Tantalum capacitor shell packaging equipment capable of accurately controlling pin implantation

Abstract

The invention discloses tantalum capacitor shell packaging equipment capable of accurately controlling pin implantation, and relates to the technical field of tantalum capacitor shell packaging, the tantalum capacitor shell packaging equipment comprises a workbench, a pin carrying table and an auxiliary implantation assembly, a positioning assembly is installed in front of the upper side of the workbench, and a fixing plate is fixed to the rear of the upper side of the workbench; two electric push rods are mounted on one side of the fixing plate, a pin carrying table is mounted at one end of each electric push rod, and an auxiliary implantation assembly is mounted on the upper side of each pin carrying table. According to the tantalum capacitor shell packaging equipment capable of accurately controlling pin implantation, two limiting frames can preliminarily limit pins between the two limiting frames, a micro telescopic rod can drive a positioning block to ascend and descend so that the positioning block can position the pins between the two limiting frames, and a pin carrying table can be conveniently pushed to move through an electric push rod; and the pin carrying platform and the pins on the upper side of the pin carrying platform are close to mounting hole positions on one side of the tantalum capacitor shell.

Description

Technical Field

[0001] The present invention relates to the technical field of tantalum capacitor housing encapsulation, and specifically to a tantalum capacitor housing encapsulation device for precisely controlling pin implantation. Background Technique

[0002] A tantalum capacitor is a capacitor with tantalum metal as the electrode, having characteristics such as high stability, high precision, and excellent frequency response; due to its unique physical and chemical properties, the tantalum capacitor has become an important type of capacitor in electronic circuits. During the processing of tantalum capacitors, a housing encapsulation device is required, and capacitor housing encapsulation is a key process in capacitor manufacturing.

[0003] In the encapsulation process of existing tantalum capacitor housing encapsulation devices, although the encapsulation operation can be achieved, it is not convenient to control pin implantation during encapsulation, making the process relatively complex and the functionality not good. Summary of the Invention

[0004] The purpose of the present invention is to provide a tantalum capacitor housing encapsulation device for precisely controlling pin implantation to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A tantalum capacitor housing encapsulation device for precisely controlling pin implantation, including a workbench, a pin carrier, and an auxiliary implantation component. A positioning component is installed in the front of the upper side of the workbench, and a fixing plate is fixed at the rear of the upper side of the workbench. Two electric push rods are installed on one side of the fixing plate, and a pin carrier is installed at one end of the electric push rod. An auxiliary implantation component is installed on the upper side of the pin carrier, and the auxiliary implantation component includes a limit frame, a locking screw, a side plate, a micro telescopic rod, and a positioning block. The limit frame is slidably arranged on the upper side of the pin carrier, and a locking screw penetrates through the middle of the upper side of the limit frame. One side of the limit frame is connected to a side plate, and a micro telescopic rod is installed on the lower side of the side plate. A positioning block is fixed at the bottom of the micro telescopic rod.

[0006] Further, the positioning component includes a fixed frame, a bidirectional lead screw, a moving sleeve, and a positioning clamp. The bidirectional lead screw is rotatably installed inside the fixed frame, and two moving sleeves are symmetrically sleeved on the outer side of the bidirectional lead screw. One side of the moving sleeve is connected to a positioning clamp through an adapter block.

[0007] Further, the positioning component further includes a driving motor. The driving motor is installed on the outer side of one side of the fixed frame, and at the same time, the moving sleeve is slidably connected to the inner wall of the fixed frame.

[0008] Further, the auxiliary implantation component further includes sliding blocks. Sliding blocks are fixed on both lower sides of the limit frame. A limit sliding groove is opened on the side wall of the pin carrier, and at the same time, the sliding blocks are slidably connected to the limit sliding groove.

[0009] Further, the pin carrier platform is slidably connected to the workbench, and support rods are fixed on both sides of the upper side of the pin carrier platform, and a cross rail is arranged at the top of the support rods.

[0010] Further, a moving seat is slidably installed on the outer side above the cross rail, and a soldering device is installed at the bottom of the moving seat.

[0011] Further, upper frames are installed on both sides of the upper side of the workbench, a cylinder is installed in the middle of the upper frame, and a piston rod passing through the upper frame is arranged on the lower side of the cylinder.

[0012] Further, a lifting seat is fixed at the bottom of the piston rod, and a pressing head is installed on the lower side of the lifting seat.

[0013] Further, the operation method is as follows: Set the tantalum capacitor shell to be encapsulated on one side of the positioning component. Drive the rotation of the bidirectional lead screw through the drive motor, drive the movement of the two moving sleeves and the positioning clamping plates on its outer side, and adjust the distance between the two positioning clamping plates so that the two parallel positioning clamping plates can perform preliminary positioning on the tantalum capacitor shell; Set pins on the pin carrier platform. Through the sliding cooperation of the sliding block and the limit sliding groove, adjust the position of the limit frame on the upper side of the pin carrier platform according to the mounting hole positions of the tantalum capacitor, move and adjust the position of the limit frame so that the two limit frames perform preliminary limiting on the pins between them. Then, drive the lifting of the positioning block through the micro telescopic rod, and further enable the positioning block to position the pins between the two limit frames; Push the displacement of the pin carrier platform through the electric push rod, so that the pin carrier platform and the pins on its upper side are close to the mounting hole positions on one side of the tantalum capacitor shell, and ensure that the pin directions are correct. Adjust the position of the soldering device by moving the moving seat on the cross rail, so that the soldering device firmly solders the pins and the hole positions through soldering, avoiding virtual soldering or short circuit. Drive the lifting of the lifting seat and the pressing head through the cylinder and the piston rod, so that the pressing head presses the tantalum capacitor shell, the core body and the sealing body that have been processed by the encapsulation device.

[0014] The present invention provides a tantalum capacitor shell encapsulation device for precisely controlling pin implantation, having the following beneficial effects:

[0015] The present invention is provided with an auxiliary implantation component. The pin carrier platform is used to carry pins. The limit frame can move on the upper side of the pin carrier platform through the sliding cooperation of the sliding block and the limit sliding groove, so as to adjust the position of the limit frame according to the mounting hole positions of the tantalum capacitor, and at the same time facilitate adjusting the distance between two adjacent limit frames, and is also convenient for setting the corresponding number of limit frames according to needs, so that the two limit frames can perform preliminary limiting on the pins between them. The micro telescopic rod can drive the lifting of the positioning block, and further enable the positioning block to position the pins between the two limit frames.

[0016] The present invention is provided with a protection component. The positioning component can perform preliminary positioning on the tantalum capacitor housing, facilitating subsequent pin implantation and encapsulation operations. The electric push rod facilitates the displacement of the pin carrier platform, enabling the pins on the pin carrier platform and its upper side to approach the mounting hole positions on one side of the tantalum capacitor housing and ensuring the correct pin direction. Then, by moving the moving seat on the cross rail, the position of the soldering device can be adjusted, allowing the soldering device to firmly solder the pins to the hole positions through soldering, avoiding false soldering or short circuits. The cylinder and piston rod facilitate the lifting of the lifting seat and the pressing head, enabling the pressing head to press the tantalum capacitor housing, core body, and sealing body that have been processed by the encapsulation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 6 is a schematic three-dimensional structure diagram of a tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to the present invention;

[0018] Figure 2 FIG. 10 is an enlarged schematic structural diagram of an auxiliary implantation component of a tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to the present invention;

[0019] Figure 3 FIG. 14 is an exploded schematic structural diagram of an auxiliary implantation component of a tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to the present invention;

[0020] Figure 4 FIG. 18 is a schematic semi-sectional structural diagram of a positioning component of a tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to the present invention;

[0021] Figure 5 FIG. 22 is a schematic side view structure diagram of a tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to the present invention.

[0022] In the figure: 1, workbench; 2, positioning component; 201, fixed frame; 202, bidirectional lead screw; 203, moving sleeve; 204, positioning clamping plate; 205, driving motor; 3, fixing plate; 4, electric push rod; 5, pin carrier platform; 6, auxiliary implantation component; 601, limiting frame; 602, locking screw; 603, side plate; 604, micro telescopic rod; 605, positioning block; 606, sliding block; 7, limiting chute; 8, support rod; 9, cross rail; 10, moving seat; 11, soldering device; 12, upper frame; 13, cylinder; 14, piston rod; 15, lifting seat; 16, pressing head. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The following further describes in detail the embodiments of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0024] As shown in Figure 1 and Figure 4As shown in the figure, a tantalum capacitor housing encapsulation device for precisely controlling pin implantation includes a workbench 1, a pin carrier 5, and an auxiliary implantation component 6. A positioning component 2 is installed in the front of the upper side of the workbench 1, and a fixing plate 3 is fixed at the rear of the upper side of the workbench 1. The positioning component 2 includes a fixing frame 201, a bidirectional lead screw 202, a moving sleeve 203, and a positioning clamping plate 204. The bidirectional lead screw 202 is rotatably installed inside the fixing frame 201, and two moving sleeves 203 are symmetrically sleeved on the outer side of the bidirectional lead screw 202. One side of the moving sleeve 203 is connected with a positioning clamping plate 204 through a connecting block. The positioning component 2 further includes a driving motor 205. The driving motor 205 is installed on the outer side of one side of the fixing frame 201. At the same time, the moving sleeve 203 is slidably connected with the inner wall of the fixing frame 201. By driving the driving motor 205, it is convenient to drive the rotation of the bidirectional lead screw 202, thereby driving the movement of the two moving sleeves 203 and the positioning clamping plates 204 on its outer side to adjust the distance between the two positioning clamping plates 204, so that the two mutually parallel positioning clamping plates 204 can perform preliminary positioning on the tantalum capacitor housing, facilitating subsequent pin implantation and encapsulation operations.

[0025] As Figure 1 and Figure 3 shown in the figure, two electric push rods 4 are installed on one side of the fixing plate 3, and one end of the electric push rod 4 is installed with a pin carrier 5. An auxiliary implantation component 6 is installed on the upper side of the pin carrier 5. The auxiliary implantation component 6 includes a limiting frame 601, a locking screw 602, a side plate 603, a micro telescopic rod 604, and a positioning block 605. The limiting frame 601 is slidably arranged on the upper side of the pin carrier 5, and the locking screw 602 penetrates through the middle of the upper side of the limiting frame 601. One side of the limiting frame 601 is connected with a side plate 603, and a micro telescopic rod 604 is installed on the lower side of the side plate 603. The bottom of the micro telescopic rod 604 is fixed with a positioning block 605. The auxiliary implantation component 6 further includes a sliding block 606. Sliding blocks 606 are fixed on both lower sides of the limiting frame 601. A limiting sliding groove 7 is opened on the side wall of the pin carrier 5. At the same time, the sliding block 606 is slidably connected with the limiting sliding groove 7. The pin carrier 5 is used to carry pins. The limiting frame 601 can move on the upper side of the pin carrier 5 through the sliding cooperation of the sliding block 606 and the limiting sliding groove 7, so as to adjust the position of the limiting frame 601 according to the installation hole position of the tantalum capacitor, and at the same time, it is convenient to adjust the distance between two adjacent limiting frames 601, and it is convenient to set the corresponding number of limiting frames 601 according to needs, so that the two limiting frames 601 can perform preliminary limiting on the pins between them. By driving the micro telescopic rod 604, the lifting of the positioning block 605 can be driven, and then the positioning block 605 can position the pins between the two limiting frames 601.

[0026] As Figure 1 and Figure 5As shown in the figure, the pin carrier 5 is slidably connected to the workbench 1. On both sides of the upper side of the pin carrier 5, support rods 8 are fixed. At the top of the support rods 8, a cross rail 9 is installed. A moving seat 10 is slidably installed on the outer side above the cross rail 9. A soldering device 11 is installed at the bottom of the moving seat 10. Upper frames 12 are installed on both sides of the upper side of the workbench 1. A cylinder 13 is installed in the middle of the upper frame 12. A piston rod 14 passing through the upper frame 12 is arranged below the cylinder 13. A lifting seat 15 is fixed at the bottom of the piston rod 14. A pressing head 16 is installed below the lifting seat 15. The electric push rod 4 facilitates the displacement of the pin carrier 5, so that the pin carrier 5 and the pins on its upper side are close to the mounting hole positions on one side of the tantalum capacitor housing, and the pin direction is ensured to be correct. Then, by moving the moving seat 10 on the cross rail 9, the position of the soldering device 11 can be adjusted, so that the soldering device 11 firmly solders the pins to the hole positions through soldering, avoiding false soldering or short circuit. The cylinder 13 and the piston rod 14 facilitate the lifting of the lifting seat 15 and the pressing head 16, so that the pressing head 16 can press the tantalum capacitor housing, the core body and the sealing body processed by the encapsulation device.

[0027] In summary, as Figures 1 - 5 shown, when using the tantalum capacitor housing encapsulation device for precisely controlling pin implantation, first, the tantalum capacitor housing to be encapsulated can be set on one side of the positioning component 2. Then, the driving motor 205 drives the rotation of the bidirectional lead screw 202, thereby driving the movement of the two moving sleeves 203 and the positioning clamping plates 204 on its outer side to adjust the distance between the two positioning clamping plates 204, so that the two parallel positioning clamping plates 204 can perform preliminary positioning on the tantalum capacitor housing.

[0028] Then, pins are set on the pin carrier 5. At this time, through the sliding cooperation of the sliding block 606 and the limit sliding groove 7, the position of the limit frame 601 can be adjusted on the upper side of the pin carrier 5 according to the mounting hole positions of the tantalum capacitor, so that the two limit frames 601 can perform preliminary limiting on the pins between them. Then, the micro telescopic rod 604 drives the lifting of the positioning block 605, so that the positioning block 605 can position the pins between the two limit frames 601.

[0029] Then, the displacement of the pin carrier 5 is pushed by the electric push rod 4, so that the pin carrier 5 and the pins on its upper side are close to the mounting hole positions on one side of the tantalum capacitor housing, and ensure that the pin directions are correct. Then, by moving the moving seat 10 on the cross rail 9, the position of the soldering device 11 can be adjusted, so that the soldering device 11 firmly solders the pins and the hole positions, avoiding false soldering or short circuit. Finally, the lifting of the lifting seat 15 and the pressing head 16 is driven by the cylinder 13 and the piston rod 14, so that the pressing head 16 can press the tantalum capacitor housing, the core body and the sealing body that have been processed by the encapsulation device. In this way, the use process of the tantalum capacitor housing encapsulation device with precise control of pin implantation is completed.

[0030] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application, and to enable those of ordinary skill in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A tantalum capacitor housing encapsulation device for precisely controlling pin implantation, comprising a workbench (1), a pin carrier (5), and an auxiliary implantation component (6), characterized in that, A positioning component (2) is installed in front of the upper side of the workbench (1), and a fixing plate (3) is fixed at the rear of the upper side of the workbench (1). Two electric push rods (4) are installed on one side of the fixing plate (3), and a pin carrier (5) is installed at one end of the electric push rod (4). An auxiliary implantation component (6) is installed on the upper side of the pin carrier (5), and the auxiliary implantation component (6) includes a limit frame (601), a locking screw (602), a side plate (603), a micro telescopic rod (604) and a positioning block (605). The limit frame (601) is slidably arranged on the upper side of the pin carrier (5), and the locking screw (602) penetrates through the middle of the upper side of the limit frame (601). One side of the limit frame (601) is connected with a side plate (603), and a micro telescopic rod (604) is installed on the lower side of the side plate (603), and a positioning block (605) is fixed at the bottom of the micro telescopic rod (604).

2. The tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 1, characterized in that, The positioning component (2) includes a fixed frame (201), a bidirectional lead screw (202), a moving sleeve (203) and a positioning clamp (204). The bidirectional lead screw (202) is rotatably installed inside the fixed frame (201), and two moving sleeves (203) are symmetrically sleeved on the outer side of the bidirectional lead screw (202), and a positioning clamp (204) is connected to one side of the moving sleeve (203) through an adapter block.

3. The tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 2, characterized in that, The positioning component (2) further includes a driving motor (205). A driving motor (205) is installed on the outer side of one side of the fixed frame (201), and at the same time, the moving sleeve (203) is slidably connected with the inner wall of the fixed frame (201).

4. The tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 3, wherein The auxiliary implantation component (6) further includes sliding blocks (606). Sliding blocks (606) are fixed on both lower sides of the limit frame (601).

5. The tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 4, wherein A limit sliding groove (7) is formed on the side wall of the pin carrier (5), and at the same time, the sliding block (606) is slidably connected with the limit sliding groove (7).

6. The tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 5, characterized in that, The pin carrier (5) is slidably connected with the workbench (1), and support rods (8) are fixed on both sides of the upper side of the pin carrier (5), and a cross rail (9) is arranged at the top of the support rods (8).

7. The tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 6, wherein, A moving seat (10) is slidably installed outside the upper side of the cross rail (9), and a soldering device (11) is installed at the bottom of the moving seat (10).

8. A tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 7, characterized in that, Upper frames (12) are installed on both sides of the upper side of the workbench (1), a cylinder (13) is installed in the middle of the upper frames (12), and a piston rod (14) penetrating through the upper frames (12) is arranged under the cylinder (13).

9. The tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 8, characterized in that, A lifting seat (15) is fixed at the bottom of the piston rod (14), and a pressing head (16) is installed on the lower side of the lifting seat (15).

10. A tantalum capacitor housing encapsulation device for precisely controlling pin implantation according to claim 9, characterized in that, The operation method is as follows: Set the tantalum capacitor housing to be encapsulated on one side of the positioning component (2). Drive the rotation of the bidirectional lead screw (202) through the drive motor (205), drive the movement of the two outer moving sleeves (203) and the positioning clamping plates (204), and adjust the distance between the two positioning clamping plates (204) so that the two mutually parallel positioning clamping plates (204) can perform preliminary positioning on the tantalum capacitor housing; Set pins on the pin carrier (5). Through the sliding fit of the sliding block (606) and the limit chute (7), adjust the position of the limit frame (601) according to the mounting hole positions of the tantalum capacitor. Move and adjust the position of the limit frame (601) above the pin carrier (5) so that the two limit frames (601) perform preliminary limiting on the pins between them. Then drive the lifting of the positioning block (605) through the micro telescopic rod (604) so that the positioning block (605) positions the pins between the two limit frames (601); Push the displacement of the pin carrier (5) through the electric push rod (4) so that the pin carrier (5) and the pins on its upper side approach the mounting hole positions on one side of the tantalum capacitor housing and ensure that the pin directions are correct. Adjust the position of the soldering device (11) through the movement of the moving seat (10) on the cross rail (9) so that the soldering device (11) firmly solders the pins and the hole positions through soldering to avoid virtual soldering or short circuit. Drive the lifting of the lifting seat (15) and the pressing head (16) through the cylinder (13) and the piston rod (14) so that the pressing head (16) presses the tantalum capacitor housing, the core body, and the sealing body that have been processed by the encapsulation device.

Images