Temperature measuring method and related device

Abstract

The invention discloses a temperature measurement method and a related device, and relates to the technical field of electronics, and the method comprises the steps: obtaining resistance values corresponding to a plurality of NTC thermistors; for each NTC thermistor, calculating the temperature of the to-be-detected object detected by the NTC thermistor based on the resistance value of the NTC thermistor; and determining the target temperature of the to-be-detected object based on the temperatures corresponding to the plurality of NTC thermistors. In an environment where a to-be-detected object is located, a plurality of NTC thermistors may be sensitive to different environmental factors, so that different error characteristics are caused; and the temperatures corresponding to the plurality of NTC thermistors are fused, so that the advantages of the plurality of NTC thermistors can be integrated, and the defects of a single NTC thermistor are overcome. Noise and errors respectively corresponding to the NTC thermistors are generally irrelevant, and random noise can be reduced through a statistical method by fusing temperatures respectively corresponding to the NTC thermistors, so that the detection precision is improved.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and in particular, to a temperature measurement method and related devices. Background Art

[0002] Temperature sensors need to be provided inside many devices. For example, temperature sensors need to be provided in air conditioners. In related technologies, to achieve a high detection accuracy, a PT1000 platinum thermal resistor is used as the temperature sensor. The resistance value of the PT1000 platinum thermal resistor is proportional to the change in temperature. The relationship between the resistance value of the PT1000 platinum thermal resistor and the temperature change is as follows: when the temperature of the PT1000 platinum thermal resistor is 0 °C, its resistance value is 1000 ohms, and at 100 °C, its resistance value is approximately 1385.005 ohms. The working principle of the PT1000 platinum thermal resistor is that the resistance value increases uniformly as the temperature rises. However, the PT1000 platinum thermal resistor contains precious metals and has a relatively high price.

[0003] Based on this, there is an urgent need for a temperature detection method with low cost and high detection accuracy. Summary of the Invention

[0004] In view of the above problems, this application provides a temperature measurement method and related devices to achieve the purpose of a temperature detection method with low cost and high detection accuracy. The specific solutions are as follows:

[0005] A first aspect of this application provides a temperature measurement method, including:

[0006] In a possible implementation, the step of determining the target temperature of the object to be detected based on the temperatures respectively corresponding to multiple NTC thermistors includes:

[0007] Obtain target NTC thermistors whose corresponding temperatures belong to a preset temperature range from the multiple NTC thermistors;

[0008] Determine the target temperature of the object to be detected based on the temperature corresponding to the target NTC thermistor.

[0009] In a possible implementation, the target NTC thermistors include a first NTC thermistor and a second NTC thermistor. The step of determining the target temperature of the object to be detected based on the temperatures respectively corresponding to the multiple NTC thermistors includes:

[0010] Through the formula T = k×T A +(1 - k)×T B , calculate to obtain the target temperature T;

[0011] Where k = σ B 2 / (σ A2 +σ B 2 ), σ A is the temperature measurement variance of the first NTC thermistor, σ B is the temperature measurement variance of the second NTC thermistor, T A is the temperature corresponding to the first NTC thermistor, T B is the temperature corresponding to the second NTC thermistor.

[0012] In a possible implementation, the method for obtaining the temperature measurement variance of the first NTC thermistor includes:

[0013] When the temperature of the object to be detected remains unchanged, obtain the resistance values of the first NTC thermistor at different times;

[0014] Obtain the variance of the temperatures corresponding to the resistance values of the first NTC thermistor at different times.

[0015] In a possible implementation, the method for obtaining the temperature measurement variance of the first NTC thermistor includes:

[0016] When the object to be detected maintains a first temperature, obtain the first resistance values of the first NTC thermistor at different times;

[0017] Obtain the first variance of the temperatures corresponding to the first resistance values of the first NTC thermistor at different times;

[0018] When the object to be detected maintains a second temperature, obtain the second resistance values of the first NTC thermistor at different times;

[0019] Obtain the second variance of the temperatures corresponding to the second resistance values of the first NTC thermistor at different times;

[0020] Determine the mean of the first variance and the second variance as the temperature measurement variance of the first NTC thermistor.

[0021] A second aspect of the present application provides a temperature measurement device, including:

[0022] A first acquisition module, configured to acquire the resistance values corresponding to multiple NTC thermistors respectively; the multiple NTC thermistors are used to measure the temperature of the same object to be detected;

[0023] A calculation module, configured to, for each of the NTC thermistors, calculate the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor;

[0024] A first determination module, configured to determine a target temperature of the object to be detected based on temperatures respectively corresponding to a plurality of the NTC thermistors.

[0025] In a possible implementation, a calculation unit is configured to calculate the target temperature T through the formula T = k × T A +(1 - k) × T B , and obtain the target temperature T;

[0026] where k = σ B 2 / (σ A 2 +σ B 2 ), σ A is the temperature measurement variance of the first NTC thermistor, σ B is the temperature measurement variance of the second NTC thermistor, T A is the temperature corresponding to the first NTC thermistor, T B is the temperature corresponding to the second NTC thermistor.

[0027] In a possible implementation, the first determination module includes:

[0028] A first acquisition unit, configured to acquire a target NTC thermistor whose corresponding temperature belongs to a preset temperature range from a plurality of the NTC thermistors;

[0029] A first determination unit, configured to determine the target temperature of the object to be detected based on the temperature corresponding to the target NTC thermistor.

[0030] In a possible implementation, it further includes:

[0031] A second acquisition module, configured to acquire resistance values of the first NTC thermistor at different times when the temperature of the object to be detected remains unchanged;

[0032] A third acquisition module, configured to acquire the variance of temperatures respectively corresponding to the resistance values of the first NTC thermistor at different times.

[0033] In a possible implementation, it further includes:

[0034] A fourth acquisition module, configured to acquire first resistance values of the first NTC thermistor at different times when the object to be detected maintains a first temperature;

[0035] A fifth acquisition module, configured to acquire a first variance of temperatures respectively corresponding to the first resistance values of the first NTC thermistor at different times;

[0036] The sixth acquisition module is configured to acquire second resistance values of the first NTC thermistor at different times when the object to be detected maintains a second temperature;

[0037] The seventh acquisition module is configured to acquire a second variance of temperatures corresponding to the second resistance values of the first NTC thermistor at different times;

[0038] The second determination module is configured to determine that the mean of the first variance and the second variance is the temperature measurement variance of the first NTC thermistor.

[0039] A third aspect of the present application provides a computer program product, including computer-readable instructions, which, when running on an electronic device, enable the electronic device to implement the temperature measurement method according to the first aspect or any implementation manner of the first aspect.

[0040] A fourth aspect of the present application provides an electronic device, including at least one processor and a memory connected to the processor, where:

[0041] The memory is used to store a computer program;

[0042] The processor is configured to execute the computer program so that the electronic device can implement the temperature measurement method according to the first aspect or any implementation manner of the first aspect.

[0043] A fifth aspect of the present application provides a computer storage medium, which carries one or more computer programs, and when the one or more computer programs are executed by an electronic device, the electronic device can implement the temperature measurement method according to the first aspect or any implementation manner of the first aspect.

[0044] By means of the above technical solutions, the present application provides a temperature measurement method, which acquires resistance values corresponding to multiple NTC thermistors respectively; for each of the NTC thermistors, calculates the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor; and determines the target temperature of the object to be detected based on the temperatures corresponding to the multiple NTC thermistors respectively. In the environment where the object to be detected is located, multiple NTC thermistors may be sensitive to different environmental factors, resulting in different error characteristics; fusing the temperatures corresponding to multiple NTC thermistors can integrate the advantages of multiple NTC thermistors and make up for the deficiencies of a single NTC thermistor. The noises and errors corresponding to multiple NTC thermistors are usually uncorrelated, and fusing the temperatures corresponding to multiple NTC thermistors can reduce random noise through statistical methods, thereby improving the detection accuracy. Description of the Drawings

[0045] In combination with the accompanying drawings and with reference to the following specific embodiments, the above and other features, advantages, and aspects of the embodiments of the present disclosure will become more apparent. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic and the original components and elements are not necessarily drawn to scale.

[0046] Figure 1 Schematic diagram of a temperature measurement device provided for this application;

[0047] Figure 2 Schematic flowchart of a temperature measurement method provided by an embodiment of this application;

[0048] Figure 3 Schematic structural diagram of a temperature measurement device provided by an embodiment of this application;

[0049] Figure 4 Schematic structural diagram of an electronic device provided by an embodiment of this application;

[0050] Figure 5 Schematic diagram of the device to which the temperature measurement device provided by an embodiment of this application is applied;

[0051] Figure 6 Schematic structural diagram of the server provided and of this application embodiment. Specific embodiments

[0052] The following describes the embodiments of the present application in combination with the drawings in the embodiments of the present application. The terms used in the embodiments part of the present application are only used to explain the specific embodiments of the present application and are not intended to limit the present application.

[0053] The following describes the embodiments of the present application in combination with the drawings. Those of ordinary skill in the art will know that with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0054] The terms "first", "second", etc. in the specification and claims of the present application and the above drawings are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances, which is only a way of distinguishing when describing objects with the same attributes in the embodiments of the present application. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion, so that a process, method, system, product, or device including a series of units does not have to be limited to those units, but may include other units not clearly listed or inherent to these processes, methods, products, or devices.

[0055] See Figure 1 , Figure 1The figure shows a schematic diagram of a temperature measurement device. The temperature measurement device may include: a controller 100 and a plurality of NTC thermistors 200.

[0056] Among them, the controller 100 may be any one or more of controllers such as a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor (MP), or a digital signal processor (DSP).

[0057] It can be understood that the price of the NTC thermistor is much lower than that of the PT1000 platinum resistance thermometer, so the cost of the temperature measurement device using the NTC thermistor as the temperature sensor is relatively low.

[0058] It can be understood that the detection accuracy of a single NTC thermistor is relatively low. In order to improve the detection accuracy of the temperature measurement device, for example, to reach the detection accuracy of the PT1000 platinum resistance thermometer, the embodiments of the present application adopt a temperature sensor composed of a plurality of NTC thermistors. The reasons for improving the detection accuracy by using a temperature sensor composed of a plurality of NTC thermistors will be described below.

[0059] In the environment where the object to be detected is located, multiple NTC thermistors may be sensitive to different environmental factors, resulting in different error characteristics; fusing the temperatures corresponding to multiple NTC thermistors can integrate the advantages of multiple NTC thermistors and make up for the deficiencies of a single NTC thermistor. The noises and errors corresponding to multiple NTC thermistors are usually uncorrelated. Fusing the temperatures corresponding to multiple NTC thermistors can reduce random noise through statistical methods, thereby improving the detection accuracy.

[0060] In the related art, due to the high price of the PT1000 platinum resistance thermometer, a single PT1000 platinum resistance thermometer is set inside the device. If the PT1000 platinum resistance thermometer fails, to prevent the device from being damaged due to incorrect temperature causing malfunction, an alarm is generally given and the machine is stopped until the fault is eliminated, resulting in a decrease in the availability of the device. The present application includes a plurality of NTC thermistors. If a certain NTC thermistor fails, the temperature can still be detected by other non-faulty NTC thermistors, so that the operation of the device will not stop and the availability of the device will not decrease.

[0061] Exemplarily, the device may be an air conditioner or a refrigerator.

[0062] Refer to Figure 2 , Figure 2The flowchart of a temperature measurement method provided by an embodiment of the present application is as follows. As Figure 2 shown, a temperature measurement method provided by an embodiment of the present application may include steps S201 to S203, and the following will describe these steps in detail.

[0063] Step S201: Obtain the resistance values corresponding to multiple NTC thermistors respectively; the multiple NTC thermistors are used to measure the temperature of the same object to be detected.

[0064] Exemplarily, the object to be detected may be a device (such as a battery) in the device where the temperature measurement device shown in Figure 1 is deployed or the environment around the device.

[0065] That multiple NTC (Negative Temperature Coefficient) thermistors are used to measure the temperature of the same object to be detected means that the multiple NTC thermistors are arranged around the object to be detected in the same device.

[0066] An NTC thermistor is a semiconductor material or component with a large negative temperature coefficient. NTC thermistors are mainly made of metal oxides such as manganese, cobalt, nickel, and copper, and are manufactured by ceramic technology. These metal oxide materials all have semiconductor properties because they are completely similar to semiconductor materials such as germanium and silicon in the way of conducting electricity.

[0067] When the temperature of the detection object is low, the number of carriers (electrons and holes) in the oxide material of the NTC thermistor is small, so its resistance value is high; as the temperature rises, the number of carriers increases, so the resistance value decreases. The change range of the NTC thermistor at room temperature is between 100 and 1,000,000 ohms, and the temperature coefficient is -2% to -6.5%. NTC thermistors can be widely used in temperature measurement, temperature control, temperature compensation, etc.

[0068] Step S202: For each of the NTC thermistors, calculate the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor.

[0069] The following will explain the process of calculating the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor.

[0070] The temperature T1 of the object to be detected detected by the NTC thermistor is calculated through the formula: T1 = 1 / (ln(Rt / R) / B + 1 / T2).

[0071] Wherein, Rt refers to the resistance value of the thermistor at temperature T1, and R refers to the nominal resistance value of the NTC thermistor at normal temperature T2 (usually 25°C); both T1 and T2 refer to Kelvin temperature, and B is the resistance value B of the NTC thermistor obtained through step S201.

[0072] Step S203: Based on the temperatures respectively corresponding to multiple said NTC thermistors, determine the target temperature of the object to be detected.

[0073] The embodiment of the present application provides a temperature measurement method, which acquires the resistance values respectively corresponding to multiple NTC thermistors; for each said NTC thermistor, calculates the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor; based on the temperatures respectively corresponding to multiple said NTC thermistors, determines the target temperature of the object to be detected. In the environment where the object to be detected is located, multiple NTC thermistors may be sensitive to different environmental factors, resulting in different error characteristics; fusing the temperatures corresponding to multiple NTC thermistors can integrate the advantages of multiple NTC thermistors and make up for the deficiencies of a single NTC thermistor. The noises and errors respectively corresponding to multiple NTC thermistors are usually uncorrelated, and fusing the temperatures respectively corresponding to multiple NTC thermistors can reduce random noise through statistical methods, thereby improving the detection accuracy.

[0074] In an optional implementation manner, there are multiple implementation manners for step S203, and the embodiment of the present application provides but is not limited to the following two.

[0075] The first implementation manner of step S203 includes the following steps A11 to A12.

[0076] Step A11: Obtain target NTC thermistors from multiple said NTC thermistors whose corresponding temperatures belong to a preset temperature range.

[0077] It can be understood that if an NTC thermistor fails, such as being open-circuited or short-circuited, the temperature obtained through the resistance value of the NTC thermistor is either very small or very large, that is, not within the normal preset temperature range. For example, if the object to be detected is water, the preset temperature range is [0°C, 100°C]. If the temperature obtained through the resistance value of the NTC thermistor is lower than 0°C or higher than 100°C, it is determined that the NTC thermistor has failed.

[0078] Exemplarily, for different objects to be detected, the preset temperature ranges are different, and the corresponding relationship between the object to be detected and the preset temperature range can be set in advance.

[0079] Step A12: Based on the temperature corresponding to the target NTC thermistor, determine the target temperature of the object to be detected.

[0080] In the related art, due to the high price of the PT1000 platinum thermal resistor, a PT1000 platinum thermal resistor is provided inside the device. If the PT1000 platinum thermal resistor fails, to prevent the device from being damaged due to misoperation caused by incorrect temperature, it generally alarms and stops until the fault is eliminated, thus reducing the availability of the device. This application includes multiple NTC thermistors. If a certain NTC thermistor fails, the temperature can still be detected by other non-faulty target NTC thermistors, so that the operation of the device will not stop and the availability of the device will not be reduced.

[0081] Exemplarily, the number of target NTC thermistors is one or more.

[0082] The second implementation manner of step S203 includes the following steps A21.

[0083] Step A21: Calculate the target temperature T through the formula T = k×T A +(1 - k)×T B , and obtain the target temperature T.

[0084] Where k = σ B 2 / (σ A 2 +σ B 2 ), σ A is the temperature measurement variance of the first NTC thermistor, σ B is the temperature measurement variance of the second NTC thermistor, T A is the temperature corresponding to the first NTC thermistor, T B is the temperature corresponding to the second NTC thermistor.

[0085] It can be understood that the smaller the temperature measurement variance of the NTC thermistor, the closer the measurement result of the NTC thermistor is to the true temperature, with smaller fluctuations and higher stability.

[0086] In the process of fusing the temperatures corresponding to multiple NTC thermistors respectively, it is necessary to determine the weights corresponding to multiple NTC thermistors respectively. It can be seen from the above formula that if the temperature measurement variance of the first NTC thermistor is less than that of the second NTC thermistor, the T A coefficient of the first NTC thermistor is larger, and the T B coefficient of the second NTC thermistor is smaller, so that the obtained target temperature T is closer to the true temperature of the temperature of the detection object, improving the detection accuracy. If the temperature measurement variance of the second NTC thermistor is less than that of the first NTC thermistor, the TB The larger the coefficient, the T of the first NTC thermistor A The smaller the coefficient, so that the obtained target temperature T is closer to the true temperature of the temperature of the object to be detected, improving the detection accuracy.

[0087] In order for those skilled in the art to understand that the detection temperature accuracy can be improved by multiple NTC thermistors, the applicant also conducted experiments, which will be described below.

[0088] The first temperature measurement device is Figure 1 the device shown; the second temperature measurement device includes a controller and a PT1000 platinum thermal resistor. The first temperature measurement device and the second temperature measurement device are set in the same environment and detect the same object to be detected; the error between the temperature detected by the first temperature measurement device and the temperature detected by the second temperature measurement device is less than or equal to 0.01%.

[0089] It can be understood that there are multiple methods to obtain the temperature measurement variance of any NTC thermistor. The embodiments of the present application provide but are not limited to the following two.

[0090] The first method to obtain the temperature measurement variance of an NTC thermistor includes the following steps B11 to step B12.

[0091] Step B11: When the temperature of the object to be detected remains unchanged, obtain the resistance values of the NTC thermistor at different times.

[0092] Step B12: Obtain the variance of the temperatures corresponding to the resistance values of the NTC thermistor at different times.

[0093] The variance obtained in step B12 is the temperature measurement variance of the NTC thermistor.

[0094] It can be understood that when the temperature of the object to be detected remains unchanged, the resistance values of the NTC thermistor at different times should be the same. If the resistance values of the NTC thermistor at different times are not completely the same, it means that there is a certain error in the NTC thermistor.

[0095] The second method to obtain the temperature measurement variance of an NTC thermistor includes the following steps B21 to step B24. Here, the NTC thermistor is taken as the first NTC thermistor as an example for illustration.

[0096] Step B21: When the object to be detected maintains the first temperature, obtain the first resistance values of the first NTC thermistor at different times.

[0097] Step B22: Obtain the first variance of the temperatures corresponding to the first resistance values of the first NTC thermistor at different times.

[0098] Step B23: When the object to be detected maintains the second temperature, obtain the second resistance values of the first NTC thermistor at different times.

[0099] Step B24: Obtain the second variance of the temperatures corresponding to the second resistance values of the first NTC thermistor at different times.

[0100] Step B25: Determine the mean of the first variance and the second variance as the temperature measurement variance of the first NTC thermistor.

[0101] In an alternative implementation, if it is necessary to use an NTC thermistor to replace a PT1000 platinum resistance thermometer, the operating temperature range of the NTC thermistor needs to cover the application range of the PT1000 platinum resistance thermometer. Based on this, the present application also provides the following method, which further includes steps C1 to C2.

[0102] Step C1: Obtain the temperature change range of the object to be detected corresponding to the PT1000 platinum resistance thermometer in the related art.

[0103] Step C2: If the operating temperature range of the NTC thermistor includes the temperature change range, determine that the NTC thermistor can be used to replace the PT1000 platinum resistance thermometer.

[0104] Exemplarily, the controller in the related art can send the temperature change range to the server. Thus, the server executes the above steps C1 to C2.

[0105] Exemplarily, the server can also input the temperature change range into a machine learning model, and output the result of whether the NTC thermistor can be used to replace the PT1000 platinum resistance thermometer through the machine learning model.

[0106] In the process of training the machine learning model, at least one of the techniques in machine learning such as artificial neural network, belief network, reinforcement learning, transfer learning, inductive learning, and rote learning is involved.

[0107] Exemplarily, the machine learning model can be any one of a neural network model, a logistic regression model, a linear regression model, a support vector machine (SVM), Adaboost, XGboost, a Transformer-Encoder model, or a large language model.

[0108] Exemplarily, the neural network model can be any one of a model based on a recurrent neural network, a model based on a convolutional neural network, and a classification model based on Transformer-encoder.

[0109] Exemplarily, the machine learning model can be a deep hybrid model of a model based on a recurrent neural network, a model based on a convolutional neural network, and a classification model based on Transformer-encoder.

[0110] Exemplarily, the machine learning model can be any one of an attention-based deep model, a memory network-based deep model, and a short text classification model based on deep learning.

[0111] The short text classification model based on deep learning is a recurrent neural network (RNN) or a convolutional neural network (CNN) or a variant based on a recurrent neural network or a convolutional neural network.

[0112] Exemplarily, some simple domain adaptation modifications can be made on a pre-trained model to obtain a machine learning model.

[0113] Exemplarily, the "simple domain adaptation modifications" include, but are not limited to, re-using a large-scale unsupervised domain corpus for secondary pre-training on a pre-trained model, and / or compressing the pre-trained model by means of model distillation.

[0114] Exemplarily, semi-supervised learning or supervised learning or unsupervised learning can also be performed on the machine learning model. Semi-supervised learning is a learning method that combines supervised learning and unsupervised learning. Semi-supervised learning uses a large amount of unlabeled data and simultaneously uses labeled data to perform pattern recognition work.

[0115] The above introduced a temperature measurement method provided by an embodiment of the present application. Next, a device for executing the above temperature measurement method will be introduced.

[0116] Please refer to Figure 3 , Figure 3 which is a schematic structural diagram of a temperature measurement device provided by an embodiment of the present application. As Figure 3 shown, the device includes:

[0117] A first acquisition module 301, configured to acquire resistance values respectively corresponding to a plurality of NTC thermistors; the plurality of NTC thermistors are used to measure the temperature of the same object to be detected;

[0118] A calculation module 302, configured to calculate, for each of the NTC thermistors, the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor;

[0119] A first determination module 303, configured to determine a target temperature of the object to be detected based on temperatures respectively corresponding to a plurality of the NTC thermistors.

[0120] In an optional implementation manner, the first determination module includes:

[0121] A calculation unit, configured to calculate the target temperature T through the formula T = k×T A +(1 - k)×T B , and calculate and obtain the target temperature T;

[0122] where k = σ B 2 / (σ A 2 +σ B 2 ), σ A is the temperature measurement variance of the first NTC thermistor, σ B is the temperature measurement variance of the second NTC thermistor, T A is the temperature corresponding to the first NTC thermistor, T B is the temperature corresponding to the second NTC thermistor.

[0123] In an optional implementation manner, the first determination module includes:

[0124] A first acquisition unit, configured to acquire a target NTC thermistor whose corresponding temperature belongs to a preset temperature range from a plurality of the NTC thermistors;

[0125] A first determination unit, configured to determine a target temperature of the object to be detected based on the temperature corresponding to the target NTC thermistor.

[0126] In an optional implementation manner, it further includes:

[0127] A second acquisition module, configured to acquire resistance values of the first NTC thermistor at different times when the temperature of the object to be detected remains unchanged;

[0128] A third acquisition module, configured to obtain the temperature measurement variance of the first NTC thermistor based on the resistance values of the first NTC thermistor at different times.

[0129] In an optional implementation manner, it further includes:

[0130] A fourth acquisition module, configured to acquire first resistance values of the first NTC thermistor at different times when the object to be detected maintains a first temperature;

[0131] A fifth acquisition module, configured to acquire a first variance of temperatures corresponding to the first resistance values of the first NTC thermistor at different times;

[0132] A sixth acquisition module, configured to acquire second resistance values of the first NTC thermistor at different times when the object to be detected maintains a second temperature;

[0133] A seventh acquisition module, configured to acquire a second variance of temperatures corresponding to the second resistance values of the first NTC thermistor at different times;

[0134] A second determination module, configured to determine that an average value of the first variance and the second variance is the temperature measurement variance of the first NTC thermistor.

[0135] An embodiment of the present application further provides an electronic device. Refer to Figure 4 As shown, it shows a schematic structural diagram of an electronic device suitable for implementing the electronic device in the embodiment of the present application. The electronic device in the embodiment of the present application may include, but is not limited to, fixed terminals such as mobile phones, laptop computers, PDAs (Personal Digital Assistants), PADs (Tablet Computers), desktop computers, and the like. Figure 4 The electronic device shown is merely an example and should not impose any limitation on the functions and usage scope of the embodiment of the present application.

[0136] As Figure 4 shown, the electronic device may include a processing device (such as a central processing unit, a graphics processing unit, etc.) 401, which may perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 402 or a program loaded from a storage device 408 into a random access memory (RAM) 403. When the electronic device is powered on, various programs and data required for the operation of the electronic device are also stored in the RAM 403. The processing device 401, the ROM 402, and the RAM 403 are connected to each other through a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0137] Generally, the following devices may be connected to the I / O interface 405: an input device 406 including, for example, a touch screen, a touchpad, a keyboard, a mouse, a camera, a microphone, an accelerometer, a gyroscope, etc.; an output device 407 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 408 including, for example, a memory card, a hard disk, etc.; and a communication device 409. The communication device 409 may allow the electronic device to communicate with other devices wirelessly or wiredly to exchange data. Although Figure 4 the shown electronic device has various devices, it should be understood that it is not required to implement or have all the shown devices. More or fewer devices may be alternatively implemented or had.

[0138] Please refer to Figure 5 , which is a schematic diagram of the device applied to the temperature measurement device provided in the embodiment of the present application.

[0139] The device in the embodiment of the present application can be a mobile phone, a tablet computer, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a thermometer, an air conditioner, a refrigerator, a television, etc. The embodiment of the present application does not make any restrictions on this.

[0140] Refer to Figure 5 As shown, the device may include a radio frequency unit 110, a memory 120, an input unit 130, a display unit 140, a camera 150 (optional), an audio circuit 160 (optional), a speaker 161 (optional), a microphone 162 (optional), a headphone jack 163 (optional), a processor 170, an external interface 180, a power supply 190, and other components. Those skilled in the art can understand that Figure 5 This is only an example of the device and does not constitute a limitation on the device. It may include more or fewer components than shown in the figure, or combine certain components, or different components.

[0141] The input unit 130 can be used to receive input digital or character information, and generate key signal inputs related to the user settings and function controls of the device. Specifically, the input unit 130 may include a touch screen 131 (optional) and / or other input devices 132. The touch screen 131 can collect touch operations of the user on or near it (such as operations of the user using a finger, a joint, a stylus, or any suitable object on or near the touch screen), and drive the corresponding connection device according to a pre-set program. The touch screen can detect the touch action of the user on the touch screen, convert the touch action into a touch signal and send it to the processor 170, and can receive and execute the command sent by the processor 170; the touch signal at least includes contact coordinate information. The touch screen 131 can provide an input interface and an output interface between the device and the user. In addition, multiple types such as resistive, capacitive, infrared, and surface acoustic wave can be used to implement the touch screen. In addition to the touch screen 131, the input unit 130 may further include other input devices. Specifically, the other input devices 132 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, etc.

[0142] Among them, the input device 132 can receive input data and so on.

[0143] The display unit 140 can be used to display information input by the user or information provided to the user, various menus of the device, an interactive interface, file display, and / or the playback of any multimedia file. In the embodiment of the present application, the display unit 140 can be used to display an interface, a processing result, etc.

[0144] The memory 120 can be used to store instructions and data. The memory 120 mainly includes a storage instruction area and a storage data area. The storage data area can store various data, such as multimedia files, texts, etc.; the storage instruction area can store software units such as an operating system, an application, instructions required for at least one function, or their subsets and extended sets. It can also include a non-volatile random access memory; it provides management for hardware, software, and data resources in the computing processing device, supports control software and applications. It is also used for the storage of multimedia files, as well as the storage of running programs and applications.

[0145] The processor 170 is the control center of the device. It connects various parts of the entire device using various interfaces and lines. By running or executing instructions stored in the memory 120 and calling data stored in the memory 120, it executes various functions of the device and processes data, thereby controlling the device as a whole. Optionally, the processor 170 can include one or more processing units; preferably, the processor 170 can integrate an application processor and a modem processor. Among them, the application processor mainly processes the operating system, user interface, application programs, etc., and the modem processor mainly processes wireless communication. It can be understood that the above-mentioned modem processor may not be integrated into the processor 170. In some embodiments, the processor and the memory can be implemented on a single chip. In some embodiments, they can also be separately implemented on independent chips. The processor 170 can also be used to generate corresponding operation control signals, send them to corresponding components of the computing processing device, read and process data in the software, especially read and process data and programs in the memory 120, so that each function module therein executes corresponding functions, thereby controlling the corresponding components to act according to the requirements of the instructions.

[0146] The radio frequency unit 110 (optional) can be used for receiving and sending information or signals during a call. For example, after receiving the downlink information of the base station, it is sent to the processor 170 for processing; in addition, the uplink data is sent to the base station. Generally, the RF circuit includes but is not limited to antennas, at least one amplifier, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency unit 110 can also communicate with network devices and other devices through wireless communication. This wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Messaging Service (SMS), etc.

[0147] Among them, in the embodiment of the present application, the radio frequency unit 110 can send data to the server 200 and receive the processing result sent by the server 200.

[0148] It should be understood that the radio frequency unit 110 is optional and can be replaced by other communication interfaces, such as a network interface.

[0149] The device also includes a power supply 190 (such as a battery) for powering each component. Preferably, the power supply can be logically connected to the processor 170 through a power management system, so as to realize functions such as management of charging, discharging, and power consumption management through the power management system.

[0150] The device also includes an external interface 180. The external interface can be a standard Micro USB interface or a multi-pin connector, which can be used to connect the device to other devices for communication and can also be used to connect a charger to charge the device.

[0151] Although not shown, the device may also include a flash, a wireless fidelity (WiFi) module, a Bluetooth module, sensors with different functions, etc., which will not be elaborated here. Some or all of the methods described below can be applied to the device as Figure 5 shown.

[0152] Please refer to Figure 6, is a schematic structural diagram of the server provided in the embodiments of the present application. As Figure 6 shown, the server includes a bus 201, a processor 202, a communication interface 203, and a memory 204. The processor 202, the memory 204, and the communication interface 203 communicate with each other through the bus 201.

[0153] The bus 201 may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 only a thick line is used to represent it in the figure, but it does not mean that there is only one bus or one type of bus.

[0154] The processor 202 may be any one or more of a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor (MP), or a digital signal processor (DSP), etc.

[0155] The memory 204 may include volatile memory, such as random access memory (RAM). The memory 204 may also include non-volatile memory, such as read-only memory (ROM), flash memory, a hard disk drive (HDD), or a solid state drive (SSD).

[0156] It should be understood that the server can be a centralized or distributed device. The processor in the above-mentioned server can be a hardware circuit (such as an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a general-purpose processor, a digital signal processor (DSP), a microprocessor or a microcontroller, etc.), or a combination of these hardware circuits. For example, the processor can be a hardware system with the function of executing instructions, such as a CPU, a DSP, etc., or a hardware system without the function of executing instructions, such as an ASIC, an FPGA, etc., or a combination of the above hardware system without the function of executing instructions and the hardware system with the function of executing instructions.

[0157] An embodiment of the present application also provides a computer program product, including computer-readable instructions. When the computer-readable instructions run on an electronic device, the electronic device is enabled to implement any one of the temperature measurement methods provided by the embodiments of the present application.

[0158] An embodiment of the present application also provides a computer-readable storage medium. The storage medium carries one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can be enabled to implement any one of the temperature measurement methods provided by the embodiments of the present application.

[0159] In addition, it should be noted that the device embodiments described above are only illustrative. The units described as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. In addition, in the drawings of the device embodiments provided in the present application, the connection relationship between the modules indicates that they have a communication connection, which can be specifically implemented as one or more communication buses or signal lines.

[0160] Through the description of the above embodiments, those skilled in the art can clearly understand that the present application can be implemented by means of software plus necessary general hardware. Of course, it can also be implemented by dedicated hardware including application-specific integrated circuits, dedicated CPUs, dedicated memories, dedicated components, etc. Generally, functions completed by computer programs can be easily implemented by corresponding hardware, and the specific hardware structures for implementing the same function can also be diverse, such as analog circuits, digital circuits or dedicated circuits, etc. However, for the present application, software program implementation is a better embodiment in more cases. Based on such an understanding, the technical solution of the present application, in essence, or the part that makes a contribution to the prior art, can be embodied in the form of a software product. This computer software product is stored in a readable storage medium, such as a computer floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk or optical disc, etc., and includes several instructions to enable a computer device (which can be a personal computer, training device, or network device, etc.) to execute the methods described in various embodiments of the present application.

[0161] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product.

[0162] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general computer, a dedicated computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website, computer, training device or data center to another website, computer, training device or data center in a wired (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.) manner. The computer-readable storage medium can be any available medium that a computer can store or a data storage device such as a training device or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid state disk (SSD)), etc.

Claims

1. A temperature measurement method, characterized in that, Including: Obtaining the resistance values corresponding to multiple NTC thermistors respectively; The multiple NTC thermistors are used to measure the temperature of the same object to be detected; For each of the NTC thermistors, calculating the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor; Based on the temperatures corresponding to the multiple NTC thermistors respectively, determining the target temperature of the object to be detected.

2. The temperature measurement method according to claim 1, wherein The step of determining the target temperature of the object to be detected based on the temperatures corresponding to the multiple NTC thermistors respectively includes: Obtaining target NTC thermistors whose corresponding temperatures belong to a preset temperature range from the multiple NTC thermistors; Based on the temperature corresponding to the target NTC thermistor, determining the target temperature of the object to be detected.

3. The temperature measurement method according to claim 1, characterized in that The target NTC thermistors include a first NTC thermistor and a second NTC thermistor. The step of determining the target temperature of the object to be detected based on the temperatures corresponding to the multiple NTC thermistors respectively includes: Calculate the target temperature T through the formula T = k×T A +(1 - k)×T B , where the target temperature T is obtained by calculation; where k = σ B 2 / (σ A 2 + σ B 2 ), σ A is the temperature measurement variance of the first NTC thermistor, σ B is the temperature measurement variance of the second NTC thermistor, T A is the temperature corresponding to the first NTC thermistor, T B is the temperature corresponding to the second NTC thermistor.

4. The temperature measurement method according to claim 3, characterized in that, The method for obtaining the temperature measurement variance of the first NTC thermistor includes: When the temperature of the object to be detected remains unchanged, obtaining the resistance values of the first NTC thermistor at different times; Obtaining the variance of the temperatures corresponding to the resistance values of the first NTC thermistor at different times.

5. The temperature measurement method according to claim 3, characterized in that, The method for obtaining the temperature measurement variance of the first NTC thermistor includes: When the object to be detected maintains a first temperature, obtaining the first resistance values of the first NTC thermistor at different times; Obtaining the first variance of the temperatures corresponding to the first resistance values of the first NTC thermistor at different times; When the object to be detected maintains a second temperature, obtaining the second resistance values of the first NTC thermistor at different times; Obtaining the second variance of the temperatures corresponding to the second resistance values of the first NTC thermistor at different times; Determining the mean of the first variance and the second variance as the temperature measurement variance of the first NTC thermistor.

6. A temperature measuring device, characterized in that, Including: A first obtaining module, configured to obtain the resistance values corresponding to multiple NTC thermistors respectively; The multiple NTC thermistors are used to measure the temperature of the same object to be detected; A calculation module, configured to calculate, for each of the NTC thermistors, the temperature of the object to be detected detected by the NTC thermistor based on the resistance value of the NTC thermistor; A first determining module, configured to determine the target temperature of the object to be detected based on the temperatures corresponding to the multiple NTC thermistors respectively.

7. The temperature measuring device according to claim 6, characterized in that, The first determining module includes: A calculation unit for calculating the target temperature T through the formula T = k×T A +(1 - k)×T B , where the target temperature T is calculated where k = σ B 2 / (σ A 2 + σ B 2 ), σ A is the temperature measurement variance of the first NTC thermistor, σ B is the temperature measurement variance of the second NTC thermistor, T A is the temperature corresponding to the first NTC thermistor, T B is the temperature corresponding to the second NTC thermistor.

8. A computer program product, characterized in that, Including computer-readable instructions, when the computer-readable instructions run on an electronic device, enabling the electronic device to implement the temperature measurement method according to any one of claims 1 to 5.

9. An electronic device, characterized in that, Including at least one processor and a memory connected to the processor, wherein: The memory is used to store a computer program; The processor is configured to execute the computer program, so that the electronic device can implement the temperature measurement method described in any one of claims 1 to 5.

10. A computer storage medium, characterized in that, The storage medium carries one or more computer programs, which, when executed by an electronic device, can enable the electronic device to implement the temperature measurement method described in any one of claims 1 to 5.

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