Cable assembly containing self-calibration data

Abstract

The invention relates to a cable assembly containing self-calibration data. An example cable assembly includes a coaxial cable. A layer encloses at least a portion of the coaxial cable. A memory is located on or in contact with the layer, the memory configured to store calibration data for the coaxial cable.

Description

Technical Field

[0001] This specification describes example embodiments of cable assemblies containing self - calibration data. Background Art

[0002] A device interface board (DIB) may have multiple positions, each for holding a device under test (DUT) to be tested by a test instrument. Coaxial cables may carry radio frequency (RF) signals to the DIB for transmission to multiple DUTs and their multiple pins. Materials, manufacturing, bends in the cables, and environmental factors may affect the way each cable transmits RF signals. These effects may vary for different cables. Summary of the Invention

[0003] An example cable assembly includes a coaxial cable. A layer coats at least a portion of the coaxial cable. A memory is located on or in contact with the layer and is configured to store calibration data for the coaxial cable. The cable assembly may include, individually or in combination, one or more of the following features.

[0004] The layer may be configured to protect the coaxial cable from alteration or damage. The layer may include plastic. The layer may be configured to prevent the coaxial cable from bending. The memory may be positioned around the coaxial cable using 3D printing. One or more contacts may be connected to the memory. The memory may be readable via the one or more contacts. One or more wires may supply power and signals for data transmission. The layer may be located above the one or more wires. The memory may be configured to enable reading via a wireless connection. The memory may include a read - only memory device or a read - write memory device. The memory may include an electrically erasable programmable read - only memory (EEPROM). The cable may be configured to transmit radio frequency (RF) signals. The calibration data may include S - parameters specific to the cable and based on one or more bends in the cable.

[0005] An example test system includes one or more test instruments for performing tests on a DUT by sending signals to the DUT using a cable assembly such as the cable assembly described above. One or more processing devices may read the calibration data forming the memory. The calibration data may include S - parameters associated with the coaxial cable. At least one of the phase or amplitude of the signal may be based on the calibration data.

[0006] An example system for testing a DUT includes a cable assembly that is connected to a device interface board (DIB) configured to carry signals between a test instrument and the DUT. At least one cable assembly of the cable assembly includes: a coaxial cable; a layer that coats at least a portion of the coaxial cable; and a memory that is located on or in contact with the layer. The memory may be configured to store calibration data for the coaxial cable. The system may include one or more of the following features, either alone or in combination.

[0007] The layer may be configured to protect the coaxial cable from alteration or damage. The layer may be or include plastic. The layer may be configured to prevent the coaxial cable from bending beyond a predefined shape or predefined range. The memory may be positioned around the coaxial cable using 3D printing. At least one cable assembly of the cable assembly may include one or more contacts to the memory. The calibration data may be readable from the memory via the one or more contacts. The memory may be configured to enable reading via a wireless connection. The memory may include a read-only memory device or a read-write memory device. The memory may include an electrically erasable programmable read-only memory (EEPROM). The cable may be configured to transmit radio frequency (RF) signals. The calibration data may be based on losses at corresponding RF frequencies. One or more processing devices may be configured to read the calibration data from the memory and apply the calibration data to one or more radio frequency (RF) signals transmitted through the coaxial cable. The cable may be a radio frequency (RF) cable, and the calibration data may include S-parameters of the cable.

[0008] Any two or more features described in this specification, including the present invention content paragraphs, may be combined to form a specific implementation not specifically described in this specification.

[0009] At least portions of the devices, systems, and methods described in this specification may be configured or controlled by executing instructions on one or more processing devices, the instructions being stored on one or more non-transitory machine-readable storage media. Examples of non-transitory machine-readable storage media include read-only memory, optical disk drives, memory disk drives, and random access memory. At least portions of the devices, systems, and methods described in this specification may be configured or controlled using a computing system including one or more processing devices and a memory that stores instructions executable by the one or more processing devices to perform various control operations. The devices, systems, and methods described in this specification may be configured, for example, by design, construction, composition, arrangement, placement, programming, operation, enabling, disabling, and / or control.

[0010] One or more specific embodiments are set forth in the accompanying drawings and the following description. Other features and advantages will be apparent from the description, the drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figures 1A to 1C is a perspective view of an example cable assembly configured to carry signals between a test instrument and a device under test (DUT).

[0012] Figure 2 is a block diagram showing components of an example test system for testing a DUT.

[0013] Figure 3 is a flowchart showing an example method for implementing a cable assembly.

[0014] Figure 4 shows a flowchart of an example method for installing a cable assembly.

[0015] Figure 5 is a diagram of an example interface for extracting data from a memory device and for storing the data on a tester for use by the tester.

[0016] Figure 6 is a diagram of an example interface for entering data into a memory device during cable manufacturing.

[0017] Figure 7 is a block diagram showing components of an example automatic test equipment (ATE).

[0018] Like reference numerals in different drawings indicate like elements. DETAILED DESCRIPTION

[0019] An example cable assembly is configured to store calibration data to be used in a test system to resolve or remove errors introduced by the assembly into signals sent to a DUT and / or into signals from the DUT measured by the test system. In some embodiments, a technique generally described as S-parameter de-embedding may be used to remove or resolve the errors.

[0020] An example cable assembly includes a coaxial cable having loss and VSWR (voltage standing wave ratio) non-idealities described by a frequency sweep of 2-port S-parameters through the coaxial cable. A protective layer coats at least a portion of the coaxial cable. A memory is positioned in contact with the protective layer. The memory is configured to store calibration data.

[0021] An example test system includes one or more cable assemblies of the type described above, the one or more cable assemblies being connected to a device interface board (DIB) and operative to route signals between a test instrument and a device under test (DUT). An interface is provided to enable the test system to extract calibration data from the memory of one or more cable assemblies and thereafter perform de-embedding on signals transmitted through the one or more cable assemblies using the data to improve signal accuracy. The example interface may also be used to initially and whenever it is determined that the calibration data contains errors to update the calibration data.

[0022] Figure 1A is a block diagram of an example cable assembly 100. In this example, the cable assembly is configured to carry signals between a test instrument and a DUT; however, the cable assembly may be used to carry other signals in a test system or in other types of systems not related to testing. Cable assembly 100 includes a coaxial cable 102, a protective layer 104, and a memory device 106 located on top of, inside, or below the protective layer 104. The coaxial cable 102, the protective layer 104, and the memory device 106 may be connected to the DIB through which signals are sent between the DUT and back from the DUT. For example, the memory device 106 may be attached to the protective layer, or formed on or in the protective layer. For example, the memory device may be three-dimensionally (3D) printed on or in the protective layer.

[0023] The coaxial cable 102 is configured to send radio frequency (RF) signals received from a test instrument to a DIB connected to a DUT and to send response signals from the DUT back to the test instrument. The coaxial cable 102 includes a defined set of S-parameters associated with its reflection coefficient, isolation, and insertion loss. In some embodiments, the coaxial cable 102 may be configured to send signals having a frequency of up to 60 gigahertz (GHz). In some embodiments, the coaxial cable 102 may be configured to send signals having a frequency greater than 60 GHz, such as 80 GHz, 100 GHz, 200 GHz, etc.

[0024] The patch 122 may be positioned in a peripheral region of the coaxial cable 102. The patch 122 may allow components such as the memory 106, wires 110 and 111, and / or other electronic components 105 to be placed on the coaxial cable 102 without altering, changing the nature of the coaxial cable 102 (e.g., S-parameters) or requiring additional add-ons to the coaxial cable. The patch 122 may include a plastic or deformable material. In some embodiments, the patch 122 may include an adhesive pad permanently affixed to the coaxial cable 102 and may address wear and tear of the coaxial cable 102. The patch 122 may include a material that allows electronic components to operate while positioned on the patch 122.

[0025] The protective layer 104 can cover all or part of the coaxial cable and is configured to protect the coaxial cable 102 from alteration or damage. For example, the protective layer 104 can extend along the length of the coaxial cable, or the protective layer 104 can cover less than the entire length of the coaxial cable. The protective layer 104 can include plastic or deformable material. In some specific embodiments, the protective layer 104 can include a rigid plastic material to protect the cable assembly 102 when the protective layer will be used in an environment where there is expected wear and tear on the coaxial cable 102. In some specific embodiments, the protective layer 104 can extend over the patch 122 to protect the components positioned on the patch. The protective layer 104 and / or the patch 102 can be implemented on a flexible printed circuit board fabricated on a flexible substrate such as Kapton or other similar materials.

[0026] In this regard, the coaxial cable 102 can include bends or curves as expected by the manufacturer. The protective layer 104 can be used to retain these bends or curves and prevent non-intended bends caused by handling or use from ultimately damaging the cable assembly 100. This includes deformations caused by environmental conditions, such as if the protective layer 104 is positioned over a bend or in an environment where the coaxial cable 104 expands due to an increase in temperature.

[0027] The memory device 106 is configured to store calibration data for the coaxial cable 102. The calibration data can include, for example, cable calibration identification, manufacturing date, and S-parameter data. Other types of information in addition to those listed can be part of the calibration data. The memory device 106 can be a read-only memory device or a read-write memory device. In some examples, the memory device 106 can be a flash memory. In other examples, the memory device 106 can be or include an electrically erasable programmable read-only memory (EEPROM). The memory device 106 can include a combination of different memory devices.

[0028] The memory device 106 can be configured to enable access to the stored calibration data. In some examples, one or more wired contacts 110 can be connected to the memory 106. The memory device 106 can be readable via one or more wired contacts 110. The memory device 106 can also enable reading via a wireless connection. For example, the memory device 106 can include a transceiver (not shown) that communicates via a wireless network or enables direct wireless communication.

[0029] The cable assembly 100 may also include one or more wires 111 for supplying power to the memory device in addition to (or in addition to and in addition to) data transmission, and for signal transceiver to or from the memory. The wires 110 and 111 may be below the protection device 104, on top of the protection device 104, or within the protection device 104. Additionally, the wires 110 and 111 may be of the same type of wire. The wires 110 and 111 may be configured to operate using the I2C bus. In such an arrangement, each of the wires 110 and 111 may be configured to provide power of 5V or 3.3V, coupled to ground, transmit serial data, and transmit serial clock information. The wires 110 and 111 may operate using other serial communication buses. The number of the wires 110 and 111 may be more or less than that shown in the figure, depending on the signals used by the serial communication bus.

[0030] The wires 110 and 111 may be positioned on the peripheral area of the patch 122. The wires 110 and 111 may include a hollow cylindrical shape or other suitable shapes to be positioned on the patch 122. The memory 106 is positioned on the patch 122.

[0031] Figure 1B is a block diagram of another example cable assembly 126. The cable assembly 126 may have the same or similar functionality as the cable assembly 100. In this example, the protective layer 130 is on the bend 132 of the coaxial cable 102. The protective layer 130 protects the bend 132 from damage experienced during use. The protective layer 130 may include a material similar to the Figure 1A protective layer 114. The size of the protective layer 130 may be set such that the bend 130 fits tightly inside. The wires 110 and 111 are positioned within the protective layer 130. The memory device 106 is positioned on the protective layer 130. The combination of memory devices may store the data described herein.

[0032] Figure 1C is a block diagram of another example cable assembly 136. The cable assembly 136 may have the same or similar functionality as the cable assembly 126. In this example, the protective layer 130 is made transparent to illustrate how the wires 110 and 111 can be implemented within the protective layer 130. Also, the memory device 106 is positioned within the protective layer 130 for additional protection. In another specific implementation, the protective layer 130 may use 3D printing to partially cover the flexible printed circuit board positioned around the coaxial cable 102 at the bend 132. The memory device 106 and the wires 110 and 111 are added to the flexible printed circuit board. Thereafter, the remaining portion of the protective layer 130 may be 3D printed to surround the memory device 106 and the wires 110 and 111.

[0033] Figure 2is a block diagram showing components 200 of an example test system for testing a DUT 208. Components 200 include a test instrument 202, a DIB 204, and a cable assembly 206. The test instrument 202, the DIB 204, and the cable assembly 206 can be part of an automatic test equipment (ATE) 700 (see Figure 7 ) for testing the DUT 208. The cable assembly 206 can be connected to, located on, or be part of the DIB assembly 204.

[0034] The test instrument 202 can output an RF signal to the DUT 208 via a coaxial cable in the cable assembly 206 or 204 or both. The RF signal can include a test signal that is used to trigger the DUT 208 or measure a signal originating from the DUT 208. In some cases, the test signal can be initiated by a control system connected to the test instrument 202. The test signal can include instructions, commands, data, parameters, variables, test modes, and / or any other information designed to elicit a response from the DUT 208. In some embodiments, multiple test instruments (such as the test instrument 202) can be used to output test signals to different DUTs (such as the DUT 208) located at various positions on a DIB or a wafer, etc. The test instrument 202 can use multiple channels created by one or more cable assemblies 206 to enable communication between the test instrument and the DUT.

[0035] The DIB 204 can be connected to the cable assembly 206 to receive the RF signal therefrom. The DUT 208 can be connected to the DIB 204 via a mechanical interface and an electrical interface to establish a physical connection and an electrical connection that allows the DIB 204 to transfer the RF signal to the DUT 208. The cable assembly 206 can include the features of the cable assemblies 100, 126, and / or 136 described above. In some embodiments, the cable assembly 206 can be or include a bundle of cable assemblies, each combining elements of the cable assemblies 100, 126, and / or 136. In some embodiments, the test system can obtain calibration data from a memory device of each cable assembly and use the calibration data to perform correction on the test system by de-embedding the cable from the measured waveform or a waveform originating therefrom. For example, the test system can perform calibration to account for any misalignment or inconsistency in the cable assembly relative to other such cable assemblies connected to the test system.

[0036] Figure 3 shows operations included in an example method 300 for manufacturing a cable assembly such as component 100 (126 or 136). The example method 300 includes operations that can be performed by a cable manufacturer of the cable assembly.

[0037] Method 300 includes a cable manufacturer manufacturing (302) coaxial cable 102. The cable manufacturer may use commonly known techniques to form coaxial cable 102. This may involve forming an inner conductor surrounded by concentric conductive shields, with the two separated by a dielectric (insulating material). The inner conductor may be composed of pure copper, copper-clad steel, or aluminum. The cable manufacturer may use materials other than those described to compose the inner conductor. The inner conductor is responsible for transmitting the signal of the coaxial cable. The dielectric may include foamed polyethylene (FPE), polytetrafluoroethylene, polyethylene (PE), polypropylene (PP), or polyvinyl chloride (PVC). The dielectric may include other materials than those described herein.

[0038] After forming coaxial cable 102, the cable manufacturer conforms (304) coaxial cable 102 to a final configuration. In some cases, coaxial cable 102 may be bent at one or more locations along coaxial cable 102. By bending coaxial cable 102, its original S-parameters may change, resulting in coaxial cable 102 having different S-parameters when compared to a straight version of the coaxial cable. Depending on the use of the coaxial cable, bending is used to provide easier connections between endpoints. In some embodiments, the coaxial cable is not bent below a minimum recommended bend radius. Otherwise, bending may cause corrugation and stretching in the cable jacket and dielectric changes. The bend radius may be based on the materials used to manufacture coaxial cable 102. Depending on the use of coaxial cable 102, the cable manufacturer may select materials based on the bend radius requirements of DIB 204 and / or test instrument 202 to minimize or reduce the chance of damage to coaxial cable 102 and the test system.

[0039] The cable manufacturer adds (306) a protective layer (such as protective layer 104 or 130) over all or a portion of coaxial cable 102. Protective layer 104 or 130 may be formed on coaxial cable 102 using deposition techniques or 3D printing. In some embodiments, protective layer 104 or 130 may be positioned over one or more bends of coaxial cable 102 to protect the one or more bends from movement after assembly. In some embodiments, protective layer 104 or 130 may be over the entire length of the coaxial cable, from one termination point (coaxial connection) on the cable to other termination points (coaxial connections). The protective layer may also surround or contact a memory device.

[0040] The cable manufacturer attaches (308) the memory device 106 on, in, or under the protective layer 104 or 130 to form a cable assembly 100 such that the memory device 106 is in contact with the protective layer. This can be done before, after, or during the application of the protective layer to the coaxial cable. As mentioned, the memory device 106 can be positioned on, in, or above the protective layer 104 or 130. The memory device 106 can include materials that allow a portion of the memory device 106 to be disposed on or in contact with the protective layer 104 or 130. Example materials that can be used are adhesives that are compatible with the protective layer 104 or 130 and are placed on the memory device 106 to hold the memory device attached to the protective layer 104 or 130. In some cases, the adhesive can be placed on the protective layer 104 or 130. The cable manufacturer can use materials other than those mentioned for positioning the memory device 106 on or in contact with the protective layer 104 or 130. The cable manufacturer can use 3D printing to attach the memory 106 on, in, or under the protective layer 104 or 130.

[0041] In a particular implementation where there is a wired connection to the memory device, the wired connection can be located on, in, or under the protective layer. For example, the protective layer 104 or 130 can be positioned above the wires used by the coaxial cable 102 for powering and reading data from the memory device 106 to protect those wires. The wires can be incorporated into the cable assembly simultaneously with the memory.

[0042] The S-parameters of the cable assembly 100 can change due to the addition of bends. Whether in a formed shape or straight, the cable manufacturer measures (310) the S-parameters of the cable assembly 100 to reflect the correct S-parameters of the cable assembly 100. Operation 312 can be performed by communicating directly with the memory device 106 or with an example interface 600 that performs 310 and 312 (which is further described below Figure 6 ). In some particular implementations, operation 310 and the example interface 600 can be implemented as machine-executable code and executed on a computing system at the cable manufacturer.

[0043] In some particular implementations, the cable manufacturer can use a vector network analyzer (VNA). The VNA can measure the S-parameters with respect to frequency by scanning the input frequency. The VNA can use a directional coupler to separate the transmitted and reflected power for power measurement. The VNA can be calibrated prior to measurement using known techniques applicable to the frequency band.

[0044] In some specific implementations, a Time Domain Reflectometer (TDR) can be used to measure S-parameters. The measured S-parameters can be temporarily stored in a storage device. The temporary storage device can be located in the local storage device of the VNA or TDR. In some cases, the measured S-parameters can be uploaded to a computer system for temporary storage before being loaded into the memory device 106.

[0045] After that, the cable manufacturer can store (312) the measured S-parameters in the memory device 106 as part of the calibration data for the cable assembly 100. The test system 200 can use the calibration data to calibrate the signals in the cable assembly 100. The calibration data can include other metadata or information, such as cable calibration identification and manufacturing information. Examples of calibration data that can be stored in the memory device 106 can include (but are not limited to) presence of encryption, manufacturer, manufacturing date, wire type, connector type, nominal length (in meters), customer, cable serial number, checksum, S-parameter block, where the S-parameters such as: number of points (linear sweep), start frequency, stop frequency, RI or MA format, s11, s12, s21, s22, and parameters of the equation for fitting the S-parameter data. These different types of information described can be part of the calibration data. As described herein, this data can be stored in the memory 106 via one or more wired connections or via a wireless connection.

[0046] Figure 4 Shown are operations for installing the cable assembly 100 in a tester included in the example method 400. The example method 400 includes operations that can be performed at the test system 200. In some specific implementations, at least part of the example method 400 can be implemented using machine-executable code executed on the control system of the test system 200.

[0047] The method 400 includes installing (402) the cable assembly in the test system 200. The cable assembly can be installed by connecting it to the DIB 204 and the test instrument. For example, installing the cable assembly 100 at the test system can include connecting the test instrument 202 at one end of the cable assembly 100 and connecting it to the DIB at the other end. In some specific implementations, several cable assemblies (such as cable assemblies 100, 100, 126, 136, and / or 206) can be installed at the DIB 204 of the test system 200.

[0048] When installing the cable assembly, the method 404 reads (404) data from the memory device. The S-parameters and / or other calibration data can be read from the memory device 106. For example, as described herein, the S-parameters and / or other calibration data can be read wirelessly or via a wired connection.

[0049] Method 400 includes determining (406) where to store the read data. For example, in some embodiments, S-parameters or other read data may be stored in a local file on test system 200 or in non-volatile memory on DIB 204. A user may input, via a user interface, the location for storing the read data. The user interface may transmit the location to method 400 for processing. An example of the user interface may be example user interface 500 described further below.

[0050] If the location for storing the read data is test system 200, method 400 stores (408) the read data in a local file on test system 200 or in a file linked to a file on test system 200. If the location for storing the read data is non-volatile memory on DIB 204, method 400 stores (410) the read data in the non-volatile memory on DIB 204. The non-volatile memory may be EEPROM.

[0051] Figure 5 FIG. is a diagram of an example user interface 500 for extracting de-embedded S-parameter data from a memory of a cable assembly, such as memory device 106. Example interface 500 includes interface element 502 that receives user input (e.g., 502A), or displays information regarding the status of read data from the memory of the cable assembly (e.g., 502D). In some embodiments, example interface 500 may be a graphical user interface (GUI) running on a control system of test system 200. In some embodiments, example interface 500 may be a GUI executed on a computing system separate from test system 200 or its control system. In some embodiments, example interface 500 may be implemented by executing a test program used by test system 200 for performing tests.

[0052] The input field 502A can be used to input a name and / or location associated with the channel map of the DIB 202. The channel map can identify the RF pins and locations operated by the DIB 202 to manage one or more DUTs (such as DUT 208). The channel map can also be stored in the memory on the DIB 202 or the test system 200. If the channel map is stored and accessible, the browse button 502B can be used to access the channel map from the memory. In this case, the example interface 500 can provide a list of directories for browsing (502B) to find the channel map. After the channel map is found, the location of the channel map is filled in the data field 502A and used to prompt the user during installation. After the data bus is connected to the memory device 106, the read button 502C can be used to check the status of the memory device 106 and determine whether the memory device is ready to upload. When the read button 502C is enabled, the display field 502D can display the status of the memory device 106, the data bus, and the calibration data.

[0053] The input field 502E can be used to specify the signal names at each location on the DIB as defined in the channel map and also used by the test program. The naming convention for the signals at each location can be different for different test systems. The example interface 500 can use the buttons 502F and 502G to specify where to store the calibration data read from the cable assembly 100 in the test system 200. When the button 502F or 502G is enabled, the data retrieved from the intelligent cable is stored in the file system of the test system and its name is linked to that specific signal path. In some embodiments, when 502G is selected, the calibration data from the cable assembly 100 can be stored to the non-volatile memory located on the 204 of the test system 200. In some embodiments, other non-volatile memories used by the DIB 204 can store the calibration data.

[0054] Before storing calibration data, example interface 500 may initiate verification of the calibration data to determine if the calibration data includes errors. In this case, button 502H may be enabled to initiate the verification process. In some embodiments, S-parameters are verified by the test system as described above, but example interface 500 may initiate verification of other calibration data. As previously described, the verification process may measure the corresponding S-parameter ports and check that the measured / evaluated lengths are consistent with cable assembly 100, as described in operation 406. This may include comparing the calibration data read from memory device 106 with the measured S-parameters of the verification process. If an error is detected in the calibration data, the verification process may reject the cable or assist the user in measuring it as in steps 310, 312. Otherwise, the calibration data may be stored. Once the calibration data for a path has been stored, button 502J may be used to move to the next signal path listed in the selected channel map. When all signal paths have been completed, button 502K may be enabled to indicate completion of the extraction and verification process of the calibration data. Button 502I may be used to return to the previous signal path to correct items.

[0055] When using a bundle of cable assemblies, each cable assembly (such as cable assemblies 100, 126, 136, or 206) may have its own corresponding calibration data. In this case, example interface 500 may allocate extraction pages for each cable assembly installed at test system 200. The extraction pages may include the same information as shown in example interface 500, but each cable assembly has different extraction information for their corresponding interface elements 502. The list of cable assemblies may be moved forward or backward by enabling button 502I or 502J to view or add information for a particular cable assembly.

[0056] Figure 6 FIG. is a schematic diagram of an example user interface 600 for inputting data (including calibration data) into a memory device (such as memory device 106) of a cable assembly in operations 310, 312. Example interface 600 includes interface element 602, which takes in or displays information about the status of the input data into memory device 106. In some embodiments, example interface 600 may be or may include a general user interface (GUI) running on a computer system at the cable manufacturer.

[0057] Input fields 602A and 602B can be used to input metadata such as manufacturer, name assigned to the cable, and date. The input metadata can include optional encryption (if required), manufacturer, manufacturing date, wire type, connector type, nominal length (m), customer, cable serial number, checksum, S-parameter block, where S-parameters such as number of points (linear sweep), start frequency, stop frequency, RI or MA format, s11, s12, s21, and / or s22. In some specific implementations, input fields 602A and 602B can include more information than those described here.

[0058] Input field 602C can be used to input the name and / or location of a file associated with the calibration data of the cable assembly. Buttons 602E and 602D allow the user to generate a new file (measurement) or use an existing file (browse). The cable data of the cable assembly can include additional information such as wire type, connector type, or nominal length (m). Example interface 600 can store the cable data in the memory of a computing system located at the cable manufacturer. If the cable data of the cable assembly is stored and accessible, the browse button 602B can be used to access the cable data of the cable assembly. In this case, example interface 600 can provide a list of directories for browsing to find the cable data. Once the cable data is found, the location of the cable data is automatically filled in data field 602C.

[0059] When button 602E is enabled, example interface 600 can measure or otherwise calculate the S-parameters of cable assembly 100. Example interface 600 can initiate a VNA or TDR to measure or calculate the S-parameters. After completing its operation, the VNA or TDR can transfer the S-parameters to example interface 600 for uploading to memory device 106 via wire or wirelessly. Some results of the operations performed by the VNA and TDR can be displayed in display field 602F.

[0060] Checkbox 602G can allow encryption of S-parameters (including other calibration data) when selected. The encryption used can be asymmetric encryption or symmetric encryption. Asymmetric encryption can use a key pair: different keys can be used for the encryption and decryption processes. One of the keys in each pair is generally referred to as the private key, and the other key is called the public key. The cable manufacturer can keep the private key confidential and share the public key in an authorized test system. The same key can be used for both encryption and decryption in symmetric encryption. When checkbox 602G is not selected, no encryption is used.

[0061] The button 602H can be used to generate a globally unique identifier (GUID) for the cable assembly 100. The GUID can also serve as the serial number of the cable assembly 100. The example interface 600 can use any one of several methods to generate the GUID. When the button 602H is enabled, the GUID can be displayed in the display field 602I. Additionally, the cable assembly 100 can be assigned a serial number that is the GUID displayed in the display 602I.

[0062] The button 602J can be used to verify the connection between the memory device 106 of the cable assembly 100 and the data bus before attempting to program the device. To determine whether the memory device 106 is ready or able to receive calibration data, the cable manufacturer can transmit a signal via the data bus to the memory device 106, while the memory device 106 requesting confirmation is connected to the data bus, or attempts to read / write one or more memory locations. When the button 602J is enabled, the connection between the memory device 106 and the data bus is checked, and the result is displayed in the field 602K.

[0063] Once there is an affirmative indication of the connection between the memory device 106 and the data bus, the memory device 106 can be ready to receive S-parameters and other calibration data for storage. The button 602L can be used to upload S-parameters and other calibration data, for example, to the memory device 106. When the button 602L is enabled, the example interface 600 can display in the display field 602M the status of the operation to upload S-parameters and other calibration data to the memory device 106. This includes displaying the status of checksums and additional information. For example, if the data does not fit in the device memory or the read-back does not match, an error can be indicated.

[0064] After there is an affirmative indication of the storage of S-parameters and other calibration data in the memory device 106, the button 602P can be enabled to indicate that the calibration data storage is complete.

[0065] When many cable assemblies are manufactured, each cable assembly (such as the cable assembly 100) can have its corresponding calibration data. The manufacturer can use 602N, 602O to step through the tests and data storage for each one.

[0066] If desired, a single cable assembly having multiple cables can have de-embedded data stored in a single tag having a protective layer and a memory (such as protective layer 104 and memory 106). In this case, example interface 600 can allocate storage pages for each cable assembly to be installed at test system 200. The storage pages can include the same information shown in example interface 600, but each cable assembly has different storage information for its respective interface element 602. Similarly, for the process of manufacturing many cables, the list of cable assemblies can be moved forward or backward by enabling button 602N or 602O to view or add information for a particular cable assembly.

[0067] Figure 7 is a block diagram showing components of an example ATE 700 including a test device (referred to herein as a "tester") 701 and a control system 702. Components 100, 126, or 136 described above can be part of ATE 700.

[0068] Tester 701 includes a test head 703 and a device interface board (DIB) 704 that is physically and electrically connected to test head 703. DIB 704 can be Figure 2 a specific implementation of DIB 204. In this example, DIB 704 includes a circuit board that includes a mechanical interface and an electrical interface at location 705. One or more DUTs (such as DUT 708) are connected to each of these locations for testing by the ATE. DUT 708 can be Figure 2 a specific implementation of DUT 208.

[0069] DIB 704 can include connectors, conductive traces, conductive layers, and circuits, etc., for routing signals between test instruments in test head 703, DUTs connected to DIB locations, and other circuits in the ATE. Power (including voltage and current) can be delivered to DUTs connected to the DIB via one or more layers in DIB 704.

[0070] The test head 703 includes a plurality of test instruments 711a through 711n, each of which can be configured, where appropriate, to perform testing and / or other functions. Although only four test instruments are shown, the ATE 10 can include any suitable number of test instruments (including one or more test instruments located outside the test head 715). A test instrument can be a hardware device that can include one or more processing devices and / or other circuitry. The test instrument can be configured (e.g., programmed) to output commands to test a DUT held on the DIB 704. The commands for testing the DUT can be or include instructions, signals, data, parameters, variables, test patterns, and / or any other information designed to elicit a response from the DUT. One or more (e.g., all) test instruments can be configured to receive from the DUT a response to the commands transmitted from the ATE to the DUT. The response is in the form of response data. The test instrument can be configured to analyze the response data to determine whether the DUT has passed or failed the test. Each of the test instruments 711a through 711n can be an instance of the test instrument 202.

[0071] In addition, the test system can include a cable assembly 715, examples of which include the cable assemblies 100, 126, 136, or 206 for delivering signals between the DUT on the DIB 704 and the test instruments 711a through 711n. Each of the test instruments 711a through 711n can use one or more cable assemblies, such as the cable assemblies 100, 126, 136, or 206, to deliver and receive signals from the DIB 704. In this regard, test channels are configured between the test head on the cable assembly 715 and the DIB, using one or more cable assemblies 206 to enable communication between the DUT and the test instruments. Although only four test channels are shown in Figure 7 , any number of test channels can be included, such as one or more test channels per DUT.

[0072] The control system 702 is configured (e.g., programmed) to communicate with the test instruments 711a through 711n to direct and / or control the testing of the DUT. In some embodiments, the communication 720 link can be through a direct connection, such as a high-speed serial bus of the type described herein. In some embodiments, the communication link can be through a network. In some embodiments, the communication link can be considered part of one or more of the test channels. In some embodiments, the communication link can not be considered part of one or more of the test channels. In some embodiments, the link can include a cable assembly such as 100, 126, 136, or 206.

[0073] The control system 702 may be configured to provide test programs and / or commands to the test instruments 711a through 711n in the test head, and the test instruments use these test programs and / or commands to test the DUT. The control system 702 may be configured to receive response data from the test instruments and analyze the response data to determine whether the DUT has passed or failed the test. The memory 723 also stores machine-executable instructions 734 (such computer code in binary executable form) to implement all or part of the functions performed by the control system 702. The machine-executable instructions 734 may include instructions for performing the operations of the example interface 600. In some embodiments, the machine-executable instructions 734 may include instructions for performing the operations of the method 400.

[0074] All or part of the test systems and methods described in this specification, and various modifications thereof, may be configured or controlled at least in part by one or more computers, such as the control system 702, using one or more computer programs tangibly embodied in one or more information carriers, such as one or more non-transitory machine-readable storage media. The computer programs may be written in any form of programming language, including compiled or interpreted languages, and the computer programs may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. The computer programs may be deployed to execute on one computer or on multiple computers, which may be located in the same location or distributed at multiple locations and interconnected by a network.

[0075] Actions associated with configuring or controlling the test systems and methods described herein may be performed by one or more programmable processors that execute one or more computer programs to control or perform all or some of the operations described herein. All or part of the test systems and methods may be configured or controlled by special-purpose logic circuitry, such as FPGAs (field-programmable gate arrays) and / or ASICs (application-specific integrated circuits) or embedded microprocessors that are localized to the instrument hardware.

[0076] For example, a processor suitable for executing a computer program includes both general-purpose and special-purpose microprocessors, as well as any one or more processors of any kind of digital computer. Generally speaking, a processor can receive instructions and data from a read-only storage area or a random-access storage area, or both. The elements of a computer include one or more processors for executing instructions and one or more storage devices for storing instructions and data. Generally speaking, a computer will also include one or more machine-readable storage media, or be operatively coupled thereto to receive data from or transfer data to the one or more machine-readable storage media, or both receive and transfer data, such as mass storage devices for storing data (such as magnetic disks, magneto-optical disks, or optical disks). Non-transitory machine-readable storage media suitable for embodying computer program instructions and data include all forms of non-volatile storage areas, including: for example, semiconductor storage devices, such as EPROM (erasable programmable read-only memory), EEPROM (electrically erasable programmable read-only memory), and flash storage devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CD-ROM (compact disc read-only memory) and DVD-ROM (digital versatile disc read-only memory).

[0077] The elements of the different specific embodiments described can be combined to form other specific embodiments not specifically presented above. An element may not be included in the systems described above without adversely affecting its general operation or the operation of the system. Additionally, various separate elements can be combined into one or more individual elements to perform the functions described in this specification.

[0078] Other specific embodiments not specifically described in this specification are also within the scope of the following patent application.

Claims

1. A cable assembly, the cable assembly comprising: A coaxial cable; A layer that coats at least a portion of the coaxial cable; And A memory located on or in contact with the layer, the memory being configured to store calibration data of the coaxial cable.

2. The cable assembly according to claim 1, wherein the layer is configured to protect the coaxial cable from alteration or damage.

3. The cable assembly according to claim 1, wherein the layer comprises plastic.

4. The cable assembly according to claim 1, wherein the layer is configured to prevent the coaxial cable from bending.

5. The cable assembly according to claim 1, wherein the memory is positioned around the coaxial cable using 3D printing.

6. The cable assembly according to claim 1, the cable assembly further comprising: One or more contacts connected to the memory, the memory being readable via the one or more contacts.

7. The cable assembly according to claim 1, the cable assembly further comprising: One or more wires for supplying power and signals for data transmission, the layer being located above the one or more wires.

8. The cable assembly according to claim 1, wherein the memory is configured to enable reading via a wireless connection.

9. The cable assembly according to claim 1, wherein the memory comprises a read-only memory device or a read-write memory device.

10. The cable assembly according to claim 1, wherein the memory comprises an electrically erasable programmable read-only memory (EEPROM).

11. The cable assembly according to claim 1, wherein the cable is configured to transmit radio frequency (RF) signals, and wherein the calibration data comprises S-parameters specific to the cable and based on one or more bends in the cable.

12. A system for testing a device under test (DUT), the system comprising: A cable assembly connected to a device interface board (DIB), the device interface board (DIB) being configured to carry signals between a test instrument and the DUT, at least one of the cable assemblies in the cable assembly comprising: A coaxial cable; A layer that coats at least a portion of the coaxial cable; and A memory located on or in contact with the layer, the memory being configured to store calibration data of the coaxial cable.

13. The system according to claim 12, wherein the layer is configured to protect the coaxial cable from alteration or damage.

14. The system according to claim 12, wherein the layer comprises plastic.

15. The system according to claim 12, wherein the layer is configured to prevent the coaxial cable from bending beyond a predefined shape or predefined range.

16. The system according to claim 12, wherein the memory is positioned around the coaxial cable using 3D printing.

17. The system according to claim 12, wherein at least one of the cable assemblies in the cable assembly comprises one or more contacts to the memory; and The calibration data is readable from the memory via the one or more contacts.

18. The system according to claim 12, wherein the memory is configured to enable reading via a wireless connection.

19. The system according to claim 12, wherein the memory comprises a read-only memory device or a read-write memory device.

20. The system according to claim 12, wherein the memory comprises an electrically erasable programmable read-only memory (EEPROM).

21. The system according to claim 12, wherein the cable is configured to transmit radio frequency (RF) signals, and wherein the calibration data is based on the loss at a corresponding RF frequency.

22. The system according to claim 12, the system further comprising: one or more processing devices configured to read the calibration data from the memory and apply the calibration data to one or more radio frequency (RF) signals transmitted through the coaxial cable.

23. The system according to claim 12, wherein the cable is a radio frequency (RF) cable, and the calibration data comprises S-parameters of the cable.

24. A test system, the test system comprising: one or more test instruments for performing a test on a device under test (DUT) by sending a signal to the DUT using the cable assembly according to claim 1; and one or more processing devices for performing an operation comprising the following actions: reading the calibration data forming the memory, the calibration data comprising S-parameters associated with the coaxial cable; wherein at least one of a phase or an amplitude of the signal is based on the calibration data.

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