Capping device for chip packaging

Abstract

The present invention relates to the field of chip packaging technology, specifically a capping device for chip packaging, comprising: a gripping mechanism for sequentially gripping a chip base, a chip body, and a chip cover; a clamping mechanism for clamping the chip base; a positioning mechanism disposed within the clamping mechanism for positioning the chip body and the chip cover; a flipping mechanism for driving the clamping mechanism to flip; and a guiding mechanism for positioning the moving direction of the gripping mechanism so that the chip body and the chip cover are aligned with the chip base in sequence. The present invention achieves precise positioning of the chip base, the chip body, and the chip cover through the cooperation of the gripping mechanism with the clamping mechanism and the guiding mechanism, effectively improving the accuracy and efficiency of packaging. The overall method adopts mechanical positioning, intelligent gripping, and round-by-round triggering, which not only ensures stability and accuracy during the packaging process, but also achieves good process connection, reducing the complexity of manual operation and packaging costs.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a capping device for chip packaging. Background Art

[0002] In the semiconductor chip packaging process, capping is a critical step in protecting the chip from environmental corrosion and improving device reliability. Traditional capping devices often use a single-station pneumatic pressing mechanism, where a vacuum nozzle picks up the metal or ceramic cap and presses it into place on the chip base.

[0003] The Chinese invention patent with publication number "CN112335882A" discloses a capping device for chip packaging, wherein the bottom plate feeding device is installed on the frame for conveying the bottom plates to the bottom plate packaging station one by one, and the top plate feeding device is installed on the frame for conveying the top plates to the top plate loading station one by one, the clamping and moving device includes a support, a slider is slidably installed on the support, and the slider is driven by a sliding power device to reciprocate between the bottom plate packaging station and the top plate loading station, a lifting seat driven by a lifting power device is installed on the slider, a flipping power mechanism is installed on the lifting seat, and the clamp is fixed on the flipping component of the flipping power mechanism; a plurality of carrier plates for placing the chip base are installed on the bottom plate; a plurality of chip cover placement grooves are provided on the top plate, and a negative pressure fixing structure is also provided on the top plate. The matching device can accurately clamp the top plate and flip it and place it on the bottom plate, so that the chip cover is accurately covered on the chip base, thereby improving the capping efficiency.

[0004] Although the above invention patent solves the problem of precise positioning of the chip during flipping and clamping, in the overall chip packaging process, in addition to the welding packaging of the upper cover and the base, the bonding of the base and the chip body also requires precise positioning. In addition, the traditional chip packaging capping device relies on manual experience, which requires relatively high operator skills, and the connectivity between the various devices is not strong, resulting in low packaging efficiency. The existing intelligent control chip packaging capping device relies too much on intelligent control for positioning and process connection, which not only requires a high level of artificial intelligence, but also the intelligent control relies on data collection and processing. The process connection is not tight enough, resulting in low packaging efficiency and high packaging cost. Summary of the Invention

[0005] Based on this, it is necessary to propose a capping device for chip packaging to address the above problems.

[0006] The present invention is implemented through the following technical solution: A capping device for chip packaging includes:

[0007] A gripping mechanism, used to sequentially grip the chip base, the chip body, and the chip cover;

[0008] A clamping mechanism, used for clamping the chip base;

[0009] A positioning mechanism, disposed in the clamping mechanism, for positioning the chip body and the chip cover;

[0010] a turning mechanism, disposed between the grabbing mechanism and the clamping mechanism, and configured to drive the clamping mechanism to turn;

[0011] A guide mechanism, used to position the moving direction of the grasping mechanism so that the chip body and the chip cover are aligned with the chip base in sequence;

[0012] The conveying module is used to convey the chip body, the chip base and the chip cover to the grasping mechanism.

[0013] The capping device for chip packaging achieves precise positioning of the chip base, chip body and chip cover through the cooperation of the grasping mechanism, clamping mechanism and guiding mechanism, effectively improving the accuracy and efficiency of packaging. The overall mechanical positioning, intelligent grasping and round triggering are adopted, which not only ensures the stability and accuracy of the packaging process, but also achieves good process connection, reducing the complexity of manual operation and packaging costs.

[0014] Furthermore, the grasping mechanism includes a robotic arm, a base plate, a torsion spring and a plurality of suction cups; the robotic arm is rotatably connected to the base plate; the torsion spring is fixedly connected between the base plate and the robotic arm; and a plurality of suction cups are installed in an array on the base plate.

[0015] Furthermore, the clamping mechanism includes a base, a clamping slot, and a locking assembly; a plurality of the clamping slots are provided on the base; the locking assembly is installed on the clamping slot; a locking slot matching the locking assembly is provided on the chip base; the locking assembly is used to limit the chip base.

[0016] Furthermore, the lock assembly includes a lock tongue, a ratchet, and an adjuster; the lock tongue is installed on the clamping groove, and the ratchet is installed on the base; the adjuster is installed on the ratchet and is used to adjust the position of the lock tongue.

[0017] Furthermore, the positioning mechanism includes a first positioning plate and a second positioning plate; the first positioning plate and the second positioning plate are slidably connected in the clamping groove in sequence, and are used to position and limit the chip body and the chip cover respectively.

[0018] Furthermore, the flipping mechanism includes a trigger, a motor, and a gear set; the motor is mounted on the base; the gear set is mounted on the base for transmitting the power output by the motor to the clamping groove; and the trigger is mounted on the base.

[0019] Furthermore, the adjuster includes a rack, a slider, a spring, a notched circular plate, a fan-shaped plate, a first tooth, and a second tooth; one end of the rack is slidably connected to the base plate; the other end is fixedly connected to the slider; a slide groove is provided on the base and is slidably connected to the slider; the spring is fixedly connected to the rack and the base plate; when the rack moves down along the slide groove to the upper limit position, it engages with the ratchet; the notched circular plate is coaxially fixedly connected to the ratchet; the fan-shaped plate, the first tooth, and the second tooth are respectively fixedly connected to the notched circular plate; the notched circular plate is used to limit the lock tongue, and when the notch of the notched circular plate faces the lock tongue, the lock tongue pops out to the outside of the clamping groove; the fan-shaped plate is used to drive the trigger to start the motor; the first tooth is used to drive the first positioning plate to move into the clamping groove; the second tooth is used to drive the second positioning plate to move into the clamping groove.

[0020] Furthermore, the guide mechanism includes a guide block and a guide groove 1; the guide block is mounted on the base plate; the guide groove 1 is fixedly connected to the base, and the guide block and the guide groove 1 are positioned opposite to each other.

[0021] Furthermore, it also includes a gluing module, a bonding module, a welding module and a trigger switch; the gluing module is used to apply glue to the chip base so that the chip body is glued to the chip base; the bonding module is used to bond the chip body; the welding module is used to weld the chip cover and the chip base into one; the regulator drives the trigger switch to different switch states to start the gluing module, the bonding module and the welding module respectively.

[0022] Furthermore, the conveyor module includes a conveyor belt assembly, a carrier plate, and a positioner; the conveyor belt assembly is provided with a plurality of carrier plates; the carrier plates are used to place the chip base, the chip body, and the chip cover; the positioner is mounted on the conveyor belt assembly. The carrier plates are provided with a second guide groove that matches the guide block.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The present invention achieves precise positioning of the chip base, chip body, and chip cover through the coordination of a gripping mechanism, a clamping mechanism, and a guiding mechanism, effectively improving packaging accuracy and efficiency. The positioning mechanism assists in positioning the chip body and chip cover, maintaining chip stability during gluing, bonding, and welding, and preventing deviations in the packaging process. The overall use of mechanical positioning, intelligent gripping, and round-trip triggering ensures stable and precise packaging, achieves smooth process transitions, and reduces the complexity of manual operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the three-dimensional structure of a capping device for chip packaging in Example 1 of the present invention;

[0026] Figure 2 for Figure 1 A schematic diagram of the main structure of a capping device for chip packaging;

[0027] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure along the AA direction;

[0028] Figure 4 for Figure 1 A schematic diagram of the top view of the clamping mechanism;

[0029] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure along the BB direction;

[0030] Figure 6 for Figure 5 A magnified schematic diagram of the structure at point C in the middle;

[0031] Figure 7 for Figure 1 A schematic diagram of the partial three-dimensional structure of the middle clamping groove and the locking assembly;

[0032] Figure 8 for Figure 1 Schematic diagram of the partial three-dimensional structure of the middle regulator;

[0033] Figure 9 for Figure 1 Schematic diagram of the top view of the conveying module.

[0034] In the figure: 1. Grasping mechanism; 11. Robotic arm; 12. Bottom plate; 13. Torsion spring; 14. Suction cup; 2. Clamping mechanism; 21. Base; 22. Clamping groove; 23. Locking assembly; 231. Lock tongue; 232. Ratchet; 233. Regulator; 2331. Notched circular plate; 2332. Fan-shaped plate; 2333. First tooth; 2334. Second tooth; 2335. Rack; 2336. Slider; 2337. Spring; 3. Positioning mechanism; 31. First positioning plate; 32. Second positioning plate; 4. Flipping mechanism; 41. Trigger; 42. Motor; 5. Guide mechanism; 51. Guide block; 52. Guide groove one; 7. Conveying module; 71. Conveyor belt assembly; 72. Carrying plate; 73. Positioner; 74. Guide groove two. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] It should be noted that when a component is referred to as being "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component. When a component is considered to be "fixed to" another component, it may be directly fixed to the other component or there may be a central component.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0038] Example 1: Please refer to Figures 1-8 This embodiment provides a capping device for chip packaging, including: a grasping mechanism 1, a clamping mechanism 2, a positioning mechanism 3, a flipping mechanism 4, a guiding mechanism 5, and a conveying module 7.

[0039] The grabbing mechanism 1 is used to grab the chip base, chip body and chip cover in turn, and move the chip base into the clamping mechanism 2, and then place the chip body and chip cover on the chip base in turn, and cooperate with the bonding module, gluing module and welding module to realize the chip packaging and capping process.

[0040] In this embodiment, the gripping mechanism 1 includes a robotic arm 11, a base plate 12, a torsion spring 13, and multiple suction cups 14. The robotic arm 11 is rotatably connected to the base plate 12 and is used to move the base plate 12 above the clamping mechanism 2. The torsion spring 13 is fixedly connected between the base plate 12 and the robotic arm 11 and is used to reset the base plate 12, allowing the gripping mechanism 1 to accurately grasp the chip base, chip body, or chip cover each time. Multiple suction cups 14 are arrayed on the base plate 12. The suction cups 14 generate negative pressure to absorb objects, achieving reliable gripping.

[0041] Specifically, the robotic arm 11 can be a five-axis robotic arm 11 or a six-axis robotic arm 11, capable of multi-angle position adjustment within the workspace to adapt to the working environment and achieve precise and reliable grasping. In this embodiment, the base plate 12 is a square metal plate, which not only has a stable structure and can reliably support and drive the suction cups 14, but also matches the conveying module 7 to achieve precise grasping of multiple items in a single operation. There are 16 suction cups 14, and a negative pressure vacuum pump and a gas distributor are used to connect each of the 16 suction cups 14, thereby achieving reliable grasping by the suction cups 14. The suction cups 14 are evenly spaced in a 4×4 pattern on the base plate 12, consistent with the spacing and number of items conveyed by the conveying module 7. Of course, in other embodiments, the robotic arm 11 can also be of other types or replaced with other grasping devices, the structural shape of the base plate 12 can also be replaced with a circular or other shape, and the number of suction cups 14 can be more or less, as long as it is compatible with the conveying module 7.

[0042] The clamping mechanism 2 is used to clamp the chip base. The clamping mechanism 2 includes a base 21, a clamping groove 22, and a locking assembly 23. A plurality of clamping grooves 22 are provided on the base 21. The number and position of the clamping grooves 22 correspond to the suction cup 14. In this embodiment, the number of clamping grooves 22 is also set to 16, so that the 16 objects sucked by the suction cup 14 are just placed in the 16 clamping grooves 22 respectively. The locking assembly 23 is installed on the clamping groove 22, and a locking groove matching the locking assembly 23 is provided on the chip base. The locking assembly 23 is used to limit the chip base. The chip base is moved into the clamping groove 22 by the grasping mechanism 1, and the locking assembly 23 is snapped into the locking groove to achieve clamping and fixing of the chip base.

[0043] In this embodiment, the locking assembly 23 includes a locking tongue 231, a ratchet 232, and an adjuster 233. The locking tongue 231 is installed on the clamping groove 22. The locking tongue 231 is configured as an elastic locking tongue 231. When the chip base moves into the clamping groove 22, the elastic locking tongue 231 can be driven to deform, and the elastic locking tongue 231 is reset by the elastic elastic force so that the elastic locking tongue 231 is just snapped into the locking groove on the chip base, thereby locking the chip base. The ratchet 232 is installed on the base 21. The adjuster 233 is installed on the ratchet 232 and is used to adjust the position of the locking tongue 231. After the encapsulation capping operation is completed, the adjuster 233 is driven to rotate synchronously by the rotation of the ratchet 232, thereby moving the locking tongue 231 toward the outside of the clamping groove 22, so that the elastic locking tongue 231 is away from the chip base, releasing the clamping fixation of the chip base, and allowing the packaged chip to be removed from the clamping groove 22.

[0044] The regulator 233 includes a rack 2335, a slider 2336, a spring 2337, a notched circular plate 2331, a sector plate 2332, a first tooth 2333, and a second tooth 2334. One end of the rack 2335 is slidably connected to the base plate 12. The other end is fixedly connected to the slider 2336. A chute is defined on the base 21, which is slidably connected to the slider 2336. The spring 2337 is fixedly connected between the rack 2335 and the base plate 12. When the rack 2335 moves downward along the chute to the upper limit, it engages with the ratchet 232. The notched circular plate 2331 is coaxially fixedly connected to the ratchet 232. The sector plate 2332, the first tooth 2333, and the second tooth 2334 are respectively fixedly connected to the notched circular plate 2331. The notched circular plate 2331 is used to position the lock tongue 231. When the notch of the notched circular plate 2331 faces the lock tongue 231, the lock tongue 231 pops outward from the clamping slot 22. The sector plate 2332 is used to actuate the trigger 41, thereby activating the motor 42. The first teeth 2333 are used to drive the first positioning plate 31 into the clamping slot 22. The second teeth 2334 are used to drive the second positioning plate 32 into the clamping slot 22.

[0045] In this embodiment, a notch is provided on the notched circular plate 2331. Assuming that the notched circular plate 2331 is divided into five equal sections along an angle from the center, the notch, the first tooth 2333, the second tooth 2334, and the sector plate 2332 are respectively provided at positions 1 / 5, 3 / 5, 4 / 5, and 5 / 5 of the notched circular plate 2331.

[0046] Positioning mechanism 3 is located within clamping mechanism 2 and is used to position the chip body and chip cover. Although gripping mechanism 1 can accurately grasp objects and, with the cooperation of conveying module 7, ensure that the positions and directions of the grasped chip base, chip body, and chip cover are basically consistent, there is still a large error when considering the precision requirements of chip packaging. After the chip base is clamped and positioned by clamping mechanism 2, positioning mechanism 3 is used to position the chip body and chip cover separately to meet the precision requirements of the chip packaging capping process, so that the chip body and chip cover are accurately installed on the chip base.

[0047] Specifically, the positioning mechanism 3 includes a first positioning plate 31 and a second positioning plate 32. The first positioning plate 31 and the second positioning plate 32 are slidably connected in the clamping groove 22 in sequence, and are used to position and limit the chip body and the chip cover respectively. When the grasping mechanism 1 drives the chip body into the clamping groove 22, the regulator 233 is triggered to drive the first positioning plate 31 to move toward the inner side of the clamping groove 22 to the minimum limit point, thereby achieving precise positioning of the chip body. Similarly, when the grasping mechanism 1 moves the chip cover into the clamping groove 22, the regulator 233 is triggered to drive the second positioning plate 32 to move toward the inner side of the clamping groove 22 to the minimum limit point, thereby achieving precise positioning of the chip cover.

[0048] In this embodiment, the first positioning plate 31 and the second positioning plate 32 are both positioned on one side, that is, on one side of the clamping groove 22, the shape of the side wall of the clamping groove 22 is designed according to the shape and size of the chip body and the chip cover, and on the other side of the clamping groove 22, the first positioning plate 31 and the second positioning plate 32 are slidably installed, and the first positioning plate 31 and the second positioning plate 32 are elastically connected. After the positioning is completed, they automatically return to their original positions, making it easier to remove the chip body. In other embodiments, the first positioning plate 31 and the second positioning plate 32 can also be positioned on both sides, that is, the first positioning plate 31 and the second positioning plate 32 each include two sliding plates, and the two sliding plates are connected to each other by an "X"-shaped telescopic bracket, so that the two sliding plates can move synchronously relative to each other, thereby achieving precise positioning of the chip body and the chip cover under the action of the regulator 233. When using bilateral positioning, the chip is easier to remove after the packaging capping operation is completed, but this structure is more complicated and not conducive to long-term operation.

[0049] The flip mechanism 4 is disposed between the gripping mechanism 1 and the clamping mechanism 2 and is used to drive the clamping mechanism 2 to flip. By driving the clamping mechanism 2 to flip, the clamped chip base, chip body, and chip cover are flipped to facilitate the welding process in the chip package. By providing the flip mechanism 4, rapid welding of the chip cover is achieved.

[0050] The flipping mechanism 4 includes a trigger 41, a motor 42, and a gear set. The motor 42 is mounted on the base 21. The gear set is mounted on the base 21 and is used to transmit the power output by the motor 42 to the clamping groove 22. The trigger 41 is mounted on the base 21, and when the regulator 233 contacts the trigger 41, the motor 42 is started. After the chip cover is moved to the clamping groove 22, after a short delay, the motor 42 is started, driving the gear set to drive the clamping groove 22 to flip as a whole. Depending on the chip specifications, the clamping groove 22 can be set to flip horizontally or vertically. When horizontal rotation is selected, the welding module can perform uninterrupted welding, minimizing welding marks as much as possible, making the packaged chip more beautiful. When vertical flipping is selected, the welding module performs welding on both sides of the chip respectively. In this embodiment, the gear set may include gears and incomplete gears. The motor 42 is fixedly connected to the incomplete gear. The gear is mounted at one end of the clamping groove 22, and the incomplete gear is meshed with the gear. After the motor 42 drives the incomplete gear to rotate one circle, the driving gear rotates 180 degrees to achieve the flipping of the clamping groove 22, thereby causing the chip base of each package to flip synchronously.

[0051] The guide mechanism 5 is used to position the movement direction of the grasping mechanism 1 so that the chip body and chip cover are aligned with the chip base. The guide mechanism 5 includes a guide block 51 and a guide slot 1 52. The guide block 51 is mounted on the base plate 12. The guide slot 1 52 is fixedly connected to the base 21, and the guide block 51 and the guide slot 1 52 are positioned opposite each other. When the grasping mechanism 1 moves toward the clamping mechanism 2, the guide block 51 moves along the guide slot 1 52, so that the base plate 12 and the base 21 are aligned, and the object grasped by each suction cup 14 is precisely moved into the corresponding clamping slot 22.

[0052] The gluing module is used to apply glue to the chip base to glue the chip body to the chip base. The bonding module is used to bond the chip body. The welding module is used to weld the chip cover to the chip base into one piece. The regulator 233 drives the trigger switch to different switch states to respectively activate the gluing module, bonding module, and welding module. The trigger switch includes a sensing switch located in the clamping groove 22 and a multi-position switch mounted on the base 21. The sensing switch is closed when the chip base is fully installed in the clamping groove. The multi-position switch and the sensing switch jointly control the activation of the gluing module, bonding module, and welding module. To meet the requirements of the packaging process, the gluing module, bonding module, and welding module are respectively provided with corresponding delays and timers to improve packaging quality. For example, the multi-position switch is provided with a first closing point, a second closing point, and a third closing point. When the sensing switch and the first closing point are closed simultaneously, the gluing module is activated. The gluing module can delay activation by 0.5 seconds to prevent the chip base from being fully clamped in place. At the same time, the timer counts the gluing time. After the preset time is met, the gluing module is shut down and reset. When the sensing switch and the second closing point are closed at the same time, the bonding module is started, and the bonding module can be delayed for 0.5 seconds to start, so that the chip body and the chip base are completely glued. When the sensing switch and the third closing point are closed at the same time, the welding module is started, and the welding module can also be delayed for 0.5 seconds to start, so that the chip cover is completely positioned, thereby achieving precise welding. The timer can be electrically connected to the grasping mechanism 1, and after the corresponding process is completed, the grasping mechanism 1 is triggered to start the next process. When the sensing switch and the multi-position switch are closed at the same time, in the chip packaging process, after the clamping mechanism 2 clamps the chip base, the gluing module is started to apply glue to the chip base. The grasping mechanism 1 then places and presses the chip body on the chip base, and at the same time triggers the first positioning plate 31 to accurately position the position of the chip body. After the glue solidifies, the chip body and the chip base are glued into one, and at the same time the bonding module is triggered to bond the chip body. Then the grabbing mechanism 1 moves the chip cover into the clamping groove 22, activates the second positioning plate 32 to position the chip cover, and triggers the welding module to weld the chip base and the chip cover into one.

[0053] The conveying module 7 is used to convey the chip body, the chip base and the chip cover to the grasping mechanism 1 .

[0054] The conveying module 7 includes a conveyor belt assembly 71, a carrier plate 72, and a positioner 73. A plurality of carrier plates 72 are arranged on the conveyor belt assembly 71. The carrier plates 72 are used to place the chip base, the chip body, and the chip cover. The positioner 73 is installed on the conveyor belt assembly 71 and is used to limit the carrier plates 72 so that the grasping mechanism 1 is just above the carrier plate 72 when grasping downward. A guide groove 2 74 that matches the guide block 51 is provided on the carrier plate 72. When the grasping mechanism 1 grasps the chip base or the chip body or the chip cover on the carrier plate 72, the bottom plate 12 is just opposite to the carrier plate 72 through the cooperation between the guide block 51 and the guide groove 2 74.

[0055] In this embodiment, the conveyor belt assembly 71 includes a bracket, a second motor, at least two rollers, and a conveyor belt. The motor 42 is mounted on the bracket and drives one of the rollers. The conveyor belt is positioned outside the roller to form a belt drive. The carrier plate 72 matches the shape and size of the base plate 12 and is also provided with 16 placement slots for accommodating chip bases, chip bodies, and chip covers. Multiple carrier plates 72 are provided on the conveyor belt, each of which sequentially holds a chip base, chip body, and chip cover. After the carrier plates 72 are moved to a preset position, they are positioned by a positioner 73 and a second guide slot 74, allowing the gripping mechanism 1 to accurately grasp all items on each carrier plate 72. In other embodiments, three or more conveyor modules 7 may be provided, with three conveyor modules 7 being used to convey chip bases, chip bodies, and chip covers, respectively. The gripping mechanism 1 sequentially grasps items from the three conveyor modules 7. The remaining conveyor modules 7 can be used to convey other materials required for packaging, such as solder wire and bonding wire.

[0056] The capping device of this embodiment has the following specific working principles:

[0057] First, the conveying module 7 sequentially conveys the chip base, chip body, and chip cover in a preset order. After the carrier plate 72 holding the chip base moves to a preset position, the carrier plate 72 is positioned by the positioner 73 so that the direction and position of the carrier plate 72 meet the preset direction of the gripping mechanism 1, thereby enabling all suction cups 14 of each gripping mechanism 1 to accurately grasp a chip base. The gripping mechanism 1 moves each chip base to the position directly above the clamping mechanism 2. The guide mechanism 5 positions the base plate 12 of the gripping mechanism 1 so that the base plate 12 is opposite to the base 21 of the clamping mechanism 2, thereby enabling each chip base to be accurately conveyed to the corresponding clamping groove 22. After the chip base enters the clamping groove 22, its two sides drive the locking tongues 231 outward. Since the base 21 of the clamping groove 22 is provided with a mounting groove that matches the chip base, when the chip base fully enters the mounting groove, the locking tongues 231 automatically engage with the locking groove of the chip base, fixing the chip base in the clamping groove 22. At the same time, the rack 2335 in the adjuster 233 moves with the gripping mechanism 1, driving the ratchet to rotate 1 / 5 of a circle downward, that is, °, the notch of the notched circular plate 2331 rotates away from the direction opposite to the lock tongue 231, forming a lock on the position of the lock tongue 231, preventing the lock tongue 231 from falling off and causing the position of the chip base to shift. After the chip base completely enters the clamping groove 22, the induction switch is closed, the first closing point of the multi-position switch is closed, and the gluing module is started to glue the chip base. After the gluing is completed, the gripping mechanism 1 continues to grab the chip body and place the chip body into the corresponding clamping groove 22. After the chip body enters the clamping groove 22, the gripping mechanism 1 remains in a pressed state so that the chip body and the chip base are completely bonded until the glue solidifies. During this process, the rack 2335 in the adjuster 233 moves with the gripping mechanism 1, continuing to drive the ratchet to rotate 1 / 5 of a circle downward, and the first tooth 2333 drives the first positioning plate 31 to position the chip body. The second closing point of the multi-position switch closes, activating the bonding module to bond the chip body. After bonding is complete, the gripping mechanism 1 continues to grasp the chip cover and position it within the corresponding clamping slot 22. During this process, the rack 2335 in the adjuster 233 moves with the gripping mechanism 1, continuing to drive the ratchet gear downward by 1 / 5 of a turn. The second tooth 2334 then drives the second positioning plate 32 to position the chip cover. The third closing point of the multi-position switch closes, activating the welding device to perform welding. After welding on one side is completed, the gripping mechanism 1 drives the rack 2335 downward, driving the ratchet gear to rotate 1 / 5 of a turn. At this point, the first positioning plate 31 and the second positioning plate 32 are both reset. The fan-shaped plate 2332 activates the trigger 41 to flip the clamping slot 22. For chips requiring three-sided welding, the horizontally flipped clamping slot 22 is selected. The welding module moves in coordination to achieve continuous three-sided welding. For chips requiring two-sided welding, the vertically or horizontally flipped clamping slot 22 is selected. After the flip is complete, welding is performed on the other side of the chip.After welding is completed, the grabbing device absorbs all the chips. At this time, the ratchet rotates until the notch of the notched circular plate 2331 faces the lock tongue 231 , and the lock tongue 231 pops outward, and the chip can be taken out from the clamping groove 22 .

[0058] In summary, the chip packaging capping device provided in this embodiment achieves precise positioning of the chip base, chip body, and chip cover through the cooperation of the grasping mechanism 1, the clamping mechanism 2, and the guiding mechanism 5, effectively improving the packaging accuracy and packaging efficiency. The positioning mechanism 3 assists in positioning the chip body and chip cover, maintaining the stability of the chip during gluing, bonding, and welding, and preventing deviations in the packaging process. The overall use of mechanical positioning, intelligent grasping, and round-trip triggering ensures stable and precise packaging, achieves a good process connection, and reduces the complexity of manual operation.

[0059] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A capping device for chip packaging, characterized in that: include: A gripping mechanism (1) is used to sequentially grip a chip base, a chip body, and a chip cover; the gripping mechanism (1) comprises a mechanical arm (11), a base plate (12), a torsion spring (13), and a plurality of suction cups (14); the mechanical arm (11) is rotatably connected to the base plate (12); the torsion spring (13) is fixedly connected between the base plate (12) and the mechanical arm (11); and a plurality of suction cups (14) are arrayed on the base plate (12); A clamping mechanism (2) for clamping the chip base; the clamping mechanism (2) comprises a base (21), a clamping groove (22), and a locking assembly (23); a plurality of the clamping grooves (22) are provided on the base (21); the locking assembly (23) is mounted on the clamping groove (22); a locking groove matching the locking assembly (23) is provided on the chip base; the locking assembly (23) is used to limit the chip base; the locking assembly (23) comprises a locking tongue (231), a ratchet (232), and an adjuster (233); the locking tongue (231) is mounted on the clamping groove (22), and the ratchet (232) is mounted on the base (21); the adjuster (233) is mounted on the ratchet (232) and is used to adjust the position of the locking tongue (231); A positioning mechanism (3) is provided in the clamping mechanism (2) and is used for positioning the chip body and the chip cover; the positioning mechanism (3) comprises a first positioning plate (31) and a second positioning plate (32); the first positioning plate (31) and the second positioning plate (32) are slidably connected in sequence in the clamping groove (22) and are used for positioning and limiting the chip body and the chip cover respectively; A turning mechanism (4) is provided between the grasping mechanism (1) and the clamping mechanism (2), and is used to drive the clamping mechanism (2) to turn over; A guide mechanism (5) is used to position the moving direction of the grasping mechanism (1) so that the chip body and the chip cover are aligned with the chip base in sequence; A conveying module is used for conveying the chip body, the chip base and the chip cover to the grasping mechanism (1).

2. The capping device for chip packaging according to claim 1, characterized in that: The flip mechanism (4) comprises a trigger (41), a motor (42), and a gear set; the motor (42) is mounted on the base (21); the gear set is mounted on the base (21) and is used to transmit power output by the motor (42) to the clamping groove (22); and the trigger (41) is mounted on the base (21).

3. The capping device for chip packaging according to claim 2, characterized in that: The regulator (233) comprises a rack (2335), a slider (2336), a spring (2337), a notched circular plate (2331), a sector plate (2332), a first tooth (2333), and a second tooth (2334); one end of the rack (2335) is slidably connected to the base plate (12); the other end is fixedly connected to the slider (2336); a sliding groove slidably connected to the slider (2336) is provided on the base (21); the spring (2337) is fixedly connected between the rack (2335) and the base plate (12); the rack (2335) engages with the ratchet (232) when it moves down along the sliding groove to the upper limit position; the notched circular plate (2331) and the ratchet (232) are fixed coaxially. connection; the fan-shaped plate (2332), the first teeth (2333), and the second teeth (2334) are respectively fixedly connected to the notched circular plate (2331); the notched circular plate (2331) is used to limit the lock tongue (231), and when the notch of the notched circular plate (2331) faces the lock tongue (231), the lock tongue (231) pops out toward the outside of the clamping groove (22); the fan-shaped plate (2332) is used to drive the trigger (41) to start the motor (42); the first teeth (2333) are used to drive the first positioning plate (31) to move into the clamping groove (22); the second teeth (2334) are used to drive the second positioning plate (32) to move into the clamping groove (22).

4. The capping device for chip packaging according to claim 1, wherein: The guide mechanism (5) comprises a guide block (51) and a guide groove (52); the guide block (51) is mounted on the base plate (12); the guide groove (52) is fixedly connected to the base (21), and the guide block (51) and the guide groove (52) are positioned opposite to each other.

5. The capping device for chip packaging according to claim 1, characterized in that: It also includes a gluing module, a bonding module, a welding module and a trigger switch; the gluing module is used to apply glue to the chip base so that the chip body is glued to the chip base; the bonding module is used to bond the chip body; the welding module is used to weld the chip cover and the chip base into one; the regulator (233) drives the trigger switch to be in different switch states to respectively start the gluing module, the bonding module and the welding module to work.

6. The capping device for chip packaging according to claim 4, characterized in that: The conveying module (7) includes a conveyor belt assembly (71), a carrier plate (72), and a positioner (73); a plurality of carrier plates (72) are provided on the conveyor belt assembly (71); the carrier plates (72) are used to place the chip base, the chip body, and the chip cover; the positioner (73) is installed on the conveyor belt assembly (71); and a second guide groove (74) matching the guide block (51) is provided on the carrier plate (72).

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