Onboard optical connection device

Abstract

An onboard optical connection device is connected between a first data processing device and a second data processing device and includes an optical waveguide, a first signal transceiver and a second signal transceiver. The optical waveguide is disposed between the first data processing device and the second data processing device. The first signal transceiver is optically coupled to the optical waveguide and to convert an input electrical signal transmitted from the first data processing device into an optical signal. The second signal transceiver is optically coupled to the optical waveguide and configured to convert the optical signal to an output electrical signal to the second data processing device.

Description

Technical Field

[0001] The present invention relates to the technical field of optical connectors, and particularly to an on-board optical connection device for two data processing devices. Background Art

[0002] With the development of cloud technology and AI technology, high-speed transmission systems with increasingly high bandwidths will be required in the future. Optoelectronic integrated circuits (OEICs) use photons instead of electrons for computing and data transmission in integrated circuits, bringing great benefits to the development of industries that require high-performance data exchange, long-distance interconnection, 5G facilities, and computing devices. OEICs are configured with photonic integrated circuits (PICs) and electronic integrated circuits (EICs), and are usually co-packaged as co-packaged optical devices (CPOs). Based on OEICs, optical communication can greatly meet the data transmission requirements of graphics processing units or central processing units. To meet the explosive computing speed requirements, the use of multiple processors in a single system has become a development trend. However, there is still no better solution for data transmission between multi-processor architectures. In the trend of compact equipment and increased frequency, using electrical signals to transmit data results in serious crosstalk, making it impossible to reduce the volume of the equipment and increase the computing frequency. Although active optical cables can be used for interconnection, they are vulnerable to fiber damage and are not conducive to internal space management. Summary of the Invention

[0003] An object of the present application is to provide an on-board optical connection device for connecting between two data processing devices without using fiber optic cables for the transmission of electro-optical signals and opto-electronic signals.

[0004] Another object of the present application is to provide an on-board optical connection device that can reduce waveguide propagation loss when connecting two data processing devices.

[0005] To achieve the above object, one aspect of the present application provides an on-board optical connection device connected between a first data processing device and a second data processing device. The on-board optical connection device includes: an optical waveguide disposed between the first data processing device and the second data processing device; a first signal transceiver optically coupled to the optical waveguide for converting an input electrical signal transmitted from the first data processing device into an optical signal; and a second signal transceiver optically coupled to the optical waveguide for converting the optical signal into an output electrical signal and outputting it to the second data processing device.

[0006] Optionally, the on-board optical connection device further includes a carrier board. The optical waveguide, the first signal transceiver, and the second signal transceiver are disposed on the carrier board.

[0007] Optionally, the first signal transceiver includes a signal input module, and the signal input module includes a strip-shaped substrate, a plurality of light emitters, and a plurality of conductive components electrically connected between the signal input module and the first data processing device. Each light emitter is integrally disposed on the strip-shaped substrate at the same time for transmitting an optical signal to the optical waveguide.

[0008] Optionally, the strip-shaped substrate is configured to span across the bottom of each light emitter, the position adjustment of the strip-shaped substrate drives the simultaneous displacement of the plurality of light emitters, and the plurality of light emitters are optically aligned with the optical waveguide simultaneously through a one-time active alignment process.

[0009] Optionally, the second signal transceiver includes a signal output module, and the signal output module includes a support substrate, a plurality of optical receivers disposed on the support substrate, and a plurality of second conductive components electrically connected between the signal output module and the second data processing device. The optical receivers receive the optical signal and convert the optical signal into an output electrical signal.

[0010] Optionally, the optical waveguide includes a waveguide substrate and a plurality of optical paths disposed on the waveguide substrate, and the material of the waveguide substrate is silica, silicon or silicon nitride.

[0011] Optionally, the optical path of the optical waveguide includes a planar optical waveguide.

[0012] Optionally, the waveguide substrate includes a reflection structure, the reflection structure is disposed close to the signal output module, forms an angle with the optical path, and the optical signal transmitted from the signal input module reaches the signal output module after being reflected by the reflection structure.

[0013] Optionally, the optical waveguide further includes at least one optical isolator spanning across the optical path, and the optical isolator is configured to enable the light to be transmitted along the optical path to the signal output module in a specified direction.

[0014] Optionally, the optical waveguide further includes at least one groove and a plurality of light guiding structures, the groove spans across the optical path, the light guiding structures are located on opposite sides of the groove and are adjacent to the corresponding optical path, and the optical isolator is disposed in the groove and faces the light guiding structures. Each light guiding structure extends from the optical path such that the light guiding structure has an aperture larger than the diameter of the optical path.

[0015] Another aspect of the present application is to provide an on-board optical connection device connected between a first data processing device and a second data processing device. The on-board optical connection device includes a carrier board, an optical waveguide disposed on the carrier board and including a waveguide substrate and a plurality of optical paths disposed on the waveguide substrate, a first signal transceiver optically coupled to the optical waveguide and disposed on the carrier board between the optical waveguide and the first data processing device, and a second signal transceiver optically coupled to the optical waveguide and disposed on the carrier board between the optical waveguide and the second data processing device. The first signal transceiver and the second signal transceiver respectively define a light input area and a light output area, and the two light input areas and the two light output areas together define a signal path.

[0016] Optionally, the first signal transceiver and the second signal transceiver are respectively connected to a first external power supply device and a second external power supply device.

[0017] Optionally, the first signal transceiver includes a plurality of light emitters disposed in the light input area of the first signal transceiver, and the second signal transceiver includes a plurality of light emitters. The light emitters of the second signal transceiver are disposed in the light input area of the second signal transceiver. The light emitters of the first signal transceiver and the light emitters of the second signal transceiver are respectively optically aligned with the optical paths.

[0018] Optionally, the first signal transceiver includes a plurality of optical channels disposed in the light output area of the first signal transceiver, and the second signal transceiver includes a plurality of optical channels disposed in the light output area of the second signal transceiver. The optical channels of the first signal transceiver and the optical channels of the second signal transceiver are respectively optically aligned with the optical paths.

[0019] In the present application, the size of the on-board optical connection device can be customized to connect the first data processing device and the second data processing device, for electro-optical signal, opto-electrical signal transmission or all-optical signal transmission without using fiber optic cables, which is beneficial to internal space management. In addition, the integrated structure of the light emitter and the strip substrate makes the optical alignment with the optical waveguide take less time. In addition, the setting of the optical isolator and the light guiding structure reduces the transmission loss of the optical signal, and solves the problems of fiber optic cable damage, waveguide propagation loss, and low internal space layout efficiency when connecting two data processing devices. Description of the Drawings

[0020] To describe the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. The accompanying drawings in the following description only show some embodiments of the present invention, and those skilled in the art can also derive other accompanying drawings based on these drawings without creative efforts.

[0021] Figure 1A is a schematic perspective view of an on-board optical connection device according to an embodiment of the present application.

[0022] Figure 1B is Figure 1A a side view of.

[0023] Figure 2A is a schematic perspective view of an on-board optical connection device according to an embodiment of the present application.

[0024] Figure 2B is Figure 2A a side view of.

[0025] Figure 3 is a schematic cross-sectional view of a signal input module according to an embodiment of the present application.

[0026] Figure 4 is a schematic perspective view of an on-board optical connection device shown connected between a first data processing device and a second data processing device.

[0027] Figure 5A is an enlarged schematic view of an optical waveguide according to an embodiment of the present application.

[0028] Figure 5B is Figure 5A a side view schematic of the edge surface of the optical waveguide of.

[0029] Figure 6 is a partial enlarged schematic view of an optical waveguide according to an embodiment of the present application.

[0030] Figure 6A is a partial enlarged schematic view of an optical isolator according to an embodiment of the present application.

[0031] Figure 6B is a schematic structural view of the working principle of an optical isolator according to an embodiment of the present application.

[0032] Figure 7 is a side view schematic of an on-board optical connection device according to an embodiment of the present application.

[0033] Figure 8 is a side view schematic of an on-board optical connection device according to an embodiment of the present application.

[0034] Figure 9 is a side view schematic of an on-board optical connection device according to an embodiment of the present application.

[0035] Figure 10A It is a side view schematic diagram showing the installation structure between the on-board optical connection device for Figure 8 and two data processing devices.

[0036] Figure 10B It is Figure 10A a partially enlarged perspective view of the shown installation structure.

[0037] Figure 11A It is a schematic structural diagram of the working principle of a laser element in the on-board optical connection device according to an embodiment of the present application.

[0038] Figure 11B It is a schematic structural diagram of the working principle of another laser element in the on-board optical connection device according to an embodiment of the present application.

[0039] Figure 11C It is a schematic structural diagram of the working principle of another laser element in the on-board optical connection device according to an embodiment of the present application.

[0040] Figure 12 It is a perspective schematic diagram of the on-board optical connection device connected between two data processing devices according to an embodiment of the present application.

[0041] Figure 13 It is a perspective schematic diagram of the on-board optical connection device connected between two data processing devices according to an embodiment of the present application.

[0042] Figure 14 It is a perspective schematic diagram of the on-board optical connection device connected between two data processing devices according to an embodiment of the present application.

[0043] Figure 15 It is a cross-sectional schematic diagram of the packaged on-board optical connection device according to an embodiment of the present application.

[0044] Figure 16 It is Figure 15 a top view schematic diagram of the shown packaged on-board optical connection device.

[0045] Figure 17 It is a perspective schematic diagram of the packaged on-board optical connection device connected between two data processing devices according to an embodiment of the present application.

[0046] Figure 18 It is a perspective schematic diagram of the on-board optical connection device according to another embodiment of the present application.

[0047] Figure 19 It is Figure 18 a top view schematic diagram of the shown on-board optical connection device, which includes an external power supply device. Detailed implementation manners

[0048] The following embodiments will illustrate specific implementable embodiments of the present application with reference to the accompanying drawings. The directional terms described in the present application, such as up, down, front, back, left, right, inside, outside, side, etc., are only with reference to the directions in the drawings. Therefore, the directional terms used are intended to describe and understand the present application, but the present application is not limited thereto.

[0049] It should be understood that although terms such as first and second may be used herein to describe various components, these components should not be limited by these terms. Unless otherwise specified, these terms are only used to distinguish one component from another. Thus, for example, the first component, the first part, or the first portion discussed below may be referred to as the second component, the second part, or the second portion without departing from the teachings of the present application. In addition, the present application may repeat reference numerals and / or letters in various examples. Such repetition is for the purpose of simplicity and clarity and does not in itself determine the relationship between the various embodiments and / or configurations discussed.

[0050] In one aspect, the present application provides an on-board optical connection device for transmitting electro-optical signals to opto-electrical signals between two data processing devices. In some embodiments, the data processing device may be a graphics processing unit, a central processing unit, a neural network processing unit, etc. Referring to Figure 1A and Figure 1B , Figure 1A is a perspective schematic view of the on-board optical connection device provided by an embodiment of the present application, Figure 1B is Figure 1A side view schematic diagram. The present application provides an on-board optical connection device 1A, including an optical waveguide 10, a first signal transceiver 200, a second signal transceiver 300, and a carrier board 40 for carrying the optical waveguide 10, the first signal transceiver 200, and the second signal transceiver 300. Specifically, the optical waveguide 10 is disposed between the first signal transceiver 200 and the second signal transceiver 300, and includes a waveguide substrate 11 and a plurality of optical paths 12 formed on the waveguide substrate 11. In some embodiments, the waveguide substrate 11 may be made of silica, silicon, or silicon nitride. The optical paths 12 are arranged to form a planar lightwave circuit (PLC), and there are various configuration manners, including but not limited to a straight line, a splitter line, an arrayed waveguide grating wavelength multiplexer, a cross-connect type line, etc. Preferably, the waveguide substrate 11 is made of silica.

[0051] As Figure 1A shown, the first signal transceiver 200 includes at least one signal input module 20, and the signal input module 20 is optically coupled to one end of the optical waveguide 10 for transmitting from the first data processing device 51 (such as Figure 4As shown and described in detail hereinafter, it converts the input electrical signal transmitted into an optical signal. Specifically, the signal input module 20 includes a strip-shaped substrate 21, a plurality of optical transmitters 22 arranged in an array, and a plurality of first conductive components 201. The optical transmitter 22 can be an edge-emitting laser diode, a surface-emitting laser diode, a vertical-cavity surface-emitting laser (VCSEL) diode, or a distributed feedback (DFB) laser diode, which is not limited herein. The first conductive component 201 is used to electrically connect the signal input module 20 to the first data processing device 51. Preferably, the optical transmitter 22 is a DFB laser diode, but it is not limited thereto.

[0052] Continuing to refer to Figure 1A , the second signal transceiver 300 includes at least one signal output module 30, which is optically coupled to the other end of the optical waveguide 10 opposite to the signal input module 20. The signal output module 30 is used to convert the optical signal into an output electrical signal to the second data processing device 52 (as Figure 4 shown and described in detail hereinafter). Specifically, the signal output module 30 includes a support substrate 31, a plurality of optical receivers 32 arranged in an array on the support substrate 31 (as Figure 1B shown), and a plurality of second conductive components 301 for electrically connecting the optical receivers 32 to a circuit (not shown) provided on the second data processing device 52. In some embodiments, the optical receiver 32 can be a photodiode.

[0053] Referring to Figure 1A and Figure 1B , the optical transmitter 22 emits light in response to the input electrical signal received by the signal input module 20 and propagates straight forward to the optical path 12 of the optical waveguide 10. In this embodiment, the optical receiver 32 is coplanar with the optical path 12, so that the light propagating along the optical path 12 from the optical transmitter 22 enters the optical receiver 32 in a straight line direction. The optical receiver 32 converts the optical signal into an output electrical signal and transmits it to the second data processing device 52 through the second conductive component 301.

[0054] Referring to Figure 2A and Figure 2B , an on-board optical connection device 1B according to another embodiment of the present application is shown. The on-board optical connection device 1B includes an optical waveguide 10', a first signal transceiver 200 including at least one signal input module 20, a second signal transceiver 300 including at least one signal output module 30, and a carrier board 40. The on-board optical connection device 1B has basically the same structure as the on-board optical connection device 1A except for the orientation of the optical waveguide and the signal output module 30. Specifically, in Figure 2B the shown embodiment, the optical waveguide 10' includes a waveguide substrate 11, a plurality of optical paths 12 formed in the waveguide substrate 11, and a reflection structure 111 located near the signal output module 30 and arranged at an angle with respect to the optical paths 12.

[0055] Referring to Figure 2A and Figure 2B , in some embodiments, the reflection structure 111 is an inclined wall for guiding the light beam traveling along the optical path 12 from the signal input module 20 to the signal output module 30. Specifically, the light beam is reflected by the inclined wall and deflected downward to the optical receiver 32. In some embodiments, the reflection structure 111 may be coated with a reflective layer (not shown) such that the light beam is reflected by the reflective layer and enters the optical receiver 32.

[0056] Referring to Figure 3 , which is a cross-sectional schematic diagram of the signal input module 20 of the present application. In some embodiments, the light-emitting units 220 (referred to as a set of light emitters 22 or a light emitter array) are fabricated on the strip-shaped substrate 21 simultaneously by semiconductor fabrication processes such as epitaxy. Specifically, the light-emitting units 220 and the strip-shaped substrate 21 are fabricated by thin-film growth processes, photolithography processes, doping processes, and etching processes. The light-emitting units 220 are formed on the strip-shaped substrate 21 after processes such as thin-film growth, and are further divided into a plurality of light emitters 22 by an etching process, such that the plurality of light emitters 22 are spaced apart from each other and arranged in alignment.

[0057] As Figure 3 shown, the light-emitting unit 220 includes: a functional portion, which includes an N-type semiconductor structure 221 and a P-type semiconductor structure 222; and a light-emitting portion 223. The light-emitting portion 223 is made of a semiconductor material, such as gallium arsenide (GaAs), and is located between the N-type semiconductor structure 221 and the P-type semiconductor structure 222. Each light emitter 22 includes an anode 241 and a cathode 242, which are formed on the P-type semiconductor structure 222 and the N-type semiconductor structure 221, respectively. In some embodiments, the light emitter 22 is a laser emitter, such as a gallium arsenide (GaAs) laser diode, a gallium nitride (GaN) laser diode, or an indium gallium arsenide phosphide (InGaAsP) laser diode, but is not limited thereto. In this embodiment, the strip-shaped substrate 21 is disposed to span the bottom of each light emitter 22.

[0058] Continuing to refer to Figure 3 , in this embodiment, it is necessary to first epitaxially grow the light emitter 22, that is, to grow the N-type semiconductor 221, the P-type semiconductor 222, and the light-emitting portion 223 on the strip-shaped substrate 21, such that each light emitter 22 has an epitaxial layer 22S on the strip-shaped substrate 21, and at the same time, the light emitter 22 is integrally formed on the strip-shaped substrate 21. Taking the gallium nitride laser diode as an example. The GaN laser diode is grown on a sapphire substrate. The growth method may be metalorganic chemical vapor deposition (MOCVD). Specifically, as Figure 3As shown, after forming the layer structures of all the light emitters 22 in sequence on the entire surface of the strip-shaped substrate 21, the layers other than the sapphire substrate are divided into multiple light emitter 22 units through an etching process. Then, a part of the surface of the P-type semiconductor 222 of each light emitter 22 is removed by dry etching to expose the underlying N-type semiconductor structure 221, and an anode 241 and a cathode 242 (and a drive circuit 23 on the strip-shaped substrate 21 as shown in Figure 1A are formed on the P-type semiconductor 222 and the N-type semiconductor 221), enabling current to pass through and emit light. It should be noted that the method of manufacturing the light emitter 22 is not limited to this.

[0059] In this way, there is no need to perform chip dicing (also known as scribing), chip sorting, and individual chip packaging processes, and the light emitters 22 can be positionally adjusted in combination with the strip-shaped substrate 21, enabling the light emitters 22 in the light emitter array to be optically aligned with the optical path 12 of the optical waveguide 10 at one time, thus ensuring accurate and efficient optical alignment.

[0060] Referring to Figure 1A and Figure 3 , the strip-shaped substrate 21 includes a drive circuit 23. The drive circuit 23 is coupled to the anode 241 and the cathode 242 of each light emitter 22, and is used to provide a drive voltage or a drive current to the light emitter 22, and to provide the required power to the light emitter 22. In some embodiments, the strip-shaped substrate 21 has the characteristics of high temperature resistance, corrosion resistance, high hardness, and high melting point. Preferably, according to the type of the light emitter 22, the strip-shaped substrate 21 is a sapphire substrate or a gallium arsenide (GaAs) substrate.

[0061] Referring to Figure 4 , two on-board optical connection devices 1A are connected between the first data processing device 51 and the second data processing device 52. One of the on-board optical connection devices 1A is used to transmit an electrical signal from the first data processing device 51 to the second data processing device 52, and the other on-board optical connection device 1A is used to transmit an electrical signal from the second data processing device 52 to the first data processing device 51, thereby establishing a signal path between the first data processing device 51 and the second data processing device 52 by two independent on-board optical connection devices 1A.

[0062] Referring to Figure 5A , it is an enlarged view of the optical waveguide 10 according to an embodiment of the present application. The optical waveguide 10 is configured to have a straight optical path 12. Referring to Figure 5B , it is Figure 5AA side view schematic diagram of the edge surface of the optical waveguide 10. The optical waveguide 10 is configured to have a guiding surface 112 facing the signal input module 20 and / or the signal output module 30. The guiding surface 112 is inclined at a predetermined inclination angle with respect to the signal input module 20 or the signal output module 30, so that the optical path 12 makes physical contact with the signal input module 20 and / or the signal output module 30 at an angle, ensuring that the light traveling along the optical path 12 can be accurately transmitted into the respective optical transmitters 22 or optical receivers 32, and reducing the interference caused by the reflected light. The predetermined inclination angle is between zero degrees and eight degrees, preferably eight degrees. In some embodiments, an anti-reflection layer may be coated on the guiding surface 112 to reduce light reflection, thereby reducing the transmission loss of the optical signal.

[0063] Referring to Figure 6 , which is a partial enlarged view of an optical waveguide provided by an embodiment of the present application. An optical isolator 13 is further provided on the optical waveguide 10. As Figure 6 shown, a groove 103 is formed on the waveguide substrate 11, and the groove 103 straddles the optical path 12. In some embodiments, the optical isolator 13 is separately provided and inserted into the groove 103. Specifically, the optical isolator 13 is separately fabricated from the optical waveguide 10 and mainly includes an input polarization element 131, an output polarization element 132, and a rotator 133 disposed between the input polarization element 131 and the output polarization element 132. The optical isolator 13 is configured to block the return optical signal from the forward optical path by using polarization rotation. Since the working principle of the optical isolator 13 is well known to those skilled in the art, it will not be described in detail here. Specifically, the optical isolator 13 is used to enable the light from the optical path 12 to propagate to the signal input module 20 and the signal output module 30 in a desired specified direction, and reduce the interference caused by the reflected light, thereby achieving a lower propagation loss in the specified direction.

[0064] In some embodiments, the optical isolator 13 can be integrally formed on the optical waveguide 10 by semiconductor manufacturing processes (such as epitaxial growth process, photolithography, and etching process) during the formation of the optical waveguide 10, so that the optical isolator 13 and the optical waveguide 10 are formed together as an integral component. In some embodiments, the opposite surfaces of the groove 103 adjacent to the optical isolator 13 may be coated with an anti-reflection layer.

[0065] Referring to Figure 6A , which is a partial enlarged schematic diagram of the optical isolator 13' of an embodiment of the present application. In this embodiment, a separate optical isolator 13' is provided in the groove 103 through which the optical path 12 passes. Specifically, the optical waveguide 10 further includes a plurality of light guiding structures 121 located on the opposite side portions of the groove 103. The light guiding structure 121 is integrally formed with the optical path 12 by semiconductor manufacturing processes such as photolithography and etching.

[0066] AsFigure 6A As shown, there are two light guiding structures 121, which are arranged in a group and located at opposite sides of the groove 103. The oppositely arranged light guiding structures 121 are aligned with each other and adjacent to their respective optical paths 12. The optical isolator 13' is arranged in the groove 103 and faces the light guiding structure 121. Specifically, each group of light guiding structures 121 extends from the optical path 12 such that the light guiding structure 121 forms an aperture with a diameter larger than that of the optical path 12. Preferably, the light guiding structure 121 is inclined 8 degrees relative to the optical path 12. In this way, when light is reflected during propagation between the signal input module 20 and the signal output module 30, the light will be reflected back by the light guiding structure 121 and propagate along the desired direction to the optical path 12. Therefore, the optical isolator 13' and the light guiding structure 121 together ensure that light propagates to the signal output module 30 along a desired specified direction, thereby reducing the transmission loss of the optical signal.

[0067] Referring to Figure 6B , which is the working principle of the light guiding structure 121. The two light guiding structures 121 can be equivalent to two lenses arranged on opposite surfaces of the optical isolator, so that the light from the optical path 12 is reflected to the desired direction and thus completely received by the signal input module 20 or the signal output module 30.

[0068] Referring to Figure 7 and 8 , which shows various types of bonding between the board-mounted optical connection device 1A and the first data processing device 51 and the second data processing device 52. In these embodiments, the waveguide substrate 11, the signal input module 20, and the signal output module 30 are made of a silicon-based material, so that the signal input module 20 and the signal output module 30 can be in direct electrical contact with the first data processing device 51 and the second data processing device 52 respectively, thereby reducing the signal transmission distance and improving the data processing efficiency. As Figure 7 shown, the board-mounted optical connection device 1A is electrically mounted on the first data processing device 51 and the second data processing device 52 by using conductive elements 105, such as solder balls, through the flip-chip bonding technology. Referring to Figure 8 , the board-mounted optical connection device 1A is electrically mounted on the first data processing device 51 and the second data processing device 52 by using conductive elements 105, such as conductive posts.

[0069] Referring to Figure 9 , which shows another bonding method between the board-mounted optical connection device 1A and the first data processing device 51 and the second data processing device 52. The board-mounted optical connection device 1A is connected to the first data processing device 51 and the second data processing device 52 by wire bonding. In some embodiments, an external power supply (not shown) can be connected to the signal input module 20 to provide the necessary power.

[0070] Referring toFigure 10A and Figure 10B , the conductive element 105 can be made into a column by copper or copper alloy, but not limited thereto. Figure 10A The stacked package (PoP) and fan-out wafer-level package (FOWLP) of the on-board optical connection device 1A are shown. The columnar conductive element 105 is disposed between the on-board optical connection device 1A and the first data processing device 51 and the second data processing device 52, such that the on-board optical connection device 1A is stacked on the first data processing device 51 and the second data processing device 52.

[0071] Referring to Figures 11A to 11C , which is a schematic structural diagram of the working principle of various types of optical transmitters 22 provided in the on-board optical connection device according to an embodiment of the present application. As Figure 11A shown, the optical transmitter 22 in the optical transmitter array can be a Fabry-Perot (FP) laser diode. As Figure 11B shown, the optical transmitter array can be a DFB laser diode. As Figure 11C shown, the optical transmitter array can be a VCSEL laser diode. It should be noted that since the specific structures of the above laser diodes are well known to those skilled in the art, they will not be described in detail here.

[0072] Referring to Figures 12 to 17 schematically shows various types of bonding between the on-board optical connection device 1A (1B) and the first data processing device 51 and the second data processing device 52. Specifically, Figure 15 and Figure 16 shows the formation of the encapsulation layer 41 to encapsulate and protect the optical waveguide 10, the signal input module 20, and the signal output module 30. In some embodiments, the encapsulation layer 41 can be made of a resin-based material and can be cured by ultraviolet radiation. Figures 12 to 17The various types of bonding between the on-board optical connection device 1A (1B) shown and the first data processing device 51 and the second data processing device 52 have the advantage that the on-board optical connection device 1A (1B) can be regarded as an electronic component and existing wire bonding machines, flip-chip machines, insertion machines and other installation machines for circuit boards or electronic components can be used, so that various types of bonding between the on-board optical connection device 1A (1B) and the first data processing device 51 and the second data processing device 52 can be carried out without changing the original output / input port design or slot of the first data processing device 51 and the second data processing device 52. When using an active optical cable for interconnection in the prior art, not only the output / input port design of the first data processing device 51 and the second data processing device 52 needs to be changed, but also each optical fiber needs to be manually aligned and connected to the output / input port one by one in a narrow space. The embodiments of the present application significantly improve the installation convenience, speed and yield of the optical communication components between data processing devices, as well as the stability and durability of the devices after installation.

[0073] Referring to Figure 18 , in another aspect, the present application provides an on-board optical connection device 1C. It should be noted that the first data processing device 51 and the second data processing device 52 are not shown in this embodiment for the sake of clarity. As Figure 18 shown, the on-board optical connection device 1C includes an optical waveguide 10, a first signal transceiver 200', a second signal transceiver 300' and a carrier board 40. Specifically, the first signal transceiver 200' and the second signal transceiver 300' are optically connected to the optical waveguide 10 on the carrier board 40. In some embodiments, the first signal transceiver 200' and the second signal transceiver 300' are respectively divided into an optical input region 101 and an optical output region 102 located on opposite sides of the optical waveguide 10. It should be noted that, in order to clearly present the optical input region 101 and the optical output region 102, Figure 18 some specific components are not shown in

[0074] As Figure 18 shown, the optical signal transmission starts from the optical input region 101 on the side of the first signal transceiver 200', passes forward through the optical path 12 of the optical waveguide 10, and reaches the optical output region 102 on the side of the second signal transceiver 300' to form a signal path. Similarly, another signal path starts from the optical input region 101 on the side of the second signal transceiver 300', passes along the optical path 12 in the opposite direction to the forward direction, and reaches the optical output region 102 on the side of the first signal transceiver 200'. That is to say, the two optical input regions 101 and the two optical output regions 102 on opposite sides of the optical waveguide 10 form signal paths on the same carrier board 40, which is beneficial to reducing the area for arranging the first data processing device 51 and the second data processing device 52.

[0075] Referring toFigure 19 , which is a Figure 18 top view schematic diagram. In some embodiments, the first signal transceiver 200' includes a plurality of optical transmitters 22 disposed in the optical input region 101 of the first signal transceiver 200', and the second signal transceiver 300' includes a plurality of optical transmitters 22 disposed in the optical input region 101 of the second signal transceiver 300'. The optical transmitters 22 are optically aligned and arranged with the optical paths 12 respectively. As Figure 19 shown, the first signal transceiver 200' includes a strip-shaped substrate 21' and a plurality of optical channels 212 disposed in the optical output region 102 on the strip-shaped substrate 21', and the second signal transceiver 300' includes a support substrate 31' and a plurality of optical channels 312 disposed in the optical output region 102 on the support substrate 31'. The optical channels 212 and 312 in the two optical output regions 102 are optically aligned with the optical paths 12 respectively.

[0076] Continuing to refer to Figure 19 , in this embodiment, the optical transmitters 22 and the optical channels 212 and 312 of the first signal transceiver 200' and the second signal transceiver 300' can be formed by semiconductor manufacturing processes, such as epitaxial growth processes, photolithography processes, and etching processes. Specifically, the optical transmitters 22 can be fabricated using the same method as in the above embodiments. That is to say, the optical transmitters 22 and the optical channels 212 of the first signal transceiver 200' are integrally formed on the strip-shaped substrate 21' by semiconductor manufacturing processes. Similarly, the optical transmitters 22 and the optical channels 312 of the second signal transceiver 300' are integrally formed on the support substrate 31'. In this embodiment, the first signal transceiver 200' and the second signal transceiver 300' are respectively connected to the first external power supply device 251 and the second external power supply device 252 to supply the required power. Since the optical channels 212 and 312 function to optically connect with the first data processing device 51 and the second data processing device 52, and the first external power supply device 251 and the second external power supply device 252 are utilized, there is no need for a photodiode (optical receiver) and conductive components to be electrically connected to the first data processing device 51 and the second data processing device 52, thereby achieving all-optical transmission between the on-board optical connection device 1C and the first data processing device 51 and the second data processing device 52.

[0077] Similarly, the on-board optical connection device 1C may include optical isolators 13, 13' and a light guiding structure 121 to reduce optical signal transmission loss. For the structures and settings of the optical isolators 13, 13' and the light guiding structure 121, please refer to the description in the above first aspect and will not be elaborated here.

[0078] Accordingly, the present application provides the on-board optical connection device, the size of which can be adapted to connect the first data processing device and the second data processing device, for electro-optical signal, opto-electronic signal transmission or all-optical signal transmission, and without the use of optical fiber cables, which is beneficial to internal space management. In addition, the integrated molding of the optical transmitter on the strip-shaped substrate takes less time for optical alignment with the optical waveguide. In addition, the setting of the optical isolator and the light guiding structure reduces the transmission loss of the optical signal, and solves the problems of optical fiber damage, waveguide propagation loss and low internal space layout efficiency when connecting two data processing devices.

[0079] The above embodiments are used to illustrate the technical idea of the present disclosure, rather than to limit the technical idea of the present disclosure. Therefore, the scope of rights of the present disclosure is not limited to this embodiment. The protection scope of the present disclosure should be interpreted by the claims, and should be interpreted as including all technical ideas that are the same as or equivalent to the above protection scope within the scope of rights of the present disclosure.

Claims

1. An on-board optical connection device is connected between a first data processing device and a second data processing device, characterized in that, The onboard optical connection device comprises: an optical waveguide, arranged between the first data processing device and the second data processing device; a first signal transceiver optically coupled to the optical waveguide and used to convert an input electrical signal transmitted from the first data processing device into an optical signal; and A second signal transceiver is optically coupled to the optical waveguide and is used to convert the optical signal into an output electrical signal to the second data processing device.

2. The on-board optical connection device according to claim 1, characterized in that, The on-board optical connection device further includes a carrier board, wherein the optical waveguide, the first signal transceiver, and the second signal transceiver are disposed on the carrier board.

3. The on-board optical connection device according to claim 2, wherein The first signal transceiver includes a signal input module, which includes a strip substrate, a plurality of optical emitters, and a plurality of first conductive components electrically connected between the signal input module and the first data processing device, wherein each of the optical emitters is integrally arranged on the strip substrate and is configured to transmit the optical signal to the optical waveguide.

4. The on-board optical connection device according to claim 3, characterized in that, The strip substrate is configured to span across the bottom of each light emitter, and the position adjustment of the strip substrate causes the multiple light emitters to be displaced simultaneously, and the multiple light emitters are optically aligned with the optical waveguide simultaneously through a one-time active alignment process.

5. The on-board optical connection device according to claim 3, characterized in that, The second signal transceiver includes a signal output module, which includes a supporting substrate, a plurality of optical receivers arranged on the supporting substrate, and a plurality of second conductive components electrically connected between the signal output module and the second data processing device, wherein the optical receivers receive the optical signals and convert the optical signals into the output electrical signals.

6. The on-board optical connection device according to claim 5, characterized in that, The optical waveguide includes a waveguide substrate and a plurality of optical paths arranged on the waveguide substrate, wherein the waveguide substrate is made of a material including silicon dioxide, silicon or silicon nitride.

7. The on-board optical connection device according to claim 6, wherein The optical path of the optical waveguide includes a planar optical waveguide circuit.

8. The on-board optical connection device according to claim 6, characterized in that, The waveguide substrate includes a reflection structure, which is arranged close to the signal output module and forms an angle with the optical path. The optical signal transmitted from the signal input module reaches the signal output module after being reflected by the reflection structure.

9. The on-board optical connection device according to claim 6, wherein The optical waveguide further includes at least one optical isolator arranged across the optical path, and the optical isolator is configured to transmit light along the optical path to the signal output module in a specified direction.

10. The on-board optical connection device according to claim 9, characterized in that, The optical waveguide also includes at least one groove and a plurality of light-guiding structures, wherein the groove spans the optical path, the light-guiding structures are located on opposite sides of the groove and are adjacent to the corresponding optical path, and the optical isolator is arranged in the groove and faces the light-guiding structures, wherein each of the light-guiding structures extends from the optical path so that the light-guiding structure has an aperture larger than a diameter of the optical path.

11. An on-board optical connection device is connected between a first data processing device and a second data processing device, characterized in that, The onboard optical connection device comprises: Carrier board; An optical waveguide, disposed on the carrier, comprising a waveguide substrate and a plurality of optical paths disposed on the waveguide substrate; a first signal transceiver, optically coupled to the optical waveguide and disposed on the carrier and located between the optical waveguide and the first data processing device; and A second signal transceiver, optically coupled to the optical waveguide and disposed on the carrier board and between the optical waveguide and the second data processing device; Wherein the first signal transceiver and the second signal transceiver respectively define an optical input region and an optical output region, and the two optical input regions and the two optical output regions jointly define a signal path.

12. The on-board optical connection device according to claim 11, characterized in that, The first signal transceiver and the second signal transceiver are respectively connected to a first external power supply device and a second external power supply device.

13. The on-board optical connection device according to claim 11, characterized in that, The first signal transceiver includes a plurality of optical transmitters, and the plurality of optical transmitters are disposed in the optical input region of the first signal transceiver. The second signal transceiver includes a plurality of optical transmitters, and the optical transmitters of the second signal transceiver are disposed in the optical input region of the second signal transceiver. The optical transmitters of the first signal transceiver and the optical transmitters of the second signal transceiver are respectively optically aligned with the optical path.

14. The on-board optical connection device according to claim 11, wherein The first signal transceiver includes a plurality of optical channels disposed in the optical output region of the first signal transceiver. The second signal transceiver includes a plurality of optical channels disposed in the optical output region of the second signal transceiver. The optical channels of the first signal transceiver and the optical channels of the second signal transceiver are respectively optically aligned with the optical path.

15. The on-board optical connection device according to claim 11, wherein The optical waveguide further includes at least one optical isolator spanning the optical path, and the optical isolator is configured to cause light to be transmitted along the optical path to the optical output region in a specified direction.

16. The on-board optical connection device according to claim 15, wherein, The optical waveguide further includes at least one trench and a plurality of light guiding structures. The trench spans the optical path. The light guiding structures are located on opposite sides of the trench and adjacent to the corresponding optical path. The optical isolator is disposed in the trench and faces the light guiding structures. Each of the light guiding structures extends from the optical path such that the light guiding structure has an aperture larger than the diameter of the optical path.

Images