Control method of needle grinding machine, electronic equipment, storage medium and needle grinding machine

Abstract

The invention discloses a control method of a needle grinding machine, electronic equipment, a storage medium and the needle grinding machine, and the method comprises the following steps: when a probe card is fixed by a fixing module of the needle grinding machine, obtaining an arrangement type of probe tips of the probe card; determining a grinding mode corresponding to the arrangement type based on the arrangement type and a first preset rule; grinding parameters corresponding to the grinding mode are determined according to the grinding mode and a second preset rule; and based on the grinding parameters, controlling a first driving part, a second driving part and a third driving part of the probe grinding machine to drive a motion platform to move so as to grind a probe tip of the probe card by adopting a grinding mode corresponding to the probe card. According to the method, the grinding mode of the probe card is determined based on the arrangement type and the first preset rule, then the probe grinding machine is controlled to grind the probe tips by adopting the appropriate grinding mode according to the arrangement type of the probe tips of the probe card, deformation of the probes in the grinding process can be avoided, and therefore the grinding effect is improved.

Description

Technical Field

[0001] The present invention relates to the field of high-end equipment manufacturing, and particularly to a control method for a needle grinding machine, an electronic device, a storage medium, and a needle grinding machine. Background Art

[0002] Currently, the chip industry is booming. During the production process of chips, before the chips are encapsulated, it is necessary to detect the wafers to prevent unqualified wafers from being further processed. Detecting the wafers requires a probe card, which includes a plurality of probes. The probes transmit test signals by directly contacting the pads or bumps on the wafer. During the manufacturing process of the probe card, the newly processed probe tips are usually relatively sharp. If they directly contact the wafer, it is easy to cause problems such as virtual connection, poor contact, or scratching of the pads, which will affect the test accuracy and cause yield loss. Therefore, a needle grinding machine is needed to grind the tip of the needle into a spherical or near-spherical shape to increase the contact area, reduce the contact impedance, and ensure the test stability.

[0003] Currently, during the grinding process of the probe tip, generally, the motion platform used for grinding is controlled to continuously make a circular motion to grind the probe tip.

[0004] However, there are various types of probe cards and multiple probe arrangement methods. If the circular motion grinding method is used for all of them, for some probes with certain arrangement methods, it is easy to cause the probes to deform. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present application provides a control method for a needle grinding machine, an electronic device, a storage medium, and a needle grinding machine. By determining the grinding method of the probe card based on the arrangement type and the first preset rule, and determining the grinding parameters according to the grinding method and the second preset rule, and then controlling the needle grinding machine to grind the probe tips of the probe card of the probe needle tip arrangement type by using a suitable grinding method, it can avoid the deformation of the probe during the grinding process, thereby improving the grinding effect.

[0006] To solve the above problems, the present invention provides the following technical solutions: In a first aspect, an embodiment of the present application provides a control method for a needle grinding machine, including: when the probe card is fixed by the fixing module of the needle grinding machine, obtaining the arrangement type of the probe tips of the probe card; Determining the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule, where the first preset rule includes that when the arrangement type is a vertical arrangement, determining the grinding method of the probe card as a circular motion grinding method, and when the arrangement type is a linear arrangement or an arc arrangement, photographing an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card; Determine the grinding parameters corresponding to the grinding method according to the grinding method and the second preset rule. The grinding parameters include the first motion parameter of the first driving part of the needle grinding machine, the first motion parameter of the second driving part, and the third motion parameter of the third driving part. The first driving part is used to drive the motion platform of the needle grinding machine to move in the first direction, the second driving part is used to drive the motion platform to move in the second direction, and the third driving part is used to drive the motion platform to move in the third direction. The first direction, the second direction, and the third direction are different from each other. The motion platform is used to grind the probe tips of the probe card. Control the first driving part, the second driving part, and the third driving part of the needle grinding machine to drive the motion platform to move based on the grinding parameters, so as to grind the probe tips of the probe card by using the grinding method corresponding to the probe card.

[0007] In some embodiments, the determining the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule includes: Determine the grinding method corresponding to the arrangement type based on the arrangement type and the corresponding relationship information between the arrangement type and the grinding method preset; or Display the arrangement type, and in response to receiving a grinding method determination instruction, obtain the grinding method corresponding to the arrangement type according to the grinding method determination instruction.

[0008] In some embodiments, the arrangement type includes a linear arrangement, a vertical arrangement, and an arc arrangement. The determining the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule includes: When the arrangement type is a vertical arrangement, determine that the grinding method of the probe card is a circular motion grinding method; When the arrangement type is the linear arrangement or the arc arrangement, take an image of the probe card; Based on the image of the probe card, determine the first expression of the first line formed by the arrangement of multiple probe tips and the second expression of the second line where each probe itself is located; Based on the first expression and all the second expressions, determine the grinding method of the probe card.

[0009] In some embodiments, the determining the first expression of the first line formed by the arrangement of multiple probe tips and the second expression of the second line where each probe itself is located based on the image of the probe card includes: Identify multiple probe feature regions in the image of the probe card, where multiple probes in each probe feature region are closely adjacent; Calculate the first expression of the first line formed by the arrangement of multiple probe tips in each of the probe feature regions and the second expression of the second line where each probe itself is located; Determining the grinding method of the probe card based on the first expression and all the second expressions includes: Determine the grinding method corresponding to the probe feature region based on the first expression of each probe feature region and all the second expressions; Determine the grinding method of the probe card as grinding respectively using the grinding methods corresponding to each probe feature region.

[0010] In some embodiments, determining the grinding method corresponding to the probe feature region based on the first expression of each probe feature region and all the second expressions includes: For each probe feature region, when the arrangement type is the linear arrangement, calculate the third expression of the trend line of all the second lines based on all the second expressions of the probe feature region; When it is determined that the difference between the angle between the trend line of all the second lines and the first line and 90 degrees is less than a preset difference based on the third expression and the first expression, determine that the grinding method corresponding to the probe feature region is the grinding method of making a linear reciprocating motion along the trend line; When the arrangement type is the arc arrangement, calculate the radian of the first line according to the first expression, and determine the radian as the rotation angle of the circular motion; Calculate the expressions of the perpendicular lines of multiple tangents of the first line according to the first expression, and determine the trend line of all the perpendicular lines based on the expressions of all the perpendicular lines, and determine the trend line of all the perpendicular lines as the straight line where the motion direction of the linear reciprocating motion is located, and then determine the circular motion and the linear reciprocating motion; Determine that the grinding method corresponding to the probe feature region is the grinding method of the combined motion of the circular motion and the linear reciprocating motion.

[0011] In some embodiments, determining the grinding parameters corresponding to the grinding method according to the grinding method and the second preset rule includes: Determine the grinding parameters corresponding to the grinding method according to the grinding method and the corresponding relationship information between the grinding method and the grinding parameters; or Display the grinding method, and in response to receiving a grinding parameter determination instruction, obtain the grinding parameters corresponding to the grinding method according to the grinding parameter determination instruction; or Determine the motion trajectory and motion speed of the motion platform according to the grinding method; Determine the first motion parameter of the first driving part, the first motion parameter of the second driving part, and the third motion parameter of the third driving part based on the motion trajectory and the motion speed, so as to determine the grinding parameters corresponding to the grinding method.

[0012] In some embodiments, the determining the motion trajectory and the motion speed of the motion platform according to the grinding method includes: Determine the motion trajectory and the motion speed of the motion platform during the grinding process according to the grinding method; Whenever the length of the motion trajectory of the motion platform reaches a preset length, determine the motion trajectory and the motion speed of the motion platform during the non-grinding process according to the preset adjustment parameters, so that the motion platform moves a preset distance without contacting the probe card, and then contacts the probe card to continue the grinding process; Determine the motion trajectory and the motion speed of the motion platform during the entire working process based on the motion trajectory and the motion speed of the motion platform during the grinding process and the non-grinding process.

[0013] In a second aspect, an embodiment of the present application provides an electronic device, which includes: At least one processor; and, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the control method of the needle grinding machine as described in the first aspect.

[0014] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, which stores an executable program, and the executable program is executed by a processor to implement the control method of the needle grinding machine as described in the first aspect.

[0015] In a fourth aspect, an embodiment of the present application provides a needle grinding machine, which includes a main body, the electronic device as described in the second aspect, and a motion module; The electronic device is installed on the main body, and the electronic device is used to control the motion module; The motion module includes a motion platform and a driving part that can drive the motion platform to move. The motion platform is used to move under the drive of the driving part to grind the probes of the probe card; The driving part includes a first driving part, a second driving part, and a third driving part; The first driving part includes a first slider and a first electromagnetic driving member, and the first electromagnetic driving member is used to drive the first slider to move along a first direction; The second driving part includes a second slider and a second electromagnetic driving member, and the second electromagnetic driving member is used to drive the second slider to move along a second direction; The moving platform is fixedly connected to the first slider of the first driving part, the first driving part is fixedly connected to the second slider of the second driving part, the second driving part is fixedly connected to the third slider of the third driving part, the third slider can move along a third direction, and the first direction, the second direction and the third direction are different from each other.

[0016] The present application provides a control method, an electronic device, a storage medium and a needle grinding machine for a needle grinding machine. By determining the grinding method of the probe card based on the arrangement type and the first preset rule, and determining the grinding parameters according to the grinding method and the second preset rule, the present application can control the needle grinding machine to grind the probe tips of the probe card with a suitable grinding method according to the arrangement type of the probe tips, so as to avoid deformation of the probes during the grinding process, thereby improving the grinding effect. Description of the Drawings

[0017] Figure 1 is a schematic flowchart of the control method of the needle grinding machine provided by the embodiment of the present application.

[0018] Figure 2 is a schematic diagram of an image of a probe card with a linear arrangement type provided by the embodiment of the present application.

[0019] Figure 3 is a schematic diagram of an image of a probe card with an arc arrangement type provided by the embodiment of the present application.

[0020] Figure 4 is a schematic structural diagram of an electronic device provided by the embodiment of the present application.

[0021] Figure 5 is a structural block diagram of a computer-readable storage medium provided by the embodiment of the present application.

[0022] Figure 6 is a schematic three-dimensional structure diagram of the needle grinding machine provided by the embodiment of the present application.

[0023] Figure 7 is an exploded view of the needle grinding machine provided by the embodiment of the present application.

[0024] Figure 8 is a schematic diagram of the first connecting member, the first driving part and the second driving part of the needle grinding machine provided by the embodiment of the present application.

[0025] Figure 9 is a schematic diagram of the servo motor, the lead screw and the vertical movement assembly of the third driving part of the needle grinding machine provided by the embodiment of the present application. Detailed Description of the Embodiment

[0026] Next, in combination with the accompanying drawings in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0027] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0028] The present application provides a control method for a needle grinding machine, an electronic device, a storage medium, and a needle grinding machine. By determining the grinding method of the probe card based on the arrangement type and the first preset rule, and determining the grinding parameters according to the grinding method and the second preset rule, and then controlling the needle grinding machine to grind the probe tips of the probe card with a suitable grinding method according to the arrangement type of the probe tips of the probe card, it is possible to avoid the deformation of the probes during the grinding process, thereby improving the grinding effect.

[0029] The needle grinding machine involved in the present application is used to grind the probe tips of the probe card and belongs to a machine tool for grinding or polishing. The control method of the needle grinding machine of the present application belongs to a process for grinding or polishing.

[0030] Next, the control method of the needle grinding machine provided by the present application will be specifically described in combination with the accompanying drawings.

[0031] Please refer to Figure 1 , Figure 1 which is a schematic flowchart of the control method of the needle grinding machine provided by the embodiment of the present application. As Figure 1 shown, the control method of the needle grinding machine includes: step S100 to step S400.

[0032] Step S100: When the probe card is fixed by the fixing module of the needle grinding machine, obtain the arrangement type of the probe tips of the probe card.

[0033] Among them, the arrangement type of the probe tips of the probe card refers to the type of the line formed by the arrangement of the probe tips of the probe card.

[0034] In some embodiments, the types of probe cards include vertical probe cards, cantilever probe cards, etc. The arrangement types of the probe tips of the probe card include, but are not limited to, vertical arrangement, linear arrangement, arc arrangement, etc. The arrangement type of the probe tips of the vertical probe card is vertical arrangement, which means that the probes of the probe card are perpendicular to the substrate and in the vertical direction. The vertical probe card may include a vertical spring pin type probe card, which is a special vertical probe card with spring pin structures for its probes. The cantilever probe card is a probe card including a tiny cantilever beam structure, and its probes contact the wafer surface through elastic bending. There are various arrangement types of the probe tips of the cantilever probe card, including linear arrangement, arc arrangement, arbitrary shape arrangement, etc.

[0035] Step S200: Determine the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule.

[0036] Among them, the first preset rule includes that when the arrangement type is vertical arrangement, determine the grinding method of the probe card as the circular motion grinding method; when the arrangement type is linear arrangement or arc arrangement, take an image of the probe card, and determine the grinding method corresponding to the arrangement type based on the image of the probe card.

[0037] Optionally, the grinding method can be a grinding method that makes the moving platform of the needle grinding machine make any specified movement. For example, the grinding method can include circular motion grinding method, linear reciprocating motion grinding method, compound motion grinding method, reciprocating motion grinding method along an arc, reciprocating motion grinding method along an arbitrary curve, and other motion grinding methods, which are not limited herein.

[0038] Optionally, the circular motion grinding method can further include a reciprocating motion grinding method with a full circle trajectory and a reciprocating motion grinding method with a semi - circle trajectory. In the circular motion grinding method, the rotation direction can be changed.

[0039] In some embodiments, the linear reciprocating motion grinding method can include a grinding method of reciprocating motion along a specified or calculated straight line.

[0040] Optionally, the first preset rule further includes determining the grinding method corresponding to the arrangement type based on the arrangement type and the corresponding relationship information between the arrangement type and the grinding method preset, and directly determining the grinding method corresponding to the arrangement type according to the instruction input manually. At this time, step S200 includes step S210 or step S220.

[0041] Step S210: Determine the grinding method corresponding to the arrangement type based on the arrangement type and the corresponding relationship information between the arrangement type and the grinding method preset.

[0042] In some embodiments, in the correspondence information between a preset arrangement type and a grinding method, one arrangement type corresponds to one grinding method, and the grinding method corresponding to the arrangement type can be determined according to the correspondence information between the arrangement type and the grinding method.

[0043] Step S220: Display the arrangement type, and in response to receiving a grinding method determination instruction, obtain the grinding method corresponding to the arrangement type according to the grinding method determination instruction.

[0044] Optionally, the grinding method determination instruction includes the movement trajectory of a specified moving platform, and the grinding method corresponding to the arrangement type can be directly obtained according to the grinding method determination instruction.

[0045] When determining the grinding method corresponding to the arrangement type, the moving platform needs to move along the straight line where the probe itself is located as much as possible to reduce the friction force on the probe tip in the direction not along the straight line where the probe itself is located, thereby reducing the deformation degree of the probe. For example, when the straight line where the probe itself is located is in the X-axis direction, the moving platform is made to reciprocate along the X-axis direction, so that the probe tip will not be deformed due to the friction in the Y-axis direction. Here, the X-axis is perpendicular to the Y-axis.

[0046] In some embodiments, the arrangement types include linear arrangement, vertical arrangement, and arc arrangement. Step S200 includes steps S230 to S260.

[0047] Step S230: When the arrangement type is a vertical arrangement, determine the grinding method of the probe card as a circular motion grinding method.

[0048] When the arrangement type is a vertical arrangement, the probe is perpendicular to the plane where the moving platform is located. Therefore, the grinding method of the probe card can be determined as a circular motion grinding method. During the circular motion of the moving platform, the friction force on the probe tip in a certain direction will not be continuously generated, so the deformation degree of the probe can be reduced.

[0049] Step S240: When the arrangement type is a linear arrangement or an arc arrangement, take an image of the probe card.

[0050] When the arrangement type is a linear arrangement or an arc arrangement, in order to determine the first line formed by the arrangement of the probe tips and the second line where each probe itself is located, and further determine the movement direction of the moving platform, it is necessary to take an image of the probe card.

[0051] Step S250: Based on the image of the probe card, determine the first expression of the first line formed by the arrangement of multiple probe tips and the second expression of the second line where each probe itself is located.

[0052] In some embodiments, an image recognition model is used to identify the feature regions of the probe tips and the feature regions of the probes themselves in the image of the probe card, and then the first expression of the first line formed by arranging a plurality of probe tips and the second expression of the second line where each probe itself is located can be determined.

[0053] Optionally, the first expression and the second expression in the plane coordinate system of the plane where the motion platform is located can be determined according to the image.

[0054] In some embodiments, step S250 includes steps S251 to S252.

[0055] Step S251: Identify a plurality of probe feature regions in the image of the probe card.

[0056] Among them, a plurality of probes in each probe feature region are closely adjacent to each other.

[0057] In some embodiments, the probe card includes a plurality of probe groups, a plurality of probes in each probe group are closely adjacent to each other, and each probe group is not adjacent to other probe groups. In the image of the probe card, one probe feature region corresponds to represent one probe group.

[0058] Optionally, in each probe group, the straight lines where the first lines formed by arranging a plurality of probe tips are located are different, so the motion directions of the motion platform also need to be correspondingly different, and a method of separately grinding each probe group can be adopted.

[0059] Step S252: Calculate the first expression of the first line formed by arranging a plurality of probe tips and the second expression of the second line where each probe itself is located in each probe feature region.

[0060] Please refer to Figure 2 and Figure 3 , Figure 2 is a schematic diagram of the image of the probe card when the arrangement type provided in the embodiment of the present application is a linear arrangement, Figure 3 is a schematic diagram of the image of the probe card when the arrangement type provided in the embodiment of the present application is an arc arrangement. As Figure 2 shown, the image 2 of the probe card includes a probe feature region A1 and a probe feature region A2, Figure 2 shows the first line L1 and 4 second lines L2 of the probe feature region A1, and the second line L2 is a straight line. The probe feature region A1 and the probe feature region A2 respectively represent different probe groups. As Figure 3 shown, in the probe feature region A3, the second line L2 is an arc line.

[0061] It can be understood that the number of probes on the probe card is relatively large. For example, one probe group may include 1000 probes, Figure 2 andFigure 3 Only a few first lines are drawn for illustration purposes.

[0062] Step S260: Determine the grinding method of the probe card based on the first expression and all second expressions.

[0063] In some embodiments, step S260 includes steps S261 to S264.

[0064] Step S261: Determine the grinding method corresponding to the probe feature region based on the first expression of each probe feature region and all second expressions.

[0065] In some embodiments, step S261 includes steps S2611 to S2615.

[0066] Step S2611: For each probe feature region, when the arrangement type is a linear arrangement, calculate the third expression of the trend line of all second lines based on all second expressions of the probe feature region.

[0067] In some embodiments, the third expression of the trend line of all second lines is calculated based on all second expressions using the least squares method. The trend line of all second lines is used to represent the overall direction trend of all second lines.

[0068] Step S2612: When it is determined that the difference between the angle between the trend line of all second lines and the first line and 90 degrees is less than a preset difference based on the third expression and the first expression, determine that the grinding method corresponding to the probe feature region is a grinding method of making a linear reciprocating motion along the trend line.

[0069] Optionally, the preset difference can be 5 degrees, 10 degrees, 15 degrees, etc.

[0070] As Figure 2 shown, when the arrangement type is a linear arrangement, the second lines L2 in the probe feature region A1 tend to be approximately parallel to each other. When it is determined that the difference between the angle between the trend line of all second lines and the first line and 90 degrees is less than a preset difference based on the third expression and the first expression, it can be determined that the grinding method corresponding to the probe feature region is a grinding method of making a linear reciprocating motion along the trend line. In this way, the friction force on the probe tip in a direction not along the straight line where the probe itself is located can be reduced, thereby reducing the deformation degree of the probe.

[0071] In some embodiments, when it is determined based on the third expression and the first expression that the difference between the angle formed by the trend line of all the second lines and the first line and 90 degrees is not less than a preset difference, the grinding method corresponding to the probe feature area can be determined as a compound motion of a linear reciprocating sub-motion and a circumferential sub-motion along the trend line. Optionally, the rotation angle of the circumferential sub-motion can be the angle of the angle formed by the trend line and the first line. In this way, while reducing the frictional force on the probe tip in a direction not along the straight line where the probe itself is located, the probe tip can be fully ground from different angles, thereby improving the grinding effect.

[0072] In some other embodiments, when it is determined based on the third expression and the first expression that the difference between the angle formed by the trend line of all the second lines and the first line and 90 degrees is not less than a preset difference, the grinding method corresponding to the probe feature area can also be determined as a grinding method of a linear reciprocating motion along the trend line.

[0073] Step S2613: When the arrangement type is an arc arrangement, calculate the radian of the first line according to the first expression, and determine the radian as the rotation angle of the circumferential sub-motion.

[0074] As Figure 3 shown, when the arrangement type is an arc arrangement, the second lines L2 in the probe feature area A3 often do not parallel to each other, and may even intersect. At this time, if a linear reciprocating motion grinding method is used, for some probe tips, there will always be a frictional force in a direction not along the straight line where the probe itself is located, which is likely to cause deformation. However, if the grinding method is a circular motion, it will also cause some probe tips to always be subject to a frictional force in a direction not along the straight line where the probe itself is located. Therefore, when the arrangement type is an arc arrangement, a compound motion grinding method of a circumferential sub-motion and a linear reciprocating sub-motion can be used.

[0075] Step S2614: Calculate the expressions of the perpendiculars to multiple tangents of the first line according to the first expression, determine the trend line of all the perpendiculars based on the expressions of all the perpendiculars, and determine the trend line of all the perpendiculars as the straight line where the motion direction of the linear reciprocating sub-motion is located, and then determine the circumferential sub-motion and the linear reciprocating sub-motion.

[0076] As Figure 3 shown, when the arrangement type is an arc arrangement, the second line L2 will be approximately located on the perpendicular to one tangent of the first line. Determining the trend line of all the perpendiculars as the straight line where the motion direction of the linear reciprocating sub-motion is located can make the speed direction of the motion platform as close as possible to the second line where the probe itself is located, thereby reducing the frictional force on the probe tip in a direction not along the straight line where the probe itself is located.

[0077] Step S2615: Determine that the grinding method corresponding to the probe feature area is a composite movement grinding method of circular divided movement and linear reciprocating divided movement.

[0078] When the moving platform performs a composite movement of circular divided movement and linear reciprocating divided movement, the tangential velocity of the circular divided movement can be partially offset, so that the velocity direction of the moving platform is as close as possible to the second line where the probe itself is located, reducing the friction force on the probe tip in the direction not along the straight line where the probe itself is located, and avoiding deformation of the probe during the grinding process.

[0079] Step S262: Determine the grinding method of the probe card as grinding respectively using the grinding method corresponding to each probe feature area.

[0080] In some embodiments, during the grinding process, a grinding abrasive paper is fixed on the moving platform. When the area of the pre-fixed grinding abrasive paper is smaller than the area occupied by any two probe groups of the probe card, it is possible to grind only one probe group each time. Optionally, by pre-fixing the grinding abrasive paper with a shape designed for the probe card, multiple probe groups corresponding to the same grinding method can be ground together.

[0081] Optionally, by controlling the movement of the moving platform, the position of the grinding area where the grinding abrasive paper contacts the probe tip can be controlled, so that multiple probe groups corresponding to the same grinding method are ground together.

[0082] In some embodiments, the probe feature area may not be recognized, and the grinding method corresponding to the arrangement type is directly determined according to the arrangement type. At this time, as described above, step S200 includes step S210 or step S220.

[0083] As described above, the present application does not limit the arrangement type. For other arrangement types, only calculate the movement method that makes the velocity direction of the moving platform as close as possible to the second line where the probe itself is located according to the first expression and the second expression, and then determine the grinding method according to the movement method.

[0084] Optionally, an artificial intelligence model can be used to calculate the movement method of the moving platform according to the first expression and the second expression. The artificial intelligence model can be a deep Q network model or a neural network model, etc.

[0085] Step S300: Determine the grinding parameters corresponding to the grinding method according to the grinding method and the second preset rule.

[0086] Among them, the grinding parameters include the first motion parameter of the first driving part of the needle grinding machine, the first motion parameter of the second driving part, and the third motion parameter of the third driving part. The first driving part is used to drive the moving platform of the needle grinding machine to move in the first direction, the second driving part is used to drive the moving platform to move in the second direction, and the third driving part is used to drive the moving platform to move in the third direction. The first direction, the second direction, and the third direction are different from each other. The moving platform is used to grind the probe tips of the probe card.

[0087] Optionally, the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0088] In some embodiments, the first direction is the Y-axis of the spatial coordinate system, the second direction is the X-axis of the spatial coordinate system, and the third direction is the Z-axis of the spatial coordinate system. The plane where the X-axis and the Y-axis are located is the horizontal plane, and the Z-axis direction is the vertical direction.

[0089] Optionally, the first motion parameter includes motion speed, motion direction, number of motions, distance of one motion, etc.

[0090] Optionally, the second motion parameter includes motion speed, motion direction, number of motions, distance of one motion, etc.

[0091] Optionally, the third motion parameter includes the needle grinding height, rising speed, number of rises, height of one rise, falling speed, speed of returning to the origin, and falling speed after the grinding process ends during the grinding process.

[0092] In some embodiments, step S300 includes step S310, step S320, or steps S330 to S340.

[0093] Step S310: Determine the grinding parameters corresponding to the grinding method according to the grinding method and the corresponding relationship information between the preset grinding method and the grinding parameters.

[0094] In some embodiments, in the corresponding relationship information between the preset grinding method and the grinding parameters, one grinding method corresponds to a set of grinding parameters. According to the grinding method and the corresponding relationship information between the grinding method and the grinding parameters, the grinding parameters corresponding to the grinding method can be determined.

[0095] Optionally, in the corresponding relationship information between the preset grinding method and the grinding parameters, one grinding method corresponds to multiple sets of grinding parameters. The grinding method and the corresponding multiple sets of grinding parameters can be displayed, and in response to receiving a grinding parameter determination instruction, the grinding parameters corresponding to the grinding method are obtained according to the grinding parameter determination instruction.

[0096] In some embodiments, the number, needle grinding height, number of movements of the moving platform, number of rises of the third driving part, height of one rise, and current position of each set of grinding parameters can be displayed.

[0097] Step S320: displaying the grinding method, and in response to receiving the grinding parameter determination instruction, obtaining the grinding parameters corresponding to the grinding method according to the grinding parameter determination instruction.

[0098] In some embodiments, the manually input grinding parameters can be obtained according to the grinding parameter determination instruction. In this way, the grinding method can be any grinding method, which increases the diversity of the grinding methods. When the arrangement type is more complex, the probe can also be ground specifically.

[0099] In some embodiments, when the grinding method has been calculated and determined, the grinding method can be displayed, and the movement speed and movement time of the first drive unit, the second drive unit, and the third drive unit of the needle grinder in the grinding parameters corresponding to the manually input grinding method are obtained according to the grinding parameter determination instruction. At this time, the movement directions of the first drive unit, the second drive unit, and the third drive unit can be automatically determined according to the grinding method.

[0100] In step S330 and step S340 , the grinding parameters can be automatically calculated according to the grinding method.

[0101] Step S330: determining the motion trajectory and motion speed of the motion platform according to the grinding method.

[0102] Exemplarily, when the grinding method is a linear reciprocating grinding method along a trend line, the motion trajectory of the motion platform can be determined as a partial line segment on the trend line, and the motion speed corresponding to the grinding method can be determined based on the correspondence information between the preset grinding method and the motion speed.

[0103] Step S340: determining a first motion parameter of the first driving unit, a first motion parameter of the second driving unit, and a third motion parameter of the third driving unit based on the motion trajectory and the motion speed, thereby determining a grinding parameter corresponding to the grinding method.

[0104] In some embodiments, according to the mechanical connection relationship between the first driving unit, the second driving unit, the third driving unit and the moving platform, a conversion model between the motion trajectory and the motion speed of the moving platform and the grinding parameters can be predetermined. The conversion model can be used to determine the first motion parameter of the first driving unit, the first motion parameter of the second driving unit and the third motion parameter of the third driving unit based on the motion trajectory and the motion speed, thereby determining the grinding parameters corresponding to the grinding method.

[0105] In some embodiments, step S340 includes steps S341 to S343.

[0106] Step S341: determining the motion trajectory and motion speed of the motion platform during the grinding process according to the grinding method.

[0107] Step S342: Whenever the length of the movement trajectory of the moving platform reaches a preset length, determine the movement trajectory and movement speed of the moving platform during the non-grinding process according to preset adjustment parameters, so that the moving platform moves a preset distance without contacting the probe card, and then contacts the probe card to continue the grinding process.

[0108] During the grinding process, control the moving platform fixed with the grinding sandpaper to reciprocate, so that a grinding area on the grinding sandpaper is worn. When the grinding sandpaper is worn, the grinding efficiency will decrease.

[0109] In some embodiments, whenever the length of the movement trajectory of the moving platform reaches a preset length, it can be determined that the wear degree of a grinding area on the currently used grinding sandpaper exceeds a preset degree. According to the preset adjustment parameters, the movement trajectory and movement speed of the moving platform during the non-grinding process can be determined. According to the movement trajectory and movement speed of the moving platform during the non-grinding process, the moving platform can be controlled to move a preset distance without contacting the probe card, and then a grinding area on the grinding sandpaper with a wear degree lower than the preset degree is made to contact the probe card to continue the grinding process. In this way, compared with the existing method of only grinding in circles with a fixed area of the grinding sandpaper, the grinding sandpaper can be fully utilized and the grinding efficiency can be improved.

[0110] Step S343: Determine the movement trajectory and movement speed of the moving platform during the entire working process based on the movement trajectory and movement speed of the moving platform during the grinding process and the non-grinding process.

[0111] Step S400: Based on the grinding parameters, control the first driving part, the second driving part and the third driving part of the needle grinding machine to drive the moving platform to move, so as to grind the probe tips of the probe card in the corresponding grinding mode of the probe card.

[0112] In some embodiments, the needle grinding machine further includes an alarm device. The method further includes: when the alarm device detects an abnormal grinding process, display the alarm content. Wherein, the alarm content includes the current date, the alarm trigger time, the content of the abnormal situation, the recovery time, etc.

[0113] In some embodiments, a list of all abnormal situations that can trigger an alarm can be displayed, and a function area for clearing the alarm content area can be displayed.

[0114] In some embodiments, the monitoring content of the grinding process can also be displayed. Wherein, the monitoring content can include the operating parameters of the first driving part, the second driving part and the third driving part during the grinding process. The operating parameters can include the number of movements and the movement distance, etc.

[0115] In some embodiments, the main body of the needle grinding machine further includes a display screen. The method further includes: displaying an initial interface, and when receiving and passing the administrator identity login information, displaying a system version list; in response to a system version selection instruction, controlling the control interface of the control system corresponding to the selected version according to the system version selection instruction. Wherein, each system version corresponds to a model of the needle grinding machine. In the control system, grinding parameter limits are preset for each model of the needle grinding machine. For example, for the model of the needle grinding machine, the maximum movement distances of the first driving part, the second driving part, and the third driving part of the needle grinding machine are limited.

[0116] In some embodiments, the method further includes: in response to receiving a zero point setting instruction, setting the current position of the moving platform of the needle grinding machine as the zero point according to the zero point setting instruction.

[0117] In summary, the control method of the needle grinding machine provided by the embodiments of the present application has the following advantages: 1. By determining the grinding method of the probe card based on the arrangement type and the first preset rule, and determining the grinding parameters according to the grinding method and the second preset rule, and then controlling the needle grinding machine to grind the probe tips of the probe card with a suitable grinding method according to the arrangement type of the probe tips, it is possible to avoid deformation of the probes during grinding, thereby improving the grinding effect.

[0118] 2. When the arrangement type is vertical arrangement, by determining the grinding method of the probe card as a circular motion grinding method, during the circular motion of the moving platform, continuous friction force on the probe tips in a certain direction will not be generated, so the deformation degree of the probes can be reduced.

[0119] 3. When it is determined that the difference between the included angle between the trend lines of all the second lines and the first line and 90 degrees is not less than the preset difference based on the third expression and the first expression, by determining the grinding method corresponding to the probe feature area as a compound motion of a linear reciprocating sub-motion and a circular sub-motion along the trend line, while reducing the friction force on the probe tips in a direction not along the straight line where the probes are located, the probe tips can be fully ground from different angles, thereby improving the grinding effect.

[0120] 4. When the arrangement type is arc arrangement, by determining the grinding method corresponding to the probe feature area as a compound motion of a circular sub-motion and a linear reciprocating sub-motion, the tangential velocity of the circular sub-motion can be partially offset, so that the velocity direction of the moving platform is as close as possible to the second line where the probes are located, reducing the friction force on the probe tips in a direction not along the straight line where the probes are located, and avoiding deformation of the probes during grinding.

[0121] 5. By determining the movement trajectory and movement speed of the movement platform during the non-grinding process according to the preset adjustment parameters whenever the length of the movement trajectory of the movement platform reaches the preset length, so that the movement platform moves a preset distance without contacting the probe card and then contacts the probe card to continue the grinding process, compared with the existing method of only grinding in a circular motion in a fixed area of the grinding sandpaper, the grinding sandpaper can be fully utilized and the grinding efficiency can be improved.

[0122] Please refer to Figure 4 , Figure 4 which is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As Figure 4 shown, the electronic device 400 includes: one or more processors 410 and a memory 420. Figure 4 Here, one processor 410 is taken as an example.

[0123] In some embodiments, the processor 410 and the memory 420 can be connected by a bus or other means. Figure 4 Here, connection by a bus is taken as an example.

[0124] In some embodiments, the processor 410 is configured to, when the probe card has been fixed by the fixing module of the needle grinding machine, obtain the arrangement type of the probe tips of the probe card; determine the grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule, the first preset rule includes that when the arrangement type is a vertical arrangement, determining the grinding method of the probe card as a circular motion grinding method, and when the arrangement type is a linear arrangement or an arc arrangement, taking an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card; determining the grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule, the grinding parameters include the first movement parameters of the first driving part of the needle grinding machine, the first movement parameters of the second driving part, and the third movement parameters of the third driving part, the first driving part is used to drive the movement platform of the needle grinding machine to move in a first direction, the second driving part is used to drive the movement platform to move in a second direction, the third driving part is used to drive the movement platform to move in a third direction, the first direction, the second direction and the third direction are different from each other, and the movement platform is used to grind the probe tips of the probe card; controlling the first driving part, the second driving part and the third driving part of the needle grinding machine to drive the movement platform to move based on the grinding parameters, so as to grind the probe tips of the probe card by using the grinding method corresponding to the probe card.

[0125] In some embodiments, the memory 420 serves as a non-volatile computer-readable storage medium and can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as program instructions / modules for the control method of the needle grinding machine in the embodiments of the present application. The processor 410 executes various functional applications and data processing of the electronic device 400 by running the non-volatile software programs, instructions, and modules stored in the memory 420, that is, implements the control method of the needle grinding machine in the above method embodiments.

[0126] In some embodiments, the memory 420 may include a program storage area and a data storage area. Among them, the program storage area can store an operating system and application programs required for at least one function; the data storage area can store data created according to the use of the electronic device 400, etc. In addition, the memory 420 may include high-speed random access memory and may also include non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage devices. In some embodiments, the memory 420 optionally includes a memory remotely arranged relative to the processor 410, and these remote memories can be connected to the controller through a network. Examples of the above network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0127] In some embodiments, one or more modules are stored in the memory 420, and when executed by one or more processors 410, they execute the control method of the needle grinding machine in any of the above method embodiments. For example, they execute the method steps S100 to step S400 described above. Figure 1 in.

[0128] Please refer to Figure 5 , Figure 5 is a structural block diagram of a computer-readable storage medium provided by an embodiment of the present application. Program code 510 is stored in the computer-readable storage medium 500, and the program code 510 can be called by a processor to execute the control method of the needle grinding machine described in the above method embodiments.

[0129] The computer-readable storage medium 500 can be an electronic memory such as a flash memory, an Electrically Erasable Programmable Read Only Memory (EEPROM), a hard disk, or a Read-Only Memory (ROM). Optionally, the computer-readable storage medium includes a non-volatile computer-readable medium. The computer-readable storage medium 500 has a storage space for program codes that execute any of the method steps in the above-described control method of the needle grinding machine. These program codes can be read out from or written into one or more computer program products. The program codes can be compressed in an appropriate form, for example.

[0130] This application also provides a needle grinding machine. Please refer to Figure 6 , Figure 6 which is a schematic three-dimensional structure diagram of the needle grinding machine provided by an embodiment of this application. As Figure 6 shown, in some embodiments, the needle grinding machine 1 includes a main body 10, the above-described electronic device, and a motion module 20. The electronic device is installed on the main body 10, and the electronic device is used to control the motion module 20.

[0131] Optionally, the main body 10 includes a cabinet body having an accommodation space, and the cabinet body has a cabinet door installed at the opening of the cabinet body in a movable connection manner. Both the electronic device 400 and the motion module 20 are disposed in the accommodation space of the cabinet body.

[0132] In some embodiments, the motion module 20 includes a motion platform 21 and a driving part D that can drive the motion platform 21 to move. The motion platform 21 is used to move under the drive of the driving part D to grind the probes of the probe card.

[0133] In some embodiments, a working platform 11 is provided on the main body 10 of the needle grinding machine 1. The needle grinding machine 1 further includes a fixing module 30. The fixing module 30 is disposed on the working platform 11. The fixing module 30 includes multiple groups of symmetrically arranged fixing brackets. The multiple groups of fixing brackets are used to fix the probe card at a position corresponding to the motion platform 21 in the working window 40. The motion platform 21 can move in the working window 40 under the drive of the driving part D to grind the probes of the probe card.

[0134] Optionally, the material of the working platform 11 is marble.

[0135] Please refer to Figure 7 , Figure 7 which is an exploded view of the needle grinding machine provided by an embodiment of this application. As Figure 7As shown, in some embodiments, multiple groups of symmetrically arranged fixing brackets include a first fixing bracket 31 for fixing a square probe card and a second fixing bracket 32 for fixing a circular probe card.

[0136] As Figure 6 shown, in some embodiments, a first image module 50 and a second image module 60 are further provided on the work platform 11.

[0137] Optionally, the first image module 50 includes a first robotic arm 51 provided on the work platform 11, a microscopic imaging device 52 provided on the first robotic arm 51, and a first display screen 53. The first robotic arm 51 can drive the microscopic imaging device 52 to move, and the first display screen 53 can display the image obtained by the microscopic imaging device 52 taking a picture of the probe card from a first angle.

[0138] Optionally, the second image module 60 includes a camera 61 provided on the work platform 11 and a second display screen 62. The second display screen 62 can display the image obtained by the camera 61 taking a picture of the probe card from a second angle, and the second angle is different from the first angle.

[0139] Optionally, there are multiple cameras 61 in the second image module 60, and the multiple cameras 61 are arranged at different positions on the work platform 11. Therefore, the shooting angles of each camera 61 can be different.

[0140] In some embodiments, in step S240, the camera 61 provided on the work platform 11 and directly above the work window 40 in the second image module 60 can be controlled to take an image of the probe card.

[0141] As Figure 6 shown, in some embodiments, a third display screen 70 and multiple operation buttons 80 are further provided on the main body 10 of the needle grinding machine 1. The third display screen 70 is used to display the control interface of the needle grinding machine 1 system. Optionally, the third display screen 70 can be a touch screen. The multiple operation buttons 80 can include a start button, an emergency stop button, a reset button, etc.

[0142] As Figure 7 shown, in some embodiments, a plurality of mounting holes K arranged according to a preset arrangement relationship for installing magnetic fixing members are provided at positions corresponding to each fixing bracket on the work platform 11. At this time, the fixing bracket can include a magnet that attracts the magnetic fixing member.

[0143] Optionally, the magnetic fixing member can be a magnetic strip.

[0144] In some embodiments, a planar calibration device is further provided on the working platform 11. The planar calibration device includes a guide rod arranged in the vertical direction, a sliding component slidably sleeved on the guide rod, and a micrometer device mounted on the sliding component. The micrometer device faces the plane where the working platform 11 is located. The micrometer device is used to measure the distance between the moving platform 21 and the micrometer device, so that the staff can adjust the moving platform 21 to make the upper surface of the moving platform 21 and the working platform 11 in the same plane, so that the moving platform 21 can uniformly grind the probe.

[0145] As Figure 7 shown, optionally, the driving part D includes a first driving part D1, a second driving part D2 and a third driving part D3. Both the first driving part D1 and the second driving part D2 include linear motors. The first driving part D1 includes a first slider D11 and a first electromagnetic driving member D12, and the first electromagnetic driving member D12 is used to drive the first slider D11 to move along the first direction. The second driving part D2 includes a second slider and a second electromagnetic driving member, and the second electromagnetic driving member is used to drive the second slider to move along the second direction.

[0146] Optionally, the first electromagnetic driving member D12 and the second electromagnetic driving member can be iron cores or magnetic cores. When the first driving part D1 is powered on, the first electromagnetic driving member D12 can drive the first slider D11 to move along the first direction through electromagnetic action. When the second driving part D2 is powered on, the second electromagnetic driving member can drive the second slider to move along the second direction through electromagnetic action.

[0147] In some embodiments, the third driving part D3 includes a third slider D34. Optionally, the third driving part D3 further includes a servo motor, a lead screw and a vertical motion component. The vertical motion component is fixedly connected to the third slider, and the servo motor is used to drive the lead screw to rotate, and the vertical motion component can convert the rotational motion of the lead screw into the motion of the third slider in the vertical direction.

[0148] In some embodiments, the moving platform 21 is fixedly connected to the first slider D11 of the first driving part D1, the first driving part D1 is fixedly connected to the second slider of the second driving part D2, the second driving part D2 is fixedly connected to the third slider D34 of the third driving part D3, the third slider D34 can move along the third direction, and the first direction, the second direction and the third direction are different from each other.

[0149] As Figure 7 shown, in some embodiments, the moving platform 21 includes a first connecting plate 211 and a second connecting plate 212. Please refer to Figure 8 , Figure 8 is a schematic diagram of the first connecting member, the first driving part and the second driving part of the needle grinding machine provided by the embodiment of the present application. As Figure 8As shown, in some embodiments, the first connecting plate 211 is fixedly connected to the first slider D11, and the second connecting plate 212 is fixedly connected to the first connecting plate 211. The first connecting plate 211 includes a first hole 2111. The first driving part D1 further includes a first grating scale and a fourth slider D13 connected to the sliding part G1 of the first grating scale. The fourth slider D13 is embedded in the first hole 2111 and fixedly connected to the first connecting plate 211 through a plurality of fasteners.

[0150] Optionally, the fasteners can be screws, rivets, etc.

[0151] Through the first connecting plate 211, the moving platform 21 can move driven by the first slider D11 of the first driving part D1. When the first connecting plate 211 moves, it can drive the fourth slider D13 connected to the sliding part G1 of the first grating scale to move, thereby enabling the first grating scale to work. Through the first grating scale, high-precision position feedback control of the linear motor of the first driving part D1 can be achieved, so as to accurately control the movement of the moving platform 21.

[0152] In some embodiments, at the position where the first driving part D1 is close to the second driving part D2, there is also a third connecting plate, and the third connecting plate is fixedly connected to the second slider of the second driving part D2. Optionally, the third connecting plate includes a second hole. The second driving part D2 further includes a second grating scale and a fifth slider connected to the sliding part of the second grating scale. The fifth slider is embedded in the second hole and fixedly connected to the third connecting plate through a plurality of fasteners. Through the third connecting plate, the first driving part D1 can move driven by the second slider of the second driving part D2. When the third connecting plate moves, it can drive the fifth slider connected to the sliding part of the second grating scale to move, thereby enabling the second grating scale to work. Through the second grating scale, high-precision position feedback control of the linear motor of the second driving part D2 can be achieved, so as to accurately control the movement of the first driving part D1.

[0153] In some embodiments, the first driving part D1 further includes a first limiting device D14, and the first limiting device D14 can limit the movement of the first slider D11 in the first direction. When the first limiting device D14 is triggered by the first slider D11, the first electromagnetic driving part D12 can be made to stop driving the first slider D11 to move.

[0154] In some embodiments, the second driving part D2 further includes a second limiting device, and the second limiting device can limit the movement of the second slider in the second direction. When the second limiting device is triggered by the second slider, the second electromagnetic driving part can be made to stop driving the second slider to move.

[0155] Optionally, the first limiting device D14 or the second limiting device can be a limiting sensor, and the limiting sensor can include a photoelectric limiting sensor, a contact limiting sensor, an electromagnetic induction limiting sensor, etc.

[0156] In some embodiments, the first driving part D1 further includes first slide rails D15. There are two first slide rails D15, and each first slide rail D15 includes a first slide rail groove D151, a first slide rail assembly D152, and a second slide rail assembly D153. The first slide rail assembly D152 is fixedly connected to the moving platform 21 and is located within the first slide rail groove D151. The second slide rail assembly D153 is fixedly arranged on the first slide rail groove D151 and is parallel to the first slide rail assembly D152. The second slide rail assembly D153 can restrict the first slide rail assembly D152 to slide within the first slide rail groove D151.

[0157] Optionally, the first slide rail assemblies D152 of the two first slide rails D15 are fixedly connected to the first connecting plate 211 of the moving platform 21. Through the two first slide rails D15, the moving platform 21 can be restricted to slide in the first direction determined by the first slide rail groove D151.

[0158] In some embodiments, the second driving part D2 further includes second slide rails. There are two second slide rails. Each second slide rail includes a second slide rail groove, a third slide rail assembly, and a fourth slide rail assembly. The third slide rail assembly is fixedly connected to the first driving part D1 and is located within the second slide rail groove. The fourth slide rail assembly is fixedly arranged on the second slide rail groove and is parallel to the third slide rail assembly. The fourth slide rail assembly can restrict the third slide rail assembly to slide within the second slide rail groove.

[0159] Optionally, the third slide rail assemblies of the two second slide rails are fixedly connected to the third connecting plate of the first driving part D1. Through the two second slide rails, the first driving part D1 can be restricted to slide in the second direction determined by the second slide rail groove. At the same time, the first driving part D1 can drive the moving platform 21 to move in the first direction, and the third driving part D3 can drive the second driving part D2 to move in the third direction, so that the moving platform 21 can perform a composite movement in the first direction, the second direction, and the third direction. Since the first direction, the second direction, and the third direction are different from each other, the driving part D can drive the moving platform 21 to move arbitrarily in space.

[0160] As Figure 8 shown, in some embodiments, a first slide rail adjusting device D154 is arranged on the second slide rail assembly D153. The first slide rail adjusting device D154 can adjust the fixed position of the second slide rail assembly D153 to adjust the first distance between the first slide rail assembly D152 and the second slide rail assembly D153.

[0161] In some embodiments, a second slide rail adjusting device is arranged on the second slide rail assembly D153. The second slide rail adjusting device can adjust the fixed position of the fourth slide rail assembly to adjust the second distance between the third slide rail assembly and the fourth slide rail assembly.

[0162] Optionally, the first slide rail adjusting device D154 or the second slide rail adjusting device may include screws, rivets, etc.

[0163] Please refer to Figure 9 , Figure 9 which is a schematic diagram of the servo motor, lead screw, and vertical motion component of the third driving part of the needle grinding machine provided by the embodiment of the present application. As Figure 9 shown, in some embodiments, the third driving part D3 further includes a servo motor D31, a lead screw D32, and a vertical motion component D33. The servo motor D31 is connected to the lead screw D32, the lead screw D32 is movably connected to the vertical motion component D33, the vertical motion component D33 is fixedly connected to the third slider D34, and the vertical motion component D33 can convert the rotational motion of the lead screw D32 into the motion of the third slider D34 in the vertical direction, and the third direction is the vertical direction.

[0164] Optionally, the vertical motion component D33 includes a fifth slide rail assembly D331 and a sixth slide rail assembly D332. The third slider D34 is slidably connected to the fifth slide rail assembly D331 and the sixth slide rail assembly D332. The lead screw D32 movably passes through the vertical motion component D33. When the servo motor D31 drives the lead screw D32 to rotate, the lead screw D32 drives the vertical motion component D33 to move horizontally, and at the same time, the third slider D34 can move in the vertical direction under the guidance of the fifth slide rail assembly D331 and the sixth slide rail assembly D332.

[0165] In some embodiments, the third driving part D3 further includes a home position detection device D35 provided on the vertical motion component D33. The home position detection device D35 is used to detect whether the vertical motion component D33 moves to a preset home position.

[0166] In summary, the present application provides a control method for a needle grinding machine, an electronic device, a storage medium, and a needle grinding machine. The control method for the needle grinding machine includes: when the probe card has been fixed by the fixing module of the needle grinding machine, obtaining the arrangement type of the probe tips of the probe card; determining the grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule, where the first preset rule includes that when the arrangement type is a vertical arrangement, determining the grinding method of the probe card as a circular motion grinding method, and when the arrangement type is a linear arrangement or an arc arrangement, taking an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card; determining the grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule, where the grinding parameters include the first motion parameters of the first driving part of the needle grinding machine, the first motion parameters of the second driving part, and the third motion parameters of the third driving part. The first driving part is used to drive the moving platform of the needle grinding machine to move in a first direction, the second driving part is used to drive the moving platform to move in a second direction, the third driving part is used to drive the moving platform to move in a third direction, the first direction, the second direction, and the third direction are different from each other, and the moving platform is used to grind the probe tips of the probe card; controlling the first driving part, the second driving part, and the third driving part of the needle grinding machine to drive the moving platform to move based on the grinding parameters, so as to grind the probe tips of the probe card by using the grinding method corresponding to the probe card. By determining the grinding method of the probe card based on the arrangement type and the first preset rule, and determining the grinding parameters according to the grinding method and the second preset rule, and then controlling the needle grinding machine to grind the probe tips by using a suitable grinding method according to the arrangement type of the probe tips of the probe card, the present application can avoid the deformation of the probes during the grinding process, thereby improving the grinding effect.

[0167] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A control method for a needle grinding machine, characterized in that Including: When the probe card is fixed by the fixing module of the needle grinding machine, obtaining the arrangement type of the probe tips of the probe card; Determining the grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule, where the first preset rule includes that when the arrangement type is a vertical arrangement, determining the grinding method of the probe card as a circular motion grinding method, and when the arrangement type is a linear arrangement or an arc arrangement, taking an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card; Determining the grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule, where the grinding parameters include the first motion parameters of the first driving part of the needle grinding machine, the first motion parameters of the second driving part, and the third motion parameters of the third driving part. The first driving part is used to drive the motion platform of the needle grinding machine to move in a first direction, the second driving part is used to drive the motion platform to move in a second direction, the third driving part is used to drive the motion platform to move in a third direction, the first direction, the second direction, and the third direction are different from each other, and the motion platform is used to grind the probe tips of the probe card; Controlling the first driving part, the second driving part, and the third driving part of the needle grinding machine to drive the motion platform to move based on the grinding parameters, so as to grind the probe tips of the probe card by using the grinding method corresponding to the probe card.

2. The control method of the needle grinding machine according to claim 1, wherein The determining the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule includes: Determining the grinding method corresponding to the arrangement type based on the arrangement type and the corresponding relationship information between the arrangement type and the grinding method preset; or Displaying the arrangement type, and in response to receiving a grinding method determination instruction, obtaining the grinding method corresponding to the arrangement type according to the grinding method determination instruction.

3. The control method of the needle grinding machine according to claim 1, wherein, The arrangement type includes a linear arrangement, a vertical arrangement, and an arc arrangement. The determining the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule includes: When the arrangement type is a vertical arrangement, determining the grinding method of the probe card as a circular motion grinding method; When the arrangement type is the linear arrangement or the arc arrangement, taking an image of the probe card; Determining a first expression of a first line formed by arranging a plurality of probe tips and a second expression of a second line where each probe itself is located based on the image of the probe card; Determining the grinding method of the probe card based on the first expression and all the second expressions.

4. The control method of the needle grinding machine according to claim 3, characterized in that, The determining a first expression of a first line formed by arranging a plurality of probe tips and a second expression of a second line where each probe itself is located based on the image of the probe card includes: Identifying a plurality of probe feature regions in the image of the probe card, where a plurality of probes in each probe feature region are closely adjacent to each other; Calculating a first expression of a first line formed by arranging a plurality of probe tips and a second expression of a second line where each probe itself is located in each probe feature region; Determining the grinding method of the probe card based on the first expression and all the second expressions includes: Determining the grinding method corresponding to each probe feature area based on the first expression and all the second expressions of each probe feature area; Determining the grinding method of the probe card as grinding respectively using the grinding methods corresponding to each probe feature area.

5. The control method of the needle grinding machine according to claim 4, characterized in that, The determining the grinding method corresponding to each probe feature area based on the first expression and all the second expressions of each probe feature area includes: For each probe feature area, when the arrangement type is the linear arrangement, calculating a third expression of the trend line of all the second lines based on all the second expressions of the probe feature area; When the difference between the included angle between the trend line of all the second lines and the first line and 90 degrees determined based on the third expression and the first expression is less than a preset difference, determining the grinding method corresponding to the probe feature area as the grinding method of making a linear reciprocating motion along the trend line; When the arrangement type is the arc arrangement, calculating the radian of the first line according to the first expression and determining the radian as the rotation angle of the circular motion; Calculating the expressions of the perpendicular lines of multiple tangents of the first line according to the first expression, determining the trend line of all the perpendicular lines based on the expressions of all the perpendicular lines, and determining the trend line of all the perpendicular lines as the straight line where the motion direction of the linear reciprocating motion is located, and further determining the circular motion and the linear reciprocating motion; Determining the grinding method corresponding to the probe feature area as the grinding method of the combined motion of the circular motion and the linear reciprocating motion.

6. The control method of the needle grinding machine according to claim 1, characterized in that, The determining the grinding parameters corresponding to the grinding method according to the grinding method and the second preset rule includes: Determining the grinding parameters corresponding to the grinding method according to the corresponding relationship information between the grinding method and the grinding parameters preset; or Displaying the grinding method, and in response to receiving a grinding parameter determination instruction, obtaining the grinding parameters corresponding to the grinding method according to the grinding parameter determination instruction; or Determining the motion trajectory and motion speed of the motion platform according to the grinding method; Determining the first motion parameter of the first driving part, the first motion parameter of the second driving part and the third motion parameter of the third driving part based on the motion trajectory and the motion speed, so as to determine the grinding parameters corresponding to the grinding method.

7. The control method of the needle grinding machine according to claim 6, characterized in that, The determining the motion trajectory and motion speed of the motion platform according to the grinding method includes: Determining the motion trajectory and motion speed of the motion platform during the grinding process according to the grinding method; Whenever the length of the motion trajectory of the motion platform reaches a preset length, determining the motion trajectory and motion speed of the motion platform during the non-grinding process according to preset adjustment parameters, so that the motion platform moves a preset distance without contacting the probe card and then contacts the probe card to continue the grinding process; Determine the motion trajectory and motion speed of the motion platform during the entire working process based on the motion trajectory and motion speed of the motion platform during the grinding process and the non-grinding process.

8. An electronic device, characterized in that, The electronic device includes: at least one processor; and, a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the control method of the probe needle grinding machine according to any one of claims 1 to 7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores an executable program, and the executable program is executed by a processor to implement the control method of the probe needle grinding machine according to any one of claims 1 to 7.

10. A probe needle grinding machine, characterized in that the probe needle grinding machine includes a main body, the electronic device according to claim 8, and a motion module; the electronic device is installed on the main body, and the electronic device is used to control the motion module; the motion module includes a motion platform and a driving part capable of driving the motion platform to move, and the motion platform is used to move under the drive of the driving part to grind the probe of the probe card; the driving part includes a first driving part, a second driving part and a third driving part; the first driving part includes a first slider and a first electromagnetic driving member, and the first electromagnetic driving member is used to drive the first slider to move along a first direction; the second driving part includes a second slider and a second electromagnetic driving member, and the second electromagnetic driving member is used to drive the second slider to move along a second direction; the motion platform is fixedly connected to the first slider of the first driving part, the first driving part is fixedly connected to the second slider of the second driving part, the second driving part is fixedly connected to the third slider of the third driving part, the third slider can move along a third direction, and the first direction, the second direction and the third direction are different from each other.

Images