Circuit board assembly and electronic device

Abstract

The present application provides a circuit board assembly and electronic device, comprising a board body and at least one chip. The board body comprises a first surface and a second surface relative to each other. The first surface comprises at least one chip area. Each chip is disposed on a corresponding chip area, and the power pins of its core area fan out through vias within the corresponding chip area. The board body is provided with a plurality of liquid cooling channels corresponding to the chips, and utilizes a cooling medium filled in the liquid cooling channels to quickly absorb the heat generated by the chips. The present application solves the problem of high integration and heat dissipation design difficulties in high-power chip-related circuit board assemblies and electronic devices, thereby improving the integration and miniaturization of circuit board assemblies and electronic devices and further reducing production costs.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] As electronic devices advance toward higher performance and higher integration, thermal management of printed circuit boards (PCBs) is becoming increasingly prominent in applications such as AI servers and data centers. Traditionally, PCB assembly heat dissipation relies on surface heat sinks or metal substrates, or fan modules are installed to blow air through the PCB assembly for cooling, or metal cold plates are installed above high-power chips (such as CPUs, GPUs, and power MOSFETs) to remove heat through the coolant flowing through the cold plate's fluid channels.

[0003] However, these existing heat dissipation methods have obvious limitations. For example, they have a single heat dissipation path, a complex structure, and a large space occupation. This makes it difficult to balance the compactness of electronic devices with high heat dissipation efficiency, hindering the miniaturization and high-density integration design of electronic equipment such as servers. Summary of the Invention

[0004] The present disclosure provides a circuit board assembly and an electronic device, the main purpose of which is to achieve the use requirements of compact structure and high heat dissipation efficiency of the circuit board assembly.

[0005] To achieve the above objectives, a first embodiment of the present application provides a circuit board assembly, comprising:

[0006] A plate body, the plate body comprising a first surface and a second surface opposite to each other, the first surface comprising a plurality of chip areas, each of the chip areas comprising a plurality of vias extending from the first surface toward one side of the second surface, the vias being filled with metal connecting portions;

[0007] A plate body, the plate body comprising a first surface and a second surface opposite to each other, the first surface comprising at least one chip area, each chip area comprising a plurality of vias extending from the first surface toward one side of the second surface, the vias being filled with metal connecting portions;

[0008] At least one chip is arranged on the chip area; a power pin is provided in the core area of ​​each chip, and the power pin is fanned out through the via hole in the corresponding chip area;

[0009] In which, a plurality of liquid cooling channels corresponding to each chip are also provided in the plate body, and the liquid cooling channels are spaced apart from each other in the first direction and extend along the second direction and pass through the plate body; wherein, the first direction is orthogonal to the second direction, and the orthogonal plane is parallel to the first surface.

[0010] Optionally, the diameters and / or quantities of the liquid cooling channels corresponding to the chips with different power thresholds are different.

[0011] Optionally, the apertures of the fan-out vias corresponding to the power pins of the chips with different power thresholds are different.

[0012] Optionally, the via hole includes at least one of a through hole and a blind hole.

[0013] Optionally, the vertical projection of the blind hole on the first surface completely or partially overlaps with the vertical projection of the liquid cooling channel on the first surface, and the vertical projection of the through hole on the first surface does not overlap with the vertical projection of the liquid cooling channel on the first surface.

[0014] Optionally, the chip includes at least one of a first chip, a second chip, and a third chip, whose power thresholds increase in sequence; wherein,

[0015] The apertures of the via holes corresponding to the fan-out of the first chip, the second chip and the third chip increase in sequence;

[0016] And / or, the diameters of the liquid cooling channels corresponding to the first chip, the second chip, and the third chip increase sequentially;

[0017] And / or, the numbers of the liquid cooling channels corresponding to the first chip, the second chip and the third chip increase sequentially.

[0018] Optionally, the aperture range of the via hole of the power pin of the first chip corresponding to the fan-out of the chip area is 0.2 mm to 0.25 mm;

[0019] And / or, the aperture range of the via hole of the power pin of the second chip corresponding to the fan-out of the chip area is 0.25 mm to 0.3 mm;

[0020] And / or, the aperture range of the via hole corresponding to the fan-out of the power pin of the third chip in the chip area is 0.3 mm to 0.35 mm.

[0021] Optionally, the number of the liquid cooling channels corresponding to the first chip is 2-3, and the diameter of each of the liquid cooling channels is 1 mm-1.3 mm;

[0022] And / or, the number of the liquid cooling channels corresponding to the second chip is 2-3, and the diameter of each of the liquid cooling channels is 1.3 mm-1.7 mm;

[0023] And / or, the number of the liquid cooling channels corresponding to the third chip is not less than 3, and the diameter of each of the liquid cooling channels is 1.7 mm to 2 mm.

[0024] Optionally, the distance between the centers of adjacent liquid channels in the first direction is not less than 4 mm.

[0025] Optionally, the plurality of liquid cooling channels respectively penetrate the plate body at both ends in the second direction and extend a first preset length toward a side away from the plate body, and the range of the first preset length is not less than 100 mm.

[0026] Optionally, the two sides of the plate body along the second direction also include a liquid inlet pipe and a liquid outlet pipe extending along the first direction, the liquid inlet pipe is connected to the inlet end of each liquid cooling channel, and the liquid outlet pipe is connected to the outlet end of each liquid cooling channel.

[0027] To achieve the above-mentioned purpose, a second embodiment of the present application proposes an electronic device, comprising a circuit board assembly according to any one of the above-mentioned items.

[0028] The circuit board assembly and electronic device provided by the present application include at least the following excellent effects:

[0029] The present application provides a circuit board assembly and electronic device, including a board body and at least one chip, the board body including a first surface and a second surface relative to each other, the first surface including at least one chip area, each chip being arranged on a corresponding chip area, and the power pins of its core area being fanned out through vias in the corresponding chip area. A plurality of liquid cooling channels corresponding to the chips are provided in the board body, and the heat generated by the chips is quickly absorbed by the cooling medium filled in the liquid cooling channels. Compared with the prior art, the present application eliminates the need to install an air-cooled radiator, a fan module or a liquid-cooled cold plate outside the circuit board assembly, which not only reduces the assembly size of the entire machine body, improves the integration and miniaturization of the circuit board assembly and the electronic device, but also further reduces the production cost of the circuit board assembly and the electronic device, and solves the technical problem of the high integration of electronic equipment related to high-power chips and the incompatibility of heat dissipation design.

[0030] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0032] Figure 1 1 is a schematic diagram of a top view of a circuit board assembly according to an embodiment of the present application;

[0033] Figure 2 1 is a schematic diagram of a three-dimensional structure of a circuit board assembly according to an embodiment of the present application;

[0034] Figure 3 Based on Figure 2 A schematic diagram of the longitudinal cross-section structure of a circuit board assembly taken along the AA section line;

[0035] Figure 4 Based on Figure 2 A schematic diagram of the longitudinal cross-section structure of another circuit board assembly taken along the AA section line;

[0036] Figure 5 This is a schematic top view of another circuit board assembly according to an embodiment of the present application.

[0037] Figure 6 This is a schematic structural diagram of an integrated liquid cooling assembly according to an embodiment of the present application.

[0038] 100 board body; 101 chip area; 110 via; 120 liquid cooling channel; 130 liquid inlet pipe; 140 liquid outlet pipe; 200 power chip; 201 core area; 210 first chip; 220 second chip; 230 third chip. DETAILED DESCRIPTION

[0039] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0040] As electronic devices develop towards high performance and high integration, the heat dissipation design of circuit board components is a key link in ensuring the operating performance, reliability and service life of their high-power chips. Especially in high-power density scenarios (AI servers, data centers, etc.), semiconductor chips are becoming more and more powerful and smaller in size. As a result, traditional circuit board component structures can no longer meet the heat dissipation requirements of semiconductor chips and electronic products, which limits the application needs of electronic equipment in high-power density scenarios.

[0041] Existing circuit board assemblies mainly rely on surface heat sinks or metal substrates for heat dissipation, or set a fan module on the outside of the circuit board assembly to blow air to the circuit board assembly through the fan module for air cooling and heat dissipation, or install a metal cold plate above the high-power chip to remove heat by the flow of coolant in the liquid flow channel inside the cold plate. However, these existing heat dissipation methods have obvious limitations. First, the heat dissipation path of the heat dissipation method that relies on surface heat sinks or metal substrates for heat dissipation is generally relatively single, which easily leads to the inability to quickly diffuse heat and the problem of low heat dissipation efficiency. Secondly, the thermal efficiency of conventional air-cooled heat dissipation is relatively limited, and the fan noise is relatively large, which not only takes up a large space in the entire system, but is also greatly affected by the environment. In addition, the liquid-cooled cold plate heat dissipation method is generally expensive, and the overall heat dissipation system is relatively complex, which cannot take into account the heat dissipation requirements between various power chips on the entire board. There is also a risk of leakage of heat-conducting liquid.

[0042] In other words, current PCB assembly heat dissipation designs often struggle to balance the compactness of electronic devices with high heat dissipation efficiency, hindering the miniaturization and high-density integration of electronic devices such as servers. Consequently, addressing the heat dissipation of high-power chips (such as DC-DC power converters, LDO linear regulators, CPUs, GPUs, and power MOSFETs) has become a key and challenging area of ​​research in PCB assembly structure design.

[0043] To address the aforementioned issues, the present application provides a circuit board assembly and electronic device that can adjust the size of the fan-out vias for the power pins of the chips on the board body, based on the heat dissipation requirements of the chips with different power thresholds on the circuit board assembly, thereby meeting the heat dissipation requirements of chips with different power thresholds. Furthermore, the present application also provides liquid cooling channels of varying sizes and / or quantities within the circuit board assembly, corresponding to the chips with different power thresholds.

[0044] In addition, compared with the existing technology, the circuit board assembly and electronic equipment provided by the present application eliminate the need to install an air-cooled radiator and fan or a liquid-cooled cold plate outside the circuit board during the assembly of the entire machine. This not only reduces the assembly size of the entire machine body, improves the integration of the circuit board assembly and electronic equipment, promotes the miniaturization of the circuit board assembly and electronic equipment, but also further reduces the production cost of the circuit board assembly and electronic equipment, and solves the current technical problem of the high integration of high-power chips and related electronic equipment being difficult to be compatible with the heat dissipation design.

[0045] According to one aspect of the present application, a circuit board assembly is provided, such as Figure 1As shown, the board includes a main plate body 100 and at least one chip 200. The main plate body 100 includes a first surface and a second surface facing each other. The first surface includes at least a chip area 101. Each chip area 101 includes multiple vias 110 extending from the first surface toward one side of the second surface. The vias 110 are filled with metal connectors (not shown). Each chip 200 is disposed on the first surface corresponding to the chip area 101. The core area 201 of each chip 200 is provided with an array of power pins. These power pins fan out through the vias in the corresponding chip area. The aperture diameters of the fan-out vias corresponding to the power pins of chips 200 with different power thresholds are different.

[0046] The board body 100 is typically made of multiple laminated circuit board layers. Each circuit board layer is equipped with multiple circuits to connect multiple circuits, forming various network structures. These network structures include conductive layers connected to vias. The chip 200 is mounted on the board body 100, and its power pins are connected to vias in the board body 100, allowing the conductive layer to supply power to the chip 200 through the vias and generating heat during operation.

[0047] It is understandable that, because the power of the chip 200 is positively correlated with the corresponding heat generated, the chips 200 with different power thresholds generate different amounts of heat per unit time, and the greater the power of the chip 200, the more heat it generates per unit time. Therefore, the present application adapts the apertures of the vias 110 in different chip regions 101 to the actual power threshold of the chip 200, and makes the apertures of the fan-out vias 110 corresponding to the power pins of the chips 200 with different power thresholds different, thereby meeting the heat dissipation requirements of the chips 200 with different power thresholds.

[0048] Because each via 110 is filled with a conductive metal connection, for example, using an electroplating fill process, the interior of the via 110 is fully filled to form solid copper. The metal connection composed of solid copper allows the power pin of the chip 200 to be electrically connected to the conductive layer of the board body 100 through the via 110, allowing the chip 200 to operate electrically and generate heat. At the same time, the heat generated by the operation of the chip 200 can be quickly transferred to the board body 100 or the second surface of the board body 100 through the solid copper in the via 110, thereby preventing heat accumulation between the chip 200 and the first surface. The larger the aperture of the via 110, the larger the size of the solid copper filling the via 110, and the stronger its thermal conductivity to the chip 200, thus ensuring the heat dissipation requirements of the chip 200.

[0049] It should be noted that the above-mentioned use of solid metal copper filled in the via 110 as the metal connection part is only an example. In other embodiments, the metal connection part can also be other metals or their alloys with excellent electrical conductivity and heat dissipation capabilities, including but not limited to metal elements or alloys such as gold, silver, aluminum, platinum, and tin.

[0050] In order to facilitate the heat generated by the chip 200 to be better discharged through the via 110, during the design process of the circuit board assembly, the fan-out of the power pin of the chip 200 can also adopt a hole-on-plate process, so that the power pin of the chip 200 can directly transfer heat to other areas of the board body 100 through the metal connection part in the via 110, further improving the heat dissipation efficiency of the chip 200.

[0051] like Figures 1 to 3 As shown, the panel body 100 is provided with a plurality of liquid cooling channels 120 on one side near the first surface, corresponding to each chip 200. A cooling medium is injected into each liquid cooling channel 120 to continuously dissipate heat transferred from the chip 200 to the interior of the panel body 100, thereby improving the heat dissipation of the chip and enhancing the electrical stability of the electronic device. The cooling medium may include, but is not limited to, cooling water, cooling oil, or liquid refrigerant at a relatively low temperature (e.g., 1°C to 5°C). The specific type of cooling medium is not limited in this embodiment of the present application.

[0052] For ease of expression, one side along the horizontal direction on the first surface of the plate body 100 can be set as the first direction, and one side along the vertical direction on the first surface can be set as the second direction. The first direction is orthogonal to the second direction, and the orthogonal plane is parallel to the first surface.

[0053] Therefore, the present application increases the contact area between the liquid cooling channel 120 and the plate body 100 by setting a plurality of liquid cooling channels 120 spaced apart from each other in the first direction and extending in the second direction and penetrating the plate body 100 in the plate body 100 corresponding to each chip area 101, so that the heat generated by the chip 200 mounted on each chip area 101 can be quickly absorbed and discharged by the cooling medium injected into the liquid cooling channel 120 with a directional flow when it is transferred to the plate body 100, thereby also ensuring the stability of the internal temperature of the plate body 100.

[0054] To improve the heat conduction efficiency of the liquid cooling channels 120 within the plate body 100, the liquid cooling channels 120 are positioned within the plate body 100 on a side close to the first surface of the plate body 100, bringing them closer to the chips 200 mounted on the corresponding chip area 101. Furthermore, while maintaining a certain thickness for the plate body 100, the larger the diameter of the liquid cooling channels 120 and the greater the number of liquid cooling channels 120 within the corresponding chip area 101, the greater their heat conduction capacity to the chips 200, thereby better ensuring the heat dissipation requirements of the chips 200.

[0055] In order to facilitate the heat generated by the chip 200 to be better absorbed and discharged by the liquid cooling channel 120, the present application also adapts the diameter and number of each liquid cooling channel 120 corresponding to different chips to the actual power threshold of the chip 200 according to the actual power threshold of the chip 200, and makes the diameters of the liquid cooling channels 120 corresponding to different chips 200 different, and the setting numbers are the same or different. For example, the setting number of liquid cooling channels 120 increases adaptively with the increase of the power threshold of the chip 200, thereby meeting the heat dissipation requirements of different chips 200.

[0056] As an example, Figures 1 to 4 As shown, the chips 200 with different power thresholds include at least one of a first chip 210, a second chip 220, and a third chip 230. The power threshold of the first chip 210 is 20W-50W, the power threshold of the second chip 220 is 50W-100W, and the power threshold of the third chip 230 is greater than 100W.

[0057] like Figure 1 As shown, since the power thresholds of the first chip 210, the second chip 220, and the third chip 230 increase in sequence, and the power level of the chip 200 is positively correlated with the heat generated by the chip 200, the apertures of the fan-out vias 110 corresponding to the power pins of the first chip 210, the second chip 220, and the third chip 230 also increase in sequence. For example, the apertures of the fan-out vias 110 corresponding to the power pins of the first chip 210 range from 0.2mm to 0.25mm, preferably 0.2mm; the apertures of the fan-out vias 110 corresponding to the power pins of the second chip 220 range from 0.25mm to 0.3mm, preferably 0.25mm; and the apertures of the fan-out vias 110 corresponding to the power pins of the third chip 230 range from 0.3mm to 0.35mm, preferably 0.3mm.

[0058] Similarly, if Figure 1 and Figure 3As shown, since the power thresholds of the first chip 210, the second chip 220, and the third chip 230 increase in sequence, and the power level of the chip 200 is positively correlated with the heat generated by the chip 200, the number and / or diameter of the liquid-cooling channels 120 corresponding to the first chip 210, the second chip 220, and the third chip 230 are different. For example, the number of liquid-cooling channels 120 corresponding to the first chip 210 is 2 to 3, and the diameter of each liquid-cooling channel 120 is in the range of 1 mm to 1.3 mm, preferably 1 mm; the number of liquid-cooling channels 120 corresponding to the second chip 220 is 2 to 3, and the diameter of each liquid-cooling channel 120 is in the range of 1.3 mm to 1.7 mm, preferably 1.5 mm; the number of liquid-cooling channels 120 corresponding to the third chip 230 is not less than 3, and the diameter of each liquid-cooling channel 120 is in the range of 1.7 mm to 2 mm, preferably 2 mm.

[0059] like Figure 1 、 Figure 3 and 4 As shown, in order to further improve the heat dissipation capacity of the first chip 210, the second chip 220, and the third chip 230, the apertures of the power pin fan-out vias 110 of the first chip 210, the second chip 220, and the third chip 230 are sequentially increased, while the number and / or diameter of the corresponding liquid cooling channels 120 provided in the plate body 100 are also configured to be sequentially increased. As a result, the solid copper metal connecting portions within the different vias 110 quickly conduct the heat generated by the corresponding power devices and continuously transfer it into the plate body 100. At the same time, the liquid cooling channels 120 in the corresponding position areas further absorb and conduct the heat transferred to the plate body through the cooling medium moving directionally therein, thereby ensuring the continuous stability of the internal temperature of the plate body 100.

[0060] That is to say, the above-mentioned heat dissipation method of setting up a liquid cooling channel 120 in the plate body 100, and the above-mentioned heat dissipation method of differentially designing the size of the power pin fan-out via 110 of the chip 200 on the plate body, the two heat dissipation methods can be applied independently to the circuit board assembly to improve the heat dissipation efficiency of the chip 200, or the two methods can be combined with each other to further enhance the heat dissipation effect of the chip 200. This application does not make specific restrictions on the design selection of the specific heat dissipation method of the circuit board assembly.

[0061] At the same time, since the present application sets a liquid cooling channel 120 in the board body 100, and / or specifically differentiates the size of the internal power pin fan-out via 110 of the chip 200 on the board body 100, the overall heat dissipation effect of the circuit board assembly can be greatly improved, and there is no need to set a fan module outside the circuit board assembly for air cooling and heat dissipation, which avoids increasing the size of the electronic device and is conducive to the miniaturization and compact design of the circuit board assembly and the corresponding electronic equipment.

[0062] Since the liquid cooling channels 120 are embedded in the plate body 100, the number and diameter of the liquid cooling channels 120 corresponding to each chip area 101 need to be subject to certain restrictions. An overly dense arrangement of the liquid cooling channels 120 will affect the normal fan-out of the power supply or signal routing of the chip 200. Liquid cooling channels 120 with too large a diameter will also cause the thickness of the plate body 100 to increase, or make it difficult to press the plate body 100 together, resulting in a decrease in the production yield of the plate body 100.

[0063] Therefore, the outer diameter of the liquid cooling channel 120 can be set to no greater than 2 mm, so that the thickness of the finished plate body 100 can be approximately 3 mm, thereby improving the production yield of the plate body 100 and reducing production costs. At the same time, the wall thickness of the liquid cooling channel 120 can be set to 0.3 mm. This design prevents the liquid cooling channel 120 from becoming too large when the liquid cooling medium flows through the liquid cooling channel 120, which could cause the liquid cooling channel 120 to crack and the plate body 100 to bulge.

[0064] In addition, the number of liquid cooling channels 120 corresponding to the chip area 101 can also be flexibly set according to the spacing distance between adjacent liquid cooling channels 120 in the first direction. For example, the center spacing between adjacent liquid cooling channels 120 in the first direction is set to no less than 4 mm to ensure the electrical connection or signal connection between the chip 200 and the plate body 100.

[0065] It should be noted that the aforementioned configuration of different apertures of vias 110 within chip area 101 applies only to the power vias fanned out corresponding to the power pins of chip 200, and not to other signal vias outside the power pins of chip 200. In other words, the apertures of the signal vias in chip area 101 corresponding to the signal areas outside the power pins of chip 200 remain unchanged, for example, using 0.2mm signal via fan-out routing.

[0066] Since the liquid cooling channel 120 penetrates the plate body 100 along the second direction and corresponds to the setting position of the chip area 101 in the direction perpendicular to the first surface, the drilling positions of some vias 110 may overlap with the setting positions of the cooling tubes. If the drilling depth of the vias 110 is not restricted, the liquid cooling channel 120 pre-embedded in the plate body 100 will be drilled through during the drilling process of the vias 110, resulting in leakage of the cooling medium in the liquid cooling channel 120 during the subsequent application of the circuit board assembly, or the vias 110 may contact the tube body or cooling medium of the liquid cooling channel 120, resulting in the risk of short circuit of the chip 200.

[0067] Therefore, according to the setting position of the liquid cooling channel 120, the actual type of the via 110 within each chip area 101 may include a blind hole. Since the vertical projection of the power pin of the chip 200 in the direction perpendicular to the first surface may completely overlap or partially overlap with the vertical projection of the liquid cooling channel 120 on the first surface, this part of the power pin needs to be fanned out using a blind hole with a relatively shallow depth. Among them, the blind hole can be drilled at the corresponding position of the first surface using a depth-controlled drilling process that accurately controls the depth of the blind hole to avoid the blind hole penetrating the liquid cooling channel 120. Correspondingly, the vertical projection of the blind hole in the direction perpendicular to the first surface also completely overlaps or partially overlaps with the vertical projection of the liquid cooling channel 120 on the first surface.

[0068] Depending on the placement of the liquid-cooling channels 120, the actual type of vias 110 within each chip area 101 also includes through-holes. Because the vertical projection of the through-holes in a direction perpendicular to the first surface does not overlap with the vertical projection of the liquid-cooling channels 120 on the first surface, the through-holes can extend from the first surface to the second surface of the plate body 100, vertically penetrating the plate body 100. As a result, heat dissipated by the chips 200 can be conducted to the second surface of the plate body 100 via the metal connections filled in the through-holes, where it is exposed to the outside air, further facilitating convection heat dissipation with the air.

[0069] Furthermore, a thermally conductive copper sheet (not shown in the figure) is provided on the second surface corresponding to the position of the chip area 101. The thermally conductive copper sheet is in contact with the bottom of the through hole, so that the heat generated by the subsequent chip 200 can also be conducted to the thermally conductive copper sheet through the metal connection portion filled in the through hole. The heat is conducted to the air by the thermally conductive copper sheet with a larger surface area, further improving the heat dissipation efficiency of the via 110 for the chip.

[0070] In addition, since the plate body 100 is usually formed by pressing together multiple circuit boards, during the design and preparation process of the plate body 100, liquid cooling channels 120 of different sizes need to be pressed between two relative circuit boards according to the designed coordinate positions, so that the different chip areas 101 of the pressed plate body 100 can correspond to the liquid cooling channels 120 of different sizes.

[0071] Before the liquid cooling channel 120 is electrically pressed together with the circuit board to form the board body 100, the ends of the liquid cooling channel 120 must be sealed to prevent chemical liquids from etching and plating processes during PCB board production from entering the liquid cooling channel 120 and causing problems such as blockage. After the liquid cooling channel 120 is electrically pressed together with the circuit board to form the board body 100, the vias 110 are drilled into the board body 100 according to the designed coordinate positions.

[0072] Furthermore, if Figure 5 As shown, the plate body 100 further includes a liquid inlet pipe 130 and a liquid outlet pipe 140 extending along the first direction on both sides along the second direction, and the liquid inlet pipe 130 is connected to the inlet end of each liquid cooling channel 120, and the liquid outlet pipe 140 is connected to the outlet end of each liquid cooling channel 120. The liquid cooling medium can flow into each liquid cooling channel 120 through the liquid inlet pipe 130 in turn, and then flow out through the liquid outlet pipe 140, so that the cooling medium can flow in a direction in the liquid cooling channel 120, and the heat transferred to the plate body 100 can be quickly discharged.

[0073] In order to ensure the normal connection between the inlet end of the liquid cooling channel 120 and the liquid inlet pipe 130, and between the outlet end of the liquid cooling channel 120 and the liquid outlet pipe 140, each liquid cooling channel 120 should extend through the plate body 100 at both ends along the second direction, and then extend to the side away from the plate body 100 by a first preset length, so that the liquid inlet pipe 130 and the liquid outlet pipe 140 can be connected to the inlet end and outlet end of each liquid cooling channel 120 respectively.

[0074] As an example, the inlet end and the outlet end of each liquid cooling channel 120 extend toward a side away from the plate body 100 by a preset length ranging from 80 mm to 120 mm.

[0075] As an example, a brazing process can be used to connect the inlet and outlet ends of each liquid cooling channel 120 of different diameters to the liquid inlet pipe 130 and the liquid outlet pipe 140. Since the brazing process has a temperature range of 700°C to 750°C, which exceeds the wave soldering or reflow soldering temperature of other components on the circuit board assembly, to prevent components from falling off the circuit board assembly during the soldering of the liquid cooling channel 120 to the liquid inlet pipe 130 and the liquid outlet pipe 140, during the preparation of the circuit board assembly, the liquid inlet pipe 130 and the liquid outlet pipe 140 must be soldered to the liquid cooling channel 120 first, and then other components on the circuit board assembly must be soldered.

[0076] At the same time, in order to meet the total flow demand of the liquid cooling medium in the liquid cooling channel 120 in the plate body 100, and at the same time, to facilitate the minimization of the system assembly thickness of the subsequent circuit board assembly, while taking into account the structural compactness of the circuit board assembly, the outer diameter of the liquid inlet pipe 130 and the liquid outlet pipe 140 arranged at both ends of the plate body 100 along the second direction needs to be greater than the plate thickness of the plate body 100, and less than the sum of the thickness of the plate body 100 and the maximum thickness (height) of the devices connected to the plate body 100.

[0077] For example, when the thickness of the plate body 100 is 3 mm and the maximum thickness (height) of the components on the plate body 100 is 4 mm, the outer diameters of the liquid inlet pipe 130 and the liquid outlet pipe 140 range from 3 mm to 7 mm.

[0078] As an example, Figure 5 and 6 As shown, to save on the subsequent soldering process for the liquid inlet and outlet pipes 130 and 140, the liquid inlet and outlet pipes 130 and 140, along with the various liquid cooling channels 120 of varying diameters, can be directly designed and fabricated into a single, integrated liquid cooling assembly, depending on the design requirements of the PCB assembly. The entire liquid cooling assembly is then pressed into place within the board body 100, and finally, a milling cutter is used to remove the corresponding portions of the board body 100, exposing the liquid inlet and outlet pipes 130 and 140. This design does not affect the subsequent soldering and assembly of other components on the PCB assembly, eliminates a soldering step, and reduces the cost of PCB assembly production.

[0079] It should be noted that the integrated liquid cooling assembly in the above example requires that the outer diameters of the corresponding liquid inlet and outlet pipes 130 and 140 should be no larger than the thickness of the board body 100. This prevents the board body 100 from being difficult to press together, or from deforming the liquid inlet and outlet pipes 130 and 140 during pressing. Furthermore, the smaller outer diameters of the liquid inlet and outlet pipes 130 and 140 may result in insufficient total cooling medium flow within the liquid cooling assembly or risk a thicker circuit board design.

[0080] Therefore, if the liquid cooling medium in the liquid inlet pipe 130 and the liquid outlet pipe 140 is less than the sum of the liquid cooling medium flow rates of all the liquid cooling channels 120 in the circuit board, the liquid inlet pipe 130 and the liquid outlet pipe 140 can be further designed as a pipe structure with an elliptical or rectangular interface, and the total liquid cooling medium flow rate of the liquid inlet pipe 130 and the liquid outlet main pipe meets the sum of the liquid cooling medium flow rates of all the liquid cooling channels 120 in the circuit board, that is, the inner diameter cross-sectional area of ​​the liquid inlet main pipe and / or the liquid outlet pipe 140 is not less than the sum of the inner diameter cross-sectional areas of each liquid cooling channel 120 in the board body 100.

[0081] A second aspect of the present application further provides an electronic device, comprising a circuit board assembly according to any of the above embodiments.

[0082] In summary, the present application provides a circuit board assembly and electronic device, including a board body 100 and at least one chip 200. The board body 100 includes a first surface and a second surface relative to each other. The first surface includes at least one chip area 101. Each chip area 101 includes a plurality of vias 110 extending from the first surface to one side of the second surface. The vias are filled with metal connecting portions. Each chip 200 corresponds one-to-one to each chip area 101 on the first surface, and the power pins of each chip 200 are fanned out through the vias 110 in the corresponding chip area 101. Based on the different power thresholds of different chips 200, the present application specifically adjusts the size of the power fan-out vias 110 in the chip area on the board body 100, so that the apertures of the fan-out vias 110 corresponding to the power pins of chips 200 with different power thresholds are different, so as to meet the heat dissipation requirements of power chips 200 with different power thresholds and improve the operating stability of the power chips 200 and their corresponding electronic devices.

[0083] At the same time, the circuit board assembly and electronic device provided in this application also provide liquid cooling channels 120 of varying sizes and / or quantities at preset coordinate positions within the board body 100, corresponding to power chips 200 of different power thresholds. The locations of the liquid cooling channels 120 are aligned with the locations of the corresponding power chips 200, so that the cooling medium filled in the liquid cooling channels 120 can quickly absorb the heat generated by the power chips 200. Furthermore, the cooling medium is configured to flow directionally within the liquid cooling channels 120 to continuously absorb the heat generated by the power chips 200, further improving the heat dissipation and cooling effect on the power chips 200.

[0084] During the assembly process of the entire machine, the circuit board assembly and electronic equipment provided in the present application eliminate the need to install an air-cooled radiator, fan module or liquid-cooled cold plate outside the circuit board assembly compared to the prior art. This not only reduces the assembly size of the entire machine body, improves the integration and miniaturization of the circuit board assembly and electronic equipment, but also further reduces the production cost of the circuit board assembly and electronic equipment, and solves the technical problem of the high integration and heat dissipation design of high-power chip-related electronic equipment being difficult to be compatible.

[0085] In the descriptions of the foregoing embodiments, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and features of different embodiments or examples, unless they are mutually inconsistent.

[0086] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

Claims

1. A circuit board assembly, characterized in that: include: A plate body, the plate body comprising a first surface and a second surface opposite to each other, the first surface comprising at least one chip area, each chip area comprising a plurality of vias extending from the first surface toward one side of the second surface, the vias being filled with metal connecting portions; At least one chip is arranged on the chip area; a power pin is provided in the core area of ​​each chip, and the power pin is fanned out through the via hole in the corresponding chip area; In which, the plate body is also provided with a plurality of liquid cooling channels corresponding to each of the chips, the liquid cooling channels are spaced apart from each other in the first direction, and extend along the second direction and penetrate the plate body; the diameters and / or numbers of the liquid cooling channels corresponding to the chips with different power thresholds are different, and the apertures of the fan-out vias corresponding to the power pins of the chips with different power thresholds are different; wherein, the first direction is orthogonal to the second direction, and the orthogonal plane is parallel to the first surface.

2. The circuit board assembly according to claim 1, wherein: The via hole includes at least one of a through hole and a blind hole.

3. The circuit board assembly according to claim 2, wherein: The vertical projection of the blind hole on the first surface completely or partially overlaps with the vertical projection of the liquid cooling channel on the first surface, and the vertical projection of the through hole on the first surface does not overlap with the vertical projection of the liquid cooling channel on the first surface.

4. The circuit board assembly according to claim 1, wherein: The chip includes at least one of a first chip, a second chip, and a third chip with power thresholds increasing in sequence; wherein, The apertures of the via holes corresponding to the fan-out of the first chip, the second chip and the third chip increase in sequence; And / or, the diameters of the liquid cooling channels corresponding to the first chip, the second chip, and the third chip increase sequentially; And / or, the numbers of the liquid cooling channels corresponding to the first chip, the second chip and the third chip increase sequentially.

5. The circuit board assembly according to claim 4, wherein: The aperture range of the via hole of the power pin of the first chip corresponding to the fan-out of the chip area is 0.2mm~0.25mm; And / or, the aperture range of the via hole of the power pin of the second chip corresponding to the fan-out of the chip area is 0.25 mm to 0.3 mm; And / or, the aperture range of the via hole corresponding to the fan-out of the power pin of the third chip in the chip area is 0.3 mm to 0.35 mm.

6. The circuit board assembly according to claim 4, wherein: The number of the liquid cooling channels corresponding to the first chip is 2 to 3, and the diameter of each of the liquid cooling channels is 1 mm to 1.3 mm; And / or, the number of the liquid cooling channels corresponding to the second chip is 2-3, and the diameter of each of the liquid cooling channels is 1.3 mm-1.7 mm; And / or, the number of the liquid cooling channels corresponding to the third chip is not less than 3, and the diameter of each of the liquid cooling channels is 1.7 mm to 2 mm.

7. The circuit board assembly according to claim 6, wherein: The distance between the centers of adjacent liquid channels in the first direction is not less than 4 mm.

8. The circuit board assembly according to claim 1, wherein: The plurality of liquid cooling channels respectively penetrate the plate body at both ends in the second direction and extend a first preset length toward a side away from the plate body, wherein the range of the first preset length is not less than 100 mm.

9. The circuit board assembly according to claim 8, wherein: The plate body further includes a liquid inlet pipe and a liquid outlet pipe extending along the first direction on both sides along the second direction, the liquid inlet pipe is connected to the inlet end of each liquid cooling channel, and the liquid outlet pipe is connected to the outlet end of each liquid cooling channel.

10. An electronic device, characterized in that: The invention comprises a circuit board assembly according to any one of claims 1 to 9.

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