Cap device for chip packaging

Abstract

The invention relates to the technical field of chip packaging, in particular to a cap device for chip packaging, and the cap device comprises a grabbing mechanism which is used for grabbing a chip base, a chip body and a chip upper cover in sequence; the clamping mechanism is used for clamping the chip base; the positioning mechanism is arranged in the clamping mechanism and is used for positioning the chip body and the chip upper cover; the turnover mechanism is used for driving the clamping mechanism to turn over; and the guide mechanism is used for positioning the moving direction of the grabbing mechanism, so that the chip body and the chip upper cover are sequentially aligned with the position of the chip base. Through cooperation of the grabbing mechanism, the clamping mechanism and the guiding mechanism, accurate positioning of the chip base, the chip body and the chip upper cover is achieved, the packaging accuracy and the packaging efficiency are effectively improved, the mode of mechanical positioning, intelligent grabbing and round triggering is adopted in the whole, stability and accuracy in the packaging process are guaranteed, and the packaging efficiency is improved. And good process connection can be realized, and the complexity of manual operation and the packaging cost are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to a capping device for chip packaging. Background Art

[0002] In the semiconductor chip packaging process, the capping process is a key link to protect the chip from environmental erosion and improve the reliability of the device. Traditional capping devices mostly adopt a single-station pneumatic pressing structure, and pick up metal / ceramic caps through a vacuum suction nozzle and then perform alignment and pressing with the chip base.

[0003] The Chinese invention patent with the publication number of "CN112335882A" discloses a capping device for chip packaging. The bottom plate feeding device is installed on the frame to sequentially convey the bottom plates to the bottom plate packaging station, and the top plate feeding device is installed on the frame to sequentially convey the top plates to the top plate loading station. The clamping and moving device includes a support, on which a slider is slidably installed. The slider is driven by a sliding power device to reciprocate between the bottom plate packaging station and the top plate loading station. An elevating seat driven by an elevating power device is installed on the slider in an elevating manner, and a flipping power mechanism is installed on the elevating seat. The fixture is fixed on the flipping component of the flipping power mechanism; a plurality of carrier plates for placing chip bases are installed on the bottom plate; a plurality of chip upper cover placement grooves are provided on the top plate, and a negative pressure fixing structure is also provided on the top plate. This matching device can accurately clamp the top plate, flip it and place it on the bottom plate, so that the chip upper cover can accurately cover the chip base, improving the capping efficiency.

[0004] Although the above-mentioned invention patent solves the problem of precise positioning in the flipping and clamping of the chip, in the overall chip packaging process, in addition to the welding and packaging of the upper cover and the base, the adhesion between the base and the chip body also requires precise positioning. In addition, traditional chip packaging capping devices rely on manual experience, have relatively high requirements for the capabilities of operators, and the connection between each device is not strong, resulting in low packaging efficiency. And existing intelligent control chip packaging capping devices rely too much on intelligent control for positioning and process connection. They not only require a relatively high level of artificial intelligence, but also intelligent control depends on data collection and processing, and the process connection is not tight enough, resulting in low packaging efficiency and high packaging costs. Summary of the Invention

[0005] Based on this, in view of the above problems, it is necessary to propose a capping device for chip packaging.

[0006] The present invention is realized through the following technical solutions: A capping device for chip packaging includes: A grasping mechanism for sequentially grasping a chip base, a chip body, and a chip upper cover; A clamping mechanism for clamping the chip base; A positioning mechanism, which is arranged inside the clamping mechanism and is used for positioning the chip body and the chip upper cover; A flipping mechanism, which is arranged between the grasping mechanism and the clamping mechanism and is used for driving the clamping mechanism to flip; A guiding mechanism, which is used for positioning the moving direction of the grasping mechanism so that the chip body and the chip upper cover are aligned with the chip base in sequence; A conveying module, which is used for conveying the chip body, the chip base and the chip upper cover to the grasping mechanism.

[0007] The above-mentioned capping device for chip packaging realizes the precise positioning of the chip base, the chip body and the chip upper cover through the cooperation of the grasping mechanism, the clamping mechanism and the guiding mechanism, effectively improves the packaging accuracy and packaging efficiency, and adopts the overall mechanical positioning, intelligent grasping and round-by-round triggering method, which not only ensures the stability and precision during the packaging process, but also realizes good process connection, reduces the complexity of manual operation and the packaging cost.

[0008] Further, the grasping mechanism includes a robotic arm, a bottom plate, a torsion spring and a plurality of suction cups; the robotic arm is rotatably connected to the bottom plate; the torsion spring is fixedly connected between the bottom plate and the robotic arm; a plurality of the suction cups are arrayedly installed on the bottom plate.

[0009] Further, the clamping mechanism includes a base, a clamping groove and a locking component; a plurality of the clamping grooves are arranged on the base; the locking component is installed on the clamping groove; a locking groove matching with the locking component is arranged on the chip base; the locking component is used for limiting the chip base.

[0010] Further, the locking component includes a locking tongue, a ratchet wheel and a regulator; the locking tongue is installed on the clamping groove, the ratchet wheel is installed on the base; the regulator is installed on the ratchet wheel and is used for adjusting the position of the locking tongue.

[0011] Further, the positioning mechanism includes a first positioning plate and a second positioning plate; the first positioning plate and the second positioning plate are sequentially slidably connected in the clamping groove and are respectively used for positioning and limiting the chip body and the chip upper cover.

[0012] Further, the flipping mechanism includes a trigger, a motor and a gear set; the motor is installed on the base; the gear set is installed on the base and is used for transmitting the power output by the motor to the clamping groove; the trigger is installed on the base.

[0013] Further, the regulator includes a rack, a slider, a spring, a notched circular plate, a sector plate, a first tooth, and a second tooth; one end of the rack is slidably connected to the bottom plate; the other end is fixedly connected to the slider; a chute for slidably connecting the slider is formed on the base; the spring is fixedly connected between the rack and the bottom plate; when the rack moves downward along the chute to the upper limit position, it meshes with the ratchet; the notched circular plate is coaxially and fixedly connected to the ratchet; the sector plate, the first tooth, and the second tooth are respectively fixedly connected to the notched circular plate; the notched circular plate is used to limit the tongue, and when the notch of the notched circular plate faces the tongue, the tongue pops out toward the outside of the clamping groove; the sector plate is used to drive a trigger to start the motor; the first tooth is used to drive the first positioning plate to move into the clamping groove; the second tooth is used to drive the second positioning plate to move into the clamping groove.

[0014] Further, the guiding mechanism includes a guiding block and a first guiding groove; the guiding block is installed on the bottom plate; the first guiding groove is fixedly connected to the base, and the guiding block and the first guiding groove are opposite in position.

[0015] Further, it further includes a glue injection module, a bonding module, a welding module, and a trigger switch; the glue injection module is used to inject glue into the chip base so that the chip body is glued to the chip base; the bonding module is used to bond the chip body; the welding module is used to weld the chip upper cover and the chip base into one body; the regulator drives the trigger switch to be in different switch states to respectively start the glue injection module, the bonding module, and the welding module to work.

[0016] Further, the conveying module includes a conveyor belt assembly, a carrier plate, and a locator; a plurality of the carrier plates are arranged on the conveyor belt assembly; the carrier plate is used to place the chip base, the chip body, and the chip upper cover; the locator is installed on the conveyor belt assembly. A second guiding groove matching the guiding block is formed on the carrier plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects: Through the cooperation of the grasping mechanism, the clamping mechanism, and the guiding mechanism, the present invention realizes the precise positioning of the chip base, the chip body, and the chip upper cover, effectively improving the precision and efficiency of packaging. Through the auxiliary positioning of the positioning mechanism for the chip body and the chip upper cover, the stability of the chip during the gluing, bonding, and welding processes is maintained, preventing deviations in the packaging process. The overall adoption of mechanical positioning, intelligent grasping, and sequential triggering methods not only ensures the stability and precision during the packaging process but also enables good process connection, reducing the complexity of manual operation. Description of the Drawings

[0018] Figure 1 Schematic three-dimensional structure diagram of a capping device for chip packaging in Embodiment 1 of the present invention; Figure 2 is Figure 1 front view structure diagram of a capping device for chip packaging in; Figure 3 is Figure 2 cross-sectional structure diagram along the A-A direction in; Figure 4 is Figure 1 top view structure diagram of the clamping mechanism in; Figure 5 is Figure 4 cross-sectional structure diagram along the B-B direction in; Figure 6 is Figure 5 enlarged structure diagram of the C position in; Figure 7 is Figure 1 partial three-dimensional structure diagram of the clamping groove and the locking component in; Figure 8 is Figure 1 partial three-dimensional structure diagram of the regulator in; Figure 9 is Figure 1 top view structure diagram of the conveying module in.

[0019] In the figure: 1, grasping mechanism; 11, robotic arm; 12, bottom plate; 13, torsion spring; 14, suction cup; 2, clamping mechanism; 21, base; 22, clamping groove; 23, locking component; 231, locking tongue; 232, ratchet wheel; 233, regulator; 2331, notched circular plate; 2332, sector plate; 2333, first tooth; 2334, second tooth; 2335, rack; 2336, slider; 2337, spring; 3, positioning mechanism; 31, first positioning plate; 32, second positioning plate; 4, flipping mechanism; 41, trigger; 42, motor; 5, guiding mechanism; 51, guiding block; 52, first guiding groove; 7, conveying module; 71, conveyor belt assembly; 72, carrier plate; 73, locator; 74, second guiding groove. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] It should be noted that when a component is referred to as "installed on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "set on" another component, it can be directly set on the other component or there may be an intermediate component at the same time. When a component is considered to be "fixed to" another component, it can be directly fixed to the other component or there may be an intermediate component at the same time.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used in the description of this invention herein are for the purpose of describing specific embodiments only and are not intended to limit the invention. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0023] Example 1: Please refer to Figures 1-8 , this example provides a capping device for chip packaging, including: a grasping mechanism 1, a clamping mechanism 2, a positioning mechanism 3, a flipping mechanism 4, a guiding mechanism 5, and a conveying module 7.

[0024] The grasping mechanism 1 is used to sequentially grasp the chip base, the chip body, and the chip upper cover, move the chip base into the clamping mechanism 2, and then sequentially place the chip body and the chip upper cover on the chip base, and cooperate with the bonding module, the glue application module, and the welding module to realize the chip packaging capping process.

[0025] In this example, the grasping mechanism 1 includes a robotic arm 11, a bottom plate 12, a torsion spring 13, and a plurality of suction cups 14. The robotic arm 11 is rotatably connected to the bottom plate 12 and is used to move the bottom plate 12 above the clamping mechanism 2. The torsion spring 13 is fixedly connected between the bottom plate 12 and the robotic arm 11 and is used to reset the bottom plate 12 so that the grasping mechanism 1 can accurately grasp the chip base, the chip body, or the chip upper cover each time. A plurality of suction cups 14 are array-mounted on the bottom plate 12, and the suction cups 14 generate negative pressure to suck objects to achieve reliable grasping.

[0026] Specifically, the robotic arm 11 can be a five-axis robotic arm 11 or a six-axis robotic arm 11, etc., which can achieve multi-angle position adjustment within the working space to adapt to the working environment and achieve precise and reliable grasping actions. In this embodiment, the bottom plate 12 is a square metal plate, which not only has a stable structure and can reliably support and drive the suction cup 14, but also matches the conveying module 7 to achieve precise grasping of multiple items at one time. The suction cups 14 are set to 16, and a negative pressure vacuum pump and a gas distributor are respectively connected to the 16 suction cups 14 to achieve reliable grasping of the suction cups 14. The suction cups 14 are evenly distributed on the bottom plate 12 in a 4×4 pattern, keeping consistent with the spacing and quantity of the items conveyed by the conveying module 7. Of course, in other embodiments, the robotic arm 11 can also be of other types or replaced with other grasping devices, the structural shape of the bottom plate 12 can also be replaced with a circular or other shape, and the number of suction cups 14 can be more or less, as long as it can be adapted to the conveying module 7.

[0027] The clamping mechanism 2 is used to clamp the chip base. The clamping mechanism 2 includes a base 21, a clamping groove 22, and a locking component 23. A plurality of clamping grooves 22 are provided on the base 21. The number and position of the clamping grooves 22 correspond to those of the suction cups 14. In this embodiment, the number of the clamping grooves 22 is also set to 16, so that the 16 items sucked by the suction cups 14 can be just placed into the 16 clamping grooves 22 respectively. The locking component 23 is installed on the clamping groove 22, and a locking groove matching the locking component 23 is provided on the chip base. The locking component 23 is used to limit the chip base. The chip base is moved into the clamping groove 22 by the grasping mechanism 1, and the locking component 23 is snapped into the locking groove to achieve clamping and fixing of the chip base.

[0028] In this embodiment, the locking component 23 includes a locking tongue 231, a ratchet wheel 232, and a regulator 233. The locking tongue 231 is installed on the clamping groove 22, and the locking tongue 231 is an elastic locking tongue 231. During the process of the chip base moving into the clamping groove 22, the elastic locking tongue 231 can be driven to deform, and through the reset elastic force of the elastic locking tongue 231, the elastic locking tongue 231 can be just snapped into the locking groove on the chip base to achieve locking of the chip base. The ratchet wheel 232 is installed on the base 21. The regulator 233 is installed on the ratchet wheel 232 and is used to adjust the position of the locking tongue 231. After the encapsulation capping operation is completed, the regulator 233 is synchronously rotated by driving the ratchet wheel 232 to rotate, and then the locking tongue 231 is moved towards the outside of the clamping groove 22, so that the elastic locking tongue 231 is away from the chip base, releasing the clamping and fixing of the chip base, and enabling the encapsulated chip to be removed from the clamping groove 22.

[0029] The regulator 233 includes a rack 2335, a slider 2336, a spring 2337, a notched circular plate 2331, a sector plate 2332, a first tooth 2333, and a second tooth 2334. One end of the rack 2335 is slidably connected to the bottom plate 12. The other end is fixedly connected to the slider 2336. A chute for slidably connecting with the slider 2336 is formed on the base 21. The spring 2337 is fixedly connected between the rack 2335 and the bottom plate 12. When the rack 2335 moves downward along the chute to the upper limit position, it meshes with the ratchet 232. The notched circular plate 2331 is coaxially and fixedly connected to the ratchet 232. The sector plate 2332, the first tooth 2333, and the second tooth 2334 are respectively fixedly connected to the notched circular plate 2331. The notched circular plate 2331 is used to limit the tongue 231, and when the notch of the notched circular plate 2331 faces the tongue 231, the tongue 231 pops out towards the outside of the clamping groove 22. The sector plate 2332 is used to drive the trigger 41 to start the motor 42. The first tooth 2333 is used to drive the first positioning plate 31 to move into the clamping groove 22. The second tooth 2334 is used to drive the second positioning plate 32 to move into the clamping groove 22.

[0030] In this embodiment, there is about 1 / 5 notch on the notched circular plate 2331. Assume that the notched circular plate 2331 is evenly divided into 5 pieces by angle from the center of the circle, then the notch, the first tooth 2333, the second tooth 2334, and the sector plate 2332 are respectively arranged at the 1 / 5, 3 / 5, 4 / 5, and 5 / 5 positions of the notched circular plate 2331.

[0031] The positioning mechanism 3 is arranged in the clamping mechanism 2 and is used to position the chip body and the chip upper cover. Although the grasping mechanism 1 can accurately grasp items and, with the cooperation of the conveying module 7, make the positions and directions of the grasped chip base, chip body, and chip upper cover basically the same, there are still relatively large errors for the accuracy requirements of chip packaging. After the clamping mechanism 2 clamps and positions the chip base, the positioning mechanism 3 is used to respectively position the chip body and the chip upper cover to meet the accuracy requirements of the chip packaging capping process and accurately install the chip body and the chip upper cover onto the chip base.

[0032] Specifically, the positioning mechanism 3 includes a first positioning plate 31 and a second positioning plate 32. The first positioning plate 31 and the second positioning plate 32 are sequentially slidably connected in the clamping groove 22 and are respectively used to position and limit the chip body and the chip upper cover. When the grasping mechanism 1 drives the chip body into the clamping groove 22, by triggering the regulator 233, the first positioning plate 31 is driven to move towards the inner side direction of the clamping groove 22 to the minimum limit point to achieve precise positioning of the chip body. Similarly, when the grasping mechanism 1 moves the chip upper cover into the clamping groove 22, by triggering the regulator 233, the second positioning plate 32 is driven to move towards the inner side direction of the clamping groove 22 to the minimum limit point to achieve precise positioning of the chip upper cover.

[0033] In this embodiment, both the first positioning plate 31 and the second positioning plate 32 adopt single-sided positioning, that is, on one side of the clamping groove 22, the shape of the side wall of the clamping groove 22 is designed according to the shape and size of the chip body and the chip upper cover. On the other side of the clamping groove 22, the first positioning plate 31 and the second positioning plate 32 are slidably installed, and the first positioning plate 31 and the second positioning plate 32 are elastically connected. After positioning is completed, they automatically return to their original positions, facilitating the removal of the chip body. In other embodiments, the first positioning plate 31 and the second positioning plate 32 can also adopt double-sided positioning, that is, both the first positioning plate 31 and the second positioning plate 32 include two sliding plates, and the two sliding plates are connected to each other by an "X"-shaped telescopic bracket, so that the two sliding plates can move relatively synchronously, thereby realizing precise positioning of the chip body and the chip upper cover under the action of the regulator 233. When double-sided positioning is adopted, the chip is easier to remove after the encapsulation capping operation, but this structure is more complex and not conducive to long-term operation.

[0034] The flipping mechanism 4 is arranged between the grasping mechanism 1 and the clamping mechanism 2 and is used to drive the clamping mechanism 2 to flip. By driving the clamping mechanism 2 to flip, the clamped chip base, chip body, and chip upper cover are flipped to cooperate with the welding process in chip encapsulation. By setting the flipping mechanism 4, rapid welding of the chip upper cover is achieved.

[0035] The flipping mechanism 4 includes a trigger 41, a motor 42, and a gear set. The motor 42 is installed on the base 21. The gear set is installed on the base 21 and is used to transmit the power output by the motor 42 to the clamping groove 22. The trigger 41 is installed on the base 21. When the regulator 233 contacts the trigger 41, the motor 42 is started. After the chip upper cover is moved to the clamping groove 22, after a short delay, the motor 42 is started to drive the gear set to drive the entire clamping groove 22 to flip. According to the difference in chip specifications, the clamping groove 22 can be set to flip in the horizontal direction or the vertical direction. When the horizontal direction rotation is selected, the welding module can perform continuous welding, minimizing the welding marks as much as possible and making the encapsulated chip more beautiful. When the vertical direction flip is selected, the welding module welds on both sides of the chip respectively. In this embodiment, the gear set can include a gear and an incomplete gear. The motor 42 is fixedly connected to the incomplete gear. The gear is installed at one end of the clamping groove 22, and the incomplete gear meshes with the gear. After the motor 42 drives the incomplete gear to rotate one week, the driving gear rotates 180°, realizing the flipping of the clamping groove 22, and further synchronously flipping each encapsulated chip base.

[0036] The guiding mechanism 5 is used to position the moving direction of the grasping mechanism 1 so that the chip body and the chip upper cover are aligned with the chip base in sequence. The guiding mechanism 5 includes a guiding block 51 and a first guiding groove 52. The guiding block 51 is installed on the bottom plate 12. The first guiding groove 52 is fixedly connected to the base 21, and the guiding block 51 is opposite to the first guiding groove 52 in position. When the grasping mechanism 1 moves towards the clamping mechanism 2, the guiding block 51 moves along the first guiding groove 52, so that the bottom plate 12 coincides with the base 21, and the items grasped by each suction cup 14 just move into the corresponding clamping groove 22.

[0037] The glue application module is used to apply glue to the chip base so that the chip body is glued to the chip base. The bonding module is used to bond the chip body. The welding module is used to weld the chip upper cover and the chip base into one body. The regulator 233 drives the trigger switch to be in different switch states to start the glue application module, the bonding module and the welding module to work respectively. The trigger switch includes an induction switch located in the clamping groove 22 and a multi-position switch installed on the base 21. The induction switch is inductively closed after the chip base is completely installed in the clamp. The multi-position switch and the induction switch jointly control the start of the glue application module, the bonding module and the welding module. To meet the requirements of the packaging process, the glue application module, the bonding module and the welding module are respectively provided with corresponding delay devices and timers to improve the packaging quality. For example, the multi-position switch is provided with a first closing point, a second closing point and a third closing point. When the induction switch and the first closing point are closed simultaneously, the glue application module is started. The glue application module can be started with a delay of 0.5 seconds to avoid the chip base not being completely clamped in place. At the same time, the timer counts the glue application duration. After the preset duration is met, the glue application module is turned off and reset. When the induction switch and the second closing point are closed simultaneously, the bonding module is started. The bonding module can be started with a delay of [missing value] seconds to enable the chip body and the chip base to be completely glued. When the induction switch and the third closing point are closed simultaneously, the welding module is started. The welding module can also be started with a delay of 0.5 seconds to enable the chip upper cover to be completely positioned, so as to achieve precise welding. The timer can be electrically connected to the grasping mechanism 1. After the corresponding process is completed, the grasping mechanism 1 is triggered to start the next process. When the induction switch and the multi-position switch are closed simultaneously, in the chip packaging process, after the clamping mechanism 2 clamps the chip base, the glue application module is started to apply glue to the chip base. Subsequently, the grasping mechanism 1 places and presses the chip body on the chip base, and at the same time triggers the first positioning plate 31 to accurately position the chip body. After the glue solidifies, the chip body and the chip base are glued into one body, and at the same time the bonding module is triggered to bond the chip body. Then the grasping mechanism 1 moves the chip upper cover into the clamping groove 22, triggers the second positioning plate 32 to position the chip upper cover, and at the same time triggers the start of the welding module to perform welding to weld the chip base and the chip upper cover into one body.

[0038] The conveying module 7 is used to convey the chip body, the chip base and the chip upper cover to the grasping mechanism 1.

[0039] The conveying module 7 includes a conveyor belt assembly 71, a load-carrying plate 72, and a positioner 73. A plurality of load-carrying plates 72 are arranged on the conveyor belt assembly 71. The load-carrying plate 72 is used to place the chip base, the chip body, and the chip upper cover. The positioner 73 is installed on the conveyor belt assembly 71 and is used to limit the position of the load-carrying plate 72 so that when the gripping mechanism 1 grabs downward, it is just directly above the load-carrying plate 72. A second guiding groove 74 matching the guiding block 51 is formed on the load-carrying plate 72. When the gripping mechanism 1 grabs the chip base or the chip body and the chip upper cover located on the load-carrying plate 72, through the cooperation of the guiding block 51 and the second guiding groove 74, the bottom plate 12 is just opposite to the position of the load-carrying plate 72.

[0040] In this embodiment, the conveyor belt assembly 71 includes a bracket, a second motor, at least two rollers, and a conveyor belt. The motor 42 is installed on the bracket and is used to drive one of the rollers to rotate. The conveyor belt is arranged outside the rollers to form a belt drive. The shape and size of the load-carrying plate 72 match those of the bottom plate 12, and 16 placement grooves are also provided for placing the chip base, the chip body, and the chip upper cover. A plurality of load-carrying plates 72 are arranged on the conveyor belt, and the load-carrying plates 72 are successively filled with the chip base, the chip body, and the chip upper cover. After the load-carrying plate 72 moves to a preset position, the load-carrying plate 72 is positioned through the positioner 73 and the second guiding groove 74, so that the gripping mechanism 1 can accurately grab all the items on each load-carrying plate 72. In other embodiments, three or more conveying modules 7 can be provided. Among them, three conveying modules 7 are respectively used to convey the chip base, the chip body, and the chip upper cover. The gripping mechanism 1 sequentially grabs items from the three conveying modules 7, and the other conveying modules 7 can be used to convey other materials required for packaging, such as welding wires, bonding wires, etc.

[0041] The specific working principle of the capping device in this embodiment is as follows: First, the conveying module 7 conveys the chip base, the chip body, and the chip top cover in a preset order. When the carrier plate 72 containing the chip base moves to the preset position, the positioner 73 positions the carrier plate 72 so that the direction and position of the carrier plate 72 both meet the preset direction of the grasping mechanism 1, enabling all the suction cups 14 of each grasping mechanism 1 to precisely grasp one chip base. The grasping mechanism 1 moves each chip base directly above the clamping mechanism 2, and the guiding mechanism 5 positions the bottom plate 12 of the grasping mechanism 1 so that the bottom plate 12 is opposite to the base 21 of the clamping mechanism 2, thereby enabling each chip base to be accurately conveyed into the corresponding clamping groove 22. After the chip base enters the clamping groove 22, the locking tongues 231 on both sides are driven outward. Since the base 21 of the clamping groove 22 is provided with an installation groove that fits the chip base, when the chip base completely enters the installation groove, the locking tongues 231 automatically snap into the locking grooves of the chip base, fixing the chip base in the clamping groove 22. Meanwhile, the rack 2335 in the regulator 233 moves with the grasping mechanism 1, driving the ratchet to rotate downward by 1 / 5 of a turn, that is, °, and the notch of the notched circular plate 2331 rotates away from the direction facing the locking tongue 231, forming a lock on the position of the locking tongue 231 to prevent the locking tongue 231 from falling off and causing the chip base to shift in position. After the chip base completely enters the clamping groove 22, the inductive switch closes, and the first closing point of the multi-position switch closes, starting the glue application module to apply glue to the chip base. After the glue application is completed, the grasping mechanism 1 continues to grasp the chip body and places the chip body into the corresponding clamping groove 22. After the chip body enters the clamping groove 22, the grasping mechanism 1 maintains a pressing state to make the chip body fully adhere to the chip base until the glue solidifies. During this process, the rack 2335 in the regulator 233 moves with the grasping mechanism 1, continuing to drive the ratchet to rotate downward by 1 / 5 of a turn, and the first tooth 2333 drives the first positioning plate 31 to position the chip body. The second closing point of the multi-position switch closes, starting the bonding module to bond the chip body. After the bonding is completed, the grasping mechanism 1 continues to grasp the chip top cover and places the top cover into the corresponding clamping groove 22. During this process, the rack 2335 in the regulator 233 moves with the grasping mechanism 1, continuing to drive the ratchet to rotate downward by 1 / 5 of a turn, and the second tooth 2334 drives the second positioning plate 32 to position the chip top cover. The third closing point of the multi-position switch closes, starting the welding device to perform welding. After one side of the welding is completed, the grasping mechanism 1 drives the rack 2335 to move downward, driving the ratchet to rotate by 1 / 5 of a turn. At this time, both the first positioning plate 31 and the second positioning plate 32 have been reset, and the sector plate 2332 drives the trigger 41 to flip the clamping groove 22. For chips with three-sided welding, the horizontally flipped clamping groove 22 is selected, and the welding module moves in cooperation to form continuous three-sided welding. For chips with two-sided welding, the vertically flipped or horizontally flipped clamping groove 22 is selected. After the flipping is completed, the other side of the chip is welded.After welding is completed, the grasping device adsorbs all the chips. At this time, the ratchet rotates until the notch of the notch circular plate 2331 faces the locking tongue 231, and the locking tongue 231 pops outwards, and the chips can be taken out from the clamping groove 22.

[0042] In summary, the capping device for chip packaging provided in this embodiment realizes the precise positioning of the chip base, the chip body, and the chip upper cover through the cooperation of the grasping mechanism 1, the clamping mechanism 2, and the guiding mechanism 5, effectively improving the packaging accuracy and packaging efficiency. Through the auxiliary positioning of the chip body and the chip upper cover by the positioning mechanism 3, the stability of the chip during gluing, bonding, and welding is maintained, preventing deviation in the packaging process. The overall use of mechanical positioning, intelligent grasping, and sequential triggering not only ensures the stability and precision during packaging but also enables good process connection, reducing the complexity of manual operation.

[0043] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0044] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A capping device for chip packaging, characterized in that, Comprising: A grasping mechanism (1) for sequentially grasping a chip base, a chip body, and a chip top cover; A clamping mechanism (2) for clamping the chip base; A positioning mechanism (3) disposed within the clamping mechanism (2) for positioning the chip body and the chip top cover; A flipping mechanism (4) disposed between the grasping mechanism (1) and the clamping mechanism (2) for driving the clamping mechanism (2) to flip; A guiding mechanism (5) for positioning the moving direction of the grasping mechanism (1) so that the chip body and the chip top cover are sequentially aligned with the position of the chip base; A conveying module for conveying the chip body, the chip base, and the chip top cover to the grasping mechanism (1).

2. The capping device for chip packaging according to claim 1, wherein, The grasping mechanism (1) includes a robotic arm (11), a base plate (12), a torsion spring (13), and a plurality of suction cups (14); the robotic arm (11) is rotatably connected to the base plate (12); the torsion spring (13) is fixedly connected between the base plate (12) and the robotic arm (11); a plurality of the suction cups (14) are arrayedly mounted on the base plate (12).

3. The capping device for chip packaging according to claim 2, wherein, The clamping mechanism (2) includes a base (21), a clamping groove (22), and a locking component (23); a plurality of the clamping grooves (22) are provided on the base (21); the locking component (23) is mounted on the clamping groove (22); a locking groove matching the locking component (23) is provided on the chip base; the locking component (23) is used for limiting the chip base.

4. The capping device for chip packaging according to claim 3, characterized in that, The locking component (23) includes a locking tongue (231), a ratchet wheel (232), and a regulator (233); the locking tongue (231) is mounted on the clamping groove (22), the ratchet wheel (232) is mounted on the base (21); the regulator (233) is mounted on the ratchet wheel (232) for adjusting the position of the locking tongue (231).

5. The capping device for chip packaging according to claim 4, wherein, The positioning mechanism (3) includes a first positioning plate (31) and a second positioning plate (32); the first positioning plate (31) and the second positioning plate (32) are sequentially slidably connected within the clamping groove (22) for respectively positioning and limiting the chip body and the chip top cover.

6. The capping device for chip packaging according to claim 5, wherein, The flipping mechanism (4) includes a trigger (41), a motor (42), and a gear set; The motor (42) is mounted on the base (21); the gear set is mounted on the base (21) for transmitting the power output by the motor (42) to the clamping groove (22); the trigger (41) is mounted on the base (21).

7. The capping device for chip packaging according to claim 6, characterized in that, The regulator (233) includes a rack (2335), a slider (2336), a spring (2337), a notched circular plate (2331), a sector plate (2332), a first tooth (2333), and a second tooth (2334); one end of the rack (2335) is slidably connected to the bottom plate (12); the other end is fixedly connected to the slider (2336); a chute for slidably connecting with the slider (2336) is provided on the base (21); the spring (2337) is fixedly connected between the rack (2335) and the bottom plate (12); when the rack (2335) moves down along the chute to the upper limit position, it meshes with the ratchet wheel (232); the notched circular plate (2331) is coaxially and fixedly connected with the ratchet wheel (232); the sector plate (2332), the first tooth (2333), and the second tooth (2334) are respectively fixedly connected to the notched circular plate (2331); the notched circular plate (2331) is used to limit the tongue (231), and when the notch of the notched circular plate (2331) faces the tongue (231), the tongue (231) pops out towards the outside of the clamping groove (22); the sector plate (2332) is used to drive the trigger (41) to start the motor (42); the first tooth (2333) is used to drive the first positioning plate (31) to move into the clamping groove (22); the second tooth (2334) is used to drive the second positioning plate (32) to move into the clamping groove (22).

8. The capping device for chip packaging according to claim 2, wherein, The guiding mechanism (5) includes a guiding block (51) and a first guiding groove (52); the guiding block (51) is installed on the bottom plate (12); the first guiding groove (52) is fixedly connected to the base (21), and the guiding block (51) and the first guiding groove (52) are in opposite positions.

9. The capping device for chip packaging according to claim 4, wherein It further includes a glue application module, a bonding module, a welding module, and a trigger switch; the glue application module is used to apply glue to the chip base so that the chip body is glued to the chip base; the bonding module is used to bond the chip body; the welding module is used to weld the chip upper cover and the chip base into one body; the regulator (233) drives the trigger switch to be in different switch states to respectively start the glue application module, the bonding module, and the welding module to work.

10. The capping device for chip packaging according to claim 8, characterized in that, The conveying module (7) includes a conveyor belt assembly (71), a carrier plate (72), and a locator (73); a plurality of the carrier plates (72) are arranged on the conveyor belt assembly (71); the carrier plate (72) is used to place the chip base, the chip body, and the chip upper cover; the locator (73) is installed on the conveyor belt assembly (71); a second guiding groove (74) matching the guiding block (51) is provided on the carrier plate (72).

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