installed on the notebook computer, and there is an opening at a corresponding position, and the size, shape and position of the opening correspond to the first semiconductor wafer slice (104) on the heat dissipation module (1); the D shell (2) is provided with positioning holes (201) at appropriate positions; the base (4) is designed with a corresponding number of positioning pins (401) to achieve positioning connection with the positioning holes (201) on the D shell (2); the water cooling head (3) is installed inside the base (4) and includes a water cooling head top cover (302), a water cooling head bottom plate (301), and a second semiconductor wafer slice (303).

2. The notebook computer auxiliary heat dissipation device with flat solid-solid contact according to claim 1, characterized in that The plane where the first semiconductor wafer slice (104) and the second semiconductor wafer slice (303) are in contact with each other has high flatness and low surface roughness, including but not limited to semiconductor wafer slices made of silicon, silicon carbide and diamond materials.

3. The flat plate type solid-solid contact notebook computer auxiliary heat dissipation device according to claim 1, characterized in that, One side of the water cooling head bottom plate (301) is an outwardly convex quadrangular frustum, and a second semiconductor wafer slice (303) is brazed on the top surface of the outwardly convex quadrangular frustum; the other side of the water cooling head bottom plate (301) is an inwardly concave quadrangular frustum, and micro water channels are opened on the bottom surface of the inwardly concave quadrangular frustum.

4. The flat plate type solid-solid contact notebook computer auxiliary heat dissipation device according to claim 1, characterized in that, A water inlet and outlet is opened on one side edge of the water cooling head top cover (302). After the water cooling head top cover (302) is connected with the water cooling head bottom plate (301), the coolant can flow in from the water inlet, flow through the micro water channels on the water cooling head bottom plate (301), and flow out from the water outlet; there are lug structures at appropriate positions on the side edge of the water cooling head top cover (302), and through holes are provided on the lugs.

5. The flat solid-solid contact laptop computer auxiliary heat dissipation device according to claim 1, characterized in that, Guide posts (402) are arranged inside the base (4), which can cooperate with the through holes on the lugs on the side edge of the water cooling head top cover (302) to realize the guiding movement of the water cooling head (3).

6. The flat plate type solid-solid contact laptop computer auxiliary heat dissipation device according to claim 1 or 2, characterized in that When the notebook computer is placed on the base (4), the first semiconductor wafer slice (104) on the heat dissipation module (1) can be positioned and attached to the second semiconductor wafer slice (303) on the water cooling head (3).

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