Method, system and apparatus for integrating glue valve parameter compensation flow rate for semiconductor packaging

Abstract

An integrated glue valve parameter compensation flow rate method for semiconductor packaging comprises the following steps: when it is monitored that the flow rate deviates from a preset range and is abnormal, an input flow rate compensation value is obtained; a to-be-adjusted rubber valve parameter value is obtained, and the flow rate compensation value is converted into the to-be-adjusted parameter value; determining the adjustable range of each parameter and sorting according to the priority; adjusting parameters of a glue valve; adjusting the weight and the quantity of the discharged glue dot; executing flow rate correction compensation; and performing flow rate compensation to the required interval.

Description

Technical Field

[0001] The present invention relates to the field of computers, and in particular to a method, system, and device for compensating the flow rate of integrated glue valve parameters for semiconductor packaging. Background Art

[0002] Underfill refers to a technology that improves packaging stability by filling a polymer (resin)-based composite material between an integrated circuit chip (Die) and a chip packaging substrate (Substrate), or other chips, or an interposer (Interposer). Among them, Die-to-Die or Die-to-Interposer is mainly used in system-on-chip (SoC) or system-in-package (SiP).

[0003] The basic principle of Underfill material application is that after it is filled at the bottom of the chip and cured by heating, a firm bonding layer and filling layer are formed, reducing the thermal stress mismatch caused by the difference in thermal expansion coefficients between the chip and the substrate, improving the device structure and reliability, and enhancing the chip's anti-drop performance.

[0004] Currently, in the production operations in the field of semiconductor packaging, due to the running-in and use of the glue valve, reaction foreign matters, and centering affecting the impact stroke, the flow rate fluctuations or overlimit situations increase. Using long-row glue cannot solve the problem, resulting in an increase in the number of valve cleaning and rework frequencies, and thus a decrease in equipment OEE, an increase in the man-machine ratio, and a rise in the scrap rate. When the flow rate of the glue valve on the machine does not meet the requirement or there are other flow rate problems during operations, it is necessary to solve the flow rate problem by cleaning or replacing the valve off the machine. Summary of the Invention

[0005] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated glue valve parameters for semiconductor packaging, which can compensate the flow rate by changing the dot weight and quantity through the software key compensation value.

[0006] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated glue valve parameters for semiconductor packaging, which can change the size of the flow rate by compensating within a certain range by changing the dot weight and quantity when the flow rate continuously does not meet the requirement.

[0007] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated glue valve parameters for semiconductor packaging, which can compensate the flow rate by integrating the glue valve parameters.

[0008] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated glue valve parameters for semiconductor packaging, which can restore the flow rate to the required range after setting the key compensation value at the software end.

[0009] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated valve parameters in semiconductor packaging, which can improve the equipment availability rate and reduce the number of times of cleaning and replacing the valve due to the flow rate not meeting the requirements (too low or too high) when the valve is installed on the machine or the glue is replaced.

[0010] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated valve parameters in semiconductor packaging, which can improve the stability and lifespan of the valve and reduce the influence of the valve (nozzle striker) running-in or other interference factors on the flow rate.

[0011] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated valve parameters in semiconductor packaging, which can reduce the risk of product scrapping and the number of rework times.

[0012] One of the objectives of the present invention is to provide a method, system, and device for compensating the flow rate of integrated valve parameters in semiconductor packaging, which can provide software integration of valve parameters, convert compensation values into specific parameters, and reduce the number of rework times of the valve or products.

[0013] To achieve at least one of the inventive objectives of the present invention, the present invention provides a method for compensating the flow rate of integrated valve parameters in semiconductor packaging. The method for compensating the flow rate of integrated valve parameters in semiconductor packaging includes the following steps:

[0014] When it is monitored that the flow rate deviates from the preset range and an abnormality occurs, obtain the input flow rate compensation value;

[0015] Obtain the valve parameter values to be adjusted, and convert the flow rate compensation value into the parameter values to be adjusted;

[0016] Confirm the adjustable range of each parameter and sort them according to the priority;

[0017] Adjust the valve parameters;

[0018] Adjust the weight and quantity of the dispensed dots;

[0019] Perform flow rate correction compensation; and

[0020] Perform flow rate compensation to the required range.

[0021] In some embodiments, the method for compensating the flow rate of integrated valve parameters in semiconductor packaging further includes the step of: monitoring the flow rate in real time.

[0022] In some embodiments, the integrated valve parameter compensation flow rate method for semiconductor packaging further includes the steps of: obtaining the corresponding valve parameter change values after compensation value conversion, controlling the valve parameter changes according to the valve parameter change values, and further controlling the dot weight and quantity to change the flow rate.

[0023] In some embodiments, the integrated valve parameter compensation flow rate method for semiconductor packaging further includes the step of: adjusting the initial position of the pressing rod to adjust the striker stroke.

[0024] In some embodiments, the integrated valve parameter compensation flow rate method for semiconductor packaging further includes the steps of: adjusting the striker stroke, impact frequency, nozzle temperature, and glue supply pressure, and integrating them into the flow rate compensation value.

[0025] According to another aspect of the present invention, there is also provided a computer-readable storage medium, on which a computer program is stored, characterized in that when the computer program is executed by a processor, it executes the steps of the integrated valve parameter compensation flow rate method for semiconductor packaging.

[0026] According to another aspect of the present invention, there is also provided an integrated valve parameter compensation flow rate device for semiconductor packaging, including:

[0027] A memory for storing software application programs,

[0028] A processor for executing the software application programs, and each program of the software application programs correspondingly executes each step of the integrated valve parameter compensation flow rate method for semiconductor packaging.

[0029] According to another aspect of the present invention, there is also provided an integrated valve parameter compensation flow rate system for semiconductor packaging, the integrated valve parameter compensation flow rate system for semiconductor packaging includes a flow rate real-time detection unit, a flow rate compensation value input unit, a flow rate compensation value conversion unit, a parameter adjustable range confirmation unit, a priority sorting unit, a valve parameter adjustment unit, a dot weight and quantity adjustment unit, a flow rate correction compensation unit, and a flow rate compensation unit. The flow rate real-time detection unit monitors the flow rate in real time. When the flow rate real-time detection unit feedbacks that the monitored flow rate deviates from the preset range and is abnormal, the flow rate compensation value input unit obtains the input flow rate compensation value. The flow rate compensation value conversion unit obtains the parameter value to be adjusted and converts the flow rate compensation value into the parameter value to be adjusted. The parameter adjustable range confirmation unit confirms the adjustable range of each parameter. The priority sorting unit sorts by priority. The valve parameter adjustment unit is used to adjust the valve parameters. The dot weight and quantity adjustment unit adjusts the out-of-glue dot weight and quantity. The flow rate correction compensation unit performs flow rate correction compensation. The flow rate compensation unit performs flow rate compensation to the required interval.

[0030] In some embodiments, the integrated glue valve parameter compensation flow rate system for semiconductor packaging further includes a lower pressing rod initial position adjusting unit for adjusting the initial position of the lower pressing rod and feeding back the numerical value of the striker stroke after adjustment.

[0031] According to another aspect of the present invention, there is also provided a semiconductor packaging device that applies the integrated glue valve parameter compensation flow rate method for semiconductor packaging, including the integrated glue valve parameter compensation flow rate device for semiconductor packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a step flowchart of a method for integrated glue valve parameter compensation flow rate for semiconductor packaging according to an embodiment of the present invention.

[0033] Figure 2 is a schematic diagram of the glue valve structure of a system for integrated glue valve parameter compensation flow rate for semiconductor packaging according to an embodiment of the present invention, explaining how specific glue valve parameters change and their impact on dots in the application of the integrated glue valve parameter compensation flow rate method for semiconductor packaging.

[0034] Figure 3 is a relative relationship diagram of dot weight & quantity and glue valve parameters in the integrated glue valve parameter compensation flow rate system for semiconductor packaging according to the above embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description can be applied to other implementation schemes, variant schemes, improvement schemes, equivalent schemes, and other technical schemes that do not depart from the spirit and scope of the present invention.

[0036] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of this element can be multiple. The term "a" cannot be understood as a limitation on the number.

[0037] The present invention is an invention related to a computer program. As Figure 1The figure shows a flowchart of an integrated glue valve parameter compensation flow rate method for semiconductor packaging based on the present invention, which elaborates on a solution for controlling or processing external or internal objects of a computer by executing a computer program compiled according to the above process to solve the problems proposed by the present invention. Through the integrated glue valve parameter compensation flow rate method for semiconductor packaging of the present invention, the flow rate can be compensated by changing the dot weight and quantity through the software key compensation value; when the flow rate remains current, the size of the flow rate can be changed by compensating within a range by changing the dot weight and quantity; the flow rate can be compensated by integrating the glue valve parameters; the flow rate can be restored to the required range after setting the key compensation value at the software end; the equipment availability can be improved, and the number of times of cleaning and replacing the glue valve due to non-current flow rate during glue valve installation or glue replacement can be reduced; the stability and lifespan of the glue valve can be improved, and the influence of the flow rate caused by the wear-in of the glue valve nozzle and the needle or other interference factors can be reduced; the risk of product rejection can be reduced, and the number of reworks can be decreased; software integration of the glue valve parameters can be provided, and the compensation value can be converted into specific parameters, reducing the number of reworks of the glue valve or products.

[0038] It can be understood that the "computer" referred to in the present invention not only refers to devices such as desktop computers, laptops, and tablets, but also includes other intelligent electronic devices that can run according to programs and process data.

[0039] Specifically, as Figure 1 shown, the integrated glue valve parameter compensation flow rate method for semiconductor packaging includes the following steps:

[0040] Monitor the flow rate in real time;

[0041] When it is monitored that the flow rate deviates from the preset range and is abnormal, obtain the input flow rate compensation value;

[0042] Obtain the parameter value to be adjusted, and convert the flow rate compensation value into the parameter value to be adjusted;

[0043] Confirm the adjustable range of each parameter and sort them according to priority;

[0044] The gun valve adjusts the glue valve parameters;

[0045] Adjust the weight and quantity of the dispensed dot;

[0046] Execute flow rate correction compensation;

[0047] Execute flow rate compensation to the required range.

[0048] Through each step of the integrated glue valve parameter compensation flow rate method for semiconductor packaging, the compensation value is converted into the corresponding glue valve parameter change value, and then the glue valve parameter change is controlled according to the change value to control the dot weight and quantity, achieving the effect of changing the flow rate.

[0049] In a specific embodiment, the method for compensating the flow rate of the integrated glue valve for semiconductor packaging further includes the step of adjusting the initial position of the pressing rod to adjust the striker stroke.

[0050] Specifically, in a specific embodiment, the striker stroke is 190 - 260 um. The factors affecting the striker stroke include the locking value feature size, the striker length, the thickness of the flange surface of the guiding part, the distance between the upper and lower bonding surfaces of the glue chamber, and the initial position of the pressing rod. When the locking value feature size, the striker length, the thickness of the flange surface of the guiding part, and the distance between the upper and lower bonding surfaces of the glue chamber are not adjusted by software, the striker stroke can be adjusted by controlling the initial position of the pressing rod.

[0051] More specifically, when other parameters remain unchanged, the striker stroke is positively correlated with the dot weight, F(W)=kL. In terms of the flow rate compensation effect: input positive value => the pressing rod rises => the striker lifts => the stroke increases => the dot weight increases => the flow rate rises.

[0052] The method for compensating the flow rate of the integrated glue valve for semiconductor packaging further includes the steps of adjusting the striker stroke L, the impact frequency Hz, the nozzle temperature T, and the glue supply pressure P, and integrating them into the flow rate compensation value.

[0053] When other parameters remain unchanged, the opening and closing time is positively correlated with the dot quantity, F(S)=kt, and the flow rate compensation effect is relatively high.

[0054] The impact frequency affects both the dot quantity and the dot weight. The dot quantity is positively correlated, F(S)=kHz. The dot weight has different relationships at different frequencies. Let the intermediate frequency value be x. When the impact frequency ≤ x, it is positively correlated, F(W)=kHz. When the impact frequency > x, it is negatively correlated, F(W)=k / Hz, and the flow rate compensation effect is relatively high.

[0055] The nozzle temperature is the glue operation temperature, and its effects on the dot quantity and weight are inconsistent in different temperature ranges. Let the intermediate temperature value be x. When the nozzle temperature ≤ x, it is positively correlated with the quantity and weight, F(W)=k1T, F(S)=k2T. When the nozzle temperature > x, it is negatively correlated with the quantity, F(S)=k2 / T, and is positively correlated with the weight as above. The flow rate compensation effect is high.

[0056] When the glue supply pressure increases, the dot weight increases positively, F(W)=Pk. The flow rate compensation effect is relatively high.

[0057] Those skilled in the art can understand that the embodiments of the present invention can be provided in the form of a method, a system, or a computer program product. Therefore, the present invention can take the form of an all-hardware embodiment, an all-software embodiment, or an embodiment combining software and hardware.

[0058] The present invention can be embedded in a computer program product, which includes all features enabling the implementation of the integrated glue valve parameter compensation flow rate method for semiconductor packaging described herein. The computer program product is contained in one or more computer-readable storage media, which have computer-readable program code contained therein. According to another aspect of the present invention, there is also provided a computer-readable storage medium having a computer program stored thereon, which when executed by a processor can perform the steps of the integrated glue valve parameter compensation flow rate method for semiconductor packaging of the present invention. A computer storage medium is a medium in a computer memory for storing certain discontinuous physical quantities. Computer storage media include but are not limited to semiconductors, disk memories, magnetic cores, magnetic drums, magnetic tapes, laser discs, etc. Those skilled in the art can understand that computer storage media are not limited to the foregoing examples, and the foregoing examples are merely for illustration and not limited to the present invention.

[0059] According to another aspect of the present invention, there is also provided an integrated glue valve parameter compensation flow rate device for semiconductor packaging, which includes: a software application program, a memory for storing the software application program, and a processor for executing the software application program. Each program of the software application program can correspondingly perform the steps in the integrated glue valve parameter compensation flow rate method for semiconductor packaging of the present invention.

[0060] A typical combination of hardware and software can be a general computer system with a computer program, which controls the computer system when the program is loaded and executed, so as to perform the integrated glue valve parameter compensation flow rate method disclosed in the present invention.

[0061] Those skilled in the art can understand that the device can be embodied as a desktop computer, a notebook, a mobile intelligent device, etc., but the foregoing are merely for illustration and also include other intelligent analysis devices equipped with the software application program of the present invention.

[0062] Those skilled in the art can understand that the integrated glue valve parameter compensation flow rate method for semiconductor packaging of the present invention can be implemented by hardware, software, or a combination of software and hardware. The present invention can be implemented in a centralized manner in at least one computer system, or in a decentralized manner by different parts distributed in several interconnected computer systems. Any computer system or other device that can implement the method is applicable. A common combination of software and hardware can be a general computer system installed with a computer program, which controls the computer system by installing and executing the program to make it run according to the integrated glue valve parameter compensation flow rate method.

[0063] The abnormal flow rate is the most important problem point of the dispenser. Its fluctuation or exceeding the limit will cause voids in the filling layer, glue climbing or overflowing on the die. The reasons for the change in the flow rate can be divided into the change in dot weight and the change in dot quantity. The main factors affecting the dot weight include the valve running-in time, valve parameters, and Nozzle temperature shock stroke. The main factors affecting the dot quantity include the valve frequency and valve parameters. Through the method for compensating the flow rate by integrating valve parameters for semiconductor packaging of the present invention, the valve parameters are integrated in software, and the compensation value is converted into specific parameters, reducing the number of reworks of the valve or the product.

[0064] Corresponding to the embodiment of the method for compensating the flow rate by integrating valve parameters for semiconductor packaging of the present invention, according to another aspect of the present invention, there is also provided a system for compensating the flow rate by integrating valve parameters for semiconductor packaging. The system for compensating the flow rate by integrating valve parameters for semiconductor packaging is an application of the method for compensating the flow rate by integrating valve parameters for semiconductor packaging of the present invention in the improvement of computer programs. Through the system for compensating the flow rate by integrating valve parameters for semiconductor packaging of the present invention, it is possible to compensate the flow rate by changing the dot weight and quantity through the software key compensation value; when the flow rate is continuously not out of date, it is possible to change the size of the flow rate by compensating by changing the dot weight and quantity within a range; it is possible to compensate the flow rate by integrating valve parameters; it is possible to restore the flow rate to the required range after the software end key compensation value; it is possible to improve the equipment availability rate and reduce the number of times of cleaning and replacing the valve due to the non-compliance of the flow rate when the valve is put on the machine or the glue is replaced; it is possible to improve the stability and life of the valve and reduce the influence of the valve nozzle hitting the needle running-in or other interference factors on the flow rate; it is possible to reduce the risk of product scrapping and reduce the number of reworks; it is possible to provide software integration of valve parameters, convert the compensation value into specific parameters, and reduce the number of reworks of the valve or the product.

[0065] Specifically, the system for compensating the flow rate by integrating valve parameters for semiconductor packaging includes a flow rate real-time detection unit, a flow rate compensation value input unit, a flow rate compensation value conversion unit, a parameter adjustable range confirmation unit, a priority sorting unit, a valve parameter adjustment unit, a dot weight and quantity adjustment unit, a flow rate correction compensation unit, and a flow rate compensation unit.

[0066] The flow rate real-time detection unit monitors the flow rate in real time. When the flow rate real-time detection unit feeds back that the monitored flow rate deviates from the preset range and is abnormal, the flow rate compensation value input unit obtains the input flow rate compensation value. The flow rate compensation value conversion unit obtains the parameter value to be adjusted and converts the flow rate compensation value into the parameter value to be adjusted. The parameter adjustable range confirmation unit confirms the adjustable range of each parameter. The priority sorting unit sorts by priority. The glue valve parameter adjustment unit is used to adjust the glue valve parameters. The dot weight and quantity adjustment unit adjusts the weight and quantity of the dispensed dot. The flow rate correction compensation unit performs flow rate correction compensation. The flow rate compensation unit performs flow rate compensation to the required range.

[0067] Through the integrated glue valve parameter compensation flow rate system for semiconductor packaging, the compensation value is converted into the corresponding change value of the glue valve parameter, and then the glue valve parameter change is controlled according to the change value to control the dot weight and quantity, so as to achieve the effect of changing the flow rate.

[0068] The integrated glue valve parameter compensation flow rate system for semiconductor packaging further includes a lower pressure rod initial position adjustment unit for adjusting the initial position of the lower pressure rod and feeding back the adjusted striker stroke value.

[0069] The integrated glue valve parameter compensation flow rate system for semiconductor packaging further includes a glue valve parameter and dot correlation model unit. The glue valve parameter and dot correlation model unit is used to construct a glue valve parameter and dot relationship model module, adjust the striker stroke, impact frequency, nozzle temperature, and glue supply pressure parameters, and integrate them into the flow rate compensation value, so as to compensate the flow rate by changing the dot weight and quantity through the key compensation value.

[0070] Specifically, the glue valve parameter and dot correlation model unit includes a parameter adjustment module, a glue valve parameter and dot relationship model module, and a parameter integration module.

[0071] The parameter adjustment module is used to adjust the striker stroke, impact frequency, nozzle temperature, and glue supply pressure opening and closing time parameters. The parameter integration module is used to integrate the glue valve parameters into the flow rate compensation value.

[0072] The glue valve parameter and dot relationship model module constructs a glue valve parameter and dot relationship model. Specifically, in a specific embodiment, in the glue valve parameter and dot relationship model, it is set as: obtaining the striker stroke L and the dot weight W. When other parameters remain unchanged, the striker stroke L is positively correlated with the dot weight W, F(W)=kL, where the flow rate compensation effect is high.

[0073] Specifically, in a specific embodiment, in the glue valve parameter and dot relationship model, it is set as follows: obtain the opening and closing time t and the dot quantity S. When other parameters remain unchanged, the opening and closing time t is positively correlated with the dot quantity, and F(S)=kt, in the flow rate compensation effect.

[0074] Specifically, in a specific embodiment, in the glue valve parameter and dot relationship model, it is set as follows: obtain the impact frequency Hz, the dot quantity S, and the dot weight W. The impact frequency has an impact on both the dot quantity and the dot weight. The dot quantity is positively correlated, and F(S)=kHz. The dot weight has different relationships at different frequencies. Let the intermediate frequency value be x. When ≤x, it is positively correlated, and F(W)=kHz. When the impact frequency >x, it is negatively correlated, and F(W)=k / Hz, in the flow rate compensation effect.

[0075] Specifically, in a specific embodiment, in the glue valve parameter and dot relationship model, it is set as follows: obtain the nozzle temperature T, i.e., the glue temperature, the dot quantity S, and the dot weight W. The nozzle temperature, i.e., the glue operating temperature, has inconsistent effects on the dot quantity and weight in different temperature ranges. Let the intermediate temperature value be x. When ≤x, it is positively correlated with the quantity and weight, and F(W)=k1T, F(S)=k2T. When >x, it is negatively correlated with the quantity, and F(S)=k2 / T, and is positively correlated with the weight. Among them, the influence of temperature change on the dot quantity is greater in the pneumatic valve than in the piezoelectric valve, and the influence on the dot weight is less than that on the dot quantity in both valves. The flow rate compensation effect is high.

[0076] Specifically, in a specific embodiment, in the glue valve parameter and dot relationship model, it is set as follows: obtain the glue supply pressure P and the dot weight W. As the glue supply pressure increases, the dot weight increases positively, and F(W)=Pk, in the flow rate compensation effect.

[0077] Through the integrated glue valve parameter compensation flow rate system for semiconductor packaging of the present invention, when the flow rate is not out of date, the dot weight and quantity are changed within a range for compensation to change the size of the flow rate, and the integrated glue valve parameters are used to compensate the flow rate; by converting the compensation value into the corresponding glue valve parameter change value, and then controlling the glue valve parameter change according to the change value to control the dot weight and quantity, the effect of changing the flow rate is achieved. Through the integrated glue valve parameter compensation flow rate system for semiconductor packaging of the present invention, after the key compensation value, the flow rate is restored to the required interval, which can reduce the number of times of cleaning and replacing the glue valve due to the out-of-date flow rate when the glue valve is put on the machine or the glue is replaced, and reduce the influence of the nozzle needle running-in of the glue valve or other interference factors on the flow rate and the risk of product scrapping.

[0078] Those skilled in the art can understand that the present invention has been described with reference to the flowcharts and / or block diagrams of the method, system and computer program product according to the present invention. Each block in the flowchart and / or block diagram, as well as the combination of blocks in the flowchart and / or block diagram, can obviously be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to generate a machine, so that the instructions (the instructions pass through the processor of the computer or other programmable data processing device) generate a device for realizing the functions specified in one or more blocks of the flowchart and / or block diagram.

[0079] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Without departing from this principle, the embodiments of the present invention can have any deformation or modification.

Claims

1. An integrated glue valve parameter compensation flow rate method for semiconductor packaging, characterized in that, The integrated glue valve parameter compensation flow rate method for semiconductor packaging includes the following steps: When it is monitored that the flow rate deviates from the preset range and an abnormality occurs, obtain the input flow rate compensation value; Obtain the glue valve parameter value to be adjusted, and convert the flow rate compensation value into the parameter value to be adjusted; Confirm the adjustable range of each parameter and sort them according to priority; Adjust the glue valve parameters; Adjust the weight and quantity of the dispensed dots; Perform flow rate correction compensation; and Perform flow rate compensation to the required range.

2. The integrated glue valve parameter compensation flow rate method for semiconductor packaging according to claim 1, wherein the integrated glue valve parameter compensation flow rate method for semiconductor packaging further includes the step of: monitoring the flow rate in real time.

3. The integrated glue valve parameter compensation flow rate method for semiconductor packaging according to claim 1, wherein the integrated glue valve parameter compensation flow rate method for semiconductor packaging further includes the step of: obtaining the corresponding glue valve parameter change value after the conversion of the compensation value, controlling the change of the glue valve parameters according to the glue valve parameter change value, and further controlling the weight and quantity of the dots to change the flow rate.

4. The integrated glue valve parameter compensation flow rate method for semiconductor packaging according to claim 1, wherein the integrated glue valve parameter compensation flow rate method for semiconductor packaging further includes the step of: adjusting the initial position of the pressing rod to adjust the striker stroke.

5. The integrated glue valve parameter compensation flow rate method for semiconductor packaging according to any one of claims 1 to 4, wherein the integrated glue valve parameter compensation flow rate method for semiconductor packaging further includes the step of: adjusting the striker stroke, impact frequency, nozzle temperature, and glue supply pressure, and integrating them into the flow rate compensation value.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it executes the steps of the integrated glue valve parameter compensation flow rate method for semiconductor packaging according to any one of claims 1 to 5.

7. An integrated glue valve parameter compensation flow rate device for semiconductor packaging, characterized in that, Comprising: A memory for storing software application programs, A processor for executing the software application programs, and each program of the software application programs correspondingly executes each step of the integrated glue valve parameter compensation flow rate method for semiconductor packaging according to any one of claims 1 to 5.

8. An integrated glue valve parameter compensation flow rate system for semiconductor packaging, characterized in that, The integrated glue valve parameter compensation flow rate system for semiconductor packaging includes a flow rate real-time detection unit, a flow rate compensation value input unit, a flow rate compensation value conversion unit, a parameter adjustable range confirmation unit, a priority sorting unit, a glue valve parameter adjustment unit, a dot weight and quantity adjustment unit, a flow rate correction compensation unit, and a flow rate compensation unit. The flow rate real-time detection unit monitors the flow rate in real time. When the flow rate real-time detection unit feeds back that the monitored flow rate deviates from the preset range and an abnormality occurs, the flow rate compensation value input unit obtains the input flow rate compensation value. The flow rate compensation value conversion unit obtains the parameter value to be adjusted and converts the flow rate compensation value into the parameter value to be adjusted. The parameter adjustable range confirmation unit confirms the adjustable range of each parameter. The priority sorting unit sorts according to priority. The glue valve parameter adjustment unit is used to adjust the glue valve parameters. The dot weight and quantity adjustment unit adjusts the weight and quantity of the dispensed dots. The flow rate correction compensation unit performs flow rate correction compensation. The flow rate compensation unit performs flow rate compensation to the required range.

9. The integrated glue valve parameter compensation flow rate system for semiconductor packaging as claimed in claim 8, wherein the integrated glue valve parameter compensation flow rate system for semiconductor packaging further comprises a down-pressing rod initial position adjusting unit for adjusting the initial position of the down-pressing rod and feeding back the numerical value of the striker stroke after adjustment.

10. A semiconductor packaging device applies the integrated glue valve parameter compensation flow rate method for semiconductor packaging as described in any one of claims 1 to 5, characterized in that, Comprising the integrated glue valve parameter compensation flow rate device for semiconductor packaging as claimed in any one of claims 8 or 9.

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