Phase change type chip radiator

Abstract

The invention relates to a phase change type chip radiator, and belongs to the technical field of heat dissipation, the phase change type chip radiator comprises a cover plate, the cover plate is provided with a heat exchange cavity groove and a pair of cover plate through holes communicated with the heat exchange cavity groove, and the periphery of the heat exchange cavity groove is provided with a cold plate positioning groove; the heat dissipation cold plate abuts against the cold plate positioning groove, a heat exchange cavity is formed by the space between the heat dissipation cold plate and the heat exchange cavity groove, and a heat dissipation enhancing structure is arranged on the side wall, located in the heat exchange cavity, of the heat dissipation cold plate; and the pair of joints is respectively connected with the pair of cover plate through holes and is used for connecting the heat exchange cavity with an external circulating pipeline. The radiator cover plate plays a role in connecting the radiating cold plate and the chip substrate at the same time, so that the plane fitting degree of the bottom surface of the radiating cold plate and the chip integrated radiating top cover is improved; the heat dissipation enhancing structure can effectively enhance the heat exchange process and improve the heat transfer coefficient of the heat dissipation device.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly relates to a phase-change type chip radiator. Background Art

[0002] With the rapid development of microelectronics technology, the chip integration degree is continuously improved, the size is getting smaller and smaller, and the significant increase in the core heat generation of the chip and the existence of stacked heat accumulation lead to a sharp increase in the chip heat flux density. The performance of the chip is very sensitive to the working temperature, and the thermal management design of the chip has received more and more attention. In order to ensure the stable operation and service life of the chip, the heat dissipation performance of the radiator is particularly important.

[0003] Common radiators can be divided into various types such as air-cooled, heat pipe radiators, liquid-cooled, and semiconductor refrigeration according to the heat dissipation method. With the continuous increase in the heat flux density of electronic devices, the traditional air-cooled and liquid-cooled heat dissipation methods are difficult to meet the high-efficiency heat dissipation requirements. The phase-change type liquid-cooled radiator has attracted much attention due to its compact design. Especially when a phase change occurs during the liquid flow process, it can absorb a large amount of latent heat of vaporization, thereby providing a higher heat transfer coefficient and better heat dissipation performance, far exceeding the traditional heat dissipation solutions.

[0004] Working at the microscale involves complex physical phenomena such as surface tension effects and bubble behavior, which increases the complexity of the design. Due to the problems in the structural design of general phase-change type heat dissipation devices, they have defects such as limited heat dissipation effect, poor temperature uniformity on the heat dissipation surface, and inability to continuously dissipate heat at high power, and it is difficult to meet the heat dissipation requirements of high heat flux density chips. Therefore, designing a new type of efficient two-phase cooling chip radiator is a common concern of those skilled in the art. Summary of the Invention

[0005] The purpose of the present invention is to provide a phase-change type chip radiator in order to overcome at least one of the defects existing in the above-mentioned prior art.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A phase-change type chip radiator, comprising:

[0008] A cover plate, the cover plate is provided with a heat exchange cavity groove and a pair of cover plate through holes communicated with the heat exchange cavity groove, and a cold plate positioning groove is provided along the circumference of the heat exchange cavity groove;

[0009] A heat dissipation cold plate, the heat dissipation cold plate abuts against the cold plate positioning groove, the space between the heat dissipation cold plate and the heat exchange cavity groove forms a heat exchange cavity, and a heat dissipation enhancement structure is provided on the side wall of the heat dissipation cold plate located in the heat exchange cavity;

[0010] A pair of connectors, which are respectively connected to the through holes of the pair of cover plates and are used for connecting the heat exchange cavity with the external circulation pipeline.

[0011] Furthermore, the cover plate and the heat dissipation cold plate are connected by welding or screwing, and the pair of connectors are respectively connected to the through holes of the pair of cover plates by welding or screwing.

[0012] Furthermore, the heat dissipation enhancement structure includes a plurality of micro-structured rib columns arranged in an array on the heat dissipation cold plate; the array arrangement of the plurality of micro-structured rib columns is a straight row array arrangement or a staggered array arrangement.

[0013] Furthermore, the shape of the micro-structured rib column is selected from one or more of a column with a rectangular cross-section, a cone with a rectangular cross-section, a frustum with a rectangular cross-section, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape, or an umbrella shape.

[0014] Furthermore, when the shape of the micro-structured rib column is an umbrella shape, it includes a root and a head arranged on the heat dissipation cold plate from the inside out;

[0015] Wherein, the root and the head have the same or different structures, and are both selected from one or more of a column with a rectangular cross-section, a cone with a rectangular cross-section, a frustum with a rectangular cross-section, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape, etc.

[0016] Furthermore, the circumferential centers of the horizontal projection contours of the root and the head coincide or are offset. Denote the radius of the circumscribed circle of the horizontal projection contour of the root as R1, and the radius of the circumscribed circle of the horizontal projection contour of the head as R2. The ratio of R1 to R2 is 0.1 to 10; when the root and the head are offset, the offset distance is less than or equal to the sum of R1 and R2.

[0017] Furthermore, when the shape of the micro-structured rib column is an umbrella shape, a gap capillary structure covers the periphery of its root.

[0018] Furthermore, the micro-structured rib column is a solid rib column covered with a rib column capillary structure, and the percentage of the thickness of the rib column capillary structure in the total thickness of the micro-structured rib column is 0% to 100%;

[0019] When the thickness ratio of the capillary structure of the rib column is 0%, the microstructured rib column is a completely solid rib column; when the thickness ratio of the capillary structure of the rib column is 100%, the microstructured rib column is composed of a completely porous capillary structure.

[0020] Further, the side wall of the area of the heat dissipation cold plate located in the heat exchange cavity is also covered with a bottom capillary structure; when the thickness of the bottom capillary structure is 0, the side wall is a smooth metal surface.

[0021] Further, the thickness of the capillary structure is non-uniformly adjusted according to design requirements at different positions or regions.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] (1) The heat dissipation cold plate of the present invention simultaneously functions as a connection between the heat dissipation cold plate and the chip substrate, different from the method of connecting the cold plate to the cover plate and then connecting through a fixed base. This design reduces the mating steps and is more conducive to improving the planar fit between the bottom surface of the heat dissipation cold plate and the chip integrated heat dissipation top cover.

[0024] (2) The umbrella-shaped rib column of the present invention has a large surface area, which can increase the heat dissipation area. The sudden expansion part of the umbrella-shaped structure helps to enhance the turbulent effect of the fluid and improve the dispersion of bubbles. The rib column creates a complex flow path during the fluid flow process, making it difficult for bubbles to form large aggregates in the fluid, thereby reducing the detachment diameter of the bubbles and increasing the detachment speed of the bubbles.

[0025] (3) The height ratio of the microstructured rib column of the present invention to the heat exchange cavity is 0-1, which means that the height of the rib column can increase from zero to fill the longitudinal space of the heat exchange cavity. High rib columns are suitable for increasing the surface area and turbulent effect, but are prone to causing flow resistance and bubble retention; low rib columns can reduce the resistance but have a limited heat exchange area and have a lower pressure drop in a high-flow-rate heat dissipation system. Rib columns with different heights can better handle different heat dissipation scenarios.

[0026] (4) The porous capillary structure of the present invention makes the phase change heat dissipation technology more efficient and improves the overall performance of the radiator by increasing the flow area and path of the liquid on the cold plate surface and the liquid supply. Description of the Drawings

[0027] Figure 1 is an exploded view of the overall structure of the radiator according to an embodiment of the present invention;

[0028] Figure 2 is a schematic assembly structure diagram of the cover plate and the heat dissipation joint according to an embodiment of the present invention;

[0029] Figure 3 is a schematic structural diagram of the cover plate according to an embodiment of the present invention;

[0030] Figure 4 Another structural schematic diagram of the cover plate according to an embodiment of the present invention;

[0031] Figure 5 Structural schematic diagram of the heat dissipation cold plate according to an embodiment of the present invention;

[0032] Figure 6 Another structural schematic diagram of the heat dissipation cold plate according to an embodiment of the present invention;

[0033] Figure 7 Structural schematic diagram of the sealing gasket according to an embodiment of the present invention;

[0034] Figure 8 Structural schematic diagram of the radiator joint with a welding method according to an embodiment of the present invention;

[0035] Figure 9 Structural schematic diagram of the rib column shape feature according to an embodiment of the present invention;

[0036] Figure 10 Structural schematic diagram of the umbrella-shaped rib column with the center of gravity coinciding and offset according to an embodiment of the present invention;

[0037] Figure 11 Structural schematic diagram of two rib columns covered with a pore capillary structure according to an embodiment of the present invention;

[0038] Figure 12 Structural schematic diagram of the heat dissipation structure with an overall welding method according to an embodiment of the present invention;

[0039] Figure 13 Cross-sectional view of the heat dissipation structure with an overall welding method according to an embodiment of the present invention;

[0040] Markings in the figure:

[0041] 1 - Heat dissipation cold plate; 11 - Microstructure rib column; 12 - Rib column bottom surface; 13 - Cold plate screw hole; 14 - Cold plate bottom surface; 111 - Rib column capillary structure; 112 - Gap capillary structure; 121 - Bottom surface capillary structure;

[0042] 2 - Cover plate; 21 - Buckle connection hole; 22 - Buckle positioning hole; 23 - Cover plate through hole; 24 - Heat exchange cavity groove; 25 - Gasket positioning groove; 26 - Cover plate screw hole; 27 - Cold plate positioning groove; 28 - Cover plate bottom surface;

[0043] 3 - Joint; 31 - Connection structure; 32 - Installation structure;

[0044] 4 - Sealing gasket; 41 - Gasket through hole;

[0045] 5 - Connection screw. Detailed implementation manners

[0046] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation manners and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0047] The present invention provides a phase change type chip radiator, including:

[0048] A cover plate 2, the cover plate 2 is provided with a heat exchange cavity groove 24, and a pair of cover plate through holes 23 communicated with the heat exchange cavity groove 24, and a cold plate positioning groove 27 is provided along the circumference of the heat exchange cavity groove 24;

[0049] A heat dissipation cold plate 1, the heat dissipation cold plate 1 abuts against the cold plate positioning groove 27, and the space between the heat dissipation cold plate 1 and the heat exchange cavity groove 24 forms a heat exchange cavity, and a heat dissipation enhancement structure is provided on the side wall of the heat dissipation cold plate 1 located in the heat exchange cavity;

[0050] A pair of connectors 3, the pair of connectors 3 are respectively connected to the pair of cover plate through holes 23 for connecting the heat exchange cavity with an external circulation pipeline.

[0051] In some embodiments of the present invention, the heat dissipation cold plate 1 is embedded with the bottom of the cover plate 2 and connected by welding or screw connection. The bottom surface of the heat dissipation cold plate 1 is attached to the chip integrated heat dissipation top cover. The upper surface of the heat dissipation cold plate 1 is provided with microstructural rib columns 11 covering a certain capillary structure and rib column bottom surfaces 12;

[0052] The cover plate 2 is connected to the chip substrate by screw connection or buckle connection. The bottom surface 28 of the cover plate is provided with a heat exchange cavity groove 24. A cold plate positioning groove 27 is provided along the circumference of the heat exchange cavity groove 24. The heat exchange cavity groove 24 and the cold plate positioning groove 27 form a first-level stepped structure to be embedded with the heat dissipation cold plate 1. The heat exchange cavity groove 24, the surface of the microstructural rib column 11 and the rib column bottom surface 12 are combined to form a heat exchange cavity. The top surface of the cover plate is provided with a cover plate through hole 23 to communicate with the heat exchange cavity groove;

[0053] The connector 3 is installed in the cover plate through hole 23 and connected to the cover plate 2 by welding or threading. The connector 3 connects the external circulation pipeline and the heat exchange cavity.

[0054] In some embodiments of the present invention, when the connection between the heat dissipation cold plate 1 and the cover plate 2 is by welding, a solder is filled between the fitting surfaces of the heat dissipation cold plate 1 and the cover plate 2, and the heat dissipation cold plate 1 and the cover plate 2 are sealed and connected by welding.

[0055] In some embodiments of the present invention, when the connection mode between the heat dissipation cold plate 1 and the cover plate 2 is a screw mode, a sealing gasket is provided between the heat dissipation cold plate 1 and the cover plate 2, and sealed connection is achieved through connection screws 5; the cover plate 2 is provided with a gasket positioning groove 25 between the heat exchange cavity groove 24 and the cold plate positioning groove 27 to form a two-stage stepped structure; the surface of the gasket positioning groove 25 is provided with evenly distributed cover plate screw holes 26; the periphery of the heat dissipation cold plate 1 is provided with cold plate screw holes 13 corresponding to the cover plate screw holes 26; the sealing gasket 4 is installed in the gasket positioning groove 25 to achieve the sealing between the heat dissipation cold plate 1 and the cover plate 2, and the sealing gasket 4 is provided with gasket through holes for avoiding the connection screws 5, and the connection screws 5 achieve the connection between the heat dissipation cold plate 1 and the cover plate 2.

[0056] It can be understood that the welding methods include fusion welding, brazing, diffusion welding and other methods; taking brazing as an example, brazing fills the joint gap with molten solder to form a continuous and dense metal bonding layer, avoiding microcracks or pores that may be generated by traditional welding, and ensuring that the cold head still maintains strict sealing under high-pressure or high-frequency thermal cycling; the screw mode or the thread mode allows non-destructive disassembly and assembly, which is convenient for regular cleaning, replacing the sealing ring or repairing the internal flow channel, avoiding the high cost of overall replacement required for welding; the selection of the two connection methods is based on actual needs.

[0057] In some embodiments of the present invention, when the joint 3 is installed on the cover plate by welding, the joint 3 is processed by a customized process. The cover plate through holes 23 are all smooth holes. The joint 3 is provided with a joint structure 31 and an installation structure 32 for realizing pipeline connection and joint installation respectively. Solder is filled between the joint surface of the joint 3 and the cover plate 2 to achieve sealing and connection.

[0058] In some embodiments of the present invention, when the joint 3 is installed on the cover plate by a thread mode, the cover plate through holes 23 are all threaded holes, and the joint 3 is selected from one of the quick water-stop joints, pagoda joints, ferrule joints, and quick-connect joints with standard threads.

[0059] In some embodiments of the present invention, the arrangement mode of the microstructural rib columns 11 is a straight arrangement or a staggered arrangement; the covering size of the microstructural rib columns 11 is greater than or equal to the integrated heat dissipation top cover size of the chip.

[0060] In some embodiments of the present invention, the heat dissipation enhancement structure includes a plurality of microstructural rib columns 11 arrayed on the heat dissipation cold plate 1; the array arrangement of the plurality of microstructural rib columns 11 is a straight array arrangement or a staggered array arrangement.

[0061] In some embodiments of the present invention, the shape of the microstructural rib column 11 is selected from a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape, or an umbrella shape according to the applicable situation.

[0062] In some embodiments of the present invention, when the shape of the microstructural rib column 11 is an umbrella shape, it includes a root and a head arranged from the inside out on the heat dissipation cold plate 1;

[0063] Among them, the root and the head have the same or different structures, and are each selected from one or more of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape, etc. It can be understood that compared with general circular or rectangular rib columns, the umbrella-shaped rib column expands the contact area between the rib column and the fluid, significantly improving the convective heat transfer coefficient. The sudden expansion structure at the top or bottom of the umbrella can enhance the turbulence effect and break the fluid boundary layer.

[0064] In some embodiments of the present invention, the circumcenter of the horizontal projection profile of the root and the head coincide or are misaligned. Denote the radius of the circumcircle of the horizontal projection profile of the root as R1, and the radius of the circumcircle of the horizontal projection profile of the head as R2. The ratio of R1 to R2 is 0.1 to 10; when the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

[0065] In some embodiments of the present invention, when the shape of the microstructural rib column 11 is an umbrella shape, a gap capillary structure 112 covers the periphery of its root.

[0066] In some embodiments of the present invention, the height ratio of the microstructural rib column 11 to the heat exchange cavity is 0 to 1;

[0067] In some embodiments of the present invention, the microstructural rib column 11 is a solid rib column covered with a rib column capillary structure 111, and the percentage of the thickness of the rib column capillary structure 111 in the total thickness of the microstructural rib column 11 is 0% to 100%;

[0068] When the thickness ratio of the rib column capillary structure 111 is 0%, the microstructural rib column 11 is a completely solid rib column; when the thickness ratio of the rib column capillary structure 111 is 100%, the microstructural rib column 11 is composed of a completely porous capillary structure.

[0069] In some embodiments of the present invention, the side wall of the heat dissipation cold plate 1 in the heat exchange cavity is further covered with a bottom capillary structure 121; when the thickness of the bottom capillary structure 121 is 0, the side wall is a smooth metal surface.

[0070] In some embodiments of the present invention, the rib capillary structure 111, the gap capillary structure 112 and the bottom capillary structure 121 are all porous capillary structures; the porous capillary structure is formed by one of metal powder sintering, metal wire sintering or metal powder and metal wire mixed sintering; the thickness of the porous capillary structure in different positions or regions is non-uniformly adjusted according to design requirements. It can be understood that the addition of a porous capillary structure can greatly increase the surface area of the cold plate, help enhance the conduction and dispersion of heat, promote the uniform distribution of liquid, and help to perform more efficient evaporation and condensation processes on the surface of the cold plate. In addition, the capillary structure can help the coolant to be quickly absorbed and distributed through capillary action, ensure the uniformity of the coolant in the radiator, reduce the local drying up of the liquid, and improve the stability of the heat dissipation system.

[0071] In some embodiments of the present invention, the material of the heat dissipation cold plate 1, the cover plate 2 and the joint 3 is selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic or glass; the sealing gasket 4 is selected from one of rubber, silicone, fluororubber or plastic.

[0072] In some embodiments of the present invention, the cooling medium of the chip heat sink is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils or fluorinated liquids.

[0073] The basic application principle of the chip heat sink in the present invention is: the low-temperature cooling medium enters the heat exchange cavity composed of the heat dissipation cold plate 1 and the cover plate 2 through the one-side joint 3 to undergo boiling heat exchange, taking away the heat conducted from the high-temperature chip to the microchannel cold plate, and is discharged to the external circulation pipeline through the other-side joint 3. It can be understood that the chip is a high-power semiconductor device, and the present invention does not limit the type of chip. Exemplarily, the chip is a CPU chip, a GPU chip or a laser chip.

[0074] Example 1

[0075] See also Figures 1 to 8 As shown, this embodiment provides a phase change chip heat sink, including a heat dissipation cold plate 1, a cover plate 2 and a joint 3;

[0076] The heat dissipation cold plate 1 is embedded in the bottom of the cover plate 2 and connected by welding. The bottom surface 14 of the cold plate is attached to the integrated heat dissipation top cover of the chip. The upper surface of the heat dissipation cold plate 1 is provided with microstructural rib columns 11 and rib column bottoms 12 that cover a certain capillary structure;

[0077] The cover plate 2 is connected to the chip substrate by a buckle. The cover plate 2 is provided with buckle mounting holes 21 and buckle positioning holes 22; The bottom surface 28 of the cover plate is provided with a heat exchange cavity groove 24. A cold plate positioning groove 27 is provided along the periphery of the heat exchange cavity groove 24. The heat exchange cavity groove 24 and the cold plate positioning groove 27 form a first-level stepped structure for fitting with the heat dissipation cold plate 1. The heat exchange cavity groove 23, the surface of the microstructural rib column 11 and the rib column bottom 12 are combined to form a heat exchange cavity. A cover plate through hole 23 is opened on the top surface of the cover plate 2 to communicate with the heat exchange cavity groove 24; The buckle used in this embodiment is a common means in the art, so the specific structure of the buckle will not be described in detail here;

[0078] The joint 3 is installed in the cover plate through hole 23 and connected to the cover plate 2 by a threaded method. The joint 3 communicates with the external circulation pipeline and the heat exchange cavity.

[0079] A sealing gasket 4 is provided between the heat dissipation cold plate 1 and the cover plate 2, and sealed connection is achieved through connection screws 5; The cover plate 2 is provided with a gasket positioning groove 25 between the heat exchange cavity groove 24 and the cold plate positioning groove 27 to form a two-level stepped structure; The surface of the gasket positioning groove 25 is provided with evenly distributed cover plate screw holes 26; The periphery of the heat dissipation cold plate 1 is provided with cold plate screw holes 13 corresponding to the cover plate screw holes 26; The sealing gasket 4 is installed in the gasket positioning groove 25 to achieve the seal between the heat dissipation cold plate 1 and the cover plate 2. The sealing gasket 4 is provided with a gasket through hole 41 to avoid the connection screw 5, and the connection screw 5 realizes the connection between the heat dissipation cold plate 1 and the cover plate 2.

[0080] The cover plate through holes 23 are all threaded holes. The joint 3 is selected from one of a quick water-stop joint, a pagoda joint, a ferrule joint, and a quick-connect joint with a standard thread.

[0081] The arrangement of the microstructural rib columns 11 is a straight row type or a staggered type; The coverage size of the microstructural rib columns 11 is greater than or equal to the size of the integrated heat dissipation top cover of the chip.

[0082] Please refer to Figures 9 to 11 The shape characteristics of the shown microstructural rib columns 11 are selected from a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape according to the applicable situation.

[0083] When the shape feature of the microstructural rib column 11 is an umbrella shape, the umbrella structure is divided into two parts: a head structure and a root structure. The head structure and the root structure can be the same or different, and are each selected from one or more of the shapes of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape, etc.

[0084] The circumcenter of the horizontal projection contour of the root structure and the head structure of the umbrella structure can be coincident or misaligned according to design requirements; define R1 as the radius of the circumcircle of the horizontal projection contour of the root structure, and R2 as the radius of the circumcircle of the horizontal projection contour of the head structure. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2; the ratio of the circumcircle radius size R1 of the root structure to the circumcircle radius size R2 of the head structure is 0.1 to 10, and the height ratio of the root structure to the head structure can be adjusted to any value according to design requirements.

[0085] The height ratio of the microstructural rib column 11 to the heat exchange cavity is 0 to 1.

[0086] The microstructural rib column 11 is a solid rib column covering the rib column capillary structure 111, and the percentage of the thickness of the rib column capillary structure 111 in the total thickness of the microstructural rib column 11 is 0% to 100%; when the thickness ratio of the rib column capillary structure 111 is 0%, the microstructural rib column 11 is a completely solid rib column; when the thickness ratio of the rib column capillary structure 111 is 100%, the microstructural rib column 11 is composed of a completely porous capillary structure.

[0087] When the shape feature of the microstructural rib column 11 is an umbrella shape, an additional layer of gap capillary structure 112 is covered around its root structure.

[0088] The bottom surface 12 of the rib column is covered with a bottom surface capillary structure 121; when the thickness of the bottom surface capillary structure 121 is zero, the bottom surface 12 of the rib column is a smooth metal surface.

[0089] The rib column capillary structure 111, the gap capillary structure 112, and the bottom surface capillary structure 121 are all porous capillary structures; the composition method of the porous capillary structure is selected from one of the metal powder sintering method, the metal wire sintering method, or the mixed sintering method of metal powder and metal wire, and the thickness of the porous capillary structure at different positions or regions is adjusted non-uniformly according to design requirements.

[0090] The materials of the heat dissipation cold plate 1, the cover plate 2, and the joint 3 are selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic, or glass; the sealing gasket 4 is selected from one of rubber, silica gel, fluororubber, or plastic.

[0091] The cooling medium of the chip radiator is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils or fluorinated liquids.

[0092] The basic application principle of the chip radiator is as follows: The low-temperature cooling medium enters the heat exchange cavity composed of the heat dissipation cold plate 1 and the cover plate 2 through one side joint 1 and undergoes boiling heat exchange, taking away the heat conducted from the high-temperature chip to the micro-channel cold plate 1, and is discharged to the external circulation pipeline through the other side joint 1.

[0093] Embodiment 2

[0094] Please refer to Figures 12 - 13 As shown, the difference between this embodiment and Embodiment 1 is that the connection method between the joint 3 and the cover plate 2 is a welded connection, and the connection method between the heat dissipation cold plate 1 and the cover plate 2 is also a welded connection. The purpose of doing this is to simplify the structure of the radiator and improve the reliability of the connection between components. The overall combination of the heat dissipation cold plate 1, the cover plate 2 and the joint 3 can be completed through one-time vacuum welding or welding in a protective atmosphere.

[0095] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the technical content disclosed above to make changes or modifications into equivalent embodiments with equivalent changes. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution content of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A phase change type chip radiator, characterized in that Comprising: A cover plate (2), the cover plate (2) is provided with a heat exchange cavity groove (24), and a pair of cover plate through holes (23) communicated with the heat exchange cavity groove (24), and a cold plate positioning groove (27) is arranged along the periphery of the heat exchange cavity groove (24); A heat dissipation cold plate (1), the heat dissipation cold plate (1) abuts against the cold plate positioning groove (27), and the space between the heat dissipation cold plate (1) and the heat exchange cavity groove (24) forms a heat exchange cavity, and a heat dissipation enhancement structure is arranged on the side wall of the heat dissipation cold plate (1) in the heat exchange cavity; A pair of connectors (3), the pair of connectors (3) are respectively connected with the pair of cover plate through holes (23) for connecting the heat exchange cavity with an external circulation pipeline.

2. The phase change type chip radiator according to claim 1, characterized in that The heat dissipation enhancement structure includes a plurality of microstructural rib columns (11) arranged in an array on the heat dissipation cold plate (1); the array arrangement of the plurality of microstructural rib columns (11) is a straight row array arrangement or an interleaved array arrangement.

3. The phase change type chip radiator according to claim 2, characterized in that, The shape of the microstructural rib column (11) is selected from one or more of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape or an umbrella shape.

4. The phase change type chip radiator according to claim 3, characterized in that, When the shape of the microstructural rib column (11) is an umbrella shape, it includes a root part and a head part arranged on the heat dissipation cold plate (1) from the inside out.

5. The phase change type chip radiator according to claim 4, characterized in that, The root part and the head part have the same or different structures, and are both selected from one or more of a rectangular cross-section column, a rectangular cross-section cone, a rectangular cross-section frustum, a trapezoidal column, a trapezoidal cone, a trapezoidal frustum, a parallelogram column, a parallelogram cone, a parallelogram frustum, a triangular column, a triangular cone, a triangular frustum, a circular column, a circular cone, a circular frustum, an elliptical column, an elliptical cone, an elliptical frustum, a hemispherical shape.

6. The phase change type chip radiator according to claim 4, wherein The circumferential centers of the horizontal projection contours of the root part and the head part coincide or are offset. Denote the circumradius of the horizontal projection contour of the root part as R1, and the circumradius of the horizontal projection contour of the head part as R2. The ratio of R1 to R2 is 0.1 to 10; when the root part and the head part are offset, the offset distance is less than or equal to the sum of R1 and R2.

7. The phase change type chip radiator according to claim 4, characterized in that, When the shape of the microstructural rib column (11) is an umbrella shape, a gap capillary structure (112) is covered around its root part.

8. The phase change type chip radiator according to claim 2, characterized in that, The height ratio of the microstructural rib column (11) to the heat exchange cavity is 0 to 1.

9. The phase change type chip radiator according to claim 2, wherein The microstructural rib column (11) is a solid rib column covered with a rib column capillary structure (111), and the percentage of the thickness of the rib column capillary structure (111) in the total thickness of the microstructural rib column (11) is 0% to 100%; When the capillary thickness ratio of the rib column capillary structure (111) is 0%, the microstructural rib column (11) is a completely solid rib column; when the thickness ratio of the rib column capillary structure (111) is 100%, the microstructural rib column (11) is composed of a completely porous capillary structure.

10. The phase-change type chip radiator according to claim 1, characterized in that, The side wall of the area of the heat dissipation cold plate (1) located in the heat exchange cavity is also covered with a bottom surface capillary structure (121).

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