Intelligent measurement system and method for high-voltage circuit board assembly

Abstract

The invention provides an intelligent measurement system and method for a high-voltage circuit board assembly, and belongs to the technical field of measurement systems, and the system comprises a test system power supply unit, a display interaction unit, a control center unit, a test path selection and performance test unit, and a variable load unit. The control center unit is in control connection with the test system power supply unit, the display interaction unit, the circuit board assembly test probe array unit, the test path selection and performance test unit and the variable load unit, and the test system power supply unit and the variable load unit are in communication connection with the display interaction unit. The performance test unit is in communication connection with the variable load unit and the circuit board assembly test probe array unit, and the circuit board assembly test probe array unit is in communication connection with the test system power supply unit. According to the circuit board fault detection device, various fault types of the circuit board are detected through the multiple detection units.

Description

Technical Field

[0001] The invention relates to the technical field of measurement systems, and in particular to an intelligent measurement system and method for a high-voltage circuit board assembly. Background Art

[0002] With the widespread application of electronic technology in all walks of life, more customized designs of intelligent electronic circuits are needed. After the customized design of the electronic circuit, the designed circuit is made into a circuit board assembly, and then a large number of electronic components and a main control chip with solidified embedded software form an electronic circuit board assembly. The functional test of the electronic circuit board assembly that carries out various functions of the electronic circuit is very important. However, most traditional test schemes are based on manual measurement, and the test efficiency is not high. Some test environments with high voltage are relatively dangerous. At the same time, the quality of the test also fluctuates with various subjective factors of the measurement personnel. Therefore, it is necessary to design an automatic measurement scheme and system for high-voltage circuit boards to achieve automatic, efficient, safe and reliable measurement.

[0003] With the development of high-voltage pulse technology, high-voltage switches and their drive modules are integrated on circuit board assemblies. The manual testing methods of high-voltage circuit board assemblies are inefficient and have great safety hazards. Therefore, safe, reliable, automatic and efficient measurement methods and systems are urgently needed to be designed and developed.

[0004] Chinese patent publication number CN117740240A discloses a PCB equipment fault detection method and system for performing fault detection on a PCB circuit board.

[0005] However, the above-mentioned publicly available solutions have the following shortcomings: the above-mentioned solutions have low compatibility with circuit board performance testing during actual use, and cannot perform compatibility testing for various types of fault conditions existing in the circuit board.

[0006] The invention proposes an intelligent measurement system and method for a high voltage circuit board assembly to solve the problem. Summary of the invention

[0007] The purpose of the present invention is to achieve the detection effect of various types of faults on circuit boards through the structure of various detection units, thereby overcoming the problems in the above-mentioned background technology.

[0008] Based on the above technical ideas, the technical solution adopted by the present invention is: An intelligent measurement system for a high-voltage circuit board assembly, comprising a test system power supply unit, a display interaction unit, a control center unit, a circuit board assembly test probe array unit, a test path selection and performance test unit, and a variable load unit; The control center unit is controllably connected to the power supply unit of the test system, the display and interaction unit, the test probe array unit of the circuit board assembly, the test path selection and performance test unit, and the variable load unit. The power supply unit of the test system and the variable load unit are communicatively connected to the display and interaction unit. The performance test unit is communicatively connected to the variable load unit and the test probe array unit of the circuit board assembly. The test probe array unit of the circuit board assembly is communicatively connected to the power supply unit of the test system.

[0009] Further limitation of the above technical solution: The power supply unit of the test system includes a dual-mode power supply system and a safety protection mechanism. The dual-mode power supply system includes a low-voltage side, DC 24V / 5V, powered by an LLC resonant topology to provide stable power for the control unit and the human-machine interface. The high-voltage side is continuously adjustable from 0 to 40 kV, using a series resonant inverter technology, with an output ripple <0.5%, medical-grade isolation, withstand voltage between input / output of AC 40 kV / 60 s, and interlayer insulation thickness ≥ 3 mm, meeting the creepage distance standard of GB9706.1. The safety protection mechanism includes dynamic leakage current monitoring: real-time detection of L-N / GND leakage current, immediately cutting off in case of exceeding the standard, and an arc suppression module, using a vacuum interrupter + magnetic blow technology, with an action response time <10 μs.

[0010] Further limitation of the above technical solution: The display and interaction unit includes a 21.5-inch industrial touch screen with 1024-level pressure sensing technology, as well as a three-color LED alarm light column and an 85 dB buzzer array. It also includes software functions, which include a test parameter configuration interface, a real-time monitoring view, and an alarm logic. The test parameter configuration interface includes a visual topology editor: drag-and-drop definition of the mapping relationship between test points and probes, and a parameter preset library: storing more than [number] circuit templates of medical devices. The real-time monitoring view includes a thermal imaging overlay display: presenting the PCB temperature field through an infrared matrix, and a leakage current trend graph: synchronously displaying 6-channel leakage current curves such as L-N / GND. The alarm logic includes a yellow early warning for single parameter overlimit, a red emergency stop for safety regulation parameter overstandard, and sound and light linkage, with the sound pressure level dynamically enhanced according to the risk level.

[0011] Further limitation of the above technical solution: The control center unit includes a detection algorithm, which includes a measurement data analysis engine and a self-learning database. The measurement data analysis engine includes an improved LSTM neural network for feature extraction of 100,000 groups of historical test data. The self-learning database includes a dynamic update mechanism that automatically optimizes the evaluation model for each newly added group of data, and a fault knowledge base that contains feature vectors of 127 typical fault modes.

[0012] For further limitation of the above technical solution, the test probe array unit of the circuit board assembly includes a drive system and a safety design. The drive system includes a piezoelectric ceramic driver: response time 0.1 ms, thrust 20 N, contact force feedback: integrated micro weighing sensor; the safety design includes the probe insulation performance, partial discharge < 5 pC, surface resistivity > 1×10¹ 4 Ω·cm.

[0013] For further limitation of the above technical solution, the performance test unit includes a high-voltage acquisition module, a temperature monitoring system and humidity control. The high-voltage acquisition module includes a voltage divider structure: 0:1 resistance-capacitance hybrid voltage division, bandwidth DC-MHz, digital sampling: 16-bit ADC, sampling rate 1 GS / s; the temperature monitoring system includes an 8×8 infrared array: temperature measurement range -20°C to °C, spatial resolution 1 mm², contact thermocouple: K-type sensor, adjustable insertion depth; the humidity control includes a dehumidification module: semiconductor refrigeration, a humidification module: ultrasonic atomization.

[0014] For further limitation of the above technical solution, the variable load unit includes biological effect simulation, dynamic load testing and heat dissipation design. The biological effect simulation includes a human impedance model: integrated with the IEC 60479-1 standard characteristic curve, electrocardiogram signal loading: can superimpose 10 mVp-p 0.5-Hz sinusoidal interference; the dynamic load testing includes transient response: 0-% load step time < 50 μs, phase angle control: -90° to +90° continuously adjustable, accuracy 0.1°; the heat dissipation design includes a liquid cooling system: heat transfer oil circulation flow rate 10 L / min, temperature rise < 15 K.

[0015] An intelligent measurement method for a high-voltage circuit board assembly includes the following steps: S1 System startup and initialization step, which includes a power supply unit activation link and a human-machine interface configuration link; S2 Test preparation stage step, which includes a probe array calibration link and an environmental parameter setting link; S3 Core test execution step, which includes running an automated measurement process and performing real-time safety monitoring while running the automated measurement process; S4 Data analysis and output step, which includes the system automatically generating a test report, the deep learning engine comparing historical data, marking abnormal fluctuation points, and generating improvement suggestions; S5 System shutdown and maintenance step, which includes the high-voltage power supply gradually reducing voltage and the probe array resetting to a safe height.

[0016] For further limitation of the above technical solution, in the step of starting and initializing the S1 system, the activation link of the power supply unit includes turning on the AC 220V power supply, verifying that the grounding resistance < 0.1Ω, starting the low-voltage power supply, observing the status of the indicator light, gradually adjusting the high-voltage output to the target value, and monitoring the leakage current < 10μA; the human-machine interface configuration link includes importing the CAD file of the board under test, automatically mapping the probe positions, and setting the test parameters: voltage level, contact force threshold.

[0017] For further limitation of the above technical solution, in the step of the S2 test preparation stage, the probe array calibration link in this step includes performing laser positioning with an error control within ±0.2mm, calibrating the probe pressure in sub-regions, and verifying that the insulation resistance between probes > 1GΩ; the environmental parameter setting link includes adjusting the humidity in the test chamber to 45%RH ± 3%, and pre-running the load unit to a stable temperature.

[0018] Compared with the prior art, the beneficial effects of the present invention are: 1. Safety test mechanism, pioneering the high-voltage probe partition insulation technology, reducing the arc risk through the coating process, and the probe matrix dynamic reconstruction technology, adapting to different sizes of PCB board types; 2. Intelligent diagnosis system, based on the machine learning-based fault prediction model, automatically generating an improvement plan library, and providing component-level optimization suggestions; 3. Dynamic load matching, with a patented load topology structure, capable of switching the resistance-capacitance-inductance composite parameters within 5ms. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic flow chart of an intelligent measurement system and method for a high-voltage circuit board assembly of the present invention.

[0021] Among them, 100, test system power supply unit; 200, display and interaction unit; 300, control center unit; 400, circuit board assembly test probe array unit; 500, test path selection and performance test unit; 600, variable load unit. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The following will further elaborate on the present invention Figure 1 with reference to the attached

[0023] Embodiment 1: This embodiment provides an intelligent measurement system for a high-voltage circuit board assembly, as Figure 1 shown, which includes a power supply unit 100 for the test system, a display and interaction unit 200, a control center unit 300, a circuit board assembly test probe array unit 400, a test path selection and performance test unit 500, and a variable load unit 600; The control center unit 300 is connected to the power supply unit 100 for the test system, the display and interaction unit 200, the circuit board assembly test probe array unit 400, the test path selection and performance test unit 500, and the variable load unit 600 for control connection. The power supply unit 100 for the test system and the variable load unit 600 are communicatively connected to the display and interaction unit 200. The performance test unit 500 is communicatively connected to the variable load unit 600 and the circuit board assembly test probe array unit 400. The circuit board assembly test probe array unit 400 is communicatively connected to the power supply unit 100 for the test system.

[0024] The power supply unit 100 for the test system includes a dual-mode power system and a safety protection mechanism. The dual-mode power system includes a low-voltage side, DC 24V / 5V, which is powered by an LLC resonant topology to provide a stable power supply for the control unit and the human-machine interface. The high-voltage side is continuously adjustable from 0 to 40 kV, adopts a series-resonant inverter technology, with an output ripple < 0.5%, medical-grade isolation, withstand voltage between input / output of AC 40 kV / 60 s, and interlayer insulation thickness ≥ 3 mm, meeting the creepage distance standard of GB9706.1. The safety protection mechanism includes dynamic leakage current monitoring: real-time detection of L-N / GND leakage current, and immediate cut-off in case of exceeding the standard, and an arc suppression module, which adopts a vacuum interrupter + magnetic blow technology, with an action response time < 10 μs.

[0025] The display and interaction unit 200 includes a 21.5-inch industrial touch screen, equipped with 1024-level pressure sensing technology, as well as a three-color LED alarm light column and an 85 dB buzzer array; it also includes software functions, which include a test parameter configuration interface, a real-time monitoring view, and an alarm logic. The test parameter configuration interface includes a visual topology editor: drag-and-drop definition of the mapping relationship between test points and probes, and a parameter preset library: storing more than 200 medical device circuit templates. The real-time monitoring view includes a thermal imaging overlay display: presenting the PCB temperature field through an infrared matrix, and a leakage current trend graph: synchronously displaying 6-channel leakage current curves such as L-N / GND. The alarm logic includes a yellow early warning for single parameter overrun, a red emergency stop for safety regulation parameter overrun, and sound and light linkage, with the sound pressure level dynamically enhanced according to the risk level.

[0026] The control center unit 300 includes a detection algorithm, which includes a measurement data analysis engine and a self-learning database. The measurement data analysis engine includes an improved LSTM neural network for feature extraction from 100,000 groups of historical test data. The self-learning database includes a dynamic update mechanism that automatically optimizes the evaluation model every time 100 new data sets are added, and a fault knowledge base containing the feature vectors of 127 typical fault modes.

[0027] The test probe array unit 400 of the circuit board assembly includes a drive system and a safety design. The drive system includes a piezoelectric ceramic actuator with a response time of 0.1 ms, a thrust of 20 N, and contact force feedback integrated with a micro weighing sensor. The safety design includes the probe insulation performance with a partial discharge less than 5 pC and a surface resistivity greater than 1×10¹ 4 Ω·cm.

[0028] The performance test unit 500 includes a high-voltage acquisition module, a temperature monitoring system, and humidity control. The high-voltage acquisition module includes a voltage divider structure: 1000:1 resistance-capacitance hybrid voltage division, a bandwidth of DC-100 MHz, digital sampling: 16-bit ADC, and a sampling rate of 1 GS / s. The temperature monitoring system includes an 8×8 infrared array with a temperature measurement range of -20°C to 300°C, a spatial resolution of 1 mm², a contact thermocouple: K-type sensor with adjustable insertion depth. The humidity control includes a dehumidification module: semiconductor refrigeration, and a humidification module: ultrasonic atomization.

[0029] The variable load unit 600 includes biological effect simulation, dynamic load testing, and heat dissipation design. The biological effect simulation includes a human impedance model: integrated with the characteristic curve of IEC 60479-1 standard, and electrocardiogram signal loading: 10 mVp-p 0.5-100 Hz sinusoidal interference can be superimposed. The dynamic load testing includes transient response: 0-100% load step time < 50 μs, phase angle control: -90° to +90° continuously adjustable with an accuracy of 0.1°. The heat dissipation design includes a liquid cooling system: the circulating flow rate of the heat transfer oil is 10 L / min, and the temperature rise < 15 K.

[0030] With the development of high-voltage pulse technology, high-voltage switches and their drive modules are integrated on circuit board assemblies. The manual testing method for high-voltage resistant circuit board assemblies is inefficient and has great safety hazards. Therefore, a safe, reliable, automatic, and efficient measurement method and system are urgently needed to be designed and developed.

[0031] The present invention designs an intelligent automatic measurement method and system, which can achieve automatic, efficient, safe, reliable, and intelligent measurement of high-voltage circuit board assemblies.

[0032] The automatic test method and system for high-voltage circuit board assemblies replace the manual testing of high-voltage circuit board assemblies, which has low test efficiency and potential safety hazards.

[0033] To achieve the customization of high-voltage circuit board assemblies, the test probe array unit divides multiple voltage-level test areas, and the probes of the entire test probe array are independently controlled to lift and lower, meeting the diverse and customized test requirements.

[0034] Using intelligent algorithms for processing and control, the test system has an intelligent learning function, continuously evolving and improving. It uses intelligent algorithms to analyze the measurement results, and evaluates and scores the parameters of the measurement results according to the standards of various measurement indicators in the database. Further, improvement measures and scheme suggestions for each parameter are given, and each measurement result is updated into the database to improve its parameter indicators, making the intelligent system gradually improve and advance, in order to ultimately achieve intelligent and automated measurement.

[0035] Embodiment 2: This embodiment provides an intelligent measurement system and method for high-voltage circuit board assemblies, as Figure 1 shown, which also includes 6 parts: a test system power supply unit 100, a display and interaction unit 200, a control center unit 300, a circuit board assembly crimping and fixing unit 400, a test path selection and performance test unit 500, and a variable load unit 600.

[0036] Among them, the test system power supply unit 100 includes a low-voltage isolated power supply component, a high-voltage isolated power supply component, etc. The low-voltage power supply component mainly supplies power to the 200 display and interaction system and the 300 control center unit; the power supply system of the circuit board assembly crimping and fixing unit includes a low-voltage power supply for the low-voltage functional area of the test and a high-voltage power supply for the high-voltage functional area of the test. Since the high-voltage circuit board assembly being tested belongs to the active part of medical devices, the isolated power supply used in this power supply unit needs to meet the safety regulations requirements such as the input and output power isolation withstand voltage level, electrical clearance, and creepage distance of medical standard GB9706.1-2020.

[0037] Among them, the display and interaction unit 200 can use a computer display screen plus a keyboard, mouse, or touch display screen to display input parameters or selectable parameters of control signals, test procedures or status prompt warnings, test result feedback and analysis, etc. The test result feedback parameters include the leakage current between the input power supply and the ground part, the leakage current between the live wire (L) and the neutral wire (N) of the input power supply, the leakage current between the mains power supply and the application part, the leakage current between the mains power supply and the signal input and output part, the current between the application part and the signal input and output part, the leakage current between the application part and the ground part, the maximum output power of the high-voltage-resistant circuit board assembly, and the multi-point surface temperature after the maximum power of the high-voltage-resistant circuit board assembly runs continuously until thermal stability; in addition, the measurement result feedback also includes some sound and light prompts. For example, when a measurement failure or error occurs, the display screen will flash with yellow or red words to remind, and when there is a higher risk, there will be an auxiliary sound alarm.

[0038] The control center unit 300 is connected to the other system components and is the core of the entire test system. It receives the low-voltage power supply from the power supply unit, sends instructions for the corresponding indicators of the test plan, collects the test parameters of the circuit board assembly, and analyzes the results. In the result analysis part, intelligent algorithms are used to analyze the measured results, and each parameter of the measured results is evaluated and scored according to the standard of each measurement index in the database. Further, improvement measures and scheme suggestions for each parameter are given. Further, engineers classify the high-voltage-resistant circuit board assemblies of different models, optimize and confirm their various parameter indicators, and update each measurement result into the database to improve its parameter indicators, so that the intelligent system is gradually improved and advanced, in order to ultimately achieve intelligent and automated measurement. If a fault occurs, parameter analysis is carried out and a fault analysis report is given, along with corrective solutions and strategy recommendations.

[0039] The test probe array unit 400 of the circuit board assembly integrates a test probe substrate that covers the largest circuit board assembly size. The test probes therein are divided into a high-voltage test probe area and a low-voltage test probe area. The high-voltage probe test area is divided into four major areas according to the high-voltage levels connected by the probes: the 0-1KV area, the 1-3KV area, the 3KV-10KV area, and the 10KV-30KV area. According to the upper limit value of the voltage level of each area, the required electrical clearance and creepage distance between the test probes are calculated to ensure that the needle pitch distance of the test probes and the creepage distance after installation meet the safety requirements. In addition, the outer layer of the test probe part uses high-voltage coating technology, and the test probes in the high-voltage area are wrapped by an insulating coating, and only the exposed length of 3mm at the head end is not coated to contact the high-voltage circuit board test point. The insulating coating material can use parylene coating or polyester imide coating or polyimide coating, and the coating thickness is obtained by calculating according to the high value of the withstand voltage level. The probe tail integrates a propulsion system, which can independently drive each probe to descend and lift, ensuring that the probe array unit has a high degree of customization and diversified combination to meet the circuit board test requirements of different specifications, different test function requirements, and multiple high-voltage level requirements. In addition, the substrate of the test probe array of the circuit board assembly can also be designed into a special-shaped structure with different shape requirements according to needs.

[0040] The test path selection and performance test unit is connected to the control center unit, and is also connected to the test probe array unit. At the same time, it is connected to the variable load unit 600 and integrates a high-voltage test function selection module, a voltage performance detection and acquisition unit, a current performance detection and acquisition unit, a temperature detection and acquisition unit, and a humidity control and acquisition unit.

[0041] The variable load unit 600 includes resistive loads, capacitive loads, inductive loads, and in addition, composite loads, such as RC loads combined with resistors and capacitors, LCR loads combined with capacitors, inductors, and resistors, etc. Different load combinations correspond to different load phase angles, simulating different diverse load states, and simulating and testing various extreme parameter combinations and biological effects.

[0042] Embodiment 2: This embodiment provides an intelligent measurement method for a high-voltage circuit board assembly, as Figure 1 shown, including the following steps: S1 System startup and initialization step, which includes a power supply unit activation link and a human-machine interface configuration link; S2 Test preparation phase step, which includes a probe array calibration link and an environmental parameter setting link; S3 Core test execution step, which includes running an automated measurement process and performing real-time safety monitoring while running the automated measurement process; S4 Data analysis and output step, which includes the system automatically generating a test report, the deep learning engine comparing historical data, marking abnormal fluctuation points, and generating improvement suggestions; S5 System shutdown and maintenance step, which includes the high-voltage power supply gradually reducing voltage and the probe array resetting to a safe height.

[0043] S1 System startup and initialization step. In this step, the power supply unit activation link includes turning on the AC 220V power supply, verifying that the grounding resistance < 0.1Ω, starting the low-voltage power supply, observing the indicator light status, gradually adjusting the high-voltage output to the target value, and monitoring the leakage current < 10μA; the human-machine interface configuration link includes importing the CAD file of the board to be tested, automatically mapping the probe positions, and setting the test parameters: voltage level, contact force threshold.

[0044] S2 Test preparation phase step. The probe array calibration link in this step includes performing laser positioning with an error controlled within ±0.2mm, calibrating the probe pressure in sub-regions, and verifying that the insulation resistance between probes > 1GΩ; the environmental parameter setting link includes adjusting the humidity in the test chamber to 45%RH ± 3% and pre-running the load unit to a stable temperature.

[0045] The above content is a further detailed description of the present invention in combination with specific preferred implementation schemes, facilitating those skilled in the art of this technology to understand and apply the present invention. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions.

Claims

1. An intelligent measurement system for a high-voltage circuit board assembly, characterized in that, It includes a test system power supply unit (100), a display and interaction unit (200), a control center unit (300), a circuit board assembly test probe array unit (400), a test path selection and performance test unit (500), and a variable load unit (600); The control center unit (300) is controllably connected to the test system power supply unit (100), the display and interaction unit (200), the circuit board assembly test probe array unit (400), the test path selection and performance test unit (500), and the variable load unit (600). The test system power supply unit (100) and the variable load unit (600) are communicatively connected to the display and interaction unit (200). The performance test unit (500) is communicatively connected to the variable load unit (600) and the circuit board assembly test probe array unit (400). The circuit board assembly test probe array unit (400) is communicatively connected to the test system power supply unit (100).

2. The intelligent measurement system for a high-voltage circuit board assembly according to claim 1, characterized in that, The test system power supply unit (100) includes a dual-mode power system and a safety protection mechanism. The dual-mode power system includes a low-voltage side, DC 24V / 5V, which is powered by an LLC resonant topology to provide a stable power supply for the control unit and the human-machine interface. The high-voltage side is continuously adjustable from 0 to 40 kV, using a series-resonant inverter technology, with an output ripple <0.5%, medical-grade isolation, a withstand voltage between input / output of AC 40 kV / 60 s, and an interlayer insulation thickness ≥3 mm, meeting the creepage distance standard of GB9706.

1. The safety protection mechanism includes dynamic leakage current monitoring: real-time detection of L-N / GND leakage current, and immediate cut-off in case of exceeding the standard, and an arc suppression module, using a vacuum interrupter + magnetic blow technology, with an action response time <10 μs.

3. The intelligent measurement system for a high-voltage circuit board assembly according to claim 2, characterized in that, The display and interaction unit (200) includes a 21.5-inch industrial touch screen with 1024-level pressure sensing technology, as well as a three-color LED alarm light column and an 85 dB buzzer array. It also includes software functions, which include a test parameter configuration interface, a real-time monitoring view, and an alarm logic. The test parameter configuration interface includes a visual topology editor: defining the mapping relationship between test points and probes by dragging and dropping, and a parameter preset library: storing more than 200 medical device circuit templates. The real-time monitoring view includes a thermal imaging overlay display: presenting the PCB temperature field through an infrared matrix, and a leakage current trend graph: synchronously displaying 6-channel leakage current curves such as L-N / GND. The alarm logic includes a yellow early warning for single parameter overrun, a red emergency stop for safety regulation parameter overrun, and an acoustic-optic linkage, with the sound pressure level dynamically enhanced according to the risk level.

4. The intelligent measurement system for a high-voltage circuit board assembly according to claim 3, wherein, The control center unit (300) includes a detection algorithm, which includes a measurement data analysis engine and a self-learning database. The measurement data analysis engine includes an improved LSTM neural network.

5. The intelligent measurement system for a high-voltage circuit board assembly according to claim 4, wherein The test probe array unit (400) of the circuit board assembly includes a drive system and a safety design. The drive system includes a piezoelectric ceramic driver: response time 0.1 ms, thrust 20 N, contact force feedback: integrated micro load cell; The safety design includes probe insulation performance, partial discharge < 5 pC, surface resistivity > 1×10¹ 4 Ω·cm.

6. The intelligent measurement system for a high-voltage circuit board assembly according to claim 5, characterized in that, The performance test unit (500) includes a high-voltage acquisition module, a temperature monitoring system, and humidity control. The high-voltage acquisition module includes a voltage divider structure: 1000:1 resistance-capacitance hybrid voltage division, bandwidth DC-100 MHz, digital sampling: 16-bit ADC, sampling rate 1 GS / s; the temperature monitoring system includes an 8×8 infrared array: temperature measurement range -20°C to 300°C, spatial resolution 1 mm², contact thermocouple: K-type sensor, adjustable insertion depth; the humidity control includes a dehumidification module: semiconductor refrigeration, and a humidification module: ultrasonic atomization.

7. The intelligent measurement system for a high-voltage circuit board assembly according to claim 6, wherein, The variable load unit (600) includes biological effect simulation, dynamic load testing, and heat dissipation design. The biological effect simulation includes a human impedance model: integrated with the characteristic curve of IEC 60479-1 standard, and electrocardiogram signal loading: can superimpose 10 mVp-p 0.5-100 Hz sinusoidal interference.

8. An intelligent measurement method for a high-voltage circuit board assembly, characterized in that, It includes the following steps: S1 System startup and initialization step, which includes a power supply unit activation link and a human-machine interface configuration link; S2 Test preparation phase step, which includes a probe array calibration link and an environmental parameter setting link; S3 Core test execution step, which includes running an automated measurement process and performing real-time safety monitoring while running the automated measurement process; S4 Data analysis and output step, which includes the system automatically generating a test report, the deep learning engine comparing historical data, marking abnormal fluctuation points, and generating improvement suggestions; S5 System shutdown and maintenance step, which includes the high-voltage power supply gradually reducing voltage and the probe array resetting to a safe height.

9. The intelligent measurement method of a high-voltage circuit board assembly according to claim 8, wherein, In the S1 System startup and initialization step, in the power supply unit activation link, it includes turning on the AC 220V power supply, verifying that the grounding resistance < 0.1 Ω, starting the low-voltage power supply, observing the indicator light status, gradually adjusting the high-voltage output to the target value, and monitoring the leakage current < 10 μA; in the human-machine interface configuration link, it includes importing the CAD file of the board to be tested, automatically mapping the probe positions, and setting test parameters: voltage level, contact force threshold.

10. The intelligent measurement method for a high-voltage circuit board assembly according to claim 9, characterized in that, In the S2 Test preparation phase step, in the probe array calibration link, it includes performing laser positioning with an error control within ±0.2 mm, calibrating the probe pressure in sub-regions, and verifying that the insulation resistance between probes > 1 GΩ; in the environmental parameter setting link, it includes adjusting the humidity in the test chamber to 45%RH ± 3% and pre-running the load unit to a stable temperature.

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