Semiconductor packaging lead welding device

Abstract

The present invention belongs to the field of semiconductor production technology and provides a semiconductor package lead welding device, comprising a base, a slide being slidably mounted on the base, a first telescopic member being fixedly mounted on the base to drive the slide, a clamping plate being provided on the slide for clamping the semiconductor, a second telescopic member being fixedly mounted in the middle of the base, a protective cover being fixedly mounted on the output end of the second telescopic member, the opening of the protective cover facing the base and the projection of the protective cover onto the base being located on the movement trajectory of the slide, an exhaust fan being fixedly mounted on the top of the protective cover, and the exhaust fan being connected to a first branch pipe. Compared to the prior art, the present invention has the following beneficial effects: it can completely extract all fumes generated by welding, thereby improving the collection efficiency of welding fumes and enhancing the environmental friendliness and safety of the equipment.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor production, and in particular relates to a semiconductor packaging lead welding device. Background Art

[0002] Semiconductor devices capable of achieving specific functions are fabricated by etching and wiring semiconductor wafers. These chips are not limited to silicon chips; other common materials include gallium arsenide (GaAs), germanium, and other semiconductor materials. Welding, also known as welding, is a manufacturing process and technology that uses heat, high temperature, or high pressure to join metals or other thermoplastic materials, such as plastics.

[0003] The semiconductor package lead welding devices currently on the market still have certain defects during use. For example, when using the semiconductor package lead welding device, it is difficult for the semiconductor package lead welding device to remove the harmful gases generated during welding, and the user will inhale the harmful gases. In response to the above technical problems, the Chinese patent with patent announcement number CN208913407U removes the smoke generated by welding by placing an exhaust pipe head near the welding position to extract air. However, since the welding area is not restricted, even if the air is extracted through the exhaust pipe head, it is still impossible to limit the air from completely flowing into the exhaust pipe head, resulting in part of the smoke diffusing into the surrounding air, and the smoke collection effect is poor. Summary of the Invention

[0004] The object of the present invention is to provide a semiconductor package lead welding device, aiming to solve the technical problem in the prior art that smoke diffuses into the surrounding air and the smoke collection effect is poor.

[0005] The present invention is implemented as follows: a semiconductor package lead welding device includes a base, a slide is slidably mounted on the base, and a first telescopic member is fixedly mounted on the base to drive the slide to move, a clamping plate for clamping the semiconductor is provided on the slide, a second telescopic member is fixedly mounted on the middle of the base, a protective cover is fixedly mounted on the output end of the second telescopic member, the opening of the protective cover faces the base and the projection of the protective cover onto the base is located on the moving trajectory of the slide, an exhaust fan is fixedly mounted on the top of the protective cover, the exhaust fan is connected to a first branch pipe, the first branch pipe extends into the protective cover and the first branch pipe is connected to the second branch pipe, solenoid valves are provided on the first branch pipe and the second branch pipe, the opening of the protective cover is connected to an air inlet pipe, and a welding gun is provided in the protective cover.

[0006] Further technical solution: two groups of mounting frames are fixedly mounted on the skateboard, two groups of clamping plates are provided on the mounting frames, and threaded rods are rotatably mounted on the mounting frames to drive the two groups of clamping plates to move in opposite directions at the same time.

[0007] Further technical solution: a base plate is fixedly installed in the protective cover and a through hole is opened in the middle of the base plate, a mounting ring is rotatably installed on the surface of the base plate away from the base, a rotating power part that drives the mounting ring to rotate is provided on the base plate, two groups of symmetrically distributed vertical rods are fixedly installed on the mounting ring, a lifting frame is slidably installed on the vertical rods, a third telescopic part is fixedly installed at both ends of the lifting frame, the end of the third telescopic part away from the lifting frame is fixedly connected to the end of the vertical rod, and the welding gun is set on the lifting frame.

[0008] Further technical solution: a moving block is slidably mounted on the lifting frame, the welding gun is fixedly mounted on the moving block, and a servo module for driving the moving block to move is provided on the lifting frame.

[0009] Further technical solution: the output shaft of the rotating power part is distributed along the radial direction of the mounting ring, a gear is fixedly installed at the end of the output shaft of the rotating power part, the gear is engaged with the gear ring fixedly installed on the mounting ring, and the gear ring and the mounting ring are coaxially arranged.

[0010] Further technical solution: Multiple groups of symmetrically distributed guide rods are fixedly installed in the mounting ring, and semicircular closing plates are provided on the guide rods on both sides. The closing plates are in sliding contact with the base plate, and second electromagnets are fixedly installed on the sides of the closing plates that are close to each other. When the two groups of closing plates are in contact, the through holes are covered.

[0011] Further technical solution: two groups of limit blocks are fixedly installed on the guide rod, the limit blocks are located at the end and the middle of the guide rod, and buffer pads are fixedly installed on the limit blocks at the end of the guide rod.

[0012] Further technical solution: Two groups of support plates are provided in the mounting ring, the support plates are slidably installed on the guide rods, support rods are slidably installed on the support plates, the support rods are fixedly connected to the corresponding closing plates, and a permanent magnet is fixedly installed on one end of the support rod away from the closing plate, and the permanent magnet is used in conjunction with the first electromagnet fixedly installed on the support plate.

[0013] Further technical solution: The first branch pipe is rotatably connected to a connecting hard pipe, and the end of the connecting hard pipe away from the first branch pipe is connected to a connecting hose, which is fixedly connected to one set of closing plates and connected to the area below the base plate.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. Through the setting of the protective cover, the welding area is completely covered and only one air inlet position is retained, so that the air in the protective cover can flow in the set direction, and the fume generated by welding can be completely extracted, avoiding the fume generated by welding from diffusing into the surrounding air and being inhaled by workers, improving the collection effect of welding fume, and improving the environmental protection and safety of equipment use.

[0016] 2. After welding is completed, the welding gun is reset, and then the second electromagnet is energized. After the two groups of second electromagnets are energized, they attract each other so that the two groups of closing plates are connected to form a complete circular plate. Then the first electromagnet is de-energized. Under the action of gravity and the magnetic force of the permanent magnet, the closing plate moves downward and contacts the substrate to complete the closing of the through hole. The through hole is quickly closed by the closing plate, thereby realizing the separation of the upper and lower areas in the protective cover. After welding is completed, the fume generated by welding moves to the top of the substrate under the drive of the air during the resetting of the welding gun. After being separated by the substrate and the closing plate, the protective cover can be opened upward without all the fume in the protective cover being extracted, thereby reducing the waiting time after welding is completed and improving the welding efficiency.

[0017] 3. By energizing and de-energizing the first electromagnet, the closing plate does not contact the substrate when moving, thereby avoiding friction loss of the closing plate during use, which leads to failure to completely seal the through-hole, improving the sealing of the through-hole, avoiding leakage of welding fume, and further improving the safety and environmental protection of the equipment.

[0018] 4. When welding is completed and the closing plate closes the through hole, open the solenoid valve on the first branch pipe and close the solenoid valve on the second branch pipe. At this time, the exhaust fan directly extracts the air in the area below the substrate in the protective cover through the first branch pipe, the connecting hard pipe and the connecting hose. In the process of the protective cover moving upward, the air in the welding position can be continuously extracted, further reducing the probability of smoke residue and further improving the safety and environmental protection of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0020] Figure 2 It is a schematic cross-sectional structural diagram of the protective cover in the present invention.

[0021] Figure 3 Schematic diagram of the structure of the substrate in the present invention.

[0022] Figure 4 It is a structural schematic diagram of the installation ring in the present invention.

[0023] Figure 5 for Figure 3 A magnified schematic diagram of the A1 region in the middle.

[0024] Figure 6 for Figure 3 A magnified schematic diagram of the A2 region in the middle.

[0025] Figure 7 for Figure 4 Schematic diagram of the enlarged A3 region.

[0026] In the accompanying drawings: 1. base; 2. slide; 3. first telescopic member; 4. mounting frame; 5. splint; 6. threaded rod; 7. second telescopic member; 8. protective cover; 9. base plate; 10. through hole; 11. mounting ring; 12. rotating power member; 13. gear; 14. gear ring; 15. vertical rod; 16. third telescopic member; 17. lifting frame; 18. moving block; 19. servo module; 20. welding gun; 21. exhaust fan; 22. first branch pipe; 23. second branch pipe; 24. air inlet pipe; 25. guide rod; 26. support plate; 27. limit block; 28. support rod; 29. ​​closing plate; 30. permanent magnet; 31. first electromagnet; 32. buffer pad; 33. second electromagnet; 34. connecting hard pipe; 35. connecting hose. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0029] like Figure 1-Figure 7 As shown, a semiconductor package lead welding device provided by the present invention includes a base 1, a skateboard 2 is slidably mounted on the base 1 and a first telescopic member 3 that drives the skateboard 2 to move is fixedly mounted on the base 1, a clamping plate 5 for clamping the semiconductor is provided on the skateboard 2, two groups of mounting frames 4 are fixedly mounted on the skateboard 2, two groups of clamping plates 5 are provided on the mounting frames 4, and a threaded rod 6 that drives the two groups of clamping plates 5 to move in opposite directions at the same time is rotatably mounted on the mounting frames 4, a second telescopic member 7 is fixedly mounted on the middle part of the base 1, a protective cover 8 is fixedly mounted on the output end of the second telescopic member 7, the protective cover 8 opening is facing the base 1 and the projection of the protective cover 8 to the base 1 is located on the moving trajectory of the skateboard 2, an exhaust fan 21 is fixedly mounted on the top of the protective cover 8, the exhaust fan 21 is connected to a first branch pipe 22, the first branch pipe 22 extends into the protective cover 8 and is connected to a second branch pipe 23 on the first branch pipe 22, and solenoid valves are provided on the first branch pipe 22 and the second branch pipe 23, the opening of the protective cover 8 is connected to an air inlet pipe 24, and a welding gun 20 is provided in the protective cover 8.

[0030] In actual application of this embodiment, the semiconductor to be welded is placed on the slide 2 and located between the two sets of clamping plates 5. The threaded rod 6 is rotated to drive the two sets of clamping plates 5 to clamp the semiconductor. Then, the first telescopic member 3 drives the slide 2 to move so that the semiconductor moves to just below the protective cover 8. Then, the second telescopic member 7 drives the protective cover 8 to move downward to contact the slide 2. The protective cover 8 completely covers the position of the semiconductor. At the same time, the semiconductor can be installed and fixed in the other set of mounting frames 4.

[0031] After that, the position of the welding gun 20 is adjusted to carry out welding. At the same time, the exhaust fan 21 is turned on while welding. The exhaust fan 21 extracts the air in the protective cover 8 through the second branch pipe 23, and the outside air enters the protective cover 8 through the air inlet pipe 24, so that the air in the protective cover 8 continues to flow from bottom to top. The smoke generated during welding follows the air and is directly extracted by the exhaust fan 21 through the second branch pipe 23 and transported to the external gas treatment equipment. After the welding is completed, wait for a set time so that the exhaust fan 21 can completely extract the remaining smoke in the protective cover 8 to avoid smoke residue in the protective cover 8. After that, the protective cover 8 is reset, and the slide 2 moves in the opposite direction to move another group of semiconductors to the bottom of the protective cover 8 to continue the welding operation. By setting the protective cover 8, the welding area is completely covered and only one air inlet position is retained, so that the air in the protective cover 8 can flow in the set direction, and the smoke generated by welding can be completely extracted, avoiding the smoke generated by welding from diffusing into the surrounding air and being inhaled by the workers, thereby improving the collection effect of welding smoke and improving the environmental protection and safety of the equipment.

[0032] In an example of this embodiment, the first telescopic member 3 and the second telescopic member 7 are respectively the first electric telescopic rod and the second electric telescopic rod. Of course, they can also be other components that can actively change the length, such as hydraulic cylinders. The first electric telescopic rod drives the skateboard 2 to move, and the second electric telescopic rod drives the protective cover 8 to move up and down.

[0033] like Figure 2-Figure 5 As shown, a semiconductor package lead welding device provided by the present invention, a base plate 9 is fixedly installed in the protective cover 8 and a through hole 10 is opened in the middle of the base plate 9, a camera and a lighting lamp are provided on the surface of the base plate 9 close to the base 1, and a mounting ring 11 is rotatably installed on the surface of the base plate 9 away from the base 1, and a rotating power part 12 is provided on the base plate 9 to drive the mounting ring 11 to rotate, two groups of symmetrically distributed vertical rods 15 are fixedly installed on the mounting ring 11, and a lifting frame 17 is slidably installed on the vertical rods 15, and a third telescopic member 16 is fixedly installed at both ends of the lifting frame 17, and the end of the third telescopic member 16 away from the lifting frame 17 is fixedly connected to the end of the vertical rod 15, and a welding gun 20 is set on the lifting frame 17.

[0034] Specifically, a moving block 18 is slidably mounted on the lifting frame 17 , the welding gun 20 is fixedly mounted on the moving block 18 , and a servo module 19 for driving the moving block 18 to move is provided on the lifting frame 17 .

[0035] Specifically, the output shaft of the rotating power part 12 is distributed along the radial direction of the mounting ring 11, and a gear 13 is fixedly installed at the end of the output shaft of the rotating power part 12. The gear 13 is engaged with a ring gear 14 fixedly installed on the mounting ring 11, and the ring gear 14 is coaxially arranged with the mounting ring 11.

[0036] During actual application of this embodiment, after the protective cover 8 contacts the skateboard 2, the semiconductor is illuminated by the lighting lamp, and the welding position on the semiconductor is detected by the camera. After the welding position is determined, the rotating power part 12 drives the mounting ring 11 to rotate through the gear 13 and the ring gear 14, and the mounting ring 11 drives the lifting frame 17 to rotate through the vertical rod 15, so that the projection of the welding position to the lifting frame 17 is located on the moving trajectory of the moving block 18, and then the moving block 18 is driven by the servo module 19 to move so that the welding gun 20 is moved to the top of the welding position. At this time, the third telescopic part 16 drives the lifting frame 17 to move downward so that the welding gun 20 welds the welding position, thereby realizing flexible adjustment of the position of the welding gun 20 and improving the convenience of welding.

[0037] In one embodiment of the present invention, the rotating power part 12 is a motor, and of course it can also be other components that can output rotational power, such as a hydraulic motor. The motor drives the mounting ring 11 to rotate to adjust the position of the welding gun 20. The third telescopic part 16 is a third electric telescopic rod, and of course it can also be other components that can actively change the length, such as a hydraulic cylinder. The third electric telescopic rod drives the lifting frame 17 to move up and down.

[0038] like Figure 3-Figure 7 As shown, a semiconductor package lead welding device provided by the present invention is provided. A plurality of sets of symmetrically distributed guide rods 25 are fixedly installed in the mounting ring 11. Semicircular closing plates 29 are provided on the guide rods 25 on both sides. The closing plates 29 are in sliding contact with the substrate 9. The sides of the closing plates 29 that are close to each other are fixedly installed with second electromagnets 33. When the two sets of closing plates 29 are in contact, they cover the through holes 10.

[0039] Specifically, two groups of limit blocks 27 are fixedly mounted on the guide rod 25 . The limit blocks 27 are located at the end and the middle of the guide rod 25 . Buffer pads 32 are fixedly mounted on the limit blocks 27 at the end of the guide rod 25 .

[0040] Specifically, two sets of support plates 26 are provided in the mounting ring 11. The support plates 26 are slidably mounted on the guide rods 25. A support rod 28 is slidably mounted on the support plates 26. The support rod 28 is fixedly connected to the corresponding closing plate 29. A permanent magnet 30 is fixedly mounted on one end of the support rod 28 away from the closing plate 29. The permanent magnet 30 is used in conjunction with a first electromagnet 31 fixedly mounted on the support plate 26.

[0041] After the welding is completed, the welding gun 20 is reset, and then the second electromagnet 33 is energized. After the two sets of second electromagnets 33 are energized, they attract each other so that the two sets of sealing plates 29 are connected to form a complete circular plate. Then, the first electromagnet 31 is de-energized, and under the action of gravity and the magnetic force of the permanent magnet 30, the sealing plate 29 moves downward and contacts the substrate 9 to complete the sealing of the through hole 10. The through hole 10 is quickly sealed by the sealing plate 29, thereby realizing the separation of the upper and lower areas in the protective cover 8. After the welding is completed, the smoke generated by welding during the resetting of the welding gun 20 is driven by the air and moves to the top of the substrate 9. After the substrate 9 is separated from the sealing plate 29, the smoke generated by welding is driven by the air. The protective cover 8 can be opened upward without exhausting all the smoke in the protective cover 8, which reduces the waiting time after welding is completed and improves the welding efficiency. When the protective cover 8 contacts the slide plate 2 again for welding, the first electromagnet 31 is first energized to make the closing plate 29 move away from the substrate 9 again. Then, the current direction of one group of second electromagnets 33 is reversed so that the two groups of second electromagnets 33 repel each other and separate. The limit block 27 prevents the closing plate 29 from moving excessively, and the buffer pad 32 ensures that the two groups of closing plates 29 can be tightly connected and aligned with the through hole 10 at the same time, ensuring that the closing plate 29 can close the through hole 10. The energization and de-energization of the first electromagnet 31 ensure that the closing plate 29 does not contact the substrate 9 when moving, thereby avoiding friction loss of the closing plate 29 during use, resulting in the inability to completely seal the through hole 10, improving the sealing of the through hole 10, avoiding leakage of welding smoke, and further improving the safety and environmental protection of the equipment.

[0042] like Figure 3 、 Figure 4 、 Figure 6 As shown, a semiconductor package lead welding device provided by the present invention, the first branch pipe 22 is rotatably connected to a connecting hard pipe 34, and the end of the connecting hard pipe 34 away from the first branch pipe 22 is connected to a connecting hose 35, and the connecting hose 35 is fixedly connected to one group of closing plates 29, and the connecting hose 35 is connected to the area below the substrate 9.

[0043] In actual application of this embodiment, when welding is completed and the closing plate 29 closes the through hole 10, the solenoid valve on the first branch pipe 22 is opened and the solenoid valve on the second branch pipe 23 is closed. At this time, the exhaust fan 21 directly extracts the air in the area below the base plate 9 in the protective cover 8 through the first branch pipe 22, the connecting hard pipe 34 and the connecting hose 35, so that during the upward movement of the protective cover 8, the air in the welding position can be continuously extracted, further reducing the probability of residual smoke and further improving the safety and environmental protection of the equipment. When welding again subsequently, the states of the solenoid valves on the first branch pipe 22 and the second branch pipe 23 are interchanged.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0045] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A semiconductor package lead welding device, comprising a base (1), characterized in that: A slide plate (2) is slidably mounted on the base (1) and a first telescopic member (3) for driving the slide plate (2) to move is fixedly mounted on the base (1); a clamping plate (5) for clamping a semiconductor is provided on the slide plate (2); a second telescopic member (7) is fixedly mounted on the middle of the base (1); a protective cover (8) is fixedly mounted on the output end of the second telescopic member (7); the opening of the protective cover (8) faces the base (1) and the projection of the protective cover (8) onto the base (1) is located on the moving track of the slide plate (2); an exhaust fan (21) is fixedly mounted on the top of the protective cover (8); the exhaust fan (21) is connected to a first branch pipe (22); the first branch pipe (22) extends into the protective cover (8) and the first branch pipe (22) is connected to a second branch pipe (23); solenoid valves are provided on both the first branch pipe (22) and the second branch pipe (23); an air inlet pipe (24) is connected to the opening of the protective cover (8); a welding gun (20) is provided in the protective cover (8); A base plate (9) is fixedly mounted in the protective cover (8) and a through hole (10) is provided in the middle of the base plate (9); a mounting ring (11) is rotatably mounted on the surface of the base plate (9) away from the base (1); a rotating power member (12) is provided on the base plate (9) for driving the mounting ring (11) to rotate; two groups of symmetrically distributed vertical rods (15) are fixedly mounted on the mounting ring (11); a lifting frame (17) is slidably mounted on the vertical rods (15); a third telescopic member (16) is fixedly mounted on both ends of the lifting frame (17); an end of the third telescopic member (16) away from the lifting frame (17) is fixedly connected to the end of the vertical rod (15); and a welding gun (20) is provided on the lifting frame (17); A plurality of symmetrically distributed guide rods (25) are fixedly mounted in the mounting ring (11), and a semicircular closing plate (29) is provided on each of the guide rods (25) on both sides. The closing plates (29) are in sliding contact with the base plate (9), and a second electromagnet (33) is fixedly mounted on the sides of the closing plates (29) that are close to each other. When the two sets of closing plates (29) are in contact, they cover the through hole (10); The first branch pipe (22) is rotatably connected to a connecting hard pipe (34), and one end of the connecting hard pipe (34) away from the first branch pipe (22) is connected to a connecting hose (35). The connecting hose (35) is fixedly connected to one set of closing plates (29), and the connecting hose (35) is connected to the area below the base plate (9).

2. A semiconductor package lead bonding device according to claim 1, characterized in that: Two groups of mounting frames (4) are fixedly mounted on the slide (2), two groups of clamping plates (5) are arranged on the mounting frames (4), and a threaded rod (6) is rotatably mounted on the mounting frames (4) to drive the two groups of clamping plates (5) to move in opposite directions simultaneously.

3. The semiconductor package lead bonding device according to claim 1, wherein: A moving block (18) is slidably mounted on the lifting frame (17), a welding gun (20) is fixedly mounted on the moving block (18), and a servo module (19) for driving the moving block (18) to move is provided on the lifting frame (17).

4. The semiconductor package lead bonding device according to claim 1, wherein: The output shaft of the rotating power member (12) is distributed along the radial direction of the mounting ring (11), and a gear (13) is fixedly mounted on the end of the output shaft of the rotating power member (12). The gear (13) meshes with a gear ring (14) fixedly mounted on the mounting ring (11), and the gear ring (14) and the mounting ring (11) are coaxially arranged.

5. The semiconductor package lead bonding device according to claim 1, wherein: Two sets of limit blocks (27) are fixedly mounted on the guide rod (25), and the limit blocks (27) are located at the end and the middle of the guide rod (25). A buffer pad (32) is fixedly mounted on the limit block (27) at the end of the guide rod (25).

6. The semiconductor package lead bonding device according to claim 5, characterized in that: Two groups of support plates (26) are provided in the mounting ring (11), the support plates (26) are slidably mounted on the guide rods (25), a support rod (28) is slidably mounted on the support plates (26), the support rod (28) is fixedly connected to the corresponding closing plate (29), a permanent magnet (30) is fixedly mounted on one end of the support rod (28) away from the closing plate (29), and the permanent magnet (30) is used in conjunction with a first electromagnet (31) fixedly mounted on the support plate (26).

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