Radial phase change heat dissipation cold head

Abstract

The radiation type phase change heat dissipation cold head comprises a heat dissipation bottom plate and a heat dissipation cover, and a heat dissipation cavity is defined by the heat dissipation bottom plate and the heat dissipation cover; a liquid inlet and a liquid outlet which are respectively communicated with the heat dissipation cavity are formed in the heat dissipation cover; a heat dissipation enhancing structure is arranged on the side, located in the heat dissipation cavity, of the heat dissipation bottom plate and comprises a plurality of tiny structures extending from inside to outside in the radial direction, and a tiny channel is formed by the interval between any two adjacent tiny structures in the tiny structures. An inner core is further arranged in the heat dissipation cavity, a through hole penetrating through the inner core is formed in the middle of the inner core, one end of the through hole abuts against the liquid inlet, and the other end of the through hole abuts against the heat dissipation enhancing structure. Compared with the prior art, through the structural design of the heat dissipation bottom plate, the heat dissipation cover and the inner core and the design and assembly of the micro channel on the inner side of the heat dissipation bottom plate, the contact area of the heat dissipation cold head and the chip and the contact area of the working medium and the bottom plate are increased; and the heat exchange rate and the heat dissipation efficiency of the heat dissipation device and the working efficiency and the service life of the chip are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly to a radial phase change heat dissipation cold head. Background Art

[0002] Under the background of the rapid development of microelectronics technology, while the chip integration degree is continuously improved and the size is getting smaller and smaller, the substantial increase in the core heat generation and the existence of stacked heat accumulation lead to a sharp increase in the heat flux density. The performance of the chip is very sensitive to the working temperature, and the thermal design of the chip has been paid more and more attention. In order to ensure the stable operation and service life of various device chips, the heat dissipation technology plays a key role in the development of chips.

[0003] In the prior art, although attempts have been made to improve the performance by fixing the bifurcated flow channels or surface coatings, the unidirectional flow channels lack the ability of adaptive adjustment, and the complex bifurcated design results in the formation of flow dead zones in the fork tip regions due to insufficient manufacturing accuracy. Moreover, the traditional surface treatment processes such as anodic oxidation and chemical coatings are difficult to achieve uniform coverage in the micro-scale flow channels, and the problems of coating peeling and particle agglomeration further exacerbate the contradiction between the flow resistance and the thermal resistance. In addition, the stacked packaging design of the traditional microchannels increases the thickness of the device by 30%, which is contrary to the trend of miniaturization and light weight. Summary of the Invention

[0004] The purpose of the present invention is to provide a radial phase change heat dissipation cold head in order to overcome at least one of the defects existing in the above-mentioned prior art. The fork-shaped microchannels in the heat dissipation cold head reconstruct the fluid path through a multi-stage radial bifurcation network. The secondary flow effect generated at the bifurcation points can break the thermal boundary layer and significantly improve the heat transfer efficiency. At the same time, the surface modification technology precisely regulates the wettability and bubble dynamics behavior of the phase change working fluid through gradient hydrophilic-hydrophobic treatment (the combination of a super-hydrophilic substrate and a super-hydrophobic top surface), and combines laser-etched microgrooves or nano-composite coatings (such as silicon nitride / silicon carbide) to increase the effective heat dissipation area and reduce the interfacial thermal resistance. The integrated forming process of the porous medium and the flow channel makes up for the manufacturing defects of the complex structure. This two-level design of "macroscopic flow channel optimization - microscopic interface strengthening" not only realizes the adaptive distribution of the fluid and the dynamic thermal resistance matching, but also provides a systematic solution with high-efficiency heat dissipation, rapid response and process compatibility for high heat flux density scenarios by suppressing local overheating and long-term performance degradation.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A radial phase change heat dissipation cold head includes a heat dissipation bottom plate and a heat dissipation cover, and the two enclose to form a heat dissipation chamber;

[0007] The heat dissipation cover is provided with a liquid inlet and a liquid outlet that are respectively communicated with the heat dissipation chamber;

[0008] One side of the heat dissipation base plate located in the heat dissipation chamber is provided with a heat dissipation enhancement structure, which includes a plurality of microstructures extending radially from the inside outwards. Intervals between any two adjacent microstructures among the plurality of microstructures form micro-channels;

[0009] An inner core is further provided in the heat dissipation chamber. The middle of the inner core has a through hole penetrating the inner core. One end of the through hole abuts against the liquid inlet and the other end abuts against the heat dissipation enhancement structure.

[0010] Further, the plurality of microstructures are divided into multiple concentrically arranged annular arrays from the inside outwards. The outlet end of the micro-channels in the inner layer is connected to the inlet ends of at least two micro-channels in the next layer.

[0011] Further, the micro-channels between each layer are sequentially connected to form a multi-stage radial network structure extending outwards from the radiation center. That is to say, the micro-channels are a multi-stage radial network structure from the central circular groove to the periphery. The multi-stage radial network structure includes multiple layers of short micro-channels connected in sequence; the micro-channels are specifically a multi-stage radial network structure. The multi-stage radial network structure includes multiple layers of short-range micro-channels connected in sequence. Among them, the first layer of short-range micro-channels surrounds the central circular groove 11. Each layer of short-range micro-channels includes an upstream micro-channel and a downstream micro-channel. The structures of each layer of short-range micro-channels are connected to each other. The downstream micro-channel of the previous layer is the upstream micro-channel of the next layer; preferably, the cross-sectional shape of the micro-channels is a parallelogram.

[0012] Further, the microstructures are solid prisms, solid prisms with a first porous medium layer partially covering the surface, solid prisms with the surface completely covered with a first porous medium layer, prisms that are partially solid and partially porous structures, and prisms that are completely porous structures;

[0013] Among them, the pore diameter range of the first porous medium is 0.1 μm to 800 μm, and the porosity is 5% to 99%; the pore diameter range of the porous structure is 0.1 μm to 800 μm, and the porosity is 5% to 99%.

[0014] Further, the width of the micro-channels is between 5 microns and 10 millimeters, and the height is between 5 microns and 10 millimeters.

[0015] Further, the several microstructures are divided into multiple concentrically arranged annular arrays from the inside outwards. The outlet end of the micro-channels in the inner layer is connected to the inlet ends of at least two micro-channels in the next layer.

[0016] Further, a hydrophilic modified layer or a hydrophobic modified layer is provided on the surface of the micro-channels on one side of the heat dissipation base plate located in the heat dissipation chamber.

[0017] Further, a second porous medium layer is covered on one side of the heat dissipation base plate close to the heat dissipation cover. The thickness of the second porous medium layer is 0.01 - 10 mm, the porosity of the second porous medium is 5% - 99%, the pore diameter ranges from 0.1 μm to 800 μm, and the thickness at different positions or regions is adjusted differentially according to design requirements.

[0018] Further, the heat dissipation base plate and the heat dissipation cover are connected by screw threads or welding;

[0019] When the heat dissipation base plate and the heat dissipation cover are connected by welding, a solder is filled between their joint surfaces, and a sealed connection is formed through a brazing process;

[0020] When the heat dissipation base plate and the heat dissipation cover are connected by screw threads, threaded holes and sealing grooves for placing sealing rings are evenly arranged around the heat dissipation base plate and the heat dissipation cover. A sealing ring is arranged between the heat dissipation base plate and the heat dissipation cover and placed in the sealing groove; the sealing ring is located inside the threaded holes, and the sealing ring is pressed tightly between the heat dissipation base plate and the heat dissipation cover by screwing a screw into the threaded hole, forming a sealed structure.

[0021] Further, the phase change heat dissipation cold head further includes a first bent elbow joint and a second bent elbow joint. The first bent elbow joint and the liquid inlet are connected by screw threads or welding, and the second bent elbow joint and the liquid outlet are connected by screw threads or welding.

[0022] Further, the connection manner between the inner core and the heat dissipation cover is welding or static sealing connection.

[0023] Further, the ends of the first bent elbow joint and the second bent elbow joint are one or more of a threaded structure, a pagoda structure, or a quick-release joint structure.

[0024] Further, a through pipe extending outward is arranged at the through port at one end of the inner core close to the heat dissipation cover. A convex platform is circumferentially arranged on the outer wall of the through pipe. The through pipe extends into the liquid inlet, and the convex platform abuts against the inner wall of the heat dissipation cover.

[0025] Through the structural design of the heat dissipation base plate, the heat dissipation cover and the inner core, as well as the design and assembly of the micro-channels on the inner side of the heat dissipation base plate, the contact area between the heat dissipation cold head and the chip and the contact area between the working medium and the base plate are increased, and the heat exchange rate and heat dissipation efficiency of the heat dissipation device and the working efficiency and service life of the chip are improved. Compared with the prior art, the present invention has the following advantages:

[0026] (1) The combination of microchannels expands continuously from the central circular groove on the heat dissipation base plate towards the chassis edge, thereby gradually increasing the equivalent cross-sectional area along the flow path of the two-phase vapor-liquid flow, so as to adapt to the drastic expansion of the fluid volume caused by phase change under high heat flux density. This can effectively reduce the pressure drop loss caused by fluid phase change, reduce the power consumption of the heat dissipation cold head, and improve the stability of the heat dissipation cold head;

[0027] (2) Adding hydrophilic treatment or hydrophobic treatment on the surface of microchannels can greatly improve the heat transfer performance of the heat dissipation cold head;

[0028] (3) Use a multi-stage radiation network structure to construct a microchannel system. In this structure, a continuous connection of multiple layers of short-range fork-shaped microchannel structures is adopted, so that the dynamic behaviors such as the coalescence and rupture of bubbles near the nodes can interfere with the thermal boundary layer of the nearby microchannels and reduce the thickness of the thin liquid film, thereby increasing the wall heat transfer efficiency of the microchannel network. In addition, in the multi-layer short-range fork-shaped microchannels, two basic node structure units are introduced, making the distribution of the microchannel network denser and more uniform than the existing fractal tree-like network, significantly increasing the specific surface heat transfer area, effectively improving the cooling effect and helping to maintain the uniformity of the chip temperature; The interconnection of the short-range fork-shaped microchannels in the microchannel network can achieve efficient heat and mass exchange between different microchannels, helping to postpone the occurrence of boiling flow instability phenomena.

[0029] (4) The components of this heat dissipation device are easy to process and assemble, facilitating popularization and application. Description of the Drawings

[0030] Figure 1 It is a schematic structural diagram of the heat dissipation cold head provided by the present invention;

[0031] Figure 2 It is a structural cross-sectional view of the heat dissipation cold head provided by the present invention;

[0032] Figure 3 It is a schematic structural diagram of the heat dissipation base plate provided by the present invention;

[0033] Figure 4 It is one of the schematic structural diagrams of the heat dissipation cover provided by the present invention;

[0034] Figure 5 It is the other schematic structural diagram of the heat dissipation cover provided by the present invention;

[0035] Figure 6 It is one of the schematic structural diagrams of the inner core provided by the present invention;

[0036] Figure 7 It is the other schematic structural diagram of the inner core provided by the present invention;

[0037] Figure 8 It is the schematic structural diagram of the microchannel network provided by the present invention;

[0038] Figure 9 One of the schematic diagrams of the first bent structure and the second bent structure of the heat dissipation cold head provided by the present invention;

[0039] Figure 10 One of the schematic diagrams of the first bent structure and the second bent structure of the heat dissipation cold head provided by the present invention;

[0040] Figure 11 Schematic diagram of the working fluid flow direction of the heat dissipation cold head in the present invention;

[0041] In the figure: 1 - heat dissipation bottom plate; 2 - heat dissipation cover; 3 - first bent joint; 4 - second bent joint; 5 - inner core; 11 - central circular groove; 12 - micro structure; 13 - micro channel; 21 - welding surface; 22 - flow chamber; 23 - first through hole; 24 - second through hole; 25 - upper surface of the heat dissipation cover; 51 - through hole; 52 - connection surface; 53 - convex table surface. Detailed implementation manners

[0042] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation manners and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0043] The present invention provides a radial phase change heat dissipation cold head, including a heat dissipation bottom plate 1 and a heat dissipation cover 2, which together enclose a heat dissipation chamber;

[0044] The heat dissipation cover 2 is provided with a liquid inlet and a liquid outlet that respectively communicate with the heat dissipation chamber;

[0045] One side of the heat dissipation bottom plate 1 located in the heat dissipation chamber is provided with a heat dissipation enhancement structure, which includes a plurality of micro structures 12 extending radially from the inside to the outside, and the intervals between any two adjacent micro structures 12 among the plurality of micro structures 12 form micro channels 13;

[0046] An inner core 5 is further provided in the heat dissipation chamber. The middle part of the inner core 5 has a through hole 51 that penetrates the inner core. One end of the through hole 51 abuts against the liquid inlet, and the other end abuts against the heat dissipation enhancement structure.

[0047] In some embodiments of the present invention, the plurality of micro structures 12 are divided into multiple layers of concentrically arranged annular arrays from the inside to the outside, and the outlet end of the micro channel 13 in the inner layer is connected to the inlet ends of at least two micro channels 13 in the next layer.

[0048] In some embodiments of the present invention, the micro channels 13 between each layer are sequentially connected to form a multi-stage radial network structure extending from the radiation center to the outside.

[0049] In some embodiments of the present invention, the micro-structure 12 is a solid prism, a solid prism with a first porous medium layer partially covering its surface, a solid prism with its surface completely covered by a first porous medium layer, a prism that is partially solid and partially porous, or a prism that is completely porous;

[0050] In some embodiments of the present invention, the width of the micro-channel 13 ranges from 5 microns to 10 millimeters, and the height ranges from 5 microns to 10 millimeters.

[0051] In some embodiments of the present invention, on one side of the heat dissipation bottom plate 1 within the heat dissipation chamber, a hydrophilic modified layer or a hydrophobic modified layer is provided on the surface of the micro-channel 13.

[0052] In some embodiments of the present invention, on the side of the heat dissipation bottom plate 1 close to the heat dissipation cover 2, a second porous medium layer is covered, and the thickness of the second porous medium layer is 0.01 - 10 mm.

[0053] In some embodiments of the present invention, the heat dissipation bottom plate 1 and the heat dissipation cover 2 are connected by screw threads or welding;

[0054] The phase change heat dissipation cold head further includes a first elbow joint 3 and a second elbow joint 4. The first elbow joint 3 is connected to the liquid inlet by screw threads or welding, and the second elbow joint 4 is connected to the liquid outlet by screw threads or welding.

[0055] The connection mode between the inner core 5 and the heat dissipation cover 2 is welding or static sealing connection.

[0056] In some embodiments of the present invention, the ends of the first elbow joint 3 and the second elbow joint 4 are one or more of a threaded structure, a pagoda structure, or a quick-release joint structure.

[0057] In some embodiments of the present invention, at the through-hole at one end of the inner core 5 close to the heat dissipation cover 2, a through-tube extending outward is provided. A boss 53 is circumferentially provided on the outer wall of the through-tube. The through-tube extends into the liquid inlet, and the boss 53 abuts against the inner wall of the heat dissipation cover 2.

[0058] Embodiment

[0059] This embodiment provides a radial phase change heat dissipation cold head, as Figures 1-10 shown, a radial phase change heat dissipation cold head includes a heat dissipation bottom plate 1, a heat dissipation cover 2, a first elbow joint 3, a second elbow joint 4, and an inner core 5. The heat dissipation bottom plate 1 is installed at the lower part of the heat dissipation cover 2;

[0060] The inner core 5 is installed inside the heat dissipation cover 2;

[0061] The first bent joint 3 and the second bent joint 4 are installed on the upper part of the heat dissipation cover 2;

[0062] The inner core 5 is installed inside the heat dissipation cover 2, and when installed, ensure that the connection surface 51 coincides with the micro-structure 12;

[0063] The heat dissipation cover includes a welding surface 21, a flow chamber 22, a first through hole 23, a second through hole 24, and the upper surface of the heat dissipation cover 2. The second through hole 24 is opened on a frustum;

[0064] The heat dissipation bottom plate includes a central circular groove 11, a micro-structure 12, and a micro-channel 13;

[0065] The inner core includes a through hole 51, a connection surface 52, and a convex table surface 53;

[0066] The first bent joint 3 is installed and connected inside the first through hole 23. The inner core 5 is installed in the first through hole 32 by making its upper frustum convex table surface 53 coincide with the upper surface of the flow chamber 22 and coincide with the welding surface 21;

[0067] The second bent joint 4 is installed in the second through hole 24, communicates with the flow chamber 22, and coincides with the welding surface 21; The micro-channel 13 is a multi-stage radial network structure from the central circular groove 11 to the periphery. The multi-stage radial network structure includes multiple layers of short micro-channels connected in sequence;

[0068] As Figure 8 shown, the micro-channel 13 is specifically a multi-stage radial network structure. The multi-stage radial network structure includes multiple layers of short-range micro-channels 13 connected in sequence. Among them, the first layer of short-range micro-channels 13 surrounds the central circular groove 11. Each layer of short-range micro-channels 13 includes an upstream micro-channel 13 and a downstream micro-channel 13. The structure of each layer of short-range micro-channels 13 is connected to the downstream micro-channel 13 of the previous layer, which is the upstream micro-channel 13 of the next layer.

[0069] In the multi-stage radial network structure, the first layer of short-range micro-channels 13 is connected by the first basic unit, the second layer of short-range micro-channels 13 is connected by the second basic unit, and the remaining layers of short-range bifurcated micro-channels 13 are connected by a mixture of the first basic unit and the second basic unit in an alternating manner.

[0070] The cross-sectional shape of the micro-channel 13 is rectangular;

[0071] The micro-structure formed between the micro-channels 13 is a solid structure, a combination structure of solid and porous medium, or a porous medium structure;

[0072] The solid and porous medium combined structure is such that the porous medium coats the surface of the solid structure, and its surface coverage rate is 0 - 100%. The positions and thicknesses of different coverage areas can be adjusted according to design requirements;

[0073] The pore diameter range of the porous medium is 0.1 μm - 800 μm, and the porosity is 5% - 99%.

[0074] The upper surface of the heat dissipation cold plate 1 can be covered with a porous medium layer. The thickness of the porous medium layer is 0.01 - 10 mm, the porosity of the porous medium is 5% - 99%, the pore diameter range is 0.1 μm - 800 μm, and the thickness at different positions or regions is differentially adjusted according to design requirements.

[0075] The width of the microchannel 13 ranges from 5 microns to 10 mm, and the height ranges from 5 microns to 10 mm;

[0076] The connection method between the heat dissipation bottom plate 1 and the heat dissipation cover 2 is threaded connection or welding;

[0077] Preferably, when the heat dissipation bottom plate 1 and the heat dissipation cover 2 are connected by welding, a solder is filled between their joint surfaces, and a sealed connection is formed through the brazing process.

[0078] Preferably, when the heat dissipation bottom plate 1 and the heat dissipation cover 2 are connected by threading, threaded holes and sealing grooves for placing sealing rings are evenly opened around the heat dissipation bottom plate 1 and the heat dissipation cover 2. A sealing ring is provided between the heat dissipation bottom plate 1 and the heat dissipation cover 2 and placed in the sealing groove; the sealing ring is located inside the threaded hole, and the sealing ring is pressed between the heat dissipation bottom plate 1 and the heat dissipation cover 2 by screwing a screw into the threaded hole to form a sealed structure.

[0079] The connection method between the first bent elbow joint 3 and the heat dissipation cover 2, and between the inner core 5 and the heat dissipation cover 2 is welding or threaded connection;

[0080] The connection method between the second bent elbow joint 4 and the heat dissipation cover 2 is welding or threaded connection;

[0081] The connection method between the inner core 5 and the heat dissipation cover 2 is welding or static sealing connection;

[0082] Preferably, when the connection method between the inner core 5 and the heat dissipation cover 2 is welding, a solder is provided between the convex table surface 53 and the upper surface of the flow chamber 22;

[0083] Preferably, when the inner core 5 and the heat dissipation cover 2 are in static sealing connection, a gasket with the same size as the convex table surface 53 on the inner core 5 is padded between the inner core 5 and the heat dissipation cover 2. A through hole with the same size as the through hole 51 is opened in the center of the gasket, and the gasket is installed between the convex table surface 53 and the upper surface of the flow chamber 22 to form a seal;

[0084] The connection mode between the inner core 5 and the heat dissipation bottom plate 1 is welding or static seal connection;

[0085] Preferably, when the connection mode between the inner core 5 and the heat dissipation bottom plate 1 is welding, solder is provided on the connection surface 52 and the micro-structure 12;

[0086] Preferably, when the inner core 5 and the heat dissipation bottom plate 1 are in static seal connection, a gasket with the same size as the connection surface 52 on the inner core 5 is padded between the inner core 5 and the heat dissipation bottom plate 1. A through hole with the same size as the through hole 51 is opened in the center of the gasket, and the gasket is installed on the connection surface 52 and the micro-structure 12 to form a seal.

[0087] The materials of the heat dissipation bottom plate 1, the heat dissipation cover 2 and the inner core 5 are copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride or silicon; they are manufactured with materials having high thermal conductivity and certain strength to ensure that the heat dissipation cold head has excellent heat exchange efficiency and good service life.

[0088] The cooling working medium introduced when the heat dissipation cold head is in use includes water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils and fluorinated liquids;

[0089] The inner wall of the bottom plate of the heat dissipation bottom plate 1 and the surface of the micro-channel 13 can be provided with a natural surface, a hydrophilic modified layer or a hydrophobic modified layer according to design requirements; hydrophobically or hydrophilically modifying the inner wall of the bottom plate and the surface of the micro-channel 13 can further increase the boiling rate of the working medium and improve the heat removal efficiency. The choice of hydrophilic or hydrophobic modification is based on the heat flux density of the specific working conditions: hydrophobic modification has a better heat exchange effect under low heat flux density, and hydrophilic modification has a better heat exchange effect under high heat flux density; this is because: generally speaking, a hydrophilic surface has a larger heat transfer coefficient under high heat flux density, and a hydrophobic surface has a larger heat transfer coefficient under low heat flux density. Hydrophobic modification or hydrophilic modification can be achieved by loading corresponding materials on the surface, or by taking the way of laser texturing to make the inner wall of the bottom plate of the bottom plate hydrophilic or hydrophobic.

[0090] Preferably, the method of hydrophilic / hydrophobic modification can be spin coating or electrodeposition of hydrophilic / hydrophobic coatings.

[0091] Preferably, the material of the hydrophobic layer is trimethylsilane, polytetrafluoroethylene or polydimethylsiloxane.

[0092] The orientations of the first bent elbow joint 3 and the second bent elbow joint 4 are in any direction perpendicular to the upper surface 25 of the heat dissipation cover;

[0093] For the described radial phase change heat dissipation cold head, it is characterized in that the ends of the first bent elbow joint 3 and the second bent elbow joint 4 are in a threaded structure, a pagoda structure, a quick-release joint structure, etc.

[0094] As Figure 10 shown, the first bent elbow joint 3 and the second bent elbow joint 4 can also be of this structure 2.

[0095] As Figure 11 shown, the heat dissipation bottom plate 1, the heat dissipation cover 2, the first bent elbow joint 3, the second bent elbow joint 4 and the inner core 5 together constitute the working fluid flow channel of this radial phase change heat dissipation cold head. Specifically, the cold working fluid enters the central circular groove 11 through the through hole of the inner core 5 through the first bent elbow joint 3, and exchanges heat with the heat dissipation bottom plate 1 and the chip through the microchannel 13; the heat is transferred to the liquid working fluid through the heat dissipation bottom plate 1 and the microchannel 13, causing the liquid working fluid to change from liquid to gas state. Then, the gas-liquid mixed working fluid enters another chamber formed by the outer wall of the inner core 5 and the heat dissipation cover 2 and the inner core 5 through the central circular groove 11 and the microchannel 13, and finally is discharged from this heat dissipation cold head through the second bent elbow joint 4.

[0096] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution content of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. A radial phase change heat dissipation cold head, characterized in that, It includes a heat dissipation bottom plate (1) and a heat dissipation cover (2), and the two enclose to form a heat dissipation chamber; The heat dissipation cover (2) is provided with a liquid inlet and a liquid outlet that are respectively communicated with the heat dissipation chamber; On one side of the heat dissipation bottom plate (1) located in the heat dissipation chamber, there is a heat dissipation enhancement structure, which includes a plurality of microstructures (12) extending radially from the inside to the outside. The intervals between any two adjacent microstructures (12) among the plurality of microstructures (12) form micro-channels (13); An inner core (5) is further arranged in the heat dissipation chamber. The middle of the inner core (5) has a through hole (51) passing through the inner core. One end of the through hole (51) abuts against the liquid inlet and the other end abuts against the heat dissipation enhancement structure.

2. The radial phase change heat dissipation cold head according to claim 1, wherein The plurality of microstructures (12) are divided into multiple layers of concentrically arranged annular arrays from the inside to the outside. The outlet end of the micro-channel (13) in the inner layer is communicated with the inlet ends of at least two micro-channels (13) in the next layer.

3. The radial phase change heat dissipation cold head according to claim 2, wherein The micro-channels (13) between each layer are sequentially connected to form a multi-stage radial network structure extending outward from the radiation center.

4. The radial phase change heat dissipation cold head according to claim 2, wherein The microstructures (12) are solid prisms, solid prisms with a first porous medium layer partially covering the surface, solid prisms with the surface completely covered with a first porous medium layer, prisms that are partially solid and partially porous structures, and prisms that are completely porous structures.

5. The radial phase change heat dissipation cold head according to claim 2, wherein The width of the micro-channel (13) is between 5 microns and 10 millimeters, and the height is between 5 microns and 10 millimeters.

6. The radial phase change heat dissipation cold head according to claim 2, wherein, On one side of the heat dissipation bottom plate (1) located in the heat dissipation chamber and on the surface of the micro-channel (13), there is a hydrophilic modified layer or a hydrophobic modified layer.

7. The radial phase change heat dissipation cold head according to claim 1, characterized in that, On the side of the heat dissipation bottom plate (1) close to the heat dissipation cover (2), there is a second porous medium layer, and the thickness of the second porous medium layer is 0.01 - 10 mm.

8. The radial phase change heat dissipation cold head according to claim 1, characterized in that The heat dissipation bottom plate (1) and the heat dissipation cover (2) are connected by screwing or welding; The phase change heat dissipation cold head further includes a first elbow joint (3) and a second elbow joint (4). The first elbow joint (3) and the liquid inlet are connected by screwing or welding, and the second elbow joint (4) and the liquid outlet are connected by screwing or welding. The connection method between the inner core (5) and the heat dissipation cover (2) is welding or static sealing connection.

9. The radial phase change heat dissipation cold head according to claim 1, wherein At the through port at one end of the inner core (5) close to the heat dissipation cover (2), there is a through pipe extending outward. A boss (53) is circumferentially arranged on the outer wall of the through pipe. The through pipe extends into the liquid inlet, and the boss (53) abuts against the inner wall of the heat dissipation cover (2).

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