Fixing structure of semiconductor material pipe and detection equipment of semiconductor structure

Abstract

The invention provides a fixing structure of a semiconductor material pipe and detection equipment of a semiconductor structure. The fixing structure comprises a base plate and a pressing block. A groove is formed in the side, facing the base plate, of the pressing block, the pressing block comprises a first end and a second end which are opposite in the extending direction of the groove, the groove penetrates through the first end and the second end, and the groove is used for containing at least part of a semiconductor material pipe; one of the pressing block and the substrate is provided with a plurality of limiting holes, and the other one of the pressing block and the substrate is provided with a plurality of limiting parts; when the pressing block is matched with the base plate, each limiting part is located in the corresponding limiting hole, and the limiting parts are distributed on the two opposite sides of the groove so as to limit movement of the pressing block relative to the base plate in the direction perpendicular to the extending direction of the groove.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and particularly relates to a fixing structure for a semiconductor tube and a detection device for a semiconductor structure. Background Art

[0002] In the semiconductor field, after a semiconductor structure is fabricated, it is detected using a detection device. The detection device includes a fixing structure for a semiconductor tube, a track, and a detector. After the semiconductor tube is fixed to the fixing structure, the outlet of the semiconductor tube is docked with the guide rail of the track. Under the action of gravity, the semiconductor structure in the semiconductor tube moves out of the semiconductor tube and enters the guide rail of the track, and moves along the guide rail to the detection position, where the detector detects the semiconductor structure at the detection position.

[0003] The fixing structure includes a substrate and a pressing block. The pressing block is provided with a groove. A cylinder pushes the pressing block towards the substrate to fix the semiconductor tube in the groove. In the existing detection device, the semiconductor tube will move relative to the substrate, causing the outlet of the semiconductor tube to deviate from the guide rail, resulting in the semiconductor structure in the semiconductor tube being unable to smoothly enter the guide rail. Summary of the Invention

[0004] An embodiment of the present application provides a fixing structure for a semiconductor tube and a detection device for a semiconductor structure.

[0005] According to a first aspect of an embodiment of the present application, a fixing structure for a semiconductor tube is provided. The fixing structure includes a substrate and a pressing block;

[0006] On a side of the pressing block facing the substrate, a groove is provided. In the extending direction of the groove, the pressing block includes opposite first and second ends. The groove extends from the first end to the second end and is used to accommodate at least a part of the semiconductor tube. One of the pressing block and the substrate is provided with a plurality of limiting holes, and the other is provided with a plurality of limiting portions. When the pressing block and the substrate cooperate, each limiting portion is located in one of the limiting holes, and the limiting portions are distributed on opposite sides of the groove to limit the movement of the pressing block relative to the substrate in a direction perpendicular to the extending direction of the groove.

[0007] In one embodiment, on a side of the pressing block away from the groove, a mounting hole is provided for connecting with a connecting rod of a driving part. The ratio of the distance from the mounting hole to the first end to the distance from the mounting hole to the second end ranges from 2:1 to 1:2.

[0008] In one embodiment, the ratio of the distance from the mounting hole to the first end to the distance from the mounting hole to the second end is 1:1.

[0009] In one embodiment, when the limiting portion is provided on the pressing block, the plurality of limiting portions are symmetrically distributed on both sides of the groove; when the limiting holes are provided on the pressing block, the plurality of limiting holes are symmetrically distributed on both sides of the groove.

[0010] In one embodiment, when the limiting portion is provided on the pressing block, the plurality of limiting portions are symmetrically distributed with respect to a plane perpendicular to the extending direction of the groove, and the distance from the plane to the first end is equal to the distance from the plane to the second end; when the limiting holes are provided on the pressing block, the plurality of limiting holes are symmetrically distributed with respect to a plane perpendicular to the extending direction of the groove, and the distance from the plane to the first end is equal to the distance from the plane to the second end.

[0011] In one embodiment, the limiting hole is a long strip hole, and the length direction of the limiting hole is parallel to the extending direction of the groove.

[0012] In one embodiment, the length range of the limiting hole is 5.5 mm to 6.5 mm.

[0013] In one embodiment, the limiting portion is provided on the side of the pressing block facing the substrate, and the limiting hole is provided on the substrate.

[0014] According to the second aspect of the embodiments of the present application, a detection device for a semiconductor structure is provided. The detection device includes a guide rail, a detection device, and the fixing structure of the semiconductor cartridge as described above; the guide rail transports the semiconductor structure removed from the semiconductor cartridge fixed to the fixing structure to the detection device.

[0015] In one embodiment, the detection device further includes a driving portion, and the driving portion drives the pressing block away from and close to the substrate.

[0016] The fixing structure and the detecting device for a semiconductor structure provided by an embodiment of the present application set a plurality of limiting holes in one of a pressing block and a substrate, and a plurality of limiting parts in the other. When the substrate and the pressing block are matched, the plurality of limiting parts are distributed on opposite sides of a groove. Then, the cooperation between the limiting parts and the limiting holes can limit the movement of the pressing block relative to the substrate in a direction perpendicular to the extending direction of the groove. Even if the bracket for supporting the pressing block in the detecting device where the fixing structure is located becomes loose, it can prevent the pressing block from moving relative to the substrate in a direction perpendicular to the extending direction of the groove, thereby preventing the semiconductor material tube located in the groove from shifting relative to the substrate, and preventing the problem that the outlet of the semiconductor material tube is misaligned with the inlet of the guide rail of the detecting device where the fixing structure is located. It can improve the situation where the semiconductor structure in the semiconductor material tube is stuck in the semiconductor material tube and cannot smoothly enter the guide rail due to the misalignment of the outlet of the semiconductor material tube and the inlet of the guide rail of the detecting device where the fixing structure is located. At the same time, it can avoid damage to the semiconductor structure during the process of entering the guide rail from the semiconductor material tube, ensure the quality of the semiconductor structure, and reduce the time required for operators to handle the situation where the semiconductor structure is stuck, thereby improving the transmission efficiency of the semiconductor structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 6 is a partial structural schematic diagram of a detecting device for a semiconductor structure provided by an exemplary embodiment of the present application;

[0018] Figure 2 FIG. 10 is a side view of a partial structure of a detecting device for a semiconductor material tube provided by an exemplary embodiment of the present application;

[0019] Figure 3 FIG. 14 is a three-dimensional structural schematic diagram of a partial structure of a detecting device for a semiconductor material tube provided by an exemplary embodiment of the present application;

[0020] Figure 4 FIG. 18 is a top view of a pressing block in a fixing structure of a semiconductor material tube provided by an exemplary embodiment of the present application;

[0021] Figure 5 FIG. 22 is a bottom view of a pressing block in a fixing structure of a semiconductor material tube provided by an exemplary embodiment of the present application;

[0022] Figure 6 FIG. Figure 4 28 is a cross-sectional view of the pressing block shown in FIG. 28 taken along AA;

[0023] Figure 7 FIG. 32 is a top view of a substrate in a fixing structure of a semiconductor material tube provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0025] The terms used in the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "the", and "said" used in the present application and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0026] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to determining".

[0027] The following will describe in detail some embodiments of the present application with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0028] An embodiment of the present application provides a fixing structure for a semiconductor material tube. As Figures 1 to 3 shown, the fixing structure of the semiconductor material tube includes a substrate 10 and a pressing block 20.

[0029] As Figures 4 to 7 shown, a groove 211 is provided on a side of the pressing block 20 facing the substrate 10. In the extending direction of the groove 211, the pressing block 20 includes opposite first end 201 and second end 202, and the groove 211 extends from the first end 201 to the second end 202. The groove 211 is used to accommodate at least a part of the semiconductor material tube. One of the pressing block 20 and the substrate 10 is provided with a plurality of limiting holes 30, and the other is provided with a plurality of limiting parts 40. Referring again to Figure 2When the pressing block 20 is engaged with the substrate 10, each of the limiting portions 40 is located within one of the limiting holes 30, and the limiting portions 40 are located on opposite sides of the groove 211, so as to limit the movement of the pressing block 20 relative to the substrate 10 in a direction perpendicular to the extending direction of the groove 211. Wherein, the engagement of the pressing block 20 with the substrate 10 means that the pressing block 20 abuts against the substrate 10 to fix the semiconductor material tube located within the groove 211.

[0030] The fixing structure of the semiconductor material tube provided by the embodiment of the present application, by providing a plurality of limiting holes in one of the pressing block and the substrate, and a plurality of limiting portions in the other, and when the substrate and the pressing block are engaged, the plurality of limiting portions are distributed on opposite sides of the groove, the cooperation between the limiting portion and the limiting hole can limit the movement of the pressing block relative to the substrate in a direction perpendicular to the extending direction of the groove. Even if the bracket for supporting the pressing block in the detection device where the fixing structure is located becomes loose, it can prevent the pressing block from moving relative to the substrate in a direction perpendicular to the extending direction of the groove, thereby preventing the semiconductor material tube located within the groove from shifting relative to the substrate, and preventing the problem of misalignment between the outlet of the semiconductor material tube and the inlet of the guide rail of the detection device where the fixing structure is located, improving the situation where the semiconductor structure within the semiconductor material tube is stuck within the semiconductor material tube and cannot smoothly enter the guide rail due to the misalignment between the outlet of the semiconductor material tube and the inlet of the guide rail of the detection device where the fixing structure is located; at the same time, it can avoid damage to the semiconductor structure during the process of entering the guide rail from the semiconductor material tube, ensure the quality of the semiconductor structure, and can reduce the time required for operators to handle due to the semiconductor structure being stuck, improving the transmission efficiency of the semiconductor structure.

[0031] In one embodiment, as Figure 1 shown, when the pressing block 20 is engaged with the substrate 10, the semiconductor material tube 60 is located within the groove 211 of the pressing block 20, and one side of the semiconductor material tube 60 facing the bottom surface of the groove 211 abuts against the bottom surface of the groove 211, and the side of the semiconductor material tube 60 away from the bottom surface of the groove 211 abuts against the substrate 10, so that the semiconductor material tube 60 is fixed within the fixing structure.

[0032] In one embodiment, as Figures 4 to 6 shown, the pressing block 20 includes a pressing block body 21, and the groove 211 is provided on the surface of the pressing block body 21 facing the substrate 10.

[0033] In one embodiment, as Figure 3 shown, when the semiconductor material tube 60 is fixed within the fixing structure, the length of the semiconductor material tube 60 extending from the first end 201 is less than the length of the semiconductor material tube 60 extending from the second end 202, and the end of the portion of the semiconductor material tube 60 extending from the first end 201 is docked with the guide rail 70.

[0034] In one embodiment, as Figure 3 , Figures 4 to 6 shown, on the side of the pressing block 20 away from the groove 211, there is an installation hole 212 for connecting with the connecting rod 51 of the driving part 50. The connecting rod 51 of the driving part 50 is connected to the pressing block 20 through the installation hole 212, and can drive the pressing block 20 away from the substrate 10 or drive the pressing block 20 closer to the substrate 10. The process of fixing the semiconductor material tube to the fixing structure is as follows: First, the driving part 50 drives the pressing block 20 away from the substrate 10, and the semiconductor material tube can move to the surface where the substrate 10 and the pressing block 20 cooperate; then the driving part 50 drives the pressing block 20 closer to the substrate 10 until the pressing block 20 abuts against the substrate 10. The driving part 50 applies a force to the pressing block 20 through the connecting rod 51, so that the semiconductor material tube is fixed between the pressing block 20 and the substrate 10. Among them, the driving part 50 can be a cylinder.

[0035] In one embodiment, the ratio range of the distance from the installation hole 212 to the first end 201 to the distance from the installation hole 212 to the second end 202 is 2:1 to 1:2. With such a setting, it can be avoided that the distance from the installation hole 212 to the first end 201 of the pressing block 20 is too small, and the force applied by the driving part to the pressing block 20 is concentrated at a position close to the first end 201, resulting in the semiconductor material tube being prone to shaking from the second end 202 of the pressing block 20, and further resulting in the problem that the outlet of the semiconductor material tube is misaligned with the inlet of the guide rail of the detection device. In some embodiments, the ratio of the distance from the installation hole 212 to the first end 201 to the distance from the installation hole 212 to the second end 202 can be 2:1, 2:1.5, 1:1, 1:1.5, 1:2, etc.

[0036] Furthermore, the ratio of the distance from the installation hole 212 to the first end 201 to the distance from the installation hole 212 to the second end 202 is 1:1. That is to say, the distance from the installation hole 212 to the first end 201 is equal to the distance from the installation hole 212 to the second end 202. With such a setting, the force applied by the driving part to the pressing block is concentrated in the middle area of the pressing block, and the problem that the semiconductor material tube is prone to shaking due to the force applied by the driving part being concentrated at a position close to the first end can be effectively improved.

[0037] In one embodiment, as Figure 2 , Figures 4 to 7As shown, the limiting portion 40 is disposed on the side of the pressing block 20 facing the substrate 10, that is, the limiting portion 40 and the groove 211 are on the same side of the pressing block body 21; the limiting hole 30 is disposed on the substrate 10. When it is necessary to replace the semiconductor material tube fixed by the fixing structure, first, the driving portion drives the pressing block 20 away from the substrate 10; then the detection device drives the semiconductor material tube to be removed to move along the surface where the substrate 10 and the pressing block 20 cooperate, so as to leave the substrate 10 from one side of the substrate 10; then the detection device drives the semiconductor material tube to be fixed to approach the substrate 10 from the other side of the substrate, and move along the surface where the substrate 10 and the pressing block 20 cooperate to a position corresponding to the groove 211 on the surface of the substrate 10; then the driving portion 50 drives the pressing block 20 to approach the substrate 10 and abut against the substrate 10, so that the semiconductor material tube is fixed in the groove 211 of the pressing block 20. In the above process, the moving direction of the semiconductor material tube is perpendicular to its length direction. By disposing the limiting portion 40 on the side of the pressing block 20 facing the substrate 10 and the limiting hole 30 on the substrate 10, the setting of the limiting portion 40 can be prevented from affecting the replacement of the semiconductor material tube. In other embodiments, the limiting portion 40 may be disposed on the substrate 10 and the limiting hole 30 may be disposed on the pressing block 20, and then the replacement method of the semiconductor material tube needs to be changed.

[0038] In one embodiment, as Figure 7 shown, the substrate 10 includes a substrate body 11, and the limiting hole 30 is disposed on the substrate body 11. The limiting hole 30 may be a through hole, that is, the limiting hole 30 penetrates through the substrate body 11. In other embodiments, the limiting hole 30 may be a blind hole, and the limiting hole 30 is disposed on the surface where the substrate 10 and the pressing block 20 cooperate.

[0039] In one embodiment, the number of the limiting holes 30 is the same as that of the limiting portions 40, and the limiting holes 30 and the limiting portions 40 correspond to each other one by one. When the pressing block 20 cooperates with the substrate 10, each limiting portion 40 is respectively located in the corresponding limiting hole 30.

[0040] In one embodiment, in the direction perpendicular to the extending direction of the groove 211, the width of the limiting hole 30 is substantially the same as the width of the limiting portion 40. For example, the width of the limiting hole 30 is slightly larger than the width of the limiting portion 40. In some embodiments, in the direction perpendicular to the extending direction of the groove 211, the limiting portion 40 is cylindrical, and the diameter of the cross section is 2.06 mm, and the width of the limiting hole 30 is 2.08 mm to 2.10 mm. Thus, after the limiting portion 40 enters the limiting hole 30, in the direction perpendicular to the extending direction of the groove 211, the limiting portion 40 cannot move relative to the limiting hole 30, and the relative movement between the pressing block 20 and the substrate 10 in the direction perpendicular to the extending direction of the groove 211 can be effectively avoided.

[0041] In one embodiment, asFigure 6 As shown, the limiting part 40 is a columnar structure. For example, the limiting part 40 can be a cylindrical structure.

[0042] In one embodiment, as Figure 7 shown, the limiting hole 30 is an elongated hole, and the length direction of the limiting hole 30 is parallel to the extending direction of the groove 211. With such a setting, when the substrate 10 cooperates with the pressing block 20, the pressing block 20 can move relative to the substrate 10 in the extending direction of the groove 211. The movement of the pressing block 20 relative to the substrate 10 can adjust the position where the pressing block 20 applies a force to the semiconductor material tube 60, which is beneficial to fixing the semiconductor material tube 60 more firmly.

[0043] In one implementation, the length range of the limiting hole 30 is 5.5 mm to 6.5 mm. By setting the length of the limiting hole 30 within this range, the semiconductor material tube 60 can be fixed relatively firmly by adjusting the position where the pressing block 20 applies a force to the semiconductor material tube 60. In some embodiments, the length of the limiting hole 30 can be 5.5 mm, 5.7 mm, 5.8 mm, 6.0 mm, 6.2 mm, 6.4 mm, 6.6 mm, etc.

[0044] In one embodiment, as Figure 5 shown, the limiting part 40 is arranged on the pressing block 20, and the plurality of limiting parts 40 are symmetrically distributed on both sides of the groove 211. With such a setting, the cooperation between the limiting part 40 and the limiting hole 30 has a better limiting effect on the relative movement of the pressing block 20 and the substrate 10; when the pressing block 20 has a tendency to move relative to the substrate 10 in a direction perpendicular to the extending direction of the groove 211, the force preventing its movement received by the pressing block 20 is evenly distributed on both sides of the groove 211, which can prevent the pressing block 20 from deforming due to uneven force.

[0045] In other embodiments, the limiting holes 30 are arranged on the pressing block 20, and the plurality of limiting holes 30 are symmetrically distributed on both sides of the groove 211. With such a setting, the cooperation between the limiting part 40 and the limiting hole 30 has a better limiting effect on the relative movement of the pressing block 20 and the substrate 10; when the pressing block 20 has a tendency to move relative to the substrate 10 in a direction perpendicular to the extending direction of the groove 211, the force preventing its movement received by the pressing block 20 is evenly distributed on both sides of the groove 211, which can prevent the pressing block 20 from deforming due to uneven force.

[0046] In one embodiment, as Figure 5As shown, the limiting part 40 is arranged on the pressing block 20. The multiple limiting parts 40 are symmetrically distributed about a plane perpendicular to the extending direction of the groove 211, and the distance from the plane to the first end 201 is equal to the distance from the plane to the second end 202. With such an arrangement, the cooperation between the limiting part 40 and the limiting hole 30 has a better limiting effect on the relative movement of the pressing block 20 and the substrate 10, preventing the situation that one end of the pressing block 20 deviates relative to the substrate 10; when the pressing block 20 has a tendency to move relative to the substrate 10 in a direction perpendicular to the extending direction of the groove 211, the acting force preventing its movement on both sides of the plane is evenly distributed, which can prevent the pressing block 20 from deforming due to uneven force.

[0047] In other embodiments, when the limiting holes 30 are arranged on the pressing block, the multiple limiting holes 30 are symmetrically distributed about a plane perpendicular to the extending direction of the groove 211, and the distance from the plane to the first end 201 is equal to the distance from the plane to the second end 202. With such an arrangement, the cooperation between the limiting part 40 and the limiting hole 30 has a better limiting effect on the relative movement of the pressing block 20 and the substrate 10, preventing the situation that one end of the pressing block 20 deviates relative to the substrate 10; when the pressing block 20 has a tendency to move relative to the substrate 10 in a direction perpendicular to the extending direction of the groove 211, the acting force preventing its movement on both sides of the plane is evenly distributed, which can prevent the pressing block 20 from deforming due to uneven force.

[0048] In one embodiment, as Figure 5 shown, the number of the limiting holes 30 is four. In other embodiments, the number of the limiting holes 30 can be different from four, for example, it can be two, six, eight, etc. Among them, when the number of the limiting holes 30 is two, the symmetry plane of the limiting holes 30 is on this plane, that is, the limiting holes 30 are symmetric about this plane.

[0049] In one embodiment, as Figure 4 and Figure 6 shown, a receiving groove 214 is further arranged on the side of the pressing block 20 away from the groove 211. The receiving groove 214 is used to receive the pipeline of the driving part 50, prevent the pipeline from moving near the pressing block 20 and affecting the replacement of the semiconductor material tube, and can improve the neatness of the detection device. The extending direction of the receiving groove 214 and the extending direction of the groove 211 can intersect, for example, the extending direction of the receiving groove 214 and the extending direction of the groove 211 can be perpendicular.

[0050] In one embodiment, as Figure 4 and Figure 6 shown, two receiving grooves 214 are arranged on the side of the pressing block 20 away from the groove 211, and the two receiving grooves 214 are located on both sides of the mounting hole 212.

[0051] In one embodiment, as Figure 4 and Figure 6 shown, on the side of the pressing block 20 away from the groove 211, there is also an installation hole 213 for connecting the pressing block 20 to the connecting rod 51 of the driving part 50. There may be two installation holes 213 on the side of the pressing block 20 away from the groove 211, and the two installation holes 213 are respectively located on both sides of the two receiving grooves 214. The installation hole 213 may be a threaded hole.

[0052] In one embodiment, as Figure 7 shown, the substrate 10 is also provided with an installation hole 111, and the substrate 10 is fixedly connected to other structures of the detection device through the installation hole 111. The installation hole 111 may be a threaded hole.

[0053] The embodiment of the present application also provides a detection device for a semiconductor structure. As Figure 2 and Figure 3 shown, the detection device includes a guide rail 70, a detection device (not shown) and the fixing structure described in any of the above embodiments; the guide rail 70 is used to transfer the semiconductor structure removed from the semiconductor cartridge 60 fixed to the fixing structure to the detection device. When the semiconductor cartridge 60 is fixed to the fixing structure, the outlet of the semiconductor cartridge 60 is docked with the inlet of the guide rail 70, and the semiconductor structure removed from the outlet of the semiconductor cartridge 60 enters the guide rail 70 through the inlet of the guide rail 70, and the guide rail 70 transfers the semiconductor structure to the detection device, so that the detection device can detect the semiconductor structure.

[0054] In one embodiment, the guide rail 70 is provided with a track, and the semiconductor structure moves along the track of the guide rail 70 to the detection position.

[0055] In one embodiment, the guide rail 70 includes a cover plate that covers the track to prevent the semiconductor structure moving along the track from flying out of the track.

[0056] In one embodiment, as Figure 2 and Figure 3 shown, the detection device further includes a driving part 50 that drives the pressing block 20 to move away from and close to the substrate 10. The connecting rod 51 of the driving part 50 is connected to the installation hole 212 of the pressing block 20. The driving part 50 may be a cylinder, and the connecting rod 51 may be a telescopic rod.

[0057] It should be noted that in the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or an intermediate layer may be present. Additionally, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or more than one intermediate layer or element may be present. Further, it will be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or more than one intermediate layer or element may also be present. Like reference numerals throughout the specification indicate like elements.

[0058] Other embodiments of the present application will be readily apparent to those skilled in the art upon consideration of the specification and practice of the disclosure herein. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present application are pointed out by the following claims.

[0059] It should be understood that the present application is not limited to the exact structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is limited only by the appended claims.

Claims

1. A fixing structure for a semiconductor tube, characterized in that, The fixing structure includes a substrate and a pressing block; On one side of the pressing block facing the substrate, there is a groove. In the extending direction of the groove, the pressing block includes opposite first and second ends, and the groove extends from the first end to the second end. The groove is used to accommodate at least part of the semiconductor material tube. One of the pressing block and the substrate is provided with a plurality of limiting holes, and the other is provided with a plurality of limiting parts. When the pressing block and the substrate are cooperated, each limiting part is located in one of the limiting holes, and the limiting parts are distributed on opposite sides of the groove to limit the movement of the pressing block relative to the substrate in a direction perpendicular to the extending direction of the groove.

2. The fixing structure of the semiconductor material tube according to claim 1, wherein, On the side of the pressing block away from the groove, there is an installation hole for connecting with the connecting rod of the driving part, and the ratio range of the distance from the installation hole to the first end to the distance from the installation hole to the second end is 2:1 to 1:

2.

3. The fixing structure of the semiconductor tube according to claim 2, characterized in that, The ratio of the distance from the installation hole to the first end to the distance from the installation hole to the second end is 1:

1.

4. The fixing structure of the semiconductor tube according to claim 1, wherein, When the limiting parts are arranged on the pressing block, the plurality of limiting parts are symmetrically distributed on both sides of the groove; when the limiting holes are arranged on the pressing block, the plurality of limiting holes are symmetrically distributed on both sides of the groove.

5. The fixing structure of the semiconductor tube according to claim 1, characterized in that, When the limiting parts are arranged on the pressing block, the plurality of limiting parts are symmetrically distributed with respect to a plane perpendicular to the extending direction of the groove, and the distance from the plane to the first end is equal to the distance from the plane to the second end; when the limiting holes are arranged on the pressing block, the plurality of limiting holes are symmetrically distributed with respect to a plane perpendicular to the extending direction of the groove, and the distance from the plane to the first end is equal to the distance from the plane to the second end.

6. The fixing structure of the semiconductor tube according to claim 1, wherein, The limiting hole is a long strip hole, and the length direction of the limiting hole is parallel to the extending direction of the groove.

7. The fixing structure of the semiconductor tube according to claim 6, characterized in that, The length range of the limiting hole is 5.5 mm to 6.5 mm.

8. The fixing structure of the semiconductor tube according to claim 1, characterized in that, The limiting parts are arranged on the side of the pressing block facing the substrate, and the limiting holes are arranged on the substrate.

9. A detection device for a semiconductor structure, characterized in that, The detection device includes a guide rail, a detection device and the fixing structure of the semiconductor material tube according to any one of claims 1 to 8; the guide rail transports the semiconductor structure removed from the semiconductor material tube fixed to the fixing structure to the detection device.

10. The detection device for the semiconductor structure according to claim 9, wherein, The detection device further includes a driving part, and the driving part drives the pressing block to move away from and close to the substrate.

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