A high temperature pressure switch sensor suitable for semiconductor industry

Abstract

The application discloses a high-temperature pressure switch sensor suitable for the semiconductor industry and relates to the technical field of intelligent sensors, which comprises an outer shell, a floating assembly and a sensing assembly. The outer shell is provided with a heat dissipation assembly at the outer end, the bottom outer end of the heat dissipation assembly is provided with a piston seat, and the bottom outer end of the piston seat is connected with a butt joint. The heat exchange cavity, the heat dissipation seat at the bottom end of the partition plate and the cooling oil stored in the piston seat can directly cool the piston seat, preventing the high-temperature expansion from affecting the lifting precision. When the floating piston moves upwards, the cooling oil is pushed to enter the heat exchange cavity through the one-way liquid inlet valve to realize the mixing cooling of high-temperature and low-temperature oil, and when the floating piston moves downwards, the cooling oil in the heat exchange cavity is sucked back to the heat dissipation seat and the piston seat through the one-way liquid outlet valve. The circulating system utilizes the proportional relationship between temperature and pressure, automatically triggers the cooling oil flow to dissipate heat when the equipment pressure rises, avoids the boiling of oil through continuous heat exchange and maintains the thermal stability of the system.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent sensor, in particular to a high-temperature pressure switch sensor suitable for semiconductor industry. BACKGROUND

[0002] As the core component of modern industrial automation and Internet of Things technology, intelligent sensors realize the leap from single physical quantity detection to intelligent decision-making by integrating sensing, data processing and communication functions. Compared with traditional sensors, the core advantages of intelligent sensors lie in environmental self-adaptation, multi-signal fusion and fault self-diagnosis capability. High-temperature pressure switch sensors belong to intelligent sensors, and can effectively meet the stringent requirements for stability and reliability in high-temperature and high-pressure scenarios such as semiconductor manufacturing.

[0003] In semiconductor manufacturing and packaging processes, high-temperature and high-pressure environments have very high requirements for the stability and reliability of equipment. As a key monitoring component, pressure switch sensors need to accurately control pressure and ensure the continuity of signal transmission under extreme working conditions. Traditional pressure switch sensors mostly use metal materials or simple heat dissipation structures, but they are prone to piston component jamming and poor contact due to thermal expansion during long-term high-temperature operation, which may cause signal distortion or failure. In addition, conventional cooling systems mostly rely on external cooling devices, which have the problems of response lag and low heat dissipation efficiency, and are difficult to achieve dynamic adaptation of oil circulation cooling and pressure changes, which may cause boiling or sealing failure due to high oil temperature.

[0004] In the prior art, the sensor contact usually uses a single signal transmission path. When the contact fails due to high-temperature oxidation or mechanical wear, it is difficult to determine the fault point in time, which may cause system misjudgment or shutdown. At the same time, for the working condition of sudden temperature rise, the traditional sensor lacks active temperature control protection design, and the internal electronic components are easily damaged by heat, affecting the service life of the equipment. SUMMARY

[0005] The present application aims to provide a high-temperature pressure switch sensor suitable for semiconductor industry to solve the problems raised in the background.

[0006] In order to achieve the above object, the application provides the following technical scheme: a high-temperature pressure switch sensor suitable for the semiconductor industry, comprising an outer shell, a floating assembly and a sensing assembly, the outer end of the outer shell is provided with a heat dissipation assembly, the bottom outer end of the heat dissipation assembly is provided with a piston seat, the bottom outer end of the piston seat is connected with a docking head, the inside of the outer shell is provided with the floating assembly, the floating assembly comprises a floating seat, the bottom outer end of the floating seat is provided with a first reset spring, the bottom middle end of the floating seat is connected with a docking rod, the bottom outer end of the docking rod is provided with a floating piston, the top outer end of the floating seat is provided with a sensing head, the top outer end of the sensing head is provided with a pressing head, the outer end of the sensing head is provided with a normally open contact, the outer end of the outer shell is provided with a communication head, the end of the communication head is provided with a signal transmission line, and the end of the communication head away from the signal transmission line is provided with an open-close contact.

[0007] Further, the heat dissipation assembly comprises a heat dissipation seat, the outer end of the heat dissipation seat is provided with a heat dissipation fin, and the inside of the heat dissipation seat is provided with a heat exchange cavity, the heat exchange cavity and the heat dissipation seat are provided with a one-way liquid inlet valve and a one-way liquid outlet valve, and the inside of the heat dissipation seat is provided with a partition plate.

[0008] Further, the heat dissipation seat and the outer shell and the piston seat are integrated structures, and the heat dissipation seat is communicated with the heat exchange cavity through the one-way liquid inlet valve and the one-way liquid outlet valve.

[0009] Further, the heat dissipation seat is communicated with the piston seat, and the piston seat and the docking head are integrated structures.

[0010] Further, the floating seat is elastically connected with the heat dissipation seat through the first reset spring, and the outer contour size of the floating piston matches the inner contour size of the piston seat.

[0011] Further, the floating piston drives the floating seat and the sensing head to move upward through the docking rod, and the sensing head drives the normally open contact and the open-close contact to separate and contact when moving upward.

[0012] Further, the top outer end of the outer shell is provided with a top shell, the inside of the top shell is provided with a through slot, the top inside of the outer shell is provided with a heat-sensitive electromagnet, and the bottom inside of the outer shell is provided with a sensing assembly.

[0013] Further, the sensing assembly comprises a lifting seat, the top outer end of the lifting seat is provided with a ventilation slot, the inside of the lifting seat is provided with a heat dissipation cavity, the bottom middle end of the lifting seat is provided with a pressing contact, and the lifting seat and the outer shell are provided with a second reset spring.

[0014] Further, the lifting seat is electromagnetically connected with the heat-sensitive electromagnet, and the lifting seat is elastically connected with the second reset spring.

[0015] Further, the through groove is communicated with the heat dissipation cavity through the air passage, and the extrusion contact is arranged inside the heat dissipation cavity.

[0016] The application provides a high-temperature pressure switch sensor suitable for the semiconductor industry

[0017] Beneficial effects:

[0018] 1. The cooling oil stored in the heat dissipation seat and the piston seat at the bottom end of the heat exchange cavity can directly cool the piston seat, preventing high-temperature expansion from affecting the lifting precision. When the floating piston moves upward, the cooling oil is pushed into the heat exchange cavity through the one-way liquid inlet valve to realize high and low temperature oil mixing cooling. When the floating piston moves downward, the cooling oil in the heat exchange cavity is sucked back to the heat dissipation seat and the piston seat through the one-way liquid outlet valve. The circulating system utilizes the proportional relationship between temperature and pressure to automatically trigger the cooling oil flow and heat dissipation when the equipment pressure rises, avoids oil boiling through continuous heat exchange, and maintains the system thermal stability.

[0019] 2. The high-temperature cooling oil entering the heat exchange cavity is quickly cooled through the heat dissipation fins, ensuring that the heat exchange cavity maintains a low temperature state. Since the shell and the heat dissipation seat are designed in an integrated manner, the cooling oil can simultaneously absorb the heat of the shell when it is cooled in the heat exchange cavity, thereby reducing the working temperature of the internal communication head and the opening and closing contact, effectively preventing signal interference and attenuation caused by high temperature, and avoiding contact failure of the opening and closing contact and the opposite contact due to thermal expansion.

[0020] 3. When the equipment environment temperature is too high, the heat-sensitive electromagnet loses power and is driven downward by the second reset spring, so that the air passage is communicated with the opposite groove of the top shell, and low-temperature cold air enters the heat dissipation cavity to cool the internal extrusion contact. If the bottom contact of the opening and closing contact fails, the floating seat pushes the opposite contact and the top contact thereof into contact under the action of air pressure, and the extrusion head and the extrusion contact abut each other at this time. At this time, the pressure switch can determine the bottom contact failure by receiving the double signals of the top contact of the opening and closing contact and the extrusion contact through the signal transmission line. If only the extrusion contact signal is received, it is judged that the communication head is abnormal. Through the multi-contact signal interaction verification, accurate identification of the fault point and work stability are realized. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a whole three-dimensional structure schematic diagram of the high-temperature pressure switch sensor suitable for the semiconductor industry.

[0022] Figure 2 It is an internal cross-sectional structure schematic diagram A of the high-temperature pressure switch sensor suitable for the semiconductor industry.

[0023] Figure 3 It is an internal cross-sectional structure schematic diagram B of the high-temperature pressure switch sensor suitable for the semiconductor industry.

[0024] Figure 4 It is a floating assembly structure diagram of a high-temperature pressure switch sensor suitable for the semiconductor industry according to the present application;

[0025] Figure 5 It is a whole sectional structure diagram of a high-temperature pressure switch sensor suitable for the semiconductor industry according to the present application;

[0026] Figure 6 It is a displacement structure diagram of a floating assembly and a sensing assembly of a high-temperature pressure switch sensor suitable for the semiconductor industry according to the present application.

[0027] In the figure: 1, outer shell; 2, heat dissipation assembly; 201, heat dissipation seat; 202, heat dissipation fin; 203, heat exchange cavity; 204, one-way liquid inlet valve; 205, one-way liquid outlet valve; 206, partition plate; 3, piston seat; 4, butt joint; 5, floating assembly; 501, floating seat; 502, first reset spring; 503, butt joint rod; 504, floating piston; 505, sensing head; 506, extrusion head; 507, through contact; 6, communication head; 7, signal transmission line; 8, opening and closing contact; 9, top shell; 10, through groove; 11, heat-sensitive electromagnet; 12, sensing assembly; 1201, lifting seat; 1202, air vent groove; 1203, heat dissipation cavity; 1204, extrusion contact; 1205, second reset spring. DETAILED DESCRIPTION

[0028] Please refer to Figures 1 to 6 The present application provides a technical solution: a high-temperature pressure switch sensor suitable for the semiconductor industry, which comprises an outer shell 1, a floating assembly 5 and a sensing assembly 12, the outer end of the outer shell 1 is provided with a heat dissipation assembly 2, the bottom outer end of the heat dissipation assembly 2 is provided with a piston seat 3, the bottom outer end of the piston seat 3 is connected with a butt joint 4, the inside of the outer shell 1 is provided with the floating assembly 5, the floating assembly 5 comprises a floating seat 501, the bottom outer end of the floating seat 501 is provided with a first reset spring 502, the bottom middle end of the floating seat 501 is connected with a butt joint rod 503, the bottom outer end of the butt joint rod 503 is provided with a floating piston 504, the top outer end of the floating seat 501 is provided with a sensing head 505, the top outer end of the sensing head 505 is provided with an extrusion head 506, the outer end of the sensing head 505 is provided with a through contact 507, the outer end of the outer shell 1 is provided with a communication head 6, the distal end of the communication head 6 is provided with a signal transmission line 7, and the end of the communication head 6 away from the signal transmission line 7 is provided with an opening and closing contact 8.

[0029] Specific operation as follows, the adapter 4 is provided with a thread inside, which makes the adapter 4 can be convenient and stable with the external pipeline docking, the staff will be adapter 4 and need to be measured pressure pipeline docking is completed, and the device power and pressure switch circuit communication after being energized, the device can operate normally, the process of device operation, gas pressure, liquid pressure in the pipeline can be transmitted to the piston seat 3 inside the adapter 4, the floating piston 504 is arranged in the piston seat 3, which makes the pressure can push the floating piston 504 up, the floating piston 504 through the adapter rod 503 and floating seat 501 link, which makes the floating seat 501 can push the sensor head 505 to rise, the sensor head 505 in the up, the communication head 6 can be separated from the bottom of the open and close contact 8, and the signal transmission line 7 will be transmitted to the pressure switch, at this time the pressure switch can open the valve to release pressure, pressure recovery, the floating seat 501 will be reset under the traction of the first reset spring 502, at this time the contact is closed again, the pressure switch will control the valve to close.

[0030] Please see Figures 1 to 6 , the heat dissipation assembly 2 includes a heat dissipation seat 201, the outer end of the heat dissipation seat 201 is provided with a heat dissipation fin 202, and the inside of the heat dissipation seat 201 is provided with a heat exchange cavity 203, the heat exchange cavity 203 and the heat dissipation seat 201 are provided with a one-way liquid inlet valve 204 and a one-way liquid outlet valve 205, the inner side of the heat dissipation seat 201 is provided with a partition plate 206, the heat dissipation seat 201 and the outer shell 1, the piston seat 3 are integrated structure, and the heat dissipation seat 201 is communicated with the heat exchange cavity 203 through the one-way liquid inlet valve 204 and the one-way liquid outlet valve 205, the heat dissipation seat 201 is communicated with the piston seat 3, and the piston seat 3 and the adapter 4 are integrated structure, the floating seat 501 is elastically connected with the heat dissipation seat 201 through the first reset spring 502, the outer contour size of the floating piston 504 matches the inner contour size of the piston seat 3, the floating piston 504 drives the floating seat 501 and the sensor head 505 to move up through the adapter rod 503, and the sensor head 505 drives the open and close contact 8 to separate and contact;

[0031] The specific operation is as follows: the heat exchange cavity 203, the heat dissipation seat 201 at the bottom end of the partition plate 206, and the inside of the piston seat 3 store cooling oil, which can directly cool the piston seat 3 to avoid expansion deformation of the piston seat 3 under high temperature, affecting its normal lifting. In addition, the floating piston 504 can push the cooling oil to flow during upward movement, which makes the cooling oil enter the heat exchange cavity 203 through the one-way liquid inlet valve 204, so that the high-temperature cooling oil can be mixed and cooled with the low-temperature cooling oil in the heat exchange cavity 203. During the downward movement of the floating piston 504, the cooling oil in the heat exchange cavity 203 will flow back to the inside of the heat dissipation seat 201 and the piston seat 3 through the one-way liquid outlet valve 205 due to the suction force when the floating piston 504 is displaced. Through this operation, the mixed cooling of the cooling oil can be achieved, which can avoid boiling of the cooling oil due to high temperature. Since the temperature rise is proportional to the pressure rise, the device can automatically cool when the pressure rises, which can effectively improve the working stability of the device in a high-temperature environment. The high-temperature cooling oil entering the heat exchange cavity 203 will be quickly cooled by the heat dissipation fins 202, which can ensure that the cooling oil in the heat exchange cavity 203 is at a low temperature during subsequent heat exchange. Since the outer shell 1 and the heat dissipation seat 201 are integrated, the cooling oil in the heat exchange cavity 203 can absorb heat from the outer shell 1 during cooling, which makes the communication head 6 and the opening and closing contact 8 inside the outer shell 1 in a low-temperature environment, which can effectively avoid signal interference and attenuation caused by high temperature, as well as contact failure of the opening and closing contact 8 and the contact 507 due to thermal expansion.

[0032] Please refer to Figures 1 to 6 , the top outer end of the outer shell 1 is provided with a top shell 9, and the inner side of the top shell 9 is provided with a through slot 10. The top inner side of the outer shell 1 is provided with a heat-sensitive electromagnet 11, and the bottom inner side of the outer shell 1 is provided with a sensing assembly 12. The sensing assembly 12 includes a lifting seat 1201, the top outer end of the lifting seat 1201 is provided with a ventilation groove 1202, and the inside of the lifting seat 1201 is provided with a heat dissipation cavity 1203. The bottom middle end of the lifting seat 1201 is provided with a squeeze contact 1204, and the lifting seat 1201 and the outer shell 1 are provided with a second reset spring 1205. The lifting seat 1201 and the heat-sensitive electromagnet 11 are electromagnetically attracted and connected, and the lifting seat 1201 and the second reset spring 1205 are elastically connected. The through slot 10 is connected with the heat dissipation cavity 1203 through the ventilation groove 1202, and the squeeze contact 1204 is arranged in the heat dissipation cavity 1203;

[0033] The specific operation is as follows: the temperature of the environment where the device is located is too high, the thermal sensitive electromagnet 11 will lose power when the ambient temperature reaches a specified temperature, at this time the second reset spring 1205 will push the lifting seat 1201 to move down, which makes the ventilation groove 1202 communicate with the through groove 10 of the top shell 9, so that the low-temperature cold air can enter the heat dissipation cavity 1203, and the end of the compression contact 1204 is located inside the heat dissipation cavity 1203, which makes the compression contact 1204 can be cooled to prevent damage in high temperature environment, in addition, if the contact at the bottom of the opening and closing contact 8 fails to transmit signals, under the push of air pressure, the floating seat 501 will push the through contact 507 to contact the top contact of the opening and closing contact 8, and at this point, the compression head 506 will contact the compression contact 1204, the compression contact 1204 is connected to a signal transmission line 7 and a pressure switch, through the above operation, when the pressure switch contacts the double signals from the top contact of the opening and closing contact 8 and the compression contact 1204, the device can determine that the bottom contact of the opening and closing contact 8 is damaged, if the pressure switch only receives the signal from the compression contact 1204, it can be determined that the communication head 6 is damaged, which makes the device can transmit signals through multiple contacts to ensure the stability of the work, and the signal transmission point of the fault is determined through multiple signal verification.

[0034] In summary, the high-temperature pressure switch sensor suitable for the semiconductor industry is used, first of all, the adapter 4 is provided with threads inside, which makes the adapter 4 can be conveniently and stably connected with the external pipeline, the staff connects the adapter 4 with the pipeline to be measured, and after the device is powered on and the circuit is connected with the pressure switch, the device can operate normally;

[0035] Then during the operation of the device, the gas pressure and liquid pressure in the pipeline can be transmitted to the piston seat 3 inside through the adapter 4, the floating piston 504 is arranged in the piston seat 3, which makes the pressure push the floating piston 504 to move up, the floating piston 504 is connected with the floating seat 501 through the connecting rod 503, which makes the floating seat 501 push the sensing head 505 to rise, when the sensing head 505 moves up, the through contact 507 and the bottom contact of the opening and closing contact 8 are separated, the communication head 6 can sense this state and transmit the signal to the pressure switch through the signal transmission line 7, at this time the pressure switch can open the valve to release pressure, after the pressure is restored, the floating seat 501 will reset under the traction of the first reset spring 502, at this time the contacts are closed again, and the pressure switch will control the valve to close;

[0036] The cooling oil stored in the heat exchange cavity 203 and the heat sink 201 at the bottom of the partition 206 and the piston seat 3 can directly cool the piston seat 3, avoiding the expansion deformation of the piston seat 3 under high temperature, affecting its normal lifting. In addition, the floating piston 504 can push the cooling oil to flow during the upward movement, which makes the cooling oil enter the heat exchange cavity 203 through the one-way inlet valve 204, so that the high-temperature cooling oil can be mixed and cooled with the low-temperature cooling oil in the heat exchange cavity 203. During the downward movement of the floating piston 504, the cooling oil in the heat exchange cavity 203 can flow back to the heat sink 201 and the piston seat 3 through the one-way outlet valve 205 due to the suction force when the floating piston 504 is displaced. Through the above operation, the mixed cooling of the cooling oil can be realized, which can avoid the boiling of the cooling oil due to the high temperature. Since the temperature rise is proportional to the pressure rise, the device can automatically cool when the pressure rises, which can effectively improve the working stability of the device in a high-temperature environment.

[0037] The high-temperature cooling oil entering the heat exchange cavity 203 can be quickly cooled by the heat dissipation fins 202, which can ensure that the cooling oil in the heat exchange cavity 203 is at a low temperature during subsequent heat exchange. Since the outer shell 1 and the heat sink 201 are integrated, the cooling oil in the heat exchange cavity 203 can absorb heat from the outer shell 1 during cooling, which can keep the communication head 6 and the opening and closing contact 8 in the outer shell 1 in a low-temperature environment, effectively avoiding signal interference and attenuation caused by high temperature, as well as contact failure between the opening and closing contact 8 and the opposite contact 507 due to thermal expansion.

[0038] Finally, when the ambient temperature is too high, the heat-sensitive electromagnet 11 will lose power when it senses that the ambient temperature reaches a specified temperature. At this time, the second reset spring 1205 will push the lifting seat 1201 to move downward, which makes the ventilation groove 1202 communicate with the opposite groove 10 of the top shell 9, so that low-temperature cold air can enter the heat dissipation cavity 1203, and the end of the compression contact 1204 is located in the heat dissipation cavity 1203, which makes the compression contact 1204 cool down to prevent damage in a high-temperature environment. In addition, if the contact at the bottom of the opening and closing contact 8 fails to transmit signals, the floating seat 501 will push the opposite contact 507 and the top contact of the opening and closing contact 8 to contact under the push of the air pressure. At this point, the compression head 506 is in contact with the compression contact 1204. The compression contact 1204 is connected to a signal transmission line 7 and a pressure switch. Through the above operation, when the pressure switch contacts the double signals from the top contact of the opening and closing contact 8 and the compression contact 1204, the device can determine that the contact at the bottom of the opening and closing contact 8 is damaged. If the pressure switch only receives the signal from the compression contact 1204, it can be determined that the communication head 6 is damaged. This makes the device transmit signals through multiple contacts to ensure the working stability, and verifies the faulty signal transmission point through multiple signals.

[0039] It should be noted that, in this text, the term "comprising" or "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or include elements inherent to such processes, methods, articles or devices.

[0040] The principles and implementation modes of the present application are described by applying specific examples in this text, and the above examples are only used to help understand the method of the present application and its core idea. The above description is only the preferred implementation mode of the present application, and it should be noted that, due to the limited expression of the text, there are infinite specific structures in the objective world, and for ordinary skilled persons in the technical field, some improvements, refinements or changes can be made without departing from the principle of the present application, and the above technical features can also be combined in a proper way; these improvements, refinements, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the protection scope of the present application.

Claims

1. A high-temperature pressure switch sensor suitable for the semiconductor industry, characterized in that, The assembly includes a housing (1), a floating component (5), and a sensing component (12). A heat dissipation component (2) is provided at the outer end of the housing (1), and a piston seat (3) is placed at the bottom outer end of the heat dissipation component (2). A connecting joint (4) is connected to the bottom outer end of the piston seat (3). The floating component (5) is placed inside the housing (1). The floating component (5) includes a floating seat (501). A first return spring (502) is placed at the bottom outer end of the floating seat (501), and a connecting rod is connected to the bottom middle end of the floating seat (501). (503), and a floating piston (504) is provided at the bottom outer end of the docking rod (503). A sensing head (505) is provided at the top outer end of the floating seat (501). A pressing head (506) is provided at the top outer end of the sensing head (505). A communication contact (507) is provided at the outer end of the sensing head (505). A communication head (6) is provided at the outer end of the outer shell (1). A signal transmission line (7) is provided at the end of the communication head (6). An opening and closing contact (8) is provided at the end of the communication head (6) away from the signal transmission line (7).

2. The high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 1, characterized in that, The heat dissipation assembly (2) includes a heat dissipation base (201), the outer end of which is provided with heat dissipation fins (202), and the heat dissipation base (201) has a heat exchange chamber (203) inside. A one-way liquid inlet valve (204) and a one-way liquid outlet valve (205) are provided between the heat exchange chamber (203) and the heat dissipation base (201), and a partition (206) is arranged on the inner side of the heat dissipation base (201).

3. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 2, characterized in that, The heat sink (201) is an integrated structure with the outer shell (1) and the piston seat (3), and the heat sink (201) is connected to the heat exchange chamber (203) through a one-way liquid inlet valve (204) and a one-way liquid outlet valve (205).

4. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 2, characterized in that, The heat sink (201) is connected to the piston seat (3), and the piston seat (3) and the connector (4) are an integrated structure.

5. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 1, characterized in that, The floating seat (501) is elastically connected to the heat sink (201) via the first return spring (502), and the outer contour dimension of the floating piston (504) matches the inner contour dimension of the piston seat (3).

6. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 1, characterized in that, The floating piston (504) drives the floating seat (501) and the sensing head (505) to move upward through the docking rod (503), and the upward movement of the sensing head (505) causes the switching contact (507) to separate and contact with the opening and closing contact (8).

7. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 1, characterized in that, The outer top of the outer shell (1) is provided with a top shell (9), and a through groove (10) is provided on the inner side of the top shell (9). A thermistor (11) is arranged on the inner top of the outer shell (1), and a sensing component (12) is arranged on the inner bottom of the outer shell (1).

8. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 7, characterized in that, The sensing component (12) includes a lifting seat (1201), a ventilation groove (1202) is provided at the top outer end of the lifting seat (1201), a heat dissipation cavity (1203) is provided inside the lifting seat (1201), a compression contact (1204) is provided at the bottom middle end of the lifting seat (1201), and a second return spring (1205) is provided between the lifting seat (1201) and the outer shell (1).

9. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 8, characterized in that, The lifting seat (1201) is electromagnetically attracted to the thermistor (11), and the lifting seat (1201) is elastically connected to the second return spring (1205).

10. A high-temperature pressure switch sensor suitable for the semiconductor industry according to claim 8, characterized in that, The through slot (10) is connected to the heat dissipation cavity (1203) through the ventilation slot (1202), and the compression contact (1204) is placed inside the heat dissipation cavity (1203).

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