Preparation method of laser device

Abstract

The invention relates to a preparation method of a laser device, and relates to the technical field of laser, in the preparation method, a substrate and at least two light-emitting chips are firstly provided, then the light-emitting chips are arranged on the substrate based on the arrangement of target light spots, then a first optical element is arranged on the side, away from the substrate, of each light-emitting chip, and a second optical element is arranged on the side, away from the substrate, of each light-emitting chip. A second optical element is arranged on the side, away from the light-emitting chips, of the first optical element, the first optical element is provided with collimating lenses in one-to-one correspondence with the light-emitting chips, and the second optical element is provided with wave mirrors in one-to-one correspondence with the collimating lenses. The first optical element and the second optical element are integrally formed, so that the assembly of a collimating lens and the assembly of a wave lens are not needed, and the difficulty of an active alignment process during assembly is reduced. The first optical element and the second optical element which are integrally formed enable the laser device to be higher in integration level, better in consistency and more stable in structure, and meanwhile, the difficulty of batch production is reduced.

Description

Technical Field

[0001] This application relates to the field of laser technology, and particularly to a method for preparing a laser device. Background Art

[0002] Linear light spots can be applied in various fields such as laser processing, welding, optical detection, medical devices, etc.

[0003] When preparing traditional linear light spots, if multiple light spots need to be formed, multiple light-emitting chips and multiple optical elements need to be added. More parts will lead to complex assembly, a cumbersome process, and a greatly increased difficulty in the active alignment process during assembly, resulting in a higher cost. Summary of the Invention

[0004] Based on this, it is necessary to provide a method for preparing a laser device for a laser device with a large difficulty in the active alignment process.

[0005] To achieve the above object, the present invention provides a method for preparing a laser device, including:

[0006] Providing a substrate and at least two light-emitting chips;

[0007] Based on the arrangement of the target light spots, arranging the light-emitting chips on the substrate, with the target light spots corresponding to the light-emitting chips one by one;

[0008] Providing a first optical element formed integrally on the side of the light-emitting chip facing away from the substrate, the first optical element including at least two collimating lenses, with the collimating lenses corresponding to the light-emitting chips one by one;

[0009] Providing a second optical element formed integrally on the side of the first optical element facing away from the light-emitting chip, the second optical element including at least two wavy mirrors, with the wavy mirrors corresponding to the collimating lenses one by one.

[0010] In one embodiment, before arranging the light-emitting chips on the substrate based on the arrangement of the target light spots, it includes:

[0011] Determining the shape of the target light spot;

[0012] Based on the shape of the target light spot, determining the placement method of the corresponding light-emitting chip;

[0013] And installing the light-emitting chip on the substrate according to the placement method.

[0014] In one embodiment, before providing the first optical element on the side of the light-emitting chip facing away from the substrate, it includes:

[0015] Providing a first mold;

[0016] The first optical element is formed in one piece based on the first mold.

[0017] In one embodiment, providing a first mold includes:

[0018] Determining the line width and the first emission angle of the target light spot;

[0019] The first focal length of the collimating lens corresponding to the light emitting chip is calculated according to the line width, the distance between the collimating lens and the target light spot, and the short side width of the light emitting chip, wherein the calculation formula of the first focal length is: F=a×O / N, wherein F is the first focal length, N is the line width, θ is the first emission angle, a is the short side width of the light emitting chip, and O is the distance between the collimating lens and the target light spot;

[0020] A first distance between an orthographic projection of the optical axis position of the collimating lens on the substrate and an orthographic projection of the center of the light-emitting chip on the substrate is calculated according to the first emission angle and the first focal length, and a calculation formula for the first distance is: L=Ftanθ, where L is the first distance;

[0021] Determine the position of the corresponding collimating lens according to the first distance;

[0022] Determining the optical effective aperture of each of the collimating lenses;

[0023] A first mold is formed according to the optical effective aperture of the collimating lens, the first focal length, and the position of the collimating lens.

[0024] In one embodiment, determining the optical effective aperture of each of the collimating lenses comprises:

[0025] Determine a second spacing between the optical axes of two adjacent collimating lenses, where the second spacing satisfies 1≤K / D≤2, K>2tanα1×D, where K is the second spacing, D is the back focus of the collimating lens, and α1 is the light-emitting angle of the light-emitting chip.

[0026] In one embodiment, the first optical element further includes a first bracket surrounding the collimating lens, the first bracket includes a first sleeve portion, and the first sleeve portion is used to be nested with the second optical element.

[0027] In one embodiment, before the second optical element is provided on a side of the first optical element away from the light emitting chip, the method includes:

[0028] providing a second mold;

[0029] The second optical element is integrally formed based on the second mold.

[0030] In one embodiment, the providing of the second mold includes:

[0031] Determine the period and peak value of the wavy mirror corresponding to the light-emitting chip according to the field of view angle of the target light spot, where the field of view angle satisfies a proportional relationship between FOV and (A / T), where FOV is the field of view angle, T is the period, and A is the peak value;

[0032] Determine the surface profile of the wavy mirror according to the period and the peak value;

[0033] Determine a first included angle between the corresponding wavy mirror and the substrate based on the first emission angle of the target light spot, where the first emission angle is equal to the first included angle;

[0034] Determine the optical effective aperture of the wavy mirror according to the optical effective aperture of the collimating lens;

[0035] Form a second mold according to the surface profile of the wavy mirror, the optical effective aperture of the wavy mirror, and the first included angle, and form the second optical element integrally based on the second mold.

[0036] In one embodiment, after determining the surface profile of the wavy mirror according to the period and the peak value, it further includes:

[0037] Determine a second spacing between the wavy mirror and the light-emitting chip, where the second spacing satisfies X > 2T / tanα1, where X is the second spacing, α1 is the emission angle of the light-emitting chip, and T is the period of the wavy mirror.

[0038] In one embodiment, the second optical element further includes a second bracket surrounding the wavy mirror, and the second bracket has a second socket portion that is nested with the first socket portion of the first optical element.

[0039] Compared with the prior art, the above technical solution has the following advantages:

[0040] In this preparation method, a substrate and at least two light-emitting chips are first provided, and then the light-emitting chips are arranged on the substrate based on the arrangement of the target light spots. After that, a first optical element is arranged on the side of the light-emitting chip facing away from the substrate, and a second optical element is arranged on the side of the first optical element facing away from the light-emitting chip. The first optical element has collimating lenses corresponding to the light-emitting chips one by one, and the second optical element has wavy mirrors corresponding to the collimating lenses one by one. Since both the first optical element and the second optical element are integrally formed, there is no need to assemble the collimating lenses and the wavy mirrors anymore, which reduces the difficulty of the active alignment process during assembly. The integrally formed first optical element and second optical element make the laser device have a higher integration degree, better consistency, more stable structure, and at the same time reduce the difficulty of mass production. Description of the Drawings

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0042] Figure 1 It is a schematic diagram of the preparation process of a laser device provided by an embodiment of the present application;

[0043] Figures 2 - 4 It is a schematic diagram of the arrangement of target light spots provided by an embodiment of the present application;

[0044] Figure 5 It is a schematic diagram of the arrangement of light-emitting chips provided by an embodiment of the present application;

[0045] Figure 6 It is a schematic diagram of the relationship between a collimating lens, a light-emitting chip, and a target light spot provided by an embodiment of the present application;

[0046] Figure 7 It is a schematic cross-sectional structure diagram of setting three collimating lenses provided by an embodiment of the present application;

[0047] Figure 8 It is a schematic top view structure diagram of setting a structure of three collimating lenses provided by an embodiment of the present application;

[0048] Figure 9 It is a schematic structure diagram of the optical aperture of three collimating lenses provided by an embodiment of the present application;

[0049] Figure 10 It is a schematic structure diagram of a first optical element provided by an embodiment of the present application;

[0050] Figure 11Schematic cross-sectional structure diagram of a first optical element provided by an embodiment of the present application;

[0051] Figure 12 Schematic structure diagram of a structure with three wavy mirrors provided by an embodiment of the present application;

[0052] Figure 13 Schematic cross-sectional structure diagram of a structure with three wavy mirrors provided by an embodiment of the present application;

[0053] Figure 14 Schematic structure diagram of a second optical element provided by an embodiment of the present application;

[0054] Figure 15 Schematic structure diagram of the nesting of a first optical element and a second optical element provided by an embodiment of the present application.

[0055] Explanation of reference numerals: 01 - substrate; 02 - light-emitting chip; 10 - first optical element; 11 - collimating lens; 12 - first bracket; 12a - first socket part; 20 - second optical element; 21 - wavy mirror; 22 - second bracket; 22a - second socket part. Detailed implementation manners

[0056] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the description of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0058] It should be understood that when a layer is referred to as "on...", "adjacent to...", "connected to" another layer, it can be directly on the other layer, adjacent to it or connected to it, or there may be an intermediate layer. In contrast, when an element is referred to as "directly on...", "directly adjacent to..." or "directly connected to" another layer, there is no intermediate layer.

[0059] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising", "including" or "having", etc. specify the presence of the stated features, integers, steps, operations, components, parts or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts or combinations thereof.

[0060] In order to make the objectives, features and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0061] Reference Figure 1 , Figure 1 The present embodiment of the application provides a schematic diagram of the preparation process of a laser device; the preparation steps of the laser device are as follows:

[0062] Step S101: Provide a substrate 01 and at least two light-emitting chips 02.

[0063] In this step, at least two light-emitting chips 02 can be provided. For example, when two target light spots are required, two light-emitting chips 02 are provided; when three target light spots are required, three light-emitting chips 02 are provided. The number of light-emitting chips 02 required can be provided according to the required target light spots, and no specific limitation is made. The substrate 01 can be a power supply substrate 01 for supplying power to the light-emitting chips 02.

[0064] Step S102: Arrange the light-emitting chips 02 on the substrate 01 based on the arrangement of the target light spots, and the target light spots correspond to the light-emitting chips 02 one by one.

[0065] In this step, the target light spot can be a linear light spot. The target light spot can be arranged according to actual needs. Reference Figures 2 - 4 , Figures 2 - 4 The present embodiment of the application provides a schematic diagram of the arrangement of a target light spot. Reference Figure 5 , Figure 5 The present embodiment of the application provides a schematic diagram of the arrangement of a light-emitting chip. Figure 2 , Figure 3 And Figure 4 are examples in the present embodiment of the application, and can also be other required combined arrangement forms, and no specific limitation is made here. Based on the arrangement of the target light spots, the light-emitting chips 02 corresponding to the target light spots one by one are arranged on the substrate 01, so that the light spot shape of the formed laser device corresponds to the arrangement of the target light spots. For example, two target light spots arrange two light-emitting chips 02, and three target light spots arrange three light-emitting chips 02.

[0066] Step S103: On the side of the light-emitting chip 02 facing away from the substrate 01, a first optical element 10 formed integrally (as shown in Figure 15 is provided. The first optical element 10 includes at least two collimating lenses 11 (as shown in Figure 7 ), and the collimating lenses 11 correspond to the light-emitting chips 02 one by one.

[0067] In this step, the first optical element 10 includes collimating lenses 11 corresponding to the light-emitting chips 02 one by one (as shown in Figure 7 ). And since the first optical element 10 is formed integrally, the positions of the collimating lenses 11 are fixed and no additional assembly is required.

[0068] Step S104: On the side of the first optical element 10 facing away from the light-emitting chip 02, a second optical element 20 formed integrally (as shown in Figure 15 is provided. The second optical element 20 includes at least two wavy mirrors 21 (as shown in Figure 12 ), and the wavy mirrors 21 correspond to the collimating lenses 11 one by one.

[0069] In this step, the second optical element 20 includes wavy mirrors 21 corresponding to the collimating lenses 11 one by one. At this time, the light-emitting chips 02, the collimating lenses 11, and the wavy mirrors 21 correspond to each other one by one. Since the second optical element 20 is formed integrally, the positions of the wavy mirrors 21 are fixed and no additional assembly is required.

[0070] In this embodiment, since both the first optical element 10 and the second optical element 20 are formed integrally, no additional assembly of the collimating lenses 11 and the wavy mirrors 21 is required, reducing the difficulty of the active alignment process during assembly. The integrally formed first optical element 10 and second optical element 20 make the laser device have higher integration, better consistency, more stable structure, and at the same time reduce the difficulty of mass production.

[0071] In another embodiment of the present application, before step S102, it includes:

[0072] Step S1020: Determine the shape of the target light spot.

[0073] In this embodiment, the shape of the target light spot can be a linear light spot.

[0074] Step S1021: Based on the shape of the target light spot, determine the placement method of the corresponding light-emitting chip 02.

[0075] In this step, as shown in Figure 5As shown, the light-emitting region of the light-emitting chip 02 includes the width direction and the length direction, which can correspond to the line width of the linear light spot. At this time, the length direction of the light-emitting chip 02 can be placed in the same way as the length direction of the corresponding linear target light spot, and the width direction of the light-emitting chip 02 can be placed in the same way as the width direction of the corresponding linear target light spot, so as to ensure that the light-emitting chip 02 can form the corresponding target light spot in the length direction and the width direction after passing through the first optical element and the second optical element. When the target light spot includes multiple linear light spots, the placement method of each light-emitting chip 02 corresponds to the shape of the target light spot.

[0076] Step S1022: Place the light-emitting chip 02 on the substrate 01 according to the placement method (as Figure 5 shown).

[0077] In this step, the light-emitting chip 02 corresponding to the target light spot is installed on the substrate 01 according to the placement method. It should be noted that the shape of the target light spot is not specifically limited and can be designed according to needs. The installation position of the light-emitting chip 02 on the substrate 01 can be adjusted according to the shape of the target light spot.

[0078] In this embodiment, the placement method of the light-emitting chip 02 is set based on the target light spot, which can ensure that the light-emitting chip 02 can form the corresponding target light spot in the length direction and the width direction after passing through the first optical element and the second optical element.

[0079] In another embodiment of the present application, before step S103, it includes:

[0080] Step S113: Provide a first mold;

[0081] Step S123: Form the integrally formed first optical element 10 based on the first mold.

[0082] In this embodiment, to form the integrally formed first optical element 10, a first mold can be provided first. The first mold can be pre-designed according to the target light spot, and then the first mold is used for the processing of the first optical element 10. One-time molding does not require further assembly, reducing the active alignment process. Since the first optical element 10 is formed by injection molding based on the first mold, the difficulty of mass production can be reduced. The injection molding method usually designs a draft angle to facilitate demolding.

[0083] In another embodiment of the present application, refer to Figure 6 , Figure 6 which is a schematic diagram of the relationship between a collimating lens, a light-emitting chip, and a target light spot provided by an embodiment of the present application; refer to Figure 7 , Figure 7 which is a schematic cross-sectional structure diagram of a collimating lens provided by an embodiment of the present application with three collimating lenses, refer toFigure 8 , Figure 8 This is a top - view structural schematic diagram of a collimating lens structure with three provided by an embodiment of the present application. Step S113 includes:

[0084] Step S1131: Determine the line width N of the target light spot and the first emission angle θ (as Figure 6 shown);

[0085] Step S1132: Calculate the first focal length of the collimating lens 11 corresponding to the light - emitting chip 02 according to the line width, the distance between the collimating lens and the target light spot. The calculation formula for the first focal length is: F = a×O / N, where F is the first focal length, N is the line width, a is the short - side width of the light - emitting chip, and O is the distance between the collimating lens and the target light spot (as Figure 6 , Figure 8 shown);

[0086] Step S1133: Calculate the first distance between the positive projection of the optical axis position of the collimating lens 11 on the substrate 01 and the positive projection of the center of the light - emitting chip 02 on the substrate 01 according to the first emission angle θ and the first focal length F. The calculation formula for the first distance is: L = Ftanθ, where L is the first distance;

[0087] Step S1134: Determine the position of the corresponding collimating lens 11 according to the first distance L;

[0088] Step S1135: Determine the optical effective aperture of each collimating lens 11;

[0089] Step S1136: Form a first mold according to the optical effective aperture of the collimating lens 11, the first focal length F, and the position of the collimating lens 11.

[0090] In the above steps, to form the first mold, it is necessary to first confirm the required target light spot and design the first mold according to the target light spot, which can ensure the accuracy of the finally emitted target light spot.

[0091] The line width N of the target light spot, the short - side width a of the light - emitting chip, and the distance O between the collimating lens and the target light spot are all known quantities. According to the line width N of the target light spot, the short - side width a of the light - emitting chip, and the distance O between the collimating lens and the target light spot, calculate the first focal length F of the collimating lens 11, and then calculate the first distance L between the positive projection of the optical axis position of the collimating lens 11 on the substrate 01 and the positive projection of the center of the light - emitting chip 02 on the substrate 01 according to the first focal length F and the first emission angle θ. Each target light spot corresponds to a collimating lens 11, for example Figure 7As shown in the figure, there are light-emitting chip 1, light-emitting chip 2, and light-emitting chip 3. The distance between the orthographic projection of the center of light-emitting chip 1 on the substrate 01 and the orthographic projection of the optical axis position of the collimating lens 11 on the substrate 01 is L1, and the distance between the orthographic projection of the center of light-emitting chip 3 on the substrate 01 and the orthographic projection of the optical axis position of the collimating lens 11 on the substrate 01 is L3. As Figure 8 shown, the distance between the orthographic projection of the center of light-emitting chip 2 on the substrate 01 and the orthographic projection of the optical axis position of the collimating lens 11 on the substrate 01 is L2.

[0092] Based on the first distance L, the position of each collimating lens 11 can be determined. For example, the position of each collimating lens 11 is determined based on L1, L2, and L3.

[0093] After determining the position of the collimating lens 11, under the condition that the product of the width a of the light-emitting area of the light-emitting chip 02 and the distance O from the collimating lens to the target spot is equal to the product of the line width N and the first focal length F, that is, under the condition of a×O = N×F, continue to determine the optical effective aperture of each collimating lens 11.

[0094] Here, the optical effective aperture of the collimating lens 11 can be the area where the collimating lens 11 in the first mold can transmit light. For example, refer to Figure 9 , Figure 9 is a schematic structural diagram of the optical apertures of three collimating lenses provided by an embodiment of the present application. When there are three light-emitting chips 02, the optical effective aperture B1 of the first collimating lens 11 corresponding to the light-emitting chip 1 is smaller than the optical effective aperture B1' of the complete collimating lens 11, the optical effective aperture B2 of the second collimating lens 11 corresponding to the light-emitting chip 2 is equal to the optical effective aperture B2' of the complete collimating lens 11, and the optical effective aperture B3 of the third collimating lens 11 corresponding to the light-emitting chip 3 is smaller than the optical effective aperture B3' of the complete collimating lens 11. Such a design can improve the integration of the laser device while forming the target spot.

[0095] After that, a first mold is formed according to the optical effective aperture of the collimating lens 11, the first focal length F, and the position of the collimating lens 11. At this time, since the optical effective aperture of the collimating lens 11, the first focal length F, and the position of the collimating lens 11 are all confirmed based on the target spot, the formed first mold has a high accuracy. It should be noted that the material of the collimating lens 11 can be PC plastic.

[0096] In this embodiment, forming the first mold confirmed based on the target spot can reduce the difficulty of subsequent mass production and reduce the production cost.

[0097] In another embodiment of the present application, as Figure 7 shown, step S1135 includes:

[0098] Determine a second spacing between the optical axes of two adjacent collimating lenses 11, where the second spacing satisfies 1 ≤ K / D ≤ 2, K > 2tanα1×D, where K is the second spacing, D is the back focal length of the collimating lens 11, and α1 is the emission angle of the light-emitting chip 02;

[0099] Determine the optical effective aperture of the collimating lens 11 according to the second spacing K.

[0100] Specifically, when confirming the optical effective aperture of the collimating lens 11, in addition to confirming the size of the optical effective aperture, it is also necessary to confirm the second spacing K between the optical axes of two adjacent collimating lenses 11. For example Figure 7 As shown, K1 is the spacing between the optical axis of the collimating lens 11 corresponding to the light-emitting chip 1 and the optical axis of the collimating lens 11 corresponding to the light-emitting chip 2; K2 is the spacing between the optical axis of the collimating lens 11 corresponding to the light-emitting chip 2 and the optical axis of the collimating lens 11 corresponding to the light-emitting chip 3.

[0101] When confirming the second spacing K, the back focal length D of the collimating lens 11 will be used. For example Figure 7 As shown, the back focal lengths D of the collimating lenses 11 corresponding to the light-emitting chip 1, the light-emitting chip 2, and the light-emitting chip 3 are D1, D2, and D3 respectively. It should be noted that after the first focal length F of the collimating lens 11 is confirmed, the back focal length D will also be correspondingly confirmed. And when providing the light-emitting chip 02, the emission angle α1 of the light-emitting chip 02 is already fixed, so the second spacing K can be easily confirmed.

[0102] In this embodiment, confirming the second spacing K between the optical axes of two adjacent collimating lenses 11 can ensure that the light of the three chips does not interfere.

[0103] In another embodiment of the present application, refer to Figure 10 , Figure 10 is a schematic structural diagram of a first optical element provided by an embodiment of the present application. Refer to Figure 11 , Figure 11 is a schematic cross-sectional structure diagram of a first optical element provided by an embodiment of the present application. The first optical element 10 further includes a first bracket 12 surrounding the collimating lens 11. The first bracket 12 includes a first socket portion 12a, and the first socket portion 12a is used for nesting with the second optical element 20.

[0104] Specifically, the connection between the substrate 01 and the second optical element 20 also needs to be connected through the first bracket 12. The first bracket 12 and the substrate 01 can be connected by glue, and no specific limitation is made.

[0105] It should be noted that the first bracket 12 further includes a first socket portion 12a, which can be nested with the second optical element 20. The nesting method can achieve better fixation of the first optical element 10 and the second optical element 20, reducing the subsequent alignment process.

[0106] In this embodiment, the first bracket 12 and the collimating lens 11 are integrally formed, so the process of aligning after separately setting the bracket can be omitted. Moreover, due to the provision of the first socket portion 12a, the alignment of the first optical element 10 and the second optical element 20 is also more convenient, reducing costs.

[0107] In another embodiment of the present application, before step S104, it includes:

[0108] Step S114: Provide a second mold;

[0109] Step S124: Form the integrally formed second optical element 20 based on the second mold.

[0110] In this embodiment, to form the integrally formed second optical element 20, a second mold can be provided first. The second mold can be pre-designed according to the target light spot, and then the second optical element 20 is processed using the second mold. One-time forming eliminates the need for further assembly, reducing the active alignment process. Since the second optical element 20 is formed by injection molding based on the second mold, the difficulty of mass production can be reduced. The injection molding method usually designs a draft angle to facilitate demolding.

[0111] In another embodiment of the present application, refer to Figure 12 , Figure 12 which is a schematic structural diagram of a structure with three corrugated mirrors provided by an embodiment of the present application. Refer to Figure 13 , Figure 13 which is a schematic cross-sectional structural diagram of a structure with three corrugated mirrors provided by an embodiment of the present application. Step S114 includes:

[0112] Step S1141: Determine the period and peak value of the corrugated mirror 21 corresponding to the light-emitting chip 02 according to the field angle of the target light spot. The field angle FOV is directly proportional to (A / T), where FOV is the field angle, T is the period, and A is the peak value;

[0113] Step S1142: Determine the surface shape of the corrugated mirror 21 according to the period T and the peak value A;

[0114] Step S1143: Determine the first included angle between the corresponding corrugated mirror 21 and the substrate 01 based on the first emission angle θ of the target light spot, where the first emission angle θ is equal to the first included angle;

[0115] Step S1144: Determine the optical effective aperture of the wavy mirror 21 according to the optical effective aperture of the collimating lens 11;

[0116] Step S1145: Form a second mold according to the surface profile of the wavy mirror 21, the optical effective aperture of the wavy mirror 21, and the first included angle β, and form an integrally formed second optical element 20 based on the second mold.

[0117] In the above steps, the field of view angle of the target spot has been fixed when the target spot is confirmed and only needs to be obtained. Then, according to the field of view angle FOV of the target spot, confirm the period T and peak value A of the wavy mirror 21. At this time, it only needs to satisfy that the field of view angle FOV of the target spot is proportional to the peak value A / period T of the wavy mirror 21. The constant K can be set according to the needs of the target spot and is not specifically limited.

[0118] After that, the surface profile of the wavy mirror 21 can be determined according to the period and peak value. In one example, the surface profile equation of the wavy mirror 21 can be y = A×(1 - cos(2x / T×π)), where A is the peak value of the wavy mirror 21, T is the period of the wavy mirror, π is the pi, x is the horizontal direction coordinate value of the wavy mirror, and y is the vertical direction coordinate value of the wavy mirror.

[0119] After the surface profile is confirmed, it is also necessary to confirm the first included angle between the wavy mirror 21 and the plane where the substrate 01 is located. For example, Figure 12 as Figure 13 shown, the first included angle is β. Since the target spot has a first emission angle θ, when the light emitted by the light-emitting chip 02 passes through the first optical element 10, an angular offset will occur. Setting the first included angle β between the wavy mirror 21 and the plane where the substrate 01 is located equal to the first emission angle θ can correct the offset angle and ensure that the light emitted from the first optical element 10 is perpendicularly incident on the wavy mirror 21. In the second optical element 20, the surface of the wavy mirror 21 facing the air is a plane, and the surface facing the light-emitting chip 02 is a wavy surface profile.

[0120] The collimating lens 11 and the wavy mirror 21 are in one-to-one correspondence. Therefore, the optical effective aperture of the wavy mirror 21 can be determined according to the optical effective aperture of the collimating lens 11. For example, the optical effective aperture of each collimating lens 11 is the same as that of the corresponding wavy mirror 21. As Figure 12 as Figure 13 shown, when there are three target spots, there are also three wavy mirrors 21.

[0121] After that, determine the surface profile of the wavy mirror 21, the optical effective aperture of the wavy mirror 21, and the first included angle β to form a second mold. Since the surface profile of the wavy mirror 21, the optical effective aperture of the wavy mirror 21, and the first included angle β are all determined based on the target spot, the formed second mold has a high accuracy. It should be noted that the material of the wavy mirror 21 can be PC plastic.

[0122] In this embodiment, a second mold formed based on the target light spot and the collimating lens 11 can reduce the difficulty of subsequent mass production and reduce the production cost.

[0123] In another embodiment of the present application, after step S1142, it further includes:

[0124] Determine a second distance between the corrugated mirror 21 and the light-emitting chip 02, and the second distance satisfies X>2T / tanα1, where X is the second distance, α1 is the emission angle of the light-emitting chip 02, and T is the period of the corrugated mirror 21.

[0125] Specifically, after confirming the surface shape of the corrugated mirror 21, it is also necessary to confirm the second distance X between the corrugated mirror 21 and the light-emitting chip 02 to ensure that the laser emitted from the collimating lens 11 satisfies the parameters of the target light spot after passing through the corrugated mirror 21. For example, the laser emitted from the collimating lens 11 covers at least two periodic surface shapes on the surface of the corrugated mirror 21, that is, X>2T / tanα1.

[0126] In this embodiment, in order to obtain a target light spot with a specific intensity distribution, it is necessary to redistribute the intensity of the incident light. The corrugated mirror 21 adjusts each laser incident into a periodic surface shape, so that the light beams of multiple periods coincide in the far field, and a target light spot with a specific intensity distribution is obtained. Determining the second distance X between the corrugated mirror 21 and the light-emitting chip 02 can make the light intensity distribution of the target light spot more uniform.

[0127] In another embodiment of the present application, refer to Figure 14 , Figure 14 is a schematic structural diagram of a second optical element provided by an embodiment of the present application. Refer to Figure 15 , Figure 15 is a schematic structural diagram of the nesting of a first optical element and a second optical element provided by an embodiment of the present application. The second optical element 20 further includes a second bracket 22 surrounding the corrugated mirror 21. The second bracket 22 has a second socket part 22a, and the second socket part 22a is nested with the first socket part 12a of the first optical element 10.

[0128] Specifically, the connection between the first optical element 10 and the second optical element 20 can be connected by nesting. At this time, the second optical element 20 further includes a second bracket 22, and the second bracket 22 has a second socket part 22a. It should be noted that the first socket part 12a of the first optical element 10 and the second socket part 22a of the second optical element 20 need to be nested with each other. Therefore, the first socket part 12a can be set in the shape of a boss (such as Figure 10 shown), and the second socket part 22a is set in the shape of a concave platform (such as Figure 14 shown), so as to better achieve nesting (such asFigure 15 as shown

[0129] In one embodiment, the second socket part 22a further includes a clamping part 23 to facilitate the nesting of the first optical element 10 and the second optical element 20. The first socket part 12a of the first optical element 10 and the second socket part 22a of the second optical element 20 can be connected by glue or surge ultrasonic welding to ensure stable connection.

[0130] Since the clamping process position or reference plane is considered in the design of the first optical element 10 and the second optical element 20, it is convenient for subsequent manufacturing processes to be integrally formed. Only one set of molds needs to be opened during mass production, reducing the preparation cost.

[0131] In this embodiment, the second bracket 22 and the wavy mirror 21 are integrally formed, so the process of aligning after separately setting the bracket can be omitted. Moreover, due to the provision of the second socket part 22a, the alignment of the second optical element 20 and the first optical element 10 is also more convenient, reducing the cost.

[0132] It should be noted that since the alignment process has been carried out during the design of the mold to ensure the accuracy, there are no variables in the subsequent assembly process, significantly reducing the difficulty of the alignment process.

[0133] Based on the above embodiments, the present application also provides a specific laser device for preparation as an example.

[0134] The target spot of this embodiment includes three linear spots, one horizontal line and two vertical lines (as Figure 2 shown). Based on the target spot, the light-emitting chips 1, 2 and 3 as shown in Figure 7 and Figure 8 are arranged and installed on the substrate 01. The light-emitting chips 1, 2 and 3 respectively correspond to the three collimating lenses 11 in the first optical element 10, and the collimating lenses 11 collimate the light emitted by the light-emitting chip 02.

[0135] The light-emitting chips 1, 2 and 3 respectively correspond to the three wavy mirrors 21 of the second optical element 20, which stretch the light emitted by the light-emitting chip 02 and redistribute the intensity distribution. The surfaces of the three wavy mirrors 21 facing the air are flat, and the surfaces facing the light-emitting chip 02 are wavy. The inclination directions of the flat surfaces of the three wavy mirrors 21 are the same as the direction in which the light-emitting surface of the light-emitting chip 02 deviates from the optical axis.

[0136] The light-emitting chip 2 corresponds to a horizontal line. The horizontal line requires a field of view angle of FOV120°, a line width N < 5mm × 30cm, and a first emission angle θ of 12°. Based on the requirements of the horizontal line, it is calculated that the collimating lens 11 in the corresponding first optical element 10 satisfies 0.7 ≤ F2 / D2 ≤ 1.7, 4 ≤ F2 / L2 ≤ 5, and the wavy mirror 21 satisfies 0.5 ≤ A2 / T2 ≤ 1, 0.1 ≤ θ2 / ATAN(D2 / F2) ≤ 0.5.

[0137] The light-emitting chip 1 corresponds to a vertical line. The vertical line requires a field of view angle of FOV68°, a line width N < 8mm × 60cm, and a first emission angle θ of 35°. Based on the requirements of the vertical line, it is calculated that the collimating deflection mirror in the corresponding first optical element 10 satisfies 1.3 ≤ F1 / D1 ≤ 2.3, 0.5 ≤ F1 / L1 ≤ 2, and the wavy mirror 21 satisfies 0.1 ≤ A1 / T1 ≤ 0.5, 1 ≤ θ1 / ATAN(D1 / F1) ≤ 1.5. The light-emitting chip 3 is the same as the light-emitting chip 1, and will not be elaborated here.

[0138] Design the first mold of the first optical element 10 and the second mold of the second optical element 20 according to the calculated values, and then through mold injection molding, the required integrally formed first optical element 10 and second optical element 20 can be obtained. The injection molding method usually designs a draft angle to facilitate demolding.

[0139] The first optical element 10 and the second optical element 20 are prepared by an integrally formed method, and there is no need to assemble the collimating lens 11 and the wavy mirror 21 anymore, which reduces the difficulty of the active alignment process during assembly. Moreover, the integrally formed first optical element 10 and second optical element 20 make the laser device have a higher integration degree, better consistency, more stable structure, and at the same time reduce the difficulty of mass production.

[0140] In the description of this specification, the descriptions referring to terms such as "some embodiments", "another embodiment", etc. mean that the specific features, structures, materials or features described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0141] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0142] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patented application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A method for preparing a laser device, characterized in that, Including: Providing a substrate and at least two light-emitting chips; Arranging the light-emitting chips on the substrate based on the arrangement of target light spots, with the target light spots corresponding to the light-emitting chips one by one; Providing an integrally formed first optical element on a side of the light-emitting chip facing away from the substrate, the first optical element including at least two collimating lenses, with the collimating lenses corresponding to the light-emitting chips one by one; Providing an integrally formed second optical element on a side of the first optical element facing away from the light-emitting chip, the second optical element including at least two wavy mirrors, with the wavy mirrors corresponding to the collimating lenses one by one.

2. The preparation method of the laser device according to claim 1, characterized in that, Before arranging the light-emitting chips on the substrate based on the arrangement of target light spots, it includes: Determining the shape of the target light spot; Determining the placement method of the corresponding light-emitting chip based on the shape of the target light spot; And placing the light-emitting chip on the substrate according to the placement method.

3. The preparation method of the laser device according to claim 1, characterized in that, Before providing the first optical element on a side of the light-emitting chip facing away from the substrate, it includes: Providing a first mold; Forming the integrally formed first optical element based on the first mold.

4. The manufacturing method of the laser device according to claim 3, characterized in that, Providing the first mold includes: Determining the line width and the first emission angle of the target light spot; Calculating the first focal length of the collimating lens corresponding to the light-emitting chip according to the line width, the distance between the collimating lens and the target light spot, and the short side width of the light-emitting chip. The calculation formula for the first focal length is: F = a×O / N, where F is the first focal length, N is the line width, θ is the first emission angle, a is the short side width of the light-emitting chip, and O is the distance between the collimating lens and the target light spot; Calculating the first distance between the orthographic projection of the optical axis position of the collimating lens on the substrate and the orthographic projection of the center of the light-emitting chip on the substrate according to the first emission angle and the first focal length. The calculation formula for the first distance is: L = Ftanθ, where L is the first distance; Determining the position of the corresponding collimating lens according to the first distance; Determining the optical effective aperture of each collimating lens; Forming a first mold according to the optical effective aperture of the collimating lens, the first focal length, and the position of the collimating lens.

5. The method for preparing a laser device according to claim 4, wherein, Determining the optical effective aperture of each collimating lens includes: Determining the second distance between the optical axes of two adjacent collimating lenses, and the second distance satisfies 1≤K / D≤2, K>2tanα1×D, where K is the second distance, D is the back focal length of the collimating lens, and α1 is the emission angle of the light-emitting chip; Determining the optical effective aperture of the collimating lens according to the second distance.

6. The preparation method of the laser device according to claim 1, characterized in that, The first optical element further includes a first bracket surrounding the collimating lens, and the first bracket includes a first socket portion for nesting with the second optical element.

7. The manufacturing method of the laser device according to claim 1, characterized in that, Before providing the second optical element on a side of the first optical element facing away from the light-emitting chip, it includes: Providing a second mold; Forming the integrally formed second optical element based on the second mold.

8. The method for preparing a laser device according to claim 7, characterized in that, Providing the second mold includes: Determine the period and peak value of the corrugated mirror corresponding to the light-emitting chip according to the field of view angle of the target light spot, where the field of view angle satisfies a proportional relationship between FOV and (A / T), where FOV is the field of view angle, T is the period, and A is the peak value; Determine the surface shape of the corrugated mirror according to the period and the peak value; Determine a first included angle between the corresponding corrugated mirror and the substrate based on a first emission angle of the target light spot, where the first emission angle is equal to the first included angle; Determine the optical effective aperture of the corrugated mirror according to the optical effective aperture of the collimating lens; Form a second mold according to the surface shape of the corrugated mirror, the optical effective aperture of the corrugated mirror, and the first included angle, and form the second optical element integrally formed based on the second mold.

9. The preparation method of the laser device according to claim 8, characterized in that, After determining the surface shape of the corrugated mirror according to the period and the peak value, it further includes: Determine a second distance between the corrugated mirror and the light-emitting chip, where the second distance satisfies X>2T / tanα1, where X is the second distance, α1 is the emission angle of the light-emitting chip, and T is the period of the corrugated mirror.

10. The preparation method of the laser device according to claim 1, characterized in that, The second optical element further includes a second bracket surrounding the corrugated mirror, and the second bracket has a second socket portion, and the second socket portion is nested with the first socket portion of the first optical element.

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