Electrical connection structure and electrical connection method
By adopting groove and raised structure design in the electrical connection structure, the contact area and stability are increased, and the problems of instability and low space utilization of traditional gold finger connection methods are solved, thereby achieving higher electrical connection reliability and space optimization.
Patent Information
- Application Number
- CN202410089435.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-22
- Publication Date
- 2025-07-22
Smart Images
Figure CN120357201A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of electrical connection, and particularly relates to an electrical connection structure and an electrical connection method. Background Art
[0002] In the design and manufacture of traditional electronic devices, the gold finger wire bonding connection method is a commonly used technology for establishing electrical connections between circuit boards and other components. This connection method involves using gold fingers - usually thin sheets made of gold or other conductive materials - to achieve electrical connections. Gold fingers are favored for their good electrical conductivity and corrosion resistance. However, the contact area of gold fingers is relatively small, which to a certain extent limits the stability and reliability of electrical connections. A small contact area means that the path for current to pass through is restricted, which may lead to unstable connections, especially when the electronic device is subjected to physical vibrations. This instability is a significant drawback for electronic devices that require high reliability. Secondly, the use of gold fingers requires reserving a certain amount of wiring space on the surface of the circuit board. This space occupation limits the utilization rate of the outer layer of the circuit board to a certain extent, especially in the design of modern electronic products that pursue high-density wiring and miniaturization. In applications with limited space, the traditional gold finger wire bonding method may no longer be the most ideal choice. In addition, the small contact area of gold fingers and the requirement for wiring space also pose challenges in the production process. Ensuring the correct and firm connection of each gold finger to the corresponding component requires fine process control, which not only increases the complexity of production but also raises the production cost. Summary of the Invention
[0003] To solve the above deficiencies of the prior art, the present application provides an electrical connection method.
[0004] In addition, the present application also provides an electrical connection structure.
[0005] An electrical connection method includes the steps of: providing a groove on a first connection board; providing a first electrical connection pad in the groove; providing a protrusion on a second connection board; providing a second electrical connection pad on the protrusion; and inserting the protrusion into the groove so that the first electrical connection pad contacts and electrically conducts with the second electrical connection pad.
[0006] In some possible embodiments, the method further includes the step of: providing a conductive adhesive between the first electrical connection pad and the second electrical connection pad.
[0007] In some possible embodiments, the step of "providing a groove in the first connection board" includes: providing a first base mother board, the first base mother board including a first insulator and a first inner circuit layer disposed outside the insulator. A first opening is formed through the first base mother board. A body to be removed is disposed within the first opening. A first side mother board is disposed on the first base mother board, the first side mother board covering the body to be removed, obtaining a first intermediate body, the first intermediate body having a dividing line that passes through the first side mother board and the body to be removed. The first intermediate body is cut along the dividing line, and the body to be removed is removed, obtaining the first connection board.
[0008] In some possible embodiments, the body to be removed is a pyrolytic colloid, and the step of "disposing the body to be removed within the first opening" includes: heating the body to be removed.
[0009] In some possible embodiments, the first inner circuit layer is exposed in the groove, and the step of "disposing a first electrical connection pad in the groove" includes: electroplating in the groove to form the first electrical connection pad, the first electrical connection pad connecting the first inner circuit layer.
[0010] In some possible embodiments, the first side mother board includes a first base material layer and a first copper foil layer, the first base material layer being disposed between the first copper foil layer and the first inner circuit layer, and the manufacturing method further includes the steps of: etching the first copper foil layer to form a first circuit layer. Disposing a first solder mask layer on the first circuit layer.
[0011] In some possible embodiments, the step of "providing a protrusion on the second connection board" includes: providing a second base mother board, the second base mother board including a second insulator and a second inner circuit layer disposed within the second insulator. A slot is formed in the second base mother board, the slot passing through the second inner circuit layer and a portion of the second insulator. A second opening is formed through the second base mother board, the second opening being located at the bottom of the slot, the second opening passing through another portion of the second insulator, obtaining the second connection board, wherein the edge of the second opening and the edge of the slot are offset to form the protrusion.
[0012] In some possible embodiments, a portion of the second inner circuit layer is exposed in the slot, and the step of "disposing a second connection pad on the protrusion" includes: forming the second connection pad on the protrusion by electroplating. In some possible embodiments, the second base mother board further includes a second copper foil layer disposed outside the second insulator, and the electrical connection method further includes the steps of: etching the second copper foil layer to form a second circuit layer. Disposing a second solder mask layer on the second copper foil layer.
[0013] An electrical connection structure includes a first connection plate, a second connection plate, a first connection pad, and a second connection pad. The first connection plate includes a groove. The first connection pad is disposed in the groove. The second connection plate includes a bump. The second connection pad is disposed on the bump. The bump is inserted into the groove, and the first connection pad contacts the second connection pad and is electrically conductive.
[0014] Compared with the prior art, the electrical connection method provided in this application provides a larger contact area and a more stable current transmission path through the contact and electrical conduction between the first electrical connection pad and the second electrical connection pad, thereby significantly enhancing the stability and reliability of the connection. In addition, by designing the groove and protrusion structures, the space utilization rate of the electrical connection structure is optimized. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a cross-sectional schematic view of a first base mother board provided by an embodiment of this application.
[0016] Figure 2 is Figure 1 A cross-sectional schematic view of the first base mother board shown after setting a first opening.
[0017] Figure 3 is Figure 2 A cross-sectional schematic view of the first opening shown after setting a body to be removed.
[0018] Figure 4 is Figure 3 A cross-sectional schematic view of a first intermediate body obtained after respectively setting first side mother boards on both sides of the first base mother board shown.
[0019] Figure 5 is Figure 4 A cross-sectional schematic view of the first intermediate body shown after being cut along the dividing line.
[0020] Figure 6 is to remove Figure 5 A cross-sectional schematic view of the first connection plate obtained after removing the body to be removed shown to form a groove and setting a first electrical connection pad in the groove.
[0021] Figure 7 It is a cross-sectional schematic view of a second base mother board provided by an embodiment of this application.
[0022] Figure 8 is Figure 7 A cross-sectional schematic view of the second base mother board shown after setting a slot.
[0023] Figure 9 is Figure 8 A cross-sectional schematic view of the second base mother board shown after forming a protrusion by setting a second opening.
[0024] Figure 10 The Figure 9 cross-sectional schematic diagram of the second connection board obtained by providing a second electrical connection pad for the shown protrusion.
[0025] Figure 11 The Figure 10 cross-sectional schematic diagram of the second connection board shown after providing a second solder mask layer.
[0026] Figure 12 The Figure 6 cross-sectional schematic diagram of the first connection board shown connected to Figure 11 the second connection board shown.
[0027] Figure 13 The Figure 12 cross-sectional schematic diagram of the electrical connection structure obtained by providing electronic components on the first connection board and the second connection board shown.
[0028] Description of main component symbols
[0029] Electrical connection structure 100
[0030] First connection board 10
[0031] First substrate 11
[0032] First side plate 12
[0033] First base material layer 121
[0034] First copper foil layer 122
[0035] Groove 13
[0036] First base mother board 14
[0037] First insulator 141
[0038] First electrical connection structure 142
[0039] Embedded inner circuit 142a
[0040] First inner circuit layer 143
[0041] First opening 15
[0042] Body to be removed 20
[0043] First side mother board 16
[0044] First intermediate body 21
[0045] First circuit layer 131
[0046] First solder mask layer 132
[0047] The first electrical connection pad 22
[0048] The second connection plate 30
[0049] The second base mother board 31
[0050] The protrusion 46
[0051] The second base mother board 40
[0052] The second insulator 41
[0053] The second electrical connection structure 42
[0054] The second inner circuit layer 42a
[0055] The second copper foil layer 43
[0056] The slotted groove 44
[0057] The second opening 45
[0058] The second circuit layer 431
[0059] The second solder mask layer 432
[0060] The second electrical connection pad 50
[0061] The electronic component 60
[0062] The thickness direction A
[0063] The cutting line B
[0064] The following specific embodiments will further illustrate the present application in combination with the above-mentioned drawings. Specific embodiments
[0065] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.
[0066] An embodiment of the present application provides an electrical connection method, including the steps of:
[0067] S1: Please refer to Figures 1 to 6 , provide a first connection plate 10, the first connection plate 10 includes a first substrate 11 and first side plates 12 disposed on both sides of the first substrate 11. The end faces of the two first side plates 12 protrude from the end face of the first substrate 11, thereby forming a groove 13.
[0068] In this embodiment, the end faces of the two first side plates 12 are flush. It can be understood that in other embodiments of the present application, the end faces of the two first side plates 12 are not flush.
[0069] In this embodiment, please refer to Figures 1 to 6 , the manufacturing method of the first connecting plate 10 includes the steps of:
[0070] S11: Please refer to Figure 1 , provide a first base mother board 14, the first base mother board 14 includes a first insulator 141, a first electrical connection structure 142 and two first inner circuit layers 143. The first electrical connection structure 142 is disposed within the first insulator 141, and the two first inner circuit layers 143 are respectively disposed on opposite side surfaces of the first insulator 141.
[0071] In this embodiment, the material of the first insulator 141 includes at least one of polyimide (PI), liquid crystal polymer (LCP), phenolic epoxy resin (EP), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate glycol ester (PEN). The two first inner circuit layers 143 are both copper foil layers. Preferably, the material of the first insulator 141 is polyimide.
[0072] In this embodiment, the first electrical connection structure 142 includes a plurality of buried circuits 142a arranged at intervals and a first interlayer conductor (not shown in the figure) connected between two adjacent buried circuits 142a.
[0073] S12: Please refer to Figure 2 , penetrate a first opening 15 through the first base mother board 14, and the first opening 15 penetrates the first insulator 141, the first electrical connection structure 142, and the two first inner circuit layers 143.
[0074] In this embodiment, the first opening 15 is formed by laser drilling. In other embodiments of the present application, the first opening 15 is formed by mechanical drilling.
[0075] S13: Please refer to Figure 3, a body to be removed 20 is disposed within the first opening 15, and the body to be removed 20 is a pyrolytic colloid. It can be understood that in other embodiments of the present application, the material of the body to be removed 20 may also be a photocurable resin, a soluble filling material, a volatile material, or a material that is easily mechanically removed. The purpose of these material selections is to facilitate the removal of the body to be removed 20 through heating, light exposure, dissolution, or physical methods in subsequent steps, thereby leaving an accurate space or structure.
[0076] S14: Please refer to Figure 4 , the first side motherboards 16 are respectively disposed on two sides of the first base motherboard 14. The two first side motherboards 16 cover opposite ends of the body to be removed 20 to obtain a first intermediate body 21. Among them, the first intermediate body 21 has a thickness direction A and a cutting line B, the cutting line B is parallel to the thickness direction A, and the cutting line B passes through the first side motherboard 16 and the body to be removed 20.
[0077] In this embodiment, the first side motherboard 16 includes a first base material layer 121 and a first copper foil layer 122. The first base material layer 121 is disposed between the first copper foil layer 122 and the first inner circuit layer 143.
[0078] S15: Please refer to Figure 5 , the first intermediate body 21 is separated along the cutting line B to form two second intermediate bodies (not shown in the figure). Among them, the first base motherboard 14 is divided into two first baseboards 11, and each first side motherboard 16 is divided into two first sideboards 12. Each second intermediate body includes the first baseboard 11, the first sideboard 12, and a part of the body to be removed 20.
[0079] S16: Please refer to Figure 5 , the body to be removed 20 is removed to form the groove 13, and the first connecting plate 10 is obtained. Among them, the body to be removed 20 is removed by heating.
[0080] In this embodiment, please refer to Figure 6 , the manufacturing method of the first connecting plate 10 further includes the steps of:
[0081] S17: Etch the first copper foil layer 122 to form a first circuit layer 131. Specifically, the first copper foil layer 122 forms the first circuit layer 131 through the methods of dry film, exposure and development, and etching.
[0082] S18: A first solder mask layer 132 is provided on the first circuit layer 131. The material of the first solder mask layer 132 includes a polymer and an additive, and its main function is to protect the first circuit layer 131 from environmental factors such as air, moisture, and dust, prevent short circuits during the soldering process, provide insulation on the first circuit layer 131, and help identify the soldering area, thereby improving reliability.
[0083] S2: Please refer to Figure 6 , and a first electrical connection pad 22 is provided in the groove 13. The first electrical connection pad 22 is electrically connected to the first inner circuit layer 143. Specifically, the first electrical connection pad 22 is formed in the groove 13 by electroplating.
[0084] S3: Please refer to Figures 7 to 11 , and a second connecting plate 30 is provided. The second connecting plate 30 includes a second base mother board 31 and a protrusion 46. The protrusion 46 protrudes from the end face of the second base mother board 31.
[0085] In this embodiment, the manufacturing method of the second connecting plate 30 includes the steps:
[0086] S31: Please refer to Figure 7 , and a second base mother board 40 is provided. The second base mother board 40 includes a second insulator 41, a second electrical connection structure 42, and two second copper foil layers 43. The second electrical connection structure 42 is disposed in the second insulator 41. The two second copper foil layers 43 are respectively disposed on the opposite outer sides of the second insulator 41.
[0087] In this embodiment, the material of the second insulator 41 includes at least one of polyimide (PI), liquid crystal polymer (LCP), phenolic epoxy resin (EP), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate glycol ester (PEN). Preferably, the material of the second insulator 41 is polyimide.
[0088] In this embodiment, the second electrical connection structure 42 includes a plurality of second inner circuits 42a arranged at intervals and an interlayer conductor (not shown in the figure) connecting between two adjacent second inner circuit layers 42a.
[0089] S32: Please refer to Figure 8 , and slots 44 are respectively provided on opposite sides of the second base motherboard 40. The slots 44 penetrate through the second copper foil layer 43 and part of the second insulator 41. That is, the depth of the slots 44 is greater than the thickness of the second copper foil layer 43 and less than the thickness of the second insulator 41. The two slots 44 are oppositely arranged. Part of the second inner circuit layers 42a are exposed in the slots 44.
[0090] In this embodiment, the slots 44 are formed by laser drilling. In other embodiments of the present application, the slots 44 are formed by mechanical drilling.
[0091] S33: Please refer to Figure 9 , and a second opening 45 is provided through the second base motherboard 40, so that the second base motherboard 40 is divided into two second base motherboards 31. The second opening 45 communicates with the bottoms of the two slots 44, that is, the second opening 45 penetrates through another part of the second insulator 41. The side edges of the second opening 45 and the side edges of the slots 44 are staggered to form the protrusion 46, and the second connecting plate 30 is obtained.
[0092] In this embodiment, please refer to Figures 10 to 11 , the manufacturing method of the second connecting plate 30 further includes the steps of:
[0093] S34: Please refer to Figure 9 , and the second copper foil layer 43 is etched to form a second circuit layer 431. Specifically, the second copper foil layer 43 forms the second circuit layer 431 by means of dry film, exposure and development, and etching.
[0094] S35: Please refer to Figure 11 , and a second solder mask layer 432 is provided on the second circuit layer 431. The material of the second solder mask layer 432 is usually a special chemical material composed of a polymer and an additive. Its main function is to protect the second circuit layer 431 from environmental factors such as air, moisture, and dust, prevent short circuits during the welding process, provide insulation on the second circuit layer 431, and help identify the welding area, thereby improving reliability.
[0095] S4: Please refer to Figure 10, a second electrical connection pad 50 is provided on the protrusion 46, and the second electrical connection pad 50 is electrically connected to the second inner circuit layer 42a. Specifically, the second electrical connection pad 50 is formed on the protrusion 46 by electroplating.
[0096] S5: Please refer to Figure 12 , insert the protrusion 46 into the groove 13 so that the first electrical connection pad 22 contacts and is electrically connected to the second electrical connection pad 50, obtaining the electrical connection structure 100. Among them, the first inner circuit layer 143 is electrically connected to the second inner circuit layer 42a. The first circuit layer 131 and the second circuit layer 431 are flush.
[0097] In this embodiment, please refer to Figure 13 , the manufacturing method of the electrical connection structure 100 further includes the steps:
[0098] S6: A conductive adhesive (not shown in the figure) is provided between the first electrical connection pad 22 and the second electrical connection pad 50. The conductive adhesive is used for electrical connection and mechanical fixation, while ensuring good electrical conductivity and reliability of the first electrical connection pad 22 and the second electrical connection pad 50.
[0099] S7: Electronic components 60 are provided on the first circuit layer 131 and the second circuit layer 431. The electronic components 60 include capacitors, resistors, transistors, integrated circuits, etc., and are used to meet the functional and electrical performance requirements of the electrical connection structure 100.
[0100] Compared with the prior art, the electrical connection method provided by the present application has the following advantages:
[0101] (1) Enhanced electrical connection stability and reliability: Through the contact and electrical connection of the first electrical connection pad 22 and the second electrical connection pad 50, the electrical connection method of the present application provides a larger contact area and a more stable current transmission path compared with the traditional gold finger connection, thus significantly enhancing the stability and reliability of the connection.
[0102] (2) Improved space utilization: In the present application, by designing the groove 13 and protrusion 46 structures, the space utilization of the electrical connection structure 100 is optimized. This design enables the electrical connection structure 100 to achieve high-density surface wiring while maintaining miniaturization, which is particularly important for modern electronic product design.
[0103] In addition, an embodiment of the present application further provides an electrical connection structure 100, which includes a first connection plate 10, a second connection plate 30, a first electrical connection pad 22, and a second electrical connection pad 50. The first connection plate 10 includes a groove 13. The first electrical connection pad 22 is disposed in the groove 13. The second connection plate 30 includes a protrusion 46. The second electrical connection pad 50 is disposed on the protrusion 46. The protrusion 46 is inserted into the groove 13, and the first electrical connection pad 22 contacts the second electrical connection pad 50 and is electrically conducted. The electrical connection structure 100 provided by the embodiment of the present application has the advantages of compact structure, reliable electrical connection, and convenient installation and maintenance.
[0104] The above description is only a specific implementation manner of an optimization of the present application, but in the actual application process, it cannot be limited to this implementation manner. For those of ordinary skill in the art, other deformations and changes made according to the technical concept of the present application should fall within the protection scope of the present application.
Claims
1. An electrical connection method, characterized in that, Including the steps of: Providing a groove on a first connecting plate; Providing a first electrical connection pad within the groove; Providing a protrusion on a second connecting plate; Providing a second electrical connection pad on the protrusion, and Inserting the protrusion into the groove such that the first electrical connection pad contacts and electrically conducts with the second electrical connection pad.
2. The electrical connection method according to claim 1, wherein Further including the steps of: Providing a conductive adhesive between the first electrical connection pad and the second electrical connection pad.
3. The electrical connection method according to claim 1, characterized in that The step of "providing a groove on a first connecting plate" includes: Providing a first base motherboard, the first base motherboard including a first insulator and a first inner circuit layer provided on the outer side of the first insulator; Providing a first through hole through the first base motherboard; Providing a body to be removed within the first through hole; Providing a first side motherboard on the first base motherboard, the first side motherboard covering the body to be removed to obtain a first intermediate body, the first intermediate body having a dividing line passing through the first side motherboard and the body to be removed; Cutting the first intermediate body along the dividing line, and Removing the body to be removed to obtain the first connecting plate.
4. The electrical connection method according to claim 3, characterized in that, The body to be removed is a pyrolytic colloid, and the step of "providing a body to be removed within the first through hole" includes: Heating the body to be removed.
5. The electrical connection method according to claim 3, characterized in that The first inner circuit layer is exposed in the groove, and the step of "providing a first electrical connection pad within the groove" includes: Electroplating the groove to form the first electrical connection pad, the first electrical connection pad connecting the first inner circuit layer.
6. The electrical connection method according to claim 1, wherein The first side motherboard includes a first base material layer and a first copper foil layer, the first base material layer being provided between the first copper foil layer and the first inner circuit layer, and the electrical connection method further includes the steps of: Etching the first copper foil layer to form a first circuit layer; Providing a first solder resist layer on the first circuit layer.
7. The electrical connection method according to claim 1, characterized in that The step of "providing a protrusion on a second connecting plate" includes: Providing a second base motherboard, the second base motherboard including a second insulator and a second inner circuit layer provided within the second insulator; Providing a slot on the second base motherboard, the slot passing through the second inner circuit layer and part of the second insulator; Providing a second through hole through the second base motherboard, the second through hole being located at the bottom of the slot and passing through another part of the second insulator to obtain the second connecting plate, wherein the edge of the second through hole and the edge of the slot are offset to form the protrusion.
8. The electrical connection method according to claim 7, wherein, Part of the second inner circuit layer is exposed in the slot, and the step of "providing a second connection pad on the protrusion" includes: Forming the second connection pad on the protrusion by electroplating.
9. The electrical connection method according to claim 7, characterized in that, The second base motherboard further includes a second copper foil layer provided on the outer side of the second insulator, and the electrical connection method further includes the steps of: Etching the second copper foil layer to form a second circuit layer; Providing a second solder resist layer on the second copper foil layer.
10. An electrical connection structure, characterized in that, Including: A first connecting plate, the first connecting plate including a groove; A first connection pad, the first connection pad being provided in the groove; A second connecting plate, the second connecting plate including a bump A second connection pad, the second connection pad being provided on the bump; The bump is inserted into the groove, and the first connection pad contacts and electrically conducts with the second connection pad.