Wafer detection mechanism

Abstract

The invention discloses a wafer detection mechanism. The wafer detection mechanism comprises a fixedly arranged camera; the bearing assembly is arranged below the camera and comprises a horizontally arranged mounting plate and a plurality of bearing blocks movably arranged on the mounting plate; a through hole is formed in the mounting plate, and the multiple bearing blocks are arranged in the circumferential direction of the through hole at intervals; the moving direction of the bearing block is parallel to the radial direction of the through hole; the bearing block has an extending position and a retracting position, and when the bearing block is located at the extending position, the minimum distance from the bearing block to the center of the through hole is smaller than the radius of the wafer to be detected; when the bearing block is located at the retraction position, the minimum distance from the bearing block to the center of the through hole is greater than the radius of the wafer to be detected; the plurality of bearing blocks are configured as follows: when one bearing block is located at the retraction position, at least three bearing blocks are located at the extension position; the first light source assembly is arranged above the bearing assembly; the second light source assembly is arranged below the bearing assembly; and the moving assembly is connected with the mounting plate. According to the wafer detection mechanism, non-shielding detection can be realized, and the detection efficiency can be improved.

Description

Technical Field

[0001] This specification relates to the technical field of semiconductor equipment, and particularly to a wafer inspection mechanism. Background Art

[0002] A wafer refers to a circular silicon wafer or substrate used in semiconductor processes, also known as a silicon wafer or substrate. It is the basic material for manufacturing integrated circuits. Wafers are generally made of single-crystalline silicon material and have a very flat surface. The process of manufacturing wafers is called wafer manufacturing or semiconductor manufacturing, which involves multiple process steps such as wafer growth, cutting, polishing, and cleaning. On the wafer, various components and layers of integrated circuits can be manufactured through process steps such as lithography, thin-film deposition, ion implantation, diffusion, and metal deposition. Multiple chips can be manufactured on a single wafer, and each chip is used as an independent IC product through cutting and packaging. Wafer manufacturing is a crucial step in the semiconductor industry, affecting the quality, efficiency, and cost of integrated circuits. After wafer manufacturing is completed, the wafers need to be inspected. Wafer inspection is the core link in semiconductor manufacturing to ensure chip quality and yield, involving multi-dimensional technologies such as physical defect identification, dimensional measurement, and electrical performance testing.

[0003] In the prior art, when inspecting wafers, it is often necessary to clamp or support the wafers, which results in at least partial occlusion of the wafers. The occluded parts cannot be accurately inspected, leading to a decrease in inspection efficiency and affecting the inspection effect, and may cause defective products to flow out. Summary of the Invention

[0004] In view of the deficiencies of the prior art, an object of this specification is to provide a wafer inspection mechanism that can achieve unobstructed inspection and improve inspection efficiency.

[0005] To achieve the above object, an embodiment of this specification provides a wafer inspection mechanism, including: A fixedly arranged camera; A carrier assembly for carrying a wafer to be inspected, the carrier assembly is arranged below the camera, the carrier assembly includes a horizontally arranged mounting plate and a plurality of carrier blocks movably arranged on the mounting plate; the mounting plate is provided with a through hole, and the plurality of carrier blocks are spaced apart in the circumferential direction of the through hole; the moving direction of the carrier blocks is parallel to the radial direction of the through hole; the carrier blocks have an extended position and a retracted position, when the carrier blocks are in the extended position, the minimum distance from the carrier blocks to the center of the through hole is less than the radius of the wafer to be inspected; when the carrier blocks are in the retracted position, the minimum distance from the carrier blocks to the center of the through hole is greater than the radius of the wafer to be inspected; the plurality of carrier blocks are configured such that when there is a carrier block in the retracted position, at least three carrier blocks are in the extended position; A first light source assembly disposed above the carrier assembly; A second light source assembly disposed below the carrier assembly; A moving assembly connected to the mounting plate for driving the carrier assembly to move in a first horizontal direction and a second horizontal direction, the first horizontal direction being perpendicular to the second horizontal direction.

[0006] As a preferred embodiment, a connecting block is fixedly connected to a surface of the bearing block facing away from the center of the through hole, a fixing block and a guiding member are fixedly connected to the mounting plate, and the guiding member extends along the radial direction of the through hole; the connecting block is slidably connected to the guiding member; a spring is disposed between the connecting block and the fixing block.

[0007] As a preferred embodiment, a limiting member is fixedly disposed on the connecting block and extends in a direction perpendicular to the radial direction of the through hole; a vertically extending rotating shaft is fixedly connected to the mounting plate; the rotating shaft is rotatably connected to a connecting rod, one end of the connecting rod abuts against a side of the limiting member close to the bearing block, and the other end is fixedly connected to an output end of a first driving member.

[0008] As a preferred embodiment, an opening is provided on one side of the mounting plate in the first horizontal direction, and the opening communicates with the through hole.

[0009] As a preferred embodiment, the number of the bearing blocks is six; the six bearing blocks are evenly spaced in the circumferential direction of the through hole and are symmetrically arranged both in the first horizontal direction and the second horizontal direction; the moving directions of the output ends of the plurality of first driving members are all parallel to the second horizontal direction.

[0010] As a preferred embodiment, a bearing surface for bearing a wafer to be measured is provided at the bottom of the bearing block, and the bearing surface is horizontally arranged; one end of the bearing surface facing the center of the through hole is connected with an inclined surface, and the inclined surface is not higher than the bearing surface.

[0011] As a preferred embodiment, the wafer detection mechanism further includes a horizontally arranged fixing plate and a support frame fixedly connected above the fixing plate; the camera is fixedly connected to the support frame; the carrier assembly is slidably connected to the fixing plate through the moving assembly.

[0012] As a preferred embodiment, the moving assembly includes: Two first slide rails fixedly connected to the upper surface of the fixing plate, the first slide rails extending along the first horizontal direction; the two first slide rails are spaced apart in the second horizontal direction; A connecting plate slidably connected to the two first slide rails; A second driving member connected to the connecting plate is configured to drive the connecting plate to move along the first horizontal direction; A second sliding rail fixedly connected to the upper surface of the connecting plate, the second sliding rail extending along the second horizontal direction; the mounting plate is slidably connected to the second sliding rail; A third driving member connected to the mounting plate is configured to drive the mounting plate to move along the second horizontal direction.

[0013] As a preferred embodiment, the first light source assembly is connected to the support frame through a first adjustable bracket; the second light source assembly is connected to the fixing plate through a second adjustable bracket.

[0014] As a preferred embodiment, the light rays of the first light source assembly illuminating the upper surface of the wafer to be measured are staggered from the light rays of the second light source assembly illuminating the lower surface of the wafer to be measured. Advantageous Effects

[0015] The wafer detection mechanism provided by this embodiment is provided with a camera, a carrying assembly, a first light source assembly, a second light source assembly and a moving assembly. Through the first light source assembly above the carrying assembly and the second light source assembly below the carrying assembly, both the upper and lower sides of the wafer to be measured on the carrying assembly can be illuminated, so that the image captured by the camera can be clearer and the accuracy of detection can be improved. By driving the carrying assembly to move in the first horizontal direction and the second horizontal direction through the moving assembly, different parts of the wafer to be measured can pass through the bottom of the camera in sequence, so as to realize the photographing and detection of all positions of the wafer to be measured.

[0016] When the position where the wafer to be measured contacts the carrying block is moved directly below the camera, the carrying block moves from the extended position to the retracted position along the radial direction, so that the contact and carrying state with the wafer to be measured changes to a separated state, and the carrying part will not block the second light source assembly, and the camera can capture a clear image of the wafer to be measured without occlusion under the illumination of the first light source assembly and the second light source assembly, so as to realize unobstructed detection and improve the accuracy of detection.

[0017] At the same time, since multiple carrying blocks are configured such that when there is a carrying block in the retracted position, at least three carrying blocks are in the extended position, even if some carrying blocks are in the retracted position in order to capture an unobstructed image, at least three other carrying blocks in the extended position can stably carry the wafer to be measured, ensuring the sustainability of the detection process and improving the detection efficiency.

[0018] Referring to the following description and the accompanying drawings, specific embodiments of the present invention are disclosed in detail, indicating the ways in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope thereby.

[0019] Features described and / or illustrated for one embodiment can be used in the same or similar way in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0020] It should be emphasized that the term "comprising / including" as used herein refers to the presence of features, whole things, steps or components, but does not exclude the presence or addition of one or more other features, whole things, steps or components. Brief Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 Schematic three-dimensional structure diagram of a wafer detection mechanism provided in this embodiment; Figure 2 Schematic structure diagram of a carrier assembly provided in this embodiment; Figure 3 Top view of a carrier assembly provided in this embodiment; Figure 4 Schematic structure diagram between a carrier block and a first driving member provided in this embodiment; Figure 5 Schematic structure diagram of a moving assembly provided in this embodiment.

[0023] Description of the Reference Numerals in the Drawings: 1, camera; 2, carrier assembly; 21, mounting plate; 211, through hole; 212, opening; 22, carrier block; 221, bearing surface; 222, inclined surface; 23, connecting block; 24, fixing block; 25, guiding member; 26, spring; 27, limiting member; 28, rotating shaft; 29, connecting rod; 210, first driving member; 3, first light source assembly; 31, first adjustable bracket; 4, second light source assembly; 41, second adjustable bracket; 5, moving assembly; 51, first slide rail; 52, connecting plate; 53, second driving member; 54, second slide rail; 55, third driving member; 56, intermediate plate; 6, fixing plate; 7, support frame; 10, wafer to be measured; F, radial direction; X, first horizontal direction; Y, second horizontal direction; Z, vertical direction. Detailed Embodiments

[0024] To enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0025] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there can also be another element in the middle. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be another element in the middle at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0027] Please refer to Figures 1 to 5 。This application embodiment provides a wafer detection mechanism, including: a camera 1, a carrying component 2, a first light source component 3, a second light source component 4 and a moving component 5.

[0028] Among them, the camera 1 is fixedly arranged. The carrying component 2 is used to carry the wafer 10 to be detected. The carrying component 2 is disposed below the camera 1. As Figure 2As shown in the figure, the carrier assembly 2 includes a horizontally arranged mounting plate 21 and a plurality of carrier blocks 22 movably arranged on the mounting plate 21. The mounting plate 21 is provided with a through hole 211, and the plurality of carrier blocks 22 are arranged at intervals in the circumferential direction of the through hole 211. The moving direction of the carrier block 22 is parallel to the radial direction F of the through hole 211. The carrier block 22 has an extended position and a retracted position. When the carrier block 22 is in the extended position, the minimum distance from the carrier block 22 to the center of the through hole 211 is less than the radius of the wafer 10 to be measured. At this time, the carrier block 22 can carry the wafer 10 to be measured. When the carrier block 22 is in the retracted position, the minimum distance from the carrier block 22 to the center of the through hole 211 is greater than the radius of the wafer 10 to be measured. At this time, the carrier block 22 is separated from the wafer 10 to be measured. The plurality of carrier blocks 22 are configured such that when there is a carrier block 22 in the retracted position, at least three carrier blocks 22 are in the extended position. The first light source assembly 3 is arranged above the carrier assembly 2. The second light source assembly 4 is arranged below the carrier assembly 2. The moving assembly 5 is connected to the mounting plate 21 and is used to drive the carrier assembly 2 to move in the first horizontal direction X and the second horizontal direction Y. The first horizontal direction X and the second horizontal direction Y are two mutually perpendicular directions in the horizontal plane, and both the first horizontal direction X and the second horizontal direction Y are perpendicular to the vertical direction Z.

[0029] The wafer detection mechanism provided by this embodiment is provided with a camera 1, a carrier assembly 2, a first light source assembly 3, a second light source assembly 4 and a moving assembly 5. Through the first light source assembly 3 above the carrier assembly 2 and the second light source assembly 4 below the carrier assembly 2, the upper and lower sides of the wafer 10 to be measured on the carrier assembly 2 can be illuminated, so that the image captured by the camera 1 can be clearer and the detection accuracy can be improved. By driving the carrier assembly 2 to move in the first horizontal direction X and the second horizontal direction Y through the moving assembly 5, different parts of the wafer 10 to be measured can pass through the bottom of the camera 1 in sequence, so as to realize the photographing and detection of all positions of the wafer 10 to be measured.

[0030] When the position where the wafer 10 to be measured contacts the carrier block 22 is moved directly below the camera 1, the carrier block 22 moves from the extended position to the retracted position along the radial direction F, so that the contact and carrying state with the wafer 10 to be measured changes to a separated state, and the carrying part will not block the second light source assembly 4. The camera 1 can capture a clear image of the wafer 10 to be measured without occlusion under the illumination of the first light source assembly 3 and the second light source assembly 4, so as to realize occlusion-free detection and improve the detection accuracy.

[0031] At the same time, since the plurality of carrier blocks 22 are configured such that when there is a carrier block 22 in the retracted position, at least three carrier blocks 22 are in the extended position, even if some carrier blocks 22 are in the retracted position in order to capture an unobstructed image, the other at least three carrier blocks 22 in the extended position can stably carry the wafer 10 to be measured, ensuring that the detection process can continue, and improving the detection efficiency.

[0032] In this embodiment, if Figure 4 As shown, a connecting block 23 is fixedly connected to a side of the bearing block 22 away from the center of the through hole 211, and a fixing block 24 and a guide member 25 are fixedly connected to the mounting plate 21, and the guide member 25 extends along the radial direction F of the through hole 211. The connecting block 23 is slidably connected to the guide member 25. A spring 26 is provided between the connecting block 23 and the fixing block 24, and under the action of the spring 26, the bearing block 22 is in an extended position. The connecting block 23 is driven by an external force, so that the connecting block 23 moves along the guide member 25 in a direction away from the center of the through hole 211, and the spring 26 is compressed, so that the bearing block 22 can be in a retracted position. When the external force is removed, the compressed spring 26 will reset, and under the push of the spring 26, the bearing block 22 returns to the extended position.

[0033] Specifically, a limiter 27 is fixedly provided on the connection block 23, and the limiter 27 extends in a direction perpendicular to the radial direction F of the through hole 211. A vertically extending rotating shaft 28 is fixedly connected to the mounting plate 21. A connecting rod 29 is rotatably connected to the rotating shaft 28, and the rotating shaft 28 is approximately located at the center of the connecting rod 29, and the connecting rod 29 can rotate around the rotating shaft 28. One end of the connecting rod 29 abuts against a side of the limiter 27 close to the bearing block 22, and the other end is fixedly connected to the output end of the first driving member 210. The first driving member 210 is used to drive one end of the connecting rod 29 to move, so that the connecting rod 29 rotates, and the end of the connecting rod 29 abutting against the limiter 27 moves accordingly, so as to apply an external force to the connection block 23, thereby moving the bearing block 22 from the extended position to the retracted position. By driving the bearing block 22 in the manner of the first driving member 210 and the connecting rod 29, the space on the mounting plate 21 can be reasonably utilized.

[0034] Multiple first driving members 210 can be electrically connected to the controller, and the controller is electrically connected to the moving component 5. In the process of the moving component 5 driving the supporting component 2 to move, when the contact position between the wafer 10 to be tested and the supporting block 22 is located directly below the camera 1, the first driving member 210 corresponding to the supporting block 22 is started, so that the supporting block 22 is retracted and separated from the wafer 10 to be tested; when the contact position between the wafer 10 to be tested and the supporting block 22 is not located directly below the camera 1, the first driving member 210 is reset, and the force of the connecting rod 29 on the limit member 27 is released. Under the reset force of the spring 26, the supporting block 22 returns to the extended position.

[0035] In this embodiment, an opening 212 is provided on one side of the mounting plate 21 in the first horizontal direction X, and the opening 212 is connected to the through hole 211. The opening 212 can reserve sufficient loading space for the robot, so that the robot can move the wafer 10 to be tested to the through hole 211 and place it on multiple supporting blocks 22.

[0036] Specifically, the number of the bearing blocks 22 is at least four. In a preferred embodiment, the number of the bearing blocks 22 is six. When one of the bearing blocks 22 moves to the position directly below the camera 1 and switches to the retracted position, the remaining five bearing blocks 22 can stably support the wafer 10 to be measured.

[0037] As Figure 3 shown, the six bearing blocks 22 are evenly distributed in the circumferential direction of the through hole 211, and are symmetrically arranged both in the first horizontal direction X and in the second horizontal direction Y. Since the opening 212 is located on one side of the mounting plate 21 in the first horizontal direction X, two bearing blocks 22 are respectively located at both ends of the diameter of the through hole 211 extending along the second horizontal direction Y, and two bearing blocks 22 are located on both sides of the opening 212. The included angle between the center lines of two adjacent bearing blocks 22 and the center of the through hole 211 is 60°.

[0038] Preferably, the moving directions of the output ends of the plurality of first driving members 210 are all parallel to the second horizontal direction Y, which is convenient for the layout and control of the plurality of first driving members 210.

[0039] As Figure 4 shown, the bottom of the bearing block 22 is provided with a bearing surface 221 for bearing the wafer 10 to be measured. The bearing surface 221 is horizontally arranged, and the bearing surfaces 221 of the plurality of bearing blocks 22 are located in the same plane. One end of the bearing surface 221 facing the center of the through hole 211 is connected with an inclined surface 222. The inclined surface 222 is not higher than the bearing surface 221, and this inclined surface 222 can prevent the right-angle edge of the bearing surface 221 from scratching and damaging the wafer 10 to be measured.

[0040] In this embodiment, as Figure 1 shown, the wafer detection mechanism further includes a horizontally arranged fixing plate 6 and a support frame 7 fixedly connected above the fixing plate 6. The wafer detection mechanism can be installed on a specific working surface through the fixing plate 6. The camera 1 is fixedly connected to the support frame 7, which can avoid the vibration caused by movement and ensure the detection accuracy. The bearing assembly 2 is slidably connected to the fixing plate 6 through the moving assembly 5.

[0041] Specifically, as Figure 5As shown in the figure, the moving component 5 includes two first slide rails 51, a connecting plate 52, a second driving member 53, a second slide rail 54 and a third driving member 55. The two first slide rails 51 are fixedly connected to the upper surface of the fixed plate 6. The first slide rail 51 extends along the first horizontal direction X. The two first slide rails 51 are spaced apart in the second horizontal direction Y. The connecting plate 52 is slidably connected to the two first slide rails 51. The second driving member 53 is connected to the connecting plate 52 and is used to drive the connecting plate 52 to move along the first horizontal direction X. The second slide rail 54 is fixedly connected to the upper surface of the connecting plate 52. The second slide rail 54 extends along the second horizontal direction Y. The mounting plate 21 is slidably connected to the second slide rail 54 through an intermediate plate 56. The third driving member 55 is connected to the mounting plate 21 and is used to drive the intermediate plate 56 to drive the mounting plate 21 to move along the second horizontal direction Y.

[0042] In this embodiment, the first light source assembly 3 is connected to the support frame 7 through the first adjustable bracket 31. By adjusting the angle between the first adjustable bracket 31 and the horizontal plane, the angle of the first light source assembly 3 can be adjusted. The second light source assembly 4 is connected to the fixed plate 6 through the second adjustable bracket 41. By adjusting the angle between the second adjustable bracket 41 and the horizontal plane, the angle of the second light source assembly 4 can be adjusted.

[0043] Preferably, the light rays of the first light source assembly 3 illuminating the upper surface of the wafer 10 to be measured are staggered from the light rays of the second light source assembly 4 illuminating the lower surface of the wafer 10 to be measured, that is, the two are located in different vertical planes, so that the illuminating lights of the two light source assemblies will not interfere with each other, which can ensure the clarity of the image captured by the camera 1, thereby improving the accuracy of the inspection.

[0044] It should be noted that in the description of this specification, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects, and there is no sequence between the two, nor can it be understood as indicating or implying relative importance. In addition, in the description of this specification, unless otherwise stated, the meaning of "a plurality" is two or more.

[0045] Any numerical value cited herein includes all values from the lower limit value to the upper limit value increasing by one unit, as long as there is an interval of at least two units between any lower value and any higher value. For example, if the value of the number of components or process variables (such as temperature, pressure, time, etc.) is stated as ranging from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, then the purpose is to illustrate that values such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. are also explicitly listed in this specification. For values less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be clearly expressed, and it can be considered that all possible combinations of the numerical values listed between the lowest value and the highest value are explicitly stated in this specification in a similar manner.

[0046] Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The term "about" or "approximate" used in connection with a range is applicable to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30", including at least the specified endpoints.

[0047] All articles and references disclosed, including patent applications and publications, are incorporated herein by reference for various purposes. The term "consisting essentially of" in describing a combination shall include the identified elements, ingredients, components or steps as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe the combinations of elements, ingredients, components or steps herein also contemplates embodiments consisting essentially of these elements, ingredients, components or steps. By using the term "may" herein, it is intended that any of the attributes described as "may" include are optional.

[0048] A plurality of elements, ingredients, components or steps can be provided by a single integrated element, ingredient, component or step. Alternatively, a single integrated element, ingredient, component or step can be divided into separate plural elements, ingredients, components or steps. The disclosure of the term "a" or "an" used to describe an element, ingredient, component or step is not intended to exclude other elements, ingredients, components or steps.

[0049] It should be understood that the above description is for purposes of illustration and not limitation. Many embodiments and many applications other than the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but should be determined with reference to the appended claims and the full scope of equivalents to which those claims are entitled. For the sake of completeness, all articles and references including patent applications and published disclosures are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the foregoing claims is not intended to abandon such subject matter, nor should it be considered that the inventor has not considered such subject matter to be part of the disclosed inventive subject matter.

Claims

1. A wafer inspection mechanism, characterized in that, Including: A fixedly arranged camera; A carrier assembly for carrying a wafer to be measured, the carrier assembly being arranged below the camera, the carrier assembly including a horizontally arranged mounting plate and a plurality of carrier blocks movably arranged on the mounting plate; the mounting plate is provided with a through hole, and the plurality of carrier blocks are arranged at intervals in the circumferential direction of the through hole; the moving direction of the carrier blocks is parallel to the radial direction of the through hole; the carrier blocks have an extended position and a retracted position, when the carrier blocks are in the extended position, the minimum distance from the carrier blocks to the center of the through hole is less than the radius of the wafer to be measured; when the carrier blocks are in the retracted position, the minimum distance from the carrier blocks to the center of the through hole is greater than the radius of the wafer to be measured; the plurality of carrier blocks are configured such that when there is a carrier block in the retracted position, at least three carrier blocks are in the extended position; A first light source assembly arranged above the carrier assembly; A second light source assembly arranged below the carrier assembly; A moving assembly connected to the mounting plate, for driving the carrier assembly to move in a first horizontal direction and a second horizontal direction, the first horizontal direction being perpendicular to the second horizontal direction.

2. The wafer inspection mechanism according to claim 1, wherein A connecting block is fixedly connected to one side of the carrier block facing away from the center of the through hole, a fixed block and a guiding member are fixedly connected to the mounting plate, and the guiding member extends along the radial direction of the through hole; the connecting block is slidably connected to the guiding member; a spring is arranged between the connecting block and the fixed block.

3. The wafer inspection mechanism according to claim 2, characterized in that, A limiting member is fixedly arranged on the connecting block, and the limiting member extends in a direction perpendicular to the radial direction of the through hole; a vertically extending rotating shaft is fixedly connected to the mounting plate; the rotating shaft is rotatably connected to a connecting rod, one end of the connecting rod abuts against one side of the limiting member close to the carrier block, and the other end is fixedly connected to the output end of a first driving member.

4. The wafer inspection mechanism according to claim 3, wherein, An opening is arranged on one side of the mounting plate in the first horizontal direction, and the opening is communicated with the through hole.

5. The wafer inspection mechanism according to claim 4, wherein, The number of the carrier blocks is six; the six carrier blocks are evenly distributed at intervals in the circumferential direction of the through hole, and are symmetrically arranged in both the first horizontal direction and the second horizontal direction; the moving directions of the output ends of the plurality of first driving members are all parallel to the second horizontal direction.

6. The wafer inspection mechanism according to claim 1, wherein A bearing surface for carrying the wafer to be measured is arranged at the bottom of the carrier block, and the bearing surface is horizontally arranged; one end of the bearing surface facing the center of the through hole is connected with an inclined surface, and the inclined surface is not higher than the bearing surface.

7. The wafer inspection mechanism according to claim 1, wherein, The wafer detection mechanism further includes a horizontally arranged fixing plate and a support frame fixedly connected above the fixing plate; the camera is fixedly connected to the support frame; the carrier assembly is slidably connected to the fixing plate through the moving assembly.

8. The wafer inspection mechanism according to claim 7, wherein The moving assembly includes: Two first sliding rails fixedly connected to the upper surface of the fixing plate, the first sliding rails extending along the first horizontal direction; the two first sliding rails are arranged at intervals in the second horizontal direction; A connecting plate slidably connected to the two first sliding rails; A second driving member connected to the connecting plate, for driving the connecting plate to move along the first horizontal direction; A second slide rail fixedly connected to the upper surface of the connecting plate, the second slide rail extending along the second horizontal direction; the mounting plate is slidably connected to the second slide rail; A third driving member connected to the mounting plate for driving the mounting plate to move along the second horizontal direction.

9. The wafer inspection mechanism according to claim 7, wherein, The first light source assembly is connected to the support frame through a first adjustable bracket; the second light source assembly is connected to the fixed plate through a second adjustable bracket.

10. The wafer inspection mechanism according to claim 9, characterized in that, The light from the first light source assembly illuminating the upper surface of the wafer to be measured is offset from the light from the second light source assembly illuminating the lower surface of the wafer to be measured.

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