Method for determining optimal heat dissipation position of chip, electronic device and storage medium

Abstract

The present invention discloses a method for determining the optimal heat dissipation position for a chip, an electronic device, and a storage medium. The technical solution provided by the embodiments of the present invention utilizes velocity simulation to analyze the flow field distribution from a three-dimensional perspective. By intercepting n circular cross-sections, the maximum wind speed absolute value and the spatial location of each circular cross-section are extracted. Based on this, the average surface velocity of the equivalent area within each circular cross-section equal to the windward surface area of ​​the chip is calculated, and the theoretical optimal heat dissipation position is derived. This method not only accurately finds the optimal solution but also, by analyzing only the flow field, eliminates the accidental errors caused by adding the chip solid domain and thermal boundary to analyze the temperature field, as well as the iterative calculation errors caused by activating the energy equation, effectively improving simulation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip thermal simulation and analysis, and in particular to a method for determining an optimal heat dissipation position of a chip, an electronic device, and a storage medium. Background Art

[0002] Currently, there are no patents for the optimal heat dissipation position for chips in forced air cooling. Based on research papers, most research focuses on the one-dimensional distance along the axial fan axis—that is, the distance between the fan outlet and the chip center. However, since the chip's frontal area is generally much smaller than the fan's outlet cross-sectional area, and the airflow generated by the axial fan is highly non-uniform across the cross-section due to the rotation of the hub and the gas, the axial persistence of this non-uniformity is related to the hub diameter. Furthermore, given a certain heat transfer area, the chip's heat dissipation efficiency directly depends on the heat transfer coefficient. Given certain material properties and initial operating conditions, the heat transfer coefficient ultimately depends on the average flow velocity on the chip's frontal surface. Specifically, the greater the average flow velocity, the greater the heat transfer coefficient and the better the chip's heat dissipation efficiency. Therefore, analyzing the distance-average wind speed relationship based on the one-dimensional axial direction of the axial fan cannot determine the relative position of the maximum average wind speed, i.e., the optimal heat dissipation position for the chip. Therefore, analyzing the distance-average wind speed relationship between the fan outlet and the chip center and the average windward wind speed from a three-dimensional perspective is extremely valuable. Summary of the Invention

[0003] The present invention provides a method for determining the optimal heat dissipation position of a chip, an electronic device and a storage medium to solve the problem that the prior art is based on the one-dimensional direction of the axial direction of the axial flow fan and analyzes the distance-average wind speed correspondence, which cannot determine the optimal heat dissipation position of the chip and the problem that the optimal heat dissipation position is inaccurate.

[0004] According to one aspect of the present invention, a method for determining an optimal heat dissipation position of a chip is provided, comprising:

[0005] S1. In the simulation software, based on the pre-imported fan-chip simulation model, n equal distances are intercepted along the fan axis according to the fan hub diameter, and a circular section identical to the fan outlet section is established at each distance;

[0006] S2. Identify the maximum wind speed area within each circular cross-section according to the wind speed distribution cloud map of each circular cross-section, and extract the maximum wind speed absolute value of the circular cross-section where each maximum wind speed area is located, as well as the spatial region position where each maximum wind speed absolute value is located;

[0007] S3. Starting from the i-th circular cross section, extract the first absolute value of the wind speed of the i-1th circular cross section and the second absolute value of the wind speed of the i+1th circular cross section, which are located in the same spatial region as the maximum absolute value of the wind speed of the i-th circular cross section;

[0008] S4. Calculate the wind speed change rate of the i-th circular cross-section based on the maximum wind speed absolute value of the i-th circular cross-section, the first wind speed absolute value of the i-1th circular cross-section, and the second wind speed absolute value of the i+1th circular cross-section;

[0009] S5. Determine whether the wind speed change rate of the i-th circular cross-section is less than a preset wind speed change rate threshold. If the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, set i=i+1 and execute S3 and subsequent steps until the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold.

[0010] S6. When the wind speed change rates of the n circular cross-sections are all less than a preset wind speed change rate threshold, take the spatial region where the absolute value of the maximum wind speed of each circular cross-section is located as the center, take an equivalent area equal to the windward area of ​​the chip, and calculate the average surface velocity of each equivalent area;

[0011] S7. Determine the optimal heat dissipation position of the chip based on the average surface velocity; wherein i=n, ​​and i and n are both integers greater than or equal to 1.

[0012] Optionally, after determining whether the wind speed change rate of the i-th circular cross section is less than a preset wind speed change rate threshold in S5, the method further includes:

[0013] When the wind speed change rate of the i-th circular section is greater than or equal to the preset wind speed change rate threshold, m / 2 circular sections are evenly added between the i-th circular section and the i-1-th circular section, and between the i-th circular section and the i+1-th circular section, for a total of m circular sections, and S2 and subsequent steps are executed until the wind speed change rate of the i-th circular section is less than the preset wind speed change rate threshold; wherein m is an integer multiple of 2.

[0014] Optionally, after executing step S4, the following steps are further included:

[0015] Recording the duration and / or number of cyclic calculations, and determining whether the duration and / or number of calculations reaches a preset calculation duration limit and / or a preset calculation number limit;

[0016] If yes, modify the preset wind speed change rate threshold, and execute S2 and subsequent steps;

[0017] If not, execute S2 and subsequent steps.

[0018] Optionally, S7, determining an optimal heat dissipation position of the chip according to the average surface velocity, includes:

[0019] The spatial region where the maximum average surface velocity value among the n+m average surface velocities is located is determined as the optimal heat dissipation position of the chip.

[0020] Optionally, the step S4 of calculating the wind speed change rate of the i-th circular cross-section according to the maximum wind speed absolute value of the i-th circular cross-section, the first wind speed absolute value of the i-1th circular cross-section, and the second wind speed absolute value of the i+1th circular cross-section includes:

[0021] The maximum and minimum values ​​are respectively taken among the absolute value of the maximum wind speed of the i-th circular cross section, the absolute value of the first wind speed of the i-1th circular cross section, and the absolute value of the second wind speed of the i+1th circular cross section;

[0022] The wind speed change rate of the i-th circular section is calculated by dividing the difference between the maximum value and the minimum value by the minimum value.

[0023] Optionally, in S6, when the wind speed change rates of the n circular cross sections are all less than a preset wind speed change rate threshold, taking the spatial region position where the absolute value of the maximum wind speed of each circular cross section is located as the center, taking an equivalent area equal to the windward area of ​​the chip, and calculating the average surface velocity of each equivalent area includes:

[0024] When the wind speed change rates of n circular cross-sections are all less than a preset wind speed change rate threshold, take the spatial region where the absolute value of the maximum wind speed of each circular cross-section is located as the center, take an equivalent area equal to the windward area of ​​the chip, and calculate the volume flow rate of the fluid passing through each equivalent area;

[0025] The volume flow rate of each of the equivalent areas is divided by each of the equivalent areas to calculate the average surface velocity of each of the equivalent areas.

[0026] Optionally, the initial value of the preset wind speed change rate threshold can be pre-set based on an empirical value.

[0027] According to another aspect of the present invention, an electronic device is provided, comprising:

[0028] at least one processor; and

[0029] a memory communicatively connected to the at least one processor; wherein,

[0030] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for determining the optimal heat dissipation position of the chip according to any embodiment of the present invention.

[0031] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for determining the optimal heat dissipation position of a chip according to any embodiment of the present invention when executed.

[0032] The embodiment of the present invention provides a method for determining the optimal heat dissipation position of a chip, an electronic device and a storage medium. The method includes: S1. In the simulation software, based on the pre-imported fan-chip simulation model, n equal distances are intercepted along the fan axis according to the fan hub diameter, and a circular section identical to the fan outlet section is established at each distance; S2. According to the wind speed distribution cloud map of each circular section, the maximum wind speed area in each circular section is identified, and the maximum wind speed absolute value of the circular section where each maximum wind speed area is located, as well as the spatial area position of each maximum wind speed absolute value are extracted; S3. Starting from the i-th circular section, the first wind speed absolute value of the i-1th circular section and the second wind speed absolute value of the i+1th circular section with the same spatial area position as the maximum wind speed absolute value of the i-th circular section are extracted respectively; S4. According to the maximum wind speed absolute value of the i-1th circular section, the first wind speed absolute value of the i-1th circular section and the second wind speed absolute value of the i+1th circular section, the maximum wind speed absolute value of the i-1th circular section and the second wind speed absolute value of the i+1th circular section are extracted respectively. The second wind speed absolute value of the i+1 circular cross-section is used to calculate the wind speed change rate of the i-th circular cross-section; S5, judge whether the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, and when the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, set i=i+1 and execute S3 and its subsequent steps until the wind speed change rates of the n circular cross-sections are all less than the preset wind speed change rate threshold; S6, when the wind speed change rates of the n circular cross-sections are all less than the preset wind speed change rate threshold, take the spatial area position where the maximum wind speed absolute value of each circular cross-section is located as the center, take an equivalent area equal to the windward area of ​​the chip, and calculate the average surface velocity of each equivalent area; S7, determine the optimal heat dissipation position of the chip based on the average surface velocity; wherein, i=n, ​​and i and n are both integers greater than or equal to 1. The technical solution provided by the embodiment of the present invention uses velocity simulation to analyze the flow field distribution from a three-dimensional perspective. By intercepting n circular sections, the absolute value of the maximum wind speed of each circular section and its spatial area position are extracted. Based on this, the average surface velocity of the equivalent area equal to the windward surface area of ​​the chip in each circular section is calculated, and then the theoretical optimal heat dissipation position is derived. Not only can the optimal solution be found accurately; but also, since only the flow field is analyzed, the accidental errors caused by adding the chip solid domain and thermal boundary analysis temperature field and the iterative calculation errors caused by enabling the energy equation are omitted, thereby effectively improving the simulation efficiency.

[0033] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A flow chart of a method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention;

[0036] Figure 2 A schematic diagram of the spatial structure position of the axial flow fan and chip provided in an embodiment of the present invention;

[0037] Figure 3 A schematic diagram of the maximum wind speed for different circular cross-sections provided by an embodiment of the present invention;

[0038] Figure 4 A flowchart of another method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention;

[0039] Figure 5 A schematic diagram of a newly added circular cross section provided in an embodiment of the present invention;

[0040] Figure 6 A schematic diagram of the structure of an electronic device for determining an optimal heat dissipation position of a chip provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0043] Figure 1 This is a flow chart of a method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention. This embodiment is applicable to determining the optimal heat dissipation position of a chip in a forced air cooling mode. The method can be performed by a device for determining the optimal heat dissipation position of a chip. The device can be implemented in the form of hardware and / or software and can be configured in any electronic device with communication functions. Figure 1 , the method comprising:

[0044] S1. In the simulation software, based on the pre-imported fan-chip simulation model, n equal distances are intercepted along the fan axis according to the fan hub diameter, and a circular section identical to the fan outlet section is established at each distance.

[0045] Among them, see first Figure 2 , Figure 2 Schematic diagram of the spatial structural position of the axial flow fan and chip provided in an embodiment of the present invention, p, q, and h represent the length, width, and height distances from the center of the chip to the center of the fan outlet, respectively; the simulation software can use Computational Fluid Dynamics (CFD) software; the fan axial direction refers to the extension direction of the fan rotation axis, that is, the main flow direction of the fan airflow; the hub diameter refers to the diameter of the central hub to which the fan blades are connected; n equal distances refer to dividing the fan axial length into n sections according to the hub diameter, and the distance of each section is the same. The larger the value of n, the higher the accuracy of finding the optimal heat dissipation position; and the initial value of each distance can be set according to the hub diameter. Assume that the hub diameter is d, the distance in the n equal distances is a, and d / a is the distance of each section. When a=1, that is, within a hub diameter range, the unevenness of the flow field is very obvious. Therefore, the larger the value of a, the faster the optimal heat dissipation position can be found. Generally, 2-5 can be used first, and then appropriately increased according to the simulation results. For details, please refer to Figure 3 , Figure 3This is a schematic diagram of the maximum wind speed for different circular cross-sections provided by an embodiment of the present invention. In the figure, d / a is the distance per segment, and dn / a is the total distance value of n segments of equal distance. The outlet cross-section refers to the cross-section at the fan outlet, which is usually circular.

[0046] Specifically, the constructed "fan-chip" simulation model is imported into the simulation software to determine the axial direction of the fan, which is usually the z-axis or center axis of the model's coordinate system. N equal distances are intercepted along the axial direction of the fan according to the diameter of the fan hub. At the end point of each distance, a circular section is established perpendicular to the axial direction of the fan. The diameter and shape of the section are exactly the same as the section of the fan outlet, and a total of n circular sections are formed.

[0047] S2. According to the wind speed distribution cloud map of each circular cross section, identify the maximum wind speed area in each circular cross section, and extract the maximum wind speed absolute value of the circular cross section where each maximum wind speed area is located, as well as the spatial region position where each maximum wind speed absolute value is located.

[0048] Specifically, the simulation software will automatically generate a wind speed distribution cloud map for each circular section, using a color gradient to visually display the wind speed at each point in each circular section. The local area with the highest wind speed value in the circular section usually corresponds to the darkest area in the cloud map. Based on this, the maximum wind speed area in each circular section can be identified, and the probe tool can be used to read the maximum wind speed absolute value V1max, V2max, V3max........Vnmax of the circular section where each maximum wind speed area is located, and record the spatial area position corresponding to each maximum wind speed absolute value. Figure 3 , Figure 3 The red vertical lines in the figure identify the maximum absolute values ​​of wind speed V1max, V2max, V3max........Vnmax of each circular section and their spatial location.

[0049] S3. Starting from the i-th circular section, extract the first absolute wind speed value of the i-1th circular section and the second absolute wind speed value of the i+1th circular section that are located in the same spatial region as the maximum absolute wind speed value of the i-th circular section.

[0050] For example, see Figure 3 Taking the second circular section as an example, it can be seen from the figure that the maximum wind speed absolute value of the second circular section is V2max. Taking the position of V2max as the reference, read the first absolute wind speed value of the first circular section and the second absolute wind speed value of the third circular section in the same spatial area as the maximum wind speed absolute value V2max of the second circular section, that is, V2.1 and V2.2 in the figure.

[0051] S4. Calculate the wind speed change rate of the i-th circular section according to the maximum wind speed absolute value of the i-th circular section, the first wind speed absolute value of the i-1-th circular section, and the second wind speed absolute value of the i+1-th circular section.

[0052] Specifically, the absolute value of the maximum wind speed of the i-th circular section, the absolute value of the first wind speed of the i-1th circular section, and the absolute value of the second wind speed of the i+1th circular section are compared to find the maximum and minimum values ​​among the three. Based on the maximum and minimum values, the wind speed change rate of the i-th circular section is calculated.

[0053] For example, taking the second circular section as an example, V2max, V2.1 and V2.2 are compared to find the maximum and minimum values ​​among V2max, V2.1 and V2.2. The difference obtained by subtracting the minimum value from the maximum value is divided by the minimum value to obtain the wind speed change rate of the second circular section.

[0054] S5. Determine whether the wind speed change rate of the i-th circular cross section is less than a preset wind speed change rate threshold; if so, execute S6.

[0055] S6. Let i=i+1.

[0056] Among them, the initial value of the preset wind speed change rate threshold can be pre-set based on an empirical value. The preset wind speed change rate threshold is related to the windward surface area of ​​the chip. The smaller the windward surface area, the larger the preset wind speed change rate threshold, which can generally be ≤5%.

[0057] Specifically, determine whether the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold. If the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, set i=i+1, and execute S3 and subsequent steps, and so on, until the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold.

[0058] Exemplarily, determine whether the wind speed change rate of the first circular cross-section is less than the preset wind speed change rate threshold. If the wind speed change rate of the first circular cross-section is less than the preset wind speed change rate threshold, set i=2, and execute S3 and its subsequent steps, and then determine whether the wind speed change rate of the second circular cross-section is less than the preset wind speed change rate threshold, and so on, until the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold.

[0059] S7. When the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold, take the spatial region where the absolute value of the maximum wind speed of each circular cross-section is located as the center, take the equivalent area equal to the windward area of ​​the chip, and calculate the average surface velocity of each equivalent area.

[0060] The definition of average surface velocity is: in the wind field of an axial flow fan, the average surface velocity at a certain position refers to the average distance that the airflow flows through the unit area perpendicular to the airflow direction at that position per unit time. For example, if there is 0.5m in 10.5 seconds, 3 The gas passage area is 0.25m 2 The plane has an average surface velocity of v-=2m / s. On the windward side of the chip, the wind speed is unevenly distributed, and there is only one point of Vnmax, that is, Figure 3 The wind speed is highest at the short red line in the middle, decreasing toward the ends. The overall wind speed on the windward side of the chip is higher in the middle and lower at the ends. In simulation software, the average surface velocity can be calculated by integrating the linear velocity over an infinitesimal area and then averaging it. This can be thought of as dividing an area into an infinite number of infinitesimal areas. The surface velocity of each infinitesimal area can be approximated by the linear velocity, which can then be averaged to obtain the average surface velocity.

[0061] Specifically, see Figure 3 , Figure 3 The red short vertical line in the figure is the projection of the chip's windward surface. The chip's windward surface area is perpendicular to the wind speed, and the area at each location is the same as the chip's windward surface area. At each location with the maximum absolute wind speed value Vnmax, i.e., the location with the red short vertical line, an equivalent area equal to the chip's windward surface area is taken. The average surface velocity at that location is calculated in the simulation software. Each equivalent area equal to the chip's windward surface area is centered on the spatial region where the maximum absolute wind speed value of each circular cross-section is located.

[0062] S8. Determine the optimal heat dissipation position of the chip based on the average surface velocity; wherein i=n, ​​and i and n are both integers greater than or equal to 1.

[0063] Specifically, the average surface velocities of each equivalent area equal to the windward surface area of ​​the chip are compared to find the maximum average surface velocity, and the position where the maximum average surface velocity is located is determined as the optimal heat dissipation position of the chip.

[0064] The embodiment of the present invention provides a method for determining the optimal heat dissipation position of a chip, an electronic device and a storage medium. The method includes: S1. In the simulation software, based on the pre-imported fan-chip simulation model, n equal distances are intercepted along the fan axis according to the fan hub diameter, and a circular section identical to the fan outlet section is established at each distance; S2. According to the wind speed distribution cloud map of each circular section, the maximum wind speed area in each circular section is identified, and the maximum wind speed absolute value of the circular section where each maximum wind speed area is located, as well as the spatial area position of each maximum wind speed absolute value are extracted; S3. Starting from the i-th circular section, the first wind speed absolute value of the i-1th circular section and the second wind speed absolute value of the i+1th circular section with the same spatial area position as the maximum wind speed absolute value of the i-th circular section are extracted respectively; S4. According to the maximum wind speed absolute value of the i-1th circular section, the first wind speed absolute value of the i-1th circular section and the second wind speed absolute value of the i+1th circular section, the maximum wind speed absolute value of the i-1th circular section and the second wind speed absolute value of the i+1th circular section are extracted respectively. The second wind speed absolute value of the i+1 circular cross-section is used to calculate the wind speed change rate of the i-th circular cross-section; S5, judge whether the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, and when the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, set i=i+1 and execute S3 and its subsequent steps until the wind speed change rates of the n circular cross-sections are all less than the preset wind speed change rate threshold; S6, when the wind speed change rates of the n circular cross-sections are all less than the preset wind speed change rate threshold, take the spatial area position where the maximum wind speed absolute value of each circular cross-section is located as the center, take an equivalent area equal to the windward area of ​​the chip, and calculate the average surface velocity of each equivalent area; S7, determine the optimal heat dissipation position of the chip based on the average surface velocity; wherein, i=n, ​​and i and n are both integers greater than or equal to 1. The technical solution provided by the embodiment of the present invention uses velocity simulation to analyze the flow field distribution from a three-dimensional perspective. By intercepting n circular sections, the absolute value of the maximum wind speed of each circular section and its spatial area position are extracted. Based on this, the average surface velocity of the equivalent area equal to the windward surface area of ​​the chip in each circular section is calculated, and then the theoretical optimal heat dissipation position is derived. Not only can the optimal solution be found accurately; but also, since only the flow field is analyzed, the accidental errors caused by adding the chip solid domain and thermal boundary analysis temperature field and the iterative calculation errors caused by enabling the energy equation are omitted, thereby effectively improving the simulation efficiency.

[0065] Figure 4 This is a flow chart of another method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention. The embodiment of the present invention further defines the above embodiment on the basis of the above embodiment. Figure 4 , the method comprising:

[0066] S10. In the simulation software, based on the pre-imported fan-chip simulation model, n equal distances are intercepted along the fan axis according to the fan hub diameter, and a circular section identical to the fan outlet section is established at each distance.

[0067] S20. According to the wind speed distribution cloud map of each circular cross section, identify the maximum wind speed area in each circular cross section, and extract the maximum wind speed absolute value of the circular cross section where each maximum wind speed area is located, as well as the spatial region position where each maximum wind speed absolute value is located.

[0068] S30. Starting from the i-th circular cross section, extract the first absolute wind speed value of the i-1th circular cross section and the second absolute wind speed value of the i+1th circular cross section that are located in the same spatial region as the maximum absolute wind speed value of the i-th circular cross section.

[0069] S40. Calculate the wind speed change rate of the i-th circular cross section according to the maximum wind speed absolute value of the i-th circular cross section, the first wind speed absolute value of the i-1-th circular cross section, and the second wind speed absolute value of the i+1-th circular cross section.

[0070] Optionally, step S40, calculating the wind speed change rate of the i-th circular cross section according to the maximum wind speed absolute value of the i-th circular cross section, the first wind speed absolute value of the i-1th circular cross section, and the second wind speed absolute value of the i+1th circular cross section, includes:

[0071] Take the maximum and minimum values ​​among the absolute value of the maximum wind speed of the i-th circular section, the absolute value of the first wind speed of the i-1th circular section, and the absolute value of the second wind speed of the i+1th circular section, respectively; divide the difference between the maximum and minimum values ​​by the minimum value to calculate the wind speed change rate of the i-th circular section.

[0072] S50, determining whether the wind speed change rate of the i-th circular cross section is less than a preset wind speed change rate threshold;

[0073] If yes, execute S60; if no, execute S70.

[0074] S60, let i=i+1

[0075] S70. Evenly add m / 2 circular cross sections between the i-th circular cross section and the i-1th circular cross section, and between the i-th circular cross section and the i+1th circular cross section, for a total of m circular cross sections, where m is an integer multiple of 2.

[0076] Specifically, when the wind speed change rate of the i-th circular section is greater than or equal to the preset wind speed change rate threshold, m / 2 circular sections are added between the two adjacent circular sections in front and behind, for a total of m circular sections. That is to say, each of the n equal distances initially intercepted is further subdivided.

[0077] For example, see Figure 5 , Figure 5 The schematic diagram of the newly added circular cross-section provided in the embodiment of the present invention still takes the circular cross-section where the maximum wind speed absolute value V2max is located as an example. When the wind speed change rate calculated based on V2max, V2.1 and V2.2 is greater than or equal to the preset wind speed change rate threshold, two circular cross-sections are evenly added between the circular cross-section where the maximum wind speed absolute value V2max is located and the circular cross-section where the maximum wind speed absolute value V1max is located, and between the circular cross-section where the maximum wind speed absolute value V2max is located and the circular cross-section where the maximum wind speed absolute value V3max is located, as shown by the yellow line, for a total of four newly added circular cross-sections. After adding the circular cross-sections, return to execute S20 and its subsequent steps until the wind speed change rate of the circular cross-section where the maximum wind speed absolute value V2max is located is less than the preset wind speed change rate threshold.

[0078] S80. When the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold, take the spatial region where the absolute value of the maximum wind speed of each circular cross-section is located as the center, take the equivalent area equal to the windward area of ​​the chip, and calculate the average surface velocity of each equivalent area.

[0079] Optionally, in step S80, when the wind speed change rates of the n circular cross sections are all less than a preset wind speed change rate threshold, taking the spatial region position where the absolute value of the maximum wind speed of each circular cross section is located as the center, taking an equivalent area equal to the windward area of ​​the chip, and calculating the average surface velocity of each equivalent area includes:

[0080] When the wind speed change rates of n circular sections are all less than the preset wind speed change rate threshold, the equivalent area equal to the windward area of ​​the chip is taken as the center, and the volume flow rate of the fluid passing through each equivalent area is calculated.

[0081] Specifically, in wind or fluid fields, calculating the average surface velocity across a specified surface S usually refers to calculating the average normal velocity component of the fluid passing through the surface. The core idea is to average the component of the velocity vector in the direction normal to the surface over the entire surface.

[0082] Use the following formula to calculate the volume flow rate Q (unit: m³ / s) through the curved surface S:

[0083] ; Where v represents the velocity vector of a point in the flow field (m / s); dA represents the infinitesimal area vector on the surface S, and its direction is the direction of the surface normal; It represents the product of the normal component of velocity and the area.

[0084] The average face velocity of each equivalent area is calculated by dividing the volume flow rate of each equivalent area by the volume flow rate of each equivalent area.

[0085] Specifically, the average surface velocity is calculated using the following formula:

[0086] ; is the total area of ​​surface S, is the average normal velocity.

[0087] S90. Determine the optimal heat dissipation position of the chip based on the average surface velocity.

[0088] Optionally, step S90, determining the optimal heat dissipation position of the chip according to the average surface velocity, includes:

[0089] The spatial region where the maximum average surface velocity value among the n+m average surface velocities is located is determined as the optimal heat dissipation position of the chip.

[0090] Specifically, across all circular sections (including the initial n sections and the subsequent m sections, i.e., n+m sections), the average surface velocity of the equivalent area of ​​the chip's windward surface in each section is compared to find the maximum value. The spatial region with the maximum average surface velocity is the optimal heat dissipation location for the chip. The windward surface area refers to the area of ​​an object in a flow field that is perpendicular to the flow velocity and first contacts the fluid.

[0091] After step S40, the method further includes:

[0092] S100: Record the duration and / or number of cyclic calculations.

[0093] Among them, the cyclic calculation here means that when the wind speed change rate of the i-th circular section is greater than the preset wind speed change rate threshold, after further subdividing each of the n equal distances initially intercepted, S20 to S40 are re-executed to continue calculating the total duration and / or number of cyclic calculations of the wind speed change rate of the i-th circular section.

[0094] S110: Determine whether the duration and / or number of times reaches a preset calculation duration limit and / or a preset calculation number limit.

[0095] If yes, execute S120 ; if no, execute S20 .

[0096] S120: Modify the preset wind speed change rate threshold.

[0097] Specifically, in the process of judging whether the wind speed change rate of a circular cross-section is less than the preset wind speed change rate threshold, if the wind speed change rate of the circular cross-section is always greater than or equal to the preset wind speed change rate threshold, it is not always executed to add a new circular cross-section and repeatedly calculate its wind speed change rate. In order to avoid an infinite loop, the duration and / or number of loop calculations will be recorded during the calculation process. When the calculation duration reaches the preset calculation duration limit, and / or when the number of calculations reaches the preset calculation number limit, the simulation software will modify and adjust the preset wind speed change rate threshold.

[0098] The technical solution provided by the embodiment of the present invention derives the theoretical optimal heat dissipation position through a series of steps: intercepting n circular cross sections, identifying the maximum wind speed value and its spatial area position, refining the segmentation accuracy, and calculating the average surface velocity of the windward surface. This not only accurately finds the optimal solution; but also, since only the flow field is analyzed, it eliminates the accidental errors caused by adding the chip solid domain and thermal boundary analysis temperature field and the iterative calculation errors caused by enabling the energy equation, thereby effectively improving the simulation efficiency.

[0099] Figure 6 A schematic diagram of an electronic device structure for a method for determining the optimal heat dissipation position of a chip provided by an embodiment of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are provided for example only and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0100] like Figure 6 As shown, electronic device 10 includes at least one processor 11 and memory, such as read-only memory (ROM) 12 and random access memory (RAM) 13, communicatively connected to at least one processor 11. The memory stores computer programs executable by the at least one processor. Processor 11 can perform various appropriate actions and processes based on the computer programs stored in ROM 12 or loaded from storage unit 18 into RAM 13. RAM 13 can also store various programs and data required for the operation of electronic device 10. Processor 11, ROM 12, and RAM 13 are interconnected via bus 14. An input / output (I / O) interface 15 is also connected to bus 14.

[0101] Multiple components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0102] Processor 11 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any other suitable processor, controller, microcontroller, etc. Processor 11 executes the various methods and processes described above, such as a method for determining the optimal heat dissipation location for a chip.

[0103] In some embodiments, the method for determining the optimal heat dissipation location for a chip can be implemented as a computer program tangibly embodied in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the method for determining the optimal heat dissipation location for a chip described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to execute the method for determining the optimal heat dissipation location for a chip in any other appropriate manner (e.g., via firmware).

[0104] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0105] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0106] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, device, or apparatus. A computer-readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or apparatus, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media may include an electrical connection based on one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0107] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device that has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0108] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0109] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0110] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0111] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for determining the optimal heat dissipation position of a chip, characterized in that: include: S1. In the simulation software, based on the pre-imported fan-chip simulation model, n equal distances are intercepted along the fan axis according to the fan hub diameter, and a circular section identical to the fan outlet section is established at each distance; S2. Identify the maximum wind speed area within each circular cross-section according to the wind speed distribution cloud map of each circular cross-section, and extract the maximum wind speed absolute value of the circular cross-section where each maximum wind speed area is located, as well as the spatial region position where each maximum wind speed absolute value is located; S3. Starting from the i-th circular cross section, extract the first absolute value of the wind speed of the i-1th circular cross section and the second absolute value of the wind speed of the i+1th circular cross section, which are located in the same spatial region as the maximum absolute value of the wind speed of the i-th circular cross section; S4. Calculate the wind speed change rate of the i-th circular cross-section based on the maximum wind speed absolute value of the i-th circular cross-section, the first wind speed absolute value of the i-1th circular cross-section, and the second wind speed absolute value of the i+1th circular cross-section; S5. Determine whether the wind speed change rate of the i-th circular cross-section is less than a preset wind speed change rate threshold. If the wind speed change rate of the i-th circular cross-section is less than the preset wind speed change rate threshold, set i=i+1 and execute S3 and subsequent steps until the wind speed change rates of n circular cross-sections are all less than the preset wind speed change rate threshold. S6. When the wind speed change rates of the n circular cross-sections are all less than a preset wind speed change rate threshold, take the spatial region where the absolute value of the maximum wind speed of each circular cross-section is located as the center, take an equivalent area equal to the windward area of ​​the chip, and calculate the average surface velocity of each equivalent area; S7. Determine an optimal heat dissipation position for the chip based on the average surface velocity; wherein i=n, ​​and i and n are both integers greater than or equal to 1; Wherein, after S5, determining whether the wind speed change rate of the i-th circular cross section is less than a preset wind speed change rate threshold, the method further includes: When the wind speed change rate of the i-th circular section is greater than or equal to the preset wind speed change rate threshold, m / 2 circular sections are evenly added between the i-th circular section and the i-1-th circular section, and between the i-th circular section and the i+1-th circular section, for a total of m circular sections, and S2 and subsequent steps are executed until the wind speed change rate of the i-th circular section is less than the preset wind speed change rate threshold; wherein m is an integer multiple of 2.

2. The determination method according to claim 1, characterized in that After executing step S4, it also includes: Recording the duration and / or number of cyclic calculations, and determining whether the duration and / or number of calculations reaches a preset calculation duration limit and / or a preset calculation number limit; If yes, modify the preset wind speed change rate threshold, and execute S2 and subsequent steps; If not, execute S2 and subsequent steps.

3. The determination method according to claim 1, characterized in that S7. Determining an optimal heat dissipation position of the chip according to the average surface velocity includes: The spatial region where the maximum average surface velocity value among the n+m average surface velocities is located is determined as the optimal heat dissipation position of the chip.

4. The determination method according to claim 1, characterized in that The step S4, calculating the wind speed change rate of the i-th circular cross section according to the maximum wind speed absolute value of the i-th circular cross section, the first wind speed absolute value of the i-1th circular cross section, and the second wind speed absolute value of the i+1th circular cross section, comprises: The maximum and minimum values ​​are respectively taken among the absolute value of the maximum wind speed of the i-th circular cross section, the absolute value of the first wind speed of the i-1th circular cross section, and the absolute value of the second wind speed of the i+1th circular cross section; The wind speed change rate of the i-th circular section is calculated by dividing the difference between the maximum value and the minimum value by the minimum value.

5. The determination method according to claim 1, characterized in that: S6, when the wind speed change rates of n circular cross sections are all less than a preset wind speed change rate threshold, taking the spatial region position where the absolute value of the maximum wind speed of each circular cross section is located as the center, taking an equivalent area equal to the windward area of ​​the chip, and calculating the average surface velocity of each equivalent area includes: When the wind speed change rates of n circular cross-sections are all less than a preset wind speed change rate threshold, take the spatial region where the absolute value of the maximum wind speed of each circular cross-section is located as the center, take an equivalent area equal to the windward area of ​​the chip, and calculate the volume flow rate of the fluid passing through each equivalent area; The volume flow rate of each of the equivalent areas is divided by each of the equivalent areas to calculate the average surface velocity of each of the equivalent areas.

6. The determination method according to claim 1, characterized in that: The initial value of the preset wind speed change rate threshold is pre-set based on an empirical value.

7. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for determining the optimal heat dissipation position of a chip according to any one of claims 1 to 6.

8. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for determining the optimal heat dissipation position of a chip according to any one of claims 1 to 6 when executed.

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