Gas flow detection device and semiconductor device
By setting up a temperature control device on the gas detection box, the problem of unstable gas flow detection in semiconductor processes is solved, and higher accuracy and stability are achieved, and process stability and production capacity are improved.
Patent Information
- Application Number
- CN202410064612.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-16
- Publication Date
- 2025-07-25
AI Technical Summary
In existing semiconductor processes, gas flow detection is affected by chamber consumption, polymer deposition and machine maintenance, resulting in unstable detection results, affecting process stability and production capacity.
The gas detection box is adopted and equipped with a temperature control device. The gas detection box is controlled to conduct gas flow detection within the preset temperature range to avoid component consumption and polymer deposition, and stabilize the temperature through the temperature control device.
It improves the accuracy and stability of gas flow detection, shortens detection time, improves process stability and production capacity, and reduces gas costs.
Smart Images
Figure CN120369058A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor integrated circuits, and particularly relates to a gas flow detection device and a semiconductor device. Background Art
[0002] With the deep evolution of Moore's Law in semiconductor processes, higher requirements are placed on process performance, and the requirements for the etching gas of raw materials in the process are more complex and diverse. The main manifestations are higher gas purity requirements, more precise gas flow control, more stable control, and stronger durability. Therefore, the accuracy, stability, and reliability of gas flow control become particularly important. At present, with the consumption of internal components in the chamber, polymer deposition, and the impact of machine maintenance (PM) on the chamber conditions, there is a risk of unstable detection results in the gas detection process, which affects process stability and causes production capacity losses while.
[0003] In addition, during the production and operation of semiconductor devices, in addition to completing specific processes, the machine needs to be self-checked (offline monitor) regularly, and production can only be carried out after the results meet the regulations. Gas self-checks also need to be increased after regular maintenance of the process chamber or gas-related downtime. Due to the variety of process gases, the existing self-check methods result in long machine downtime and impaired operating time. On the other hand, the process gas has high purity, and there is a possibility of cost optimization for a large number of long-term detections. Summary of the Invention
[0004] The purpose of the present invention is to provide a gas flow detection device and a semiconductor device, which can improve the accuracy and stability of gas flow detection and enhance process stability.
[0005] To solve the above technical problems, the present invention provides a gas flow detection device, including: a gas detection box and a pressure detector, the pressure detector is used to detect the pressure of the gas detection box, one end of the gas detection box is connected to an intake pipeline, and the other end is connected to an exhaust pipeline; wherein,
[0006] A temperature control device is further provided on the gas detection box, and the temperature control device is used to control the gas detection box within a preset temperature range.
[0007] Optionally, the temperature control device includes a heating device, a temperature feedback device, and a heating control device. The temperature feedback device is used to measure the temperature of the gas detection box and feedback it to the heating control device. The heating control device is used to control the working state of the heating device according to the temperature of the gas detection box, and the heating device is used to heat the gas detection box.
[0008] Optionally, the temperature control device further includes an overtemperature switch. When the temperature in the gas detection box reaches the set temperature, the overtemperature switch cuts off the power supply of the heating device.
[0009] Optionally, the temperature control device further includes a cooling device for cooling the gas detection box.
[0010] Optionally, the heating device includes a heater, the temperature feedback device includes a thermocouple, and the heating control device includes a PLC and a solid-state relay. The PLC controls the on-off frequency of the solid-state relay to control the change of the heating power of the heater.
[0011] Optionally, the gas detection box has a cubic structure.
[0012] Optionally, multiple sets of the temperature control devices are provided on the gas detection box, and the multiple sets of temperature control devices are symmetrically arranged about the center of the gas detection box.
[0013] Optionally, 4 sets of the temperature control devices are provided on the gas detection box, and the 4 sets of temperature control devices are respectively arranged at 4 included angles formed by the sides of the gas detection box.
[0014] Optionally, a protective coating is provided on the inner surface of the gas detection box.
[0015] Correspondingly, the present invention further provides a semiconductor device, including a process chamber and the gas flow detection device as described above. The inlet pipeline of the process chamber and the inlet pipeline of the gas detection box are connected to a gas source through a first three-way valve, and the outlet pipeline of the process chamber and the outlet pipeline of the gas detection box are connected to a suction pump through a second three-way valve.
[0016] Optionally, the volume of the gas detection box is one-fourth of the volume of the process chamber.
[0017] In summary, in the gas flow detection device and semiconductor equipment provided by the present invention, the gas flow detection device includes a gas detection box and a pressure detector. The pressure detector is used to detect the pressure of the gas detection box. One end of the gas detection box is connected to an inlet pipeline, and the other end is connected to an outlet pipeline. Among them, a temperature control device is further provided on the gas detection box, and the temperature control device is used to control the gas detection box within a preset temperature range. The present invention uses a gas detection box to detect gas flow, and controls the gas detection box within a preset temperature range through a temperature control device. Compared with the prior art that uses a process chamber to detect gas flow, there are no factors such as component consumption, polymer deposition, and machine maintenance that affect the detection conditions of the gas detection box. Moreover, the temperature is controlled within a preset temperature range, making the gas measurement environment stable, thereby improving the accuracy and stability of gas flow detection and enhancing process stability.
[0018] In addition, compared with the process chamber, the volume of the gas detection box is reduced, thereby shortening the gas flow detection time, increasing the machine operation time, and improving the production capacity. At the same time, the gas consumption for self-checking gas flow is reduced, and the process gas cost is lowered.
[0019] Furthermore, the temperature control device includes a heating device and also includes a cooling device. The cooling device cooperates with the heating device, can control the temperature more stably, and can reach the sub-zero temperature environment required by the low-temperature chamber, further improving the measurement accuracy.
[0020] Furthermore, the gas detection box is of a cube structure, which is convenient for the processing and maintenance of the gas detection box. A protective coating is provided on the inner surface of the gas detection box, which can protect the gas detection box from being corroded by corrosive gases, so that it can be used for a long time. The volume of the gas detection box is one-fourth of the volume of the process chamber, which is convenient for matching the measurement results of the chambers of the same type of machine. The gas detection box is arranged in a negative pressure environment, which is convenient for safety control and reduces the safety risk caused by gas leakage. Description of the Drawings
[0021] Figure 1 is a schematic structural diagram of a gas flow detection device.
[0022] Figure 2 is a schematic structural diagram of a gas flow detection device provided by an embodiment of the present invention.
[0023] Figure 3 is a schematic diagram of a gas detection box provided by an embodiment of the present invention.
[0024] Figure 4 is a partial schematic structural diagram of a gas detection box provided by an embodiment of the present invention.
[0025] Figure 5 It is the schematic diagram of gas flow detection provided by an embodiment of the present invention.
[0026] Figure 6 It is the schematic diagram of temperature control of the temperature control device provided by an embodiment of the present invention.
[0027] Description of reference numerals:
[0028] 1 - Mass flowmeter; 2 - Gas cabinet; 3 - Inlet gas pipeline; 4 - Pneumatic valve; 5 - Capacitance gauge; 6 - Process chamber; 7 - Turbo molecular pump; 8 - Outlet gas pipeline; 9 - Third three-way valve; 10 - Exhaust pump; 11 - First three-way valve; 12 - First control valve; 13 - Inlet gas pipeline; 14 - Pressure detector; 15 - Gas detection box; 150 - Temperature control device; 151 - Heater; 152 - Thermocouple; 153 - Shielding box; 154 - Over-temperature switch; 155 - Fixing screw; 16 - Second control valve; 17 - Outlet gas pipeline; 18 - Second three-way valve. Detailed implementation manners
[0029] Figure 1 It is the structural schematic diagram of a gas flow detection device. Please refer to Figure 1 As shown, the gas flow detection device includes a plurality of mass flow controllers (MFCs) 1. Each mass flowmeter 1 is used to measure the mass flow of different gases. The gas passing through the mass flowmeter 1 enters the process chamber 6 through the inlet gas pipeline 3. The inlet gas pipeline 3 is provided with a pneumatic valve 4 for controlling whether the gas flows into the process chamber 6. The plurality of mass flowmeters 1 are arranged in the gas cabinet 2, and an exhaust system and a leakage detection system are arranged in the gas cabinet 2. The process chamber 6 is connected to a capacitance manometer (CM) 5. The capacitance gauge 5 is a capacitive barometer, which is an instrument for measuring gas pressure. Based on the capacitance principle, it uses the capacitance change between two electrodes to measure the gas pressure. The gas flow detection device further includes a turbo molecular pump (TMP) 7 connected to the process chamber 6. The turbo molecular pump 7 and the process chamber 6 are both connected to the outlet gas pipeline 8 and are connected to the same outlet gas pipeline 8 through the third three-way valve 9 and are finally connected to the exhaust pump 10.
[0030] When the pneumatic valve 4 is opened, the gas in the gas source flows into the process chamber 6 through the mass flowmeter 1. The capacitance gauge 5 measures the pressure of the gas in the process chamber 6. Finally, the gas flow is obtained through the gas flow detection principle, and then the gas in the process chamber 6 is pumped away by the turbo molecular pump 7 and the exhaust pump 10.
[0031] As described in the background art, when measuring the gas flow rate using the process chamber 6, due to the consumption of internal components of the process chamber 6, polymer deposition, and the impact of machine maintenance on the process chamber 6, there is a risk of unstable detection results, which not only affects the process stability but also causes production losses.
[0032] To address the above problems, the present invention provides a gas flow rate detection device that uses a gas detection box to detect the gas flow rate. The gas detection box is provided with a temperature control device for controlling the gas detection box within a preset temperature range. Compared with using a process chamber to detect the gas flow rate, there are no factors such as component consumption, polymer deposition, and machine maintenance that affect the detection conditions of the gas detection box. Moreover, the temperature is controlled within the preset temperature range, making the gas measurement environment stable, thereby improving the accuracy and stability of gas flow rate detection and enhancing the process stability.
[0033] To make the objectives, advantages, and features of the present invention clearer, the following further elaborates on the present invention in detail with reference to the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are in very simplified forms and not drawn to scale, only for the purpose of facilitating and clearly assisting in explaining the objectives of the embodiments of the present invention. In addition, the structures shown in the accompanying drawings are often part of the actual structures. In particular, the emphasis shown in each drawing is different, and sometimes different scales are used.
[0034] As used in the present invention, the singular forms "a", "an", and "the" include plural objects unless the context clearly indicates otherwise. As used in the present invention, the term "or" is generally used in the sense of including "and / or" unless the context clearly indicates otherwise. As used in the present invention, the term "several" is generally used in the sense of including "at least one" unless the context clearly indicates otherwise. As used in the present invention, the term "at least two" is generally used in the sense of including "two or more" unless the context clearly indicates otherwise. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include one or at least two of such features.
[0035] Figure 2 It is a schematic structural diagram of a gas flow rate detection device provided by an embodiment of the present invention. Please refer to Figure 2As shown in the figure, the gas flow detection device provided in this embodiment includes: a gas detection box 15 and a pressure detector 14. The pressure detector 14 is used to detect the pressure of the gas detection box 15. One end of the gas detection box 15 is connected to an intake pipeline 13, and the other end is connected to an outlet pipeline 17. Among them, a temperature control device is further provided on the gas detection box 15, and the temperature control device is used to control the gas detection box 15 within a preset temperature range.
[0036] In the present invention, the gas detection box 15 is used to detect the gas flow, and the gas detection box is controlled within a preset temperature range by a temperature control device. Compared with the prior art in which a process chamber is used to detect the gas flow, there are no factors such as component consumption, polymer deposition, and machine maintenance that affect the detection conditions of the gas detection box 15. Moreover, the temperature is controlled within the preset temperature range, making the gas measurement environment stable, thereby improving the accuracy and stability of gas flow detection and enhancing the process stability. In addition, compared with the process chamber, the volume of the gas detection box 15 is reduced, thereby shortening the gas flow detection time, increasing the machine operation time, and improving the production capacity. At the same time, the gas consumption for self-checking the gas flow is reduced, and the process gas cost is lowered.
[0037] In this embodiment, the temperature control device controls the gas detection box 15 within a preset temperature range. The preset temperature range refers to a temperature range that does not affect the detection of the gas flow by the gas flow detection device and can be artificially set according to actual needs. For example, the preset temperature range is 15° - 25°, but it is not limited thereto.
[0038] In an embodiment of the present invention, the temperature control device includes a heating device, a temperature feedback device, and a heating control device. The temperature feedback device is used to measure the temperature of the gas detection box and feedback it to the heating control device. The heating control device is used to control the working state of the heating device according to the temperature of the gas detection box. The heating device is used to heat the gas detection box. Exemplarily, the heating device includes a heater, the temperature feedback device includes a thermocouple (TC), and the heating control device includes a PLC (Programmable Logic Controller) and a solid-state relay. The PLC controls the on-off frequency of the solid-state relay to control the change in the heating power of the heating device.
[0039] The temperature control device may further include an over-temperature switch. When the temperature inside the gas detection box 15 reaches the set temperature, the over-temperature switch cuts off the power supply of the heating device.
[0040] Figure 3It is a partial structural schematic diagram of a gas detection box provided by an embodiment of the present invention. Please refer to Figure 3 As shown, in this embodiment, the heating device includes a heater 151, the temperature feedback device includes a thermocouple 152, and the temperature control device may further include a shielding box 153. The heater 151 is used to heat the gas detection box 15, the thermocouple 152 is used to measure the temperature inside the gas detection box 15 and feedback it to the heating control device, and the shielding box 153 is used to shield the temperature and prevent electric leakage. The temperature control device further includes an overtemperature switch 154. When the temperature inside the gas detection box 15 reaches the set temperature, the overtemperature switch 154 cuts off the power supply of the heater 151.
[0041] The heater 151, the thermocouple 152 and the overtemperature switch 154 are arranged inside the gas detection box 15. The shielding box 153 covers the heater 151, the thermocouple 152 and the overtemperature switch 154 and is fixed by fixing screws 155.
[0042] When multiple sets of the temperature control devices are arranged on the gas detection box 15, multiple sets of the temperature control devices can share the heating control device, but this is not limited thereto.
[0043] Figure 4 It is a schematic diagram of temperature control by a temperature control device provided by an embodiment of the present invention. Please refer to Figure 4 As shown, the hot end of the thermocouple (TC) is arranged inside the gas detection box and cooperates with the cold end. A potential difference is formed between the positive and negative poles of the thermocouple and is converted into the temperature value of the gas detection box, and is transmitted to the PLC through a compensating wire. The PLC receives the temperature measured by the thermocouple TC and controls the heating power of the heater to change by controlling the on-off frequency of the solid-state relay, forming a closed-loop feedback, so as to control the temperature inside the gas detection box. For the strong electricity of the temperature control device, for example, 220V three-wire single-phase 7KW / 32A is selected as the power supply, and the strong electricity is controlled by the weak electricity to stabilize the temperature to the constant required temperature.
[0044] Figure 5 It is a schematic diagram of gas flow detection principle provided by an embodiment of the present invention. Please refer to Figure 5As shown in the figure, as time increases from t1 to t2, the pressure increases from P1 to P2, the temperature increases from T1 to T2, and the calculation formula for the gas flow rate is: Flow = V / t, where V is the volume of the gas flowing into the gas detection box 15, and t is the time of gas flow. Additionally, according to the ideal gas state equation, PV = nRT, where R is the gas constant, P is the gas pressure, V is the gas volume, n represents the amount of substance, and T represents the temperature. The calculation formula for the gas flow rate can be obtained as Flow = (n2RT2 / P2 - n1RT1 / P1) / (t2 - t1), where n1 represents the amount of substance in the gas detection box at time t1, and n2 represents the amount of substance in the gas detection box at time t2. The temperature control device is provided inside the gas detection box 15. Under stable temperature conditions, the detection accuracy of the gas flow rate is not affected by the external environment, and the gas flow rate detected by the gas detection box can be calculated based on the pressure change caused by the inflowing gas and the time difference. The temperature control device provided inside the gas detection box 15 makes the gas measurement environment stable, thereby further improving the measurement accuracy.
[0045] Figure 6 is a schematic diagram of the gas detection box provided by an embodiment of the present invention. Please refer to Figure 2 and Figure 6 As shown, the gas detection box 15 has a cubic structure to facilitate the processing and maintenance of the gas detection box 15. Of course, it is not limited to this, and the gas detection box 15 can also be other structures known to those skilled in the art.
[0046] In an embodiment of the present invention, multiple sets of the temperature control devices can be provided on the gas detection box 15, and the multiple sets of temperature control devices are symmetrically arranged about the center of the gas detection box 15. For example, two sets of the temperature control devices are provided on the gas detection box 15, and the two sets of temperature control devices are arranged on both sides of the diagonal of the cubic structure, or the two sets of temperature control devices are arranged on the opposite side edges of the cubic structure. The present invention does not limit the shape of the gas detection box 15, the number of the temperature control devices, and the positions of the temperature control devices on the gas detection box 15.
[0047] In an embodiment of the present invention, please refer to Figure 6 As shown, 4 sets of the temperature control devices 150 are provided on the gas detection box 15, and the 4 sets of temperature control devices 150 are respectively arranged at the 4 included angles formed by the sides of the gas detection box, as Figure 3 shown. Of course, the temperature control device 150 can also be arranged at other positions inside the gas detection box 15, and the present invention does not limit this.
[0048] In another embodiment of the present invention, the temperature control device further includes a cooling device (not shown), and the cooling device is used to cool the gas detection box. Four such cooling devices can be provided in the gas detection box 15, and the cooling devices correspond to the heating devices and are arranged at four included angles formed by the sides of the gas detection box. The cooling device and the heating device cooperate with each other, which can more stably control the temperature and can reach the sub-zero temperature environment required for the low-temperature chamber, further improving the measurement accuracy.
[0049] Please continue to refer to Figure 2 As shown, the intake pipeline 13 of the gas detection box 15 is connected to a gas source, and a first control valve 12 is provided on the intake pipeline 13. The outlet pipeline 17 of the gas detection box 15 is connected to a vacuum pump 10, and a second control valve 16 is provided on the intake pipeline 13. In this embodiment, both the first control valve 12 and the second control valve 16 are pneumatic valves, but are not limited thereto. When it is necessary to detect the gas flow rate, the first control valve 12 is opened, and the gas in the gas source enters the gas detection box 15 through the intake pipeline 13, while the second control valve 16 is closed. The pressure detector 14 measures the pressure of the gas detection box 15 and calculates the gas flow rate in the gas detection box 15. After the detection is completed, the first control valve 12 is closed, the second control valve 16 is opened, and the gas is pumped away by the vacuum pump 10 through the outlet pipeline 17. In this embodiment, the pressure detector 14 can be a capacitance gauge, and the vacuum pump 10 can be a dry pump, but are not limited thereto.
[0050] In this embodiment, the gas in the gas source is introduced into a process chamber (such as process chamber 6) for semiconductor processing. The volume of the gas detection box 15 is one-fourth of the volume of the process chamber 6, so as to facilitate the matching of the measurement results of the chambers of the same type of machine. A protective coating, such as Y2O3 (yttrium oxide), is provided on the inner surface of the gas detection box 15, which can protect the gas detection box from being corroded by corrosive gases, so that it can be used for a long time. The gas detection box 15 is arranged in the gas cabinet 2, and the gas cabinet 2 is in a negative pressure environment, which is convenient for safety control and reduces the safety risk caused by gas leakage.
[0051] Correspondingly, the present invention also provides a semiconductor device. Please refer to Figure 2 As shown, the semiconductor device includes a process chamber 6 and the gas flow rate detection device as described above. The intake pipeline 3 of the process chamber 6 and the intake pipeline 13 of the gas detection box 15 are connected to the gas source through a first three-way valve 11, and the outlet pipeline 8 of the process chamber 6 and the outlet pipeline 17 of the gas detection box 15 are connected to the vacuum pump 10 through a second three-way valve 18.
[0052] Please refer to Figure 2 As shown, the semiconductor device further includes a plurality of mass flow controllers (MFCs) 1, and each mass flow controller 1 is used to control the mass flow rate of different gases. The gas passing through the mass flow controller 1 can enter the gas detection box 15 or the process chamber 6 through the first three-way valve 11.
[0053] In summary, in the gas flow rate detection device and the semiconductor device provided by the present invention, the gas flow rate detection device includes a gas detection box and a pressure detector. The pressure detector is used to detect the pressure of the gas detection box. One end of the gas detection box is connected to the inlet pipeline, and the other end is connected to the outlet pipeline. Among them, a temperature control device is further provided on the gas detection box, and the temperature control device is used to control the gas detection box within a preset temperature range. The present invention uses a gas detection box to detect the gas flow rate, and a temperature control device for controlling the gas detection box within a preset temperature range is provided on the gas detection box. Compared with the prior art in which the process chamber is used to detect the gas flow rate, there are no factors such as component consumption, polymer deposition, and machine maintenance that affect the detection conditions of the gas detection box, and the temperature is controlled within the preset temperature range, making the gas measurement environment stable, thereby improving the accuracy and stability of gas flow rate detection and enhancing process stability.
[0054] In addition, compared with the process chamber, the volume of the gas detection box is reduced, thereby shortening the gas flow rate detection time, increasing the machine operation time, and improving the production capacity; at the same time, the gas consumption for self-checking the gas flow rate is reduced, and the process gas cost is lowered.
[0055] Furthermore, the temperature control device includes a heating device and also includes a cooling device. The cooling device cooperates with the heating device to control the temperature more stably and can reach the sub-zero temperature environment required by the low-temperature chamber, further improving the measurement accuracy.
[0056] Furthermore, the gas detection box is of a cube structure, which is convenient for the processing and maintenance of the gas detection box; a protective coating is provided on the inner surface of the gas detection box, which can protect the gas detection box from being corroded by corrosive gases, so that it can be used for a long time; the volume of the gas detection box is one-fourth of the volume of the process chamber, which is convenient for matching the measurement results of the chambers of the same type of machine; the gas detection box is arranged in a negative pressure environment, which is convenient for safety control and reduces the safety risk caused by gas leakage.
[0057] The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the art of the present invention according to the above disclosure are within the protection scope of the claims.
Claims
1. A gas flow detection device, characterized in that, Comprising: A gas detection box and a pressure detector, the pressure detector is used to detect the pressure of the gas detection box, one end of the gas detection box is connected to an inlet gas pipeline, and the other end is connected to an outlet gas pipeline; wherein, A temperature control device is further arranged on the gas detection box, and the temperature control device is used to control the gas detection box within a preset temperature range.
2. The gas flow rate detection device according to claim 1, characterized in that, The temperature control device includes a heating device, a temperature feedback device and a heating control device. The temperature feedback device is used to measure the temperature of the gas detection box and feedback it to the heating control device. The heating control device is used to control the working state of the heating device according to the temperature of the gas detection box, and the heating device is used to heat the gas detection box.
3. The gas flow rate detection device according to claim 2, characterized in that, The temperature control device further includes an over-temperature switch. When the temperature in the gas detection box reaches the set temperature, the over-temperature switch cuts off the power supply of the heating device.
4. The gas flow rate detection device according to claim 2, characterized in that, The temperature control device further includes a cooling device for cooling the gas detection box.
5. The gas flow rate detection device according to claim 2, characterized in that, The heating device includes a heater, the temperature feedback device includes a thermocouple, the heating control device includes a PLC and a solid-state relay, and the PLC controls the on-off frequency of the solid-state relay to control the change of the heating power of the heater.
6. The gas flow rate detection device according to any one of claims 2 to 5, characterized in that The gas detection box is in a cube structure.
7. The gas flow rate detection device according to claim 6, characterized in that Multiple sets of the temperature control devices are arranged on the gas detection box, and the multiple sets of the temperature control devices are symmetrically arranged about the center of the gas detection box.
8. The gas flow rate detection device according to claim 7, wherein, 4 sets of the temperature control devices are arranged on the gas detection box, and the 4 sets of the temperature control devices are respectively arranged at 4 included angles formed by the sides of the gas detection box.
9. The gas flow rate detection device according to any one of claims 1 to 5, characterized in that A protective coating is provided on the inner surface of the gas detection box.
10. A semiconductor device, characterized in that, Comprising a process chamber and the gas flow detection device according to any one of claims 1 to 9, the inlet gas pipeline of the process chamber and the inlet gas pipeline of the gas detection box are connected to a gas source through a first three-way valve, and the outlet gas pipeline of the process chamber and the outlet gas pipeline of the gas detection box are connected to an air extraction pump through a second three-way valve.
11. The semiconductor device according to claim 10, wherein, The volume of the gas detection box is one-fourth of the volume of the process chamber.