Shell injection molding optimization method and device, storage medium and program product

Abstract

The invention provides a shell injection molding optimization method and device, a storage medium and a program product. The shell injection molding optimization method comprises the following steps: establishing an initial injection molding simulation model based on an obtained injection molding part structure and injection molding process conditions; performing mold flow simulation analysis according to the initial injection molding simulation model to generate initial mold flow analysis data; performing data analysis processing according to the initial mold flow analysis data and the main influence factors to obtain optimized injection molding process conditions; according to optimized injection molding process conditions, the initial injection molding simulation model is optimized, an optimized injection molding simulation model is obtained, and real pouring is conducted according to the optimized injection molding simulation model. The injection molding process is optimized by establishing the simulation model, and the optimal injection molding process parameters meeting specific optimization requirements are obtained by adjusting the parameters of the injection molding simulation model in the simulation injection molding process, so that the purpose of improving the production efficiency and the quality of injection molded parts is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to an optimization method, device, storage medium and program product for shell injection molding. Background Art

[0002] At present, in the field of chip packaging thermoplastic injection molding, there are still many problems in the preparation of glass fiber reinforced composite material with an embedded hole shell. First of all, after adding glass fibers, the strength and rigidity of the material can be significantly improved. However, due to the difference in fluidity between glass fibers and the material itself, when the plastic melt is divided by the embedded holes and then converges, the polymer chains at the plastic joint surface are parallel to each other, and the melt properties are different (the time / temperature / pressure in the mold cavity are all different), which will form a weld line, resulting in poor structural strength in this area at the microscopic level.

[0003] In addition, affected by temperature, glass fibers are prone to agglomeration locally, resulting in the exposure of glass fibers on the injection molded parts, that is, the phenomenon of fiber floating occurs, which affects the surface gloss of the parts. More serious fiber floating will directly affect the mechanical stability of the injection molded parts. When the corresponding plastic parts are used as electronic devices such as electrical component shells and electrical component structural parts, it will seriously affect their use performance, reduce the product quality, and the fiber distribution of the material is not easy to detect. If a shell with insufficient strength is used, it will pose a safety hazard to the application scenarios of electronic devices.

[0004] Traditional injection molding processes rely on the experience and trial-and-error of engineers, resulting in a long development cycle, low efficiency and material waste. Summary of the Invention

[0005] In view of the problems existing in the prior art, the present invention provides an optimization method, device, storage medium and program product for shell injection molding, which at least partially solves the problems of long cycle, low efficiency and material waste existing in the prior art.

[0006] In a first aspect, an embodiment of the present disclosure provides an optimization method for shell injection molding, including: Establishing an initial injection molding simulation model based on the obtained injection molded part structure and injection molding process conditions; Performing mold flow simulation analysis according to the initial injection molding simulation model to generate initial mold flow analysis data; Performing data analysis and processing according to the initial mold flow analysis data and main influencing factors to obtain optimized injection molding process conditions; Optimizing the initial injection molding simulation model according to the optimized injection molding process conditions to obtain an optimized injection molding simulation model, and performing real casting according to the optimized injection molding simulation model.

[0007] Optionally, the initial mold flow analysis data includes: The rheological properties of the workpiece and the interfacial properties of the workpiece.

[0008] Optionally, the rheological properties of the workpiece are the relationship of behavioral changes during the cooling process, and the behavioral changes include pressure, volume, and temperature; The interfacial properties of the workpiece are the weld lines generated during the filling process and their strength.

[0009] Optionally, the threshold of the weld line strength judgment criterion is 0 to 75°, and the corresponding strength is 0 to 1.

[0010] Optionally, establishing the initial injection molding simulation model based on the obtained injection molded part structure and injection molding process conditions includes: establishing the initial injection molding simulation model according to the optimization requirements, The optimization requirements are the weld line strength generated during the injection molding process and the balance of volume shrinkage rate and the difference in sink mark amount in adjacent regions.

[0011] Optionally, performing data analysis and processing according to the initial mold flow analysis data and the main influencing factors to obtain the optimized injection molding process conditions, including: evaluating the initial injection molding simulation model based on the quality index, and the calculation formula for evaluating the quality index of the injection molding simulation model is: , Wherein, is the quality index of the initial injection molding simulation model, is the preset characteristic coefficient, is the minimum value of the weld line angle, is the maximum value of the sink mark amount, is the maximum value of the volume shrinkage rate.

[0012] Optionally, the quality index threshold of the initial injection molding simulation model is 0 to 1, and the closer it is to 1, the better the quality.

[0013] In a second aspect, an embodiment of the present disclosure further provides an electronic device, which includes: At least one processor; and, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute any one of the housing injection molding optimization methods in the first aspect.

[0014] In a third aspect, an embodiment of the present disclosure further provides a computer-readable storage medium, which stores computer instructions for causing a computer to execute any one of the housing injection molding optimization methods in the first aspect.

[0015] Fourthly, an embodiment of the present disclosure further provides a computer program product, including a computer program / instructions, which, when executed by a processor, implement the housing injection molding optimization method described in any of the first aspects.

[0016] The housing injection molding optimization method, device, storage medium and program product provided by the present invention. In the housing injection molding optimization method, the injection molding process is optimized by establishing a simulation model, and the parameters of the injection molding simulation model during the simulation injection process are adjusted to obtain the best injection molding process parameters that meet specific optimization requirements, so as to achieve the purpose of improving production efficiency and the quality of injection molded parts. Description of the Drawings

[0017] By describing the exemplary embodiments of the present disclosure in more detail in conjunction with the accompanying drawings, the above and other objects, features and advantages of the present disclosure will become more obvious. Among them, in the exemplary embodiments of the present disclosure, the same reference numerals generally represent the same components.

[0018] Figure 1 It is a flowchart of the housing injection molding optimization method provided by the embodiment of the present disclosure; Figure 2 It is a schematic diagram of the injection molding simulation model No. 5 - weld line provided by the embodiment of the present disclosure; Figure 3 It is a schematic diagram of the injection molding simulation model No. 10 - weld line provided by the embodiment of the present disclosure; Figure 4 It is a schematic diagram of the injection molding simulation model No. 5 - volume shrinkage rate provided by the embodiment of the present disclosure; Figure 5 It is a schematic diagram of the injection molding simulation model No. 10 - volume shrinkage rate provided by the embodiment of the present disclosure; Figure 6 It is a schematic block diagram of an electronic device provided by the embodiment of the present disclosure. Detailed Embodiments

[0019] The embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings.

[0020] It should be clear that the following illustrates the implementation manners of the present disclosure through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. The present disclosure can also be implemented or applied through other different specific implementation manners, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope protected by the present disclosure.

[0021] It should be noted that the following describes various aspects of embodiments within the scope of the appended claims. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, those skilled in the art should understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of the aspects described herein can be used to implement an apparatus and / or practice a method. Additionally, this apparatus and / or method can be implemented using other structures and / or functionality in addition to one or more of the aspects described herein.

[0022] It should also be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present disclosure in a schematic manner. The drawings only show the components related to the present disclosure, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0023] In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0024] Currently, there is still a lack of a method for adjusting the parameters of an injection molding simulation model according to specific optimization requirements, the molding quality of simulated injection molded parts, and combined with injection molding process data to obtain the best injection molding process parameters that meet specific requirements. To address this problem, this embodiment provides a method for optimizing the simulation of shell injection molding, aiming to solve the problems of long existing development cycle, low efficiency, and material waste.

[0025] At the same time, by adjusting the parameters of the injection molding simulation model during the simulation injection molding process to obtain the best injection molding process parameters that meet specific optimization requirements, thereby achieving the improvement of production efficiency and the quality of injection molded parts.

[0026] The housing of this embodiment can be a glass fiber-reinforced composite material housing with an embedded hole, or other modified composite materials. Hereinafter, the glass fiber-reinforced composite material housing with an embedded hole is taken as an example.

[0027] For ease of understanding, as Figure 1 shown, this embodiment discloses an optimization method for injection molding of a housing, including the following steps: The first step: Obtain the injection molded part structure and injection molding process conditions, and the injection molding process conditions include the applicable range of the material under the injection molding process.

[0028] Injection molding is a complex process, and there are many factors affecting the molding. The most important influencing factors are: pressure, speed, position, temperature, time, etc. The specific optimization requirements of this embodiment are the weld line strength generated during the injection molding process, as well as the balance of volume shrinkage rate and the difference in sink mark amount in the adjacent area. Since the structure and cycle of the injection molded part in this embodiment have been determined, the main influencing factors are melt temperature, water channel temperature, mold temperature, and holding pressure, while filling time, holding time, cooling time, etc. are not considered as influencing factors in this case.

[0029] The specific optimization requirements of this embodiment are the weld line strength generated during the injection molding process, as well as the balance of volume shrinkage rate and the difference in sink mark amount in the adjacent area, and can also be applied to injection molded parts with other specific optimization requirements.

[0030] The applicable range of the material of this embodiment under the injection molding process is as follows: melt temperature [250, 275 °C], water channel temperature [25, 45 °C], mold temperature [70, 90 °C], holding pressure [40, 50 MPa].

[0031] The second step: According to the injection molded part structure and injection molding process conditions, establish an initial injection molding simulation model. The injection molding process conditions include the applicable range of the material under the injection molding process, theoretical injection molding production process conditions, and actual injection molding production process conditions.

[0032] The third step: Conduct mold flow simulation analysis based on the initial injection molding simulation model to generate initial mold flow analysis data, including: part PVT characteristics (the relationship of behavior changes during the cooling process [P (pressure) - V (volume) - T (temperature)] is called PVT characteristics), part interface performance (the weld line generated during the filling process and its strength, weld line strength judgment standard: threshold [0, 75°] corresponding to strength [0, 1]); The fourth step: According to the initial mold flow analysis data and the main influencing factors, conduct data analysis and processing to obtain optimized injection molding process conditions. The analysis results are shown in Table 1, Figure 2 、 Figure 3 、 Figure 4 and Figure 5As shown; Table 1. Injection Molding Process Conditions Table Through Taguchi orthogonal experiment research and analysis, it is found that the order of influence of each factor on the weld line angle is: mold temperature > water channel temperature > holding pressure > melt temperature; the order of influence on the sink mark amount is: holding pressure > melt temperature > water channel temperature > mold temperature; the order of influence on the volume shrinkage rate is: holding pressure > mold temperature > melt temperature > water channel temperature.

[0033] Although it is still impossible to improve the weld line strength by 100% and reduce the problems of large balanced volume shrinkage rate and large sink mark amount in the adjacent area and the optimization method by optimizing the injection molding process conditions, but through data analysis and processing of No. 1 - 9, the currently relatively good injection molding process conditions are No. 10: melt temperature 260°C, water channel temperature 25°C, mold temperature 80°C, holding pressure 45 MPa.

[0034] According to the above-mentioned mold flow data and combined with the preset injection molded product standard threshold for comparative analysis to verify and judge the quality status of the initial injection molding simulation model; The calculation formula for evaluating the quality index of the initial injection molding simulation model is: , Among them, is the quality index of the initial injection molding simulation model, is the preset characteristic coefficient (the percentage of influence of each quality standard and variable, which can be obtained by querying the simulation database), is the minimum value of the weld line angle, is the maximum value of the sink mark amount, is the maximum value of the volume shrinkage rate.

[0035] In this embodiment, the quality index threshold of the initial injection molding simulation model is [0, 1]. The closer it is to 1, the better the quality of the simulation model. Among the initial injection molding simulation models of No. 1 - 9, the relatively poor injection molding process conditions are No. 5, and its quality index is 0.13. The relatively good injection molding process conditions are No. 10, and its quality index is 0.50, which improves the quality index of the initial injection molding simulation model by about 37%, proving that this injection molding process condition is a better solution with higher weld line strength and balanced volume shrinkage rate and sink mark amount in the adjacent area.

[0036] Step 5: According to the optimized injection molding process conditions, optimize the initial injection molding simulation model to obtain an optimized injection molding simulation model, and conduct actual casting according to the optimized injection molding simulation model.

[0037] The electronic device disclosed in this embodiment includes a memory and a processor. The memory is used to store non-transitory computer-readable instructions. Specifically, the memory may include one or more computer program products, and the computer program products may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory, etc. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc.

[0038] The processor may be a central processing unit (CPU) or other forms of processing units with data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions. In an embodiment of the present disclosure, the processor is used to run the computer-readable instructions stored in the memory, so that the electronic device executes all or part of the steps of the housing injection molding optimization method of the foregoing embodiments of the present disclosure.

[0039] Those skilled in the art should understand that, in order to solve the technical problem of how to obtain a good user experience effect, this embodiment may also include well-known structures such as communication buses, interfaces, etc., and these well-known structures should also be included in the protection scope of the present disclosure.

[0040] As Figure 6 FIG. is a schematic structural diagram of an electronic device provided by an embodiment of the present disclosure. It shows a schematic structural diagram suitable for implementing the electronic device in the embodiments of the present disclosure. Figure 6 The shown electronic device is only an example and should not impose any limitations on the functions and usage scope of the embodiments of the present disclosure.

[0041] As Figure 6 As shown, the electronic device may include a processing device (such as a central processing unit, a graphics processing unit, etc.), which may perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) or the program loaded from the storage device into the random access memory (RAM). In the RAM, various programs and data required for the operation of the electronic device are also stored. The processing device, ROM, and RAM are connected to each other through a bus. The input / output (I / O) interface is also connected to the bus.

[0042] Generally, the following devices may be connected to the I / O interface: input devices including, for example, sensors or visual information acquisition devices; output devices including, for example, display screens; storage devices including, for example, magnetic tapes, hard disks, etc.; and communication devices. The communication device may allow the electronic device to communicate wirelessly or wiredly with other devices (such as edge computing devices) to exchange data. Although Figure 6An electronic device having various devices is shown, but it should be understood that it is not required to implement or have all the shown devices. Instead, more or fewer devices may be implemented or had.

[0043] In particular, according to an embodiment of the present disclosure, the processes described above with reference to the flowcharts may be implemented as computer software programs. For example, an embodiment of the present disclosure includes a computer program product that includes a computer program carried on a non-transitory computer-readable medium, and the computer program includes program code for performing the methods shown in the flowcharts. In such an embodiment, the computer program may be downloaded and installed from a network through a communication device, or installed from a storage device, or installed from a ROM. When the computer program is executed by a processing device, all or part of the steps of the housing injection molding optimization method according to the embodiments of the present disclosure are performed.

[0044] For a detailed description of this embodiment, reference may be made to the corresponding descriptions in the foregoing embodiments, and details are not described herein again.

[0045] The computer-readable storage medium disclosed in this embodiment stores non-temporary computer-readable instructions. When the non-temporary computer-readable instructions are run by a processor, all or part of the steps of the housing injection molding optimization method according to the foregoing embodiments of the present disclosure are performed.

[0046] The above-mentioned computer-readable storage medium includes but is not limited to: optical storage media (such as CD-ROMs and DVDs), magneto-optical storage media (such as MOs), magnetic storage media (such as magnetic tapes or external hard drives), media having built-in rewritable non-volatile memories (such as memory cards), and media having built-in ROMs (such as ROM cartridges).

[0047] For a detailed description of this embodiment, reference may be made to the corresponding descriptions in the foregoing embodiments, and details are not described herein again.

[0048] The basic principles of the present disclosure have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, benefits, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, benefits, effects, etc. are essential for each embodiment of the present disclosure. In addition, the above-disclosed specific details are only for the purposes of illustration and facilitating understanding, and are not limitations. The above details do not limit the present disclosure to necessarily adopt the above specific details for implementation.

[0049] In this disclosure, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. The block diagrams of the devices, apparatuses, equipment, and systems involved in this disclosure are only illustrative examples and do not intend to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open-ended words, meaning "including but not limited to", and can be used interchangeably with each other. The words "or" and "and" used herein refer to the word "and / or", and can be used interchangeably with each other, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to", and can be used interchangeably with each other.

[0050] In addition, as used herein, the "or" used in the listing of items starting with "at least one" indicates a disjunctive listing, so that for example, the listing of "at least one of A, B, or C" means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). Furthermore, the wording "exemplary" does not mean that the examples described are preferred or better than other examples.

[0051] It should also be noted that in the systems and methods of this disclosure, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of this disclosure.

[0052] Various changes, substitutions, and alterations to the technologies described herein can be made without departing from the teachings defined by the appended claims. In addition, the scope of the claims of this disclosure is not limited to the specific aspects of the processes, machines, manufactures, compositions of events, means, methods, and acts described above. Current or later-developed processes, machines, manufactures, compositions of events, means, methods, or acts that perform substantially the same function or achieve substantially the same result as the corresponding aspects described herein can be utilized. Thus, the appended claims include such processes, machines, manufactures, compositions of events, means, methods, or acts within their scope.

[0053] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

[0054] The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit embodiments of the present disclosure to the form disclosed herein. Although several example aspects and embodiments have been discussed above, those skilled in the art will recognize some of their variations, modifications, alterations, additions, and subcombinations.

Claims

1. An optimization method for shell injection molding, characterized in that, including: establishing an initial injection molding simulation model based on the obtained injection molded part structure and injection molding process conditions; performing mold flow simulation analysis according to the initial injection molding simulation model to generate initial mold flow analysis data; performing data analysis and processing according to the initial mold flow analysis data and main influencing factors to obtain optimized injection molding process conditions; optimizing the initial injection molding simulation model according to the optimized injection molding process conditions to obtain an optimized injection molding simulation model, and performing actual pouring according to the optimized injection molding simulation model.

2. The optimized method for injection molding of the housing according to claim 1, wherein, The initial mold flow analysis data includes: the rheological properties of the part and the interfacial properties of the part.

3. The optimized method for injection molding of the housing according to claim 2, characterized in that The rheological properties of the part are the behavioral change relationships during the cooling process, and the behavioral changes include pressure, volume, and temperature; The interfacial properties of the part are the weld lines generated during the filling process and their strengths.

4. The optimized method for injection molding of the housing according to claim 3, wherein, The threshold of the weld line strength judgment criterion is 0 to 75°, and the corresponding strength is 0 to 1.

5. The optimized method for injection molding of the housing according to claim 1, characterized in that The establishing an initial injection molding simulation model based on the obtained injection molded part structure and injection molding process conditions includes: establishing an initial injection molding simulation model according to the optimization requirements, wherein the optimization requirements are the weld line strength generated during the injection molding process and the balance of volume shrinkage rate and the difference in sink mark amount in adjacent regions.

6. The optimized method for injection molding of the housing according to claim 1, characterized in that, The performing data analysis and processing according to the initial mold flow analysis data and main influencing factors to obtain optimized injection molding process conditions includes: evaluating the initial injection molding simulation model based on a quality index, and the calculation formula for evaluating the quality index of the injection molding simulation model is: ， Among them, is the quality index of the initial injection molding simulation model, is the preset characteristic coefficient, is the minimum value of the weld line angle, is the maximum value of the sink mark amount, is the maximum value of the volume shrinkage rate.

7. The optimized method for injection molding of the housing according to claim 6, wherein, The quality index threshold of the initial injection molding simulation model is 0 to 1, and the closer it is to 1, the better the quality.

8. An electronic device, characterized in that, The electronic device includes: at least one processor; and, a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the housing injection molding optimization method according to any one of claims 1-7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing a computer to execute the housing injection molding optimization method according to any one of claims 1-7.

10. A computer program product, comprising a computer program / instructions, characterized in that, The computer program / instructions, when executed by a processor, implement the housing injection molding optimization method according to any one of claims 1-7.

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