Cooler and semiconductor device

Abstract

The cooler is provided with: a heat dissipation substrate (210) that includes a first main surface (210S1) on which one or more semiconductor elements (10) are mounted, and a second main surface (210S2) on which heat dissipation fins are provided; a case (200) that is in close contact with the second main surface and accommodates the heat sink part; and a structure (240). The housing includes: a first wall portion (200M1); a second wall portion (200M2) facing the first wall portion; an introduction port (204A) for introducing a refrigerant into the interior of the housing; and a discharge port (204B) located in the direction of a main line (L) from the first wall portion toward the second wall portion with respect to the introduction port, the discharge port (204B) discharging the refrigerant from the inside of the housing. The structure allows the refrigerant flowing in from the introduction port to enter the interior, guides the refrigerant in a guide direction intersecting with the main line, and allows the refrigerant to flow out from a position corresponding to the cooling fin part.

Description

Technical Field

[0001] The present disclosure relates to a cooler and a semiconductor device. Background Art

[0002] Conventionally, a semiconductor device including a semiconductor module and a cooler for cooling the semiconductor module has been known. In addition, a liquid-cooled cooler using a liquid as a refrigerant has been known. Patent Documents 1 and 2 disclose a cooling structure including: a heat dissipation substrate joined to a semiconductor module; and a cooling case which is a box shape open on one side, and the open side is mounted on the heat dissipation substrate. In this cooling structure, heat dissipation fins for heat dissipation are provided on the heat dissipation substrate, and the cooling case is mounted on the heat dissipation substrate so as to house the heat dissipation fins therein. In addition, an inlet and an outlet are provided in the cooling case, and the coolant is circulated from the inlet to the outlet to cool the heat dissipation fins using the coolant.

[0003] In addition, Patent Documents 1 and 2 also show the following structure: a convex body is provided inside the cooling case, and the coolant flowing in from the inlet is diffused by the convex body, thereby improving the cooling efficiency.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: International Publication No. 2014 / 069174

[0007] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2020-145245 Summary of the Invention

[0008] Problems to be Solved by the Invention

[0009] However, in the conventional cooling structure, the diffusion of the coolant in the direction crossing the straight line connecting the inlet and the outlet is insufficient. Therefore, the cooling effect becomes weaker at positions farther from the straight line, and as a result, the temperature of the semiconductor element rises. Therefore, there is a problem that a temperature difference occurs in each semiconductor element.

[0010] An object of the present disclosure is to provide a cooler and a semiconductor device capable of suppressing a temperature difference corresponding to a position in one or more semiconductor elements and reducing the temperature at the position where the highest temperature is reached.

[0011] Means for Solving the Problems

[0012] One embodiment of the present disclosure relates to a cooler including: a heat dissipation substrate including a first main surface for mounting one or more semiconductor elements and a second main surface provided with a heat sink portion; a housing that is in close contact with the second main surface and houses the heat sink portion; and a structure. In the cooler, the housing includes: a first wall portion; a second wall portion facing the first wall portion; an inlet for introducing a refrigerant into the interior of the housing; and an outlet located in a direction of a main line from the first wall portion toward the second wall portion with respect to the inlet for discharging the refrigerant from the interior of the housing. The structure allows the refrigerant flowing in from the inlet to enter the interior, guides the refrigerant in a guiding direction intersecting the main line, and causes the refrigerant to flow out from a position corresponding to the heat sink portion.

[0013] One embodiment of the present disclosure relates to a semiconductor device including: one or more semiconductor elements; and a cooler that cools the semiconductor elements. In the semiconductor device, the cooler includes: a heat dissipation substrate including a first main surface for mounting the semiconductor elements and a second main surface provided with a heat sink portion; a housing that is in close contact with the second main surface and houses the heat sink portion; and a structure. The housing includes: a first wall portion; a second wall portion facing the first wall portion; an inlet for introducing a refrigerant into the interior of the housing; and an outlet located in a direction of a main line from the first wall portion toward the second wall portion with respect to the inlet for discharging the refrigerant from the interior of the housing. The structure allows the refrigerant flowing in from the inlet to enter the interior, guides the refrigerant in a guiding direction intersecting the main line, and causes the refrigerant to flow out from a position corresponding to the heat sink portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 FIG. 1 is a perspective view showing an example of the structure of a semiconductor device according to an embodiment of the present disclosure.

[0015] Figure 2 FIG. 2 is a top view showing an example of the structure of the semiconductor device.

[0016] Figure 3 FIG. 3 is a front view obtained by observing the semiconductor device from the inlet side.

[0017] Figure 4 FIG. 4 is a view showing Figure 2 a cross-sectional view of the semiconductor device taken along the section line IV-IV in FIG. 1.

[0018] Figure 5 FIG. 5 is a view showing Figure 2 the semiconductor device observed along the section line V-V in FIG. 1.

[0019] Figure 6 It is a perspective view obtained by observing the housing from above.

[0020] Figure 7 It is a top view obtained by observing the housing from above.

[0021] Figure 8 It is a view showing Figure 6 the cross-sectional surface obtained by cutting the housing along the VIII-VIII cross-sectional line in

[0022] Figure 9 It is a view obtained by observing the housing along the IX-IX cross-sectional line in Figure 6 It is a view obtained by observing the housing along the IX-IX cross-sectional line in

[0023] Figure 10 It is a view schematically showing the flow of the refrigerant observed from above the housing.

[0024] Figure 11 It is a view schematically showing the flow of the refrigerant at the cross-section of the housing.

[0025] Figure 12 It is a view showing the simulation results of the temperatures of the six semiconductor elements mounted on the cooler.

[0026] Figure 13 It is a view showing the simulation results of the pressure loss in the cooler.

[0027] Figure 14 It is a view showing an example of the structure of the housing according to the first modification of the present disclosure.

[0028] Figure 15 It is an exploded perspective view showing an example of the structure of the housing according to the second modification of the present disclosure.

[0029] Figure 16 It is a cross-sectional view of the semiconductor device according to the seventh modification of the present disclosure.

[0030] Figure 17 It is a cross-sectional view of the semiconductor device according to the eighth modification of the present disclosure.

[0031] Figure 18 It is a top view of the semiconductor device according to the ninth modification of the present disclosure.

[0032] Figure 19 It is a circuit diagram of the power conversion device (inverter circuit).

[0033] Figure 20 It is a top view of the semiconductor device according to another aspect of the ninth modification.

[0034] Figure 21It is a top view of a semiconductor device related to another mode of the ninth modification example.

[0035] Figure 22 It is a top view of a semiconductor device related to the tenth modification example.

[0036] Figure 23 It is Figure 22 a cross-sectional view taken along the cross-section line XXIII-XXIII in

[0037] Figure 24 It is a top view of a semiconductor device related to the eleventh modification example.

[0038] Figure 25 It is a top view of a semiconductor device related to the twelfth modification example.

[0039] Figure 26 It is a top view of a semiconductor device related to another mode of the twelfth modification example.

[0040] Figure 27 It is a top view of a semiconductor device related to another mode of the twelfth modification example. Detailed Implementation Manner

[0041] Next, preferred modes related to the present disclosure will be described with reference to the accompanying drawings. In addition, in the drawings, sometimes the sizes and scales of each part are appropriately different from the actual ones, and sometimes parts are schematically shown for easy understanding. Further, in the following description, unless there is a special description limiting the meaning of the present disclosure, the scope of the present disclosure is not limited to the modes described below. The scope of the present disclosure includes equivalent scopes of these modes.

[0042] 1. Embodiment

[0043] Figure 1 It is a perspective view showing an example of the structure of a semiconductor device 1 related to the embodiment of the present disclosure, Figure 2 and it is a top view showing an example of the structure of the semiconductor device 1. In addition, Figure 1 it is also an assembly view showing a state in which a semiconductor element 10 is mounted on a cooler 20. Further, Figure 2 it is also a perspective view obtained by looking through the internal structure of the cooler 20.

[0044] The semiconductor device 1 includes one or more semiconductor elements 10 and a cooler 20 on which the semiconductor elements 10 are mounted. The semiconductor element 10 is, for example, a switching device such as an IGBT (Insulated Gate Bipolar Transistor) and a MOSFET (Metal Oxide Semiconductor Field Effect Transistor). At least one of the plurality of semiconductor elements 10 may be a wide-bandgap semiconductor element. The wide-bandgap semiconductor element refers to a semiconductor element having a larger bandgap than that of a silicon semiconductor element, and is, for example, a semiconductor element including SiC, GaN, diamond, a gallium nitride-based material, a gallium oxide-based material, AlN, AlGaN, or ZnO. The wide-bandgap semiconductor element can improve the switching speed compared with the silicon semiconductor element. The semiconductor element 10 may also be bonded to a conductive pattern provided on an insulating substrate and mounted on the cooler 20 via the conductive pattern and the insulating substrate.

[0045] The number of semiconductor elements 10 included in the semiconductor device 1 of the present embodiment is two or more. As Figure 2 shown, each semiconductor element 10 is mounted on the cooler 20 in a state of being arranged in a column at intervals. The intervals between the semiconductor elements 10 may be constant or variable.

[0046] Figure 3 FIG. is a view of the semiconductor device 1 as viewed from the inlet 204A side. Figure 4 is a view showing Figure 2 a cross-sectional view of the semiconductor device 1 cut along the IV-IV cross-sectional line in Figure 5 is a view of the semiconductor device 1 as viewed from the V-V cross-sectional line in Figure 2 . In addition, the illustration of the inlet pipe 4A is omitted in Figure 3 , and the illustrations of the inlet pipe 4A and the discharge pipe 4B are omitted in Figure 5 .

[0047] The cooler 20 is a device that cools the semiconductor element 10 using a liquid refrigerant A. That is, the semiconductor element 10 corresponds to a body to be cooled cooled by the cooler 20. The type of the liquid for the refrigerant A is not limited.

[0048] As Figure 4 shown, the cooler 20 of the present embodiment includes: a housing 200 provided with an opening 202; and a heat dissipation substrate 210 that closes the opening 202 of the housing 200. The semiconductor element 10 is mounted on the first main surface 210S1 of the heat dissipation substrate 210. In addition, the housing 200 is also referred to as a water jacket.

[0049] The heat dissipation substrate 210 is a flat member. The heat dissipation substrate 210 includes a first main surface 210S1 and a second main surface 210S2. The first main surface 210S1 and the second main surface 210S2 are main surfaces facing in opposite directions. For the main material of the heat dissipation substrate 210, a material with high thermal conductivity is used. Examples of such materials include metals or alloys such as copper and aluminum. On the first main surface 210S1 of the heat dissipation substrate 210, a bonding material mainly made of a highly thermally conductive material is used to bond the semiconductor element 10.

[0050] As Figure 4 shown, on the heat dissipation substrate 210, a heat sink portion 212 is provided within a range C1 of the second main surface 210S2 facing the opening 202 of the housing 200, which corresponds to the back side of the first main surface 210S1. The heat sink portion 212 includes a plurality of heat sinks 214 erected on the second main surface 210S2. The plurality of heat sinks 214 enter the interior of the housing 200 from the opening 202 and are thus accommodated in the housing 200.

[0051] The shapes of the plurality of heat sinks 214 are appropriate. For example, they can be columnar, plate-like, etc. It is not necessary for all the plurality of heat sinks 214 to have the same shape. In addition, the heat sink portion 212 can either be an integrally formed object with the heat dissipation substrate 210 or be independent of the heat dissipation substrate 210. In the present embodiment, as Figure 2 and Figure 4 shown, the heat sinks 214 are columnar. In addition, the arrangements of the plurality of heat sinks 214 are also appropriate. For example, in a top view, the plurality of heat sinks 214 can be arranged in a grid pattern or in a staggered pattern (zigzag pattern).

[0052] As Figure 4 shown, the housing 200 is a so-called box-shaped member having a hollow three-dimensional shape. For the main material of the housing 200, a material with high thermal conductivity is used. Representative examples of such materials include metals or alloys such as copper and aluminum.

[0053] The housing 200 is composed of a first wall portion 200M1, a second wall portion 200M2, a third wall portion 200M3, a fourth wall portion 200M4, and a bottom surface portion 200M5. The first wall portion 200M1, the second wall portion 200M2, the third wall portion 200M3, and the fourth wall portion 200M4 form the side walls of the housing 200 by being connected in a rectangular frame shape in a top view.

[0054] As Figure 1 shown, the first wall portion 200M1 is a plate-like portion constituting one side surface of the housing 200. An inlet 204A for introducing the refrigerant A into the interior is provided on the first wall portion 200M1.

[0055] As Figure 2and Figure 5 As shown in Figure 5 , the second wall portion 200M2 is a plate-like portion that forms one side surface of the housing 200. The second wall portion 200M2 faces the first wall portion 200M1. A discharge port 204B for discharging the refrigerant A from the inside is provided in the second wall portion 200M2.

[0056] In the present embodiment, the inlet port 204A and the discharge port 204B are provided at positions facing each other. That is, the discharge port 204B is located on the extension line of the direction in which the inlet port 204A penetrates the first wall portion 200M1. In addition, the direction of this extension line corresponds to the direction of the main line L described later.

[0057] The third wall portion 200M3 and the fourth wall portion 200M4 are surfaces facing each other, and each is a plate-like portion that forms one side surface of the housing 200. As Figure 2 shown, the third wall portion 200M3 and the fourth wall portion 200M4 intersect with the first wall portion 200M1 and the second wall portion 200M2.

[0058] In addition, each of the first wall portion 200M1 to the fourth wall portion 200M4 may be a flat surface, or may include curved surfaces, unevenness, etc. in part or all of the first wall portion 200M1 to the fourth wall portion 200M4. In addition, each of the first wall portion 200M1 to the fourth wall portion 200M4 may also include two or more flat surfaces. When all of the first wall portion 200M1 to the fourth wall portion 200M4 are flat surfaces, the external shape of the housing 200 is a rectangular parallelepiped or a cube.

[0059] The bottom surface portion 200M5 is a plate-like portion that forms the bottom surface of the housing 200. The first wall portion 200M1, the second wall portion 200M2, the third wall portion 200M3, and the fourth wall portion 200M4 project upward from the bottom surface portion 200M5.

[0060] As Figure 4 shown, the sealing surface 200S is the top surface of the housing 200. Specifically, the upper surface of the frame-like portion formed by the first wall portion 200M1, the second wall portion 200M2, the third wall portion 200M3, and the fourth wall portion 200M4 is the sealing surface 200S. Therefore, the sealing surface 200S is a plane substantially parallel to the bottom surface portion 200M5.

[0061] The above-mentioned opening 202 is provided in the sealing surface 200S. The sealing surface 200S is bonded to the second main surface 210S2 of the heat dissipation substrate 210 using a fastening unit such as screws. In addition to the fastening unit, an appropriate joining method such as an adhesive and welding may also be used. In addition, the shape of the opening 202 when viewed from above is appropriate, typically a rectangular shape. In addition, the opening area of the opening 202 is also appropriate.

[0062] In the following description, asFigure 5 As shown in the figure, the normal direction of the sealing surface 200S as the top surface and the bottom surface portion 200M5 is defined as the "vertical direction D". In this vertical direction D, the direction from the bottom surface portion 200M5 toward the sealing surface 200S is defined as the "upward direction Du", and the direction opposite to the "upward direction Du" is defined as the "downward direction Dd".

[0063] As Figure 1 shown in the figure, an inlet pipe 4A is connected to the inlet port 204A, and an outlet pipe 4B is connected to the outlet port 204B. At least one of the inlet pipe 4A and the outlet pipe 4B is connected to a pump for ejecting or sucking refrigerant A. By the operation of this pump, refrigerant A is introduced into the interior of the housing 200 through the inlet pipe 4A, flows inside the housing 200, and is discharged from the interior of the housing 200 through the outlet pipe 4B. In addition, the illustration of the pump is omitted. During the process of refrigerant A flowing inside the housing 200, the heat generated by the semiconductor element 10 is recovered by heat exchange with the heat sink portion 212, thereby cooling the semiconductor element 10.

[0064] In the present embodiment, as Figure 4 shown in the figure, on the second main surface 210S2 of the heat dissipation substrate 210, a heat sink portion 212 is provided at least over the entire range of the element cooling range C2. The element cooling range C2 is the back side of the element mounting range C3 in the first main surface 210S1, that is, the range located directly below the element mounting range C3 in the cross-sectional view. The element mounting range C3 is a range where the semiconductor element 10 can be mounted. By providing the heat sink portion 212 over substantially the entire range of the element cooling range C2, the heat generated by the semiconductor element 10 mounted in the element mounting range C3 is efficiently recovered by the heat sink portion 212 directly below it by refrigerant A.

[0065] Here, as Figure 1 shown in the figure, the planar shape of the element mounting range C3 in the present embodiment is a shape extending in the direction of the major axis K. When a plurality of semiconductor elements 10 are mounted on the heat dissipation substrate 210, the plurality of semiconductor elements 10 are mounted in a state arranged in the direction of the major axis K of the element mounting range C3. In other words, the major axis K of the element mounting range C3 can also be said to be the direction of arrangement of the plurality of semiconductor elements 10.

[0066] On the other hand, assuming that there are no structures inside the housing 200, as Figure 2 shown in the figure, refrigerant A flows along a line that linearly connects the inlet port 204A and the outlet port 204B, that is, the main line L. The main line L is a virtual straight line from the first wall portion 200M1 to the second wall portion 200M2. In other words, the main line L is also a straight line parallel to the normal of the first wall portion 200M1 or the second wall portion 200M2.

[0067] As shown in Figure 1 and Figure 2 shown, the main line L does not coincide with the major axis K of the component mounting range C3, but intersects the major axis K. In the present embodiment, the angle at which the major axis K of the component mounting range C3 intersects the main line L is approximately 90 degrees.

[0068] Therefore, when the refrigerant A flows along the main line L, at the end C3A on the major axis K in the component mounting range C3, the flow rate of the refrigerant A flowing directly below it is less than the flow rate near the main line L, and the heat recovery amount is also less. As a result, in the component mounting range C3, the farther away from the main line L, the weaker the cooling effect, and the temperature of the semiconductor element 10 rises. Therefore, a temperature difference is generated between the semiconductor elements 10.

[0069] Therefore, in order to suppress the temperature difference between the semiconductor elements 10, in the cooler 20 of the present embodiment, as shown in Figure 5 shown, a convex structure 240 is provided on the bottom surface portion 200M5 of the housing 200. The structure 240 is a structure that allows the refrigerant A flowing in from the inlet 204A to enter its interior, guides the entered refrigerant A in the guiding direction E, and allows the refrigerant A to flow out from a position corresponding to the heat sink portion 212. As shown in Figure 2 shown, the guiding direction E of the structure 240 is substantially parallel to the direction of the major axis K of the component mounting range C3.

[0070] By guiding the refrigerant A in the guiding direction E, the flow rate of the refrigerant A flowing directly below at the end C3A of the component mounting range C3 increases. With the increase in the flow rate of the refrigerant A, the heat recovery amount also increases. As a result, the temperature difference between the semiconductor elements 10 in the component mounting range C3 is suppressed. That is, the temperature of the semiconductor element 10 having the highest temperature decreases. In addition, since the refrigerant A passes through the interior of the structure 240 and is guided in the guiding direction E, for example, compared with a structure that controls the refrigerant A flowing along the surface of the structure 240 using the surface shape of the structure 240, etc., the refrigerant A can be reliably guided in the guiding direction E.

[0071] Next, the structure 240 will be described in further detail.

[0072] Figure 6 is a perspective view obtained by observing the housing 200 from above, Figure 7 is a top view obtained by observing the housing 200 from above. Figure 8 is a view showing the cross-section obtained by cutting the housing 200 along the VIII-VIII cross-section line in Figure 6 . Figure 9 is from Figure 6 a view obtained by observing the housing 200 along the IX-IX cross-section line in

[0073] As Figure 6 and Figure 7 shown, the structure 240 has a main body portion 242 that is substantially rod-shaped in plan view, and the main body portion 242 extends in the direction of the long axis K of the component mounting range C3 between the third wall portion 200M3 and the fourth wall portion 200M4. Both ends of the main body portion 242 are connected to the inner surfaces of the third wall portion 200M3 and the fourth wall portion 200M4 without a gap.

[0074] For the main material of the main body portion 242, similar to the case of the housing 200, a material having a high thermal conductivity is used. As Figure 9 shown, the cross-sectional shape of the main body portion 242 is a trapezoidal shape. Specifically, the main body portion 242 includes a first facing surface 242M1, a second facing surface 242M2, and an upper surface 242M3.

[0075] The first facing surface 242M1 is a surface facing the inlet 204A, and the second facing surface 242M2 is a surface facing the outlet 204B. The upper surface 242M3 is a surface connecting the first facing surface 242M1 and the second facing surface 242M2. Therefore, the upper surface 242M3 faces the heat sink portion 212 of the heat dissipation substrate 210.

[0076] The first facing surface 242M1 is inclined in a direction away from the inlet 204A as it goes upward in the upward direction Du. In other words, the first facing surface 242M1 is an inclined surface inclined at an acute angle with respect to the bottom surface portion 200M5. The upper surface 242M3 is a plane substantially parallel to the second main surface 210S2 of the heat dissipation substrate 210, and is located near the heat sink portion 212 within a range where it does not contact the heat sink portion 212 in the vertical direction D. The second facing surface 242M2 is inclined in a direction approaching the outlet 204B as it goes downward in the downward direction Dd. In other words, the second facing surface 242M2 is an inclined surface inclined at an acute angle with respect to the bottom surface portion 200M5. In addition, the second facing surface 242M2 may not necessarily be an inclined surface.

[0077] An inlet hole 244 is provided at a position of the first facing surface 242M1 of the present embodiment that faces the inlet 204A. In other words, the inlet hole 244 is provided on the main line L corresponding to the extension line in the penetration direction of the inlet 204A. The inlet hole 244 is a horizontal hole for allowing the refrigerant A flowing in from the inlet 204A to enter the inside of the structure 240. The depth direction of the inlet hole 244 is orthogonal to the vertical direction D.

[0078] On the other hand, as Figure 7As shown, a pair of outflow holes 246 are provided on the upper surface 242M3 in a manner that sandwiches the main line L. The pair of outflow holes 246 are vertical holes respectively for allowing the refrigerant A that has entered the interior of the structure 240 to flow out from the upper surface 242M3. The vertical holes are holes whose depth direction is the up-down direction D. More specifically, as Figure 8 and Figure 9 shown, the pair of outflow holes 246 communicate with the inlet holes 244 respectively. As Figure 7 and Figure 8 shown, the pair of outflow holes 246 are holes shaped to extend along the guiding direction E in a top view, that is, long holes. In the present embodiment, as described above, the guiding direction E is substantially parallel to the long axis K of the component mounting range C3.

[0079] The structure 240 of the present embodiment is an integrally molded product with the housing 200. For the integral molding of the structure 240 and the housing 200, for example, die casting is used. The outflow holes 246 as vertical holes can be formed using the mold used in the integral molding. In addition, the inlet holes 244 as horizontal holes can be formed using a tool that is coaxially inserted into the inlet 204A after the inlet 204A is formed by tapping or the like. According to this manufacturing method, in the manufacturing process of the housing 200, the additional processing for setting the structure 240 is only the processing for forming the inlet holes 244 in the structure 240, so an increase in processing costs can be suppressed.

[0080] Next, the flow of the refrigerant A will be described in detail.

[0081] Figure 10 is a diagram schematically showing the flow of the refrigerant A as observed from above the housing 200, Figure 11 is a diagram schematically showing the flow of the refrigerant A in the cross section of the housing 200. As Figure 11 shown, inside the housing 200, the refrigerant A introduced from the inlet 204A enters the interior of the structure 240 through the inlet holes 244 of the structure 240. As described above, the inlet holes 244 are located on the extension line in the through direction of the inlet 204A, so the refrigerant A smoothly enters the inlet holes 244. In addition, the opening diameter of the inlet holes 244 is appropriately set according to the simulation results of the pressure loss described later and the like.

[0082] The refrigerant A that has entered through the inlet holes 244 flows respectively toward the pair of outflow holes 246 that communicate with the inlet holes 244. Then, as Figure 10As shown, refrigerant A moves along the guiding direction E in each of the pair of outflow holes 246 and flows out from the upper surface 242M3. By moving refrigerant A in the guiding direction E, on the upper surface 242M3, refrigerant A diffuses in the direction of the major axis K, and even in a portion away from the main line L in the direction of the major axis K of the component mounting range C3, the flow rate of refrigerant A can be ensured. The refrigerant A flowing out from the outflow holes 246 flows toward the discharge port 204B along the upper surface 242M3 while recovering heat from the fin portion 212, and is discharged from the discharge port 204B.

[0083] In the present embodiment, as described above Figure 2 As shown, the pair of outflow holes 246 are arranged directly below the range in the component mounting range C3 that is closer to the inlet 204A than to the discharge port 204B, that is, on the upstream side of the flow of refrigerant A on the upper surface 242M3. According to the above structure, on the upper surface 242M3, refrigerant A can flow in substantially the entire range directly below the semiconductor element 10. Thus, the calorific value generated by the semiconductor element 10 can be recovered more efficiently, and the cooling performance can be improved.

[0084] Here, as Figure 11 shown, a part of the refrigerant A introduced from the inlet 204A reaches the upper surface 242M3 along the first opposing surface 242M1 of the main body portion 242. When viewed from above, the flow rate of this refrigerant A is large near the main line L, and the flow rate of this refrigerant A becomes smaller as it moves farther away from the main line L in the direction of the major axis K of the component mounting range C3. Therefore, the cooling performance near the main line L is relatively high.

[0085] On the other hand, since the pair of outflow holes 246 are provided with the main line L interposed therebetween, the flow rate of the refrigerant A flowing out from the outflow holes 246 is the smallest near the main line L, and the cooling performance near the main line L in the direction of the major axis K of the component mounting range C3 is relatively low.

[0086] As a result, in the direction of the major axis K of the component mounting range C3, a balance can be achieved between the cooling performance achieved by the refrigerant A flowing along the first opposing surface 242M1 and the cooling performance achieved by the refrigerant A flowing out from the pair of outflow holes 246 respectively.

[0087] Figure 12 is a diagram showing the simulation results of the temperatures of each of the six semiconductor elements 10 mounted on the cooler 20, Figure 13 is a diagram showing the simulation results of the pressure loss in the cooler 20. In addition, in Figure 13 the semiconductor element numbers indicate the order of the semiconductor elements 10 when counting from one end in the arrangement of the six semiconductor elements 10. Also, Figure 13The pressure loss of refrigerant A therein is the difference between the pressure at the inlet port 204A and the pressure at the outlet port 204B. And, in Figure 12 and Figure 13 the comparative structure is a structure in which the inlet hole 244 and the pair of outlet holes 246 are not provided in the structure body 240 as compared with the structure of the semiconductor device 1 of the present embodiment.

[0088] As Figure 12 shown, by guiding refrigerant A from the structure body 240 in the guiding direction E, the temperature difference of each of the six semiconductor elements 10 in the element mounting range C3 also becomes smaller as compared with the comparative structure.

[0089] In addition, as Figure 13 shown, inside the housing 200, the flow path reaching the upper surface 242M3 of the structure body 240 through the inside of the structure body 240 is formed by the inlet hole 244 and the pair of outlet holes 246. Therefore, as compared with the comparative structure without this path, the pressure loss is reduced. By reducing the pressure loss, the retention of refrigerant A in the cooler 20 is suppressed, and thus the cooling performance is improved.

[0090] As described above, the cooler 20 of the present embodiment includes: a heat dissipation substrate 210 on which one or more semiconductor elements 10 are mounted on the first main surface 210S1; and a housing 200 that is closely attached to the second main surface 210S2 of the heat dissipation substrate 210 and houses the heat sink portion 212 provided on the second main surface 210S2. The housing 200 includes: a first wall portion 200M1 provided with an inlet port 204A for introducing refrigerant A into the housing 200; and a second wall portion 200M2 which is a surface facing the first wall portion 200M1 and is provided with an outlet port 204B for discharging refrigerant A from the inside of the housing 200. The housing 200 is provided with a structure body 240 that allows refrigerant A flowing in from the inlet port 204A to enter the inside, guides the refrigerant A in the guiding direction E that intersects the main line L that linearly connects the inlet port 204A and the outlet port 204B, and discharges the refrigerant A from a position corresponding to the heat sink portion 212.

[0091] According to this structure, since refrigerant A is guided in the guiding direction E, even in a portion far from the main line L in the direction intersecting the main line L, the flow rate of refrigerant A flowing in this portion increases, and the cooling performance at this portion is improved. As a result, the temperature difference between the semiconductor elements 10 can be suppressed, and the temperature of the semiconductor element 10 having the highest temperature can be reduced. In addition, since refrigerant A passes through the inside of the structure body 240 and is guided in the guiding direction E, for example, as compared with a structure that controls refrigerant A flowing along the surface of the structure body 240 using the surface shape of the structure body 240 or the like, refrigerant A can be reliably guided in the guiding direction E.

[0092] In the cooler 20 of the present embodiment, the structure 240 includes a first facing surface 242M1 facing the inlet 204A of the first wall portion 200M1. An inlet hole 244 for allowing the refrigerant A flowing in from the inlet 204A to enter the interior is provided on an extension line in the penetration direction of the inlet 204A of the first facing surface 242M1. According to this structure, the refrigerant A flowing in from the inlet 204A can smoothly enter through the inlet hole 244. In addition, the inlet hole 244 can be simply formed using a tool inserted from the inlet 204A.

[0093] In the cooler 20 of the present embodiment, the structure 240 includes an upper surface 242M3 facing the fin portion 212 of the second main surface 210S2 of the heat dissipation substrate 210. On the upper surface 242M3, one or more outflow holes 246 for allowing the refrigerant A that has entered through the inlet hole 244 to flow out are provided, and the one or more outflow holes 246 are holes in an opening shape extending in a guiding direction E intersecting the main line L in a plan view. According to this structure, the refrigerant A can be reliably guided in the guiding direction E intersecting the main line L, and the refrigerant A can flow out at a portion corresponding to the fin portion 212.

[0094] In the cooler 20 of the present embodiment, the number of semiconductor elements 10 is two or more, and the semiconductor elements 10 are mounted along the guiding direction E. According to this structure, the temperature difference between the semiconductor elements 10 caused by uneven cooling performance can be suppressed.

[0095] In the cooler 20 of the present embodiment, the number of outflow holes 246 is two, and on the upper surface 242M3, the two outflow holes 246 are provided on both sides sandwiching the inlet hole 244. According to this structure, in the guiding direction E intersecting the main line L, a balance can be achieved between the cooling performance achieved by the refrigerant A flowing along the first facing surface 242M1 and the cooling performance achieved by the refrigerant A flowing out from each outflow hole 246.

[0096] In the cooler 20 of the present embodiment, the outflow holes 246 are provided on the upstream side of the flow of the refrigerant A in the upper surface 242M3. According to this structure, the refrigerant A can flow in substantially the entire range directly below the semiconductor element 10, and thus, the calorific value generated by the semiconductor element 10 can be recovered more efficiently, and the cooling performance can be improved.

[0097] 2. Modification

[0098] The following illustrates modified embodiments added to the above-described embodiments. Two or more embodiments arbitrarily selected from the following illustrations can be appropriately combined within a non-conflicting range. In addition, in each of the drawings referred to in the following description, the same reference numerals are assigned to elements that are the same as those described in the embodiments.

[0099] (Modification Example 1)

[0100] Figure 14 FIG. is an example showing the structure of the housing 200 according to the first modification of the present disclosure. As Figure 14 shown, in the structure 240 of the housing 200, the first facing surface 242M1 may not be an inclined surface but a surface substantially perpendicular to the bottom surface portion 200M5. Alternatively, the first facing surface 242M1 may be an inclined surface that is inclined at an obtuse angle with respect to the bottom surface portion 200M5. The inclination angle of the first facing surface 242M1 is appropriately set according to the above-described pressure loss and the non-uniformity of the cooling performance within the component mounting range C3.

[0101] In addition, as Figure 14 shown, the second facing surface 242M2 of the structure 240 may not be an inclined surface but a surface substantially perpendicular to the bottom surface portion 200M5. Alternatively, the second facing surface 242M2 may be an inclined surface that is inclined at an obtuse angle with respect to the bottom surface portion 200M5.

[0102] (Modification Example 2)

[0103] Figure 15 FIG. is an exploded perspective view showing an example of the structure of the housing 200 according to the second modification of the present disclosure. The structure 240 is not limited to being integrally formed with the housing 200, and as Figure 15 shown, it may be independent of the housing 200.

[0104] (Modification Example 3)

[0105] In the above-described embodiment, the guiding direction E in which the outflow hole 246 extends only needs to be a direction intersecting the main line L, and it may not necessarily be the same as the direction of the long axis K of the component mounting range C3 and the direction of the arrangement of the semiconductor elements 10. That is, the guiding direction E may not be a direction orthogonal to the main line L but a direction intersecting at an acute angle or an obtuse angle.

[0106] (Modification Example 4)

[0107] In the above-described embodiment, the main line L is located substantially at the center in the direction of the long axis K in the cooler 20, and the outflow holes 246 are provided on both sides sandwiching the main line L. However, when the main line L is located at a position offset from the substantially center in the direction of the long axis K in the cooler 20, the outflow hole 246 may be provided on either one of the two sides of the main line L.

[0108] (Modification Example 5)

[0109] In the above-described embodiment, the shape of the outflow hole 246 in the upper surface 242M3 is such that the width in the direction of the main line L at any part in the guiding direction E is constant. However, this width may not be constant. For example, it may be such that the width becomes larger or smaller as it moves farther away from the main line L in the guiding direction E.

[0110] (Modification Example 6)

[0111] In the above-described embodiment, the inlet 204A of the housing 200 and the inlet hole 244 of the structure 240 may also be connected by a pipe body. This pipe body may be, for example, the front end portion of the inlet pipe 4A.

[0112] (Modification Example 7)

[0113] In the foregoing embodiment, a structure in which the first facing surface 242M1 of the structure 240 (main body portion 242) faces the inner wall surface of the first wall portion 200M1 with a gap therebetween is illustrated. However, as Figure 16 illustrated, the first wall portion 200M1 and the structure 240 may also be integrally formed. That is, the first facing surface 242M1 is not formed in the structure 240, and the upper surface 242M3 is directly connected to the inner wall surface of the first wall portion 200M1. The inlet hole 244 of the structure 240 and the inlet 204A of the first wall portion 200M1 are directly communicated.

[0114] In the above structure, the refrigerant A introduced from the inlet 204A directly enters the interior of the structure 240 through the inlet hole 244, and the refrigerant A diffuses in the interior of the structure 240 in the guiding direction E and then flows out from each outflow hole 246. The refrigerant A flowing out from the structure 240 is discharged from the discharge port 204B of the second wall portion 200M2 through the space between the upper surface 242M3 and the heat dissipation substrate 210. In Figure 16 this structure, the same effects as those of the foregoing embodiment can also be achieved.

[0115] (Modification Example 8)

[0116] In the foregoing embodiment, a method of providing the inlet 204A in the first wall portion 200M1 and the discharge port 204B in the second wall portion 200M2 is illustrated. However, the positions of the inlet 204A and the discharge port 204B are not limited to the above illustration.

[0117] For example, as Figure 17As illustrated, the inlet 204A may also be formed in the region of the bottom surface portion 200M5 that is located between the first wall portion 200M1 and the structure 240 in a plan view. The inlet pipe 4A communicating with the inlet 204A is connected to the bottom surface portion 200M5. A part of the refrigerant A that has passed through the inlet 204A enters the inlet hole 244 and flows out from each outlet hole 246. In addition, another part of the refrigerant A that has passed through the inlet 204A reaches the upper surface 242M3 along the first facing surface 242M1.

[0118] In addition, as Figure 17 illustrated, the outlet 204B may also be formed in the region of the bottom surface portion 200M5 that is located between the second wall portion 200M2 and the structure 240 in a plan view. The discharge pipe 4B communicating with the outlet 204B is connected to the bottom surface portion 200M5. The outlet 204B is located in the direction of the main line L with respect to the inlet 204A. That is, the structure in which the inlet 204A and the outlet 204B are located on the main line L in a plan view is the same in the foregoing embodiment and Figure 17 the structure of.

[0119] As described above, the positions where the inlet 204A and the outlet 204B are formed can be arbitrarily changed. However, according to the structure in which the inlet 204A is formed in the first wall portion 200M1 as in the foregoing embodiment, the inlet hole 244 can be provided at a position directly opposite to the inlet 204A. Therefore, there is an advantage that the refrigerant A introduced from the inlet 204A can be efficiently supplied to the inlet hole 244. In addition, in the structure where the first wall portion 200M1 is continuous with the structure 240, Figure 16 similarly, the inlet 204A and the outlet 204B may be formed in the bottom surface portion 200M5. Figure 17

[0120] (Modification Example 9)

[0121] In the foregoing embodiment, the manner in which a plurality of semiconductor elements 10 are mounted on the cooler 20 is illustrated. However, the manner in which each semiconductor element 10 is mounted on the cooler 20 is not limited to the above illustration. For example, as Figure 18 illustrated, a semiconductor module 30 (30U, 30V, 30W) including a plurality of semiconductor elements 10 may be mounted on the cooler 20.

[0122] In Figure 18 the structure in which three semiconductor modules 30 (30U, 30V, 30W) are mounted on the first main surface 210S1 of the heat dissipation substrate 210 is illustrated. Specifically, the three semiconductor modules 30 are arranged at intervals along the long axis K.

[0123] The three semiconductor modules 30 constitute, for example,​Figure 19 The illustrated power conversion device 40. Figure 19 The power conversion device 40 is a three-phase inverter circuit that converts DC power into AC power. The semiconductor module 30U corresponds to U, the semiconductor module 30V corresponds to V, and the semiconductor module 30W corresponds to W. In addition, the power conversion device 40 is not limited to an inverter circuit. For example, a converter circuit or a chopper circuit, etc., can also be formed as the power conversion device 40 by the semiconductor module 30.

[0124] As Figure 18 illustrated, each semiconductor module 30 includes three upper arm elements 10u and three lower arm elements 10d. As Figure 19 illustrated, each upper arm element 10u is, for example, a semiconductor element including a switching device and a diode. Figure 19 One upper arm element 10u illustrated actually consists of Figure 18 three upper arm elements 10u illustrated in parallel. Similarly, each lower arm element 10d is also, for example, a semiconductor element including a switching device and a diode. Figure 19 One lower arm element 10d illustrated actually consists of Figure 18 three lower arm elements 10d illustrated in parallel. As Figure 18 illustrated, the three upper arm elements 10u in each semiconductor module 30 are arranged in a region on one side sandwiching the long axis K, and the three lower arm elements 10d are arranged in a region on the other side sandwiching the long axis K.

[0125] As described above, also in the Figure 18 structure, a plurality of semiconductor elements (upper arm elements 10u and lower arm elements 10d) are mounted on the cooler 20. In addition, although three semiconductor modules 30 are illustrated in Figure 18 , as Figure 20 illustrated, it can also be that a single semiconductor module 30 constituting the Figure 19 illustrated power conversion device 40 is mounted on the cooler 20.

[0126] In Figure 18 , a manner is illustrated in which a pair of outflow holes 246 are located between the arrangement of the plurality of semiconductor modules 30 and the first wall portion 200M1 of the housing 200 in a plan view, but the positional relationship between the plurality of semiconductor modules 30 and the pair of outflow holes 246 is not limited to the above illustration. For example, as Figure 21 illustrated, a pair of outflow holes 246 can also be formed between the arrangement of the plurality of upper arm elements 10u and the arrangement of the plurality of lower arm elements 10d. In Figure 21In the structure, a plurality of lower arm elements 10d are cooled by refrigerant A that travels from the first opposing surface 242M1 of the structure body 240 to the upper surface 242M3. On the other hand, a plurality of upper arm elements 10u are cooled by refrigerant A that travels from the first opposing surface 242M1 to the upper surface 242M3 and by refrigerant A that flows out from the interior of the structure body 240 through the respective outflow holes 246 to the upper surface 242M3.

[0127] In addition, the semiconductor modules 30 (30U, 30V, 30W), the upper arm elements 10u, the lower arm elements 10d, and the semiconductor element 10 are examples of "semiconductor elements" in the present disclosure.

[0128] (Modification Example 10)

[0129] As Figure 22 illustrated, a recess 215 may be formed on the first main surface 210S1 of the heat dissipation substrate 210. Figure 23 is Figure 22 a cross-sectional view taken along the cross-section line XXIII-XXIII in Figure 22 and Figure 23 illustrated, the recess 215 on the first main surface 210S1 is a rectangular pit whose outer dimensions are slightly larger than the outer dimensions of the arrangement of the three semiconductor modules 30. The three semiconductor modules 30 are mounted on the cooler 20 in a state of being housed in the recess 215. The depth of the recess 215 is lower than the height of the semiconductor module 30.

[0130] According to Figure 22 the structure, by bringing the side surfaces of the respective semiconductor modules 30 into contact with the inner wall surfaces of the recess 215, the respective semiconductor modules 30 are positioned in a plane parallel to the first main surface 210S1.

[0131] (Modification Example 11)

[0132] In the foregoing embodiment, the manner in which the semiconductor element 10 is joined to the first main surface 210S1 of the heat dissipation substrate 210 is illustrated. However, the structure for mounting the semiconductor element 10 on the heat dissipation substrate 210 is not limited to the above illustration. For example, a plurality of semiconductor modules 30 may be mounted on the cooler 20 by Figure 24 the structure illustrated.

[0133] Figure 24 The semiconductor device 1 of

[0134] The capacitor 35 is a passive component, such as for smoothing the voltage in the power conversion device 40, and is fixed to a housing (not shown). Each connection conductor 31 is a conductor for electrically connecting the semiconductor device 1 and the capacitor 35. The connection conductor 31 is, for example, a bus bar.

[0135] Each output conductor 32 is a conductor for electrically connecting the semiconductor device 1 and an external device such as a motor (not shown). The output conductor 32 is, for example, a bus bar. The holding member 36 is a structure for supporting and fixing a plurality of output conductors 32 to a housing (not shown). In a plan view, the cooler 20 is located between the capacitor 35 and the plurality of output conductors 32.

[0136] Each semiconductor module 30 includes two connection terminals 33 and one output terminal 34. Each connection terminal 33 is electrically connected to the capacitor 35 by engaging with the connection conductor 31. The output terminal 34 is electrically connected to an external device such as a motor by engaging with the output conductor 32.

[0137] Through the engagement of the connection terminal 33 with each connection conductor 31 and the engagement of the output terminal 34 with each output conductor 32, each semiconductor module 30 is supported between the capacitor 35 and the holding member 36. Specifically, each semiconductor module 30 is supported between the capacitor 35 and the holding member 36 in a state where the bottom surface is in contact with the first main surface 210S1 of the heat dissipation substrate 210.

[0138] As exemplified above, in the Figure 24 structure, for example, by supporting each semiconductor module 30 (semiconductor element) by a supporting member such as the capacitor 35 or the holding member 36, each semiconductor module 30 is positioned in a plane parallel to the first main surface 210S1, and the semiconductor module 30 is mounted on the cooler 20. Therefore, the semiconductor module 30 does not need to be directly joined to the first main surface 210S1. In addition, in the Figure 24 structure, each semiconductor module 30 can also be joined to the first main surface 210S1 by a joining material mainly made of a highly thermally conductive material.

[0139] (Modification Example 12)

[0140] In the foregoing embodiment, an example is shown in which in a rectangular-shaped housing 200 in a plan view, the first wall portion 200M1 and the second wall portion 200M2 form the long sides of the rectangle, and the third wall portion 200M3 and the fourth wall portion 200M4 form the short sides of the rectangle. However, the shape of the housing 200 is not limited to the above example.

[0141] For example, as Figure 25As illustrated, the first wall portion 200M1 and the second wall portion 200M2 may form the short sides of a rectangle, and the third wall portion 200M3 and the fourth wall portion 200M4 may form the long sides of the rectangle. The inlet 204A is provided in the first wall portion 200M1, and the outlet 204B is provided in the second wall portion 200M2. Therefore, the refrigerant A flowing into the housing 200 from the inlet 204A flows along the long side direction of the housing 200. The guiding direction E corresponds to the short side direction of the housing 200.

[0142] A plurality of semiconductor modules 30 (30U, 30V, 30W) mounted on the first main surface 210S1 of the heat dissipation substrate 210 are arranged at intervals along the long side direction of the housing 200. Figure 25 In the structure of [], a pair of outflow holes 246 are formed between the semiconductor module 30U and the first wall portion 200M1 in a top view. Therefore, the plurality of semiconductor modules 30 are cooled by the refrigerant A that reaches the upper surface 242M3 from the inside of the structure 240 through the respective outflow holes 246.

[0143] In addition, in Figure 25 , a structure in which a pair of outflow holes 246 are formed on the upstream side of the semiconductor module 30U is illustrated, but the position of the pair of outflow holes 246 is not limited to the above illustration. For example, as Figure 26 illustrates, a pair of outflow holes 246 may be formed between the semiconductor module 30V and the semiconductor module 30W in a top view. Alternatively, a pair of outflow holes 246 may be formed between the semiconductor module 30U and the semiconductor module 30V in a top view.

[0144] As Figure 27 illustrates, a plurality of pairs of outflow holes 246 (2461, 2462, 2463) may be formed in the structure 240. Specifically, a pair of outflow holes 246 may be formed individually for each semiconductor module 30. In the structure of Figure 27 , a plurality of pairs of outflow holes 246 are formed at intervals along the direction in which the plurality of semiconductor modules 30 are arranged.

[0145] Specifically, a pair of outflow holes 2461 are located between the semiconductor module 30U and the first wall portion 200M1 in a top view. A pair of outflow holes 2462 are located between the semiconductor module 30U and the semiconductor module 30V in a top view. A pair of outflow holes 2463 are located between the semiconductor module 30V and the semiconductor module 30W in a top view.

[0146] In the above structure, the semiconductor module 30U is cooled by the refrigerant A flowing out from each outflow hole 2461. The semiconductor module 30V is cooled by the refrigerant A flowing out from each outflow hole 2461 and each outflow hole 2462. The semiconductor module 30W is cooled by the refrigerant A flowing out from each outflow hole 2461, each outflow hole 2462, and each outflow hole 2463.

[0147] The shapes or sizes of the outflow holes 2461, 2462, and 2463 may be the same as or different from each other. For example, consider the following method: the opening area (e.g., the width of the outflow hole 246) of the outflow hole 246 on the more downstream side of the refrigerant A is larger. Specifically, the area of the outflow hole 2462 is larger than the area of the outflow hole 2461, and the area of the outflow hole 2463 is larger than the area of the outflow hole 2462. According to the above structure, it is easy to ensure the flow rate of the refrigerant A even for the outflow hole 246 on the more downstream side.

[0148] Description of Reference Numerals

[0149] 1: semiconductor device; 4A: inlet pipe; 4B: discharge pipe; 10: semiconductor element; 20: cooler; 200: housing; 200M1: first wall portion; 200M2: second wall portion; 200M3: third wall portion; 200M4: fourth wall portion; 200M5: bottom surface portion; 200S: sealing surface; 202: opening; 204A: inlet; 204B: outlet; 210: heat dissipation substrate; 210S1: first main surface; 210S2: second main surface; 212: heat sink portion; 214: heat sink; 240: structure; 242: main body portion; 242M1: first facing surface; 242M3: upper surface; 244: inlet hole; 246: outflow hole; A: refrigerant; C3: element mounting range; D: vertical direction; Dd: downward direction; Du: upward direction; E: guiding direction; K: major axis; L: main line.

Claims

1. A cooler, comprising: A heat dissipation substrate, which includes a first main surface for mounting one or more semiconductor elements and a second main surface provided with a heat sink portion; A housing, which is closely attached to the second main surface and houses the heat sink portion; And A structure, In the cooler, The housing includes: A first wall portion; A second wall portion, which faces the first wall portion; An inlet for introducing a refrigerant into the interior of the housing; and An outlet, which is located in the direction of the main line from the first wall portion toward the second wall portion with respect to the inlet, for discharging the refrigerant from the interior of the housing, The structure allows the refrigerant flowing in from the inlet to enter the interior, guides the refrigerant in a guiding direction intersecting the main line, and causes the refrigerant to flow out from a position corresponding to the heat sink portion.

2. The cooler according to claim 1, wherein The inlet is provided on the first wall portion, The outlet is provided on the second wall portion.

3. The cooler according to claim 2, wherein The structure includes a first facing surface facing the first wall portion, The inlet hole of the structure for allowing the refrigerant flowing in from the inlet to enter the interior is provided on an extension line in the through direction of the inlet on the first facing surface.

4. The cooler according to claim 3, wherein The structure includes an upper surface facing the second main surface, One or more outlet holes of the structure for allowing the refrigerant entering from the inlet hole to flow out are provided on the upper surface, and the one or more outlet holes are in a shape extending along the guiding direction when viewed from above.

5. The cooler according to claim 4, wherein The one or more semiconductor elements are two or more semiconductor elements, The two or more semiconductor elements are mounted along the guiding direction.

6. The cooler according to claim 4 or 5, wherein The one or more outlet holes are two outlet holes, The main line is a line that linearly connects the inlet and the outlet, On the upper surface, the two outlet holes are provided on both sides sandwiching the main line.

7. The cooler according to any one of claims 4 to 6, wherein The one or more outlet holes are provided on the upstream side of the flow of the refrigerant on the upper surface.

8. A semiconductor device, comprising: One or more semiconductor elements; and A cooler for cooling the semiconductor elements, In the semiconductor device, The cooler includes: A heat dissipation substrate, which includes a first main surface for mounting the semiconductor elements and a second main surface provided with a heat sink portion; A housing, which is closely attached to the second main surface and houses the heat sink portion; And A structure, The housing includes: A first wall portion; A second wall portion, which faces the first wall portion; An inlet for introducing a refrigerant into the interior of the housing; and An outlet, which is located in the direction of the main line from the first wall portion toward the second wall portion with respect to the inlet, for discharging the refrigerant from the interior of the housing, The structure allows the refrigerant flowing in from the inlet to enter the interior, guides the refrigerant in a guiding direction intersecting the main line, and causes the refrigerant to flow out from a position corresponding to the fin portion.

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