Baking device used in wafer bonding equipment

Abstract

The invention belongs to the field of wafer bonding equipment, and discloses a baking device for wafer bonding equipment, which comprises a bracket and a barrel, the bracket comprises a fixed support ring, a plurality of support legs are uniformly arranged on the side edge of the support ring, the barrel is fixedly mounted on the inner wall of the support ring, a switch door is arranged on the surface of the barrel, and a plurality of partition plates are uniformly arranged on the inner wall of the barrel. The inner wall of the barrel is divided into a heat dissipation box, a cleaning box and a drying box by the partition plates, a rotating device is fixedly arranged at the axis position of the inner wall of the barrel, a plurality of limiting devices are fixedly arranged above the inner wall of the barrel, and a filtering device is fixedly arranged above the barrel; the invention aims to provide the baking device used in the wafer bonding equipment, through innovative structural design and function integration, integrated treatment of multiple procedures of heat dissipation, cleaning, drying and the like of a wafer before bonding is achieved, the problems that an existing device is single in function, low in treatment efficiency and incapable of meeting the continuous production requirement are solved, and the device is suitable for large-scale popularization and application. Therefore, the wafer bonding quality and the production efficiency are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer bonding equipment, and specifically provides a baking device for wafer bonding equipment. Background Art

[0002] In the process of wafer bonding, the pretreatment before wafer bonding is extremely crucial. Traditional baking devices only focus on the drying function and are unable to meet the complex pre-treatment requirements for wafer bonding.

[0003] From the perspective of the wafer production process, after a series of complex processing steps such as lithography and etching, various impurities will remain on the wafer surface, such as photoresist, metal particles, chemical reagent residues, etc. If these impurities are not completely removed, they will form an isolation layer during the wafer bonding process, hindering atomic diffusion and chemical bonding at the bonding interface, resulting in a decrease in bonding strength and even defects such as voids and delamination, seriously affecting the reliability and performance of the chip.

[0004] At the same time, the heat generated during the processing will cause thermal stress inside the wafer. If the wafer is not effectively cooled first, the thermal stress may be released during the bonding process, causing the wafer to warp and deform, affecting the alignment accuracy and fitting degree of the bonding. In addition, high temperatures may also trigger chemical reactions on the wafer surface, further reducing the bonding quality.

[0005] Moreover, during the operation of traditional devices, a single process is usually used for sequential processing, making it difficult to achieve efficient connection between different processing steps. This means that wafers need to be frequently transferred between different processing devices, which not only increases the risk of wafer contamination and damage but also makes the production process cumbersome and inefficient. At the same time, traditional devices cannot perform supplementary processing on new wafers without interrupting the overall process and need to wait for a batch of wafers to be processed before starting the next batch of operations, which greatly limits the production efficiency and increases the production cost.

[0006] Therefore, developing a baking device with comprehensive functions, convenient operation, and high efficiency to meet the multi-process requirements before wafer bonding and improve the wafer bonding quality and production efficiency has become an urgent problem to be solved in the semiconductor manufacturing industry. Summary of the Invention

[0007] The present invention aims to provide a baking device for wafer bonding equipment. Through innovative structural design and function integration, the device realizes the integrated processing of multiple processes such as heat dissipation, cleaning, and drying of wafers before bonding, solves the problems of single function, low processing efficiency, and inability to meet the requirements of continuous production of existing devices, and thus improves the wafer bonding quality and production efficiency.

[0008] To achieve the above object, the present invention provides the following technical solutions: The technical solution provided by the present invention is: a baking device for a wafer bonding apparatus, comprising a bracket and a cylinder body. The bracket includes a fixed support ring, and a plurality of support legs are evenly arranged on the side of the support ring. The cylinder body is fixedly installed on the inner wall of the support ring, and a switch door is provided on the surface of the cylinder body. A plurality of partition plates are evenly arranged on the inner wall of the cylinder body. The partition plates divide the inner wall of the cylinder body into a heat dissipation box, a cleaning box, and a drying box. A rotating device is fixedly arranged at the central position of the inner wall of the cylinder body, a plurality of limiting devices are fixedly arranged above the inner wall of the cylinder body, and a filtering device is fixedly arranged above the cylinder body.

[0009] Furthermore, a heat dissipation filter plate is fixedly arranged below the heat dissipation box. A heat dissipation gear is movably clamped below the heat dissipation filter plate, and a heat dissipation blade is fixedly arranged above the heat dissipation gear.

[0010] Furthermore, a cleaning motor is fixedly arranged below the cleaning box. A cleaning gear is adaptively arranged at the output end of the cleaning motor. A cleaning shaft is fixedly arranged above the cleaning gear. Cleaning blades are fixedly arranged on the surface of the cleaning shaft. A cleaning belt is adaptively arranged on the surface of the cleaning gear, and the other end of the cleaning belt is adaptively connected to the heat dissipation gear.

[0011] Furthermore, a dryer is fixedly arranged below the drying box, and a drying plate is fixedly arranged above the drying box. Drying grooves are provided on the surface of the drying plate.

[0012] Furthermore, the rotating device includes a positioning rod fixedly installed at the central position of the inner wall of the cylinder body. A rotating shaft is movably arranged above the positioning rod. A rotating motor is fixedly arranged above the rotating shaft, and the rotating motor is fixedly installed above the cylinder body. Lifting slide rails are evenly arranged on the side of the rotating shaft. Lifting damping rods are fixedly arranged above the lifting slide rails. One end of the lower part of the lifting damping rod is fixedly provided with a lifting slide plate. The lifting slide plate is movably and adaptively installed in the lifting slide rail. A lifting connecting rod is fixedly arranged on one side of the lifting slide plate. A placing ring is fixedly arranged on one side of the lower part of the lifting connecting rod. Openings are provided on the side of the placing ring.

[0013] Furthermore, the limiting device includes a limiting telescopic rod fixedly installed above the inner wall of the cylinder body. A limiting plate is fixedly arranged below the limiting telescopic rod, and a plurality of holes are provided on the surface of the limiting plate.

[0014] Furthermore, the filtering device includes a filtering cylinder fixedly installed above the cylinder body. A plurality of filter plates are evenly arranged on the inner wall of the filtering cylinder, and air outlet holes are provided on the upper surface of the filtering cylinder.

[0015] The beneficial effects of this technical solution are: (1) By integrating multiple functions such as heat dissipation, cleaning, and drying into one device, it avoids the situation in traditional processes where multiple independent devices are required to complete different processes separately, greatly reducing the floor area of the equipment. At the same time, in traditional devices, wafers need to be frequently transferred between different processes, which increases the risk of wafer contamination and mechanical damage. However, the integrated design of the present invention enables wafers to complete multiple processing processes within one device, reducing the number of wafer transfers, thereby reducing the possibility of wafer damage, improving the yield rate of products, and enabling each functional area to cooperate closely to achieve continuous processing from heat dissipation to cleaning and then to drying, avoiding production stagnation caused by poor connection between different devices, making the entire production process smoother, and improving the coherence and stability of production.

[0016] (2) The heat dissipation gear and the cleaning gear are linked by a cleaning belt, realizing the coordinated operation of the cleaning and heat dissipation functions. While the cleaning motor is running, it can drive the heat dissipation device to work synchronously without an additional power source to drive heat dissipation, thus effectively saving energy consumption and reducing production costs; This coordinated working method enables the cleaning and heat dissipation processes to be carried out simultaneously, reducing the processing time. The originally separate cleaning and heat dissipation processes can now be carried out in parallel, greatly improving the overall processing capacity and production efficiency of the device.

[0017] (3) The rotating device cooperates with the limiting device to accurately switch the wafer between different functional areas. The precise rotation angle control of the rotating shaft and the stable movement of the placement ring ensure that the wafer can accurately reach each processing position, guaranteeing the accuracy and consistency of the processing process; While not interrupting other wafer drying and other processing processes, it can achieve the supplementary processing of new wafers. Operators can take out the wafers that have completed processing at any time during the operation of the device and put in new wafers to be processed, realizing continuous production, greatly improving production efficiency, and shortening the production cycle.

[0018] (4) The filtering device can effectively purify the internal air, removing pollutant particles, water vapor and other impurities in the air, creating a clean environment for the wafer processing process, preventing impurities from adhering to the wafer surface during the processing, avoiding secondary pollution, and thus ensuring that each processing process can be carried out in a high-quality environment; By comprehensively and effectively dissipating heat, cleaning, and drying the wafer, impurities on the wafer surface and internal thermal stress are removed, improving the flatness and cleanliness of the wafer surface. This is conducive to better atomic diffusion and chemical bonding during the wafer bonding process, thereby improving the strength and quality of wafer bonding, reducing the incidence of bonding defects, and improving the reliability and performance of the chip. Description of the Drawings

[0019] Figure 1 One of the schematic structural diagrams of a baking device for a wafer bonding apparatus proposed by the present invention; Figure 2 Another schematic structural diagram of a baking device for a wafer bonding apparatus proposed by the present invention; Figure 3 Schematic cross-sectional structure diagram of an internal cleaning tank of a baking device for a wafer bonding apparatus proposed by the present invention; Figure 4 Schematic cross-sectional structure diagram of an internal heat dissipation tank of a baking device for a wafer bonding apparatus proposed by the present invention; Figure 5 Schematic cross-sectional structure diagram of an internal drying tank of a baking device for a wafer bonding apparatus proposed by the present invention; Figure 6 Schematic structural diagram of a rotating device of a baking device for a wafer bonding apparatus proposed by the present invention.

[0020] The names of the corresponding marks in the drawings are: 1, bracket; 2, cylinder; 3, partition board; 4, heat dissipation tank; 5, cleaning tank; 6, drying tank; 7, rotating device; 8, limiting device; 9, filtering device; 101, support ring; 102, support leg; 201, switch door; 401, heat dissipation gear; 402, heat dissipation filter plate; 403, heat dissipation blade; 501, cleaning motor; 502, cleaning gear; 503, cleaning shaft; 504, cleaning blade; 505, cleaning belt; 601, dryer; 602, drying plate; 603, drying groove; 701, positioning rod; 702, rotating shaft; 703, lifting slide rail; 704, lifting damping rod; 705, lifting slide plate; 706, lifting connecting rod; 707, placing ring; 708, air hole; 709, rotating motor; 801, limiting telescopic rod; 802, limiting plate; 803, hole; 901, filter plate; 902, air outlet hole; 903, filter cylinder. Detailed implementation manners

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] The specific implementation process is as follows: Embodiment 1: Please refer to Figure 1-6, a technical solution provided by the present invention: a baking device for a wafer bonding equipment, mainly composed of a bracket 1 and a cylinder body 2. The bracket 1 includes a fixed support ring 101, and several support legs 102 are evenly distributed on the side of the support ring 101. The support legs 102 and the support ring 101 are fixedly connected by welding to provide stable support for the whole device. The cylinder body 2 is firmly installed on the inner wall of the support ring 101 by bolts. A switch door 201 is arranged on the surface of the cylinder body 2, and the switch door 201 is connected to the cylinder body 2 through a hinge, which is convenient for operators to take and place the internal wafers; The inner wall of the cylinder body 2 is accurately divided into a heat dissipation box 4, a cleaning box 5 and a drying box 6 by several evenly arranged partition plates 3. The partition plates 3 and the inner wall of the cylinder body 2 are fixedly connected by welding to ensure the independence and stability of each functional area. A rotating device 7 is fixedly arranged at the axial center position of the inner wall of the cylinder body 2, several limiting devices 8 are fixedly arranged above the inner wall of the cylinder body 2, and a filtering device 9 is fixedly arranged above the cylinder body 2; A heat dissipation filter plate 402 is fixedly installed below the heat dissipation box 4. The heat dissipation filter plate 402 is fixedly connected to the bottom of the heat dissipation box 4 by bolts. Its function is to block impurities from entering the heat dissipation area and ensure the cleanliness of the heat dissipation environment. A heat dissipation gear 401 is movably clamped below the heat dissipation filter plate 402. The heat dissipation gear 401 and the heat dissipation filter plate 402 are connected by a bearing, so that the heat dissipation gear 401 can rotate flexibly. A heat dissipation blade 403 is fixedly connected to the upper part of the heat dissipation gear 401 by key connection. When the heat dissipation gear 401 operates, it drives the heat dissipation blade 403 to rotate at a high speed, generating strong air flow to efficiently dissipate heat from the wafer; A cleaning motor 501 is fixedly installed below the cleaning box 5. The cleaning motor 501 is fixedly connected to the bottom of the cleaning box 5 by bolts. The output end of the cleaning motor 501 is adaptively connected to a cleaning gear 502 through a coupling to ensure stable power transmission. A cleaning shaft 503 is installed above the cleaning gear 502 by key connection. Cleaning blades 504 are fixedly arranged on the surface of the cleaning shaft 503 by welding. At the same time, the cleaning gear 502 is connected to the heat dissipation gear 401 through a cleaning belt 505. This unique connection method enables the cleaning motor 501 to drive the cleaning blades 504 to clean the wafer while driving the heat dissipation gear 401 to operate through the cleaning belt 505, realizing the coordinated work of the heat dissipation and cleaning functions and greatly improving the energy utilization efficiency; A dryer 601 is installed below the drying box 6 by bolts. The heat generated by the dryer 601 is evenly transmitted to the wafer through the drying plate 602 fixed above. The drying plate 602 is fixedly connected to the inner wall of the drying box 6 by bolts. Drying grooves 603 are opened on the surface of the drying plate 602. Its design can better fit the shape of the wafer, ensure uniform heat distribution during the drying process and improve the drying effect; The rotating device 7 is installed at the axial center position of the inner wall of the cylinder body 2. It includes a positioning rod 701 fixed at the axial center of the inner wall of the cylinder body 2. The positioning rod 701 is fixedly connected to the inner wall of the cylinder body 2 by welding. Above the positioning rod 701, a rotating shaft 702 is movably installed through a bearing. Above the rotating shaft 702, a rotating motor 709 is connected through a coupling. The rotating motor 709 is fixedly installed above the cylinder body 2 by bolts. On the side of the rotating shaft 702, lifting slide rails 703 are evenly distributed. The lifting slide rails 703 are fixedly connected to the rotating shaft 702 by bolts. Above the lifting slide rails 703, lifting damping rods 704 are installed. The lifting damping rods 704 are fixedly connected to the tops of the lifting slide rails 703 by bolts. Below the lifting damping rods 704, lifting slide plates 705 are connected. The lifting slide plates 705 are welded to the piston rods of the lifting damping rods 704, and the lifting slide plates 705 can move flexibly within the lifting slide rails 703. On one side of the lifting slide plates 705, lifting connecting rods 706 are connected by bolts. On one side below the lifting connecting rods 706, a placement ring 707 is installed by bolts. The placement ring 707 is used to carry the wafer. Openings 708 are provided on its side to facilitate the circulation of heat and air flow within the placement ring 707, ensuring that the wafer is evenly heated and exposed to air during each processing step. By driving the rotation of the rotating shaft 702 by the rotating motor 709, precise switching of the placement ring 707 between different functional boxes can be achieved. At the same time, the lifting damping rods 704 can adjust the height of the placement ring 707 according to actual needs to meet the requirements of different processing steps; The limiting device 8 is fixedly installed above the inner wall of the cylinder body 2. It includes a limiting telescopic rod 801 fixed above the inner wall of the cylinder body 2. The limiting telescopic rod 801 is fixedly connected to the inner wall of the cylinder body 2 by bolts. Below the limiting telescopic rod 801, a limiting plate 802 is connected by welding. A number of holes 803 are provided on the surface of the limiting plate 802. These holes 803 neither affect the normal circulation of heat and air flow nor play a buffering role during the limiting process. The limiting telescopic rod 801 can flexibly adjust the height of the limiting plate 802 according to the actual height and position of the wafer, ensuring that the wafer always remains stable during the processing and avoiding affecting the processing quality due to shaking; The filtering device 9 is fixedly installed above the cylinder body 2. It includes a filtering cylinder 903 fixed above the cylinder body 2. The filtering cylinder 903 is fixedly connected to the top of the cylinder body 2 by bolts. A number of filter plates 901 are evenly arranged on the inner wall of the filtering cylinder 903. The filter plates 901 are fixedly connected to the inner wall of the filtering cylinder 903 through card slots. During the operation of the device, the internal air circulates continuously. Through the layer-by-layer filtration of the filter plates 901, pollutants such as impurity particles and water vapor in the air can be effectively removed. The purified air is discharged from the air outlet holes 902 provided on the upper surface of the filtering cylinder 903, creating a clean environment for the wafer processing process, effectively avoiding secondary pollution, and improving the quality and success rate of wafer bonding; During use, the operator opens the switch door 201 on the surface of the cylinder body 2. At this time, the heat dissipation box 4 is in an operable state. The operator takes out the wafer that has been cooled through the previous cooling process from the placement ring 707 in the heat dissipation box 4, and at the same time places a new wafer to be processed on the placement ring 707; The operator issues an instruction through the control device to control the operation of the rotation motor 709. After the rotation motor 709 starts, it drives the rotation shaft 702 to rotate 120 degrees. Since the rotation shaft 702 is connected to the placement ring 707 through structures such as the lifting connecting rod 706, the rotation of the rotation shaft 702 drives the placement ring 707 on the side to synchronously rotate 120 degrees. After rotation, the placement ring 707 with the new wafer originally located above the heat dissipation box 4 moves above the cleaning box 5; After the placement ring 707 moves into place, the operator controls the operation of the three groups of limit telescopic rods 801 through the control device again. After the limit telescopic rods 801 start, their elongation drives the limit plate 802 to gradually move downward. When the limit plate 802 contacts the upper part of the placement ring 707, as the limit telescopic rods 801 continue to descend, the limit plate 802 pushes the placement ring 707 to overcome the resistance of the lifting damping rod 704 and move downward along the lifting slide rail 703. Finally, the placement rings 707 in the heat dissipation box 4, the cleaning box 5, and the drying box 6 all move into the corresponding boxes. At this time, the cleaning motor 501 in the cleaning box 5 starts to drive the cleaning blade 504 to clean the wafer on the placement ring 707 in the cleaning box 5; the dryer 601 in the drying box 6 starts to dry the wafer on the placement ring 707 in the drying box 6 through the drying plate 602 and the drying groove 603; the heat dissipation gear 401 in the heat dissipation box 4 is driven by the cleaning belt 505 to drive the heat dissipation blade 403 to dissipate heat from the wafer on the placement ring 707 in the heat dissipation box 4, so as to carry out the processing work of different processes simultaneously; During the processing of the above-mentioned various processes, when the wafer in the drying box 6 has completed the drying process and the wafer in the heat dissipation box 4 has also completed the heat dissipation process, the operator opens the switch door 201 again, takes out the wafer that has completed heat dissipation in the heat dissipation box 4, and places a new wafer. Subsequently, according to the above process of functional area switching, limiting, and process start, the rotation motor 709 and the limit telescopic rods 801 are started again to transfer the newly placed wafer at the position of the heat dissipation box 4 to the cleaning box 5 for cleaning, the wafer that has been cleaned in the cleaning box 5 is transferred to the drying box 6 for drying, and the wafer that has been dried in the drying box 6 is transferred to the heat dissipation box 4 for heat dissipation. By repeating this cycle, in this way, while not interrupting the drying and other processing processes of other wafers, the continuous supplementary processing of new wafers is realized, greatly improving the production efficiency and the utilization rate of the device.

[0023] The above are only embodiments of the present invention, and common general technical solutions or characteristics in the solutions are not described in detail herein. It should be noted that for those skilled in the art, without departing from the technical solutions of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the implementation effect of the present invention and the practicality of the patent. The protection scope claimed in this application shall be subject to the content of its claims, and the specific implementation manners described in the specification can be used to interpret the content of the claims.

Claims

1. A baking device for a wafer bonding equipment, comprising a bracket (1) and a cylinder body (2). The bracket (1) includes a support ring (101), and a number of support legs (102) are evenly arranged on the side of the support ring (101). The cylinder body (2) is fixedly installed on the inner wall of the support ring (101), and a switch door (201) is opened on the surface of the cylinder body (2). It is characterized in that: A number of partition plates (3) are evenly arranged on the inner wall of the cylinder body (2). The partition plates (3) divide the inner wall of the cylinder body (2) into a heat dissipation box (4), a cleaning box (5) and a drying box (6). A rotating device (7) is fixedly installed at the axial center position of the inner wall of the cylinder body (2), and a number of limiting devices (8) are fixedly installed above the inner wall of the cylinder body (2). A filtering device (9) is fixedly installed above the cylinder body (2).

2. The baking device for a wafer bonding apparatus according to claim 1, wherein: A heat dissipation filter plate (402) is fixedly installed below the heat dissipation box (4). A heat dissipation gear (401) is movably clamped below the heat dissipation filter plate (402), and a heat dissipation blade (403) is fixedly installed above the heat dissipation gear (401).

3. A baking device for a wafer bonding apparatus according to claim 2, characterized in that: A cleaning motor (501) is fixedly installed below the cleaning box (5). A cleaning gear (502) is adapted to the output end of the cleaning motor (501). A cleaning shaft (503) is fixedly installed above the cleaning gear (502). Cleaning blades (504) are fixedly installed on the surface of the cleaning shaft (503). A cleaning belt (505) is adapted to the surface of the cleaning gear (502), and the other end of the cleaning belt (505) is adapted to be connected with the heat dissipation gear (401).

4. A baking device for a wafer bonding apparatus according to claim 1, wherein: A dryer (601) is fixedly installed below the drying box (6), and a drying plate (602) is fixedly installed above the drying box (6). Drying grooves (603) are opened on the surface of the drying plate (602).

5. A baking device for a wafer bonding apparatus according to claim 1, characterized in that: The rotating device (7) includes a positioning rod (701) fixedly installed at the axial center position of the inner wall of the cylinder body (2). A rotating shaft (702) is movably arranged above the positioning rod (701). A rotating motor (709) is fixedly installed above the rotating shaft (702), and the rotating motor (709) is fixedly installed above the cylinder body (2). A number of lifting slide rails (703) are evenly arranged on the side of the rotating shaft (702). A lifting damping rod (704) is fixedly installed above the lifting slide rails (703). One end of the lower part of the lifting damping rod (704) is fixedly installed with a lifting slide plate (705). The lifting slide plate (705) is movably and adaptively installed in the lifting slide rails (703). A lifting connecting rod (706) is fixedly installed on one side of the lifting slide plate (705). A placing ring (707) is fixedly installed on one side of the lower part of the lifting connecting rod (706). Openings (708) are opened on the side of the placing ring (707).

6. The baking device for a wafer bonding apparatus according to claim 1, wherein: The limiting device (8) includes a limiting telescopic rod (801) fixedly installed above the inner wall of the cylinder body (2). A limiting plate (802) is fixedly installed below the limiting telescopic rod (801), and a number of holes (803) are opened on the surface of the limiting plate (802).

7. A baking device for a wafer bonding apparatus according to claim 1, wherein: The filtering device (9) includes a filtering cylinder (903) fixedly installed above the cylinder body (2). A plurality of filter plates (901) are evenly arranged on the inner wall of the filtering cylinder (903), and an air outlet hole (902) is formed on the upper surface of the filtering cylinder (903).

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